Circuit board structure, display panel, display device and preparation method

Abstract

The application relates to the technical field of display, and discloses a circuit board structure, a display panel, a display device and a preparation method. The circuit board structure comprises a circuit board body, a first connecting part, a second connecting part, a connecting circuit board, a plurality of first wires and a plurality of second wires. The circuit board body is provided with a containing hole. The first connecting part is arranged on the circuit board body and located on one side of the containing hole. The plurality of first wires are arranged on the circuit board body and located on the same side of the containing hole as the first connecting part, and are connected with the first connecting part. The second connecting part is arranged on the circuit board body and located on the side of the containing hole away from the first connecting part. The plurality of second wires are arranged on the circuit board body and located on the same side of the containing hole as the second connecting part, and are connected with the second connecting part. The connecting circuit board is provided with a plurality of connecting wires, and the connecting wires are connected with the first connecting part and the second connecting part. The circuit board structure enables the wires located on both sides of the hole to be connected.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a circuit board structure, a display panel comprising the circuit board structure and a display device comprising the display panel, and a preparation method of a circuit board assembly comprising the circuit board structure. BACKGROUND

[0002] At present, mobile phones have become necessities in people's lives, and people cannot live without mobile phones for life, work, communication and entertainment. The endurance of mobile phones has always been a concern. One way to improve the endurance of the battery is to increase the capacity of the battery, which leads to the compression of the space of other components of the mobile phone. For example, in order to increase the battery capacity of the whole machine, it is necessary to compress the width of the circuit board and change the position of the fingerprint film group. It is necessary to dig a hole on the circuit board of the display module to place the fingerprint module, so that the wire area on both sides of the hole becomes narrower. Due to the design rule, the MIPI signal line must be on the same layer, and there is a minimum width requirement between the adjacent two signal lines. Therefore, the MIPI signal line needs to have a minimum width. The wire area on both sides of the hole on the circuit board cannot meet the minimum width requirement of the signal line, resulting in that the signal line, touch line, etc. on the side of the hole away from the connector on the circuit board cannot be connected to the connector through the wire area on both sides of the hole.

[0003] Therefore, it is necessary to study a new circuit board structure, a display panel comprising the circuit board structure and a display device comprising the display panel, and a preparation method of a circuit board assembly comprising the circuit board structure.

[0004] The above information disclosed in the background section is only used to strengthen the understanding of the background of the present application, so it can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0005] The purpose of the present application is to overcome the deficiency that the wires on both sides of the hole cannot be connected in the prior art, and to provide a circuit board structure in which the wires on both sides of the hole can be connected, a display panel comprising the circuit board structure and a display device comprising the display panel, and a preparation method of a circuit board assembly comprising the circuit board structure.

[0006] Additional aspects and advantages of the present application will be set forth in part in the following description, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the application.

[0007] According to one aspect of the present disclosure, a circuit board structure is provided, comprising:

[0008] a circuit board body, on which a receiving hole is arranged;

[0009] The first connecting part is provided on the circuit board body and is located on one side of the receiving hole;

[0010] Multiple first wires are disposed on the circuit board body and are located on the same side of the receiving hole as the first connecting part, and are connected to the first connecting part;

[0011] The second connecting part is provided on the circuit board body and is located on the side of the receiving hole away from the first connecting part;

[0012] Multiple second wires are disposed on the circuit board body and are located on the same side of the receiving hole as the second connection part, and are connected to the second connection part;

[0013] A connecting circuit board is provided with multiple connecting wires, which connect the first connecting part and the second connecting part; the orthographic projection of the connecting circuit board on the circuit board body and the orthographic projection of the receiving hole on the circuit board body do not overlap.

[0014] In one exemplary embodiment of this disclosure, the circuit board structure further includes:

[0015] The third connecting part is located on the same side of the receiving hole as the second connecting part, and is connected to the second connecting part through the second wire.

[0016] In one exemplary embodiment of this disclosure, the second connecting portion is disposed between the third connecting portion and the receiving hole.

[0017] In one exemplary embodiment of this disclosure, the first connecting part is one of a ZIF connector, a BTB connector, and a PCB connector; the second connecting part is one of a ZIF connector, a BTB connector, and a PCB connector; and the third connecting part is one of a ZIF connector, a BTB connector, and a PCB connector.

