Organic light-emitting display device and manufacturing method thereof

Abstract

An organic light-emitting display device and a method for manufacturing the same are disclosed. The organic light-emitting display device includes a substrate, a pixel electrode located on the substrate, an auxiliary electrode spaced apart from the pixel electrode, a first insulating film located between the pixel electrode and the auxiliary electrode and covering ends of the pixel electrode and the auxiliary electrode, an intermediate layer located on the pixel electrode and including an emissive layer, an opposing electrode covering the intermediate layer and in contact with the auxiliary electrode, and a passivation layer covering the opposing electrode.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of Korean Patent Application No. 10-2018-0136035, filed on November 7, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present inventive concept relates to an organic light emitting display device and a method for manufacturing the same. Background Art

[0004] An organic light-emitting display device is a self-luminous display device that includes an organic light-emitting device (OLED). The organic light-emitting device has a hole injection electrode, an electron injection electrode, and an organic emission layer formed between the hole and electron injection electrodes. As holes injected by the hole injection electrode and electrons injected by the electron injection electrode combine in the organic emission layer, excitons generated by the combination transition from an excited state to a ground state, causing the OLED to emit light.

[0005] Although a fine metal mask (FMM) is used to deposit an organic emission layer on a substrate, the FMM may increase manufacturing costs. Summary of the Invention

[0006] According to an exemplary embodiment of the present invention, an organic light-emitting display device includes a substrate, a pixel electrode located on the substrate, an auxiliary electrode spaced apart from the pixel electrode, a first insulating film located between the pixel electrode and the auxiliary electrode and covering an end portion of the pixel electrode and an end portion of the auxiliary electrode, an intermediate layer located on the pixel electrode and including an emission layer, a relative electrode covering the intermediate layer and in contact with the auxiliary electrode, and a passivation layer covering the relative electrode.

[0007] The auxiliary electrode may surround the pixel electrode.

[0008] The auxiliary electrode may include the same material as the pixel electrode.

[0009] The first insulating film may surround the pixel electrode.

[0010] The intermediate layer may also include a hole injection layer, a hole transport layer, an electron transport layer, or an electron injection layer.

[0011] An end portion of the opposing electrode may be in contact with an upper surface of the auxiliary electrode.

[0012] An end portion of the passivation layer may be in contact with an upper surface of the auxiliary electrode.

[0013] The passivation layer may be in an island shape.

[0014] The passivation layer may include oxide, oxynitride, or nitride.

[0015] The organic light-emitting display device may further include a sealing member on the passivation layer, and the sealing member may include an organic layer and an inorganic layer.

[0016] The organic light emitting display device may further include a second insulating film between the auxiliary electrode and the substrate.

[0017] The auxiliary electrode and the first insulating film may be located on the second insulating film.

[0018] An end portion of the pixel electrode may be located on the second insulating film.

[0019] The first insulating film may surround the pixel electrode located on the second insulating film.

[0020] According to an exemplary embodiment of the present invention, an organic light-emitting display device includes a substrate, a first pixel electrode, a second pixel electrode, an auxiliary electrode, a first insulating film, a second insulating film, a first intermediate layer, a second intermediate layer, a first relative electrode, a second relative electrode, a first passivation layer, and a second passivation layer, wherein the first pixel electrode and the second pixel electrode are located on the substrate; the auxiliary electrode surrounds the first pixel electrode and the second pixel electrode, wherein the auxiliary electrode is spaced apart from the first pixel electrode and the second pixel electrode; the first insulating film is located between the first pixel electrode and the auxiliary electrode and covers an end portion of the first pixel electrode and a first end portion of the auxiliary electrode; the second insulating film is arranged between the second pixel electrode and the auxiliary electrode and covers an end portion of the second pixel electrode and a second end portion of the auxiliary electrode; the first intermediate layer includes a first emission layer and is arranged on the first pixel electrode; the second intermediate layer includes a second emission layer and is arranged on the second pixel electrode; the first relative electrode covers the first intermediate layer and is in contact with the auxiliary electrode; the second relative electrode covers the second intermediate layer and is in contact with the auxiliary electrode; the first passivation layer covers the first relative electrode; and the second passivation layer covers the second relative electrode.

[0021] The first pixel electrode and the second pixel electrode may include the same material as the auxiliary electrode.

[0022] The first insulating film and the second insulating film may surround the first pixel electrode and the second pixel electrode, respectively.

[0023] The organic light emitting display device may further include a third insulating film between the first pixel electrode, the second pixel electrode, and the substrate.

[0024] The first pixel electrode and the second pixel electrode may be located on the third insulating film.

[0025] The organic light-emitting display device may further include a sealing member disposed on the first passivation layer and the second passivation layer and including an organic layer and an inorganic layer.

[0026] According to an exemplary embodiment of the present invention, a method for manufacturing an organic light-emitting display device includes: simultaneously forming a pixel electrode and an auxiliary electrode on a substrate; forming a first insulating film between the pixel electrode and the auxiliary electrode to cover an end portion of the pixel electrode and an end portion of the auxiliary electrode; sequentially forming a stripping layer and a photoresist on the pixel electrode, the auxiliary electrode and the first insulating film; forming an opening exposing an upper surface of the pixel electrode by patterning the stripping layer and the photoresist; sequentially forming an intermediate layer including an emission layer, a relative electrode and a passivation layer in the opening and on the photoresist, wherein the relative electrode in the opening contacts the auxiliary electrode while covering the intermediate layer; and removing the stripping layer and the photoresist.

[0027] The auxiliary electrode may surround the pixel electrode.

[0028] The counter electrode and the passivation layer may be formed by a vapor deposition method.

[0029] The method for manufacturing an organic light-emitting display device may further include forming a second insulating film between the substrate and the auxiliary electrode, wherein the auxiliary electrode and the first insulating film may be located on the second insulating film.

[0030] The pixel electrode and the auxiliary electrode may be formed using the same material and the same mask process.

[0031] According to an exemplary embodiment of the present invention, a light-emitting display device includes a substrate, a pixel electrode located on the substrate, an auxiliary electrode located on the substrate, an insulating film located between the pixel electrode and the auxiliary electrode and overlapping with the pixel electrode and the auxiliary electrode, an intermediate layer overlapping with the pixel electrode and the insulating film, a relative electrode covering the intermediate layer and in contact with the auxiliary electrode, and a passivation layer covering the relative electrode and in contact with the auxiliary electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other features of the inventive concept will become more apparent by describing in detail exemplary embodiments of the present invention with reference to the accompanying drawings, in which:

[0033] Figure 1 is a plan view of an organic light emitting display device according to a first exemplary embodiment of the present inventive concept;

[0034] Figure 2 It is along Figure 1 A cross-sectional view taken along line IIA-IIB of FIG.

