Display Devices

Abstract

A display device is provided. The display device includes: a substrate; a plurality of pixels located on the substrate, and each of the pixels includes first to third sub-pixels, each of the first to third sub-pixels includes at least one light-emitting diode configured to emit light; and a color conversion layer includes first to third color conversion patterns corresponding to the first to third sub-pixels, respectively, each of the first to third color conversion patterns is configured to transmit light or convert light into light of a different color. The light-emitting diode of each of the first to third sub-pixels is connected to a first electrode and a second electrode. At least one of the first to third color conversion patterns includes a perovskite compound.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0102240, filed on August 29, 2018, which is hereby incorporated by reference in its entirety. Technical Field

[0003] Various embodiments of the present disclosure relate to a display device. Background Art

[0004] Light emitting diodes (LEDs) may have relatively suitable or satisfactory durability even under severe environmental conditions and have excellent performance in terms of life span and brightness. Recently, research on applying such LEDs to various display devices has become significantly more active.

[0005] As part of this research, a technology is being developed to manufacture LEDs with small sizes corresponding to the micrometer or nanometer scale using inorganic crystal structures (e.g., structures obtained by growing nitride-based semiconductors). For example, LEDs can be made small enough to form pixels of self-luminous display devices, etc. Summary of the invention

[0006] Various embodiments of the present disclosure are directed to display devices with improved color gamut.

[0007] An embodiment of the present disclosure may provide a display device, the display device comprising: a substrate; a plurality of pixels located on the substrate, each of the pixels comprising first to third sub-pixels, each of the first to third sub-pixels comprising at least one light-emitting diode configured to emit light; and a color conversion layer comprising first to third color conversion patterns corresponding to the first to third sub-pixels, respectively, each of the first to third color conversion patterns being configured to transmit light or convert light into light of a different color. The light-emitting diode of each of the first to third sub-pixels may be coupled to a first electrode and a second electrode. At least one of the first to third color conversion patterns may comprise a perovskite compound.

[0008] In an embodiment, two of the first to third color conversion patterns each may include a perovskite compound.

[0009] In an embodiment, the color conversion patterns each including a perovskite compound are a first color conversion pattern and a second color conversion pattern, and the first color conversion pattern may be configured to convert light into red light, the second color conversion pattern may be configured to convert light into green light, and the third color conversion pattern may be configured to transmit light.

[0010] In an embodiment, at least one of the first color conversion pattern and the second color conversion pattern may further include quantum dots.

[0011] In an embodiment, the light emitting diodes of the first to third sub-pixels may be configured to emit blue light.

[0012] In an embodiment, one of the first to third color conversion patterns may include a perovskite compound, and another one of the first to third color conversion patterns may include a quantum dot.

[0013] In an embodiment, the first color conversion pattern may include quantum dots configured to convert light into red light, and the second color conversion pattern may include a perovskite compound configured to convert light into green light.

[0014] In an embodiment, the second color conversion pattern may further include quantum dots.

[0015] In an embodiment, the light emitting diode may be configured to emit blue light.

[0016] In an embodiment, the perovskite compound may be represented by the following Chemical Formula 1:

[0017] AMX 3 [Chemical formula 1]

[0018] Wherein, A may be a monovalent organic cation or a monovalent transition metal or alkali metal cation, M may be a divalent transition metal, rare earth metal, alkaline earth metal, Pb, Sn, Ge, Ga, In, Al, Sb, Bi or Po cation, X may be selected from the group consisting of halogen anions and combinations thereof, and two or more of A, M and X may be the same or different.

[0019] In an embodiment, the perovskite compound may be represented by the following Chemical Formula 2:

[0020] A 3 M 2 X 9 [Chemical formula 2]

[0021] Wherein, A may be selected from the group consisting of monovalent organic cations, monovalent transition metal and alkali metal cations and combinations thereof, M may be selected from the group consisting of trivalent cations and combinations thereof, X may be selected from the group consisting of halogen anions and combinations thereof, and two or more of A, M and X may be the same or different.

[0022] In an embodiment, the perovskite compound may be represented by the following Chemical Formula 3:

[0023] A 2 MM'X6 [Chemical formula 3]

[0024] Wherein, A may be selected from the group consisting of monovalent organic cations, monovalent transition metal and alkali metal cations and combinations thereof, M may be a monovalent transition metal, alkali metal or In cation, M' may be a trivalent cation, X may be selected from the group consisting of halogen anions and combinations thereof, and two or more of A, M and X may be the same or different.

[0025] In an embodiment, the perovskite compound may be represented by the following Chemical Formula 4:

[0026] A 2 MX 4 [Chemical formula 4]

[0027] Wherein, A may be selected from the group consisting of monovalent organic cations, monovalent transition metal and alkali metal cations and combinations thereof, M may be a divalent cation of a transition metal or other suitable metal, X may be selected from the group consisting of halogen anions and combinations thereof, and two or more of A, M and X may be the same or different.

[0028] In an embodiment, the perovskite compound may have a form selected from the group consisting of quantum dots, nanocrystals, nanoplates, nanosheets, and combinations thereof.

[0029] In an embodiment, the at least one of the first to third color conversion patterns includes a polymer forming a composition with a perovskite compound.

[0030] In an embodiment, the at least one of the first to third color conversion patterns may be provided by dispersing or stacking a perovskite compound in a dielectric matrix.

[0031] In an embodiment, at least one of the first to third color conversion patterns may further include a diffuser. In an embodiment, the color conversion layer may further include first to third color filters respectively located on the first to third color conversion patterns. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The drawings, together with the specification, illustrate embodiments of the presently disclosed subject matter, and, together with the description, serve to explain principles of the embodiments of the presently disclosed subject matter.

[0033] Figure 1 is a perspective view showing a rod-type light emitting diode (LED) according to an embodiment of the present disclosure.

[0034] Figure 2 Schematically shows a pixel of a display device according to an embodiment of the present disclosure, including Figure 1 A plan view of first to third sub-pixels of a rod-type light emitting diode.

[0035] Figure 3 According to the embodiment of the present disclosure, Figure 2 A cross-sectional view taken along line II'.

[0036] Figure 4 According to the embodiment of the present disclosure, Figure 2 A cross-sectional view taken along line II'.

[0037] Figure 5 According to the embodiment of the present disclosure, Figure 2 A cross-sectional view taken along line II'. DETAILED DESCRIPTION

[0038] Hereinafter, embodiments will be described in more detail with reference to the accompanying drawings. Embodiments are described herein with reference to cross-sectional views as schematic diagrams of embodiments (and intermediate structures). Therefore, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, embodiments should not be interpreted as limited to the specific regional shapes shown herein, but may include shape deviations, for example, caused by manufacturing. In the accompanying drawings, the lengths and sizes of layers and regions may be exaggerated for clarity.