[0018] In one exemplary embodiment of this disclosure, the number of pins in the first connecting portion is the same as the number of pins in the second connecting portion, and the number of pins in the third connecting portion is greater than the number of pins in the first connecting portion.

[0019] In an exemplary embodiment of this disclosure, the circuit board body is provided with a first component area and a second component area. The first component area and the first connecting portion are located on the same side of the receiving hole, and the second component area and the second connecting portion are located on the same side of the receiving hole. The first component area and the second component area are respectively provided with a plurality of functional devices.

[0020] In one exemplary embodiment of this disclosure, at least a portion of the first wire is connected between at least a portion of the functional devices in the first component area and the first connection portion.

[0021] In an exemplary embodiment of this disclosure, a bonding area is provided on the circuit board body. The bonding area is located on the side parallel to the line connecting the first component area, the receiving hole, and the second component area. The distance between the edge of the receiving hole near the bonding area and the bonding area is less than the distance between the edge of the second component area near the bonding area and the bonding area, or the distance between the edge of the receiving hole near the bonding area and the bonding area is less than the distance between the edge of the first component area near the bonding area and the bonding area.

[0022] In one exemplary embodiment of this disclosure, the orthographic projection of the connecting circuit board on the circuit board body overlaps with the orthographic projection of the bonding area on the circuit board body.

[0023] In one exemplary embodiment of this disclosure, the first connecting portion is a plurality of first terminal blocks, the second connecting portion is a plurality of second terminal blocks, and the connecting circuit board is bonded to the first connecting portion and the second connecting portion by anisotropic conductive adhesive.

[0024] According to one aspect of this disclosure, a display panel is provided, comprising: the circuit board structure described in any one of the preceding claims.

[0025] According to one aspect of this disclosure, a display device is provided, comprising: a display panel as described in any one of the preceding claims.

[0026] According to one aspect of this disclosure, a method for manufacturing a circuit board assembly is provided, comprising:

[0027] A circuit board body is provided, a receiving hole is formed on the circuit board body, and a plurality of first wires and a plurality of second wires are formed on the circuit board body, wherein the plurality of first wires are located on one side of the receiving hole, and the plurality of second wires are located on the side of the receiving hole away from the first wires;

[0028] A first connecting part is connected to the circuit board body, the first connecting part and the plurality of first wires are located on the same side of the receiving hole and are connected to the plurality of first wires;

[0029] A second connection portion is connected to the circuit board body, the second connection portion and the plurality of second wires are located on the same side of the receiving hole, and are connected to the plurality of second wires;

[0030] A second circuit board is provided, and the bonding area of ​​the circuit board body is bonded to the second circuit board;

[0031] A connecting circuit board is provided, wherein multiple connecting wires are provided on the connecting circuit board, and the connecting circuit board is connected between the first connecting part and the second connecting part, so that the connecting wires conduct and connect the first connecting part and the second connecting part, and the orthographic projection of the connecting circuit board on the circuit board body does not overlap with the orthographic projection of the receiving hole on the circuit board body.

[0032] As can be seen from the above technical solution, the present invention possesses at least one of the following advantages and positive effects:

[0033] The circuit board structure of the present invention includes a first connecting portion on one side of the receiving hole, to which multiple first wires are connected, and these multiple first wires are disposed on the circuit board body. A second connecting portion is provided on the side of the receiving hole away from the first connecting portion, to which multiple second wires are connected, and these multiple second wires are disposed on the circuit board body. A connecting circuit board is provided with multiple connecting wires, which connect the first connecting portion and the second connecting portion. The orthographic projection of the connecting circuit board on the circuit board body does not overlap with the orthographic projection of the receiving hole on the circuit board body. On one hand, by connecting the first and second wires on both sides of the receiving hole together through the connecting circuit board, the first connecting portion, and the second connecting portion, the connecting wires at the receiving hole are avoided. On the other hand, the connecting circuit board is separately provided and is not affected by the width of the circuit board body. The width of the connecting circuit board can be set wider, and the connecting wires on it do not need to be compressed, resulting in lower resistance and greater safety. Attached Figure Description

[0034] The above and other features and advantages of the present invention will become more apparent from a detailed description of exemplary embodiments thereof with reference to the accompanying drawings.

