Device for holding substrate and / or releasing holding of substrate and plating device

Abstract

The present invention provides a substrate loading and unloading device and a plating device that can be suitable for a double-sided holder. The present invention discloses a device, which is used to hold a substrate on a substrate holder and / or to release the substrate from being held by the substrate holder, wherein the substrate holder comprises a first frame and a second frame, wherein the first frame and the second frame respectively have openings, and the device comprises a substrate support unit for clamping the substrate between the first frame and the second frame, wherein the substrate support unit comprises a lower substrate support member and an upper substrate support member, wherein the lower substrate support member is configured to contact the substrate through the opening of the frame located below, and the upper substrate support member is configured to contact the substrate through the opening of the frame located above.

Description

Technical Field

[0001] The present invention relates to a device for holding a substrate on a substrate holder and / or for releasing the substrate from being held by the substrate holder, and a plating device having the device. Background Art

[0002] Patent document 1 discloses a plating device including a substrate loading and unloading device ("substrate holder opening and closing mechanism 102" in Patent document 1) for holding a substrate on a substrate holder and releasing the substrate from being held by the substrate holder.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2012-107311 Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] In Patent Document 1, a substrate holder (single-sided holder) for plating only one side of a substrate is used. On the other hand, Patent Document 1 does not consider the use of a substrate holder (double-sided holder) for plating both sides of a substrate. Therefore, one object of the present application is to provide a substrate loading and unloading device that can be adapted to a double-sided holder.

[0008] [Technical organization to solve the problem]

[0009] As one embodiment, the present application discloses a device for holding a substrate on a substrate holder and / or for releasing the substrate from the substrate holder, the substrate holder comprising a first frame and a second frame for clamping the substrate, the first frame and the second frame respectively having openings for exposing the substrate, the device comprising a substrate support unit for clamping the substrate between the first frame and the second frame, the substrate support unit comprising: a lower substrate support member, supporting the substrate from the bottom; and an upper substrate support member, supporting the substrate from the top; the lower substrate support member is configured to contact the substrate through an opening of a frame located below in the first frame and the second frame, and the upper substrate support member is configured to contact the substrate through an opening of a frame located above in the first frame and the second frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1A It is a top view of the plating apparatus according to one embodiment.

[0011] Figure 1B This is a front view of a plating apparatus according to one embodiment.

[0012] Figure 2A This is a front view of a substrate holder used in a plating apparatus according to an embodiment.

[0013] Figure 2B This is a cross-sectional view of a substrate holder used in a plating apparatus according to one embodiment.

[0014] Figure 2C yes Figure 2B An enlarged exploded view of the area marked "A".

[0015] Figure 3 It is a cross-sectional view of a portion of a substrate holder that holds a substrate.

[0016] Figure 4A It is a top view of the substrate handling device according to one embodiment.

[0017] Figure 4B This is a front view of a substrate handling device according to one embodiment.

[0018] Figure 5A It is a front view of the holder tilting part before receiving the substrate holder.

[0019] Figure 5B This is a front view of the holder tilting unit after receiving the substrate holder.

[0020] Fig. 6A It is a front view of the holder transport unit before receiving the substrate holder.

[0021] Figure 6B This is a front view of a holder transporting unit that transports a substrate holder to a pressing unit.

[0022] Fig. 7A It is a front view of the pressing portion before receiving the substrate holder.

[0023] Figure 7B This is a front view of the pressing part after receiving the substrate holder.

[0024] Figure 7C This is a front view of a pressing portion that presses the substrate holder downward.

[0025] Fig. 8A This is a perspective view of the pressing portion as seen from above.

[0026] Figure 8B This is a three-dimensional view of the pressing part viewed from above. Figure 8B The pressing portion is cut at a position slightly higher than the light source.

[0027] Figure 8C This is a three-dimensional view of the pressing part viewed from below. Figure 8CThe pressing portion is cut at a position lower than the pressing unit and higher than the stage.

[0028] Fig. 9A It is a schematic diagram of the pressing portion at the first time point (hereinafter referred to as “n-th time point”) of the operation of releasing the holding of the substrate by the substrate holder.

[0029] Fig. 9B 2 is a schematic diagram of the pressing part at the second time point.

[0030] Fig. 9C 3 is a schematic diagram of the pressing part at the third time point.

[0031] Fig.9D 3 is a schematic diagram of the pressing part at the fourth time point.

[0032] Fig.9E 3 is a schematic diagram of the pressing part at the fifth time point.

[0033] Fig.9F 3 is a schematic diagram of the pressing part at the sixth time point.

[0034] Figure 9G It is a schematic diagram of the pressing part at the seventh time point.

[0035] Figure 9H It is a schematic diagram of the pressing part at the eighth time point.

[0036] Fig.9I It is a schematic diagram of the pressing part at the ninth time point.

[0037] Figure 9J It is a schematic diagram of the pressing part at the tenth time point.

[0038] Figure 9K It is a schematic diagram of the pressing part at the eleventh time point.

[0039] Figure 9L It is a schematic diagram of the pressing part at the twelfth time point.

[0040] Figure 9M It is a schematic diagram of the pressing part at the thirteenth time point.

[0041] Fig. 10A It is a schematic diagram of the pressing part when both the light source and the camera are in the standby position.

[0042] Fig. 10B It is a schematic diagram of the pressing part when the light source is located at the irradiation position and the camera is located at the photographing position.

[0043] Fig.11 is a perspective view of a plate of a clamp having a semi-locking function.

[0044] Fig.12 is with Fig.11 A three-dimensional view of the paired hook portions of a plate.

[0045] Fig.13 Yes Fig.11 The board and Fig.12 A cross-sectional view of the hook portion of the clamp.

[0046] Fig.14 It is a schematic diagram of a pressing portion according to one embodiment.

[0047] Fig.15 This is a diagram showing an embodiment in which a substrate is attached to and detached from a substrate holder in a vertical posture.

[0048] [Explanation of Symbols]

[0049] 100: Plating equipment

[0050] 110: Loading port

[0051] 120: Substrate handling robot

[0052] 130: Dryer

[0053] 140: Substrate loading and unloading device

[0054] 150: Processing Department

[0055] 151: Front washing tank

[0056] 152: Pre-treatment tank

[0057] 153: First elution tank

[0058] 154: First plating tank

[0059] 155: Second elution tank

[0060] 156: Second plating tank

[0061] 157: The third elution tank

[0062] 158: Blowing slot

[0063] 160: Transport aircraft

[0064] 161: Transporter Arm

[0065] 162: Arm up and down movement mechanism

[0066] 163: Horizontal movement mechanism

[0067] 170: Temporary storage box

[0068] 180: Control Department

[0069] 200: Substrate holder

[0070] 200a, 200a-1: front frame (first frame)

[0071] 200b, 200b-1: rear frame (second frame)

[0072] 210a, 210b: retainer arms

[0073] 220: Shoulder Electrode

[0074] 230a, 230b: Wiring storage part

[0075] 240a, 240b: Frame body

[0076] 241a, 241b: Port

[0077] 250, 250SL: Hook

[0078] 251: Hook base

[0079] 252: Hook body

[0080] 253: Axis

[0081] 254: Rod

[0082] 260a, 260b: Open

[0083] 270, 270SL: Plate

[0084] 271: Claw

[0085] 271a: Locking claw

[0086] 271b: Half-lock claw

[0087] 290: Gripper

[0088] 300: Outer seal

[0089] 310: Inner seal

[0090] 320: Electrode for substrate

[0091] 400: Retainer receiving part

[0092] 401: Retainer receiving body

[0093] 402: Direct-acting mechanism

[0094] 410: Retainer tilting part

[0095] 411: Retainer tilting arm

[0096] 420: Retainer transport unit

[0097] 421: Retainer Carrier

[0098] 422: Carrier up and down movement mechanism

[0099] 423: Direct-acting mechanism of the transport unit

[0100] 430: Pressing part (substrate loading and unloading part, fixing part)

[0101] 431, 431-1: stage (first base)

[0102] 432, 432-1: Pressing unit (second base)

[0103] 432op: Press unit opening

[0104] 500: Pin

[0105] 800: Rack

[0106] 810: Pressing unit up and down movement mechanism

[0107] 811: Linear guide

[0108] 812: Brakes

[0109] 820, 820-1: Loading portion (contact portion)

[0110] 830: Positioning mechanism

[0111] 831: Fixing fixture

[0112] 840: Frame push rod

[0113] 850: Substrate support unit

[0114] 851, 851-1: Lower substrate support (first substrate support)

[0115] 852, 852-1: Lower substrate support member up and down moving mechanism (first substrate support member moving mechanism)

[0116] 853, 853-1: Upper substrate support (second substrate support)

[0117] 854, 854-1: Upper substrate support member up and down moving mechanism (second substrate support member moving mechanism)

[0118] 860: Gripper Opener

[0119] 870: Pressing mechanism

[0120] 880, 880-1: Frame lifting claw (claw)

[0121] 890: Light Source

[0122] 891: Camera

[0123] 892: Power sensor

[0124] 893: Actuator for light source

[0125] 894: Camera actuator

[0126] W: substrate

[0127] S1: One side of the substrate

[0128] S2: The other side of the substrate DETAILED DESCRIPTION

[0129] <About Plating Equipment>

[0130] Figure 1A and Figure 1B It is a schematic diagram of a plating apparatus 100 according to one embodiment. Figure 1A 1 is a top view of the plating apparatus 100 . Figure 1B 1 is a front view of the plating apparatus 100. The plating apparatus 100 of one embodiment includes: a loading port 110, a substrate transport robot 120, a dryer 130, a substrate loading and unloading device 140, a plating processing unit 150, a transporter 160, and a temporary storage box 170. Furthermore, the plating apparatus 100 may also include a control unit 180 for controlling each unit of the plating apparatus 100.

