Micro-device Transfer Device and Method

Abstract

A micro-device transfer device and a micro-device transfer method are provided. The micro-device transfer device includes: a platform unit including a platform on which a target substrate is provided; at least one transfer head unit disposed above the platform; and a transfer head unit moving part configured to move the transfer head unit, wherein the transfer head unit includes: a carrier substrate fastening part configured to fasten a carrier substrate on which a plurality of micro-devices are provided; a mask unit disposed above the carrier substrate fastening part, the mask unit including a mask having an opening part and a blocking part; and a light emitting part disposed on the mask unit.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2019 - 0088306, filed on July 22, 2019, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical field

[0003] The present disclosure relates to a micro - device transfer apparatus and method. In particular, the present disclosure relates to a micro - device transfer apparatus and method capable of transferring a plurality of micro - devices from a carrier substrate to a target substrate. Background art

[0004] With the progress of the information age, the demand for display devices for displaying images has also increased in various forms. For example, such display devices are applied to various electronic devices such as smart phones, digital cameras, laptop computers, navigation devices, and smart TVs. Recently, with the increasing demand for large - sized display devices, the sizes of substrates and backlight units have also increased. Therefore, active research has been conducted on micro - device transfer apparatuses and methods having good transfer efficiency when transferring a plurality of micro - devices to a large substrate. Summary of the invention

[0005] Aspects of the present disclosure provide a micro - device transfer apparatus capable of selectively and / or rapidly transferring a plurality of micro - devices from a carrier substrate to a target substrate.

[0006] Aspects of the present disclosure also provide a micro - device transfer method capable of effectively transferring a plurality of micro - devices provided on a carrier substrate to a target substrate.

[0007] It should be noted that the objectives of the present disclosure are not limited to the above - mentioned objectives, and other objectives of the present disclosure will be clearly apparent to those skilled in the art from the following description.

[0008] According to an exemplary embodiment of the present disclosure, a micro - device transfer apparatus includes: a platform unit including a platform on which a target substrate is disposed; at least one transfer head unit disposed above the platform; and a transfer head unit moving part configured to move the transfer head unit, wherein the transfer head unit includes a carrier substrate fastening part configured to fasten a carrier substrate on which a plurality of micro - devices are disposed; a mask unit disposed above the carrier substrate fastening part, the mask unit including a mask, the mask including an opening part and a blocking part; and a light - emitting part disposed on the mask unit.

[0009] In an exemplary embodiment, an opening of a mask unit exposes some of a plurality of micro-devices disposed on a carrier substrate fastened to a carrier substrate fastening portion, and a blocking portion of the mask unit blocks the remaining micro-devices among the plurality of micro-devices other than the micro-devices exposed by the opening.

[0010] In an exemplary embodiment, the micro-device transfer device further includes a frame provided above the platform, and a transfer head unit is mounted on the frame.

[0011] In an exemplary embodiment, the micro-device transfer device further includes a transfer head unit moving module configured to move the transfer head unit along the frame as a first moving module mounted on the frame.

[0012] In an exemplary embodiment, the transfer head unit includes a first transfer head unit and a second transfer head unit, and the first transfer head unit and the second transfer head unit are spaced apart from each other on the frame.

[0013] In an exemplary embodiment, each of the plurality of transfer head units has a planar area smaller than the planar area of the platform.

[0014] According to an exemplary embodiment of the present disclosure, a micro-device transfer method includes: preparing a micro-device / carrier substrate laminate including a plurality of micro-devices attached to a carrier substrate; and a first separation step of placing a mask including an opening and a blocking portion at a first position on the micro-device / carrier substrate laminate and emitting a first active light to separate some of the micro-devices from the carrier substrate, wherein the first active light is emitted through the opening to the some of the micro-devices.

[0015] In an exemplary embodiment, the micro-device transfer method further includes: after the first separation step, a second separation step of placing the mask at a second position different from the first position and emitting a second active light to separate some other micro-devices from the carrier substrate, wherein the second active light is emitted through the opening to the some other micro-devices.

[0016] In an exemplary embodiment, the micro-device / carrier substrate laminate further includes an adhesive film disposed between the carrier substrate and the plurality of micro-devices, and the adhesive film has a reduced viscosity by the first active light.

[0017] In an exemplary embodiment, the transfer head unit is mounted on the frame.

[0018] In an exemplary embodiment, after the first separation step, the transfer head unit moves along the frame from a first area of the target substrate to a second area different from the first area, where the first separation step is performed on the first area of the target substrate.

[0019] According to an embodiment, by transferring a plurality of micro-devices onto a target substrate using a micro-device transfer apparatus including a plurality of transfer head units, the working time can be shortened. Further, by transferring a plurality of micro-devices onto a plurality of areas of the target substrate through the plurality of transfer head units, the micro-devices can be effectively transferred onto a large target substrate.

[0020] The present disclosure is not limited to the above advantageous effects, and various other effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other aspects and features of the present disclosure will become more apparent by referring to the following detailed description of the exemplary embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0022] Figure 1 is a perspective view of a micro-device transfer apparatus according to an embodiment;

[0023] Figure 2 is a top plan view of a micro-device transfer apparatus according to an embodiment;

[0024] Figure 3 is a front view of a micro-device transfer apparatus according to an embodiment;

[0025] Figure 4 is Figure 1 a schematic front view of a carrier substrate cassette of

[0026] Figure 5 is Figure 4 a bottom view of a carrier substrate cassette of

[0027] Figure 6 is a cross-sectional view of a transfer head unit according to an embodiment;

[0028] Figure 7 is a flowchart showing a micro-device transfer method according to an embodiment;

[0029] Figure 8 is showing Figure 7 an exemplary detailed process of step S20 and step S30 of

[0030] Figure 9 is a top plan view showing a micro-device transfer apparatus and a target substrate;

[0031] Figure 10 is showing at Figure 8Layout diagram of an example of the relative placement of multiple transfer head units and a target substrate in S310;

[0032] Figure 11 It shows in Figure 8 Cross-sectional view of an example of a transfer head unit and a laminate of a micro-device / carrier substrate in the step of S320;

[0033] Figure 12 It shows Figure 11 Layout diagram of the relative placement of a mask and a laminate of a micro-device / carrier substrate;

[0034] Figure 13 It shows in Figure 8 Layout diagram of an example of the relative placement of multiple transfer head units and a target substrate in the step of S380;

[0035] Figure 14 , Figure 15 , Figure 16 , Figure 17 , Figure 18 and Figure 19 Schematic diagram showing a micro-device transfer method;

[0036] Figure 20 Top plan view of a micro-device transfer device according to another embodiment;

[0037] Figure 21 It shows Figure 20 Layout diagram of the relative placement of multiple transfer head units and a target substrate;

[0038] Figure 22 Top plan view of a micro-device transfer device according to another embodiment;

[0039] Figure 23 It shows Figure 22 Layout diagram of the relative placement of multiple transfer head units and a target substrate; and

[0040] Figure 24 Cross-sectional view of a transfer head unit according to another embodiment. Detailed Description of the Invention

[0041] The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. However, the present disclosure may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0042] It should also be understood that when a layer is referred to as being "on" another layer or another substrate, it can be directly on the other layer or substrate, or there can be intermediate layers. Throughout the specification, the same reference numerals represent the same components.

