Attaching RFID chips directly to metal structures as part of fabric tags

Abstract

Systems and methods are provided for assembling RFID devices mounted to a fabric substrate by a "flip chip" method. The system includes a pin-style thermode having a tip configured to penetrate the fabric substrate. The pin-style thermode can or can not include a heating element, with the tip being configured differently depending on whether the pin-style thermode includes a heating element. The tip may, for example, have a variable cross-sectional area or include a plurality of protrusions that each penetrate the fabric substrate. If the pin-style thermode includes a heating element, the body of the pin-style thermode can be formed of a material having low thermal conductivity to allow the temperature of the tip to be raised without raising the temperature of the body to the same extent. The body can define an internal cavity, with the tip and / or the body defining an aperture for liquid to flow out of the pin-style thermode and into an area surrounding the pin-style thermode.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to U.S. Provisional Utility Model Patent Application No. 62 / 635,246, filed February 26, 2018, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This subject matter relates to radio frequency identification (“RFID”) devices mounted on flexible substrates, such as fabrics. More specifically, this subject matter relates to mounting RFID devices onto fabric substrates using a “flip-chip” method without excessively damaging the substrate. Background Technology

[0004] Devices incorporating wireless communication methods, including RFID technology, are widely used in a variety of applications, including inventory control, tracking, security, and safety systems. Such systems are well-known in the retail industry, particularly in applications related to apparel inventory control and security against theft and other losses.

[0005] RFID devices can have various integrated components, such as RFID chips containing data that forms identification codes, like those used for products and / or product parts, enabling immediate electronic identification and tracking of the exact item associated with the unique identification code. Other components include at least one antenna electrically connected to the RFID chip, which is responsible for sending signals to and / or receiving signals from another RFID device (e.g., an RFID reader system).

[0006] In one example, an RFID reader is associated with a point-of-sale location or checkout counter in a retail facility and detects a chip in a tag associated with an item. This chip may include an Inventory Holding Unit (SKU) and the item's registered price, as well as other specific identification markings. In another example, an RFID-readable tag is attached to an item in a retail facility, and these tags are scanned using an RFID reader to maintain accurate product inventory counts and / or as a security measure, serving as a so-called protective tag.

[0007] Currently, typical RFID devices on the market are susceptible to damage and reduced or eliminated intended operability when exposed to industrial processing conditions on clothing, components, or other items or products, especially those made of fabric materials. This sensitivity may be experienced before, during, and / or after manufacturing and processing, as well as subsequent warehousing, sales, and use and handling by consumers.

[0008] A common method for manufacturing RFID devices is often referred to as a "flip-chip" or direct chip attachment method. According to this method, an RFID chip is pushed into the surface of an antenna formed from a suitable conductive material, such as an aluminum or copper foil. The RFID chip is oriented so that its conductive connections face the foil and is secured using an adhesive. Typically, the adhesive is in the form of an epoxy resin in which particles, such as gold-plated plastic beads, are bonded together. Such adhesives are often called "anisotropic conductive adhesives." In one embodiment, the adhesive is non-conductive in its state before application, but a conductive connection is formed when the RFID chip is pushed down so that its conductive connections protrude near or contact the foil, which can be aided by trapping the particles in the interface.

[0009] Once the RFID chip is in place and the adhesive is positioned between the chip and the foil, the adhesive needs to be cured. This is typically achieved by applying pressure and heat using two metal blocks, one below the antenna and one above the RFID chip. These metal blocks are commonly referred to as "thermodes." Processing conditions vary depending on the size of the RFID chip and the properties of the substrate; however, for 400 μm... 2 For RFID chips, applying a force of 1N for 1 to 10 seconds using a top hot electrode at 180°C (i.e., the hot electrode closest to the RFID chip) and a bottom hot electrode at 160°C (i.e., the hot electrode closest to the antenna) is generally suitable for curing the adhesive and completing the bonding. Summary of the Invention

[0010] This subject matter has several aspects, which may be embodied individually or together in the apparatuses and systems described and claimed below. These aspects may be used alone or in combination with other aspects of the subject matter described herein, and the joint description of these aspects is not intended to exclude their individual use or to exclude claims to these aspects individually, nor may they be claimed in different combinations as set forth in the appended claims.

