Camera module, processing method and device, electronic device, and storage medium

Abstract

The present disclosure relates to a camera module, a processing method and device, an electronic device, and a storage medium. The camera module may include: an image sensor; a diffraction structure, wherein the diffraction structure covers part of the photosensitive pixels on the image sensor and is used to disperse the incident light directed to the covered photosensitive pixels into diffracted light of different phases to be directed into one or more photosensitive pixels; a signal processing structure, wherein the signal processing structure obtains a first sensing signal corresponding to the photosensitive pixel that does not receive the diffracted light for generating a 2D image; and the signal processing structure obtains a second sensing signal corresponding to the diffracted light for generating 3D information.

Description

Technical Field

[0001] The present disclosure relates to the field of terminal technology, and in particular to a camera module, a processing method and device, an electronic device, and a storage medium. Background Art

[0002] By installing a camera module on an electronic device, the acquisition and generation of 2D images can be realized. With the development of 3D face recognition technology and augmented reality technology, the demand for the acquisition of 3D information through electronic devices has been proposed.

[0003] In the related art, by adding a 3D information acquisition component to an electronic device, a 3D information acquisition function based on technologies such as structured light or TOF can be realized, but it requires additional device space in the electronic device. Summary of the invention

[0004] The present disclosure provides a camera module, a processing method and device, an electronic device, and a storage medium to solve the deficiencies in the related art.

[0005] According to a first aspect of an embodiment of the present disclosure, there is provided a camera module, including:

[0006] Image sensor;

[0007] A diffraction structure, wherein the diffraction structure covers part of the photosensitive pixels on the image sensor and is used to disperse the incident light directed to the covered photosensitive pixels into diffracted light with different phases to be directed to one or more photosensitive pixels;

[0008] A signal processing structure, wherein the signal processing structure obtains a first sensing signal corresponding to a photosensitive pixel that does not receive the diffracted light, so as to generate a 2D image; and the signal processing structure obtains a second sensing signal corresponding to the diffracted light, so as to generate 3D information.

[0009] Optionally, the diffraction structure includes a plurality of diffraction regions, each of which covers one or more photosensitive pixels.

[0010] Optionally, the diffraction regions are separated from each other so that the same photosensitive pixel only receives diffraction light formed by one diffraction region.

[0011] Optionally, the photosensitive pixels on the image sensor constitute a photosensitive pixel array, and the plurality of diffraction regions are evenly distributed on the photosensitive pixel array.

[0012] Optionally, the photosensitive pixels on the image sensor constitute a photosensitive pixel array, and the distribution density of the diffraction areas in the central area of ​​the photosensitive pixel array is higher than the distribution density in the edge area.

[0013] Optionally, the diffraction structure includes a diffraction lens or a diffraction film.

[0014] Optionally, the camera module further includes a color filter covering the photosensitive pixels of the image sensor;

[0015] Wherein, the diffraction structure is located between the photosensitive pixel and the color filter, or the diffraction structure is located on a side of the color filter away from the photosensitive pixel.

[0016] According to a second aspect of the embodiments of the present disclosure, there is provided an electronic device, comprising: a camera module as described in any one of the above embodiments.

[0017] Optionally, the front camera and / or rear camera of the electronic device is composed of the camera module.

[0018] Optionally, also include:

[0019] A processor is used to obtain a first sensing signal and a second sensing signal output by the camera module, so as to generate a 2D image according to the first sensing signal and to generate 3D information according to the second sensing signal.

[0020] According to a third aspect of an embodiment of the present disclosure, a processing method is provided, which is applied to an electronic device as described in any of the above embodiments, and the method includes:

[0021] Obtaining a first sensing signal and a second sensing signal output by the camera module;

[0022] generating a 2D image according to the first sensing signal;

[0023] Generate 3D information according to the second sensing signal.

[0024] Optionally, generating a 2D image according to the first sensing signal includes:

[0025] Processing the first sensing signal and the second sensing signal to generate the 2D image;

[0026] Alternatively, signal compensation is performed on a photosensitive pixel that receives the diffracted light according to the first sensing signal, and the obtained compensated signal and the first sensing signal are processed to generate the 2D image.

[0027] Optionally, the 3D information at a position corresponding to any photosensitive pixel is generated by a second sensing signal sensed by a photosensitive pixel near any photosensitive pixel and / or a photosensitive pixel far away from any photosensitive pixel.

