Organic light emitting display device

Abstract

An organic light-emitting display device is provided. The organic light-emitting display device includes: a substrate including a plurality of pixels having a light-emitting portion and a non-light-emitting portion respectively; a first electrode arranged on the light-emitting portion; a pixel definition film arranged on an edge portion of the first electrode and the non-light-emitting portion; a common organic layer arranged on the first electrode and the pixel definition film; an organic light-emitting layer arranged on the common organic layer and overlapping with the light-emitting portion; and a second electrode arranged on the common organic layer and the organic light-emitting layer. The pixel definition film includes a plurality of pits between adjacent pixels. The common organic layer and the second electrode are disconnected at the pits.

Description

Technical Field

[0001] The invention relates to an organic light emitting display device and a method for manufacturing the organic light emitting display device. Background Art

[0002] The display device is a device for displaying an image, and includes a display panel such as an organic light emitting display panel or a liquid crystal display panel.

[0003] An organic light emitting diode display (OLED display) is a type of self-luminous display device. An organic light emitting display device includes an organic light emitting layer sandwiched between a pixel electrode and a counter electrode. When the two electrodes inject electrons and holes into the organic light emitting layer, excitons are generated by the combination of electrons and holes, and light is generated when the excitons drop from an excited state to a ground state.

[0004] In order to display colors, an organic light emitting display device divides sub-pixels into red sub-pixels, green sub-pixels, and blue sub-pixels, and forms organic light emitting layers of the colors of the corresponding sub-pixels. Generally, the organic light emitting layers are deposited using a shadow mask.

[0005] However, when the shadow mask has a large area, it sags due to its own weight, which causes a problem of reduced yield when used multiple times. Therefore, organic layers other than the light-emitting layer are formed together in each sub-pixel without using a shadow mask.

[0006] However, recently, in a structure using a common layer, it has been observed that, due to the common layer provided in common to sub-pixels, current flows to the side through the common layer continuous on a plane, thereby causing a problem of side leakage current. Summary of the invention

[0007] The problem to be solved by the present invention is to provide an organic light emitting display device in which pits or spacers are arranged between sub-pixels to disconnect the common layer from the cathode electrode, thereby preventing side leakage current.

[0008] The subject of the present invention is not limited to the technical subject mentioned above, and those skilled in the art can clearly understand other technical subjects not mentioned through the following description.

[0009] An organic light-emitting display device according to one embodiment for solving the above-mentioned problems includes: a substrate including a plurality of pixels each having a light-emitting portion and a non-light-emitting portion; a first electrode disposed on the light-emitting portion; a pixel definition film disposed on an edge of the first electrode and the non-light-emitting portion; a common organic layer disposed on the first electrode and the pixel definition film; an organic light-emitting layer disposed on the common organic layer and overlapped with the light-emitting portion; and a second electrode disposed on the common organic layer and the organic light-emitting layer. The pixel definition film includes a plurality of pits between adjacent pixels, and the common organic layer and the second electrode are disconnected at the pits.

[0010] The common organic layer may include a hole injection layer and a hole transport layer.

[0011] The pit may include a flat surface parallel to the substrate and a side surface perpendicular to the substrate.

[0012] The common organic layer and the second electrode disposed on the side of the pit may be thinner than the common organic layer and the second electrode disposed on the upper surface of the pixel definition film.

[0013] The first sub-pixels and the second sub-pixels of the pixel may be alternately arranged along a first direction, and two third sub-pixels are arranged between the first sub-pixels and the second sub-pixels along a second direction perpendicular to the first direction, so that the pixel has a diamond shape.

[0014] The sizes of the first to third sub-pixels may be different from each other.

[0015] The recess may be separately formed spaced apart from each side of the first to third sub-pixels by a predetermined distance.

[0016] The length of the pit may be the same as the length of the sides of the first to third sub-pixels.

[0017] The concave pit may be separately and additionally formed from each vertex of the first to third sub-pixels.

[0018] A thin film encapsulation layer may be further included on the second electrode, and a touch sensor layer is arranged on the thin film encapsulation layer.

[0019] The touch sensor layer may include a drive electrode in a touch sensor region, at least a portion of the drive electrode overlapping the plurality of recesses.

[0020] The thin film encapsulation layer may include a first inorganic film, an organic film, and a second inorganic film, the first inorganic film being in direct contact with the common organic layer and the disconnected side surfaces of the second electrode.

[0021] An organic light-emitting display device according to another embodiment for solving the above-mentioned problems comprises: a substrate, comprising a plurality of pixels each having a light-emitting portion and a non-light-emitting portion; a first electrode, arranged on the light-emitting portion; a pixel definition film, arranged on an edge of the first electrode and the non-light-emitting portion; a common organic layer, arranged on the first electrode and the pixel definition film; an organic light-emitting layer, arranged on the common organic layer and arranged overlapping with the light-emitting portion; and a second electrode, arranged on the common organic layer and the organic light-emitting layer. The pixel definition film comprises a plurality of spacers between adjacent pixels, and the common organic layer and the second electrode are disconnected at the spacers.

[0022] The common organic layer may include a hole injection layer and a hole transport layer.

[0023] The spacer may include an upper surface parallel to the substrate and a side surface perpendicular to the substrate.

[0024] The common organic layer and the second electrode disposed on the side of the spacer may be thinner than the common organic layer and the second electrode disposed on the upper surface of the pixel definition film.

[0025] The first sub-pixels and the second sub-pixels of the pixel may be alternately arranged along a first direction, and two third sub-pixels are arranged between the first sub-pixels and the second sub-pixels along a second direction perpendicular to the first direction, so that the pixel has a diamond shape.

[0026] The sizes of the first to third sub-pixels may be different from each other.

[0027] The spacers may be formed to be spaced apart from respective sides of the first to third sub-pixels by a predetermined distance.

[0028] The length of the spacer may be the same as the length of the sides of the first to third sub-pixels. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a plan view showing a display device according to an embodiment.

[0030] Figure 2 It is shown Figure 1 A cross-sectional view of an example of II'.

[0031] Figure 3 It is shown in detail Figure 2 A plan view of an example of a display unit.

[0032] Figure 4 It is shown in detail Figure 2 A plan view of an example of a touch sensing unit.

[0033] Figure 5 It is shown Figure 4 An enlarged plan view of an example of area A.

[0034] Figure 6 It is shown Figure 5 An enlarged plan view of an example of area B.

[0035] Figure 7 It is shown Figure 6 A cross-sectional view of an example of II-II'.

[0036] Figure 8 It is an enlarged image Figure 7 Figure 1. X portion of the graph.

[0037] Fig. 9 It is shown Figure 6 A cross-sectional view of an example of III-III'.

[0038] Fig. 10A and Fig. 10B This is a graph showing changes in the electric field depending on the presence or absence of pits.

[0039] Fig.11A and Fig. 11B This is a graph showing the change in current density depending on the presence or absence of pits.

[0040] Fig. 12A and Fig. 12B It is a diagram showing a modified example of the planar shape of the dimple.

[0041] Fig.13A and Fig. 13B It is a diagram showing a modified example of the cross-sectional shape of the dimple.

[0042] Fig.14 It is shown Figure 5 An enlarged plan view of another example of region B.

[0043] Fig.15 It is shown Fig.14 A cross-sectional view of an example of IV-IV'.

[0044] Fig.16 It is an enlarged image Fig.15 Figure 2. Y portion of the graph.

[0045] FIG. 17A to FIG. 17C It is a diagram showing a modified example of the cross-sectional shape of the spacer.

[0046] Fig.18 It is shown Figure 5 An enlarged plan view of yet another example of region B.

[0047] Fig.19 It is shown Fig.18 A cross-sectional view of an example of VI-VI'.

[0048] Fig. 20 It is an enlarged image Fig.19 Figure 2. Z portion of the graph.

[0049] Fig.21 It is shown Figure 7 A diagram showing the manufacturing process of an organic light-emitting display device.

[0050] Fig. 22 It is shown Fig.15 A diagram showing the manufacturing process of an organic light-emitting display device.

[0051] Fig.23 It is shown Fig.19 A diagram showing the manufacturing process of an organic light-emitting display device.

[0052] Explanation of symbols

[0053] 10: Display device 100: Display panel

[0054] SUB: Substrate TFTL: Thin Film Transistor Layer

[0055] EML: Light Emitting Element Layer TFEL: Thin Film Encapsulation Layer

[0056] TSL: Touch Sensor Layer PIT: Pit

[0057] SPC: Spacer TE, RE: Touch electrode DETAILED DESCRIPTION

[0058] References and Attachments Figure 1 The advantages and features of the present invention and the methods for achieving them will be made clear by the detailed embodiments described below. However, the present invention is not limited to the embodiments disclosed below, but can also be implemented in other forms. That is, the present invention is only defined by the scope of the claims.

[0059] The situation that indicates that an element or layer is located "on" or "above" another element or layer includes not only the situation that the element or layer is located immediately above the other element or layer, but also the situation that the other layer or other element is sandwiched between the two. On the contrary, the situation that indicates that an element is located "directly above" or "immediately above" means that no other element or layer is sandwiched between the two.

[0060] Throughout the specification, the same reference numerals are used to refer to the same or like parts.

[0061] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0062] Figure 1 is a plan view showing a display device according to an embodiment, Figure 2 It is shown Figure 1 A cross-sectional view of an example of II'.

[0063] Reference Figure 1 and Figure 2 As a device for displaying video or still images, the display device 10 can be used not only as a mobile phone, a smart phone, a tablet personal computer, a smart watch, a watch phone, a mobile communication terminal, an electronic notebook, an electronic book, a portable multimedia player (PMP), a navigation, an ultra-portable mobile personal computer (UMPC), and other portable electronic devices, but also as a display screen for a variety of products such as a television, a notebook computer, a display, a billboard, and the Internet of Things (IOT). The display device 10 can be any one of an organic light-emitting display device, a liquid crystal display device, a plasma display device, a field emission display device, an electrophoretic display device, an electrowetting display device, a quantum dot light-emitting display device, and a micro LED display device. The following description is centered on the case where the display device 10 is an organic light-emitting display device, but the present invention is not limited to this.

[0064] According to an embodiment, a display device 10 includes a display panel 100 , a display driving circuit 200 , a circuit board 300 , and a touch driving circuit 400 .

[0065] The display panel 100 may include a main area MA and a protrusion area PA protruding from one side of the main area MA.

[0066] The main area MA may be formed as a rectangular plane having short sides in the first direction DR1 and long sides in the second direction DR2 intersecting the first direction DR1. A corner where the short side in the first direction DR1 meets the long side in the second direction DR2 may be smoothly formed with a predetermined curvature or formed at a right angle. The plane shape of the display device 10 is not limited to a quadrilateral, and may be formed as other polygons, a circle, or an ellipse.

[0067] The main area MA may be formed flat, but is not limited thereto, and may include curved surface portions formed at left and right ends. In this case, the curved surface portions may have a constant curvature or a varying curvature.

[0068] The main area MA may include a display area DA where pixels are formed to display an image, and a non-display area NDA which is an area surrounding the display area DA.