[0039] In the accompanying drawings, the same reference numerals represent the same elements. In the accompanying drawings, in order to make the subject matter of the present disclosure clear, the size of the structure is shown exaggerated according to the actual situation.

[0040] Terms such as "first" and "second" may be used to describe various components, but they should not limit the various components. These terms are only used for the purpose of distinguishing a component from other components. For example, a first component may be referred to as a second component, and a second component may be referred to as a first component, and so on, without departing from the spirit and scope of the present disclosure. In addition, unless the context clearly indicates otherwise, a singular form may include a plural form.

[0041] In the present application, the terms "including" or "having" and the like are used to specify the presence of the stated features, wholes, actions, operations, elements, components or combinations thereof, and one or more other features should not be interpreted as excluding the presence or addition of one or more other features, wholes, actions, operations, elements, components or combinations thereof. In addition, when a portion of a layer, film, region, plate, etc. is referred to as being on another portion, this includes not only the case where it is directly on the other portion, but also the case where it is located in the middle of the other portion. In the present disclosure, when a portion of a layer, film, region, plate, etc. is formed on another portion, the formation direction is not limited to the upper direction, but includes the lateral direction or the lower direction. On the contrary, when a portion of a layer, film, region, plate, etc. is referred to as being under another portion, this includes not only the case where it is directly below, but also the case where it is located in the middle of another portion.

[0042] Hereinafter, embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings.

[0043] Figure 1 is a perspective view showing a rod-type light emitting diode as an example of a light emitting diode according to an embodiment of the present disclosure.

[0044] Although already Figure 1 , a rod-type light emitting diode LD having a cylindrical shape is shown, but the present disclosure is not limited thereto. For example, as used herein, the term "rod-type light emitting diode" or "rod-type LED" may refer to a light emitting diode having a length that is longer than the width or circumference of the light emitting diode and may have any suitable shape.

[0045] refer to Figure 1 The rod-type light emitting diode LD according to an embodiment of the present disclosure may include a first conductive semiconductor layer 11 , a second conductive semiconductor layer 13 , and an active layer 12 interposed between the first conductive semiconductor layer 11 and the second conductive semiconductor layer 13 .

[0046] For example, the rod-type light emitting diode LD may be configured to have a stacked body formed by sequentially stacking a first conductive semiconductor layer 11, an active layer 12, and a second conductive semiconductor layer 13. In the following description, for convenience of explanation, the rod-type light emitting diode LD will be referred to as a "rod-type LED LD."

[0047] In an embodiment of the present disclosure, the rod-type LED LD may be in the form of a rod extending in one direction. If the direction in which the rod-type LED LD extends is defined as a longitudinal direction, the rod-type LED LD may have a first end and a second end relative to the longitudinal direction in which the rod-type LED LD extends.

[0048] In an embodiment, one of the first and second conductive semiconductor layers 11 and 13 may be located on a first end of the rod-type LED LD, and the other of the first and second conductive semiconductor layers 11 and 13 may be located on a second end of the rod-type LED LD.

[0049] In an embodiment, the rod-type LED LD may have a cylindrical shape. As used herein, the term "rod-type" includes a rod-like shape or a rod-like shape extending in a longitudinal direction (e.g., to have an aspect ratio greater than 1), such as a cylindrical shape and a prismatic shape. For example, the length of the rod-type LED LD may be greater than its diameter or width.

[0050] The rod-type LED LD may be manufactured to have a small size having a diameter and / or a length corresponding to, for example, a micrometer-scale size or a nanometer-scale size.

[0051] However, the size of the stick-type LED LD according to the embodiment of the present disclosure is not limited thereto, and the size of the stick-type LED LD may be changed according to the situation of the display device to which the stick-type LED LD is applied.

[0052] The first conductive semiconductor layer 11 may include, for example, at least one N-type semiconductor layer. For example, the first conductive semiconductor layer 11 may include any semiconductor material including InAlGaN, GaN, AlGaN, InGaN, AlN and / or InN, and a semiconductor layer doped with a first conductive dopant such as Si, Ge and / or Sn.

[0053] The material forming the first conductive semiconductor layer 11 is not limited thereto, and the first conductive semiconductor layer 11 may include various other suitable materials.

[0054] The active layer 12 may be formed on the first conductive semiconductor layer 11 and may have a single quantum well structure or a multi-quantum well structure. In an embodiment of the present disclosure, a plated layer doped with a conductive dopant may be formed on the active layer 12 and / or under the active layer 12. For example, the plated layer may include an AlGaN layer or an InAlGaN layer. In addition, the active layer 12 may be formed using a material such as AlGaN or AlInGaN.

[0055] If an electric field having a set or predetermined voltage or more is applied to opposite ends of the stick-type LED LD, the stick-type LED LD emits light by combining electron-hole pairs in the active layer 12 .

[0056] The second conductive semiconductor layer 13 may be located on the active layer 12, and may include a semiconductor layer of a different type from that of the first conductive semiconductor layer 11. For example, the second conductive semiconductor layer 13 may include at least one P-type semiconductor layer. For example, the second conductive semiconductor layer 13 may include any semiconductor material including InAlGaN, GaN, AlGaN, InGaN, AlN, and / or InN, and a semiconductor layer doped with a second conductive dopant such as Mg.

[0057] The material forming the second conductive semiconductor layer 13 is not limited thereto, and the second conductive semiconductor layer 13 may include various other suitable materials.

[0058] In an embodiment of the present disclosure, the rod-type LED LD may include not only the first conductive semiconductor layer 11, the active layer 12, and the second conductive semiconductor layer 13, but may also include a fluorescent layer, another active layer, another semiconductor layer, and / or an electrode layer located on and / or under each layer.

[0059] In addition, the rod type LED LD may further include an insulating film 14. In the embodiment of the present disclosure, the insulating film 14 may be omitted, or the insulating film 14 may cover only some of the first conductive semiconductor layer 11, the active layer 12, and the second conductive semiconductor layer 13.

[0060] For example, the insulating film 14 may be located on a portion of the stick-type LED LD except for the opposite ends of the stick-type LED LD, thereby exposing the opposite ends of the stick-type LED LD.

[0061] Although for the convenience of explanation Figure 1 , a part of the insulating film 14 is shown to have been removed therefrom, but the actual stick-type LED LD may be formed such that the entire (or substantially the entire) side surface of the cylindrical body of the stick-type LED LD is surrounded by the insulating film 14 .

[0062] The insulating film 14 may surround at least a portion of the outer circumferential surface of the first conductive semiconductor layer 11, the active layer 12, and / or the second conductive semiconductor layer 13. For example, the insulating film 14 may surround the outer circumferential surface of the active layer 12.