[0035] Figure 1 This is a three-dimensional structural schematic diagram of an example embodiment of the circuit board structure of the present invention;

[0036] Figure 2 yes Figure 1 A three-dimensional structural diagram of the circuit board body;

[0037] Figure 3 yes Figure 1 A schematic diagram of the connecting circuit board in the diagram;

[0038] Figure 4 This is a schematic flowchart of the method for preparing the circuit board assembly of the present invention.

[0039] The annotations for the main components in the diagram are explained below:

[0040] 1. Circuit board body; 2. First connecting part; 3. Second connecting part; 4. Receiving hole; 5. First wire; 6. Second wire; 7. Third connecting part; 8. First component area; 9. Second component area; 10. Third wire;

[0041] 11. Connect the circuit board; 111. Connect the wires;

[0042] 12. Bangding District. Detailed Implementation

[0043] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that the invention will be thorough and complete, and the concept of the exemplary embodiments will be fully conveyed to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted.

[0044] This invention first provides a circuit board structure, referring to... Figure 1 The diagram shows a three-dimensional structural schematic of an example embodiment of the circuit board structure of the present invention. For ease of understanding, the first conductor 5, the second conductor 6, and the third conductor 10 are drawn above the circuit board body. However, in actual products, since the circuit board structure can be a multilayer printed circuit board, the first conductor 5, the second conductor 6, and the third conductor 10 can be set in any layer as needed. The circuit board structure may include a circuit board body 1, a first connecting part 2, a second connecting part 3, a connecting circuit board 11, multiple first wires 5, and multiple second wires 6. A receiving hole 4 is provided on the circuit board body 1. The first connecting part 2 is located on the circuit board body 1 and on one side of the receiving hole 4. Multiple first wires 5 are located on the circuit board body 1 and on the same side of the receiving hole 4 as the first connecting part 2, and are connected to the first connecting part 2. The second connecting part 3 is located on the circuit board body 1 and on the side of the receiving hole 4 away from the first connecting part 2. Multiple second wires 6 are located on the circuit board body 1 and on the same side of the receiving hole 4 as the second connecting part 3, and are connected to the second connecting part 3. Multiple connecting wires 111 are provided on the connecting circuit board 11, and the connecting wires 111 connect the first connecting part 2 and the second connecting part 3. The orthographic projection of the connecting circuit board 11 on the circuit board body 1 does not overlap with the orthographic projection of the receiving hole 4 on the circuit board body 1.

[0045] The first wire 5 and the second wire 6 on both sides of the receiving hole 4 are connected together by the connecting circuit board 11, the first connecting part 2 and the second connecting part 3, so as to avoid setting the connecting wire 111 at the receiving hole 4. The connecting circuit board 11 is set separately and is not affected by the width of the circuit board body 1. The width of the connecting circuit board 11 can be set to be wider, and the connecting wire 111 on it does not need to be compressed in width, so that the resistance of the connecting wire 111 is smaller and safer.

[0046] In this example embodiment, the circuit board body 1 can be a flexible circuit board or a rigid printed circuit board. (Refer to...) Figure 2 The schematic diagram shows a three-dimensional structure of the circuit board body. The first wire 5, second wire 6, and third wire 10 in the diagram are only for illustrative purposes to show several wires and their wiring method, and are not intended to limit the actual number of wires or the actual wiring method. The circuit board body 1 can be rectangular. A receiving hole 4 is provided on the circuit board body 1, and a fingerprint recognition module can be placed inside the receiving hole 4. The receiving hole 4 can be a through hole or a blind hole, depending on the need. The radial dimension of the receiving hole 4 is slightly smaller than the width of the circuit board body 1, so that wires cannot be placed on both sides of the receiving hole 4 in the width direction of the circuit board body 1, thus preventing the wires on both sides of the receiving hole 4 in the length direction of the circuit board body 1 from being connected. Alternatively, the circuit board body 1 can be any shape other than rectangular, as long as it has a receiving hole 4, and the remaining portion of the circuit board body 1 on the opposite sides of the receiving hole 4 is insufficient to accommodate connecting wires 111 to connect the wires on the other opposite sides of the receiving hole 4; this example embodiment can be used.

