Display apparatus and method of manufacturing display apparatus

Abstract

A display device and a method for manufacturing the display device are provided. The display device includes a display panel, a first circuit board, a driver integrated circuit, a sealing member, and an insulating tape, wherein the first circuit board has a first end attached to the display panel, the driver integrated circuit is disposed on the first circuit board, the sealing member is disposed on the first circuit board and around an outer surface of the driver integrated circuit, and the insulating tape is disposed on the sealing member and the driver integrated circuit.

Description

[0001] This application claims priority to and all the benefits of Korean Patent Application No. 10-2019-0050561, filed on April 30, 2019, the contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to a display apparatus and a method of manufacturing a display apparatus. BACKGROUND

[0003] With the development of multimedia, display apparatuses are becoming increasingly important. Accordingly, various types of display apparatuses, such as organic light emitting displays ("OLEDs") and liquid crystal displays ("LCDs"), are being used. These display apparatuses are being applied to a wider and wider variety of devices, mainly to various mobile electronic devices, such as portable electronic devices, such as smart phones, smart watches, and tablet personal computers ("PCs").

[0004] A display apparatus can include a flexible film to which a circuit board or an integrated circuit for controlling driving of a display panel is attached or on which the circuit board or the integrated circuit for controlling driving of the display panel is disposed. A tape for preventing static electricity that can be generated in the integrated circuit can be disposed on the flexible film. An anti-static tape can be attached to the flexible film to cover the integrated circuit or the like. SUMMARY

[0005] Aspects of the present disclosure provide a display apparatus including a structure for compensating for a step formed by a driver integrated circuit disposed on a flexible film and an anti-static tape disposed to cover the structure.

[0006] Aspects of the present disclosure also provide a method of manufacturing a display apparatus. The method includes a process of forming a structure for compensating for a step formed by a driver integrated circuit.

[0007] However, aspects of the present disclosure are not limited to the aspects set forth herein. The above and other aspects of the present disclosure will become more apparent to one of ordinary skill in the art to which the present disclosure pertains by referencing the detailed description of the present disclosure given below.

[0008] According to an exemplary embodiment of the present disclosure, a display apparatus includes a display panel, a first circuit board having a first end attached to the display panel, a driver integrated circuit disposed on the first circuit board, a sealing member disposed on the first circuit board and surrounding an outer surface of the driver integrated circuit, and an insulating tape disposed on the sealing member and the driver integrated circuit.

[0009] In an exemplary embodiment, the insulating tape can overlap the driver integrated circuit, and can be attached to at least a portion of the upper surface of the sealing member.

[0010] In an exemplary embodiment, a side surface of the insulating tape can form a flat surface with a side surface of the sealing member.

[0011] In an exemplary embodiment, the sealing member can have a height greater than a height measured from an upper surface of the first circuit board to an upper surface of the driver integrated circuit.

[0012] In an exemplary embodiment, at least a portion of the insulating tape can be sunken toward the driver integrated circuit, and a lower surface of the sunken portion can contact an upper surface of the driver integrated circuit.

[0013] In an exemplary embodiment, the display apparatus can further include a protective resin disposed between the insulating tape and the first circuit board in an area surrounded by the sealing member.

[0014] In an exemplary embodiment, the protective resin can be disposed between the driver integrated circuit and the sealing member.

[0015] In an exemplary embodiment, the protective resin can be disposed between an upper surface of the driver integrated circuit and the insulating tape.

[0016] In an exemplary embodiment, the display apparatus can further include a second circuit board attached to a second end of the first circuit board opposite the first end.

[0017] In an exemplary embodiment, the second circuit board can be spaced apart from the sealing member.

[0018] In an exemplary embodiment, the second circuit board can surround one edge of the sealing member and two edges of the sealing member connected to both ends of the one edge, and be spaced apart from the one edge and the two edges.

[0019] In an exemplary embodiment, the display apparatus can further include a printed layer formed on the first circuit board to be spaced apart from the driver integrated circuit, wherein at least a portion of the printed layer surrounds an outer surface of the driver integrated circuit, and at least a portion of the sealing member partially overlaps the printed layer.

[0020] In an exemplary embodiment, the printed layer can include one or more printed patterns, and the printed patterns can be spaced apart from each other and face the outer surface of the driver integrated circuit.

[0021] In an example embodiment, the sealing member can include a first region overlapping the printed pattern of the one or more printed patterns and a second region adjacent to the first region and not overlapping the one or more printed patterns.

[0022] According to another example embodiment of the disclosure, a display apparatus includes a display panel, a first circuit board, a second circuit board, a driver integrated circuit, a printed layer, a sealing member, an insulating tape, and a protective resin, wherein: the display panel includes a display area, a non-display area surrounding the display area, and a coupling area disposed on one side of the non-display area; the first circuit board has a first end attached to the coupling area of the display panel; the second circuit board is attached to a second end of the first circuit board opposite the first end; the driver integrated circuit is disposed on the first circuit board to be spaced apart from the second circuit board; the printed layer is formed on the first circuit board to surround the driver integrated circuit at a distance from the driver integrated circuit; the sealing member is disposed on the printed layer to surround the driver integrated circuit and between the driver integrated circuit and the second circuit board; the insulating tape is disposed on the sealing member and the driver integrated circuit; and the protective resin is disposed between the insulating tape and the first circuit board in an area surrounded by the sealing member.

[0023] In an example embodiment, the insulating tape can overlap the driver integrated circuit and be attached to at least a portion of an upper surface of the sealing member.

[0024] In an example embodiment, the second circuit board can surround one edge of the sealing member and two edges of the sealing member connected to both ends of the one edge and be spaced apart from the one edge and the two edges.

[0025] According to an example embodiment of the disclosure, a method for manufacturing a display apparatus includes: preparing a first circuit board having a printed layer formed on at least a portion of the first circuit board; placing a driver integrated circuit in an area surrounded by the printed layer and forming a sealing member on the printed layer; and injecting a protective resin into an area surrounded by the sealing member and placing an insulating tape on the sealing member and the driver integrated circuit.

[0026] In an example embodiment, forming the sealing member can include moving a camera sensing a position of the printed layer formed on the first circuit board along the printed layer and injecting a sealant onto the printed layer using a first nozzle moving in the same direction as the camera.

[0027] In an example embodiment, in a process of placing the insulating tape, the insulating tape can be attached to at least a portion of an upper surface of the sealing member. BRIEF DESCRIPTION OF DRAWINGS

[0028] The above and other objects, features and advantages of the present application will become more apparent to one of ordinary skill in the art by describing in detail exemplary embodiments thereof with reference to the accompanying drawings, in which:

[0029] Figure 1 is a plan view of a display apparatus according to an exemplary embodiment;

[0030] Figure 2 is a partial cross-sectional view of the display apparatus of Figure 1

[0031] Figure 3 is a plan view of a first circuit board according to an exemplary embodiment;

[0032] Figure 4 is a cross-sectional view taken along line Q4-Q4' of Figure 3

[0033] Figure 5 is a flowchart illustrating a method of manufacturing a display apparatus according to an exemplary embodiment;

[0034] Figures 6 to 13 is a schematic diagram illustrating a process of manufacturing a display apparatus according to an exemplary embodiment;

[0035] Figures 14 to 16 is a partial cross-sectional view of a first circuit board of a display apparatus according to an exemplary embodiment;

[0036] Figure 17 is a partial plan view of a first circuit board of a display apparatus according to an exemplary embodiment;

[0037] Figure 18 is a cross-sectional view taken along line QN-QN' of Figure 17

[0038] is a partial plan view of a first circuit board of a display apparatus according to another exemplary embodiment; and Figure 19

[0039] is a partial plan view of a display apparatus according to an exemplary embodiment. Figure 20 DETAILED DESCRIPTION

[0040] Hereinafter, the present application will be described more fully with reference to the accompanying drawings, in which preferred exemplary embodiments of the present application are shown. The present application may, however, be embodied in different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present application to those skilled in the art.

