Display device

Abstract

A display device is provided. The display device includes a lower substrate including a display area and a non-display area around the display area, the display area including a display element; a sealing member disposed in the non-display area and around the display area; a terminal portion disposed in the non-display area and including at least one internal terminal extending toward an edge of the lower substrate; a fan-out wire portion connected to the at least one internal terminal and including wires extending to the display area; an upper substrate disposed to face the lower substrate and bonded to the lower substrate by the sealing member; and an upper groove portion on a side surface of the upper substrate to correspond to the at least one internal terminal.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2019-0088522, filed on July 22, 2019, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments relate to a display device, and more specifically, to a display device capable of minimizing the area of ​​a non-display region outside the display area. Background Technology

[0004] The demand for display devices with a variety of desired features that offer commensurate advantages is ongoing. The field of display devices has been rapidly transformed into thin, lightweight, and large-area flat panel displays (FPDs), which have replaced bulky cathode ray tubes (CRTs). Flat panel displays can include liquid crystal displays (LCDs), plasma display panels (PDPs), organic light-emitting diode displays (OLEDs), and electrophoretic display devices (EPDs).

[0005] A display device may include a display area for displaying images and a non-display area for not displaying images. Summary of the Invention

[0006] One or more embodiments include a display device capable of reducing the area of ​​the non-display region.

[0007] According to one or more embodiments, a display device may include: a lower substrate including a display area and a non-display area surrounding the display area, the display area including display elements; a sealing member disposed in the non-display area and located around the display area; a terminal portion disposed in the non-display area and including at least one internal terminal extending toward an edge of the lower substrate; a fan-out line portion connected to the at least one internal terminal and including a line extending to the display area; an upper substrate configured to face the lower substrate and coupled to the lower substrate by the sealing member; and an upper recess portion located on a side surface of the upper substrate to correspond to the at least one internal terminal.

[0008] External terminals may be located in a first region defined by the edges of the upper recessed portion, the sealing member, and the lower base.

[0009] External terminals may be disposed around a portion of the at least one internal terminal.

[0010] The external terminal can be connected to the side surface and the top surface of the at least one internal terminal.

[0011] External terminals can extend along the thickness direction of the upper substrate on the side surface of the upper substrate, and can also be disposed on the side surface of the lower substrate.

[0012] The at least one internal terminal may include a first internal terminal and a second internal terminal, and the upper groove portion may include a first groove and a second groove spaced apart from the first groove, wherein the first internal terminal may correspond to the first groove and the second internal terminal may correspond to the second groove.

[0013] The first internal terminal can be disposed in the first groove, and the second internal terminal can be disposed in the second groove.

[0014] The external terminal may include a first external terminal and a second external terminal spaced apart from the first external terminal, wherein the first external terminal may be disposed in a first groove and connected to a first internal terminal, and the second external terminal may be disposed in a second groove and connected to a second internal terminal.

[0015] The display device may include a columnar support disposed between the terminal portion and the sealing member, and the external terminal may be disposed in a second region defined by the edge of the upper recessed portion, the columnar support and the lower substrate.

[0016] The display device may include a lower recessed portion located on the side surface of the lower substrate to correspond to the at least one internal terminal.

[0017] The at least one internal terminal may be disposed in the lower recess portion.

[0018] The external terminal may be located in a third region defined by the upper recessed portion, the lower recessed portion, and the sealing member, and may be connected to the at least one internal terminal.

[0019] The display device may include an additional terminal located between the upper substrate and the at least one internal terminal, and the additional terminal may be disposed in a first region defined by the upper recessed portion, the sealing member and the edge of the lower substrate.

[0020] External terminals can be located in the first area, and external terminals can be connected to additional terminals.

[0021] The side surfaces of the upper base and the lower base can be flush with each other.

[0022] According to one or more embodiments, a display device may include: a lower substrate including a display area and a non-display area surrounding the display area, the display area including display elements; a sealing member disposed in the non-display area and located around the display area; a terminal portion disposed in the non-display area and including at least one internal terminal extending toward an edge of the lower substrate; a fan-out line portion connected to the at least one internal terminal and including a line extending to the display area; an upper substrate configured to face the lower substrate and coupled to the lower substrate by the sealing member; an upper recess portion disposed at an edge where a side surface and a lower surface of the upper substrate meet; and an external terminal disposed in the upper recess portion, wherein the upper recess portion corresponds to the at least one internal terminal, and the external terminal may extend toward and connect to the at least one internal terminal.

[0023] The at least one internal terminal may be disposed in the upper recessed portion and may be connected to an external terminal in the upper recessed portion.

[0024] The external terminal can be connected to the upper surface of the at least one internal terminal.

[0025] External terminals can extend in the thickness direction of the upper substrate and can be disposed on the side surface of the lower substrate.

[0026] The display device may include a recessed portion disposed at the edge where the side surface and the upper surface of the lower substrate meet, wherein an external terminal may extend in the thickness direction of the upper substrate and be disposed in the recessed portion, and may be disposed around the at least one internal terminal.

[0027] The external terminal can be connected to the lower surface of the at least one internal terminal.

[0028] The display device may include additional terminals located between the upper substrate and the at least one internal terminal, and external terminals may be connected to the additional terminals.

[0029] The side surfaces of the upper base and the lower base can be flush with each other. Attached Figure Description

[0030] The above and other aspects, features, and advantages of the disclosed embodiments will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0031] Figure 1A A schematic cross-sectional view of a display device according to an embodiment is shown;

[0032] Figure 1B A plan view of a display device according to an embodiment is shown;

[0033] Figure 1CA plan view of a display device according to another embodiment is shown;

[0034] Figure 2 A schematic diagram of an equivalent circuit that may be included in a pixel in a display device according to an embodiment is shown;

[0035] Figure 3 It shows along Figure 1B A schematic cross-sectional view taken from line III-III';

[0036] Figure 4A A perspective view showing the relationship between the lower substrate, the upper recessed portion, and the upper substrate according to an embodiment is shown;

[0037] Figure 4B It shows along Figure 1B A schematic cross-sectional view taken by line B-B';

[0038] Figure 4C It shows along Figure 1B A schematic cross-sectional view taken by line C-C';

[0039] Figure 5A A schematic cross-sectional view of a display device according to another embodiment is shown;

[0040] Figure 5B A schematic cross-sectional view of a display device according to another embodiment is shown;

[0041] Figure 6 A schematic cross-sectional view of a display device according to another embodiment is shown;

[0042] Figures 7A to 10B A schematic cross-sectional view showing a method for manufacturing an embodiment is shown; and

[0043] Figure 11A and Figure 11B A view is shown for comparison with the embodiments. Detailed Implementation

[0044] The effects and features disclosed, as well as the methods for implementing them, will become apparent when referring to the embodiments described with reference to the accompanying drawings. However, the disclosure may be implemented in many different forms and should not be construed as limiting oneself to the embodiments set forth herein.