[0047] In this example embodiment, a first connecting part 2 and a second connecting part 3 are provided on the circuit board body 1. The first connecting part 2 is located on one side of the receiving hole 4, and the second connecting part 3 is located on the side of the receiving hole 4 away from the first connecting part 2, that is, the first connecting part 2 and the second connecting part 3 are located on opposite sides of the receiving hole 4.

[0048] Multiple first wires 5 are also provided on the circuit board body 1. The multiple first wires 5 are located on the same side of the receiving hole 4 as the first connecting part 2 and are connected to the first connecting part 2. Multiple second wires 6 are also provided on the circuit board body 1. The multiple second wires 6 are located on the same side of the receiving hole 4 as the second connecting part 3 and are connected to the second connecting part 3.

[0049] In this example embodiment, the first connecting part 2 can be a ZIF (Zero Insertion Force) connector, a BTB (Board-to-board) connector, or a PCB (Printed Circuit Board) connector, etc. The second connecting part 3 can be a ZIF connector, a BTB connector, or a PCB connector, etc.

[0050] The length direction of the first connecting part 2 is consistent with the length direction of the circuit board body 1. The length direction of the second connecting part 3 is consistent with the length direction of the circuit board body 1. The length direction of the first connecting part 2 may be consistent with the width direction of the circuit board body 1. The length direction of the second connecting part 3 may also be consistent with the width direction of the circuit board body 1. The first connecting part 2 and the second connecting part 3 may also be inclined relative to the circuit board body 1.

[0051] In this example embodiment, a first component area 8 and a second component area 9 are provided on the circuit board body 1, and multiple functional devices are respectively provided in the first component area 8 and the second component area 9. The first component area 8 is located on one side of the receiving hole 4, and the second component area 9 is located on the side of the receiving hole 4 away from the first component area 8, that is, the first component area 8 and the second component area 9 are located on opposite sides of the receiving hole 4.

[0052] The first component area 8 and the first connecting portion 2 are located on the same side of the receiving hole 4, and the second component area 9 and the second connecting portion 3 are located on the same side of the receiving hole 4. Specifically, the first connecting portion 2 is located on the side of the first component area 8 away from the receiving hole 4, that is, the first component area 8 is located between the first connecting portion 2 and the receiving hole 4. The second connecting portion 3 is located between the receiving hole 4 and the second component area 9. Of course, in other exemplary embodiments of the present invention, the first connecting portion 2 may also be located between the first component area 8 and the receiving hole 4, and the second component area 9 may also be located between the receiving hole 4 and the second connecting portion 3.

[0053] In this example embodiment, at least a portion of the first wire 5 is connected between at least a portion of the functional devices in the first component area 8 and the first connection portion 2; that is, at least a portion of the functional devices in the first component area 8 are connected to the first connection portion 2 through at least a portion of the first wire 5, and the signal is transmitted to the first connection portion 2 through the first wire 5, transmitted to the connecting wire 111 through the first connection portion 2, and subsequently transmitted to the second connection portion 3 and the second wire 6 in sequence.

[0054] Additionally, it should be noted that circuit board body pins can be provided on the circuit board body 1, and some of the first wires 5 are connected to the circuit board body pins. The first wires 5 can be connected to external circuits outside the circuit board body 1 through these circuit board body pins. When the circuit board structure is in operation, the electrical signal conduction path is as follows: circuit board body pins, first wires 5, first connecting part 2, connecting wire 111, second connecting part 3, second wire 6. Of course, the path can also be the reverse of the previous one.

[0055] In this example embodiment, the circuit board structure may further include a third connecting portion 7, which is located on the same side as the second connecting portion 3, specifically: the third connecting portion 7 is located on the side of the second component area 9 away from the second connecting portion 3, and is situated at the edge of the circuit board body 1. The third connecting portion 7 is used to connect to an external circuit, transmitting signals from the circuit board body 1 or transmitting external signals to the circuit board body 1. The length direction of the third connecting portion 7 is consistent with the width direction of the circuit board body 1. A second wire 6 connects the third connecting portion 7 and the second connecting portion 3.

[0056] It should also be noted that multiple functional devices in the second component area 9 can be connected to the third connection part 7 via the third wire 10. The third connection part 7 can be a ZIF connector, a BTB connector, or a PCB connector, etc. Therefore, the number of pins in the first connection part 2 can be the same as the number of pins in the second connection part 3, and the number of pins in the third connection part 7 can be greater than the number of pins in the first connection part 2.

