Techniques for increasing antenna-to-antenna isolation applicable to enhancing MIMO performance

Abstract

Techniques are disclosed for providing a multi-antenna device with increased antenna-to-antenna isolation, as well as methods of operating and manufacturing the multi-antenna device. The multi-antenna device may include a support structure, one or more radio devices coupled to a first antenna, a first antenna coupled to the support structure at a first location, a second antenna coupled to the support structure at a second location and communicatively coupled to the one or more radio devices, and a conductive structure coupled to the support structure to move a zero electric field point of the first antenna from an initial location towards the second location during communication using the first antenna, thereby increasing isolation between the first antenna and the second antenna. The length of the conductive structure is approximately half of the wavelength of the frequency band used for communication (e.g., 2.4 gigahertz or 5 gigahertz).

Description

BACKGROUND OF THE INVENTION

[0001] Electronic devices can use multiple antennas to receive and / or transmit communications simultaneously, either in combination with each other or independently. For example, multiple-input and multiple-output (MIMO) or other related techniques can be used to exploit multipath propagation by using multiple transmit and receive antennas, thereby multiplying the capacity of the radio link. When multiple antennas are used, they sometimes interfere with each other's operation, thus limiting the isolation achieved by the antennas. For example, the isolation between antennas can depend on the extent to which the electromagnetic field (EMF) of one antenna is absorbed by another antenna. When the antennas operate at similar frequencies, such as in MIMO, the amount of EMF absorbed can be particularly high, which can degrade the performance of the electronic device. In MIMO Wi-Fi, the isolation between antennas should be approximately 13 decibels or greater to achieve maximum throughput performance.

[0002] Conventional methods for reducing interference between antennas include increasing the spacing between the antennas. Other methods include filtering the signals processed by the antennas using signal filters or frequency separation in cases where the antennas do not operate at the same frequency. However, these methods can significantly reduce the flexibility of antenna placement and increase the cost and size of the electronic device. Therefore, in various situations, such as for compact or small multi-antenna devices, such solutions may have limitations or may be undesirable or impractical to implement for various reasons. This can lead to poor performance of electronic devices using such antennas.

[0003] Summary

[0004] Embodiments of the present invention relate to multi-antenna devices having increased antenna-to-antenna isolation, as well as methods of operating and manufacturing the same. The multi-antenna devices described herein are adapted to provide such increased isolation by incorporating a conductive structure. The conductive structure can be used to reduce interference to at least one antenna caused by the operation of one or more other antennas. To this end, the conductive structure can move or shift the electric field null of the EMF generated by at least one antenna from an initial position (where the null would not have the conductive structure) towards or to the position of another antenna operating on the multi-antenna device during communication at a selected frequency or frequency band, thereby increasing the isolation between these antennas. The length of the conductive structure is approximately half the wavelength of the selected frequency (e.g., frequency band), such as 2.4 gigahertz or 5 gigahertz. However, a quarter wavelength or other fraction of the wavelength can be used, for example, if the increased isolation is not required for the desired operation. The disclosed method can be used to increase antenna-to-antenna isolation, even in relatively small-scale or compact multi-antenna designs, thereby improving the throughput and performance of such devices, among other benefits. These improvements can be achieved in these devices even in cases where size or placement constraints may limit the use of conventional solutions. Brief Description of the Drawings

[0005] This document describes in detail, with reference to the accompanying drawings, techniques for increasing antenna - to - antenna isolation applicable to enhancing MIMO wireless performance, which is actually illustrative rather than restrictive, wherein:

[0006] Figure 1 A multi - antenna device during one stage of assembly and during signal transmission at a selected frequency, according to some embodiments of the present invention, is described;

[0007] Figure 2 Another multi - antenna device, according to some embodiments of the present invention, in which a conductive structure has been incorporated to increase antenna - to - antenna isolation during communication at a selected frequency, is described;

[0008] Figure 3 A multi - antenna device including a conductive structure on a metal structure, according to some embodiments of the present invention, is described;

[0009] Figure 4 An example housing of a multi - antenna device, according to some embodiments of the present invention, is described;

[0010] Figure 5 A configuration of components associated with a multi - antenna device, according to some embodiments of the present invention, is described;

[0011] Figure 6 A block diagram of an example method of manufacturing a multi - antenna device, according to some embodiments of the present invention, is described; and

[0012] Figure 7 An example computing device applicable to implementing some embodiments of the present invention is described. Detailed Description of the Invention

[0013] The present invention relates to techniques for increasing antenna - to - antenna isolation applicable to enhancing MIMO wireless performance. Specifically, the present invention relates to techniques for adapting a multi - antenna device to provide increased antenna - to - antenna isolation during communication at one or more selected frequencies or frequency bands, as well as methods of operating and manufacturing such techniques.

[0014] A multi-antenna device with separate antennas that processes signals on a common frequency or frequency band (e.g., the 2.4 gigahertz band or the 5 gigahertz band) may sometimes encounter signal interference between the antennas operating on the device. Such interference can reduce antenna-to-antenna isolation, thereby limiting the throughput and performance of the antennas (e.g., limiting the maximum isolation in decibels that can be achieved between the antennas of a multi-antenna device). Traditional solutions for reducing such interference and increasing antenna-to-antenna isolation typically rely on increasing the distance between the antennas, using filters to modify the signals processed by the antennas, or separating the frequencies used to operate the antennas. However, for various reasons, these solutions may not be practical or desirable, such as in small or compact multi-antenna devices where design requirements may lead to size or component limitations.

