A kind of hollow silicone earphone cover and its production method

Abstract

The present invention belongs to the technical field of earphone covers, and in particular, relates to a silicone hollow earphone cover, including a silicone cover body and a base. The silicone cover body is an annular hollow structure, and an earmuff hole penetrating its axial direction is formed in the middle thereof, and a step portion is provided at the upper end of the earmuff hole, and the height of the step portion increases step by step from the inside to the outside. The base is a metal base or a plastic base, which is fixed to the bottom of the silicone cover body. The silicone hollow earphone cover includes a silicone cover body, which has good thermal conductivity, will not feel stuffy when used, and is more comfortable; the silicone cover body will not have delamination or scaling, and has a longer service life; a step portion is provided at the upper end of the earmuff hole, and the height of the step portion increases step by step from the inside to the outside; the step portion fits the ear better, and improves the sound insulation effect. The present invention also discloses a production method of the silicone hollow earphone cover.

Description

Technical Field

[0001] This invention belongs to the field of headphone cover technology, and particularly relates to a hollow silicone headphone cover and its manufacturing method. Background Technology

[0002] The earcups are mounted on the speaker modules of the headphones. When in use, the earcups fit snugly against the ears, providing sound insulation, ear support, and cushioning.

[0003] Application number CN201721847670.2 discloses a noise-isolating earcup for helmet-mounted headphones. This earcup, connected to the headphone body, includes a noise-isolating main body and contact layers and flanged connecting parts respectively disposed on both sides of the noise-isolating main body. The noise-isolating main body is annularly shaped and filled with an elastic porous material. The contact layer is annularly shaped, with one side connected to the noise-isolating main body and the other side in contact with the skin. The flanged connecting part is barrel-shaped with openings at both ends; one end of the flanged connecting part is connected to the noise-isolating main body, and the other end is fitted onto the headphone body. The contact layer is made of leather. The disadvantage of leather is its poor thermal conductivity.

[0004] The contact parts of the earphone covers in the existing technology are made of imitation leather and filled with foam materials such as sponge. The heat dissipation effect is poor and it feels stuffy when used. The imitation leather is prone to peeling and shedding, resulting in an unsatisfactory performance. Summary of the Invention

[0005] The purpose of this invention is to provide a silicone hollow headphone cover and its manufacturing method, aiming to solve the technical problem that the contact parts of the existing headphone covers are made of imitation leather material and the inside is filled with foam materials such as sponge, resulting in poor heat dissipation and stuffiness during use.

[0006] To achieve the above objectives, an embodiment of the present invention provides a hollow silicone earphone cover, comprising:

[0007] A silicone earcup, wherein the silicone earcup has a ring-shaped hollow structure, with an earcup hole extending through its axis in its central part; the upper end of the earcup hole has a stepped portion, the height of which gradually increases from the inside to the outside; and

[0008] The base, which is a metal base or a plastic base, is fixed to the bottom of the silicone cover.

[0009] Preferably, the silicone cover has a first mounting groove on the inner side of its bottom periphery; the base is a plate-shaped structure, and its periphery is embedded in the first mounting groove.

[0010] Preferably, the silicone cover has an integrally formed mounting ring on the inner side of its bottom periphery, and the upper end of the base is provided with a second mounting groove, in which the mounting ring is embedded.

[0011] Preferably, the base is a plate-shaped structure with heat dissipation fins on its upper surface.

[0012] This invention also provides a method for producing the above-mentioned silicone hollow earphone cover, comprising the following steps:

[0013] 1) Prepare the base, apply a primer to the base, and let it stand at room temperature for 10 to 40 minutes; place the base with the primer applied into the mold;

[0014] 2) Prepare silicone, add vulcanizing agent to silicone, and mix evenly; the amount of vulcanizing agent is 0.5-3% of the amount of silicone;

[0015] 3) Weigh the mixed silicone and put it into the mold for molding. The temperature inside the mold is 110-130℃ and the molding time is 4-6 minutes. Open the mold to obtain the silicone hollow headphone cover.

[0016] Preferably, the silicone comprises the following raw materials by mass percentage: 60-70% polysiloxane; 25-35% silica; and 1-10% hydroxyl silicone oil.

