LED packaging structure and packaging method

Abstract

The present invention discloses an LED packaging structure and packaging method. The LED packaging structure includes an LED chip, a first packaging adhesive layer, an electrode pair, and a bonding structure. The electrode pair includes two metal electrodes. The LED chip is a vertical chip arranged in the first packaging adhesive layer. The lower electrode of the LED chip is welded or conductively bonded to the top of the first metal electrode. The bonding structure is a gate-shaped electroplated structure, including a metal lintel and two metallized vias arranged vertically in the first packaging adhesive layer. The metal lintel is arranged on the top surface of the first packaging adhesive layer, and the two ends of the metal lintel are connected to the top surface of the upper electrode of the LED chip and the top surface of the second metal electrode respectively through the two metallized vias. The bonding structure of the present invention has low resistance and good reliability.

Description

[Technical field]

[0001] The present invention relates to an LED light source, and in particular to an LED packaging structure and a packaging method. [Background Technology]

[0002] An LED (Light Emitting Diode) is a solid-state semiconductor device that converts electrical energy into light. It offers advantages such as low power consumption, excellent light focusing, fast response, strong controllability, high impact resistance, long service life, and environmental friendliness. LEDs have replaced traditional light sources, becoming the fourth generation. Different packaging structures significantly impact LED light output, such as luminous efficiency, beam angle, reliability, and package size.

[0003] Patent No. CN201520209346.2 discloses an LED package module and an LED lamp having the same. The LED package module comprises: a bracket; electrode pins disposed on the bracket; an LED chip, the LED chip being fixed to the bracket in a vertical mounting manner, with the electrodes of the LED chip connected to the electrode pins via bonding wires; and an encapsulation colloid covering the LED chip and the bonding wires. The bracket is made of a transparent material and includes a bracket body and an outwardly protruding boss portion disposed on the bracket body, the boss portion having an inclined surface or an outwardly protruding curved surface. The LED chip is disposed on the top surface of the boss portion. The LED package module of this utility model adopts a vertical mounting manner, with the electrodes of the LED chip connected to the electrode pins via bonding wires. The contact resistance between the bonding wires and the two electrodes is high, resulting in poor reliability, and the LED package module is relatively large. [Summary of the invention]

[0004] The technical problem to be solved by the present invention is to provide an LED packaging structure with low bonding structure resistance and good reliability.

[0005] Another technical problem to be solved by the present invention is to provide a packaging method for the above-mentioned LED packaging structure.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is an LED packaging structure, comprising at least one LED chip, a first packaging adhesive layer, an electrode pair corresponding to the LED chip and a bonding structure, the electrode pair comprising two metal electrodes, the LED chip being a vertical chip, the LED chip being arranged in the first packaging adhesive layer, located above the first metal electrode, the lower electrode of the LED chip being welded or conductively bonded to the top of the first metal electrode; the bonding structure being a gate-shaped electroplating molding structure, comprising a metal beam and two vertically arranged metallized vias, the metal beam being arranged on the top surface of the first packaging adhesive layer, the two ends of the metal beam being respectively connected to the tops of the two metallized vias; the first metallized via passes through the first packaging adhesive layer, and the lower end of the first metallized via passes through the first packaging adhesive layer, and the lower end of the second metallized via is connected to the top surface of the upper electrode of the LED chip;

[0007] In the LED packaging structure described above, the first packaging adhesive layer includes a light-blocking resin layer and a light-transmitting resin layer, and the LED chip is arranged in the light-blocking resin layer; the top of the light-blocking resin layer includes a light-transmitting window, which is located directly above the LED chip, and the light-transmitting resin layer is filled in the light-transmitting window or covers the light-blocking resin layer and the LED chip.

[0008] The LED packaging structure described above is an LED lamp bead packaging structure, in which the metal electrode is arranged at the bottom of the first packaging adhesive layer, and the bottom surface of the metal electrode is exposed outside the first packaging adhesive layer.

[0009] The LED packaging structure described above includes a second packaging glue layer or a first solder resist ink layer, which covers the first packaging glue layer and the metal lintel; the first solder resist ink layer has a light-transmitting window corresponding to the LED chip, and the light-transmitting window is located directly above the LED chip.

[0010] The LED packaging structure described above includes an intermediate circuit layer, a second solder resist ink layer, a third packaging adhesive layer and multiple bottom electrodes, wherein the metal electrode is located in the intermediate circuit layer; the third packaging adhesive layer is arranged below the intermediate circuit layer and includes a plurality of metallized vias; the bottom electrode is arranged below the third packaging adhesive layer, and the intermediate circuit layer is connected to the bottom electrode through the metallized vias of the third packaging adhesive layer; the second solder resist ink layer is arranged between the intermediate circuit layer and the first packaging adhesive layer, the second solder resist ink layer includes a plurality of windows, and the windows of the second solder resist ink layer are located directly above the metal electrodes.

