Sensor components and image signal processing systems

Abstract

The present invention discloses a sensor component and an image signal processing system. The sensor component includes: a substrate; a sensor unit, which is arranged on the substrate and is used to obtain an image signal; a compression unit, which is arranged on the substrate and is electrically connected to the image sensor unit and is used to compress the image signal. In the above technical solution, the compression unit and the sensor unit are directly electrically connected, and the interface setting between the sensor unit and the compression unit is reduced, so that the data transmission rate of the interface can be avoided to limit the data transmission rate between the sensor unit and the compression unit, and the data transmission rate between the sensor unit and the compression unit is increased. After the image signal is compressed by the compression unit, the compression unit can reduce the data volume of the image signal. When the image signal compressed by the compression unit is transmitted again, the demand for the data transmission interface can be reduced, so that the sensor component can transmit the image signal at a high speed, and the timeliness of the image communication is improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of communication technology, and in particular to a sensor component and an image signal processing system. Background Art

[0002] With the development and progress of technology, image communication has been increasingly widely used in radio and television, communications, entertainment, medical care, weather forecasting, satellite remote sensing, industrial monitoring, military, education, finance, news publishing and other fields.

[0003] However, with the increasing application requirements in various fields, the demand for image communication transmission capacity is getting higher and higher. When performing image communication, the amount of image data transmission is getting larger and larger. Due to the limited transmission capacity of the image data transmission interface, the image communication transmission speed is slow and all image data cannot be transmitted to the receiving end in time, resulting in image communication delays and image communication transmission jams. Summary of the invention

[0004] The present invention provides a sensor component and an image signal processing system, which can solve the problems in the prior art of slow image data transmission rate and obstruction of real-time image communication.

[0005] In a first aspect, an embodiment of the present invention provides a sensor assembly comprising:

[0006] substrate;

[0007] A sensor unit, disposed on the substrate, for acquiring an image signal;

[0008] The compression unit is arranged on the substrate and is electrically connected to the sensor unit for compressing the image signal.

[0009] Furthermore, the sensor unit is arranged on one side of the substrate, and the compression unit is arranged on the other side of the substrate. A through hole is arranged on the substrate, and the sensor unit and the compression unit are electrically connected through the through hole.

[0010] Furthermore, the through hole is filled with a conductive material.

[0011] Furthermore, the sensor unit and the compression unit are both arranged on one side of the substrate, an electrical connection portion is arranged on the substrate, and the sensor unit and the compression unit are electrically connected via the electrical connection portion.

[0012] Furthermore, the sensor assembly also includes an image signal processing unit, the compression unit is integrated in the image signal processing unit, and the compression unit is electrically connected to the sensor unit through the image signal processing unit.

[0013] Furthermore, the sensor component also includes an image signal processing unit, and the compression unit is connected to the image signal processing unit.

[0014] Further, the image signal processing unit includes: at least one of an image distortion correction subunit, a white balance correction subunit, a color compensation subunit, an image noise reduction subunit, and a high dynamic range subunit;

[0015] The image distortion correction subunit is used to perform distortion correction on the image signal obtained by the sensor unit; the white balance correction subunit is used to perform white balance correction on the image signal obtained by the sensor unit; the color compensation subunit is used to perform color compensation on the image signal obtained by the sensor unit; the image noise reduction subunit is used to perform noise reduction on the image signal obtained by the sensor unit; and the high dynamic range subunit is used to adjust the dynamic range of the image signal obtained by the sensor unit.

[0016] Furthermore, the sensor assembly also includes a temperature control unit for controlling the temperatures of the sensor unit and the compression unit respectively.

[0017] Furthermore, the substrate is a silicon connecting plate.

[0018] Furthermore, the sensor unit includes an active pixel sensor and / or a dynamic vision sensor, the active pixel sensor is used to collect synchronous signals in the image signal, and the dynamic vision sensor is used to collect asynchronous signals in the image signal.

[0019] Furthermore, the sensor component also includes an interface, which is used to adapt to an external docking device and output a processed image signal.

[0020] Furthermore, the interface is a low voltage differential signal interface or a mobile industry processor interface.

[0021] In a second aspect, an embodiment of the present invention further provides an image signal processing system, comprising a sensor component implementing any one of the items in the first aspect.

