Electronic devices including biometric sensors

Abstract

An electronic device is provided. The electronic device includes: a transparent member comprising a transparent material; a display panel disposed below the transparent member and including a plurality of pixels; a biometric sensor disposed below the display panel; and a filter disposed between the display panel and the biometric sensor and covering the biometric sensor.

Description

Technical Field

[0001] This disclosure relates to an apparatus including a biometric sensor for sensing a user's biometric information. Background Technology

[0002] Recently, technologies have been developed to perform user authentication using biometric information (such as fingerprints, irises, etc.) obtained through biometric sensors. Based on the method of obtaining fingerprint information, biometric sensors used for fingerprint recognition can be classified into optical, ultrasonic, and capacitive types.

[0003] The above information is provided as background information and is intended to aid in understanding this disclosure. There is no determination or assertion as to whether any of the above content is applicable to prior art relating to this disclosure. Summary of the Invention

[0004] Technical issues

[0005] Optical sensors must maintain a constant distance between the display and the sensor, and foreign objects (such as dust) must be prevented from being introduced between them. However, the distance between the display and the biometric sensor may change due to external shocks or aging during the use of electronic devices, or the sensor's performance may be degraded due to foreign objects introduced between the display and the sensor.

[0006] The embodiments of this disclosure at least address the aforementioned problems and / or disadvantages, and provide at least the following advantages. Therefore, one aspect of this disclosure is to provide a biometric sensor having a structure for stably maintaining a distance between a display and a sensor to prevent and / or reduce the introduction of foreign objects between the display and the sensor, and an apparatus including the biometric sensor.

[0007] Technical solution

[0008] According to one aspect of this disclosure, an electronic device is provided. The electronic device may include: a transparent member comprising a transparent material; a display panel disposed below the transparent member and including a plurality of pixels; a biometric sensor disposed below the display panel; and a filter disposed between the display panel and the biometric sensor to cover the biometric sensor.

[0009] According to another aspect of this disclosure, an electronic device is provided. The electronic device may include: a display including a panel layer and a support layer configured to support the panel layer; a transparent member including a transparent material disposed on the panel layer; a biometric sensor module including a biometric sensor disposed below the support layer; and a processor electrically connected to the panel layer and the biometric sensor module and configured to control the electronic device to obtain biometric information using the biometric sensor module. The biometric sensor module may include: a circuit board; a sensor housing having one side disposed below the support layer and another side disposed on the circuit board, and having one side forming an opening, wherein the biometric sensor is disposed in the sensor housing and on the circuit board; an optical layer disposed on the biometric sensor; and an optical filter disposed in the opening.

[0010] According to various embodiments of this disclosure, the electronic device can stably maintain the distance between the display and the sensor to prevent and / or reduce the introduction of foreign objects between the display and the sensor, thereby preventing degradation of the sensor's performance.

[0011] Other aspects, advantages, and salient features of this disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of this disclosure, which is disclosed in conjunction with the accompanying drawings.

[0012] Beneficial effects

[0013] According to various embodiments of this disclosure, the electronic device can stably maintain the distance between the display and the sensor to prevent and / or reduce the introduction of foreign objects between the display and the sensor, thereby preventing degradation of the sensor's performance.

[0014] Other aspects, advantages, and salient features of this disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of this disclosure, which is disclosed in conjunction with the accompanying drawings. Attached Figure Description

[0015] The above and other aspects, features and advantages of certain embodiments of this disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0016] Figure 1 This is a block diagram illustrating example electronic devices in a network environment according to various embodiments;

[0017] Figure 2 This is a diagram showing the appearance of an example electronic device according to one embodiment;

[0018] Figure 3 This is an exploded perspective view showing an example electronic device according to one embodiment;

[0019] Figure 4a and Figure 4bThis is a cross-sectional view illustrating an example electronic device according to various embodiments;

[0020] Figure 5a , Figure 5b and Figure 5c This is a cross-sectional view illustrating an example package structure of a biometric sensor module according to various embodiments; and

[0021] Figure 6a , Figure 6b and Figure 6c This is a cross-sectional view showing an example electronic device according to various embodiments. Detailed Implementation

[0022] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. (Refer to...) Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input device 150, sound output device 155, display device 160, audio module 170, sensor module 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of these components (e.g., display device 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device 160 (e.g., a display).