[0131] The load port 110 is provided for loading and unloading substrates on and from the plating apparatus 100. The load port 110 may be configured to accommodate a front opening unified pod (FOUP) or the like, or to transfer substrates between FOUP and the like.

[0132] The substrate loaded by the loading port 110 is transported by the substrate transport robot 120. Specifically, the substrate transport robot 120 is configured to be able to transport the substrate between the loading port 110, the dryer 130, and the substrate loading and unloading device 140. However, a transport mechanism other than the substrate transport robot 120 may also be used. Furthermore, "transporting a substrate to the loading port 110" in this specification includes "transporting a substrate to a mechanism such as a FOUP placed on the loading port 110". The dryer 130 is provided to dry the substrate processed by the plating processing unit 150.

[0133] The substrate loading and unloading device 140 is a device for holding a substrate on a substrate holder and / or for releasing the substrate from being held by the substrate holder. Figure 1A and Figure 1BThe substrate loading and unloading device 140 can realize both holding the substrate on the substrate holder and releasing the substrate from being held by the substrate holder. On the other hand, a substrate loading and unloading device 140 for holding the substrate on the substrate holder and a substrate loading and unloading device 140 for releasing the substrate from being held by the substrate holder may be separately provided, or only one of them may be provided. Both the substrate and the substrate holder need to be carried into the substrate loading and unloading device 140. Therefore, the substrate loading and unloading device 140 is positioned at a position where both the substrate transport robot 120 and the conveyor 160 can access it. The details of the substrate loading and unloading device 140 will be described later.

[0134] The plating treatment unit 150 is provided for performing plating treatment (plating processing) on ​​the substrate. The plating treatment unit 150 includes one or more treatment tanks. At least one of the one or more treatment tanks is a plating tank. As an example, Figure 1A and Figure 1B The processing section 150 includes 8 processing tanks, namely, a pre-rinsing tank 151, a pre-processing tank 152, a first rinsing tank 153, a first plating tank 154, a second rinsing tank 155, a second plating tank 156, a third rinsing tank 157 and a blow tank 158. The plating device 100 can sequentially perform a predetermined process in each processing tank.

[0135] The conveyor 160 is configured to transport the substrate holder between the substrate loading and unloading device 140, the plating processing unit 150, and the temporary storage box 170. Furthermore, the conveyor 160 is configured to transport the substrate holder between each processing tank (pre-rinsing tank 151 to air blowing tank 158). The conveyor 160 includes: a conveyor arm 161 for hanging the substrate holder, an arm up-down moving mechanism 162 for moving the conveyor arm 161 up and down, and a horizontal moving mechanism 163 for moving the arm up-down moving mechanism 162 horizontally along the arrangement of the processing tanks. The horizontal moving mechanism 163 can be expressed as a mechanism for moving the conveyor arm 161 horizontally. It should be noted that the configuration of the conveyor 160 is only an example.

[0136] The temporary storage box 170 is configured to be able to store at least one, preferably a plurality of substrate holders. The control unit 180 of one embodiment controls the conveyor 160 so that a substrate holder that does not hold a substrate is taken out from the substrate holders stored in the temporary storage box 170. Thereafter, the control unit 180 controls the substrate loading and unloading device 140 and the conveyor 160 so that the taken-out substrate holder is transported to the substrate loading and unloading device 140. Thereafter, the control unit 180 controls the substrate loading and unloading device 140 so that the substrate is held by the substrate holder. The substrate to be held by the substrate holder is transported from the loading port 110 to the substrate loading and unloading device 140 by the substrate transport robot 120. Through the above sequence, the substrate holder that does not hold a substrate becomes a "substrate holder that holds a substrate". Thereafter, the control unit 180 controls the substrate loading and unloading device 140 and the conveyor 160 so that the substrate holder that holds a substrate is taken out from the substrate loading and unloading device 140. Furthermore, thereafter, the control unit 180 controls the conveyor 160 so that the substrate holder is conveyed to the plating processing unit 150 .

[0137] When the substrate holder needs to release the substrate after the plating process is finished, the control unit 180 controls the elements of the plating device 100 in a sequence substantially opposite to the above sequence. That is, the control unit 180 controls the substrate loading and unloading device 140 and the conveyor 160 so that the substrate holder holding the substrate is transported to the substrate loading and unloading device 140. Thereafter, the control unit 180 controls the substrate loading and unloading device 140 to release the substrate holder from holding the substrate. Through the above sequence, the substrate holder holding the substrate becomes a "substrate holder not holding a substrate". After releasing the substrate holder from holding the substrate, another substrate may be held on the substrate holder and transported to the plating processing unit 150 again. Alternatively, after releasing the substrate holder from holding the substrate, the substrate holder may be stored in the temporary storage box 170. The substrate unloaded from the substrate holder may be transported to the loading port 110 or the dryer 130 by the substrate transport robot 120.

[0138] <About substrate holder>

[0139] Next, a substrate holder (hereinafter referred to as "200") used in the plating apparatus 100 will be described. Figure 2A to Figure 2C is a schematic diagram of a substrate holder 200 . Figure 2A 2 is a front view of the substrate holder 200 . Figure 2B is a cross-sectional view of the substrate holder 200 . Figure 2C yes Figure 2B It is an enlarged exploded view of the portion marked with "A" in FIG. 1. It should be noted that "the front of the plating apparatus 100 or the substrate handling apparatus 140" and "the front of the substrate holder 200" are not necessarily the same.

[0140] The substrate holder 200 is a member for holding the substrate by clamping the substrate between frames. The substrate holder 200 includes a front frame 200a and a rear frame 200b for clamping the substrate. The front frame 200a and the rear frame 200b are clamped by at least one, preferably a plurality of clamps 290 (the details of the clamps 290 will be described later). The substrate (hereinafter marked with the symbol "W") is Figure 2B Indicated by imaginary lines.

[0141] The front frame 200a and the rear frame 200b have a symmetrical structure except for the hook 250 and the plate 270 described later. Therefore, the names "front" and "rear" are only for convenience. Either the side where the front frame 200a is located or the side where the rear frame 200b is located can be regarded as the front side. The front frame 200a and the rear frame 200b may not have a symmetrical structure.

[0142] A holder arm 210a is provided at the upper portion of the front frame 200a. A shoulder electrode 220 may be provided at the shoulder of the holder arm 210a. Figure 2A to Figure 2C In the example of the embodiment, two shoulder electrodes 220 are provided on both shoulders of the holder arm 210a. The shoulder electrodes 220 are electrically connected to the substrate electrode 320 described later through a conductive path (wiring or busbar, etc.) not shown. The substrate electrode 320 described later is electrically connected to the substrate W, so the shoulder electrodes 220 are electrically connected to the substrate W. The holder arm 210b is provided on the rear frame 200b. The structure of the holder arm 210b is the same as that of the holder arm 210a. The front frame 200a may include a wiring accommodating portion 230a. The rear frame 200b may include a wiring accommodating portion 230b.

[0143] The front frame 200a further includes a frame body 240a. The rear frame 200b further includes a frame body 240b. The frame bodies 240a and 240b are generally plate-shaped members. An opening 260a and an opening 260b are formed in the central portion of each of the frame bodies 240a and 240b, respectively, for exposing the substrate W. Figure 2A to Figure 2C In the example of FIG. 2 , the opening 260 a and the opening 260 b are square. The shapes of the opening 260 a and the opening 260 b can be changed as needed. The substrate W is sandwiched between the frame body 240 a and the frame body 240 b.

[0144] One side of the substrate W is exposed to the outside through the opening 260a. The other side of the substrate W is exposed to the outside through the opening 260b. Figure 2A to Figure 2C When the substrate holder 200 is subjected to plating treatment, both surfaces of the substrate W are in contact with the plating liquid. Figure 2A to Figure 2CThe substrate holder 200 is a "double-sided holder". However, by covering any opening or controlling electrical conditions, the substrate holder 200 can also be used for single-sided plating.

[0145] The substrate holder 200 includes one or more clamps 290. The clamp 290 has a hook 250 mounted on the frame body 240a and a plate 270 mounted on the frame body 240b. Figure 2A to Figure 2C In the example, a total of four clamps 290 are provided.