[0069] In the display area DA, not only pixels but also scan lines, data lines, and power lines connected to the pixels may be arranged. In the case where the main area MA includes a curved surface, the display area DA may be arranged on the curved surface. In this case, the image of the display panel 100 can also be seen on the curved surface.

[0070] The non-display area NDA may be defined by a region from the outside of the display area DA to the edge of the display panel 100. A scan driving unit for applying scan signals to scan lines and connection lines connecting data lines with the display driving circuit 200 may be disposed in the non-display area NDA.

[0071] The protrusion area PA may protrude from one side of the main area MA. For example, the protrusion area PA may protrude from the lower side of the main area MA. The length of the protrusion area PA in the first direction DR1 may be smaller than the length of the main area MA in the first direction DR2.

[0072] The protruding area PA may include a bending area BA and a pad area PDA. In this case, the pad area PDA may be arranged on one side of the bending area BA, and the main area MA may be arranged on the other side of the bending area BA. For example, the pad area PDA may be arranged on the lower side of the bending area BA, and the main area MA may be arranged on the upper side of the bending area BA.

[0073] The display panel 100 may be formed to have flexibility so that it can be bent, curved, bent, folded or rolled. Therefore, the display panel 100 may be bent in the thickness direction DR3 at the bending area BA. In this case, before the display panel 100 is bent, one side of the pad area PDA of the display panel 100 faces upward, but after the display panel 100 is bent, one side of the pad area PDA of the display panel 100 faces downward. Therefore, the pad area PDA is arranged at the lower part of the main area MA, and thus may overlap with the main area MA.

[0074] like Figure 2 As shown, the display panel 100 may include a display unit DU having a thin film transistor layer TFTL, a light emitting element layer EML, and a thin film encapsulation layer TFEL, and a touch sensing unit TDU having a touch sensor layer TSL in the main area MA. Figure 2 In the embodiment, the touch sensing unit TDU having the touch sensor layer TSL is included in the display panel 100, but the present invention is not limited thereto. For example, the touch sensing unit TDU may be formed as a separate touch panel, in which case the separate touch panel may be attached to the display panel 100.

[0075] Pads electrically connected to the display driving circuit 200 and the circuit board 300 may be arranged in the pad area PDA of the display panel 100 .

[0076] The display driving circuit 200 outputs signals and voltages for driving the display panel 100. For example, the display driving circuit 200 can supply a data voltage to a data line. In addition, the display driving circuit 200 can supply a power supply voltage to a power supply line and supply a scan control signal to a scan driving unit. The display driving circuit 200 can be formed by an integrated circuit (IC) and mounted on the display panel 100 in the pad area PDA by a chip on glass (COG) method, a chip on plastic (COP) method, or an ultrasonic bonding method, but is not limited thereto. For example, the display driving circuit 200 can be mounted on a circuit board 300.

[0077] The pad may include a display pad electrically connected to the display driving circuit 200 and a touch pad electrically connected to the touch line.

[0078] The circuit board 300 can be attached to the pad using an anisotropic conductive film. Therefore, the leads of the circuit board 300 can be electrically connected to the pad. The circuit board 300 can be a flexible printed circuit board, a printed circuit board, or a flexible film such as a chip on film.

[0079] The touch driving circuit 400 may be connected to the touch electrodes of the touch sensor layer TSL of the display panel 100. The touch driving circuit 400 applies a driving signal to the touch electrodes of the touch sensor layer TSL and measures the capacitance value of the touch electrodes. The driving signal may be a signal having a plurality of driving pulses. The touch driving circuit 400 may not only determine whether a touch input is present based on the capacitance value, but may also calculate the touch coordinates of the input touch.

[0080] The touch driving circuit 400 may be disposed on the circuit board 300. The touch driving circuit 400 may be formed of an integrated circuit (IC) to be mounted on the circuit board 300.

[0081] Figure 2 It is shown Figure 1 A cross-sectional view of an example of II'.

[0082] Reference Figure 2, the display panel 100 may include: a substrate SUB; a display unit DU having a thin film transistor layer TFTL, a light emitting element layer EML, and a thin film encapsulation layer TFEL arranged on the substrate SUB; and a touch sensing unit TDU having a touch sensor layer TSL.

[0083] The substrate SUB can be made of insulating materials such as glass, quartz, and polymer resin. The polymer material can be, for example, polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or a combination thereof. Alternatively, the substrate SUB can also include a material made of metal.

[0084] The substrate SUB may be a rigid substrate or a flexible substrate capable of bending, folding, rolling, etc. When the substrate SUB is a flexible substrate, it may be formed using polyimide (PI), but is not limited thereto.

[0085] The thin film transistor layer TFTL may be arranged on the substrate SUB. The thin film transistor layer TFTL may not only form thin film transistors of each pixel, but also may form scan lines, data lines, power lines, scan control lines, and connection lines between connection pads and data lines. Each thin film transistor may include a gate electrode, a semiconductor layer, a source electrode, and a drain electrode. Figure 3 As shown, in the case where the scan driving part 110 is formed in the non-display area NDA of the display panel 100 , the scan driving part 110 may include a thin film transistor.

[0086] The thin film transistor layer TFTL may be arranged in the display area DA and the non-display area NDA. Specifically, the thin film transistors, scan lines, data lines and power lines of each pixel of the thin film transistor layer TFTL may be arranged in the display area DA. The scan control lines and connection lines of the thin film transistor layer TFTL may be arranged in the non-display area NDA.

[0087] A light emitting element layer EML may be arranged on the thin film transistor layer TFTL. The light emitting element layer EML may include a pixel including a first electrode, a light emitting layer, and a second electrode, and a pixel definition film defining the pixel. The light emitting layer may be an organic light emitting layer including an organic substance. In this case, the light emitting layer may include a hole transporting layer, an organic light emitting layer, and an electron transporting layer. If a predetermined voltage is applied to the first electrode through the thin film transistor of the thin film transistor layer TFTL, and a cathode voltage is applied to the second electrode, holes and electrons move to the organic light emitting layer through the hole transporting layer and the electron transporting layer, respectively, and emit light by combining with each other in the organic light emitting layer. The pixels of the light emitting element layer EML may be arranged in the display area DA.

[0088] A thin film encapsulation layer TFEL may be arranged on the light emitting element layer EML. The thin film encapsulation layer TFEL serves to prevent oxygen or moisture from penetrating into the light emitting element layer EML. To this end, the thin film encapsulation layer TFEL may include at least one inorganic film. The inorganic film may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer or an aluminum oxide layer, but is not limited thereto. Furthermore, the thin film encapsulation layer TFEL serves to protect the light emitting element layer EML from foreign matter such as dust. To this end, the thin film encapsulation layer TFEL may include at least one organic film. The organic film may be formed using an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, etc., but is not limited thereto.

[0089] The thin film encapsulation layer TFEL may be arranged in the display area DA and the non-display area NDA. Specifically, the thin film encapsulation layer TFEL may be arranged to cover the light emitting element layer EML in the display area DA and the non-display area NDA and to cover the thin film transistor layer TFTL in the non-display area NDA.

[0090] A touch sensor layer TSL may be disposed on the thin film encapsulation layer TFEL. The touch sensor layer TSL is directly disposed on the thin film encapsulation layer TFEL, so compared with a case where a separate touch panel including the touch sensor layer TSL is attached to the thin film encapsulation layer TFEL, the thickness of the display device 10 can be reduced.

[0091] The touch sensor layer TSL may include touch electrodes for sensing a user's touch in a capacitive manner and touch wires connecting pads and touch electrodes. For example, the touch sensor layer TSL may sense a user's touch in a self-capacitance manner or a mutual capacitance manner.

[0092] The touch electrodes of the touch sensor layer TSL may be arranged in the display area DA, and the touch wires of the touch sensor layer TSL may be arranged in the non-display area NDA.

[0093] A cover window may be additionally arranged on the touch sensor layer TSL. In this case, the touch sensor layer TSL and the cover window may be attached via a transparent adhesive member.

[0094] Figure 3 It is shown in detail Figure 2 A plan view of an example of a display unit. Figure 3 In the figure, for the convenience of explanation, only the pixel P, the scan line SL, the data line DL, the power line PL, the scan control line SCL, the scan driving part 110, the display driving circuit 200 and the display pad DP of the display unit DU are shown.

[0095] Reference Figure 3 , scan lines SL, data lines DL, power lines PL and pixels P are arranged in the display area DA. The scan lines SL may be formed in parallel along a first direction DR1, and the data lines DL may be formed in parallel along a second direction DR2 crossing the first direction DR1. The power lines PL may include at least one line formed in parallel with the data lines DL in the second direction DR2 and a plurality of lines branching from the at least one line in the first direction DR1.

[0096] Each pixel P may be connected to at least any one of the scan lines SL, any one of the data lines DL, and the power line PL. Each pixel P may include a thin film transistor, an organic light emitting diode, and a capacitor, wherein the thin film transistor includes a driving transistor and at least one switching transistor. When a scan signal is applied from the scan line SL, each pixel P receives a data voltage of the data line DL, and supplies a driving current to the organic light emitting diode according to the data voltage applied to the gate electrode, so that it can emit light.

[0097] The scan driving unit 110 is connected to the display driving circuit 200 through at least one scan control line SCL. Therefore, the scan driving unit 110 can receive a scan control signal from the display driving circuit 200. The scan driving unit 110 generates a scan signal according to the scan control signal and supplies it to the scan line SL.

[0098] exist Figure 3 In the example, the scanning driving unit 110 is formed in the non-display area NDA on the left side of the display area DA, but the present invention is not limited thereto. For example, the scanning driving unit 110 may be formed in the non-display area NDA on the left side and the right side of the display area DA.

[0099] The display driving circuit 200 is connected to the display pad DP and receives digital video data and timing signals. The display driving circuit 200 converts the digital video data into analog positive polarity / negative polarity data voltages, and then supplies them to the data lines DL through the connection lines LL. In addition, the display driving circuit 200 generates a scanning control signal for controlling the scanning driving unit 110 through the scanning control line SCL and supplies it. The pixel P to which the data voltage is to be supplied is selected by the scanning signal of the scanning driving unit 110, and the data voltage is supplied to the selected pixel P. The display driving circuit 200 can be formed by an integrated circuit (IC) and attached to the substrate SUB by a chip on glass (COG) method, a chip on plastic (COP) method, or an ultrasonic bonding method.

[0100] Figure 4 It is shown in detail Figure 2 A plan view of an example of a touch sensing unit. Figure 4 In the figure, for convenience of description, only the touch electrodes TE and RE, the touch lines TL and RL, and the touch pad TP are illustrated.

[0101] Reference Figure 4 The touch sensing unit TDU includes a touch sensor area TSA for sensing a user's touch and a touch surrounding area TPA arranged around the touch sensor area TSA. The touch sensor area TSA may overlap with the display area DA of the display unit DU, and the touch surrounding area TPA may overlap with the non-display area NDA of the display unit DU.

[0102] The touch electrodes TE and RE may be arranged in the touch sensor area TSA. The touch electrodes TE and RE may include sensing electrodes RE electrically connected along a first direction DR1 and driving electrodes TE electrically connected along a second direction DR2 crossing the first direction DR1. Figure 4 In the embodiment, the case where the sensing electrodes RE and the driving electrodes TE are formed in a diamond-shaped plane is shown as an example, but the present invention is not limited thereto.