[0035] Figure 3A and Figure 3B yes Figure 1 A plan view of the local configuration of Zone II;

[0036] Figure 4is a cross-sectional view of an operation of forming first to third pixel electrodes, an auxiliary electrode, and a first insulating film on a substrate of the organic light emitting display device according to the first embodiment;

[0037] Figure 5A 、 Figure 5B 、 Figure 5C 、 Figure 5D and Figure 5E is a cross-sectional view of a first unit process of the organic light emitting display device according to the first embodiment;

[0038] Figure 6A 、 Figure 6B 、 Figure 6C 、 Figure 6D and Figure 6E is a cross-sectional view of a second unit process of the organic light emitting display device according to the first embodiment;

[0039] Figure 7A 、 Figure 7B 、 Figure 7C 、 Figure 7D and Figure 7E is a cross-sectional view of a third unit process of the organic light emitting display device according to the first embodiment;

[0040] Figure 8 is a plan view of an organic light emitting display device according to a comparative example;

[0041] Figure 9 、 Figure 10 and Figure 11 is a cross-sectional view of an operation of forming first to third pixel electrodes, an auxiliary electrode, and a first insulating film on a substrate of an organic light emitting display device according to a comparative example;

[0042] Figure 12A 、 Figure 12B 、 Figure 12C 、 Figure 12D and Figure 12E is a cross-sectional view of a first unit process of an organic light emitting display device according to a comparative example;

[0043] Figure 13 is a cross-sectional view of an organic light emitting display device according to a second exemplary embodiment of the present inventive concept;

[0044] Figure 14 and Figure 15 is a cross-sectional view of an operation of forming first and second pixel electrodes, an auxiliary electrode, and first and second insulating films on a substrate of an organic light emitting display device according to a second embodiment; and

[0045] Figure 16A 、 Figure 16B 、 Figure 16C 、 Figure 16D and Figure 16E FIG. 1 is a cross-sectional view of a first unit process of an organic light emitting display device according to a second embodiment. DETAILED DESCRIPTION

[0046] Exemplary embodiments of the present inventive concept will be described with reference to the accompanying drawings. However, the present inventive concept may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0047] Unless it has an obviously different meaning in the context, an expression used in the singular includes the expression in the plural.

[0048] It will be understood that when a layer, region or component is referred to as being “formed on” another layer, region or component, it can be directly formed on the other layer, region or component or intervening layers, regions or components may be present.

[0049] For convenience of explanation, the sizes of components in the drawings may be exaggerated. In addition, the same reference numerals may designate the same elements throughout the specification.

[0050] Figure 1 is a plan view of an organic light emitting display device 1 according to a first exemplary embodiment of the present inventive concept, Figure 2 It is along Figure 1 A cross-sectional view taken along line IIA-IIB of Figure 3A and Figure 3B yes Figure 1 A plan view of the local configuration of Zone II.

[0051] Reference Figure 1 The organic light emitting display device 1 according to the first embodiment includes a display area DA and a peripheral area PA as a non-display area located outside the display area DA on a substrate 100. For example, the peripheral area PA may surround the display area DA.

[0052] The display area DA is used for displaying images and may be arranged with multiple pixels including organic light-emitting devices. Each pixel may include at least two thin-film transistors and at least one capacitor. The peripheral area PA is a region where images are not displayed and may be arranged with circuitry for applying electrical signals to the display area DA, wiring, and the like.

[0053] Reference Figure 2 According to this embodiment, the organic light-emitting display device 1 includes a first pixel electrode 101, a second pixel electrode 102 and a third pixel electrode 103 spaced apart from each other on a substrate 100, and an auxiliary electrode 201 located between the first pixel electrode 101, the second pixel electrode 102 and the third pixel electrode 103.

[0054] A thin film transistor layer 109 including a first thin film transistor TR1, a second thin film transistor TR2, and a third thin film transistor TR3 is disposed between the substrate 100 and the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103. The first thin film transistor TR1, the second thin film transistor TR2, and the third thin film transistor TR3 may be driving thin film transistors connected to the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103, respectively.

[0055] The first insulating film 110 covers the ends of the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 and the end of the auxiliary electrode 201. The first insulating film 110 covers the ends of the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 to prevent electric field concentration at each end, and may serve as a pixel defining layer that defines a light emitting area.

[0056] Figure 3A and Figure 3B As Figure 1 The partial configuration of the region II in FIG. 1 shows an example of the arrangement relationship of the first pixel electrode 101 , the second pixel electrode 102 , and the third pixel electrode 103 , the auxiliary electrode 201 , and the first insulating film 110 of this embodiment.

[0057] Reference Figure 3A , the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 are spaced apart from each other. The same pixel electrodes are arranged in the same column, and different pixel electrodes are arranged in a matrix in the same row. For example, the first pixel electrode 101 can be arranged in the first column.

[0058] The auxiliary electrode 201 is spaced apart from the first pixel electrode 101 , the second pixel electrode 102 , and the third pixel electrode 103 and surrounds the first pixel electrode 101 , the second pixel electrode 102 , and the third pixel electrode 103 . Figure 3A and Figure 3B The auxiliary electrode 201 may be electrically connected to a wiring on a different layer from the auxiliary electrode 201 through a contact hole.

[0059] The first insulating film 110 is respectively disposed between the first pixel electrode 101 and the auxiliary electrode 201, between the second pixel electrode 102 and the auxiliary electrode 201, and between the third pixel electrode 103 and the auxiliary electrode 201. The first insulating film 110 may surround the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 in a closed loop shape.

[0060] Reference Figure 3B, the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 are spaced apart from each other. The first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 may be arranged in a diamond shape, and the diamond shape may have a pentile arrangement in which the first pixel electrode 101 and the third pixel electrode 103 are radially arranged with the second pixel electrode 102 as the center.

[0061] and Figure 3A Similarly, the auxiliary electrode 201 is arranged to be spaced apart from the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 and to surround the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103. The first insulating film 110 is respectively arranged between the first pixel electrode 101 and the auxiliary electrode 201, between the second pixel electrode 102 and the auxiliary electrode 201, and between the third pixel electrode 103 and the auxiliary electrode 201. The first insulating film 110 may surround the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 in a closed loop shape.

[0062] exist Figure 3A and Figure 3B In the embodiment, the first pixel electrode 101, the second pixel electrode 102 and the third pixel electrode 103 have the same size, but this is only an example. The sizes of the pixel electrodes may be different. In addition, this embodiment can be applied to Figure 3A and Figure 3B The pixel electrode arrangements shown in FIG. 5 are different from those in FIG.

[0063] Refer again Figure 2 The first intermediate layer 301 , the second intermediate layer 302 and the third intermediate layer 303 are respectively arranged on the first pixel electrode 101 , the second pixel electrode 102 and the third pixel electrode 103 .

[0064] The first intermediate layer 301, the second intermediate layer 302, and the third intermediate layer 303 include a first emission layer, a second emission layer, and a third emission layer, respectively. The first to third emission layers can emit light of different colors. In an exemplary embodiment of the present invention, the first emission layer can emit red light, the second emission layer can emit green light, and the third emission layer can emit blue light. In this embodiment, the first intermediate layer 301, the second intermediate layer 302, and the third intermediate layer 303 including the first to third emission layers are arranged in the display area DA, but the present invention is not limited thereto. Another exemplary embodiment of the present invention may further include a fourth intermediate layer and a fourth emission layer that emits white light in addition to the first to third emission layers.

[0065] The first intermediate layer 301 , the second intermediate layer 302 , and the third intermediate layer 303 may further include a hole injection layer, a hole transport layer, an electron transport layer, or an electron injection layer.

