Heat dissipation structure of a head-mounted intelligent terminal

Abstract

The present invention discloses a heat dissipation structure for a head-mounted intelligent terminal. A cold plate is in contact with the top surface of the main chip on the internal PCB board of the product. The cold plate is internally provided with microchannels adapted to the flow of coolant. The left and right ends of the cold plate are respectively provided with left and right adapters connected to the microchannels, and are respectively connected to a micro pump and a heat dissipation component through hoses, jointly forming a heat dissipation structure adapted to the cyclic flow of coolant therein. Due to the adoption of a cold plate with microchannels and a corresponding water-cooling structure, taking advantage of the lower thermal resistance, a large amount of heat generated by the main chip during operation can be transferred to a local cold area that is difficult to achieve by conventional heat dissipation methods more quickly and efficiently. It effectively solves the defects such as the overheating of the main chip and the hot shell of the product in high-performance usage scenarios, significantly improves the user experience, and also effectively solves the problems such as the performance reduction and the shortened lifespan of the product caused by high temperature.

Description

Technical Field

[0001] The present invention relates to the field of head-mounted intelligent terminals, and particularly to a heat dissipation structure for a head-mounted AR or VR intelligent terminal. Background Art

[0002] To improve the functional experience of users with mobile intelligent terminal products, while major manufacturers are continuously developing various new functions and enhancing the performance of intelligent terminal products, they are also continuously thinning and compacting the product structure, which also poses a severe heat dissipation challenge to the products; with the advent of the 5G era, the rapidly increasing data processing tasks have further exacerbated the heat dissipation problem of intelligent terminal products.

[0003] The existing heat dissipation methods for intelligent terminal products generally use thermal interface materials, heat pipes or heat spreaders to conduct the heat of the chip to the outer shell, and use the outer shell and graphite sheets for heat dissipation and temperature equalization, and are then equipped with an overheat protection program to control the overall temperature of the mobile intelligent terminal products.

[0004] For some head-mounted intelligent terminal products with complex structures and irregular shapes such as AR / VR, due to their complex internal structures and their outer shells not being as regular as those of mobile phones, the existing conventional heat dissipation methods such as heat pipes, graphite sheets and heat spreaders are difficult to effectively diffuse the heat of the heat source to the outer shell for temperature equalization and heat dissipation; moreover, the outer shell materials of AR / VR products are usually plastics, and their thermal conductivity is also poor, and the heat generated by the chips is difficult to quickly dissipate through the plastic outer shell; even if a metal outer shell is used, its heat dissipation ability to the outside world is also very limited, which is very likely to cause the temperature of the chip to rise above the overheat point within a very short time, triggering the overheat protection program and triggering frequency reduction and frame dropping, and at the same time also bringing a poor sensory experience, thus seriously affecting the user experience.

[0005] There are also those that use fans for heat dissipation in the prior art. For example, in the patent document with the publication number CN205958846U and the theme name of a compact wireless VR / AR helmet, it adopts a heat dissipation structure with a fan and a heat pipe radiator. Although this heat dissipation method can well solve the heat dissipation problem of the product, there are still many problems such as noise and dust.

[0006] Therefore, the prior art still needs to be improved and developed. Summary of the Invention

[0007] To solve the above technical problems, the present invention provides a heat dissipation structure for a head-mounted intelligent terminal, which can effectively improve the heat dissipation efficiency and enhance the user experience; and has a compact structure, low noise, and is conducive to improving the dust and water protection level of the product.

[0008] The technical solution of the present invention is as follows: A heat dissipation structure for a head-mounted intelligent terminal, comprising a cold plate, a micro pump, a hose, a heat dissipation component, and a coolant; the cold plate is in contact with the top surface of the main chip on the internal PCB board of the head-mounted intelligent terminal, and a micro channel adapted for the flow of the coolant is provided inside the cold plate. Left and right adapters communicating with the micro channel are respectively provided at the left and right ends of the cold plate, and are respectively connected to the micro pump and the heat dissipation component through hoses, jointly forming a heat dissipation structure adapted for the coolant to circulate therein.

[0009] For the heat dissipation structure of the head-mounted intelligent terminal described above, wherein: the heat dissipation component is a transparent mask of the head-mounted intelligent terminal; the inside of the transparent mask is hollow and is used to be filled with the coolant; an inlet joint and an outlet joint communicating with its internal space are respectively provided on the outer side wall of the transparent mask facing the PCB board, and are used to be respectively connected to the micro pump and the cold plate through hoses.

