A device and method for adjusting, detecting and fixing the flatness of an imaging module

Abstract

The present invention discloses a device and method for adjusting, detecting and fixing the flatness of an imaging module, wherein the device includes an image sensor flatness adjustment mechanism, a collimator, an automatic glue dispenser and a UV irradiation lamp; the image sensor flatness adjustment mechanism includes a support base and a plurality of micrometer adjusters; the support base includes an upper support plate, a lower support plate, and a support column connected between the upper support plate and the lower support plate; the upper support plate is provided with through holes for the top ends of the plurality of micrometer adjusters to pass through, and the parts of the top ends of the plurality of micrometer adjusters passing through the through holes constitute a support adjustment surface for fixing a fixed plate with an image sensor; the micrometer adjuster is adjusted to make the fixed plate in a horizontal state. The present invention can realize the adjustment of the flatness of the image sensor without starting up, and eliminates the step of judging and adjusting by software at the display end during installation and startup, which improves the efficiency by 90% compared with the prior art.

Description

Technical Field

[0001] The invention relates to image acquisition equipment, and more specifically to a device and method for adjusting, detecting and fixing the flatness of an imaging module. Background Art

[0002] For image acquisition equipment, the optical axis of the optical lens and the plane of the image sensor (such as CMOS / CCD, etc.) must be kept perpendicular to ensure that the image captured by the image sensor is uniform on all sides and reduce aberrations. As the requirements for imaging quality continue to increase, the requirements for image sensor flatness are also getting higher and higher. However, due to the accumulation of tolerances, it is difficult for the plane of the image sensor to remain perpendicular to the optical axis of the lens, so the flatness of the image sensor must be adjusted and confirmed to meet the requirements.

[0003] The existing method for adjusting the verticality of the optical axis is to first install the machine and power it on, and after imaging on the display side, use software to judge the imaging quality, and then adjust the image sensor fixing screws to adjust the verticality of the image sensor and the optical axis, so as to achieve the image sensor flatness requirements. However, this method requires a series of steps such as installation, power on, startup, imaging, software judgment, screw adjustment, and re-judgment, which takes a long time (usually 2 to 3 minutes) and has low adjustment efficiency, which greatly limits the production efficiency of the production line. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a device and method for adjusting, detecting and fixing the flatness of an imaging module.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] On the one hand, a device for adjusting, detecting and fixing the flatness of an imaging module comprises an image sensor flatness adjustment mechanism; the image sensor flatness adjustment mechanism comprises a support base and a plurality of micrometer adjusters; the support base comprises an upper support plate, a lower support plate, and a support column connected between the upper support plate and the lower support plate; the upper support plate is provided with a through hole for the top ends of the plurality of micrometer adjusters to pass through, and the parts of the top ends of the plurality of micrometer adjusters passing through the through hole constitute a support adjustment surface for fixing a fixed plate with the image sensor; the fixed plate is kept in a horizontal state by adjusting the micrometer adjusters.

[0007] Its further technical solution is: there are three micrometer head adjusters, namely the first micrometer head adjuster, the second micrometer head adjuster and the third micrometer head adjuster; there are three through holes, namely the first through hole, the second through hole and the third through hole; the first micrometer head adjuster corresponds to the first through hole, the second micrometer head adjuster corresponds to the second through hole, and the third micrometer head adjuster corresponds to the third through hole; the first through hole is located in the middle of the rear of the upper support plate, and the second through hole and the third through hole are respectively located on both sides of the front of the upper support plate; the connecting line between the first through hole, the second through hole and the third through hole forms an equilateral triangle.

[0008] Its further technical solution is: the device also includes a collimator; the image sensor flatness adjustment mechanism also includes a spring pressure column landing gear, multiple first spring columns, multiple second spring columns, multiple positioning columns and a cover with a glass reflective surface; the spring pressure column landing gear is fixed to the side of the upper support plate; the lower ends of the multiple positioning columns are fixedly connected to the upper support plate, and the upper ends of the multiple positioning columns pass through the reserved holes on the fixed plate to laterally position the fixed plate, and the diameter of the reserved holes is larger than the diameter of the positioning columns; the upper ends of the multiple first spring columns are connected to the spring pressure column landing gear, and the lower ends of the multiple first spring columns are lightly pressed on the top of the fixed plate; the upper ends of the multiple second spring columns are connected to the spring pressure column landing gear, and the lower ends of the multiple second spring columns are lightly pressed on the top of the cover to compress the metal connector between the fixed plate and the cover; the collimator is arranged directly above the cover to adjust the flatness of the image sensor relative to the metal connection.