[0043] At the end of the detailed description, those skilled in the art will understand that many changes and modifications can be made to the preferred embodiments without substantially departing from the principles of the present disclosure. Therefore, the disclosed preferred embodiments of the present disclosure are used only in a general and descriptive sense, and not for limiting purposes.

[0044] Hereinafter, exemplary embodiments will be described with reference to the accompanying drawings.

[0045] Figure 1 is a perspective view of a micro-device transfer device according to an embodiment. Figure 2 is a top plan view of a micro-device transfer device according to an embodiment. Figure 3 is a front view of a micro-device transfer device according to an embodiment.

[0046] In the drawings, a first direction D1, a second direction D2, and a third direction D3 are defined. The first direction D1 and the second direction D2 are horizontal, coplanar, and orthogonal to each other, and the third direction D3 is perpendicular to the first direction D1 and the second direction D2, respectively.

[0047] Refer to Figure 1 , Figure 2 and Figure 3 , a micro-device transfer device 1000 according to an embodiment may include a platform unit 100, supports 310 and 320, frame frames 410 and 420, and a plurality of transfer head units HD1, HD2, HD3, and HD4 spaced apart above the platform unit 100 in the (third direction D3). The micro-device transfer device 1000 may further include frame frame moving modules 331, 332, 341, and 342 and a transfer head unit moving part.

[0048] The platform unit 100 may include a base frame 110, a platform 120 disposed on the base frame 110, and a platform moving part 130.

[0049] The platform 120 provides a space for disposing a target substrate SUB. The target substrate SUB can be disposed above the platform 120 in the (third direction D3) for the micro-device transfer process. A substrate aligner (not shown here) may be further installed above the platform 120 to align the target substrate SUB.

[0050] The overall planar shape of the platform 120 may follow the planar shape of the target substrate SUB. For example, when the target substrate SUB is rectangular, the overall shape of the platform 120 may be rectangular, and when the target substrate SUB is circular, the overall shape of the platform 120 may be circular. In these figures, the platform 120 is shown as having a rectangular shape with a long side arranged in the second direction D2 and a short side arranged in the first direction D1.

[0051] The platform moving unit 130 is configured to supply the target substrate SUB to the micro-device transfer device 1000 or release the target substrate SUB having a plurality of micro-devices disposed thereon. The platform 120 can be fastened by the platform moving unit 130. The platform moving unit 130 can be mounted on the base frame 110, and the platform 120 can be moved by the platform moving unit 130. For example, the platform moving unit 130 can move the platform 120 in the second direction D2.

[0052] The supports 310 and 320 may include a first support 310 provided on the first long side of the platform unit 100 and a second support 320 provided on the second long side of the platform unit 100 opposite to the first long side. Thus, the first support 310 and the second support 320 can be spaced apart from each other in the first direction D1. The platform 120 can be disposed between the first support 310 and the second support 320. Thus, the first support 310 and the second support 320 can be externally disposed adjacent to the platform 120 in the first direction D1.

[0053] As Figure 1 depicted, the first support 310 may include a first horizontal support portion 311 extending in the second direction D2 and first vertical support portions 312 connected to both ends of the first horizontal support portion 311 and extending in the third direction D3 which is the vertical direction. One end of the first vertical support portion 312 may be placed on the base frame 110. The cross-sectional shape of the first support 310 is rectangular, but the cross-sectional shape is not particularly limited.

[0054] The second support 320 may include a second horizontal support portion 321 extending in the second direction D2 and second vertical support portions 322 connected to both ends of the second horizontal support portion 321 and extending in the third direction D3 which is the vertical direction. One end of the second vertical support portion 322 may be placed on the base frame 110. The cross-sectional shape of the second support 320 is rectangular, but the cross-sectional shape is not particularly limited.

[0055] The rack frames 410 and 420 to be described below are movably connected to the first horizontal support portion 311 of the first support member 310 and the second horizontal support portion 321 of the second support member 320, and the first support member 310 and the second support member 320 are used to support the rack frames 410 and 420.

[0056] The rack frames 410 and 420 are disposed above the platform 120. The rack frames 410 and 420 may be disposed between the first support member 310 and the second support member 320. As described above, the rack frames 410 and 420 may be movably connected to the first horizontal support portion 311 of the first support member 310 and the second horizontal support portion 321 of the second support member 320.

[0057] The rack frames 410 and 420 may include a first rack frame 410 and a second rack frame 420.

[0058] The first rack frame 410 is disposed between the first support member 310 and the second support member 320. The first rack frame 410 may be connected to the first horizontal support portion 311 of the first support member 310 and the second horizontal support portion 321 of the second support member 320. The second rack frame 420 is disposed between the first support member 310 and the second support member 320. The second rack frame 420 may be connected to the first horizontal support portion 311 of the first support member 310 and the second horizontal support portion 321 of the second support member 320. Accordingly, the distances of the first rack frame 410 and the second rack frame 420 from the base frame 110 in the third direction D3 may be equal to the distances of the first horizontal support portion 311 and the second horizontal support portion 321 from the base frame 110 in the third direction D3.

[0059] The first rack frame 410 may have a rectangular cross-sectional shape extending in the first direction D1. The second rack frame 420 may have a rectangular cross-sectional shape extending in the first direction D1. Accordingly, the extending directions of the first rack frame 410 and the second rack frame 420 may be the first direction D1, that is, the short side direction of the platform unit 100. In an exemplary embodiment, the first rack frame 410 and the second rack frame 420 may be positioned parallel to each other in the first direction D1 and spaced apart from each other in the second direction D2. The lengths of the first rack frame 410 and the second rack frame 420 extending in the first direction D1 may be equal to each other.

[0060] As Figure 2As depicted, the multiple transfer head units HD may include a first transfer head unit HD1, a second transfer head unit HD2, a third transfer head unit HD3, and a fourth transfer head unit HD4. The multiple transfer head units HD1, HD2, HD3, and HD4 are disposed above the platform 120. The multiple transfer head units HD1, HD2, HD3, and HD4 may be mounted on the frame racks 410 and 420. At least one of the transfer head units HD1, HD2, HD3, and HD4 may be mounted on the frame racks 410 and 420.

[0061] Each transfer head unit HD is configured to place a plurality of micro-devices 520 (see Figure 4 ) onto the target substrate SUB. Each of the transfer head units HD1, HD2, HD3, and HD4 may be spaced apart from the platform 120 by a predetermined distance corresponding to the height of the vertical support portions 312 and 322 of the supports 310 and 320.

[0062] Each of the transfer head units HD1, HD2, HD3, and HD4 may be arranged in multiple rows along the extending direction of the frame racks 410 and 420. Each of the transfer head units HD1, HD2, HD3, and HD4 may be arranged on the frame racks 410 and 420 to be spaced apart from each other. For example, the first transfer head unit HD1 and the second transfer head unit HD2 may be mounted on the first frame rack 410 to be spaced apart from each other. In addition, the third transfer head unit HD3 and the fourth transfer head unit HD4 may be mounted on the second frame rack 420 to be spaced apart from each other. However, each of the transfer head units HD1, HD2, HD3, and HD4 may have different arrangement directions and arrangement shapes according to the extending direction and / or the number of the frame racks 410 and 420. By arranging the multiple transfer head units HD1, HD2, HD3, and HD4 to be spaced apart from each other, collisions of the transfer head units HD1, HD2, HD3, and HD4 can be prevented when driving the micro-device transfer device 1000.