[0146] The hook portion 250 includes a hook base 251 mounted on the frame body 240a, a hook body 252, and a shaft 253 that pivotally supports the hook body 252 relative to the hook base 251. The hook portion 250 may also include a rod 254 for pivoting the hook body 252 around the shaft 253. The hook body 252 extends in the direction of the rear frame 200b. The shaft 253 extends in a plane parallel to the surface of the substrate W to be held. The hook portion 250 also includes a pressing member (not shown) that presses the hook body 252 to the rear frame 200b around the shaft 253. Figure 2B or Figure 2C The counterclockwise force is applied to maintain the hooking between the hook body 252 and the claw 271 (described later). The pressing member may be a torsion spring, for example.

[0147] The frame body 240a is provided with a port 241a (see Figure 2C The hook 250 is mounted on the port 241a by means of bolts or the like. The frame body 240b is provided with a port 241b (see Figure 2C ). The position and number of the ports 241b correspond to the position and number of the ports 241a. The plate 270 is mounted on the ports 241b by bolts or the like. The plate 270 is provided with a claw 271 to which the hook body 252 is hooked. The claw 271 extends in the direction of the front frame 200a.

[0148] exist Figure 2A to Figure 2C In the illustrated embodiment, the hook body 252 and the claw 271 are released by pressing the lever 254 toward the frame body 240b. Alternatively, the lever 254 may be configured so that the hook is released by pulling the lever 254 toward the front side.

[0149] exist Figure 2A to Figure 2C In the embodiment, the hook 250 is mounted on the front frame 200a, and the plate 270 is mounted on the rear frame 200b. Alternatively, the hook 250 may be mounted on the rear frame 200b, and the plate 270 may be mounted on the front frame 200a.

[0150] Next, use Figure 3 The details of the portion of the substrate holder 200 that holds the substrate W will be described. Figure 3 FIG. 2 is a cross-sectional view of a portion of the substrate holder 200 that holds the substrate W. In order to perform plating on both sides of the substrate W, it is necessary to supply power to both sides of the substrate W. Figure 3 The frame body 240a and the frame body 240b are respectively provided with substrate electrodes 320. The substrate electrodes 320 are respectively electrically connected to the respective surfaces of the substrate W. The substrate electrodes 320 are electrically connected to the shoulder electrodes 220. Therefore, the power supplied to the shoulder electrodes 220 is supplied to the substrate W via the substrate electrodes 320.

[0151] The substrate holder 200 includes an outer seal 300 and an inner seal 310, which are used to seal the space where the substrate electrode 320 exists to protect it from the influence of the plating liquid. The outer seal 300 is configured to seal the gap between the frame body 240a and the frame body 240b on the outside of the substrate W. The outer seal 300 can be set on the frame body 240a or the frame body 240b. The inner seal 310 is respectively set on the frame body 240a and the frame body 240b. The inner seal 310 contacts the substrate W while holding the substrate W. The outer seal 300 and the inner seal 310 can be elastically deformed in the thickness direction of the substrate W. The substrate W is held between the frame body 240a and the frame body 240b by the contact pressure between the inner seal 310 and the substrate W. Furthermore, Figure 3 This is only a schematic diagram and may be different from the actual configuration. For example, the substrate holder 200 may have a seal holder for holding the outer seal 300 and the inner seal 310 .

[0152] <About substrate loading and unloading equipment>

[0153] In order to clamp the substrate W between the frame body 240a and the frame body 240b, the hook body 252 needs to be hooked on the claw 271. If the hook body 252 is hooked on the claw 271, the frame body 240a and the frame body 240b are restricted from being separated from each other, and the outer seal 300 and the inner seal 310 are elastically deformed in the thickness direction of the substrate W to generate sealing pressure. In order to hook the hook body 252 on the claw 271, the hook body 252 needs to be temporarily located on the back side (below the claw 271) of the claw 271. Figure 2C Therefore, in order to hold the substrate W by the substrate holder 200, it is necessary to push the frame body 240a toward the frame body 240b, or to push the frame body 240b toward the frame body 240a.

[0154] As described above, the outer seal 300 and the inner seal 310 are present between the frame body 240a and the frame body 240b. Therefore, if the frame body 240a and / or the frame body 240b are pushed, a reaction force from the outer seal 300 and the inner seal 310 is generated. The substrate handling device 140 of one embodiment is configured to be able to push the frame body 240a and / or the frame body 240b against the reaction force from the outer seal 300 and the inner seal 310. The substrate handling device 140 is also configured to be able to hook the hook body 252 on the claw 271 (pivot the hook body 252) in a state where the frame body 240a and / or the frame body 240b are pushed. The substrate handling device 140 can make the substrate holder 200 hold the substrate W through these operations. The following is a detailed description of the substrate handling device 140.

[0155] Figure 4A and Figure 4B It is a schematic diagram of a substrate handling device 140 according to one embodiment. Figure 4A It is a top view of the substrate loading and unloading device 140 . Figure 4B 1 is a front view of the substrate handling device 140. Figure 4A The substrate transport robot 120 and the conveyor 160 are shown together.

[0156] The substrate handling device 140 includes a holder receiving portion 400, a holder tilting portion 410, a holder conveying portion 420, and a pressing portion 430. The pressing portion 430 may also be referred to as a "fixing portion" or a "substrate handling portion". The conveyor 160 is configured to be accessible to the holder receiving portion 400. The substrate W is loaded on the substrate handling device 140, more specifically, on the pressing portion 430, by the substrate conveying robot 120, and is removed from the substrate handling device 140, more specifically, from the pressing portion 430, by the substrate conveying robot 120.

[0157] The holder receiving part 400 includes a holder receiving body 401 and a holder receiving direct motion mechanism 402 for moving the holder receiving body 401. The holder receiving body 401 receives the substrate holder 200 from the conveyor 160. Then, the holder receiving body 401 is moved to the vicinity of the holder tilting part 410 by the holder receiving direct motion mechanism 402.

[0158] The holder tilting portion 410 includes a holder tilting portion arm 411. Figure 5A As shown, first, the tilting arm 411 of the retainer is directed directly downward. Figure 5BAs shown, by tilting the holder tilting arm 411 to the horizontal, the holder tilting arm 411 receives the substrate holder 200 from the holder receiving body 401. By tilting the holder tilting arm 411, the substrate holder 200 tilts to the horizontal (so that the longitudinal substrate holder 200 becomes horizontal). The holder tilting arm 411 may have a pin 500 for supporting the substrate holder 200 and preventing the substrate holder 200 from falling. The pin 500 may be accommodative. The specific structure, configuration, number, etc. of the pin 500 can be appropriately determined. The substrate holder 200 may have a pin hole (not shown) corresponding to the pin 500.

[0159] The holder transport unit 420 includes a holder carrier 421, a carrier vertical movement mechanism 422 for moving the holder carrier 421 up and down, and a transport unit direct motion mechanism 423 for moving the carrier vertical movement mechanism 422 toward the pressing unit 430. Fig. 6A and Figure 6B As shown, the carrier holder 421 receives the substrate holder 200 from the lower portion of the holder tilting portion arm 411 and carries the substrate holder 200 toward the pressing portion 430 .

[0160] The pressing section 430 includes a stage 431 for horizontally placing the substrate holder 200 and a pressing unit 432. The stage 431 is configured to receive the substrate holder 200 from the holder transporting section 420. The stage 431 is also configured to deliver the substrate holder 200 to the holder transporting section 420. The pressing unit 432 is disposed above the stage 431. The pressing unit 432 is configured to be movable up and down. The pressing unit 432 can press the substrate holder 200 on the stage 431 downward.

[0161] use Figure 7A to Figure 7C The operation of the holder transport unit 420 and the pressing unit 430 is described. First, the height of the holder carrier 421 is adjusted to a suitable height by the carrier vertical movement mechanism 422 so that the substrate holder 200 can be transferred to the stage 431. Then, the holder carrier 421 is loaded into the pressing unit 430 by the transport unit direct motion mechanism 423 ( Fig. 7A Then, the holder carrier 421 is lowered by the carrier up-and-down moving mechanism 422 ( Figure 7B ). The substrate holder 200 is placed on the stage 431 by lowering the holder carrier 421 .

[0162] Next, the pressing unit 432 is lowered toward the substrate holder 200 on the stage 431 ( Figure 7CBy pressing the substrate holder 200 by the pressing unit 432, the hook body 252 and the claw 271 are positioned at a position where the hook body 252 can be hooked to the claw 271 or the hooking of the hook body 252 and the claw 271 can be released (for the hook body 252 and the claw 271, refer to Figure 2A to Figure 2C ).

[0163] It should be noted that the configuration of the substrate handling device 140 shown in the figure is only an example. For example, if the substrate holder 200 can be horizontally moved by the conveyor 160, the holder tilting portion 410 is not required. For example, if the conveyor 160 can directly transport the substrate holder 200 to the pressing portion 430, elements other than the pressing portion 430 are not required. The specific configuration of the substrate handling device 140 can be determined as appropriate. In addition, when the substrate holder 200 placed on the stage 431 is transported to the conveyor 160, the same operation as that performed by using Figure 5A and FIG. 5B to FIG. 7A ~ Figure 7C The order is reversed from the order of instructions.