[0103] In order to prevent the sensing electrodes RE and the driving electrodes TE from being short-circuited with each other at the intersection area of ​​these electrodes, the driving electrodes TE adjacent to each other along the second direction DR2 may be electrically connected by the connecting electrode BE. In this case, the driving electrodes TE and the sensing electrodes RE may be arranged in one layer, and the connecting electrode BE may be arranged in a layer different from the driving electrodes TE and the sensing electrodes RE. Furthermore, the sensing electrodes RE electrically connected in the first direction DR1 and the driving electrodes TE electrically connected in the second direction DR2 are electrically insulated from each other.

[0104] The touch lines TL, RL may be arranged in the touch peripheral area TPA. The touch lines TL, RL may include a sensing line RL connected to the sensing electrode RE and a first driving line TL1 and a second driving line TL2 connected to the driving electrode TE.

[0105] Specifically, among the sensing electrodes RE electrically connected along the first direction DR1, the sensing electrodes arranged at one end may be connected to the sensing line RL. The sensing line RL may be connected to the first touch pad TP1. Among the driving electrodes TE electrically connected along the second direction DR2, the driving electrodes TE arranged at one end may be connected to the first driving line TL1, and the driving electrodes TE arranged at the other end may be connected to the second driving line TL2. For example, the first driving line TL1 may be connected to the driving electrode TE at the lower side of the touch sensor area TSA, and the second driving line TL2 may be connected to the driving electrode TE at the upper side of the touch sensor area TSA. In this case, the second driving line TL2 may pass through the left outer side of the touch sensor area TSA and be connected to the driving electrode TE at the upper side of the touch sensor area TSA. The first driving line TL1 and the second driving line TL2 may be connected to the second touch pad TP2. Therefore, the touch driving circuit 400 may be electrically connected to the driving electrode TE and the sensing electrode RE.

[0106] The touch electrodes TE and RE may be driven by mutual capacitance or self capacitance. First, when the touch electrodes TE and RE are driven by mutual capacitance, a driving signal is supplied to the driving electrode TE through the first driving line TL1 and the second driving line TL2, thereby charging the mutual capacitance formed in the intersection area between the sensing electrode RE and the driving electrode TE. Then, the charge change of the sensing electrode RE is measured through the sensing line RL, and whether a touch input is present is determined based on the charge change of the sensing electrode RE. The driving signal may be a signal having multiple driving pulses.

[0107] In the second case, when the touch electrodes TE and RE are driven by self-capacitance, the first drive line TL1, the second drive line TL2 and the sensing line RL are used to supply drive signals to the drive electrode TE and the sensing electrode RE, thereby charging the self-capacitance of the drive electrode TE and the sensing electrode RE. Then, the charge change of the self-capacitance of the drive electrode TE and the sensing electrode RE is measured by the first drive line TL1, the second drive line TL2 and the sensing line RL, and whether a touch input is present is determined based on the charge change of the self-capacitance.

[0108] like Figure 5 As shown in FIG. 1 , the driving electrodes TE and the sensing electrodes RE may be formed as electrodes in a grid shape. Figure 2 In the case where the second electrode of the light emitting element layer EML is directly formed on the thin film encapsulation layer TFEL as shown in the figure, since the distance between the second electrode of the light emitting element layer EML and the driving electrode TE or the sensing electrode RE of the touch sensor layer TSL is relatively close, a very large parasitic capacitance may be formed between the second electrode of the light emitting element layer EML and the driving electrode TE or the sensing electrode RE of the touch sensor layer TSL. In order to reduce the parasitic capacitance, the driving electrode TE and the sensing electrode RE are preferably formed as shown in FIG. 1 , as compared to the entire electrode formed as a transparent oxide conductive layer such as ITO or IZO. Figure 4 The electrodes shown are formed into a grid pattern.

[0109] And, if Figure 5 As shown, the floating electrode FLE can be arranged in a manner separated from the driving electrode TE and the sensing electrode RE. The floating electrode FLE can be arranged between the driving electrode TE and the sensing electrode RE, or arranged to be surrounded by the driving electrode TE or surrounded by the sensing electrode RE. The floating electrode FLE can be formed as a grid-shaped electrode. No voltage is applied to the floating electrode FLE. The larger the area of ​​the floating electrode FLE, the smaller the parasitic capacitance between the second electrode of the light emitting element layer EML and the driving electrode TE or the sensing electrode RE of the touch sensor layer TSL can be, but the mutual capacitance between the driving electrode TE and the sensing electrode RE may also become smaller. When the parasitic capacitance becomes smaller, there is an advantage of being able to increase the charging speed of charging the mutual capacitance, but when the mutual capacitance becomes smaller, the influence of touch noise may become larger. Therefore, the area of ​​the floating electrode FLE is preferably appropriately set in consideration of the parasitic capacitance and the mutual capacitance.

[0110] In the following, for the sake of convenience of explanation, the sensing electrodes RE arranged along the first direction DR1 in the j-th row (j is a positive integer) are defined as the sensing electrodes in the j-th row, and the sensing lines connected to the sensing electrodes in the j-th row are defined as the j-th sensing lines. In this case, the sensing line connected to the sensing electrode RE1 in the first row may be the first sensing line RL1, the sensing line connected to the sensing electrode RE2 in the second row may be the second sensing line RL2, the sensing line connected to the sensing electrode RE36 in the thirty-sixth row may be the thirty-sixth sensing line RL36, and the sensing line connected to the sensing electrode RE37 in the thirty-seventh row may be the thirty-seventh sensing line RL37. Here, the first row may be the row arranged on the lowermost side, and the thirty-seventh row may be the row arranged on the uppermost side. In Figure 4 In the embodiment, for the sake of convenience, an example is given in which the sensing electrodes RE are arranged in thirty-seven rows, but the number of rows in which the sensing electrodes RE are arranged is not limited to thirty-seven. Among the sensing lines RL, the first sensing line RL1 may be arranged closest to the touch sensor area TSA, and the thirty-seventh sensing line RL37 may be arranged farthest from the touch sensor area TSA.

[0111] In addition, among the sensing electrodes RE, the sensing electrode RE37 of the thirty-seventh row is arranged farthest from the first touch pad TP1, and the sensing electrode RE1 of the first row is arranged closest to the first touch pad TP1. Therefore, among the sensing lines RL, the thirty-seventh sensing line RL37 has the longest length, and the first sensing line RL1 has the shortest length.

[0112] Furthermore, for the sake of convenience of explanation, the driving electrode TE arranged along the second direction DR2 in the kth column (k is a positive integer) is defined as the driving electrode of the kth column, the driving line connected to one side of the driving electrode of the kth column is defined as the 1-k driving line, and the driving line connected to the other side of the driving electrode of the kth column is defined as the 2-k driving line. In this case, the driving line connected to one side of the driving electrode TE1 of the first column may be the 1-1 driving line TL11, the driving line connected to the other side of the driving electrode TE1 of the first column may be the 2-1 driving line TL21, the driving line connected to one side of the driving electrode of the second column may be the 1-2 driving line, the driving line connected to the other side of the driving electrode of the second column may be the 2-2 driving line, the driving line connected to one side of the driving electrode TE15 of the fifteenth column may be the 1-15 driving line TL115, the driving line connected to the other side of the driving electrode TE15 of the fifteenth column may be the 2-15 driving line TL215, the driving line connected to one side of the driving electrode TE16 of the sixteenth column may be the 1-16 driving line TL116, and the driving line connected to the other side of the driving electrode TE16 of the sixteenth column may be the 2-16 driving line TL216. Here, the first column may be the column arranged on the leftmost side, and the sixteenth column may be the column arranged on the rightmost side. In Figure 4 In the embodiment, for the sake of convenience, the driving electrodes TE are arranged in sixteen columns, but the number of columns in which the driving electrodes TE are arranged is not limited to sixteen. In the second driving lines TL2, the 2-1 driving line TL21 is arranged closest to the touch sensor area TSA, and the 2-16 driving line TL216 can be arranged farthest from the touch sensor area TSA.

[0113] In addition, among the driving electrodes TE, the upper side of the sixteenth driving electrode TE16 is arranged farthest from the second touch pad TP2, and the upper side of the first driving electrode TE1 is arranged closest to the second touch pad TP2. Therefore, among the second driving lines TL2, the 2-16 driving line TL216 has the longest length, and the 2-1 driving line TL21 has the shortest length.

[0114] The first guide line GL1 may be arranged outside the thirty-seventh sensing line RL37 arranged at the outermost periphery among the sensing lines RL. Also, the first ground line GRL1 may be arranged outside the first guide line GL1. That is, the thirty-seventh sensing line RL37 is arranged at the right end among the sensing lines RL, so the first guide line GL1 may be arranged on the right side of the thirty-seventh sensing line RL37, and the first ground line GRL1 may be arranged on the right side of the first guide line GL1.

[0115] A second guide line GL2 may be disposed between the first sensing line RL1 disposed at the innermost side among the sensing lines RL and the 1st to 16th driving lines TL116. Furthermore, the second guide line GL2 may be disposed between the 1st to 16th driving lines TL116 and the second ground line GRL2. Furthermore, the third guide line GL3 may be disposed between the first sensing line RL1 and the second ground line GRL2. The second ground line GRL2 may be connected to the first touch pad disposed at the innermost side among the first touch pads TP1 and the second touch pad disposed at the innermost side among the second touch pads TP2.

[0116] The fourth guide line GL4 may be arranged outside the 2nd-16th driving line TL216 arranged at the outermost periphery among the second driving lines TL2. Furthermore, the third ground line GRL3 may be arranged outside the fourth guide line GL4. That is, the 2nd-16th driving line TL216 is arranged at the left and upper ends of the second driving lines TL2, so the fourth guide line GL4 may be arranged on the left and upper sides of the 2nd-16th driving line TL216, and the third ground line GRL3 may be arranged on the left and upper sides of the fourth guide line GL4.

[0117] The fifth guide line GL5 may be disposed inside the 2-1st driving line TL21 disposed at the innermost side among the second driving lines TL2. That is, the fifth guide line GL5 may be disposed between the 2-1st driving line TL21 and the touch electrodes TE, RE.

[0118] according to Figure 4 In the embodiment shown, the first ground line GRL1, the second ground line GRL2 and the third ground line GRL3 are arranged at the outermost periphery on the upper side, the left side and the right side of the display panel 100. A ground voltage is applied to the first ground line GRL1, the second ground line GRL2 and the third ground line GRL3. Therefore, in the case where static electricity is applied from the outside, the static electricity can be discharged through the first ground line GRL1, the second ground line GRL2 and the third ground line GRL3.