[0023] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) and an auxiliary processor 123 (e.g., graphics processing unit (GPU), image signal processor (ISP), sensor hub processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. Additionally or alternatively, auxiliary processor 123 may be adapted to consume less power than main processor 121, or adapted for a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or it can be implemented as part of the main processor 121.

[0024] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 may control at least some of the functions or states associated with at least one component of the electronic device 101 (other than the main processor 121) (e.g., display device 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display device 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123.

[0025] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0026] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0027] Input device 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input device 150 may include, for example, a microphone, mouse, or keyboard.

[0028] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0029] Display device 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display device 160 may include touch circuitry adapted to detect touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of the force caused by touch.

[0030] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0031] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0032] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0033] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0035] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0036] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0037] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0038] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0039] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., external electronic device). According to embodiments, antenna module 197 may include one or more antennas, and therefore, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and external electronic device via the selected at least one antenna.

[0040] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0041] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 and electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, either with further processing or without further processing. For this purpose, technologies such as cloud computing, distributed computing, or client-server computing may be used.

[0042] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0043] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0044] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and is used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0045] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0046] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0047] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0048] Figure 2 This is a diagram showing the appearance of an example electronic device according to one embodiment.

[0049] Reference Figure 2 According to one embodiment, the display (or display panel) 210 and the housing 220 may be exposed to the electronic device 201 (e.g., Figure 1 The electronic device 201 may be located on the front surface of the display 210. According to one embodiment, the electronic device 201 may include various hardware modules not shown. For example, a pressure sensor that senses the intensity (pressure) of a user's touch input and / or a biometric sensor that detects a user's fingerprint may be located on the rear surface of the display 210.

[0050] According to one embodiment, the electronic device 201 can detect a user's fingerprint via a second area 212 of the display 210. For this purpose, a biometric sensor for detecting fingerprints can be disposed on the rear surface of the second area 212 of the display 210.

[0051] According to various embodiments of this disclosure, although the biometric sensor is disposed on the rear surface of the display 210, it may provide a sensor encapsulation structure that is able to maintain an appropriate distance from the display 210 to accurately obtain information about the user's fingerprint and prevent and / or reduce performance degradation due to the introduction of foreign objects outside the biometric sensor.

[0052] exist Figure 2 In this context, the electronic device 201 is merely illustrative and is not limited to the examples described above. For instance, a receiver, camera module, iris sensor, other biometric sensors, etc., may be disposed on the rear surface of the display 210.

[0053] Figure 3 This is an exploded perspective view showing an example electronic device according to one embodiment.

[0054] Reference Figure 3 Electronic device 301 (e.g.) Figure 1 Electronic device 101 or Figure 2 The electronic device 301 may include a transparent member 310 (e.g., a cover glass), a display device 320, a support member (e.g., a support) 330, a circuit board 340, a side member 350, a battery 360, and / or a back cover 370. According to various embodiments, the electronic device 301 may not include... Figure 3 Some of the components shown, and may further include Figure 3 Components not shown in the diagram.

[0055] According to one embodiment, the transparent member 310 (e.g., a first plate comprising a transparent material such as a cover glass) can transmit light generated by the display device 320. For example, a user can touch the transparent member 310 with a part of his or her body (e.g., a finger) to provide touch input (including touch using an electronic pen) to the electronic device 301. The transparent member 310 can be formed of various transparent materials (such as, but not limited to, tempered glass, reinforced plastics, flexible polymer materials, etc.) to protect the display device 320 and the configuration included in the electronic device 301 from external impacts. According to various embodiments, the transparent member 310 may be referred to as a glass window or cover glass.