[0063] In an embodiment of the present disclosure, the insulating film 14 may include a transparent insulating material. For example, the insulating film 14 may include a transparent insulating material made of SiO 2 、Si 3 N 4 、Al 2 O 3 and TiO 2 At least one insulating material selected from the group consisting of, but it is not limited to this. In other words, various suitable materials with insulating properties can be used.

[0064] If the insulating film 14 is located on the rod-type LED LD, a short circuit of the active layer 12 and the first electrode and / or the second electrode may be prevented or reduced.

[0065] In addition, due to the presence of the insulating film 14, defects on the surface of the rod-type LED LD can be minimized or reduced, thereby improving the life and efficiency of the rod-type LED LD. Even when a plurality of rod-type LEDs LD are close to each other, the insulating film 14 can prevent or reduce undesired short circuits of the rod-type LEDs LD.

[0066] The stick-type LED LD described above can be used as a light source of various suitable display devices. For example, the stick-type LED LD can be used in a lighting device or a self-luminous display device.

[0067] In an embodiment, the rod type light emitting diode LD according to the present disclosure may have a structure in which respective layers corresponding to the first conductive semiconductor layer 11 , the active layer 12 , and the second conductive semiconductor layer 13 of the rod type LED LD are longitudinally stacked on the emission region.

[0068] Figure 2 Schematically shows a pixel of a display device according to an embodiment of the present disclosure, including Figure 1 A plan view of first to third sub-pixels of a rod-type light emitting diode. Figure 3 According to the embodiment of the present disclosure, Figure 2 A cross-sectional view taken along line II'.

[0069] exist Figure 2 In the embodiment, for convenience of explanation, a plurality of rod-type LEDs are shown to be arranged horizontally. However, the arrangement of the rod-type LEDs is not limited thereto.

[0070] In addition, Figure 2 In the figure, for convenience of explanation, each rod-type LED is shown as being oriented horizontally. However, the orientation of the rod-type LED is not limited thereto. For example, each rod-type LED may be oriented in an inclined direction between the first electrode and the second electrode. In addition, for convenience of explanation, illustration of transistors connected to the rod-type LED and signal lines connected to the transistors has been omitted.

[0071] exist Figure 2 In the embodiment of the present invention, the unit emission region may be a pixel region including pixels provided with first to third sub-pixels.

[0072] refer to Figures 1 to 3 , the display device according to the embodiment of the present disclosure may include a plurality of pixels PXL. Each pixel PXL may include a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3 located on a substrate SUB.

[0073] The first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may correspond to a pixel area for displaying an image in the pixel PXL, and may correspond to an emission area from which light is emitted. Each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may include an LED configured to emit white light and / or colored light. Each sub-pixel SP1, SP2, SP3 may be configured to emit light having any color selected from red, green, and blue, and is not limited thereto. For example, each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may be configured to emit light having any color selected from cyan, magenta, yellow, and white.

[0074] Each of the first sub-pixel SP1 , the second sub-pixel SP2 , and the third sub-pixel SP3 may include a substrate SUB, a pixel circuit layer PCL, and a display element layer DPL.

[0075] The substrate SUB may include insulating materials such as glass, organic polymers and / or crystals. In addition, the substrate SUB may be made of a flexible material so as to be able to be bent or folded, and may have a single-layer structure or a multi-layer structure. For example, the substrate SUB may include at least one of the following items: polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyether sulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose triacetate and cellulose acetate propionate. However, the material of the substrate SUB may be changed in various suitable ways.

[0076] The pixel circuit layer PCL may include a buffer layer BFL on the substrate SUB, a transistor T on the buffer layer BFL, and a driving voltage line DVL.

[0077] The buffer layer BFL may prevent or reduce diffusion of impurities into the transistor T. The buffer layer BFL may have a single-layer structure, or may have a multi-layer structure including two or more layers.

[0078] In the case where the buffer layer BFL has a multi-layer structure, the respective layers may include the same material or different materials. Depending on the material or processing conditions of the substrate SUB, the buffer layer BFL may be omitted.

[0079] The transistor T may be electrically coupled to (eg, electrically connected to) a plurality of rod-type LEDs LD included in the display element layer DPL to drive the rod-type LEDs LD. The transistor T may include a semiconductor layer SCL, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0080] The semiconductor layer SCL may be located on the buffer layer BFL. The semiconductor layer SCL may include a source region contacting the source electrode SE and a drain region contacting the drain electrode DE. A region between the source region and the drain region may be a channel region.

[0081] The semiconductor layer SCL may be a semiconductor pattern including polysilicon, amorphous silicon, an oxide semiconductor, etc. The channel region may be an intrinsic semiconductor (eg, an undoped semiconductor pattern). Each of the source region and the drain region may be a semiconductor pattern doped with impurities.

[0082] The gate electrode GE may be located on the semiconductor layer SCL with the gate insulating layer GI interposed therebetween.

[0083] The source electrode SE and the drain electrode DE may respectively contact the source region and the drain region of the semiconductor layer SCL through corresponding contact holes passing through the interlayer insulating layer ILD and the gate insulating layer GI.

[0084] Although the transistor T is shown to have a top gate structure, it may have a bottom gate structure as needed.

[0085] A passivation layer PSV may be located on the transistor T.

[0086] In some embodiments, the driving voltage line DVL may be located on the interlayer insulating layer ILD and may extend in the second direction DR2 in a plan view. The driving voltage line DVL may be electrically coupled to (eg, electrically connected to) the display element layer DPL through a contact hole passing through the passivation layer PSV.

[0087] The display element layer DPL may include a rod-type LED LD on the passivation layer PSV.

[0088] Each of the rod-type LEDs LD may include a first conductive semiconductor layer 11 , a second conductive semiconductor layer 13 , and an active layer 12 interposed between the first conductive semiconductor layer 11 and the second conductive semiconductor layer 13 .

[0089] The rod type LED LD may include a first end EP1 and a second end EP2 with respect to the first direction DR1. One of the first and second conductive semiconductor layers 11 and 13 may be located on the first end EP1, and the other of the first and second conductive semiconductor layers 11 and 13 may be located on the second end EP2.

[0090] The stick-type LED LD may be configured to emit white light or colored light. For example, the stick-type LED LD may be configured to emit blue-based light, but it is not limited thereto.

[0091] Hereinafter, for convenience of explanation, the colored light will be referred to as “blue light”, but the present disclosure is not limited thereto.

[0092] The display element layer DPL may further include partition walls PDL, first and second electrodes EL1 and EL2 , first and second contact electrodes CNE1 and CNE2 , and first and second connection lines CNL1 and CNL2 .