[0164] <About the structure of the pressing part>

[0165] use Figure 8A to Figure 8C The details of the pressing portion 430 will be described. Fig. 8A It is a perspective view of the pressing portion 430 as viewed from above. Figure 8B It is a perspective view of the pressing portion 430 as viewed from above. Figure 8B The pressing portion 430 is cut at a position slightly higher than the light source 890 . Figure 8C It is a perspective view of the pressing portion 430 as viewed from below. Figure 8C The pressing portion 430 is cut at a position lower than the pressing unit 432 and higher than the stage 431 .

[0166] The pressing portion 430 includes a housing 800. Figure 8A to Figure 8CIn the example, the frame 800 is made of metal bars. The stage 431 is mounted on the frame 800. The stage 431 is substantially parallel to the horizontal plane. A pressing unit up and down moving mechanism 810 is provided on the stage 431. The pressing unit 432 moves up and down by the pressing unit up and down moving mechanism 810. The pressing unit up and down moving mechanism 810 may have, for example, a cylinder, or may have, for example, a combination of a ball screw and a motor. A direct-acting guide 811 and a brake 812 are also provided on the stage 431. The brake 812 may also be referred to as a "linear clamp", "linear guide clamp", etc. The direct-acting guide 811 extends upward from the stage 431 to guide the up and down movement of the pressing unit 432. The brake 812 can make the pressing unit 432 stationary at any position. The pressing unit vertical movement mechanism 810 , the linear guide 811 , and the brake 812 may have any configuration as long as they can bear the weight of the pressing unit 432 and the like.

[0167] A frame-shaped (window frame-shaped) placement portion 820 is provided substantially at the center of the stage 431. The specific shape of the placement portion 820 can be determined by the shapes of the substrate W and the substrate holder 200. The substrate holder 200 is placed on the placement portion 820. The placement portion 820 is configured to contact the substrate holder 200 (specifically, for example, the front frame 200a) but not the substrate W.

[0168] The stage 431 may include a positioning mechanism 830 and a clamping device 831. The positioning mechanism 830 positions the substrate holder 200 to be placed on the mounting portion 820 or placed on the mounting portion 820 two-dimensionally or one-dimensionally by pressing the substrate holder 200 in the horizontal direction. The specific configuration, shape and other characteristics of the positioning mechanism 830 are determined by the shape and size of the substrate holder 200. The clamping device 831 clamps the frame located below (in the Figure 9A to Figure 9M In the example, the front frame 200a) is used to fix the frame located below.

[0169] The stage 431 further includes a frame push rod 840. The frame push rod 840 lifts the upper frame (at the Figure 9A to Figure 9M The specific configuration, shape and other characteristics of the frame push rod 840 are determined by the shape, size and the like of the substrate holder 200. The operation of the frame push rod 840 will be described later.

[0170] The pressing part 430 further includes a substrate supporting unit 850 for clamping the substrate W between the front frame 200a and the rear frame 200b. The substrate supporting unit 850 may include a lower substrate supporting member 851, a lower substrate supporting member vertical movement mechanism 852, an upper substrate supporting member 853, and an upper substrate supporting member vertical movement mechanism 854.

[0171] The lower substrate support 851 is disposed on the stage 431. The lower substrate support 851 is a member that supports the substrate W from below. Specifically, the lower substrate support 851 is disposed inside a frame defined by the carrier portion 820. The lower substrate support 851 contacts the substrate W through an opening (e.g., opening 260a) of the frame located below. The contactable area of ​​the substrate W is a predetermined area, such as an area in which no wiring is formed in the substrate W. Therefore, the lower substrate support 851 is formed to contact only the contactable area of ​​the substrate W. For example, in Figure 8A to Figure 8C In the example of , the shape of the lower substrate support 851 is a cross. The lower substrate support 851 is configured to be able to move up and down by the lower substrate support up and down moving mechanism 852. Preferably, the lower substrate support up and down moving mechanism 852 is a pneumatic mechanism. However, a lower substrate support up and down moving mechanism 852 other than a pneumatic mechanism may also be used. The lower substrate support up and down moving mechanism 852 may be, for example, a motor.

[0172] The upper substrate support 853 is disposed on the upper portion of the stage 431. Figure 8A to Figure 8C In the example, the upper substrate support 853 is mounted on the frame 800. More specifically, Figure 8A to Figure 8C The pressing unit 432 has a pressing unit opening 432op, and the upper substrate support 853 is configured to be able to access the substrate W through the pressing unit opening 432op. The upper substrate support 853 is a component that supports the substrate W from the top. The upper substrate support 853 cooperates with the lower substrate support 851 to clamp the substrate W. Furthermore, the upper substrate support 853 is in direct contact with the substrate W through an opening (e.g., opening 260b) of the frame located above. Therefore, the upper substrate support 853 is also formed to contact only the contactable area of ​​the substrate W. Furthermore, it should be noted that the contactable area of ​​the substrate W may be different depending on the surface of the substrate. Therefore, the shape of the upper substrate support 853 may be different from the shape of the lower substrate support 851. Figure 8A to Figure 8C The upper substrate support 853 is, for example, in an inverted U shape and contacts the substrate W at two points. The upper substrate support 853 is configured to be able to move up and down by an upper substrate support up and down moving mechanism 854. Preferably, the upper substrate support up and down moving mechanism 854 is also a pneumatic mechanism. However, an upper substrate support up and down moving mechanism 854 other than a pneumatic mechanism may also be used.

[0173] When the upper frame is lifted, the substrate support unit 850 can move the substrate W. In the following, it is assumed that the front frame 200a is located at the bottom and the rear frame 200b is located at the top. Specifically, the substrate support unit 850 moves the substrate W in the first position (refer to Fig. 9C ) and the second position (reference Figure 9J), the first position is a position where the substrate W can be clamped by the front frame 200a and the rear frame 200b, and the second position is a position where the substrate W can be removed from the substrate loading and unloading device 140. The second position is a position higher than the first position. The first position is typically a position where the lower surface of the substrate W and the upper surface of the front frame 200a (the surface on the side opposite to the rear frame 200b) are substantially in the same plane.

[0174] The pressing unit 432 is a roughly plate-shaped member. A pressing mechanism 870 is provided on the lower surface of the pressing unit 432. The pressing mechanism 870 is a mechanism for pressing the substrate holder 200 in order to compress the outer seal 300 and the inner seal 310 of the substrate holder 200. More precisely, the pressing mechanism 870 presses the rear frame 200b in the direction of the stage 431, that is, in the downward direction. The pressing mechanism 870 can be composed of, for example, a cylinder and a piston that can move up and down. The pressing mechanism 870 can also include a motor and the like. As a result of compressing the outer seal 300 and the inner seal 310 by the pressing mechanism 870, the hook body 252 of the clamp 290 can be hooked on the claw 271. In order to evenly compress the outer seal 300 and the inner seal 310, the pressing unit 432 can have a plurality of (in Figure 8A to Figure 8C In the example shown in the figure, the substrate W is rectangular. Therefore, the sealing member is also rectangular. Therefore, in Figure 8A to Figure 8C In the example of FIG. 8 , the pressing mechanisms 870 are arranged in a rectangular shape. The specific number, position, and size of the pressing mechanisms 870 and the strength with which the pressing mechanisms 870 press the frame of the substrate holder 200 can be determined according to the characteristics of the substrate holder 200 .

[0175] A clamper opener 860 is also provided in the stage 431. The clamper 290 of the substrate holder 200 is configured to be "normally closed". The clamper opener 860 opens the clamper 290 by pressing the clamper 290. More specifically, the clamper opener 860 presses the lever 254 to pivot the hook body 252 around the axis 253 (see also Figure 2A to Figure 2C ). When the clamp 290 is opened, the hook body 252 can be hooked on the claw 271, and the hook between the hook body 252 and the claw 271 can be released. The number, configuration and other characteristics of the clamp opener 860 are determined according to the number and size of the clamps 290. Figure 8A to Figure 8C The clamp opener 860 operates two clamps 290 by one actuator.

[0176] The pressing unit 432 is provided with a frame lifting claw 880. The frame lifting claw 880 is configured to be retractable in a plane parallel to the substrate W. The frame lifting claw 880 is provided to hook the rear frame 200b and lift the frame. In order to support the substrate holder 200 at three points, it is preferred that the pressing unit 432 has three or more frame lifting claws 880. Figure 8C Six frame lifting claws 880 are shown, and two frame lifting claws 880 are a set. The pressing unit 432 can be configured to be able to lift the frame by a mechanism other than the claws. Mechanisms other than the claws include electromagnets and suction elements as examples.

