A machining device for assisting ultrasonic machining and an ultrasonic machining system

Abstract

The application relates to the technical field of ultrasonic machining, and particularly provides a machining device for assisting ultrasonic machining and an ultrasonic machining system, wherein the machining device comprises a transducer, a vibration conducting element and a fluid tank; the connecting part of the vibration conducting element is installed on the mounting part of the transducer, and the vibration area of the vibration conducting element is installed in the fluid tank; the fluid medium injected in the fluid tank covers the vibration conducting element and a workpiece on a positioning jig in the fluid tank; the vibration conducting element is used for concentrating and amplifying the vibration energy output by the transducer and for conducting the concentrated and amplified vibration energy to the fluid medium of the fluid tank, so that the fluid medium in the fluid tank drives the workpiece to vibrate at high frequency and ultrasonic cavitation is generated. The machining device of the application concentrates and amplifies the vibration energy output by the transducer through the vibration conducting element, ultrasonic cavitation is generated when the concentrated and amplified vibration energy is conducted to the fluid medium of the fluid tank, and the machining efficiency of the assisted ultrasonic machining can be effectively improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of power ultrasound, and particularly relates to a machining device for assisting ultrasonic machining and an ultrasonic machining system. BACKGROUND

[0002] At present, in the application field of power ultrasound, the tool end vibration or workpiece end vibration mode is generally adopted to implement the ultrasonic auxiliary machining process. Whether the tool end vibration mode or the workpiece end vibration mode is adopted, high-frequency feeding and retracting actions are introduced on the basis of the conventional machining process.

[0003] Among them, the tool end vibration mode needs to apply ultrasonic vibration to the tool, such as an ultrasonic tool holder or an ultrasonic electric spindle. These process methods all have the defect that the existing machine tool system or tool system needs to be modified, and because ultrasonic vibration is implemented on the machine tool spindle, vibration will inevitably leak to the spindle, which causes low machining efficiency.

[0004] And the workpiece end vibration mode usually uses the vibration of the positioning base or positioning jig to drive the workpiece to high-frequency ultrasonic vibration to realize the ultrasonic auxiliary machining process. However, this workpiece end vibration mode is affected by the size of the workpiece, the resonant frequency and other aspects, and also has the problem of low machining efficiency. SUMMARY

[0005] The technical problem to be solved by the present application is to provide a machining device for assisting ultrasonic machining and an ultrasonic machining system to further improve the machining efficiency of the ultrasonic machining device in view of the problems existing in the current ultrasonic auxiliary machining vibration mode.

[0006] The first aspect of the present application provides a machining device for assisting ultrasonic machining, wherein the machining device comprises a transducer, a vibration transmission member and a fluid tank;

[0007] The connecting part of the vibration transmission member is installed on the mounting part of the transducer, and the vibration area of the vibration transmission member is installed in the fluid tank;

[0008] The fluid medium injected in the fluid tank covers the vibration transmission member and the workpiece on the positioning jig in the fluid tank;

[0009] The vibration transmission member is used for concentrating and amplifying the vibration energy output by the transducer, and is used for transmitting the concentrated and amplified vibration energy to the fluid medium of the fluid tank, so that the workpiece is driven by the fluid medium in the fluid tank to high-frequency vibration and ultrasonic cavitation is generated.

[0010] Optionally, the vibration conductor is a vibration plate type conductor; the mounting portion of the transducer is provided with a mounting hole, and the connecting portion of the vibration plate type conductor is provided with a through hole;

[0011] The mounting hole of the transducer and the through hole of the vibration plate type conductor are connected through a first connecting piece.

[0012] Optionally, the processing device further comprises a variable amplitude rod; the mounting portion of the variable amplitude rod is provided with a mounting hole;

[0013] The mounting hole of the transducer, the through hole of the vibration plate type conductor and the mounting hole of the variable amplitude rod are connected through a second connecting piece.

[0014] Optionally, the vibration plate type conductor is a double-station vibration plate type conductor, and the first connecting portion and the second connecting portion of the vibration plate type conductor are respectively provided with a first through hole and a second through hole; the transducer comprises a first transducer and a second transducer, and the variable amplitude rod comprises a first variable amplitude rod and a second variable amplitude rod, wherein:

[0015] The first mounting hole of the first transducer, the first through hole and the first mounting hole of the first variable amplitude rod are connected through the second connecting piece;

[0016] The second mounting hole of the second transducer, the second through hole and the second mounting hole of the second variable amplitude rod are connected through the second connecting piece.