[0093] The partition wall PDL may be located on the passivation layer PSV and may be used to define an emission area in each of the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3. The partition wall PDL may include an opening exposing the rod-type LED LD included in each of the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3.

[0094] In this embodiment, adjacent partition walls PDL may be located above the substrate SUB at positions spaced apart from each other by a set distance or a predetermined distance. For example, adjacent partition walls PDL may be located above the substrate SUB at positions spaced apart from each other by a distance greater than the length of the rod-type LED LD. Each partition wall PDL may include an insulating material including an inorganic material or an organic material, but it is not limited thereto.

[0095] In an embodiment of the present disclosure, the partition wall PDL may be made of an insulating material including an organic material. For example, the partition wall PDL may include at least one selected from polystyrene, polymethyl methacrylate (PMMA), polyacrylonitrile (PAN), polyamide (PA), polyimide (PI), polyarylether (PAE), heterocyclic polymer, polyparaxylene, epoxy resin, benzocyclobutene (BCB), siloxane-based resin, and silane-based resin.

[0096] The first insulating layer INS1 may be located on the substrate SUB including the partition wall PDL. The first insulating layer INS1 may cover a portion of the upper surface of each of the rod-type LEDs LD in each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3. Due to the above-described structure of the first insulating layer INS1, the first end EP1 and the second end EP2 of each rod-type LED LD may be exposed to the outside.

[0097] The first electrode EL1 may be located on the passivation layer PSV. The first electrode EL1 may be adjacent to the first end EP1 or the second end EP2 of the corresponding rod-type LED LD, and may be electrically coupled to the corresponding rod-type LED LD through the first contact electrode CNE1.

[0098] The first electrode EL1 may be electrically coupled to the driving voltage line DVL through a contact hole.

[0099] The first electrode EL1 may be provided as a portion of the first connection line CNL1 or may be in the form of a protrusion extending from the first connection line CNL1. The first connection line CNL1 may be a line configured to apply a voltage to the first electrode EL1 when corresponding stick-type LEDs LD are aligned.

[0100] The second electrode EL2 may be adjacent to the other of the first end EP1 and the second end EP2 of the corresponding rod-type LED LD and may be electrically coupled to the corresponding rod-type LED LD through the second contact electrode CNE2. The corresponding second electrodes EL2 included in the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be electrically coupled (e.g., electrically connected) through the second connection line CNL2.

[0101] The second electrode EL2 may be electrically coupled to (eg, electrically connected to) the drain electrode DE of the transistor T through a contact hole CH passing through the passivation layer PSV, so that a signal may be provided to the second electrode EL2 through the transistor T.

[0102] The second electrode EL2 may be provided as a portion of the second connection line CNL2 or may be in the form of a protrusion extending from the second connection line CNL2. The second connection line CNL2 may be a line configured to apply a voltage to the second electrode EL2 when corresponding stick-type LEDs LD are aligned.

[0103] In an embodiment of the present disclosure, the first electrode EL1 and the first connection line CNL1 may be integrally provided, and the second electrode EL2 and the second connection line CNL2 may be integrally provided.

[0104] The first electrode EL1 and the second electrode EL2 may be located on the same (substantially the same) plane and may have the same (or substantially the same) height. If the first electrode EL1 and the second electrode EL2 have the same (or substantially the same) height, the rod-type LED LD may be more reliably coupled to the first electrode EL1 and the second electrode EL2.

[0105] The first and second electrodes EL1 and EL2 and the first and second connection lines CNL1 and CNL2 may include the same (or substantially the same) material. For example, the first and second electrodes EL1 and EL2 and the first and second connection lines CNL1 and CNL2 may include a conductive material.

[0106] Conductive materials may include metals (such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr) or their alloys, conductive oxides (such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium tin zinc oxide (ITZO)) and conductive polymers (such as PEDOT).

[0107] Although each of the first electrode EL1, the second electrode EL2, the first connection line CNL1, and the second connection line CNL2 may have a single layer, it is not limited thereto, and it may have, for example, a multilayer structure formed by stacking two or more layers, wherein the two or more layers each include a metal, an alloy, a conductive oxide, or a conductive polymer. Here, the materials of the first electrode EL1, the second electrode EL2, the first connection line CNL1, and the second connection line CNL2 are not limited to the above materials. For example, the first electrode EL1, the second electrode EL2, the first connection line CNL1, and the second connection line CNL2 may be made of a conductive material having a set or predetermined reflectivity to allow light emitted from opposite ends of the rod-type LED LD to propagate in a direction in which an image is displayed (for example, in a front direction).

[0108] The rod-type LED LD may be located above the substrate SUB between the first electrode EL1 and the second electrode EL2. The rod-type LED LD may be induced to self-align by an electric field formed between the first electrode EL1 and the second electrode EL2. Here, each rod-type LED LD may be in the form of a rod extending in the first direction DR1.

[0109] The first end EP1 of the rod-type LED LD may be adjacent to the first electrode EL1 , and the second end EP2 of the rod-type LED LD may be adjacent to one side of the second electrode EL2 .

[0110] A first contact electrode CNE1 for electrically and / or physically reliably coupling (eg, connecting) the first electrode EL1 and the corresponding stick-type LED LD may be located on the first electrode EL1. In a plan view, the first contact electrode CNE1 may overlap the first electrode EL1.

[0111] The first contact electrode CNE1 may be in ohmic contact with the first electrode EL1 .

[0112] The first end EP1 of the rod-type LED LD may be electrically and / or physically reliably coupled to the first electrode EL1 through the first contact electrode CNE1. Thus, the voltage applied to the driving voltage line DVL may be applied to the first end EP1 of the corresponding rod-type LED LD through the first electrode EL1 and the first contact electrode CNE1.

[0113] The first contact electrode CNE1 may be made of a transparent conductive material such as ITO, IZO, or ITZO to allow light emitted from the rod-type LED LD to pass through the first contact electrode CNE1, but it is not limited thereto.

[0114] The first contact electrode CNE1 may cover and overlap the first electrode EL1 in a plan view. In addition, the first contact electrode CNE1 may partially overlap the first end EP1 of the rod-type LED LD.

[0115] The second insulating layer INS2 may be located on the substrate SUB including the first contact electrode CNE1. The second insulating layer INS2 may prevent or reduce the first contact electrode CNE1 from being exposed to the outside, thereby preventing or reducing corrosion of the first contact electrode CNE1. The second insulating layer INS2 may include an inorganic insulating layer including an inorganic material or an organic insulating layer including an organic material.

[0116] A second contact electrode CNE2 for electrically and / or physically reliably coupling (eg, connecting) the second electrode EL2 and the corresponding rod-type LED LD may be located on the second electrode EL2. In a plan view, the second contact electrode CNE2 may overlap the second electrode EL2.

