Pressure sensing device, equipment and method for manufacturing pressure sensing device

Abstract

The present application belongs to the field of pressure sensing technology, and relates to pressure sensing devices, equipment, and methods for manufacturing pressure sensing devices. When in use, a rigid structure is placed against an object to be measured, and the object to be measured is deformed by force, and the rigid structure follows the deformation. The strain amplification area is relatively soft, and the rigid block is relatively hard. The strain of the rigid structure is concentrated in the strain amplification area. The force sensor in the strain amplification area obtains a pressure signal, and the bridge circuit generates an output signal, which is passed through a signal processing circuit to identify the applied force. The pressure sensing device is an integrated structure, which is easy to install, has a simple circuit, and is low-cost. The pressure sensing device and equipment can sensitively detect tiny deformations of the object to be measured and accurately identify the pressure on the object to be measured. In addition to the need to open a hollow groove in the substrate, the manufacturing method of the pressure sensing component is a standard PCB manufacturing process. The pressure sensing device is simple to manufacture and low-cost.

Description

Technical Field

[0001] The present application belongs to the field of pressure sensing technology and relates to a pressure sensing device, equipment and a method for manufacturing the pressure sensing device. Background Art

[0002] With the development of intelligent electronic products, traditional mechanical buttons are not only not waterproof and dustproof, and are easy to wear. The buttons need to form a certain movement stroke to realize related functions. By applying pressure sensing technology to electronic devices, it is possible to detect information such as position and micro-pressure with just a slight touch. There are many types of pressure sensing technologies, such as pressure capacitance technology (detecting the capacitance between surfaces), pressure inductance (detecting the inductance between surfaces), piezoelectric ceramics, etc. The common points of these technologies are complex installation, high production cost, and low reliability, which limits the device in many usage scenarios. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a pressure sensing device, equipment and a method for manufacturing a pressure sensing device to solve the technical problems of complex installation and high manufacturing cost of existing pressure sensing structures.

[0004] The present application provides a pressure sensing device, including:

[0005] A rigid structure, used to abut against the object to be measured and deform along with the object to be measured, the rigid structure comprising rigid blocks spaced apart in a predetermined direction, a strain amplification region formed between two adjacent rigid blocks, and the rigid structure having two mounting surfaces disposed back to back and two side wall surfaces disposed back to back; and

[0006] The detection structure includes a soft insulating layer abutting against at least one of the mounting surfaces, a force sensor arranged on the soft insulating layer, and a circuit layer for connecting the force sensor. At least four of the force sensors are connected to form a bridge circuit, and at least one group of relative bridge arms in the bridge circuit is arranged corresponding to the strain amplification area.

[0007] Optionally, a protective layer is provided on a surface of the detection structure facing away from the rigid structure.

[0008] Optionally, the soft insulating layer and the rigid structure are bonded by colloid; or, the soft insulating layer and the rigid structure are welded.

[0009] Optionally, the rigid structure further includes a connecting arm connecting two adjacent rigid blocks.

[0010] Optionally, the number of the connecting arms is two, and the two connecting arms are respectively arranged close to two side wall surfaces of the rigid block;

[0011] Alternatively, the number of the connecting arm is one, and the connecting arm is arranged close to one of the side wall surfaces of the rigid block;

[0012] Alternatively, the number of the connecting arm is one, and the connecting arm is connected to the middle parts of the two rigid blocks.

[0013] Optionally, the number of the soft insulating layers is the same as that of the circuit layers and is at least two, wherein the two circuit layers are respectively arranged on two of the soft insulating layers, and the two soft insulating layers are respectively arranged on the two mounting surfaces.

[0014] Optionally, a through hole penetrating the two mounting surfaces is formed on the rigid block, and perforations are formed on the two soft insulating layers corresponding to the through hole, and conductors are provided between the through hole and the perforations to electrically connect the two circuit layers.

[0015] Optionally, two groups of relative bridge arms in the same bridge circuit are arranged corresponding to the same strain amplification area, and the two groups of relative bridge arms are located on different soft insulation layers; one of the mounting surfaces serves as a contact surface against the object to be measured.