[0015] The method described herein provides a multi-antenna device and / or antenna structure (which may or may not include integrated circuits, CPUs, and / or other circuit components) that improves antenna-to-antenna isolation by incorporating a conductive structure. The conductive structure can move the electric field nulls generated by the antennas operating the device at a selected frequency to the location of another antenna operating at or near the selected frequency, thereby reducing signal interference between the antennas and increasing isolation, thus improving throughput and performance while maintaining design flexibility. The length of the conductive structure is approximately half the wavelength of the selected frequency (e.g., frequency band) (e.g., 2.4 gigahertz or 5 gigahertz). However, a quarter wavelength or other fraction of the wavelength can be used, e.g., where not as much isolation increase is required in the desired operation. Example embodiments providing the above advantages are further described below with reference to Figures 1 - 7 Further description.

[0016] The multi-antenna device according to the present invention can take any one of various forms and be any one of various types of devices. By way of example and not limitation, the multi-antenna device can include a personal computer (PC), laptop, mobile device, smart phone, tablet, smart watch, wearable computer, personal digital assistant (PDA), MP3 player, global positioning system (GPS) or device, video player, handheld communication device, gaming device or system, headset, streaming device (e.g., video streaming device), entertainment system, vehicle computer system, embedded system controller, remote control, device, consumer electronic device, workstation, any combination of these devices described above, or any other suitable device. Additionally, the antennas and / or conductive structures described herein can be included in one or more enclosures, which can be shared or separated from the enclosures of other electrical components including the multi-antenna device. For example, in some embodiments, one or more antennas and / or conductive structures are included in an enclosure module (e.g., an antenna module), which can be connected to the main enclosure of the multi-antenna device (e.g., via an antenna connection cable). In other examples, the antennas and / or conductive structures can be located inside and / or on the main enclosure.

[0017] Now referring Figure 1 , in accordance with some embodiments of the present invention, there is provided a multi-antenna device 130 as described during one stage of assembly and during signal transmission at a selected frequency. Figure 1 The multi-antenna device 130 shown includes a support structure 132 and an antenna 134. The antenna 134 is mechanically coupled (and optionally electrically coupled) to the support structure 132 at a location 136 on the support structure 132. The antenna 134 is also communicatively coupled to one or more radio devices ( Figure 2 not described herein, but Figure 5 an example is described herein). The one or more radio devices can be coupled or integrated into the multi-antenna device 130 in different ways. For example, in one aspect contemplated, the one or more radio devices can be mounted directly on the support structure 132 and coupled to the antenna 134 via an integrated circuit located on the support structure 132. Optionally, the one or more radio devices can be placed separately from the support structure 132 (e.g., when fully assembled, for inclusion in a different enclosure), and in another aspect contemplated, can be communicatively coupled to the antenna 134 via a communication link extending to the support structure 132 and the antenna 134.

[0018] The one or more radio devices are adapted to process communications at one or more selected frequencies or frequency bands using the antenna 134. In this regard, the one or more radio devices are adapted to transmit, receive, decode, generate, transmit, or store data signals, including signals transmitted or received using the antenna 134 and signals that can be Figure 1Any other antenna incorporated in the multi-antenna device 130 shown. One or more radio devices may be adapted to process Wi-Fi communication, Bluetooth communication, and / or other types of wireless and / or near-field communication using antenna 134 (e.g., using an integrated processor or chip that supports such wireless capabilities). One or more radio devices may also be adapted to process communication transmitted or received at one or more selected frequencies (e.g., certain frequencies, or certain frequency bands). For example, in an expected embodiment, one or more radio devices may also be adapted to process communication at least using antenna 134 (e.g., for MIMO) in the 2.4 gigahertz band and / or the 5 gigahertz band, in addition to other possible frequencies or bands, depending on the configuration of the one or more radio devices and / or the multi-antenna device 130 and its components.

[0019] Figure 1 The support structure 132 shown can provide structural support for the components of the multi-antenna device 130 (e.g., antenna 134) and other components assembled with the multi-antenna device 130 ( Figure 1 not shown). As used herein, the term "support structure" should be construed broadly to include any one or combination of components or structures that together form part of the multi-antenna device and support the functional components mounted on the multi-antenna device. For example, in some expected embodiments, the support structure may include a substrate formed of one or more materials that at least exhibit some rigidity, allowing the components of the associated multi-antenna device to be fixedly mounted thereon. In further expected embodiments, the support structure may include one or more structural features, such as a frame, housing, base, etc. that support the mounting of the components of the associated multi-antenna device. In yet another example, the support structure may include one or more functional components of the associated multi-antenna device, such as communication coupling, power coupling, wiring, and / or integrated circuits. In an embodiment, the support structure may be a printed circuit board (e.g., a motherboard) or a similar type of device having one or more integrated circuits (e.g., housing at least one radio). Many other configurations of the above support structures and their configurations are expected to be within the scope of the present disclosure.