[0011] In one aspect, this disclosure has recognized that when a foil as described above is mounted on a substrate material or support structure of sufficient temperature resistance (e.g., polyethylene terephthalate (“PET”) or paper), the attached heat does not significantly damage the substrate material. This disclosure provides a method for achieving the same result for fragile fabric substrates without causing fabric damage, since typical thermoelectric electrodes compress and heat the fabric over a large area.

[0012] In another aspect or embodiment of this disclosure, a pin thermode is provided for connecting an RFID chip to an antenna associated with a fabric substrate. The pin thermode includes a body and a tip associated with the body, wherein the tip is configured to penetrate the fabric substrate and move to contact or move to the vicinity of the antenna.

[0013] In another aspect or embodiment of this disclosure, a pin-type thermoelectric electrode is provided for attaching an RFID chip to an antenna associated with a fabric substrate. Instead of one or more flat thermoelectric electrodes, two pins are provided, such as a top pin and a bottom pin, wherein at least the bottom pin has sufficient surface area to cover the base of the chip and, when the pin is configured to penetrate the fabric substrate and move to contact or near the antenna, to provide heat to the formed chip-antenna junction as needed. Alternatively, the bottom pin is not heated, where the required heat comes from the top pin, thereby functioning similarly to an anvil that pushes the chip onto it due to the adhesive being cured via conduction from the top pin.

[0014] In another aspect or embodiment of this disclosure, a pin-type thermoelectric electrode is provided for connecting an RFID chip to an antenna associated with a fabric substrate. The pin-type thermoelectric electrode includes a body and an end or cap associated with the body, wherein the end is configured to penetrate the fabric substrate and move to contact or move near the antenna. The pin-type thermoelectric electrode (e.g., a bottom thermoelectric electrode) includes two coaxial structures supporting the end or cap, wherein a heating element is coaxially positioned within the body of the pin-type thermoelectric electrode to facilitate controlled heating as needed without damaging the fabric supporting the chip.

[0015] In another aspect or embodiment of this disclosure, a pin-type thermoelectric electrode is provided for connecting an RFID chip to an antenna associated with a fabric substrate. The pin-type thermoelectric electrode includes a body and an end associated with the body, wherein the end is configured to penetrate the fabric substrate, thereby moving to contact or move to the vicinity of the antenna. The pin-type thermoelectric electrode is configured such that its width at the location of contact with the chip rapidly increases by applying pressure or pulling downward to provide an increased area, the width at this location being narrower before stretching or rapidly increasing to facilitate passage through the fabric in its narrower state. Typically, this structure is provided by a bottom-pin thermoelectric electrode.

[0016] In another aspect or embodiment of this disclosure, a pin-type thermoelectric electrode is provided for connecting an RFID chip to an antenna associated with a fabric substrate. The pin-type thermoelectric electrode includes a body and an end associated with the body, wherein the end is configured to penetrate the fabric substrate, thereby moving to contact or move to the vicinity of the antenna. The pin-type thermoelectric electrode (e.g., a bottom pin) has a series of narrow pins to more easily penetrate the fabric than wide pins, thereby applying pressure and heat to selected points where good adhesion is required.

[0017] In another aspect or embodiment of this disclosure, a pin-type thermoelectric electrode is provided for attaching an RFID chip to an antenna associated with a fabric substrate. The pin-type thermoelectric electrode includes a body and an end associated with the body, wherein the end is configured to penetrate the fabric substrate, thereby moving to contact or move to the vicinity of the antenna. The pin-type thermoelectric electrode (e.g., a bottom pin) heats up upon penetration of the fabric or after contact with the chip attachment area of ​​the fusion adhesive region, thereby creating a relatively strong reinforcing point beneath the chip to reduce flexing that could otherwise damage the chip-antenna junction.