[0056] According to one embodiment, the display device 320 may be disposed in the space between the transparent member 310 (e.g., the first plate) and the rear cover 370 (e.g., the second plate). The display device 320 may be arranged or integrated below, for example, the transparent member 310, and may be exposed through at least a portion of the transparent member 310. The display device 320 may output content (e.g., text, images, videos, icons, widgets, symbols, etc.) and / or may receive input from a user (e.g., touch input or electronic pen input).

[0057] According to one embodiment, the display device 320 may include, for example, but not limited to, a display panel, a touch sensor, and / or an electronic pen sensor. The display panel may include, for example, but not limited to, a liquid crystal display (LCD) panel, a light-emitting diode (LED) display panel, an organic LED (OLED) display panel, a microelectromechanical system (MEMS) display panel, an electronic paper display panel, and one or more of the following. The touch sensor may include, for example, but not limited to, a capacitive touch panel, a resistive touch panel, an infrared touch panel, an ultrasonic touch panel, and the like. The touch panel may be inserted between display panels (add-on touch panel), may be directly formed on the display panel (on-cell touch panel), or may be included in the display panel (in-cell touch panel). The electronic pen sensor (e.g., a digitizer) can detect touches, gestures, hovers, etc., from an electronic pen. According to one embodiment, the display device 320 may include a biometric sensor module (e.g., a fingerprint sensor module) for obtaining the user's biometric information (e.g., a fingerprint).

[0058] According to one embodiment, the display device 320 may include a planar region 321 and a curved region 322 extending from one side (e.g., the top, bottom, left, or right side) of the planar region 321. Pixels of the display panel (e.g., OLED), conductive patterns of touch sensors, conductive patterns of electronic pen sensors, etc., may be disposed on the planar region 321. The curved region 322 may be electrically connected to a flexible printed circuit board (FPCB) 325 via various conductive patterns (wiring), and the flexible printed circuit board (FPCB) 325 may be located on the rear surface of the display device 320.

[0059] According to one embodiment, a portion of the curved region 322 may be curved toward the rear surface of the planar region 321. According to various embodiments, wiring of the FPCB 325 may pass through one side of the support member (support) 330 and may be electrically connected to the circuit board 340 (e.g., main circuit board 340m) via designated connectors. According to various embodiments, similar to the planar region 321, pixels for displaying various information may be arranged on the curved region 322.

[0060] According to one embodiment, the support member 330 (e.g., a bracket) may include, for example, but not limited to, a metal material, a polymer material, etc. The support member 330 may be disposed, for example, between the display device 320 and the circuit board 340. The support member 330 may be combined with the display device 320 and the circuit board 340 to physically support them. According to one embodiment, a bulge gap for accommodating the expansion of the battery 360 may be formed in the support member 330.

[0061] According to one embodiment, circuit board 340 may include, for example, a main circuit board 340m and / or sub-circuit boards 340s. According to one embodiment, the main circuit board 340m and sub-circuit boards 340s may be disposed under a support member 330 and may be electrically connected to each other via designated connectors or designated wiring. Each of circuit boards 340m and 340s may be implemented as, for example, but not limited to, a rigid PCB (RPCB) and / or an unrigidified PCB. According to one embodiment, various electronic components, devices, printed circuits, etc. (e.g., processors, memory, communication modules (e.g., wireless communication circuits)) of electronic device 301 may be mounted or arranged on circuit boards 340m and 340s. According to various embodiments, each of circuit boards 340m and 340s may be referred to as a motherboard or printed circuit board assembly (PBA), or simply as a PCB.

[0062] According to one embodiment, a side member 350 may be disposed between a circuit board 340 and a rear cover 370 and receive components of an electronic device 301. The side member 350 may be coupled to, for example, a support member 330 of the electronic device 301 and / or the rear cover 370. The side member 350 may surround the space between a transparent member 310 (e.g., a first plate) and the rear cover 370 (e.g., a second plate).