[0117] The second contact electrode CNE2 may be in ohmic contact with the second electrode EL2. The corresponding second end EP2 of the rod-type LED LD may be electrically coupled to the second electrode EL2 through the second contact electrode CNE2. Thus, the voltage of the transistor T may be applied to the corresponding second end EP2 of the rod-type LED LD through the second electrode EL2 and the second contact electrode CNE2.

[0118] As such, since a set or predetermined voltage is applied to the opposite first and second ends EP1 and EP2 of the stick-type LED LD through the first and second electrodes EL1 and EL2 , the stick-type LED LD may emit blue light.

[0119] The second contact electrode CNE2 may be made of the same (substantially the same) material as that of the first contact electrode CNE1, but it is not limited thereto.

[0120] The third insulating layer INS3 may be located on the substrate SUB on which the second contact electrode CNE2 is disposed. The third insulating layer INS3 may cover the second contact electrode CNE2, so that the second contact electrode CNE2 located under the third insulating layer INS3 may be prevented or reduced from being exposed to the outside and corroded. The third insulating layer INS3 may include an inorganic insulating layer including an inorganic material or an organic insulating layer including an organic material.

[0121] The display device may further include a color conversion layer CCL on the third insulating layer INS3.

[0122] The color conversion layer CCL may be configured to convert blue light emitted from the stick-type LED LD into light having a set or specific color according to each sub-pixel.

[0123] In an embodiment of the present disclosure, the color conversion layer CCL may include first, second, and third color conversion patterns CCP1, CCP2, and CCP3. Here, the first, second, and third color conversion patterns CCP1, CCP2, and CCP3 may correspond to respective sub-pixels.

[0124] For example, the first color conversion pattern CCP1 may correspond to the first sub-pixel SP1, the second color conversion pattern CCP2 may correspond to the second sub-pixel SP2, and the third color conversion pattern CCP3 may correspond to the third sub-pixel SP3.

[0125] In an embodiment of the present disclosure, the first color conversion pattern CCP1, the second color conversion pattern CCP2, and the third color conversion pattern CCP3 may have the following configurations.

[0126] At least one of the first to third color conversion patterns CCP1 to CCP3 may include color conversion particles. For example, two of the first to third color conversion patterns CCP1 to CCP3 may include color conversion particles.

[0127] In an embodiment, the first color conversion pattern CCP1 and the second color conversion pattern CCP2 may include first color conversion particles and second color conversion particles, respectively.

[0128] The first color conversion pattern CCP1 may be configured to convert light emitted from the rod-type LED LD of the first subpixel SP1 into red light. The first color conversion pattern CCP1 may absorb blue light, shift its wavelength through energy conversion, and thus emit red light having a wavelength in the range of 620nm to 780nm.

[0129] The first color conversion pattern CCP1 may include first color conversion particles. The first color conversion particles may be perovskite compounds. The first color conversion particles may be red perovskite compounds.

[0130] Each perovskite compound may be a compound having a perovskite structure. As used in the present disclosure, the term "perovskite compound" includes not only a compound having a perovskite structure but also a compound having a double perovskite structure or a compound having a perovskite-like structure.

[0131] The compound having a perovskite structure may include a structure having three or four identical or different anions and two metal cations carrying two or three positive charges. The compound having a perovskite structure may be a compound represented by the following Chemical Formula 1:

[0132] AMX 3 [Chemical formula 1]

[0133] Wherein, A may be a monovalent organic cation or a monovalent transition metal or alkali metal cation; M may be a divalent transition metal, rare earth metal, alkaline earth metal, Pb, Sn, Ge, Ga, In, Al, Sb, Bi or Po cation; X may be selected from the group consisting of halogen anions and combinations thereof; and two or more of A, M and X may be the same or different.

[0134] When A in Chemical Formula 1 is a monovalent organic cation, the compound having a perovskite structure may have an organic / inorganic hybrid perovskite structure, and the organic cation may include but is not limited to an organic ammonium cation, an organic phosphine cation, an organic pyridinium cation, an organic imidazolium cation, or an organic sulfonium cation.

[0135] The organic group of the organic cation can be selected from hydrogen, alkyl, hydroxyl, alkenyl, aryl and combinations thereof. The alkyl group can be unsubstituted or substituted C 1 To C 24 Straight or branched chain alkyl or unsubstituted or substituted C 3 To C 20 Cycloalkyl; Hydroxyl may be unsubstituted or substituted C 1 To C 6 Hydroxyl; alkenyl may be unsubstituted or substituted C 10 To C 20 Alkenyl; and aryl can be composed of unsubstituted or substituted C 6 To C 20 Select from the group consisting of aromatic groups and combinations thereof.

[0136] For example, the organic ammonium cation constituting A in Chemical Formula 1 may be (R 1 R 2 R 3 R 4 N) + or (R 1 R 2 N=CH-NR 3 R 4 ) + Represents a monovalent organic ammonium ion, where R 1 To R 4 It can be derived from H, unsubstituted or halogen-substituted C 1 To C 24 Straight chain or branched alkyl, unsubstituted or halogen substituted C 3 To C 20 Cycloalkyl, unsubstituted or halogen-substituted C 6 To C 20 The organic ammonium cation may be an unsubstituted or halogen-substituted C1 To C 10 Alkyl ammonium or C 1 To C 10 Alkylene diamine amine. In some embodiments, the organic ammonium ion constituting A in Chemical Formula 1 may be a monovalent cation of methylamine, ethylamine, methylenediamine, ethylenediamine, tetraethylamine, benzyltrimethylamine, or benzyltriethylamine, but is not limited thereto.

[0137] For example, the organic phosphorus cation constituting A in Chemical Formula 1 may be (R 1 R 2 R 3 R 4 P) + Represents a monovalent organic phosphorus ion, where R 1 To R 4 It can be derived from H, unsubstituted or halogen-substituted C 1 To C 24 Straight chain or branched alkyl, unsubstituted or halogen substituted C 3 To C 20 Cycloalkyl, unsubstituted or halogen-substituted C 6 To C 20 The organic phosphorus ions constituting A in Chemical Formula 1 include, but are not limited to, tetraalkylphosphonium ions (such as tetraethylphosphonium, tetrabutylphosphonium or tetraphenylphosphonium cations), triethylbenzylphosphonium, trimethyldecylphosphonium, methyltriphenylphosphonium, tributylarylphosphonium, and diphenyldioctylphosphonium cations, etc.

[0138] In addition, when A in Chemical Formula 1 is a monovalent transition metal cation, the compound having a perovskite structure may have a transition metal perovskite structure. The transition metal of A in Chemical Formula 1 may be titanium.