[0018] In another aspect or embodiment of this disclosure, a pin-type thermoelectric electrode is provided for connecting an RFID chip to an antenna associated with a fabric substrate. The pin-type thermoelectric electrode includes a body and an end associated with the body, wherein the end is configured to penetrate the fabric substrate and move to contact or move to the vicinity of the antenna. The pin-type thermoelectric electrode (e.g., a bottom pin) includes one or more holes in fluid communication with the inner cavity of the pin-type thermoelectric electrode to allow liquid to advance beyond the one or more holes and into the region surrounding the pin-type thermoelectric electrode.

[0019] In another aspect or embodiment, a method for assembling an RFID device is provided. The method includes providing an adhesive between the RFID chip and the antenna to an RFID chip located near an antenna associated with a fabric substrate. Pressure and heat are applied to the RFID chip and / or the antenna using a top heating electrode and a pin heating electrode to cure the adhesive. This involves moving the end of the pin heating electrode through the fabric substrate to bring it into contact with or near the antenna. Attached Figure Description

[0020] Figure 1 This is a side cross-sectional view of an embodiment of a pair of pin-type hot electrodes configured according to one aspect of this disclosure, during the assembly and mounting of an RFID device onto a fabric substrate.

[0021] Figure 2 This is a side cross-sectional view of another embodiment of a pair of pin-type thermoelectrodes configured according to one aspect of the present disclosure, during the assembly and mounting of an RFID device onto a fabric substrate.

[0022] Figure 3 This is a side cross-sectional view of an embodiment of a pin-type thermoelectric electrode according to one aspect of the present disclosure;

[0023] Figure 4 This is a side cross-sectional view of another embodiment of a pin-type thermoelectric electrode according to one aspect of this disclosure in a first configuration;

[0024] Figure 4A It is in the second configuration Figure 4 A side cross-sectional view of a pin-type thermoelectric electrode;

[0025] Figure 5 This is a side view of another embodiment of a pin-type thermoelectric electrode according to one aspect of this disclosure;

[0026] Figure 6 yes Figure 5 A top view of a pin-type thermoelectric electrode;

[0027] Figure 7 During the assembly and installation of the RFID device onto the fabric substrate... Figure 5 and Figure 6 A top view of a pin-type thermoelectric electrode; and

[0028] Figure 8 This is a side cross-sectional view of another embodiment of a pair of pin-type thermoelectrodes configured according to one aspect of this disclosure, during the assembly and mounting of an RFID device onto a fabric substrate. Detailed Implementation

[0029] Detailed embodiments of the invention have been disclosed herein as needed; however, it should be understood that the disclosed embodiments are merely examples of the invention, which may be implemented in various forms. Therefore, the specific details disclosed herein should not be construed as limiting, but merely as a basis for the claims and as a representative basis for teaching those skilled in the art to apply the invention differently in virtually any suitable manner.

[0030] Figure 1 An assembly of an RFID device using one method according to this disclosure is shown. The RFID device may be configured with an RFID chip 10, an associated antenna 12, and an adhesive 14 according to a conventional design. For a "flip-chip" or direct chip attachment method, the RFID chip 10 is oriented so that its conductive connection 16 faces the antenna 12. The antenna 12 is mounted to or otherwise associated with a fabric substrate 18, such as a patch, garment, or clothing tag. The antenna 12 can be any shape of antenna contemplated in the art. In one embodiment, the antenna is a dipole.

[0031] Figure 1A pair of similarly configured thermal electrodes 20 and 22 are shown, with the top thermal electrode 20 positioned closer to the RFID chip 10 and the bottom thermal electrode 22 positioned closer to the antenna 12, but spaced apart from the antenna 12 by a substrate 18, which is a fabric as discussed herein. It is important to note that the invention is not limited to fabric substrates, but can be any other type of flexible substrate known in the art. Figure 1 In the embodiment, both thermoelectrodes 20 and 22 are configured as pin-type thermoelectrodes, each having an end 24 having a smaller cross-sectional area than a conventional flat thermoelectrode (i.e., in...). Figure 1 (The orientation of the component facing another thermoelectrode and the surface of the RFID device). For example, the cross-sectional area of ​​a conventional flat thermoelectrode can be approximately 100 mm². 2 (or at 10mm) 2 With 100mm 2 The cross-sectional area of ​​a conventional thermoelectrode (within the range between) is similar to that of a conventional thermoelectrode, while the pin-type thermoelectrode according to this disclosure can have an end 24 with a cross-sectional area of ​​approximately 1 mm. 2 (Or, depending on the size of the RFID chip, approximately 0.25mm) 2 Up to 1mm 2 The cross-sectional area of ​​the end of the pin-type thermoelectrode is similar (within the range of the RFID chip). In one embodiment, the cross-sectional area of ​​the pin-type thermoelectrode may be smaller than, or at most substantially equal to, the cross-sectional area of ​​the associated RFID chip, to ensure that pressure and heat are applied to the necessary portions of the adhesive. However, a cross-sectional area of ​​the pin-type thermoelectrode larger than the cross-sectional area of ​​the associated RFID chip is also within the scope of this disclosure, but preferably not exceeding a nominally larger cross-sectional area.