[0041] ​​​It will be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present. In the entire description, like reference numerals denote like components.

[0042] It will be understood that, although the terms "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element discussed below could be termed a second element without departing from the teachings of the present application. Similarly, a second element could be termed a first element.

[0043] Hereinafter, exemplary embodiments will be described with reference to the accompanying drawings.

[0044] Figure 1 is a plan view of a display apparatus 10 according to an exemplary embodiment.

[0045] Referring to Figure 1 , the display apparatus 10 displays a moving image or a still image. The display apparatus 10 can refer to any electronic apparatus that provides a display screen. Examples of the display apparatus 10 as an apparatus for providing a display screen can include, but are not limited to, a television, a notebook computer, a monitor, a billboard, a mobile phone, a smart phone, a tablet personal computer ("PC"), an electronic watch, a smart watch, a watch phone, a head-mounted display, a mobile communication terminal, an electronic notebook, an electronic book, a personal digital assistant ("PDA"), a portable multimedia player ("PMP"), a navigation apparatus, a game console, a digital camera, a camcorder, a watch-type electronic apparatus, a monitor of a PC, a car dashboard, an outdoor billboard, an electronic board, various medical apparatuses, various examination apparatuses, various home appliances including a display area such as a refrigerator and a washing machine, and an Internet of Things ("IoT") apparatus.

[0046] The display apparatus 10 includes a display panel 100, a first circuit board 300, and a second circuit board 500.

[0047] The display panel 100 provides a display screen of the display apparatus 10. Examples of the display panel 100 include a light emitting diode ("LED") display panel, an organic light emitting display panel, a quantum dot light emitting display panel, a plasma display panel, and a field emission display panel. An example in which an LED display panel is applied as the display panel 100 will be described below, but the present application is not limited to the example, and other display panels can also be applied as long as the same technical spirit is applicable.

[0048] In a plan view, the display panel 100 can be substantially rectangular. In a plan view, the display panel 100 can be shaped like a rectangle having right-angled corners or a rectangle having rounded corners. The display panel 100 can include four sides or four edges. The display panel 100 can include a long side and a short side. Here, the length of the long side is longer than the length of the short side. The display panel 100 can include a coupling area PA, in which the coupling area PA protrudes from a portion of a lower side among the four sides of the display panel 100, and the first circuit board 300 is attached to the coupling area PA.

[0049] However, the shape of the display apparatus 10 is not limited to this example and can be changed to various shapes. For example, the display apparatus 10 can have various shapes such as a horizontally long rectangle, a vertically long rectangle, a square, a quadrilateral having rounded corners (i.e., vertices), other polygons, and a circle. The shape of the display area DA of the display apparatus 10 can also be similar to the overall shape of the display apparatus 10. In Figure 1 In an embodiment, the display apparatus 10 and the display area DA are shaped like a vertically long rectangle.

[0050] In a plan view, the display apparatus 10 can be divided into a display area DA and a non-display area NDA, in which the display area DA displays an image or a video, and the non-display area NDA is disposed around the display area DA. The display area DA can be an area including a screen, and the non-display area NDA can be an area not including a screen. The display area DA can also be referred to as an active area, and the non-display area NDA can also be referred to as an inactive area. The display area DA can generally occupy the center of the display apparatus 10. The non-display area NDA can be an area other than the display area DA and can surround the display area DA. However, the present disclosure is not limited to these examples.

[0051] The display area DA can include a plurality of pixels. Each of the pixels is a basic unit for displaying an image on a screen. The pixels can be, but are not limited to, red pixels, green pixels, and blue pixels. The pixels can also include white pixels. In a plan view, the pixels can be alternately arranged. For example, the pixels can be arranged in a matrix direction.

[0052] The non-display area NDA can be disposed around the display area DA. The non-display area NDA can surround the display area DA. In an exemplary embodiment, the display area DA can be formed in a rectangular shape, and the non-display area NDA can be disposed around four sides of the display area DA. A black matrix can be disposed in the non-display area NDA to prevent light emitted from adjacent pixels from leaking.

[0053] The display panel 100 can include a coupling area PA disposed on one side of the non-display area NDA. In the coupling area PA, pads connected to a plurality of wirings disposed in the display area DA can be placed. The pads connected to the plurality of wirings can be connected to pads of the first circuit board 300 (to be described later) and can receive predetermined electrical signals or control signals. Although the lower edge of the display panel 100 is protruded to form the coupling area PA in the drawings, the present application is not limited to this case. Furthermore, the pads connected to the plurality of wirings can not necessarily be disposed in the coupling area PA. In some cases, the pads connected to the plurality of wirings can be disposed around both short edges of the display area DA, or around both short edges and both long edges of the display area DA.

[0054] The first circuit board 300 can be attached to the pads disposed at the edges of the coupling area PA by using an anisotropic conductive film, wherein the edges of the coupling area PA are the edges of the display panel 100. The leads of the first circuit board 300 can be electrically connected to the pads disposed at the edges of the coupling area PA. The first circuit board 300 can be a flexible printed circuit board, a printed circuit board, or a flexible film such as a chip on film.

[0055] The first circuit board 300 includes a plurality of stacked structures. The first circuit board 300 can include a plurality of wiring layers, insulating layers disposed between the wiring layers, and organic protective layers disposed above and below the wiring layers.

[0056] The first circuit board 300 can be bent toward the lower surface of the display panel 100, as shown in FIG. Figure 2 In this case, the first side of the first circuit board 300 can be attached to the coupling area PA at the edges of the display panel 100, and the second side of the first circuit board 300 can be disposed below the display panel 100 and connected to a system board on which a host system is mounted. For example, the second side of the first circuit board 300 can be a side opposite to the first side of the first circuit board 300. The driver integrated circuit 310 is disposed on the first circuit board 300. The driver integrated circuit 310 can be connected to the wiring layers, and can be electrically connected to the pads of the display panel 100 and the circuit pads of the second circuit board 500.

[0057] Furthermore, as shown in FIG. (for example, Figure 2 ), the display apparatus 10 according to an exemplary embodiment can include an insulating tape 350 disposed on the driver integrated circuit 310. The insulating tape 350 can be disposed on the first circuit board 300 to cover the driver integrated circuit 310 and prevent static electricity from being generated in the driver integrated circuit 310. The structure of the driver integrated circuit 310 and the insulating tape 350 on the first circuit board 300 will be described in more detail later with reference to other drawings.

[0058] The second circuit board 500 can include a circuit pad area attached to the second side of the first circuit board 300. A plurality of circuit pads can be disposed in the circuit pad area of the second circuit board 500 and can be connected to the leads of the first circuit board 300. Although the second circuit board 500 is attached only to the second side of the first circuit board 300 under the driver integrated circuit 310 in the drawing (for example, Figure 2 ), the present application is not limited to this example. In some cases, the second circuit board 500 can also be attached to the left or right side of the first circuit board 300 to partially cover the driver integrated circuit 310. Here, the left and right sides of the first circuit board 300 are the sides of the first circuit board 300 other than the first and second sides of the first circuit board 300.

[0059] Figure 2 is a partial cross-sectional view of the display apparatus 10 of Figure 1 .

[0060] Referring to Figure 2 , the display panel 100 can include a base substrate 101, a circuit driving layer 110, a light emitting layer 130, an encapsulation layer 150, and a panel under member 170. The first circuit board 300 can be disposed on one side of the base substrate 101 and can be bent in a downward direction (i.e., a third direction DR3) to be attached to a lower surface of the panel under member 170 by an adhesive member AM.

[0061] The circuit driving layer 110 can include display wiring, display electrodes, and at least one transistor, and can control the amount of light emitted from the light emitting layer 130. The light emitting layer 130 can include a material that emits light of a specific wavelength band, for example, an organic light emitting material.

