Drive mechanism, camera module and electronic equipment

Abstract

The present disclosure relates to a driving mechanism, a camera module and an electronic device, wherein the driving mechanism includes: a driving component, a movable assembly and a fixed assembly. The electromagnetic force generated by the closed circuit cutting the magnetic field overcomes the elastic force of the elastic conductor to drive the movable assembly connected to the elastic conductor. The structural setting of the electromagnetic drive is easy to implement and improves the overall lightness and thinness of the driving mechanism. In addition, the photosensitive chip of the camera module is assembled on the movable assembly, and the lens assembly is assembled on the fixed assembly, so that the camera module can achieve automatic focusing by moving the photosensitive chip with smaller volume and mass, while the lens assembly with larger volume and mass is fixed, which reduces the power and volume of the driving mechanism and improves the shooting effect and overall lightness and thinness of the camera module and the electronic device.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic technology, and in particular to a driving mechanism, a camera module, and an electronic device. Background Art

[0002] In related technology, cameras in electronic devices, such as mobile phones, are generally divided into fixed-focus cameras and autofocus cameras. Fixed-focus cameras have a fixed distance between the lens and the photosensitive chip, enabling only fixed-focus shots, which can't meet user expectations. Autofocus cameras typically use a motor to move the lens relative to the fixed photosensitive chip.

[0003] However, as camera performance improves, the thickness, volume, and mass of the lens also increase. To meet the driving force requirements, the corresponding drive motors are also getting larger, which increases the overall thickness, volume, and mass of the camera and electronic equipment.

[0004] Therefore, how to improve the thinness of the camera while ensuring the camera's autofocus function and shooting quality has become a hot research issue in the current field. Summary of the Invention

[0005] The present disclosure provides a driving mechanism, a camera module, and an electronic device to improve the lightness and thinness of the driving mechanism, the camera module, and the electronic device, while improving the shooting effect of the camera module and the electronic device.

[0006] According to a first aspect of the present disclosure, a driving mechanism is provided, comprising: a driving assembly, a fixed assembly, and a movable assembly; the driving assembly comprises an elastic conductor, a closed circuit, and a magnetic member;

[0007] The closed circuit is located in the magnetic field generated by the magnetic member, and the closed circuit is connected to the elastic conductor to generate an electromagnetic force that overcomes the elastic force of the elastic conductor;

[0008] The elastic conductor is fixedly connected to the fixed assembly and abuts against the movable assembly; the electromagnetic force overcomes the elastic force so that the elastic conductor drives the movable assembly to move relative to the fixed assembly during the focusing function.

[0009] Optionally, there are two magnetic members, which are assembled at opposite ends of the fixed assembly.

[0010] Optionally, there are two elastic conductors, which are fitted at opposite ends of the movable assembly.

[0011] Optionally, the fixed assembly includes a shell and a cover; the shell and the cover are sealed together to form an assembly space, and the drive component and the movable assembly are arranged in the assembly space.

[0012] Optionally, the movable assembly cooperates with at least a portion of the housing to form a receiving portion, and the drive assembly is assembled in the receiving portion.

[0013] According to a second aspect of the present disclosure, a camera module is provided, comprising:

[0014] The aforementioned driving mechanism;

[0015] A photosensitive chip, assembled on the movable assembly;

[0016] The lens assembly is assembled on the fixed assembly.

[0017] Optionally, the photosensitive chip includes a photosensitive body and a circuit board connected to the photosensitive body; the photosensitive body corresponds to the position of the lens assembly, and the closed circuit is electrically connected to the circuit board.

[0018] Optionally, the circuit board is made of flexible material.

[0019] Optionally, the fixed assembly includes a shell and a cover, the cover includes a main body portion that cooperates with the shell and a hollow portion corresponding to the photosensitive body of the photosensitive chip; the lens assembly of the camera module is assembled on the outside of the cover and sealed with the hollow portion.

[0020] According to a third aspect of the present disclosure, an electronic device is provided, comprising:

[0021] Equipment body;

[0022] The aforementioned driving mechanism is assembled to the device body;

[0023] Or, the above-mentioned camera module is assembled on the device body.

[0024] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0025] The present invention provides a driving mechanism with a drive assembly that includes an elastic conductor, a closed circuit, and a magnetic component, so that the electromagnetic force generated by the closed circuit cutting the magnetic field overcomes the elastic force of the elastic conductor to drive a movable assembly connected to the elastic conductor. The above-mentioned electromagnetic drive structural arrangement facilitates implementation and improves the overall lightness and thinness of the driving mechanism. In addition, the photosensitive chip of the camera module is assembled on the movable assembly, and the lens assembly is assembled on the fixed assembly, so that the camera module can achieve automatic focusing by moving the photosensitive chip with a smaller volume and mass, while the lens assembly with a larger volume and mass is fixed. This reduces the power and volume of the driving mechanism, and improves the shooting effect and overall lightness and thinness of the camera module and electronic device.