[0057] In this example embodiment, the connecting circuit board 11 can also be a flexible circuit board or a rigid printed circuit board. (See also...) Figure 3 The schematic diagram of the connecting circuit board shown is only for illustrative purposes to illustrate the number of wires and their wiring method, and is not intended to limit the actual number of wires or the actual wiring method. Multiple connecting wires 111 are provided on the connecting circuit board 11. These multiple connecting wires 111 may include MIPI signal lines, touch signal lines, etc. One end of the connecting circuit board 11 is connected to the first connecting part 2, and the other end of the connecting circuit board 11 is connected to the second connecting part 3. The connecting wires 111 on the connecting circuit board 11 conduct electricity between the first wire 5 connected to the first connecting part 2 and the second wire 6 connected to the second connecting part 3.

[0058] The installed connecting circuit board 11 can be parallel to the circuit board body 1. The orthographic projection of the connecting circuit board 11 on the circuit board body 1 does not overlap with the orthographic projection of the receiving hole 4 on the circuit board body 1, thus avoiding the connecting circuit board 11 from blocking the receiving hole 4. This ensures that the fingerprint recognition module will not be affected after it is installed in the receiving hole 4.

[0059] In this example embodiment, a bonding area 12 is also provided on the circuit board body 1. The circuit board body 1 can be a multilayer printed circuit board, and the bonding area 12 can be located on the bottom layer of the circuit board body 1. The bonding area 12 is located on the side parallel to the line connecting the first component area 8, the receiving hole 4, and the second component area 9, that is, the bonding area 12 is located on the long side of the circuit board body 1. The distance H between the edge of the receiving hole 4 near the bonding area 12 and the bonding area 12 is less than the distance L2 between the edge of the second component area 9 near the bonding area 12 and the bonding area 12, or the distance H between the edge of the receiving hole 4 near the bonding area 12 and the bonding area 12 is less than the distance L1 between the edge of the first component area 8 near the bonding area 12 and the bonding area 12. That is, the distance between the receiving hole 4 and the bonding area 12 is the smallest, and no circuit can be set there.

[0060] The installed connecting circuit board 11 can be parallel to the circuit board body 1. The orthographic projection of the connecting circuit board 11 on the circuit board body 1 overlaps with the orthographic projection of the bonding area 12 on the circuit board body 1. This allows the connecting circuit board 11 to be made wider, sufficient to accommodate multiple connecting wires 111.

[0061] In other exemplary embodiments of the present invention, the first connecting part 2 may also be a plurality of first terminal blocks, each corresponding to a plurality of first wires 5. The second connecting part 3 may also be a plurality of second terminal blocks, each corresponding to a plurality of second wires 6. A plurality of first connecting terminal blocks and a plurality of second connecting terminal blocks are respectively provided at both ends of the connecting circuit board 11. The connecting circuit board 11, the first connecting part 2, and the second connecting part 3 can be bonded together using anisotropic conductive adhesive, so that the first connecting terminal blocks are bonded to each other in a conductive manner, and the second connecting terminal blocks are bonded to each other in a conductive manner. The anisotropic conductive adhesive is a conductive adhesive with unidirectional (vertical conduction, parallel non-conductivity) conductivity and bonding and fixing functions. Avoiding the use of ZIF connectors, BTB connectors, or PCB connectors reduces the height of the circuit board body 1 after connection with the connecting circuit board 11, facilitating the subsequent thinner design of the display panel.

[0062] Furthermore, the present invention also provides a display panel, which may include the circuit board structure described above. The specific structure of the circuit board structure has been described in detail above, and therefore will not be repeated here.

[0063] The display panel can be a liquid crystal display panel, an LED display panel, an OLED display panel, etc., and the display panel can also include a light-emitting part, an array substrate, a color filter substrate, etc.

[0064] Compared with the prior art, the beneficial effects of the display panel provided in the embodiments of the present invention are the same as the beneficial effects of the circuit board structure provided in the above embodiments, and will not be repeated here.

[0065] Furthermore, the present invention also provides a display device, which may include the display panel described above. The specific structure of the display panel has been described in detail above, and therefore will not be repeated here.