[0028] According to a fourth aspect of an embodiment of the present disclosure, a processing device is provided, which is applied to an electronic device as described in any of the above embodiments, and the device includes:

[0029] An acquisition unit, which acquires a first sensing signal and a second sensing signal output by the camera module;

[0030] an image generating unit, configured to generate a 2D image according to the first sensing signal;

[0031] An information generating unit generates 3D information according to the second sensing signal.

[0032] Optionally, the image generation unit includes a processing subunit or a compensation subunit;

[0033] The processing subunit is configured to process the first sensing signal and the second sensing signal to generate the 2D image;

[0034] The compensation subunit is configured to perform signal compensation on the photosensitive pixel receiving the diffracted light according to the first sensing signal, and process the obtained compensated signal and the first sensing signal to generate the 2D image.

[0035] Optionally, the 3D information at a position corresponding to any photosensitive pixel is generated by a second sensing signal sensed by a photosensitive pixel near any photosensitive pixel and / or a photosensitive pixel far away from any photosensitive pixel.

[0036] According to a fifth aspect of an embodiment of the present disclosure, there is provided an electronic device, including:

[0037] processor;

[0038] a memory for storing processor-executable instructions;

[0039] The processor implements any of the methods described in the above embodiments by running the executable instructions.

[0040] According to a sixth aspect of an embodiment of the present disclosure, there is provided a computer-readable storage medium on which computer instructions are stored, and when the instructions are executed by a processor, the steps of the method described in any of the above embodiments are implemented.

[0041] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0043] Figure 1 The figure is a schematic structural diagram of a camera module according to an exemplary embodiment.

[0044] Figure 2 is a cross-sectional view of a camera module according to an exemplary embodiment.

[0045] Figure 3 is a cross-sectional view of another camera module according to an exemplary embodiment.

[0046] Figure 4 is a schematic diagram showing a uniform arrangement of diffraction regions according to an exemplary embodiment.

[0047] Figure 5 is a schematic diagram showing another method of uniformly arranging diffraction regions according to an exemplary embodiment.

[0048] Figure 6 is a schematic diagram showing a random arrangement of diffraction regions according to an exemplary embodiment.

[0049] Figure 7 It is a schematic diagram showing an orderly arrangement of diffraction regions according to an exemplary embodiment.

[0050] Figure 8 The invention is a flowchart of a processing method according to an exemplary embodiment.

[0051] Fig. 9 The invention is a block diagram of a processing device according to an exemplary embodiment.

[0052] Fig.10 It is a block diagram of another processing device according to an exemplary embodiment.

[0053] Fig.11 It is a schematic structural diagram of a processing device according to an exemplary embodiment. DETAILED DESCRIPTION

[0054] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0055] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0056] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0057] Figure 1 FIG. 1 is a schematic diagram showing the structure of a camera module according to an exemplary embodiment. Figure 1 As shown, the camera module includes: an image sensor 1 (sensor), a diffraction structure 2 and a signal processing structure 3. The image sensor 1 includes a plurality of photosensitive pixels, which form a Figure 1 The R (red), G (green), and B (blue) pixel array shown is used to sense the light directed to the image sensor 1. The diffraction structure 2 can cover part of the photosensitive pixels on the image sensor 1, such as Figure 1 The pixel array includes 64 photosensitive pixels, of which the diffraction structure 2 covers 16 photosensitive pixels. The diffraction structure 2 can disperse the incident light directed to the covered photosensitive pixels into diffraction light of different phases to be incident on one or more photosensitive pixels (i.e., one photosensitive pixel can receive diffraction light of one or more phases); the signal processing structure 3 can obtain a first sensing signal corresponding to the photosensitive pixel that does not receive the diffraction light for generating a 2D image, and the signal processing structure 3 can obtain a second sensing signal corresponding to the diffraction light for generating 3D information.

[0058] Therefore, it is only necessary to assemble the camera module based on the present disclosure in the electronic device without installing a separate 3D information acquisition component in the electronic device, so as to have the function of acquiring 2D images and 3D information, thereby avoiding the additional space occupation of the electronic device. Among them, since the diffraction structure 2 only covers part of the photosensitive pixels of the image sensor 1, it is possible to minimize the impact on the generation of 2D images while ensuring the acquisition of 3D information, thereby avoiding the reduction of the quality of the 2D images.

[0059] In one embodiment, the diffraction structure 2 can be made of any material that can achieve diffraction function, and the present disclosure is not limited to this. For example, the diffraction structure 2 can be a diffraction lens; for another example, the diffraction structure 2 can be a diffraction film, etc.