[0026] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0028] Figure 1 is a schematic diagram of the three-dimensional structure of a camera module in an exemplary embodiment of the present disclosure;

[0029] Figure 2 is a schematic cross-sectional structural diagram of a camera module in an exemplary embodiment of the present disclosure;

[0030] Figure 3 is a schematic cross-sectional structural diagram of a driving mechanism according to an exemplary embodiment of the present disclosure;

[0031] Figure 4 is a schematic diagram of the three-dimensional structure of a driving mechanism according to an exemplary embodiment of the present disclosure;

[0032] Figure 5 is a schematic cross-sectional structural diagram of a camera module according to another exemplary embodiment of the present disclosure;

[0033] Figure 6 is a schematic diagram of the exploded structure of a driving mechanism according to an exemplary embodiment of the present disclosure;

[0034] Figure 7 The figure is a schematic diagram of the exploded structure of a camera module according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0035] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0036] In related technologies, cameras in electronic devices such as mobile phones are generally divided into fixed-focus cameras and autofocus cameras. Fixed-focus cameras have a fixed distance between the lens and the photosensitive chip, which only allows for fixed-focus shooting, and the shooting effect is difficult to meet user needs. Autofocus cameras, on the other hand, generally use a drive motor to move the lens relative to the fixed photosensitive chip. As camera performance improves, the thickness, volume, and mass of the lens also increase. To meet the driving force requirements, the corresponding drive motor is also getting larger.

[0037] It can be concluded that the above-mentioned fixed-focus cameras are difficult to meet the user's shooting needs, and the increase in the size and mass of the lens and motor of the autofocus camera leads to the overall thickness, volume and mass of the camera and electronic equipment.

[0038] Figure 1 is a schematic diagram of a three-dimensional structure of a camera module in an exemplary embodiment of the present disclosure. Figure 2 FIG. 1 is a schematic cross-sectional view of a camera module in an exemplary embodiment of the present disclosure. Figure 1 、 Figure 2 As shown, the camera module 1 includes a drive mechanism 13, a photosensitive chip 12, and a lens assembly 11. The drive mechanism 13 includes a drive assembly 131, a fixed assembly 133, and a movable assembly 132. The photosensitive chip 12 is assembled on the movable assembly 132, and the lens assembly 11 is assembled on the fixed assembly 133. The drive assembly 131 cooperates with the movable assembly 132 to drive the movable assembly 132 to move relative to the fixed assembly 133 during the focus function.

[0039] Among them, such as Figure 3 、 Figure 4As shown, the drive assembly 131 includes an elastic conductor 1311, a closed circuit 1312, and a magnetic member 1313. The elastic conductor 1311 is fixedly connected to the fixed assembly 133 and abuts against the movable assembly 132. The magnetic member 1313 is capable of generating a magnetic field perpendicular to the optical axis of the lens assembly 11. The closed circuit 1312 is located in the magnetic field generated by the magnetic member 1313 and is connected to the elastic conductor 1311. When the closed circuit 1312 is energized, it cuts through the magnetic field to generate an electromagnetic force. This electromagnetic force overcomes the elastic force of the elastic conductor 1311, causing the movable assembly 132, which abuts against the elastic conductor 1311, to move up and down along the optical axis. At this point, the photosensitive chip 12 assembled on the movable assembly 132 can move up and down along the optical axis of the lens assembly 11 along with the movable assembly 132, and cooperates with the stationary lens assembly 11 to achieve an autofocus function.

[0040] The electromagnetic force generated by the closed circuit 1312 cutting through the magnetic field overcomes the elastic force of the elastic conductor 1311, thereby driving the movable assembly 132 connected to the elastic conductor 1311. This electromagnetic drive structure facilitates control and improves the displacement accuracy of the photosensitive chip 12 assembled in the movable assembly 132, thereby improving focusing accuracy and shooting quality, and the overall lightness and thinness of the drive mechanism 13.

[0041] The photosensitive chip 12 of the camera module 1 is assembled on the movable assembly 132, and the lens assembly 11 is assembled on the fixed assembly 133, so that the camera module 1 can achieve automatic focusing by moving the photosensitive chip 12 with smaller volume and mass, while the lens assembly 11 with larger volume and mass is fixed, reducing the power and volume of the driving mechanism 13, and improving the shooting effect and overall lightness of the camera module 1 and the electronic device.