[0010] For the heat dissipation structure of the head-mounted intelligent terminal described above, wherein: in the case of using one micro pump, the left adapter of the cold plate is connected to the water outlet end of the micro pump through a hose, the right adapter of the cold plate is connected to the inlet joint of the transparent mask through a hose, and the outlet joint of the transparent mask is connected to the water inlet end of the micro pump through a hose.

[0011] For the heat dissipation structure of the head-mounted intelligent terminal described above, wherein: the heat dissipation component is a rear radiator with fins on the outside, a pipe passing through all the fins is provided inside the rear radiator, and the left and right ends of the rear radiator are respectively the water inlet and the water outlet of the rear radiator; the rear radiator is connected to the rear part of the head-mounted intelligent terminal through a headband, and the hose is connected to the rear radiator along the headband.

[0012] For the heat dissipation structure of the head-mounted intelligent terminal described above, wherein: in the case of using one micro pump, the left adapter of the cold plate is connected to the water outlet end of the micro pump through a hose, the right adapter of the cold plate is connected to the water inlet of the rear radiator through a hose, and the water outlet of the rear radiator is connected to the water inlet end of the micro pump through a hose.

[0013] For the heat dissipation structure of the head-mounted intelligent terminal described above, wherein: a micro fan is additionally installed at the bottom or the top of the rear radiator.

[0014] For the heat dissipation structure of the head-mounted intelligent terminal described above, wherein: the cold plate is welded by an upper cover plate and a lower bottom plate both made of copper or aluminum, and micro grooves are uniformly distributed in the lower bottom plate.

[0015] For the heat dissipation structure of the head-mounted intelligent terminal described above, wherein: the thickness of the cold plate is between 0.3 and 0.8 mm, the width of the micro grooves is between 0.2 and 0.5 mm, and the depth of the micro grooves is between 0.1 and 0.6 mm.

[0016] For the heat dissipation structure of the head-mounted intelligent terminal described above, where: thermal paste is applied on the contact surface between the cold plate and the main chip.

[0017] For the heat dissipation structure of the head-mounted intelligent terminal described above, where: the flow rate of the micropump ≥ 20 ml / min, and the diameter of the hose is 3 - 5 mm.

[0018] For the heat dissipation structure of a head-mounted intelligent terminal provided by the present invention, due to the adoption of a cold plate with microchannels and a corresponding water-cooling structure, taking advantage of the lower thermal resistance, a large amount of heat generated by the main chip during operation can be transferred to a local cold area that is difficult to achieve by conventional heat dissipation methods more quickly and efficiently, effectively solving defects such as the main chip overheating and the shell getting hot in high-performance usage scenarios of head-mounted intelligent terminal products. While significantly improving the user experience, it also effectively solves problems such as performance degradation and shortened lifespan caused by high temperature in head-mounted intelligent terminal products. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are for illustrative purposes only and are not intended to limit the scope of the present invention disclosure in any way; the shapes and proportional dimensions of the components in the drawings are only schematic and are used to assist in understanding the present invention, rather than specifically defining the shapes and proportional dimensions of the components of the present invention; those skilled in the art can, under the teaching of the present invention, select various possible shapes and proportional dimensions according to specific circumstances to implement the present invention.

[0020] Figure 1 It is a schematic diagram of the composition of the core components of the heat dissipation structure of the head-mounted intelligent terminal of the present invention;

[0021] Figure 2 It is an exploded view of Embodiment 1 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention;

[0022] Figure 3 It is a top view (without the top cover state) of Embodiment 1 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention;

[0023] Figure 4 It is a transverse cross-sectional view of the transparent mask used in Embodiment 1 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention;

[0024] Figure 5 It is a longitudinal cross-sectional schematic diagram of the transparent mask used in Embodiment 1 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention;

[0025] Figure 6 It is an exploded view of Embodiment 2 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention;

[0026] Figure 7 It is a top view (without the top cover state) of Embodiment 2 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention;

[0027] Figure 8 It is the front view and enlarged sectional view of the rear radiator used in the second embodiment of the heat dissipation structure of the head-mounted intelligent terminal of the present invention;

[0028] Figure 9 It is the enlarged sectional view of the cold plate used in the first and second embodiments of the heat dissipation structure of the head-mounted intelligent terminal of the present invention;