[0139] In addition, when A in Chemical Formula 1 is a monovalent alkali metal cation, the compound having a perovskite structure may have an inorganic metal perovskite structure. The alkali metal of A in Chemical Formula 1 may be Na, K, Rb, Cs, or Fr.

[0140] The halogen anion in Chemical Formula 1 may be Cl - Br - or I - .

[0141] When the compound having a perovskite structure has an organic / inorganic perovskite structure, it has a feature that it can emit light with high color purity. For example, when the compound having a perovskite structure has an inorganic metal perovskite structure, it can have a feature of material stability.

[0142] Examples of compounds having a perovskite structure may include, but are not limited to, CsPbX 3 and CsSbX 3 , for example, CsPbCl 3 、CsPbBr 3 , CsPbI 3 、CsSbCl 3 , CsSbBr 3 and CsSbI 3 .

[0143] Alternatively, the compound having a perovskite-like structure may be a compound represented by the following Chemical Formula 2:

[0144] A 3 M 2 X 9 [Chemical formula 2]

[0145] Wherein, A can be selected from the group consisting of monovalent organic cations, monovalent transition metal and alkali metal cations and combinations thereof; M can be selected from the group consisting of trivalent cations and combinations thereof; X can be selected from the group consisting of halogen anions and combinations thereof; and two or more of A, M and X can be the same or different.

[0146] Hereinafter, the definitions of A, M, and X will be described focusing on definitions different from those described above with respect to Chemical Formula 1, and the omitted contents are as described above with respect to Chemical Formula 1.

[0147] In Chemical Formula 2, the trivalent cation may be a trivalent cation of a metalloid or a late transition metal, for example, Sb 3+ Or Bi 3+ , but not limited to this.

[0148] Examples of compounds having a perovskite-like structure include, but are not limited to, Cs 3 Sb 2 X 9 , for example, Cs 3 Sb 2 Cl 9 , Cs 3 Sb 2 Br 9 and Cs 3 Sb 2 I 9 .

[0149] The compound having a double perovskite structure may be a compound represented by the following Chemical Formula 3:

[0150] A 2 MM'X 6 [Chemical formula 3]

[0151] Wherein, A may be selected from the group consisting of monovalent organic cations, monovalent transition metal and alkali metal cations and combinations thereof; M may be a monovalent transition metal, alkali metal or In cation; M' may be a trivalent cation; X may be selected from the group consisting of halogen anions and combinations thereof; and two or more of A, M and X may be the same or different.

[0152] A, M, M' and X are defined as described above with respect to Chemical Formula 1 or Chemical Formula 2.

[0153] Alternatively, the compound having a perovskite-like structure may be a compound represented by the following Chemical Formula 4:

[0154] A 2 MX 4 [Chemical formula 4]

[0155] Wherein, A may be selected from the group consisting of monovalent organic cations, monovalent transition metal and alkali metal cations and combinations thereof; M may be a divalent metal cation; X may be selected from the group consisting of halogen anions and combinations thereof; and two or more of A, M and X may be the same or different.

[0156] Hereinafter, the definitions of A, M, and X will be described focusing on definitions different from those described above with respect to Chemical Formula 1, and the omitted contents are as described above with respect to Chemical Formula 1.

[0157] In Chemical Formula 4, the divalent metal cation constituting M may be a divalent cation of a transition metal or other suitable metal, for example, Mn 2+ or Zn 2+ , but not limited to this.

[0158] The perovskite compound may have the form of nanocrystals, nanoplates, nanosheets, and the like.

[0159] The perovskite compound can form a composition with a polymer (e.g., the composition can include a perovskite compound and a polymer). The polymer used to form the composition can be, for example, polystyrene, polycarbonate, acrylonitrile butadiene styrene, or polyvinyl chloride, but is not limited thereto. When the perovskite compound forms a composition with a polymer (e.g., when the perovskite compound is chemically or physically bonded to a polymer), its water resistance and heat resistance can be increased.

[0160] In this embodiment of the present disclosure, although the first color conversion pattern CCP1 has been shown as being located above the rod-type LED LD of the first sub-pixel SP1, the present disclosure is not limited thereto. For example, the first color conversion pattern CCP1 may be located beside or below the rod-type LED LD in the first sub-pixel SP1. The second color conversion pattern CCP2 may be configured to convert blue light emitted from the rod-type LED LD of the second sub-pixel SP2 into green light. The second color conversion pattern CCP2 may absorb blue light, shift its wavelength through energy conversion, and thus emit green light having a wavelength in the range of 500 nm to 565 nm.

[0161] The second color conversion pattern CCP2 may include second color conversion particles. The second color conversion particles may be perovskite compounds. The second color conversion particles may be green perovskite compounds.

[0162] In this embodiment of the present disclosure, although the second color conversion pattern CCP2 has been shown as being located above the rod-type LED LD of the second subpixel SP2, the present disclosure is not limited thereto. For example, the second color conversion pattern CCP2 may be located beside or below the rod-type LED LD in the second subpixel SP2.

[0163] At least one of the first color conversion pattern CCP1 and the second color conversion pattern CCP2 may further selectively include quantum dots, such as red quantum dots or green quantum dots.

[0164] The quantum dot may include at least one material of a group II compound semiconductor, a group III compound semiconductor, a group V compound semiconductor, and a group VI compound semiconductor. In more detail, the core nanocrystals forming the quantum dot particles may include at least one selected from the group consisting of CdSe, CdS, CdTe, ZnS, ZnSe, ZnTe, CdSeTe, CdZnS, CdSeS, PbSe, PbS, PbTe, AgInZnS, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InZnP, InGaP, InGaN, InAs, and ZnO. In addition, the shell nanocrystals may include at least one selected from the group consisting of CdS, CdSe, CdTe, CdO, ZnS, ZnSe, ZNSeS, ZnTe, ZnO, InP, InS, GaP, GaN, GaO, InZnP, InGaP, InGaN, InZnSCdSe, PbS, TiO, SrSe and HgSe.

[0165] For example, in the case where the core nanocrystal includes CdSe, when the diameter of the quantum dot is in the range of 1nm to 3nm, blue light may be generated, when the diameter of the quantum dot is in the range of 3nm to 5nm, green light may be generated, and when the diameter of the quantum dot is in the range of 7nm to 10nm, red light may be generated. However, the present disclosure is not limited thereto.

[0166] The quantum dot may have any suitable shape commonly used in the art and is not particularly limited. For example, spherical, pyramidal, multi-armed or cubic nanoparticles, nanotubes, nanowires, nanofibers and nanosheets may be used.