[0017] Optionally, the vibration area of the vibration plate type conductor comprises a plurality of sub-vibration areas;

[0018] The plurality of sub-vibration areas respectively correspond to a plurality of positioning areas on the positioning jig.

[0019] Optionally, the plurality of sub-vibration areas are rectangular, or square, or circular, or elliptical holes, or special-shaped holes.

[0020] Optionally, the vibration conductor is a vibration rod type conductor; the mounting portion of the transducer is provided with a mounting hole, and the connecting portion of the vibration rod type conductor is provided with a blind hole;

[0021] The mounting hole of the transducer and the blind hole of the vibration rod type conductor are connected through a second connecting piece.

[0022] Optionally, the vibration rod type conductor comprises a first vibration rod type conductor and a second vibration rod type conductor, the first connecting portion of the first vibration rod type conductor is provided with a first blind hole, and the second connecting portion of the second vibration rod type conductor is provided with a second blind hole; the transducer comprises a first transducer and a second transducer;

[0023] The first mounting hole of the first transducer and the first blind hole are connected by the second connecting piece.

[0024] The second mounting hole of the second transducer and the second blind hole are connected by the second connecting piece.

[0025] Optionally, the first and second vibration rod type conductors are arranged outside the positioning area of the positioning jig.

[0026] The second aspect of the present application provides an ultrasonic machining system, wherein the ultrasonic machining system comprises a main frame and the machining device of any one of the first aspect.

[0027] The present application provides a machining device and an ultrasonic machining system for assisting ultrasonic machining, wherein the machining device comprises a transducer, a vibration conducting piece and a fluid tank; the connecting part of the vibration conducting piece is mounted on the mounting part of the transducer, and the vibration area of the vibration conducting piece is mounted in the fluid tank; the fluid medium injected in the fluid tank covers the vibration conducting piece and the workpiece on the positioning jig in the fluid tank; the vibration conducting piece is used for concentrating and amplifying the vibration energy output by the transducer, and is used for conducting the concentrated and amplified vibration energy to the fluid medium in the fluid tank, so that the workpiece is driven by the fluid medium in the fluid tank to vibrate at high frequency and ultrasonic cavitation is generated.

[0028] The machining device provided by the present application can set the fluid tank, the transducer and the vibration conducting piece on the original ultrasonic machining system, concentrate and amplify the vibration energy output by the transducer through the vibration conducting piece, conduct the concentrated and amplified vibration energy to the fluid medium in the fluid tank, so that the workpiece is driven by the fluid medium in the fluid tank to vibrate at high frequency and ultrasonic cavitation is generated. In this way, on the one hand, the tool head of the external ultrasonic device can reduce the chip resistance of the workpiece, so that the machining efficiency of the tool head to the workpiece is improved. On the other hand, the high frequency vibration generates ultrasonic cavitation in the fluid medium, and the cavitation bubbles in the fluid medium burst with energy accumulation, which can realize effective stripping of the chips and other sundries on the tool head and the workpiece, so as to remove the chip adhesion on the tool head, and the tool head can also achieve the effect of self-sharpening, thereby improving the service life of the tool head. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0030] Figure 1is a front view of a processing device provided by an embodiment of the present application;

[0031] Figure 2 is a top view of a vibration conducting member provided by an embodiment of the present application;

[0032] Figure 3 is a perspective view of a vibration conducting member provided by an embodiment of the present application;

[0033] Figure 4 is a top view of a vibration plate type conducting member provided by an embodiment of the present application;

[0034] Figure 5 is an exploded view of a vibration plate type conducting member provided by an embodiment of the present application;

[0035] Figure 6 is a top view of a single-station single-hole vibration plate type conducting member provided by an embodiment of the present application;

[0036] Figure 7 is a top view of a double-station single-hole vibration plate type conducting member provided by an embodiment of the present application;

[0037] Figure 8 is a top view of a double-station double-hole vibration plate type conducting member provided by an embodiment of the present application;

[0038] Figure 9 is a side view of a vibration rod type conducting member provided by an embodiment of the present application;

[0039] Figure 10 is a top view of a vibration rod type conducting member provided by an embodiment of the present application;

[0040] Figure 11 is a perspective view of a vibration rod type conducting member provided by an embodiment of the present application;

[0041] Figure 12 is an exploded view of a vibration rod type conducting member provided by an embodiment of the present application.