[0119] And, according to Figure 4 In the embodiment shown, the first guide line GL1 is arranged between the sensing line arranged at the outermost periphery (i.e., the thirty-seventh sensing line RL37) and the first ground line GRL1, so that the thirty-seventh sensing line RL37 can be minimized by the voltage change of the first ground line GRL1. The second guide line GL2 is arranged between the sensing line arranged at the innermost side and the first driving line arranged at the outermost periphery, i.e., between the first sensing line RL1 and the 1-16 driving line TL116. Therefore, the second guide line GL2 can minimize the influence of the first sensing line RL1 and the 1-16 driving line TL116 on each other. The third guide line GL3 is arranged between the sensing line arranged at the innermost side (i.e., the first sensing line RL1) and the second ground line GRL2, so that the first sensing line RL1 can be minimized by the voltage change of the second ground line GRL2. The fourth guide line GL4 is arranged between the second driving line (i.e., the 2-16th driving line TL216) arranged at the outermost periphery and the third ground line GRL3, so that the 2-16th driving line TL216 can be minimized by the voltage change of the third ground line GRL3. The fifth guide line GL5 is arranged between the second driving line (i.e., the 2-1st driving line TL21) arranged at the innermost side and the touch electrodes TE and RE, so that the 2-1st driving line TL21 and the touch electrodes TE and RE can be minimized by the influence of each other.

[0120] To this end, when the touch electrodes TE and RE are driven by mutual capacitance, a ground voltage may be applied to the first guide line GL1, the second guide line GL2, the third guide line GL3, the fourth guide line GL4, and the fifth guide line GL5. Furthermore, when the touch electrodes TE and RE are driven by self capacitance, a driving signal identical to the driving signal applied to the first drive line TL1, the second drive line TL2, and the sensing line RL may be applied to the first guide line GL1, the second guide line GL2, the third guide line GL3, the fourth guide line GL4, and the fifth guide line GL5.

[0121] Figure 6 It is shown Figure 5 An enlarged plan view of an example of area B. Figure 7 It is shown Figure 6 A cross-sectional view of an example of II-II'. Figure 8 It is an enlarged image Figure 7 Figure 1. X portion of the graph. Fig. 9 It is shown Figure 6 A cross-sectional view of an example of III-III'.

[0122] Reference Figure 6 and Figure 7 A thin film transistor layer TFTL is formed on the substrate SUB. The thin film transistor layer TFTL includes a thin film transistor 120, a gate insulating film 130, an interlayer insulating film 140, a protective film 150, and a planarization film 160.

[0123] A buffer film BF may be formed on one side of the substrate SUB. The buffer film BF may be formed on one side of the substrate SUB in order to protect the thin film transistor 120 and the organic light emitting layer 173 of the light emitting element layer EML from moisture that penetrates through the moisture-permeable and fragile substrate SUB. The buffer film BF may be formed using a plurality of inorganic films stacked alternately. For example, the buffer film BF may be formed as a multilayer film of one or more inorganic films of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer stacked alternately. The buffer film BF may be omitted.

[0124] A thin film transistor 120 is formed on the buffer film BF. The thin film transistor 120 includes an active layer 121, a gate electrode 122, a source electrode 123, and a drain electrode 124. Figure 7 , the thin film transistor 120 is formed by a top gate method in which the gate electrode 122 is located on the upper part of the active layer 121, but it should be noted that it is not limited to this. That is, the thin film transistor 120 can be formed by a bottom gate method in which the gate electrode 122 is located on the lower part of the active layer 121 or a double gate method in which the gate electrode 122 is arranged on both the upper part and the lower part of the active layer 121.

[0125] An active layer 121 is formed on the buffer film BF. The active layer 121 may include polycrystalline silicon, single crystal silicon, low temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor. For example, the oxide semiconductor may include a binary compound (AB) containing indium, zinc, gallium, tin, titanium, aluminum, hafnium (Hf), zirconium (Zr), magnesium (Mg), etc. x ), ternary compounds (AB x Cy), quaternary compounds (AB xCyDz). For example, the active layer 121 may include ITZO (including oxides of indium, tin, and zinc) or IGZO (including oxides of indium, gallium, and zinc). A light blocking layer for blocking external light incident on the active layer 121 may be formed between the buffer film BF and the active layer 121.

[0126] A gate insulating film 130 may be formed on the active layer 121. The gate insulating film 130 may be formed using an inorganic film, for example, a silicon nitride layer, a silicon nitride oxide layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0127] A gate electrode 122 and a gate line may be formed on the gate insulating film 130. The gate electrode 122 and the gate line may be formed as a single layer or multiple layers using any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

[0128] An interlayer insulating film 140 may be formed on the gate electrode 122 and the gate line. The interlayer insulating film 140 may be formed of an inorganic film, for example, a silicon nitride layer, a silicon nitride oxide layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0129] A source electrode 123 and a drain electrode 124 may be formed on the interlayer insulating film 140. The source electrode 123 and the drain electrode 124 may be connected to the active layer 121 through contact holes penetrating the gate insulating film 130 and the interlayer insulating film 140, respectively. The source electrode 123 and the drain electrode 124 may be formed as a single layer or multiple layers using any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0130] A protective film 150 for insulating the thin film transistor 120 may be formed on the source electrode 123 and the drain electrode 124. The protective film 150 may be formed of an inorganic film, for example, a silicon nitride layer, a silicon nitride oxide layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0131] A planarization film 160 for flattening a step caused by the thin film transistor 120 may be formed on the protection film 150. The planarization film 160 may be formed of an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0132] A light emitting element layer EML is formed on the thin film transistor layer TFTL. The light emitting element layer EML includes a light emitting element and a pixel definition film 180 .

[0133] The light emitting elements and the pixel definition film 180 are formed on the planarization film 160. Each light emitting element may include a first electrode 171, a common organic layer 172, an organic light emitting layer 173, and a second electrode 174.

[0134] The first electrode 171 may be formed on the planarization film 160 . The first electrode 171 is connected to the drain electrode 124 of the thin film transistor 120 through a contact hole penetrating the protection film 150 and the planarization film 160 .

[0135] In a top emission structure that emits light toward the second electrode 174 based on the organic light-emitting layer 173, the first electrode 171 can be formed using a metal material with high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0136] In a bottom emission structure that emits light toward the first electrode 171 based on the organic light emitting layer 173, the first electrode 171 can be formed using a transparent metal material (TCO: Transparent Conductive Material) such as ITO and IZO that can transmit light, or a semi-transmissive metal material (Semi-transmissive Conductive Material) such as magnesium (Mg), silver (Ag) or an alloy of magnesium (Mg) and silver (Ag). In this case, when the first electrode 171 is formed using a semi-transmissive metal material, the light extraction efficiency can be improved through a micro cavity.

[0137] The pixel definition film 180 may be formed to divide the first electrode 171 on the planarization film 160 to play the role of a pixel definition film for defining sub-pixels R, G, and B. The pixel definition film 180 may be formed to cover the edge portion of the first electrode 171. The pixel definition film 180 may be formed using an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0138] A pair of recessed pits PIT may be formed in the pixel definition film 180 .

[0139] Reference Figure 6 , the pits PIT may be arranged to surround each sub-pixel R, G, B. According to one embodiment, a separate pit PIT may be arranged on each side of a sub-pixel having a quadrilateral shape, so that each sub-pixel includes a total of four pits PIT. Therefore, two pits PIT may be arranged between two adjacent sub-pixels R, G, B.

[0140] The pit PIT may be formed to have the same length as the length of each side of the adjacent sub-pixels R, G, B. Since the pit PIT is formed at a predetermined distance from each sub-pixel R, G, B, the pit PIT may not be formed in a region adjacent to each vertex of the sub-pixel.

[0141] exist Figure 6 In the embodiment, the case where each sub-pixel R, G, B includes four pits PIT and the shape of the pits PIT is rectangular is described, but it is not limited to this. The number and shape of the pits PIT formed by each sub-pixel R, G, B can be variously deformed and applied. Fig. 12A and Fig. 13B Provide detailed explanation.

[0142] Reference Figure 7 , a pair of pits PIT may be formed on the pixel definition film 180. According to an embodiment, the pit PIT may include a flat surface PIT_B formed parallel to the planarization film 160 and a side surface PIT_S extending in a direction perpendicular to the planarization film 160. At least a portion of the flat surface PIT_B may overlap with the driving electrode TE in the thickness direction. The height of the side surface PIT_S may be equivalent to about half the height of the pixel definition film 180, but is not limited thereto.

[0143] Each sub-pixel R, G, and B represents a region where the first electrode 171, the common organic layer 172, the organic light-emitting layer 173, and the second electrode 174 are stacked in sequence and holes from the first electrode 171 and electrons from the second electrode 174 are combined with each other in the organic light-emitting layer 173 to emit light.

[0144] In addition, if Figure 6 As shown, one red sub-pixel R, one blue sub-pixel B, and two green sub-pixels G can be defined as one pixel P. The area of ​​the blue sub-pixel B can be larger than the area of ​​the red sub-pixel R, and the area of ​​the red sub-pixel R can be larger than the area of ​​the green sub-pixel G. Figure 6, the example of the red sub-pixel R, the green sub-pixel G, and the blue sub-pixel B having a quadrilateral plane shape is shown, but the present invention is not limited thereto. The red sub-pixel R, the green sub-pixel G, and the blue sub-pixel B may have a polygonal, circular, or elliptical plane shape other than a quadrilateral.

[0145] A common organic layer 172 is formed on the first electrode 171 and the pixel definition film 180. The common organic layer 172 may be a common layer formed on the first electrode 171 and the pixel definition film 180, and may include a hole injection layer and a hole transport layer. Since a p-type dopant with high conductivity is used in the hole injection layer, when adjacent sub-pixels are connected, it may become a main cause of side leakage current.

[0146] The common organic layer 172 may be formed by a deposition process or a solution process. In the case of being formed by a deposition process, it may be formed by an evaporation deposition method. The step coverage characteristics of the film formed by the evaporation deposition method are poor. Therefore, when the angle of the side surface PIT_S of the pit PIT is formed to be greater than about 50°, the thickness of the common organic layer 172 at the side surface PIT_S of the pit PIT may be formed to be thinner than the thickness of the common organic layer 172 at the inclined surface of the pixel definition film 180.

[0147] For example, when the angle of the side surface PIT_S of the pit PIT recessed concavely in the upper portion of the pixel definition film 180 is formed to be 90°, the common organic layer 172 stacked on the upper surface of the pixel definition film 180 and the common organic layer 172 stacked on the side surface PIT_S of the pit PIT may be disconnected. At least one inorganic film included in the thin film encapsulation layer TFEL may be in direct contact with the disconnected side surface of the common organic layer 172.

[0148] When the common organic layer 172 is formed as a common layer between adjacent sub-pixels R, G, and B, it can become a moving path for holes. Figure 8 As shown in FIG. 1 , when the common organic layer 172 is formed to be disconnected from the side surface PIT_S of the pit PIT on the upper surface of the pixel definition film 180, the holes of the blue sub-pixel B may have difficulty in moving to the adjacent green sub-pixel G because the moving path is cut off. That is, the leakage path of the current can be minimized by means of the pit PIT, so the influence of the leakage current through the common organic layer 172 on the adjacent pixels can be minimized.

[0149] An organic light-emitting layer 173 may be formed on the common organic layer 172. Unlike the common organic layer 172, the organic light-emitting layer 173 may be formed for each sub-pixel R, G, and B. The organic light-emitting layer 173 may include an organic substance to emit light of a predetermined color. In this case, the organic light-emitting layer 173 of the red sub-pixel R may emit red light, the organic light-emitting layer 173 of the green sub-pixel G may emit green light, and the organic light-emitting layer 173 of the blue sub-pixel B may emit blue light. Alternatively, the organic light-emitting layer 173 of the sub-pixels R, G, and B may emit white light, in which case the red sub-pixel R may further include a red color filter layer, the green sub-pixel G may further include a green color filter layer, and the blue sub-pixel B may further include a blue color filter layer.

