New LED bracket, LED and lighting device

Abstract

The present invention provides a new type of LED bracket, LED and lighting device, which includes a positive electrode substrate, a negative electrode substrate, an insulating isolation belt for insulating and isolating the two, and an insulating enclosure body enclosing the positive electrode substrate, the negative electrode substrate and the insulating isolation belt. The front surfaces of the positive electrode substrate and the negative electrode substrate have a functional area and an enclosure contact area in contact with the enclosure body. At least one of the positive electrode substrate and the negative electrode substrate has a connection transition area connecting the functional area and the enclosure contact area. The plane where the functional area is located is lower than the plane where the enclosure contact area is located, and at least one side surface of at least one substrate has at least one target side surface. The surface path value of the target side surface is greater than the side surface height value of the target side surface, and the target side surface is a non-planar surface, which can extend the path of moisture entering the functional area, thereby improving the moisture-proof performance of the LED bracket and the LED manufactured by using the LED bracket.

Description

Technical Field

[0001] The present invention relates to the field of LEDs (Light Emitting Diodes), and particularly to a new type of LED bracket, LED and lighting device. Background Art

[0002] Due to the advantages of rich colors, small size, environmental protection, energy saving, long lifespan, etc. of LEDs, they have been widely used and promoted in various fields, such as but not limited to domestic lighting, outdoor lighting, lighting decoration, advertising signs, automotive lighting or indication, traffic indication, etc. Since the external environments in which LEDs are used in different fields vary, relatively high requirements are placed on the reliability of LEDs. Among them, the moisture-proof performance of LEDs is an important measure of LED reliability, especially for application scenarios with relatively humid use or storage environments.

[0003] The existing LED bracket is shown in Figures 1-1 to 1-2 As shown, it includes a plastic enclosure 10 forming a reflection cavity, a positive electrode substrate 11, a negative electrode substrate 12 enclosed by the plastic enclosure 10, and an isolation strip 13 that insulates and isolates the positive electrode substrate 11 and the negative electrode substrate 12. A part of the front surface areas of the positive electrode substrate 11 and the negative electrode substrate 12 are in direct contact with the plastic enclosure 10, which is called the enclosure contact area; another part of the area is at the bottom of the reflection cavity as a functional area, which can be used to carry LED chips and other possible electronic devices, as well as for wiring, die bonding, and as a light reflection area, etc. The existing LED bracket has the following problems:

[0004] The enclosure contact area and the functional area on the front surfaces of the positive electrode substrate 11 and the negative electrode substrate 12 are on the same plane. Therefore, when moisture spreads along the joint between the side surface of the substrate and the plastic enclosure 10 to the front surface of the substrate, it is very easy to enter the functional area through the enclosure contact area on the front surface of the substrate, resulting in short circuits in the circuits in the functional area, damage to devices, and even directly causing the LED to die; and most of the functional areas of the substrates are plated with a silver metal layer, and the silver metal layer is also very easy to corrode under the action of moisture, causing functional defects.

[0005] The side surfaces of the positive electrode substrate 11 and the negative electrode substrate 12 are vertical surfaces, as Figure 1-2 shown. Therefore, when moisture is relatively easy to spread along the joint between the side surface of the substrate and the plastic enclosure 10 to the front surface of the substrate, it is very easy to enter the functional area through the side surfaces of the positive electrode substrate 11 and the negative electrode substrate 12 and the enclosure contact area, resulting in short circuits in the circuits in the functional area, damage to devices, and even directly causing the LED to die; and most of the functional areas of the substrates are plated with a silver metal layer, and the silver metal layer is also very easy to corrode under the action of moisture, causing functional defects.

[0006] It can be seen that the existing LED bracket and the LED made using this bracket have poor moisture-proof performance. Summary of the Invention

[0007] The new type of LED bracket, LED and light-emitting device provided by the present invention mainly solve the technical problem of poor moisture-proof performance of the existing LED bracket and the LED made by using the bracket.

[0008] To solve the above technical problem, the present invention provides a new type of LED bracket, including a positive electrode substrate, a negative electrode substrate and an insulating isolation belt. The insulating isolation belt is located between the positive electrode substrate and the negative electrode substrate to insulate and isolate the two. It also includes an insulating enclosure that encloses the positive electrode substrate, the negative electrode substrate and the insulating isolation belt; among the positive electrode substrate and the negative electrode substrate, at least one side surface of at least one substrate has at least one target side surface. The surface path value of this target side surface along the height direction is greater than the side height value of this target side surface, and this target side surface is a non-planar surface;

[0009] The front surfaces of the positive electrode substrate and the negative electrode substrate have a functional area and an enclosure contact area in contact with the enclosure; at least one of the positive electrode substrate and the negative electrode substrate also has a connection transition area connecting the functional area and the enclosure contact area. The plane where the functional area is located is lower than the plane where the enclosure contact area is located.

[0010] In an embodiment of the present invention, the target side surfaces are both present on the side surfaces of the positive electrode substrate and the negative electrode substrate;

[0011] And / or,

[0012] The planes where the functional areas of the positive electrode substrate and the negative electrode substrate are located are both lower than the plane where the enclosure contact area is located.

[0013] In an embodiment of the present invention, when the target side surfaces are both present on the side surfaces of the positive electrode substrate and the negative electrode substrate, at least one of the side surfaces of the positive electrode substrate and the negative electrode substrate in contact with the enclosure has the target side surface;

[0014] And / or,

[0015] The side surfaces of the positive electrode substrate and the negative electrode substrate in contact with the insulating isolation belt are the target side surfaces.

[0016] In an embodiment of the present invention, when the target side surfaces are both present on the side surfaces of the positive electrode substrate and the negative electrode substrate, the width of the front surfaces of the positive electrode substrate and the negative electrode substrate is greater than the width of the back surfaces.

[0017] In an embodiment of the present invention, the functional areas of the positive electrode substrate and the negative electrode substrate are located at the bottom of the reflection cavity formed by the enclosure wall; the height difference between the plane where the functional area is located and the plane where the enclosure wall contact area is located is greater than 0 and less than or equal to one-fourth of the depth of the reflection cavity.

[0018] In an embodiment of the present invention, the target side surface is a curved surface.

[0019] In an embodiment of the present invention, the target side surface is an arc-shaped curved surface.

[0020] In an embodiment of the present invention, the target side surface is a combined surface formed by combining at least two of a plane, an inclined plane, and an arc-shaped surface.

[0021] In an embodiment of the present invention, the target side surface is a stepped combined surface formed by combining at least two of a plane, an inclined plane, and an arc-shaped surface.

[0022] In an embodiment of the present invention, the stepped combined surface is composed of a horizontal plane, a vertical plane, and an arc-shaped surface connecting the horizontal plane and the vertical plane.

[0023] In an embodiment of the present invention, the connection transition area is an inclined plane, an arc-shaped surface, or a combined surface, and the combined surface is a combination of at least two of a plane, an inclined plane, and an arc-shaped surface.