[0066] The specific type of display device is not particularly limited, and any type of display device commonly used in the art is acceptable, such as OLED displays, mobile devices such as mobile phones, wearable devices such as watches, VR devices, etc. Those skilled in the art can make the appropriate selection according to the specific purpose of the display device, which will not be elaborated here.

[0067] It should be noted that, in addition to the display panel, the display device also includes other necessary components and parts. Taking the monitor as an example, these include, for instance, the casing, circuit board, power cord, etc. Those skilled in the art can supplement these components according to the specific usage requirements of the display device, and will not be elaborated here.

[0068] Compared with the prior art, the beneficial effects of the display device provided in the embodiments of the present invention are the same as those of the display panel provided in the above embodiments, and will not be repeated here.

[0069] Furthermore, the present invention also provides a method for manufacturing a circuit board assembly, referring to... Figure 4 The schematic diagram shown illustrates a method for fabricating a circuit board assembly according to the present invention. This method may include the following steps:

[0070] Step S10: A circuit board body 1 is provided, a receiving hole 4 is formed on the circuit board body 1, and multiple first wires 5 and multiple second wires 6 are formed on the circuit board body 1. The multiple first wires 5 are located on one side of the receiving hole 4, and the multiple second wires 6 are located on the side of the receiving hole 4 away from the first wires 5.

[0071] Step S20: Connect the first connecting part 2 to the circuit board body 1. The first connecting part 2 and the multiple first wires 5 are located on the same side of the receiving hole 4 and are connected to the multiple first wires 5.

[0072] Step S30: Connect the second connecting part 3 to the circuit board body 1. The second connecting part 3 and the multiple second wires 6 are located on the same side of the receiving hole 4 and are connected to the multiple second wires 6.

[0073] Step S40: Provide a second circuit board and bond the bonding area 12 of the circuit board body 1 to the second circuit board;

[0074] Step S50: A connecting circuit board 11 is provided, and multiple connecting wires 111 are provided on the connecting circuit board 11. The connecting circuit board 11 is connected between the first connecting part 2 and the second connecting part 3, so that the connecting wires 111 conduct and connect the first connecting part 2 and the second connecting part 3. The orthographic projection of the connecting circuit board 11 on the circuit board body 1 does not overlap with the orthographic projection of the receiving hole 4 on the circuit board body 1.

[0075] Because bonding generates a lot of heat, which can adversely affect the circuits and components on the circuit board body 1 and the connecting circuit board 11, it is not advisable to place components and circuits on the part of the circuit board body 1 near the bonding area 12. Bonding is performed first, and then the connecting circuit board 11 is connected to ensure that the circuits on the connecting circuit board 11 are not affected by the heat generated during bonding.

[0076] After the bonding area 12 of the circuit board body 1 is bonded to the second circuit board, some of the first conductors 5 on the circuit board body 1 can also be connected to the second circuit board.

[0077] The features, structures, or characteristics described above can be combined in any suitable manner in one or more embodiments, and the features discussed in the various embodiments are interchangeable where possible. In the above description, numerous specific details are provided to give a full understanding of embodiments of the invention. However, those skilled in the art will recognize that the technical solutions of the invention can be practiced without one or more of the specific details described, or other methods, components, materials, etc., can be employed. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring various aspects of the invention.

[0078] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0079] In this specification, the terms “a,” “an,” “the,” and “the” are used to indicate the presence of one or more elements / components / etc.; the terms “comprising,” “including,” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markings and are not a limitation on the number of objects.

[0080] It should be understood that the application of this invention is not limited to the detailed structure and arrangement of the components presented in this specification. The invention can have other embodiments and can be implemented and performed in various ways. The foregoing variations and modifications fall within the scope of this invention. It should be understood that the invention disclosed and defined in this specification extends to all alternative combinations of two or more individual features mentioned or apparent in the text and / or drawings. All these different combinations constitute multiple alternative aspects of the invention. The embodiments described in this specification illustrate the best known mode for carrying out the invention and will enable those skilled in the art to utilize the invention.