[0045] The disclosed embodiments will be described in detail below with reference to the accompanying drawings. The same reference numerals may be used to denote the same elements, and repeated descriptions thereof will be omitted.

[0046] It will be understood that although the terms “first,” “second,” etc., may be used here to describe various elements, these elements should not be limited by these terms. For example, without departing from the teachings herein, the first element discussed below may be named one of the second, third, and fourth elements.

[0047] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” may be used herein to describe the relationship between one element or feature as shown in the accompanying drawings and another (other) element or feature. It will be understood that spatial relative terms are intended to encompass different orientations of the device in use or operation besides those depicted in the drawings. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features would subsequently be positioned “above” said other elements or features. Thus, the term “below” can encompass both above and below orientations. The device may be otherwise positioned (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein shall be interpreted accordingly.

[0048] A singular expression may include a plural expression unless it has a distinctly different meaning in the context. As used herein, the term “and / or” may include any and all combinations of one or more of the associated listed items. When an expression such as “at least one of…” follows a list of elements, it modifies the entire list of elements, not individual elements within that list.

[0049] It will also be understood that the term “comprising” and / or variations thereof as used herein indicates the presence of the stated feature or element, but does not preclude the presence or addition of one or more other features or elements.

[0050] It will be understood that when a layer, region, or element is referred to as being "formed on" another layer, region, or element, that layer, region, or element may be formed directly or indirectly on said other layer, region, or element. For example, intermediate layers, regions, or elements may exist. Conversely, when an element is referred to as being "directly on" another element, intermediate elements may not exist. The terms "on top of" or "on" indicate positioning on or below an object portion and do not necessarily indicate positioning on the upper side of an object portion based on the direction of gravity.

[0051] For ease of explanation, the dimensions of the elements in the accompanying drawings may be exaggerated. In other words, since the dimensions and thicknesses of the components in the drawings are arbitrarily shown for ease of explanation, the following embodiments are not limited to these.

[0052] When specific embodiments can be implemented differently, the specific process sequence can be performed differently than the described sequence. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of the described sequence.

[0053] It will be understood that when a layer, region, or component is connected to another part, the layer, region, or component may be directly connected to said part, or there may be intermediate layers, regions, or components. For example, when a layer, region, or component is electrically connected to another part, the layer, region, or component may be directly electrically connected to said part, or it may be indirectly connected to said part through another layer, region, or component.

[0054] Given the measurements under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), the terms “approximately” or “about” as used herein include stated values ​​and indicate an acceptable range of deviation from a particular value as determined by one of ordinary skill in the art. For example, “approximately” may mean within one or more standard deviations, or within, for example, ±30%, ±20%, or ±5% of the stated value.

[0055] It will be understood that the terms “first,” “second,” etc., may be used here to describe various components, and these components should not be limited by these terms. These terms may be used only to distinguish one component from another.

[0056] As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “one,” and “the” are also intended to include the plural forms.

[0057] In the embodiments described below, it will be understood that when a component, region, or layer is referred to as being connected to another component, region, or layer, that component, region, or layer may be directly or indirectly connected to said other component, region, or layer. For example, it will be understood in this specification that when a component, region, or layer is referred to as being in contact with or electrically connected to another component, region, or layer, that component, region, or layer may be in direct or indirect contact with or electrically connected to said other component, region, or layer.

[0058] Furthermore, the phrase "in a plan view" refers to the view of an object portion from above, and the phrase "in a sectional view" refers to the view of a section taken by vertically cutting the element portion from the side. Additionally, the terms "overlapping" or "coinciding" indicate that the first object may be located above or below the second object, or to one side of the second object, or vice versa. Furthermore, the term "overlapping" can include layering, stacking, facing or confronting, extending above, covering or partially covering, or any other suitable term as will be understood and appreciated by those skilled in the art. The terms "facing" and "confronting" indicate that the first element may be directly or indirectly opposite the second element. Where a third element is placed between the first and second elements, although they still face each other, the first and second elements can be understood as indirectly opposite each other. When an element is described as "not overlapping" or "not coinciding" with another element, it can include elements spaced apart from each other, offset from each other, or separated from each other, or any other suitable term as will be understood and appreciated by those skilled in the art. When a layer, zone, base, or region is referred to as being "on" another layer, zone, base, or region, the layer, zone, base, or region may be directly on the other layer, zone, base, or region, or there may be an intermediate layer, zone, base, or region between them. Conversely, when a layer, zone, base, or region is referred to as being "directly on" another layer, zone, base, or region, there may be no intermediate layer, zone, base, or region between them. Furthermore, when a layer, zone, base, or region is referred to as being "below" another layer, zone, base, or region, the layer, zone, base, or region may be directly below the other layer, zone, base, or region, or there may be an intermediate layer, zone, base, or region between them. Conversely, when a layer, zone, base, or region is referred to as being "directly below" another layer, zone, base, or region, there may be no intermediate layer, zone, base, or region between them. Additionally, "on" or "above" can include positioning on or below an object and does not necessarily imply a direction based on gravity.

[0059] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having the meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an ideal or overly formal sense unless clearly defined in the description.

[0060] Figure 1A A schematic cross-sectional view of a display device according to an embodiment is shown. Figure 1B A plan view of a display device according to an embodiment is shown.

[0061] Reference Figure 1AThe display device 1 may include a display area DA on a lower substrate 100 and an upper substrate 400 sealing the display area DA. The display device 1 may include a sealing member 500 for joining the lower substrate 100 and the upper substrate 400.

[0062] Display device 1 can be a liquid crystal display, electrophoretic display, organic light-emitting display, inorganic light-emitting display, quantum dot light-emitting display, field emission display, surface conduction electron emission display, plasma display, cathode ray display, etc.

[0063] An organic light-emitting display can be configured as display device 1 according to the embodiment, but the display device according to the embodiment is not limited to this, and therefore various types of display devices can be used.

[0064] The upper substrate 400 can be formed as a transparent component to realize the image from the display area DA and prevent oxygen and moisture from penetrating into the display area DA. The upper substrate 400 can be a touch screen panel, wherein the touch screen panel can be formed to function as a touch panel.

[0065] A polarizing film, color filter, or protective window (not shown) may be further disposed on the upper substrate 400.

[0066] The edges of the lower base 100 and the upper base 400 can be joined by a sealing member 500 to seal the internal space 520 between the lower base 100 and the upper base 400. The internal space 520 can be an absorbent or a filler. In other words, the internal space 520 can be defined by an absorbent or a filler to include the absorbent or filler.