[0063] According to one embodiment, the battery 360 can convert chemical energy and electrical energy in various ways, for example. For instance, the battery 360 can convert chemical energy into electrical energy and supply the electrical energy to the display device 320 and various components or modules mounted on the circuit board 340. As another example, the battery 360 can convert electrical energy supplied from an external source into chemical energy and can store this chemical energy. According to one embodiment, a power management module for managing the charging and discharging of the battery 360 can be included in the circuit board 340.

[0064] According to one embodiment, a rear cover 370 (e.g., a second plate) may be coupled to the rear surface of the electronic device 301. The rear cover 370 may be formed, for example, but not limited to, tempered glass, molded plastic parts, metal, etc. According to various embodiments, the rear cover 370 may be integrated with a side member 350 and / or may be made removable by a user. The side member 350 may be referred to as a rear shell, rear plate, etc.

[0065] Figure 4a This is a cross-sectional view showing an example electronic device according to one embodiment.

[0066] Figure 4a The cross-sectional view shown corresponds to the area where the biometric sensor module is not attached to the display (or display panel) 420 (e.g. Figure 3 A cross-sectional view of the display device 320 in its current state. (Refer to...) Figure 4a Electronic device 401 (e.g.) Figure 3The electronic device 301 may include a transparent member 410 (e.g., Figure 3 The transparent component 310 and the display 420.

[0067] A transparent component 410 may be located on the top layer of the electronic device 401. A display 420 may be located below the transparent layer 410. The display 420 may include a panel layer 421 and a layer structure 425 comprising multiple layers. According to one embodiment, the panel layer 421 may include at least one light-emitting device (not shown) and may be disposed below the transparent layer 410. According to one embodiment, the layer structure 425 may be disposed below the panel layer 421. In one embodiment, the layer structure 425 may include a first layer group 425-1 and a second layer group 425-2. The first layer group 425-1 may include, for example, but not limited to, a support layer 41 (e.g., an EMBO layer) patterned thereon, a digital converter (or digital pen sensor) 43 for receiving input from an electronic pen, and a metal layer 45 (e.g., a copper sheet). The support layer 41 may absorb external impacts on the panel layer 421 to enhance optical properties and may visually hide the pattern included in the digital converter 43. The second layer group 425-2 may include, for example, but not limited to, a radiating sheet 47 for performing a radiation function, and a buffer layer 49 for absorbing external impacts. Figure 4a The stacked structure of the first layer group 425-1 and the second layer group 425-2 shown is illustrative only. Layer structure 425 may not include... Figure 4a Some of the multiple layers shown may further include at least one other layer, or at least some of the multiple layers may be configured in different positions. For example, layer structure 425 may not include digital converter 43 and metal layer 45. As another example, layer structure 425 may not include support layer 41 and radiating sheet 47.

[0068] According to one embodiment, the layer structure 425 may include through regions (or openings). For example, the first layer group 425-1 and the second layer group 425-2 may include through regions having a first width w1.

[0069] According to one embodiment, a pressure sensor (not shown) may be disposed below layer structure 425. According to one embodiment, a circuit board (e.g.) Figure 3 The FPCB 325 can be positioned below the pressure sensor. For example, as referenced above. Figure 3 The circuit board can extend from one side of the display 420 (e.g., panel layer 421) to be folded in the direction of the rear surface of the layer structure 425, and can be attached to a pressure sensor.

[0070] Figure 4b This is a cross-sectional view showing an example electronic device according to one embodiment.

[0071] Figure 4b The cross-sectional view shown corresponds to the area where the biometric sensor module is not attached to the display (or display module) 420 (e.g.). Figure 3 A cross-sectional view of the display device 310 in its current state. (Refer to...) Figure 4b Electronic device 401 (e.g.) Figure 3 The electronic device 301 may include a transparent member 410 (e.g., Figure 3 The transparent component 310 and the display 420.

[0072] According to one embodiment, the through regions (or openings) formed in the first layer group 425-1 and the second layer group 425-2 can be different in size from each other. For example, the width w2 of the through region in the second layer group 425-2 can be greater than the width w1 of the through region in the first layer group 425-1. Therefore, the layer structure 425 can form a stepped structure through the first layer group 425-1 and the second layer group 425-2.

