Input Sensor

Abstract

An input sensor is provided. The input sensor includes: a first connection pattern; a second connection pattern located on a different layer from the first connection pattern and electrically disconnected from the first connection pattern; a first sensor pattern located on a different layer from the first connection pattern and coupled to the first connection pattern; a second sensor pattern located on a different layer from the first connection pattern and coupled to the second connection pattern; and a floating pattern that, when viewed in a plan view, overlaps at least a portion of the first connection pattern and is spaced apart from the second connection pattern.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2019-0079640, filed on July 2, 2019, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to an input sensing unit and an electronic device including the input sensing unit. Background Technology

[0003] Electronic devices can be activated by an electrical signal applied to them. Electronic devices may include input sensing units for sensing various inputs provided from the outside (e.g., from external objects). To improve user convenience, the input sensing unit may be used alone or as a component of a display device for displaying images.

[0004] The input sensing unit includes various electrode patterns activated by electrical signals. The active area where the electrode pattern is activated can be used to display image information or to sense external touch events.

[0005] External light incident on the electronic device from the outside is reflected by the electrode pattern and emitted to the outside. The reflected light is perceived by a user located outside the electronic device. The reflected light affects the visibility of the effective area.

[0006] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore the information discussed in this background section need not constitute prior art. Summary of the Invention

[0007] Embodiments of this disclosure relate to an input sensing unit and an electronic device including the input sensing unit, for example, to an input sensing unit with improved visibility and an electronic device including the input sensing unit.

[0008] Embodiments of the inventive concept include an input sensing unit with relatively improved visibility and an electronic device including the input sensing unit.

[0009] In embodiments of the inventive concept, the input sensing unit may include: a first connection pattern; a second connection pattern disposed on a different layer from the first connection pattern and electrically disconnected from the first connection pattern; a first sensor pattern disposed on a different layer from the first connection pattern and incorporated into the first connection pattern; a second sensor pattern disposed on a different layer from the first connection pattern and incorporated into the second connection pattern; and a floating pattern that, when viewed in a plan view, overlaps at least a portion of the first connection pattern and is spaced apart from the second connection pattern.

[0010] In this embodiment, the floating pattern and the second connecting pattern can be disposed on the same layer.

[0011] In one embodiment, when viewed in a plan view, the floating pattern may be spaced apart from the second sensor pattern.

[0012] In an embodiment, the floating pattern can be electrically disconnected from the first sensor pattern, the second sensor pattern, and the second connection pattern.

[0013] In this embodiment, the floating pattern and the second connecting pattern can be disposed on different layers.

[0014] In one embodiment, when viewed in a plan view, the floating pattern may be superimposed on the second sensor pattern.

[0015] In an embodiment, the second sensor pattern may include a plurality of first grid lines and a plurality of second grid lines, each of the plurality of first grid lines extending in a first direction, and each of the plurality of second grid lines extending in a second direction intersecting the first direction and contacting the plurality of first grid lines. At least one of the plurality of first grid lines and the plurality of second grid lines that overlaps with the first connecting pattern may extend in a direction intersecting the extending direction of the first connecting pattern.

[0016] In an embodiment, the floating pattern may be spaced apart from the first grid line and the second grid line that overlap with the first connecting pattern, and may extend in a direction parallel to the extension direction of the first connecting pattern.

[0017] In the embodiments, the extension direction of the floating pattern can be a first direction or a second direction.

[0018] In an embodiment, the floating pattern may be spaced apart from the intersections of the plurality of first grid lines and the plurality of second grid lines.

[0019] In an embodiment, the overlapping area between the floating pattern and the first connecting pattern can be in the range of approximately 10% to approximately 90% of the area of ​​the first connecting pattern.

[0020] In an embodiment, the floating pattern may include the same material as the second sensor pattern.

[0021] In an embodiment, the input sensing unit may further include: a third connection pattern disposed on the same layer as the first connection pattern and spaced apart from the first and second connection patterns when viewed in a plan view; a third sensor pattern disposed on a different layer from the third connection pattern and incorporated into the third connection pattern; and an additional floating pattern disposed on a different layer from the third connection pattern and superimposed on at least a portion of the third connection pattern when viewed in a plan view.

[0022] In one embodiment, the third connection pattern may be configured to intersect with the first sensor pattern and may be electrically disconnected from the first sensor pattern. When viewed in a plan view, the additional floating pattern may be spaced apart from the first sensor pattern. Attached Figure Description

[0023] The embodiments will become clearer from the following brief description taken in conjunction with the accompanying drawings. The drawings represent non-limiting exemplary embodiments as described herein.

[0024] Figure 1 This is a perspective view illustrating an electronic device in an embodiment of the inventive concept.

[0025] Figures 2A to 2F These are cross-sectional views of electronic devices in each of the embodiments illustrating the inventive concept.

[0026] Figure 3 This is a plan view of an electronic device that briefly illustrates an embodiment of the inventive concept.

[0027] Figure 4 It is shown Figure 3 A cross-sectional view of the area of ​​the electronic device.

[0028] Figure 5A It is shown Figure 3 A magnified plan view of the area.

[0029] Figure 5B and Figure 5C It is shown Figure 5A The diagram shows a plan view of some of the components.

[0030] Figure 6A It is along Figure 5A A sectional view taken by line I-I'.

[0031] Figure 6B It is along Figure 5A The sectional view taken from line II-II'.

[0032] Figure 6C This is a cross-sectional view showing a portion of an electronic device in an embodiment of the inventive concept.

[0033] Figure 7A and Figure 7B This is a plan view of a portion of the input sensing unit in each embodiment illustrating the inventive concept.

[0034] Figure 8A This is a plan view illustrating the input sensing unit in an embodiment of the inventive concept.

[0035] Figure 8B It is along Figure 8AThe sectional view taken from line III-III'.

[0036] Figure 9A This is a plan view illustrating an electronic device in an embodiment of the inventive concept.

[0037] Figure 9B This is a plan view illustrating a portion of an electronic device in an embodiment of the inventive concept.

[0038] It should be noted that these figures are intended to illustrate the general characteristics of the methods, structures, and / or materials used in some exemplary embodiments and are intended to supplement the textual description provided below. However, these figures are not drawn to scale and may not precisely reflect the exact structural or performance characteristics of any given embodiment, and should not be construed as limiting or restricting the range of values ​​or properties contained in the exemplary embodiments. For example, the relative thickness and location of molecules, layers, regions, and / or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numerals in the various figures is intended to indicate the presence of similar or identical elements or features. Detailed Implementation

[0039] Embodiments of the inventive concept will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments are illustrated. However, exemplary embodiments of the inventive concept can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. In the drawings, the thickness of layers and regions is exaggerated for clarity. In the drawings, the same reference numerals denote the same elements, and therefore overlapping descriptions of them are omitted.

[0040] It will be understood that when an element is referred to as “connected” or “combined” to another element, the element may be directly connected or directly combined to the other element, or there may be intermediate elements. Conversely, when an element is referred to as “directly connected” or “directly combined” to another element, there are no intermediate elements. The same reference numerals always refer to the same element. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Other terms used to describe relationships between elements or layers should be interpreted in the same manner (e.g., “between…” vs. “directly between…”, “adjacent” vs. “directly adjacent”, “on…” vs. “directly on…”).

[0041] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the teachings of the exemplary embodiments, the first element, first component, first region, first layer, or first portion discussed below may be referred to as a second element, second component, second region, second layer, or second portion.