[0067] The sealing member 500 can be configured to surround the periphery of the display area DA or be located around the periphery of the display area DA. The sealing member 500, which can form a portion sealing the lower substrate 100 and the upper substrate 400, can prevent oxygen, moisture, etc. from flowing into the display area DA, and can improve the mechanical strength between the lower substrate 100 and the upper substrate 400 by combining each of the lower substrate 100 and the upper substrate 400 together.

[0068] In one embodiment, the sealing member 500 may be a sealant. In another embodiment, the sealing member 500 may include a material cured by a laser beam. For example, the sealing member 500 may be a glass frit. The sealing member 500 may include polyurethane resin, epoxy resin, acrylic resin, inorganic sealant, or silicone, wherein the polyurethane resin, epoxy resin, and acrylic resin may be organic sealants. Polyurethane resin may, for example, include polyurethane acrylate. Acrylic resin may, for example, include butyl acrylate or ethylhexyl acrylate. The sealing member 500 may include a material that can be thermosetting.

[0069] Reference Figure 1BThe display device 1 may include a display area DA for displaying an image and a non-display area NDA for not displaying an image. The display device 1 may provide an image using light emitted from a pixel P in the display area DA.

[0070] Pixel P can be electrically connected to external circuitry arranged in the non-display area NDA. The non-display area NDA may include a first scan drive circuit 110, a second scan drive circuit 120, a terminal portion PDA, a data drive circuit (not shown), a first power line 160, and a second power line 170.

[0071] The first scan driving circuit 110 supplies scan signals to each pixel P via scan lines SL. The second scan driving circuit 120 can be arranged parallel to the first scan driving circuit 110, with the display area DA located between the first scan driving circuit 110 and the second scan driving circuit 120. Some of the pixels P arranged in the display area DA can be electrically connected to the first scan driving circuit 110, and the remaining pixels P can be connected to the second scan driving circuit 120. In another embodiment, the second scan driving circuit 120 can be omitted.

[0072] The terminal portion of the PDA may be located on one side surface of the lower substrate 100. The terminal portion of the PDA may be located within the non-display area NDA and may extend to the edge of the lower substrate 100. The terminal portion of the PDA may be located outside or beyond the sealing member 500. For example, in reference... Figure 1B At this time, the terminal portion of the PDA can be configured to pass through the sealing member 500 to intersect with the sealing member 500.

[0073] The terminal portion of the PDA may include multiple pads (or solder pads), and the multiple pads may be spaced apart from each other.

[0074] The terminal section of the PDA can be connected to a printed circuit board (PCB). The pads in the terminal section of the PDA can be exposed and electrically connected to the PCB.

[0075] An adhesive layer may be located between the printed circuit board (PCB) and the display panel 10. The adhesive layer may be electrically connected to the PCB and the pads in the terminal portion of the PDA. The PCB can transmit signals or power from the controller (not shown) to the display panel 10. Control signals generated by the controller can be transmitted via the PCB to the first scan drive circuit 110 and the second scan drive circuit 120, respectively. The controller can provide a first power supply voltage ELVDD (see [reference needed]) to the first power line 160 and the second power line 170 via the first connection line 161 and the second connection line 171, respectively. Figure 2 ) and the second power supply voltage ELVSS (see Figure 2The first power supply voltage ELVDD can be provided to each pixel P through the drive voltage line PL connected to the first power supply line 160, and the second power supply voltage ELVSS can be provided to the counter electrode of each pixel P connected to the second power supply line 170.

[0076] The data driving circuit can be electrically connected to the data line DL. Data signals from the data driving circuit can be provided to each pixel P via the connection line 151 connected to the terminal portion PDA and the data line DL connected to the connection line 151. In one embodiment, the data driving circuit can be located on a printed circuit board (PCB). In another embodiment, the data driving circuit can be located on the lower substrate 100. For example, the data driving circuit can be located between the terminal portion PDA and the first power line 160.

[0077] The first power line 160 may include a first sub-line 162 and a second sub-line 163 extending parallel in the x-direction and with the display area DA located therebetween. The second power line 170 may partially surround the display area DA in a loop shape or be located around the display area DA, with one side of the second power line 170 open to avoid forming a closed loop.

[0078] Connecting line 151, first connecting line 161, and second connecting line 171 can be defined as a fan-out line portion WL including one of such connecting lines extending to the display area DA. The fan-out line portion WL can be connected to at least one pad in the terminal portion PDA.

[0079] Figure 1C A plan view of a display device according to another embodiment is shown.

[0080] Reference Figure 1C The display device may also include a cylindrical space 510.

[0081] The columnar space 510 can be configured to be spaced apart from the sealing member 500. The columnar space 510 can be located outside or beyond the sealing member 500. The columnar space 510 can be a support portion for stably connecting the lower base 100 and the upper base 400 to each other. The columnar space 510 can protect the terminal portion of the PDA that can be disposed below the columnar space 510.

[0082] The columnar space 510 may include organic insulating materials such as polyimide, polyamide, acrylic resin, benzocyclobutene (BCB), hexamethyldisiloxane (HMDSO), and phenolic resin, and may be formed by spin coating.

[0083] The terminal portion PDA may be located on one side surface of the lower substrate 100. The terminal portion PDA may be located outside or beyond the cylindrical space 510. For example, the pad in the terminal portion PDA may be arranged at the bottom of the display device 1 to pass through or intersect with the sealing member 500 and the cylindrical space 510 to expose the side surface of the pad in the terminal portion PDA.

[0084] Therefore, the pads in the terminal portion of the PDA can be arranged on the lower surface of the columnar space 510 and can be connected to the printed circuit board (PCB).

[0085] The following reference Figure 1B The discussion focuses on the possibility that the terminal portion of the PDA can be positioned at the bottom of the display device 1, either passing through or intersecting with the sealing member 500.

[0086] Figure 2 A schematic diagram of an equivalent circuit that may be included in a pixel in a display device according to an embodiment is shown.

[0087] Reference Figure 2 Each pixel P may include a pixel circuit PC connected to the scan line SL and the data line DL, and an organic light-emitting diode (OLED) connected to the pixel circuit PC.

[0088] The pixel circuit PC may include a driving thin-film transistor T1, a switching thin-film transistor T2, and a storage capacitor Cst. The switching thin-film transistor T2 may be connected to the scan line SL and the data line DL, and may supply the data signal Dm input through the data line DL to the driving thin-film transistor T1 according to the scan signal Sn.

[0089] The storage capacitor Cst can be connected to the switching thin-film transistor T2 and the drive voltage line PL, and can store the voltage corresponding to the difference between the voltage supplied from the switching thin-film transistor T2 and the first power supply voltage ELVDD (or drive voltage) supplied to the drive voltage line PL.