[0042] In the specification, the reference signs are as follows:

[0043] 1 - transducer; 11 - first transducer; 12 - second transducer;

[0044] 2 - vibration conducting member; 21 - connecting portion of the vibration conducting member;

[0045] 2a1 - single-station single-hole vibration plate type conducting member; 2a2 - double-station single-hole vibration plate type conducting member;

[0046] 2a3 - double-station double-hole vibration plate type conducting member; 2a4 - double-station four-hole vibration plate type conducting member;

[0047] 2b - vibration rod type conducting member; 2b1 - first vibration rod type conducting member; 2b2 - second vibration rod type conducting member;

[0048] 3 - fluid tank;

[0049] 4 - positioning jig;

[0050] 5 - workpiece;

[0051] 6 - amplitude transformer; 61 - first amplitude transformer; 62 - second amplitude transformer;

[0052] 71 - first sub-vibration zone; 72 - second sub-vibration zone; 73 - third sub-vibration zone; 74 - fourth sub-vibration zone;

[0053] 8 - stud. DETAILED DESCRIPTION

[0054] In order to make the technical problems to be solved by the present application, technical solutions and beneficial effects clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application.

[0055] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0056] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0057] In addition, the terms "first", "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0058] The present application relates to the field of power ultrasound, and provides a machining device for assisting ultrasonic machining, which can be used for assisting ultrasonic machining in an application scenario, so that the machining efficiency of ultrasonic machining is improved when the tool head of the ultrasonic machining device is used for cutting machining of a workpiece, and is particularly used for applying high-power ultrasonic waves to assist machining in the machining of hard and brittle materials, and is particularly applied to ultrasonic machining of 3C industry window components or structural shells.

[0059] In one embodiment, as shown in Figures 1-3 The machining device of the present application comprises a transducer 1, a vibration conductor 2 and a fluid tank 3, and the vibration conductor 2 is provided with a connecting portion, the transducer 1 is provided with a mounting portion (not shown in the figure), the connecting portion 21 of the vibration conductor is mounted on the mounting portion of the transducer 1, and the vibration area of the vibration conductor 2 is mounted in the fluid tank 3; in addition, a positioning jig for positioning the workpiece can be arranged in the fluid tank, and a passage for vacuum suction is arranged in the positioning jig, so that the workpiece can be fixed by vacuum suction. The fluid tank 3 can be filled with a certain amount of fluid medium, which can be liquid water, and the fluid medium can be injected and flooded over the vibration conductor 2 in the fluid tank 3 and the workpiece 5 on the positioning jig 4 in the fluid tank 3. During actual machining, the transducer 1 is used for converting high-frequency signals into high-frequency vibrations and outputting the high-frequency vibrations to the vibration conductor 2, the vibration conductor 2 is used for concentrating and amplifying the vibration energy output by the transducer 1, and is used for conducting the concentrated and amplified vibration energy to the fluid medium in the fluid tank 3, so that the fluid medium drives the workpiece to vibrate at high frequency and generates ultrasonic cavitation in the fluid tank 3.

[0060] The machining device provided by the above embodiment can be specifically arranged with the fluid tank, the transducer and the vibration conductor on the original ultrasonic machining system, the vibration energy output by the transducer is amplified by the vibration conductor, the amplified vibration energy is conducted to the fluid medium in the fluid tank, so that the workpiece is driven by the fluid medium to vibrate at high frequency and ultrasonic cavitation is generated. In this way, on the one hand, the tool head of the external ultrasonic device can reduce the chip resistance to the workpiece, so that the high-frequency vibration can assist the tool head to process the workpiece efficiently. On the other hand, the high-frequency vibration generates ultrasonic cavitation in the fluid medium. The ultrasonic cavitation can be understood as follows: when the ultrasonic wave energy is high enough, the micro-bubbles (cavitation nuclei) existing in the fluid medium vibrate, grow and continuously accumulate the sound field energy under the action of the ultrasonic field. When the energy reaches a certain threshold, the cavitation bubbles collapse and close sharply. The cavitation bubbles in the fluid medium burst with the energy accumulation, so that the tool head and the workpiece can be effectively stripped of the chips and other impurities, thereby removing the chip adhesion on the tool head, and the tool head can also achieve the effect of self-sharpening, thereby improving the service life of the tool head.