[0009] Its further technical solution is: the fixing plate is a PCB board.

[0010] Its further technical solution is: the device also includes an automatic glue dispensing machine and a UV irradiation lamp; the automatic glue dispensing machine and the UV irradiation lamp are both located on the side of the image sensor flatness adjustment mechanism, the automatic glue dispensing machine dispenses glue to fix the fixed plate and the metal connecting piece, and the UV irradiation lamp is used to irradiate the glue dispensing points of the fixed plate and the metal connecting piece to make them solidify quickly.

[0011] On the other hand, a method for adjusting, detecting and fixing the flatness of an imaging module comprises:

[0012] Fixing a plurality of micrometer adjusters on the upper support plate with their top ends passing through the upper surface of the upper support plate to form a support plane;

[0013] Pass the PCB board with the image sensor fixed on it through the reserved hole through the positioning column and place it on the supporting plane formed by the micrometer head adjuster;

[0014] Place the metal connector on top of the positioning post that passes through the reserved hole of the PCB board;

[0015] Covering the cover piece on the upper surface of the metal connector;

[0016] Control the spring pressure column landing gear so that the first spring column and the second spring column connected thereto lightly press on the PCB board and the cover respectively;

[0017] Observe the positions of the first laser spot and the second laser spot formed by the laser emitted by the collimator when it encounters the image sensor and the cover respectively, and adjust the micrometer head regulator to make the positions of the first laser spot and the second laser spot coincide with each other;

[0018] Start the glue dispenser to glue the metal connector to the PCB board;

[0019] Start the UV lamp to irradiate the connection between the metal connector and the PCB board with ultraviolet light so that the glue at the connection can be cured quickly.

[0020] The beneficial effects of the present invention compared with the prior art are as follows: the present invention provides a device and method for adjusting, detecting and fixing the flatness of an imaging module, which can adjust the flatness of an image sensor without starting up the machine under the action of an image sensor flatness adjustment mechanism and a collimator, thereby eliminating the step of relying on software judgment and adjustment at the display end during installation and startup. The entire flatness adjustment process only takes 10 to 15 seconds, and the time consumption is reduced to one tenth of the prior art. Compared with the prior art, the efficiency is improved by 90%. In addition, when used in conjunction with a dispensing machine, the cost of one workstation can be saved.

[0021] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of an image sensor flatness adjustment mechanism in a specific embodiment of a device for adjusting, detecting and fixing the flatness of an imaging module of the present invention;

[0023] Figure 2 A top view of a support base in a specific embodiment of a device for adjusting, detecting and fixing the flatness of an imaging module of the present invention;

[0024] Figure 3 It is a structural schematic diagram of a fixing plate, a metal connecting member and a covering member in a specific embodiment of a device for adjusting, detecting and fixing the flatness of an imaging module of the present invention;

[0025] Figure 4 This is an assembly diagram of a specific embodiment of a device for adjusting, detecting and fixing the flatness of an imaging module of the present invention.

[0026] Reference numerals

[0027] 1. Image sensor flatness adjustment mechanism; 11. Support base; 111. Lower support plate; 112. Upper support plate; 113. Support column; 12. Spring pressure column landing gear; 13. First spring column; 14. Second spring column; 15. Fixing plate; 151. Image sensor; 16. Metal connector; 17. Cover; 18. Micrometer head adjuster; 2. Collimator; 3. Automatic glue dispenser; 4. UV irradiation lamp. DETAILED DESCRIPTION

[0028] In order to more fully understand the technical content of the present invention, the technical solution of the present invention is further introduced and illustrated in conjunction with specific embodiments below, but is not limited thereto.

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0034] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0035] For image acquisition devices (e.g., cameras), the optical axis of the optical lens and the plane of the image sensor 151 (e.g., CMOS / CCD, etc.) need to remain perpendicular to ensure that the image captured by the image sensor 151 is uniform on all sides and to reduce aberrations. However, the prior art requires power-on and startup and then adjustment through software. The disadvantage of this adjustment method is that it requires power-on and startup to be adjusted, and the adjustment takes a long time, thereby limiting the production efficiency of the production line. Therefore, in order to solve the defects of the prior art, the present invention provides an image sensor 151 flatness adjustment device for an image acquisition device, which can adjust the flatness of the image sensor 151 without powering on (i.e., without powering on), eliminating the tedious steps of installing and starting the machine and then adjusting it by software, thereby improving the adjustment efficiency.

