Display device

Abstract

A display device is provided, comprising a display area and a non-display area located peripherally of the display area. The display area includes a sensor area for an optical sensor and a non-sensor area. The display device includes: a substrate; a thin-film transistor (TFT) layer disposed over the entire surface of the substrate; and a light-emitting diode (LED) disposed on the TFT layer. The TFT layer includes at least one TFT. The thickness of the substrate in the sensor area is smaller than the thickness of the substrate in the non-sensor area.

Description

[0001] This patent application claims priority from Korean Patent Application No. 10-2019-0091190 filed on July 26, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a display device. Background Art

[0003] A flat panel display (FPD) is an electronic viewing technology used to enable people to see content (e.g., still or moving images). Compared to traditional cathode ray tube (CRT) displays, FPDs are lighter, thinner, and use less electricity. FPDs can include various display devices, such as liquid crystal displays (LCDs) and organic light emitting displays (OLEDs). Organic light emitting displays use organic light emitting diodes (OLEDs) that generate light through recombination between electrons and holes to display images. An organic light emitting display can include multiple transistors that provide a drive current to each OLED in a display area.

[0004] The bezel of a display device may refer to the non-display area surrounding the display area. Bezel-less display devices attempt to minimize or eliminate the non-display area. The size of the non-display area can be reduced by positioning the display device's sensors within the display area. However, sensors positioned within the display area do not receive as much light as sensors positioned within the non-display area. Summary of the Invention

[0005] At least one exemplary embodiment of the present disclosure provides a display device including a camera or a sensor positioned in a display area of ​​the display device, the camera or the sensor receiving a greater amount of light than cameras or sensors positioned in conventional display devices.

[0006] According to an exemplary embodiment of the present disclosure, a display device is provided, comprising a display area and a non-display area. The display area includes a sensor area for an optical sensor and a non-sensor area. The display device includes: a base portion; a thin-film transistor (TFT) layer including at least one TFT; and a light-emitting diode (LED) disposed on the TFT layer. The base portion is thinner in the sensor area than in the non-sensor area.

[0007] In an exemplary embodiment, the base portion includes: a first flexible substrate; a second flexible substrate facing the first flexible substrate; and a first barrier layer disposed between the first flexible substrate and the second flexible substrate.

[0008] In an exemplary embodiment, the first flexible substrate includes a through-hole that passes through the first flexible substrate in the sensor region in a thickness direction and exposes at least a portion of a bottom surface of the first barrier layer.

[0009] The display device may further include a sacrificial pattern disposed directly on a region of the bottom surface of the first barrier layer exposed by the through hole.

[0010] In an exemplary embodiment, the exposed at least portion of the bottom surface of the first barrier layer further includes a carbonized surface, and a roughness level of the bottom surface of the first barrier layer in the sensor region is greater than a roughness level of the bottom surface of the first barrier layer in the non-sensor region.

[0011] In an exemplary embodiment, the through hole also passes through at least a portion of the first barrier layer, and a thickness of the first barrier layer in the sensor region is smaller than a thickness of the first barrier layer in the non-sensor region.

[0012] The roughness level of the bottom surface of the first barrier layer in the sensor region may be greater than the roughness level of the bottom surface of the first barrier layer in the non-sensor region.

[0013] In an exemplary embodiment, the through-hole passes completely through the first barrier layer and exposes the bottom surface of the second flexible substrate.

[0014] In an exemplary embodiment, the exposed bottom surface of the second flexible substrate further includes a carbonized surface, and a roughness level of the bottom surface of the second flexible substrate in the sensor area is greater than a roughness level of the bottom surface of the second flexible substrate in the non-sensor area.

[0015] In an exemplary embodiment, the through hole also passes through at least a portion of the second flexible substrate, and a thickness of the second flexible substrate in the sensor region is smaller than a thickness of the second flexible substrate in the non-sensor region.

[0016] The roughness level of the bottom surface of the second flexible substrate in the sensor area may be greater than the roughness level of the bottom surface of the second flexible substrate in the non-sensor area.

[0017] In an exemplary embodiment, the display device further includes a second barrier layer disposed between the second flexible substrate and the TFT layer, and the through hole completely passes through the second flexible substrate and exposes at least a portion of a bottom surface of the second barrier layer.

[0018] In an exemplary embodiment, the display device further includes a sacrificial pattern disposed directly on the region of the bottom surface of the second barrier layer exposed by the through hole.

[0019] In an exemplary embodiment, the exposed bottom surface of the second barrier layer further includes a carbonized surface, and a roughness level of the bottom surface of the second barrier layer in the sensor region is greater than a roughness level of the bottom surface of the second barrier layer in the non-sensor region.

[0020] In an exemplary embodiment, the through hole also passes through at least a portion of the second barrier layer, and a thickness of the second barrier layer in the sensor region is smaller than a thickness of the second barrier layer in the non-sensor region.

[0021] In an exemplary embodiment, the TFT layer includes a semiconductor layer arranged on a base portion, a gate electrode arranged on the semiconductor layer, and source / drain electrodes arranged on the gate electrode and respectively connected to the semiconductor layer, wherein the display device further includes: a light-blocking metal layer arranged in a sensor area on the base portion.

[0022] The light-blocking metal layer may include a plurality of light-blocking metal patterns arranged to be spaced apart from each other.

[0023] A plurality of light-blocking metal patterns may overlap the semiconductor layer.

[0024] The light-blocking metal layer may include titanium (Ti) or molybdenum (Mo).

[0025] The base portion may further include burrs protruding from a periphery of the sensor region of the base portion.

[0026] In an exemplary embodiment, the sensor area and the non-sensor area each include a plurality of pixels, and the density of the pixels arranged in the sensor area is smaller than the density of the pixels arranged in the non-sensor area.

[0027] In an exemplary embodiment, the sensor area includes a pixel arrangement area and a transmission area, the pixels are arranged in the pixel arrangement area, the pixels are not arranged in the transmission area, wherein the conductive material is not provided in the transmission area.

[0028] According to an exemplary embodiment of the present disclosure, a display device is provided, comprising a display area and a non-display area. The display area includes a sensor area for an optical sensor and a non-sensor area. The display device includes a base portion; a TFT layer disposed over the entire surface of the base portion and including at least one TFT; and an LED disposed on the TFT layer. A through hole penetrates the surface of the base portion in the sensor area in the thickness direction.

[0029] In an exemplary embodiment, the display device further includes a barrier layer disposed between the base portion and the TFT layer; and a moisture permeation blocking pattern disposed between the base portion and the TFT layer, wherein the moisture permeation blocking pattern includes silicon oxynitride.

[0030] The moisture permeation blocking pattern may be disposed in the sensor region and overlap the sensor region.

[0031] In an exemplary embodiment, the display device further includes a barrier layer disposed between the base portion and the TFT layer, wherein the barrier layer further includes a groove protruding further than the barrier layer in a thickness direction in the non-sensor region.