[0020] Figure 1 The multi-antenna device 130 is described that transmits a signal at a selected frequency. The signal may be transmitted using antenna 134 and one or more radio devices communicatively coupled thereto. The signal transmission is illustrated to show the propagation of the signal from antenna 134 when antenna 134 transmits at the selected frequency. Specifically, as Figure 1As shown, the antenna 134 transmits a signal at a selected frequency, generating an electric field 138 (also referred to as EMF 138). The electric field 138 spreads around the antenna 134, creating regions of different electric field intensities. This includes a low electric field region 140 where the zero point of the electric field can be located. Relative to most of the electric field 138 formed during signal transmission (or reception) from the antenna 134, the low electric field region 140 can represent a region of lower or reduced electric field intensity.

[0021] Figure 1 Further shown is how the intensity of the electric field 138 varies within the low electric field region 140. As shown, the average intensity of the electric field 138 in the first region 142 of the low electric field region 140 can be less than the average intensity of the electric field 138 in the second region 144 of the low electric field region 140, which can be less than the average intensity of the electric field 138 in the third region 146 of the low electric field region 140 represented by the individual shaded portions on the multi - antenna device 130 shown by Figure 1 The third region 146 can represent or contain a local or global minimum in the EMF, such as a zero point of the electric field where the EMF is substantially zero. For illustrative purposes, the discussion of the zero point of the electric field also applies to the low electric field region 140 (such as a region containing a local minimum or maximum of the EMF, which may not contain a zero point). Figure 1 The position of the low electric field region 140 shown is based on the signal propagated from the antenna 134 at a selected frequency (e.g., using a specific frequency or frequency band). Thus, the propagation of the electric field and the position of the resulting zero point of the electric field can vary according to factors such as the frequency of the transmitted signal and / or the position, configuration, and / or power of the antenna and / or radio used to transmit the signal.

[0022] To configure the multi - antenna device 130 using different methods to increase antenna - to - antenna isolation, the position of the zero point of the electric field (e.g., the low electric field region 140 shown in Figure 1 the multi - antenna device 130 shown in Figure 1 ) on the multi - antenna device (e.g., the multi - antenna device 130) can be determined. For example, the zero point of the electric field (and / or the low electric field region 140) can be located using signal propagation electromagnetic simulation software. Alternatively, an electric field probe for monitoring the EMF measurement of the signal transmission from (or reception by) the antennas of the multi - antenna device can be used to locate the zero point of the electric field. Other tools or methods can be used to further locate the zero point of the electric field, where the tools or methods are suitable for detecting and / or determining the variable intensity of the electric field generated during signal transmission by the antenna (or reception). Each of these tools and processes for locating the zero point of the electric field is contemplated within the scope of the present disclosure.

[0023] The low electric field region 140 represents a location where a conductive structure (e.g., Figure 2The indicated conductive structure 260) is in a region to achieve greater antenna-to-antenna isolation in the multi-antenna device 130. For example, the conductive structure (e.g., the end or contact area of the support structure 132) can be at least partially located in the third region 146 (as an example) to separate the third region 146 from Figure 1 its initial position to a desired position in the multi-antenna device 130 (e.g., on the support structure 132). As discussed herein, in some applications, conventional solutions for reducing signal interference between independent antennas operating at the same or similar frequencies may not be practical or desirable. However, using a conductive structure (such as Figure 2 the indicated conductive structure 260) to move the position of the third region 146 at least partially towards or to the position of another antenna operating at the same or similar frequency (as Figure 2 shown) can improve antenna-to-antenna isolation without being limited by conventional methods.

[0024] Now referring to Figure 2 , in accordance with some embodiments of the present invention, a multi-antenna device 248 is provided that has a conductive structure 260 associated therewith to increase antenna-to-antenna isolation. In an example, the multi-antenna device 248 can correspond to Figure 1 the multi-antenna device 130 in Figure 2 (although different antenna designs are shown). The multi-antenna device 248 shown in includes a support structure 250, an antenna 252 coupled to the support structure 250 at position 254, an antenna 256 coupled to the support structure 250 at position 258, and a conductive structure 260 coupled to the support structure 250 at contact positions 262 and 264. The multi-antenna device 248 may also include or incorporate one or more radio devices as Figure 1 shown ( Figure 2 not shown in Figure 5shown as an example). One or more radio devices may be communicatively coupled to antenna 252 and to antenna 256 (e.g., each antenna uses a separate radio, or shares with a radio that controls multiple antennas), and may be adapted to process communications at a selected frequency using antennas 252 and 256. In this regard, during communications processed by one or more radio devices, both antennas 252, 256 may use the selected frequency (e.g., a common frequency band). For example, one or more radio devices may be adapted to process communications in the 2.4 gigahertz band, the 5 gigahertz band, or another frequency band associated with a wireless communication protocol using antennas 252, 256 (e.g., via MIMO). In the embodiments described herein, antennas 252, 256 may further be adapted to simultaneously transmit and / or receive communications using the selected frequency or using the selected frequency separately. For example, antenna 252 may transmit using a frequency band while antenna 256 may transmit using the frequency band (or both antennas 252 and 256 may receive using the frequency band). Additionally, antenna 252 may transmit / receive data independently of antenna 256.