[0029] Figure 10 It is the enlarged sectional view of the cold plate and the main chip used in the first and second embodiments of the heat dissipation structure of the head-mounted intelligent terminal of the present invention;

[0030] Summary of the reference numerals in the figure: PCB board 100, main chip 101, cold plate 110, upper cover plate 111, lower bottom plate 112, micro-grooves 112a, left turn joint 113, right turn joint 114, micro-pump 120, hose 130, heat dissipation component 140, top cover 210, outer shell 220, transparent mask 230, water inlet joint 231a, water outlet joint 231b, headband 240, rear radiator 250, fins 251, substrate 252, pipeline 252c, micro-fan 260. Specific embodiments

[0031] The following will combine the accompanying drawings to elaborate in detail on the specific embodiments and examples of the present invention. The specific embodiments described are only used to explain the present invention and are not used to limit the specific embodiments of the present invention.

[0032] AR (Augmented Reality, augmented reality) involved in this article is also known as augmented reality technology; augmented reality technology is a relatively new technical content that combines real-world information and virtual-world information content. It implements simulation processing on entity information that is relatively difficult to experience in the spatial range of the real world on the basis of computer and other science and technologies, superimposes and effectively applies virtual information content in the real world, and can be perceived by the human senses during this process, thereby realizing a sensory experience beyond reality; after the real environment and virtual objects overlap, they can exist simultaneously in the same picture and space.

[0033] The VR (Virtual Reality) involved in this article, also known as virtual environment technology, is a computer simulation system that can create and experience virtual worlds. It uses a computer to generate a simulated environment, enabling users to immerse themselves in that environment. Virtual reality technology utilizes data from real life, generates electronic signals through computer technology, and combines them with various output devices to transform them into phenomena that people can perceive. These phenomena can be real and tangible objects in reality or substances invisible to our naked eyes, presented through 3D models. Since these phenomena are not directly visible to us but are simulated by computer technology to represent the real world, it is called virtual reality.

[0034] As Figure 1 shown, Figure 1 is a schematic diagram of the composition of the core components of the heat dissipation structure of the head-mounted intelligent terminal of the present invention. The heat dissipation structure of the head-mounted intelligent terminal mainly consists of a cold plate 110, a micropump 120, a hose 130, a heat dissipation component 140, and a coolant. The cold plate 110 covers the main chip 101 of the internal PCB board 100 of the head-mounted intelligent terminal product and is in contact with the top surface of the main chip 101. A microchannel (not shown in the figure) suitable for the flow of the coolant is provided inside the cold plate 110. The left end (i.e., the water inlet end) of the cold plate 110 is connected to the water outlet end of the micropump 120 through a hose 130 communicating with the microchannel. The water inlet end of the micropump 120 is connected to the water outlet end of the heat dissipation component 140. The right end (i.e., the water outlet end) of the cold plate 110 is connected to the water inlet end of the heat dissipation component 140 through a hose 130 communicating with the microchannel, jointly forming a heat dissipation structure suitable for the coolant to circulate therein.

[0035] The cold plate 110 is in contact with the main chip 101. The heat generated by the main chip 101 during operation is transferred to the coolant in the microchannel through the cold plate 110. The heated coolant flows through the hose 130 to the heat dissipation component 140 under the drive of the micropump 120 and transfers the heat to the heat dissipation component 140. The heat dissipation component 140 dissipates the heat into the air through air convection and thermal radiation. As the temperature of the coolant decreases, it is driven by the micropump 120 to the cold plate 110 again, repeating this process to continuously dissipate heat and cool down the main chip 101.

[0036] Because under the same volume flow rate, the heat removal capacity of water is 3700 times that of air, water cooling can remove heat with a smaller volume and temperature rise than air cooling; and for the heat dissipation structure of the head-mounted intelligent terminal of the present invention, due to the adoption of the cold plate 110 with microchannels and the corresponding water cooling structure, it has a lower thermal resistance, can transfer the heat generated by the main chip 101 during operation to the liquid working medium more quickly and efficiently, thereby ensuring the normal operation of the main chip 101 and improving the comfort of the part of the outer shell in contact with the human body around the main chip 101.

[0037] Compared with the natural heat dissipation method in the prior art, under the same heat consumption and the same temperature, the volume of the head-mounted intelligent terminal product of the present invention can be designed to be smaller, so that the entire intelligent terminal product can achieve the effects of being structurally compact and lightweight.