Claims

1. A circuit board structure, characterized in that, include: The circuit board body has receiving holes on it; The first connecting part is provided on the circuit board body and is located on one side of the receiving hole; Multiple first wires are disposed on the circuit board body and are located on the same side of the receiving hole as the first connecting part, and are connected to the first connecting part; The second connecting part is provided on the circuit board body and is located on the side of the receiving hole away from the first connecting part; Multiple second wires are disposed on the circuit board body and are located on the same side of the receiving hole as the second connection part, and are connected to the second connection part; A connecting circuit board is provided with multiple connecting wires, which connect the first connecting part and the second connecting part; the orthographic projection of the connecting circuit board on the circuit board body and the orthographic projection of the receiving hole on the circuit board body do not overlap. The circuit board body is provided with a first component area and a second component area, which are located on opposite sides of the receiving hole. The circuit board body is provided with a bonding area, which is located on the side where the line connecting the first component area, the receiving hole, and the second component area is parallel. The distance between the edge of the receiving hole near the bonding area and the bonding area is less than the distance between the edge of the second component area near the bonding area and the bonding area, or the distance between the edge of the receiving hole near the bonding area and the bonding area is less than the distance between the edge of the first component area near the bonding area and the bonding area.

2. The circuit board structure according to claim 1, characterized in that, The circuit board structure also includes: The third connecting part is located on the same side of the receiving hole as the second connecting part, and is connected to the second connecting part through the second wire.

3. The circuit board structure according to claim 2, characterized in that, The second connecting portion is disposed between the third connecting portion and the receiving hole.

4. The circuit board structure according to claim 2, characterized in that, The first connecting part is one of ZIF connector, BTB connector, and PCB connector; the second connecting part is one of ZIF connector, BTB connector, and PCB connector; and the third connecting part is one of ZIF connector, BTB connector, and PCB connector.

5. The circuit board structure according to claim 4, characterized in that, The number of needles in the first connecting part is the same as the number of needles in the second connecting part, and the number of needles in the third connecting part is greater than the number of needles in the first connecting part.

6. The circuit board structure according to claim 1, characterized in that, The first component area and the first connecting part are located on the same side of the receiving hole, and the second component area and the second connecting part are located on the same side of the receiving hole. The first component area and the second component area are respectively provided with multiple functional devices.

7. The circuit board structure according to claim 6, characterized in that, At least a portion of the first wire is connected between at least a portion of the functional devices in the first component area and the first connection portion.

8. The circuit board structure according to claim 1, characterized in that, The orthographic projection of the connecting circuit board on the circuit board body overlaps with the orthographic projection of the bonding area on the circuit board body.

9. The circuit board structure according to claim 1, characterized in that, The first connecting part comprises multiple first terminal blocks, and the second connecting part comprises multiple second terminal blocks. The connecting circuit board is bonded to the first connecting part and the second connecting part by anisotropic conductive adhesive.

10. A display panel, characterized in that, include: The circuit board structure according to any one of claims 1 to 9.

11. A display device, characterized in that, include: The display panel according to claim 10.

12. A method for manufacturing a circuit board assembly, characterized in that, include: A circuit board body is provided, a receiving hole is formed on the circuit board body, and a plurality of first wires and a plurality of second wires are formed on the circuit board body, wherein the plurality of first wires are located on one side of the receiving hole, and the plurality of second wires are located on the side of the receiving hole away from the first wires; A first connecting part is connected to the circuit board body, the first connecting part and the plurality of first wires are located on the same side of the receiving hole and are connected to the plurality of first wires; A second connection portion is connected to the circuit board body, the second connection portion and the plurality of second wires are located on the same side of the receiving hole, and are connected to the plurality of second wires; A second circuit board is provided, and the bonding area of ​​the circuit board body is bonded to the second circuit board; A connecting circuit board is provided, wherein a plurality of connecting wires are provided on the connecting circuit board, the connecting circuit board is connected between the first connecting part and the second connecting part, the connecting wires are conductively connected to the first connecting part and the second connecting part, and the orthographic projection of the connecting circuit board on the circuit board body does not overlap with the orthographic projection of the receiving hole on the circuit board body; The circuit board body is provided with a first component area and a second component area, which are located on opposite sides of the receiving hole. The circuit board body is provided with a bonding area, which is located on the side where the line connecting the first component area, the receiving hole, and the second component area is parallel. The distance between the edge of the receiving hole near the bonding area and the bonding area is less than the distance between the edge of the second component area near the bonding area and the bonding area, or the distance between the edge of the receiving hole near the bonding area and the bonding area is less than the distance between the edge of the first component area near the bonding area and the bonding area.

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