[0011] The LED packaging structure described above is a packaging structure of an RGB-LED display module. The LED chip includes multiple RGB-LED chip groups, and the RGB-LED chip group includes an R chip, a G chip, and a B chip; the intermediate circuit layer includes multiple solder pad groups corresponding to the RGB-LED chip group, and the multiple solder pad groups are arranged in a matrix manner. Each solder pad group includes three pairs of electrode pairs for soldering the RGB-LED chips, and each pair of electrode pairs includes the first metal electrode and the second metal electrode.

[0012] A packaging method for the above-mentioned LED packaging structure includes the following steps:

[0013] 701) manufacturing a bottom packaging structure, wherein the top of the bottom packaging structure includes a plurality of electrode pairs;

[0014] 702) A vertical LED chip is fixed above each first metal electrode, and the lower electrode of the vertical LED chip is welded or conductively bonded to the top surface of the first metal electrode;

[0015] 703) Plastic-sealing a first packaging glue layer above the bottom packaging structure and above the LED vertical chip;

[0016] 704) corresponding to each electrode pair, two vertical holes are opened in the first encapsulation adhesive layer, the bottom surface of the first vertical hole is the top surface of the upper electrode of the vertical LED chip, and the bottom surface of the second vertical hole is the top surface of the second metal electrode;

[0017] 705) The upper surface of the first packaging adhesive layer and the vertical holes are metallized, and excess metal surface is etched away to form a metal beam on the upper surface of the first packaging adhesive layer corresponding to each electrode pair.

[0018] The above packaging method comprises the following steps:

[0019] After step 705, a second encapsulation layer is plastic-sealed on top of the first encapsulation layer and the metal lintel or covered with a first solder resist ink layer. The first solder resist ink layer has a light-transmitting window, and the light-transmitting window is located directly above the LED chip.

[0020] The above-mentioned packaging method and the manufacturing process of the bottom packaging structure include the following steps:

[0021] 901) Covering the upper surface of the flat carrier with a release film, and forming a plurality of unit patterns on the release film, wherein the plurality of unit patterns are arranged in a matrix, and each unit pattern includes a pair of electrode holes;

[0022] 902) Electroplating is performed in the electrode hole area of ​​the release film to form a pair of metal electrodes at each unit pattern to obtain a bottom packaging structure.

[0023] The above packaging method comprises the following steps:

[0024] 1001) In step 902, when performing metal electrode electroplating on the electrode hole area of ​​the release film, the first solderable metal layer, the electrode base metal layer, and the second solderable metal layer are electroplated in sequence from bottom to top;

[0025] 1002) After step 705, the carrier board and the release film are peeled off to form a package containing a plurality of LED lamp beads arranged in a matrix; the package is cut into LED lamp beads.

[0026] The above-mentioned packaging method and the manufacturing process of the bottom packaging structure include the following steps:

[0027] 1101) Covering the upper surface of the flat carrier with a release film, and forming a pattern on the release film, wherein the pattern includes a plurality of bottom electrode holes;

[0028] 1102) electroplating the electrode hole area of ​​the release film to form a plurality of bottom electrodes;

[0029] 1103) Plastic-sealing a third encapsulation layer above the bottom electrode and the release film, and opening a plurality of vertical holes in the third encapsulation layer, wherein the bottom surfaces of the vertical holes in the third encapsulation layer serve as the top surface of the bottom electrode;

[0030] 1104) The upper surface of the third encapsulation adhesive layer and the vertical holes are metallized, and excess metal surface is etched away to form an intermediate circuit layer; the intermediate circuit layer includes multiple pad groups, and the multiple pad groups are arranged in a matrix manner. Each pad group includes three pairs of electrodes for soldering RGB-LED chips, and each pair of electrodes includes the first metal electrode and the second metal electrode;

[0031] 1105) covering the upper surface of the middle circuit layer with a second solder resist ink layer, wherein the second solder resist ink layer includes a plurality of windows corresponding to the pad groups of the middle circuit layer;

[0032] The LED chip includes multiple RGB-LED chip groups corresponding to the pad groups, and the RGB-LED chip group includes an R chip, a G chip, and a B chip; in step 702, the R chip, the G chip, and the B chip of the RGB-LED chip group are respectively fixed to the three first metal electrodes of a pad group.

[0033] The above packaging method comprises the following steps:

[0034] 1401) In step 1102, when the electrode hole area of ​​the release film is electroplated with a metal electrode, the solderable metal layer and the base metal layer are electroplated in sequence from bottom to top;

[0035] 1402) After step 705, the carrier board and the release film are peeled off to form a packaging structure of the RGB-LED display module.