[0062] The base substrate 101 can be a flexible substrate including a flexible polymer material such as polyimide. Accordingly, the display panel 100 is capable of being flexed, bent, folded, or rolled. In some exemplary embodiments, the base substrate 101 can include a plurality of sub-substrates that overlap each other in a thickness direction (i.e., a third direction DR3) with a barrier layer interposed therebetween. In this case, each of the sub-substrates can be a flexible substrate.

[0063] The circuit driving layer 110 can be disposed on the base substrate 101. The circuit driving layer 110 can include a circuit for driving the light emitting layer 130 of each pixel. The circuit driving layer 110 can include a plurality of thin film transistors.

[0064] The light emitting layer 130 can be disposed on the circuit driving layer 110. The light emitting layer 130 can include an organic light emitting layer. The light emitting layer 130 can emit light at various brightness levels according to a driving signal transmitted from the circuit driving layer 110.

[0065] An encapsulation layer 150 can be disposed on the light emitting layer 130. The encapsulation layer 150 can include an inorganic layer or a stack of an inorganic layer and an organic layer.

[0066] Although not shown in the drawings, a touch layer can be disposed on the encapsulation layer 150. The touch layer is a layer for recognizing a touch input, and can perform a function of a touch member. The touch layer can include a plurality of sensing areas and sensing electrodes.

[0067] A panel lower member 170 is disposed on a lower surface of the base substrate 101. The panel lower member 170 can include at least one functional layer and an insulating layer. In an exemplary embodiment, the functional layer can be a layer that, for example, performs a heat dissipation function, an electromagnetic wave shielding function, a grounding function, a cushioning function, a strength enhancement function, a support function, or a digitizing function. The functional layer can consist of a single layer, but can also consist of a plurality of stacked thin films or coating layers. For example, the functional layer can be, for example, a support member, a heat dissipation layer, an electromagnetic wave shielding layer, an impact absorbing layer, or a digitizer.

[0068] The first circuit board 300 can be bent toward a lower surface of the display panel 100, as shown in FIG. 1B. A portion of the first circuit board 300 and the second circuit board 500 can be located below the panel lower member 170 of the display panel 100, and can be attached to the display panel 100 by an adhesive member AM. As shown in FIG. 1B, the adhesive member AM can be disposed at a position recessed inward from a second side of the first circuit board 300. Here, the second side of the first circuit board 300 is a side to which the second circuit board 500 is attached. In other words, as shown in FIG. 1B, the second side of the first circuit board 300 can protrude from the adhesive member AM and face the lower surface of the display panel 100. Such a structure can prevent internal foreign substances from being attached to the adhesive member AM or defects from being generated, which can occur when the lower surface of the adhesive member AM is exposed to the outside from the first circuit board 300. In addition, the adhesive member AM can be prevented from flowing downward from the second side of the first circuit board 300. Figure 2 Figure 2 Figure 2

[0069] As described above, the second circuit board 500 is attached to the second side of the first circuit board 300. In a plan view, an area to which the second circuit board 500 is attached to the first circuit board 300 can at least partially overlap an area in which the adhesive member AM is located. The second circuit board 500 can be spaced apart from a lower surface of the display panel 100 (i.e., a lower surface of the panel lower member 170), and can face the lower surface of the display panel 100.

[0070] ​​​The driver integrated circuit 310 is disposed on the first circuit board 300. The driver integrated circuit 310 can be spaced apart from the second circuit board 500 and can be located below the display panel 100 in the case where the first circuit board 300 is bent toward the lower surface of the display panel 100. As described above, the display apparatus 10 can include the insulating tape 350 disposed on the first circuit board 300 to cover the driver integrated circuit 310. As Figure 2 shown in FIG. 17, a portion of the insulating tape 350 can protrude outward from the side surface of the driver integrated circuit 310 to protect the driver integrated circuit 310. That is, in a plan view, the area of the insulating tape 350 is greater than the area of the driver integrated circuit 310. In another exemplary embodiment, the protruding portion can be directly attached to the upper surface of the first circuit board 300. Here, which surface of the first circuit board 300 or the insulating tape 350 is the upper surface or the lower surface is determined based on a state before the first circuit board 300 is bent. However, in this case, a space in which the insulating tape 350 can be attached can not be guaranteed due to the second circuit board 500 attached to the first circuit board 300. Thus, the first circuit board 300 and the insulating tape 350 can not be stably attached to each other. The display apparatus 10 according to an exemplary embodiment can include the sealing member 330 surrounding the driver integrated circuit 310, and at least a portion of the lower surface of the insulating tape 350 can contact the sealing member 330. Thus, since the lower surface of the insulating tape 350 is attached to the sealing member 330, a cocking phenomenon of the insulating tape 350 (which will be described later) can be prevented, and the driver integrated circuit 310 can be reliably protected.

[0071] Now, components disposed on the first circuit board 300 will be described in detail with reference to other drawings.

[0072] Figure 3 is a plan view of the first circuit board 300 according to an exemplary embodiment. Figure 4 is a cross-sectional view taken along line Q4-Q4’ of Figure 3 Figure 4 is a cross-section of the driver integrated circuit 310 across the first circuit board 300 in a second direction DR2 according to an exemplary embodiment.

[0073] Referring to Figure 3 and Figure 4 , the display apparatus 10 according to an exemplary embodiment can include a display panel 100, a first circuit board 300 attached to one side of the display panel 100, and a driver integrated circuit 310, a printed layer SPL, a sealing member 330, an insulating tape 350, and a protective resin 370 disposed on the first circuit board 300.

[0074] ​The first circuit board 300 can include a first area CA1, a second area CA2, and a third area CA3. The first area CA1 is a first end of the first circuit board 300, and can be an area to which the first circuit board 300 is attached to the coupling area PA of the display panel 100. A lower surface of the first area CA1 of the first circuit board 300 is attached to the coupling area PA of the display panel 100. The third area CA3 is a second end opposite the first area CA1, and can be an area to which the second circuit board 500 is attached. An upper surface of the third area CA3 of the first circuit board 300 can be attached to one side of the second circuit board 500. The second circuit board 500 is spaced apart from the sealing member 330 (to be described later). However, the present application is not limited to this example. In another exemplary embodiment, the second circuit board 500 can also be attached to the first circuit board 300 in an area other than the third area CA3.

[0075] The second area CA2 is located between the first area CA1 and the third area CA3, and can be an area in which a member disposed on the first circuit board 300 is located. Since the first circuit board 300 is disposed on the display panel 100 in the first area CA1 and is attached to the second circuit board 500 in the third area CA3, members such as the driver integrated circuit 310 and the insulating tape 350 can be disposed in the second area CA2.

[0076] Further, as described above, the first circuit board 300 can include a plurality of wiring layers and pads. The wirings and pads of the first circuit board 300 can be connected to the wirings or pads of the display panel 100 in the first area CA1 and to the wirings or pads of the second circuit board 500 in the third area CA3, respectively. The wirings and pads of the first circuit board 300 can extend partially to the second area CA2.

[0077] The driver integrated circuit 310 can be disposed in the second area CA2 of the first circuit board 300. The driver integrated circuit 310 can be an integrated circuit integrated for a data driver integrated circuit for transmitting a data signal and a scan driver integrated circuit for transmitting a scan signal. The driver integrated circuit 310 can be, but is not limited to, a chip on film ("COF") implemented as a driver chip. The driver integrated circuit 310 can be coupled to the wirings (i.e., the first wiring PAD1 and the second wiring PAD2) included in the first circuit board 300 through the conductive coupling members BP1 and BP2. In particular, the driver integrated circuit 310 can be connected to the first wiring PAD1 through the first conductive coupling member BP1, and can be connected to the second wiring PAD2 through the second conductive coupling member BP2. The first wiring PAD1 can be connected to other pads of the first circuit board 300 connected to the pads of the coupling area PA of the display panel 100 in the first area CA1, and the second wiring PAD2 can be connected to other pads of the first circuit board 300 connected to the pads of the second circuit board 500 in the third area CA3. However, the present application is not limited to such a case.