[0090] The driving thin-film transistor T1 can be connected to the driving voltage line PL and the storage capacitor Cst, and the driving current flowing from the driving voltage line PL to the organic light-emitting diode (OLED) can be controlled according to the voltage value stored in the storage capacitor Cst. The OLED can emit light with a certain brightness according to the driving current.

[0091] Although Figure 2The illustration shows a pixel circuit PC that may include two thin-film transistors and a storage capacitor Cst, but the disclosure is not limited to this. For example, the pixel circuit PC may include seven thin-film transistors and a storage capacitor, and may be modified in various ways that will be understood by those skilled in the art.

[0092] Figure 3 It shows along Figure 1B A schematic cross-sectional view taken from line III-III'.

[0093] For reference Figure 3 As shown, the display area DA of the display device according to the embodiment may include a stacked structure.

[0094] The lower substrate 100 may comprise glass or a polymeric resin. For example, the polymeric resin may comprise polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate (PAR), polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP). The lower substrate 100 comprising the polymeric resin may be flexible, rollable, or bendable. The lower substrate 100 may have a multilayer structure comprising a layer containing the aforementioned polymeric resin and an inorganic layer (not shown).

[0095] A buffer layer 111 may be located on the lower substrate 100 to reduce or block the penetration of foreign matter, moisture, or external air from the lower part of the lower substrate 100, and may include a flat surface disposed on the lower substrate 100. The buffer layer 111 may include inorganic materials (such as oxides or nitrides), organic materials, or organic-inorganic composite materials, and may have a single-layer or multi-layer structure comprising inorganic or organic materials. A barrier layer (not shown) may be further disposed between the lower substrate 100 and the buffer layer 111 to block the penetration of external air. The buffer layer 111 may include silicon oxide (SiO2) or silicon nitride (SiN). X ).

[0096] The thin-film transistor T can be located on the buffer layer 111. The thin-film transistor T may include a semiconductor layer A, a gate electrode G, a source electrode S, and a drain electrode D.

[0097] Figure 3 The thin-film transistor T shown may include a top-gate type. However, embodiments may not be limited to this and may employ various types such as a bottom-gate type.

[0098] Although one thin-film transistor T is shown, the display device may use two or more thin-film transistors T for a single pixel.

[0099] Semiconductor layer A may comprise amorphous silicon or polycrystalline silicon. In another embodiment, semiconductor layer A may comprise an oxide of at least one material selected from indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). Semiconductor layer A may comprise a channel region, a source region, and a drain region, wherein the carrier concentration in the source region and the drain region is higher than the carrier concentration in the channel region.

[0100] The gate electrode G may be located on the semiconductor layer A, and the first gate insulating layer 113 is located between the gate electrode G and the semiconductor layer A. The gate electrode G may include molybdenum (Mo), aluminum (Al), copper (Cu), or Ti, and may be formed as a single layer or multiple layers. For example, the gate electrode G may be a single layer of Mo.

[0101] The first gate insulating layer 113, which can insulate the semiconductor layer A from the gate electrode G, may include SiO2, silicon nitride (SiN) x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zirconium oxide (ZrO2).

[0102] The first electrode CE1 of the storage capacitor Cst may include the same material as the gate electrode G1 and is located on the same layer as the gate electrode G1. The second electrode CE2 of the storage capacitor Cst may be stacked with or face the first electrode CE1, and the second gate insulating layer 115 is located between the first electrode CE1 and the second electrode CE2.

[0103] exist Figure 3 In this embodiment, the storage capacitor Cst may not be stacked with or face the thin-film transistor T. However, the disclosure is not limited to this. For example, the storage capacitor Cst may be stacked with or face the thin-film transistor T. The first electrode CE1 of the storage capacitor Cst may be integrally formed with the gate electrode G. In other words, the gate electrode G of the thin-film transistor T may be used as the first electrode CE1 of the storage capacitor Cst.

[0104] The interlayer insulating layer 117 can be formed to cover the second electrode CE2. The interlayer insulating layer 117 may include SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2 or ZrO2.

[0105] The first gate insulating layer 113, the second gate insulating layer 115, and the interlayer insulating layer 117 can be collectively referred to as the inorganic insulating layer IL.

[0106] The source electrode S and drain electrode D can be located on the interlayer insulating layer 117. The source electrode S and drain electrode D can include conductive materials containing Mo, Al, Cu, Ti, etc., and can be formed as a single layer or multiple layers including the above materials. For example, the source electrode S and drain electrode D can have a Ti / Al / Ti multilayer structure.

[0107] The planarization layer 119 may be located on the source electrode S and the drain electrode D, and the organic light-emitting diode 300 may be located on the planarization layer 119. The planarization layer 119 may include organic materials and may be formed as a single layer or multiple layers. Organic materials may include general polymers such as polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives including phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, or blends thereof. The planarization layer 119 may be a composite laminate of an inorganic insulating film and an organic insulating film.

[0108] Although Figure 3 It is shown that the planarization layer 119 can be located between the thin-film transistor T and the organic light-emitting diode 300, but the disclosure is not limited to this. For example, a lower planarization layer and an upper planarization layer can be located between the thin-film transistor T and the organic light-emitting diode 300, and various modifications are possible.

[0109] In the display area DA of the lower substrate 100, an organic light-emitting diode 300 may be located on the planarization layer 119. The organic light-emitting diode 300 includes a pixel electrode 310, a counter electrode 330, and a light-emitting layer 320 disposed between the pixel electrode 310 and the counter electrode 330 and including a light-emitting area. The pixel electrode 310 may be electrically connected to a thin-film transistor T through an opening formed in the planarization layer 119.

[0110] The pixel electrode 310 may be a reflective electrode. For example, the pixel electrode 310 may include a reflective film formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or mixtures thereof, and a transparent or translucent electrode layer formed on the reflective film. The transparent or translucent electrode layer may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and zinc aluminum oxide (AZO).

[0111] The pixel defining layer 200 may be located on the planarization layer 119. The pixel defining layer 200 may define pixels by including openings corresponding to each sub-pixel. For example, the opening may be an opening that at least exposes the center of the pixel electrode 310. The pixel defining layer 200 may prevent arcing at the edges of the pixel electrode 310 by increasing the distance between the edge of the pixel electrode 310 and the counter electrode 330 disposed above the pixel electrode 310. The pixel defining layer 200 may be formed of an organic material such as PI or HMDSO.

[0112] The light-emitting layer 320 of the organic light-emitting diode 300 may include small molecule or polymer materials. When the light-emitting layer 320 may include small molecule materials, it can have a monolayer or composite structure by stacking a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL). The light-emitting layer 320 may include various organic materials, such as copper phthalocyanine (CuPc), N,N'-di(naphthyl-1-yl)-N,N'-diphenyl-benzidine (NPB), and aluminum tri-8-hydroxyquinoline (Alq3). These layers can be formed by vapor deposition.