[0016] Optionally, two groups of relative bridge arms in the same bridge circuit are located on the same soft insulating layer, and one group of relative bridge arms in the bridge circuit is arranged corresponding to the rigid block; and one of the mounting surfaces serves as abutment surface against the object to be measured;

[0017] Alternatively, two groups of relative bridge arms in the same bridge circuit are located on the same soft insulating layer, and one group of relative bridge arms in the bridge circuit is arranged corresponding to the rigid block; one of the side wall surfaces serves as abutment surface against the object to be measured;

[0018] Alternatively, two groups of relative bridge arms in the same bridge circuit are arranged corresponding to the same strain amplification area, and the two force sensors in each group of relative bridge arms are respectively located on different soft insulating layers, one group of relative bridge arms is arranged close to one of the side wall surfaces, and the other group of relative bridge arms is arranged close to the other side wall surface; one of the side wall surfaces serves as abutment surface against the object to be measured.

[0019] Optionally, the rigid structure and the object to be measured are bonded by colloid; or, the rigid structure and the object to be measured are welded.

[0020] An embodiment of the present application provides a device including the above-mentioned pressure sensing device.

[0021] The present application embodiment provides a method for manufacturing the above-mentioned pressure sensing device, comprising the following steps:

[0022] S10) providing a substrate and a soft insulating layer with a circuit layer; and providing array-distributed hollow grooves at predetermined positions of the substrate;

[0023] S20) pressing the soft insulating layer onto the substrate; arranging a plurality of force sensors on the soft insulating layer to form a plurality of bridge circuits, and at least one group of relative bridge arms in each of the bridge circuits is arranged corresponding to one of the hollow grooves; obtaining a total board;

[0024] S30) dividing the main plate to obtain a plurality of the pressure sensing devices, wherein the divided substrate forms the rigid structure, and the hollow groove corresponds to the strain amplification area.

[0025] Optionally, in step S10), the following steps are also included: opening a through hole on the substrate; opening a perforation in the soft insulating layer corresponding to the through hole;

[0026] In step S20), the two soft insulating layers are respectively pressed onto the two surfaces of the substrate, and conductive materials are provided in the through holes and the perforations to electrically connect the two circuit layers.

[0027] Optionally, in step S10), when the substrate is a metal plate, holes are pre-drilled on the substrate and filled with insulating material, and then holes are drilled to obtain the through holes.

[0028] Optionally, in step S20), after a plurality of force sensors are arranged on the soft insulating layer, a protective layer is arranged on a side of the soft insulating layer facing away from the substrate.

[0029] The above one or more technical solutions provided by the embodiments of the present application have at least one of the following technical effects: when the pressure sensing device is used, the rigid structure is placed against the object to be measured, the object to be measured is deformed by force, and the rigid structure follows the deformation, the strain amplification area is softer, and the rigid block is harder, the strain of the rigid structure is concentrated in the strain amplification area, the force sensor in the strain amplification area obtains a pressure signal, the bridge circuit generates an output signal, and the signal processing circuit is used to identify the force. The pressure sensing device is an integrated structure, easy to install, simple circuit, and low cost. The pressure sensing device and equipment can very sensitively detect tiny deformations of the object to be measured, accurately identify the pressure on the object to be measured, and have a small temperature drift, thereby improving the reliability and stability of the pressure sensing device.

[0030] The manufacturing method of the pressure sensing component provides a substrate and a soft insulating layer with a circuit layer, processes hollow grooves distributed in an array on the substrate, presses the soft insulating layer on the substrate, sets a number of force sensors on the soft insulating layer, and divides the total board into a number of pressure sensing devices. Except for the need to open the hollow grooves on the substrate, the rest of the process is a standard PCB manufacturing process, and the pressure sensing device is simple to manufacture and low in price. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0032] Figure 1 A schematic diagram of the assembly of a pressure sensing device provided in one embodiment of the present application;

[0033] Figure 2 for Figure 1 A top view of a pressure sensing device;