[0032] While the top heating electrode 20 can be configured according to conventional designs, the pin configuration shown is particularly advantageous for the bottom heating electrode 22. As described above, conventional heating electrodes compress the fabric substrate and heat the fabric over a large area, whereas the end 24 of the bottom pin-type heating electrode 22 is shaped to penetrate into the fabric substrate 18 to move into contact with or at least to the vicinity of the antenna 12. If the bottom heating electrode 22 is provided with a heating element 26 associated with the end 24 and / or body 28 of the bottom heating electrode 22 (such as in... Figure 1In some embodiments, where the top heating electrode 20 also includes a heating element 26, the heat applied to the fabric substrate 18 by the bottom heating electrode 22 is reduced to a smaller area (i.e., the immediate area surrounding the portion of the bottom heating electrode 22 that penetrates the fabric substrate 18). Therefore, if the bottom heating electrode 22 has a substantially circular or circular cross-sectional shape, heat will be applied only to a small cylindrical area of ​​the fabric substrate 18, rather than to a much larger area, which further reduces damage to the fabric substrate 18 during RFID device assembly.

[0033] It is advantageous if the bottom heating electrode 22 is provided with a heating element 26, because the bottom heating electrode 22 applies less heat to the RFID device compared to the top heating electrode 20, further reducing the amount of damage to the fabric substrate 18. For example, in one embodiment, the top heating electrode 20 may be configured to heat to a temperature of 180°C, while all or part of the end 24 of the bottom heating electrode 22 may be configured to heat to a lower temperature. In one embodiment, as in a conventional flip-chip method, the end 24 (or a portion thereof) of the bottom heating electrode 22 may be configured to heat to 160°C. In another embodiment, the end 24 (or a portion thereof) of the bottom heating electrode 22 is heated to a lower temperature, which may depend on the critical temperature of the associated fabric substrate 18 at which visual finishing or localized deformation is achieved. For example, if the fabric substrate is composed of polyester, its critical temperature may be between approximately 120°C and 290°C. Based on composition, the lower the temperature in the glass transition region where the material softens and is highly deformable under pressure, the higher the melting-related value. It should be understood that it is important for clothing to avoid localized damage to the appearance and feel of the fabric. In this case, the end 24 (or a portion thereof) of the bottom heating electrode 22 can be heated to a temperature below the critical temperature of the exemplary fabric material to minimize damage to the fabric substrate 18, such as spots or blemishes. In yet another embodiment, the end 24 (or a portion thereof) of the bottom heating electrode 22 can be heated to a first temperature as the end 24 penetrates the fabric substrate 18, and then heated to a higher second temperature once it has moved to its final position to cure the adhesive 14.

[0034] exist Figure 2 In another embodiment shown, the bottom hot electrode 30 is as follows Figure 1 The configuration shown is modified, but the heating element is omitted, so that the unheated bottom heating electrode 30 acts as an anvil to push the RFID chip 10 onto it as the adhesive 14 cures through conduction from the top heating electrode 20. Alternatively, using Figure 1The bottom heating electrode 22 can achieve the same effect without operating its heating element 26. By applying heat first by the bottom heating electrode 30 and then applying all the heat by the top heating electrode 20, the damage to the fabric substrate 18 during the curing of the adhesive 14 is even less.