[0042] For ease of description, spatial relative terms such as “below…”, “under…”, “down,” “above…”, “above”, etc., may be used herein to describe the relationship between one element or feature shown in the figures and another (other) element or feature. It will be understood that spatial relative terms are intended to encompass different orientations of the device in use or operation other than those depicted in the figures. For example, if the device in the figures were flipped, an element described as “below” or “under” another element or feature would then be positioned “above” said other element or feature. Thus, the exemplary term “below…” can encompass both above and below orientations. The device may be otherwise positioned (rotated 90 degrees or located in other orientations), and the spatial relative descriptive terms used herein will be interpreted accordingly.

[0043] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the exemplary embodiments. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are also intended to include the plural forms. It will also be understood that if the terms “comprising” and / or “including” and variations thereof are used herein, it indicates the presence of the stated features, integrals, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0044] Example embodiments of the inventive concept are described herein with reference to a cross-sectional view of an idealized embodiment (and intermediate structure) as an exemplary embodiment. Thus, variations in the illustrated shape, for example, due to manufacturing techniques and / or tolerances, will be expected. Therefore, the example embodiments of the inventive concept should not be construed as limited to the specific shape of the areas shown herein, but will include, for example, deviations in shape due to manufacturing processes.

[0045] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments of the inventive concept pertain. It will also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense, unless expressly defined herein.

[0046] Figure 1 This is a perspective view illustrating an embodiment of the inventive concept of an electronic device. The electronic device EA can be activated by an electrical signal applied thereto. The electronic device EA may include a display surface IS defined by a plane extending along a first direction DR1 and a second direction DR2. The display surface IS of the electronic device EA can be selectively activated by an electrical signal applied thereto. When viewed in a plan view, the display surface IS can be divided into an active area AA and a peripheral area NAA.

[0047] The active area AA can be an area that is electrically activated when an electrical signal is supplied to it. Depending on the design of the electronic device EA, the active area AA can be activated to perform various functions.

[0048] In an embodiment, the effective area AA can be a sensing area used to sense input events provided from the outside. For example... Figure 1 As shown, the electronic device EA can sense the external input TC applied to the effective area AA. In other words, the electronic device EA can be used as an input device.

[0049] Figure 1 An example is shown in which a user's hand is used as an external input TC, but various external inputs can be used as external input TCs. For example, external input TCs can be provided in various forms including (e.g., by a user's hand or finger, stylus, etc.) contact touch, non-contact touch (e.g., proximity sensing), force, pressure, or light, but the inventive concept is not limited to a particular type of external input TC.

[0050] Furthermore, the effective area AA can be a display area for information. The electronic device EA can display an image IM within the effective area AA, in which case the user can obtain information from the image IM. In this sense, the electronic device EA can be used as an output device or a graphical interface.

[0051] The peripheral area NAA can be positioned adjacent to the active area AA. Even when the electronic device EA is activated or an electrical signal is applied to the peripheral area NAA, the peripheral area NAA may not be used to display images or sense external input.

[0052] Signal lines used to provide external signals to the active region AA, or driving devices used to drive the active region AA, may be located in the peripheral region NAA. The peripheral region NAA may be adjacent to at least one of the edge regions of the active region AA.

[0053] In this embodiment, the peripheral region NAA is shown as having a frame shape surrounding the active region AA. However, embodiments of the inventive concept are not limited to this, and in some embodiments, the peripheral region NAA may be omitted from the electronic device EA. The shape of the peripheral region NAA can be varied, and the inventive concept is not limited to a specific shape for the peripheral region NAA.

[0054] Figure 1 An example in which the electronic device EA is a touchscreen device is shown. However, the inventive concept is not limited to this example, and according to some embodiments, the electronic device EA may not have a display function.

[0055] Figures 2A to 2F These are cross-sectional views of electronic devices in each of the embodiments illustrating the inventive concept. Figures 2A to 2F The diagram shows a vertical section, each of which is cut parallel to the plane defined by the second direction DR2 and the third direction DR3. Figures 2A to 2F The image shows some examples of the stacked structures of functional panels and / or functional units that constitute an electronic device EA, presented in a simplified manner.

[0056] In an embodiment, the electronic device EA may include a display panel, an input sensing unit (or input sensor), an anti-reflective unit (or anti-reflector), and a window unit (or window). At least some of the display panel, input sensing unit, anti-reflective unit, and window unit may be formed continuously by a continuous process or may be bonded together by adhesive members. Figures 2A to 2F An example in which a pressure-sensitive adhesive film (PSA) is used as an adhesive component is shown. However, in the embodiments described in more detail below, the adhesive component can be any suitable adhesive material or glue. In the embodiments, the anti-reflective unit and the light control unit can be replaced by other units or can be omitted.

[0057] exist Figures 2A to 2FIn this context, if one of the input sensing unit, anti-reflective unit, light control unit (or light controller), and window unit is formed on another element via a continuous process, that unit will be referred to using the term "layer." Conversely, if one of the input sensing unit, anti-reflective unit, light control unit, and window unit is bonded to another element via an adhesive member, that unit will be referred to using the term "panel." A unit referred to using the term "panel" may include a substrate layer (e.g., a synthetic resin film, composite film, or glass substrate) providing a substrate surface, but for units referred to using the term "layer," the substrate layer may be omitted. In other words, a unit referred to using the term "layer" may be disposed on a substrate surface provided by another element or unit.

[0058] Depending on the presence or absence of the substrate layer, the input sensing unit, anti-reflective unit, and window unit can be referred to as the input sensing panel ISP, anti-reflective panel RPP, and window panel WP, or as the input sensing layer ISL, anti-reflective layer RPL, and window layer WL.

[0059] like Figure 2A As shown, the electronic device EA1 may include a display panel DP, an input sensing layer ISL, an anti-reflective panel RPP, a window panel WP, and a protective member PF. The input sensing layer ISL can be directly disposed on the display panel DP. The statement in the specification that "component B1 can be directly disposed on component A1" can mean that no adhesive member is disposed between component A1 and component B1. After component A1 is formed, component B1 can be formed on the substrate surface provided by component A1 through a continuous process.

[0060] Pressure-sensitive adhesive film (PSA) can be disposed between the input sensing layer (ISL) and the anti-reflective panel (RPP), between the anti-reflective panel (RPP) and the window panel (WP), and between the display panel (DP) and the protective component (PF).

[0061] The display panel DP can display images IM (e.g., see...). Figure 1 The input sensing layer ISL can obtain information about the external input TC (e.g., see...). Figure 1 The information includes the coordinates of the display panel (DP). The protective component PF can support the display panel (DP) and protect it from external impacts.

[0062] The protective member PF may include a plastic film (or plastic film) used as a base layer. The protective member PF may include a plastic film comprising one selected from the group consisting of thermoplastic resins such as polyethylene terephthalate (PET), polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP), polystyrene (PS), polyacrylonitrile (PAN), styrene-acrylonitrile copolymer (SAN), acrylonitrile-butadiene-styrene (ABS), polymethyl methacrylate (PMMA), and combinations thereof. When the protective member PF is formed of polyethylene terephthalate (PET), the protective member PF may exhibit excellent heat resistance, fatigue strength, and electrical properties, and may be insensitive to temperature and humidity.

[0063] The materials used for the protective component PF are not limited to plastic resins, and organic / inorganic composites can be used for the protective component PF. The protective component PF may include a porous organic layer and an inorganic material filling the pores of the organic layer.