[0078] The printed layer SPL can be formed on the first circuit board 300. The printed layer SPL according to an exemplary embodiment can be spaced apart from the driver integrated circuit 310 in the second area CA2. In Figure 3 and Figure 4 , the printed layer SPL surrounds the outer surface of the driver integrated circuit 310. However, the present application is not limited to such a case. In another exemplary embodiment, the printed layer SPL can also include a plurality of printed patterns (e.g., "SPP_4" and "SPP_5" in Figures 17 to 19 ) spaced apart from each other to face a portion of the outer surface of the driver integrated circuit 310. Here, as shown in Figure 2 , the outer surface of the driver integrated circuit 310 is a side surface of the driver integrated circuit 310.

[0079] The first circuit board 300 having the printed layer SPL can be prepared before the display panel 100 is attached to the first circuit board 300. The printed layer SPL can be a layer for marking an area where the sealing member 330 (to be described later) is disposed.

[0080] The sealing member 330 is disposed in the second area CA2. The sealing member 330 can surround the outer surface of the driver integrated circuit 310, and at least a portion of the sealing member 330 can cover the printed layer SPL. The sealing member 330 can be disposed to have a predetermined height from the upper surface of the first circuit board 300. The sealing member 330 can be spaced apart from the outer surface of the driver integrated circuit 310 to face the outer surface of the driver integrated circuit 310, and can be disposed in the second area CA2 to not contact the second circuit board 500.

[0081] In an exemplary embodiment, the height H330 of the sealing member 330 may be equal to or greater than the measured height H310 from the upper surface of the first circuit board 300 to the upper surface of the driver integrated circuit 310. The sealing member 330 may be configured to surround the driver integrated circuit 310 and may form a predetermined space in which the driver integrated circuit 310 is disposed. A protective resin 370 (described later) may be disposed in this predetermined space and protect the driver integrated circuit 310. During the manufacturing process of the display device 10, the sealing member 330 may be disposed along the printed layer SPL on the first circuit board 300.

[0082] Insulating tape 350 can be disposed on the sealing member 330 and the driver integrated circuit 310. The insulating tape 350 prevents static electricity from being generated in the driver integrated circuit 310. The insulating tape 350 can cover the driver integrated circuit 310 and can be attached to the upper surface of the sealing member 330. The insulating tape 350 can overlap with the driver integrated circuit 310, and both sides of the insulating tape 350 can be partially attached to the upper surface of the sealing member 330 to surround the driver integrated circuit 310 together with the sealing member 330, such as... Figure 4 As shown in the figure. Therefore, the driver integrated circuit 310 can be kept away from external air and static electricity can be prevented from being generated in the driver integrated circuit 310.

[0083] In an exemplary embodiment, the side surface of the insulating tape 350 may form a flat surface with the side surface of the sealing member 330, or form the same surface perpendicular to the first circuit board 300 with the side surface of the sealing member 330, as shown in the figure (e.g., Figure 4 As shown in the diagram. That is, the width W350 of the insulating tape 350, measured in one direction (i.e., the first direction DR1 or the second direction DR2), can be equal to the distance W330 between the two opposing outer surfaces of the sealing member 330, measured in the same direction. Therefore, the side surface of the insulating tape 350 can be aligned with the side surface of the sealing member 330 in the vertical direction (i.e., the third direction DR3). Since the width W350 of the insulating tape 350 is equal to or less than the distance W330 of the sealing member 330, the insulating tape 350 does not need to protrude outward from the side surface of the sealing member 330. The insulating tape 350 can be disposed on the first circuit board 300 such that its adhesive lower surface is not exposed to the outside. Therefore, it is possible to prevent internal foreign matter from adhering to the insulating tape 350.

[0084] Further, according to an exemplary embodiment, the height H330 of the sealing member 330 can be equal to or greater than the height H310 measured from the upper surface of the first circuit board 300 to the upper surface of the driver integrated circuit 310. The insulating tape 350 can prevent static electricity that can be generated in the driver integrated circuit 310 when the insulating tape 350 is not present, and at the same time form a closed space with the sealing member 330 so that the driver integrated circuit 310 can be protected by the protective resin 370. If the sealing member 330 is formed to have a lower height than the driver integrated circuit 310, the insulating tape 350 can be attached to the upper surface of the driver integrated circuit 310 and can not be stably attached to the upper surface of the sealing member 330. In this case, a step can be formed in the area where the insulating tape 350 is attached to the sealing member 330. Due to the step, the insulating tape 350 can be peeled off, thereby causing the protective resin 370 to leak out or the driver integrated circuit 310 to be exposed to the outside air. This is a cocking phenomenon of the insulating tape 350.

[0085] To prevent such a phenomenon, in the display apparatus 10 according to an exemplary embodiment, the height H330 of the sealing member 330 can be equal to the height H310 from the upper surface of the driver integrated circuit 310 to the upper surface of the first circuit board 300. The insulating tape 350 can be attached to each of the upper surface of the driver integrated circuit 310 and the upper surface of the sealing member 330 to form a closed space with the sealing member 330. This can prevent the protective resin 370 from leaking out, prevent the driver integrated circuit 310 from being exposed to the outside air, and prevent static electricity that can be generated in the driver integrated circuit 310.

[0086] Although the insulating tape 350 is completely attached to the upper surface of the driver integrated circuit 310 and the upper surface of the sealing member 330 in the drawings, the present application is not limited to this case. In some cases, the insulating tape 350 can be spaced apart from the upper surface of the driver integrated circuit 310, or can be recessed inward from the side surface of the sealing member 330. This will be described in detail with reference to other exemplary embodiments.

[0087] To protect the driver integrated circuit 310, the protective resin 370 can surround the driver integrated circuit 310. In an exemplary embodiment, the protective resin 370 can be disposed between the insulating tape 350 and the first circuit board 300 in an area surrounded by the sealing member 330. That is, the protective resin 370 can surround the side surface and the lower surface of the driver integrated circuit 310 in a space formed by the insulating tape 350 and the sealing member 330. The space formed by the sealing member 330 and the insulating tape 350 can be sealed so that the driver integrated circuit 310 is not exposed to the outside air, and the sealed space can be filled with the protective resin 370.

[0088] Since the first circuit board 300 is attached to the second circuit board 500 in the third area CA3, a member disposed on the first circuit board 300 can be located in the second area CA2. In order to prevent static electricity, the insulating tape 350 needs to completely surround the driver integrated circuit 310 and prevent the driver integrated circuit 310 from being exposed to external air. However, in some cases, the second area CA2 can not provide sufficient space for the insulating tape 350 to be disposed to cover the driver integrated circuit 310. In particular, when the insulating tape 350 is directly disposed on the driver integrated circuit 310, the insulating tape 350 can not completely cover the side surface of the driver integrated circuit 310 due to a step formed by the driver integrated circuit 310. The display device 10 according to the above-described exemplary embodiment can include a sealing member 330 disposed on the first circuit board 300 to prevent the driver integrated circuit 310 from being exposed to external air, and the insulating tape 350 can be attached to the sealing member 330 and the driver integrated circuit 310. Accordingly, the sealing member 330 can compensate for the step formed by the driver integrated circuit 310, and the insulating tape 350 can be attached to the sealing member 330 without a cocking phenomenon and without directly contacting the first circuit board 300.

[0089] Further, since the insulating tape 350 is attached to the upper surface of the sealing member 330, an area on the first circuit board 300 in which the insulating tape 350 is not disposed can be further secured. In the display device 10 according to the exemplary embodiment, the sealing member 330 can be disposed in a narrow space on the first circuit board 300 to provide an area on the first circuit board 300 in which the insulating tape 350 for protecting the driver integrated circuit 310 is disposed and to secure a space in which the second circuit board 500 is disposed.