[0060] In one embodiment, Figure 1 The image sensor 1 in the illustrated embodiment arranges RBG photosensitive pixels using a Bayer array, but the present disclosure may also be applicable to any other type of pixel arrangement, such as the RGBW pixel arrangement and X-Trans pixel arrangement in the related art, and the present disclosure is not limited thereto.

[0061] In the technical solution disclosed in the present invention, it is sufficient to ensure that the diffraction structure 2 can diffract the light directed to the image sensor 1 (the light directed to the photosensitive pixels covered by the diffraction structure 2), that is, the diffraction structure 2 should be located in front of the image sensor 1, regardless of the positional relationship between the diffraction structure 2 and other structures in the camera module. For example, Figure 2 is a cross-sectional view of a camera module according to an exemplary embodiment; Figure 2 As shown, the camera module may include a color filter 4 (Color Filter) in addition to the image sensor 1 and the diffraction structure 2. The diffraction structure 2 may be located on the side of the color filter 4 away from the image sensor 1 (or photosensitive pixel), that is, the diffraction structure 2, the color filter 4 and the image sensor 1 are stacked in sequence. For another example, Figure 3 is a cross-sectional view of another camera module according to an exemplary embodiment; Figure 3 As shown, the diffraction structure 2 may be located between the image sensor 1 (or photosensitive pixel) and the color filter 4 .

[0062] In the technical solution of the present disclosure, the diffraction structure 2 may include a plurality of diffraction regions 20, such as Figure 1 The embodiment shown includes four diffraction regions 20, while other embodiments may include other numbers of one or more diffraction regions 20, which is not limited by the present disclosure. Each diffraction region 20 may be of any shape, such as Figure 1 The present disclosure is not limited to the circular or other elliptical, rectangular, etc. shapes shown.

[0063] Combination Figure 2-3 In the embodiment shown, the diffraction structure 2 includes several diffraction regions 20 which are often located in the same layer, and the distances between each diffraction region 20 and the image sensor 1 are equal. These diffraction regions 20 may be independent of each other, or may be connected as a whole by transparent materials, and the present disclosure does not limit this.

[0064] Figure 4FIG. 1 is a schematic diagram showing a method of uniformly arranging diffraction regions according to an exemplary embodiment. Figure 4 As shown, the diffraction structure 2 may include four diffraction regions 20, which may be evenly distributed on the pixel array formed by the image sensor 1, so that the influence of the diffraction structure 2 on the 2D image is evenly distributed to each position, avoiding a large influence on the 2D image locally. Figure 5 is a schematic diagram showing another method of uniformly arranging diffraction regions according to an exemplary embodiment; Figure 5 As shown, the diffraction structure 2 may include five diffraction regions 20 , and these diffraction regions 20 may be evenly distributed on the pixel array formed by the image sensor 1 .

[0065] In addition to the different number of diffraction regions 20, Figure 4 and Figure 5 In the illustrated embodiment, the number of photosensitive pixels covered by each diffraction region 20 is also different, for example Figure 4 Each diffraction region 20 in the embodiment can cover four photosensitive regions, Figure 5 Each diffraction region 20 in the embodiment may cover 9 or more photosensitive regions. Of course, each diffraction region 20 in the technical solution of the present disclosure may cover one or more photosensitive pixels, and the present disclosure does not limit the number of covered photosensitive pixels.

[0066] Figure 6 FIG. 1 is a schematic diagram showing a random arrangement of diffraction regions according to an exemplary embodiment. Figure 6 As shown, when the diffraction structure 2 includes a plurality of diffraction regions 20, these diffraction regions 20 may be randomly distributed on the pixel array formed by the image sensor 1, as long as the corresponding diffraction function can be achieved and 2D images and 3D information can be generated.

[0067] Figure 7 1 is a schematic diagram showing an orderly arrangement of diffraction regions according to an exemplary embodiment. In a photosensitive pixel array formed by photosensitive pixels on an image sensor 1, the distribution density of the multiple diffraction regions 20 included in the diffraction structure 2 in the central area of ​​the photosensitive pixel array can be higher than the distribution density in the edge area, for example Figure 7 In the illustrated embodiment, seven diffraction regions 20 may be distributed in the central region and only four diffraction regions 20 may be distributed in the edge region. This allows more 3D information to be obtained in the more important central region, which helps improve recognition accuracy in scenarios such as 3D face recognition.