[0035] Figure 1 and Figure 2 The comparison illustrates different possible final positions for the bottom thermal electrodes 22 and 30 used to cure the adhesive 14. Figure 1 In one embodiment (where the bottom heating electrode 22 is heated), the end 24 of the bottom heating electrode 22 is moved to contact the antenna 22. This can be advantageous when the end 24 of the bottom heating electrode 22 is heated to improve heat application from the end 24 to the adhesive 14. Conversely, in Figure 2 In one embodiment (where the bottom heating electrode 30 is not heated), the end 24 is moved to the vicinity of the antenna 12 without contacting it. Since the bottom heating electrode 30 does not apply heat to the adhesive 14, it is not important for the end 24 to contact the antenna 12. Furthermore, moving the end 24 to the vicinity of the antenna 12 without actually contacting it further reduces damage to the fabric substrate 18, as the end 24 cannot completely penetrate the fabric substrate 18. However, although... Figure 1 This shows the heated bottom thermal electrode 22 being moved to contact the associated antenna 12 and... Figure 2 It is shown that the unheated bottom thermal electrode 30 is moved only to the vicinity of the associated antenna 12, but it should be understood that the following is also within the scope of this disclosure: the heated bottom thermal electrode 22 is moved only to the vicinity of the associated antenna 12 (rather than to contact it), while the unheated bottom thermal electrode 30 is moved to contact the associated antenna 12.

[0036] Figure 3 Another configuration of the pin-type hot electrode 50 is shown. Figure 3 In one embodiment, the pin-type thermoelectric electrode 50 includes a cap or end 52 and an associated body 54, wherein the cap or end 52 is oriented closer to the associated RFID device than the body 54. The pin-type thermoelectric electrode 50 also includes a heating element 56 associated with the end 52 and extending at least partially through the body 54. In the illustrated embodiment, the heating element 56 is coaxial with the body 54; however, positioning the heating element 56 non-coaxially within the body 54 is also within the scope of this disclosure.

[0037] The heating element 56 can be configured in various ways without departing from the scope of this disclosure; however, in the exemplary embodiments, the heating element 56 is configured as a thermal or electrical path for the heater associated with the end 52. Regardless of its exact configuration, as described above... Figure 1 As described in the embodiments, the heating element 56 is configured to raise the temperature of the end 52 of the pin-type thermoelectrode 50. Although the heating element 56 raises the temperature of the end 52, the body 54 is configured such that its outer surface is not heated by the heating element 56, or at least not heated to the same temperature as the end 52. In embodiments where heat is transferred through the body 54 (i.e., when the heating element 56 includes a heat-conducting path), the body 54 may be made of a material with low thermal conductivity, such as, but not limited to, PTFE or foamed PTFE, to limit temperature variations at the outer surface of the body 54, so that less heat is applied to the fabric substrate it has penetrated. In one embodiment, a material with a low-friction surface is used because it will slide through the fabric with less force and a lower probability of damage.

[0038] Figure 4 and Figure 4A Another alternative embodiment of the pin-type thermoelectric electrode 100 according to one aspect of this disclosure is shown. As in other embodiments, in... Figure 4 and Figure 4A In one embodiment, the pin-type thermoelectric electrode 100 includes a distal end 102 and a body 104. The pin-type thermoelectric electrode 100 also includes an actuator 106 operable to cause the distal end 102 (or at least a portion thereof) to be in a first configuration with a different cross-sectional area. Figure 4 ) and second configuration ( Figure 4A The first configuration is designed to facilitate penetration of the fabric substrate, while the second configuration is designed to increase the area of ​​the end 102 that contacts or otherwise applies force to the RFID device during its adhesive curing.

[0039] The specific configuration of the end 102 can vary, which can also affect the specific configuration of the associated actuator 106. In one embodiment, the end 102 is formed of a deformable or flexible material (e.g., an elastomeric material) fixed to the distal end 108 of the body 104. In such an embodiment, the actuator 106 can be configured as an elongated rod having an enlarged end 110 that moves proximally to press the end 102 against the distal end 108 of the body 104, thereby extending the end 102 outward to increase its cross-sectional area. In another embodiment, the end 102 is formed of a plurality of rigid or semi-rigid members configured to be pivotally or otherwise movably connected to a petal of the distal end 108 of the body 104. In such an embodiment, the actuator 106 can move proximally to deploy a single member, or can be manipulated in some other way (e.g., by rotation about its central axis) to deploy a single member. Figure 4AThe unfolded configuration. Other configurations of the end 102 may also be adopted without departing from the scope of this disclosure, wherein the optimal configuration depends on any of a number of factors, such as the thickness and material composition of the associated fabric substrate, the cross-sectional area of ​​the associated RFID, and whether the end 102 is to be heated.