[0064] In embodiments of the inventive concept, the display panel DP can be a light-emitting display panel, but embodiments of the inventive concept are not limited to a specific type of display panel DP. For example, the display panel DP can be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel can be formed of or include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel can include quantum dots and / or quantum rods. For simplicity, the following description will refer to examples in which the display panel DP is an organic light-emitting display panel.

[0065] An anti-reflective panel RPP can reduce the reflectivity of natural light or sunlight incident on a window panel WP from external space. In embodiments, the anti-reflective panel RPP may include a phase retarder and a polarizer. The phase retarder may be film-type or liquid crystal coated type, and may include λ / 2 phase retarders and / or λ / 4 phase retarders. The polarizer may also be film-type or liquid crystal coated type. Film-type polarizers or phase retarders may include stretched synthetic resin films, while liquid crystal coated polarizers or phase retarders may include liquid crystals arranged in a specific orientation. The phase retarder and polarizer may also include a protective film. At least one of the phase retarder, polarizer, and their protective films may be used as a substrate layer of the anti-reflective panel RPP.

[0066] In an embodiment, the anti-reflective panel RPP may include color filters. The color filters may be arranged in a specific manner. The arrangement of the color filters may be determined by considering the color of light to be emitted from the pixels in the display panel DP. The anti-reflective panel RPP may also include a black matrix adjacent to the color filters.

[0067] In this embodiment, the window panel WP may include a substrate layer WP-BS and a light-blocking pattern WP-BZ. The substrate layer WP-BS may include a glass substrate and / or a synthetic resin film. The substrate layer WP-BS may not be limited to a single-layer structure. The substrate layer WP-BS may include two or more films attached to each other by adhesive members.

[0068] The light-blocking pattern WP-BZ can be partially superimposed on the substrate layer WP-BS. The light-blocking pattern WP-BZ can be located on the rear surface of the substrate layer WP-BS to define the border area of ​​the electronic device EA1 (e.g., Figure 1 The outer region (NAA).

[0069] The light-blocking pattern WP-BZ can be a colored organic layer and can be formed, for example, by coating. In an embodiment, the window panel WP may also include a functional coating disposed on the front surface of the substrate layer WP-BS. The functional coating may include an anti-fingerprint layer, an anti-reflective layer, a hard coating, etc.

[0070] exist Figures 2B to 2F In the image, the window panel WP and the window layer WL are briefly shown without distinguishing between the substrate layer WP-BS and the light-blocking pattern WP-BZ.

[0071] like Figure 2B and Figure 2C As shown, electronic device EA2 or EA3 may include a protective component PF, a display panel DP, an input sensing panel ISP, an anti-reflective panel RPP, and a window panel WP. The stacking order of the input sensing panel ISP and the anti-reflective panel RPP can be changed.

[0072] like Figure 2D As shown, the electronic device EA4 may include a protective component PF, a display panel DP, an input sensing layer ISL, an anti-reflective layer RPL, and a window layer WL. The adhesive component can be omitted from the electronic device EA4, and the input sensing layer ISL, anti-reflective layer RPL, and window layer WL can be formed on the substrate surface provided by the display panel DP through a continuous process. The stacking order of the input sensing layer ISL and the anti-reflective layer RPL can be changed.

[0073] Here, the anti-reflective layer RPL may include a liquid crystal coated phase retarder and a liquid crystal coated polarizer. The phase retarder and polarizer may include a disk-shaped liquid crystal layer having a tilt angle in a specific direction.

[0074] like Figure 2E and Figure 2F As shown, electronic devices EA5 or EA6 may not include a separate anti-reflective layer. (With...) Figures 2A to 2D The input sensing panel ISP or input sensing layer ISL shown are different. Figure 2EThe input sensing layer ISL-1 shown may also include a color filter with anti-reflective properties. Figures 2A to 2D The display panel DP shown is different. Figure 2F The display panel DP-1 shown may also include a color filter with anti-reflective properties.

[0075] Figure 3 This is a plan view of an electronic device that briefly illustrates an embodiment of the inventive concept. Figure 4 It is shown Figure 3 A cross-sectional view of the area containing electronic equipment. For ease of illustration, in Figure 3 and Figure 4 The diagram shows a portion of an electronic device EA (e.g., a display unit (or monitor) DU and an input sensing unit ISU), and... Figure 4 The effective region AA is shown in the figure. In the following text, reference will be made to... Figure 3 and Figure 4 Electronic device EA in an embodiment of the inventive concept.

[0076] In this embodiment, the input sensing unit ISU is shown as being disposed on the display unit DU. However, embodiments according to the inventive concept are not limited to this example, and in other embodiments, the input sensing unit ISU may be disposed below the display unit DU or may be inserted into the display unit DU. The position of the input sensing unit ISU can be varied, and the inventive concept is not limited to an input sensing unit ISU in a specific position.

[0077] Reference Figure 4 The display unit DU may include a substrate layer BL, a pixel definition layer PDL, a display device ED, and an encapsulation layer EC. The display unit DU may include multiple light-emitting regions PXA and multiple non-light-emitting regions NPXA arranged in the effective area AA. Although in Figure 4 Only two regions of the luminescent PXA are shown in the figure, but the inventive concept is not limited thereto.

[0078] In an embodiment, the substrate layer BL may include multiple insulating layers and multiple conductive layers. The conductive and insulating layers may form thin-film transistors and capacitors connected to the display device ED.

[0079] The pixel-defining layer (PDL) can be set on the substrate layer (BL). An opening can be defined within the PDL. Each opening can define a light-emitting region (PXA).

[0080] Display devices ED can be disposed on the substrate layer BL. Display devices ED can be disposed at positions corresponding to the openings. Display devices ED can emit light constituting the image to be displayed in response to electrical signals transmitted through the thin-film transistors and capacitors constituting the substrate layer BL.

[0081] Display devices (EDs) can be implemented in various forms. For example, an ED can be an electrophoretic device, a liquid crystal capacitor, an electrowetting device, an organic light-emitting device, a quantum dot light-emitting device, a micro LED, or a nano LED. The following description will refer to examples where the ED is an organic light-emitting device.

[0082] A display device ED may include a first electrode EL1, a light-emitting layer EML, and a second electrode EL2. In the display device ED, the potential difference between the first electrode EL1 and the second electrode EL2 can be adjusted to activate the light-emitting layer EML or to emit light from the light-emitting layer EML. Therefore, the light-emitting region PXA can correspond to the region on which the light-emitting layer EML is disposed.

[0083] The luminescent region PXA can have at least two different sizes or areas. For example, the area of ​​each luminescent region PXA can be determined based on the color of the light emitted from it. That is, in embodiments of the inventive concept, the luminescent region PXA can have an area or size suitable for the color of the light emitted from it, which can enable uniform optical efficiency for various colors of light.

[0084] An encapsulation layer EC can cover the display device ED. The encapsulation layer EC may include at least one inorganic layer and / or at least one organic layer. The encapsulation layer EC can prevent moisture from entering the display device ED and protect the display device ED. Furthermore, the encapsulation layer EC can be disposed between the display device ED and the input sensing unit ISU to electrically isolate the display device ED from the input sensing unit ISU. However, the inventive concept is not limited to this example, and in some embodiments, the encapsulation layer EC may be provided in the form of a glass substrate or a plastic substrate. In this case, the space between the encapsulation layer EC and the display device ED may be filled with an inert gas or a non-reactive gas. The structure of the display unit DU can be varied, and the inventive concept is not limited to a particular structure of the display unit DU.