[0068] It should be pointed out that: when the diffraction structure 2 includes multiple diffraction regions 20, these diffraction regions 20 should be separated from each other so that the same photosensitive pixel can only receive the diffraction light formed by one diffraction region 20, and avoid the diffraction light formed by multiple diffraction regions 20 from irradiating the same photosensitive pixel, thereby ensuring that the final 3D information obtained has sufficient accuracy.

[0069] In the technical solution of the present disclosure, the camera module based on any of the above embodiments can be applied to a certain electronic device, for example, the camera module can be used as the front camera or rear camera of the electronic device, or as the front camera and rear camera at the same time (the same camera can be used as both the front camera and the rear camera; or, some of the multiple cameras are used as the front camera and the rest are used as the rear camera), so that it can be used to collect 2D images and generate 3D information. Among them, the electronic device can be a mobile phone, a tablet, a laptop computer, a wearable device, etc., and the present disclosure does not limit this.

[0070] In one embodiment, the processor of the electronic device can respectively obtain the first sensing signal and the second sensing signal output by the camera module to generate a 2D image according to the first sensing signal and generate 3D information according to the second sensing signal. Figure 8 Describe in detail.

[0071] Figure 8 is a flowchart of a processing method according to an exemplary embodiment. Figure 8 As shown, the method is applied to the above electronic device and may include the following steps:

[0072] In step 802, a first sensing signal and a second sensing signal output by the camera module are obtained.

[0073] In one embodiment, the camera module has the ability to output both the first sensing signal and the second sensing signal, but the camera module may output only the first sensing signal or the second sensing signal at the same time, or may output both the first sensing signal and the second sensing signal at the same time, depending on the requirements of the processor in the electronic device.

[0074] In one embodiment, the camera module can output a first sensing signal and a second sensing signal at the same time, and the processor can choose to generate a 2D image according to the first sensing signal or generate 3D information according to the second sensing signal according to actual needs, or generate a 2D image and 3D information at the same time.

[0075] In step 804A, a 2D image is generated according to the first sensing signal.

[0076] In one embodiment, the processor may directly process the first sensing signal and the second sensing signal to generate the 2D image.

[0077] In one embodiment, since the second sensing signal contains 3D information, it may have an adverse effect on the 2D image, so the photosensitive pixel receiving the diffracted light can be compensated for the signal according to the first sensing signal, and the obtained compensated signal and the first sensing signal are processed to generate the 2D image. The above compensation process can be to correct the second sensing signal based on the first sensing signal, or to completely abandon the second sensing signal and only interpolate and repair the photosensitive pixel receiving the diffracted light based on the first sensing signal.

[0078] In step 804B, 3D information is generated according to the second sensing signal.

[0079] In one embodiment, the 3D information at the position corresponding to any photosensitive pixel is generated by the second sensing signal sensed by the photosensitive pixel near the photosensitive pixel and / or the photosensitive pixel far away from the photosensitive pixel. In particular, when generating the 3D information at a certain position, if the second sensing signal sensed by the photosensitive pixel at a longer distance is referred to, it will help to improve the baseline between the pixels for acquiring the 3D information, and can improve the accuracy of the generated 3D information.

[0080] In one embodiment, a 3D information generation scheme in the related art may be referred to so that the processor can generate 3D information based on the second sensing signal corresponding to the diffracted light. The present disclosure does not limit the content of the adopted 3D information generation scheme. For example, the principle of a 3D information generation scheme may include: dividing the photosensitive pixels into a plurality of groups, wherein a group of photosensitive pixels includes at least one side of the pixel being Figure 1 The diffraction structure 2 shown is covered, and the other side of at least one other pixel is covered by the diffraction structure 2, so the second sensing signals sensed by these pixels can be combined into a group to simulate the light receiving scene corresponding to the binocular camera, thereby calculating the corresponding 3D information (such as the depth of the object being photographed).

[0081] Corresponding to the aforementioned embodiments of the processing method, the present disclosure also provides embodiments of a processing device.

[0082] Fig. 9 is a block diagram of a processing device according to an exemplary embodiment. Fig. 9 , the device comprises:

[0083] An acquisition unit 91 acquires a first sensing signal and a second sensing signal output by the camera module;

[0084] An image generating unit 92, generating a 2D image according to the first sensing signal;

[0085] The information generating unit 93 generates 3D information according to the second sensing signal.

[0086] Optionally, the 3D information at a position corresponding to any photosensitive pixel is generated by a second sensing signal sensed by a photosensitive pixel near any photosensitive pixel and / or a photosensitive pixel far away from any photosensitive pixel.