[0024] To solve the above problems, the present invention also provides an LED, including the novel LED bracket described above and at least one LED chip. The LED chip is disposed on the positive electrode substrate and / or the negative electrode substrate, and the positive electrode lead and the negative electrode lead of the LED chip are electrically connected to the positive electrode substrate and the negative electrode substrate respectively.

[0025] To solve the above problems, the present invention also provides a lighting device, including the LED described above. The lighting device is a lighting device, an optical signal indicating device, a supplementary lighting device, or a backlight device.

[0026] The beneficial effects of the present invention are:

[0027] The novel LED bracket, LED and light-emitting device provided by the present invention include a positive electrode substrate, a negative electrode substrate, and an insulating isolation belt that insulates and isolates the two, and further include an insulating enclosure that encloses the positive electrode substrate, the negative electrode substrate, and the insulating isolation belt. The front surfaces of the positive electrode substrate and the negative electrode substrate have a functional area and an enclosure contact area that contacts the enclosure. At least one of the positive electrode substrate and the negative electrode substrate further has a connection transition area that connects the functional area and the enclosure contact area. The plane where the functional area is located is lower than the plane where the enclosure contact area is located. Therefore, the path between the enclosure contact area and the functional area of the substrate can be extended, that is, the path for moisture to enter the functional area can be extended, thereby improving the moisture-proof performance of the LED bracket and the LED manufactured using the LED bracket;

[0028] In addition, in the present invention, at least one of the positive electrode substrate and the negative electrode substrate can be provided with at least one target side surface on the side surface. The surface path value of the target side surface is greater than the side surface height value of the target side surface, and the target side surface is a non-planar surface. Compared with the existing setting where the side surface of the substrate is a vertical surface, the path of the side surface of the substrate can be further extended, that is, the path for moisture to enter the functional area can be extended, thereby doubling the moisture-proof performance of the LED bracket and the LED manufactured using the LED bracket, improving the reliability and durability of the LED, enabling the LED to be better applicable to various environmental application scenarios, and being more conducive to the popularization and use of the LED. Description of the Drawings

[0029] Figure 1-1 Is a top view of an LED bracket;

[0030] Figure 1-2 Is Figure 1-1 A cross-sectional view of the shown LED bracket;

[0031] Figure 2-1 Is a cross-sectional view one of the LED bracket provided in Embodiment II of the present invention;

[0032] Figure 2-2 Is a cross-sectional view two of the LED bracket provided in Embodiment II of the present invention;

[0033] Figure 2-3 Is a cross-sectional view three of the LED bracket provided in Embodiment II of the present invention;

[0034] Figure 2-4 Is a cross-sectional view four of the LED bracket provided in Embodiment II of the present invention;

[0035] Figure 3-1 Is a cross-sectional view one of the LED bracket provided in Embodiment III of the present invention;

[0036] Figure 3-2 Is a cross-sectional view two of the LED bracket provided in Embodiment III of the present invention;

[0037] Figure 3-3 Figure III of the cross-sectional view of the LED bracket provided in Embodiment III of the present invention;

[0038] Figure 3-4 Figure IV of the cross-sectional view of the LED bracket provided in Embodiment III of the present invention;

[0039] Figure 3-5 Figure V of the cross-sectional view of the LED bracket provided in Embodiment III of the present invention;

[0040] Figure 3-6 Figure VI of the cross-sectional view of the LED bracket provided in Embodiment III of the present invention;

[0041] Figure 3-7 Figure VII of the cross-sectional view of the LED bracket provided in Embodiment III of the present invention;

[0042] Figure 3-8 Figure VIII of the cross-sectional view of the LED bracket provided in Embodiment III of the present invention;

[0043] Figure 3-9 Figure IX of the cross-sectional view of the LED bracket provided in Embodiment III of the present invention;

[0044] Figure 3-10 Figure X of the cross-sectional view of the LED bracket provided in Embodiment III of the present invention;

[0045] Figure 4-1 Top view I of the LED bracket provided in Embodiment IV of the present invention;

[0046] Figure 4-2 Top view II of the LED bracket provided in Embodiment IV of the present invention;

[0047] Figure 4-3 Top view III of the LED bracket provided in Embodiment IV of the present invention;

[0048] Figure 4-4 Top view IV of the LED bracket provided in Embodiment IV of the present invention;

[0049] Figure 4-5 Top view V of the LED bracket provided in Embodiment IV of the present invention;

[0050] Figure 4-6 Top view VI of the LED bracket provided in Embodiment IV of the present invention;

[0051] Figure 5-1 Top view VII of the LED bracket provided in Embodiment IV of the present invention;

[0052] Figure 5-2 Top view VIII of the LED bracket provided in Embodiment IV of the present invention;

[0053] Figure 5-3 Top view IX of the LED bracket provided in Embodiment IV of the present invention;

[0054] Figure 5-4 Figure 10 is a top view of the LED bracket provided in the fourth embodiment of the present invention;

[0055] Among them, Figures 1-1 to 1-2 in Figures 1-1 to 1-2 , the reference numeral 10 is a plastic enclosure wall, 11 is a positive electrode substrate, 12 is a negative electrode substrate, and 13 is an isolation strip; Figures 2-1 to 2-4 in Figures 2-1 to 2-4 , 20 is an enclosure wall body, 21 is a substrate, 211 is a functional area, 212 is an enclosure wall contact area, and 214 is a target side surface; Figures 3-1 to 3-10 in Figures 3-1 to 3-10 , 30 is an enclosure wall body, 31 is a substrate, 311 is a functional area, 312 is an enclosure wall contact area, 313 is a connection transition area, and 314 is a target side surface; Figures 4-1 to 4-6 in Figures 4-1 to 4-6 , 50 is an enclosure wall body, 51 is a positive electrode substrate, 52 is a negative electrode substrate, and 53 is an insulating isolation area; Figures 5-1 to 5-4 in Figures 5-1 to 5-4 , 60 is an enclosure wall body, 61 is a substrate, 61 is a positive electrode substrate, 62 is a negative electrode substrate, and 63 is an insulating isolation area. Detailed implementation manners

[0056] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the embodiments of the present invention will be further described in detail below through specific implementation manners in combination with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0057] Embodiment 1:

[0058] In order to solve the problem of poor moisture resistance of the existing LED bracket, this embodiment provides a highly sealed LED bracket, which includes a positive electrode substrate, a negative electrode substrate, and an insulating isolation strip. The insulating isolation strip is located between the positive electrode substrate and the negative electrode substrate to insulate and isolate the two. The LED bracket in this embodiment further includes an insulating enclosure wall body that encloses the positive electrode substrate, the negative electrode substrate, and the insulating isolation strip. The front surfaces of the positive electrode substrate and the negative electrode substrate have a functional area and an enclosure wall contact area that contacts the enclosure wall body; in one example, the functional areas on the front surfaces of the positive electrode substrate and the negative electrode substrate are located at the bottom of the reflection cavity formed by the enclosure wall body.