[0066] The first opposing electrode 401, the second opposing electrode 402, and the third opposing electrode 403 are respectively arranged on the first intermediate layer 301, the second intermediate layer 302, and the third intermediate layer 303, and cover the first intermediate layer 301, the second intermediate layer 302, and the third intermediate layer 303. The first opposing electrode 401 covers the first intermediate layer 301 and extends to the auxiliary electrode 201 to contact the auxiliary electrode 201, the second opposing electrode 402 covers the second intermediate layer 302 and extends to the auxiliary electrode 201 to contact the auxiliary electrode 201, and the third opposing electrode 403 covers the third intermediate layer 303 and extends to the auxiliary electrode 201 to contact the auxiliary electrode 201.

[0067] The auxiliary electrode 201 is electrically connected to a common power supply voltage, and the common power supply voltage is applied to each of the first opposing electrode 401, the second opposing electrode 402, and the third opposing electrode 403 that are in contact with the auxiliary electrode 201. When a driving current is transmitted from the driving thin film transistor to the first to third pixel electrodes 101 to 103 and the common power supply voltage is applied to the first to third opposing electrodes 401 to 403 through the auxiliary electrode 201, the first to third emission layers emit light.

[0068] The first passivation layer 501 , the second passivation layer 502 , and the third passivation layer 503 are disposed on the first opposing electrode 401 , the second opposing electrode 402 , and the third opposing electrode 403 , respectively.

[0069] The first passivation layer 501 completely covers the first opposing electrode 401 and extends to the auxiliary electrode 201, such that an end of the first passivation layer 501 contacts the upper surface of the auxiliary electrode 201. The second passivation layer 502 completely covers the second opposing electrode 402 and extends to the auxiliary electrode 201, such that an end of the second passivation layer 502 contacts the upper surface of the auxiliary electrode 201. The third passivation layer 503 completely covers the third opposing electrode 403 and extends to the auxiliary electrode 201, such that an end of the third passivation layer 503 contacts the upper surface of the auxiliary electrode 201.

[0070] The first, second, and third passivation layers 501, 502, and 503 completely cover the first, second, and third intermediate layers 301, 302, and 303, respectively, as well as the first, second, and third opposing electrodes 401, 402, and 403. As a result, the organic light-emitting device can be prevented from being damaged during a patterning operation to be described later.

[0071] In this embodiment, the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 may be spaced apart from each other in an island shape, and the first intermediate layer 301, the second intermediate layer 302, and the third intermediate layer 303 may also be arranged in an island shape on the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103. The first passivation layer 501, the second passivation layer 502, and the third passivation layer 503 covering the first opposing electrode 401, the second opposing electrode 402, and the third opposing electrode 403 may also be arranged in an island shape.

[0072] A sealing member 700 covering the entire upper surface of the first, second, and third passivation layers 501 , 502 , and 503 and the auxiliary electrode 201 is disposed on the substrate 100 .

[0073] The sealing member 700 may include at least one organic layer and at least one inorganic layer. Figure 2 A structure in which a first inorganic layer 701 , an organic layer 702 , and a second inorganic layer 703 are sequentially stacked is shown.

[0074] The organic layer 702 may include a polymer material such as polymethyl methacrylate (PMMA), polycarbonate (PC), polystyrene (PS), acrylic resin, epoxy resin, polyimide, and polyethylene. The first inorganic layer 701 and the second inorganic layer 703 may include aluminum nitride (AlN), aluminum oxide (Al2O3), titanium nitride (TiN), titanium oxide (TiO2), silicon oxynitride (SiON), silicon nitride (SiN x ), silicon oxide (SiO x )wait.

[0075] The sealing member 700 may prevent the organic light-emitting device together with the first to third passivation layers 501 , 502 , and 503 from being damaged by moisture by preventing moisture penetration.

[0076] Will refer to Figures 4 to 7E A method of manufacturing the organic light-emitting display device 1 according to the first embodiment and the organic light-emitting display device 1 manufactured by the manufacturing method are described in more detail.

[0077] Figure 4 is a cross-sectional view of an operation of forming the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103, the auxiliary electrode 201, and the first insulating film 110 on the substrate 100 of the organic light-emitting display device 1 according to the first embodiment, Figures 5A to 5E is a cross-sectional view of a first unit process of the organic light-emitting display device 1 according to the first embodiment. Figures 6A to 6E is a cross-sectional view of a second unit process of the organic light emitting display device 1 according to the first embodiment, and 7A to 7Eis a cross-sectional view of a third unit process of the organic light emitting display device 1 according to the first embodiment.

[0078] Reference Figure 4 , the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 are spaced apart from each other on the substrate 100, and the auxiliary electrode 201 is arranged between the first pixel electrode 101 to the third pixel electrode 103. For example, the auxiliary electrode 201 is arranged between the first pixel electrode 101 and the second pixel electrode 102, and the auxiliary electrode 201 is arranged between the second pixel electrode 102 and the third pixel electrode 103. The first insulating film 110 is formed to cover the end portions of the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 and the end portion of the auxiliary electrode 201, and the first thin film transistor TR1, the second thin film transistor TR2, and the third thin film transistor TR3 are connected to the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103, respectively.

[0079] The substrate 100 may include various materials such as a glass material or a plastic material (such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide). When the substrate 100 includes a plastic material, its flexibility may be better than when the substrate 100 includes a glass material. The substrate 100 may be provided with a SiO2 film formed to prevent impurities from penetrating. x and / or SiN x Buffer layer.

[0080] A buffer layer may also be formed on the substrate 100 to form a smooth surface and prevent impurities from penetrating thereunder. For example, the buffer layer may include SiN x or SiO x Single or multi-layer.

[0081] The first pixel electrode 101 , the second pixel electrode 102 , and the third pixel electrode 103 and the auxiliary electrode 201 are formed by forming a conductive material layer and patterning the conductive material layer.

[0082] The conductive material layer may include a reflective layer formed of Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, or a transparent conductive oxide (TCO) film located above or below the reflective layer. Alternatively, the conductive material layer may be a thin film including silver (Ag) or an Ag alloy, or may include a transparent conductive oxide film formed on a thin film. Depending on the conductive material layer, the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 may include a reflective electrode or a transparent electrode.

[0083] The auxiliary electrode 201 includes the same material as the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103, and is formed using the same patterning process as the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103. The auxiliary electrode 201 is spaced apart from and surrounds the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103. In this embodiment, since the auxiliary electrode 201 is formed using the same patterning process as the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103, the process can be simplified and damage to the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 can be prevented.

[0084] Afterwards, an insulating film is formed and patterned to form a first insulating film 110. The first insulating film 110 covers the ends of the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 and the end of the auxiliary electrode 201. The first insulating film 110 may include an organic insulating material or an inorganic insulating material.

[0085] Reference Figure 5A ,exist Figure 4 A first lift-off layer LOL1 and a first photoresist PR1 are sequentially formed on the structure.

