Manufacturing device for manufacturing a display device and method for manufacturing a display device

Abstract

The present disclosure relates to a manufacturing device for manufacturing a display device and a method for manufacturing a display device. The manufacturing device for manufacturing a display device includes: a polisher at which a polishing material is supplied to a base member of the display device and the base member is polished with the polishing material to provide a polished base member having a polished surface; a conveyor to which the polished base member is supplied from the polisher and from which the polished base member is conveyed to the outside of the manufacturing device; and a suction unit provided corresponding to the conveyor and by which a pressure around the conveyor is provided to be lower than a pressure at the rest of the manufacturing device.

Description

[0001] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2019-0053908, filed on May 8, 2019, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] One or more embodiments relate to a manufacturing device and a method of using the same. More particularly, one or more embodiments relate to a manufacturing device and a method of manufacturing a display device using the same. Background Art

[0003] Mobile electronic devices are widely used. Tablet personal computers ("PCs") and relatively small electronic devices such as mobile phones are widely used as mobile electronic devices.

[0004] Mobile electronic devices include display devices to provide visual information such as images to users, such as in supporting various functions of the mobile electronic devices. As components for driving display devices have been miniaturized, the use of display devices in mobile electronic devices has gradually increased, and the structure of the display device has been developed to be able to be bent at a predetermined angle from a flat state of the display device. Summary of the invention

[0005] One or more embodiments of the present disclosure include a manufacturing device and a method of manufacturing a display device using the same, which reduces or effectively prevents stains generated on a substrate of a display device when a polishing material is dried after polishing of the substrate during a polishing process during the manufacture of the display device.

[0006] Additional features will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.

[0007] According to one or more embodiments, a manufacturing device for manufacturing a display device includes: a polisher, at which a polishing material is supplied to a base component of the display device, and the base component is polished using the polishing material to provide a polished base component having a polished surface; a conveyor, to which the polished base component is supplied from the polisher and from which the polished base component is transferred to the outside of the manufacturing device; and a suction unit, which is provided corresponding to the conveyor and through which the pressure around the conveyor is provided to be lower than the pressure at the rest of the manufacturing device.

[0008] The manufacturing apparatus may further include a feeder with which the base member is transferred to the polisher. At least one of the feeder and the conveyor may include a roller with which the base member can be moved along the manufacturing apparatus.

[0009] The polishing material may include a liquid.

[0010] The polishing base member provided to the conveyor may include a portion of the polishing material, which remains on the polishing surface of the polishing base member, and the operation of the suction unit maintains the weight of the liquid in the portion of the polishing material on the polishing surface of the polishing base member at a level equal to or greater than approximately 90% of the total weight of the portion of the polishing material on the polishing base member.

[0011] The manufacturing device may further include a polishing head, the polishing head being arranged corresponding to the polisher, and with which the base member is polished at the polisher to provide the polished base member having the polished surface. The polisher may include a belt, with which the base member can be moved along the manufacturing device to be arranged corresponding to the polishing head.

[0012] The suction unit may include: a suction pipe which is spaced apart from the conveyor and into which the gas at the conveyor is sucked, the suction pipe including an inlet portion through which the gas at the conveyor is sucked into the suction pipe; and a conduit connected to the suction pipe.

[0013] The cross-sectional area of ​​the inlet portion of the suction tube may be larger than the cross-sectional area of ​​the conduit.

[0014] An inlet portion of the suction pipe may be disposed corresponding to a portion of the conveyor and the polisher.

[0015] The wall of the suction pipe at its inlet portion may be inclined.

[0016] According to one or more embodiments, a method for manufacturing a display device includes: providing a polishing material on an unpolished base component of the display device, the pressure at the surface of the unpolished base component defining the atmospheric pressure; polishing the surface of the unpolished base component using the polishing material to provide a polished base component, the polished base component having the polishing material on the polishing surface; and providing a pressure different from the atmospheric pressure at the polishing surface of the polishing base component.

[0017] Polishing the surface of the base member may include transferring the base member to a polisher of a manufacturing apparatus by using a roller and transferring the polished base member from the polisher to the outside of the manufacturing apparatus.

[0018] Providing the polishing material on the base member may include providing the base member on a belt of a manufacturing apparatus, with which the base member is movable along the manufacturing apparatus.

[0019] The pressure at the polishing surface of the polishing base member may be lower than the atmospheric pressure defined at the surface of the base member that is not polished.

[0020] Providing the pressure may include providing a suction pipe of a manufacturing apparatus facing the polishing surface of the polishing base member having the polishing material thereon, and sucking gas from around the polishing base member into the suction pipe to provide the pressure different from the atmospheric pressure at the polishing surface.

[0021] The suction pipe may include an inlet portion through which the gas is sucked into the suction pipe from around the polishing base member, and a wall of the suction pipe at the inlet portion may be inclined.

[0022] The cross-sectional area of ​​the inlet portion of the suction pipe may be larger than the total planar area of ​​the base member.

[0023] Polishing the surface of the base component may be performed at a polisher of a manufacturing device, the polisher being located along the manufacturing device before the suction pipe, and the method may further include conveying the polished base component to an area outside the manufacturing device, which is behind the suction pipe and includes the atmospheric pressure.

[0024] The polishing material may include liquid, and the suction tube, which draws the gas from around the polishing base member into the suction tube to provide the pressure different from the atmospheric pressure at the polishing surface, can maintain the weight of the liquid in the polishing material on the polishing surface at a level equal to or greater than about 90% of the total weight of the polishing material on the polishing surface.

[0025] The polishing material may include deionized water, a surfactant, and a slurry.

[0026] According to one or more embodiments, a method for manufacturing a display device includes: supplying a polishing material to a base component of the display device at a polisher of a manufacturing device, and polishing the base component by using the polishing material, polishing the base component to provide a polished base component having the polishing material thereon; conveying the polished base component from the polisher to a conveyor of the manufacturing device, the conveyor following the polisher along the manufacturing device; and sucking gas from around the polished base component at the polisher and the conveyor into a suction pipe of the manufacturing device facing each of the polisher and the conveyor to keep the polishing material on the polished base component at the polisher and the conveyor.