[0032] The groove may include a plurality of groove patterns arranged in the periphery of the sensor area.

[0033] The groove may completely surround the sensor area in plan view. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present disclosure will become more apparent by describing in detail exemplary embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0035] Figure 1 is a perspective view of a display device according to a disclosed exemplary embodiment;

[0036] Figure 2 is an exploded perspective view of a display device according to a disclosed exemplary embodiment;

[0037] Figure 3 It is along Figure 2 A schematic cross-sectional view taken along line III-III';

[0038] Figure 4 is a schematic plan view showing a lower cover panel and a display panel;

[0039] Figure 5 is a schematic block diagram of a display device according to a disclosed exemplary embodiment;

[0040] Figure 6 is a layout diagram showing a semiconductor layer and a light-blocking metal pattern;

[0041] Figure 7 It is along Figure 4 a sectional view taken along line VIII-VIII';

[0042] Figure 8 It shows Figure 7 An enlarged view of region A;

[0043] Figure 9 is a cross-sectional view of a display panel according to a disclosed exemplary embodiment;

[0044] Figure 10 is a cross-sectional view of a display panel according to a disclosed exemplary embodiment;

[0045] Figure 11is a cross-sectional view of a display panel according to a disclosed exemplary embodiment;

[0046] Figure 12 is a cross-sectional view of a display panel according to a disclosed exemplary embodiment;

[0047] Figure 13 is a cross-sectional view of a display panel according to a disclosed exemplary embodiment;

[0048] Figure 14 is a cross-sectional view of a display panel according to a disclosed exemplary embodiment;

[0049] Figure 15 is a cross-sectional view of a display panel according to a disclosed exemplary embodiment;

[0050] Figure 16 is a cross-sectional view of a display panel according to a disclosed exemplary embodiment;

[0051] Figure 17 is a schematic plan view showing a lower cover panel and a display panel according to an exemplary embodiment of the disclosure;

[0052] Figure 18 is a schematic plan view of a lower cover panel and a display panel according to a disclosed exemplary embodiment;

[0053] Figure 19 According to the disclosed exemplary embodiments Figure 18 a cross-sectional view of a display panel;

[0054] Figure 20 is a cross-sectional view of a display panel according to a disclosed exemplary embodiment;

[0055] Figure 21 is a schematic plan view showing a lower cover panel and a display panel according to an exemplary embodiment of the disclosure;

[0056] Figure 22 According to the disclosed exemplary embodiments Figure 21 a cross-sectional view of a display panel;

[0057] Figure 23 is a cross-sectional view of a display panel according to a disclosed exemplary embodiment;

[0058] Figure 24 is a schematic plan view showing a lower cover panel and a display panel according to an exemplary embodiment of the disclosure;

[0059] Figure 25 According to the disclosed exemplary embodiments Figure 24 a cross-sectional view of a display panel;

[0060] Figure 26is a plan view showing a plurality of pixels arranged in a sensor area and a non-sensor area; and

[0061] Figure 27 It is along Figure 26 A cross-sectional view taken along line XXVII-XXVII'. DETAILED DESCRIPTION

[0062] The present invention and methods of achieving the same will become apparent with reference to the accompanying drawings, in which exemplary embodiments of the present invention are described in detail below. However, the present invention may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the present invention to those skilled in the art.

[0063] As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, the element or layer can be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. Like reference numerals refer to like elements throughout the specification.

[0064] Hereinafter, exemplary embodiments of the inventive concept will be described with reference to the accompanying drawings. Hereinafter, an organic light emitting display will be described as an example of a display device according to exemplary embodiments of the inventive concept.

[0065] Figure 1 is a perspective view of a display device according to an exemplary embodiment of the inventive concept, Figure 2 is an exploded perspective view of a display device according to an exemplary embodiment of the inventive concept, Figure 3 It is along Figure 2 A schematic cross-sectional view taken along line III-III' in FIG. Figure 4 is a schematic plan view showing a lower cover panel and a display panel.

[0066] In the specification, the terms "above", "top" and "top surface" indicate the direction along which the window 100 is set based on the display panel 300 to be described below (i.e., one side direction of the third direction DR3), and the terms "below", "bottom" and "bottom surface" indicate the direction along which the lower frame 500 is set based on the display panel 300 (i.e., the other side direction of the third direction DR3).

[0067] Reference Figures 1 to 4, a display device 1 according to an exemplary embodiment of the inventive concept includes: a window 100; a touch member 200, disposed below the window 100; a display panel 300, disposed below the touch member 200; a display circuit board 600, attached to the display panel 300; a display driving portion 610, disposed on the display circuit board 600; a lower cover panel 400, disposed below the display panel 300; a main circuit board 700, disposed below the lower cover panel 400 and including a second connector 750 physically connected to the first connector 630 of the display circuit board 600, an optical sensor 710 and a main driving portion 740 arranged on the main circuit board 700; and a lower frame 500.

[0068] The display device 1 may have a rectangular shape in a plane. Figure 1 and Figure 2 As shown in , the display device 1 may have a flat rectangular shape having long sides in a first direction DR1 and short sides in a second direction DR2. For example, the short sides may be shorter than the long sides. The corner where the long side in the first direction meets the short side in the second direction may be rounded with a certain curvature or formed at a right angle. The planar shape of the display device 1 is not limited to a rectangular shape and may be another polygonal shape, a circular shape, or an elliptical shape.

[0069] The window 100 may be disposed above the display panel 300 to cover the top surface of the display panel 300. Thus, the window 100 may function to protect the top surface of the display panel 300. The window 100 may be formed of glass, sapphire, and / or plastic. The window 100 may be rigid or flexible. For example, the window 100 may be formed of a transparent or translucent material.

[0070] The touch member 200 may be provided between the window 100 and the display panel 300. The touch member 200 is a device for sensing the position of the user's touch and may be implemented by a capacitive device (such as a self-capacitive device or a mutual-capacitive device). The touch member 200 may be formed to have a panel shape or a film shape. For example, the touch member 200 may have a flat rectangular shape. In addition, the touch member 200 may be formed integrally with the display panel 300. In this case, the touch drive electrodes and touch sensing electrodes of the touch member 200 may be formed on a thin encapsulation film of the display panel 300. Although not shown in the drawings, a touch circuit board including a touch drive portion electrically connected to the touch drive electrodes and touch sensing electrodes of the touch member 200 may be attached to one side of the touch member 200. The touch circuit board may be a flexible printed circuit board (FPCB). The touch drive portion may be formed as an integrated circuit.

[0071] For example, the display panel 300 may be implemented by an organic light-emitting display panel. Although the display panel 300 is described below as being implemented by an organic light-emitting display panel, the embodiments of the present disclosure are not limited thereto. For example, the display panel 300 may be implemented by other types of display panels (such as a liquid crystal display (LCD), a quantum dot organic light-emitting diode (QD-OLED) display panel, a QD-LCD, a quantum nano-light-emitting diode (LED), or a micro-LED).

