Thermoelectric refrigeration device for electronic equipment and electronic equipment
By using a cooling substrate and a heating substrate made of topological semi-metallic materials, combined with a liquid cooling heat dissipation mechanism, the problems of low heat dissipation efficiency and complex structure of electronic devices are solved, achieving efficient and rapid heat conduction, which is suitable for thin and light electronic devices.
CN111818779BActive Publication Date: 2026-07-03GREE ELECTRIC APPLIANCE INC OF ZHUHAI
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GREE ELECTRIC APPLIANCE INC OF ZHUHAI
- Filing Date
- 2020-08-10
- Publication Date
- 2026-07-03
AI Technical Summary
Technical Problem
The passive heat dissipation efficiency of existing electronic devices is low, while the active heat dissipation structure is complex and the distance between the hot and cold ends is too close, which cannot meet the requirements of thinner and lighter devices.
Method used
The cooling and heating substrates are made of topological semi-metallic materials. By utilizing the transverse thermoelectric effect of the Dirac semi-metal cadmium arsenide and combining it with a liquid cooling heat dissipation mechanism, efficient and rapid heat conduction is achieved.
Benefits of technology
It achieves efficient and rapid heat conduction, has a simple structure, occupies little space, and is conducive to the manufacture of thinner and lighter electronic devices.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN111818779B_ABST
Abstract
This invention relates to a thermoelectric cooling device for electronic devices and the electronic device itself. The electronic device includes a first region and a second region. The temperature of the first region during use is higher than the temperature of the second region during use. The thermoelectric cooling device includes a series structure connected to and powered by a power supply element of the electronic device. The series structure includes a cooling substrate disposed in the first region of the electronic device and a heating substrate disposed in the second region of the electronic device and connected in series with the cooling substrate. Both the cooling substrate and the heating substrate are made of a topological semi-metallic material. This invention provides a thermoelectric cooling device for electronic devices and an electronic device including the thermoelectric cooling device. This thermoelectric cooling device is an active heat dissipation method, which has high heat dissipation efficiency, simple structure, and small space occupation, which is beneficial for obtaining thinner and lighter electronic devices.
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