[0034] Figure 3 for Figure 2 A three-dimensional structural diagram of a pressure sensing device;

[0035] Figure 4 A bridge circuit diagram of a pressure sensing device provided in one embodiment of the present application;

[0036] Figure 5 A schematic diagram of the assembly of a pressure sensing device provided by another embodiment of the present application;

[0037] Figure 6 (a) Figure 6 (b) Figure 6 (c) are top views of pressure sensing devices provided in three other embodiments of the present application;

[0038] Figure 7 A three-dimensional structural diagram of a pressure sensing device provided in another embodiment of the present application;

[0039] Figure 8 A schematic diagram of the assembly of a pressure sensing device provided by another embodiment of the present application;

[0040] Fig. 9 for Figure 8 A top view of a pressure sensing device;

[0041] Fig.10 A schematic diagram of opening a hollow groove on a substrate in the method for manufacturing a pressure sensing device provided in an embodiment of the present application;

[0042] Fig.11 A schematic diagram of laminating a soft insulating layer with a circuit layer on a substrate in a method for manufacturing a pressure sensing device provided in an embodiment of the present application;

[0043] Fig.12 This is a schematic diagram of dividing the main plate in the method for manufacturing a pressure sensing device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0044] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0045] In the description of the embodiments of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0046] In the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0047] See also Figures 1 to 4, an embodiment of the present application provides a pressure sensing device, including a rigid structure 10 and a detection structure 20. The rigid structure 10 is used to abut against an object to be measured (not shown) and follow the deformation of the object to be measured. The rigid structure 10 includes rigid blocks 11 arranged at intervals along a predetermined direction, and a strain amplification area 12 is formed between two adjacent rigid blocks 11. The strain amplification area 12 can be a hollow groove, and the rigid structure 10 has two mounting surfaces (10a, 10b) arranged back to back and two side wall surfaces (10c, 10d) arranged back to back. The rigid structure 10 can be a rectangular parallelepiped or other shapes. A certain distance is formed between the two mounting surfaces (10a, 10b), and a certain distance is also formed between the two side wall surfaces (10c, 10d). The rigid structure 10 can be made of aluminum sheets, FR4, glass sheets, patches, copper sheets, steel sheets or other materials with a certain rigidity, which can be selected as needed.

[0048] The detection structure 20 includes a soft insulating layer 21 disposed against at least one mounting surface (10a, 10b), and a force sensor (R1, R2, R3, R4) disposed on the soft insulating layer 21, wherein the soft insulating layer 21 serves as a carrier of the force sensor. The soft insulating layer 21 may be a PP sheet (polypropylene sheet), PET (high temperature resistant polyester film), PI film (polyimide film) or other soft materials with good flatness, which may be selected as required. The force sensor may be a strain sensing resistor, which may be made of at least one of polycrystalline semiconductor materials, amorphous semiconductor materials, polycrystalline silicon, graphene, copper-nickel alloy, carbon nanotubes, metal fine wires, and conductor-insulator composite materials, which may be selected as required.

[0049] The detection structure 20 also includes a circuit layer 22 for connecting the force sensors (R1, R2, R3, R4), at least four force sensors (R1, R2, R3, R4) are connected to form a bridge circuit, and at least one group of relative bridge arms (R1 and R4) in the bridge circuit is arranged corresponding to the strain amplification area 12. The circuit layer 22 can be made of conductive metal materials such as copper wire, silver wire, gold wire, etc.

[0050] Compared with the prior art, the pressure sensing device provided by the present application is that when in use, the rigid structure 10 is placed against the object to be measured, the object to be measured is deformed by force, and the rigid structure 10 follows the deformation, the strain amplification area 12 is relatively soft, and the rigid block 11 is relatively hard, and the strain of the rigid structure 10 is concentrated in the strain amplification area 12, and the force sensor (R1, R2, R3, R4) at the strain amplification area 12 obtains a pressure signal, and the bridge circuit generates an output signal, which is passed through the signal processing circuit to identify the applied force. The pressure sensing device is an integrated structure, easy to install, simple in circuit, and low in cost. The pressure sensing device can very sensitively detect the slight deformation of the object to be measured, accurately identify the pressure on the object to be measured, and has a small temperature drift, thereby improving the reliability and stability of the pressure sensing device.