[0086] The first peeling layer LOL1 may include a non-photosensitive organic material. The first peeling layer LOL1 may include a fluoropolymer. The fluoropolymer included in the first peeling layer LOL1 may be formed of a polymer including a fluorine content of about 20 to about 60wt%. For example, the fluoropolymer included in the first peeling layer LOL1 may include polytetrafluoroethylene, polychlorotrifluoroethylene, polydichlorodifluoroethylene, a copolymer of chlorotrifluoroethylene and dichlorodifluoroethylene, a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether, a copolymer of chlorotrifluoroethylene and perfluoroalkyl vinyl ether, a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether, a copolymer of perfluoroalkyl vinyl ether and perfluoroalkyl vinyl ether, a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether, or a copolymer of chlorotrifluoroethylene and perfluoroalkyl vinyl ether. The first peeling layer LOL1 may be formed by a coating method, a printing method, a vapor deposition method, etc.

[0087] A first photoresist PR1 is formed on the first lift-off layer LOL1. The first photoresist PR1 at a position corresponding to the first pixel electrode 101 is exposed through a first photomask M1 including a light-transmitting portion M11 and a light-blocking portion M12.

[0088] Reference Figure 5B, the first photoresist PR1 is developed. The first photoresist PR1 can be positive or negative. In this embodiment, the positive type is described as an example. The developed first photoresist PR1 has a first opening C1 at a portion corresponding to the first pixel electrode 101.

[0089] Reference Figure 5C ,use Figure 5B The first lift-off layer LOL1 is etched using the patterned first photoresist PR1 as an etching mask.

[0090] When the first lift-off layer LOL1 includes a fluoropolymer, the etchant uses a first solvent capable of etching the fluoropolymer. The first solvent may include a hydrofluoroether. Hydrofluoroether is an electrochemically stable material with low interaction with other materials and is environmentally stable due to its low global warming potential and low toxicity.

[0091] When the first lift-off layer LOL1 is etched through the etching process, the first solvent including fluorine forms a first undercut profile UC1 below the first opening C1 of the first photoresist PR1.

[0092] Reference Figure 5D ,exist Figure 5C A first intermediate layer 301 including a first emission layer, a first opposite electrode 401, and a first passivation layer 501 are formed on the structure. The first intermediate layer 301 may be formed to further include a hole injection layer, a hole transport layer, an electron transport layer, or an electron injection layer.

[0093] The first intermediate layer 301, the first opposite electrode 401, and the first passivation layer 501 are formed by vacuum deposition. Deposition materials discharged from a deposition source are sequentially deposited by controlling a deposition angle incident on the substrate 100.

[0094] The first intermediate layer 301 is stacked on the upper surface of the first pixel electrode 101 and the upper surface of the first insulating film 110. The first opposing electrode 401 is stacked on and in contact with the upper surface of the first intermediate layer 301, the first insulating film 110, and the auxiliary electrode 201. The first passivation layer 501 is stacked on and in contact with the upper surface of the first opposing electrode 401 and the auxiliary electrode 201. The first intermediate layer 301, the first opposing electrode 401, and the first passivation layer 501 are also stacked on the first photoresist PR1.

[0095] The first passivation layer 501 may include oxide, oxynitride, or nitride. The first passivation layer 501 may be formed by a vapor deposition method.

[0096] The first peeling layer LOL1 may include a non-photosensitive organic material. The first peeling layer LOL1 may include a fluorine-containing polymer. The fluorine-containing polymer included in the first peeling layer LOL1 may be formed of a polymer including a fluorine content of about 20 to about 60 wt %.

[0097] Since the first passivation layer 501 completely covers the first intermediate layer 301 , the first intermediate layer 301 including the first emission layer may be prevented from being damaged by a first solvent used in a lift-off process to be described below.

[0098] Reference Figure 5E ,exist Figure 5D A lift-off process is performed on the structure.

[0099] When the first peeling layer LOL1 includes a fluorine-containing polymer, a second solvent including fluorine may be used to remove the first peeling layer LOL1. Since the peeling process is performed after forming the first intermediate layer 301 including the first emission layer, a material having low reactivity with the first intermediate layer 301 may be used as the second solvent. The second solvent may include hydrofluoroether as well as the first solvent.

[0100] As a result of the lift-off process, the first intermediate layer 301 , the first opposite electrode 401 , and the first passivation layer 501 disposed on the first pixel electrode 101 , the first insulating film 110 , and the auxiliary electrode 201 remain as a pattern.

[0101] Reference Figure 6A ,exist Figure 5E A second lift-off layer LOL2 and a second photoresist PR2 are sequentially formed on the structure.

[0102] The second peeling layer LOL2 may include the same material as the first peeling layer LOL1 described above. The second peeling layer LOL2 may be formed by a coating method, a printing method, a vapor deposition method, or the like.

[0103] A second photoresist PR2 is formed on the second lift-off layer LOL2. The second photoresist PR2 at a position corresponding to the second pixel electrode 102 is exposed through a second photomask M2 including a light-transmitting portion M21 and a light-blocking portion M22.

[0104] Reference Figure 6B , the second photoresist PR2 is developed. The developed second photoresist PR2 has a second opening C2 at a portion corresponding to the second pixel electrode 102.

[0105] Reference Figure 6C ,use Figure 6B The second lift-off layer LOL2 is etched using the patterned second photoresist PR2 as an etching mask.

[0106] When the second lift-off layer LOL2 includes a fluoropolymer, the etchant uses a first solvent capable of etching the fluoropolymer. The first solvent may include a hydrofluoroether. When the second lift-off layer LOL2 is etched by the etching process, the first solvent including fluorine forms a second undercut profile UC2 below the second opening C2 of the second photoresist PR2.

[0107] Reference Figure 6D ,exist Figure 6C A second intermediate layer 302 including a second emission layer, a second opposing electrode 402, and a second passivation layer 502 are formed on the structure. The second intermediate layer 302 may be formed to further include a hole injection layer, a hole transport layer, an electron transport layer, or an electron injection layer.

[0108] The second intermediate layer 302, the second opposite electrode 402, and the second passivation layer 502 are formed by vacuum deposition. Deposition materials discharged from a deposition source are sequentially deposited by controlling a deposition angle incident on the substrate 100.

[0109] The second intermediate layer 302 is stacked on the upper surface of the second pixel electrode 102 and the upper surface of the first insulating film 110. The second opposing electrode 402 is stacked on and in contact with the second intermediate layer 302, the first insulating film 110, and the upper surface of the auxiliary electrode 201. The second passivation layer 502 is stacked on and in contact with the upper surface of the second opposing electrode 402 and the auxiliary electrode 201. The second intermediate layer 302, the second opposing electrode 402, and the second passivation layer 502 are also stacked on the second photoresist PR2.

[0110] The second peeling layer LOL2 may include a non-photosensitive organic material. The second peeling layer LOL2 may include a fluorine-containing polymer. The fluorine-containing polymer included in the second peeling layer LOL2 may be formed of a polymer including a fluorine content of about 20 to about 60 wt %.

[0111] Since the second passivation layer 502 completely covers the second intermediate layer 302 , the second intermediate layer 302 including the second emission layer may be prevented from being damaged by a first solvent used in a lift-off process to be described below.

[0112] Reference Figure 6E ,exist Figure 6D A lift-off process is performed on the structure.