[0113] When the light-emitting layer 320 may comprise a polymer material, the light-emitting layer 320 may have a structure including HTL and EML. The HTL may comprise PEDOT, and the light-emitting layer 320 may comprise polymer materials such as polyphenylenevinylene (PPV) and polyfluorene. The light-emitting layer 320 may be formed using screen printing, inkjet printing, or laser-induced thermal imaging (LITI).

[0114] The light-emitting layer 320 is not limited to this and can have various other structures. The light-emitting layer 320 may include a monolithic layer that covers all of the plurality of pixel electrodes 310, or it may have layers patterned to correspond to each of the pixel electrodes 310.

[0115] like Figure 3 As shown, the counter electrode 330 can be configured to cover the display area DA. The counter electrode 330 can be integrally formed for multiple organic light-emitting diodes 300 to correspond to multiple pixel electrodes 310.

[0116] The counter electrode 330 may be a transparent electrode. The counter electrode 330 may be a transparent electrode or a reflective electrode, and may include a metal thin film with low work function comprising Li, Ca, lithium fluoride (LiF) / Ca, LiF / Al, Al, Ag, Mg or mixtures thereof.

[0117] Since the pixel electrode 310 can be a reflective electrode and the counter electrode 330 can be a transparent electrode, the display device can be a top-emitting type in which light emitted from the light-emitting layer 320 can illuminate the counter electrode 330. However, the display device can be a bottom-emitting type in which light emitted from the light-emitting layer 320 can illuminate the lower substrate 100. The pixel electrode 310 may include a transparent or translucent electrode, and the counter electrode 330 may include a reflective electrode. The display device according to the embodiment can be a dual-emission type that emits light towards the front and rear sides of the display device.

[0118] The upper substrate 400 may be spaced apart from the counter electrode 330. As described above, the upper substrate 400 may be formed as a transparent member to realize the image from the display area DA and to prevent oxygen and moisture from penetrating into the display area DA. The upper substrate 400 may be patterned with touch pattern electrodes to serve as a touch panel. A polarizing film, color filter, or protective window (not shown) may be further disposed on the upper substrate 400.

[0119] Figure 4A A perspective view showing the relationship between the lower substrate, the upper recessed portion, and the upper substrate according to an embodiment is shown. Figure 4B It shows along Figure 1B A schematic cross-sectional view taken by line B-B', and Figure 4C It shows along Figure 1B A schematic cross-sectional view taken by line C-C'.

[0120] Reference Figure 4A and Figure 4B The display device according to the embodiment may include a lower substrate 100, an upper substrate 400, a sealing member 500, and a pad 600 configured to overlap with the side surface portions of the lower substrate 100 and the upper substrate 400.

[0121] exist Figure 4A In this context, pad 600 may be omitted from one of the upper groove portions UH to illustrate the relationship between pad 600 and the lower substrate 100, the upper groove portion UH, and the upper substrate 400. The buffer layer and the inorganic insulating layer may also be omitted to further illustrate the aforementioned relationships.

[0122] A buffer layer 111 may be located on the lower substrate 100, and the fan-out line portion WL may be located on the buffer layer 111. An inorganic insulating layer IL' may be located on the fan-out line portion WL. The inorganic insulating layer IL' may include... Figure 3 At least one of the first gate insulating layer 113, the second gate insulating layer 115, and the interlayer insulating layer 117.

[0123] The pad 600 may be located on the inorganic insulating layer IL', and the pad 600 may be connected to the fan-out portion WL through contact holes formed in the inorganic insulating layer IL'. However, the disclosure is not limited to this. For example, the pad 600 may be located on the same layer as the fan-out portion WL.

[0124] The terminal portion of the PDA may be located in the non-display area NDA and may include at least one pad 600 extending to the edge of the lower substrate 100. More specifically, the pad 600 may extend toward the edge of the lower substrate 100 to expose one side of the pad 600. Thus, one side of the pad 600 may be exposed at the edge of the lower substrate 100, and the other side of the pad 600 may be connected to the fan-out portion WL.

[0125] The sealing member 500 may be located on the pad 600 to at least partially overlap with or face the pad 600. Therefore, the sealing member 500 may expose at least a portion of the pad 600. For example, the sealing member 500 may expose a portion of the pad 600 corresponding to the edge of the lower substrate 100. Alternatively, the sealing member 500 may not be located on a portion of the pad 600.

[0126] The upper base 400 may be located on the sealing member 500, and the upper recessed portion UH may be located on the side surface of the upper base 400. For example, the upper recessed portion UH may be formed by pulling or recessing relative to the upper base 400 in the y direction. The upper recessed portion UH may be considered to have a recessed portion formed from the side surface of the upper base 400.

[0127] The upper groove portion UH can be located at the edge where the side surface and the lower surface of the upper base 400 intersect or meet each other. For example, a portion of the left side surface of the upper base 400 can be partially removed. The upper base 400 may also include a third surface that intersects with the side surface and the lower surface of the upper base 400.

[0128] The side surfaces of the lower substrate 100 and the upper substrate 400 may be flush with each other. For example, the side surfaces of the lower substrate 100 and the upper substrate 400 may not be flush with each other.

[0129] The pad 600 may be located in the upper recessed portion UH. The pad 600 may be located on the side surface of the upper base 400 and simultaneously in the upper recessed portion UH. The pad 600 may extend to the side surface of the lower base 100.

[0130] The pad 600 can be attached to the printed circuit board (PCB) via the adhesive layer 700. The adhesive layer 700 may include conductive balls, and the pad 600 and the PCB can be electrically connected to each other via the conductive balls.

[0131] The pad 600 may include an internal terminal 610 and an external terminal 620.

[0132] The internal terminal 610 can be located on the inorganic insulating layer IL' and can be connected to the fan-out line portion WL through a contact hole. The internal terminal 610 can be located on the inorganic insulating layer IL', and one side of the internal terminal 610 can be flush with one side of the lower substrate 100. The internal terminal 610 can be connected to the fan-out line portion WL through a contact hole provided near the other side surface of the internal terminal 610.

[0133] The sealing member 500 may be located on the internal terminal 610. For example, the sealing member 500 may be located on the pad 600 to at least partially overlap with or face the pad 600.

[0134] External terminal 620 may be located on the side surface of each of the upper recess portion UH and the upper base 400. External terminal 620 may be connected to internal terminal 610. For example, external terminal 620 may be connected to the upper surface of internal terminal 610 at a depth d1 on the upper base 400 along the upper recess portion UH.