[0090] The display device 10 according to the exemplary embodiment can protect the driver integrated circuit 310 from being exposed to external air by including the printed layer SPL, the sealing member 330 disposed to partially overlap the printed layer SPL, and the insulating tape 350 disposed on the sealing member 330. The display device 10 can be manufactured by preparing the first circuit board 300 having the printed layer SPL, and forming the sealing member 330 by injecting the sealant 330' (see Figure 11 ) along the printed layer SPL. A method of manufacturing the display device 10 according to the exemplary embodiment will now be described.

[0091] Figure 5 is a flowchart illustrating a method of manufacturing the display device 10 according to the exemplary embodiment.

[0092] Referring to Figure 5A method for manufacturing a display device 10 according to an exemplary embodiment may include: preparing a first circuit board 300 having a printed layer SPL (operation S100); placing a driver integrated circuit 310 in an area surrounded by the printed layer SPL and forming a sealing member 330 on the printed layer SPL (operation S200); and injecting a protective resin 370 into the area surrounded by the sealing member 330 and placing insulating tape 350 on the sealing member 330 and the driver integrated circuit 310 (operation S300).

[0093] During the manufacturing process of the display device 10, the sealing member 330 placed around the driver integrated circuit 310 to protect the driver integrated circuit 310 can be sealed by injecting sealant 330' along the printed layer SPL formed on the first circuit board 300 (see...). Figure 11 This is formed during the injection of sealant 330'. The camera CM (see [reference]) sensing the printed layer SPL formed on the first circuit board 300 can then be activated. Figure 11 The sealant 330' can be injected from the first nozzle NZ1, which moves in the same direction as the camera CM, and can move along the printed layer SPL. The process of manufacturing the display device 10 will now be described in detail with reference to the other accompanying drawings.

[0094] Figures 6 to 13 This is a schematic diagram illustrating the process of manufacturing a display device 10 according to an exemplary embodiment.

[0095] First, refer to Figure 6 A first circuit board 300 with a printed layer SPL is fabricated (operation S100). Although not shown in the figures, the first circuit board 300 includes a first region CA1, a second region CA2, and a third region CA3. The printed layer SPL may be formed in the second region CA2. The printed layer SPL may surround the region where a driver integrated circuit 310 is to be disposed. In the figures, the printed layer SPL completely surrounds a region. The driver integrated circuit 310 may be disposed in the region surrounded by the printed layer SPL. However, the invention is not limited to this example. In another exemplary embodiment, the printed layer SPL may include one or more patterns, and the patterns may be spaced apart from each other to surround a region. Other exemplary embodiments will be described with reference to them.

[0096] Next, refer to Figure 7 and Figure 8 A first circuit board 300 with a printed layer SPL is attached to a display panel 100 and a second circuit board 500, and a driver integrated circuit 310 is placed on the first circuit board 300. Figure 8 It is along Figure 7FIG. 6 is a cross-sectional view taken along a line QM-QM' of FIG. 5, which is a cross section taken across a printed layer SPL formed on the first circuit board 300. As described above, the first circuit board 300 can be attached to the display panel 100 in the first area CA1, and can be attached to the second circuit board 500 in the third area CA3. The second circuit board 500 can be attached to the third area CA3 so that the second circuit board 500 is spaced apart from the printed layer SPL.

[0097] The driver integrated circuit 310 can be placed in the second area CA2 of the first circuit board 300. The driver integrated circuit 310 is placed in an area surrounded by the printed layer SPL, and is spaced apart from the printed layer SPL. Accordingly, an outer surface of the driver integrated circuit 310 can face at least a portion of the printed layer SPL.

[0098] Next, referring to Figure 9 and Figure 10 The sealing member 330 is formed on the printed layer SPL. At least a portion of the sealing member 330 can overlap the printed layer SPL, and the sealing member 330 can be spaced apart from the driver integrated circuit 310. In the drawing, since the printed layer SPL is formed to completely surround an outer surface of the driver integrated circuit 310, the sealing member 330 is directly formed on the printed layer SPL. However, the present application is not limited to this case. In another exemplary embodiment in which the printed layer SPL includes patterns spaced apart from each other, the sealing member 330 can include an area overlapping the printed layer SPL and an area not overlapping the printed layer SPL.

[0099] The sealing member 330 is placed to surround an area surrounded by the printed layer SPL (i.e., an area in which the driver integrated circuit 310 is disposed). The sealing member 330 can be spaced apart from an outer surface of the driver integrated circuit 310 to face the outer surface of the driver integrated circuit 310, and can completely surround the area in which the driver integrated circuit 310 is disposed. The sealing member 330 can be formed by injecting a sealant 330' along the printed layer SPL formed on the first circuit board 300.

[0100] Referring to Figure 11In the method of manufacturing the display apparatus 10 according to the exemplary embodiment, forming the sealing member 330 can include moving a camera CM that senses a position of the printed layer SPL formed on the first circuit board 300 along the printed layer SPL, and injecting a sealant 330' onto the printed layer SPL using a first nozzle NZ1 that moves in the same direction as the camera CM. The camera CM can sense the printed layer SPL formed on the first circuit board 300. The camera CM can move along the printed layer SPL, and the first nozzle NZ1 can move in the same direction as the direction in which the camera CM moves. As shown in the drawing, the camera CM and the first nozzle NZ1 can be provided in the same apparatus, and can move integrally with each other. However, the present application is not limited to this example.

[0101] As the camera CM moves along the printed layer SPL, the first nozzle NZ1 can inject the sealant 330' onto the printed layer SPL. The first nozzle NZ1 moves at a certain distance from the camera CM, and injects the sealant 330' onto the printed layer SPL. The sealant 330' can be injected to a predetermined height on the printed layer SPL, thereby forming the sealing member 330. Since the sealing member 330 is disposed on the first circuit board 300 along the printed layer SPL, it surrounds the area in which the driver integrated circuit 310 is disposed.

[0102] Next, referring to Figure 12 The protective resin 370' is injected into the area surrounded by the sealing member 330. The protective resin 370' can be injected into the area using a second nozzle NZ2. The protective resin 370 can be formed of the injected protective resin 370' to surround the driver integrated circuit 310, and can also be disposed between the lower surface of the driver integrated circuit 310 and the upper surface of the first circuit board 300.

[0103] Finally, referring to Figure 13 The insulating tape 350 is placed on the driver integrated circuit 310 and the sealing member 330 (operation S300). As described above, the insulating tape 350 can be disposed on at least a portion of the upper surface of the sealing member 330. The insulating tape 350 can seal the area defined by the sealing member 330 disposed to surround the driver integrated circuit 310, and can prevent static electricity that can be generated in the driver integrated circuit 310.

[0104] Through the above-described process, the display apparatus 10 in which the sealing member 330 and the insulating tape 350 surround the driver integrated circuit 310 can be manufactured. In the display apparatus 10 according to the exemplary embodiment, the sealing member 330 can be disposed to surround the driver integrated circuit 310, and the insulating tape 350 can be disposed to prevent the driver integrated circuit 310 from being exposed to external air. Due to the insulating tape 350 attached to the upper surface of the sealing member 330, a space in which the second circuit board 500 can be attached to the third area CA3 of the first circuit board 300 can be secured.

[0105] Hereinafter, display apparatuses according to other exemplary embodiments will now be described with reference to other accompanying drawings.

[0106] Figures 14 to 16 are partial cross-sectional views of various first circuit boards of display apparatuses according to exemplary embodiments.

[0107] As described above, the insulating tape 350 of the display apparatus 10 can not necessarily be attached to the entire upper surface of the sealing member 330, and can also be spaced apart from the upper surface of the driver integrated circuit 310.