[0036] The packaging method described above includes the following steps in step 703:

[0037] 1301) Covering the bottom packaging structure and the vertical LED chip with a light-blocking resin layer;

[0038] 1302) opening a light-transmitting window on the top of the light-blocking resin layer, wherein the light-transmitting window is located directly above the LED chip;

[0039] 1303) Fill the light-transmitting window with light-transmitting resin or cover the light-transmitting resin layer above the light-blocking resin layer and above the LED chip with a light-transmitting resin layer.

[0040] The bonding structure of the present invention has low resistance and good reliability. [Brief Description of the Drawings]

[0041] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0042] Figure 1 Schematic diagram of process step 1-1 of Example 1 of the present invention.

[0043] Figure 2 Schematic diagram of process steps 1-2 of Example 1 of the present invention.

[0044] Figure 3 Schematic diagram of process step 2 of Example 1 of the present invention.

[0045] Figure 4 Schematic diagram of process step 3 of Example 1 of the present invention.

[0046] Figure 5 Schematic diagram of process step 4 of Example 1 of the present invention.

[0047] Figure 6 Schematic diagram of process step 5 of Example 1 of the present invention.

[0048] Figure 7 Schematic diagram of process step 6-1 of Example 1 of the present invention.

[0049] Figure 8 Schematic diagram of process step 6-2 of Example 1 of the present invention.

[0050] Figure 9 Schematic diagram of process step 7 of Example 1 of the present invention.

[0051] Figure 10 It is a schematic structural diagram of two separate LED lamp beads in embodiment 1 of the present invention.

[0052] Figure 11 Schematic diagram of process step 8 of Example 2 of the present invention.

[0053] Figure 12 Schematic diagram of process step 9 of Example 2 of the present invention.

[0054] Figure 13 This is a schematic structural diagram of two separate LED lamp beads in Example 2 of the present invention.

[0055] Figure 14 Schematic diagram of process step 8 of Example 3 of the present invention.

[0056] Figure 15 Schematic diagram of process step 9 of Example 3 of the present invention.

[0057] Figure 16 This is a schematic structural diagram of two separate LED lamp beads in Example 3 of the present invention.

[0058] Figure 17 This is a bottom view of the four-in-one RGB-LED display module according to embodiment 4 of the present invention.

[0059] Figure 18 This is a schematic structural diagram of the middle circuit layer of the four-in-one RGB-LED display module according to embodiment 4 of the present invention.

[0060] Figure 19 Schematic diagram of process step 1-1 of Example 4 of the present invention.

[0061] Figure 20 Schematic diagram of process steps 1-2 of Example 4 of the present invention.

[0062] Figure 21 Schematic diagram of process step 2 of Example 4 of the present invention.

[0063] Figure 22 Schematic diagram of process step 3 of Example 4 of the present invention.

[0064] Figure 23 Schematic diagram of process step 4 of Example 4 of the present invention.

[0065] Figure 24 Schematic diagram of process step 5 of Example 4 of the present invention.

[0066] Figure 25 Schematic diagram of process step 6 of Example 4 of the present invention.

[0067] Figure 26 Schematic diagram of process step 7 of Example 4 of the present invention.

[0068] Figure 27 Schematic diagram of process step 8 of Example 4 of the present invention.

[0069] Figure 28 Schematic diagram of process step 9 of Example 4 of the present invention.

[0070] Figure 29 It is a schematic diagram of process step 10-1 of Example 4 of the present invention.

[0071] Figure 30 It is a schematic diagram of process step 10-2 of Example 4 of the present invention.

[0072] Figure 31 Schematic diagram of the structure of the four-in-one RGB-LED display module according to embodiment 4 of the present invention.

[0073] Figure 32 Schematic diagram of process step 11 of Example 5 of the present invention.

[0074] Figure 33 This is a structural diagram of a four-in-one RGB-LED display module according to embodiment 5 of the present invention.

[0075] Figure 34 Schematic diagram of process step 11 of Example 6 of the present invention.

[0076] Figure 35 This is a structural diagram of the four-in-one RGB-LED display module according to Example 6 of the present invention.

[0077] Figure 36 This is a schematic diagram of the structure of the LED lamp bead in Example 7 of the present invention.

[0078] Figure 37 It is a schematic diagram of process step 401 of Example 7 of the present invention.

[0079] Figure 38 Schematic diagram of process step 402 of embodiment 7 of the present invention.

[0080] Figure 39 It is a schematic diagram of process step 403 of Example 7 of the present invention. [Specific implementation method]

[0081] The packaging structure of the LED lamp bead 100 in embodiment 1 of the present invention is as follows Figure 10 As shown, Figure 10 Two LED lamp beads 100 are shown cut apart. The LED lamp beads 100 include an LED chip 6, a transparent first encapsulation layer 7, a pair of electrodes, and a bonding structure 8. The electrode pair includes two metal electrodes 5, which are arranged at the bottom of the first encapsulation layer 7. The bottom and top surfaces of the metal electrodes 5 include solderable metal layers 5-1 and 5-2, respectively. The bottom of the metal electrodes 5 protrudes from the bottom surface of the first encapsulation layer 7.