[0027] Other features and advantages of the disclosure will become more apparent from the accompanying drawings, claims, and detailed description.

[0028] These general and specific embodiments may be implemented using a system, method, computer program, or a combination thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] These and / or other features will become apparent and more readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, in which:

[0030] Figure 1 is a cross-sectional view illustrating an embodiment of an apparatus for manufacturing a display device;

[0031] Figure 2 As an example Figure 1 A top plan view of an embodiment of the positional relationship between the suction pipe and the base member of the device;

[0032] Figures 3 to 5 For operation Figure 1 A cross-sectional view of an embodiment of a process in a method for manufacturing a display device;

[0033] Figure 6 is a top plan view illustrating an embodiment of a display device;

[0034] Figure 7 As an example Figure 6 A cross-sectional view of an embodiment of a display device;

[0035] Figure 8 As an example Figure 7 an enlarged cross-sectional view of a display device; and

[0036] Fig. 9 As an example Figure 6 A cross-sectional view of another embodiment of a display device in FIG. DETAILED DESCRIPTION

[0037] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein the same reference numerals refer to the same elements throughout. In this regard, the embodiments may have different forms and should not be construed as being limited to the description set forth herein. Accordingly, the embodiments are described below only with reference to the drawings to explain the features of the present description.

[0038] It will be understood that although the terms “first,” “second,” etc. may be used herein to describe various elements, these elements should not be limited by these terms and these terms are only used to distinguish one element from another.

[0039] The terms used herein are for the purpose of describing specific embodiments only and are not intended to be limiting. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of..." when following a list of elements modify the entire list of elements, rather than modifying the individual elements in the list.

[0040] It will be further understood that the terms “include” and / or “comprises” used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0041] It will be understood that when a layer, region, or element is referred to as being associated with another layer, region, or element, such as being "on" another layer, region, or element, it can be directly or indirectly on the other layer, region, or element, or intervening layers, regions, or elements may exist between them. In contrast, when a layer, region, or element is referred to as being associated with another layer, region, or element, such as being "directly" "on" another layer, region, or element, there are no intervening layers, regions, or elements between them.

[0042] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element as illustrated in the figure. It will be understood that relative terms are intended to include different orientations of the device in addition to the orientation depicted in the figure. For example, if the device in one figure is turned over, the element described as being on the "lower" side of the other element will then be oriented on the "upper" side of the other element. Therefore, the exemplary term "lower" may include both "lower" and "upper" orientations depending on the specific orientation of the figure. Similarly, if the device in one figure is turned over, the element described as being "below" or "below" the other element will then be oriented "above" the other element. Therefore, the exemplary term "below" or "below" may include both upper and lower orientations.

[0043] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable range of deviation from a particular value determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, 20%, 10%, or 5% of the stated value.

[0044] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0045] Exemplary embodiments are described herein with reference to schematically illustrated cross-sectional views as idealized embodiments. Thus, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances should be expected. Therefore, the embodiments described herein should not be construed as being limited to the specific shapes of the zones illustrated herein, but will include deviations in shapes due to, for example, manufacturing. For example, a zone illustrated or described as flat may typically have rough and / or nonlinear features. In addition, illustrated acute angles may be rounded. Therefore, the zones illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the zones, and are not intended to limit the scope of the claims.

[0046] In the drawings, the size of the elements may be exaggerated for convenience of explanation. For example, since the size and thickness of the elements in the drawings are arbitrarily illustrated for convenience of explanation, the present disclosure is not limited thereto.

[0047] In the following embodiments, the x-axis, y-axis and z-axis are not limited to the three axes of the rectangular coordinate system, and can be interpreted in a broader sense. For example, the x-axis, y-axis and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0048] When a certain embodiment can be implemented differently, the specific process order may be different from the described order. For example, two processes described in succession may be performed substantially simultaneously or in the reverse order of the described order.

[0049] When foreign matter is attached to a substrate used in a display device, defects may occur in the display device. Structures and manufacturing methods related to display devices have been studied in which foreign matter is removed during display device manufacturing to reduce or effectively prevent defects in the display device.

[0050] Figure 1A cross-sectional view illustrating an example of a manufacturing apparatus for manufacturing a display device. Figure 2 As an example Figure 1 A top plan view of an embodiment of the positional relationship between the suction pipe and the base member of the manufacturing device.

[0051] See also Figure 1 and Figure 2 , an apparatus 100 for manufacturing a display device may include a feeder 110 , a polisher 120 , a polishing head 130 , a conveyor 140 , and a suction unit 150 .

[0052] The base member M is supplied from the outside of the device 100 and is installed on the feeder 110. In this case, the feeder 110 may include a first support 111, a first roller 112, and a first driver 113. The first support 111 may include a plurality of frames connected to each other. One of the plurality of frames may be fixed to a surface such as the ground, an inner surface of a building, etc. to fix the position of the first support 111.

[0053] The first roller 112 may be located on or connected to the first support 111 and may be rotatable around the rotation axis. The first roller 112 may be provided in plurality (e.g., a plurality of first rollers 112) and each may be located on or connected to the first support 111 to be spaced apart from each other along the length of the first support 111. The first driver 113 may be connected to the first roller 112 and may drive the first roller 112 to rotate the first roller 112 around the rotation axis.

