Wafer Cleaning Equipment

Abstract

The embodiment of the present application discloses a wafer cleaning device. The wafer cleaning equipment includes a process tank assembly, and the process tank assembly includes a tank body component and a safety control circuit; the tank body component includes a tank body and a heater, the tank body is used for carrying the cleaning liquid, and the heater is used for heating the cleaning liquid in the tank body ; The safety control circuit includes a first control loop and a second control loop, the first control loop is used to control the conduction or disconnection of the second control loop, and the second control loop is used to control the heater to be turned on or off; wherein, the first control loop The loop includes a first control device and a liquid leakage detection component connected in series; when the control part of the first control device is energized, its switch part is closed, and when the control part is powered off, the switch part is disconnected, and the control part of the first control device is connected in series with the first control part. The second control loop includes a second control device; the switch part of the second control device is connected in series in the second control loop, and the control part of the second control device is connected in series with the switch part of the first control device.

Description

technical field

[0001] The present invention relates to the technical field of semiconductors, and in particular, to a wafer cleaning device. Background technique

[0002] The processing and manufacturing of wafers is extremely complex. Hundreds of processes are required, and the accuracy of each process is guaranteed to be extremely high, in order to finally obtain a wafer with a satisfactory availability rate. After each process, there are different kinds of residues on the wafer, such as impurities such as chemicals, metals, glues, particles, etc. Each impurity corresponds to a different type of cleaning step, so cleaning plays an important role in the wafer fabrication process and is also one of the most basic processes.

[0003] At present, the cleaning equipment of wafers mainly involves two methods: trough machine and single-chip microcomputer, which are used to clean impurities such as particles, polymers, oxides, metal ions and excess films. Among them, the cleani...

Examples

Embodiment Construction

[0019] Embodiments of the present application provide a wafer cleaning device, which is used to solve the problems of inaccurate heating temperature of cleaning solution and low safety during wafer cleaning.

[0020] In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described The embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the scope of protection of this application.

[0021] The wafer cleaning equipment provided in the embodiments of this specification can be applied to the wafer cl...

technical field

[0001] The present invention relates to the technical field of semiconductors, and in particular, to a wafer cleaning device. Background technique

[0002] The processing and manufacturing of wafers is extremely complex. Hundreds of processes are required, and the accuracy of each process is guaranteed to be extremely high, in order to finally obtain a wafer with a satisfactory availability rate. After each process, there are different kinds of residues on the wafer, such as impurities such as chemicals, metals, glues, particles, etc. Each impurity corresponds to a different type of cleaning step, so cleaning plays an important role in the wafer fabrication process and is also one of the most basic processes.

[0003] At present, the cleaning equipment of wafers mainly involves two methods: trough machine and single-chip microcomputer, which are used to clean impurities such as particles, polymers, oxides, metal ions and excess films. Among them, the cleani...

Examples

Embodiment Construction

[0019] Embodiments of the present application provide a wafer cleaning device, which is used to solve the problems of inaccurate heating temperature of cleaning solution and low safety during wafer cleaning.

[0020] In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described The embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the scope of protection of this application.

[0021] The wafer cleaning equipment provided in the embodiments of this specification can be applied to the wafer cl...

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