[0082] The LED chip 6 is a vertical chip, which is arranged in the first packaging adhesive layer 7 and located above the first metal electrode 5. The lower electrode of the LED chip 6 is welded to the top of the first metal electrode 5A or bonded with silver glue.

[0083] The bonding structure 8 is a gate-shaped electroplated structure, consisting of a metal lintel 8-1 and two vertically arranged metalized vias. Metal lintel 8-1 is arranged on the top surface of the first encapsulation adhesive layer 7, with its ends connected to the tops of the two metalized vias 8-2 and 8-3, respectively. The first metalized via 8-2 passes through the first encapsulation adhesive layer 7, with its lower end connected to the top surface of the top electrode of the LED chip 6. The second metalized via 8-3 passes through the first encapsulation adhesive layer 7, with its lower end connected to the top surface of the second metal electrode 5B.

[0084] The packaging process of the LED lamp bead 100 in embodiment 1 of the present invention includes the following steps:

[0085] 1) If Figure 1 and Figure 2 As shown, a release film 2 is coated on the upper surface of a flat stainless steel carrier plate 1, and a plurality of unit patterns are made on the release film 2. The plurality of unit patterns are arranged in a matrix manner. Each unit pattern includes a pair of electrode holes 2-1. The unit patterns can be processed by laser.

[0086] 2) If Figure 3 As shown, electroplating is performed in the electrode hole 2-1 area of ​​the release film 2, and a pair of metal electrodes 5 are formed at each unit pattern. When the metal electrode 5 is electroplated in the electrode hole 2-1 area of ​​the release film 2, the first solderable metal layer 5-1, the electrode base metal layer 5-3 and the second solderable metal layer 5-2 are electroplated in sequence from bottom to top to obtain a bottom packaging structure.

[0087] 3) If Figure 4 As shown, an LED chip 6 (vertical chip) is fixed above each first metal electrode 5A, and the lower electrode of the LED chip 6 is welded to the top surface of the first metal electrode 5A or conductively bonded with silver glue.

[0088] 4) If Figure 5 As shown, a transparent first packaging glue layer 7 is plastic-sealed above the bottom packaging structure and above the LED chip 6 .

[0089] 5) If Figure 6 As shown, corresponding to each electrode pair, two vertical holes 7-1 and 7-2 are opened on the first packaging glue layer 7. The bottom surface of the first vertical hole 7-1 is the top surface of the upper electrode of the LED chip 6, and the bottom surface of the second vertical hole 7-2 is the top surface of the second metal electrode 5B.

[0090] 6) If Figure 7 and Figure 8As shown, the upper surface and vertical holes of the first packaging glue layer 7 are metallized, and then the excess metal surface is etched away. On the upper surface of the first packaging glue layer 7, corresponding to each electrode pair, a metal beam 8-1 and two metallized vias 8-2 and 8-3 are formed.

[0091] 7) If Figure 9 As shown, the carrier board 1 and the release film 2 are peeled off to form a package containing a plurality of LED lamp beads arranged in a matrix.

[0092] 8) If Figure 10 As shown, the package body is cut into a plurality of LED lamp beads 100 .

[0093] The packaging structure of the LED lamp bead 100 in embodiment 2 of the present invention is as follows Figure 13 As shown, the packaging structure of the LED lamp bead 100 in Example 1 is different in that the LED lamp bead 100 in Example 1 includes a transparent second packaging adhesive layer 9, which covers the first packaging adhesive layer 7 and the metal lintel 8-1.

[0094] The packaging process of the LED lamp beads in Example 2 of the present invention includes the following steps based on the packaging step 6 of Example 1:

[0095] 7) If Figure 11 As shown, a second packaging glue layer 9 is plastic-sealed above the first packaging glue layer 7 and the metal lintel 8 - 1 .

[0096] 8) If Figure 12 As shown, the carrier board 1 and the release film 2 are peeled off to form a package containing a plurality of LED lamp beads arranged in a matrix.

[0097] 9) If Figure 13 As shown, the package body is cut into a plurality of LED lamp beads 100 .

[0098] The packaging structure of the LED lamp bead 100 in embodiment 3 of the present invention is as follows Figure 16 As shown, the packaging structure of the LED lamp bead 100 in Example 1 is different in that the LED lamp bead 100 in Example 1 includes a first solder resist ink layer 11, and the first solder resist ink layer 11 has a light-transmitting window 11-1 corresponding to the LED chip 6, and the light-transmitting window 11-1 is located directly above the LED chip 6.