[0177] The substrate handling device 140 may further include at least one set of light sources 890 and cameras 891. The light sources 890 and the cameras 891 are used when the substrate W is transported from the substrate handling robot 120 to the substrate handling device 140. Specifically, the light sources 890 and the cameras 891 are used to adjust the position and / or angle of the substrate W. The light source 890 is mounted on the stage 431. Specifically, the light source 890 is disposed outside the carrier 820. The light source 890 is configured to be pivotable (rotatably movable) by a light source actuator 893. The pivot axis of the light source 890 is along the vertical direction. By pivoting, the light source 890 moves between a light source standby position that does not hinder the loading and unloading of the substrate W and an irradiation position that is a position where light can be irradiated to the corner of the substrate W gripped by the substrate handling robot 120. Among them, the light source 890 can be moved by other mechanisms other than pivoting, such as direct motion.

[0178] The camera 891 is mounted on the frame 800 or the upper substrate support vertical movement mechanism 854. Figure 8A to Figure 8C In the example, the camera 891 is mounted on the frame 800. The camera 891 is configured to be horizontally movable by a camera actuator 894. Specifically, the camera actuator 894 moves the camera 891 between a camera standby position and a photographing position. The camera standby position is a position that does not hinder the loading and unloading of the substrate W, and is a position located on the inner side of the opening 260b so as not to interfere with the rising and falling of the rear frame 200b. The photographing position is a position opposite to the irradiation position. Furthermore, the photographing position is a position where a corner of the substrate W irradiated by the light source can be photographed. The camera 891 can be moved by other methods other than horizontal movement, such as pivoting. The specific operation of the light source 890 and the camera 891 will be described later.

[0179] The pressing part 430 may further include a current sensor 892. The current sensor 892 is a sensor for confirming the current conduction between the substrate holder 200 and the substrate W. The current sensor 892 is configured to be contactable with the shoulder electrode 220. The current sensor 892 may be accommodated by a motor or air compressor mechanism (not shown).

[0180] Furthermore, in Figure 8A to Figure 8C , the parts mounted on the stage 431 may be parts independent of the stage 431 (but excluding the mounting portion 820). That is, the description "the stage 431 includes part A" may be alternatively stated as "the pressing portion 430 includes part A". The specific configuration of the substrate loading and unloading device 140 may be appropriately determined. So far, the description has been made taking the case where the frame body 240a having the hook portion 250 is located below as an example, but if, for example, the hook portion 250 is mounted on the frame body 240b, the clamp opener 860 may be provided on the pressing unit 432 instead of on the stage 431.

[0181] <About the operation of the pressing part>

[0182] Next, use Figure 9A to Figure 9M The operation of the pressing portion 430 will be described. Figure 9A to Figure 9M In the description, the operation of the pressing portion 430 for releasing the substrate W held by the substrate holder 200 is described as an example. Figure 9A to Figure 9M It only shows the basic principle of the operation of the pressing part 430. Figure 9A to Figure 9M The size, shape, configuration, etc. of the elements shown are not accurate. Figure 9A to Figure 9M It is recorded in chronological order. Fig. 9A In the diagram, all parts are marked with symbols. Figure 9B to Figure 9M In the example, only the parts that are in operation at that point in time are marked with symbols. Figure 9A to Figure 9M , the front frame 200a is considered to be the same as the frame body 240a, and the rear frame 200b is considered to be the same as the frame body 240b.

[0183] exist Figure 9A to Figure 9M In the embodiment, the substrate W is moved between the first position and the second position by the substrate support unit 850. The first position is a position where the substrate can be clamped between the front frame 200a and the rear frame 200b ( FIG. 9C to FIG. 9I The second position is a position where the substrate W can be removed from the substrate loading and unloading device 140 ( Figure 9J , Figure 9K ). The second position is higher than the first position.

[0184] Fig. 9A1 is a schematic diagram of the pressing unit 430 at the first time point (hereinafter referred to as the "nth time point") of the operation of releasing the substrate W held by the substrate holder 200. At the first time point, the substrate holder 200 is placed on the mounting portion 820, and the pressing unit 432 is lifted. That is, Fig. 9A Equivalent to Figure 7B At the first time point, the positioning mechanism 830 ( Figure 9A to Figure 9M (not shown) and clamping device 831.

[0185] Fig. 9B 4 is a schematic diagram of the pressing unit 430 at the second time point. At the second time point, the pressing unit moves up and down by the mechanism 810 ( Figure 9A to Figure 9M The pressing unit 432 is lowered to a position where the pressing mechanism 870 can press the rear frame 200b. After the pressing unit 432 is lowered to an appropriate position, the brake 812 ( Figure 9A to Figure 9M The position of the pressing unit 432 is fixed by operating the pressing unit 432 (not shown).

[0186] Fig. 9C is a schematic diagram of the pressing part 430 at the third time point. At the third time point, the substrate support unit 850 operates. That is, at the third time point, the lower substrate support 851 is raised by the lower substrate support vertical movement mechanism 852. Furthermore, at the third time point, the upper substrate support 853 is lowered by the upper substrate support vertical movement mechanism 854. As a result, at the third time point, the substrate W is clamped by the lower substrate support 851 and the upper substrate support 853. The substrate W is Fig. 9C The substrate holder 200 is mounted on or unloaded from the substrate holder 200 at the position shown. That is, the substrate is clamped by the front frame 200a and the rear frame 200b, or the front frame 200a and the rear frame 200b are separated from each other to release the clamping of the substrate. Fig. 9C The position of the substrate W shown is the “first position.” The raising of the lower substrate support 851 and the lowering of the upper substrate support vertical moving mechanism 854 may be performed simultaneously or sequentially.

[0187] Fig.9D 4 is a schematic diagram of the pressing unit 430 at a fourth time point. At the fourth time point, the pressing mechanism 870 operates to press the rear frame 200b downward. By pressing, the outer seal 300 and the inner seal 310 are compressed, and the rear frame 200b approaches the front frame 200a. As a result, the clamp opener 860 can open the clamp 290. Since the pressing unit 432 is fixed by the brake 812, the pressing mechanism 870 can press the rear frame 200b sufficiently strongly.

[0188] Fig.9E4 is a schematic diagram of the pressing portion 430 at the fifth time point. At the fifth time point, the clamp opener 860 operates, and the clamp opener 860 pivots the hook body 252. The clamp opener 860 releases the hook between the hook body 252 and the claw 271, and opens the clamp 290. Furthermore, if the front frame 200a is fixed by the fixing fixture 831, the front frame 200a can be prevented from being lifted by the clamp opener 860.

[0189] Fig.9F 4 is a schematic diagram of the pressing portion 430 at the sixth time point. At the sixth time point, the pressing of the pressing mechanism 870 is released. Since the clamp 290 is opened at the fifth time point, when the pressing is released at the sixth time point, the rear frame 200b rises slightly due to the reaction force of the outer seal 300 and the inner seal 310.

[0190] Figure 9G 8 is a schematic diagram of the pressing portion 430 at the seventh time point. At the seventh time point, the rear frame 200b is further pushed upward by the frame push rod 840. The frame push rod 840 creates a gap large enough between the rear frame 200b and the front frame 200a to insert the frame lifting claw 880.

[0191] Figure 9H 2 is a schematic diagram of the pressing portion 430 at the eighth time point. At the eighth time point, preparation for lifting the rear frame 200b is performed. That is, at the eighth time point, the frame lifting claw 880 extends toward the gap between the rear frame 200b and the front frame 200a.

[0192] Fig.9I Schematic diagram of the pressing unit 430 at the ninth time point. At the ninth time point, the pressing unit 432 is moved up and down by the pressing unit mechanism 810 ( Figure 9A to Figure 9M The frame lifting claw 880 is hooked on the rear frame 200b, so the rear frame 200b is also lifted together with the pressing unit 432. Furthermore, at the ninth time point, the brake 812 is released. More specifically, the brake 812 is released before the pressing unit 432 is lifted. The brake 812 may also be operated again after the pressing unit 432 is lifted to a predetermined height.

[0193] Figure 9J Schematic diagram of the pressing part 430 at the tenth time point. At the tenth time point, the substrate W is floated by the substrate support unit 850. The lower substrate support 851 and the upper substrate support 853 rise, thereby separating the substrate W from the front frame 200a and floating from the front frame 200a. The substrate W floats, thereby making it easier for the substrate transport robot 120 to grasp the substrate W. That is, the lower surface of the substrate W is separated from the front frame 200a, so the substrate transport robot 120 can support and transport the lower surface of the substrate. Therefore, Figure 9JThe position of the substrate W shown is the "second position".

[0194] Figure 9K is a schematic diagram of the pressing part 430 at the eleventh time point. Figure 9K 1 shows a substrate transport robot 120. At time 11, the substrate transport robot 120 grasps the substrate W. To simplify the illustration, Figure 9K Although the substrate transport robot 120 grasps only one side of the substrate W, the substrate transport robot 120 preferably supports the substrate W over the entire surface of the substrate W. Therefore, it is desirable that at least one of the lower substrate support 851 and the upper substrate support 853 has a shape that does not interfere with the substrate transport robot 120.

[0195] Figure 9L 12 is a schematic diagram of the pressing part 430 at the twelfth time point. At the twelfth time point, the upper substrate support vertical moving mechanism 854 is raised. Thus, the clamping of the substrate by the substrate support unit 850 is released. Furthermore, since the substrate W is gripped by the substrate transport robot 120, the substrate W does not fall from the lower substrate support 851.