[0087] like Fig.10 As shown, Fig.10 is a block diagram of another processing device according to an exemplary embodiment. Fig. 9 Based on the illustrated embodiment, the image generation unit 92 includes a processing subunit 921 or a compensation subunit 922;

[0088] The processing subunit 921 is configured to process the first sensing signal and the second sensing signal to generate the 2D image;

[0089] The compensation subunit 922 is configured to perform signal compensation on the photosensitive pixels receiving the diffracted light according to the first sensing signal, and process the obtained compensated signal and the first sensing signal to generate the 2D image.

[0090] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0091] For the device embodiments, since they basically correspond to the method embodiments, the relevant parts can refer to the partial description of the method embodiments. The device embodiments described above are only schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the disclosed solution. A person of ordinary skill in the art can understand and implement it without paying any creative work.

[0092] Accordingly, the present disclosure also provides a processing device, comprising: a processor; a memory for storing processor executable instructions; wherein the processor is configured to: implement the processing method as described in any of the above embodiments by running the executable instructions.

[0093] Accordingly, the present disclosure also provides a terminal, which includes a memory and one or more programs, wherein the one or more programs are stored in the memory and are configured to be executed by one or more processors, wherein the one or more programs include instructions for performing the following operations: obtaining a first sensing signal and a second sensing signal output by a camera module; generating a 2D image according to the first sensing signal; and generating 3D information according to the second sensing signal.

[0094] Optionally, generating a 2D image according to the first sensing signal includes:

[0095] Processing the first sensing signal and the second sensing signal to generate the 2D image;

[0096] Alternatively, signal compensation is performed on a photosensitive pixel that receives the diffracted light according to the first sensing signal, and the obtained compensated signal and the first sensing signal are processed to generate the 2D image.

[0097] Optionally, the 3D information at a position corresponding to any photosensitive pixel is generated by a second sensing signal sensed by a photosensitive pixel near any photosensitive pixel and / or a photosensitive pixel far away from any photosensitive pixel.

[0098] Fig.11 1 is a schematic diagram of a processing device 1100 according to an exemplary embodiment. For example, the device 1100 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0099] Reference Fig.11 , the device 1100 may include one or more of the following components: a processing component 1102 , a memory 1104 , a power component 1106 , a multimedia component 1108 , an audio component 1110 , an input / output (I / O) interface 1112 , a sensor component 1114 , and a communication component 1116 .

[0100] The processing component 1102 generally controls the overall operation of the device 1100, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 1102 may include one or more processors 1120 to execute instructions to perform all or part of the steps of the above-described method. In addition, the processing component 1102 may include one or more modules to facilitate interaction between the processing component 1102 and other components. For example, the processing component 1102 may include a multimedia module to facilitate interaction between the multimedia component 1108 and the processing component 1102.

[0101] The memory 1104 is configured to store various types of data to support the operation of the device 1100. Examples of such data include instructions for any application or method operating on the device 1100, contact data, phone book data, messages, pictures, videos, etc. The memory 1104 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0102] The power supply component 1106 provides power to the various components of the device 1100. The power supply component 1106 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the device 1100.

[0103] The multimedia component 1108 includes a screen that provides an output interface between the device 1100 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 1108 includes a front camera and / or a rear camera. When the device 1100 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and the rear camera may be a fixed optical lens system or have a focal length and optical zoom capability. Among them, the front camera and / or the rear camera may adopt a camera module based on the technical solution of the present disclosure, which has the function of collecting 2D images and 3D information at the same time, and can collect 2D images and / or 3D information according to actual needs.

[0104] The audio component 1110 is configured to output and / or input audio signals. For example, the audio component 1110 includes a microphone (MIC), and when the device 1100 is in an operating mode, such as a call mode, a recording mode, and a speech recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 1104 or sent via the communication component 1116. In some embodiments, the audio component 1110 also includes a speaker for outputting audio signals.

[0105] I / O interface 1112 provides an interface between processing component 1102 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: a home button, a volume button, a start button, and a lock button.

[0106] The sensor assembly 1114 includes one or more sensors for providing various aspects of the status assessment of the device 1100. For example, the sensor assembly 1114 can detect the open / closed state of the device 1100, the relative positioning of components, such as the display and keypad of the device 1100, the sensor assembly 1114 can also detect the position change of the device 1100 or a component of the device 1100, the presence or absence of user contact with the device 1100, the orientation or acceleration / deceleration of the device 1100, and the temperature change of the device 1100. The sensor assembly 1114 can include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 1114 can also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 1114 can also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0107] The communication component 1116 is configured to facilitate wired or wireless communication between the device 1100 and other devices. The device 1100 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 1116 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 1116 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0108] In an exemplary embodiment, the device 1100 can be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components to perform the above methods.