[0059] The positive electrode substrate and the negative electrode substrate in this embodiment are both conductive substrates. The conductive substrates in this embodiment can be substrates made of various conductive materials, for example, various metal conductive substrates, including but not limited to copper substrates, aluminum substrates, iron substrates, and silver substrates; the conductive substrates can also be hybrid material conductive substrates containing conductive materials, such as conductive rubber, etc.

[0060] Optionally, a reflection layer may be further provided in the functional area on at least one of the front surfaces of the positive electrode substrate and the negative electrode substrate in this embodiment to improve the light extraction efficiency of the bracket. The reflection layer can be various light reflection layers that can improve the light extraction efficiency, such as including but not limited to a silver plating layer.

[0061] Optionally, in this embodiment, the back surface of at least one of the positive electrode substrate and the negative electrode substrate exposes the bottom of the enclosure wall as an electrode welding area. Of course, in some examples, the back surface of at least one of the positive electrode substrate and the negative electrode substrate may not be used as a welding area, but its side surface may be used as a welding area, and the specific setting can be flexibly determined according to specific application requirements.

[0062] Optionally, in this embodiment, the enclosure wall can be made of various insulating materials, such as but not limited to various plastics, insulating ceramics, etc. For example, in one example, the materials that the enclosure wall can be made of include but are not limited to epoxy resins (EP), high-temperature resistant nylon (PPA plastic), polyphthalamide (PPA), poly(1,4-cyclohexylene dimethylene terephthalate) (PCT), liquid crystal polymer (LCP), sheet molding compound (SMC), epoxy molding compound (EMC), unsaturated polyester (UP) resin, polyethylene terephthalate (PET), polycarbonate (PC), polyhexamethylene adipamide (nylon 66), and glass fiber.

[0063] Optionally, in this embodiment, the material of the insulating isolation strip can be the same as or different from that of the enclosure wall, and it can be formed together with the enclosure wall or separately.

[0064] In addition, it should be understood that the formation method of the enclosure wall in this embodiment can also be flexibly selected, such as but not limited to injection molding.

[0065] In this embodiment, the functional area and the enclosure contact area of at least one of the positive electrode substrate and the negative electrode substrate of the LED bracket are not in the same plane. For example, the functional area and the enclosure contact area on the front surface of the positive electrode substrate are not in the same plane, and / or the functional area and the enclosure contact area on the front surface of the negative electrode substrate are not in the same plane. Specifically, whether one or both of the positive electrode substrate and the negative electrode substrate have the functional area and the enclosure contact area not in the same plane can be flexibly set according to specific requirements. For example, in one example, in order to comprehensively improve the sealing performance of the LED bracket, it can be set that the functional areas and the enclosure contact areas of both the positive electrode substrate and the negative electrode substrate are not in the same plane. This setting can extend the path between the functional areas of the enclosure contact area of the substrate, that is, extend the path for moisture to enter the functional area, thereby improving the sealing performance of the LED bracket and the LED made using this LED bracket, enhancing the reliability and durability of the LED, enabling the LED to better meet the usage requirements in various environments, and being more conducive to the popularization and use of the LED.

[0066] In addition, in the present invention, at least one of the positive electrode substrate and the negative electrode substrate can be provided with at least one target side surface on the side surface. The surface path value of the target side surface is greater than the side surface height value of the target side surface, and the target side surface is a non-planar surface. Compared with the existing setting where the side surface of the substrate is a vertical surface, the path of the side surface of the substrate can be further extended, that is, the path for moisture to enter the functional area is extended, thereby doubling the moisture-proof performance of the LED bracket and the LED made using this LED bracket, enhancing the reliability and durability of the LED, enabling the LED to be better applicable to the application scenarios in various environments, and being more conducive to the popularization and use of the LED.

[0067] In one example of this embodiment, the enclosure contact area on the front surface of the substrate can be directly connected to the functional area, and the enclosure contact area can be an inclined surface, a curved surface, or other types of surfaces.

[0068] In another example of this embodiment, in order to further extend the path between the enclosure contact area and the functional area of the substrate, a connection transition area can also be provided between the enclosure contact area and the functional area of the substrate. In this way, moisture needs to pass through the enclosure contact area and the connection transition area before entering the functional area, which can further improve the moisture-proof performance of the bracket. In this embodiment, the connection transition area can also be an inclined surface, a curved surface, or a combined surface, and the combined surface can also include, but is not limited to, the combination of at least two of a plane, an inclined surface, and a curved surface.

[0069] In this embodiment, by setting that at least one of the functional area and the wall contact area of the positive substrate and the negative substrate of the LED bracket is not in the same plane, and optionally, the plane where the functional area is located can be set higher than the plane where the wall contact area is located, or the plane where the functional area is located can be set lower than the plane where the wall contact area is located. Therefore, the path between the wall contact area and the functional area of the substrate can be extended, that is, the path for moisture to enter the functional area can be extended, thereby improving the moisture-proof performance of the LED bracket and the LED manufactured using the LED bracket.

[0070] In order to better improve the airtightness of the LED bracket and thus its moisture-proof performance, in some examples, when the side of the substrate is set as the above-mentioned target side, the sides of both the positive substrate and the negative substrate can be set to have the above-mentioned target side. For example:

[0071] Example 1: At least one of the sides of the positive substrate and the negative substrate that are in contact with the enclosure body has the above-mentioned target side;

[0072] For example, when three sides of the positive substrate and the negative substrate need to be in contact with the enclosure body, and the two sides in the width direction are opposite sides, all three sides can be set as the above-mentioned target side, or only the two opposite sides among the three sides can be set as the above-mentioned target side, or only one of the sides can be set as the above-mentioned target side; specifically, which sides are set as the above-mentioned target side can be selected according to requirements.

[0073] Example 2:

[0074] The sides of the positive substrate and the negative substrate that are in contact with the insulating isolation strip are set as the above-mentioned target side.

[0075] Example 3:

[0076] At least one of the sides of the positive substrate and the negative substrate that are in contact with the enclosure body has the above-mentioned target side, and the sides of the positive substrate and the negative substrate that are in contact with the insulating isolation strip are set as the above-mentioned target side.

[0077] In this embodiment, the target side surface can be any surface whose surface path value in the height direction is greater than the side surface height value of the target side surface, and the target side surface is a non-planar surface; for example, it can be a curved surface, and when it is a curved surface, the curved surface can be set as a regular arc-shaped curved surface or an irregular curved surface. Again, for example, in some examples, the target side surface can also be a combined surface, and the combined surface includes, but is not limited to, a combined surface obtained by combining at least two of a plane, an inclined plane, and an arc-shaped surface. And when it is a combined surface, it can also be a stepped combined surface including at least two of a plane, an inclined plane, and an arc-shaped surface combined to further extend the side surface path and improve the moisture-proof performance. For example, in one example, the stepped combined surface is composed of a horizontal plane, a vertical plane, and an arc-shaped surface connecting the horizontal plane and the vertical plane; or composed of multiple inclined planes, or composed of a horizontal plane or a vertical plane and an inclined plane, or composed of a vertical plane, an inclined plane, and an arc surface, or composed of a horizontal plane, an inclined plane, and an arc surface; the specific combination composition method can be set flexibly.