[0085] The input sensing unit (ISU) can be directly disposed on the encapsulation layer (EC). For example, the input sensing unit (ISU) can be directly deposited on the top surface of the encapsulation layer (EC) and then patterned. However, embodiments of the inventive concept are not limited to this example, and in embodiments, the electronic device (EA) may also include another element (e.g., a color filter or buffer layer) disposed between the input sensing unit (ISU) and the encapsulation layer (EC).

[0086] Reference Figure 3 The input sensing unit (ISU) may include a first sensing electrode TE1, a second sensing electrode TE2, first signal lines SL11 and SL12, a second signal line SL2, and a pad (or "solder pad") PD.

[0087] The first sensing electrode TE1 may extend along the first direction DR1. In an embodiment, a plurality of first sensing electrodes TE1 may be arranged along the second direction DR2. The first sensing electrode TE1 may include a plurality of first sensor patterns SP1 and a plurality of first connection patterns CP1, the plurality of first sensor patterns SP1 being arranged along the first direction DR1, and the plurality of first connection patterns CP1 being disposed between the first sensor patterns SP1 to connect adjacent first sensor patterns SP1 to each other.

[0088] The second sensing electrode TE2 can be configured to be electrically disconnected from the first sensing electrode TE1. The second sensing electrode TE2 can extend along the second direction DR2. In an embodiment, a plurality of second sensing electrodes TE2 can be arranged along the first direction DR1. The second sensing electrode TE2 may include a plurality of second sensor patterns SP2 and a plurality of second connection patterns CP2, the plurality of second sensor patterns SP2 being arranged along the second direction DR2, and the plurality of second connection patterns CP2 being disposed between the second sensor patterns SP2 to connect adjacent second sensor patterns SP2 to each other.

[0089] The input sensing unit (ISU) can sense the external input TC by sensing the change in capacitance between the first sensing electrode TE1 and the second sensing electrode TE2, or by sensing the change in capacitance of each of the first sensing electrode TE1 and the second sensing electrode TE2 (see, for example, [link to relevant documentation]). Figure 1 In the embodiments, the input sensing unit (ISU) can sense the external input (TC) in various ways, and the inventive concept is not limited to a particular embodiment.

[0090] First signal lines SL11 and SL12 can be connected to the first sensing electrode TE1. First signal lines SL11 and SL12 can be located in the peripheral area NAA and can be undetectable by the user. Second signal line SL2 can be connected to the second sensing electrode TE2. Second signal line SL2 can be located in the peripheral area NAA and can be undetectable by the user.

[0091] In an embodiment, the first signal lines SL11 and SL12 may include an upper signal line SL11 and a lower signal line SL12. The upper signal line SL11 may be connected to the upper part of the first sensing electrode TE1, and the lower signal line SL12 may be connected to the lower part of the first sensing electrode TE1.

[0092] The upper signal line SL11 and the lower signal line SL12 can be connected to the spaced-apart pads PD11 and PD12, respectively. Therefore, even when the first sensing electrode TE1 is longer than the second sensing electrode TE2, the electrical signal can be uniformly applied to the entire area of ​​the input sensing unit ISU. Thus, regardless of the shape of the input sensing unit ISU, it can provide a uniform touch sensing environment covering the entire effective area AA.

[0093] However, the inventive concept is not limited to this example. As an example, the opposite ends of the second sensing electrode TE2 may also be connected to a pair of signal lines. As another example, the ends of each of the first sensing electrode TE1 and the second sensing electrode TE2 may be connected to signal lines. Furthermore, the input sensing unit ISU can operate in various ways, but the inventive concept is not limited to a particular operating method.

[0094] The pad PD may include first pads PD11 and PD12 and a second pad PD2. As described above, each of the pads PD can be connected to a corresponding one of the first signal lines SL11 and SL12 or the second signal line SL2, and can be electrically connected to the first sensing electrode TE1 or the second sensing electrode TE2. An externally supplied electrical signal can be provided to the input sensing unit ISU through the pad PD.

[0095] Return to reference Figure 4 The input sensing unit (ISU) may include multiple conductive layers and multiple insulating layers stacked vertically. In an embodiment, the input sensing unit (ISU) may include a first conductive layer 10, a second conductive layer 20, a first insulating layer 30, and a second insulating layer 40 disposed on different layers or at different levels.

[0096] The first conductive layer 10 can be disposed on the display unit DU. The second conductive layer 20 can be disposed on the first conductive layer 10 and the first insulating layer 30. Each of the first sensing electrode TE1, the second sensing electrode TE2, the first signal lines SL11 and SL12, the second signal line SL2, and the pad PD can be included in one of the first conductive layer 10 and the second conductive layer 20.

[0097] Each of the first conductive layer 10 and the second conductive layer 20 may include multiple conductive patterns. The conductive patterns may include the first sensing electrode TE1, the second sensing electrode TE2, the first signal lines SL11 and SL12, the second signal line SL2, and the pad PD.

[0098] When viewed in a planar view, the conductive patterns constituting each of the first conductive layer 10 and the second conductive layer 20 may not overlap with the light-emitting region PXA. In this case, even if the first conductive layer 10 and the second conductive layer 20 are formed of opaque material, it is possible to prevent the first conductive layer 10 and the second conductive layer 20 from affecting the image IM displayed in the light-emitting region PXA. However, embodiments according to the inventive concept are not limited to this example or specific embodiment, and each of the first conductive layer 10 and the second conductive layer 20 may include a conductive pattern or an optically transparent conductive pattern overlapping at least a portion of the light-emitting region PXA.

[0099] A first insulating layer 30 may be disposed between the first conductive layer 10 and the second conductive layer 20. When viewed in cross-sectional view, the first insulating layer 30 allows the first conductive layer 10 to be separated from the second conductive layer 20. A portion of the second conductive layer 20 and the first conductive layer 10 may be electrically connected to each other through a contact hole CH formed to penetrate the first insulating layer 30.

[0100] The second insulating layer 40 may be disposed on the first insulating layer 30. The second insulating layer 40 may cover the second conductive layer 20. The second insulating layer 40 may protect the second conductive layer 20 from the influence of the external environment.

[0101] The first insulating layer 30 and the second insulating layer 40 can have insulating and optically transparent properties. Therefore, even when the light-emitting region PXA is covered by the first insulating layer 30 and the second insulating layer 40, the light from the light-emitting region PXA can be easily recognized by a user located outside the input sensing unit ISU.

[0102] The first insulating layer 30 and the second insulating layer 40 may include at least one inorganic layer and / or at least one organic layer. When the first insulating layer 30 and the second insulating layer 40 are formed substantially of organic materials or substantially comprise organic materials, the flexibility of the input sensing unit ISU can be improved. Alternatively, when the first insulating layer 30 and the second insulating layer 40 are formed substantially of inorganic materials or substantially comprise inorganic materials, the input sensing unit ISU can have a thin structure and improved shock resistance. In the embodiments, various materials can be used for the first insulating layer 30 and the second insulating layer 40, but the inventive concept is not limited to specific materials.

[0103] Figure 5A It is shown Figure 3 A magnified plan view of the area. Figure 5B and Figure 5C It is shown Figure 5A The diagram shows a plan view of some of the components. For ease of explanation, Figure 5A The diagram shows an area of ​​the input sensing unit (ISU) in which a first connection pattern CP1 and a second connection pattern CP2 are disposed. Specifically, in Figure 5AOnly the conductive pattern is shown in the image, but... Figure 5A The first insulating layer 30 and the second insulating layer 40 are omitted.