[0109] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 1104 including instructions, and the instructions can be executed by the processor 1120 of the device 1100 to complete the above-mentioned processing method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0110] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0111] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A camera module, characterized in that: include: An image sensor, wherein the photosensitive pixels on the image sensor constitute a photosensitive pixel array; A diffraction structure, the diffraction structure covers part of the photosensitive pixels on the image sensor, and is used to disperse the incident light directed to the covered photosensitive pixels into diffracted light with different phases to be directed to one or more photosensitive pixels, and the diffraction structure includes a plurality of diffraction regions; A signal processing structure, wherein the signal processing structure obtains a first sensing signal corresponding to a photosensitive pixel not covered by the diffractive structure, so as to generate a 2D image; Furthermore, the signal processing structure obtains a second sensing signal corresponding to the diffracted light to generate 3D information.

2. The camera module according to claim 1, characterized in that: Each diffraction region covers one or more photosensitive pixels.

3. The camera module according to claim 1, characterized in that: The diffraction areas are separated from each other, so that the same photosensitive pixel only receives the diffraction light formed by one diffraction area.

4. The camera module according to claim 1, characterized in that: A plurality of diffraction regions are evenly distributed on the photosensitive pixel array.

5. The camera module according to claim 1, characterized in that: The distribution density of the diffraction regions in the central region of the photosensitive pixel array is higher than that in the edge region.

6. The camera module according to claim 1, characterized in that: The diffractive structure includes a diffractive lens or a diffractive film.

7. The camera module according to claim 1, characterized in that: The camera module also includes a color filter covering the photosensitive pixels of the image sensor; Wherein, the diffraction structure is located between the photosensitive pixel and the color filter, or the diffraction structure is located on a side of the color filter away from the photosensitive pixel.

8. An electronic device, characterized in that: include: A camera module as described in any one of claims 1 to 7.

9. The electronic device according to claim 8, characterized in that: The front camera and / or rear camera of the electronic device is composed of the camera module.

10. The electronic device according to claim 8, characterized in that: Also includes: A processor is used to obtain a first sensing signal and a second sensing signal output by the camera module, so as to generate a 2D image according to the first sensing signal and to generate 3D information according to the second sensing signal.

11. A processing method, characterized in that: Applied to the electronic device according to any one of claims 8 to 10, the method comprising: Obtaining a first sensing signal and a second sensing signal output by the camera module; generating a 2D image according to the first sensing signal; Generate 3D information according to the second sensing signal.

12. The method according to claim 11, characterized in that The generating a 2D image according to the first sensing signal comprises: Processing the first sensing signal and the second sensing signal to generate the 2D image; Alternatively, signal compensation is performed on a photosensitive pixel that receives the diffracted light according to the first sensing signal, and the obtained compensated signal and the first sensing signal are processed to generate the 2D image.

13. The method according to claim 11, characterized in that The 3D information at the position corresponding to any photosensitive pixel is generated by the second sensing signal sensed by the photosensitive pixels near the any photosensitive pixel and / or the photosensitive pixels far away from the any photosensitive pixel.

14. A processing device, characterized in that: Applied to the electronic device according to any one of claims 8 to 10, the device comprises: An acquisition unit, which acquires a first sensing signal and a second sensing signal output by the camera module; an image generating unit, configured to generate a 2D image according to the first sensing signal; An information generating unit generates 3D information according to the second sensing signal.

15. The device according to claim 14, characterized in that The image generation unit includes a processing subunit or a compensation subunit; The processing subunit is configured to process the first sensing signal and the second sensing signal to generate the 2D image; The compensation subunit is configured to perform signal compensation on the photosensitive pixel receiving the diffracted light according to the first sensing signal, and process the obtained compensated signal and the first sensing signal to generate the 2D image.

16. The device according to claim 14, characterized in that The 3D information at the position corresponding to any photosensitive pixel is generated by the second sensing signal sensed by the photosensitive pixels near the any photosensitive pixel and / or the photosensitive pixels far away from the any photosensitive pixel.

17. An electronic device, characterized in that: include: processor; a memory for storing processor-executable instructions; The processor implements the method according to any one of claims 11 to 13 by running the executable instructions.

18. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the instruction is executed by a processor, the steps of the method according to any one of claims 11 to 13 are implemented.

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