[0054] The first driver 113 may be connected to a first roller 112 of a plurality of first rollers 112. In one embodiment, for example, the first driver 113 may include a motor. The first driver 113 may be provided as a plurality (e.g., a plurality of first drivers 113) to correspond to the first rollers 112 respectively, without limitation thereto. In another embodiment, the first driver 113 may include a chain connected to each of the plurality of first rollers 112, a sprocket connected to the chain and the first roller 112, and a motor connected to the sprocket. The chain may be movable by actuation of the first driver 113. The first driver 113 is not limited thereto, and may include any device and structure connected to each of the plurality of first rollers 112 to rotate the first roller 112 or connected to a portion or all of the plurality of first rollers 112 to simultaneously drive and rotate the plurality of first rollers 112. However, for ease of explanation, the following description includes a single first driver 113 corresponding to a single first roller 112, and driving the first roller 112 to rotate the first roller 112.

[0055] Polishing of the base member M supplied by the feeder 110 may be provided at the polisher 120. The polisher 120 may include: a belt 121 on which the base member M is placed and which is movable relative to the polishing head 130; a second roller 122; the second roller 122 is provided as a plurality of (e.g., second rollers 122) respectively located at opposite ends of the belt 121 (such as on the inner side of the belt 121); and a second driver 123 for driving the second roller 122.

[0056] The belt 121 may be wound on the second roller 122, and the position of the belt 121 may change as the second roller 122 rotates. In addition, a plurality of second rollers 122 may be provided, and may be spaced apart from each other along the length of the polisher 120 to maintain the tension of the belt 121 at a constant level. The second driver 123 may include a motor, etc., and may be positioned corresponding to the second roller 122 to drive and rotate the second roller 122. In this case, the second driver 123 may correspond to at least one of the plurality of second rollers 122.

[0057] In addition, the polisher 120 may further include a second support 124 on the belt 121. In this case, the base member M may be placed on the second support 124, and the second support 124 may support the base member M during surface polishing of the base member M. The second support 124 may be a plate-type support.

[0058] The polishing head 130 may be positioned to correspond to the polisher 120. In one embodiment, for example, the polishing head 130 may be located above the surface of the belt 121 on which the second support 124 is provided. In this case, the polishing head 130 may be movable in various directions. In one embodiment, for example, the polishing head 130 may be Figure 1 The surface of the base member M that can be polished at the polisher 120 may be disposed in a plane defined by the X-direction and the Y-direction.

[0059] The polishing head 130 may include a polishing head body 131, a polishing head rotator 132, a polishing pad 133, and a polishing driver 134. The polishing head body 131 may be connected to the polishing driver 134 and may be linearly moved by actuation of the polishing driver 134. In addition, the polishing head rotator 132 may be rotatably connected to the polishing head body 131. In this case, the polishing pad 133 may be connected to the polishing head rotator 132 and may be rotatable by rotation of the polishing head rotator 132. The polishing pad 133 may be a plate-type pad located on a lower surface of the polishing head rotator 132 and used to polish the surface of the base member M.

[0060] The polishing driver 134 may include a first polishing driver 134A and a second polishing driver 134B. The first polishing driver 134A is connected to the polishing head body 131, and the polishing head rotator 132 may be rotated by the operation of the first polishing driver 134A. The first polishing driver 134A may extend into and / or pass through the polishing head body 131 to be connected to the polishing head rotator 132, without being limited thereto. The second polishing driver 134B corresponds to and / or is connected to the polishing head body 131, and the polishing head body 131 may be linearly moved by the operation of the second polishing driver 134B.

[0061] The first polishing driver 134A may include a motor connected to the polishing head rotator 132 and used to rotate the polishing head rotator 132. In another embodiment, the first polishing driver 134A may include a motor connected to the polishing head rotator 132 and used to rotate the polishing head rotator 132; and a speed reducer located between the motor and the polishing head rotator 132.

[0062] The second polishing driver 134B may linearly move the polishing head body 131 by using any of various methods. In this case, at least one second polishing driver 134B may be provided. In one embodiment, for example, a plurality of second polishing drivers 134B may be provided, and each second polishing driver 134B may linearly move the polishing head body 131. Figure 1 In this case, the second polishing driver 134B may have any of various shapes. In one embodiment, for example, the second polishing driver 134B may include a cylinder. In another embodiment, the second polishing driver 134B may include a ball screw and a motor connected to the ball screw. In another embodiment, the second polishing driver 134B may include a linear motor. In this case, the second polishing driver 134B is not limited thereto, and may include any device and structure connected to the polishing head body 131 and with which the polishing head body 131 can move linearly in various directions. In this case, the first second polishing driver 134B of the plurality of second polishing drivers 134B may be connected to the polishing head body 131, and the second second polishing driver 134B of the plurality of second polishing drivers 134B may be connected to the first second polishing driver 134B of the second polishing driver 134B connected to the polishing head body 131. In addition, the third second polishing driver 134B of the plurality of second polishing drivers 134B may be connected to the second second polishing driver 134B of the plurality of second polishing drivers 134B. In this case, each second polishing driver 134B may linearly move the polishing head body 131 in a single direction.

[0063] The conveyor 140 may be spaced apart from the polisher 120, and may transfer the base member M polished at the polisher 120. The conveyor 140 may include a third support 141, a third roller 142, and a third driver 143. In this case, the third support 141, the third roller 142, and the third driver 143 may be provided or formed to be the same as or similar to the first support 111, the first roller 112, and the first driver 113 of the feeder 110.

[0064] The conveyor 140 may transfer the base member M from the polisher 120, and may transport the base member M to the outside of the apparatus 100. Along the apparatus 100 (e.g., the moving direction indicated by the arrow in the X-direction), the feeder 110 is before the polisher 120, and the conveyor 140 is after the polisher 120, and the area outside the apparatus 100 is after the conveyor 140. In one embodiment, for example, the conveyor 140 may feed the base member M to an external cleaner (not shown) provided outside the apparatus 100.

[0065] The suction unit 150 may face the conveyor 140. The suction unit 150 may include a suction tube 151, a connecting tube (also referred to as a conduit) 152, a pump 153, and a valve 154.