[0099] The packaging process of the LED lamp beads in Example 3 of the present invention includes the following steps based on the packaging step 6 of Example 1:

[0100] 7) If Figure 14 As shown, a first solder resist ink layer 11 is covered above the first packaging glue layer 7 and the metal lintel 8 - 1 , and a light-transmitting window 11 - 1 is opened on the first solder resist ink layer 11 . The light-transmitting window 11 - 1 is located directly above the LED chip 6 .

[0101] 8) If Figure 15 As shown, the carrier board 1 and the release film 2 are peeled off to form a package containing a plurality of LED lamp beads arranged in a matrix.

[0102] 9) If Figure 16 As shown, the package body is cut into a plurality of LED lamp beads 100 .

[0103] The packaging structure of the four-in-one RGB-LED display module 200 in embodiment 4 of the present invention is as follows: Figure 17 、 Figure 18 and Figure 31 The packaging structure of the four-in-one RGB-LED display module 200 is different from that of the LED lamp bead 100 in Example 1 in that the LED chip 6 of the four-in-one LED RGB-LED display module 200 includes four RGB-LED chip groups, each of which includes an R chip, a G chip, and a B chip, all of which are vertical LED chips.

[0104] In addition, the four-in-one LED RGB-LED display module 200 also includes an intermediate circuit layer 12, a second solder resist ink layer 13, a third encapsulation layer (insulating resin layer) 14 and 8 bottom electrodes 15. The metal electrode 5 is located in the intermediate circuit layer 12, and the third encapsulation layer 14 is arranged below the intermediate circuit layer 12 and includes a plurality of metallized vias. The bottom electrode 15 is arranged below the third encapsulation layer 14, and the intermediate circuit layer 12 is connected to the bottom electrode 15 through the metallized vias 12-2 of the third encapsulation layer 14. The second solder resist ink layer 13 is arranged between the intermediate circuit layer 12 and the first encapsulation layer 7. The second solder resist ink layer 13 has four windows 13-1 corresponding to the four pad groups 12-1 of the intermediate circuit layer. The three metal electrodes 5A and the three metal electrodes 5B in the pad group 12-1 are exposed in the windows 13-1 of the second solder resist ink layer 13.

[0105] The middle circuit layer 12 includes multiple pad groups 12-1 corresponding to the RGB-LED chip groups. These pad groups 12-1 are arranged in a matrix. Each pad group 12-1 includes three pairs of electrodes for soldering the RGB-LED chips. Each electrode pair includes a first metal electrode 5A and a second metal electrode 5B. The three RGB LED chips 6 in each RGB-LED chip group are respectively fixed to the three first metal electrodes 5A of the same pad group 12-1.

[0106] The fixing method of the RGB LED chip 6 of the four-in-one RGB-LED display module in the fourth embodiment of the present invention, the structures of the first packaging adhesive layer 7 and the bonding structure 8 are the same as those in the first embodiment.

[0107] The packaging process of the four-in-one RGB-LED display module 200 according to the fourth embodiment of the present invention includes the following steps:

[0108] 1) If Figure 19 and Figure 22 As shown, a release film 2 is covered on the upper surface of a flat stainless steel carrier plate 1 , and a pattern is made on the release film 2 . The pattern includes 8 bottom electrode holes 2 - 2 , and the pattern can be processed by laser.

[0109] 2) If Figure 21 As shown, the eight electrode holes 2-2 areas of the release film 2 are electroplated to form eight bottom electrodes 15. When the bottom electrodes 15 are electroplated in the electrode holes 2-2 of the release film 2, the first solderable metal layer 15-1 and the electrode base metal layer 15-2 are electroplated in sequence from bottom to top.

[0110] 3) If Figure 22 As shown, a third packaging adhesive layer (insulating resin layer) 14 is plastic-sealed above the bottom electrode 15 and the release film 2, and a plurality of vertical holes 14 - 1 are opened on the third packaging adhesive layer 14 by laser. The bottom surface of the vertical holes 14 - 1 in the third packaging adhesive layer 14 is the top surface of the bottom electrode 15 .

[0111] 4) If Figure 23 As shown, the upper surface of the third packaging adhesive layer 14 and the vertical hole 14 - 1 are metallized to form a surface metal layer and a metallized via 12 - 2 .

[0112] 5) If Figure 24 and Figure 18 As shown, the excess metal surface on the metal layer on the top surface of the third encapsulation layer is etched away to form an intermediate circuit layer 12. The intermediate circuit layer 12 includes four pad groups 12-1 arranged in a matrix. Each pad group 12-1 includes three pairs of electrodes for soldering RGB-LED chips. Each electrode pair includes a first metal electrode 5A and a second metal electrode 5B.