[0022] The technical solution of the embodiment of the present invention is to obtain an image signal through a sensor unit; and compress the image signal by a compression unit. The compression unit and the sensor unit are directly electrically connected, and the interface settings between the sensor unit and the compression unit are reduced, so that the data transmission rate of the interface can be avoided to limit the data transmission rate between the sensor unit and the compression unit, and the data transmission rate between the sensor unit and the compression unit is increased. After the image signal is compressed by the compression unit, the compression unit can reduce the data volume of the image signal. When the image signal compressed by the compression unit is transmitted again, the demand for the data transmission interface can be reduced, and the sensor component can transmit the image signal at a high speed, thereby improving the timeliness of image communication. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of an image signal processing system provided by the prior art;

[0024] Figure 2 A schematic diagram of the structure of a sensor assembly provided by an embodiment of the present invention;

[0025] Figure 3 A schematic diagram of the structure of another sensor assembly provided by an embodiment of the present invention;

[0026] Figure 4 A schematic diagram of the structure of another sensor assembly provided by an embodiment of the present invention;

[0027] Figure 5 A schematic diagram of the structure of another sensor assembly provided by an embodiment of the present invention;

[0028] Figure 6 A schematic diagram of the structure of another sensor assembly provided by an embodiment of the present invention;

[0029] Figure 7 A schematic structural diagram of another sensor assembly provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Figure 1 The following is a schematic diagram of the structure of an image signal processing system provided by the prior art. Figure 1 As shown, the image signal processing system includes an image sensor, an image signal processor and a memory / signal analysis module.

[0032] The image sensor collects image signals and sends the image signals to the image signal processor for image processing through a data transmission interface. For example, the data transmission interface may be a low-voltage differential signal (LVDS) interface or a mobile industry processor (MIPI) interface. The image signal processor includes a compression module for compressing the processed image signal, and the image signal is transmitted to the memory / signal analysis module after compression. When the image sensor collects image signals, the entire image signal composed of all pixels can be collected. When the image sensor transmits the image signal to the image signal processor, due to the limited data transmission capacity of the data transmission interface, the number of frames of the image signal transmitted per second between the image sensor and the image signal processor is limited, resulting in transmission delays and jams of the image signal. Exemplarily, the image sensor and the image signal processor can be transmitted through a low-voltage differential signal interface or a mobile industry processor interface. The low voltage differential signal interface can support the transmission of high-definition single-frame images with a size of 1920×1080×3, that is, the maximum transmission speed it can support is 50Mbps; the mobile industry processor interface can support a transmission speed of 10Gbps, that is, it can support a maximum of 20 frames per second. At this time, the transmission capacity of the interface between the image sensor and the image signal processor of the image signal processing system is limited, so that the number of image signal frames transmitted per second between the image sensor and the image signal processor of the image signal processing system is limited, resulting in a slow transmission speed of the image signal of the image signal processing system.

[0033] The present invention improves the above-mentioned defects of the existing sensors and designs sensor components, which can effectively increase the transmission speed of image signals, thereby improving the timeliness of image communication.

[0034] Figure 2 A schematic diagram of the structure of a sensor assembly provided by an embodiment of the present invention. Figure 2 As shown, the sensor assembly includes: a substrate 110; a sensor unit 120, which is disposed on the substrate 110 and is used to obtain image signals; and a compression unit 130, which is disposed on the substrate 110 and is electrically connected to the sensor unit 120 and is used to compress the image signals.

[0035] The substrate 110 refers to a fixed plate of the sensor assembly, which is used to place various components of the sensor assembly. For example, the sensor unit 120 and the compression unit 130 of the sensor assembly are both fixed on the substrate 110. The sensor unit 120 is used to collect image signals. The image signal can be a synchronous signal provided by an active pixel sensor (APS) and / or an asynchronous signal provided by a dynamic vision sensor (DVS). The compression unit 130 is used to compress the image signal obtained by the sensor unit 120, eliminate a large amount of redundant information in the image, and use as few bytes as possible to represent the original data, so as to improve the efficiency of image transmission and reduce the storage capacity of the image. The compression unit 130 is directly electrically connected to the sensor unit 120, reducing the interface setting between the sensor unit 120 and the compression unit 130, thereby avoiding the data transmission rate of the interface limiting the data transmission rate between the sensor unit 120 and the compression unit 130, and increasing the data transmission rate between the sensor unit 120 and the compression unit 130. After the image signal is compressed by the compression unit 130, the compression unit 130 can reduce the data volume of the image signal. When the image signal compressed by the compression unit 130 is transmitted again, the demand for the data transmission interface can be reduced, the sensor component can transmit the image signal at a high speed, and the timeliness of the image communication is improved.