[0066] The suction pipe 151 may face a portion of each of the polisher 120 and the conveyor 140. Figure 1 As shown, the suction pipe 151 may lead to a portion of the polisher 120 and a portion of the conveyor 140. In this case, as shown in FIG. Figure 2 As shown, the plane area of ​​the inlet portion 151A of the suction pipe 151 defined along the X-direction and the Y-direction may be greater than the total plane area of ​​the base member M. That is, in a top plan view, the edge (or end, the edge defined by the inlet portion 151A) of the suction pipe 151 may surround the edge of the base member M, so that the entire edge of the base member M may be located inside the edge of the suction pipe 151. In this case, the inlet portion 151A of the suction pipe 151 may completely cover the substrate 21 of the display device (see Figure 6-Figure 9 )'s front surface.

[0067] The inlet portion 151A of the suction pipe 151 may extend from the connecting pipe 152 and include a horizontal portion (eg, Figure 1 The wall of the suction pipe 151 at the vertical portion may define an inlet portion 151A of the suction pipe 151 and may be inclined. In one embodiment, for example, the inlet portion 151A of the suction pipe 151 may be inclined in the height direction (for example, Figure 1In this case, the width of the inlet portion 151A of the suction pipe 151 along the X-direction may decrease in a direction toward the connecting pipe 152. That is, the inner plane area of ​​the suction pipe 151 taken in a plane defined by the X-direction and the Y-direction may gradually decrease along the height direction of the suction pipe 151 from the edge of the suction pipe 151 (e.g., at the distal end of the inlet portion 151A).

[0068] The connecting pipe 152 may be connected to the suction pipe 151. The connecting pipe 152 may be fluidly connected to the suction pipe 151 that leads to the outside of the suction unit 150 at the polisher 120 and the conveyor 140. In this case, the connecting pipe 152 may guide the gas from the suction pipe 151 to the outside of the suction unit 150 and / or the device 100. In this case, the cross-sectional area of ​​the connecting pipe 152 may be smaller than the cross-sectional area of ​​the suction pipe 151. The connecting pipe 152 connected to the suction pipe 151 may provide a flow channel through which materials (e.g., solids, gases, etc.) are conveyed from the inlet portion 151A to the outside of the suction unit 150 and / or the device 100.

[0069] The pump 153 may correspond to and be connected to the connecting tube 152, such as being fluidly connected to the connecting tube 152. The actuation of the pump 153 may provide a suction force to suck materials such as gas from around a portion of the polisher 120 and the conveyor 140 through the suction tube 151. In this case, the pump 153 may be any of various types. In one embodiment, for example, the pump 153 may adjust the flow of gas through the connecting tube 152 so that the gas has a constant pressure in the suction unit 150. In another embodiment, the pump 153 may adjust the flow of gas through the connecting tube 152 so that the pressure of the gas in the suction unit 150 varies.

[0070] The valve 154 may correspond to and / or be connected to the connection pipe 152, such as being fluidly connected to the connection pipe 152. In this case, the valve 154 may be located between the suction pipe 151 and the pump 153, or may be located at the rear end of the pump 153. For ease of explanation, the following will be described in detail on the assumption that the valve 154 is located at the rear end of the pump 153.

[0071] Actuation of the valve 154 may open or close the connecting pipe 152. In this case, the valve 154 may include a solenoid valve that operates according to an external signal provided from the outside of the suction unit 150 and / or the device 100. In one embodiment, for example, the valve 154 may interoperate with the pump 153 and may open the connecting pipe 152 when the pump 153 is operating. In contrast, the valve 154 may interoperate with the pump 153 and may not open the connecting pipe 152 when the pump 153 is not operating. In another embodiment, regardless of the operation of the pump 153, the actuation of the valve 154 may adjust the degree of opening of the connecting pipe 152 to adjust the internal pressure of the connecting pipe 152.

[0072] The operation of the apparatus 100 will now be described in detail.

[0073] Figure 3 As an example operation Figure 1 sectional views of an embodiment of a process in a method for manufacturing an apparatus 100 for a display device.

[0074] See also Figure 3 , the base member M may be provided on the feeder 110 from the outside of the device 100 by using any of various methods. In one embodiment, for example, the base member M may be fed to the feeder 110 by using a robot arm. In another embodiment, the user may manually supply the base member M to the feeder 110, such as by using a separate mechanism.

[0075] The base member M may be directly provided on the feeder 110, or may be mounted on a bearing member (not shown) provided on the feeder 110. In this case, the bearing member may be a plate-type member including glass, etc. For ease of explanation, the following will be described in detail on the assumption that the base member M is directly provided on the feeder 110.

[0076] The base component M may be any of various types. In one embodiment, for example, the base component M may be used to manufacture a single display device (not shown) (e.g., corresponding to a single display device). In another embodiment, the base component M may be used to manufacture multiple display devices (e.g., corresponding to multiple display devices). In this case, after multiple display units (not shown) of each display device in the display device are provided or formed on the base component M, the base component M may be divided into a plurality of parts to correspond to the multiple display units for the multiple display devices, respectively.

[0077] The base component M may include various materials. For example, the base component M may include glass or a polymer resin. The polymer resin may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate or cellulose acetate propionate. The base component M may have a multilayer structure including a layer containing a polymer resin and an inorganic layer (not shown). For ease of explanation, the following will be described in detail under the assumption that the base component M includes glass.

[0078] The base member 144 may be movable according to the operation of the first driver 113. In this case, the first roller 112 may rotate according to the operation of each first driver 113. In this case, an elastic material such as rubber or silicone may be located on the outer surface of the first roller 112 to increase the friction between the first roller 112 and the base member 144.

[0079] Figure 4 As an example operation Figure 1 FIG. 1 is a cross-sectional view of an embodiment of another process in a method for manufacturing an apparatus 100 for a display device.

[0080] See also Figure 4 , the base member M may be moved from the feeder 110 to the polisher 120 (right arrow between the feeder 110 and the polisher 120). In this case, the first driver 113 and the second driver 123 may interoperate with each other. When the second driver 123 operates, the second roller 122 may rotate to rotate the belt 121. The interoperation of the first driver 113 and the second driver 123 may provide the base member M to the belt 121.