[0025] Figure 2 During operation of the multi-antenna device 248, the antenna 256 shown in transmits a signal using the selected frequency through the two antennas 252, 256. This signal transmission generates an electric field 255, as Figure 2 shown. The electric field 255 is dispersed in the region around the antenna 256, including the entire support structure 250, as Figure 1 shown for the electric field 138. The intensity of the electric field 255 varies with position, and thus a low electric field region 268 may be formed on the support structure 250. The low electric field region 268 may represent a region where the intensity of the electric field 255 generated by the antenna 256 is less than the intensity of the electric field 255 in some other region (similar to Figure 1 the low electric field region 140 in), e.g., the region 257 located on the support structure 250. Similarly, factors such as changes in the frequency and / or power of the transmitted signal, changes in the configuration and / or positioning of the antenna 256 on the support structure 250, etc. may affect the distribution of the electric field 255 and the position (and number) of the low electric field region 268 on the multi-antenna device 248. Thus, it should be understood that Figure 2 the configuration shown and the resulting electric field distribution only represent an example configuration, and other configurations for achieving improved antenna-to-antenna isolation are contemplated herein.

[0026] Before placing the conductive structure 260, the low electric field region 268 includes an initial position 270 of the low electric field region 268. For example, before incorporating the conductive structure 260, Figure 1The low electric field region 140 can correspond to the low electric field region 268. In the example, the initial position 270 can correspond to the third region 146 (e.g., the electric field zero point) to achieve greater antenna-to-antenna isolation in the multi-antenna device 248. Using this method, the electric field zero point (e.g., Figure 2 the electric field zero point 265 in Figure 2 ) can be moved from one or more initial positions to one or more desired positions, as

[0027] shown. As discussed herein, in some applications, conventional solutions for reducing signal interference between independent antennas using the same or similar frequencies may not be practical or desirable. However, using a conductive structure (e.g., Figure 2 the conductive structure 260 shown) to move at least partially one or more electric field zero point positions of one antenna towards or to one or more positions of another or more antennas allows for improved antenna-to-antenna isolation without being limited by traditional methods.

[0028] Figure 2 The conductive structure 260 shown in Figure 2 includes an end 272 mechanically coupled to the support structure 250 at the contact position 262 and another end 274 mechanically coupled to the support structure 250 at the contact position 264. By measuring along the conductive structure 260 itself, the distance between the ends 272, 274 can define the length of the conductive structure 260. The length of the conductive structure 260 can be adapted to affect the movement of the low electric field region 268 from the initial position 270 as described herein. According to the embodiments described herein, the ends 272, 274 of the conductive structure 260 can be commonly grounded to the antenna 252 and / or the antenna 256 through the support structure 250 (e.g., through the ends 272, 274), thus facilitating the electromagnetic movement of the low electric field region 268, as

[0029] Figure 2 shown. Figure 2 describes how the end 272 of the conductive structure 260 is positioned at the initial position 270 of the low electric field region 268 generated during the transmission of a signal by the antenna 256 at a selected frequency. This positioning method can particularly effectively cause the electric field zero point 265 to move towards the position 254 of the antenna 252, for example. Figure 2 The moving electric field zero point 265 shown in

[0030] In other aspects, the electric field null of the EMF (not shown) generated during signal transmission from (or reception by) antenna 252 can be similarly shifted towards or to the location 258 of antenna 256 by the conductive structure 260 to produce a similar isolation improvement. Additional antennas can also be placed and used in other areas where the electric field null has been shifted to or otherwise positioned on a particular multi-antenna device to allow for additional antenna operations with increased antenna-to-antenna isolation. Figure 2 The location 253 in Figure 2 is an example of such a location. For example, antennas 252 and 256 can be used for MIMO communication, and an antenna at or near location 253 can be used for other purposes (such as Bluetooth). In an example, during operation at one or more selected frequencies, location 253 can include the electric field nulls of both antennas 252 and 256.

[0031] Still referring to Figure 2 the multi-antenna device 248 shown, by shifting the electric field null 265 generated during signal communication using the above-described antennas 252 and / or 256, the signal interference between antennas 252 and 256 can be reduced, thereby increasing the antenna-to-antenna isolation. This increased antenna-to-antenna isolation can improve communication performance and throughput and can reduce the need to modify the size, shape, or dimensions of the multi-antenna device 248 to achieve sufficient isolation.

[0032] Using the method described herein, during operation of a multi-antenna device in the 2.4 gigahertz band, an increase in antenna-to-antenna isolation from 7 decibels to at least 15 decibels has been achieved by using the above-described conductive structure. During operation of a multi-antenna device in the 5 gigahertz band, an increase in antenna-to-antenna isolation from 12 decibels to at least 25 decibels has been achieved by using the above-described conductive structure.

[0033] The conductive structures described herein can be formed of different materials and structures that enable the desired movement of the electric field null on the associated multi-antenna device. For example, embodiments of the conductive structure can comprise metal strips. Additionally, embodiments of the conductive structure can have a curved shape or can have a shape that includes one or more angular connections, such as Figure 2 the conductive structure 260 shown.

[0034] To achieve the desired movement of one or more low electric field regions 268 towards or to the location 254 of the antenna 252, and similarly to achieve the movement of the electric field null of the antenna 252 towards or to the location 258 of the antenna 256, a conductive structure 260 can be formed, the length of which is approximately half of the wavelength (e.g., at 2.4 gigahertz or 5 gigahertz) of the selected frequency (e.g., frequency band) used by the antennas 252 and 256 during signal communication (transmission and / or reception). Approximately speaking, this may mean that in the expected variation, the length may vary by + / - 5% of the wavelength, and the length closest to half the wavelength is shown to produce the movement of the low electric field region 268, resulting in higher antenna-to-antenna isolation. However, a quarter wavelength or other fractions of the wavelength can be used in embodiments, for example, when not as much isolation increase is required in the desired operation.