[0135] The external terminal 620 may extend in the thickness direction of the upper substrate 400. For example, the external terminal 620 may extend along the z or -z direction on a side surface of the upper substrate 400. Therefore, the external terminal 620 may be connected to the side surface of the internal terminal 610. In an embodiment, the external terminal 620 may extend to the side surface of the inorganic insulating layer 11', the buffer layer 111, or the lower substrate 100.

[0136] The first region R1 can be defined as the area surrounding the edges of the upper recessed portion UH, the sealing member 500, and the lower base 100. (Refer to...) Figure 4A The first region R1 can be a region extending from the edge 100S of the lower base 100 corresponding to the upper groove portion UH in the thickness direction of the lower base 100 (e.g., the z or -z direction) to the upper groove portion UH.

[0137] The external terminal 620 may be disposed in the first region R1, and may be disposed in the upper recessed portion UH and extend into the first region R1. For example, the external terminal 620 may be disposed in the upper recessed portion UH and may extend in the -z direction. Therefore, the external terminal 620 may surround or be located around at least a portion of the internal terminal 610.

[0138] The external terminals 620 and internal terminals 610 that can form the pad 600 constituting the terminal portion of the PDA may include the same material as the gate electrode G, source electrode S, or drain electrode D of the display area DA.

[0139] Reference Figure 4CThe xz-plane shape of the upper groove portion UH can be rectangular, but is not limited to this. The upper groove portion UH can have a polygonal shape such as a quadrilateral or pentagon, or an approximately semi-circular shape. When the upper groove portion UH can have an approximately semi-circular shape, stress can be reduced at the apex portion of the upper base 400 where the upper groove portion UH is formed.

[0140] The upper groove portion UH may include multiple grooves, and the multiple grooves may be spaced apart from each other. The upper groove portion UH may have multiple grooves spaced apart from each other on the side surface of the upper substrate 400. For example, the upper groove portion UH may include a first groove H1 and a second groove H2. The first groove H1 and the second groove H2 may be spaced apart from each other.

[0141] Reference Figure 4C The three grooves can be spaced apart from each other in the upper groove portion UH. The upper groove portion UH can have various modifications, such as having three or more grooves.

[0142] Multiple internal terminals 610 may be spaced apart from each other. For example, internal terminals 610 may include a first internal terminal 611 and a second internal terminal 613. The first internal terminal 611 and the second internal terminal 613 may be spaced apart from each other.

[0143] The upper recessed portion UH can be configured to correspond to at least one internal terminal 610. For example, the first recess H1 of the upper recessed portion UH can be configured to correspond to a first internal terminal 611. In other words, the first internal terminal 611 can be disposed in the first recess H1 of the upper recessed portion UH. As another example, the second recess H2 of the upper recessed portion UH can be configured to correspond to a second internal terminal 613. In other words, the second internal terminal 613 can be disposed in the second recess H2 of the upper recessed portion UH.

[0144] In one embodiment, a side surface of the sealing member 500 located between the plurality of internal terminals 610 may be flush with a side surface of the upper substrate 400 or a side surface of the lower substrate 100. In another embodiment, a side surface of the sealing member 500 located between the plurality of internal terminals 610 may be flush with both the side surfaces of the upper substrate 400 and the lower substrate 100.

[0145] Multiple external terminals 620 can be separated from each other on the upper recessed portion UH. For example, a first external terminal 621 can be disposed in a first recess H1, and a second external terminal 623 can be disposed in a second recess H2, spaced apart from the first external terminal 621. Thus, the first external terminal 621 can be connected to a first internal terminal 611, and the second external terminal 623 can be connected to a second internal terminal 613.

[0146] External terminal 620 and internal terminal 610 can be connected such that the contact area between them can be increased according to the side bonding method used to attach the printed circuit board (PCB) to the side surface of the display panel. Therefore, the contact resistance can be reduced due to the increased contact area.

[0147] Since the external terminal 620 can be disposed in the upper recessed portion UH and simultaneously connected to the internal terminal 610, the space in which the internal terminal 610 and the external terminal 620 can contact each other, and the space in which the external terminal 620 can enter between the upper substrate 400 and the lower substrate 100, can accommodate the terminal of the above dimensions, thereby ensuring reliable operation of the terminal portion of the PDA.

[0148] Including columnar space 510 (see Figure 1C In another embodiment, the second region may be defined as the region surrounding the edges of the upper recessed portion UH, the columnar space 510, and the lower substrate 100. External terminals may be disposed in the second region. The second region may be similar to the first region R1.

[0149] Figure 5A and Figure 5B A schematic cross-sectional view of a display device according to another embodiment is shown.

[0150] Reference Figure 5A The side surface of the lower substrate 100 of the display device may include a lower recessed portion DH.

[0151] The lower recessed portion DH can be positioned in the y-direction relative to the lower base 100. The lower recessed portion DH may include a recessed portion disposed on the side surface of the lower base 100.

[0152] The lower recessed portion DH can be located at the edge where the side surface and the top surface of the lower base 100 intersect or meet each other. For example, the left end of the lower base 100 can be partially removed. The lower base 100 may also include a third surface that intersects with the side surface and the top surface of the lower base 100.

[0153] Similar to the recessed portion DH, the buffer layer 111 and the inorganic insulating layer IL' can each include a buffer layer recessed portion and an inorganic insulating layer recessed portion, respectively. The recessed portion DH, the buffer layer recessed portion, and the inorganic insulating layer recessed portion can be connected to each other. Therefore, in the following text, the recessed portion DH can be understood as meaning that the recessed portion DH can be connected to the entire recessed portion of the buffer layer recessed portion and the inorganic insulating layer recessed portion. In other words, the recessed portion DH can include both the buffer layer recessed portion and the inorganic insulating layer recessed portion.

[0154] The pad 600 can be disposed in the lower recessed portion DH. The pad 600 can be integrally formed with the upper recessed portion UH and the lower recessed portion DH.

[0155] The third region R3 can be defined as the area surrounding the upper recessed portion UH, the sealing member 500, and the lower recessed portion DH. The third region R3 can be the area extending from the lower recessed portion DH in the thickness direction (e.g., the z or -z direction) of the lower substrate 100 to the upper recessed portion UH.

[0156] External terminal 620 may be disposed in the third region R3, and external terminal 620 may extend in the thickness direction of the upper substrate 400. (Refer to...) Figure 5A The external terminal 620 can extend in the z-direction or the -z-direction and can be disposed in the third region R3. The external terminal 620 can extend to the side surfaces of the upper substrate 400 and the lower substrate 100.