[0078] In one example of this embodiment, the width of the front surface of the positive electrode substrate and the negative electrode substrate can be set to be greater than the width of the back surface, so as to better prevent external moisture from entering the functional area through the side surface of the substrate, and it is also more conducive to the production and processing of the substrate and the LED bracket.

[0079] In this embodiment, the target side surface can be formed by, but not limited to, stamping, etching, cutting and other methods.

[0080] In this embodiment, by setting that in the positive electrode substrate and the negative electrode substrate, the surface path value of at least one side surface of at least one substrate is greater than the side surface height value of the side surface, and the side surface is a non-planar surface, compared with the existing setting where the side surface of the substrate is a vertical surface, the path of the side surface of the substrate can be extended, that is, the path for moisture to enter the functional area can be extended, thereby improving the moisture-proof performance of the LED bracket and the LED manufactured by using the LED bracket, enhancing the reliability and durability of the LED, enabling the LED to be better applicable to application scenarios in various environments, and being more conducive to the popularization and use of the LED.

[0081] In this embodiment, by setting at least one of the positive electrode substrate and the negative electrode substrate of the LED bracket such that the functional area and the wall contact area are not in the same plane, and optionally, the plane where the functional area is located can be set higher than the plane where the wall contact area is located, or the plane where the functional area is located can be set lower than the plane where the wall contact area is located; at the same time, in the positive electrode substrate and the negative electrode substrate, at least one substrate has at least one target side surface, and the surface path value of the target side surface is greater than the side height value of the target side surface, and the target side surface is a non-planar surface. Compared with the existing substrate side surface which is a vertical surface, the path of the substrate side surface can be further extended, that is, the path for moisture to enter the functional area can be extended, thereby doubling the moisture-proof performance of the LED bracket and the LED manufactured using the LED bracket, improving the reliability and durability of the LED, enabling the LED to be better applicable to various environmental application scenarios, and being more conducive to the popularization and use of the LED.

[0082] Embodiment 2:

[0083] For the sake of easy understanding, in this embodiment, taking the case where the wall contact area on the substrate is directly connected to the functional area and the functional area is located above the wall contact area, and combining several example target side surface structures as examples for illustration.

[0084] Please refer to Figure 2-1 As shown in the figure, the figure shows a schematic diagram of the direct connection between the wall contact area and the functional area on a substrate, where 20 is the enclosure body, 21 is the substrate (which may be the positive electrode substrate and / or the negative electrode substrate), 211 is the functional area, 212 is the wall contact area, and 214 is the target side surface. In Figure 2-1 , the wall contact area 212 is an inclined surface, and the functional area 211 is a plane located on the wall contact area 212. Of course, the functional area 211 can also be set as a non-planar surface according to requirements. The path between the wall contact area 212 and the functional area 211 is significantly longer than the path when the existing wall contact area and the functional area are set in the same plane. Therefore, the path for moisture to enter the functional area can be lengthened, thereby improving the moisture-proof performance of the bracket and the reliability of the LED lamp beads or other products manufactured using the bracket. In addition, in Figure 1, both opposite side surfaces of the substrate are set as the target side surface 214, and the target side surface 214 is a curved surface, and the front width and the back width of the substrate are basically the same. Figure 2-1The surface path value of the target side 214 in the height direction is the length value of the line indicated by 212 in the figure. With respect to the vertical surface setting of the substrate side, its path is significantly lengthened. Therefore, the path for moisture to enter the functional area can be further extended, thereby doubling the moisture-proof performance of the bracket and improving the reliability of the LED lamp beads or other products made using this bracket. Of course, in some examples, the target side can also be set as an inclined plane. Compared with the vertical surface setting of the substrate side, it can also extend the path for moisture to enter the functional area to a certain extent. However, its path is shorter compared to the curved surface or combined surface setting, and setting it as a curved surface or combined surface is also more conducive to the combination of the substrate side and the enclosure wall 20 or the insulating isolation belt, increasing the combination area of the two. While improving the airtightness, the overall strength of the bracket can also be enhanced.

[0085] In some examples, the enclosure contact area 212 can also not be an inclined plane, but other types of surfaces. For example, referring to Figure 2-2 As shown, the enclosure contact area 212 in this figure is an arc surface, and it is a convex arc surface protruding outward from the outside of the substrate 21. Figure 2-2 The setting of the convex arc surface shown relative to Figure 2-1 The inclined plane shown can further extend the path for moisture to enter the functional area. Therefore, the moisture-proof effect can be further improved. And in some examples, the width of the front side of the substrate and the width of the back side do not have to be the same. For example, referring to Figure 2-2 As shown, the target side 214 still adopts the curved surface setting, but the curved surfaces on both sides extend outward in an overall "eight" shape, making the width of the front side of the substrate smaller than the width of the back side; this setting method can further extend the path for moisture to enter the functional area; of course, Figure 2-4 The target side 214 shown in

[0086] In some examples, when the enclosure contact area 212 is an arc surface, in addition to being the Figure 2-2 convex arc surface shown, it can also be other types of arc surfaces. For example, referring to Figure 2-3 As shown, it is an inner arc surface concave toward the inside of the substrate 21. Compared with the Figure 2-1 inclined plane shown, it can also further extend the path for moisture to enter the functional area. Therefore, the moisture-proof effect can be further improved. At the same time, referring to Figure 2-3 As shown, the target side 214 can be composed of multiple continuous small curved surfaces. This setting method enables the target side to be more firmly combined with the enclosure wall 20 or the insulating isolation belt, enhancing the strength and airtightness of the bracket. Referring to Figure 2-4 As shown, the target side 214 can extend relatively inward, making the width of the front side of the substrate larger than the width of the back side, which is more conducive to the processing of the substrate and the LED bracket.

[0087] Of course, it should be understood that in this embodiment, in addition to being a bevel or an arc surface, the enclosure contact area 212 can also be set to other types of surfaces according to requirements, and it can be a regular surface or an irregular surface specifically. For example, referring to Figure 2-4 as shown, the enclosure contact area 212 is a curved surface, which Figure 2-1 compared with the bevel surface shown, can also further extend the path of moisture entering the functional area, so the moisture-proof effect can be further improved.

[0088] In addition, it should be understood that Figures 2-1 to 2-4 the enclosure contact areas 212 on the opposite sides of can be set to the same surface or different surfaces, which can be flexibly set according to the application scenario specifically. And in this embodiment, the functional area 211 can also be set below the enclosure contact area; this embodiment only exemplifies several schematic diagrams of setting the target side as a curved surface, and it should be understood that when there are at least two sides on the substrate that are the above-mentioned target sides, each target side can be set to the same surface or different surfaces; and when there are target sides on both the positive electrode substrate and the negative electrode substrate, the target sides on the positive electrode substrate and the negative electrode substrate can also be set to the same surface or different surfaces. For example, for the sake of considering the unity of processing, they can all be set to the same target side.