[0081] The second driver 123 may operate to rotate the belt 121 conveying the base member M in a moving direction (eg, X-direction) and provide the base member M at a predetermined position along the polisher 120. In this case, the base member M may be located below the polishing head 130.

[0082] Termination of the operation of the second driver 123 may stop the movement of the belt 121 and fix the position of the base member M along the polisher 120. Operation of the first polishing driver 134A and / or the second polishing driver 134B may linearly move the polishing head body 131 to correspond to the surface of the base member M. The polishing head 130 may contact the surface of the base member M to polish the surface.

[0083] While or before polishing is performed, the polishing material P may be supplied to the surface of the base member M. In this case, the polishing material P may be supplied by using any of various methods. In one embodiment, for example, the polishing material P may be supplied to the base member M through the polishing head 130. In one embodiment, for example, the polishing material P may be supplied to the base member M from the outside of the polishing head 130 through a flow path provided or formed in the polishing head 130. In this case, a hole through which the polishing material P is supplied may be provided or formed in the polishing pad 133. That is, the flow path and the hole in the polishing pad 133 may be fluidly connected to each other.

[0084] In another embodiment, the polishing material P may be supplied to the surface of the base member M by a polishing material supplier 160 provided independently of the polishing head 130. In this case, the polishing material supplier 160 may be a nozzle-type supplier. For ease of explanation, the following will be described in detail under the assumption that the polishing material supplier 160 is provided independently of the polishing head 130 and the polishing material P is supplied to the base member M before the polishing head 130 operates.

[0085] The polishing material P used to polish the surface of the base member M may include deionized water ("DIW"), a surfactant, and a slurry.

[0086] In one embodiment, the base member M may be supported by the second support 124 while the surface of the base member M is polished by using the polishing head 130 and the polishing material P. That is, the second support 124 may support the base member M and thus may reduce or effectively prevent the base member M from moving during operation of the polishing head 130.

[0087] In another embodiment, the base member M may be temporarily supported by another supporting structure similar to the second support member 124. In one embodiment, for example, a separate frame may be temporarily supported between the belt 121 and the base member M, or the portion of the belt 121 on which the base member M is mounted may have a thickness and hardness different from the rest of the belt 121, and may support the base member M during the polishing of the base member M. In this case, the method of supporting the base member M during the polishing of the base member M is not limited thereto. Any device and structure for minimizing the movement of the base member M during the polishing of the base member M by the polishing head 130 may be used, as long as the same pressure is provided by the polishing head 130 on the entire surface of the base member M. That is, within the same one base member M, the first portion of the surface that has been polished (e.g., the polished portion), the second portion of the surface that is actively being polished, and the third portion of the surface that has not yet been polished (e.g., the pre-polishing portion) are all supported by the device and structure for minimizing the movement of the base member M at the polisher 120, so that the polishing head 130 applies the same pressure on the entire surface of the base member M.

[0088] When polishing of the surface of the base member M is completed, a portion of the polishing material P may remain on the polished surface of the base member M. In this case, the second driver 123 and the third driver 143 may operate to feed the base member M on which a portion of the polishing material P remains to the conveyor 140 .

[0089] Figure 5 As an example operation Figure 1 FIG. 1 is a cross-sectional view of an embodiment of still another process in a method for manufacturing an apparatus 100 for a display device.

[0090] See also Figure 5 , the base member M fed to the conveyor 140 may be provided at a static position on the conveyor 140 before being conveyed to another external device or equipment (e.g., a cleaner (not shown) outside the apparatus 100). In this case, the polishing material P remaining on the base member M may be dried, and the dried polishing material P may be adhered to the surface of the base member M. In particular, the polishing material P on the base member M may be removed by a separate cleaner, but when the polishing material P is dried, the polishing material P may not be completely removed from the base member M, and may not be separated from the base member M.

[0091] To improve the removal of the dried polishing material P to facilitate its complete removal and separation from the polished base member M, the operation of the pump 153 can reduce or effectively prevent the polishing material P from flowing along the surface of the base member M and over its edge to flow off the base member M (e.g., in the direction of gravity or with respect to the base member M). Figure 5 In particular, the pump 153 may be operated to minimize the flow or evaporation of the liquid (eg, deionized water) of the polishing material P over the edge of the base member M and along the side surface of the base member M.

[0092] In detail, from the time when the base member M is fed from the polisher 120 to the conveyor 140 to the time when the base member M is located on the conveyor 140, the suction unit 150 can reduce or effectively prevent the polishing material P from being separated from the base member M due to the above-mentioned flow or evaporation. That is, when the pump 153 operates, gas can be sucked into the suction pipe 151, such as from the environment outside thereof. In this case, since the apparatus 100 for manufacturing a display device is located in an atmospheric pressure state, a pressure different from the atmospheric pressure can be provided or formed around the suction pipe 151. The pressure at the surface of the base member M that is not polished can define the atmospheric pressure, and can be different from the pressure at the polishing surface of the base member M that is polished.

[0093] In one embodiment, for example, the pressure around the suction pipe 151 (or the pressure inside the suction pipe 151) may be lower than the atmospheric pressure. In this case, the pressure around a portion of the polisher 120 and the conveyor 140, and therefore the pressure at the polishing surface of the base member M at the portion of the polisher 120 and the conveyor 140, may be lower than the pressure of the rest of the device 100. That is, the pressure around the portion of the polisher 120 and the conveyor 140 may be lower than the atmospheric pressure. In this case, the pump 153 may enable the pressure inside the connecting pipe 152 and the suction pipe 151 to be similar to the pressure of the vacuum state. That is, the suction unit 150 provided at least corresponding to the conveyor 140 and a portion of the polisher 120 provides a pressure around the conveyor 140 that is lower than the pressure at the rest of the device 100 (e.g., atmospheric pressure).