[0113] When the second peeling layer LOL2 includes a fluorine-containing polymer, the second peeling layer LOL2 may be removed using a second solvent including fluorine.

[0114] As a result of the lift-off process, the second intermediate layer 302 , the second opposite electrode 402 , and the second passivation layer 502 disposed on the second pixel electrode 102 , the first insulating film 110 , and the auxiliary electrode 201 remain as a pattern.

[0115] Reference Figure 7A ,exist Figure 6E A third lift-off layer LOL3 and a third photoresist PR3 are sequentially formed on the structure.

[0116] The third peeling layer LOL3 may include the same material as the first peeling layer LOL1 and the second peeling layer LOL2 described above. The third peeling layer LOL3 may be formed by a coating method, a printing method, a vapor deposition method, or the like.

[0117] A third photoresist PR3 is formed on the third lift-off layer LOL3. The third photoresist PR3 at a position corresponding to the third pixel electrode 103 is exposed through a third photomask M3 including a light-transmitting portion M31 and a light-blocking portion M32.

[0118] Reference Figure 7B , the third photoresist PR3 is developed. The developed third photoresist PR3 has a third opening C3 at a portion corresponding to the third pixel electrode 103.

[0119] Reference Figure 7C ,use Figure 7B The patterned third photoresist PR3 is used as an etching mask to etch the third lift-off layer LOL3.

[0120] When the third lift-off layer LOL3 includes a fluoropolymer, the etchant uses a first solvent capable of etching the fluoropolymer. The first solvent may include a hydrofluoroether. When the third lift-off layer LOL3 is etched by the etching process, the first solvent including fluorine forms a third undercut profile UC3 below the third opening C3 of the third photoresist PR3.

[0121] Reference Figure 7D ,exist Figure 7C A third intermediate layer 303 including a third emission layer, a third opposing electrode 403, and a third passivation layer 503 are formed on the structure. The third intermediate layer 303 may be formed to further include a hole injection layer, a hole transport layer, an electron transport layer, or an electron injection layer.

[0122] The third intermediate layer 303, the third opposite electrode 403, and the third passivation layer 503 are formed by vacuum deposition. Deposition materials discharged from a deposition source are sequentially deposited by controlling a deposition angle incident on the substrate 100.

[0123] The third intermediate layer 303 is stacked on and in contact with the upper surface of the third pixel electrode 103 and the upper surface of the first insulating film 110. The third opposing electrode 403 is stacked on and in contact with the upper surface of the third intermediate layer 303, the first insulating film 110, and the auxiliary electrode 201. The third passivation layer 503 is stacked on and in contact with the upper surface of the third opposing electrode 403 and the auxiliary electrode 201. The third intermediate layer 303, the third opposing electrode 403, and the third passivation layer 503 are also stacked on the third photoresist PR3.

[0124] The third peeling layer LOL3 may include a non-photosensitive organic material. The third peeling layer LOL3 may include a fluorine-containing polymer. The fluorine-containing polymer included in the third peeling layer LOL3 may be formed of a polymer including a fluorine content of about 20 to about 60 wt %.

[0125] Since the third passivation layer 503 completely covers the third intermediate layer 303 , the third intermediate layer 303 including the third emission layer may be prevented from being damaged by a first solvent used in a lift-off process to be described below.

[0126] Reference Figure 7E ,exist Figure 7D A lift-off process is performed on the structure.

[0127] When the third peeling layer LOL3 includes a fluorine-containing polymer, the third peeling layer LOL3 can be removed using a second solvent including fluorine. As a result of the peeling process, the third intermediate layer 303, the third opposing electrode 403, and the third passivation layer 503 disposed on the third pixel electrode 103, the first insulating film 110, and the auxiliary electrode 201 remain as a pattern.

[0128] According to the above-described embodiments of the inventive concept, since the intermediate layer including the emission layer is formed through a lift-off process rather than deposition using a fine metal mask, misalignment of the fine metal mask may be prevented and manufacturing costs may be reduced.

[0129] Furthermore, according to the above-described embodiments of the inventive concept, since the auxiliary electrode is formed in the same process as the pixel electrode, it is possible to prevent the pixel electrode from being damaged by forming the auxiliary electrode without performing an additional photomask process.

[0130] In the following, reference will be made to Figures 8 to 12E An organic light emitting display device 1R according to a comparative example is described in which a pixel electrode and an auxiliary electrode are not formed of the same material in the same process as the above-described embodiment of the present inventive concept.

[0131] Figure 8 is a plan view of an organic light emitting display device 1R according to a comparative example, Figures 9 to 11is a cross-sectional view of an operation of forming a first pixel electrode 101, a second pixel electrode 102, and a third pixel electrode 103, an auxiliary electrode 2201, and a first insulating film 110 on a substrate 100 of an organic light-emitting display device 1R according to a comparative example, and 12A to 12E FIG. 1 is a cross-sectional view of a first unit process of an organic light-emitting display device 1R according to a comparative example.

[0132] Reference Figure 8 The organic light-emitting display device 1R according to the comparative example includes a first pixel electrode 101, a second pixel electrode 102, and a third pixel electrode 103 spaced apart from each other on a substrate 100, and an auxiliary electrode 2201 located between the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103.

[0133] In the comparative example, the auxiliary electrode 2201 does not include the same material as the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103, and is not located on the same layer as the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103. For example, the auxiliary electrode 2201 is disposed on the first insulating film 110.

[0134] A thin film transistor layer 109 including a first thin film transistor TR1, a second thin film transistor TR2, and a third thin film transistor TR3 is disposed between the substrate 100 and the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103. The first thin film transistor TR1, the second thin film transistor TR2, and the third thin film transistor TR3 may be driving thin film transistors connected to the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103, respectively.

[0135] The first insulating film 110 covers the ends of the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103. The first insulating film 110 covers the ends of the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 to prevent electric field concentration at each end, and may serve as a pixel defining layer that defines a light emitting area.

[0136] The first intermediate layer 301 , the second intermediate layer 302 , and the third intermediate layer 303 are disposed on the first pixel electrode 101 , the second pixel electrode 102 , and the third pixel electrode 103 , respectively.

[0137] The first opposing electrode 401, the second opposing electrode 402, and the third opposing electrode 403 are arranged on the first intermediate layer 301, the second intermediate layer 302, and the third intermediate layer 303, and respectively cover the first intermediate layer 301, the second intermediate layer 302, and the third intermediate layer 303. The first opposing electrode 401 covers the first intermediate layer 301 and extends to the auxiliary electrode 2201 to contact the auxiliary electrode 2201, the second opposing electrode 402 covers the second intermediate layer 302 and extends to the auxiliary electrode 2201 to contact the auxiliary electrode 2201, and the third opposing electrode 403 covers the third intermediate layer 303 and extends to the auxiliary electrode 2201 to contact the auxiliary electrode 2201.

[0138] The first passivation layer 501 , the second passivation layer 502 , and the third passivation layer 503 are disposed on the first opposing electrode 401 , the second opposing electrode 402 , and the third opposing electrode 403 , respectively.