[0051] It should be noted that the signal processing circuit is electrically connected to the bridge circuit, analyzes and processes the electrical signal of the force sensor, and converts the force analog signal into a force digital signal, which belongs to the prior art.

[0052] See also Figure 1 In another embodiment of the present application, a protective layer 30 is provided on the surface of the detection structure 20 facing away from the rigid structure 10. The protective layer 30 is used to isolate the detection structure 20 from the outside to prevent the detection structure 20 from being damaged by external forces and improve reliability. The protective layer 30 can be solder resist or a cover film.

[0053] See also Figure 1 In another embodiment of the present application, the soft insulating layer 21 and the rigid structure 10 are bonded by a colloid 41, for example, a colloid of similar materials such as epoxy film, 502 glue, thermosetting glue, silicone, etc.; or, the soft insulating layer 21 and the rigid structure 10 are welded. The above schemes can reliably connect the soft insulating layer 21 and the rigid structure 10, and when the object to be measured is deformed by force, the soft insulating layer 21 and the rigid structure 10 can follow the deformation, thereby causing the force sensors (R1, R2, R3, R4) on the soft insulating layer 21 to deform, thereby realizing pressure sensing.

[0054] See also Figure 6 In another embodiment of the present application, the rigid structure 10 further includes a connecting arm 13 connecting two adjacent rigid blocks 11. That is, the two rigid blocks 11 are connected by the connecting arm 13, and the connecting arm 13 can be set to be single-sided or double-sided, so that the rigid structure 10 remains as a whole. In this way, the pressure sensing device has a stronger structural strength, a stronger anti-drop ability, and is more convenient to pick up and assemble.

[0055] See also Figure 6 (a), in another embodiment of the present application, the number of the connecting arms 13 is two, and the two connecting arms 13 are respectively disposed close to the side wall surfaces (10c, 10d) of the rigid block 11. Figure 6 (b) In another embodiment of the present application, the number of the connecting arm 13 is one, and the connecting arm 13 is arranged close to one of the side walls (10c, 10d) of the rigid block 11. When manufacturing the pressure sensing device, as long as a sufficient distance is reserved when setting the board splitting line on the main board, the rigid structure 10 including the rigid block 11 and the connecting arm 13 can be cut and formed, which is easy to manufacture. Figure 6 (c) In another embodiment of the present application, the number of the connecting arm 13 is one, and the connecting arm 13 is connected to the middle of the two rigid blocks 11. When manufacturing the pressure sensing device, the hollow grooves on the substrate need to be opened in pairs so that a connecting arm 13 is formed between the two hollow grooves, and then cut to form a rigid structure 10 including the rigid block 11 and the connecting arm 13, which is easy to manufacture.

[0056] See also Figure 1 In another embodiment of the present application, the number of the soft insulating layer 21 and the circuit layer 22 is the same and at least two, wherein the two circuit layers 22 are respectively arranged on two of the soft insulating layers 21, and the two soft insulating layers 21 are respectively arranged on two mounting surfaces (10a, 10b). When in use, the rigid structure 10 is placed against the object to be measured, the object to be measured is deformed by force, and the rigid structure 10 follows the deformation, and the strain of the soft insulating layer 21 is concentrated in the strain amplification area 12 near the force, and the soft insulating layer 21 in the strain amplification area 12 will follow the rigid structure 10 to deform in a certain pattern, and the impedance of the force sensor (R1, R2, R3, R4) will change accordingly, and the bridge circuit outputs a signal, thereby realizing pressure sensing.

[0057] See also Figure 1 In another embodiment of the present application, a through hole 111 penetrating through the two mounting surfaces (10a, 10b) is provided on the rigid block 11, and a through hole 211 is provided on the two soft insulating layers 21 corresponding to the through hole 111, and a conductor 23 is provided between the through hole 111 and the through hole 211 to electrically connect the two circuit layers 22. With this solution, the circuit layers 22 on both sides can be electrically connected to form a predetermined bridge circuit, which is easy to process and avoids the situation where the circuit layers 22 on both sides need additional wiring to achieve electrical connection.