[0036] For example, Figure 2 As shown, the sensor unit 120 and the compression unit 130 are both disposed on one side of the substrate 110 , and an electrical connection portion 140 is disposed on the substrate 110 , through which the sensor unit 120 and the compression unit 130 are electrically connected.

[0037] Among them, Figure 2As shown, the electrical connection part 140 may include a first part 141 disposed inside the substrate 110 and a second part 142 disposed on the side of the substrate 110 close to the sensor unit 120. The first part 141 may be formed by providing a via in the substrate 110, and the via is filled with a conductive material. The sensor unit 120 and the compression unit 130 are both disposed on one side of the substrate 110, so both ends of the first part 141 are disposed on the surface of the substrate 110 on which the sensor unit 120 and the compression unit 130 are disposed. The second part 142 may be an electrical connection part such as a solder ball. The second part 142 is disposed at both ends of the first part 141 to realize electrical connection with the first part 141, and then the sensor unit 120 and the compression unit 130 are both electrically connected to the first part 141 through the second part 142, thereby realizing electrical connection between the sensor unit 120 and the compression unit 130. When the sensor unit 120 is directly electrically connected to the compression unit 130, the data transmission rate between the sensor unit 120 and the compression unit 130 can be avoided from being limited by the data transmission rate of the interface, thereby increasing the data transmission rate between the sensor unit 120 and the compression unit 130. After the image signal is compressed by the compression unit 130, the compression unit 130 can reduce the data volume of the image signal. When the image signal compressed by the compression unit 130 is transmitted again, the demand for the data transmission interface can be reduced, the sensor component can transmit the image signal at a high speed, and the timeliness of the image communication is improved.

[0038] It should be noted that when vias are set on the substrate 110 to form the first part 141, the via parts in different directions can be perpendicular, which can reduce the length of the first part 141, thereby reducing the delay of the image signal and reducing the power consumption between the sensor unit 120 and the compression unit 130.

[0039] Figure 3 FIG. 1 is a schematic diagram of the structure of another sensor assembly provided by an embodiment of the present invention. Figure 3 As shown, the sensor unit 120 is disposed on one side of the substrate 110 , and the compression unit 130 is disposed on the other side of the substrate 110 . A through hole 150 is disposed on the substrate 110 , and the sensor unit 120 and the compression unit 130 are electrically connected through the through hole 150 .

[0040] Among them, when the compression unit 130 and the sensor unit 120 are respectively arranged on opposite sides of the substrate 110, the sensor unit 120 and the compression unit 130 can form a stacked structure. A through hole 150 can be arranged on the substrate 110, and the through hole 150 penetrates the substrate 110 along the thickness direction of the substrate 110, and one end of the through hole 150 contacts the sensor unit 120 on the side of the substrate 110, and the other end of the through hole 150 contacts the compression unit 130 on the other side of the substrate 110, so that the electrical connection between the sensor unit 120 and the compression unit 130 can be achieved through the through hole 150, avoiding the data transmission rate of the interface to limit the data transmission rate between the sensor unit 120 and the compression unit 130, and increasing the data transmission rate between the sensor unit 120 and the compression unit 130. After the image signal is compressed by the compression unit 130, the compression unit 130 can reduce the data volume of the image signal. When the image signal compressed by the compression unit 130 is transmitted again, the demand for the data transmission interface can be reduced, and the sensor component can transmit the image signal at high speed, which improves the timeliness of image communication.

[0041] Optionally, continue to refer to Figure 3 The through hole 150 is filled with a conductive material.

[0042] The conductive material such as copper, tungsten and polysilicon is filled in the through hole 150, so that the through hole 150 has conductive properties. The conductive material can directly contact the sensor unit 120 and the compression unit 130 by the sensor unit 120 and the compression unit 130 respectively contacting the through hole 150, so as to realize the electrical connection between the sensor unit 120 and the compression unit 130.