[0089] In some examples, the forming processes of the above-mentioned enclosure contact area 212 and the target side 214 can be flexibly selected, such as including but not limited to etching, cutting, stamping, etc. The forming method is simple, low in cost and high in efficiency, which can improve the moisture-proof performance of the LED bracket while ensuring the manufacturing cost and efficiency of the bracket.

[0090] Embodiment 3:

[0091] For the sake of easy understanding, in this embodiment, it is exemplified that there is a connection transition area between the enclosure contact area and the functional area on the substrate, and the functional area is located below the enclosure contact area.

[0092] In one example of this embodiment, the planes where the functional areas of the positive electrode substrate and the negative electrode substrate are located can both be lower than the plane where the enclosure contact area is located.

[0093] In one example of this embodiment, the functional areas of the positive electrode substrate and the negative electrode substrate are located at the bottom of the reflection cavity formed by the enclosure body; the value of the height difference between the plane where the functional area is located and the plane where the enclosure contact area is located can be flexibly set. For example, the height difference can be set to be greater than 0 and less than or equal to one-fourth of the depth of the reflection cavity; of course, according to specific requirements, it can also be set to other values, such as the height difference can be set to be greater than 0 and less than or equal to one-fifth, one-sixth or one-third of the depth of the reflection cavity, etc.

[0094] In this embodiment, the connecting transition region can be an inclined surface, an arc surface, or a combined surface, and the combined surface is a combination including at least two of a flat surface, an inclined surface, and an arc surface.

[0095] Optionally, at least a part of the connecting transition region can also be in contact with the surrounding wall body to simultaneously increase the contact area between the substrate and the surrounding wall body, thereby enhancing the strength of the bracket.

[0096] The surrounding wall contact region and the connecting transition region in this embodiment can have the same or different types and / or manufacturing processes. It should be understood that the surrounding wall contact region in this embodiment can also be several types of surfaces shown in Embodiment 2.

[0097] For example, in one example, refer to Figure 3-1 As shown, where 30 is the surrounding wall body, 31 is the substrate (which may be the positive electrode substrate and / or the negative electrode substrate), 311 is the functional region, 312 is the surrounding wall contact region, 313 is the connecting transition region, and 314 is the target side surface. In Figure 3-1 , the region of the surrounding wall contact region 312 is the flat surface region where the front surface of the substrate is in direct contact with the surrounding wall body 30, and the connecting transition region 313 is the inclined surface region connecting the surrounding wall contact region 312 and the functional region 11. Through the setting of the connecting transition region 313, the path between the surrounding wall contact region 312 and the functional region 311 can be further increased, enhancing the moisture-proof performance of the bracket. And in Figure 3-1 , the target side surface is set as an arc-shaped curved surface. In one example, the target side surface 214 is the Figure 3-1 arc-shaped curved surface shown, which is a concave arc-shaped curved surface formed by inverting the substrate. The specific radian of the arc-shaped curved surface can be flexibly set according to requirements. Figure 3-1 The setting of the arc-shaped curved surface shown can not only further extend the path of moisture entering the functional region, but also enhance the bonding stability between the side surface of the substrate and the surrounding wall body or the insulating isolation belt, and make the width of the front surface of the substrate greater than the width of the back surface, which is more conducive to the processing of the substrate and the LED bracket.

[0098] Again, for example, in one example, refer to Figure 3-2 As shown, the region of the surrounding wall contact region 312 is the flat surface region where the front surface of the substrate is in direct contact with the surrounding wall body 30, and the connecting transition region 313 is the arc surface region connecting the surrounding wall contact region 312 and the functional region 11. In the Figure 3-2 example shown, the arc surface region is a concave arc surface region that is concave downward on the back surface of the substrate 31. The concave arc surface region transition connection region can further increase the path between the surrounding wall contact region 312 and the functional region 311 compared with the inclined surface transition connection region. Therefore, the moisture-proof performance and strength of the bracket can be further enhanced. When the connecting transition region 313 in this embodiment is the arc surface region connecting the surrounding wall contact region 312 and the functional region 11, it can also be a convex arc surface region that protrudes upward above the front surface of the substrate 31. Refer to Figure 3-4As shown, the relative inclined surface transition connection area can further increase the path between the enclosure contact area 312 and the functional area 311, and can also further improve the moisture-proof performance and strength of the bracket. In addition, when the target side surface in this embodiment is an arc-shaped curved surface, it can be a concave arc-shaped curved surface or a convex arc-shaped curved surface. An example is shown in Figure 3-2 As shown, the target side surface 314 shown in this figure is a convex arc-shaped curved surface protruding outward from the substrate, which can not only further extend the path of moisture entering the functional area, but also increase the bonding area between the side surface of the substrate and the enclosure body or the insulation isolation belt, thereby increasing the strength of the bracket; at the same time, the width of the front surface of the substrate is smaller than that of the back surface, which is more conducive to the heat dissipation of the LED bracket.

[0099] In this embodiment, the connection transition area can also be a combined surface, which can include, but is not limited to, the combination of at least two of a plane, an inclined surface, and an arc-shaped surface. In this embodiment, the target side surface can also be a combined surface. According to the above analysis, the combined surface includes, but is not limited to, the combined surface obtained by combining at least two of a plane, an inclined surface, and an arc-shaped surface. When it is a combined surface, it can also be a stepped combined surface including the combination of at least two of a plane, an inclined surface, and an arc-shaped surface to further extend the side path and improve the moisture-proof performance. For example, in one example, the stepped combined surface is composed of a horizontal plane, a vertical plane, and an arc-shaped surface connecting the horizontal plane and the vertical plane; or composed of multiple inclined surfaces, or composed of a horizontal plane or a vertical plane and an inclined surface, or composed of a vertical plane, an inclined surface, and an arc surface, or composed of a horizontal plane, an inclined surface, and an arc surface; the specific combination composition method can be set flexibly. The following takes several specific structures with the target side surface as a combined surface as examples for illustration.

[0100] For another example, in one example, see Figure 3-3 As shown, the area of the enclosure contact area 312 is the plane area where the front surface of the substrate is in direct contact with the enclosure body 30. The connection transition area 313 is a combined surface composed of the combination of the plane area and the inclined surface area connecting the enclosure contact area 312 and the functional area 311 on the front surface of the substrate. This combined surface can also further increase the path between the enclosure contact area 312 and the functional area 311 to improve the moisture-proof performance.

[0101] For example, in Figure 3-3 the target side surface 314 is a combined surface obtained by combining two inclined surfaces and a plane connecting these two inclined surfaces, and in Figure 3-1 the included angle at the junction of each surface is greater than 90°. This setting method can prevent the formation of air bubbles at the junction of the included angle during the injection molding process compared with the included angle less than or equal to 90°. It can further prevent the generation of air bubbles while extending the moisture entry path, thereby further improving the moisture-proof performance of the bracket. For another example, in Figure 3-4Among them, the target side surface 314 is composed of two vertical planes, a horizontal plane located between the two vertical planes, and arc surfaces respectively connecting the two vertical planes and the horizontal plane. In this way, at the connection junction of the vertical plane and the horizontal plane, it is an arc-shaped curved surface, which can also prevent the formation of air bubbles at the joint during processes such as injection molding. While extending the moisture entry path, it can further prevent the generation of air bubbles and improve the moisture-proof performance of the bracket.