[0063] The planar shape of each of the transfer head units HD1, HD2, HD3, and HD4 may be square. The transfer head units HD1, HD2, HD3, and HD4 may have the same size. However, the transfer head units HD1, HD2, HD3, and HD4 may have different sizes according to the partitioning of the transfer area LA (see Figure 10 ) of the target substrate SUB. The planar area of each of the transfer head units HD1, HD2, HD3, and HD4 may be smaller than the planar area of the target substrate SUB to be described below.

[0064] The first frame frame 410 and the second frame frame 420 can be moved in the horizontal direction by the frame frame moving module. The horizontal direction along which the first frame frame 410 and the second frame frame 420 move can be the second direction D2, and the second direction D2 is the long side direction of the platform unit 100. As Figure 1 depicted, the frame frame moving module can include a first frame frame moving module 331, a second frame frame moving module 332, a third frame frame moving module 341, and a fourth frame frame moving module 342.

[0065] The first frame frame moving module 331 and the third frame frame moving module 341 can be disposed at both ends of the first frame frame 410. The first frame frame moving module 331 can be mounted on the first horizontal support portion 311 of the first support member 310, and the third frame frame moving module 341 can be mounted on the second horizontal support portion 321 of the second support member 320. The first frame frame moving module 331 and the third frame frame moving module 341 can be disposed at both ends of the first frame frame 410 to move the first frame frame 410 in the second direction D2.

[0066] The second frame frame moving module 332 and the fourth frame frame moving module 342 can be disposed at both ends of the second frame frame 420. The second frame frame moving module 332 can be mounted on the first horizontal support portion 311 of the first support member 310, and the fourth frame frame moving module 342 can be mounted on the second horizontal support portion 321 of the second support member 320. The second frame frame moving module 332 and the fourth frame frame moving module 342 can be disposed at both ends of the second frame frame 420 to move the second frame frame 420 in the second direction D2.

[0067] The frame frame moving modules 331, 332, 341, and 342 can allow the first frame frame 410 and the second frame frame 420 to move on the first horizontal support portion 311 and / or the second horizontal support portion 321 in the second direction D2. Therefore, by moving the first frame frame 410 and the second frame frame 420 in the second direction D2, a plurality of transfer head units HD1, HD2, HD3, and HD4 mounted on the first frame frame 410 and the second frame frame 420 can be moved in the second direction D2.

[0068] A plurality of transfer head units HD1, HD2, HD3, and HD4 can be moved in a first direction D1 by a transfer head unit moving module. The transfer head unit moving module can include a plurality of transfer head unit moving modules. The transfer head unit moving module can include the same number of transfer head unit moving modules as the number of transfer head units HD. In an exemplary embodiment, the transfer head unit moving module can include a first transfer head unit moving module 431, a second transfer head unit moving module 432, a third transfer head unit moving module 441, and a fourth transfer head unit moving module 442. The plurality of transfer head unit moving modules 431, 432, 441, and 442 can be mounted on a first frame 410 and a second frame 420.

[0069] Specifically, as Figure 1 depicted, the first transfer head unit moving module 431 and the second transfer head unit moving module 432 can be mounted on the first frame 410. The first transfer head unit moving module 431 can allow the first transfer head unit HD1 to move on the first frame 410 in the first direction D1. The second transfer head unit moving module 432 can allow the second transfer head unit HD2 to move on the first frame 410 in the first direction D1.

[0070] The third transfer head unit moving module 441 and the fourth transfer head unit moving module 442 can be mounted on the second frame 420. The third transfer head unit moving module 441 can allow the third transfer head unit HD3 to move on the second frame 420 in the first direction D1. The fourth transfer head unit moving module 442 can allow the fourth transfer head unit HD4 to move on the second frame 420 in the first direction D1.

[0071] The plurality of transfer head units HD1, HD2, HD3, and HD4 can be horizontally moved in a first direction D1 or in a second direction D2 by frame moving modules 331, 332, 341, and 342 and transfer head unit moving modules 431, 432, 441, and 442. Through the horizontal movement of the plurality of transfer head units HD1, HD2, HD3, and HD4, a plurality of micro-devices 520 (see Figure 4 ) having an area smaller than that of the target substrate SUB can be transferred to the entire area of the target substrate SUB to perform a micro-device transfer process.

[0072] As Figure 3As depicted, a vertical movement module can also be installed between each transfer head unit movement module 431, 432, 441, and 442 and the corresponding transfer head unit HD1, HD2, HD3, and HD4. The vertical movement module can include a first vertical movement part 451, a second vertical movement part 452, a third vertical movement part 461, and a fourth vertical movement part 462. The first vertical movement part 451 can be installed between the first transfer head unit HD1 and the first transfer head unit movement module 431. The second vertical movement part 452 can be installed between the second transfer head unit HD2 and the second transfer head unit movement module 432. The third vertical movement part 461 can be installed between the third transfer head unit HD3 and the third transfer head unit movement module 441. The fourth vertical movement part 462 can be installed between the fourth transfer head unit HD4 and the fourth transfer head unit movement module 442. The vertical movement parts 451, 452, 461, and 462 can adjust the distance between the platform 120 and each transfer head unit HD1, HD2, HD3, and HD4 by lifting the transfer head units HD1, HD2, HD3, and HD4 in the vertical direction relative to the transfer head unit movement modules 431, 432, 441, and 442. That is, when the target substrate SUB is set on the platform 120, the process of placing a plurality of micro-devices 520 on the target substrate SUB can be performed by allowing the transfer head units HD1, HD2, HD3, and HD4 to be set adjacent to the target substrate SUB in the third direction D3 through the vertical movement parts 451, 452, 461, and 462.

[0073] The micro-device transfer device 1000 may further include a carrier substrate cassette WM. This will be described in detail with reference to Figure 4 and Figure 5

[0074] Figure 4 is Figure 1 a schematic front view of the carrier substrate cassette. Figure 5 is Figure 4 a bottom view of the micro-device / carrier substrate laminate.

[0075] Reference Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 ​, the carrier substrate cassette WM may include a plurality of carrier substrate cassettes WM1, WM2, WM3, and WM4. The microdevice / carrier substrate laminate 500 may include a carrier substrate 510 and a plurality of microdevices 520 disposed on the carrier substrate 510. The carrier substrate cassette WM may be used to store the microdevice / carrier substrate laminate 500 including a plurality of microdevices 520 to be transferred to the target substrate SUB, and supply the microdevice / carrier substrate laminate 500 to the transfer head units HD1, HD2, HD3, and HD4 through a carrier substrate supply unit (not shown).

[0076] Each carrier substrate cassette WM may be externally disposed adjacent to at least one side of the platform unit 100. In an exemplary embodiment, the carrier substrate cassette WM may be externally disposed adjacent to two long sides of the platform unit 100. The number of carrier substrate cassettes WM equal to the number of transfer head units HD may be provided. In the drawings, as an example, four transfer head units HD1, HD2, HD3, and HD4 and four carrier substrate cassettes WM1, WM2, WM3, and WM4 are shown. However, different numbers of carrier substrate cassettes WM may be provided at different positions.