[0196] Figure 9M 3 is a schematic diagram of the pressing part 430 at the thirteenth time point. At the thirteenth time point, the substrate transport robot 120 transports the substrate W from the pressing part 430. The substrate transport robot 120 may move slightly upward so that the substrate W and the lower substrate support 851 do not rub against each other when transporting the substrate W, or the lower substrate support vertical moving mechanism 852 may move downward.

[0197] By the operation of the pressing portion 430 shown above, the substrate W held by the substrate holder 200 is released, and the substrate W is removed from the substrate loading and unloading device 140. In order to hold the substrate W on the substrate holder 200, the operation having the reverse order of the operation shown above (hereinafter referred to as "forward operation") is performed, that is, FIG. 9M to FIG. 9A After the substrate holder 200 has completed holding the substrate W in the reverse operation (i.e., FIG. 9B to FIG. 9A At any time point in time), the power supply between the substrate holder 200 and the substrate W can be confirmed by the power supply sensor 892. In the case where the power supply cannot be confirmed, the substrate W can be moved out of the pressing part 430 by the sequential operation. In the case where the power supply cannot be confirmed, for example, the sequential operation can be performed until the substrate W is removed from the pressing part 430. Figure 9J After that, the reverse operation is performed to confirm the power supply between the substrate holder 200 and the substrate W again.

[0198] In the reverse operation, before the substrate support unit 850 clamps the substrate W, that is, before Figures 9L to 9KAt any time point between , the positioning of the substrate W using the light source 890 and the camera 891 can be performed. Fig. 10A and Fig. 10B This positioning will be described. Fig. 10A and Fig. 10B The time points shown correspond to Figure 9L The time point shown (the twelfth time point). Fig. 10A and Fig. 10B The shape of the substrate used in the description is a rectangular shape.

[0199] Fig. 10A Schematic diagram of the pressing section 430 when both the light source 890 and the camera 891 are in the standby position. The light source 890 is located outside the loading section 820, and the camera 891 is located inside the pressing unit opening 432op and inside the opening 260b. Here, even if the height of the part A is different from that of the opening, if the entire part A can be observed from the opening when viewed from directly above or directly below (that is, the part A can pass through the opening when the part A is moved up and down), it is assumed that "the part A is located inside the opening". The light source 890 and the camera 891 located in the standby position do not hinder the loading and unloading of the substrate W by the pressing section 430. Except for the case of performing positioning of the substrate W, the light source 890 and the camera 891 stand by in the standby position.

[0200] Fig. 10B 891 is a schematic diagram of the pressing portion 430 when the light source 890 is at the irradiation position and the camera 891 is at the photographing position. As described above, the light source 890 is, for example, pivotable, and the camera 891 is, for example, horizontally movable. The photographing position is substantially directly above the irradiation position. The light source 890 located at the irradiation position irradiates light to the corner of the substrate W gripped by the substrate transport robot 120. The camera 891 located at the photographing position photographs the corner of the substrate W gripped by the substrate transport robot 120. The camera 891 can obtain a sufficient amount of light through the light source 890.

[0201] Since the shooting position is fixed, the position and / or angle of the substrate W can be calculated based on the image obtained by the camera 891. The substrate transport robot 120 adjusts the position and / or angle of the substrate W based on the calculated position and / or angle of the substrate W. In order to prevent the mutual friction between the substrate W and the lower substrate support 851, the substrate transport robot 120 can be raised and / or the lower substrate support 851 can be lowered during the position adjustment. Once the adjustment of the position and / or angle of the substrate W is completed, the light source 890 and the camera 891 return to the standby position again.

[0202] Fig. 10A and Fig. 10B A set of light sources 890 and cameras 891 are shown in FIG. Fig. 10A and Fig. 10B The number of corners of the substrate W photographed in the image is one. In order to adjust the position and / or angle of the substrate W with high precision, it is preferred to photograph multiple corners. Specifically, it is preferred to photograph at least one set of diagonal corners. Therefore, the pressing part 430 may include multiple sets of light sources 890 and cameras 891. For example Figure 8A to Figure 8C The pressing portion 430 includes two sets of light sources 890 and a camera 891 for photographing a set of diagonal images.

[0203] If sufficient contrast is obtained in order to detect the position of the corner of the substrate, the pressing part 430 may not include the light source 890. In addition, instead of the combination of the light source 890 and the camera 891, a sensor such as a laser sensor, a linear sensor, a contact sensor, etc. may be used to calculate the position and / or angle of the substrate W. In addition, the positional relationship between the camera 891, the substrate W, and the light source 890 in the height direction is not particularly limited, and the camera 891 and the light source 890 may be located above the substrate W. The position of the light source 890 may be set at a position of a specified angle, rather than being strictly set directly above the camera 891. The part of the substrate referred to in order to detect the position and / or angle of the substrate W is not limited to the corner, and may be, for example, a reference mark pre-set on the substrate W. In this specification, the parts such as the corner of the substrate and the reference mark are collectively referred to as "parts serving as the detection reference of the position and / or angle of the substrate". In this specification, the mechanism for calculating the position and / or angle of the substrate W before the substrate support unit 850 clamps the substrate is collectively referred to as a "substrate position detection unit". Depending on the configuration of the substrate position detection unit, the substrate may not be rectangular.

[0204] <About the push part that can be used with "half lock">

[0205] The substrate holder may include a clamp having a "semi-locking function". The so-called semi-locking function refers to "a function of holding the front frame 200a and the rear frame 200b in a state where the front frame 200a and the rear frame 200b are separated". Basically, the semi-locking function is a function of pre-combining the front frame 200a and the rear frame 200b of the substrate holder that do not hold the substrate. In the semi-locked state, the seals (outer seal 300, inner seal 310) and contacts (substrate electrodes 320) of the front frame 200a and the rear frame 200b do not contact each other. Semi-locking the substrate holder is advantageous in terms of the life of the parts, the ease of carrying the substrate holder, the ease of cleaning the substrate holder, etc.

[0206] Fig.11 2 is a perspective view of a plate of a clamp 290 having a semi-locking function. Fig.11 The plate shown is referred to as "plate 270SL." Again, "SL" is the acronym for "Semi-Lock." Fig.12270SL is a perspective view of the hook portion that is paired with the plate 270SL. Fig.12 The hook portion shown is referred to as "hook portion 250SL". Fig.13 Is has Fig.11 The board 270SL with Fig.12 A cross-sectional view of the clamp 290 of the hook portion 250SL.

[0207] The plate 270SL has two claws 271. Specifically, the plate 270SL has a locking claw 271a and a semi-locking claw 271b. The locking claw 271a is configured so that when the hook body 252 is hooked on the locking claw 271a, the substrate holder 200 can hold the substrate W. The semi-locking claw 271b is configured so that when the hook body 252 is hooked on the semi-locking claw 271b, the distance between the front frame 200a and the rear frame 200b is greater than the distance between the front frame 200a and the rear frame 200b when the hook body 252 is hooked on the locking claw 271a.

[0208] The hook part 250SL includes a hook body 252 extending in the length direction of the shaft 253. As the hook body 252 extends, the hook body 252 is supported by two shafts 253. The shafts 253 are respectively arranged on the same axis. Instead of two shafts 253, one extended shaft 253 may be used.

[0209] The extended hook body 252 is selectively hooked on the locking claw 271a and the semi-locking claw 271b. When the hook body 252 is hooked on the locking claw 271a, the clamper 290 is locked. When the hook body 252 is hooked on the semi-locking claw 271b, the clamper 290 is semi-locked (also referred to as "the substrate holder 200 is semi-locked"). When the substrate holder 200 is semi-locked, the outer seal 300 and the inner seal 310 are in a completely uncompressed state, a slightly compressed state, or a state separated from each other.

[0210] The substrate holder 200 is half-locked in the following sequence shown as an example.

[0211] (a) Figure 9M In the embodiment, after the substrate W is removed by the substrate transport robot 120 , the pressing unit 432 is lowered by the pressing unit vertical movement mechanism 810 to a position where the hook body 252 can be hooked on the semi-locking claw 271 b .

[0212] (b) The pivoting of the hook body 252 by the clamp opener 860 is released, and the hook body 252 is hooked on the half-locking claw 271b.

[0213] Fig.14 FIG. 4 is a schematic diagram showing a pressing portion 430 according to an embodiment. Fig.14For symbols of parts without symbols, refer to Fig. 9A In a preferred embodiment, the upper frame is pushed upward by the frame push rod 840 to a position where the frame lifting claw 880 can be inserted between the frames and the hook body 252 can be hooked on the semi-locking claw 271b. That is, the height of the rear frame 200b lifted by the frame push rod 840 is the same as the height at which the hook body 252 can be hooked on the semi-locking claw 271b (of the rear frame 200b), so that the frame lifting claw 880 can be inserted between the frames. Figure 9M In the embodiment, after the substrate W is removed by the substrate transport robot 120, the pressing unit vertical movement mechanism 810 lowers the rear frame 200b while the frame push rod 840 is extended upward, and places the rear frame 200b on the protruding portion of the frame push rod 840. The preferred pressing portion 430 can semi-lock the substrate holder 200 by relatively simple control.