[0072] The display panel 300 includes a display area DA and a non-display area NA, the display area DA includes a plurality of pixels displaying an image, and the non-display area NA is located in the periphery of the display area DA. In an exemplary embodiment, the display panel 300 includes a base portion, a TFT layer including a plurality of thin film transistors (TFTs) arranged on the base portion, an LED layer including an anode electrode electrically connected to the TFT layer, a cathode electrode facing the anode electrode, and an organic emission layer arranged between the anode electrode and the cathode electrode, and an encapsulation layer arranged on the LED layer. Each pixel may include a plurality of TFTs and a plurality of LEDs of the LED layer. When a voltage is applied to the anode electrode and the cathode electrode, holes and electrons are transferred to the organic emission layer through the hole transport layer and the electron transport layer, respectively, and combine with each other at the organic emission layer to emit light. The detailed cross-sectional shape of the display panel 300 will be described below.

[0073] The encapsulation layer is disposed on the LED layer. The encapsulation layer may prevent air (eg, oxygen) or moisture (eg, water) from penetrating through the LED layer. The encapsulation layer may include at least one inorganic film and at least one organic film.

[0074] The display circuit board 600 may be attached to one side of the display panel 300. In an exemplary embodiment, the display circuit board 600 is attached to a pad (also known as a "pad") provided on one side of the display panel 300 using an anisotropic conductive film. In an exemplary embodiment, the display circuit board 600 is attached to one side of the display panel 300 by ultrasonic bonding. The display driving unit 610 (e.g., a circuit) outputs signals and voltages for driving the display panel 300 through the display circuit board 600. The display driving unit 610 may be implemented by an integrated circuit and mounted on the display circuit board 600, but is not limited thereto. For example, the display driving unit 610 may be attached to one side of the top surface or bottom surface of the substrate of the display panel 300.

[0075] The lower cover panel 400 is disposed below the display panel 300. The lower cover panel 400 includes at least one functional layer. The functional layer may be a layer that performs a heat dissipation function, an electromagnetic wave blocking function, a grounding function, a buffering function, a reinforcement function, a support function, or a digitizing function. The functional layer may be a sheet layer formed by a sheet, a film layer formed by a film, a thin film layer, a coating, a panel, or a plate. A functional layer may be formed as a single layer, but may also be formed by a plurality of stacked thin films or coatings. The functional layer may be, for example, a support member, a heat dissipation layer, an electromagnetic wave blocking layer, a shock absorbing layer, or a digitizer.

[0076] The lower cover panel 400 includes a cable hole CAH through which the first connector 630 of the display circuit board 600 passes in the thickness direction, and a sensor hole SH that exposes the optical sensor 710 provided on the main circuit board 700. The lower cover panel 400 includes the sensor hole SH that exposes the optical sensor 710 so that the optical sensor 710 can be advanced toward the display surface. The cable hole CAH and the sensor hole SH may be through holes in the lower cover panel 400.

[0077] A main circuit board 700 physically connected to the display circuit board 600 may be disposed under the lower cover panel 400. A main driving part 740 (eg, a circuit) disposed on the main circuit board 700 may perform a function of controlling the display driving part 610 described above.

[0078] In an exemplary embodiment, a first optically transparent adhesive member AM1 is disposed between the window 100 and the touch member 200, a second optically transparent adhesive member AM2 is disposed between the touch member 200 and the display panel 300, and a third optically transparent adhesive member AM3 is disposed between the display panel 300 and the lower cover panel 400. Each of the optically transparent adhesive members AM1, AM2, and AM3 can bond adjacent members to one another. Each of the optically transparent adhesive members AM1, AM2, and AM3 can be implemented by at least one of an optically transparent adhesive film, an optically transparent adhesive tape, and an optically transparent resin. According to an exemplary embodiment of the inventive concept, each of the first and second optically transparent adhesive members AM1 and AM2 has a higher optical transparency than the third optically transparent adhesive member AM3. In this case, when the display device 1 is a top-emitting display device, the optical transparency of light emitted from the display panel 300 toward the display surface can be improved.

[0079] However, the present disclosure is not limited thereto, as in an alternative embodiment, each of the first optically transparent adhesive member AM1 and the second optically transparent adhesive member AM2 may have an optical transparency equal to that of the third optically transparent adhesive member AM3.

[0080] In an exemplary embodiment, as Figure 2 and Figure 3 As shown in FIG, the optical sensor 710 includes a light emitting portion 720 and a light receiving portion 730. The light emitting portion 720 emits sensor light SL in an upward direction through the sensor hole SH of the lower cover panel 400. The sensor light SL emitted from the light emitting portion 720 may pass through the upper structure (including the display panel 300, the touch member 200, and the window 100) and contact an object, and at least a portion of the sensor light SL may be reflected from the object and become incident on the light receiving portion 730.

[0081] In an exemplary embodiment, the optical sensor 710 is implemented by a facial recognition device, a fingerprint recognition device, an infrared camera, or a visible light camera using light. In one embodiment, the optical sensor 710 may be a camera device.

[0082] As described above, the sensor light SL emitted from the optical sensor 710 is emitted from the light emitting section 720, reflected by an object, and then incident on the light receiving section 730. Here, the light incident on the light receiving section 730 is recognized by the optical sensor 710, making it possible to determine the shape of the object. In other words, as the amount of sensor light SL emitted from the optical sensor 710 and the amount of incident sensor light SL increase, the clarity of the acquired image can be increased or the optical sensor 710 can operate more efficiently. In an exemplary embodiment, the light emitting section 720 is a light source such as an LED or an OLED, and the light receiving section 730 is a photodiode.

[0083] However, due to the upper structure, specifically, due to the material of the base portion of the display panel 300, a desired amount of sensor light SL emitted from the optical sensor 710 may not reach an object, or at least a portion of the sensor light SL reflected by the object may not be incident on the light receiving portion 730. According to the disclosed exemplary embodiments, the display device 1 has a shape in which the base portion of the display panel 300 penetrates into the region in which the optical sensor 710 is provided. For example, the shape of the base portion enables the light emitting portion 720 and the light receiving portion 730 to penetrate into the interior of the base portion.

[0084] Reference Figure 4 The display area DA of the display device 1 includes an optical sensor setting area SA (e.g., sensor area) and an optical sensor non-setting area NSA (e.g., non-sensor area), the optical sensor 710 is set in the optical sensor setting area SA, the optical sensor non-setting area NSA is set in the periphery of the optical sensor setting area SA, and the optical sensor 710 is not set in the optical sensor non-setting area NSA.

[0085] In addition, the display area DA may further include a light-blocking metal pattern placement region BMLP positioned to overlap the optical sensor placement region SA. In an exemplary embodiment, one or more light-blocking metal patterns described below are arranged in the light-blocking metal pattern placement region BMLP. The light-blocking metal patterns may be arranged to be spaced apart from each other.