[0113] 6) If Figure 25 As shown, the upper surface of the middle circuit layer 12 is covered with a second solder resist ink layer 13, and the second solder resist ink layer 13 has four windows 13-1 corresponding to the four pad groups 12-1 of the middle circuit layer, thereby obtaining the bottom packaging structure of the four-in-one RGB-LED display module.

[0114] 7) The LED chip includes four RGB-LED chip groups corresponding to the pad group 12-1, and the RGB-LED chip group includes an R chip, a G chip, and a B chip. Figure 26As shown, the R, G, and B chips of the RGB-LED chip set are each fixed to three first metal electrodes 5A of a pad group 12-1. The LED chip 6 is a vertical chip, and the bottom electrode of the vertical chip is soldered or conductively bonded to the top surface of the first metal electrode 5A using silver glue.

[0115] 8) If Figure 27 As shown, a transparent first packaging glue layer 7 is plastic-sealed above the bottom packaging structure and above the LED chip 6 .

[0116] 9) If Figure 28 As shown, corresponding to each electrode pair, two vertical holes 7-1 and 7-2 are opened on the first packaging glue layer 7. The bottom surface of the first vertical hole 7-1 is the top surface of the upper electrode of the LED chip 6, and the bottom surface of the second vertical hole 7-2 is the top surface of the second metal electrode 5B.

[0117] 10) If Figure 29 and Figure 30 As shown, the upper surface and vertical holes of the first packaging glue layer 7 are metallized, and then the excess metal surface is etched away. On the upper surface of the first packaging glue layer 7, corresponding to each electrode pair, a metal beam 8-1 and two metallized vias 8-2 and 8-3 are formed.

[0118] 11) If Figure 31 As shown, the carrier board 1 and the release film 2 are peeled off to obtain the four-in-one RGB-LED display module 200 according to the fourth embodiment of the present invention.

[0119] The structure of the four-in-one RGB-LED display module 200 in embodiment 5 of the present invention is as follows: Figure 33 As shown, different from the packaging structure of the four-in-one RGB-LED display module 200 in Example 4, the four-in-one RGB-LED display module 200 in Example 5 includes a transparent second packaging adhesive layer 9, which covers the first packaging adhesive layer 7 and the metal lintel 8-1.

[0120] The packaging process of the four-in-one RGB-LED display module 200 in Example 5 of the present invention is based on the packaging step 10 in Example 4, and includes the following steps:

[0121] 11) If Figure 32 As shown, a second packaging glue layer 9 is plastic-sealed above the first packaging glue layer 7 and the metal lintel 8 - 1 .

[0122] 12) If Figure 33 As shown, the carrier board 1 and the release film 2 are peeled off to obtain the four-in-one RGB-LED display module 200 according to embodiment 5 of the present invention.

[0123] The structure of the 4-in-1 RGB-LED display module 200 in embodiment 6 of the present invention is as follows: Figure 35As shown, unlike the packaging structure of the four-in-one RGB-LED display module 200 of Example 4, the four-in-one RGB-LED display module 200 of Example 6 includes a first solder resist ink layer 11, and the first solder resist ink layer 11 has a light-transmitting window 11-1 corresponding to the LED chip 6, and the light-transmitting window 11-1 is located directly above the LED chip 6.

[0124] The packaging process of the four-in-one RGB-LED display module 200 in Example 6 of the present invention is based on the packaging step 10 in Example 4, and includes the following steps:

[0125] 11) If Figure 34 As shown, a first solder resist ink layer 11 is covered above the first packaging glue layer 7 and the metal lintel 8 - 1 , and a light-transmitting window 11 - 1 is opened on the first solder resist ink layer 11 . The light-transmitting window 11 - 1 is located directly above the LED chip 6 .

[0126] 12) If Figure 35 As shown, the carrier board 1 and the release film 2 are peeled off to obtain the four-in-one RGB-LED display module 200 according to embodiment 6 of the present invention.

[0127] The packaging structure of the LED lamp bead 100 in embodiment 7 of the present invention is as follows Figure 36 As shown, as an improvement to the packaging structure of the LED lamp bead 100 of Example 1, based on the LED lamp bead 100 of Example 1, the first encapsulation adhesive layer 7 includes a light-blocking resin layer 7A and a light-transmitting resin layer 7B, and the LED chip is arranged in the light-blocking resin layer 7A. A light-transmitting window 7-3 is defined at the top of the light-blocking resin layer 7A, and the light-transmitting window 7-3 is located directly above the LED chip. The light-transmitting resin layer 7B fills the light-transmitting window 7-3 or covers the light-blocking resin layer 7A and the LED chip, including the light-transmitting window 7-3.