[0157] The external terminal 620 can be integrally formed with the upper recessed portion UH and the lower recessed portion DH. The external terminal 620 can be connected in the third region R3 to surround at least a portion of the internal terminal 610 or to be located around at least a portion of the internal terminal 610. Therefore, the external terminal 620 can be connected to the upper and lower surfaces of the internal terminal 610.

[0158] Reference Figure 5B The planar shape of the recessed portion DH can be rectangular. However, the disclosure is not limited to this. The recessed portion DH can have a polygonal shape such as a quadrilateral or pentagon and an approximately semi-circular shape. When the recessed portion DH has an approximately semi-circular shape, stress can be relieved at the apex portion of the lower base 100 where the recessed portion DH is formed.

[0159] The lower recessed portion DH may include multiple recesses, and these recesses may be spaced apart from each other. The lower recessed portion DH may have multiple spaced-apart recesses on the side surface of the lower base 100. For example, the third recess H3 and the fourth recess H4 may be spaced apart from each other.

[0160] The lower recessed portion DH can be configured to correspond to at least one internal terminal 610. For example, the third recess H3 of the lower recessed portion DH can be configured to correspond to the first internal terminal 611. In other words, the first internal terminal 611 can be disposed in the third recess H3 of the lower recessed portion DH. As another example, the fourth recess H4 of the lower recessed portion DH can be configured to correspond to the second internal terminal 613. In other words, the second internal terminal 613 can be disposed in the fourth recess H4 of the lower recessed portion DH.

[0161] External terminal 620 can be integrally formed with the upper recess portion UH and the lower recess portion DH. For example, the first external terminal 621 can be integrally formed with the first recess H1 and the third recess H3, and the second external terminal 623 can be integrally formed with the second recess H2 and the fourth recess H4.

[0162] External terminals 620 and internal terminals 610 can be connected such that the contact area between them can be increased according to the side bonding method used to attach the printed circuit board (PCB) to the side surface of the display panel.

[0163] External terminals 620 can be electrically connected to the upper and lower surfaces of the conductive layer. This reduces the problem of poor contact with external terminals 620 and decreases contact resistance.

[0164] Figure 6 A schematic cross-sectional view of a display device according to another embodiment is shown.

[0165] Reference Figure 6 The display device may include an additional terminal 615 between the upper substrate 400 and the internal terminal 610.

[0166] The additional terminal 615 can be disposed in the first region R1, and the upper recessed portion UH can be disposed on the additional terminal 615.

[0167] The additional terminal 615 can be connected to the external terminal 620 and the internal terminal 610. The upper and side surfaces of the additional terminal 615 can be connected to the external terminal 620. The lower surface of the additional terminal 615 can be connected to the upper surface of the internal terminal 610. Therefore, the additional terminal 615 can be electrically connected to the external terminal 620 and the internal terminal 610.

[0168] An additional terminal 615 may be located on the upper surface of the internal terminal 610 to protect the internal terminal 610. As described later below, a laser beam irradiation process may be performed to form an upper recessed portion UH in the upper substrate 400. The additional terminal 615 can prevent direct or indirect damage to the internal terminal 610 that may be caused by laser beam irradiation during the laser beam irradiation process.

[0169] Figures 7A to 10B A schematic cross-sectional view of a method for manufacturing an embodiment is shown.

[0170] First, refer to Figure 7A and Figure 7B The lower base 100 and upper base 400, on which internal terminals 610 may be provided, can be combined with the sealing member 500.

[0171] The side surface of the internal terminal 610 can be polished. (In forming...) Figure 9AWhen the conductive material 620' is used, polishing can increase the interfacial adhesion of the conductive material to be deposited on the side surface of the internal terminal 610 by removing foreign matter on the side surface, so that the conductive material can be uniformly deposited on the side surface of the internal terminal 610.

[0172] Since a sealing member 500 can be provided on the internal terminal 610, the internal terminal 610 can be prevented from becoming loose even if the side surface of the internal terminal 610 is polished.

[0173] like Figure 8A and Figure 8B As shown, some of the upper substrate 400 and sealing member 500 can be removed by laser beam irradiation to expose the upper surface of the internal terminal 610.

[0174] The upper groove portion UH can be formed by irradiating the side surface of the upper substrate 400 with a laser beam. The upper groove portion UH can also be formed by irradiating the edge where the side and lower surfaces of the upper substrate 400 intersect or meet. For example, the upper groove portion UH can be formed by partially removing the left end portion of the upper substrate 400.

[0175] The portion of the sealing member 500 located below the upper groove portion UH can also be removed by laser beam irradiation. However, the disclosure is not limited to this. In cases where the sealing member 500 may comprise an organic material, some of the sealing member 500 can be removed by the heat generated when the upper groove portion UH is formed by laser beam irradiation.

[0176] Therefore, conductive material can be provided on the upper surface and side surface of the internal terminal 610.

[0177] Reference Figure 8B The upper groove portion UH can be formed into a rectangular shape, but is not limited to this. Depending on the laser beam irradiation, the upper groove portion UH can have a polygonal shape such as a quadrilateral or pentagon, or an approximately semi-circular shape.

[0178] The upper groove portion UH may have multiple grooves spaced apart from each other on the side surface of the upper substrate 400. For example, the upper groove portion UH may include a first groove H1 and a second groove H2. The second groove H2 may be formed on the side surface of the upper substrate 400, thereby spacing the second groove H2 from the first groove H1.

[0179] While embodiments may include three grooves spaced apart from each other in the upper groove portion UH, the upper groove portion UH may have various modifications, such as having three or more grooves, by means of laser beam irradiation.

[0180] The upper recessed portion UH can be formed by irradiating a laser beam, such that the upper recessed portion UH corresponds to at least one internal terminal 610. For example, the first recess H1 of the upper recessed portion UH can be formed to correspond to a first internal terminal 611. In other words, the first internal terminal 611 can be provided in the first recess H1 of the upper recessed portion UH. As another example, the second recess H2 of the upper recessed portion UH can be formed to correspond to a second internal terminal 613. In other words, the second internal terminal 613 can be provided in the second recess H2 of the upper recessed portion UH.

[0181] Reference Figure 9A and Figure 9B Conductive material 620' can be formed on the side surfaces of the upper substrate 400 and the lower substrate 100 using processes such as spin coating, printing, sputtering, chemical vapor deposition (CVD), atomic layer deposition (ALD), plasma-enhanced CVD (PECVD), high-density plasma CVD (HDP-CVD), and vacuum deposition. However, for ease of description, the process of forming conductive material 620' on the side surfaces of the upper substrate 400 and the lower substrate 100 may include sputtering.

[0182] The conductive material 620' can be integrally formed with the side surfaces of the upper substrate 400 and the lower substrate 100. The conductive material 620' can extend into the first region R1 and connect to the internal terminal 610. The conductive material 620' can connect to the side surface and the upper surface of the internal terminal 610.