[0017] Preferably, the vulcanizing agent comprises the following raw materials by mass percentage: 59-74% polysiloxane; 25-40% polymethylchlorosilane; and 0.1-1% platinum catalyst.

[0018] Preferably, the primer comprises the following raw materials by mass percentage: 90-99% heptane and 1-10% tetrabutyl titanate.

[0019] Preferably, in step 2), thermally conductive powder is also added to the silicone, and the amount of thermally conductive powder is 20-30% of the amount of silicone.

[0020] Preferably, in step 2), a thermochromic agent is also added to the silicone, and the amount of the thermochromic agent is 1 to 2% of the amount of silicone.

[0021] The silicone hollow earphone cover and its production method provided in this invention have at least one of the following technical effects:

[0022] 1. The hollow silicone earphone cover includes a silicone cover body, which has good thermal conductivity, so it will not feel stuffy during use and will be more comfortable;

[0023] 2. The silicone cover will not delaminate or shed, resulting in a longer service life;

[0024] 3. The upper part of the ear cup hole is provided with a stepped section, the height of which gradually increases from the inside to the outside; the stepped section fits the ear more closely and improves the sound insulation effect;

[0025] 4. The production method of this silicone hollow earphone cover has the characteristics of simple steps, one-time molding, and high production efficiency;

[0026] 5. The vulcanizing agent has a low vulcanization temperature and a fast vulcanization speed; after vulcanization molding, the product molecules are fully cross-linked; the vulcanized product is odorless.

[0027] 6. In the production method of the silicone hollow earphone cover, step 2) enhances its thermal conductivity by adding thermally conductive powder to the silicone.

[0028] 7. In the production method of the silicone hollow earphone cover, step 2) involves adding a thermochromic agent to give it a thermochromic function. Attached Figure Description

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 This is a schematic diagram of the structure of the silicone hollow earphone cover provided in Embodiment 1 of the present invention.

[0031] Figure 2 This is a schematic diagram of the structure of the silicone hollow earphone cover provided in Embodiment 2 of the present invention.

[0032] Figure 3 This is a schematic diagram of the structure of the silicone hollow earphone cover provided in Embodiment 3 of the present invention. Detailed Implementation

[0033] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain embodiments of the present invention, and should not be construed as limiting the present invention.

[0034] Example 1

[0035] This embodiment provides a hollow silicone earphone cover, including a silicone cover body 100a and a base 200a. The silicone cover body 100a has an annular hollow structure with an earcup hole 110 extending through its axial direction in its central part. The earcup hole 110 is elliptical. A stepped portion 111 is provided at the upper end of the earcup hole 110, and the height of the stepped portion 111 gradually increases from the inside to the outside. The silicone cover body 100a has good thermal conductivity, preventing stuffiness during use and providing greater comfort. The silicone cover body 100a does not experience delamination or peeling, resulting in a longer service life. The stepped portion 111 fits the ear more closely, improving sound insulation. The silicone cover body 100a also has the advantage of a pleasant tactile feel.

[0036] The base 200a is a plastic base, specifically a polycarbonate base, which is fixed to the bottom of the silicone cover 100a. Specifically, the connection between the base 200a and the silicone cover 100a can be integral molding, welding, bonding, or screwing. The base 200a is fixed to the speaker cover of the earphone by means of snaps or screws, and its surface may have sound guide holes for guiding sound. The specific structure of the sound guide holes is common knowledge in the art and will not be described in detail here.

[0037] The silicone cover 100a has a first mounting groove 120 on the inner side of its bottom periphery. The base 200 is a plate-shaped structure, and its periphery is embedded in the first mounting groove 120.

[0038] The surface of the silicone cover 100a is textured. By etching the texture onto a mold, the silicone cover 100a is formed in the mold, resulting in a textured surface. The function of the texture is to improve tactile feel and prevent slippage.

[0039] Example 2

[0040] The difference between this embodiment and embodiment 1 is that: the silicone cover 100b has an integrally formed mounting ring 130 on the inner side of its bottom periphery, and the upper end of the base 200b is provided with a second mounting groove 210, in which the mounting ring 130 is embedded. The above arrangement has the advantages of stable installation and simple structure.

[0041] The rest of this embodiment is the same as that of Embodiment 1. Features not explained in this embodiment are explained using the methods of Embodiment 1, and will not be repeated here.

