Method for transferring micro devices and micro device structure

Abstract

The present application relates to a kind of transfer method of micro device and micro device structure.The transfer method of micro device includes: providing the micro device structure to be transferred, the micro device structure to be transferred includes substrate, multiple micro devices on substrate by buffer structure, elastic sealing structure;Elastic sealing structure is connected to substrate, and each buffer structure corresponding to micro device and at least part of the sidewall of each micro device is surrounded;Providing back plate, and the micro device structure to be transferred is arranged opposite to back plate;Using laser to decompose buffer structure, the gas generated when buffer structure decomposes makes elastic sealing structure expand and stretch, and micro device is topped to the surface of back plate;Remove elastic sealing structure, to transfer micro device to back plate.Can make micro device quickly and mass transfer to back plate, and can avoid micro device to incline, roll over and fall in back plate in the process of transfer, improve transfer yield, and simple and convenient operation.

Images