[0214] <About the position of the substrate held by the substrate holder>

[0215] In one embodiment, the lower substrate support vertical movement mechanism 852 and the upper substrate support vertical movement mechanism 854 are pneumatic mechanisms (cylinders). The substrate support unit 850 can move between at least two positions while holding the substrate W.

[0216] In one embodiment, the position at which the substrate support unit 850 clamps the substrate W can be selected by adjusting the pressure supplied to the lower substrate support vertical movement mechanism 852 and the upper substrate support vertical movement mechanism 854. When the substrate W is clamped at the first position, the pressure supplied to the lower substrate support vertical movement mechanism 852 is lower than the pressure supplied to the upper substrate support vertical movement mechanism 854. When the substrate W is clamped at the second position, the pressure supplied to the lower substrate support vertical movement mechanism 852 is higher than the pressure supplied to the upper substrate support vertical movement mechanism 854. It is preferred that when the substrate W is raised or lowered between the first position and the second position, the pressure supplied to the lower substrate support vertical movement mechanism 852 and the upper substrate support vertical movement mechanism 854 is also adjusted so that the lower substrate support 851 and the upper substrate support 853 always maintain the state of pressing the substrate W.

[0217] The lower substrate support member up-and-down moving mechanism 852 and the upper substrate support member up-and-down moving mechanism 854 are air pressure mechanisms, respectively, so the possibility of failure caused by pressing each other is low. Through the above control, even without an expensive and complicated height measuring mechanism (height adjustment mechanism), it is possible to select the position where the substrate W is clamped while preventing the substrate W from falling off the substrate support unit 850.

[0218] In the embodiments described so far, the substrate holder has a clamper for clamping the substrate with two frames in a state where a sealing pressure is generated, and the pressing unit has a function of pressing the rear frame 200b in the direction of the front frame 200a in order to tighten and release the clamper. However, for example, in the case where the substrate holder itself can generate a sealing pressure, the substrate loading and unloading device 140 may not have the function of pressing the rear frame 200b. In this case, the substrate loading and unloading device 140 only needs to have the following functions: the rear frame 200b is located in at least two positions of (1) a position for clamping the substrate and (2) a position for removing the substrate from the substrate holder. In this case, the stage 431 can be alternatively referred to as a first base, and the pressing unit can be alternatively referred to as a second base. In this case, the pressing portion 430 can be alternatively referred to as a "substrate loading and unloading portion" or a "fixing portion".

[0219] Furthermore, so far, the substrate holder having a frame with a quadrilateral opening has been described as an example, but the example of the opening is not limited to this. For example, in the case of a substrate holder for electrolytic plating a quadrilateral substrate, the power supply electrode is sometimes arranged only along a set of opposite sides. In this case, the portion of the substrate holder for arranging the power supply electrode along the periphery of the substrate may exist only along a set of opposite sides. Therefore, a set of sides of the substrate that are not powered may sometimes be exposed. In the case of a substrate holder in which a portion of the substrate holder exists only along a set of opposite sides, the area between the portions becomes an opening for exposing the substrate.

[0220] In the present invention, at the time point when the substrate holder holding the substrate is transported to the pressing part (substrate loading and unloading part) 430, the lower substrate support 851 is located at a position lower than the front frame 200a, and the upper substrate support 853 is located at a position higher than the rear frame 200b. Therefore, the substrate support unit 850 does not hinder the transportation of the substrate holder. Furthermore, the lower substrate support 851 passes through the opening 260a, and the upper substrate support 853 passes through the opening 260b, and clamps the substrate at the first position. Furthermore, the substrate support unit 850 can move the substrate to the second position. The second position is a position suitable for handing over the substrate to the substrate loading and unloading device or receiving the substrate from the substrate loading and unloading device. As described above, the lower substrate support 851 needs to pass through the opening 260a, and the upper substrate support 853 needs to pass through the opening 260b. Therefore, for example, the lower substrate support 851 is configured to be smaller than the opening 260a, and the upper substrate support 853 is configured to be smaller than the opening 260b.

[0221] <About the vertical pressing part (substrate attachment and detachment part)>

[0222] So far, the substrate loading and unloading device has been described as loading and unloading the substrate on the substrate holder in a horizontal posture. However, it should be understood by those skilled in the art that the present invention can also be applied to substrates in postures other than the horizontal posture. Fig.15 An embodiment in which a substrate is attached to and detached from a substrate holder in a vertical posture is shown.

[0223] The first frame 200a-1 is equivalent to the front frame 200a of the embodiment in a horizontal posture, and is opposite to one side S1 of the substrate. The second frame 200b-1 is equivalent to the rear frame 200b, and is opposite to the other side S2 of the substrate. The first frame 200a-1 and / or the second frame 200b-1 may have a member for preventing the substrate W from falling. The first base 431-1 is equivalent to the stage 431 and is configured to be opposite to one side S1 of the substrate. The second base 432-1 is equivalent to the pressing unit 432 and is configured to be opposite to the other side S2 of the substrate. The first substrate support 851-1 is equivalent to the lower substrate support 851 and is configured to be opposite to one side S1 of the substrate. The first substrate support moving mechanism 852-1 is equivalent to the lower substrate support up and down moving mechanism 852, so that the first substrate support 851-1 moves in a manner close to the substrate W or away from the substrate W. The second substrate support 853-1 is equivalent to the upper substrate support 853 and is configured to be opposite to the other side S2 of the substrate. The second substrate support member moving mechanism 854-1 is equivalent to the upper substrate support member up and down moving mechanism 854, so that the second substrate support member 853-1 can be moved in a manner close to the substrate W or away from the substrate W. The abutting portion 820-1 is equivalent to the loading portion 820, and is arranged on the first base 431-1. The abutting portion 820-1 abuts against the first frame 200a-1. The claw 880-1 is equivalent to the frame lifting claw 880, and is arranged on the second base 432-1. In order to prevent the second frame 200b-1 from falling after the clamp 290 is released, the claw 880-1 can support the lower end of the second frame 200b, thereby allowing the second frame 200b to slide in a direction away from the substrate. Therefore, it is preferred that the claw 880-1 is configured to be movable along Fig.15 The first base 431-1 has a fixing fixture (not shown) for fixing the first frame 200a-1. Fig.15 The other parts shown have the same functions as the embodiment in the horizontal posture.

[0224] exist Fig.15 In the example, "***-1", the names of the parts with the suffix numbers are Fig.15 This is the general name of the parts not having a suffix number in the figures other than . Fig.15 The “stage 431 ” shown otherwise may be referred to as a “first base 431 ”.

[0225] Above, some embodiments of the present invention have been described, but the embodiments of the invention are intended to facilitate the understanding of the present invention and do not limit the present invention. The present invention can be changed and improved without departing from its main purpose, and its equivalents are of course included in the present invention. In addition, within the scope of being able to solve at least part of the problems or within the scope of exerting at least part of the effects, any combination or omission of the constituent elements recorded in the claims and the specification can be performed.

[0226] So far, the substrate holder 200 has been described as a double-sided holder. However, the substrate holder 200 is not limited to a double-sided holder, and may be a single-sided holder. In addition, as described above, the substrate loading and unloading device 140 may not include the holder receiving portion 400, the holder tilting portion 410, and the holder conveying portion 420. In other words, the substrate loading and unloading device 140 sometimes only includes the pressing portion 430. Therefore, as long as there is no contradiction, the pressing portion 430 can be regarded as the same as the substrate loading and unloading device 140, and the pressing portion 430 can also be referred to as the substrate loading and unloading device 140 in another way. For example, a statement such as "the pressing portion 430 includes part A" can be referred to as "the substrate loading and unloading device 140 includes part A".

[0227] As one embodiment, the present application discloses a device for holding a substrate on a substrate holder and / or for releasing the substrate from the substrate holder, the substrate holder comprising a first frame and a second frame for clamping the substrate, the first frame and the second frame respectively having openings for exposing the substrate, the device comprising a substrate support unit for clamping the substrate between the first frame and the second frame, the substrate support unit comprising: a lower substrate support member, supporting the substrate from the bottom; and an upper substrate support member, supporting the substrate from the top; the lower substrate support member is configured to contact the substrate through an opening of a frame located below in the first frame and the second frame, and the upper substrate support member is configured to contact the substrate through an opening of a frame located above in the first frame and the second frame.

[0228] Furthermore, as one embodiment, the present application discloses a device, wherein the substrate support unit includes: a lower substrate support member up and down moving mechanism for moving the lower substrate support member up and down; and an upper substrate support member up and down moving mechanism for moving the upper substrate support member up and down; the substrate support unit is configured to enable the substrate to move between a first position and a second position, the first position can use the first frame and the second frame to clamp the substrate, and the second position is located at a higher position than the first position and is a position where the substrate can be removed from the device.