[0108] First, reference will be made to Figure 14 In the display apparatus 10_1 according to the exemplary embodiment, the width W350_1 of the insulating tape 350_1 in one direction can be smaller than the distance W330_1 between the two opposite outer surfaces of the sealing member 330_1 measured in the same direction (i.e., the first direction DR1 or the second direction DR2). In addition to the width W350_1 of the insulating tape 350_1, Figure 14 The display apparatus 10_1 of Figure 4 is the same as the display apparatus 10 of

[0109] As shown in Figure 14 According to the exemplary embodiment, the insulating tape 350_1 has a width smaller than the distance W330_1 between the two opposite outer surfaces of the sealing member 330_1 measured in the same direction. Accordingly, the insulating tape 350_1 can be attached only to a portion of the upper surface of the sealing member 330_1. The other portion of the upper surface of the sealing member 330_1 is exposed to the outside. Since the upper surface of the sealing member 330_1 does not have adhesion, it can not be contaminated by internal foreign matter even though it is exposed to the outside. The side surface of the insulating tape 350_1 can be recessed inward from the side surface of the sealing member 330_1.

[0110] In the manufacturing process of the display device 10_1, the process of forming the sealing member 330_1 includes injecting a sealant 330' of the sealing member 330_1 along the printed layer SPL. The thickness (in the first direction DR1 or the second direction DR2) of the sealing member 330_1 can be non-uniform depending on the amount or injection time of the sealant 330' injected. However, since the second area CA2 of the first circuit board 300 can provide only a narrow space, the insulating tape 350_1 having a uniform size can be attached to the upper surface of the sealing member 330_1. In some cases, even if the distance W330_1 between the two opposite outer surfaces of the sealing member 330_1 is increased, the outer end of the insulating tape 350_1 can be partially attached to the upper surface of the sealing member 330_1. Accordingly, the insulating tape 350_1 can form an enclosed space with the sealing member 330_1, and the protective resin 370_1 disposed in the space can protect the driver integrated circuit 310. In Figure 14 In the exemplary embodiment shown in FIG. 10B, the height H330_1 of the sealing member 330_1 can be equal to the measured height H310 from the upper surface of the driver integrated circuit 310 to the upper surface of the first circuit board 300.

[0111] In some cases, the height (in the third direction DR3) of the sealing member 330 can be greater than the height of the driver integrated circuit 310. Referring to Figure 15 In the display device 10_2 according to the exemplary embodiment, the height H330_2 of the sealing member 330_2 can be greater than the measured height H310_2 from the upper surface of the driver integrated circuit 310_2 to the upper surface of the first circuit board 300. In addition to the height H330_2 of the sealing member 330_2 being greater than the height H310_2 of the driver integrated circuit 310_2, Figure 15 The display device 10_2 of Figure 4 is the same as the display device 10 of

[0112] As shown in Figure 15 , the upper surface of the sealing member 330_2 can protrude above the upper surface of the driver integrated circuit 310_2. The lower surface of the insulating tape 350_2 attached to at least a portion of the upper surface of the sealing member 330_2 can be spaced apart from the upper surface of the driver integrated circuit 310_2, and the protective resin 370_2 can be disposed in the gap. That is, the protective resin 370_2 can be disposed not only on the side surface and the lower surface of the driver integrated circuit 310_2 but also between the upper surface of the driver integrated circuit 310_2 and the lower surface of the insulating tape 350_2.

[0113] The insulating tape 350_2 can prevent static electricity that can be generated in the driver integrated circuit 310_2, and at the same time form an enclosed space with the sealing member 330_2 so that the driver integrated circuit 310_2 can be protected by the protective resin 370_2. If the sealing member 330_2 is formed to have a lower height than the driver integrated circuit 310_2, the insulating tape 350_2 can be attached to the upper surface of the driver integrated circuit 310_2 and can not be stably attached to the upper surface of the sealing member 330_2. In this case, a step can be formed in the area where the insulating tape 350_2 is attached to the sealing member 330_2. Due to the step, the insulating tape 350_2 can be peeled off, thereby causing the protective resin 370_2 to leak out or the driver integrated circuit 310_2 to be exposed to the outside air.

[0114] To prevent such a case, in the display apparatus 10_2 according to an exemplary embodiment, the height H330_2 of the sealing member 330_2 can have a value greater than the height H310_2 from the upper surface of the driver integrated circuit 310_2 to the upper surface of the first circuit board 300. The insulating tape 350_2 can be spaced apart from the upper surface of the driver integrated circuit 310_2, but can be stably attached to the upper surface of the sealing member 330_2 and can form an enclosed space with the sealing member 330_2. This can prevent the protective resin 370_2 from leaking out, prevent the driver integrated circuit 310_2 from being exposed to the outside air, and prevent static electricity that can be generated in the driver integrated circuit 310_2.

[0115] Further, in some cases, the insulating tape 350_2 can be disposed to contact the upper surface of the driver integrated circuit 310_2. That is, in the display apparatus 10_2 according to an exemplary embodiment, the insulating tape 350_2 can be attached to the upper surface of the driver integrated circuit 310_2. Figure 15 Further, in some cases, the insulating tape 350_2 can be disposed to contact the upper surface of the driver integrated circuit 310_2. That is, in the display apparatus 10_2 according to an exemplary embodiment, the insulating tape 350_2 can be attached to the upper surface of the driver integrated circuit 310_2. Figure 15 In the exemplary embodiment shown in FIG. 10, the width W350_2 of the insulating tape 350_2 in one direction (e.g., the first direction DR1 or the second direction DR2) can be equal to the distance W330_2 between the two opposite side surfaces of the sealing member 330_2 measured in the same direction, but the present application is not limited thereto. In another embodiment, the width W350_2 of the insulating tape 350_2 in one direction (e.g., the first direction DR1 or the second direction DR2) can be smaller than the distance W330_2 between the two opposite side surfaces of the sealing member 330_2 measured in the same direction, as in FIG. 11. Figure 14 In the exemplary embodiment shown in FIG. 10, the width W350_2 of the insulating tape 350_2 in one direction (e.g., the first direction DR1 or the second direction DR2) can be equal to the distance W330_2 between the two opposite side surfaces of the sealing member 330_2 measured in the same direction, but the present application is not limited thereto. In another embodiment, the width W350_2 of the insulating tape 350_2 in one direction (e.g., the first direction DR1 or the second direction DR2) can be smaller than the distance W330_2 between the two opposite side surfaces of the sealing member 330_2 measured in the same direction, as in FIG. 11.

[0116] Referring to FIG. 12, Figure 16In the display apparatus 10_3 according to the exemplary embodiment, at least a portion of the insulating tape 350_3 can be sunken toward the driver integrated circuit 310_3, and a lower surface of the sunken portion can contact an upper surface of the driver integrated circuit 310_3. In addition to the insulating tape 350_3 being attached to the upper surface of the driver integrated circuit 310_3, Figure 16 The display apparatus 10_3 is the same as the display apparatus 10_2 of Figure 15 In the following, any redundant description will be omitted, and the differences will be described.

[0117] As shown in Figure 16 , a central portion of the insulating tape 350_3 can be sunken, and a lower surface of the central portion can be attached to an upper surface of the driver integrated circuit 310_3. Because the upper surface portion of the insulating tape 350_3 is sunken, a step can be formed. However, since the insulating tape 350_3 is attached to the upper surface of the sealing member 330_3 and the upper surface of the driver integrated circuit 310_3, peeling of the insulating tape 350_3 during a manufacturing process of the display apparatus 10_3 can be prevented. In addition, since the area to which the insulating tape 350_3 is attached is increased, a space formed by the insulating tape 350_3 and the sealing member 330_3 can be tightly sealed, and the driver integrated circuit 310_3 can be prevented from being exposed to external air. In addition, similar to the embodiment shown in Figure 15 , a height H330_3 of the sealing member 330_3 can be greater than a height H310_3 measured from the upper surface of the driver integrated circuit 310_3 to the upper surface of the first circuit board 300. In the exemplary embodiment shown in Figure 16 , a width W350_3 of the insulating tape 350_3 in one direction (e.g., the first direction DR1 or the second direction DR2) can be equal to a distance W330_3 between two opposite side surfaces of the sealing member 330_3 measured in the same direction, but the present application is not limited thereto. In another embodiment, the width W350_3 of the insulating tape 350_3 in one direction (e.g., the first direction DR1 or the second direction DR2) can be smaller than the distance W330_3 between the two opposite side surfaces of the sealing member 330_3 measured in the same direction, as in Figure 14 Since the insulating tape 350_3 can form a closed space with the sealing member 330_3, it is possible to prevent the protective resin 370_3 from leaking out, to prevent the driver integrated circuit 310_3 from being exposed to external air, and also to prevent static electricity that can be generated in the driver integrated circuit 310_3.