[0102] For example, referring to Figure 3-5 As shown, the area of the enclosure contact area 312 is the planar area where the front side of the substrate is in direct contact with the enclosure body 30. The connection transition area 313 is a combined surface formed by the combination of a plane and an arc surface that connects the enclosure contact area 312 and the functional area 311 on the front side of the substrate, and this arc surface is a convex arc surface area that protrudes upward from the front side of the substrate 31. Also for example, referring to Figure 3-6 As shown, its difference from the bracket shown in Figure 3-5 is that the connection transition area 313 is composed of a plane and a concave arc surface area. This combined surface can also further increase the path between the enclosure contact area 312 and the functional area 311 to improve the moisture-proof performance. In Figure 3-5 the example shown, the target side surface 314 is composed of two inclined planes, a horizontal plane located between the two inclined planes, and arc surfaces respectively connecting the two inclined planes and the horizontal plane. In this way, at the connection junction of the inclined plane and the horizontal plane, it is an arc-shaped curved surface, which can also further prevent the formation of air bubbles at the joint during processes such as injection molding. In the example shown in Figure - 6, the target side surface 314 is composed of an inclined plane, a vertical plane, a horizontal plane located between the inclined plane and the vertical plane, and arc surfaces respectively connecting the two inclined planes and the vertical plane and the horizontal plane. In this way, at the connection junctions of the inclined plane and the horizontal plane and the vertical plane and the horizontal plane, it is an arc-shaped curved surface, which can also further prevent the formation of air bubbles at the joint during processes such as injection molding.

[0103] In addition, it should be understood that the connection transition areas 313 on the opposite sides of the front side of the substrate in this embodiment can also be set to the same type of surface or different types of surfaces. For example, referring to Figure 3-8 as shown, the connection transition area 313 on one side of the substrate is set to a combined surface of a plane and an inclined plane, and the connection transition area 313 on the opposite side is a combined surface of a plane and a concave arc surface. The specific setting method can be flexibly determined according to the specific application scenario and the adopted process. In this figure, the target side surface 312 is a combined surface composed of inclined planes, and the included angle between the two inclined planes is greater than 90°.

[0104] In addition, in this embodiment, a connection transition area is further provided between the enclosure contact area and the functional area on the substrate, which can be at least partially in direct contact with the additional enclosure contact area 312 to simultaneously increase the contact area between the substrate and the enclosure body. For example, referring to Figure 3-7As shown, the combined surface 313 formed by the inclined surface and the flat surface is in direct contact with the enclosure contact area 312 completely, which can further increase the contact area between the substrate and the enclosure body, thereby enhancing the strength of the bracket; at the same time, the airtightness of the bracket can be further improved to further enhance the moisture-proof performance; in Figure 3-7 it, the target side surface 312 is a stepped combined surface with multiple steps composed of a vertical flat surface, a horizontal flat surface and an arc surface. This kind of stepped combined surface can further extend the moisture entry path, increase the combined area with the enclosure body or the insulation isolation belt, and enhance the airtightness and overall strength of the LED bracket.

[0105] See Figure 3-9 As shown, the target side surface 314 is a combined surface obtained by combining two inclined surfaces and an arc surface connecting the two inclined surfaces. According to the above examples, when the target side surface in this embodiment is a combined surface, the specific combination method can be flexible and variable, and can also be flexibly selected according to specific requirements, and when setting, the overall width of the front side of the substrate can be made larger than the width of the back side of the substrate; of course, according to requirements, it can also be flexibly set that the overall width of the front side of the substrate is less than or equal to the width of the back side of the substrate.

[0106] As analyzed above, in this embodiment, when there are at least two side surfaces on the substrate that are the above-mentioned target side surfaces, the target side surfaces can be set to the same surface or different surfaces; for example, see Figure 3-10 As shown, different combined surfaces are set on the two opposite target side surfaces 314 of the substrate. Of course, one can be set as a combined surface, one as a curved surface, or both as different curved surfaces.

[0107] In this embodiment, a connection transition area is further provided between the enclosure contact area and the functional area on the substrate, which can further increase the path between the enclosure contact area 312 and the functional area 311 to enhance the moisture-proof performance; and optionally, at least part of the connection transition area can be set to be in contact with the enclosure body to simultaneously increase the contact area between the substrate and the enclosure body, thereby enhancing the strength of the bracket; in addition, at least one side surface of the substrate can be set as the target side surface to further extend the path of moisture entering the LED bracket and enhance the strength of the LED bracket.

[0108] Embodiment 4:

[0109] See Figures 1-1 to 1-2 As shown, in the existing LED bracket, the insulation isolation belt between the positive electrode substrate and the negative electrode substrate is perpendicular to the long sides of the positive electrode substrate and the negative electrode substrate and is parallel to the positive electrode substrate and the negative electrode substrate; and the insulation isolation belt is made of a relatively fragile insulating material, and in addition, the width of the insulation isolation belt is relatively narrow, resulting in easy breakage at the insulation isolation belt, reducing the overall strength and reliability of the LED bracket.

[0110] To address this problem, in this embodiment, an LED bracket with a novel structure is also provided. The cross-sectional profile of the insulating isolation belt of the LED bracket has two long sides that are arc-shaped edges, or curved edges with at least one bend, or broken line edges with at least one fold, or bevel edges with an angle greater than or equal to 10° and less than 90° with the short side of the negative substrate. In this way, when the isolation belt is stressed, part of the mechanical force can be transmitted to the positive substrate, the negative substrate, and the surrounding wall, so the strength of the insulating isolation belt can be increased.

[0111] Optionally, the two long sides of the cross-sectional profile of the insulating isolation belt in this embodiment can be parallel or non-parallel, which can be flexibly set according to specific requirements. For the sake of understanding, two examples of parallel setting and non-parallel setting are described below in this embodiment.

[0112] Example of parallel setting:

[0113] See Figure 4-1 As shown, where 50 is the surrounding wall, 51 is the positive substrate, 52 is the negative substrate, and 53 is the insulating isolation area. In Figure 4-1 , the dotted line is the short side of the negative substrate 52. In Figure 4-1 , the two long sides of the cross-sectional profile of the insulating isolation belt 53 are bevel edges with an angle A greater than or equal to 10° and less than 90° with the short side of the negative substrate. The value of this angle can be flexibly set according to at least one of the strength requirements of the specific application scenario, the material used for the insulating isolation belt, the forming process, etc. For example, in one example, the value of the angle A can be from 75° to 85°, such as the specific values being 75°, 78°, 80°, 83°, 85°, etc. In this way, when the insulating isolation belt 53 is subjected to mechanical force, part of the mechanical force received can be transmitted to the positive substrate 51, the negative substrate 52, and the surrounding wall 50, thereby enhancing the strength of the insulating isolation belt 53 and further enhancing the overall strength and reliability of the LED bracket.