[0038] When compared with the air-cooled heat dissipation method in the prior art, the heat dissipation structure of the head-mounted intelligent terminal of the present invention also has the advantages of low noise, no need to open holes in the outer shell, and can achieve a higher level of dust and water protection.

[0039] Preferably, the heat dissipation component 140 can be a part of the structure of the head-mounted intelligent terminal product, such as the top cover of the outer shell part, or a transparent mask, which can make the product structure more compact and lightweight, and can avoid opening ventilation holes, which is beneficial for the product to achieve a higher level of dust and water protection; of course, the heat dissipation component 140 can also be an additional radiator component.

[0040] Embodiment 1. Combine Figure 2 and 3 as shown, Figure 2 is an exploded view of Embodiment 1 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention, Figure 3 is a top view (without the top cover state) of Embodiment 1 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention; the head-mounted intelligent terminal includes a top cover 210, an outer shell 220, a PCB board 100 and a transparent mask 230, and a main chip 101 is arranged on the PCB board 100; the PCB board 100 is horizontally placed in the upper middle part of the outer shell 220, and the micro pump 120 is fixed at the left end in the outer shell 220; the transparent mask 230 is located on the front side wall of the outer shell 220, and both the water inlet joint 231a and the water outlet joint 231b of the transparent mask 230 are located in the outer shell 220; the cold plate 110 is located above the main chip 101 of the PCB board 100, and the bottom surface of the cold plate 110 is in contact with the top surface of the main chip 101 for heat conduction.

[0041] In Embodiment 1, Figure 1 the heat dissipation component 140 is the transparent mask 230 of the head-mounted intelligent terminal; the inside of the transparent mask 230 is hollow and is used to be filled with a coolant; combine Figure 4 as shown, Figure 4FIG. 0 is a transverse cross-sectional view of the transparent mask used in the first embodiment of the heat dissipation structure of the head-mounted intelligent terminal of the present invention. An inlet joint 231a and an outlet joint 231b communicating with its internal space are respectively provided on the outer side wall of the transparent mask 230 facing the PCB board 100. The inlet joint 231a of the transparent mask 230 is connected to the outlet end of the cold plate 110 through a hose 130. The inlet end of the cold plate 110 is connected to the outlet end of the micropump 120 through a hose 130. The inlet end of the micropump 120 is connected to the outlet joint 231b of the transparent mask 230 through a hose 130.

[0042] In the specific implementation process, the transparent mask 230 is in the shape of a hollow plate (it can also be a serpentine groove liquid path, and the hollow plate is taken as an example in this embodiment), and the material is a high light transmittance material such as PMMA. The overall thickness of the transparent mask 230 is 1.8 - 2.5 mm, and the wall thickness is 0.5 - 1 mm; combined Figure 5 as shown Figure 5 FIG. 7 is a longitudinal sectional schematic view of the transparent mask used in the first embodiment of the heat dissipation structure of the head-mounted intelligent terminal of the present invention; it is divided into an inner plate 231 and an outer plate 232. The inlet joint 231a and the outlet joint 231b are located on the inner plate 231. The inner plate 231 and the outer plate 232 are bonded together by pressing or other fixing processes. The transparent mask 230 is filled with a coolant (or the serpentine groove liquid path is filled with a coolant).

[0043] The advantages of the first embodiment are that it can quickly and efficiently transfer a large amount of heat generated when the main chip 101 works to a large-area mask area that is difficult to achieve by conventional heat dissipation methods. While reducing the temperature of the main chip 101, the overall temperature of the outer surface of the housing 220 will also decrease, thereby improving the comfort and user experience of the contact part with the human body; at the same time, by reasonably using the micropump 120, the water-cooled heat dissipation system of the first embodiment can provide an additional heat dissipation capacity of more than 4W, making the structure of the head-mounted intelligent terminal product lighter, more compact, and achieving the purpose of being thin and light.

[0044] Embodiment Two, combined Figure 6 with 7 as shown Figure 6 FIG. 19 is an exploded view of the second embodiment of the heat dissipation structure of the head-mounted intelligent terminal of the present invention, Figure 7It is the top view (without the top cover state) of the second embodiment of the heat dissipation structure of the head-mounted intelligent terminal of the present invention; the head-mounted intelligent terminal includes a top cover 210, a housing 220, a PCB board 100, a transparent mask 230, and a headband 240; different from the first embodiment, the rear radiator 250 is connected to the rear part of the head-mounted intelligent terminal via the headband 240; the rear radiator 250 is composed of fins 251 and a substrate 252, and the materials of the fins 251 and the substrate 252 can both be made of aluminum alloy or magnesium alloy or other high thermal conductivity lightweight metals. The fins 251 are welded to the substrate 252, and the substrate 252 is connected to the headband 240.