[0077] Each carrier substrate cassette WM may store a plurality of microdevice / carrier substrate laminates 500. Referring to Figure 4 , the plurality of microdevice / carrier substrate laminates 500 may be stacked on each carrier substrate cassette WM in the third direction D3. Although not shown, the microdevice / carrier substrate laminate 500 disposed on the carrier substrate cassette WM may be supplied to the transfer head units HD1, HD2, HD3, and HD4 by means of a robot, a conveyor, or the like. When the microdevice / carrier substrate laminate 500 disposed on the uppermost part of the carrier substrate cassette WM is provided to each transfer head unit HD, the next microdevice / carrier substrate laminate 500 may be moved to the uppermost part by the driving unit of the carrier substrate cassette WM.

[0078] The carrier substrate 510 provided with a plurality of microdevices 520 may include a material transparent to ultraviolet (UV) light. However, the plurality of microdevices 520 may be attached to the light-transmitting substrate by an adhesive.

[0079] The carrier substrate 510 may be a UV film. The UV film may include a UV-transparent base film and a pressure-sensitive adhesive layer formed on one surface of the UV-transparent base film to fasten the UV-transparent base film, and the pressure-sensitive adhesive layer may be a film having a reduced adhesive strength when the film is exposed to ultraviolet light. Thus, when the carrier substrate 510 includes a UV film and is exposed to UV light, the adhesive strength of the area of the carrier substrate 510 exposed to the UV light may be weakened. Alternatively, a plurality of micro-devices 520 may be attached to the carrier substrate 510 capable of transmitting ultraviolet light through an adhesive, and the adhesive strength of the adhesive weakens when the carrier substrate 510 is exposed to ultraviolet light. The plurality of micro-devices 520 formed on the wafer may be formed on or attached to the carrier substrate 510 by lamination or coating to form a micro-device / carrier substrate laminate 500.

[0080] A plurality of micro-devices 520 may be disposed on one surface of the carrier substrate 510 (i.e., the surface facing the side in the third direction D3). Each micro-device 520 may include a light-emitting diode (LED), an LED chip, a micro-LED, etc.

[0081] Reference Figure 5 , a plurality of micro-devices 520 may be arranged on the carrier substrate 510 in a matrix form. The plurality of micro-devices 520 may be coplanar with each other and spaced apart from each other by a predetermined distance in the first direction D1 and the second direction D2. The predetermined distance between two adjacent micro-devices 520 will be described in detail below.

[0082] In the drawings, as an example, the planar shape of the carrier substrate 510 is square, and the arrangement direction of the plurality of micro-devices 520 is the same as the extending direction of each side of the carrier substrate 510. However, the planar shape of the carrier substrate 510 may be circular.

[0083] The configuration of the transfer head unit HD according to the embodiment will be described in detail below.

[0084] Figure 6 is a cross-sectional view of the first transfer head unit according to the embodiment. The structure of the first transfer head unit HD1 according to the embodiment will be described in detail below.

[0085] Reference Figure 6 , the first transfer head unit HD1 may include a light-emitting part 730, a mask unit 750, a carrier substrate fastening part 770, and a housing 710 for accommodating components.

[0086] The housing 710 may include a first horizontal surface 711, a side surface 713, and a second horizontal surface 712.

[0087] The side surfaces 713 may extend from both ends of the first horizontal surface 711 in the third direction D3, and the second horizontal surface 712 may extend from one end of the two side surfaces 713 in the horizontal direction (i.e., the first direction D1 or the second direction D2). In an exemplary embodiment, when viewed from the top, the second horizontal surface 712 may have a central region exposed in the third direction D3. By disposing the carrier substrate 510 in the central region of the second horizontal surface 712, a plurality of micro-devices 520 disposed on the carrier substrate 510 may be exposed in the third direction D3.

[0088] The light emitting unit 730 may be disposed at an upper portion of the first transfer head unit HD1. The light emitting unit 730 may be used to emit active light so that the active light may separate a plurality of micro-devices 520 disposed on the carrier substrate 510 from the carrier substrate 510 of the micro-device / carrier substrate laminate 500.

[0089] The active light emitted by the light emitting unit 730 may be high-level light. In an exemplary embodiment, the active light may be near-ultraviolet light, ultraviolet light, etc. In an exemplary embodiment, when the carrier substrate 510 includes a UV film, the active light emitted by the light emitting unit 730 may be UV light. The active light emitted by the light emitting unit 730 may propagate mostly downward.

[0090] The light emitting unit 730 may be disposed on the bottom side of the first horizontal surface 711 forming the upper portion of the first transfer head unit HD1. In the drawings, the light emitting unit 730 is shown as being disposed on the entire bottom side of the first horizontal surface 711. However, the light emitting unit 730 may be disposed only on a part of the bottom side of the first horizontal surface 711, or may be spaced apart from the bottom side of the first horizontal surface 711 by a predetermined distance.

[0091] The mask unit 750 may be disposed below the light emitting unit 730. The mask unit 750 and the light emitting unit 730 may be disposed completely apart from each other in the third direction D3. The mask unit 750 may include a mask 751 including a plurality of opening portions 751H and another region (i.e., a blocking portion) and a mask moving module 753 for moving the mask 751 in the horizontal direction.

[0092] The mask 751 may contain a light-blocking material, i.e., a material that does not transmit the UV light emitted by the light emitting unit 730. Therefore, when the active light emitted by the light emitting unit 730 propagates to the blocking portion of the mask 751, the blocking portion may cause the active light not to reach at least a partial region of the carrier substrate 510 of the micro-device / carrier substrate laminate 500. That is, by including a plurality of patterned opening portions 751H, the mask 751 is used to selectively separate only some of the plurality of micro-devices 520 disposed on the carrier substrate 510 onto the target substrate SUB.

[0093] A plurality of openings 751H are provided in the mask 751 to pass through the mask 751. The planar shape of each opening 751H is not limited. For example, the planar shape of the opening 751H may be circular or square. The shape and position of the plurality of openings 751H will be described in detail below with reference to Figure 11 the shape and position of the plurality of openings 751H will be described in detail.

[0094] The mask moving module 753 may be provided on the side surface of the mask 751. The mask moving module 753 may be provided on the side surface of the mask 751 to move the mask 751 in the horizontal direction. Thus, as will be described below, the mask moving module 753 can be used to adjust the position of the micro device 520 to be separated from the carrier substrate 510 relative to the opening 751H during each separation step.

[0095] The carrier substrate fastening portion 770 may be provided at the lower portion of the first transfer head unit HD1. The carrier substrate fastening portion 770 may be provided on the top side of the second horizontal surface 712. The carrier substrate fastening portion 770 can fasten a carrier substrate 510 on which a plurality of micro devices 520 received from the carrier substrate cassette WM are provided in the first transfer head unit HD1. By fastening the carrier substrate 510 to the first transfer head unit HD1, the carrier substrate fastening portion 770 can align the relative positions between the carrier substrate 510 and the mask 751 only by moving the mask 751.

[0096] In an exemplary embodiment, the transfer head units HD may have the same structure. Therefore, the structure of the first transfer head unit HD1 can be applied to the structures of the second transfer head unit HD2, the third transfer head unit HD3, and the fourth transfer head unit HD4. Therefore, the same description of the structures of the second transfer head unit HD2, the third transfer head unit HD3, and the fourth transfer head unit HD4 will be omitted.

[0097] A method of transferring the micro device 520 using the micro device transfer apparatus 1000 according to the above-described embodiment will be described below.

[0098] Figure 7 is a flowchart showing a micro device transfer method according to an embodiment. Figure 9 is a top plan view showing the micro device transfer apparatus and the target substrate.