[0042] It should be noted that the direction of the electromagnetic force can be changed to obtain electromagnetic forces in different directions by controlling the direction of the current in the closed circuit 1312. When the direction of the electromagnetic force changes, it can overcome the elastic forces in the upper and lower directions, thereby achieving the up and down movement of the movable assembly 132.

[0043] In the above embodiment, there can be two magnetic parts 1313 and two closed circuits 1312 respectively. The two magnetic parts 1313 are assembled at opposite ends of the fixed assembly 133 to generate a magnetic field perpendicular to the optical axis direction of the lens assembly 11, and the two closed circuits 1312 are both arranged in the above magnetic field. The magnetic parts 1313 arranged at both ends of the fixed assembly 133 avoid occupying the installation space in the central area of the fixed assembly 133, thereby improving space utilization. Alternatively, there can be multiple groups of magnetic parts 1313 and closed circuits 1312. Multiple groups of magnetic parts 1313 are arranged at any position on the fixed assembly 133, so as to be able to cooperate with the closed circuit 1312 to achieve magnetic field cutting. The present disclosure does not limit the number and position of the magnetic parts 1313 and the closed circuit 1312.

[0044] It should be noted that the magnetic member 1313 may be a magnet or other object capable of generating a magnetic field, and the present disclosure does not limit this. The closed circuit 1312 may be a coil electrically connected to the photosensitive chip 12 to obtain current. Alternatively, a separate power supply may be provided for the closed circuit 1312, and the present disclosure does not limit this. For example, Figure 5 As shown, the photosensitive chip 12 includes a photosensitive body 121 and a circuit board 122 connected to the photosensitive body 121. The coil is electrically connected to the circuit board 122 to obtain current. The photosensitive body 121 corresponds to the position of the lens assembly 11 to facilitate sensing incident light. The circuit board 122 is made of a flexible material. The material selection and bending process can be used to eliminate stress on the circuit board 122, preventing the movement of the photosensitive chip 12 from affecting the function of the flexible board.

[0045] Furthermore, two elastic conductors 1311 may be provided, with the two elastic conductors 1311 being positioned at opposite ends of the movable assembly 132 to enhance stability during the abutment between the elastic conductors 1311 and the movable assembly 132, thereby preventing shaking and damage to the movable assembly 132 when the electromagnetic force overcomes the elastic force. Alternatively, multiple elastic conductors 1311 may be provided for the drive assembly 131 to further enhance stability of the movable assembly 132 during movement, although this disclosure is not intended to limit this aspect.

[0046] It should be noted that the elastic conductor 1311 can be a spring made of metal, which has a simple structure and good structural strength. Alternatively, the elastic conductor 1311 can also be made of other elastic conductor materials, which is not limited in this disclosure.

[0047] Since the camera module 1 used in electronic devices usually contains precision components, dust or debris will greatly affect the functions of the camera module 1 and the electronic device. Therefore, the sealing of the camera module 1 is extremely important to itself and the electronic device. The following examples illustrate the overall structural configuration of the camera module 1:

[0048] The fixed assembly 133 includes a shell and a cover 1333. The shell and the cover 1333 are sealed together to form an assembly space, and the drive assembly 131 and the movable assembly 132 are arranged in the assembly space. Specifically, the movable assembly 132 is arranged in the shell and cooperates with the shell to form a housing 134, and the drive assembly 131 is assembled in the housing 134. Directly using the shell as the fixed part of the drive mechanism 13 and arranging the movable assembly 132 in the shell improves the aesthetics of the drive mechanism 13 and reduces the overall thickness of the drive mechanism 13. Assembling the drive assembly 131 in the housing 134 surrounded by the shell and the movable assembly 132 realizes the encapsulation of the drive assembly 131, avoiding interference of dust and other debris on the operation of the drive assembly 131. In particular, when magnetic drive is adopted, it can avoid interference of dust and other debris on the magnetic field and electromagnetic induction effect, thereby improving the control accuracy of the electromagnetic force and the focusing accuracy.