[0040] Figure 5 and Figure 6 Another alternative embodiment of the pin-type thermoelectric electrode 150 according to one aspect of this disclosure is shown. Figure 5 and Figure 6 In one embodiment, the pin-type thermoelectric electrode 150 includes a body 152 and an associated end 154, wherein the end 154 includes a plurality of protrusions 156 (which may or may not be heated) penetrating the associated fabric substrate. In the illustrated embodiment, the protrusions 156 are substantially identical (to better ensure uniform application of pressure and / or heat to the RFID device) and extend in parallel (to better ensure penetration of the fabric substrate); however, it is also within the scope of this disclosure that at least two of the protrusions 156 are configured differently and / or that at least two of the protrusions 156 are non-parallel. It may be advantageous for the protrusions 156 to be elongated enough to completely penetrate the associated fabric substrate, while the body 152 of the pin-type thermoelectric electrode 150 still cannot penetrate the fabric substrate, in order to minimize any damage to the fabric substrate. However, it is also within the scope of this disclosure that both the protrusions 156 and a portion of the body 152 penetrate the fabric substrate.

[0041] Figure 7 The positions of the protrusions 156 relative to the associated RFID chip 10 and antenna 12 are shown. These positions may correspond to the locations of conductive connections of the RFID chip 10, such that each protrusion 156 applies pressure to one of the conductive connections. However, it should be understood that the positions of the protrusions relative to the conductive connections of the associated RFID chip may vary without departing from the scope of this disclosure, as long as the selected points where the protrusions apply pressure and / or heat to the RFID device are sufficient to form an acceptable bond between the RFID chip and the antenna.

[0042] Figure 8 An assembly of an RFID device using a pin-type thermoelectric electrode 200, according to one aspect of this disclosure, is shown. Figure 8In some embodiments, the pin-type thermoelectric electrode 200 (which may or may not be heated) includes an end 202 and an associated body 204. The body 204 defines a cavity 206, wherein at least one aperture 208 in fluid communication with the cavity 206 is defined in the end 202 and / or the body 204. In one embodiment, a plurality of apertures 208 are uniformly positioned around the periphery of the body 204 and / or the end 202, but having only one aperture 208 or having a plurality of apertures 208 arranged in a non-uniform pattern is also within the scope of this disclosure.

[0043] The pin-type thermoelectric electrode 200 also includes a liquid source from which liquid can advance into and through a cavity 206 to one or more holes 208. The liquid advances from these holes 208 beyond the pin-type thermoelectric electrode 200 and enters a region surrounding the pin-type thermoelectric electrode 200 (e.g., into a gap defined in the antenna 12 or into the fabric substrate 18). The properties of the liquid can vary, which can affect the optimal location of the one or more holes 208. For example, the liquid can be the same as or similar to the adhesive 14 located between the RFID chip 10 and the antenna 12. In this case, defining at least one hole 208 in the end 202 to apply the adhesive to the RFID device may be advantageous. In another embodiment, the liquid can be an adhesive or varnish that prevents moisture ingress or a flexible material such as silicone rubber. In this case, defining at least one hole 208 in the body 204 may be advantageous, allowing a portion of the liquid to be applied to the fabric substrate 18 to reinforce and seal the area of ​​the fabric substrate 18 penetrated by the pin-type thermoelectric electrode 200.

[0044] In one embodiment, the bottom pin is not heated and functions as an anvil, and the top pin is also not heated and functions as an anvil to apply pressure, but has a downward optical path through the center, such as fibers, to allow light, particularly infrared light, to pass through, where wavelengths between approximately 1µm and 16µm are strongly absorbed. Once the chip is under pressure, the applied infrared light causes the chip itself to heat up and cure the adhesive. Alternatively, the bottom pin, top pin, or both are made of an optically transparent material such as glass.