[0035] Reference Figure 3 , according to some embodiments of the present invention, a multi-antenna device 380 including a conductive structure 394 and a metal structure 382 is provided. The multi-antenna device 380, like other multi-antenna devices depicted and described herein, can be coupled to one or more radio devices and includes a support structure 384, an antenna 386 (e.g., coupled to the support structure 384 at the location 388), and an antenna 390 (e.g., coupled to the support structure 384 at the location 392). The multi-antenna device 380 further includes a conductive structure 394, the operation and configuration of which are similar to Figure 2 the conductive structure 260 and its variations described herein. The conductive structure 394 forms an elongated shape extending between an end 396 and an end 398. The ends 396, 398 are mechanically (and optionally electrically) coupled to the support structure 384 at respective contact locations 385, 387. In an expected embodiment, the contact locations 385, 387 can provide a common ground connection between the conductive structure 394 and the antennas 386, 390.

[0036] Figure 3 describes how the ends 396, 398 of the conductive structure 394 are coupled to the support structure 384 at the contact locations 385, 387, so that one or more electric field nulls associated with the antenna 386 and / or with the antenna 390 move towards or to another location of the antennas 386, 390. This movement of one or more electric field nulls improves the antenna-to-antenna isolation between the antennas 386, 390, as described herein with respect to Figure 2Further detailed description. The conductive structure 394 (e.g., a mechanical clamp) is additionally positioned and fixed to the support structure 384 to at least partially mechanically couple or fix the metal structure 382 to the support structure 384. The conductive structure 394 can share a common ground connection with the antennas 386 and 390 through the contact locations 385, 387 on the support structure 384. However, in the described embodiments, the conductive structure 394 cannot obtain an additional ground connection with the antennas 386, 390 through the metal structure 382. For example, the metal structure 382 can provide an insulating non-conductive mechanical bridge between the conductive structure 394 and the support structure 384 (e.g., having a plug-in integrated circuit). In the illustrated example, the metal structure 382 can correspond to any number of metal structures and, in a non-limiting example, can include a heat sink or other structures. The conductive structure 394 can work with the metal structure 382 by extending the antenna beam length. The length of the conductive structure 394 is approximately equal to half of the wavelength of the frequency used by the antenna 386 and / or the antenna 390, allowing the conductive structure 394 to move one or more electric field nulls related to signal communication using the antennas 386, 390 to positions that provide higher antenna-to-antenna isolation as described herein. The conductive structure 394 and / or one or more metal structures 382 can be a single part (e.g., having a single composition) or can be formed from any number of separate parts.

[0037] The antennas that can be used to implement the present invention can take various forms and can be located at different positions, some of which have been described herein. For example, antennas 134, 252, 256, 390, and 386 are non-limiting examples and configurations of antennas. As a further example, an antenna according to the present invention can be at least partially integrated into a support structure and / or a PCB. For example, one or more antennas can be etched on a printed circuit board. Additionally, the relative positions of the antennas and the conductive structures 260, 394 are shown only as examples and can vary in different implementations. For example, in some embodiments, the conductive structure 260 does not have to be located between the antennas 252 and 256, but can be located at any suitable position for moving the electric field nulls described herein (e.g., closer to one of the antennas than the other, at least partially under one of the antennas, rather than between the antennas as shown, having a length that extends beyond both sides of one or more antennas, rather than Figure 2 the length shown, etc.).

[0038] Now referring to Figure 4 , in some embodiments according to the present invention, a housing 400 for a multi-antenna device is provided. The size and shape of the housing 400 can allow for a multi-antenna device, such as Figure 2 the multi-antenna device 248 shown or Figure 3The multi-antenna device 380 shown is adapted to provide increased antenna-to-antenna isolation and is at least partially enclosed therein. The housing 400 and the multi-antenna device at least partially enclosed therein can be used to implement various electronic devices in the embodiments, such as computing devices, gaming devices, televisions, and other electronics and hardware. Figure 4 The housing 400 shown in is provided only as an example of a housing for a multi-antenna device with improved antenna-to-antenna isolation, and other shapes, sizes, and configurations of housings suitable for accommodating different multi-antenna devices of different sizes, shapes, and dimensions are expected to be within the scope of the present disclosure.

[0039] Reference Figure 5 , according to some embodiments of the present invention, an example configuration of components related to a multi-antenna device with improved antenna-to-antenna isolation is provided. The multi-antenna device described herein can include multiple antennas communicatively coupled to one or more radio devices, as Figure 5 shown. Figure 5 A configuration of components including one or more radio devices 502 is specifically described, which can be adapted to handle communications on one or more specific frequencies or frequency bands, such as the 2.4 gigahertz band and / or the 5 gigahertz band (e.g., using MIMO), as well as antennas 504 and 506, each of which is communicatively coupled to the radio device 502. The radio device 502 can be communicatively coupled to Figure 7 the computing device 700 described or form a part thereof, and can use the antennas 504, 506 to handle communications, and in some embodiments, the components of the computing device 700 are as Figure 7 shown. The antennas 504, 506 can communicate using a selected frequency, which is shared by both the antennas 504, 506 and processed by the radio device 502. The radio device 502 can include or be connected to one or more communication chips of the multi-antenna device capable of enabling or supporting wireless communication through a specific wireless communication protocol. For example, in an expected embodiment, the multi-antenna device and its one or more radio devices can use Wi-Fi or Bluetooth enabling chips to support wireless communication from the multi-antenna device.