[0094] In this case, as the gas around the portion of the polisher 120 and the conveyor 140 is sucked into the suction pipe 151 ( Figure 5 ), the polishing material P on the base member M may be forced in a direction toward the suction tube 151 (e.g., along the Z-direction) without being sucked into the suction tube 151. At this time, due to the surface tension between the base member M and the polishing material P, the polishing material P (e.g., particularly its liquid component) may not be separated from the base member M.

[0095] In this case, the pump 153 and / or the valve 154 may adjust the pressure inside the connecting pipe 152 and / or the suction pipe 151. In addition, when the wall of the suction pipe 151 at its inlet portion 151A is inclined as described above, the inner area of ​​the suction pipe 151 may gradually decrease in the height direction from its inlet through which the gas is introduced, and the gas may be sucked upward over the entire planar area of ​​the base member M.

[0096] The suction unit 150 may continuously perform the suction function until the base member M is provided outside the plane area of ​​the suction pipe 151 .

[0097] The base member M may be supplied to a cleaner (not shown) or the like to remove the polishing material P remaining on the base member M after the conveyor 140. In one embodiment, after the polishing material P remaining on the base member M is removed after the conveyor 140, a display unit D and / or a display device 20 or 20′ (such as a display device 20′) may be provided on the polished base member M. Figures 6 to 9 Various layers (as shown) are formed to manufacture a display device.

[0098] In this case, when the base member M is transferred to the outside of the apparatus 100, the weight of the deionized water of the polishing material P remaining on the base member M may be equal to or greater than about 90% of the total weight of the polishing material P. In this case, when the weight of the deionized water of the polishing material P remaining on the base member M is less than about 90% of the total weight of the polishing material P, the slurry in the polishing material P remaining on the base member M may not be properly removed during the cleaning of the base member M, and thus, stains may be generated on the base member M or the flatness of the polishing surface of the base member M may be reduced. That is, the operation of the suction unit 150 maintains the weight of the liquid in the remaining portion of the polishing material P on the polishing surface of the polished form of the base member M at a level equal to or greater than about 90% of the total weight of the remaining portion of the polishing material P on the polishing surface of the polished form of the base member M.

[0099] Accordingly, since one or more embodiments of the device 100 and the method for manufacturing a display device using the device 100 reduce or effectively prevent the polishing material P (for example, in particular its liquid component) from separating from the polished base component M to promote complete removal and separation of the polishing material P remaining on the polished base component M, supplying a separate liquid after polishing to minimize or effectively prevent drying of the polishing material P on the base component M can be avoided.

[0100] Since one or more embodiments of the apparatus 100 and the method of making the apparatus 100 manufacture a display device omit the removal of the polishing material P at the feeder 110, the polisher 120, the polishing head 130, and / or the conveyor 140, the possibility of the polishing material P being scattered during removal such as by using a nozzle, etc. is reduced or effectively prevented. Therefore, contamination due to the scattered polishing material P at one of the feeder 110, the polisher 120, the polishing head 130, and the conveyor 140 is reduced or effectively prevented.

[0101] One or more embodiments of the apparatus 100 and a method of manufacturing a display device using the apparatus 100 may provide a uniform planarized surface of the base member M after the base member M is polished.

[0102] Figure 6 2 is a top plan view illustrating an embodiment of a display device 20 or 20 ′.

[0103] See also Figure 6 In the display device 20 or the display device 20', the substrate 21 may include a display area DA and a non-display area NDA outside the display area DA. Figures 7 to 9 The power wiring (not shown) may be located in the display area DA, and the power wiring (not shown) may be located in the non-display area NDA. In addition, the pad unit C may be located in the non-display area NDA. An image may be displayed at the display area DA. The image may be generated and / or displayed by the display unit D. The power wiring and / or the pad unit C may be connected to the display unit D for driving the display unit D to generate and / or display an image. In one or more embodiments, the substrate 21 may be the base component M previously described with respect to the device 100, without being limited thereto.

[0104] Figure 7 2 is a cross-sectional view illustrating an embodiment of the display device 20 . Figure 8 for Figure 7 FIG. 2 is an enlarged cross-sectional view of an embodiment of a portion of a display unit of a display device 20 .

[0105] See also Figure 7 and Figure 8 , the display device 20 may include a substrate 21, a display unit D, and a thin film encapsulation layer E. In this case, the display unit D may include a thin film transistor ("TFT"), a passivation film 27, and a pixel electrode 28-1.

[0106] The substrate 21 may include a glass material or a polymer resin. In this case, the polymer resin may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose acetate propionate, or cellulose triacetate. The polymer resin may be transparent. In this case, the substrate 21 may have a single-layer or multi-layer structure including the polymer resin.

[0107] Can be used Figures 1 to 5 The substrate 21 is provided or formed from the base member M. In one embodiment, for example, one of the base members M may be polished, and then one of the substrates 21 may be provided or formed from the one of the base members M. In another embodiment, one base member M may be polished and then may be divided, such as by being cut, or a plurality of display units D may be provided or formed on the base member M, and then may be separated from the rest of the base member M, such as by being cut, to provide a plurality of substrates 21, and a plurality of display devices 20 are provided from the plurality of substrates 21, respectively.

[0108] The TFT may be provided or formed on the substrate 21 , the passivation film 27 may be provided or formed to cover the TFT, and the organic light emitting device (“OLED”) 28 may be provided or formed on the passivation film 27 .

[0109] A buffer layer 22 including or formed of an organic material and / or an inorganic material may be further provided or formed on the top surface of the substrate 21, and may include SiO x (x≥1) or SiN x (x≥1).

[0110] An active layer 23 arranged in a predetermined pattern is provided or formed on the buffer layer 22, and the active layer 23 is covered by a gate insulating layer 24. The active layer 23 includes a source region 23-1 and a drain region 23-3, and further includes a channel region 23-2 between the source region 23-1 and the drain region 23-3.