[0114] In this embodiment, in addition to being bevel edges, the two long sides of the cross-sectional profile of the insulating isolation belt 53 can also be arc-shaped edges. For example, one setting is shown in Figure 4-2 . The two long sides of the cross-sectional profile of the insulating isolation belt 53 are two parallel arc-shaped edges. The setting of the arc-shaped edges can also enable the insulating isolation belt 53 to transmit part of the mechanical force received to the positive substrate 51, the negative substrate 52, and the surrounding wall 50 when the insulating isolation belt 53 is subjected to mechanical force, thereby enhancing the strength of the insulating isolation belt 53.

[0115] In this embodiment, in addition to being bevel edges and arc-shaped edges, the two long sides of the cross-sectional profile of the insulating isolation belt 53 can also be curved edges. For example, one setting is shown in Figure 4-3As shown, the two long sides of the cross-sectional profile of the insulating isolation strip 53 that are opposite to each other are two curved sides that are parallel to each other. The setting of the curved sides can also enable the insulating isolation strip 53 to transfer a part of the mechanical force it receives to the positive electrode substrate 51, the negative electrode substrate 52, and the enclosure wall 50 when the insulating isolation strip 53 is subjected to mechanical force, thereby enhancing the strength of the insulating isolation strip 53. In this embodiment, the number of bends of the curved sides can be flexibly set. For example, in addition to the curved sides shown in Figure 4-3 in addition to the curved sides shown, it can also be Figure 4-5 the curved sides shown, and of course it can also be other forms of curved sides.

[0116] In this embodiment, the two long sides of the cross-sectional profile of the insulating isolation strip 53 that are opposite to each other can be not only beveled edges, arc-shaped edges, and curved edges, but also broken-line edges with at least one bend. For example, one setting is shown in Figure 4-4 As shown, the two long sides of the cross-sectional profile of the insulating isolation strip 53 that are opposite to each other are two parallel broken-line edges. The setting of the broken-line edges can also enable the insulating isolation strip 53 to transfer a part of the mechanical force it receives to the positive electrode substrate 51, the negative electrode substrate 52, and the enclosure wall 50 when the insulating isolation strip 53 is subjected to mechanical force, thereby enhancing the strength of the insulating isolation strip 53. In this embodiment, the number of bends of the broken-line edges can be flexibly set. For example, in addition to the broken-line edges shown in Figure 4-4 in addition to the broken-line edges shown, it can also be Figure 4-6 the broken-line edges shown, and of course it can also be other forms of broken-line edges.

[0117] Non-parallel setting example:

[0118] See Figure 5-1 As shown, where 60 is the enclosure wall, 61 is the positive electrode substrate, 62 is the negative electrode substrate, and 63 is the insulating isolation area. In Figure 5-1 , the two long sides of the cross-sectional profile of the insulating isolation strip 63 that are opposite to each other are beveled edges with an angle A between the short side of the negative electrode substrate that is greater than or equal to 10° and less than 90°. These two beveled edges are not parallel to each other. In this way, when the insulating isolation strip 63 is subjected to mechanical force, a part of the mechanical force it receives can be transferred to the positive electrode substrate 61, the negative electrode substrate 62, and the enclosure wall 60, thereby enhancing the strength of the insulating isolation strip 63, and further enhancing the overall strength and reliability of the LED bracket.

[0119] In this embodiment, the two long sides of the cross-sectional profile of the insulating isolation strip 63 that are opposite to each other can be not only beveled edges, but also arc-shaped edges. For example, one setting is shown in Figure 5-2 As shown, the two long sides of the cross-sectional profile of the insulating isolation strip 63 that are opposite to each other are two non-parallel arc-shaped edges. The setting of the non-parallel arc-shaped edges can also enable the insulating isolation strip 63 to transfer a part of the mechanical force it receives to the positive electrode substrate 61, the negative electrode substrate 62, and the enclosure wall 60 when the insulating isolation strip 63 is subjected to mechanical force, thereby enhancing the strength of the insulating isolation strip 63.

[0120] In this embodiment, in addition to being bevel edges and arc edges, the two long sides of the cross-sectional profile of the insulating isolation strip 63 can also be curved edges. For example, one setting is shown in Figure 5-3 As shown, the two long sides of the cross-sectional profile of the insulating isolation strip 63 are two non-parallel curved edges. The setting of the two non-parallel curved edges can also cause a part of the mechanical force received by the insulating isolation strip 63 to be transmitted to the positive electrode substrate 61, the negative electrode substrate 62, and the enclosure 60 when the insulating isolation strip 63 is subjected to mechanical force, thereby enhancing the strength of the insulating isolation strip 63.

[0121] In this embodiment, in addition to being bevel edges, arc edges, and curved edges, the two long sides of the cross-sectional profile of the insulating isolation strip 63 can also be broken line edges with at least one bend. For example, one setting is shown in Figure 5-4 As shown, the two long sides of the cross-sectional profile of the insulating isolation strip 63 are two non-parallel broken line edges. The setting of the two non-parallel broken line edges can also cause a part of the mechanical force received by the insulating isolation strip 63 to be transmitted to the positive electrode substrate 61, the negative electrode substrate 62, and the enclosure 60 when the insulating isolation strip 63 is subjected to mechanical force, thereby enhancing the strength of the insulating isolation strip 63.

[0122] In another example of this embodiment, in order to further enhance the strength of the insulating isolation strip, the front surface of the insulating isolation strip can also be set higher than the front surfaces of the positive electrode substrate and the negative electrode substrate; and the protruding part can also span across the positive electrode substrate and the negative electrode substrate to further enhance the strength of the insulating isolation strip.

[0123] In this embodiment, the two long sides of the cross-sectional profile of the insulating isolation strip are set as arc edges, or curved edges, or broken line edges, or bevel edges with an included angle greater than or equal to 10° and less than 90° with the short side of the negative electrode substrate. When the isolation strip is stressed, a part of the mechanical force received can be transmitted to the positive electrode substrate, the negative electrode substrate, and the enclosure. Therefore, the strength of the insulating isolation strip can be increased, and the overall strength and reliability of the LED bracket and the LED manufactured using the bracket can be improved.

[0124] Embodiment Five:

[0125] This embodiment provides an LED, including the LED bracket as shown in the above embodiments, and further having at least one LED chip. The LED chip is disposed on the positive electrode substrate and / or the negative electrode substrate, and the positive electrode lead and the negative electrode lead of the LED chip are electrically connected to the positive electrode substrate and the negative electrode substrate respectively.

[0126] It should be understood that the color of the light emitted by the LED provided in this embodiment and presented to the user can be flexibly set according to actual needs and application scenarios. The color of the light emitted by the LED and presented can be flexibly controlled by, but not limited to, the following factors: the color of the light emitted by the LED chip itself, whether the LED includes a light-emitting conversion layer, and the type of the light-emitting conversion layer when the LED includes a light-emitting conversion layer.