[0058] See also Figure 1 , Figure 4 In another embodiment of the present application, two groups of relative bridge arms in the same bridge circuit are arranged corresponding to the same strain amplification area 12, and the two groups of relative bridge arms R1 and R4 (R2 and R3) are located on different soft insulating layers 21, that is, the soft insulating layers 21 on both sides are respectively provided with a group of relative bridge arms R1 and R4 (R2 and R3), and there is a certain distance between the two-sided force sensors. One of the mounting surfaces 10a (10b) serves as a contact surface against the object to be measured. One or more channels can be set according to the coverage area of ​​pressure sensing, for example, 3 channels are set.

[0059] Assume VCC = Ui, then:

[0060]

[0061]

[0062] By taking the derivatives of R1, R2, R3 and R4 respectively, we can see that U1 increases with the increase of R2 and R3, and decreases with the increase of R1 and R4.

[0063] When the object under test is subjected to pressure from top to bottom, the pressure sensing device bends downward, R1 and R4 decrease in impedance as the soft insulating layer 21 contracts, R2 and R3 increase in impedance as the soft insulating layer 21 stretches, and U1 increases. When the pressure is removed, the pressure sensing device returns to its initial state, R1 and R4 increase, R2 and R3 decrease, and U1 decreases. The signal processing circuit will detect the changes in the pressure signal of U1 in real time, and the direction, magnitude and position of the force can be identified through the characteristics of the pressure signal, thereby realizing pressure sensing.

[0064] See also Figure 4 , Figure 8 In another embodiment of the present application, two groups of relative bridge arms R1 and R4 (R2 and R3) in the same bridge circuit are located on the same soft insulating layer 21, one group of relative bridge arms R1 and R4 in the bridge circuit is set corresponding to the rigid block 11; the other group of relative bridge arms R2 and R3 is set corresponding to the strain amplification area 12; one of the mounting surfaces 10a (10b) is used as the abutment surface against the object to be measured. For example, the mounting surface 10b on the side where the force sensor is not set is selected as the abutment surface, that is, Figure 8 The lower surface of the rigid structure 10 can be provided with a soft insulating layer 21 on the mounting surface 10b, and then abutted against the object to be measured. When the object to be measured is subjected to a force, the pressure sensing device bends upward along with the object to be measured, and the strain is concentrated on the soft insulating layer 21 in the strain amplification area 12, and the resistance values ​​of R2 and R3 increase; at this time, the rigid block 11 hardly deforms, and since R1 and R4 are tightly adhered to the rigid block 11, the resistance values ​​of R1 and R4 hardly change. As can be seen from the above, U1 increases with the increase of R2 and R3. The pressure information is obtained by detecting the change of U1 through the signal processing circuit, and pressure sensing is realized. It can be understood that the mounting surface 10a on the side where the force sensor is provided can also be selected as the abutting surface against the object to be measured.

[0065] In another embodiment of the present application, two groups of relative bridge arms in the same bridge circuit are located on the same soft insulating layer 21, one group of relative bridge arms in the bridge circuit is arranged corresponding to the rigid block 11; the other group of relative bridge arms is arranged corresponding to the strain amplification area 12; one of the side wall surfaces 10c (10d) is used as a contact surface with the object to be measured. With this solution, pressure sensing can also be achieved.