[0139] The first passivation layer 501 completely covers the first opposing electrode 401 and extends to the auxiliary electrode 2201, so that an end of the first passivation layer 501 contacts the upper surface of the auxiliary electrode 2201. The second passivation layer 502 completely covers the second opposing electrode 402 and extends to the auxiliary electrode 2201, so that an end of the second passivation layer 502 contacts the upper surface of the auxiliary electrode 2201. The third passivation layer 503 completely covers the third opposing electrode 403 and extends to the auxiliary electrode 2201, so that an end of the third passivation layer 503 contacts the upper surface of the auxiliary electrode 2201. The sealing member 700 is arranged on the upper surfaces of the first passivation layer 501, the second passivation layer 502, and the third passivation layer 503.

[0140] The first passivation layer 501 , the second passivation layer 502 and the third passivation layer 503 completely cover the first intermediate layer 301 , the second intermediate layer 302 and the third intermediate layer 303 and the first opposing electrode 401 , the second opposing electrode 402 and the third opposing electrode 403 , respectively.

[0141] In the comparative example, after the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 are formed, the auxiliary electrode 2201 is formed without including the same material as the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103. For example, the auxiliary electrode 2201 is not formed in the same process as the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103. Therefore, a process using a photomask is added, and when the auxiliary electrode 2201 is patterned, the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 may be damaged by an etchant or the like.

[0142] Reference Figure 9The first pixel electrode 101, the second pixel electrode 102 and the third pixel electrode 103 are spaced apart from each other on the substrate 100, the first insulating film 110 is formed to cover the ends of the first pixel electrode 101, the second pixel electrode 102 and the third pixel electrode 103, and the first thin film transistor TR1, the second thin film transistor TR2 and the third thin film transistor TR3 are respectively connected to the first pixel electrode 101, the second pixel electrode 102 and the third pixel electrode 103.

[0143] Reference Figure 10 and Figure 11 A conductive material layer 2201_A is formed on the first pixel electrode 101, the second pixel electrode 102, the third pixel electrode 103 and the first insulating film 110, and a photoresist PR0 is formed on the conductive material layer 2201_A.

[0144] The photoresist PR0 on the first insulating film 110 positioned between the first pixel electrode 101 , the second pixel electrode 102 , and the third pixel electrode 103 is exposed through the photomask M0 including the light-transmitting portion M01 and the light-blocking portion M02 , and the auxiliary electrode 2201 is patterned.

[0145] Reference Figure 12A ,exist Figure 11 A first lift-off layer LOL1 and a first photoresist PR1 are sequentially formed on the structure.

[0146] The first photoresist PR1 at a position corresponding to the first pixel electrode 101 is exposed through the first photomask M1 including the light-transmitting portion M11 and the light-blocking portion M12 .

[0147] Reference Figure 12B , the first photoresist PR1 is developed. The developed first photoresist PR1 has a first opening C1 at a portion corresponding to the first pixel electrode 101.

[0148] Reference Figure 12C ,use Figure 12B The first lift-off layer LOL1 is etched using the patterned first photoresist PR1 as an etching mask.

[0149] When the first lift-off layer LOL1 is etched through the etching process, the first solvent including fluorine forms a first undercut profile UC1 below the first opening C1 of the first photoresist PR1.

[0150] Reference Figure 12D ,exist Figure 12C A first intermediate layer 301 including a first emission layer, a first opposite electrode 401 and a first passivation layer 501 are formed on the structure.

[0151] The first intermediate layer 301, the first opposite electrode 401, and the first passivation layer 501 are formed by vacuum deposition. Deposition materials discharged from a deposition source are sequentially deposited by controlling a deposition angle incident on the substrate 100.

[0152] The first intermediate layer 301 is stacked on and in contact with the upper surface of the first pixel electrode 101 and the upper surface of the first insulating film 110. The first opposing electrode 401 covers the first intermediate layer 301 and is connected to a portion of the auxiliary electrode 2201 on the first insulating film 110. The first opposing electrode 401 is also in contact with the upper surface of the first insulating film 110. The first passivation layer 501 is stacked on and in contact with the upper surfaces of the first opposing electrode 401 and the auxiliary electrode 2201. The first intermediate layer 301, the first opposing electrode 401, and the first passivation layer 501 are also stacked on the first photoresist PR1.

[0153] Since the first passivation layer 501 completely covers the first intermediate layer 301 , the first intermediate layer 301 including the first emission layer may be prevented from being damaged by the first solvent used in the lift-off process.

[0154] Reference Figure 12E ,exist Figure 12D A lift-off process is performed on the structure.

[0155] When the first peeling layer LOL1 includes a fluorine-containing polymer, the first peeling layer LOL1 may be removed using a second solvent including fluorine.

[0156] As a result of the lift-off process, the first pixel electrode 101 formed in the first unit process, the first intermediate layer 301 located on the first insulating film 110, the first relative electrode 401 located on the first intermediate layer 301 and having an end in contact with the auxiliary electrode 2201, and the first passivation layer 501 covering the first relative electrode 401 remain as a pattern.

[0157] According to the above comparative example, since the auxiliary electrode 2201 is deposited on the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 and patterned by a photolithography process using the photomask M0, the first pixel electrode 101, the second pixel electrode 102, and the third pixel electrode 103 may be damaged during the patterning process. In addition, the photolithography process is an additional step, and thus leads to an increase in process time and manufacturing costs.

[0158] In the following, reference will be made to Figures 13 to 16E An organic light-emitting display device 2 and a method of manufacturing the organic light-emitting display device 2 according to a second exemplary embodiment of the present inventive concepts are described.

[0159] Figure 13is a cross-sectional view of an organic light-emitting display device 2 according to a second embodiment, Figure 14 and Figure 15 is a cross-sectional view of an operation of forming the first and second pixel electrodes 101 and 102, the auxiliary electrode 201, the first and second insulating films 110 and 210 on the substrate 100 of the organic light-emitting display device 2 according to the second embodiment, and 16A to 16E FIG. 4 is a cross-sectional view of a first unit process of the organic light-emitting display device 2 according to the second embodiment.

[0160] Reference Figure 13 The organic light-emitting display device 2 according to the second embodiment includes a first pixel electrode 101 and a second pixel electrode 102 spaced apart from each other on a substrate 100, and an auxiliary electrode 201 between the first pixel electrode 101 and the second pixel electrode 102, wherein a first insulating film 110 covers the ends of the first pixel electrode 101 and the second pixel electrode 102, and the end of the auxiliary electrode 201. For example, the first insulating film 110 may be in contact with the end of the auxiliary electrode 201, the end of the second pixel electrode 102, and a portion of the second insulating film 210 located between the auxiliary electrode 201 and the second pixel electrode 102. The first insulating film 110 covers the ends of the first pixel electrode 101 and the second pixel electrode 102 to prevent electric field concentration at each end, and may serve as a pixel-defining layer that defines a light-emitting area.

[0161] In this embodiment, unlike the above-described first embodiment, a second insulating film 210 is disposed between the substrate 100 and the auxiliary electrode 201 .

[0162] The first intermediate layer 301 and the second intermediate layer 302 are disposed on the first pixel electrode 101 and the second pixel electrode 102 and may include a first emission layer and a second emission layer, respectively.