[0045] To further improve the heat dissipation effect of the second embodiment, a micro fan 260 can be added at the bottom or top of the rear radiator 250 according to the magnitude of the heat dissipation power. When the micro fan 260 is located at the bottom of the fins 251, it blows air towards the fins 251 (i.e., the state shown in the figure). When the micro fan 260 is located at the top of the fins 251, it extracts air from the gaps between the fins 251 to further improve the heat dissipation efficiency; specifically, the micro fan 260 can preferably be an axial flow fan, with a length and width dimension of 25 - 40 mm, a thickness dimension of 3 - 4 mm, an air volume of 0.01 - 0.02 m 3 / min, and the noise ≤ 25 dB @ 0.3 m (@0.3 m represents within a space range of 0.3 meters).

[0046] In the second embodiment, Figure 1 the heat dissipation component 140 therein is the rear radiator 250 with fins 251 on the outside. Combining Figure 8 as shown, Figure 8 are the main view and the enlarged sectional view of the rear radiator used in the second embodiment of the heat dissipation structure of the head-mounted intelligent terminal of the present invention. (a) is the enlarged main view, and (b) is the enlarged sectional view A - A in the main view; a pipe 252c running through all the fins 251 is horizontally arranged inside the substrate 252 of the rear radiator 250. The left and right ends of the pipe 252c are respectively the water inlet and the water outlet of the rear radiator 250; the water inlet of the rear radiator 250 is connected to the water outlet end of the cold plate 110 via a hose 130 along the headband 240. The water inlet end of the cold plate 110 is connected to the water outlet end of the micro pump 120 via a hose 130. The water inlet end of the micro pump 120 is connected to the water outlet of the rear radiator 250 via a hose 130 along the headband 240.

[0047] The advantages of the second embodiment are as follows: it can quickly and efficiently transfer a large amount of heat generated when the main chip 101 is working to the rear radiator 250, ensuring the normal operation of the main chip 101 and the comfort of the contact part with the human body; at the same time, by reasonably using the micropump 120, the water-cooled heat dissipation system of the second embodiment can also provide an additional heat dissipation capacity of more than 4W, which can meet the heat dissipation requirements of most head-mounted intelligent terminal products, making the main part of the product structure more compact and lightweight; in addition, due to the certain weight of the rear radiator 250, the overall front-back weight balance of the product is also achieved, reducing the discomfort of the wearer caused by the excessive weight of the main part dragging down the forehead part.

[0048] In the specific implementation process, the fins 251 of the rear radiator 250 are preferably arranged in the vertical direction to improve the air flow and facilitate convective heat dissipation.

[0049] In the above two embodiments, multiple micropumps 120 can also be set to ensure sufficient driving force; and the arrangement, combination, and manifestation forms of each component are not limited to the above two embodiments; any other changes, modifications, substitutions, combinations, and simplifications made without departing from the spirit and principle of the present invention should be regarded as equivalent replacement methods and should fall within the protection scope of the present invention.

[0050] In the specific implementation manner of the heat dissipation structure of the head-mounted intelligent terminal of the present invention, specifically, the length and width dimensions of the micropump 120 are both ≤ 30mm, the thickness dimension is ≤ 8mm, the flow rate is ≥ 20ml / min, and the noise is ≤ 25dB@0.3m (@0.3m represents within a space range of 0.3 meters); the type of the micropump 120 can be a piezoelectric micropump, a shape memory alloy micropump, or other types of micropumps; the coolant can be deionized water, ethylene glycol, or other high specific heat capacity, low viscosity, non-toxic, and non-corrosive liquid working media; the liquid path is filled with coolant; considering the overall weight and convenience of the product, the material of the hose 130 can be flexible PVC, soft silicone, or other flexible materials, and the diameter of the hose 130 is between 3 and 5mm.

[0051] Combined Figure 9 shown Figure 9 is an enlarged cross-sectional view of the cold plate used in the first and second embodiments of the heat dissipation structure of the head-mounted intelligent terminal of the present invention; the cold plate 110 is welded by an upper cover plate 111 and a lower bottom plate 112, and the materials of the upper cover plate 111 and the lower bottom plate 112 are both copper or aluminum, or other materials with good thermal conductivity, and the welding method can be brazing, diffusion welding, solder paste welding, or other forms of welding and fixing methods; and the lower bottom plate 112 is evenly distributed with micro-grooves 112a, which together with the upper cover plate 111 form the micro-channels inside the cold plate 110.