[0150] The second electrode 174 is formed on the common organic layer 172 and the organic light emitting layer 173. The second electrode 174 may be formed to cover the common organic layer 172 and the organic light emitting layer 173. The second electrode 174 may be a common layer formed in common in the pixels P. Since holes can move through the second electrode 174, when adjacent sub-pixels are connected, it may become another cause of side leakage current. A capping layer may be formed on the second electrode 174.

[0151] The second electrode 174 is made of metal and has a characteristic of being randomly deposited due to the diffuse reflection characteristics of particles relative to organic matter, so that the coverage is good. However, when the angle of the side surface PIT_S of the pit PIT recessed in the upper part of the pixel definition film 180 is formed to 90°, the second electrode 174 stacked on the upper surface of the pixel definition film 180 and the second electrode 174 stacked on the side surface PIT_S of the pit PIT may be disconnected. At least one inorganic film included in the thin film encapsulation layer TFEL may be in direct contact with the disconnected side surface of the second electrode 174.

[0152] When the second electrode 174 is formed as a common layer between adjacent sub-pixels R, G, and B, it can become a moving path for holes. Figure 8 As shown in FIG. 1 , when the second electrode 174 is formed to be disconnected from the side surface PIT_S of the pit PIT on the upper surface of the pixel definition film 180, the holes of the blue sub-pixel B may have difficulty in moving to the adjacent green sub-pixel G because the path through which they can move in a roundabout way is cut off. That is, the leakage path of the current can be minimized by means of the pit PIT, so the influence of the leakage current through the second electrode 174 on the adjacent pixels can be minimized.

[0153] In the top emission structure, the second electrode 174 can be formed using a transparent metal material (TCO: Transparent Conductive Material) such as ITO, IZO, etc. that can transmit light, or a semi-transmissive metal material (Semi-transmissive Conductive Material) such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). In the case where the second electrode 174 is formed using a semi-transmissive metal material, the light extraction efficiency can be improved through a micro cavity.

[0154] In the bottom emission structure, the second electrode 174 can be formed of a metal material with high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0155] A thin film encapsulation layer TFEL is formed on the light emitting element layer EML and includes an encapsulation film 190 .

[0156] The encapsulation film 190 is arranged on the second electrode 174. The encapsulation film 190 may include at least one inorganic film 191, 193 to prevent oxygen or moisture from penetrating into the organic light-emitting layer 173 and the second electrode 174. In addition, the encapsulation film 190 may include at least one organic film 192 to protect the light-emitting element layer EML from foreign matter such as dust. For example, the encapsulation film 190 may include a first inorganic film 191 arranged on the second electrode 174, an organic film 192 arranged on the first inorganic film, and a second inorganic film 193 arranged on the organic film. The first inorganic film 191 and the second inorganic film 193 may be formed using a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but are not limited thereto. The organic film 192 may be formed using an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, etc., but are not limited thereto.

[0157] A touch sensor layer TSL is formed on the thin film encapsulation layer TFEL. The touch sensor layer TSL includes a driving electrode TE, a sensing electrode RE, a connecting electrode BE, a first driving line TL1, a second driving line TL2, a sensing line RL, guide lines GL1, GL2, GL3, GL4, GL5, and ground lines GRL1, GRL2, GRL3. Figure 6 and Figure 7 In the figure, for the convenience of explanation, only the driving electrode TE of the touch sensor layer TSL is shown as an example.

[0158] The driving electrode TE is formed on the encapsulation film 190. In addition to the driving electrode TE, the sensing electrode RE, the first driving line TL1, the second driving line TL2, the sensing line RL, the guide lines GL1, GL2, GL3, GL4, GL5, and the ground lines GRL1, GRL2, and GRL3 may be arranged on the encapsulation film 190. That is, the driving electrode TE, the sensing electrode RE, the first driving line TL1, the second driving line TL2, the sensing line RL, the guide lines GL1, GL2, GL3, GL4, GL5, and the ground lines GRL1, GRL2, and GRL3 except the connection electrode BE may be arranged on the same layer and may be formed of the same material.

[0159] The driving electrode TE may include a first metal layer ML1 and a second metal layer ML2, respectively. The first metal layer ML1 is formed on the encapsulation film 190. The first metal layer ML1 is arranged to overlap with the pixel definition film 180, and does not overlap with the red sub-pixel R, the green sub-pixel G, and the blue sub-pixel B. The first metal layer ML1 may be formed using a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO), but is not limited thereto.

[0160] A first insulating film INS1 is formed on the first metal layer ML1 , and a first contact hole CT1 penetrating the first insulating film INS1 and exposing the first metal layer ML1 may be formed in the first insulating film INS1 .

[0161] A second metal layer ML2 is formed on the first insulating film INS1. The second metal layer ML2 is arranged to overlap with the pixel definition film 180, and does not overlap with the red sub-pixel R, the green sub-pixel G, and the blue sub-pixel B. The second metal layer ML2 can be connected to the first metal layer ML1 through the first contact hole CT1. The second metal layer ML2 can be formed using the same material as the first metal layer ML1. For example, the second metal layer ML2 can be formed using a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO), but is not limited thereto.

[0162] A second insulating film INS2 is formed on the second metal layer ML2 , and a second contact hole CT2 penetrating the second insulating film INS2 and exposing the second metal layer ML2 may be formed in the second insulating film INS2 .

[0163] The third insulating film INS3 is formed on the second insulating film INS2. The first insulating film INS1, the second insulating film INS2 and the third insulating film INS3 may be formed using an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer or an aluminum oxide layer.

[0164] according to Figure 6 and Figure 7 In the illustrated embodiment, the touch electrodes TE and RE are directly formed on the encapsulation film 190 , so the thickness of the display device 10 can be reduced compared to a case where a separate touch panel including the touch electrodes TE and RE is attached to the encapsulation film 190 .

[0165] And, according to Figure 6 and Figure 7 In the illustrated embodiment, the touch electrodes TE and RE are not only formed as grid-shaped electrodes, but also arranged to overlap with the pixel definition film 180. Therefore, it is possible to prevent the opening area of ​​the sub-pixels R, G, and B from being reduced. In addition, the parasitic capacitance between the touch electrodes TE and RE and the second electrode 174 can be reduced.

[0166] And, according to Figure 6 and Figure 7 In the illustrated embodiment, the touch electrodes TE and RE include a first metal layer ML1 and a second metal layer ML2, so that the thickness of the touch electrodes TE and RE can be increased. Therefore, the resistance of the touch electrodes TE and RE can be reduced. Therefore, the speed of charging the mutual capacitance by the driving signal can be increased without reducing the frequency of the driving signal, so that the touch sensitivity can be improved.

[0167] Reference Figure 6 and Fig. 9 , the pit PIT may not be formed on the pixel definition film 180. The pit PIT may be formed to have the same length as the length of each side of the adjacent sub-pixels R, G, and B. Since the pit PIT is formed at a predetermined distance from each sub-pixel R, G, and B, the pit PIT may not be formed in an area adjacent to each vertex of the sub-pixel.

[0168] The common organic layer 172 may form a common layer on the first electrode 171 and the pixel definition film 180. On the common organic layer 172, the organic light emitting layer 173 may be independently stacked for each sub-pixel R, G, and B. On the common organic layer 172 and the organic light emitting layer 173, the second electrode 174 may form a common layer. That is, by not including the pit PIT on the pixel definition film 180, the common organic layer 172 and the second electrode 174 may be formed uninterruptedly between adjacent sub-pixels R, G, and B, and electrons can move through the region.

[0169] Fig. 10A and Fig. 10B This is a graph showing changes in the electric field depending on the presence or absence of pits.

[0170] Reference Fig. 10A and Fig. 10B Regardless of whether the pits PIT exist on the pixel definition film 180, the highest electric field can be formed in the region where the organic light emitting layer 173 is formed. In addition, in the case where the pits PIT do not exist on the pixel definition film 180, an electric field above a predetermined level can be formed on the entire upper surface of the pixel definition film 180. At this time, a larger electric field can be formed in the region where the organic light emitting layer 173 is formed than in the upper surface region of the pixel definition film 180. On the contrary, in the case where the pits PIT exist on the pixel definition film 180, an electric field can be hardly formed in the region where the pits PIT are formed.

[0171] That is, holes can be accelerated or maintained by the electric field applied to both ends of the first electrode 171 and the second electrode 174 , so when the pixel definition film 180 includes the pit PIT, the number of holes moving to adjacent sub-pixels R, G, B can be reduced.

[0172] Fig.11A and Fig. 11B This is a graph showing the change in current density depending on the presence or absence of pits.

[0173] Reference Fig.11A and Fig. 11B Regardless of whether there is a pit PIT on the pixel definition film 180, the current density may be the largest in the region where the organic light emitting layer 173 is formed. In addition, in the case where there is no pit PIT on the pixel definition film 180, a current density above a predetermined level may be measured on the entire upper surface of the pixel definition film 180. At this time, the region where the organic light emitting layer 173 is formed may have a higher current density than the region on the upper surface of the pixel definition film 180. On the contrary, in the case where there is a pit PIT on the pixel definition film 180, the current density may be close to 0 in the region where the pit PIT is formed.

[0174] That is, the holes cannot move to the adjacent sub-pixels R, G, B due to the pits PIT formed on the pixel definition film 180, but stagnate in the area between the pits PIT and the organic light-emitting layer 173, thereby reducing the number of holes moving to the adjacent sub-pixels R, G, B.

[0175] In the following embodiment, the description of the same configuration as that of the previously described embodiment is omitted or simplified, and the description is mainly focused on the differences.

[0176] Fig. 12A and Fig. 12BIt is a diagram showing a modified example of the planar shape of the dimple.

[0177] Reference Fig. 12A ,and Figure 6 The difference of the rectangular-shaped pit PIT shown is that the pit PIT_a is a polygon having a curved surface curved along the edge of each sub-pixel R, G, B.

[0178] More specifically, the pits PIT_a may be arranged to surround the respective sub-pixels R, G, and B. For example, when the curved pits PIT_a are arranged along the vicinity of the respective vertices of the sub-pixels having a quadrilateral shape, the moving paths of holes moving to adjacent sub-pixels through the common organic layer 172 or the second electrode 174 can be increased.

[0179] Reference Fig. 12B ,and Figure 6 The difference from the structure in which the pits PIT are arranged only on the sides of the sub-pixels shown is that the pits PIT_b are additionally arranged in the vicinity of the vertices of the sub-pixels R, G, and B.

[0180] More specifically, the pits PIT_b may be arranged to surround each sub-pixel R, G, B. For example, a separate pit PIT_b is arranged in each side and each vertex vicinity of a sub-pixel having a quadrilateral shape, so that each sub-pixel may include a total of eight pits PIT_b. At this time, the size of the pits PIT_2b arranged in the vertex vicinity may be formed to be smaller than the size of the pits PIT_1b arranged in the vicinity of each side of the sub-pixel. As the number of pits PIT_b surrounding one sub-pixel increases, the amount of holes moving to adjacent sub-pixels through the common organic layer 172 or the second electrode 174 can be reduced.