[0167] Generally, quantum dots have a characteristic that the larger the wavelength of incident light, the smaller the absorption coefficient. For example, when light with a wavelength of 450nm or more is incident, the absorption coefficient of red quantum dots and green quantum dots is significantly reduced.

[0168] Therefore, when light having a wavelength of 450 nm or more is incident on the color conversion layer CCL including only red quantum dots or green quantum dots, the efficiency of light finally emitted from the red quantum dots or green quantum dots is reduced.

[0169] The light emitted from the perovskite compound may have a relatively small full width at half maximum (FWHM) value. In other words, the light emitted from the perovskite compound may exhibit a relatively high color purity. The perovskite compound may be similar to a single crystal with a quantum well, so that electrons and holes may be directly coupled to the perovskite compound. The perovskite compound may include relatively few parts that do not participate in the emission of light. Therefore, as described in this embodiment of the present disclosure, if the color conversion layer CCL includes a perovskite compound, the display device may have an increased color gamut.

[0170] Therefore, in the case where blue light is incident on, for example, a perovskite compound (eg, incident on a green perovskite compound), efficiency of light finally emitted from the second subpixel SP2 may be improved due to an increase in the absorption coefficient.

[0171] Thus, the brightness of the display device according to the embodiment of the present disclosure may be improved, and the quality of an image finally displayed on the display device may be enhanced.

[0172] The first color conversion pattern CCP1 and the second color conversion pattern CCP2 may be disposed in such a manner that color conversion particles (ie, perovskite compounds and / or quantum dots) are uniformly or unevenly dispersed or stacked in a dielectric matrix according to the form of the color conversion particles.

[0173] The third color conversion pattern CCP3 may allow the blue light emitted from the rod-type LED LD to directly pass through the third color conversion pattern CCP3. To this end, the third color conversion pattern CCP3 may include a transparent layer.

[0174] The transparent layer may include a transparent polymer to allow the blue light emitted from the rod-type LED LD to pass therethrough and be directly emitted.

[0175] The transparent layer may further include a blue pigment, and the blue pigment may absorb at least one of red light and green light included in the external light.

[0176] The third color conversion pattern CCP3 including the transparent layer may be configured to directly emit blue light incident on the third color conversion pattern CCP3 without separate color conversion particles. Therefore, the intensity of light emitted from the third sub-pixel SP3 may be enhanced.

[0177] At least one of the first color conversion pattern CCP1, the second color conversion pattern CCP2, and the third color conversion pattern CCP3 may further include a scatterer. The scatterer may include, for example, TiO 2 、Al 2 O 3 、SiO 2 The scatterer may scatter light incident on the first, second, and third color conversion patterns CCP1, CCP2, and CCP3 to increase the intensity of light emitted from the first, second, and third color conversion patterns CCP1, CCP2, and CCP3 or make the front brightness and the side brightness of the light uniform (or substantially uniform).

[0178] The color conversion layer CCL may further include a light shielding pattern BLP located between the first color conversion pattern CCP1, the second color conversion pattern CCP2, and the third color conversion pattern CCP3. The light shielding pattern BLP located between the first color conversion pattern CCP1, the second color conversion pattern CCP2, and the third color conversion pattern CCP3 may prevent or reduce color mixing between the first color conversion pattern CCP1, the second color conversion pattern CCP2, and the third color conversion pattern CCP3.

[0179] Furthermore, each of the light blocking patterns BLP may be located at a non-emission region other than an emission region of a corresponding subpixel and may prevent or reduce visibility of a transistor T, a driving voltage line DVL, etc. located at the non-emission region from the outside.

[0180] The light shielding pattern BLP may include a black matrix, but it is not limited thereto. For example, the light shielding pattern BLP may be made of other suitable materials capable of blocking light.

[0181] The overcoat layer OC may be located on the color conversion layer CCL. The overcoat layer OC may serve as a planarization layer for planarizing a step structure formed by components located below the overcoat layer OC. In addition, the overcoat layer OC may serve as an encapsulation layer for preventing or reducing oxygen or water from penetrating into the rod-type LED LD.

[0182] Figure 4 According to the embodiment of the present disclosure, Figure 2 A cross-sectional view taken along line II'.

[0183] refer to Figure 1 , Figure 2 and Figure 4 , the display device according to the embodiment of the present disclosure may include a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3. Each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may include a substrate SUB, a pixel circuit layer PCL, a display element layer DPL, a color conversion layer CCL, and a coating layer OC.

[0184] In the following description, the display device according to the present embodiment will be explained focusing on the differences between the present embodiment and the previous embodiments, and redundant explanations thereof will not be repeated here.

[0185] The first color conversion pattern CCP1' may include first color conversion particles. The first color conversion particles may be quantum dots.

[0186] For example, the first color conversion pattern CCP1' may be configured to convert light emitted from the rod-type LED LD of the first sub-pixel SP1 into red light. Here, the first color conversion particles may be red quantum dots.

[0187] The second color conversion pattern CCP2' may include second color conversion particles. The second color conversion particles may be a perovskite compound.

[0188] For example, the second color conversion pattern CCP2' may be configured to convert light emitted from the rod-type LED LD of the second sub-pixel SP2 into green light. Here, the second color conversion particles may be a green perovskite compound.

[0189] The second color converting particles may also include quantum dots, for example, green quantum dots.

[0190] Figure 5 According to the embodiment of the present disclosure, Figure 2 A cross-sectional view taken along line II'.

[0191] refer to Figure 1 , Figure 2 and Figure 5, the display device according to the embodiment of the present disclosure may include a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3. Each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may include a substrate SUB, a pixel circuit layer PCL, a display element layer DPL, a color conversion layer CCL, and a coating layer OC.

[0192] In the following description, the display device according to the present embodiment will be explained focusing on the differences between the present embodiment and the previous embodiments, and redundant explanations thereof will not be repeated here.

[0193] In the embodiment of the present disclosure, the color conversion layer CCL may further include first, second, and third color filters CF1, CF2, and CF3 respectively on the first, second, and third color conversion patterns CCP1, CCP2, and CCP3.

[0194] For example, the first color filter CF1 may correspond to the first color conversion pattern CCP1, the second color filter CF2 may correspond to the second color conversion pattern CCP2, and the third color filter CF3 may correspond to the third color conversion pattern CCP3.

[0195] Each of the first color filter CF1 , the second color filter CF2 , and the third color filter CF3 may be located at a position corresponding to at least one direction in which light emitted from the color conversion layer CCL travels.