[0061] In one embodiment, the vibration conductor 2 is a vibration plate type conductor; the mounting portion of the transducer 1 is provided with a mounting hole, and the connecting portion of the vibration plate type conductor is provided with a through hole; specifically, the mounting hole of the transducer 1 and the through hole of the vibration plate type conductor can be connected by a first connecting piece. The first connecting piece can be a stud 8, or a screw, or an internal hexagonal stud, which is not limited here.

[0062] In one embodiment, as shown in Figure 1 、 Figure 4 and Figure 5 , the machining device can further include an amplitude horn 6; specifically, the mounting portion of the amplitude horn 6 is provided with a mounting hole; the mounting hole of the transducer 1, the through hole of the vibration plate type conductor and the mounting hole of the amplitude horn 6 are connected by a second connecting piece, which can be a stud 8. In this embodiment, the amplitude horn 6 can be understood as a transducer 1 without energy input. By arranging the transducer 1 and the amplitude horn 6 in the middle of the connecting portion of the vibration plate type conductor, the transducer 1 can play a role in balancing the vibration when outputting high-frequency vibration to the vibration conductor 2, so as to avoid the problem of uneven vibration distribution of the vibration plate type conductor, thereby further improving the machining efficiency of the ultrasonic machining.

[0063] In order to further improve the machining efficiency of ultrasonic machining, in one embodiment, as shown in Figure 4 and Figure 5As shown, the vibration plate type conducting member can be a double-station vibration plate type conducting member, specifically, first and second connecting portions (not shown in the figure) are respectively arranged on two ends of the vibration plate type conducting member, a first through hole (not shown in the figure) is arranged on the first connecting portion, and a second through hole (not shown in the figure) is arranged on the second connecting portion; the transducer 1 includes a first transducer 11 and a second transducer 12, and the amplitude horn 6 includes a first amplitude horn 61 and a second amplitude horn 62, wherein the first mounting hole of the first transducer 11, the first through hole, and the first mounting hole of the first amplitude horn 61 are connected through a second connecting member; the second mounting hole of the second transducer 12, the second through hole, and the second mounting hole of the second amplitude horn 62 are connected through a second connecting member, and the second connecting member can be a stud 8 or the like. In this embodiment, by arranging the double-station vibration plate type conducting member, the transducers 1 at both ends can output high-frequency vibration energy to the double-station vibration conducting member 2, so as to realize energy concentration and amplification of the vibration energy output by the double-station vibration plate type conducting member to the transducers 1 at both ends, so as to make the vibration energy after energy concentration and amplification more concentrated, thereby further improving the processing efficiency of the auxiliary ultrasonic machining.

[0064] In one embodiment, the vibration area of the vibration plate type conducting member includes a plurality of sub-vibration areas; the plurality of sub-vibration areas can include, for example Figure 2 two sub-vibration areas (a first sub-vibration area 71 and a second sub-vibration area 72) as shown in Figure 3 three sub-vibration areas, or four sub-vibration areas (a first sub-vibration area 71, a second sub-vibration area 72, a third sub-vibration area 73, and a fourth sub-vibration area 74) as shown in Figure 4 and the like, the sub-vibration areas in this embodiment can be correspondingly arranged according to the clamping number on the positioning jig 4, which is not limited here. Moreover, the plurality of sub-vibration areas correspond to a plurality of positioning areas on the positioning jig 4 respectively. In this embodiment, by arranging corresponding sub-vibration areas on the positioning areas on the positioning jig 4, each sub-vibration area forms a local vibration area interval, so that each sub-vibration area can respectively reduce the chip resistance of the tool head to the workpiece 5 during ultrasonic machining, thereby further improving the processing efficiency of ultrasonic machining.

[0065] In one embodiment, the plurality of sub-vibration areas can be arranged in the form of, but not limited to, for example, a rectangle, or a square, or a circle, or an elliptical hole, or a special-shaped hole, and the like, which can be arranged according to the actual shape of the workpiece 5, which is not limited here.

[0066] It should be noted that the vibration rod type conducting member 2b in the above-mentioned embodiments can include, but is not limited to, for example Figure 6 a single-station single-hole vibration plate type conducting member 2a1 as shown in Figure 7 a double-station single-hole vibration plate type conducting member 2a2 as shown in Figure 8The double-station double-hole vibration plate type conducting member 2a3 shown in the figure, or Figure 4 and Figure 5 The double-station four-hole vibration plate type conducting member 2a4 shown in the figure, or a multi-station multi-hole vibration plate type conducting member, etc., are not limited here.