[0099] Referring to Figure 7 , the micro device transfer method according to an embodiment may include a step (S10) of preparing a target substrate SUB on the platform 120 of the micro device transfer apparatus 1000, a step (S20) of supplying a micro device / carrier substrate laminate 500 including the micro device 520 to the transfer head unit HD, and a step (S30) of disposing a plurality of micro devices 520 on the target substrate SUB.

[0100] Reference Figure 1 、 Figure 2 、 Figure 3 、 Figure 7 and Figure 9 ,a target substrate SUB is prepared on a platform 120 of a micro-device transfer apparatus 1000 (S10).

[0101] As Figure 9 depicted in, the target substrate SUB may be disposed on the platform 120 such that a surface of the target substrate SUB opposite to a first surface is supported by the platform 120, wherein a plurality of micro-devices 520 are attached to the first surface of the target substrate SUB.

[0102] As described above, the micro-device transfer apparatus 1000 includes a platform 120, a plurality of transfer head units HD1, HD2, HD3, and HD4, and a plurality of carrier substrate cassettes WM1, WM2, WM3, and WM4. A plurality of micro-device / carrier substrate laminates 500 are disposed in the carrier substrate cassettes WM1, WM2, WM3, and WM4. For example, the first transfer head unit HD1 may be positioned adjacent to the first carrier substrate cassette WM1, the second transfer head unit HD2 may be positioned adjacent to the second carrier substrate cassette WM2, the third transfer head unit HD3 may be positioned adjacent to the third carrier substrate cassette WM3, and the fourth transfer head unit HD4 may be positioned adjacent to the fourth carrier substrate cassette WM4.

[0103] The target substrate SUB may be disposed at the center of the platform 120 of the micro-device transfer apparatus 1000. The target substrate SUB may have a rectangular planar shape including a long side and a short side. The short side of the target substrate SUB may be disposed parallel to the short side of the platform 120, and the long side of the target substrate SUB may be disposed parallel to the long side of the platform 120. In an exemplary embodiment, the target substrate SUB may be a large substrate having a rectangular shape including a long side having a length of about 2000 mm to 2500 mm and a short side having a length of about 1800 mm to 2200 mm.

[0104] In particular, the transfer head units HD may be positioned on the platform unit 100 adjacent to the carrier substrate cassettes WM1, WM2, WM3, and WM4. Thus, when viewed from the top, each transfer head unit HD may at least partially not overlap with the target substrate SUB in a third direction D3. Each transfer head unit HD may be disposed at least side by side.

[0105] Subsequently, one micro-device / carrier substrate laminate 500 including a plurality of micro-devices 520 is supplied to each transfer head unit HD (S20).

[0106] Specifically, a microdevice / carrier substrate laminate 500 provided in a carrier substrate cassette WM is supplied to a transfer head unit HD using a robot, a conveyor, etc. The first transfer head unit HD1 can receive a microdevice / carrier substrate laminate 500 from a first carrier substrate cassette WM1 adjacent to the first transfer head unit HD1, the second transfer head unit HD2 can receive a microdevice / carrier substrate laminate 500 from a second carrier substrate cassette WM2 adjacent to the second transfer head unit HD2, the third transfer head unit HD3 can receive a microdevice / carrier substrate laminate 500 from a third carrier substrate cassette WM3 adjacent to the third transfer head unit HD3, and the fourth transfer head unit HD4 can receive a microdevice / carrier substrate laminate 500 from a fourth carrier substrate cassette WM4 adjacent to the fourth transfer head unit HD4. The microdevice / carrier substrate laminate 500 provided on the uppermost layer among the multiple microdevice / carrier substrate laminates 500 provided in each carrier substrate cassette WM can be supplied to the corresponding transfer head unit HD.

[0107] Each transfer head unit HD that has received the microdevice / carrier substrate laminate 500 can fasten the carrier substrate 510 to the carrier substrate fastening portion 770. The microdevice / carrier substrate laminate 500 fastened to the carrier substrate fastening portion 770 can be arranged such that the microdevice 520 is directed downward and the upper surface of the carrier substrate 510 faces the lower surface of the blocking portion of the mask 751.

[0108] Subsequently, at least some of the multiple microdevices 520 are separated from the carrier substrate 510 and transferred from the microdevice / carrier substrate laminate 500 on each transfer head unit HD to the target substrate SUB (S30).

[0109] The combination Figure 8 and Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 、 Figure 14 、 Figure 15 、 Figure 16 、 Figure 17 、 Figure 18 and Figure 19 will describe the steps of S30 in detail.

[0110] Figure 8 is a flowchart showing in detail Figure 7 examples of S20 and S30. Figure 10 is a layout diagram showing an example of the relative placement of multiple transfer head units and a target substrate in Figure 8 S310. Figure 11 is a cross-sectional view showing an example of a transfer head unit and a microdevice / carrier substrate laminate in Figure 8 S320.Figure 12 is a layout diagram showing Figure 11 the relative placement of a mask and a micro-device / carrier substrate laminate. Figure 13 is a layout diagram showing an example of the relative placement of a plurality of transfer head units and a target substrate in S380 of Figure 8 . Figure 14 , Figure 15 , Figure 16 , Figure 17 , Figure 18 and Figure 19 are schematic diagrams showing a micro-device transfer method.

[0111] Referring to Figure 8 , Figure 9 and Figure 10 , each transfer head unit HD is moved to a first transfer target area (S310 in Figure 8 ) where the micro-device 520 is to be set.

[0112] Specifically, by driving the frame frame moving modules 331, 332, 341, and 342 and the transfer head unit moving modules 431, 432, 441, and 442, the micro-device transfer device 1000 can horizontally move the transfer head unit HD to a transfer target position such that the transfer head unit HD is set in the thickness direction with respect to the transfer target position to be overlapped.

[0113] Referring to Figure 10, the target substrate SUB may include a non-transfer region DA and a transfer region LA to which the micro-devices 520 are to be transferred. The transfer region LA of the target substrate SUB may be divided into a number of regions equal to the number of transfer head units HD. As described above, the micro-device transfer apparatus 1000 may include four transfer head units HD1, HD2, HD3, and HD4, and the target substrate SUB may include four transfer regions LA where the transfer head units HD1, HD2, HD3, and HD4 perform the transfer. The first transfer head unit HD1 may transfer a plurality of micro-devices 520 to the transfer region "a" LAa (which includes, for example, regions "a11" LAa11, "a12" LAa12, "a13" LAa13, "a21" LAa21, "a22" LAa22, "a23" LAa23, "a31" LAa31, "a32" LAa32, "a33" LAa33, "a41" LAa41, "a42" LAa42, and "a43" LAa43), the second transfer head unit HD2 may transfer a plurality of micro-devices 520 to the transfer region "b" LAb (which includes, for example, regions "b11" LAb11, "b12" LAb12, "b13" LAb13, "b21" LAb21, "b22" LAb22, "b23" LAb23, "b31" LAb31, "b32" LAb32, "b33" LAb33, "b41" LAb41, "b42" LAb42, and "b43" LAb43), the third transfer head unit HD3 may transfer a plurality of micro-devices 520 to the transfer region "c" LAc (which includes, for example, regions "c11" LAc11, "c12" LAc12, "c13" LAc13, "c21" LAc21, "c22" LAc22, "c23" LAc23, "c31" LAc31, "c32" LAc32, "c33" LAc33, "c41" LAc41, "c42" LAc42, and "c43" LAc43), and the fourth transfer head unit HD4 may transfer a plurality of micro-devices 520 to the transfer region "d" LAd (which includes, for example, regions "d11" LAd11, "d12" LAd12, "d13" LAd13, "d21" LAd21, "d22" LAd22, "d23" LAd23, "d31" LAd31, "d32" LAd32, "d33" LAd33, "d41" LAd41, "d42" LAd42, and "d43" LAd43). The transfer regions LA may have the same area, but the present disclosure is not limited thereto.