[0043] Optionally, the substrate is a silicon connection board.

[0044] Specifically, when the substrate is a silicon connecting plate, its main material is silicon, which has good heat dissipation and thermal conductivity, and can provide a good heat dissipation environment for each structure of the sensor component, so that the temperature difference of each structure is kept within a certain range, and the continuous and rapid communication between its units through electrical connection is ensured. In addition, vias or through holes are formed on the silicon connecting plate, and the electrical connection between the sensor unit and the compression unit is realized through silicon via (TSV) technology.

[0045] Figure 4 FIG. 1 is a schematic diagram of the structure of another sensor assembly provided by an embodiment of the present invention. Figure 4 As shown, the sensor assembly further includes an image signal processing unit 200 , the compression unit 130 is integrated in the image signal processing unit 200 , and the compression unit 130 is electrically connected to the sensor unit 120 via the image signal processing unit 200 .

[0046] Among them, the image signal processing unit 200 is used to perform image processing on the image signal to prevent the image signal from being distorted during the transmission process, so that the processed image signal can better restore the image. When the compression unit 130 is integrated in the image signal processing unit 200, the image signal processing unit 200 can first perform image signal processing on the acquired image signal through the image signal processing module, and then compress and output the processed image signal through the compression unit 130. The image signal processing module and the compression unit 130 are electrically connected to realize the transmission of the image signal. Therefore, it can be set that the sensor unit 120 can be electrically connected to the image signal processing unit 200, so that the sensor unit 120 is electrically connected to the compression unit 130 through the image signal processing module in the image signal processing unit 200. Since the sensor unit 120 and the image signal processing unit 200 are electrically connected, the interface setting between the sensor unit 120 and the image signal processing unit 200 can be reduced, so that the data transmission rate of the interface can be avoided to limit the data transmission rate between the sensor unit 120 and the image signal processing unit 200, and the data transmission rate between the sensor unit 120 and the image signal processing unit 200 is increased. The compression unit 130 inside the image signal processing unit 200 compresses the received image signal and then transmits the compressed image signal again, which can reduce the demand for the data transmission interface, realize high-speed transmission of the image signal by the sensor component, and improve the timeliness of image communication.

[0047] It should be noted that Figure 4 The electrical connection between the sensor unit 120 and the image signal processing unit 200 is merely exemplified, that is, the sensor unit 120 and the image signal processing unit 200 are both disposed on one side of the substrate 110 to achieve electrical connection. In other embodiments, the sensor unit 120 and the image signal processing unit 200 may also be disposed on both sides of the substrate 110, respectively. Figure 5 FIG. 1 is a schematic diagram of the structure of another sensor assembly provided by an embodiment of the present invention. Figure 5 As shown, the sensor unit 120 and the image signal processing unit 200 form a stacked structure and are electrically connected by providing a through hole 150 on the substrate 110 .

[0048] Figure 6 FIG. 1 is a schematic diagram of the structure of another sensor assembly provided by an embodiment of the present invention. Figure 6 As shown, the sensor assembly further includes an image signal processing unit 200 , and the compression unit 130 is connected to the image signal processing unit 200 .

[0049] Among them, when the sensor unit 120 is electrically connected to the compression unit 130, the compression unit 130 can reduce the data volume of the image signal. The compression unit 130 and the image signal processing unit 200 can be connected through a data transmission interface. When the image signal compressed by the compression unit 130 is transmitted to the image signal processing unit 200, the demand for the data transmission interface can be reduced, and the sensor component can transmit the image signal at a high speed, thereby improving the timeliness of image communication.

[0050] It should be noted that Figure 6 The present invention only exemplarily shows an electrical connection form between the sensor unit 120 and the compression unit 130, that is, the sensor unit 120 and the compression unit 130 are both arranged on one side of the substrate 110 to realize electrical connection. In other embodiments, the sensor unit 120 and the compression unit 130 can also be arranged on both sides of the substrate 110 respectively. Figure 7 FIG. 1 is a schematic diagram of the structure of another sensor assembly provided by an embodiment of the present invention. Figure 7 As shown, the sensor unit 120 and the compression unit 130 form a stacked structure and are electrically connected by providing a through hole 150 on the substrate 110 .