[0073] Figure 5a , Figure 5b and Figure 5c This is a cross-sectional view showing an example package structure of a biometric sensor module according to various embodiments.

[0074] Figure 5a , Figure 5b and Figure 5c An example of a cross-sectional view of a biometric sensor module is shown.

[0075] Reference Figure 5a The biometric sensor module 503 may include a circuit board 531 (e.g., PCB), a biometric sensor 532 (e.g., an image sensor), an optical layer 533, a housing 534, an optical filter 535, conductive wiring 536, and circuit elements 537.

[0076] According to one embodiment, circuit board 531 may include a rear-printed circuit board (RPCB) and a front-printed circuit board (FPCB). The RPCB may include passive components, printed circuitry, and a sensor integrated circuit (IC) for controlling a biometric sensor. The passive components, printed circuitry, and sensor IC may be disposed on the rear surface of the RPCB. The FPCB may extend from one side of the RPCB or may be attached to the rear surface of the RPCB for electrical connection. The FPCB (or connection portion) may be attached thereto to a display (e.g., a display panel). Figure 4a The display 420) is in a state with another circuit board (e.g. Figure 3 Electrical connection of FPCB 325 or circuit board 340.

[0077] According to one embodiment, a biometric sensor 532 (e.g., a complementary metal-oxide-semiconductor (CMOS) image sensor) can be disposed on a circuit board 531. For example, the biometric sensor 532 can be attached to the circuit board 531 via a first adhesive film 51 (e.g., die attachment film (DAF)). The biometric sensor 532 can be, for example, an array-type image sensor on which multiple image sensors are arranged at specified intervals. The biometric sensor 532 can, for example, but not limited to, use reflected light reflected from a user's finger to obtain fingerprint information (or a fingerprint image).

[0078] According to one embodiment, an optical layer 533 may be disposed on a biometric sensor 532. The optical layer 533 may enhance the optical properties of reflected light from, for example, an external object (e.g., a finger), and may refract the reflected light to enhance the light-receiving efficiency of the biometric sensor 532. According to one embodiment, the optical layer 533 may include a microlens having a form that protrudes in an upward direction in units corresponding to each pixel of the image sensor.

[0079] According to one embodiment, the housing 534 may be disposed on the circuit board 531. For example, the housing 534 may be attached to the circuit board 531 via a first adhesive film 51 (e.g., DAF). The housing 534 may comprise, for example, polymeric materials, such as, but not limited to, epoxy resin, and / or metallic materials, such as stainless steel or aluminum. According to one embodiment, the housing 534 may include an opening 539.

[0080] According to one embodiment, an optical filter 535 may be attached to at least a portion of a surface of a housing 534 to block the biometric sensor 532 from the outside. For example, the optical filter 535 may be attached to the bottom surface of the housing 534 via a second adhesive film 52 (e.g., DAF) to cover the opening 539 of the housing 534.

[0081] According to one embodiment, the optical filter 535 may be formed, for example, as a layer-shaped optical filter layer disposed in the opening 539 of the housing 534.

[0082] According to one embodiment, the optical filter 535 may be spaced a specified distance from the optical layer 533. Therefore, the biometric sensor module 503 may include a dielectric material layer 538 through which a dielectric material (e.g., air) is filled between the optical layer 533 and the optical filter 535. The optical layer 533 may refract reflected light incident through the optical filter 535 based on, for example, the difference in dielectric constant between the optical layer 533 and the dielectric layer 538. The optical filter 535 may transmit light of a specific wavelength (e.g., visible light) and may block light of another wavelength (e.g., infrared light) reflected from, for example, an external object (e.g., a finger). For example, the optical filter 535 may transmit light of a wavelength (e.g., green light) necessary for the biometric sensor 532 to obtain fingerprint information or light that can pass well through a panel layer formed on the display (e.g., [missing information]). Figure 4a The light wavelength is emitted through the apertures between the light-emitting devices in the panel layer 421. According to one embodiment, the optical filter 535 may include, for example, but not limited to, a polyethylene terephthalate (PET) film.