[0045] In another embodiment of the invention, the adhesive used to bond the chip is cured when ultraviolet light is applied via an optical path bonded to the bottom pin-type thermoelectric electrode.

[0046] In another embodiment, a bottom-pin thermoelectric electrode can transfer catalysts, curing agents, and / or accelerators applied to the end of the thermoelectric electrode or through the channel into the adhesive, thereby causing rapid curing, which can be exothermic to further heat the chip and adhesive to complete the bonding. The curing agents can be latent, as they are mixed with and activated by the adhesive, where the curing agent can be added as a two-part system. A variety of chemical types can be used as curing agents (e.g., amines, anhydrides, phenols, and thiols) as well as as accelerators / catalysts added to the latent curing mixture (e.g., tertiary amines and alcohols). Because the curing process of epoxy adhesives can be highly exothermic, the pin thermoelectric electrode can have high thermal conductivity and can be cooled according to the generated heat to limit the peak temperature of the bond and chip, thereby preventing damage to the substrate.

[0047] In another embodiment, the heat required to cure the adhesive is provided by transmitting ultrasonic energy into the chip and thus to the adhesive and antenna when they come into contact, wherein mechanical energy is converted into thermal energy to cure the adhesive and complete the bonding between the antenna and the chip.

[0048] It will be understood that the above embodiments illustrate some applications of the principles of this subject matter. Many modifications can be made by those skilled in the art without departing from the spirit and scope of the claimed subject matter, including those combinations of features separately disclosed or claimed herein. For these reasons, the scope of this document is not limited to the above description, but rather as set forth in the appended claims, and it should be understood that the claims may apply to features herein, including combinations of features separately disclosed or claimed herein.

Claims

1. A pin-type thermoelectric electrode (50) for connecting an RFID chip to an antenna associated with a fabric substrate, the pin-type thermoelectric electrode comprising: Main body (54); The end (52) is associated with the body and configured to penetrate the fabric substrate, thereby moving to contact the antenna or to the vicinity of the antenna; and A heating element (56) associated with the end and extending at least partially through the body, The main body is formed of a material with low thermal conductivity surrounding at least a portion of the heating element; The end (52) is capable of moving between a first configuration and a second configuration with different cross-sectional areas.

2. The pin-type thermoelectric electrode according to claim 1, wherein, The end (52) is configured to have a cross-sectional area smaller than or substantially equal to that of the RFID chip.

3. The pin-type thermoelectric electrode according to claim 1, wherein the pin-type thermoelectric electrode is configured to connect the RFID chip to the antenna without raising the temperature.

4. A method for assembling an RFID device, comprising: An RFID chip is disposed near an antenna associated with a fabric substrate, wherein an adhesive is present between the RFID chip and the antenna; and Pressure and heat are applied to the RFID chip and / or the antenna using a top heating electrode (20) and a pin heating electrode (50) to cure the adhesive, wherein applying pressure and heat to the RFID chip and / or the antenna includes penetrating the fabric substrate with the end (52) of the pin heating electrode to move the end to contact or move to the vicinity of the antenna, wherein the pin heating electrode has a heating element (56) associated with the end and extending at least partially through the body (54) of the pin heating electrode, and wherein the body is formed of a material with low thermal conductivity surrounding at least a portion of the heating element, wherein the end (52) is movable between a first configuration and a second configuration having different cross-sectional areas.

5. The method according to claim 4, wherein, The cross-sectional area of ​​the end (52) is smaller than or substantially equal to the cross-sectional area of ​​the RFID chip.

6. The method according to claim 4, wherein, Applying pressure and heat to the RFID chip and / or the antenna includes raising the temperature of at least a portion of the end (52).

7. The method according to claim 4, wherein, Applying pressure and heat to the RFID chip and / or the antenna includes increasing the cross-sectional area of ​​the end (52).

8. The method according to claim 4, wherein, Applying pressure and heat to the RFID chip and / or the antenna includes raising the temperature of the top heat electrode (20) without raising the temperature of the pin-type heat electrode (50).

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