[0051] Optionally, the image signal processing unit includes: at least one of an image distortion correction subunit, a white balance correction subunit, a color compensation subunit, an image noise reduction subunit and a high dynamic range subunit; the image distortion correction subunit is used to perform distortion correction on the image signal acquired by the sensor unit; the white balance correction subunit is used to perform white balance correction on the image signal acquired by the sensor unit; the color compensation subunit is used to perform color compensation on the image signal acquired by the sensor unit; the image noise reduction subunit is used to perform noise reduction on the image signal acquired by the sensor unit; and the high dynamic range subunit is used to adjust the dynamic range of the image signal acquired by the sensor unit.

[0052] Among them, image distortion is the error caused by the sensing device and the actual scene. The image distortion correction subunit corrects the distortion error of the image signal by a certain calculation method to minimize it, so that it can restore the image signal to the greatest extent. The white balance correction subunit automatically detects the color temperature value of the object according to the light conditions of the lens and the white balance sensor, judges the shooting conditions, and selects the closest color setting, which is corrected by the color temperature correction circuit, and compensates by strengthening the corresponding complementary color, corrects the color temperature, and restores the color of the subject, so that the picture taken under different light conditions or in different dynamics is similar to the picture color viewed by the human eye. The color compensation subunit uses the values ​​of the pixels around the compensation point to obtain the values ​​of the other two channels of the point, thereby compensating for the missing color information of the restored pixel point and obtaining the color information of the completed image. Image noise is caused by the thermal motion of molecules, resulting in a slight and constant noise signal in the output signal, which will reduce the image signal quality. The image noise reduction subunit is used to suppress or eliminate the noise of the image signal to improve the quality of the picture. High-Dynamic Range (HDR) is a technology that allows the camera to see the characteristics of the image under very strong contrast. "Dynamic range" refers to the camera's ability to adapt to the reflection of the light in the scene, specifically the range of changes in brightness (contrast) and color temperature (contrast). The high dynamic range subunit is used to adjust the dynamic range of the image signal obtained by the sensor unit. To obtain more dynamic range and image details, higher time resolution, and reflect a more realistic visual effect.

[0053] Optionally, the sensor assembly further comprises a temperature control unit for controlling the temperatures of the sensor unit and the compression unit respectively.

[0054] Among them, the temperature control unit mainly controls the temperature of the sensor unit and the compression unit, dissipates the heat of the sensor unit and / or the compression unit with too high temperature, keeps the temperature difference between the sensor unit and the compression unit within a certain range, and prevents the stacking of the sensor unit and the compression unit from causing a large difference in temperature changes between the two, thereby affecting the transmission of image signals between the sensor unit and the compression unit through electrical connection.

[0055] Optionally, the sensor unit includes an active pixel sensor and / or a dynamic vision sensor, the active pixel sensor is used to collect synchronous signals in the image signal, and the dynamic vision sensor is used to collect asynchronous signals in the image signal.

[0056] Among them, the active pixel sensor (APS) is usually an image sensor based on a voltage signal or a current signal, which is used to collect the synchronous signal in the image signal. It can make full use of the low-speed, high-resolution intensity information in the synchronous signal, that is, the image frame based on the pixel matrix, to improve the image quality of the processed synchronous signal. The active pixel sensor has the advantages of high color reproduction and image quality, and can restore the color of the image with high precision to obtain a color image with higher quality. The dynamic vision sensor (DVS) is used to collect the asynchronous signal in the image signal. It can make full use of the high-speed, high-dynamic, low-resolution optical flow visual information in the asynchronous signal, that is, the event-based image signal, to improve the dynamic range and time resolution of the processed asynchronous signal.

[0057] When the sensor unit includes only an active pixel sensor, the image signal may be a synchronous signal having all color information. When the sensor unit includes only a dynamic vision sensor, the image signal may be an asynchronous signal having all grayscale gradient information. When the sensor unit includes both an active pixel sensor and a dynamic vision sensor, the sensor unit is a dual-mode image sensor, and the image signal may include both a synchronous signal having all color information and an asynchronous signal having all grayscale gradient information.