[0083] According to one embodiment, conductive wiring 536 can electrically connect circuit board 531 to biometric sensor 532. Conductive wiring 536 may include, for example, multiple wires connecting circuit board 531 to biometric sensor 532. Fingerprint information obtained by biometric sensor 532 can be transmitted to sensor IC disposed on circuit board 531 via conductive wiring 536.

[0084] According to one embodiment, circuit element 537 may be disposed on circuit board 531. Circuit element 537 may include, but is not limited to, various components necessary for the biometric sensor module 503 to acquire, process, and transmit biometric information (e.g., capacitors, electrically erasable programmable read-only memory (EEPROM), etc.), ICs, etc. According to one embodiment, circuit element 537 may be disposed under circuit board 531.

[0085] According to various embodiments, the biometric sensor module 503 may not include... Figure 5a Some of the components shown, and may further include Figure 5a Components not shown. For example, when the circuit board 531 and the biometric sensor 532 are directly connected to each other, the biometric sensor module 503 may not include conductive wiring 536.

[0086] Reference Figure 5b The biometric sensor module 505 may include a circuit board 531 (e.g., PCB), a biometric sensor 532 (e.g., an image sensor), an optical layer 533, a housing 534, an optical filter 535, conductive wiring 536, and circuit elements 537.

[0087] According to one embodiment, the housing 534 may be disposed on the circuit board 531. For example, the housing 534 may be attached to the circuit board 531 via a first adhesive film 51 (e.g., DAF). According to one embodiment, the housing 534 may be configured to cover the circuit element 537 to secure the circuit element 537 and protect the circuit element 537 from external influences. The circuit element 537 may be blocked from the outside by the housing 534.

[0088] According to one embodiment, an optical filter 535 may be attached to at least a portion of a surface of a housing 534 to block the biometric sensor 532 from the outside. For example, the optical filter 535 may be attached to a portion of the top surface of the housing 534 via a second adhesive film 52 (e.g., DAF) to cover the opening 539 of the housing 534.

[0089] Reference Figure 5c The biometric sensor module 507 may include a circuit board 531 (e.g., PCB), a biometric sensor 532 (e.g., an image sensor), an optical layer 533, a housing 534, an optical filter 535, conductive wiring 536, and circuit elements 537.

[0090] According to one embodiment, a housing 534 may be disposed on the circuit board 531 and the biometric sensor 532. For example, the housing 534 may be formed on the circuit board 531 and the biometric sensor 532, for example, by injection molding. According to one embodiment, the housing 534 may be configured to cover the conductive wiring 536 and the circuit element 537 to fix the circuit element 537 and protect the circuit element 537 from external influences. The circuit element 537 may be completely blocked from the outside by the housing 534.

[0091] According to one embodiment, an optical filter 535 may be attached to at least a portion of a surface of a housing 534 to block the biometric sensor 532 from the outside. For example, the optical filter 535 may be attached to the entire area of ​​the top surface of the housing 534 via a second adhesive film 52 (e.g., DAF) to cover the opening 539 of the housing 534.

[0092] Figure 6a , Figure 6b and Figure 6c This is a cross-sectional view showing an example electronic device according to various embodiments.

[0093] Figure 6a , Figure 6b and Figure 6c The cross-sectional view shown corresponds to a cross-sectional view of the biometric sensor module 630 attached to the display (or display panel) 620. (See reference...) Figure 6a Electronic device 601 (e.g.) Figure 3The electronic device 301 may include a transparent member 610 (e.g., Figure 3 Transparent component 310), display 620 (e.g.) Figure 3 The display device 320 and the biometric sensor module 630.

[0094] According to one embodiment, the biometric sensor module 630 can be attached to the display 620 via the top surface of the housing 634. Alternatively, the biometric sensor module 630 can be attached to a surface (e.g., the bottom surface) of the layer structure 625 via a third adhesive film 63 disposed between the housing 634 and the layer structure 625.