[0114] The transfer area LA for the transfer process of the transfer head units HD1, HD2, HD3, and HD4 of the target substrate SUB can be divided into a matrix array according to the areas of the transfer head units HD1, HD2, HD3, and HD4. Each of the transfer head units HD1, HD2, HD3, and HD4 can move to a first transfer target area where a first separation operation is to be performed. The first transfer target area can include a plurality of first transfer target areas where the first separation operation is to be performed by the transfer head units HD1, HD2, HD3, and HD4. The first transfer target area can include area "a11" LAa11, area "b11" LAb11, area "c11" LAc11, and area "d11" LAd11.

[0115] For example, the first transfer head unit HD1 can move to area "a11" LAa11 of the target substrate SUB, the second transfer head unit HD2 can move to area "b11" LAb11 of the target substrate SUB, the third transfer head unit HD3 can move to area "c11" LAc11 of the target substrate SUB, and the fourth transfer head unit HD4 can move to area "d11" LAd11 of the target substrate SUB.

[0116] Hereinafter, the driving of each transfer head unit HD to the first transfer target area of the target substrate SUB can be replaced by the driving of the first transfer head unit HD1. The driving of the second transfer head unit HD2, the third transfer head unit HD3, and the fourth transfer head unit HD4 can be the same as described below.

[0117] Next, the position of the microdevice 520 to be separated from the carrier substrate 510 to the first transfer target area of the target substrate SUB is aligned with the plurality of openings 751H of the mask 751 ( Figure 8 in S320).

[0118] Specifically, by changing the relative position of the carrier substrate 510 with respect to the carrier substrate fastening portion 770 to which it is fastened, the mask moving module 753 can perform alignment so that the opening 751H of the mask 751 overlaps with the first microdevice 520a provided in the first transfer target area in the third direction D3.

[0119] Refer to Figure 11 and Figure 12 , among the plurality of microdevices 520 provided on the carrier substrate 510, the first microdevices 520a provided in area "a11" LAa11 of the first transfer target area can be arranged in a matrix array at a predetermined distance. The distance between the first microdevices 520a provided in area "a11" LAa11 of the first transfer target area can be the same as the pitch between the microdevices 520 provided on the target substrate SUB.

[0120] The opening 751H can be provided in the mask 751 to expose the first micro-device 520a in the third direction D3. Accordingly, the width WH of the opening 751H can be greater than the width WL of the first micro-device 520a. However, when a plurality of first micro-devices 520a are to be provided on the target substrate SUB on a group basis, the opening 751H can be formed to have different widths so as to expose all of the plurality of first micro-devices 520a.

[0121] Next, each transfer head unit HD positioned above the target substrate SUB is lowered onto the target substrate SUB ( Figure 8 in S330).

[0122] Specifically, by driving the vertical movement module, each transfer head unit HD can be vertically moved to be adjacent to the first transfer target area of the target substrate SUB. The first transfer head unit HD1 can be lowered to be adjacent to the area "a11" LAa11 of the target substrate SUB by driving the first vertical movement unit 451, the second transfer head unit HD2 can be lowered to be adjacent to the area "b11" LAb11 of the target substrate SUB by driving the second vertical movement unit 452, the third transfer head unit HD3 can be lowered to be adjacent to the area "c11" LAc11 of the target substrate SUB by driving the third vertical movement unit 461, and the fourth transfer head unit HD4 can be lowered to be adjacent to the area "d11" LAd11 of the target substrate SUB by driving the fourth vertical movement unit 462.

[0123] Reference Figure 14 , the first transfer head unit HD1 located on the area "a11" LAa11 of the target substrate SUB can be spaced apart from the target substrate SUB by a predetermined distance in the third direction D3, but can be provided to be adjacent to the target substrate SUB. By providing the first transfer head unit HD1 to be adjacent to the target substrate SUB, it is possible to prevent the first transfer head unit HD1 from being transferred to a position different from the transfer target position when the micro-device 520 is separated from the carrier substrate 510 in a subsequent operation.

[0124] Next, the light emitting unit 730 emits active light ( Figure 8 in S340).

[0125] Specifically, reference Figure 15, active light can be emitted onto a mask 751 including an opening 751H and a blocking portion through a light emitting portion 730. Some of the first micro-devices 520a to be transferred onto an area "a11" LAa11 can be exposed to the active light emitted from the light emitting portion 730 through the opening 751H of the mask 751, while other micro-devices 520b and 520c can be blocked by the blocking portion of the mask 751. Accordingly, a carrier substrate 510 located above some of the first micro-devices 520a to be transferred onto the area "a11" LAa11 can be exposed to the active light through the opening 751H of the mask 751, thereby having reduced adhesiveness. Thus, some of the first micro-devices 520a disposed on the carrier substrate 510 can be separated from the carrier substrate 510 and attached to the area "a11" LAa11 of the target substrate SUB.

[0126] Although not shown, a flexible film or a welding portion is provided in an area of the target substrate SUB where the micro-device 520 is to be attached to fasten the micro-device 520 to the target substrate SUB.

[0127] Next, each transfer head unit HD is lifted to a predetermined distance from the target substrate SUB ( Figure 8 S350 in).

[0128] Specifically, by driving a vertical movement module, each transfer head unit HD can vertically move from a first transfer target area of the target substrate SUB. The first transfer head unit HD1 can be lifted from the area "a11" LAa11 of the target substrate SUB by driving a first vertical movement portion 451, the second transfer head unit HD2 can be lifted from the area "b11" LAb11 of the target substrate SUB by driving a second vertical movement portion 452, the third transfer head unit HD3 can be lifted from the area "c11" LAc11 of the target substrate SUB by driving a third vertical movement portion 461, and the fourth transfer head unit HD4 can be lifted from the area "d11" LAd11 of the target substrate SUB by driving a fourth vertical movement portion 462.

[0129] Refer to Figure 16 , the first transfer head unit HD1 located on the area "a11" LAa11 of the target substrate SUB can be vertically lifted from the target substrate SUB in a third direction D3. In the case where the first transfer head unit HD1 has been positioned in an initial step, the first transfer head unit HD1 can be separated from the base frame 110 by being lifted, but the present disclosure is not limited thereto.

[0130] Next, each transfer head unit HD is moved to a subsequent transfer target area.

[0131] Specifically, the micro-device transfer device 1000 can move the transfer head unit HD to a subsequent transfer target area by driving the frame frame moving modules 331, 332, 341, and 342 and the transfer head unit moving modules 431, 432, 441, and 442. The subsequent transfer target area can be the second transfer target area. Through the frame frame moving modules 331, 332, 341, and 342 and the transfer head unit moving modules 431, 432, 441, and 442, the micro-device transfer device 1000 can horizontally move the transfer head unit HD such that the transfer head unit HD is set to partially overlap in the thickness direction with respect to the second transfer target area.