[0058] Optionally, the sensor component further includes an interface, and the interface is used to adapt to an external docking device and output a processed image signal.

[0059] The interface is an input and output port for information exchange with external devices. After the sensor component is adapted to the external docking device through the interface, it can quickly transmit the image signal to the external receiving device, complete the high-speed transmission communication of the image signal, and improve the timeliness of image communication.

[0060] Optionally, the interface is a low voltage differential signal interface or a mobile industry processor interface.

[0061] Among them, the Low Voltage Differential Signaling (LVDS) interface is a low-amplitude differential signaling technology. LVDS uses a very low amplitude signal (about 350mV) to transmit data through a pair of differential PCB traces or balanced cables, and can transmit serial data at speeds of up to several thousand Mbps. Since the LVDS interface voltage signal amplitude is low and it is driven in constant current source mode, it only generates very low noise and consumes very little power, and even the power consumption is almost unchanged regardless of the frequency. In addition, since LVDS transmits data in a differential manner, it is not easily affected by common-mode noise. The Mobile Industry Processor Interface (MIPI) is an open standard initiated by the MIPI Alliance for mobile application processors, which specifically uses low-amplitude signal swings in high-speed (data transmission) mode. Standardizing interfaces such as cameras, displays, basebands, and radio frequency interfaces in mobile devices can increase design flexibility while reducing costs, design complexity, and power consumption.

[0062] The embodiment of the present invention further provides an image signal processing system, comprising the sensor assembly of any one of the above embodiments. The image signal processing system comprises the sensor assembly provided by any embodiment of the present invention, and thus has the beneficial effects of the sensor assembly provided by the embodiment of the present invention, which will not be described in detail here.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A sensor assembly, characterized in that: include: substrate; A sensor unit, disposed on the substrate, for acquiring an image signal; A compression unit, disposed on the substrate and electrically connected to the sensor unit, for compressing the image signal; Wherein, the sensor unit and the compression unit are both arranged on one side of the substrate, an electrical connection portion is arranged on the substrate, and the sensor unit and the compression unit are electrically connected via the electrical connection portion; The electrical connection portion includes a first part and a second part, the first part is formed by setting a via hole on the substrate and filling the via hole with a conductive material, the second part is set at two ends of the first part, and the sensor unit and the compression unit are electrically connected to the first part through the second part.

2. The sensor assembly according to claim 1, characterized in that It also includes an image signal processing unit, the compression unit is integrated in the image signal processing unit, and the compression unit is electrically connected to the sensor unit through the image signal processing unit.

3. The sensor assembly according to claim 1 or 2, characterized in that: It also includes an image signal processing unit, and the compression unit is connected to the image signal processing unit.

4. The sensor assembly according to claim 3, characterized in that The image signal processing unit includes: at least one of an image distortion correction subunit, a white balance correction subunit, a color compensation subunit, an image noise reduction subunit and a high dynamic range subunit; The image distortion correction subunit is used to perform distortion correction on the image signal acquired by the sensor unit; the white balance correction subunit is used to perform white balance correction on the image signal acquired by the sensor unit; the color compensation subunit is used to perform color compensation on the image signal acquired by the sensor unit; the image noise reduction subunit is used to perform noise reduction on the image signal acquired by the sensor unit; and the high dynamic range subunit is used to adjust the dynamic range of the image signal acquired by the sensor unit.

5. The sensor assembly according to claim 1, characterized in that A temperature control unit is also included for controlling the temperatures of the sensor unit and the compression unit respectively.

6. The sensor assembly according to claim 1, characterized in that The substrate is a silicon connecting plate.

7. The sensor assembly according to claim 1, characterized in that The sensor unit includes an active pixel sensor and / or a dynamic vision sensor. The active pixel sensor is used to collect synchronous signals in the image signal, and the dynamic vision sensor is used to collect asynchronous signals in the image signal.

8. The sensor assembly according to claim 1, characterized in that It also includes an interface, which is used to adapt to an external docking device and output the processed image signal.

9. The sensor assembly according to claim 8, characterized in that The interface is a low voltage differential signal interface or a mobile industry processor interface.

10. An image signal processing system, characterized in that: A sensor assembly comprising any one of claims 1-9.

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