[0163] The first opposing electrode 401 and the second opposing electrode 402 are arranged on the first intermediate layer 301 and the second intermediate layer 302 to cover the first intermediate layer 301 and the second intermediate layer 302, respectively. The first intermediate layer 301 and the second intermediate layer 302 may not be in contact with the auxiliary electrode 201. The first opposing electrode 401 covers the first intermediate layer 301 and extends to the auxiliary electrode 201 to contact the auxiliary electrode 201, and the second opposing electrode 402 covers the second intermediate layer 302 and extends to the auxiliary electrode 201 to contact the auxiliary electrode 201. The auxiliary electrode 201 is electrically connected to a common power supply voltage, and the common power supply voltage is applied to each of the first opposing electrode 401 and the second opposing electrode 402 that are in contact with the auxiliary electrode 201. When a driving current is transmitted from the driving thin film transistor to the first pixel electrode 101 and the second pixel electrode 102, and the common power supply voltage is applied to the first opposing electrode 401 and the second opposing electrode 402 through the auxiliary electrode 201, the first emission layer and the second emission layer emit light.

[0164] The first passivation layer 501 and the second passivation layer 502 are disposed on the first opposing electrode 401 and the second opposing electrode 402 .

[0165] The first passivation layer 501 completely covers the first opposing electrode 401 and extends to the auxiliary electrode 201, so that an end of the first passivation layer 501 contacts the upper surface of the auxiliary electrode 201. The second passivation layer 502 completely covers the second opposing electrode 402 and extends to the auxiliary electrode 201, so that an end of the second passivation layer 502 contacts the upper surface of the auxiliary electrode 201.

[0166] The first and second passivation layers 501 and 502 completely cover the first and second intermediate layers 301 and 302 and the first and second opposite electrodes 401 and 402, respectively. As a result, the organic light-emitting device can be prevented from being damaged during the patterning operation.

[0167] In this embodiment, the first pixel electrode 101 and the second pixel electrode 102 may be spaced apart from each other in an island shape, and the first intermediate layer 301 and the second intermediate layer 302 may also be arranged in an island shape on the first pixel electrode 101 and the second pixel electrode 102. The first passivation layer 501 and the second passivation layer 502 covering the first opposing electrode 401 and the second opposing electrode 402 may also be arranged in an island shape.

[0168] A sealing member 700 covering the entire upper surface of the first and second passivation layers 501 and 502 and the auxiliary electrode 201 is disposed on the substrate 100 .

[0169] The sealing member 700 may include at least one organic layer and at least one inorganic layer. Figure 13A structure in which a first inorganic layer 701 , an organic layer 702 , and a second inorganic layer 703 are sequentially stacked is shown.

[0170] Reference Figure 14 The first pixel electrode 101 and the second pixel electrode 102 are located on the substrate 100, and the second insulating film 210 is located between the first pixel electrode 101 and the second pixel electrode 102. Since the end 101a of the first pixel electrode 101 extends to the upper surface of the end 210a of the second insulating film 210 without being covered by the second insulating film 210, the emission area EA is increased.

[0171] The auxiliary electrode 201 patterned with a conductive material is located on the second insulating film 210. The auxiliary electrode 201 can be formed in a process using the same mask as the first pixel electrode 101 and the second pixel electrode 102. However, the present invention is not limited thereto. The auxiliary electrode 201 may include a material different from that of the first pixel electrode 101 and the second pixel electrode 102 and may be formed using a mask process different from that of the first pixel electrode 101 and the second pixel electrode 102.

[0172] Reference Figure 15 , a first insulating film 110 is formed in the space between the first pixel electrode 101 and the auxiliary electrode 201 and in the space between the second pixel electrode 102 and the auxiliary electrode 201. The first insulating film 110 covers the end portions of the first pixel electrode 101 and the second pixel electrode 102 and the end portion of the auxiliary electrode 201. The first insulating film 110 covers the end portions of the first pixel electrode 101 and the second pixel electrode 102 to prevent electric field concentration at each end portion and may function as a pixel defining layer that defines a light emitting area.

[0173] The first insulating film 110 and the second insulating film 210 may include an organic insulating material or an inorganic insulating material.

[0174] Reference Figure 16A ,exist Figure 15 A first lift-off layer LOL1 and a first photoresist PR1 are sequentially formed on the structure.

[0175] The first peeling layer LOL1 may include a non-photosensitive organic material. The first peeling layer LOL1 may include a fluoropolymer. The fluoropolymer included in the first peeling layer LOL1 may be formed of a polymer including a fluorine content of about 20 to about 60wt%. For example, the fluoropolymer included in the first peeling layer LOL1 may include polytetrafluoroethylene, polychlorotrifluoroethylene, polydichlorodifluoroethylene, a copolymer of chlorotrifluoroethylene and dichlorodifluoroethylene, a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether, a copolymer of chlorotrifluoroethylene and perfluoroalkyl vinyl ether, a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether, a copolymer of perfluoroalkyl vinyl ether and perfluoroalkyl vinyl ether, a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether, or a copolymer of chlorotrifluoroethylene and perfluoroalkyl vinyl ether. The first peeling layer LOL1 may be formed by a coating method, a printing method, a vapor deposition method, etc.

[0176] A first photoresist PR1 is formed on the first lift-off layer LOL1. The first photoresist PR1 at a position corresponding to the first pixel electrode 101 is exposed through a first photomask M1 including a light-transmitting portion M11 and a light-blocking portion M12.

[0177] Reference Figure 16B , the first photoresist PR1 is developed. The developed first photoresist PR1 has a first opening C1 at a portion corresponding to the first pixel electrode 101.

[0178] Reference Figure 16C ,use Figure 16B The first lift-off layer LOL1 is etched using the patterned first photoresist PR1 as an etching mask.

[0179] When the first lift-off layer LOL1 includes a fluoropolymer, the etchant uses a first solvent capable of etching the fluoropolymer. The first solvent may include a hydrofluoroether. Hydrofluoroether is an electrochemically stable material with low interaction with other materials and is environmentally stable due to its low global warming potential and low toxicity.

[0180] When the first lift-off layer LOL1 is etched through the etching process, the first solvent including fluorine forms a first undercut profile UC1 below the first opening C1 of the first photoresist PR1.

[0181] Reference Figure 16D ,exist Figure 16C A first intermediate layer 301 including a first emission layer, a first opposite electrode 401, and a first passivation layer 501 are formed on the structure. The first intermediate layer 301 may be formed to further include a hole injection layer, a hole transport layer, an electron transport layer, or an electron injection layer.

[0182] The first intermediate layer 301, the first opposite electrode 401, and the first passivation layer 501 are formed by vacuum deposition. Deposition materials discharged from a deposition source are sequentially deposited by controlling a deposition angle incident on the substrate 100.

[0183] The first intermediate layer 301 is stacked on the upper surface of the first pixel electrode 101 and the upper surface of the first insulating film 110. The first opposing electrode 401 is stacked on and in contact with the upper surface of the first intermediate layer 301, the first insulating film 110, and the auxiliary electrode 201. The first passivation layer 501 is stacked on and in contact with the upper surface of the first opposing electrode 401 and the auxiliary electrode 201. The first passivation layer 501 may not be in contact with the first insulating film 110. The first intermediate layer 301, the first opposing electrode 401, and the first passivation layer 501 are also stacked on the first photoresist PR1.