[0095] According to one embodiment, with the biometric sensor module 630 attached to the display 620, the biometric sensor module (e.g., image sensor, optical layer, and optical filter) can face the panel layer 621. According to one embodiment, the third adhesive film 63 can have a specified thickness to ensure the performance of the biometric sensor module 630.

[0096] Reference Figure 6b Electronic device 603 (e.g.) Figure 3 The electronic device 301 may include a transparent member 610 (e.g., Figure 3 Transparent component 310), display 620 (e.g.) Figure 3 The display device 320 and the biometric sensor module 630.

[0097] According to one embodiment, the biometric sensor module 630 can be attached to the display 620 via a portion (e.g., a second region) of the top surface of the housing 634. This portion of the top surface of the housing 634 can be any area other than the region on the top surface of the housing 634 where an optical filter is attached (e.g., a first region). For example, the biometric sensor module 630 can be attached to a surface (e.g., the bottom surface) of the layer structure 625 via a third adhesive film 63 disposed between a portion of the housing 634 and the layer structure 625.

[0098] According to one embodiment, with the biometric sensor module 630 attached to the display 620, the biometric sensor module (e.g., image sensor, optical layer, and optical filter) can face the panel layer 621. According to one embodiment, the third adhesive film 63 can have a specified thickness to ensure the performance of the biometric sensor module 630.

[0099] Reference Figure 6c Electronic device 605 (e.g.) Figure 3 The electronic device 301 may include a transparent member 610 (e.g., Figure 3 Transparent component 310), display 620 (e.g.) Figure 3The display device 320 and the biometric sensor module 630.

[0100] According to one embodiment, the biometric sensor module 630 can be attached to the display 620 via an optical filter 635. For example, the biometric sensor module 630 can be attached to a surface (e.g., the bottom surface) of the layer structure 625 via a third adhesive film 63 disposed between a portion of the optical filter 635 and the layer structure 625.

[0101] According to one embodiment, with the biometric sensor module 630 attached to the display 620, the biometric sensor module (e.g., image sensor, optical layer, and optical filter) can face the panel layer 621. According to one embodiment, the third adhesive film 63 can have a specified thickness to ensure the performance of the biometric sensor module 630.

[0102] Depending on the context, the expression “suitable for or configured to” as used herein may be used interchangeably with respect to hardware or software or any combination thereof, for example, to express “suitable for,” “capable of,” “modified to,” “made of,” “capable of,” or “designed to.” The expression “device configured to” can refer to, for example, a situation where the device is “capable” of operating with another device or other component. For example, “processor configured (or set to) perform A, B, and C” can refer to, but is not limited to, a dedicated processor (e.g., an embedded processor) for performing the corresponding operations, a general-purpose processor (e.g., a central processing unit (CPU), application processor (AP)) for performing the corresponding operations by running one or more software programs stored in a storage device (e.g., memory 830), etc.

[0103] The term "module" as used herein can include units implemented in hardware, software, or firmware, or any combination thereof, and is used interchangeably with the terms "logic," "logic block," "part," "circuit," etc. A "module" can be the smallest unit or part of an integrated section, or the smallest unit or part of a section for performing one or more functions. A "module" can be implemented mechanically and / or electronically, and can include, for example, but not limited to, application-specific integrated circuit (ASIC) chips, field-programmable gate arrays (FPGAs), programmable logic devices, etc., for performing known or to-be-developed operations.

[0104] At least a portion of an apparatus (e.g., a module or its function) or method (e.g., operation) according to various embodiments may be implemented, for example, by instructions stored in a computer-readable storage medium (e.g., memory 830) as program modules. When executed by a processor (e.g., processor 820), the instructions cause the processor to perform the function corresponding to the instructions. The computer-readable recording medium may include hard disks, floppy disks, magnetic media (e.g., magnetic tape), optical media (e.g., compact disc read-only memory (CD-ROM) and digital versatile disc (DVD), magneto-optical media (e.g., floppy disks)), embedded memory, etc. One or more instructions may contain code generated by a compiler or code executable by an interpreter.