[0042] Example 3

[0043] The difference between this embodiment and Embodiment 1 is that the base 200c is a metal base. The metal base is an aluminum base, which has the advantages of being lightweight and having good heat dissipation. The base 200c has a plate-like structure, and its upper surface is provided with heat dissipation fins 220. Specifically, the connection between the heat dissipation fins 220 and the base 200c is preferably integrally formed, and the heat dissipation fins 220 serve to increase the heat dissipation area and accelerate heat dissipation.

[0044] The rest of this embodiment is the same as that of Embodiment 1. Features not explained in this embodiment are explained using the methods of Embodiment 1, and will not be repeated here.

[0045] Example 4

[0046] This embodiment provides a method for producing a silicone hollow earphone cover, including the following steps:

[0047] 1) Prepare the base, brush 1 gram of primer onto the base, and place it at room temperature (35°C) for 10 minutes; place the base coated with primer into the mold;

[0048] 2) Prepare silicone, add vulcanizing agent to the silicone, and mix evenly; the amount of vulcanizing agent is 0.5% of the amount of silicone;

[0049] 3) Weigh 20 grams of the mixed silicone and place it into the mold for molding. The mold temperature is 110℃ and the molding time is 6 minutes. Open the mold to obtain the hollow silicone earphone cover.

[0050] The silicone comprises the following raw materials by weight percentage: 60% polysiloxane; 35% silica and 5% hydroxyl silicone oil.

[0051] The vulcanizing agent comprises the following raw materials by mass percentage: 74% polysiloxane, 25% polymethylchlorosilane, and 1% platinum catalyst.

[0052] The primer comprises the following raw materials by weight percentage: 90% heptane and 10% tetrabutyl titanate.

[0053] Example 5

[0054] This embodiment provides a method for producing a silicone hollow earphone cover, including the following steps:

[0055] 1) Prepare the base, brush 1.5 grams of primer onto the base, and place it at room temperature (30°C) for 20 minutes; place the base coated with primer into the mold;

[0056] 2) Prepare silicone, add vulcanizing agent, thermal conductive powder and thermochromic agent to the silicone, and mix evenly; the amount of vulcanizing agent is 1% of the amount of silicone; the amount of thermal conductive powder is 20% of the amount of silicone; the amount of thermochromic agent is 1% of the amount of silicone.

[0057] 3) Weigh 22 grams of the mixed silicone and place it into the mold for molding. The mold temperature is 120℃ and the molding time is 5 minutes. Open the mold to obtain the hollow silicone earphone cover.

[0058] The silicone comprises the following raw materials by weight percentage: 65% polysiloxane; 25% silica and 10% hydroxyl silicone oil.

[0059] The vulcanizing agent comprises the following raw materials by mass percentage: 59% polysiloxane; 40% polymethylchlorosilane; and 1% platinum catalyst.

[0060] The primer comprises the following raw materials by weight percentage: 95% heptane and 5% tetrabutyl titanate.

[0061] Example 6

[0062] This embodiment provides a method for producing a silicone hollow earphone cover, including the following steps:

[0063] 1) Prepare the base, brush 2 grams of primer onto the base, and place it at room temperature (25°C) for 30 minutes; place the base coated with primer into the mold;

[0064] 2) Prepare silicone, add vulcanizing agent, thermal conductive powder and thermochromic agent to the silicone, and mix evenly; the amount of vulcanizing agent is 1.5% of the amount of silicone; the amount of thermal conductive powder is 25% of the amount of silicone; the amount of thermochromic agent is 1.5% of the amount of silicone.

[0065] 3) Weigh 25 grams of the mixed silicone and place it into the mold for molding. The mold temperature is 130℃ and the molding time is 4 minutes. Open the mold to obtain the hollow silicone earphone cover.

[0066] The silicone comprises the following raw materials by weight percentage: 70% polysiloxane; 25% silica and 5% hydroxyl silicone oil.

[0067] The vulcanizing agent comprises the following raw materials by mass percentage: 65% polysiloxane; 34.5% polymethylchlorosilane; and 0.5% platinum catalyst.

[0068] The primer comprises the following raw materials by weight percentage: 99% heptane and 1% tetrabutyl titanate.