[0181] Fig.13A and Fig. 13B It is a diagram showing a modified example of the cross-sectional shape of the dimple.

[0182] Reference Fig.13A and Fig. 13B ,and Figure 7 The difference of the pit PIT having a rectangular cross section is that the cross section of the pit PIT_c has an inverted triangle or an inverted trapezoid shape.

[0183] More specifically, refer to Fig.13A Since the inverted triangle-shaped pit PIT_c has no flat surface, it can be easily arranged even when the width of the pixel definition film 180 is relatively small. In addition, the common organic layer 172 and the second electrode 174 are hardly stacked on the flat surface, so it is possible to effectively prevent holes from moving through the common organic layer 172 and the second electrode 174.

[0184] Reference Fig. 13B , the side of the inverted trapezoidal pit PIT_d may have an inclination angle greater than 50° and less than 90°. As described above, the organic layer may be formed by a deposition process or a solution process. When the angle of the side PIT_S of the pit PIT is formed to be greater than about 50°, the common organic layer 172 may be substantially disconnected. Therefore, when the angle formed by the side of the pit PIT and the plane portion is designed to be greater than 50° and less than 90°, compared with the case Figure 7 As described above, the case where the angle formed by the side surface and the flat surface of the pit PIT is formed to be 90 degrees can be more advantageous in terms of the process.

[0185] Fig.14 It is shown Figure 5 An enlarged plan view of another example of region B. Fig.15 It is shown Fig.14 A cross-sectional view of an example of IV-IV'. Fig.16 It is an enlarged image Fig.15 Figure 2. Y portion of the graph.

[0186] Figures 14 to 16 and Figures 6 to 8 The difference of the structure in which a pair of pits PIT are arranged on the pixel definition film 180_1 is that a pair of spacers SPC are included on the pixel definition film 180_1.

[0187] More specifically, the light emitting element and the pixel definition film 180_1 are formed on the planarization film 160. The light emitting element may include a first electrode 171_1, a common organic layer 172_1, an organic light emitting layer 173_1, and a second electrode 174_1, respectively.

[0188] The first electrode 171_1 may be formed on the planarization film 160 . The first electrode 171_1 is connected to the drain electrode 124 of the thin film transistor 120 through a contact hole penetrating the protection film 150 and the planarization film 160 .

[0189] The pixel definition film 180_1 may be formed to divide the first electrode 171_1 on the planarization film 160 to play the role of a pixel definition film for defining sub-pixels R, G, and B. The pixel definition film 180_1 may be formed to cover the edge of the first electrode 171_1. The pixel definition film 180_1 may be formed using an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0190] A pair of protruding spacers SPC may be formed on the pixel definition film 180_1 .

[0191] Reference Fig.14 , the spacer SPC may be arranged to surround each sub-pixel R, G, B. According to one embodiment, a separate spacer SPC may be arranged on each side of a sub-pixel having a quadrilateral shape, so that each sub-pixel includes a total of four spacers SPC. Therefore, two spacers SPC may be arranged between two adjacent sub-pixels R, G, B.

[0192] The spacer SPC may be formed to have the same length as the length of each side of the adjacent sub-pixels R, G, B. Since the spacer SPC is formed to be spaced a predetermined distance from each sub-pixel R, G, B, the spacer SPC may not be formed in a region adjacent to each vertex of the sub-pixel.

[0193] exist Fig.14 In the embodiment, the case where each sub-pixel R, G, B includes four spacers SPC and the spacers SPC are rectangular in shape is described, but it is not limited to this. The number and shape of the spacers SPC formed by each sub-pixel R, G, B can be variously deformed and applied. FIG. 17A to FIG. 17C Provide detailed explanation.

[0194] Reference Fig.15 , a pair of spacers SPC may be formed on the pixel definition film 180_1. According to an embodiment, the spacer SPC may include an upper surface SPC_T formed parallel to the planarization film 160 and a side surface SPC_S extending in a direction perpendicular to the planarization film 160. At least a portion of the upper surface SPC_T may overlap with the driving electrode TE in the thickness direction. The height of the side surface SPC_S may be equivalent to about half of the height of the pixel definition film 180_1, but is not limited thereto.

[0195] Each sub-pixel R, G, and B represents a region where the first electrode 171_1, the common organic layer 172_1, the organic light-emitting layer 173_1, and the second electrode 174_1 are sequentially stacked so that holes from the first electrode 171_1 and electrons from the second electrode 174_1 are combined in the organic light-emitting layer 173_1 to emit light.

[0196] A common organic layer 172_1 is formed on the first electrode 171_1 and the pixel definition film 180_1. The common organic layer 172_1 may be a common layer formed on the first electrode 171_1 and the pixel definition film 180_1, and may include a hole injection layer and a hole transport layer. Since a p-type dopant with high conductivity is used in the hole injection layer, when adjacent sub-pixels are connected, it may become a main cause of side leakage current.

[0197] The common organic layer 172_1 may be formed by a deposition process or a solution process. In the case of being formed by a deposition process, it may be formed by an evaporation method. The step coverage characteristic of the film formed by the evaporation method is poor. Therefore, when the angle of the side SPC_S of the spacer SPC is formed to be greater than about 50°, the thickness of the common organic layer 172_1 at the side SPC_S of the spacer SPC may be formed to be thinner than the thickness of the common organic layer 172_1 at the inclined surface of the pixel definition film 180_1.

[0198] For example, when the side SPC_S of the spacer SPC protruding above the pixel definition film 180_1 is angled at 90°, the common organic layer 172_1 stacked on the upper surface of the pixel definition film 180_1 and the common organic layer 172_1 stacked on the side SPC_S of the spacer SPC may be disconnected.

[0199] When the common organic layer 172_1 is formed as a common layer between adjacent sub-pixels R, G, and B, it can become a moving path for holes. Fig.15 As shown, when the common organic layer 172_1 is formed to be disconnected from the side surface SPC_S of the spacer SPC on the upper surface of the pixel definition film 180_1, the holes of the blue sub-pixel B have their moving path cut off, and thus may have difficulty in moving to the adjacent green sub-pixel G. That is, the leakage path of the current can be minimized by the spacer SPC, so the influence of the leakage current through the common organic layer 172_1 on the adjacent pixels can be minimized.

[0200] An organic light-emitting layer 173_1 may be formed on the common organic layer 172_1. Unlike the common organic layer 172_1, the organic light-emitting layer 173_1 may be formed for each sub-pixel R, G, and B. The organic light-emitting layer 173_1 may include an organic substance and emit light of a predetermined color. In this case, the organic light-emitting layer 173_1 of the red sub-pixel R may emit red light, the organic light-emitting layer 173_1 of the green sub-pixel G may emit green light, and the organic light-emitting layer 173_1 of the blue sub-pixel B may emit blue light. Alternatively, the organic light-emitting layer 173_1 of the sub-pixels R, G, and B may emit white light, in which case the red sub-pixel R may further include a red color filter layer, the green sub-pixel G may further include a green color filter layer, and the blue sub-pixel B may further include a blue color filter layer.

[0201] The second electrode 174_1 is formed on the common organic layer 172_1 and the organic light emitting layer 173_1. The second electrode 174_1 may be formed to cover the common organic layer 172_1 and the organic light emitting layer 173_1. The second electrode 174_1 may be a common layer formed in common in the pixel P. Since holes can move through the second electrode 174_1, when adjacent sub-pixels are connected, it may become another cause of side leakage current. A capping layer may be formed on the second electrode 174_1.

[0202] The second electrode 174_1 is made of metal and has a characteristic of being randomly deposited due to the diffuse reflection characteristics of particles compared to organic matter, so that the coverage is good. However, when the angle of the side surface SPC_S of the spacer SPC protruding from the upper part of the pixel definition film 180_1 is formed to be 90°, the second electrode 174_1 stacked on the upper surface of the pixel definition film 180_1 and the second electrode 174_1 stacked on the side surface SPC_S of the spacer SPC can be disconnected.

[0203] When the second electrode 174_1 is formed as a common layer between adjacent sub-pixels R, G, and B, it can become a moving path for holes. Fig.16 As shown in FIG. 1 , when the second electrode 174_1 is formed to be disconnected on the upper surface of the pixel definition film 180_1 and the side surface SPC_S of the spacer SPC, the holes of the blue sub-pixel B may have difficulty in moving to the adjacent green sub-pixel G because the path through which they can move in a roundabout way is cut off. That is, the leakage path of the current can be minimized by the spacer SPC, so the influence of the leakage current through the second electrode 174_1 on the adjacent pixels can be minimized.

[0204] Reference Fig.14 and Fig.15, the spacer SPC may not be formed in a part of the area on the pixel definition film 180_1. For example, holes and electrons may be Fig.14 Specifically, the spacer SPC may be formed to have the same length as the length of each side of the adjacent sub-pixels R, G, and B. Since the spacer SPC is formed at a predetermined distance from each sub-pixel R, G, and B, the spacer SPC may not be formed in the area adjacent to each vertex of the sub-pixel.

[0205] The common organic layer 172_1 may form a common layer on the first electrode 171_1 and the pixel definition film 180_1. On the common organic layer 172_1, the organic light emitting layer 173_1 may be independently stacked for each sub-pixel R, G, B. On the common organic layer 172_1 and the organic light emitting layer 173_1, the second electrode 174_1 may form a common layer. That is, by not including the spacer SPC on the pixel definition film 180_1, the common organic layer 172_1 and the second electrode 174_1 may be formed uninterruptedly between adjacent sub-pixels R, G, B, and electrons can move through the region.

[0206] FIG. 17A to FIG. 17C It is a diagram showing a modified example of the cross-sectional shape of the spacer.

[0207] Reference FIG. 17A to FIG. 17C ,and Fig.15 The illustrated spacers SPC having a rectangular cross-section are different in that the cross-sections of the spacers SPC_a, SPC_b, and SPC_c are triangular, trapezoidal, or hammer-shaped.

[0208] More specifically, refer to Fig.17A Since the triangular spacer SPC_a has no upper surface, it can be easily arranged even when the width of the pixel definition film 180_1 is relatively small. Also, the common organic layer 172_1 and the second electrode 174_1 are hardly stacked on the upper surface, so that holes can be effectively prevented from moving through the common organic layer 172_1 and the second electrode 174_1.

[0209] Reference Fig. 17B , the side of the trapezoidal spacer SPC_b may have an inclination angle greater than 50° and less than 90°. As described above, the organic layer may be formed by a deposition process or a solution process. In the case where the angle of the side of the spacer SPC_b is formed to be greater than about 50°, substantial disconnection of the common organic layer 172_1 may occur. Therefore, in the case where the angle formed by the side of the spacer SPC_b and the pixel definition film 180_1 is designed to be greater than 50° and less than 90°, compared to the case where Fig.15As described above, the case where the angle formed by the side surface of the spacer SPC_b and the pixel definition film 180_1 is formed to be 90 degrees can be more advantageous in terms of the process.