[0067] In addition, the present application also provides another structure of the vibration conducting member 2, in an embodiment, as shown in the figure, Figures 9-12 The vibration conducting member 2 can also be provided as a vibration rod type conducting member 2b; wherein the transducer 1 is provided with a mounting portion (not shown in the figure), and the vibration rod type conducting member 2b is provided with a connecting portion (not shown in the figure), specifically, the mounting portion of the transducer 1 is provided with a mounting hole (not shown in the figure), and the connecting portion of the vibration rod type conducting member 2b is provided with a blind hole (not shown in the figure); the mounting hole of the transducer 1 and the blind hole of the vibration rod type conducting member 2b are connected through a second connecting member, which can be a stud 8 or the like. In this embodiment, a certain amount of fluid medium can be injected into the fluid tank 3, which can be liquid water or the like, and the fluid medium can be injected and flooded over the vibration conducting member 2 in the fluid tank 3 and the workpiece 5 on the positioning jig 4 in the fluid tank 3. In actual processing, the transducer 1 is used to convert high-frequency signals into high-frequency vibrations and output the high-frequency vibrations to the vibration rod type conducting member 2b, the vibration rod type conducting member 2b is used to concentrate and amplify the vibration energy output by the transducer 1, and is used to conduct the concentrated and amplified vibration energy to the fluid medium in the fluid tank 3, so that the fluid medium in the fluid tank 3 drives the workpiece to vibrate at high frequency and generates ultrasonic cavitation. When the tool head of the external ultrasonic processing device enters the fluid tank 3 and processes the workpiece 5 on the positioning jig, on the one hand, the fluid medium drives the workpiece to vibrate at high frequency, which can reduce the cutting chip resistance of the tool head of the external ultrasonic device to the workpiece, so as to assist the tool head to process the workpiece at high frequency. On the other hand, the high-frequency vibration generates ultrasonic cavitation in the fluid medium, which can be understood as when the ultrasonic wave energy is high enough, the micro-bubbles (cavitation nuclei) existing in the fluid medium vibrate, grow and continuously accumulate the sound field energy under the action of the ultrasonic field, and when the energy reaches a certain threshold, the cavitation bubbles collapse and close sharply. The cavitation bubbles in the fluid medium burst as the energy accumulates, which can effectively strip the cutting chips and other impurities on the tool head and the workpiece, thereby removing the cutting chip adhesion on the tool head, and also can make the tool head achieve the effect of self-sharpening, thereby improving the service life of the tool head.

[0068] In an embodiment, as shown in the figure, Figures 10-12As shown, the vibration rod type conducting member 2b includes a first vibration rod type conducting member 2b1 and a second vibration rod type conducting member 2b2, the first connecting part of the first vibration rod type conducting member 2b1 is provided with a first blind hole (not shown in the figure), and the second connecting part of the second vibration rod type conducting member 2b2 is provided with a second blind hole (not shown in the figure); the transducer 1 includes a first transducer 11 and a second transducer 12; specifically, the first mounting hole of the first transducer 11 and the first blind hole are connected through a second connecting member; and the second mounting hole of the second transducer 12 and the second blind hole are connected through a second connecting member. The second connecting member can be, for example, a stud 8 and the like. The machining device in this embodiment can further improve the machining efficiency of ultrasonic machining and improve the service life of the tool head of the external ultrasonic machining device by providing double vibration plate type conducting members.

[0069] In one embodiment, as Figures 10-11 shown, the first vibration rod type conducting member 2b1 and the second vibration rod type conducting member 2b2 are arranged outside the positioning area of the positioning jig 4. In this embodiment, it can be understood that, by arranging the spaced vibration rod type conducting members 2b outside the positioning area of the positioning jig 4, the vibration energy of the first vibration rod type conducting member 2b1 and the second vibration rod type conducting member 2b2 can be amplified by the vibration energy of the first transducer 11 and the second transducer 12 respectively through the machining device during ultrasonic machining, so that the vibration energy of the positioning area of the positioning jig 4 can be more concentrated, and the machining efficiency of the ultrasonic machining device can be further improved.

[0070] It should be noted that the vibration rod type conducting member in the above embodiment can also be one vibration rod type conducting member, and the vibration rod type conducting member is arranged on one side of the positioning area of the positioning jig 4, which is not limited here.