[0229] Furthermore, as one embodiment, the present application discloses a device, wherein the device includes: a first base, on which the substrate holder is placed horizontally; and a second base, which is arranged above the first base and is configured to be movable up and down, the second base being located at the upper frame of the first frame and the second frame so that the substrate can be clamped by the first frame and the second frame, and the second base being configured to be able to lift the upper frame of the first frame and the second frame.

[0230] Furthermore, as one embodiment, the present application discloses an apparatus, wherein the second base is configured to press the substrate holder placed on the first base toward the first base.

[0231] Furthermore, as one embodiment, the present application discloses a device, wherein the second base includes a frame lifting claw, the frame lifting claw is used to lift the frame located above the first frame and the second frame, the first base includes a frame push rod, the frame push rod is used to lift the frame located above the first frame and the second frame, and the frame push rod creates a gap between the first frame and the second frame for inserting the frame lifting claw.

[0232] Furthermore, as one embodiment, the present application discloses an apparatus, wherein the frame push rod can lift the first frame or the second frame to a position where the substrate holder can be semi-locked.

[0233] Furthermore, as an embodiment, the present application discloses an apparatus, wherein the substrate holder includes a clamper for clamping the first frame and the second frame, and the apparatus includes a clamper opener for opening the clamper.

[0234] Furthermore, as an embodiment, the present application discloses an apparatus, wherein the apparatus includes a substrate position detection unit configured to calculate a position and / or angle of a substrate before the substrate support unit clamps the substrate.

[0235] Furthermore, as one embodiment, the present application discloses a device, wherein the substrate position detection unit is at least one group of a light source and a camera, the light source is configured to be able to move between a light source standby position and an irradiation position, the light source standby position being a position that does not hinder the loading and unloading of the substrate; the irradiation position is capable of irradiating light to the corner of the substrate, the camera is configured to be able to move between a camera standby position and a shooting position, the camera standby position being a position that does not hinder the loading and unloading of the substrate, and is located on the inner side of the opening of the upper frame in the first frame and the second frame, and the shooting position is capable of shooting a portion of the substrate that is irradiated by the light source and serves as a detection reference for the position and / or angle of the substrate.

[0236] Furthermore, as one embodiment, the present application discloses a device for holding a substrate on a substrate holder and / or for releasing the substrate from being held by the substrate holder, the substrate holder comprising: a first frame, opposite to the first surface of the substrate, for clamping the substrate; and a second frame, opposite to the second surface of the substrate, for clamping the substrate, the first frame and the second frame respectively having openings for exposing the substrate, the device comprising a substrate supporting unit for clamping the substrate between the first frame and the second frame, the substrate supporting unit comprising: a first substrate supporting member, supporting the first surface of the substrate; and a second substrate supporting member, supporting the second surface of the substrate; the first substrate supporting member is configured to contact the substrate through the opening of the first frame, and the second substrate supporting member is configured to contact the substrate through the opening of the second frame.

[0237] These devices can exert the effect of being applicable to double-sided retainers as an example.

[0238] Furthermore, as one embodiment, the present application discloses a plating device, comprising: a plating processing part, for plating a substrate held on a substrate holder; a device for holding a substrate on the substrate holder and / or for releasing the substrate from being held by the substrate holder; a conveyor, for transporting the substrate holder between the plating processing part and the device; and a substrate transporting robot, for receiving the substrate from the device and delivering the substrate to the device.

[0239] Furthermore, as one embodiment, the present application discloses a plating device, comprising: a plating processing part, for plating a substrate held on a substrate holder; a device for holding a substrate on the substrate holder and / or for releasing the substrate from being held by the substrate holder, and comprising a substrate position detection part; a conveyor, for transporting the substrate holder between the plating processing part and the device; and a substrate transporting robot, for receiving a substrate from the device and delivering the substrate to the device; the substrate transporting robot can adjust the position and / or angle of the substrate when delivering the substrate to the device according to the position and / or angle of the substrate calculated by the substrate position detection part.

[0240] According to these disclosures, details of a plating apparatus including a device for holding a substrate on a substrate holder and / or for releasing the substrate from being held by the substrate holder have been clarified.

Claims

1. A device for holding and / or releasing the holding of a substrate, for holding a substrate on a substrate holder and / or for releasing the holding of a substrate by a substrate holder, The substrate holder comprises a first frame and a second frame for clamping the substrate. The first frame and the second frame each have an opening for exposing the substrate. The device comprises a substrate holding unit for clamping a substrate between the first frame and the second frame, The substrate supporting unit comprises: A lower substrate support member, supporting the substrate from below; as well as An upper substrate support member supports the substrate from above; The lower substrate support is configured to contact the substrate through the opening of the frame located below the first frame and the second frame. The upper substrate support is configured to contact the substrate through the opening of the upper frame of the first frame and the second frame. The substrate holder includes a clamper for clamping the first frame and the second frame, The device comprises a gripper opener for opening the gripper.

2. The device for holding and / or releasing the holding of a substrate according to claim 1, wherein the substrate holding unit comprises: A lower substrate support member up and down moving mechanism, used to move the lower substrate support member up and down; as well as An upper substrate support member up and down moving mechanism, used to move the upper substrate support member up and down; The substrate support unit is configured to enable the substrate to move between a first position and a second position. The first position can clamp the substrate by using the first frame and the second frame, The second position is located higher than the first position and is a position where the substrate can be removed from the device.

3. The device for holding a substrate and / or releasing the holding of a substrate according to claim 1 or 2, wherein the device comprises: a first base, horizontally placing the substrate holder; as well as The second base is arranged above the first base and is configured to be movable up and down. The second base is located on the upper frame of the first frame and the second frame, so that the substrate can be clamped by the first frame and the second frame. The second base is configured to be able to lift the upper frame of the first frame and the second frame. 4 . The device for holding and / or releasing holding of a substrate according to claim 3 , wherein the second base is configured to press the substrate holder placed on the first base toward the first base.

5. The device for holding and / or releasing the holding of a substrate according to claim 3, wherein the second base comprises a frame lifting claw, and the frame lifting claw is used to lift the frame located above the first frame and the second frame, The first base includes a frame push rod, and the frame push rod is used to lift the upper frame of the first frame and the second frame. The frame push rod creates a gap between the first frame and the second frame for inserting the frame lifting claw.

6. The device for holding and / or releasing holding of a substrate according to claim 5, wherein the frame push rod can lift the first frame or the second frame to a position where the substrate holder can be semi-locked.

7. The device for holding and / or releasing holding of a substrate according to claim 1 or 2, wherein the device comprises a substrate position detection unit for calculating the position and / or angle of the substrate before the substrate holding unit clamps the substrate.

8. The device for holding and / or releasing the holding of a substrate according to claim 7, wherein the substrate position detection unit is at least one set of a light source and a camera, The light source is configured to be movable between a light source standby position and an irradiation position. The light source standby position is a position that does not hinder the loading and unloading of the substrate; The irradiation position can irradiate light toward the corner of the substrate, The camera is configured to be movable between a camera standby position and a shooting position. The camera standby position is a position that does not hinder the loading and unloading of the substrate and is located inside the opening of the upper frame of the first frame and the second frame. The imaging position can image a portion of the substrate that is irradiated by the light source and serves as a detection reference for the position and / or angle of the substrate.

9. A plating device comprising: a plating processing section for plating the substrate held on the substrate holder; A device for holding a substrate and / or releasing the holding of a substrate according to any one of claims 1 to 8; a conveyor for transporting a substrate holder between the plating processing section and the device for holding and / or releasing the holding of a substrate; as well as The substrate transport robot receives a substrate from the device for holding a substrate and / or releasing the holding of a substrate, and delivers a substrate to the device for holding a substrate and / or releasing the holding of a substrate.

10. A plating device comprising: a plating processing section for plating the substrate held on the substrate holder; The device for holding and / or releasing the holding of a substrate according to claim 7 or 8; a conveyor for transporting a substrate holder between the plating processing section and the device for holding and / or releasing the holding of a substrate; as well as a substrate transport robot receiving a substrate from the device for holding a substrate and / or releasing the holding of a substrate, and delivering a substrate to the device for holding a substrate and / or releasing the holding of a substrate; The substrate transport robot can adjust the position and / or angle of the substrate when delivering the substrate to the device for holding and / or releasing the holding of the substrate, based on the position and / or angle of the substrate calculated by the substrate position detection unit.

11. A device for holding and / or releasing the holding of a substrate, for holding a substrate on a substrate holder and / or for releasing the holding of a substrate by a substrate holder, The substrate holder comprises: A first frame, opposite to the first surface of the substrate, for clamping the substrate; as well as The second frame is opposite to the second surface of the substrate and is used to clamp the substrate. The first frame and the second frame each have an opening for exposing the substrate. The device comprises a substrate holding unit for clamping a substrate between the first frame and the second frame, The substrate supporting unit comprises: a first substrate support member supporting a first surface of the substrate; and a second substrate support member, supporting a second surface of the substrate; The first substrate support is configured to contact a substrate through the opening of the first frame, the second substrate support is configured to contact a substrate through the opening of the second frame, the substrate holder includes a clamper for clamping the first frame and the second frame, and the device includes a clamper opener for opening the clamper.

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