[0086] Figure 5 is a schematic block diagram of a display device according to an exemplary embodiment.

[0087] Reference Figure 5 The display device 1 includes a display area DA including a plurality of pixels 10, a scan driving unit 20 (eg, a scan driving circuit or a gate driving circuit), a data driving unit 30 ( Figure 2 610 in the figure), the light emitting control driving section 40 (for example, a control circuit) and the control section 50 (for example, a timing controller or a control circuit). The control section 50 performs the function of controlling the scan driving section 20, the data driving section 30 and the light emitting control driving section 40. The control section 50 may be Figure 2 The data driving unit 30 may be a data driving circuit or a source driving circuit.

[0088] The display area DA includes a plurality of pixels 10, which are arranged in a matrix shape and are located at the intersections of a plurality of scanning lines SL11 to SL1n, SL21 to SL2n and SL31 to SL3n (n is greater than or equal to 2), a plurality of data lines DL1 to DLm (m is greater than or equal to 2), and a plurality of light-emitting control lines EL1 to ELn.

[0089] The plurality of scan lines SL11 to SL1n, SL21 to SL2n, and SL31 to SL3n, as well as the plurality of light-emission control lines EL1 to ELn, may extend in the row direction, and the plurality of data lines DL1 to DLm may extend in the column direction. The row and column directions may be switched. An initialization voltage supply line supplying the initialization voltage VINT may branch for each row and extend in the row direction, and a first power voltage supply line supplying the first power voltage ELVDD may branch for each column and extend in the column direction. However, the present disclosure is not limited thereto, and the extension directions of the initialization voltage supply lines and the first power voltage supply lines may be modified in various ways.

[0090] As an example, three scan lines SL11, SL21, and SL31, one data line DL1, one light emission control line EL1, one initialization power voltage supply line, and one first power voltage supply line may pass through pixels at the first row and first column. Corresponding lines may pass through other pixels.

[0091] The scan driving part 20 generates three scan signals and transmits the three scan signals to each pixel 10 through the plurality of scan lines SL11 to SL1n, SL21 to SL2n, and SL31 to SL3n. That is, the scan driving part 20 sequentially supplies the scan signals to the first scan lines SL11 to SL1n, the second scan lines SL21 to SL2n, and the third scan lines SL31 to SL3n.

[0092] The data driving part 30 transmits a data signal to each pixel 10 through the plurality of data lines DL1 to DLm. Whenever a second scan signal is supplied through the first scan lines SL11 to SL1n, the data signal is supplied to the pixel 10 selected by the second scan signal.

[0093] The light emission control driving section 40 generates a light emission control signal and transmits the light emission control signal to each pixel 10 through a plurality of light emission control lines EL1 to ELn. The light emission control signal controls the light emission time of the pixel 10. The light emission control driving section 40 may be omitted depending on the internal structure of the pixel 10 or when the scan driving section 20 generates both the scan signal and the light emission control signal.

[0094] The control section 50 may receive a plurality of image signals R, G, and B from the outside, and convert the received image signals into a plurality of image data signals DR, DG, and DB for transmission to the data driving section 30. The control section 50 may receive a vertical synchronization signal Vsync, a horizontal synchronization signal Hsync, and a clock signal MCLK, and generate control signals for controlling the driving of the scan driving section 20, the data driving section 30, and the light emission control driving section 40, and transmit the control signals to each of the scan driving section 20, the data driving section 30, and the light emission control driving section 40. That is, the control section 50 generates and transmits a scan driving control signal SCS for controlling the scan driving section 20, a data driving control signal DCS for controlling the data driving section 30, and a light emission driving control signal ECS for controlling the light emission control driving section 40.

[0095] Each of the plurality of pixels 10 receives a first power voltage ELVDD and a second power voltage ELVSS. The first power voltage ELVDD may be a certain high level voltage, and the second power voltage ELVSS may be a voltage lower than the first power voltage ELVDD.

[0096] Each of the plurality of pixels 10 emits light having a certain brightness level due to a driving current of a light source (eg, LED) supplied to the corresponding pixel according to a data signal transmitted through the plurality of data lines DL1 to DLm.

[0097] The first power voltage ELVDD, the second power voltage ELVSS, and the initialization voltage VINT may be supplied from an external voltage source (eg, a voltage generator).

[0098] Figure 6 is a layout diagram showing a semiconductor layer and a light-blocking metal pattern. Figure 6 A layout diagram illustrating a pixel semiconductor layer and a light-blocking metal pattern arranged in an optical sensor disposition area SA of a display panel 300 according to an exemplary embodiment of the inventive concept is shown.

[0099] The pixel 10 of the display device 1 according to the embodiment may include at least one transistor. The at least one transistor may include, for example, first to seventh transistors T1 to T7. For example, the first transistor T1 may be a driving transistor, and the second to seventh transistors T2 to T7 may be switching transistors.

[0100] The semiconductor layer ACT may form channels of the transistors T1 to T7. The semiconductor layer ACT may be separated for each pixel. The semiconductor layer ACT may have a specific pattern in a plane. In an exemplary embodiment, the semiconductor layer ACT is formed integrally. In an exemplary embodiment, the semiconductor layer ACT may be formed to be arranged on multiple layers, but is not limited thereto. The semiconductor layer ACT may include a first semiconductor layer ACT1 serving as a channel of the first transistor T1, a second semiconductor layer ACT2 serving as a channel of the second transistor T2, a third semiconductor layer ACT3 serving as a channel of the third transistor T3, a fourth semiconductor layer ACT4 serving as a channel of the fourth transistor T4, a fifth semiconductor layer ACT5 serving as a channel of the fifth transistor T5, a sixth semiconductor layer ACT6 serving as a channel of the sixth transistor T6, and a seventh semiconductor layer ACT7 serving as a channel of the seventh transistor T7.

[0101] like Figure 6 As shown in FIG, the semiconductor layers ACT1 to ACT7 may include a first longitudinal portion and a second longitudinal portion extending substantially in the column direction, a transverse portion extending substantially in the row direction, and a bent portion (e.g., a bent portion) extending from the second longitudinal portion in the column direction. The first longitudinal portion, the second longitudinal portion, the transverse portion, and the bent portion may be physically connected to each other.

[0102] The first longitudinal portion may be arranged adjacent to the left side of the pixel, and the second longitudinal portion may be arranged adjacent to the right side of the pixel. The first longitudinal portion and the second longitudinal portion may be arranged to be spaced apart from each other. The transverse portion may connect the middle portion between the first longitudinal portion and the second longitudinal portion. In the specification, the term "upper portion" of the first longitudinal portion and the second longitudinal portion may refer to a portion located above the portion connected to the transverse portion in a plane, and the term "lower portion" may refer to a portion located below the portion connected to the transverse portion in a plane. The planar shape of the semiconductor layer ACT may have a shape approximately similar to "H".