[0036] The following describes the specific structure of this device, please refer to Figure 2 The device includes a flatness adjustment mechanism 1 for an image sensor 151; the flatness adjustment mechanism 1 for the image sensor 151 includes a support base 11 and a plurality of micrometer adjusters 18; the support base 11 includes an upper support plate 112, a lower support plate 111, and a support column 113 connected between the upper support plate 112 and the lower support plate 111; the upper support plate 112 is provided with a through hole for the top ends of the plurality of micrometer adjusters 18 to pass through, and the parts of the top ends of the plurality of micrometer adjusters 18 passing through the through hole constitute a support adjustment surface for fixing a fixed plate 15 with the image sensor 151; the micrometer adjuster 18 is adjusted to make the fixed plate 15 in a horizontal state. The flatness adjustment mechanism 1 of the image sensor 151 also includes a spring pressure column landing gear 12, multiple first spring columns 13, multiple second spring columns 14, multiple positioning columns and a cover 17 with a glass reflective surface; the spring pressure column landing gear 12 is fixed to the side of the upper support plate 112; the lower ends of the multiple positioning columns are fixedly connected to the upper support plate 112, and the upper ends of the multiple positioning columns pass through the reserved holes on the fixed plate 15 to laterally position the fixed plate 15, and the diameter of the reserved holes is greater than the diameter of the positioning columns; the upper ends of the multiple first spring columns 13 are connected to the spring pressure column landing gear 12, and the lower ends of the multiple first spring columns 13 are lightly pressed on the top of the fixed plate 15; the upper ends of the multiple second spring columns 14 are connected to the spring pressure column landing gear 12, and the lower ends of the multiple second spring columns 14 are lightly pressed on the top of the cover 17 to compress the metal connecting piece 16 between the fixed plate 15 and the cover 17.

[0037] Specifically, the fixing plate 15 is a PCB board. The image sensor 151 is arranged on the PCB board, and the flatness of the image sensor 151 is adjusted by adjusting the PCB board. A plurality of through holes are arranged on the PCB board. In this embodiment, there are three through holes, namely, a first through hole, a second through hole and a third through hole. The first through hole is located in the middle of the rear of the upper support plate 112, and the second through hole and the third through hole are located on both sides of the front of the upper support plate 112 respectively; the connecting line between the first through hole, the second through hole and the third through hole forms an equilateral triangle for manual adjustment. The micrometer adjuster is a cone shape. In this embodiment, there are three micrometer adjusters 18, namely, a first micrometer adjuster 18, a second micrometer adjuster 18 and a third micrometer adjuster 18; the first micrometer adjuster 18 corresponds to the first through hole, the second micrometer adjuster 18 corresponds to the second through hole, and the third micrometer adjuster 18 corresponds to the third through hole. By controlling the length of the top of the micrometer adjuster 18 extending out of the through hole, the flatness of the PCB board can be adjusted. In addition, the micrometer adjuster 18 can not only adjust the flatness of the PCB board, but also solve the "stuck" phenomenon caused by the movement of the hole position caused by the up and down adjustment of the PCB board.

[0038] For further information, please refer to Figure 1 , 3 , 4, the micrometer head adjuster 18 device also includes a collimator 2, an automatic glue dispenser 3 and a UV irradiation lamp 4; the collimator 2 is arranged directly above the cover 17 to adjust the flatness of the image sensor 151 relative to the metal connection. The automatic glue dispenser 3 and the UV irradiation lamp 4 are both located on the side of the flatness adjustment mechanism 1 of the image sensor 151, the automatic glue dispenser 3 glues the fixed plate 15 and the metal connection 16, and the UV irradiation lamp 4 is used to irradiate the glued parts of the fixed plate 15 and the metal connection 16 to make them solidify quickly.