[0184] The first peeling layer LOL1 may include a non-photosensitive organic material. The first peeling layer LOL1 may include a fluorine-containing polymer. The fluorine-containing polymer included in the first peeling layer LOL1 may be formed of a polymer including a fluorine content of about 20 to about 60 wt %.

[0185] Since the first passivation layer 501 completely covers the first intermediate layer 301 , the first intermediate layer 301 including the first emission layer may be prevented from being damaged by the first solvent used in a subsequent lift-off process of the second unit process.

[0186] Reference Figure 16E ,exist Figure 16D A lift-off process is performed on the structure.

[0187] As a result of the lift-off process, the first intermediate layer 301 , the first opposite electrode 401 , and the first passivation layer 501 disposed on the first pixel electrode 101 , the first insulating film 110 , and the auxiliary electrode 201 remain as a pattern.

[0188] Compared to the first embodiment described above, the area of ​​the light-emitting region increases by ΔS because the end of the first pixel electrode 101 extends to the upper surface of the end of the second insulating film 210 and is not covered by the second insulating film 210. In other words, the end of the first pixel electrode 101 and the end of the second insulating film 210 can overlap with each other to increase the area of ​​the light-emitting region. Similarly, the end of the second pixel electrode 102 and the end of the second insulating film 210 can overlap with each other to increase the area of ​​the light-emitting region.

[0189] In this embodiment, as in the first embodiment described above, an intermediate layer, an opposing electrode, and a passivation layer are formed in the second pixel electrode 102 and the third pixel electrode 103 by performing the second unit process and the third unit process. Thus, a full-color organic light-emitting display device can be manufactured. Since this embodiment is similar to the first embodiment described above, a repeated description thereof will not be given here.

[0190] In the organic light-emitting display device 2 and the method for manufacturing the organic light-emitting display device 2 according to the second embodiment, since the auxiliary electrode is formed in the same process as the pixel electrode, it is possible to prevent damage to the pixel electrode by forming the auxiliary electrode without performing an additional photomask process. In addition, the area of ​​the light-emitting region is increased.

[0191] According to exemplary embodiments of the inventive concept, since the intermediate layer including the emission layer is formed through a lift-off process rather than deposition using a fine metal mask, misalignment of the fine metal mask may be prevented and manufacturing costs may be reduced.

[0192] Furthermore, according to exemplary embodiments of the inventive concept, since the auxiliary electrode is formed in the same process as the pixel electrode, it is possible to prevent the pixel electrode from being damaged by forming the auxiliary electrode without performing an additional photomask process.

[0193] Furthermore, according to the exemplary embodiments of the present inventive concept, there is an effect of increasing the area of ​​the light emitting region by inserting an additional insulating film between the substrate and the auxiliary electrode.

[0194] However, the present inventive concept is not limited to these effects.

[0195] Although the present inventive concept has been described with reference to exemplary embodiments thereof, workers skilled in the art will recognize that various changes in form and details may be made therein without departing from the scope and spirit of the present inventive concept as defined in the following claims.

Claims

1. An organic light-emitting display device, comprising: substrate; a first pixel electrode and a second pixel electrode, wherein the first pixel electrode and the second pixel electrode are located on the substrate; an auxiliary electrode, the auxiliary electrode surrounding the first pixel electrode and the second pixel electrode, wherein the auxiliary electrode is spaced apart from the first pixel electrode and the second pixel electrode; a first insulating film, the first insulating film being located between the first pixel electrode and the auxiliary electrode and covering an end portion of the first pixel electrode and a first end portion of the auxiliary electrode; a second insulating film, the second insulating film being located between the second pixel electrode and the auxiliary electrode and covering an end portion of the second pixel electrode and a second end portion of the auxiliary electrode; a third insulating film, the third insulating film being located on the substrate and between the first pixel electrode and the second pixel electrode; a first intermediate layer, the first intermediate layer including a first emission layer and arranged on the first pixel electrode; a second intermediate layer including a second emission layer and disposed on the second pixel electrode; a first opposing electrode covering the first intermediate layer and contacting the auxiliary electrode; a second opposing electrode covering the second intermediate layer and contacting the auxiliary electrode; a first passivation layer, the first passivation layer covering the first counter electrode; and a second passivation layer, the second passivation layer covering the second opposing electrode, wherein the first insulating film contacts a portion of the third insulating film located between the first pixel electrode and the auxiliary electrode, and The second insulating film is in contact with a portion of the third insulating film located between the second pixel electrode and the auxiliary electrode.

2. The organic light emitting display device according to claim 1, wherein: The first pixel electrode and the second pixel electrode include the same material as the auxiliary electrode.

3. The organic light emitting display device according to claim 1, wherein: The first insulating film and the second insulating film surround the first pixel electrode and the second pixel electrode, respectively.

4. The organic light emitting display device according to claim 1, wherein: The first intermediate layer and the second intermediate layer further include a hole injection layer, a hole transport layer, an electron transport layer or an electron injection layer, respectively.

5. The organic light emitting display device according to claim 1, wherein: Each of the first passivation layer and the second passivation layer has an island shape.

6. The organic light emitting display device according to claim 1, wherein: Each of the first passivation layer and the second passivation layer includes oxide, oxynitride, or nitride.

7. The organic light emitting display device according to claim 1, wherein: The end portion of the first pixel electrode and the end portion of the second pixel electrode are located on the third insulating film.

8. The organic light emitting display device according to claim 1 , further comprising: A sealing member is disposed on the first passivation layer and the second passivation layer and includes an organic layer and an inorganic layer.

9. A method for manufacturing an organic light-emitting display device, the method comprising: forming a second insulating film on the substrate; forming a first pixel electrode and a second pixel electrode on the substrate, wherein the second insulating film is located between the first pixel electrode and the second pixel electrode; forming an auxiliary electrode on the second insulating film, wherein the auxiliary electrode surrounds the first pixel electrode and the second pixel electrode; forming a first insulating film between the first pixel electrode, the second pixel electrode and the auxiliary electrode to cover an end portion of each of the first pixel electrode and the second pixel electrode and an end portion of the auxiliary electrode and to be in contact with a portion of the second insulating film located between the first pixel electrode, the second pixel electrode and the auxiliary electrode; sequentially forming a lift-off layer and a photoresist on the first pixel electrode, the second pixel electrode, the auxiliary electrode, the first insulating film, and the second insulating film; forming an opening exposing an upper surface of the first pixel electrode by patterning the lift-off layer and the photoresist; sequentially forming an intermediate layer including an emission layer, an opposite electrode, and a passivation layer in the opening and on the photoresist, wherein the opposite electrode in the opening contacts the auxiliary electrode while covering the intermediate layer; and The lift-off layer and the photoresist are removed.

10. The method of claim 9, wherein: The opposite electrode and the passivation layer are formed by a vapor deposition method.

11. The method of claim 9, wherein: The auxiliary electrode and the first insulating film are located on the second insulating film.

12. The method of claim 9, wherein: The first pixel electrode, the second pixel electrode, and the auxiliary electrode are formed using the same material and the same mask process.

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