[0104] Figure 5B It shows Figure 5A The first conductive layer 10, and Figure 5C It shows Figure 5A The second conductive layer 20. Referring below... Figures 5A to 5C Embodiments of the inventive concept will be described in more detail.

[0105] In an embodiment, a plurality of first sensor patterns SP1 may be spaced apart from each other in a first direction DR1, and a plurality of second sensor patterns SP2 may be spaced apart from each other in a second direction DR2. Each of the first connecting patterns CP1 may extend in the first direction DR1 to connect the first sensor patterns SP1 to each other, and each of the second connecting patterns CP2 may extend in the second direction DR2 to connect the second sensor patterns SP2 to each other.

[0106] The first connection pattern CP1 and the second connection pattern CP2 can be disposed on different layers or at different levels. The first connection pattern CP1 can be composed of grid lines MSL or a transparent pattern. The first connection pattern CP1 and the first sensor pattern SP1 can be disposed on different layers or at different levels, and can be connected to each other through contact holes CH_S.

[0107] In the embodiment, the first connection pattern CP1 is shown to constitute the first conductive layer 10, and the second connection pattern CP2, the first sensor pattern SP1, and the second sensor pattern SP2 are shown to constitute the second conductive layer 20.

[0108] Reference Figure 5A and Figure 5B The first connecting pattern CP1 is shown as having a shape that, when viewed in a plan view, is spaced apart from the second connecting pattern CP2 and overlaps with the second sensor pattern SP2 and the first sensor pattern SP1. In an embodiment, the first connecting pattern CP1 and the first sensor pattern SP1 may be disposed on the same layer or at the same level. Here, the first sensor pattern SP1 and the second sensor pattern SP2 may be disposed on different layers or at different levels, and the first connecting pattern CP1 and the first sensor pattern SP1 may be formed to form a single object, and the second connecting pattern CP2 and the second sensor pattern SP2 may be formed to form a single object.

[0109] In an embodiment, the first connection pattern CP1 is shown as a first sub-connection pattern CPa and a second sub-connection pattern CPb spaced apart from each other in the second direction DR2. Figure 5BAs shown, the first sub-connection pattern CPa is illustrated as having a structure in which a first line portion A1 and a second line portion A2 extending in the fourth direction DR4, and a third line portion A3 and a fourth line portion A4 extending in the fifth direction DR5, are connected to each other. The fourth direction DR4 and the fifth direction DR5 may be directions diagonally opposite to the first direction DR1 and the second direction DR2.

[0110] The first sub-connecting pattern CPa and the second sub-connecting pattern CPb are shown as having line symmetry about an axis extending in a first direction DR1. Specifically, the second sub-connecting pattern CPb may include a fifth line portion A5 and a sixth line portion A6, as well as a seventh line portion A7 and an eighth line portion A8. The fifth line portion A5 and the sixth line portion A6 extend in the fifth direction DR5 and are symmetrical to the first line portion A1 and the second line portion A2 of the first sub-connecting pattern CPa, respectively. The seventh line portion A7 and the eighth line portion A8 extend in the fourth direction DR4 and are symmetrical to the third line portion A3 and the fourth line portion A4 of the first sub-connecting pattern CPa, respectively.

[0111] However, the embodiments of the inventive concept are not limited to this example, and in the embodiments, the first connection pattern CP1 may be set as a single pattern. Furthermore, if the first connection pattern CP1 is combined with the first sensor pattern SP1, the shape of the first connection pattern CP1 can be changed in various ways, and the inventive concept is not limited to the specific embodiment.

[0112] Reference Figure 5C The first sensor pattern SP1, the second sensor pattern SP2, and the second connection pattern CP2 can be disposed on a layer different from the layer where the first connection pattern CP1 is located, and can constitute the second conductive layer 20. For ease of explanation, in Figure 5C In the image, the first sensor pattern SP1 is shown with a shaded line pattern.

[0113] When viewed in a plan view, the first sensor pattern SP1 can be spaced apart from the second sensor pattern SP2 and the second connection pattern CP2. The first sensor pattern SP1 can be electrically disconnected from the second sensor pattern SP2 and the second connection pattern CP2.

[0114] The second sensor pattern SP2 and the second connection pattern CP2 can be disposed on the same layer. As shown, the second sensor pattern SP2 and the second connection pattern CP2 can be connected to each other to form a single object. However, embodiments of the inventive concept are not limited to this example or specific embodiment, and in embodiments, the second sensor pattern SP2 and the second connection pattern CP2 can be disposed on different layers and can be combined with each other.

[0115] In an embodiment, each of the first sensor pattern SP1, the second sensor pattern SP2, and the second connection pattern CP2 may consist of multiple grid lines MSL. The grid lines MSL may include a first grid line MSL1 and a second grid line MSL2, the first grid line MSL1 extending in the fourth direction DR4, and the second grid line MSL2 extending in the fifth direction DR5 to intersect with the first grid line MSL1.

[0116] In this specification, the phrase "two elements intersect each other" means that the two elements extend in different directions. Such intersecting elements can be placed on the same layer (or at the same level) or on different layers (or at different levels).

[0117] The first grid line MSL1 and the second grid line MSL2 can be disposed on the same layer and can be connected to each other to form multiple grid openings MSL-OP. Each grid opening MSL-OP can be connected to the light-emitting region PXA (e.g., see...). Figure 4 Stacked. Figure 4 The conductive pattern shown can correspond to the grid lines MSL.

[0118] Some of the grid lines MSL can be cut to define the boundary BA between sensor patterns. The boundary BA between the first sensor pattern SP1 and the second sensor pattern SP2 can be formed by removing a portion of the first grid line MSL1, or by removing a portion of the second grid line MSL2. In an embodiment, adjacent grid lines MSL can be electrically disconnected from each other by removing some of the grid lines MSL. The boundary BA between the first sensor pattern SP1 and the second sensor pattern SP2 can be easily designed along the cut lines formed in the grid lines MSL.

[0119] In an embodiment, the input sensing unit (ISU) may further include a floating pattern (FP). For ease of illustration, the floating pattern (FP) is shown in shaded pattern.

[0120] When viewed in a plan view, the floating pattern FP can be positioned overlapping the first connecting pattern CP1. In an embodiment, the overlapping area between the floating pattern FP and the first connecting pattern CP1 can range from approximately 10% to approximately 90% of the area of ​​the first connecting pattern CP1. When the overlapping area between the floating pattern FP and the first connecting pattern CP1 is larger than approximately 90% of the area of ​​the first connecting pattern CP1 or smaller than approximately 10% of the area of ​​the first connecting pattern CP1, the reflectivity of external light will have a large difference between the area occupied by the first connecting pattern CP1 and the area surrounding the first connecting pattern CP1 (e.g., occupied by the second sensor pattern SP2 or the first sensor pattern SP1).

[0121] External light incident from outside the electronic device EA onto the effective area AA is reflected by conductive patterns (e.g., sensor patterns SP1 and SP2 or connection patterns CP1 and CP2) in the input sensing unit ISU or by conductive patterns (e.g., electrodes of thin-film transistors or light-emitting devices (i.e., display devices ED)) in the display unit DU.

[0122] In this embodiment, the reflection of external light will be described primarily based on the reflection of external light in the input sensing unit (ISU). The difference in the reflectivity of external light between the region where the first connection pattern CP1 is located and other regions can be caused by the fact that the first connection pattern CP1 is located on a different layer than the other patterns.