[0127] In an example of this embodiment, the LED may further include a lens glue layer or a diffusion glue layer disposed on the LED chip (when a light-emitting conversion glue layer is disposed on the LED chip, it is disposed on the light-emitting conversion glue layer).

[0128] It should be understood that, in an example, the light-emitting conversion glue layer may be a fluorescent glue layer containing phosphor, a colloid containing quantum dot photoluminescent materials, or other light-emitting conversion glue or film that can achieve light-emitting conversion, and may also include diffusion powder or silicon powder, etc. according to needs; in this embodiment, the methods for forming the light-emitting conversion glue layer, the lens glue layer, or the diffusion glue layer on the LED chip include, but are not limited to, dispensing, molding, spraying, pasting, etc.

[0129] For example, the light-emitting conversion layer may include a phosphor glue layer, a fluorescent film, or a quantum dot QD film; the phosphor glue layer and the fluorescent film can be made of inorganic phosphors, which may be inorganic phosphors doped with rare earth elements. Among them, the inorganic phosphors include, but are not limited to, at least one of silicate, aluminate, phosphate, nitride, and fluoride phosphors.

[0130] For another example, the quantum dot QD film can be made of quantum dot phosphors; the quantum dot phosphors include, but are not limited to, at least one of BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd(SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, CsPbI3.

[0131] In this embodiment, the type of light emitted by the LED chip itself can be visible light visible to the naked eye, or ultraviolet light or infrared light invisible to the naked eye. When the type of light emitted by the LED chip itself is ultraviolet light or infrared light invisible to the naked eye, a light-emitting conversion layer can be provided on the LED chip to convert the invisible light into visible light visible to the naked eye, so that the light emitted by the LED is visible to the user. For example, when the light emitted by the LED chip itself is ultraviolet light, if the LED is to present white light visible to the user, the light-emitting conversion layer can be made by mixing red, green, and blue phosphors.

[0132] This embodiment also provides a light-emitting device, which includes the LED exemplified in the above embodiment. The light-emitting device in this embodiment can be a lighting device, a light signal indicating device, a supplementary lighting device, or a backlight device, etc. When it is a lighting device, it can specifically be a lighting device applied to various fields, such as table lamps, fluorescent lamps, ceiling lamps, downlights, street lamps, projection lamps, etc. in daily life, or high beam lights, low beam lights, and ambient lights in automobiles, or surgical lights, low electromagnetic lighting lamps, and lighting lamps for various medical instruments in the medical field, or various colored lights, landscape lighting lamps, advertising lights, etc. in the lighting for the decoration field; when it is a light signal indicating device, it can specifically be a light signal indicating device applied to various fields, such as signal indicator lights in the traffic field, various signal status indicator lights on communication devices in the communication field, and various indicator lights on vehicles; when it is a supplementary lighting device, it can be a supplementary lighting lamp in the photography field, such as a flash lamp or a supplementary lighting lamp, or a plant supplementary lighting lamp for supplementing light to plants in the agricultural field; when it is a backlight device, it can be a backlight module applied to various backlight fields, such as being applicable to mobile terminals such as monitors, televisions, mobile phones, and advertising machines.

[0133] It should be understood that the above applications are only several applications exemplified in this embodiment, and it should be understood that the applications of the LED are not limited to the several fields exemplified above.

[0134] The above content is a further detailed description of the embodiments of the present invention in combination with specific implementation manners, and it cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention belongs, without departing from the concept of the present invention, several simple deductions or substitutions can still be made, and all should be regarded as belonging to the protection scope of the present invention.

Claims

1. A new type of LED bracket, characterized in that, It includes a positive electrode substrate, a negative electrode substrate, and an insulating isolation strip. The insulating isolation strip is located between the positive electrode substrate and the negative electrode substrate to insulate and isolate the two. It also includes an insulating enclosure wall that encloses the positive electrode substrate, the negative electrode substrate, and the insulating isolation strip. Among the positive electrode substrate and the negative electrode substrate, at least one substrate has at least one target side on its side surface. The surface path value of this target side along the height direction is greater than the side height value of this target side, and this target side is a non-planar surface. The front surfaces of the positive electrode substrate and the negative electrode substrate have a functional area for wiring and an enclosure contact area that contacts the enclosure wall. At least one of the positive electrode substrate and the negative electrode substrate also has a connection transition area that connects the functional area and the enclosure contact area. The connection transition area is an inclined surface or an arc surface. At least a part of the connection transition area contacts the enclosure wall. The planes where the functional areas are located on the positive electrode substrate and the negative electrode substrate are both lower than the plane where the enclosure contact area is located.

2. The novel LED bracket according to claim 1, characterized in that, Both the side surfaces of the positive electrode substrate and the negative electrode substrate have the target side surface.

3. The novel LED bracket according to claim 2, wherein When both the side surfaces of the positive electrode substrate and the negative electrode substrate have the target side surface, at least one of the side surfaces of the positive electrode substrate and the negative electrode substrate that contacts the enclosure wall has the target side surface. and / or The side surfaces of the positive electrode substrate and the negative electrode substrate that contact the insulating isolation strip are the target side surfaces.

4. The novel LED bracket according to claim 2, characterized in that, When both the side surfaces of the positive electrode substrate and the negative electrode substrate have the target side surface, the width of the front surfaces of the positive electrode substrate and the negative electrode substrate is greater than the width of the back surfaces.

5. The novel LED bracket according to any one of claims 1-4, characterized in that, The functional areas of the positive electrode substrate and the negative electrode substrate are located at the bottom of the reflection cavity formed by the enclosure wall. The height difference between the plane where the functional area is located and the plane where the enclosure contact area is located is greater than 0 and less than or equal to one-fourth of the depth of the reflection cavity.

6. The novel LED bracket according to any one of claims 1-4, characterized in that, The target side surface is a curved surface.

7. The novel LED bracket according to claim 6, characterized in that, The target side surface is an arc curved surface.

8. The novel LED bracket according to any one of claims 1-4, characterized in that, The target side surface is a combined surface that combines at least two of a plane, an inclined surface, and an arc surface.

9. The novel LED bracket according to claim 8, wherein, The target side surface is a stepped combined surface that combines at least two of a plane, an inclined surface, and an arc surface.

10. The novel LED bracket according to claim 8, wherein, The stepped combined surface is composed of a horizontal plane, a vertical plane, and an arc surface that connects between the horizontal plane and the vertical plane.

11. An LED, characterized in that, It includes a new type of LED bracket as described in any one of claims 1-10 and at least one LED chip. The LED chip is arranged on the positive electrode substrate and / or the negative electrode substrate. The positive electrode pin and the negative electrode pin of the LED chip are electrically connected to the positive electrode substrate and the negative electrode substrate respectively.

12. A light-emitting device, characterized in that, It includes an LED as described in claim 11. The light-emitting device is a lighting device, a light signal indicating device, a supplementary lighting device, or a backlight device.

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