[0128] The first packaging adhesive layer 7 adopts a combined structure of a light-blocking resin layer 7A and a light-transmitting resin layer 7B, which can be used not only for the packaging structure of the LED lamp beads in Examples 1 to 3, but also for the packaging structure of the four-in-one RGB-LED display module in Examples 4 to 6. The LED chip is arranged in the light-blocking resin layer 7A, and only the light-transmitting window 7-3 on the top is used to emit light outward, which can effectively improve the contrast of the LED lamp beads and the RGB-LED display module.

[0129] The packaging process of the LED lamp beads in Example 7 of the present invention is a refinement of the process of plastic-sealing the first packaging glue layer in Step 4 of Example 1, and includes the following steps:

[0130] 401) Figure 37 As shown, a light-blocking resin layer 7A is covered above the bottom packaging structure and above the LED chip 6;

[0131] 402) Figure 38As shown, a light-transmitting window 7 - 3 is opened on the top of the light-blocking resin layer, and the light-transmitting window 7 - 3 is located directly above the LED chip 6 .

[0132] 403) Figure 39 As shown, the light-transmitting window 7-3 is filled with light-transmitting resin 7B or is located above the light-blocking resin layer and above the LED chip, including the light-transmitting window 7-3 covering the light-transmitting resin layer 7B.

[0133] If the combined structure of the light-blocking resin layer 7A and the light-transmitting resin layer 7B is to be used in the packaging structure of the four-in-one RGB-LED display module of Examples 4 to 6, step 8 of the packaging process of the four-in-one RGB-LED display module 200 of Example 4 of the present invention, the process of plastic-sealing the first packaging adhesive layer, can be refined to include the following steps:

[0134] 801) Covering the bottom packaging structure and the LED chip 6 with a light-blocking resin layer 7A;

[0135] 802) A light-transmitting window 7-3 is opened on the top of the light-blocking resin layer, and the light-transmitting window 7-3 is located directly above the LED chip 6.

[0136] 803) Fill the light-transmitting window 7-3 with light-transmitting resin 7B or fill it above the light-blocking resin layer and above the LED chip, including the light-transmitting window 7-3 covering the light-transmitting resin layer 7B.

Claims

1. An LED package structure comprising at least one LED chip, a first package adhesive layer, an electrode pair corresponding to the LED chip, and a bonding structure, wherein the electrode pair comprises two metal electrodes, characterized in that: It includes a middle circuit layer, a second solder resist ink layer, a third packaging glue layer and a plurality of bottom electrodes, wherein the metal electrode is located in the middle circuit layer; the LED chip is a vertical chip, and the LED chip is arranged in the first packaging glue layer, above the first metal electrode, and the bottom electrode of the LED chip is welded or conductively bonded to the top of the first metal electrode; the bonding structure is a gate-shaped electroplating molding structure, including a metal beam and two vertically arranged metallized vias, the metal beam is arranged on the top surface of the first packaging glue layer, and the two ends of the metal beam are respectively connected to the top of the two metallized vias; the first metallized via passes through the first packaging glue layer, and the lower end is connected to the top surface of the upper electrode of the LED chip; the second metallized via passes through the first packaging glue layer, and the lower end is connected to the top surface of the second metal electrode; the third packaging glue layer is arranged below the middle circuit layer, and includes a plurality of metallized vias; the bottom electrode is arranged below the third packaging glue layer, and the middle circuit layer is connected to the bottom electrode through the metallized vias of the third packaging glue layer; The second solder resist ink layer is arranged between the middle circuit layer and the first packaging adhesive layer. The second solder resist ink layer includes a plurality of windows. The windows of the second solder resist ink layer are located directly above the metal electrodes.

2. The LED packaging structure according to claim 1, wherein: The first encapsulation adhesive layer includes a light-blocking resin layer and a light-transmitting resin layer, and the LED chip is arranged in the light-blocking resin layer; the top of the light-blocking resin layer includes a light-transmitting window, which is located directly above the LED chip, and the light-transmitting resin layer is filled in the light-transmitting window or covers the light-blocking resin layer and the LED chip.

3. The LED packaging structure according to claim 1, wherein: The LED packaging structure is an LED lamp bead packaging structure, the metal electrode is arranged at the bottom of the first packaging adhesive layer, and the bottom surface of the metal electrode is exposed outside the first packaging adhesive layer.

4. The LED packaging structure according to claim 1, wherein: It includes a second packaging glue layer or a first solder resist ink layer, which covers the first packaging glue layer and the metal lintel; the first solder resist ink layer has a light-transmitting window corresponding to the LED chip, and the light-transmitting window is located directly above the LED chip.