[0105] Each component (e.g., a module or program module) according to various embodiments may include a single entity or multiple entities, and some of the aforementioned sub-components may be omitted, or further sub-components may be included. Alternatively or additionally, after being integrated into a single entity, some components (e.g., modules or program modules) may perform the functions performed by each corresponding component in the same or similar manner prior to integration. According to various embodiments, the operations performed by modules, program modules, or other components may be performed through sequential, parallel, repetitive, or heuristic methods, or at least a portion of the operations may be performed in a different order or omitted. Alternatively, additional operations may be added.

[0106] Although this disclosure has been shown and described with reference to various exemplary embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of this disclosure as defined, for example, by the appended claims and their equivalents.

Claims

1. An electronic device comprising: Transparent components; A display panel is disposed below the transparent component and includes pixels; A sensor housing is disposed below the display panel, the sensor housing including at least one side wall and an upper wall in which an opening is formed; A biometric sensor is mounted on a printed circuit board, wherein the sensor housing is mounted on the printed circuit board such that the biometric sensor is disposed within the sensor housing; An optical filter, disposed within the sensor housing and attached to a portion of the sensor housing corresponding to the opening to cover the opening, is spaced apart from both the biometric sensor and the display panel, wherein an air gap is provided between the biometric sensor and the optical filter; and A processor, electrically connected to the biometric sensor, is configured to control the electronic device to obtain biometric information using the biometric sensor, and The biometric sensor is configured to receive light emitted by the display panel and reflected from an object located on the transparent member, passing through the display panel, the opening in the sensor housing, and the optical filter to obtain the biometric information. The biometric sensor is electrically connected to the printed circuit board.

2. The electronic device according to claim 1, wherein, When viewed in a direction perpendicular to the display panel, the opening formed on the upper wall of the sensor housing has a cross-sectional area smaller than the top surface area of ​​the biometric sensor.

3. The electronic device of claim 1, wherein the upper wall of the sensor housing comprises a first portion that partially faces the rear surface of the display panel and forms a first portion of the opening, and a second portion that surrounds the optical filter and forms a second portion of the opening, and The first portion of the opening has a first size, and the second portion of the opening has a second size, the second size being larger than the first size and smaller than the size of the top surface of the biometric sensor.

4. The electronic device according to claim 3, wherein, When viewed in a direction perpendicular to the display panel, the optical filter has a larger cross-sectional area than the first portion of the opening.

5. The electronic device of claim 3, wherein the optical filter is disposed in the second portion of the opening.

6. The electronic device according to claim 1, wherein, When viewed in a direction perpendicular to the display panel, the optical filter has a smaller cross-sectional area than the top surface of the biometric sensor.

7. The electronic device of claim 1, wherein the biometric sensor is electrically connected to the printed circuit board via conductive wiring.

8. The electronic device of claim 1, wherein the display panel includes a metal-containing layer on the rear surface of the display panel, and The second opening is formed in the metal-containing layer, and The opening in the sensor housing is partially aligned with the second opening containing the metal layer.

9. The electronic device of claim 8, wherein light received by the biometric sensor passes through the second opening of the metal-containing layer.

10. The electronic device of claim 8, further comprising a layer disposed between a region surrounding the second opening of the metal-containing layer and a region surrounding the opening of the sensor housing, such that the sensor housing and the metal-containing layer are spaced apart from each other.

11. The electronic device of claim 1, wherein the optical filter is configured to transmit light in at least one visible band and block at least a portion of light in the infrared band.

12. The electronic device of claim 1, wherein the air gap provided between the biometric sensor and the optical filter is adjacent to at least one of the biometric sensor and the optical filter.

13. The electronic device of claim 1, further comprising a circuit element electrically connected to the biometric sensor.

14. The electronic device of claim 1, wherein, when viewed from above, the optical filter overlaps with the opening in the upper wall of the sensor housing.

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