[0123] In embodiments of the inventive concept, since the overlapping area between the floating pattern FP and the first connecting pattern CP1 is designed to be approximately 10% to approximately 90% of the area of ​​the first connecting pattern CP1, the difference in reflectivity between the area occupied by the first connecting pattern CP1 and the adjacent area can be reduced, and the first connecting pattern CP1 can be prevented from being identified by the user.

[0124] In an embodiment, such as Figure 5C As shown, multiple floating patterns FP can be configured to be spaced apart from each other. Multiple floating patterns FP can be located between grid lines MSL. When viewed in a plan view, the floating patterns FP can be spaced apart from the second sensor pattern SP2 or the second connection pattern CP2. Therefore, the floating patterns FP can be electrically disconnected from the second sensor pattern SP2 or the second connection pattern CP2, thus preventing the floating patterns FP from affecting the second sensor pattern SP2 or the second connection pattern CP2 (i.e., preventing electrical interference between the floating patterns FP and the second sensor pattern SP2 or the second connection pattern CP2).

[0125] Some of the grid lines MSL constituting the second sensor pattern SP2 can be removed, and the second sensor pattern SP2 can be spaced apart from the floating pattern FP. Some of the grid lines MSL of the second sensor pattern SP2 that overlap with the first connecting pattern CP1 can intersect with the first connecting pattern CP1, and can extend without being parallel to the first connecting pattern CP1.

[0126] The portion of the first grid line MSL1 of the second sensor pattern SP2 that overlaps with the first line portion A1 and the second line portion A2 of the first sub-connecting pattern CPa extending parallel to the first grid line MSL1, or the seventh line portion A7 and the eighth line portion A8 of the second sub-connecting pattern CPb, can be removed. Furthermore, the portion of the second grid line MSL2 of the second sensor pattern SP2 that overlaps with the third line portion A3 and the fourth line portion A4 of the first sub-connecting pattern CPa extending parallel to the second grid line MSL2, or the fifth line portion A5 and the sixth line portion A6 of the second sub-connecting pattern CPb, can be removed.

[0127] Therefore, the first grid line MSL1 can intersect the first connecting pattern CP1 in the area overlapping with it, but it can not extend in a direction parallel to the first connecting pattern CP1. Similarly, the second grid line MSL2 can intersect the first connecting pattern CP1 in the area overlapping it, but it can not extend in a direction parallel to the first connecting pattern CP1. This reduces the overlap area between the first connecting pattern CP1 and the second sensor pattern SP2, thereby reducing noise problems caused by parasitic capacitance. Furthermore, the floating pattern FP can be spaced apart from the second sensor pattern SP2 and can be arranged along the first connecting pattern CP1.

[0128] Figure 6A It is along Figure 5A A sectional view taken by line I-I'. Figure 6B It is along Figure 5A The sectional view taken from line II-II'. Figure 6C This is a cross-sectional view illustrating a portion of an electronic device in an embodiment of the inventive concept. For ease of explanation, Figure 6C It shows the relationship with Figure 6B The corresponding area.

[0129] like Figure 6A As shown, the first sensor pattern SP1, the second sensor pattern SP2, and the second connection pattern CP2 can be located on the first connection pattern CP1. For example, the first connection pattern CP1 can be located between the display unit DU and the first insulating layer 30, and the first sensor pattern SP1, the second sensor pattern SP2, and the second connection pattern CP2 can be located between the first insulating layer 30 and the second insulating layer 40. The conductive pattern constituting each of the first conductive layer 10 and the second conductive layer 20 can mean a grid line MSL (e.g., see...). Figure 5A ).

[0130] The first sensor pattern SP1 can be bonded to the first connection pattern CP1 through the contact hole CH_S. The contact hole CH_S can be formed to penetrate the insulating layer between the first conductive layer 10 and the second conductive layer 20.

[0131] like Figure 6B As shown, in the second sensor pattern SP2, when viewed in a planar view, the grid lines extending in a direction parallel to the first connecting pattern CP1 may not overlap with the first connecting pattern CP1. The grid lines of the second sensor pattern SP2 that overlap with the first connecting pattern CP1 in the planar view may extend in a direction intersecting with the first connecting pattern CP1. Unlike the first grid lines MSL1 and MSL2 that overlap with the first connecting pattern CP1 in the planar view of the first sensor pattern SP1, the first grid lines MSL1 and MSL2 of the second sensor pattern SP2 that overlap with the first connecting pattern CP1 in the planar view may intersect with the first connecting pattern CP1.

[0132] The floating pattern FP can be arranged such that it is spaced apart from the first grid line MSL1 and the second grid line MSL2. When viewed in a plan view, the floating pattern FP can be superimposed on the first connecting pattern CP1 and can extend in a direction parallel to the extension direction of the first connecting pattern CP1. In an embodiment, a plurality of floating patterns FP can be disposed within the interior space of the grid lines.

[0133] In an embodiment, the floating pattern FP may be formed of or comprise the same material as the material of the second sensor pattern SP2. Furthermore, the floating pattern FP can be patterned simultaneously using the same process as that used for the second sensor pattern SP2 (i.e., by utilizing the same mask used for the second sensor pattern SP2). In this case, the floating pattern FP can be formed during the process of forming the second sensor pattern SP2, thus simplifying the manufacturing process and reducing process costs. However, embodiments according to the inventive concept are not limited to this example or specific embodiment, and in embodiments, the floating pattern FP may be formed of a material different from the material of the second sensor pattern SP2, or may be formed using a process different from that used for the second sensor pattern SP2.

[0134] Optionally, such as Figure 6C As shown, the floating pattern FP can be located on a different layer than the first connection pattern CP1 or the second connection pattern CP2. The floating pattern FP can be located on the second insulating layer 40. As long as the floating pattern FP is superimposed on the first connection pattern CP1 in the plan view, the floating pattern FP can be located on a different layer than the second connection pattern CP2, and the inventive concept is not limited to this example or specific embodiment.

[0135] In embodiments of the inventive concept, the overlap area between the first connection pattern CP1 and the second sensor pattern SP2 can be reduced, thereby easily preventing the sensitivity of the input sensing unit ISU from deteriorating due to electrical interference between the first connection pattern CP1 and the second sensor pattern SP2. Furthermore, in embodiments of the inventive concept, because the input sensing unit ISU also includes a floating pattern FP, the difference in visibility of the conductive patterns between areas where the first connection pattern CP1 is positioned and areas where the first connection pattern CP1 is not positioned can be reduced. Therefore, the first connection pattern CP1 can be prevented or reduced from being clearly identified, thereby achieving uniform visibility throughout the input sensing unit ISU.

[0136] Furthermore, in the embodiments of the inventive concept, because uniform visibility can be achieved throughout the input sensing unit ISU, it is possible to prevent the input sensing unit ISU from affecting the quality of the image generated by the display unit DU. Therefore, although the electronic device EA includes both the display unit DU and the input sensing unit ISU, the electronic device EA can provide the user with a relatively high-quality image.

[0137] Figure 7A and Figure 7B This is a plan view of a portion of the input sensing unit in each embodiment illustrating the inventive concept. For ease of illustration, in Figure 7A and Figure 7B The diagram shows a first connection pattern CP1 and a floating pattern FP-A or FP-B, with the floating pattern FP-A or FP-B shown as a shaded pattern. Reference will be made below. Figure 7A and Figure 7B Embodiments of the inventive concept will be described in more detail.

[0138] like Figure 7A As shown, the floating pattern FP-A can be set to a single object. The floating pattern FP-A can be used in conjunction with the first sensor pattern SP1 (e.g., see...). Figure 5A The floating pattern FP-A can be superimposed on the first connecting pattern CP1 when viewed in a plan view, and can be located in an area other than the area where the contact hole CH_S of the first connecting pattern CP1 is located.