[0196] Each of the first color filter CF1, the second color filter CF2, and the third color filter CF3 may be configured to transmit only light of a set or specific color (e.g., red, green, and blue) among the light emitted from the corresponding color conversion patterns CCP1, CCP2, and CCP3 according to the corresponding sub-pixel. In an embodiment, the first color filter CF1 may be configured to transmit red light emitted from the first color conversion pattern CCP1 and block light other than red light. The second color filter CF2 may be configured to transmit green light emitted from the second color conversion pattern CCP2 and block light other than green light. The third color filter CF3 may be configured to transmit blue light emitted from the third color conversion pattern CCP3 and block light other than blue light.

[0197] Each of the first color filter CF1, the second color filter CF2, and the third color filter CF3 may include a photosensitive resin including a pigment of a set or specific color corresponding to the associated sub-pixel. In an embodiment, the first color filter CF1 may include a photosensitive resin having a red pigment, the second color filter CF2 may include a photosensitive resin having a green pigment, and the third color filter CF3 may include a photosensitive resin having a blue pigment.

[0198] The display device according to the embodiments of the present disclosure can be used in various suitable electronic devices. For example, the display device can be applied to televisions, laptop computers, cellular phones, smart phones, smart tablets (PDs), portable multimedia players (PMPs), personal digital assistants (PDAs), navigation devices, various suitable types of wearable devices such as smart watches, etc.

[0199] Various embodiments of the present disclosure may provide a display device having improved display quality (eg, improved color gamut).

[0200] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of," when following a list of elements, modify the entire list of elements and do not modify the individual elements of the list.

[0201] As used herein, the terms "substantially," "approximately," and similar terms are used as approximate terms rather than terms of degree, and are intended to account for inherent deviations in measurements or calculations that will be recognized by those of ordinary skill in the art. In addition, when describing embodiments of the present disclosure, the use of "may" refers to "one or more embodiments of the present disclosure." As used herein, the terms "use," "using," and "used" may be considered synonymous with the terms "utilize," "utilizing," and "utilized," respectively. In addition, the term "exemplary" is intended to represent an example or illustration.

[0202] In addition, any numerical range described herein is intended to include all sub-ranges of the same numerical precision contained in the recorded range. For example, the range of "1.0 to 10.0" is intended to include all sub-ranges between the recorded minimum value 1.0 and the recorded maximum value 10.0 (including this number), that is, such as having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, for example, 2.4 to 7.6. Any maximum numerical limit recorded herein is intended to include all smaller numerical limits contained therein, and any minimum numerical limit recorded in this specification is intended to include all higher numerical limits contained therein. Therefore, the applicant reserves the right to modify this specification (including claims) to explicitly record any sub-ranges contained in the range explicitly recorded herein.

[0203] It should be understood by those skilled in the art that the present disclosure may be implemented in other detailed forms without departing from the technical spirit or scope of the present disclosure. Therefore, it should be understood that the above-mentioned embodiments are only exemplary and not restrictive in all aspects. It is intended that the scope of the present disclosure shall be limited by the attached claims and their equivalents rather than by the above description, and that various modifications, additions and substitutions derived from the meaning, scope and equivalent concepts of the attached claims fall within the scope of the present disclosure.

Claims

1. Display equipment, including: substrate; A plurality of pixels located on the substrate, each of the pixels including first to third sub-pixels, each of the first to third sub-pixels including at least one light emitting diode configured to emit light; as well as The color conversion layer comprises first to third color conversion patterns corresponding to the first to third sub-pixels respectively, wherein the first to third color conversion patterns comprise the first color conversion pattern, a second color conversion pattern, and the third color conversion pattern, and each of the first to third color conversion patterns is configured to transmit the light or convert the light into light of a different color. wherein the light emitting diode of each of the first to third sub-pixels is connected to a first electrode and a second electrode, wherein at least one of the first to third color conversion patterns comprises a perovskite compound, and The perovskite compound is represented by one selected from the group consisting of the following Chemical Formula 1, Chemical Formula 2, Chemical Formula 3 and Chemical Formula 4: AMX3 [chemical formula 1] wherein A is a monovalent organic cation or a monovalent transition metal or alkali metal cation, M is a divalent transition metal, rare earth metal, alkaline earth metal, Pb, Sn, Ge, Ga, In, Al, Sb, Bi or Po cation, X is selected from the group consisting of halogen anions and combinations thereof, and two or more of A, M and X are the same or different; A3M2X9 [Chemical Formula 2] wherein A is selected from the group consisting of monovalent organic cations, monovalent transition metal and alkali metal cations and combinations thereof, M is selected from the group consisting of trivalent cations and combinations thereof, X is selected from the group consisting of halogen anions and combinations thereof, and two or more of A, M and X are the same or different; A2MM'X6[Chemical formula 3] wherein A is selected from the group consisting of monovalent organic cations, monovalent transition metal and alkali metal cations and combinations thereof, M is a monovalent transition metal, alkali metal or In cation, M' is a trivalent cation, X is selected from the group consisting of halogen anions and combinations thereof, and two or more of A, M and X are the same or different; A2MX4 [Chemical Formula 4] wherein A is selected from the group consisting of monovalent organic cations, monovalent transition metal and alkali metal cations and combinations thereof, M is a divalent metal cation, X is selected from the group consisting of halogen anions and combinations thereof, and two or more of A, M and X are the same or different.

2. The display device according to claim 1, in, Two of the first to third color conversion patterns each include a perovskite compound, wherein the color conversion patterns each including the perovskite compound are the first color conversion pattern and the second color conversion pattern, and Wherein, the first color conversion pattern is configured to convert the light into red light, the second color conversion pattern is configured to convert the light into green light, and the third color conversion pattern is configured to transmit the light.

3. The display device according to claim 1, in, One of the first to third color conversion patterns includes a perovskite compound, and another of the first to third color conversion patterns includes a quantum dot, and Wherein, the first color conversion pattern includes quantum dots configured to convert the light into red light, and the second color conversion pattern includes a perovskite compound configured to convert the light into green light.

4. The display device according to claim 2 or claim 3, wherein: At least one of the first color conversion pattern and the second color conversion pattern further includes quantum dots.

5. The display device according to claim 2 or claim 3, wherein: The light emitting diodes of the first to third sub-pixels are configured to emit blue light.

6. The display device according to claim 1, in, The perovskite compound has a form selected from the group consisting of quantum dots, nanocrystals, nanoplates, nanosheets, and combinations thereof, and Wherein, at least one of the first to third color conversion patterns includes a polymer, and the polymer forms a composition with the perovskite compound.

7. The display device according to claim 1, wherein: The at least one of the first to third color conversion patterns is provided by dispersing or stacking the perovskite compound in a dielectric matrix.

8. The display device according to claim 1, wherein: At least one of the first to third color conversion patterns further includes a diffuser.

9. The display device according to claim 1, wherein: The color conversion layer further includes first to third color filters respectively located on the first to third color conversion patterns.

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