[0132] For example, referring to Figure 10 , Figure 11 , Figure 12 and Figure 13 , the second transfer target area may include the area "a12" LAa12, the area "b12" LAb12, the area "c12" LAc12, and the area "d12" LAd12. For example, the first transfer head unit HD1 can be horizontally moved from the area "a11" LAa11 of the target substrate SUB to the area "a12" LAa12 in the first direction D1 by the first transfer head unit moving module 431, the second transfer head unit HD2 can be horizontally moved from the area "b11" LAb11 of the target substrate SUB to the area "b12" LAb12 in the first direction D1 by the second transfer head unit moving module 432, the third transfer head unit HD3 can be horizontally moved from the area "c11" LAc11 of the target substrate SUB to the area "c12" LAc12 in the first direction D1 by the third transfer head unit moving module 441, and the fourth transfer head unit HD4 can be horizontally moved from the area "d11" LAd11 of the target substrate SUB to the area "d12" LAd12 in the first direction D1 by the fourth transfer head unit moving module 442.

[0133] Referring to Figure 13 , Figure 14 , Figure 15 and Figure 16 , the first transfer head unit HD1 can be set in the area "a12" LAa12 of the second transfer target area. In order to place a plurality of micro-devices 520 at regular intervals on the target substrate SUB, when viewed from the top, the first transfer head unit HD1 can be set in an overlapping manner with respect to the area "a12" LAa12 in the third direction D3. The present disclosure is not limited, and the planar area of the transfer head unit HD can be larger than the area of the plurality of unit transfer areas.

[0134] In an exemplary embodiment, the second transfer target area and the first transfer target area are shown to be in the same row, but in another embodiment, they may be placed in the same column. In this case, by horizontally moving the first frame 410 and / or the second frame 420 in the second direction D2 by the frame moving modules 331, 332, 341, and 342, each transfer head unit HD can be moved from the first transfer target area to the second transfer target area. By horizontally moving each transfer head unit in the same direction, collisions of the transfer head units during the transfer process can be prevented.

[0135] Next, the position of the second micro-device 520b to be separated from the carrier substrate 510 to the second transfer target area of the target substrate SUB is aligned with a plurality of openings 751H of the mask 751 ( Figure 8 in S380).

[0136] Specifically, by changing the relative position of the carrier substrate 510 with respect to the carrier substrate fastening portion 770 to which it is fastened, the mask moving module 753 can perform alignment such that the opening 751H of the mask 751 overlaps with the second micro-device 520b provided in the second transfer target area in the third direction D3.

[0137] Reference Figure 18 , by driving the mask moving module 753, the mask 751 can be moved in the horizontal direction to perform alignment such that the second micro-device 520b and the opening 751H provided in the mask 751 are placed to overlap in the third direction D3. In the first separation step, the second micro-device 520b provided in the area "a12" LAa12 of the second transfer target area among the plurality of micro-devices 520b and 520c provided in the carrier substrate 510 can be arranged at a predetermined interval in a matrix form like the first micro-device 520a. The interval between the second micro-devices 520b provided in the area "a12" LAa12 of the second transfer target area may be the same as the separation distance between the first micro-devices 520a provided on the target substrate SUB.

[0138] By appropriately adjusting the ratio between the distance DP between two adjacent first micro-devices 520a provided on the target substrate SUB and the distance DL between two adjacent micro-devices 520 provided on the carrier substrate 510, all of the plurality of first micro-devices 520a provided on the carrier substrate 510 can be effectively transferred onto the target substrate SUB.

[0139] Reference Figure 19, the distance DP between two adjacent first micro-devices 520a provided on the target substrate SUB can be defined as the distance from one side surface of the first micro-device 520a provided in the same transfer target area of the target substrate SUB to one side surface of another first micro-device 520a adjacent to the one side surface of the first micro-device 520a. Similarly, the distance DL between two adjacent micro-devices 520 provided on the carrier substrate 510 can be defined as the distance from one side surface of the micro-device 520 provided in the carrier substrate 510 to one side surface of another micro-device 520 adjacent to the one side surface of the micro-device 520.

[0140] By adjusting the distance DL between two adjacent micro-devices 520 provided on the carrier substrate 510 to be 1 / (natural number) times larger than the distance DP between two adjacent first micro-devices 520a provided on the target substrate SUB, that is, by adjusting the distance DP between two adjacent first micro-devices 520a provided on the target substrate SUB to be a natural number times larger than the distance DL between two adjacent micro-devices 520 provided on the carrier substrate 510, the same mask 751 can be used to perform multiple separation steps on one micro-device / carrier substrate laminate 500.

[0141] Meanwhile, the distance between multiple openings 751H provided in the mask 751 can be proportional to the distance DP between the first micro-devices 520a provided on the target substrate SUB. In addition, in the second separation step, the moving distance DM of the mask 751 moved in the horizontal direction by the mask moving module 753 can be the same as the distance DL between two adjacent micro-devices 520 provided on the carrier substrate 510. In the second separation step, by adjusting the moving distance DM of the mask 751 moved in the horizontal direction by the mask moving module 753 to be the same as the distance DL between two adjacent micro-devices 520 provided on the carrier substrate 510, all of the multiple second micro-devices 520b provided on the carrier substrate 510 can be effectively transferred onto the target substrate SUB.

[0142] Refer again to Figure 8 , after each separation step after S350, the micro-device transfer method may further include comparing the number of micro-devices 520 held on the carrier substrate 510 with a predetermined number K of micro-devices 520 provided in each unit transfer area ( Figure 8 S360 in

[0143] Specifically, when the number of micro-devices 520 held on the carrier substrate 510 is less than the predetermined number K of micro-devices 520 provided in each unit transfer area ( Figure 8(the "No" of S360 in ), the existing carrier substrate 510 set on the transfer head unit HD can be returned, and each transfer head unit HD can receive a new microdevice / carrier substrate laminate 500 from the carrier substrate cassette WM.

[0144] In addition, when the number of microdevices 520 held on the carrier substrate 510 is greater than or equal to the predetermined number K of microdevices 520 set in each unit transfer area ( Figure 8 the "Yes" of S360 in ), the number of microdevices 520 transferred to the target substrate SUB can be compared with the predetermined number of microdevices 520 to be transferred to the target substrate SUB.

[0145] When the number of microdevices 520 transferred to the target substrate SUB is equal to the predetermined number of microdevices 520 to be transferred to the target substrate SUB ( Figure 8 the "Yes" of S370 in ), the target substrate SUB can be moved from the platform 120 to the outside by the platform moving unit 130. When the number of microdevices 520 transferred to the target substrate SUB is not equal to the predetermined number of microdevices 520 to be transferred to the target substrate SUB ( Figure 8 the "No" of S370 in ), each transfer head unit HD can perform a subsequent separation operation. That is, the microdevices 520 on the carrier substrate 510 are aligned with the openings 751H of the mask 751 ( Figure 8 S380 in ), and then each transfer head unit HD is moved to the subsequent transfer target position ( Figure 8 S390 in ).

[0146] Figure 20 is a top plan view of a microdevice transfer device according to another embodiment. Figure 21 is showing Figure 20 the relative placement layout of a plurality of transfer head units and the target substrate.