5. The LED packaging structure according to claim 1, wherein: The LED packaging structure is the packaging structure of an RGB-LED display module. The LED chip includes multiple RGB-LED chip groups, and the RGB-LED chip group includes an R chip, a G chip, and a B chip. The intermediate circuit layer includes multiple solder pad groups corresponding to the RGB-LED chip group. The multiple solder pad groups are arranged in a matrix manner. Each solder pad group includes three pairs of electrode pairs for soldering the RGB-LED chips, and each pair of electrode pairs includes the first metal electrode and the second metal electrode.

6. A packaging method for the LED packaging structure according to claim 1, characterized in that: The following steps are involved: 601) Manufacturing a bottom packaging structure, wherein the top of the bottom packaging structure includes a plurality of electrode pairs; 602) Fixing a vertical LED chip above each first metal electrode, and welding or conductively bonding the lower electrode of the vertical LED chip to the top surface of the first metal electrode; 603) Plastic encapsulating a first encapsulation layer above the bottom encapsulation structure and above the LED vertical chip; 604) corresponding to each electrode pair, two vertical holes are opened in the first packaging adhesive layer, the bottom surface of the first vertical hole is the top surface of the upper electrode of the vertical LED chip, and the bottom surface of the second vertical hole is the top surface of the second metal electrode; 605) The upper surface of the first packaging adhesive layer and the vertical holes are metallized, and excess metal surface is etched away to form a metal lintel on the upper surface of the first packaging adhesive layer corresponding to each electrode pair.

7. The packaging method according to claim 6, wherein: The following steps are involved: After step 605, a second encapsulation layer is plastic-sealed on top of the first encapsulation layer and the metal lintel or covered with a first solder resist ink layer. The first solder resist ink layer has a light-transmitting window, and the light-transmitting window is located directly above the LED chip.

8. The packaging method according to claim 6, wherein: The production process of the bottom package structure includes the following steps: 801) Covering the upper surface of the flat carrier with a release film, forming a plurality of unit patterns on the release film, wherein the plurality of unit patterns are arranged in a matrix, and each unit pattern includes a pair of electrode holes; 802) Electroplating is performed in the electrode hole area of ​​the release film to form a pair of metal electrodes at each unit pattern to obtain a bottom packaging structure.

9. The packaging method according to claim 8, characterized in that: The following steps are involved: 901) In step 802, when performing metal electrode electroplating on the electrode hole area of ​​the release film, the first solderable metal layer, the electrode base metal layer, and the second solderable metal layer are electroplated in sequence from bottom to top; 902) After step 605, the carrier board and the release film are peeled off to form a package containing a plurality of LED lamp beads arranged in a matrix; the package is cut into LED lamp beads.

10. The packaging method according to claim 6, wherein: The production process of the bottom package structure includes the following steps: 1001) Covering the upper surface of the flat carrier with a release film, and forming a pattern on the release film, wherein the pattern includes a plurality of bottom electrode holes; 1002) Electroplating the electrode hole area of ​​the release film to form a plurality of bottom electrodes; 1003) Plastic-sealing a third packaging adhesive layer above the bottom electrode and the release film, and opening a plurality of vertical holes in the third packaging adhesive layer, wherein the bottom surfaces of the vertical holes in the third packaging adhesive layer serve as the top surface of the bottom electrode; 1004) The upper surface of the third encapsulation adhesive layer and the vertical holes are metallized, and excess metal surface is etched away to form an intermediate circuit layer; the intermediate circuit layer includes multiple pad groups, and the multiple pad groups are arranged in a matrix. Each pad group includes three pairs of electrodes for soldering RGB-LED chips, and each pair of electrodes includes the first metal electrode and the second metal electrode. 1005) Covering the upper surface of the middle circuit layer with a second solder resist ink layer, wherein the second solder resist ink layer includes a plurality of windows corresponding to the pad groups of the middle circuit layer; The LED chip includes multiple RGB-LED chip groups corresponding to the pad groups, and the RGB-LED chip group includes an R chip, a G chip, and a B chip; in step 602, the R chip, the G chip, and the B chip of the RGB-LED chip group are respectively fixed to the three first metal electrodes of a pad group.

11. The packaging method according to claim 10, characterized in that: The following steps are involved: 1101) In step 1002, when performing metal electrode electroplating on the electrode hole area of ​​the release film, the solderable metal layer and the base metal layer are electroplated in sequence from bottom to top; 1102) After step 605, the carrier board and the release film are peeled off to form a packaging structure of the RGB-LED display module.

12. The packaging method according to claim 6, wherein: Step 603 includes the following steps: 1201) Covering the bottom packaging structure and the vertical LED chip with a light-blocking resin layer; 1202) A light-transmitting window is formed on the top of the light-blocking resin layer, wherein the light-transmitting window is located directly above the LED chip; 1203) Filling the light-transmitting window with light-transmitting resin or covering the light-blocking resin layer and the LED chip with a light-transmitting resin layer.

Images