[0118] In manufacturing the display apparatus 10_3, the sealing member 330_3 can be formed along a print layer SPL formed on the first circuit board 300. The print layer SPL can be spaced apart from the driver integrated circuit 310_3 and disposed to surround the driver integrated circuit 310_3. However, the print layer SPL can not necessarily surround the entire outer surface of the driver integrated circuit 310_3. According to an exemplary embodiment, the print layer SPL can include a plurality of print patterns (e.g., "SPP_4" and "SPP_5" in Figures 17 to 19 , and the print patterns can be spaced apart from each other to surround the outer surface of the driver integrated circuit 310_3. That is, the print layer SPL can partially surround the outer surface of the driver integrated circuit 310_3, and can form a region in which the print layer SPL is not disposed to face the outer surface of the driver integrated circuit 310_3.

[0119] Figure 17 is a partial plan view of a first circuit board 300_4 of a display apparatus 10_4 according to an exemplary embodiment. Figure 18 is a cross-sectional view taken along a line QN-QN' of Figure 17 . Figure 18 shows a cross-section of the display apparatus 10_4 of Figure 17 along a line that crosses a print pattern SPP_4 and a line that partially crosses an upper surface of the first circuit board 300_4 on which the print pattern SPP_4 is not disposed.

[0120] Referring to Figure 17 and Figure 18 , the display apparatus 10_4 according to an exemplary embodiment can include a plurality of print patterns SPP_4, and the print patterns SPP_4 can be spaced apart from each other and disposed to face the outer surface of the driver integrated circuit 310_4. Except that the print layer SPL includes a plurality of print patterns SPP_4, Figure 17 and Figure 18 , the display apparatus 10_4 of Figure 4 is the same as the display apparatus 10 of . Hereinafter, any redundant description will be omitted, and differences will be described.

[0121] As shown in Figure 17 and Figure 18 , the print patterns SPP_4 can be disposed on the first circuit board 300_4. The print patterns SPP_4 can be spaced apart from each other, and each of the print patterns SPP_4 can be spaced apart from and face a portion of the outer surface of the driver integrated circuit 310_4. The print patterns SPP_4 can be understood to substantially constitute one print layer SPL, and the driver integrated circuit 310_4 can be disposed in a region surrounded by the print patterns SPP_4.

[0122] Since the printing layer SPL includes the printing patterns SPP_4 spaced apart from each other, some portions of the sealing member 330_4 can be disposed on the printing patterns SPP_4, and other portions of the sealing member 330_4 can be directly disposed on the first circuit board 300_4. For example, as shown in FIG. 33B, the sealing member 330_4 can include a first sealing member 331_4 overlapping the first printed region SR1 of the first circuit board 300_4 on which the printing patterns SPP_4 are formed, and a second sealing member 332_4 overlapping the second printed region SR2 of the first circuit board 300_4 on which the printing patterns SPP_4 are not formed and on which the printing patterns SPP_4 are not directly disposed. Figure 18 Since the printing layer SPL includes the printing patterns SPP_4 spaced apart from each other, some portions of the sealing member 330_4 can be disposed on the printing patterns SPP_4, and other portions of the sealing member 330_4 can be directly disposed on the first circuit board 300_4. For example, as shown in FIG. 33B, the sealing member 330_4 can include a first sealing member 331_4 overlapping the first printed region SR1 of the first circuit board 300_4 on which the printing patterns SPP_4 are formed, and a second sealing member 332_4 overlapping the second printed region SR2 of the first circuit board 300_4 on which the printing patterns SPP_4 are not formed and on which the printing patterns SPP_4 are not directly disposed.

[0123] Figure 17 and Figure 18 The display apparatus 10_4 of FIGS. 33A and 33B can be manufactured in a process of forming the sealing member 330_4 by moving the camera CM along the printing patterns SPP_4 and injecting the sealant 330' using the first nozzle NZ1 moving in the same direction as the camera CM. The camera CM can move along the regions on which the printing patterns SPP_4 are formed (i.e., the first printed region SR1). In the regions on which the printing patterns SPP_4 are not formed (i.e., the second printed region SR2), since the printing patterns SPP_4 are spaced apart from each other, the camera CM can be moved in the direction in which it moves along the printing patterns SPP_4. For example, as shown in FIG. 33B, the camera CM can be moved along the first printed region SR1 on which the printing patterns SPP_4 are formed, and the second printed region SR2 on which the printing patterns SPP_4 are not formed. Figure 17 and Figure 18The second printing area SR2 in which the printing pattern SPP_4 is not disposed can extend in the first direction DR1 between the printing patterns SPP_4 spaced apart from each other in the first direction DR1 as shown in FIG. 11. When the camera CM moving in a direction along one printing pattern SPP_4 enters the second printing area SR2 at an end of the printing pattern SPP_4, it can keep moving in the same direction. When the camera CM keeps moving in the direction, it can sense an end of another printing pattern SPP_4 and thus move along another printing pattern SPP_4. The first nozzle NZ1 can inject the sealant 330' onto the printing pattern SPP_4 and into a gap between the printing patterns SPP_4 while moving integrally with the camera CM. The sealing member 330_4 can be formed in an area in which the sealant 330' is injected, i.e., the first printing area SR1 in which the printing pattern SPP_4 is disposed and the second printing area SR2 between the printing patterns SPP_4.

[0124] Figure 17 And Figure 18 The display apparatus 10_4 according to another exemplary embodiment can include a plurality of printing patterns SPP_4 spaced apart from each other, and the sealing member 330_4 can include a first sealing member 331_4 formed in a first printing area SR1 in which the printing pattern SPP_4 is disposed and a second sealing member 332_4 formed in a second printing area SR2. The first sealing member 331_4 and the second sealing member 332_4 can be alternately disposed to form the sealing member 330_4, and the sealing member 330_4 can be disposed to surround an outer surface of the driver integrated circuit 310_4. In Figure 17 And Figure 18 In the exemplary embodiment shown in FIGS. 12 and 13, the insulating tape 350_4 can cover the driver integrated circuit 310_4 and can be attached to at least a portion of an upper surface of the sealing member 330_4. The insulating tape 350_4 can overlap the driver integrated circuit 310_4, and both sides of the insulating tape 350_4 can be attached to at least a portion of the upper surface of the sealing member 330_4 to surround the driver integrated circuit 310_4 together with the sealing member 330_4. Accordingly, the driver integrated circuit 310_4 can not be exposed to external air, and the driver integrated circuit 310_4 can be prevented from having static electricity.

[0125] Figure 19 is a partial plan view of a first circuit board 300_5 of a display apparatus 10_5 according to another exemplary embodiment.

[0126] Referring to Figure 19According to the exemplary embodiment, the display apparatus 10_5 can include a plurality of printed patterns SPP_5, and each of the printed patterns SPP_5 can be disposed to meet a corner of an edge of the driver integrated circuit 310_5. In addition to the positions of the printed patterns SPP_5, Figure 19 The display apparatus 10_5 is the same as the display apparatus 10_4 of Figure 18 In the following, any redundant description will be omitted and the differences will be described.