[0111] The active layer 23 may include various materials. In one embodiment, for example, the active layer 23 may include an inorganic semiconductor material, such as amorphous silicon or crystalline silicon. Alternatively, the active layer 23 may include an oxide semiconductor. Alternatively, the active layer 23 may include an organic semiconductor material. However, for ease of explanation, the following will be described in detail under the assumption that the active layer 23 includes or is formed of amorphous silicon.

[0112] The active layer 23 may be defined by providing or forming an amorphous silicon film on the buffer layer 22, crystallizing the amorphous silicon film into a polycrystalline silicon film, and patterning the polycrystalline silicon film. According to the type of TFT, such as a driving TFT (not shown) or a switching TFT (not shown), the source region 23-1 and the drain region 23-3 are doped with impurities.

[0113] A gate electrode 25 corresponding to the active layer 23 and an interlayer insulating layer 26 covering the gate electrode 25 are provided or formed on a top surface of the gate insulating layer 24 .

[0114] A contact hole H1 is provided or formed in the interlayer insulating layer 26 and the gate insulating layer 24, and a source electrode 27-1 and a drain electrode 27-2 are provided or formed on the interlayer insulating layer 26 to contact the source region 23-1 and the drain region 23-3, respectively.

[0115] A passivation film 27 is provided or formed on the TFT, and a pixel electrode 28-1 of the OLED 28 is provided or formed on the passivation film 27. The pixel electrode 28-1 contacts the drain electrode 27-2 of the TFT at a through hole H2 provided or formed in the passivation film 27. The passivation film 27 may have a single-layer or multi-layer structure including an inorganic material and / or an organic material, and may be provided or formed as a planarization film having a flat top surface regardless of the curvature of the underlying film, or may be provided or formed to be curved according to the curvature of the underlying film. The passivation film 27 may include a transparent insulating material to achieve a resonance effect.

[0116] After the pixel electrode 28 - 1 is provided or formed on the passivation film 27 , a pixel defining film 29 is provided or formed by using an organic material and / or an inorganic material to cover the pixel electrode 28 - 1 and the passivation film 27 , and an opening is provided or formed to expose the pixel electrode 28 - 1 .

[0117] The intermediate layer 28-2 and the counter electrode 28-3 are provided or formed on the pixel electrode 28-1, such as to correspond to a single pixel electrode 28-1. In another embodiment, the counter electrode 28-3 may be provided or formed on the entire display unit D, such as to be provided in common for more than one pixel electrode 28-1. In this case, the counter electrode 28-3 may be provided or formed on the intermediate layer 28-2 and the pixel defining film 29. For ease of explanation, the following will be described in detail under the assumption that the counter electrode 28-3 is provided or formed on the intermediate layer 28-2 and the pixel defining film 29.

[0118] The pixel electrode 28 - 1 functions as an anode, and the counter electrode 28 - 3 functions as a cathode, or vice versa.

[0119] The pixel electrode 28 - 1 and the counter electrode 28 - 3 are insulated from each other by the intermediate layer 28 - 2 , and by applying voltages having different polarities to the intermediate layer 28 - 2 , the organic emission layer emits light.

[0120] The intermediate layer 28-2 may include an organic emission layer. As a selective example, the intermediate layer 28-2 may include an organic emission layer, and may further include at least one of a hole injection layer ("HIL"), a hole transport layer ("HTL"), an electron transport layer ("ETL"), and an electron injection layer ("EIL"). The present invention is not limited thereto, and the intermediate layer 28-2 may include an organic emission layer, and may further include other various functional layers (not shown).

[0121] The plurality of intermediate layers 28-2 may be discretely provided as a pattern to form the display area DA. In particular, the plurality of intermediate layers 28-2 may form the display area DA having a shape other than a rectangular shape or a square shape. In this case, the plurality of intermediate layers 28-2 may be located inside the display area DA to be spaced apart from each other.

[0122] One unit pixel of the display device 20 may include a plurality of sub-pixels at which various colors are generated and / or emitted. In one embodiment, for example, the plurality of sub-pixels may include sub-pixels emitting red light, green light, and blue light, and / or may include sub-pixels emitting red light, green light, blue light, and white light.

[0123] The thin film encapsulation layer E may include a plurality of inorganic layers, or may include an inorganic layer and an organic layer.

[0124] The organic layer of the thin film encapsulation layer E may include a polymer or be formed of a polymer, and preferably, may have a single layer or multilayer structure including one of polyethylene terephthalate, polyimide, polycarbonate, epoxy resin, polyethylene and polyacrylate. More preferably, the organic layer may include polyacrylate, and in detail, may include a polymerized monomer including a diacrylate monomer and a triacrylate monomer. The monomer may further include a monoacrylate monomer. In addition, the monomer may further include any suitable photoinitiator, such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide ("TPO"), but the present disclosure is not limited thereto.

[0125] The inorganic layer of the thin film encapsulation layer E may have a single layer or multi-layer structure including metal oxide or metal nitride. In detail, the inorganic layer may include SiN x 、Al 2 O 3 、SiO 2 and TiO 2 One of them.

[0126] The uppermost layer of the thin film encapsulation layer E, which is exposed to the outside of the display device 20 , may be an inorganic layer to reduce or effectively prevent moisture from penetrating into the OLED 28 .

[0127] The thin film encapsulation layer E may include at least one sandwich structure in which at least one organic layer is between at least two inorganic layers. Alternatively, the thin film encapsulation layer E may include at least one sandwich structure in which at least one inorganic layer is between at least two organic layers. Alternatively, the thin film encapsulation layer E may include a sandwich structure in which at least one organic layer is between at least two inorganic layers and a sandwich structure in which at least one inorganic layer is between at least two organic layers.

[0128] The thin film encapsulation layer E may include a first inorganic layer I-1, a first organic layer O-1, and a second inorganic layer I-2 sequentially stacked on the OLED 28 of the display unit D.