[0103] The second semiconductor layer ACT2 may be disposed at the upper portion of the first longitudinal portion, and the fifth semiconductor layer ACT5 may be disposed at the lower portion of the first longitudinal portion. The sixth semiconductor layer ACT6 may be disposed at the upper and lower portions of the second longitudinal portion. The fourth semiconductor layer ACT4 may be disposed at the upper portion of the sixth semiconductor layer ACT6. The first semiconductor layer ACT1 may be disposed at the transverse portion.

[0104] The curved portion of the semiconductor layer ACT may include a first sub-transverse portion formed along the left row direction, a first sub-longitudinal portion formed along the upper row direction of the first sub-transverse portion, a second sub-transverse portion formed along the right row direction of the first sub-longitudinal portion, and a second sub-longitudinal portion formed along the lower row direction of the second sub-transverse portion. The seventh semiconductor layer ACT7 may be disposed in the first sub-transverse portion, and the third semiconductor layer ACT3 may be disposed in the first, second, and second sub-longitudinal portions.

[0105] The semiconductor layer ACT may include polycrystalline silicon. Polycrystalline silicon may be formed by crystallizing amorphous silicon. The crystallization method may include, for example, a rapid thermal annealing (RTA) method, a solid phase crystallization (SPC) method, an excimer laser annealing (ELA) method, a metal induced crystallization (MIC) method, a metal induced lateral crystallization (MILC) method, or a sequential lateral solidification (SLS) method, but is not limited thereto. As another example, the semiconductor layer ACT may include single crystal silicon, low temperature polycrystalline silicon, or amorphous silicon.

[0106] In the case of a p-type metal oxide semiconductor (PMOS) field effect transistor, a portion (source / drain region) of the semiconductor layer ACT connected to the source / drain electrodes of each of the transistors T1 to T7 may be doped with p-type impurity ions. A trivalent dopant such as boron (B) may be used as the p-type impurity ions. The semiconductor layer ACT may be a channel region of each of the transistors T1 to T7.

[0107] In another embodiment, the semiconductor layer ACT may be an oxide semiconductor. When the semiconductor layer ACT is formed of an oxide semiconductor, a material such as indium gallium zinc oxide (IGZO), zinc tin oxide (ZTO), or indium zinc oxide (IZO) may be used.

[0108] The light-blocking metal pattern BML can be set Figure 4 The light-blocking metal pattern is provided in the BMLP area.

[0109] In an exemplary embodiment, the light-blocking metal pattern BML is not provided on the entire surface of the substrate, but is provided on a portion of the entire surface of the substrate. As described above, the light-blocking metal pattern BML is provided only in the sensor area SA of the display panel 300, and not in the non-sensor area NSA. In other words, the light-blocking metal pattern area BMLP may be provided to overlap with the sensor area SA of the display panel 300.

[0110] The light-blocking metal pattern BML may be disposed so as to substantially overlap the semiconductor layer ACT disposed in the sensor area SA in a thickness direction. That is, the light-blocking metal pattern BML may have a planar shape substantially equal to that of the semiconductor layer ACT disposed in the sensor area SA. In an exemplary embodiment, a process for manufacturing the light-blocking metal pattern BML is performed using a mask having the same pattern as that of the semiconductor layer ACT disposed in the sensor area SA.

[0111] In an exemplary embodiment, the light-blocking metal pattern BML has a planar size larger than that of the semiconductor layer ACT disposed in the sensor area SA. That is, the light-blocking metal pattern BML may be disposed to cover the semiconductor layer ACT disposed in the sensor area SA in a thickness direction and also extend outward.

[0112] The light-blocking metal pattern BML is disposed to overlap the semiconductor layer ACT disposed in the sensor area SA so that light emitted from the light emitting part 720 of the optical sensor 710 and light incident on the light receiving part 730 may be prevented from entering the semiconductor layer ACT.

[0113] The light-blocking metal pattern BML may include at least one selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The light-blocking metal pattern BML may be a single layer or a multilayer. For example, the light-blocking metal pattern BML may have a stacked structure such as Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, or Ti / Cu.

[0114] In an exemplary embodiment, the light-blocking metal pattern BML includes Ti or Mo. When the light-blocking metal pattern BML according to an exemplary embodiment includes Ti, moisture or water flowing through the through hole may be easily absorbed. When the light-blocking metal pattern BML includes Ti, the light-blocking metal pattern BML may be formed by oxidizing Ti (TiO x ) in the form of .

[0115] Hereinafter, a more detailed cross-sectional structure of the display panel 300 will be described.

[0116] Figure 7 It is along Figure 4 A sectional view taken along line VIII-VIII', Figure 8 It shows Figure 7 Magnified view of area A.

[0117] Reference Figure 7 and Figure 8 The display panel 300 includes a base portion 301, a TFT layer 320 including first to seventh TFTs T1 to T7 arranged on the base portion 301, an LED layer 340 disposed on the TFT layer 320, and an encapsulation layer 360 disposed on the LED layer 340. Although the TFT layer 320 is described as including seven TFTs, the disclosed embodiments are not limited thereto, as a smaller number of TFTs may be present.

[0118] In an exemplary embodiment, the base portion 301 of the display panel 300 is disposed over the sensor area SA and the non-sensor area NSA.

[0119] The base portion 301 of the display panel 300 includes a first supporting substrate 302 or a first flexible substrate, a second supporting substrate 304 or a second flexible substrate arranged on the first supporting substrate 302, and a first barrier layer 303 arranged between the first supporting substrate 302 and the second supporting substrate 304. The first supporting substrate 302 and the second supporting substrate 304 can be flexible substrates as described above. For example, the first supporting substrate 302 and the second supporting substrate 304 can each be a film substrate and a plastic substrate including a polymer organic material. For example, the first supporting substrate 302 and the second supporting substrate 304 can include one of polystyrene, polyvinyl alcohol, poly(methyl methacrylate), polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate. In addition, the base portion 301 may include fiberglass reinforced plastic (FRP). In an exemplary embodiment, the first supporting substrate 302 and the second supporting substrate 304 include polyimide. Polyimide typically appears yellow to the naked eye. When optical sensor 710 emits light within the visible wavelength range, or ultraviolet or infrared wavelengths close to the visible wavelength range, or when light reflected by an object is within the corresponding wavelength range, light within the blue wavelength range is absorbed. This can degrade the functionality of optical sensor 710.

[0120] The first barrier layer 303 is disposed between the first supporting substrate 302 and the second supporting substrate 304. The first barrier layer 303 can bond the first supporting substrate 302 and the second supporting substrate 304 and can planarize the first supporting substrate 302 and the second supporting substrate 304, which are composed of organic materials. The first barrier layer 303 may include an inorganic material. The first barrier layer 303 may include multiple stacked films. For example, the first barrier layer 303 may include two stacked films. In an exemplary embodiment, the first barrier layer 303 is entirely composed of an inorganic material.