[0039] Specifically, the flatness of the image sensor 151 is relative to the optical axis of the optical lens. There is a connection surface at the bottom of the optical lens to which the image sensor 151 is connected. This surface is perpendicular to the optical axis, so the flatness of the image sensor 151 can be adjusted based on this surface. A high-precision and high-strength metal connector 16 is manufactured and fixed to the PCB board on which the image sensor 151 is fixed by glue, and then the metal connector 16 is locked to the connection surface at the bottom of the optical lens with screws. If the image sensor 151 can be parallel to the plane of the metal connector 16 before glue is applied, then the plane of the image sensor 151 can be perpendicular to the optical axis to achieve the minimum tolerance. Therefore, adjusting the flatness of the image sensor 151 is equivalent to adjusting the parallelism between the plane of the image sensor 151 and the plane of the metal connector 16.

[0040] The collimator uses its built-in laser to emit a laser beam. If a reflective surface is encountered on the laser path, the reflected laser will be imaged on the collimator to form a laser spot. If there are two reflective surfaces (the first reflective surface can transmit) on this laser path, two spots will be imaged on the collimator. When the two spots overlap, it means that the two reflective surfaces are parallel. Based on this principle, we can adjust the parallelism between the plane of the image sensor 151 and the plane of the metal connector 16.

[0041] For the image sensor 151, its surface itself has a certain reflectivity and can be directly used as the second reflective surface of the collimator. As for the metal connector 16, a cover 17 parallel to the surface of the metal connector 16 and having a glass reflective surface needs to be separately made to form a first reflective surface. When in use, the part where the positioning column passes through the reserved hole of the PCB board forms a support platform, the metal connector 16 is placed on the support platform, the cover 17 is placed on the metal connector 16, and then the three first spring columns 13 and the three second spring columns 14 are used to press the cover 17 to prevent it from moving.

[0042] At this point, the collimator can irradiate the laser from above the entire flatness adjustment device, thereby collecting two light spots formed by the reflection of the glass reflective surface of the cover 17 and the surface of the image sensor 151. By adjusting the height of the top of the micrometer adjuster 18 extending out of the through hole, the position of the light spot formed by the image sensor 151 can be adjusted until the positions of the two light spots coincide, that is, the flatness adjustment of the image sensor 151 is completed.

[0043] When the positions of the two light spots formed by the reflection of the glass reflective surface and the surface of the image sensor 151 are adjusted to overlap by the micrometer head adjuster 18, the automatic glue dispenser 3 can be used to dispense glue to fix the PCB board and the metal connector 16. After dispensing glue, the UV irradiation lamp 4 is started to irradiate the connection between the metal connector 16 and the PCB board with ultraviolet light so that the glue at the connection can be quickly cured. In this way, the entire image sensor 151 flatness adjustment process is completed. The image sensor 151 is then fixed to the bottom of the optical lens through the metal connector 16. At this time, the plane of the image sensor 151 is basically perpendicular to the optical axis, which eliminates the cumulative error to a great extent.

[0044] The present invention also provides a method for adjusting, detecting and fixing the flatness of an imaging module. The device used in the adjustment method is the above-mentioned device for adjusting, detecting and fixing the flatness of an imaging module. The method comprises the following steps:

[0045] The first step: fixing a plurality of micrometer adjusters on the upper support plate with their top ends passing through the upper surface of the upper support plate to form a support plane;

[0046] Step 2: Pass the PCB board with the image sensor fixed on it through the reserved hole through the positioning column and place it on the supporting plane formed by the micrometer head adjuster;

[0047] Step 3: Place the metal connector on top of the positioning column that passes through the reserved hole of the PCB board;

[0048] Step 4: Cover the cover on the upper surface of the metal connector;

[0049] Step 5: Control the spring pressure column landing gear so that the first spring column and the second spring column connected thereto lightly press on the PCB board and the cover respectively;

[0050] Step 6: Observe the positions of the first laser spot and the second laser spot formed by the laser emitted by the collimator when they encounter the image sensor and the cover respectively, and adjust the micrometer head regulator to make the positions of the first laser spot and the second laser spot coincide with each other;

[0051] Step 7: Start the glue dispenser to glue the metal connector to the PCB board;

[0052] Step 8: Start the UV lamp to irradiate the connection between the metal connector and the PCB board with ultraviolet light to quickly solidify the glue at the connection.

[0053] The present invention provides a device and method for adjusting, detecting and fixing the flatness of an imaging module. Through the action of an image sensor flatness adjustment mechanism and a collimator, the flatness of an image sensor can be adjusted without starting up the machine, eliminating the step of relying on software judgment and adjustment at the display end during installation and startup. The entire flatness adjustment process only takes 10 to 15 seconds, and the time consumption is reduced to one tenth of the prior art. Compared with the prior art, the efficiency is improved by 90%. In addition, when used in conjunction with a glue dispensing machine, the cost of one workstation can be saved.