[0129] Alternatively, the thin film encapsulation layer E may include a first inorganic layer I-1, a first organic layer O-1, a second inorganic layer I-2, a second organic layer, and a third inorganic layer sequentially stacked on the OLED 28 of the display unit D.

[0130] Alternatively, the thin film encapsulation layer E may include a first inorganic layer I-1, a first organic layer O-1, a second inorganic layer I-2, a second organic layer, a third inorganic layer, and a fourth inorganic layer sequentially stacked on the OLED 28 of the display unit D.

[0131] The capping layer CP may be formed between the OLED 28 and the first inorganic layer I-1. The capping layer CP may include LiF. Alternatively, the capping layer CP may include an inorganic insulating material such as silicon nitride, and / or may include an organic insulating material. In an embodiment, the capping layer CP may be omitted.

[0132] Despite Figure 7 and Figure 8 Although not shown, the first organic layer O-1 may have a planar area smaller than that of the second inorganic layer I-2, and the second organic layer may have a planar area smaller than that of the third inorganic layer.

[0133] Accordingly, the display device 20 can display an accurate image.

[0134] Fig. 9 is a cross-sectional view illustrating an embodiment of a display device 20 ′.

[0135] See also Fig. 9 , the display device 20' may include a substrate 21, a display unit D, an encapsulation substrate 40, and a sealing portion 30. In this case, the substrate 21 and the display unit D are the same as or similar to those described above, and thus a detailed explanation thereof will not be given.

[0136] The encapsulation substrate 40 may face the substrate 21. In this case, the encapsulation substrate 40 may include a material that is the same as or similar to that of the substrate 21.

[0137] The sealing portion 30 may be located between the encapsulation substrate 40 and the substrate 21. In this case, the sealing portion 30 may be hardened, and then may be melted when energy is supplied to fix the encapsulation substrate 40 to the substrate 21.

[0138] According to one or more embodiments of the display device 20 or the display device 20 ′, stains are omitted from the substrate 21 on which various layers are provided.

[0139] According to one or more embodiments of the apparatus and the method of manufacturing the display device 20 or the display device 20 ′ using the same, the substrate 21 having uniform quality along the surface thereof may be manufactured.

[0140] According to one or more embodiments of the apparatus and the method of manufacturing the display apparatus 20 or the display apparatus 20 ′ using the same, the defect rate of the substrate 21 may be minimized.

[0141] According to one or more embodiments of the apparatus and the method of manufacturing the display apparatus 20 or 20 ′ using the same, contamination of peripheral devices or units of the apparatus during manufacturing of the display apparatus 20 or 20 ′ may be minimized.

[0142] According to one or more embodiments of the device and the method of manufacturing the display device 20 or the display device 20' using the same, since a separate liquid is not supplied to the polishing material P remaining on the substrate 21 after the substrate 21 is polished, the size of the device 100 can be reduced and the number of processes in manufacturing the display device 20 or the display device 20' can be reduced.

[0143] It should be understood that the embodiments described herein should be considered in a descriptive sense only, and not for the purpose of limitation. The description of the features in each embodiment should generally be considered to be applicable to other similar features in other embodiments. Although one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope as defined by the appended claims.

Claims

1. A manufacturing device for manufacturing a display device, the manufacturing device comprising: a polisher at which a polishing material is supplied to a base member of the display device and the base member is polished with the polishing material to provide a polished base member having a polished surface; a conveyor to which the polishing base member is supplied from the polisher and from which the polishing base member is transferred to the outside of the manufacturing apparatus; as well as a suction unit, the suction unit being provided corresponding to the conveyor and by which a pressure around a portion of the polisher and the conveyor is provided to be lower than a pressure at a remaining portion of the manufacturing apparatus, wherein the polishing material comprises a liquid, The polishing base member provided to the conveyor includes a portion of the polishing material, the portion of the polishing material remaining on the polishing surface of the polishing base member, and The operation of the suction unit maintains the weight of the liquid in the portion of the polishing material on the polishing surface of the polishing base member at a level equal to or greater than 90% of the total weight of the portion of the polishing material on the polishing base member.

2. The manufacturing apparatus according to claim 1, further comprising a feeder, with which the base member is conveyed to the polisher, At least one of the feeder and the conveyor comprises rollers, with which the base member can be moved along the manufacturing device.

3. The manufacturing apparatus according to claim 1, further comprising a polishing head, the polishing head being provided corresponding to the polisher, and with which the base member is polished at the polisher to provide the polished base member having the polished surface; The polisher comprises a belt, with which the base member can be moved along the manufacturing device to be arranged corresponding to the polishing head.

4. The manufacturing device according to claim 1, wherein the suction unit comprises: a suction pipe which is spaced apart from the conveyor and into which the gas at the conveyor is sucked, the suction pipe comprising an inlet portion through which the gas at the conveyor is sucked into the suction pipe; as well as Connect the catheter to the suction tube. 5 . The manufacturing apparatus according to claim 4 , wherein a cross-sectional area defined by the inlet portion of the suction pipe is larger than a cross-sectional area of ​​the conduit. 6 . The manufacturing apparatus according to claim 4 , wherein the inlet portion of the suction pipe is provided corresponding to the conveyor and the portion of the polisher.

7. The manufacturing apparatus according to claim 4, wherein a wall of the suction pipe at the inlet portion thereof is inclined.

8. A method for manufacturing a display device, wherein the method is performed using the manufacturing device according to any one of claims 1 to 7, and the method comprises: providing a polishing material on an unpolished base member of the display device, the pressure at the surface of the unpolished base member defining an atmospheric pressure; polishing the surface of the base member that has not been polished with the polishing material to provide a polished base member having the polishing material on a polishing surface; as well as When the polishing base member is located on the portion of the polisher and the conveyor, a pressure lower than the atmospheric pressure is provided at the polishing surface of the polishing base member.

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