[0121] In an exemplary embodiment, the first barrier layer 303 is disposed on the first supporting substrate 302 throughout the sensor area SA and the non-sensor area NSA. The first barrier layer 303 has a first thickness t1.

[0122] In an exemplary embodiment, the second support substrate 304 is disposed over the sensor area SA and the non-sensor area NSA on the first support substrate 302. The second support substrate 304 has a second thickness t2. In an exemplary embodiment, the second thickness t2 is greater than the first thickness t1.

[0123] The display panel 300 further includes a second barrier layer 311 disposed between the base portion 301 and the TFT layer 320. In an embodiment, the second barrier layer 311 includes an inorganic material. In an embodiment, the second barrier layer 311 is entirely an inorganic material.

[0124] The light-blocking metal pattern BML of the display panel 300 is disposed between the second barrier layer 311 and the TFT layer 320. An insulating interlayer 312 may be further disposed on the light-blocking metal pattern BML. A semiconductor layer ACT may be disposed on the insulating interlayer 312.

[0125] Reference Figure 8 , the TFT layer 320 includes Figure 6 , a semiconductor layer ACT, a gate insulating film 321 arranged on the semiconductor layer ACT, gate electrodes GE of TFTs T1 to T7 arranged on the gate insulating film 321, an insulating interlayer film 322 arranged on the gate electrode GE, and a source electrode SE and a drain electrode DE arranged on the insulating interlayer film 322.

[0126] The source electrode SE and the drain electrode DE may be electrically connected to the source region and the drain region of the semiconductor layer ACT through the contact holes, respectively.

[0127] The above-mentioned gate electrode GE, source electrode SE, and drain electrode DE may form three terminals of the TFTs among the TFTs T1 to T7 .

[0128] The first via layer VIA1 is provided on the source electrode SE, the drain electrode DE and the insulating interlayer film 322. The first via layer VIA1 is provided to cover the TFT layer 320 including the TFTs T1 to T7. The first via layer VIA1 may be a planarization film. The planarization film may include materials such as acrylic resin and polyimide.

[0129] The LED layer 340 is disposed on the first via layer VIA1. The LED layer 340 may include multiple LEDs arranged for each pixel. The LED layer may include an anode electrode ANO, a cathode electrode CAT, and an organic emission layer EL disposed between the anode electrode ANO and the cathode electrode CAT. The multiple anode electrodes ANO are disposed on the first via layer VIA1. A given anode electrode ANO may be a pixel electrode of a corresponding pixel in the pixel.

[0130] The anode electrode ANO may be electrically connected to the drain electrode DE (or the source electrode SE) through a through hole passing through the first via layer VIA1 .

[0131] The anode electrode ANO may include a material with a high work function. The anode electrode ANO may include a conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium oxide (In2O3). The above-mentioned conductive materials of the examples may have a relatively high work function and be transparent. When the OLED display device is a top emission type device, in addition to the conductive materials of the examples, the anode electrode ANO may include a reflective material such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), Ca or a mixture thereof. Therefore, the anode electrode ANO may have a single-layer structure formed by the conductive material and the reflective material of the examples or a multilayer structure formed by the stack of the conductive material and the reflective material of the examples.

[0132] The pixel-defining film BNK is disposed on the anode electrode ANO. The pixel-defining film BNK includes an opening that exposes at least a portion of the anode electrode ANO. The pixel-defining film BNK may include an organic material or an inorganic material. In an exemplary embodiment, the pixel-defining film BNK includes a material such as a photoresist, a polyimide resin, an acrylic resin, a silicon compound, or a polyacrylic resin.

[0133] The organic emission layer EL is provided on the portion of the anode electrode ANO exposed by the pixel defining film BNK. The organic emission layer EL may be a color light-emitting layer that emits a specific color. For example, the organic emission layer EL may include a red light-emitting layer that emits red light, a green light-emitting layer that emits green light, or a blue light-emitting layer that emits blue light. A color light-emitting layer may be provided for each pixel.

[0134] In an exemplary embodiment, the organic emission layer EL is formed integrally with the Figure 8 The organic emission layer EL shown in FIG. 1 is different from the organic emission layer EL shown in FIG. That is, the organic emission layer EL can be formed integrally without differentiation between pixels. The organic emission layer EL may include a color light-emitting layer that emits one color. For example, the organic emission layer EL may be a blue light-emitting layer that emits blue light. In this case, a wavelength conversion pattern may also be arranged above the organic emission layer EL to convert the color of light emitted from the organic emission layer EL.

[0135] The cathode electrode CAT is provided on the organic emission layer EL. The cathode electrode CAT may be a common electrode provided everywhere without distinction between pixels. The cathode electrode CAT may comprise a material having a low work function. The cathode electrode CAT may comprise Li, Ca, LiF / Ca, LiF / Al, Al, Mg, Ag, Pt, Pd, Ni, Au, Nd, Ir, Cr, BaF, Ba, and mixtures or mixtures thereof (e.g., a mixture of Ag and Mg). The cathode electrode CAT may further comprise an auxiliary electrode. The auxiliary electrode may comprise a film formed by depositing a transparent metal oxide such as ITO, IZO, ZnO, or ITZO.

[0136] When the display device 1 is a top emission type device, a conductive layer having a low work function may be formed as a thin film and a transparent conductive film such as an ITO layer, an IZO layer, a ZnO layer, or an In2O3 layer may be stacked thereover.

[0137] Although not shown, a hole injection layer and / or a hole transport layer may be disposed between the anode electrode ANO and the organic emission layer EL, and an electron transport layer and / or an electron injection layer may be disposed between the organic emission layer EL and the cathode electrode CAT.

[0138] The encapsulation layer 360 is disposed on the LED layer 340. The encapsulation layer 360 includes at least one inorganic layer and at least one organic layer. The at least one inorganic layer and the at least one organic layer may be stacked on each other. For example, Figure 8 As shown in FIG, the encapsulation layer 360 may be formed of a multilayer film including a first encapsulation inorganic layer 361, an encapsulation organic layer 362, and a second encapsulation inorganic layer 363 stacked sequentially. Here, the first encapsulation inorganic layer 361 and the second encapsulation inorganic layer 363 may include a silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiON x ), the encapsulation organic layer 362 may include any one selected from the group consisting of epoxy resin, acrylate and urethane acrylate.

[0139] Return to reference Figure 7In the first supporting substrate 302, the thickness of the sensor area SA is smaller than the thickness of the non-sensor area NSA. The first supporting substrate 302 includes a through hole extending through the first supporting substrate 302 from its surface in the sensor area SA in the thickness direction. There may be multiple such through holes, but for ease of description, a single through hole will be described.