[0049] In the above embodiment, if Figure 6 As shown, the housing includes an upper shell 1331 and a base 1332, which facilitate the assembly of the drive mechanism 13 itself and the cooperation between the drive mechanism 13 and the photosensitive chip 12. Specifically, the magnetic member 1313 can be assembled at the corresponding position in the upper shell 1331, and the closed circuit 1312 can be assembled on the movable assembly 132; then, welding or other methods are used to fix the elastic conductor 1311 to the metal member on the base 1332, and the elastic conductor 1311 is abutted against the movable assembly 132; finally, the upper shell 1331 and the base 1332 are assembled to complete the installation of the drive mechanism 13.

[0050] Further, such as Figure 7 As shown, the cover 1333 includes a main body 1333a and a hollow portion 1333b. The main body 1333a seals with the housing, while the hollow portion 1333b seals with the photosensitive body 121 of the photosensitive chip 12. The provision of the cover 1333 enhances the overall packaging of the drive mechanism 13. The movable assembly 132 may also be provided with a sunken recess 1321 for supporting the photosensitive body 121. When the photosensitive body 121 is assembled within the recess 1321, the thickness of the drive mechanism 13 matches the thickness of the photosensitive chip 12, reducing the overall thickness of the drive mechanism 13.

[0051] In the above embodiment, the lens assembly 11 can be assembled outside the cover 1333 and sealed with the cover 1333. The lens assembly 11 can be assembled outside the cover 1333 using an adhesive such as glue, thereby improving the sealing effect of the drive mechanism 13. When the lens assembly 11 is assembled outside the cover 1333, only the lens assembly 11 protrudes from the housing of the drive mechanism 13, which not only improves the overall aesthetics of the camera module 1 but also reduces the overall thickness of the camera module 1.

[0052] The present disclosure further proposes an electronic device, which includes a device body and the camera module 1 , wherein the camera module 1 is assembled to the device body.

[0053] The camera module 1 of the electronic device is provided with a drive mechanism 13, with the photosensitive chip 12 of the camera module 1 assembled on a movable assembly 132, and the lens assembly 11 assembled on a fixed assembly 133. The drive assembly 131 of the drive mechanism 13 cooperates with the movable assembly 132, allowing the movable assembly 132 to move relative to the fixed assembly 133 under the drive of the drive mechanism 13. This structural arrangement enables the camera module 1 to achieve autofocus by moving the smaller and more massive photosensitive chip 12, while the larger and more massive lens assembly 11 remains stationary. This reduces the power and size of the drive mechanism 13, improving the camera module 1's and the overall lightness and thinness of the electronic device.

[0054] It should be noted that the electronic device may be a mobile phone, a computer, etc., and the present disclosure does not limit this.

[0055] Those skilled in the art will readily recognize other embodiments of the present disclosure after considering the specification and practicing the technical solutions disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0056] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A camera module, characterized in that: include: A drive mechanism comprising: a drive component, a fixed assembly, and a movable assembly; the drive component comprising an elastic conductor, a closed circuit, and a magnetic component; the closed circuit being located in a magnetic field generated by the magnetic component and communicating with the elastic conductor to generate an electromagnetic force that overcomes the elastic force of the elastic conductor; the elastic conductor being fixedly connected to the fixed assembly and abutting against the movable assembly; the electromagnetic force overcoming the elastic force, so that the elastic conductor drives the movable assembly to move relative to the fixed assembly during a focusing function; a photosensitive chip assembled on the movable assembly; and A lens assembly, assembled on the fixed assembly; The fixed assembly includes a shell, the movable assembly cooperates with at least a portion of the shell to form a receiving portion, and the movable assembly covers the driving component to enclose the driving component in the receiving portion.

2. The camera module according to claim 1, wherein: There are two magnetic components, which are assembled at two opposite ends of the fixed assembly component.

3. The camera module according to claim 1, wherein: There are two elastic conductors, which are matched with two opposite ends of the movable assembly.

4. The camera module according to claim 1, wherein: The photosensitive chip includes a photosensitive body and a circuit board connected to the photosensitive body; the photosensitive body corresponds to the position of the lens assembly, and the closed circuit is electrically connected to the circuit board.

5. The camera module according to claim 4, wherein: The material of the circuit board is flexible material.

6. The camera module according to claim 1, wherein: The fixed assembly also includes a cover; the shell and the cover are sealed and cooperated to form an assembly space, and the driving component and the movable assembly are arranged in the assembly space.

7. The camera module according to claim 6, wherein: The cover body includes a main body portion that cooperates with the shell and a hollow portion corresponding to the photosensitive body of the photosensitive chip; the lens assembly of the camera module is assembled outside the cover body and sealed with the hollow portion.

8. An electronic device, characterized in that: include: Equipment body; The camera module according to any one of claims 1 to 7, wherein the camera module is assembled to the device body.

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