[0210] Reference Fig. 17C , the upper diameter of the hammer-shaped spacer SPC_c can be larger than the lower diameter. The greater the diameter difference between the upper and lower parts of the spacer SPC_c, the more likely it is that the common organic layer 172_1 will have a part that cannot be deposited. The common organic layer 172_1 deposited after the formation of the spacer SPC_c has a strong straightness when deposited, so it is well deposited on the flat part, but on the side, especially when encountering a structure with a smaller diameter at the lower part than the upper part, an undeposited or partially interrupted separation portion is generated on the side. In addition, for the second electrode 174_1 provided on the upper part of the common organic layer 172_1 and the organic light-emitting layer 173_1, its component is metal, and relative to organic matter, it has the characteristic of randomly depositing due to the diffuse reflection characteristics of the particles, so that the coverage is good. However, when encountering the hammer-shaped spacer SPC_c, and the greater the difference between the upper and lower parts of the spacer SPC_c, the more likely it is that the second electrode 174_1 cannot be deposited.

[0211] Fig.18 It is shown Figure 5 An enlarged plan view of yet another example of region B. Fig.19 It is shown Fig.18 A cross-sectional view of an example of VI-VI'. Fig. 20 It is an enlarged image Fig.19 Figure 2. Z portion of the graph.

[0212] Figures 18 to 20 and Figures 6 to 8 The structure in which only a pair of pits PIT are arranged on the pixel definition film 180 and Figures 14 to 16 The difference from the structure in which only a pair of spacers SPC are arranged on the pixel definition film 180_1 is that a pair of pits PIT_1 and a pair of spacers SPC_1 are included on the pixel definition film 180_2.

[0213] More specifically, the light emitting element and the pixel definition film 180_2 are formed on the planarization film 160. The light emitting element may include a first electrode 171_2, a common organic layer 172_2, an organic light emitting layer 173_2, and a second electrode 174_2, respectively.

[0214] The first electrode 171_2 may be formed on the planarization film 160 . The first electrode 171_2 is connected to the drain electrode 124 of the thin film transistor 120 through a contact hole penetrating the protection film 150 and the planarization film 160 .

[0215] The pixel definition film 180_2 may be formed to divide the first electrode 171_2 on the planarization film 160 to play the role of a pixel definition film for defining sub-pixels R, G, and B. The pixel definition film 180_2 may be formed to cover the edge of the first electrode 171_2. The pixel definition film 180_2 may be formed using an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0216] A pair of recessed pits PIT_1 and a pair of protruding spacers SPC_1 may be continuously formed on the pixel definition film 180_2 .

[0217] Reference Fig.18 , the pits PIT_1 and the spacers SPC_1 may be arranged to surround each sub-pixel R, G, B. According to one embodiment, a separate pit PIT_1 and a spacer SPC_1 may be arranged on each side of a sub-pixel having a quadrilateral shape, so that each sub-pixel includes a total of four pits PIT_1 and four spacers SPC_1. Therefore, between two adjacent sub-pixels R, G, B, two pits PIT_1 and two spacers SPC_1 may be arranged respectively.

[0218] The pit PIT_1 and the spacer SPC_1 may be formed to have the same length as the length of each side of the adjacent sub-pixels R, G, B. Since the pit PIT_1 and the spacer SPC_1 are formed at a predetermined distance from each sub-pixel R, G, B, the pit PIT_1 and the spacer SPC_1 may not be formed in the area adjacent to each vertex of the sub-pixel.

[0219] like Fig.18 As shown, the area of ​​the pit PIT_1 may be formed to be smaller than the area of ​​the spacer SPC_1 . However, the present invention is not limited thereto, and the areas of the pit PIT_1 and the spacer SPC_1 may be variously applied according to the arrangement and size of the pixel definition film 180_2 .

[0220] exist Fig.18 In the embodiment, each sub-pixel R, G, B includes four pits PIT_1 and four spacers SPC_1, and the pits PIT_1 and the spacers SPC_1 are rectangular in shape. However, the invention is not limited thereto. The number and shape of the pits PIT_1 and the spacers SPC_1 formed by each sub-pixel R, G, B can be variously deformed and applied.

[0221] Reference Fig.19, on the pixel definition film 180_2, a pair of pits PIT_1 and a pair of spacers SPC_1 may be continuously formed. According to one embodiment, the pit PIT_1 may include a flat surface PIT_1B formed in parallel with the planarization film 160 and a side surface PIT_1S extending in a direction perpendicular to the planarization film 160. The spacer SPC_1 may include an upper surface SPC_1B formed in parallel with the planarization film 160 and a side surface SPC_1S extending in a direction perpendicular to the planarization film 160. At this time, one side of the side surface PIT_1S of the pit PIT_1 and one side of the side surface SPC_1S of the spacer SPC_1 may be aligned to form one side. At least a portion of the flat surface PIT_1B of the pit PIT_1 and / or the upper surface SPC_1B of the spacer SPC_1 may overlap with the driving electrode TE in the thickness direction. The height of the side surface PIT_1S of the pit PIT_1 and the side surface SPC_1S of the spacer SPC_1 may correspond to about half the height of the pixel definition film 180_2 , but is not limited thereto.

[0222] Each sub-pixel R, G, and B represents a region where the first electrode 171_2, the common organic layer 172_2, the organic light-emitting layer 173_2, and the second electrode 174_2 are sequentially stacked and holes from the first electrode 171_2 and electrons from the second electrode 174_2 are combined with each other in the organic light-emitting layer 173_2 to emit light.

[0223] A common organic layer 172_2 is formed on the first electrode 171_2 and the pixel definition film 180_2. The common organic layer 172_2 may be a common layer formed on the first electrode 171_2 and the pixel definition film 180_2, and may include a hole injection layer and a hole transport layer. Since a p-type dopant with high conductivity is used in the hole injection layer, when adjacent sub-pixels are connected, it may become a main cause of side leakage current.

[0224] The common organic layer 172_2 may be formed through a deposition process or a solution process. In the case of being formed through a deposition process, the common organic layer 172_2 may be formed through evaporation.

[0225] Reference Fig.19 and Fig. 20When the common organic layer 172_2 is formed to be disconnected once at the upper surface of the pixel definition film 180_2 and the right side surface PIT_1S of the pit PIT_1 and disconnected again at the left side surface PIT_1S of the pit PIT_1 and the upper surface SPC_1B of the spacer SPC_1, the holes of the blue sub-pixel B may be more difficult to move to the adjacent green sub-pixel G because the moving path is cut off. That is, the leakage path of the current can be minimized by the continuously formed pit PIT_1 and the spacer SPC_1, so the influence of the leakage current on the adjacent pixels through the common organic layer 172_2 can be minimized.

[0226] An organic light-emitting layer 173_2 may be formed on the common organic layer 172_2. The organic light-emitting layer 173_2 may be formed for each sub-pixel R, G, and B, differently from the common organic layer 172_2. The organic light-emitting layer 173_2 may include an organic substance and emit light of a predetermined color. In this case, the organic light-emitting layer 173_2 of the red sub-pixel R may emit red light, the organic light-emitting layer 173_2 of the green sub-pixel G may emit green light, and the organic light-emitting layer 173_2 of the blue sub-pixel B may emit blue light. Alternatively, the organic light-emitting layers 173_2 of the sub-pixels R, G, and B may emit white light, in which case the red sub-pixel R may further include a red color filter layer, the green sub-pixel G may further include a green color filter layer, and the blue sub-pixel B may further include a blue color filter layer.

[0227] The second electrode 174_2 is formed on the common organic layer 172_2 and the organic light emitting layer 173_2. The second electrode 174_2 may be formed to cover the common organic layer 172_2 and the organic light emitting layer 173_2. The second electrode 174_2 may be a common layer formed in the pixel P. Since holes can move through the second electrode 174_2, when adjacent sub-pixels are connected, it may become another cause of side leakage current. A capping layer may be formed on the second electrode 174_2.

[0228] The second electrode 174_2 is made of metal, which has a random deposition property due to the diffuse reflection property of particles compared to organic matter, so it has good coverage. When the second electrode 174_2 is formed as a common layer between adjacent sub-pixels R, G, and B, it can become a moving path for holes. Fig.19 and Fig. 20As shown, when the common organic layer 172_2 is formed to be disconnected once at the upper surface of the pixel definition film 180_2 and the right side surface PIT_1S of the pit PIT_1 and is disconnected again at the left side surface PIT_1S of the pit PIT_1 and the upper surface SPC_1B of the spacer SPC_1, the holes of the blue sub-pixel B may have difficulty in moving to the adjacent green sub-pixel G because the path through which they can move in a roundabout way is cut off. That is, the leakage path of the current can be minimized by means of the pit PIT_1 and the spacer SPC_1, so the influence of the leakage current on the adjacent pixels through the second electrode 174_2 can be minimized.

[0229] Reference Fig.18 and Fig.19 , the pit PIT_1 and the spacer SPC_1 may not be formed in a part of the area on the pixel definition film 180_2. Fig.18 Specifically, the pit PIT_1 and the spacer SPC_1 may be formed to have the same length as the length of each side of the adjacent sub-pixels R, G, and B. Since the pit PIT_1 and the spacer SPC_1 are formed at a predetermined distance from each sub-pixel R, G, and B, the pit PIT_1 and the spacer SPC_1 may not be formed in the area adjacent to each vertex of the sub-pixel.

[0230] Fig.21 It is shown Figure 7 A diagram showing the manufacturing process of an organic light-emitting display device.

[0231] Reference Fig.21 According to an embodiment of the present invention, a method for manufacturing an organic light-emitting display device may include the following steps: sequentially stacking an organic film 10 on a substrate SUB having a first electrode 171 formed thereon; forming an organic film pattern, wherein the organic film pattern includes a first region P1 having a first thickness, a second region P2 having a second thickness greater than the first thickness, and an opening OP exposing the first electrode 171.

[0232] Although not shown in the figure for the sake of convenience, the substrate SUB may include: a buffer film BF; an active layer 121 located on the buffer film BF in the transistor region; a gate electrode 122 insulated from the active layer 121; a gate insulating film 130 insulating the active layer 121 from the gate electrode 122; an interlayer insulating film 140 located on the gate electrode 122; a source electrode 123 / drain electrode 124 insulated from the gate electrode 122 and electrically connected to the active layer 121 through a contact hole; a protective film 150 located on the source electrode 123 / drain electrode 124; and a planarization film 160. In addition, a first electrode 171 located on the planarization film 160 is electrically connected to the drain electrode 124 through a contact hole.

[0233] Then, if Fig.21 As shown, a photosensitive organic film 10 is formed on the first electrode 171 and the planarization film 160. The organic film 10 may include at least one organic material selected from benzocyclobutene (BCB), polyimide (PI), polyamide (PA), acrylic resin, phenolic resin, and the like.

[0234] After that, a semi-transmission exposure process is performed (for example, using a halftone mask or a slit mask). In the following, the case where the photosensitive organic film 10 is formed using a photosensitive layer including a positive photosensitive material is used as an example for explanation, but the present invention is not limited thereto. In another embodiment, the photosensitive organic film 10 can also be formed using a photosensitive layer including a negative photosensitive material. At this time, the area where the photosensitive organic film 10 is to be removed, the area where the upper surface of the pixel definition film 180 is to be formed with the remaining photosensitive organic film 10, and the area where the pit PIT of the pixel definition film 180 is to be formed with the removal of the photosensitive organic film 10 are exposed to different degrees through the halftone mask or the slit mask.