[0052] Specifically, the thickness H of the cold plate 110 is between 0.3 and 0.8 mm, the width W of the micro groove 112 a is between 0.2 and 0.5 mm, and the depth of the micro groove 112 a is between 0.1 and 0.6 mm.

[0053] Combination Figure 10 As shown, Figure 10 It is an enlarged cross-sectional view of the cold plate and the main chip used in the first and second embodiments of the heat dissipation structure of the head-mounted intelligent terminal of the present invention; thermal conductive paste is applied on the contact surface between the cold plate 110 and the main chip 101 on the PCB board 100 to reduce the contact thermal resistance.

[0054] In the above two embodiments, in order to improve the process rationality of the cold plate 110, it is better that a left rotating joint 113 and a right rotating joint 114 connected to the microchannel are respectively provided at the left and right ends of the cold plate 110, and the left and right rotating joints (113 and 114) can be made by precision die-casting, injection molding, 3D printing or other technical methods. The consolidation between the left and right rotating joints (113 and 114) and the two ends of the cold plate 110 can be welded, or can be glued or other forms of bonding.

[0055] It should be understood that the above description is only a preferred embodiment of the present invention and is not sufficient to limit the technical solution of the present invention. For ordinary technicians in this field, within the spirit and principles of the present invention, additions, substitutions, changes or improvements can be made according to the above description, and all these additions, substitutions, changes or improved technical solutions should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A heat dissipation structure of a head-mounted intelligent terminal, characterized in that, It includes a cold plate, a micropump, a hose, a heat dissipation component and a coolant; the cold plate is in contact with the top surface of the main chip on the internal PCB board of the head-mounted smart terminal, and a microchannel adapted for the flow of the coolant is provided inside the cold plate. Left and right adapters connected to the microchannel are respectively provided at the left and right ends of the cold plate, and are respectively connected to the micropump and the heat dissipation component through hoses, jointly forming a heat dissipation structure adapted for the coolant to circulate therein. The heat dissipation component is a transparent mask of the head-mounted smart terminal; the inside of the transparent mask is hollow and used to be filled with the coolant; an inlet joint and an outlet joint communicating with its internal space are respectively provided on the outer side wall of the transparent mask facing the PCB board, and are respectively connected to the micropump and the cold plate through hoses. The transparent mask is made of PMMA high light transmittance material, which is divided into an inner plate and an outer plate. The inlet joint and the outlet joint are located on the inner plate, and the inner plate and the outer plate are bonded together to make the inside of the transparent mask filled with the coolant. The transparent mask is located on the front side wall of the housing of the head-mounted smart terminal, transferring a large amount of heat generated when the main chip works to a large-area mask area, while reducing the temperature of the main chip and also lowering the overall temperature of the outer surface of the housing; at the same time, by reasonably using the micropump, the water-cooling heat dissipation can provide an additional heat dissipation capacity of more than 4W.

2. The heat dissipation structure of the head-mounted intelligent terminal according to claim 1, wherein: In the case of using one micropump, the left adapter of the cold plate is connected to the water outlet end of the micropump through a hose, the right adapter of the cold plate is connected to the inlet joint of the transparent mask through a hose, and the outlet joint of the transparent mask is connected to the water inlet end of the micropump through a hose.

3. The heat dissipation structure of the head-mounted intelligent terminal according to claim 1, characterized in that: The cold plate is welded by an upper cover plate and a lower bottom plate both made of copper or aluminum, and microgrooves are evenly distributed in the lower bottom plate.

4. The heat dissipation structure of the head-mounted intelligent terminal according to claim 1, wherein: The thickness of the cold plate is between 0.3 and 0.8 mm, the width of the microgrooves is between 0.2 and 0.5 mm, and the depth of the microgrooves is between 0.1 and 0.6 mm.

5. The heat dissipation structure of the head-mounted intelligent terminal according to claim 1, wherein: Thermal paste is applied on the contact surface between the cold plate and the main chip.

6. The heat dissipation structure of the head-mounted intelligent terminal according to claim 1, wherein: The flow rate of the micropump is ≥20 ml / min, and the diameter of the hose is 3 - 5 mm.

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