[0140] The first barrier layer 303 includes a top surface facing the second supporting substrate 304 and a bottom surface 303a located on a surface opposite to the top surface. The second supporting substrate 304 includes a bottom surface 304a facing the top surface of the first barrier layer 303 and a top surface located on a surface opposite to the bottom surface 304a. The second barrier layer 311 located above the second supporting substrate 304 includes a bottom surface 311a facing the top surface of the second supporting substrate 304 and a top surface opposite to the bottom surface 311a of the second barrier layer 311.

[0141] The through-holes of the first supporting substrate 302 may pass through the surface of the first supporting substrate 302 in the thickness direction and may completely pass through the first supporting substrate 302. As a result, the bottom surface 303a of the first barrier layer 303 located on the first supporting substrate 302 may be exposed. For example, a portion of the first supporting substrate 302 in the sensor area SA may be removed to expose the bottom surface 303a of the first barrier layer 303.

[0142] The through-holes in the sensor area SA of the first supporting substrate 302 can be formed using a laser. The laser can be, but is not limited to, an ultraviolet laser within the ultraviolet laser wavelength range. When the through-holes in the first supporting substrate 302 are formed using an ultraviolet laser, burrs may form in the non-sensor area NSA of the first supporting substrate 302 adjacent to the sensor area SA due to the heat energy generated by the ultraviolet laser in adjacent portions. The burrs on the first supporting substrate 302 may protrude from the surface of the first supporting substrate 302. For example, the burrs may be bumps or protrusions.

[0143] As described above, when polyimide is applied to the first supporting substrate 302, it appears yellow to the naked eye. Here, when the light emitted by the optical sensor 710 is within the visible wavelength range, or ultraviolet wavelengths or infrared wavelengths close to the visible wavelength range, or when the light reflected by an object is within such a wavelength range, light within the blue wavelength range is absorbed. This can lead to degradation of the function of the optical sensor 710.

[0144] Furthermore, due to the base portion 301 of the display panel 300 , a desired amount of sensor light SL emitted from the optical sensor 710 may not reach an object, or at least a portion of the sensor light SL reflected by the object may not be incident on the light receiving part 730 .

[0145] However, in the display panel 300 according to an exemplary embodiment of the inventive concept, a through hole is provided in the sensor area SA in which the optical sensor 710 is provided, which passes through the first supporting substrate 302 from the surface thereof in the thickness direction, so that the function of the optical sensor 710 can be prevented from being deteriorated due to the material of the first supporting substrate 302, or a desired amount of sensor light SL emitted from the optical sensor 710 is prevented from failing to reach an object, or at least a portion of the sensor light SL reflected by the object is prevented from failing to be incident on the light receiving portion 730. That is, the amount of emitted sensor light SL and the amount of incident sensor light SL are improved not only to increase the clarity of an acquired image but also to provide a more effective function of the optical sensor 710.

[0146] Hereinafter, a display device according to an exemplary embodiment of the inventive concept will be described. In the following embodiments, components identical to those of the above-described embodiments will be denoted by the same reference numerals, and descriptions thereof will be omitted or simplified.

[0147] Figure 9 is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept.

[0148] Reference Figure 9 The display panel 300_1 according to the embodiment differs from the display panel 300 according to the embodiment in that the bottom surface 303a_1 of the first barrier layer 303_1 of the base portion 301_1 includes a first portion 303a1 having a first roughness level and a second portion 303a2 having a second roughness level greater than the first roughness level.

[0149] In the display panel 300_1 according to the embodiment, the bottom surface 303a_1 of the first barrier layer 303_1 of the base portion 301_1 includes a first portion 303a1 having a first roughness level and a second portion 303a2 having a second roughness level greater than the first roughness level.

[0150] The first portion 303a1 is disposed in the non-sensor area NSA and overlaps the first supporting substrate 302 thereunder, while the second portion 303a2 is disposed in the sensor area SA. The second portion 303a2 may be disposed so as to overlap the through-hole. For example, the second portion 303a2 may be exposed while the first portion 303a1 is covered by the first supporting substrate 302. In an exemplary embodiment, the second portion 303a2 has the same thickness as the first portion 303a1.

[0151] The second portion 303a2 may include a carbonized surface. Since a carbonized surface may appear on the surface of the second portion 303a2 due to laser light emitted from the ultraviolet laser device when the through hole is formed as described above, the second portion 303a2 may have a roughness level higher than that of the first portion 303a1.

[0152] In the display panel 300_1 according to the embodiment, a through hole is provided that passes through the first supporting substrate 302 from the surface thereof in the thickness direction in the sensor area SA in which the optical sensor 710 is provided, so that the function of the optical sensor 710 can be prevented from being deteriorated due to the material of the first supporting substrate 302, or a desired amount of sensor light SL emitted from the optical sensor 710 can be prevented from failing to reach an object, or at least a portion of the sensor light SL reflected by the object can be prevented from failing to be incident on the light receiving portion 730. That is, the amount of emitted sensor light SL and the amount of incident sensor light SL are improved not only to increase the clarity of an acquired image but also to provide a more effective function of the optical sensor 710.

[0153] Figure 10 is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept.

[0154] Reference Figure 10 , the display panel 300_2 according to the embodiment and Figure 9 The display panel 300_1 is different in that the first barrier layer 303_2 of the base portion 301_2 has different thicknesses in the sensor area SA and the non-sensor area NSA.

[0155] The through hole may be formed to penetrate into the interior of the first barrier layer 303_2. In an exemplary embodiment, the second portion 303a2_1 of the bottom surface 303a_2 of the first barrier layer 303_2 is located closer to the second supporting substrate 304 than the first portion 303a1. That is, the second portion 303a2_1 may penetrate upward.

[0156] In an exemplary embodiment, the first barrier layer 303_2 has a smaller thickness in the sensor area SA than in the non-sensor area NSA. For example, the first barrier layer 303_2 may be thinner in the sensor area SA and thicker in the non-sensor area NSA. That is, the first barrier layer 303_2 may have an 11th thickness t11 in the sensor area SA that is thinner than the first thickness t1 in the non-sensor area NSA.

[0157] Figure 11 is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept.

[0158] Reference Figure 11, the display panel 300_3 according to the embodiment and Figure 10 The display panel 300_2 is different in that the through hole of the base portion 301_3 completely passes through the first barrier layer 303_3 and the bottom surface 304 a_1 of the second support substrate 304_1 is exposed.

[0159] In the display panel 300_3 according to the embodiment, the through hole of the base portion 301_3 may completely penetrate the first barrier layer 303_3, so that the bottom surface 304a_1 of the second supporting substrate 304_1 may be exposed. For example, a portion of the first supporting substrate 302 in the sensor area SA and a portion of the first barrier layer 303_3 in the sensor area SA may be removed to expose the second supporting substrate 304_1.

[0160] The bottom surface 304 a_1 of the second supporting base 304_1 includes a first portion 304 a 1 and a second portion 304 a 2 having a roughness level higher than that of the first portion 304 a 1 .