[0139] In an embodiment, when viewed in a plan view, the floating pattern FP-A can be aligned with the second sensor pattern SP2 (e.g., see...). Figure 5A () Intersection. For example, in the second sensor pattern SP2, there is an intersection with... Figure 5AIn the case of shapes identical to those shown, the floating pattern FP-A may intersect with either the first grid line MSL1 or the second grid line MSL2, which is electrically disconnected from and intersects with the first connecting pattern CP1. In embodiments, the floating pattern FP-A and the first grid line MSL1 or the second grid line MSL2 may be located on the same layer and may be directly connected to each other. In some embodiments, the floating pattern FP-A and the first grid line MSL1 or the second grid line MSL2 may be located on different layers to intersect each other and may be electrically disconnected from each other.

[0140] However, the inventive concept is not limited to this example, and in an embodiment, when viewed in a plan view, the floating pattern FP-A may be spaced apart from the second sensor pattern SP2. Here, the second sensor pattern SP2 can be formed by removing the portion of the grid lines MSL of the second sensor pattern SP2 that overlaps with the area where the floating pattern FP-A is disposed.

[0141] In an embodiment, if the floating pattern FP-A is set as a single object, the shape of the floating pattern FP-A can be changed in various ways. The overlapping area between the floating pattern FP-A and the first connecting pattern CP1 can be in the range of approximately 10% to approximately 90% of the area of ​​the first connecting pattern CP1.

[0142] Optionally, such as Figure 7B As shown, the floating pattern FP-B can have a width greater than the width of the first connecting pattern CP1 over which it is superimposed. For example, the floating pattern FP-B can be superimposed on the portion of the first connecting pattern CP1 extending in the fourth direction DR4 to have a width greater than the width of the first connecting pattern CP1 in the fifth direction DR5, or it can be superimposed on the portion of the first connecting pattern CP1 extending in the fifth direction DR5 to have a width greater than the width of the first connecting pattern CP1 in the fourth direction DR4.

[0143] In embodiments of the inventive concept, if the floating pattern FP-A or FP-B is superimposed on the first connecting pattern CP1 when viewed in a plan view, the shape or width of the floating pattern FP-A or FP-B can be varied, but the inventive concept is not limited to a particular embodiment. In embodiments of the inventive concept, because the floating pattern FP-A or FP-B is arranged to superimpose on the first connecting pattern CP1, visibility problems can be prevented from occurring in the area where the first connecting pattern CP1 is provided.

[0144] Figure 8A This is a plan view illustrating the input sensing unit in an embodiment of the inventive concept. Figure 8B It is along Figure 8A The sectional view taken by line III-III'. For ease of explanation, Figure 8AIt shows the relationship with Figure 5A The corresponding area Figure 8B A cross-sectional view of the electronic device EA-1 is shown. Figure 8B The area shown in the image can be compared with... Figure 6B The corresponding regions are shown in the figure. In the following text, reference will be made to... Figure 8A and Figure 8B Embodiments of the inventive concept will be described in more detail. Meanwhile, for the sake of brevity, previous references will be made to... Figures 1 to 7B The described elements may be identified by the same reference numerals without repeating their overlapping descriptions.

[0145] When viewed in a plan view, the floating pattern FP-1 of the input sensing unit ISU-1 can be superimposed on the grid lines MSL. The floating pattern FP-1 can be arranged to superimpose on a portion of the first grid line MSL1 or the second grid line MSL2 of the grid lines MSL, said portion of the first grid line MSL1 or the second grid line MSL2 of the grid lines MSL being superimposed on the first connection pattern CP1, electrically disconnected from the first connection pattern CP1, and arranged to intersect with the first connection pattern CP1.

[0146] In this embodiment, the floating pattern FP-1 may be located on the second insulating layer 40. Therefore, the floating pattern FP-1 may be spaced apart from the second sensor pattern SP2 when viewed in a cross-sectional view, and may be electrically disconnected from the second sensor pattern SP2.

[0147] In embodiments of the inventive concept, if the floating pattern FP-1 is superimposed on the first connecting pattern CP1 when viewed in a planar view in the input sensing unit ISU-1, the position of the floating pattern FP-1 can be changed in various ways. The input sensing unit ISU-1 may also include the floating pattern FP-1, thereby preventing the first connecting pattern CP1 from being clearly identified and providing uniform visibility to the user.

[0148] Figure 9A This is a plan view illustrating an electronic device in an embodiment of the inventive concept. Figure 9B This is a plan view illustrating a portion of an electronic device in an embodiment of the inventive concept. For ease of explanation, Figure 9A It shows the relationship with Figure 3 The corresponding area Figure 9B The input sensing unit ISU-2 is shown with Figure 5A The corresponding area. This will be referred to in the following text. Figure 9A and Figure 9B Embodiments of the inventive concept will be described in more detail. Meanwhile, for the sake of brevity, previous references will be made to... Figures 1 to 8B The described elements may be identified by the same reference numerals without repeating their overlapping descriptions.

[0149] like Figure 9A As shown, the electronic device EA-2 may further include a third sensing electrode TE3, a third signal line SL3, and a third pad PD3. When viewed in a plan view or cross-sectional view, the third sensing electrode TE3 may be spaced apart from the first sensing electrode TE1 and the second sensing electrode TE2n. The third sensing electrode TE3 may send independent signals to or receive independent signals from the first sensing electrode TE1 and the second sensing electrode TE2n. The second sensing electrode TE2n may have a... Figure 4 The second sensing electrode TE2 shown has a different shape. The second connection pattern CP2 can have a shape different from that shown. Figure 4 The second connection pattern CP2 shown has a similar shape, while the second sensor pattern SP2n may have a shape that surrounds the third sensor pattern SP3, which will be described below.

[0150] The third sensing electrode TE3 may extend along the second direction DR2. In an embodiment, a plurality of third sensing electrodes TE3 may be arranged along the first direction DR1. However, embodiments according to the inventive concept are not limited to this example or specific embodiment, and in some embodiments, the third sensing electrode TE3 may extend along the first direction DR1 and be arranged along the second direction DR2.

[0151] The third signal line SL3 can be connected to the third sensing electrode TE3. The third signal line SL3 can be located in the peripheral area NAA and can be undetectable by the user. The third signal line SL3 can connect the third sensing electrode TE3 to the third pad PD3. The third signal line SL3 can transmit electrical signals transmitted through the third pad PD3 to the third sensing electrode TE3, or can transmit electrical signals provided by the third sensing electrode TE3 to the outside via the third pad PD3.

[0152] In an embodiment, the third sensing electrode TE3 can receive independent electrical signals from the first sensing electrode TE1 and the second sensing electrode TE2n. For example, the third sensing electrode TE3 can sense noise that may occur in the effective area AA. Optionally, the third sensing electrode TE3 can receive ground voltage, in which case interference between the display unit DU and the input sensing unit ISU-2 can be suppressed, thereby improving the sensitivity of the input sensing unit ISU-2. In an embodiment, the third sensing electrode TE3 can receive various signals, and the inventive concept is not limited to a specific embodiment.

[0153] The third sensing electrode TE3 may include multiple third sensor patterns SP3 and multiple third connecting patterns CP3. The third connecting patterns CP3 may be located between the third sensor patterns SP3 to connect adjacent third sensor patterns SP3 to each other. Figure 9BIn the illustration, the third sensor pattern SP3 is shown as a shaded pattern.