[0235] That is, the halftone mask or slit mask includes a first transmission portion Ma that transmits 100% of light, a second transmission portion Mb that transmits light to an intermediate degree, and a third transmission portion Mc that transmits almost no light. The halftone mask or slit mask is arranged and exposed in such a manner that the first transmission portion Ma corresponds to a region where the organic film 10 is to be removed, the second transmission portion Mb corresponds to a region where the organic film 10 is to be removed by about half to form a pit PIT, and the third transmission portion Mc corresponds to a region where the organic film 10 is to remain to form the upper surface of the pixel definition film 180.

[0236] Then, for the portion exposed 100% by the first transmission portion Ma, the photosensitive organic film 10 is removed by development to expose the first electrode 171 at the bottom. Also, for the portion blocked 100% by the third transmission portion Mc, the photosensitive organic film 10 remains as it is, thereby having the upper surface morphology of the pixel definition film 180. Also, for the second transmission portion Mb region that transmits light at an intermediate level, the photosensitive organic film 10 remains at an intermediate level to form a pit PIT.

[0237] Although not shown in the figure for the sake of convenience, Figure 7 A light emitting element layer EML, a thin film encapsulation layer TFEL, and a touch sensor layer TSL may be sequentially formed on the first electrode 171 and the pixel definition film 180 formed through the above-mentioned processes.

[0238] Fig. 22 It is shown Fig.15 A diagram showing the manufacturing process of an organic light-emitting display device.

[0239] Reference Fig.15 and Fig. 22 ,and Figure 7 and Fig.21 The difference from the configuration in which the pixel definition film 180 includes a pair of pits PIT is that a pair of spacers SPC is included on the pixel definition film 180_1.

[0240] Specifically, refer to Fig. 22 , a semi-transmission exposure process is performed (for example, using a halftone mask or a slit mask). Hereinafter, the case where the photosensitive organic film 10 is formed using a photosensitive layer including a positive photosensitive material is used as an example for description, however, the present invention is not limited thereto, and in another embodiment, the photosensitive organic film 10 may also be formed using a photosensitive layer including a negative photosensitive material. At this time, the region where the photosensitive organic film 10 is to be removed, the region where the photosensitive organic film 10 remains and the upper surface of the pixel definition film 180_1 is to be formed, and the region where the spacer SPC is to be formed are exposed to different degrees through the halftone mask or the slit mask.

[0241] That is, the halftone mask or the slit mask includes a first transmission portion Ma that transmits 100% of light, a second transmission portion Mb that transmits light to an intermediate degree, and a third transmission portion Mc that transmits almost no light. The halftone mask or the slit mask is arranged and exposed in such a manner that the first transmission portion Ma corresponds to a region where the organic film 10 is to be removed, the second transmission portion Mb corresponds to a region where about half of the organic film 10 is left and the upper surface of the pixel definition film 180_1 is to be formed, and the third transmission portion Mc corresponds to a region where the organic film 10 remains and the spacer SPC is to be formed.

[0242] Then, for the portion exposed 100% by the first transmission part Ma, the photosensitive organic film 10 is removed by development to expose the first electrode 171_1 at the bottom. Also, for the portion blocked 100% by the third transmission part Mc, the photosensitive organic film 10 remains as it is, thereby having the form of the spacer SPC. Also, for the second transmission part Mb region that transmits light at an intermediate level, the photosensitive organic film 10 remains at an intermediate level to form the upper surface of the pixel definition film 180_1.

[0243] Fig.23 It is shown Fig.19 A diagram showing the manufacturing process of an organic light-emitting display device.

[0244] Reference Fig.19 and Fig.23 ,and Figure 7 and Fig.21 The pixel definition film 180 includes a pair of pits PIT and Fig.15 and Fig. 22 The difference from the configuration in which the pixel definition film 180_1 includes a pair of spacers SPC is that the pixel definition film 180_2 includes a pair of pits PIT_1 and a pair of spacers SPC_1 .

[0245] Specifically, refer to Fig.23 , a semi-transmission exposure process is performed (for example, using a halftone mask or a slit mask). In the following, the case where the photosensitive organic film 10 is formed using a photosensitive layer including a positive photosensitive material is used as an example for description, but the present invention is not limited thereto. In another embodiment, the photosensitive organic film 10 can also be formed using a photosensitive layer including a negative photosensitive material. At this time, the area where the photosensitive organic film 10 is to be removed, the area where the photosensitive organic film 10 remains and the pit PIT_1 is to be formed, the area on the upper surface of the pixel definition film 180_2 is to be formed, and the area where the spacer SPC_1 is to be formed are exposed to different degrees through the halftone mask or the slit mask.

[0246] That is, the half-tone mask or the slit mask includes a first transmission portion Ma that transmits 100% of light, a second transmission portion Mb that transmits light at an intermediate level, a third transmission portion Mc that transmits almost no light, and a fourth transmission portion Md that transmits light at an intermediate level between the first transmission portion Ma and the second transmission portion Mb. The half-tone mask or the slit mask is arranged and exposed in such a manner that the first transmission portion Ma corresponds to a region where the organic film 10 is to be removed, the second transmission portion Mb corresponds to a region where about half of the organic film 10 is left and the upper surface of the pixel definition film 180_2 is to be formed, the third transmission portion Mc corresponds to a region where the organic film 10 remains and the spacer SPC_1 is to be formed, and the fourth transmission portion Md corresponds to a region where the organic film 10 remains and the pit PIT_1 is to be formed.

[0247] Then, for the portion exposed 100% by the first transmission part Ma, the photosensitive organic film 10 is removed by development to expose the first electrode 171_2 at the bottom. Also, for the portion blocked 100% by the third transmission part Mc, the photosensitive organic film 10 remains as it is and has the form of the spacer SPC_1. Also, for the second transmission part Mb region that transmits light at an intermediate level, the photosensitive organic film 10 remains at an intermediate level to form the upper surface of the pixel definition film 180_2, and for the fourth transmission part Md region that transmits light at an intermediate level between the first transmission part Ma and the second transmission part Mb, the photosensitive organic film 10 remains at an intermediate level between the first transmission part Ma and the second transmission part Mb to form the pit PIT_1.

[0248] The above description is centered on the embodiments of the present invention, but this is only for example and is not intended to limit the present invention. A person with ordinary knowledge in the field to which the present invention belongs can know that various modifications and applications not illustrated above can be performed within the scope of the essential characteristics of the embodiments of the present invention. For example, each component that specifically appears in the embodiments of the present invention can be modified and implemented. Moreover, the differences in these modifications and applications should be interpreted as being included in the scope of the present invention specified in the claims.

Claims

1. A display device, comprising: A substrate including a plurality of pixels each having a light emitting portion and a non-light emitting portion; A first electrode, arranged on the light emitting portion; A pixel definition film is arranged at the edge of the first electrode and the non-light-emitting portion; A common organic layer, arranged on the first electrode and the pixel definition film; An organic light-emitting layer is arranged on the common organic layer and overlaps with the light-emitting portion; as well as A second electrode is arranged on the common organic layer and the organic light-emitting layer, The pixel definition film includes a plurality of pits between adjacent pixels. The common organic layer and the second electrode are disconnected in the pit, In the pit, the common organic layer and the second electrode are in contact with each other, In the pit, the common organic layer is not in contact with the organic light-emitting layer. In the pit, the second electrode is not in contact with the organic light emitting layer.

2. The display device according to claim 1, wherein: The common organic layer includes a hole injection layer and a hole transport layer.

3. The display device according to claim 1, wherein: The pit includes a flat surface parallel to the substrate and a side surface perpendicular to the substrate.

4. The display device according to claim 3, wherein: The common organic layer and the second electrode disposed on the side of the pit are thinner than the common organic layer and the second electrode disposed on the upper surface of the pixel definition film.

5. The display device according to claim 1, wherein: The first sub-pixels and the second sub-pixels of the pixel are alternately arranged along a first direction, and two third sub-pixels are arranged between the first sub-pixels and the second sub-pixels along a second direction perpendicular to the first direction, so that the pixel has a diamond shape.

6. The display device according to claim 5, wherein: The sizes of the first to third sub-pixels are different from each other.

7. The display device according to claim 6, wherein: The pit is formed separately from each side of the first to third sub-pixels at a predetermined distance.

8. The display device according to claim 7, wherein: The length of the pit is the same as the length of the side from the first sub-pixel to the third sub-pixel.

9. The display device according to claim 7, wherein: The pit is separately and additionally formed from each vertex of the first to third sub-pixels.

10. The display device according to claim 1, wherein: A thin film encapsulation layer is further included on the second electrode, and a touch sensor layer is arranged on the thin film encapsulation layer.

11. The display device according to claim 10, wherein: The touch sensor layer includes a drive electrode in a touch sensor area, at least a portion of the drive electrode overlapping the plurality of dimples.

12. The display device according to claim 10, wherein: The thin film encapsulation layer includes a first inorganic film, an organic film, and a second inorganic film, and the first inorganic film is in direct contact with the common organic layer and the disconnected side surface of the second electrode.

13. A display device, comprising: A substrate including a plurality of pixels each having a light emitting portion and a non-light emitting portion; A first electrode, arranged on the light emitting portion; A pixel definition film is arranged at the edge of the first electrode and the non-light-emitting portion; A common organic layer, arranged on the first electrode and the pixel definition film; An organic light-emitting layer is arranged on the common organic layer and overlaps with the light-emitting portion; as well as A second electrode is arranged on the common organic layer and the organic light-emitting layer, The pixel definition film includes a plurality of spacers between adjacent pixels. The common organic layer and the second electrode are disconnected from each other at the spacer. A space is provided between two adjacent spacers among the plurality of spacers, In the space, the common organic layer and the second electrode are in contact with each other, In the space, the common organic layer is not in contact with the organic light-emitting layer, In the space, the second electrode is not in contact with the organic light emitting layer.

14. The display device according to claim 13, wherein: The common organic layer includes a hole injection layer and a hole transport layer.

15. The display device according to claim 13, wherein: The spacer includes an upper surface parallel to the substrate and a side surface perpendicular to the substrate.

16. The display device according to claim 15, wherein: The common organic layer and the second electrode disposed on the side of the spacer are thinner than the common organic layer and the second electrode disposed on the upper surface of the pixel definition film.

17. The display device according to claim 13, wherein: The first sub-pixels and the second sub-pixels of the pixel are alternately arranged along a first direction, and two third sub-pixels are arranged between the first sub-pixels and the second sub-pixels along a second direction perpendicular to the first direction, so that the pixel has a diamond shape.

18. The display device according to claim 17, wherein: The sizes of the first to third sub-pixels are different from each other.

19. The display device according to claim 18, wherein: The spacer is separately formed at a predetermined distance from each side of the first to third sub-pixels.

20. The display device according to claim 19, wherein: The length of the spacer is the same as the length of the sides of the first to third sub-pixels.

Images