[0069] Example 7

[0070] This embodiment provides a method for producing a silicone hollow earphone cover, including the following steps:

[0071] 1) Prepare the base, brush 2.5 grams of primer onto the base, and place it at room temperature (20°C) for 40 minutes; place the base coated with primer into the mold;

[0072] 2) Prepare silicone, add vulcanizing agent, thermal conductive powder and thermochromic agent to the silicone, and mix evenly; the amount of vulcanizing agent is 3% of the amount of silicone; the amount of thermal conductive powder is 30% of the amount of silicone; the amount of thermochromic agent is 2% of the amount of silicone.

[0073] 3) Weigh 30 grams of the mixed silicone and place it into the mold for molding. The mold temperature is 125℃ and the molding time is 5 minutes. Open the mold to obtain the hollow silicone earphone cover.

[0074] The silicone comprises the following raw materials by weight percentage: 69% polysiloxane; 30% silica and 1% hydroxyl silicone oil.

[0075] The vulcanizing agent comprises the following raw materials by mass percentage: 69.9% polysiloxane; 30% polymethylchlorosilane; and 0.1% platinum catalyst.

[0076] The primer comprises the following raw materials by weight percentage: 93% heptane and 7% tetrabutyl titanate.

[0077] Example 8

[0078] The thermal conductivity of the silicone prepared in Examples 4 to 7 was tested, and the test results are shown in Table 1.

[0079] Table 1

[0080] Thermal conductivity (W / mK) Example 4 3 Example 5 7 Example 6 8 Example 7 7

[0081] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A hollow silicone earphone cover, characterized in that: include: The silicone cover body is an annular hollow structure, wherein an earmuff hole is formed in the middle thereof and runs through the earmuff hole in an axial direction, and a step portion is provided at the upper end of the earmuff hole, and the height of the step portion increases step by step from the inside to the outside; as well as A base, which is a metal base or a plastic base and is fixed to the bottom of the silicone cover; The production method of the hollow silicone earphone cover comprises the following steps: 1) preparing the base, applying a primer on the base, and leaving it at room temperature for 10 to 40 minutes; Put the base coated with primer into the mold; 2) preparing silica gel, adding a vulcanizing agent to the silica gel, and kneading the mixture evenly; the amount of the vulcanizing agent used is 0.5 to 3% of the amount of the silica gel used; 3) weighing and kneading the silica gel, putting it into a mold for molding, the temperature in the mold is 110-130° C., and the molding time is 4-6 minutes; opening the mold to obtain the silica gel hollow earphone cover.

2. The hollow silicone earphone cover according to claim 1, characterized in that: A first mounting groove is provided on the inner side of the bottom periphery of the silicone cover body; the base is a plate-shaped structure, and its periphery is embedded in the first mounting groove.

3. The hollow silicone earphone cover according to claim 1, characterized in that: A mounting ring is integrally formed on the inner side of the bottom periphery of the silicone cover body, and a second mounting groove is provided at the upper end of the base, and the mounting ring is embedded in the second mounting groove.

4. The hollow silicone earphone cover according to claim 1, characterized in that: The base is a plate-shaped structure, and heat dissipation fins are arranged on the upper surface of the base.

5. The method for producing a hollow silicone earphone cover according to claim 1, characterized in that: The silica gel comprises the following raw materials in percentage by mass: 60-70% of polysiloxane; 25-35% of silicon dioxide and 1-10% of hydroxy silicone oil.

6. The method for producing a hollow silicone earphone cover according to claim 1, characterized in that: The vulcanizing agent comprises the following raw materials in percentage by mass: 59-74% of polysiloxane; 25-40% of polymethylchlorosilane and 0.1-1% of platinum catalyst.

7. The method for producing a hollow silicone earphone cover according to claim 1, characterized in that: The primer comprises the following raw materials in percentage by mass: 90-99% of heptane and 1-10% of tetrabutyl titanate.

8. The method for producing a hollow silicone earphone cover according to any one of claims 5 to 7, characterized in that: In step 2), thermal conductive powder is also added to the silica gel, and the amount of the thermal conductive powder is 20-30% of the amount of the silica gel.

9. The method for producing a hollow silicone earphone cover according to any one of claims 5 to 7, characterized in that: In step 2), a thermochromic agent is also added to the silica gel, and the amount of the thermochromic agent is 1-2% of the amount of the silica gel.

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