[0154] In an embodiment, each of the third sensor patterns SP3 may have a shape surrounded by a corresponding second sensor pattern SP2n in the second sensor patterns SP2n. For example, each of the third sensor patterns SP3 may have a rhomboid shape with its edges extending in the fourth direction DR4 and the fifth direction DR5, and each of the second sensor patterns SP2n may have a rhomboid ring shape surrounding a corresponding third sensor pattern SP3 in the third sensor patterns SP3. The boundary BAn formed by cutting the grid lines MSL may be defined between the second sensor pattern SP2n and the third sensor pattern SP3. However, embodiments according to the inventive concept are not limited to this example or specific embodiment, and in embodiments, the shape of each of the first sensor pattern SP1, the second sensor pattern SP2n, and the third sensor pattern SP3 may be varied.

[0155] The third connecting pattern CP3 can be located between the third sensor patterns SP3. The third sensor patterns SP3 can be electrically connected to each other through the third connecting pattern CP3. The third connecting pattern CP3 can be combined with the third sensor pattern SP3 via the second sensor pattern SP2n and the first sensor pattern SP1.

[0156] Here, the third connecting pattern CP3 can be partially superimposed on the first sensor pattern SP1. Some portions of the first sensor pattern SP1 can be removed so that the first sensor pattern SP1 does not superimpose on the third connecting pattern CP3. For example, portions of the grid lines MSL of the first sensor pattern SP1 (e.g., portions of the first grid line MSL1 or the second grid line MSL2 that, when viewed in a plan view, superimpose on and extend parallel to the third connecting pattern CP3) can be removed. Therefore, the portions of the grid lines MSL of the first sensor pattern SP1 located in the region superimposed on the third connecting pattern CP3 can intersect with the third connecting pattern CP3, but may not be parallel to the third connecting pattern CP3.

[0157] The third connection pattern CP3 can be located on a different layer than the first sensor pattern SP1 and the second sensor pattern SP2n. Therefore, even when the third connection pattern CP3 is superimposed on the first sensor pattern SP1 and the second sensor pattern SP2n when viewed in a plan view, the third connection pattern CP3 can be electrically disconnected from the first sensor pattern SP1 and the second sensor pattern SP2n.

[0158] The third connection pattern CP3 and the first connection pattern CP1 can be located on the same layer or at the same level. Because the third connection pattern CP3 is spaced apart from the first connection pattern CP1 when viewed in a plan view, the third connection pattern CP3 can reliably prevent electrical short circuits with the first connection pattern CP1.

[0159] In an embodiment, the input sensing unit ISU-2 may include a first floating pattern FP1 and a second floating pattern FP2. When viewed in a plan view, the first floating pattern FP1 may be arranged to overlap with the first connecting pattern CP1. The first floating pattern FP1 may be... Figure 5A The floating pattern FP shown corresponds to this, therefore, the description of the overlap will be omitted.

[0160] When viewed in a plan view, the second floating pattern FP2 can be arranged to overlap with the third connecting pattern CP3. In an embodiment, multiple second floating patterns FP2 can be provided, and the multiple second floating patterns FP2 can be arranged side by side in the extending direction of the third connecting pattern CP3. The second floating patterns FP2 can be spaced apart from the grid lines MSL constituting the first sensor pattern SP1.

[0161] The second floating pattern FP2 can reduce the difference in reflectivity between the area where the third connecting pattern CP3 is positioned and the area where the third connecting pattern CP3 is not positioned. Because the input sensing unit ISU-2 also includes the second floating pattern FP2, it is possible to prevent the third connecting pattern CP3 from being easily identified, and uniform visibility can be achieved throughout the input sensing unit ISU-2. However, embodiments according to the inventive concept are not limited to this example or specific embodiment, and one of the first floating pattern FP1 and the second floating pattern FP2 may be omitted from the input sensing unit ISU-2.

[0162] In embodiments of the inventive concept, it is possible to prevent certain conductive patterns on the input sensing unit from being clearly identified, thereby achieving uniform visibility of the image provided to the user across the input sensing unit. Furthermore, in embodiments of the inventive concept, uniform visibility is achieved across the effective area where the image is displayed, thereby preventing image quality degradation due to the input sensing unit.

[0163] Although exemplary embodiments of the inventive concept have been specifically shown and described, those skilled in the art will understand that changes in form and detail may be made therein without departing from the spirit and scope of the claims and their equivalents.

Claims

1. An input sensor, the input sensor comprising: A first sensing electrode includes a first connection pattern and a first sensor pattern, wherein the first sensor pattern is located on a different layer from the first connection pattern and is coupled to the first connection pattern; The second sensing electrode includes a second connection pattern and a second sensor pattern. The second connection pattern is located on a different layer from the first connection pattern and is electrically disconnected from the first connection pattern. The second sensor pattern is located on the same layer as the second connection pattern and extends to the second connection pattern. as well as A floating pattern, when viewed in a plan view, is superimposed on at least a portion of the first connection pattern and disposed in the space inside the second sensing electrode, the floating pattern being spaced apart from the second connection pattern and the second sensor pattern.

2. The input sensor according to claim 1, wherein, The floating pattern and the second connecting pattern are located on the same layer.

3. The input sensor according to claim 2, wherein, When viewed in the plan view, the floating pattern is spaced apart from the second sensor pattern.

4. The input sensor according to claim 2, wherein, The floating pattern is electrically disconnected from the first sensor pattern, the second sensor pattern, and the second connection pattern.

5. The input sensor according to claim 1, wherein, The floating pattern and the second connecting pattern are located on different layers.

6. The input sensor according to claim 5, wherein, When viewed in the plan view, the floating pattern is superimposed on the second sensor pattern.

7. The input sensor according to claim 1, wherein, The second sensor pattern includes multiple first grid lines and multiple second grid lines. Each of the multiple first grid lines extends in a first direction, and each of the multiple second grid lines extends in a second direction intersecting the first direction and contacts the multiple first grid lines. At least one of the plurality of first grid lines and the plurality of second grid lines that overlaps with the first connecting pattern extends in a direction that intersects the extension direction of the first connecting pattern.

8. The input sensor according to claim 7, wherein, The floating pattern is spaced apart from the first grid line and the second grid line that overlap with the first connecting pattern, and extends in a direction parallel to the extension direction of the first connecting pattern.

9. The input sensor according to claim 8, wherein, The extension direction of the floating pattern is either the first direction or the second direction.

10. The input sensor according to claim 7, wherein, The floating pattern is spaced apart from the intersections of the plurality of first grid lines and the plurality of second grid lines.

11. The input sensor according to claim 1, wherein, The overlapping area between the floating pattern and the first connecting pattern is in the range of 10% to 90% of the area of ​​the first connecting pattern.

12. The input sensor according to claim 1, wherein, The floating pattern and the second sensor pattern use the same material.

13. The input sensor according to claim 1, further comprising: The third connecting pattern is located on the same layer as the first connecting pattern and is spaced apart from the first connecting pattern and the second connecting pattern when viewed in the plan view; The third sensor pattern is located on a different layer than the third connection pattern and is incorporated into the third connection pattern; as well as An additional floating pattern is located on a different layer than the third connecting pattern and is superimposed on at least a portion of the third connecting pattern when viewed in the plan view.

14. The input sensor according to claim 13, wherein, The third connection pattern intersects with the first sensor pattern and is electrically disconnected from the first sensor pattern. When viewed in the plan view, the additional floating pattern is spaced apart from the first sensor pattern.

Images