[0054] The above examples are only used to further illustrate the technical content of the present invention, so that readers can understand it more easily, but they do not mean that the implementation of the present invention is limited to this. Any technical extension or re-creation made according to the present invention is protected by the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. A method for adjusting, detecting and fixing the flatness of an imaging module, which is applicable to a device for adjusting, detecting and fixing the flatness of an imaging module, characterized in that: The device includes an image sensor flatness adjustment mechanism; the image sensor flatness adjustment mechanism includes a support base and a plurality of micrometer adjusters; the support base includes an upper support plate, a lower support plate, and a support column connected between the upper support plate and the lower support plate; the upper support plate is provided with a through hole for the top ends of the plurality of micrometer adjusters to pass through, and the parts of the top ends of the plurality of micrometer adjusters passing through the through holes constitute a support adjustment surface for fixing a fixed plate with an image sensor; the micrometer adjuster is adjusted to make the fixed plate in a horizontal state; the device also includes a collimator; the image sensor flatness adjustment mechanism also includes a spring pressure column landing gear, a plurality of first spring columns, a plurality of second spring columns, a plurality of positioning columns and a cover with a glass reflective surface; the spring pressure column landing gear is fixed to the side of the upper support plate; the lower ends of the plurality of positioning columns are fixedly connected to the upper support plate, and the upper ends of the plurality of positioning columns pass through the fixed plate A reserved hole is provided to laterally position the fixing plate, and the diameter of the reserved hole is larger than the diameter of the positioning column; the upper ends of the plurality of first spring columns are connected to the spring pressure column landing gear, and the lower ends of the plurality of first spring columns are lightly pressed on the top of the fixing plate; the upper ends of the plurality of second spring columns are connected to the spring pressure column landing gear, and the lower ends of the plurality of second spring columns are lightly pressed on the top of the covering member to compress the metal connecting member between the fixing plate and the covering member; the collimator is arranged directly above the covering member to adjust the flatness of the image sensor relative to the metal connection; the fixing plate is a PCB board; the device also includes an automatic glue dispenser and a UV irradiation lamp; the automatic glue dispenser and the UV irradiation lamp are both located on the side of the image sensor flatness adjustment mechanism, the automatic glue dispenser dispenses glue to fix the fixing plate and the metal connecting member, and the UV irradiation lamp is used to irradiate the glue dispensed portion of the fixing plate and the metal connecting member to make it solidify quickly; the method includes: Fixing a plurality of micrometer adjusters on the upper support plate with their top ends passing through the upper surface of the upper support plate to form a support plane; Pass the PCB board with the image sensor fixed on it through the reserved hole through the positioning column and place it on the supporting plane formed by the micrometer head adjuster; Place the metal connector on top of the positioning post that passes through the reserved hole of the PCB board; Covering the cover piece on the upper surface of the metal connector; Control the spring pressure column landing gear so that the first spring column and the second spring column connected thereto are lightly pressed on the PCB board and the cover respectively; Observe the positions of the first laser spot and the second laser spot formed by the laser emitted by the collimator when it encounters the image sensor and the cover respectively, and adjust the micrometer head regulator to make the positions of the first laser spot and the second laser spot coincide with each other; Start the glue dispenser to glue the metal connector to the PCB board; Start the UV lamp to irradiate the connection between the metal connector and the PCB board with ultraviolet light so that the glue at the connection can be cured quickly.

2. A method for adjusting, detecting and fixing the flatness of an imaging module according to claim 1, characterized in that: There are three micrometer head adjusters, namely the first micrometer head adjuster, the second micrometer head adjuster and the third micrometer head adjuster; there are three through holes, namely the first through hole, the second through hole and the third through hole; the first micrometer head adjuster corresponds to the first through hole, the second micrometer head adjuster corresponds to the second through hole, and the third micrometer head adjuster corresponds to the third through hole; the first through hole is located in the middle of the rear of the upper support plate, and the second through hole and the third through hole are respectively located on both sides of the front of the upper support plate; the connecting line between the first through hole, the second through hole and the third through hole forms an equilateral triangle.

Images