[0040] In operation, the multi-antenna device can use one or more radio devices and at least one first antenna to handle communications on a selected frequency. For example, one or more radio devices can correspond to Figure 1 , Figure 2 and / or Figure 5 the one or more radio devices described. For example, the first antenna can correspond to Figure 2 the antenna 256 described, and can be coupled to a support structure at a first position (e.g., the position 258 shown in Figure 2 ), such as Figure 2The support structure 250 shown. The selected frequency used during communication can be any frequency suitable for a wireless communication protocol, e.g., those using the 2.4 gigahertz band and / or the 5 gigahertz band, or another frequency or band associated with a wireless communication protocol.

[0041] The multi-antenna device can correspond to Figure 2 the multi-antenna device 248 described, or another embodiment of a multi-antenna device according to the embodiments described herein, and can further include a second antenna coupled to one or more radio devices. For example, the second antenna can correspond to Figure 2 the antenna 252 shown. The second antenna can be coupled to the support structure at a second location, e.g., Figure 2 the location 254 of the antenna 252 shown in.

[0042] The multi-antenna device can be configured to move the electric field null point of the first antenna from an initial position to the second position during communication through a conductive structure coupled to the support structure, thereby increasing the isolation between the first antenna and the second antenna. For example, the conductive structure can correspond to Figure 2 the conductive structure 260 shown in, and can share a common ground connection with the first antenna and the second antenna. The conductive structure can further be formed to have a length of approximately half of the wavelength of the selected frequency.

[0043] Now referring to Figure 6 , according to some embodiments of the present invention, a flowchart showing an example method 600 of manufacturing a multi-antenna device is provided. At block 610, method 600 includes mechanically coupling a first antenna (e.g., Figure 2 the antenna 256 shown) to a support structure (e.g., Figure 2 the support structure 250 shown) at a first location of the support structure, e.g., Figure 2 the location 258 shown.

[0044] At block 620, method 600 includes mechanically coupling a second antenna (e.g., Figure 2 the antenna 252 shown) to the support structure at a second location of the support structure, e.g., Figure 2 the location 254 shown.

[0045] At block 630, method 600 includes communicatively coupling one or more radio devices (e.g., Figure 5 the one or more radio devices 502 shown) to the first antenna and the second antenna, the one or more radio devices being adapted to process communication at a selected frequency, e.g., the 2.4 gigahertz band or the 5 gigahertz band, using the first antenna and / or the second antenna.

[0046] At block 640, method 600 further includes mechanically coupling a conductive structure (e.g., Figure 2 the conductive structure 260 shown) to a support structure, whereby, during communication, an electric field null of the first antenna moves from an initial position (e.g., Figure 2 the initial position 270 shown) to a second position through the conductive structure coupled to the support structure, thereby increasing isolation between the first antenna and the second antenna.

[0047] Now referring to Figure 7 , a block diagram of an example computing device 700 suitable for implementing some embodiments of the present disclosure is provided. Computing device 700 may include a bus 712 that directly or indirectly couples the following devices: a memory 714, one or more central processing units (CPUs) 716, one or more graphics processing units (GPUs) 718, a communication interface 720, input / output (I / O) ports 722, input / output components 724, a power supply 726, and one or more display components 728 (e.g., a display).

[0048] Although Figure 7 the various modules in are shown as being connected by lines to bus 712, this is not for limitation, but for clarity only. For example, in some embodiments, display component 728 (e.g., a display device) may be considered an I / O component 724 (e.g., if the display is a touchscreen). As another example, CPU 716 and / or GPUs 718 may include memory (e.g., in addition to the memory of GPU 718, CPU 716, and / or other components, memory 714 may also represent a storage device). In other words, Figure 7 the computing devices of are merely exemplary. There is no distinction made between "workstations", "servers", "laptop computers", "desktop computers", "tablet computers", "client devices", "mobile devices", "handheld devices", "gaming consoles", "electronic control units (ECUs)", "virtual reality systems", and / or other device or system types, because all of these are within the scope of Figure 7 computing devices.

[0049] Bus 712 may represent one or more buses, such as an address bus, a data bus, a control bus, or a combination thereof. Bus 712 may include one or more bus types, such as an Industry Standard Architecture (ISA) bus, an Extended Industry Standard Architecture (EISA) bus, a Video Electronics Standards Association (VESA) bus, a Peripheral Component Interconnect (PCI) bus, a Peripheral Component Interconnect Express (PCIe) bus, and / or other types of buses.

[0050] The memory 714 may include any of a variety of computer-readable media. The computer-readable media may be any available media that can be accessed by the computer device 700. The computer-readable media may include volatile and non-volatile media, as well as removable and non-removable media. By way of example, the computer-readable media may include, but is not limited to, computer storage media and communication media.