[0147] Figure 20 and Figure 21 The embodiment shown in Figure 9 differs from the embodiment shown in Figure 20 and Figure 21 in that it further includes a fifth transfer head unit HD5. The embodiment shown in Figure 20 and Figure 21 will be described, with emphasis on the differences from the embodiment shown in Figure 9 and Figure 10 shown in.

[0148] Refer to Figure 20 and Figure 21, the micro-device transfer device 1000_2 may further include a third support member 370, a fifth transfer head unit HD5, a fifth carrier substrate cassette WM5, and a fifth transfer head unit moving module 390.

[0149] Specifically, the third support member 370 may be disposed on the base frame 110 of the platform unit 100. The third support member 370 may be disposed between the first support member 310 and the second support member 320. The third support member 370 may be spaced apart from the first support member 310 and the second support member 320 by a predetermined distance. The third support member 370 may be disposed at the center of the platform unit 100.

[0150] The third support member 370 may include a third horizontal support portion extending in the horizontal direction and third vertical support portions connected to both ends of the third horizontal support portion and extending in a third direction D3 which is the vertical direction. The extending direction of the third horizontal support portion may be the same as the second direction D2, which is the long side direction of the platform unit 100. The third horizontal support portion may be spaced apart from the base frame 110 by a predetermined distance through the third vertical support portions. The distance from the base frame 110 to the third horizontal support portion may be less than the distance from the base frame 110 to the first horizontal support portion 311. Accordingly, the third horizontal support portion may be disposed below the first frame frame 410 and the second frame frame 420.

[0151] The fifth transfer head unit HD5 may be mounted on the third support member 370. The fifth transfer head unit HD5 may move in the horizontal direction through the fifth transfer head unit moving module 390. The fifth transfer head unit HD5 may move in the extending direction of the third support member 370, that is, in the second direction D2. Different from the moving paths of the first transfer head unit HD1, the second transfer head unit HD2, the third transfer head unit HD3, and the fourth transfer head unit HD4, the fifth transfer head unit HD5 may move only in the second direction D2 to transfer a plurality of micro-devices 520 to the transfer area “e” LAe (which includes, for example, area “e1” LAe1, area “e2” LAe2, area “e3” LAe3, area “e4” LAe4, area “e5” LAe5, area “e6” LAe6, area “e7” LAe7, and area “e8” LAe8) of the target substrate SUB.

[0152] In the present embodiment, the target substrate SUB can be divided into five regions equal in number to the transfer head units HD, namely, transfer region "a" LAa, transfer region "b" LAb, transfer region "c" LAc, transfer region "d" LAd, and transfer region "e" LAe, and each transfer head unit HD can transfer a plurality of microdevices 520 to the corresponding transfer region LA. The transfer regions LA can have different areas. The present disclosure has a technical significance regarding the uniform planar area ratio between the target substrate SUB and the carrier substrate 510 or the uniform region for setting the microdevices 520 on the target substrate SUB without collision occurring between the transfer head units HD.

[0153] Figure 22 is a top plan view of a microdevice transfer apparatus according to another embodiment. Figure 23 shows Figure 22 the relative placement layout of a plurality of transfer head units and a target substrate.

[0154] Figure 22 and Figure 23 The embodiment shown in Figure 9 differs from the embodiment shown in Figure 22 and Figure 23 in that, in the microdevice transfer apparatus 1000_3, one transfer head unit HD is mounted on each of the frame frames 410 and 420. The embodiments shown in Figure 9 and Figure 10 will be described, with emphasis on the differences from the embodiments shown in

[0155] Referring to Figure 22 and Figure 23 , one transfer head unit HD can be mounted on each of the frame frames 410 and 420. Accordingly, the transfer regions LA of the target substrate SUB can be vertically divided, and then each transfer head unit HD can transfer a plurality of microdevices 520.

[0156] Figure 24 is a cross-sectional view of a transfer head unit according to another embodiment.

[0157] Figure 24 The transfer head unit HD1_2 in Figure 6 differs from the first transfer head unit HD1 in Figure 24 in that the light emitting part 730 is replaced by a pressure part. The embodiment shown in Figure 6 will be described, with emphasis on the differences from the embodiment shown in

[0158] Referring to Figure 24, the carrier substrate 510 provided to the transfer head unit HD1_2 of the microdevice / carrier substrate laminate 500 may include a pressure-sensitive adhesive. Thus, when the vertical pressure station 795 disposed above the transfer head unit HD1_2 descends onto the first microdevice 520a to be transferred to apply pressure to the area of the carrier substrate 510 where the first microdevice 520a to be separated to the first transfer target area is disposed, the first microdevice 520a can be separated from the carrier substrate 510 to the first transfer target area.

Claims

1. Micro-device transfer device, comprising: A platform unit, including a platform provided with a target substrate; A frame, provided above the platform; A plurality of transfer head units, provided above the platform, mounted on the frame, and spaced apart from each other on the frame; And A transfer head unit moving part, configured to move the plurality of transfer head units, wherein, The plurality of transfer head units include: A carrier substrate fastening part, configured to fasten a carrier substrate provided with a plurality of micro-devices; A mask unit, provided above the carrier substrate fastening part, the mask unit includes a mask, and the mask includes an opening part and a blocking part; and A light emitting part, provided on the mask unit.

2. The micro-device transfer device according to claim 1, wherein, The opening part of the mask unit exposes some of the plurality of micro-devices provided on the carrier substrate fastened to the carrier substrate fastening part, and The blocking part of the mask unit blocks the remaining micro-devices among the plurality of micro-devices other than the some micro-devices exposed by the opening part.

3. The micro-device transfer device according to claim 1, further comprising a transfer head unit moving module, the transfer head unit moving module configured to move the plurality of transfer head units along the frame as a first moving module mounted on the frame.

4. The micro-device transfer device according to claim 1, wherein, The mask unit further includes a mask moving module, the mask moving module configured to change the relative position of the mask with respect to the carrier substrate fastened to the carrier substrate fastening part.

5. The micro-device transfer device according to claim 1, wherein, Each of the plurality of transfer head units has a planar area smaller than the planar area of the platform.

6. A micro-device transfer method, performed by the micro-device transfer device according to any one of claims 1-5, the micro-device transfer method comprising: Supplying a micro-device / carrier substrate laminate to the transfer head unit, the micro-device / carrier substrate laminate including a plurality of micro-devices attached to a carrier substrate; And A first separation step of placing a mask including an opening part and a blocking part at a first position on the micro-device / carrier substrate laminate and emitting a first active light to separate some of the plurality of micro-devices from the carrier substrate, wherein the first active light is emitted through the opening part to the some micro-devices among the plurality of micro-devices.

7. The micro-device transfer method according to claim 6 further includes: After the first separation step, a second separation step of placing the mask at a second position different from the first position and emitting a second active light to separate some other micro-devices among the plurality of micro-devices from the carrier substrate, wherein the second active light is emitted through the opening part to the some other micro-devices among the plurality of micro-devices.

8. The micro-device transfer method according to claim 6, wherein, The micro-device / carrier substrate laminate further includes an adhesive film provided between the carrier substrate and the plurality of micro-devices, and The adhesive film has a reduced viscosity through the first active light.

9. The micro-device transfer method according to claim 6, wherein, After the first separation step, the transfer head unit is moved from the first area of the target substrate along the frame of the rack to a second area different from the first area, wherein the first separation step is performed on the first area of the target substrate.

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