[0127] As shown in Figure 19 , each of the printed patterns SPP_5 can be disposed to meet a respective corner of the driver integrated circuit 310_5. During the manufacturing process of the display apparatus 10_5, the sealing member 330_5 can be formed along the printed patterns SPP_5 so that it is spaced apart from and meets the respective corners of the driver integrated circuit 310_5. In the areas where the printed patterns SPP_5 are not formed, the first nozzle NZ1 can form the sealing member 330_5 as it moves in one direction (e.g., the first direction DR1 or the second direction DR2) from the end of the printed pattern SPP_5. The first nozzle NZ1 moving in the direction can form the sealing member 330_5 along the printed pattern SPP_5 that meets the other corner of the driver integrated circuit 310_5. That is, even though the display apparatus 10_5 according to the exemplary embodiment includes the printed patterns SPP_5 that meet some portions of the driver integrated circuit 310_5, the sealing member 330_5 can be formed to surround the outer surface of the driver integrated circuit 310_5 at a predetermined distance from the outer surface of the driver integrated circuit 310_5. In the exemplary embodiment shown in Figure 19 , the insulating tape 350_5 can cover the driver integrated circuit 310_5 and can be attached to at least a portion of the upper surface of the sealing member 330_5. The insulating tape 350_5 can overlap the driver integrated circuit 310_5, and both sides of the insulating tape 350_5 can be attached to at least a portion of the upper surface of the sealing member 330_5 to surround the driver integrated circuit 310_5 together with the sealing member 330_5. Accordingly, the driver integrated circuit 310_5 can not be exposed to the outside air, and the driver integrated circuit 310_5 can be prevented from having static electricity.

[0128] Figure 20 is a partial plan view of a display apparatus 10_6 according to an exemplary embodiment.

[0129] Referring to Figure 20In the display device 10_6 according to an exemplary embodiment, the second circuit board 500_6 may be attached to portions of the third region CA3 and the second region CA2 of the first circuit board 300_6. The second circuit board 500_6 may surround a side of the sealing member 330 (not shown) extending in a first direction DR1 and two sides of the sealing member 330 connected to the two ends of the side and extending in a second direction DR2, and may be spaced apart from the side and the two sides.

[0130] As described above, in the display device 10_6 according to the exemplary embodiment, since the insulating tape 350_6 is attached to the upper surface of the sealing member 330, the space on the first circuit board 300_6 where the second circuit board 500_6 can be disposed can be increased. Figure 4 The display devices 10 are different, in Figure 20 In the display device 10_6, the second circuit board 500_6 can be configured to cover a portion of the second region CA2 (i.e., the portion of the second region CA2 that is close to the two sides of the sealing member 330 extending in the second direction DR2). The second circuit board 500_6 can be spaced apart from multiple sides of the sealing member 330. Figure 20 In the exemplary embodiment shown, insulating tape 350_6 may cover driver integrated circuit 310_6 and may be attached to at least a portion of the upper surface of sealing member 330. Insulating tape 350_6 may overlap with driver integrated circuit 310_6, and both sides of insulating tape 350_6 may be attached to at least a portion of the upper surface of sealing member 330 to surround driver integrated circuit 310_6 together with sealing member 330. Therefore, driver integrated circuit 310_6 may not be exposed to outside air, and static electricity may be prevented from accumulating on driver integrated circuit 310_6.

[0131] A display device according to an exemplary embodiment includes a sealing member and an insulating tape, wherein the sealing member surrounds a driver integrated circuit, and the insulating tape is disposed on the sealing member and the driver integrated circuit. The insulating tape may be attached at least to the upper surface of the sealing member to cover the driver integrated circuit together with the sealing member. Therefore, the driver integrated circuit can be prevented from being exposed to outside air, and the insulating tape can prevent static electricity that may be generated in the driver integrated circuit.

[0132] Furthermore, because the insulating tape is placed on the sealing member, space is guaranteed on the circuit board on which the driver integrated circuit is placed so that another circuit board can be attached.

[0133] At the conclusion of the detailed description, those skilled in the art will appreciate that many modifications and variations to the preferred, exemplary embodiments of the present application are possible in light of the above teachings. It is, therefore, to be understood that the preferred, exemplary embodiments of the present application disclosed herein are merely illustrative and are not intended to limit the scope of the present application.

Claims

1. A display apparatus comprising: a display panel; a first circuit board having a first end attached to the display panel; a driver integrated circuit disposed on the first circuit board; a sealing member disposed on the first circuit board and surrounding an outer surface of the driver integrated circuit; an insulating tape disposed on the sealing member and the driver integrated circuit; and a printed layer formed on the first circuit board to be spaced apart from the driver integrated circuit, wherein at least a portion of the printed layer surrounds the outer surface of the driver integrated circuit, and at least a portion of the sealing member partially overlaps the printed layer. The insulating tape overlaps the driver integrated circuit and is attached to at least a portion of an upper surface of the sealing member.

2. The display device of claim 1, wherein, A side surface of the insulating tape forms a flat surface with a side surface of the sealing member.

3. The display device of claim 2, wherein, A height of the sealing member is greater than a height measured from an upper surface of the first circuit board to an upper surface of the driver integrated circuit.

4. The display device of claim 2, wherein, At least a portion of the insulating tape is sunken toward the driver integrated circuit, and a lower surface of the sunken portion contacts the upper surface of the driver integrated circuit.

5. The display device of claim 4, wherein, 6.The display apparatus of claim 1, further comprising a protective resin disposed between the insulating tape and the first circuit board in an area surrounded by the sealing member. The protective resin is disposed between the driver integrated circuit and the sealing member.

7. The display device of claim 6, wherein, The protective resin is disposed between an upper surface of the driver integrated circuit and the insulating tape.

8. The display device of claim 6, wherein, 9.The display apparatus of claim 1, further comprising a second circuit board attached to a second end of the first circuit board opposite the first end. The second circuit board is spaced apart from the sealing member.

10. The display device of claim 9, wherein, The second circuit board surrounds one edge of the sealing member and two edges of the sealing member connected to the one edge and is spaced apart from the one edge and the two edges.

11. The display device of claim 10, wherein, The printed layer includes one or more printed patterns, and the printed patterns are spaced apart from each other and face the outer surface of the driver integrated circuit.

12. The display device of claim 1, wherein, The sealing member includes a first area overlapping a printed pattern of the one or more printed patterns and a second area adjacent to the first area and not overlapping the one or more printed patterns.

13. The display device of claim 12, wherein, 14.A display apparatus comprising: a display panel including a display area, a non-display area surrounding the display area, and a coupling area disposed on one side of the non-display area; a first circuit board having a first end attached to the coupling area of the display panel; a second circuit board attached to a second end of the first circuit board opposite the first end; a driver integrated circuit disposed on the first circuit board to be spaced apart from the second circuit board; a printed layer formed on the first circuit board to surround the driver integrated circuit at a predetermined distance from the driver integrated circuit; and a sealing member disposed on the first circuit board to surround the driver integrated circuit. a sealing member provided on the print layer so as to surround the driver integrated circuit, and provided between the driver integrated circuit and the second circuit board; an insulating tape provided on the sealing member and the driver integrated circuit; and a protective resin provided between the insulating tape and the first circuit board in a region surrounded by the sealing member. The insulating tape overlaps the driver integrated circuit, and is attached to at least a portion of an upper surface of the sealing member.

15. The display device of claim 14, wherein, The second circuit board surrounds one side of the sealing member and two sides of the sealing member connected to both ends of the one side, and is spaced apart from the one side and the two sides.

16. The display device of claim 15, wherein, 17. A method of manufacturing a display device, the method comprising: preparing a first circuit board on at least a portion of which a print layer is formed; placing a driver integrated circuit in a region surrounded by the print layer, and forming a sealing member on the print layer; and injecting a protective resin into a region surrounded by the sealing member, and placing an insulating tape on the sealing member and the driver integrated circuit. The forming of the sealing member includes:

18. The method of claim 17, wherein, moving a camera that senses a position of the print layer formed on the first circuit board along the print layer; and injecting a sealant onto the print layer using a first nozzle that moves in the same direction as the camera. In the placing of the insulating tape, the insulating tape is attached to at least a portion of an upper surface of the sealing member.

19. The method of claim 18, wherein, ​

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