[0051] Computer storage media may include volatile and non-volatile media and / or removable and non-removable media implemented in any method or technology for storing information, such as computer-readable instructions, data structures, program modules, and / or other data types. For example, the memory 714 may store computer-readable instructions (e.g., instructions representing programs and / or program elements, such as an operating system). Computer storage media may include, but is not limited to, RAM, ROM, EEPROM, flash memory or other storage technologies, CD-ROM, digital versatile disks (DVDs) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be accessed by the computing device 700 and can be used to store the required information. When used herein, computer storage media do not themselves contain signals.

[0052] Communication media may embody computer-readable instructions, data structures, program modules, and / or other data types in a modulated data signal, such as a carrier wave or other transmission mechanism, and include any information delivery media. The term "modulated data signal" may refer to a signal having one or more characteristics set or a signal that has been altered in a manner that encodes information in the signal. By way of example, and without limitation, communication media may include wired media, such as a wired network or direct wired connection, and wireless media, such as acoustic, radio frequency, infrared, and other wireless media. Any combination of the foregoing should also be included within the scope of computer-readable media.

[0053] The CPU 716 can be configured to execute computer-readable instructions to control one or more components of the computing device 700 to perform one or more methods and / or processes described herein. The CPU 716 can each include one or more (e.g., one, two, four, eight, twenty-eight, seventy-two, etc.) cores capable of simultaneously processing multiple software threads. The CPU 716 can include any type of processor and can include different types of processors depending on the type of computing device 700 being implemented (e.g., a processor with fewer cores for a mobile device and a processor with more cores for a server). For example, depending on the type of computing device 700, the processor can be an ARM processor implemented using reduced instruction set computing (RISC) or an x86 processor implemented using complex instruction set computing (CISC). In addition to one or more microprocessors or auxiliary coprocessors (e.g., a math coprocessor), the computing device 700 can also include one or more CPUs 716.

[0054] The computing device 700 can use the GPU 718 to render graphics (e.g., 3D graphics). The GPU 718 can include hundreds or thousands of cores capable of simultaneously processing hundreds or thousands of software threads. The GPU 718 can generate pixel data for an output image according to rendering commands (e.g., rendering commands received from the CPU 716 via a host interface). The GPU 718 can include graphics memory for storing pixel data, such as display memory. The display memory can be part of the memory 714. The GPU 718 can include two or more GPUs operating in parallel (e.g., via a link). When combined, each GPU 718 can generate pixel data for different parts of an output image or different output images (e.g., the first GPU for the first image and the second GPU for the second image). Each GPU can include its own memory or can share memory with other GPUs. In an example where the computing device 700 does not include a GPU 718, the CPU 716 can be used to render graphics.

[0055] The communication interface 720 can include one or more receivers, transmitters, and / or transceivers enabling the computing device 700 to communicate with other computing devices via an electronic communication network (including via wired and / or wireless communication). The communication interface 720 can include components and functionality enabling communication over many different networks, such as wireless networks (e.g., Wi-Fi, Z-Wave, Bluetooth, Bluetooth LE, ZigBee, etc.), wired networks (e.g., communicating via Ethernet), low-power wide area networks (e.g., Lorawan, SigFox, etc.), and / or the Internet.

[0056] The I / O port 722 can logically couple the computing device 700 to other devices, including I / O components 724, display components 728, and / or other components, some of which may be built into (e.g., integrated into) the computing device 700. Exemplary I / O components 724 include microphones, mice, keyboards, joysticks, game pads, game controllers, satellite dishes, scanners, printers, wireless devices, etc. The I / O components 724 can provide a natural user interface (NUI) that processes user-generated air gestures, sounds, or other physiological inputs. In some cases, the input can be transmitted to an appropriate network element for further processing. The NUI can implement any combination of speech recognition, stylus recognition, face recognition, biometric recognition, on-screen and near-screen gesture recognition, air gestures, head and eye tracking, and touch recognition (described in more detail below) related to the display of the computing device 700. The computing device 700 can include depth cameras, such as stereo camera systems, infrared camera systems, RGB camera systems, touchscreen technologies, and combinations of these technologies, for gesture detection and recognition. Additionally, the computing device 700 can include an accelerometer or gyroscope (e.g., as part of an inertial measurement unit (IMU)) that can detect motion. In some examples, the computing device 700 can use the output of the accelerometer or gyroscope to render immersive augmented reality or virtual reality.

[0057] The power supply 726 can include a hard-wired power supply, a battery power supply, or a combination thereof. The power supply 726 can provide power to the computing device 700 to enable the components of the computing device 700 to operate.

[0058] The display component 728 can include a display (e.g., a monitor, a touch screen, a television screen, a head-up display (HUD), other display types, or a combination thereof), speakers, and / or other presentation components. The display component 728 can receive data from other components (e.g., the GPU 718, the CPU 716, etc.) and output data (e.g., images, videos, sounds, etc.).

[0059] The present invention can be described in the general context of computer code or machine-usable instructions, including computer-executable instructions executed by a computer or other machine (e.g., a personal data assistant or other handheld device), such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., which refer to code that performs a specific task or implements a specific abstract data type. The present disclosure can be implemented in various system configurations, including handheld devices, consumer electronics, general-purpose computers, more specialized computing devices, etc. The present disclosure can also be implemented in a distributed computing environment where tasks are executed by remote processing devices connected through a communication network.