[0066] See also Figure 4 , Figure 7In another embodiment of the present application, two groups of relative bridge arms R1 and R4 (R2 and R3) in the same bridge circuit are arranged corresponding to the same strain amplification area 12, and the two force sensors R1 and R4 (R2 and R3) in each group of relative bridge arms are respectively located on different soft insulating layers 21, one group of relative bridge arms R1 and R4 is arranged close to one of the side wall surfaces 10c, and the other group of relative bridge arms R2 and R3 is arranged close to the other side wall surface 10d; one of the side wall surfaces 10c (10d) is used as abutment surface against the object to be measured. One of the side wall surfaces 10c of the rigid structure 10, such as Figure 7 When the rigid structure 10 is directly in front of the measured object, it is attached to the measured object. When the measured object is subjected to force, the pressure sensing device bends backward with the measured object, so R1 and R4 decrease, R2 and R3 increase, and the pressure signal increases in the positive direction. Because the soft insulating layer 21 is not in direct contact with the measured object, when an object with a large temperature difference with the measured object contacts the measured object, it can avoid direct heating of the force sensor, and can reduce the temperature effect of the force sensor caused by the temperature difference. Since there are no force sensors and circuit layers 22 on the side walls (10c, 10d) of the rigid structure 10, the thickness of the pressure sensing device can be reduced, which is suitable for applications with smaller spaces.

[0067] See also Figure 1 , Figure 8 In another embodiment of the present application, the rigid structure 10 and the object to be measured are bonded by a colloid 42, such as double-sided adhesive, VHB adhesive, hot melt adhesive, 502 adhesive, etc. This method can reliably install the rigid structure 10 on the object to be measured, and the deformation of the object to be measured can be transmitted to the soft insulating layer 21 and the rigid structure 10 through the colloid 42, so that the rigid structure 10 deforms with the object to be measured, and the force sensor (R1, R2, R3, R4) is deformed, thereby realizing pressure sensing.

[0068] Please refer to the figure Figure 5 In another embodiment of the present application, the rigid structure 10 is welded to the object to be measured, that is, solder paste or other weldable materials 43 are provided on the abutting surface of the pressure sensing device. This method can reliably install the rigid structure 10 on the object to be measured, and the deformation of the object to be measured can be transmitted to the soft insulating layer 21 and the rigid structure 10 through the weldable material 43, so that the rigid structure 10 deforms with the object to be measured, and the force sensor (R1, R2, R3, R4) is deformed, thereby realizing pressure sensing. In addition, the lamination work can be reduced, and only a small amount of weldable material 43 is required to connect the rigid structure 10 and the object to be measured to meet the requirements of deformation transmission, which can reduce the temperature effect of the force sensor caused by the temperature difference.

[0069] See also Figures 1 to 9In another embodiment of the present application, a device is provided, including the pressure sensing device described above. Since the device adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0070] In another embodiment of the present application, the object to be measured is a panel or a frame. Force sensing of the panel or frame is realized. The panel or frame can be made of non-metallic materials such as glass, plastic, ceramic, etc. The panel can be a touch screen, a display or other electronic terminal with a rigid structure 10. The frame can be a frame of various electronic terminals. By connecting the force sensor (R1, R2, R3, R4) to the panel or frame, it is possible to accurately identify the size of the touch pressure, thereby expanding the application space for electronic terminals in product applications, human-computer interaction and consumer experience. Users can directly obtain accurate force levels and quantities by touching the touch screen, display or electronic terminal.

[0071] See also Figures 1 to 3 , Figures 10 to 12 In another embodiment of the present application, a method for manufacturing the above-mentioned pressure sensing device is provided, comprising the following steps:

[0072] S10) Provide a substrate 10' and a soft insulating layer 21 with a circuit layer 22; open an array of hollow grooves 11' at predetermined positions of the substrate 10'; the hollow grooves 11' can be made by die punching or etching, which is convenient for batch processing. Clean the dirt or impurities on the substrate 10'. If it is a metal substrate 10', it also needs to be oxidized to improve reliability.

[0073] S20) Press the entire soft insulating layer 21 onto the substrate 10', for example, by using colloid bonding, welding or other connection methods to achieve connection, the connection is reliable, and the soft insulating layer 21 and the substrate 10' can follow the deformation of the measured object. A number of force sensors (R1, R2, R3, R4) are arranged on the soft insulating layer 21 to form a number of bridge circuits, and at least one group of relative bridge arms in each bridge circuit corresponds to a hollow groove 11'. The force sensors (R1, R2, R3, R4) can be made on the soft insulating layer 21 by printing or other methods, which is easy to form. Among them, the whole soft insulating layer 21 is pressed onto the substrate 10', and a number of force sensors (R1, R2, R3, R4) are arranged on the soft insulating layer 21. These two steps can be interchangeable. After completing the circuit production work such as etching, electroplating and gold plating, the total board 1 is obtained.