[0071] The second aspect of the present application provides an ultrasonic machining system, wherein the ultrasonic machining system includes the machining device in any of the above embodiments. The ultrasonic machining system in this embodiment can make the tool head of the ultrasonic machining device amplify the vibration energy output by the transducer 1 through the vibration conducting member 2 when machining the workpiece 5 on the positioning jig 4 in the fluid tank 3, so that the ultrasonic cavitation is generated when the amplified vibration energy is conducted to the fluid medium of the fluid tank 3, effective stripping of the cutting chips and other impurities on the tool head and the workpiece 5 is realized, and the cutting resistance of the tool head in the fluid medium when machining the workpiece 5 can be further reduced, and the adhesion of the cutting chips on the tool head can be removed, so that the tool head achieves the effect of self-sharpening, thereby further improving the machining efficiency of ultrasonic machining and improving the service life of the tool head of the external ultrasonic machining device.

[0072] The above merely describes preferred embodiments of the present application, and is not used to limit the present application, any modification, equivalent replacement and improvement within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A machining device for assisting ultrasonic machining, characterized by, The processing device comprises a transducer, a vibration conductor and a fluid tank; The connecting part of the vibration conductor is mounted on the mounting part of the transducer, and the vibration area of the vibration conductor is mounted in the fluid tank; The fluid medium injected into the fluid tank floods the vibration conductor and the workpiece on the positioning jig in the fluid tank; The vibration conductor is used to concentrate and amplify the vibration energy output by the transducer, and is used to conduct the concentrated and amplified vibration energy to the fluid medium of the fluid tank, so that the fluid medium in the fluid tank drives the workpiece to vibrate at high frequency and generates ultrasonic cavitation; The vibration conductor is a vibration plate type conductor; the mounting part of the transducer is provided with a mounting hole, and the connecting part of the vibration plate type conductor is provided with a through hole; The mounting hole of the transducer and the through hole of the vibration plate type conductor are connected by a first connecting piece; wherein the first connecting piece is a stud or a screw; The processing device further comprises an amplitude transformer; the mounting part of the amplitude transformer is provided with a mounting hole; The mounting hole of the transducer, the through hole of the vibration plate type conductor and the mounting hole of the amplitude transformer are connected by a second connecting piece.

2. The processing apparatus of claim 1, wherein The vibration plate type conductor is a double-station vibration plate type conductor, and the first connecting part and the second connecting part of the vibration plate type conductor are respectively provided with a first through hole and a second through hole; the transducer comprises a first transducer and a second transducer, and the amplitude transformer comprises a first amplitude transformer and a second amplitude transformer, wherein: The first mounting hole of the first transducer, the first through hole and the first mounting hole of the first amplitude transformer are connected by the second connecting piece; The second mounting hole of the second transducer, the second through hole and the second mounting hole of the second amplitude transformer are connected by the second connecting piece.

3. The processing device according to claim 1 or 2, wherein the vibration area of the vibration plate type conductor comprises a plurality of sub-vibration areas; The plurality of sub-vibration areas correspond to a plurality of positioning areas on the positioning jig respectively.

4. The processing device according to claim 3, wherein the plurality of sub-vibration areas are rectangular or circular.

5. The apparatus of claim 1 wherein, The vibration conductor is a vibration rod type conductor; the mounting part of the transducer is provided with a mounting hole, and the connecting part of the vibration rod type conductor is provided with a blind hole; The mounting hole of the transducer and the blind hole of the vibration rod type conductor are connected by a second connecting piece.

6. The processing apparatus of claim 5, wherein The vibration rod type conductor comprises a first vibration rod type conductor and a second vibration rod type conductor, the first connecting part of the first vibration rod type conductor is provided with a first blind hole, and the second connecting part of the second vibration rod type conductor is provided with a second blind hole; the transducer comprises a first transducer and a second transducer; The first mounting hole of the first transducer and the first blind hole are connected by the second connecting piece; The second mounting hole of the second transducer and the second blind hole are connected by the second connecting piece.

7. The processing apparatus of claim 6, wherein The first vibration rod type conductor and the second vibration rod type conductor are arranged outside the positioning area of the positioning jig.

8. An ultrasonic machining system characterized by comprising: The ultrasonic processing system comprises the processing device according to any one of claims 1-7.

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