[0060] As used herein, the translation of "and / or" for two or more elements shall be construed to mean only one element or a combination of elements. For example, "element A, element B, and / or element C" can include element A alone, element B alone, element C alone, element A and element B, element A and element C, element B and element C, or element A, B, and C. In addition, "at least one of element A or element B" can include at least one of element A, at least one of element B, or at least one of element A and at least one of element B. In addition, "at least one of element A and element B" can include at least one of element A, at least one of element B, or at least one of element A and element B.

[0061] To meet statutory requirements, the subject matter of this invention has been described in detail herein. However, the specification itself is not intended to limit the scope of this disclosure. On the contrary, the inventors have contemplated that the claimed subject matter may also be embodied in other ways, including different steps or combinations of steps that are similar to the steps described in this document, as well as other present or future technologies. In addition, although the terms "step" and / or "block" may be used herein to imply different elements of the methods employed, the terms should not be construed to imply any particular order among or between the various steps disclosed herein, unless and until the order of the individual steps is explicitly described.

Claims

1. A multi-antenna device, comprising: A support structure; One or more radio devices adapted to process communications at a selected frequency using a first antenna coupled to the support structure at a first location; A second antenna coupled to the support structure at a second location, the second antenna communicatively connected to the one or more radio devices; And A conductive structure located on the support structure such that during the communication using the first antenna, the conductive structure moves an electric field null of the first antenna from an initial position towards the second position, thereby increasing isolation between the first antenna and the second antenna, wherein at least a portion of the conductive structure is located at the initial position.

2. The multi-antenna device according to claim 1, wherein the conductive structure comprises a metal strip having a first end mechanically coupled to the support structure at a first contact location and a second end mechanically coupled to the support structure at a second contact location spaced from the first contact location.

3. The multi-antenna device according to claim 2, wherein a length of the conductive structure measured between the first end of the metal strip and the second end of the metal strip is half of a wavelength of the selected frequency.

4. The multi-antenna device according to claim 1, further comprising a metal structure, wherein the conductive structure is mechanically coupled to the metal structure such that the metal structure is at least partially fixed to the support structure.

5. The multi-antenna device according to claim 1, wherein the one or more radio devices are adapted to process the communications in a 2.4 gigahertz frequency band, and wherein a position of the conductive structure is such that isolation between the first antenna and the second antenna is at least 15 decibels.

6. The multi-antenna device according to claim 1, wherein the one or more radio devices are adapted to process the communications in a 5 gigahertz frequency band, and wherein a position of the conductive structure is such that isolation between the first antenna and the second antenna is at least 25 decibels.

7. The multi-antenna device according to claim 1, wherein the one or more radio devices include at least one of a Wi-Fi radio device or a Bluetooth radio device.

8. The multi-antenna device according to claim 1, wherein both the first antenna and the second antenna are configured to transmit at the selected frequency or receive at the selected frequency or one or more of both.

9. The multi-antenna device according to claim 1, wherein the conductive structure shares a common ground connection with the first antenna and the second antenna.

10. The multi-antenna device according to claim 1, wherein a position of an electric field null of the second antenna is close to the first position during the communication.

11. A method of operating a multi-antenna device, the method comprising: Processing communications at a selected frequency using one or more radio devices and a first antenna, The one or more radio devices communicatively coupled to the first antenna and a second antenna, The first antenna is coupled to the support structure at a first location of the support structure, and the second antenna is coupled to the support structure at a second location of the support structure, wherein, during the communication, a zero point of the electric field of the first antenna is moved from an initial location towards the second location by a conductive structure coupled to the support structure, thereby increasing isolation between the first antenna and the second antenna, wherein at least a portion of the conductive structure is located at the initial location.

12. The method according to claim 11, wherein the conductive structure comprises a metal strip having a first end mechanically coupled to the support structure at a first contact location and a second end mechanically coupled to the support structure at a second contact location spaced from the first contact location, and wherein the length of the conductive structure is half of the wavelength of the selected frequency.

13. The method according to claim 11, wherein the communication is in a 2.4 gigahertz band or a 5 gigahertz band.

14. The method according to claim 11, wherein the conductive structure shares a common ground connection with the first antenna and the second antenna.

15. A multi-antenna device, comprising: a support structure; one or more radio devices adapted to process communication at a selected frequency using a first antenna coupled to the support structure at a first location; a second antenna coupled to the support structure at a second location, the second antenna being communicatively coupled to the one or more radio devices; and a conductive structure coupled to the support structure, the conductive structure having a first end coupled to the support structure at a first contact location and a second end coupled to the support structure at a second contact location spaced from the first contact location, wherein the conductive structure, the first antenna, and the second antenna share a common ground connection, wherein the position of the conductive structure relative to the first antenna is adapted to cause a local or global minimum of the electromagnetic field of the first antenna to move from an initial location to the second location during the communication, thereby increasing isolation between the first antenna and the second antenna, and wherein the first contact location is the initial location, and at least a portion of the conductive structure is located at the initial location.

16. The multi-antenna device according to claim 15, wherein the position of the conductive structure causes a local or global minimum of the electromagnetic field of the second antenna to move to the first location during the communication.

17. The multi-antenna device according to claim 15, wherein the length of the conductive structure measured between the first end and the second end of the conductive structure is half of the wavelength of the selected frequency.

18. The multi-antenna device according to claim 15, wherein the communication is in a 2.4 gigahertz band or a 5 gigahertz band.

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