[0074] S30) The main plate 1 is divided to obtain a plurality of pressure sensing devices, the divided substrate 10' forms a rigid structure 10, and the hollow groove 11' corresponds to the strain amplification area 12. For example, if a strip-shaped pressure sensing device is required, the main plate 1 is cut along the rectangular dividing line 2 to obtain a strip-shaped pressure sensing device, which includes the rigid structure 10 and the detection structure 20.

[0075] The manufacturing method of the pressure sensing component provides a substrate 10' and a soft insulating layer 21 with a circuit layer 22, processes an array of hollow grooves 11' on the substrate 10', presses the soft insulating layer 21 on the substrate 10', sets a plurality of force sensors (R1, R2, R3, R4) on the soft insulating layer 21, and divides the main board 1 into a plurality of pressure sensing devices. Except for the need to open the hollow groove 11' on the substrate 10', the rest of the process is a standard PCB manufacturing process, and the pressure sensing device is easy to manufacture and low in price.

[0076] See also Figure 1 , Fig.11 In another embodiment of the present application, in step S10), the following steps are also included: a through hole 111 is opened on the substrate 10'; a perforation 211 is opened in the soft insulating layer 21 corresponding to the through hole 111; in step S20), two soft insulating layers 21 are pressed on the two surfaces of the substrate 10' respectively, and conductive materials are provided in the through hole 111 and the perforation 211 to electrically connect the two circuit layers 22. With this solution, the circuit layers 22 on both sides can be electrically connected to form a predetermined bridge circuit, which is easy to process and avoids the situation where the circuit layers 22 on both sides need additional wiring to achieve electrical connection. The conductive material can be copper or other metal materials. The conductive material can be provided in the through hole 111 and the perforation 211 by electroplating.

[0077] See also Figure 1 In another embodiment of the present application, in step S10), when the substrate 10' is a metal plate, a hole is pre-drilled on the substrate 10' and filled with insulating material, such as resin, and then a through hole 111 is drilled. With this solution, the inner wall of the through hole 111 can be insulated to facilitate the subsequent filling of the conductive material in the through hole 111 to electrically connect the circuit layers 22 on both sides.

[0078] See also Figure 1 In another embodiment of the present application, in step S20), after a plurality of force sensors (R1, R2, R3, R4) are arranged on the soft insulating layer 21, a protective layer 30 is arranged on the side of the soft insulating layer 21 facing away from the substrate 10'. The protective layer 30 is arranged to protect the detection structure 20 and improve reliability. The protective layer 30 can be green paint.

[0079] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A pressure sensing device, It is characterized in that include: A rigid structure is used to abut against the object to be measured and deform with the object to be measured, the rigid structure includes rigid blocks arranged at intervals along a predetermined direction, a strain amplification area is formed between two adjacent rigid blocks, and the rigid structure has two mounting surfaces arranged back to back and two side wall surfaces arranged back to back; a certain distance is formed between the two mounting surfaces, and a certain distance is formed between the two side wall surfaces; as well as A detection structure, comprising a soft insulating layer disposed against at least one of the mounting surfaces, a force sensor disposed on the soft insulating layer, and a circuit layer for connecting the force sensor, at least four of the force sensors are connected to form a bridge circuit, and at least one group of relative bridge arms in the bridge circuit is disposed corresponding to the strain amplification region; Two groups of relative bridge arms in the same bridge circuit are arranged corresponding to the same strain amplification region, and the two groups of relative bridge arms are located on different soft insulating layers; one of the mounting surfaces is used as a contact surface against the object to be measured; Alternatively, two groups of relative bridge arms in the same bridge circuit are located on the same soft insulating layer, and one group of relative bridge arms in the bridge circuit is arranged corresponding to the rigid block; one of the side wall surfaces serves as abutment surface against the object to be measured; Alternatively, two groups of relative bridge arms in the same bridge circuit are arranged corresponding to the same strain amplification area, and the two force sensors in each group of relative bridge arms are respectively located on different soft insulating layers, one group of relative bridge arms is arranged close to one of the side wall surfaces, and the other group of relative bridge arms is arranged close to the other side wall surface; one of the side wall surfaces serves as abutment surface against the object to be measured.