[0183] The conductive material 620' can be formed extending in the longitudinal direction (e.g., the y or -y direction) of the upper substrate 400, and can be formed on the side surface of the upper substrate 400 along the thickness direction (e.g., the z or -z direction). The conductive material 620' can be formed on the side surface of the lower substrate 100 to extend in the thickness direction of the upper substrate 400.

[0184] The conductive material 620' can be disposed on the upper substrate 400 at the same depth as the upper groove portion UH can be disposed on the upper substrate 400 at the same depth d1. Since the upper groove portion UH can be disposed on the upper substrate 400, the conductive material 620' can be sufficiently formed in the first region R1.

[0185] Reference Figure 10A and Figure 10BExternal terminals 620 can be formed by irradiating conductive material 620' with a laser beam. External terminals 620 can be spaced apart from each other on the upper recessed portion UH. For example, a first external terminal 621 can be provided in the first recess H1, and a second external terminal 623 can be provided in the second recess H2, such that the second external terminal 623 is spaced apart from the first external terminal 621.

[0186] The external terminals 620 may each be formed to have the same width as the internal terminals 610. However, the disclosure is not limited to this, and the width of the external terminals 620 may be greater than the width of the internal terminals 610.

[0187] An external terminal 620 can be formed on one side of the first region R1 and the internal terminal 610. Therefore, the external terminal 620 can be fully connected to the upper surface of the internal terminal 610.

[0188] In examples other than those provided by the embodiments herein (such as the comparative examples discussed below), the dimensions of the side surface of the internal terminal 610 may be smaller than the dimensions of the upper surface of the internal terminal 610. For example, the thickness of the internal terminal 610 may be smaller than the length of the internal terminal 610. Therefore, in cases where the external terminal 620 can only be formed on the side surface of the internal terminal 610, an increase in contact resistance may occur. Before the external terminal 620 can be formed, a grinding operation may be performed on the side surface of the internal terminal 610. Due to the grinding operation, the side surface of the internal terminal 610 may be located in the lower substrate 100 or the upper substrate 400. Therefore, poor contact between the external terminal 620 and the internal terminal 610 may occur.

[0189] like Figure 11A and Figure 11B As shown, even in the comparative example where the upper recessed portion UH is not disposed on the upper substrate 400, the conductive material 620-1 can be formed between the upper substrate 400-1 and the lower substrate 100-1 by a sputtering process. However, in the comparative example, the conductive material 620-1 may not be adequately applied between the upper substrate 400-1 and the lower substrate 100-1, and a cavity may be formed. This cavity may occur because a sufficient vacuum is not maintained between the upper substrate 400-1 and the lower substrate 100-1, and therefore the conductive material 620-1 is not deposited onto the sealing member 500-1. Figure 11A and Figure 11B The buffer layer 111-1 and the inorganic insulating layer IL'-1 are also shown.

[0190] Therefore, the area where the upper surface of the internal terminal 610-1 connects to the conductive material 620-1 may not be sufficient to achieve the desired conductivity. As a result, contact resistance and insufficient electrical contact may increase.

[0191] To minimize this phenomenon, the embodiments herein provide that an upper recessed portion UH can be formed on the side surface of the upper substrate 400, and an external terminal 620 can be formed in the upper recessed portion UH. When the conductive material 620' can be formed by a sputtering process, the conductive material 620' can be sufficiently coated on the upper surface of the internal terminal 610, thereby reducing the chance of each of poor electrical contact and increased contact resistance. Therefore, the reliability of the display device implementing the embodiments or the embodiments herein can be improved.

[0192] As described above, the embodiment employs a side bonding method for attaching the printed circuit board to the side surfaces of the upper and lower substrates, thereby minimizing the non-display area outside the display area.

[0193] In the side bonding method according to the embodiment, the contact area between the metals is increased, thus reducing the contact resistance between the metals. Therefore, the reliability of the display device can be improved.

[0194] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope defined by the claims.

Claims

1. A display device, the display device comprising: The lower substrate includes a display area and a non-display area surrounding the display area, the display area including display elements; A sealing member is disposed in the non-display area and located around the display area; The terminal portion is disposed in the non-display area and includes at least one internal terminal extending toward the edge of the lower substrate; The fan-out section is connected to the at least one internal terminal and includes a line extending to the display area; The upper substrate is configured to face the lower substrate and is attached to the lower substrate by the sealing member; The upper groove portion is located on the side surface of the upper substrate to expose the upper surface of the at least one internal terminal; The lower recess portion is located on the side surface of the lower substrate to expose the lower surface of the at least one internal terminal; as well as External terminals are disposed in the upper recessed portion and the lower recessed portion.

2. The display device according to claim 1, in, The external terminal is disposed in a first region defined by the upper recessed portion, the sealing member, and the lower recessed portion.

3. The display device according to claim 1, further comprising: A columnar support member is disposed between the terminal portion and the sealing member, and The external terminal is disposed in a second region defined by the upper recessed portion, the columnar support, and the lower recessed portion.

4. The display device according to claim 1, in, The external terminal is integrally formed with the upper groove portion and the lower groove portion.

5. The display device according to claim 1, further comprising: Additional terminals are located between the upper substrate and the at least one internal terminal, and between the lower substrate and the at least one internal terminal. The additional terminal is disposed in a first region consisting of the upper groove portion, the sealing member, and the lower groove portion.

6. A display device, the display device comprising: The lower substrate includes a display area and a non-display area surrounding the display area, the display area including display elements; A sealing member is disposed in the non-display area and surrounds the display area; The terminal portion is disposed in the non-display area and includes at least one internal terminal extending to the edge of the lower substrate; The fan-out section is connected to the at least one internal terminal and includes a line extending to the display area; The upper substrate is configured to face the lower substrate and is attached to the lower substrate by the sealing member; The upper groove portion is located at the edge where the side surface and the lower surface of the upper base meet; The lower recessed portion is located at the edge where the side surface and the upper surface of the lower base meet, and External terminals are disposed in the upper recessed portion and the lower recessed portion. Wherein, the upper groove portion and the lower groove portion correspond to the at least one internal terminal, and The external terminal extends toward the at least one internal terminal and is connected to the upper and lower surfaces of the at least one internal terminal in the upper recessed portion and the lower recessed portion.

7. The display device according to claim 6, in, The external terminal extends in the thickness direction of the upper substrate and is disposed on the side surface of the lower substrate.

8. The display device according to claim 6, wherein, The external terminal is integrally formed with the upper groove portion and the lower groove portion.

9. The display device according to claim 6, further comprising: An additional terminal is located between the upper substrate and the at least one internal terminal, and The external terminal is connected to the additional terminal.

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