2. The pressure sensing device according to claim 1, It is characterized in that A protective layer is provided on the surface of the detection structure facing away from the rigid structure.

3. The pressure sensing device according to claim 1, It is characterized in that The soft insulating layer and the rigid structure are bonded by colloid; or, the soft insulating layer and the rigid structure are welded.

4. The pressure sensing device according to claim 1, It is characterized in that The rigid structure further includes a connecting arm connecting two adjacent rigid blocks.

5. The pressure sensing device according to claim 4, It is characterized in that The number of the connecting arms is two, and the two connecting arms are respectively arranged close to the two side wall surfaces of the rigid block; Alternatively, the number of the connecting arm is one, and the connecting arm is arranged close to one of the side wall surfaces of the rigid block; Alternatively, the number of the connecting arm is one, and the connecting arm is connected to the middle parts of the two rigid blocks.

6. The pressure sensing device according to any one of claims 1 to 5, It is characterized in that The number of the soft insulating layers is the same as that of the circuit layers and is at least two, wherein the two circuit layers are respectively arranged on two of the soft insulating layers, and the two soft insulating layers are respectively arranged on the two mounting surfaces.

7. The pressure sensing device according to claim 6, It is characterized in that The rigid block is provided with a through hole penetrating through the two mounting surfaces, and the two soft insulating layers are provided with perforations corresponding to the through hole. Conductors are provided between the through hole and the perforations to electrically connect the two circuit layers.

8. The pressure sensing device according to any one of claims 1 to 5, It is characterized in that Two groups of relative bridge arms in the same bridge circuit are located on the same soft insulating layer, and one group of relative bridge arms in the bridge circuit is arranged corresponding to the rigid block; one of the mounting surfaces serves as a contact surface against the object to be measured.

9. The pressure sensing device according to any one of claims 1 to 5, It is characterized in that The rigid structure and the object to be measured are bonded by colloid; or, the rigid structure and the object to be measured are welded.

10. A device, It is characterized in that Comprising a pressure sensing device as claimed in any one of claims 1 to 9.

11. A method for manufacturing a pressure sensing device according to any one of claims 1 to 9, It is characterized in that The following steps are involved: S10) providing a substrate and a soft insulating layer with a circuit layer; and providing array-distributed hollow grooves at predetermined positions of the substrate; S20) pressing the soft insulating layer onto the substrate; Arranging a plurality of force sensors on the soft insulating layer to form a plurality of bridge circuits, and at least one group of relative bridge arms in each of the bridge circuits is arranged corresponding to one of the hollow grooves; obtaining a total board; S30) dividing the main plate to obtain a plurality of the pressure sensing devices, wherein the divided substrate forms the rigid structure, and the hollow groove corresponds to the strain amplification area.

12. The method for manufacturing the pressure sensing device according to claim 11, It is characterized in that In step S10), the following steps are also included: opening a through hole on the substrate; opening a perforation in the soft insulating layer corresponding to the through hole; In step S20), the two soft insulating layers are respectively pressed onto the two surfaces of the substrate, and conductive materials are provided in the through holes and the perforations to electrically connect the two circuit layers.

13. The method for manufacturing the pressure sensing device according to claim 12, It is characterized in that In step S10), when the substrate is a metal plate, holes are pre-drilled on the substrate and filled with insulating material, and then holes are drilled to obtain the through holes.

14. The method for manufacturing the pressure sensing device according to claim 11, It is characterized in that In step S20), after a plurality of force sensors are arranged on the soft insulating layer, a protective layer is arranged on a side of the soft insulating layer facing away from the substrate.

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