[0161] The first portion 304a1 is disposed in the non-sensor area NSA and overlaps the first supporting substrate 302 thereunder, and the second portion 304a2 is disposed in the sensor area SA. The second portion 304a2 may be disposed to overlap the through hole.

[0162] Figure 12 is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept.

[0163] Reference Figure 12 , the display panel 300_4 according to the embodiment and Figure 11 The display panel 300_3 is different in that the second supporting substrate 304_2 of the base portion 301_4 has different thicknesses in the sensor area SA and the non-sensor area NSA.

[0164] The through hole may be formed to also penetrate into the interior of the second supporting substrate 304_2. The second portion 304a2_1 of the bottom surface 304a_2 of the second supporting substrate 304_2 may be located closer to the second barrier layer 311 than the first portion 304a1. That is, the second portion 304a2_1 may also penetrate upward.

[0165] The second supporting substrate 304_2 may have a smaller thickness in the sensor area SA than in the non-sensor area NSA. For example, the second supporting substrate 304_2 may be thinner in the sensor area SA and thicker in the non-sensor area NSA. That is, the 21st thickness t21 of the second supporting substrate 304_2 in the sensor area SA is smaller than the second thickness t2 of the second supporting substrate 304_2 in the non-sensor area NSA.

[0166] Figure 13 is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept.

[0167] Reference Figure 13 , the display panel 300_5 according to the embodiment and Figure 12 The display panel 300_4 is different in that the through hole of the base portion 301_5 completely passes through the second supporting substrate 304_3 , and the bottom surface 311 a of the second barrier layer 311 is exposed.

[0168] In the display panel 300_5 according to the embodiment, the through hole of the base portion 301_5 may completely penetrate the second supporting substrate 304_3, so that the bottom surface 311a of the second barrier layer 311 may be exposed. For example, the first supporting substrate 302, the first barrier layer 303_3, and the second supporting substrate 304_3 may be removed in the sensor area SA to expose the second barrier layer 311.

[0169] Figure 14 is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept.

[0170] Reference Figure 14 , in the display panel 300_6 according to the embodiment, the bottom surface 311a_1 of the second barrier layer 311_1 includes a first portion 311a1 and a second portion 311a2 having a roughness level higher than that of the first portion 311a1.

[0171] The first portion 311a1 is disposed in the non-sensor area NSA and overlaps the first support substrate 302 thereunder, and the second portion 311a2 is disposed in the sensor area SA. The second portion 311a2 may be disposed to overlap the through hole. Figure 14 The display panel 300_6 and Figure 13 The display panel 300_5 is similar to the display panel 300_5, but the exposed bottom surface 311a_1 of the second barrier layer 311_1 is rougher than the exposed bottom surface 311a of the second barrier layer 311. In an exemplary embodiment, the thickness of the second portion 311a2 is the same as the thickness of the first portion 311a1.

[0172] Figure 15 is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept.

[0173] Reference Figure 15 , the display panel 300_7 according to the embodiment and Figure 14 The display panel 300_6 is different in that the second barrier layer 311_2 has different thicknesses in the sensor area SA and the non-sensor area NSA.

[0174] The through hole may be formed to penetrate into the interior of the second barrier layer 311_2. The second portion 311a2_1 of the bottom surface 311a_2 of the second barrier layer 311_2 may be located closer to the TFT layer 320 than the first portion 311a1. That is, the second portion 311a2_1 may penetrate upward.

[0175] The second barrier layer 311_2 may have a smaller thickness in the sensor area SA than in the non-sensor area NSA. For example, the second barrier layer 311_2 may be thinner in the sensor area SA and thicker in the non-sensor area NSA. That is, the second barrier layer 311_2 may have a 31st thickness t31 in the sensor area SA that is thinner than the third thickness t3 in the non-sensor area NSA.

[0176] Figure 16 is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept.

[0177] Reference Figure 16 , the display panel 300_8 according to the embodiment and Figure 13 The display panel 300_5 is different in that the sacrificial layer residue SPL is disposed on the bottom surface 311a of the second barrier layer 311. Figure 16 , it is shown that the sacrificial layer remains as a residue after the process of forming a through hole.

[0178] In the display panel 300_8 according to the embodiment, the sacrificial layer residue SPL is disposed on the bottom surface 311 a of the second barrier layer 311 .

[0179] A sacrificial layer may be provided between the second supporting substrate 304_3 and the second barrier layer 311 during the process of forming the through hole to not only prevent the light-blocking metal pattern BML and the TFT layer 320 formed thereon from being damaged by the ultraviolet laser, but also allow the material included in the second supporting substrate 304_3, the material included in the first barrier layer 303_3, and the material included in the first supporting substrate 302 that are cut by the ultraviolet laser to be easily removed from the bottom surface 311a of the second barrier layer 311.

[0180] Sacrificial layer residue SPL Figure 16 is shown as being disposed only on the bottom surface 311a of the second barrier layer 311, but Figure 7 In an exemplary embodiment, the sacrificial layer residue SPL may be disposed on the bottom surface 303a of the first barrier layer 303. In exemplary embodiments, the sacrificial layer residue SPL includes a plurality of layers or regions spaced apart from each other in the sensor area SA.

[0181] Figure 17 is a schematic plan view illustrating a lower cover panel and a display panel according to an exemplary embodiment of the inventive concept.

[0182] Reference Figure 17 , the display device 2 according to the embodiment and Figure 4 The display device 1 is different in that the light-blocking metal pattern placement region BMLP is provided to extend over the entire surface of the display panel 300. That is, the light-blocking metal pattern BML provided in the light-blocking metal pattern placement region BMLP is provided over the entire surface of the display panel 300. For example, the light-blocking metal pattern BML may completely overlap the display area DA and the non-display area NA.

[0183] Figure 18 is a schematic plan view illustrating a lower cover panel and a display panel according to an exemplary embodiment of the inventive concept, Figure 19 According to an exemplary embodiment of the inventive concept Figure 18 A cross-sectional view of a display panel.

[0184] Reference Figure 18 and Figure 19 The display panel 300_9 of the display device 3 according to the embodiment is different from the display panel 300 of the display device 1 according to the embodiment in that a moisture permeation blocking pattern HPB overlapping the sensor area SA is further provided.

[0185] In the display panel 300_9 of the display device 3 according to the embodiment, a moisture permeation blocking pattern HPB overlapping the sensor area SA is further provided.

[0186] In an exemplary embodiment, the moisture permeation blocking pattern HPB has an area larger than that of the sensor area SA in a plane. That is, the moisture permeation blocking pattern HPB may be provided to extend to the sensor area SA and to a portion of the non-sensor area NSA adjacent to the sensor area SA. For example, the moisture permeation blocking pattern HPB may completely surround the sensor area SA and also extend into only a portion of the non-sensor area NSA.

[0187] The moisture permeation blocking pattern HPB may be disposed on the top surface of the second barrier layer 311. In an exemplary embodiment, the moisture permeation blocking pattern HPB is disposed between the second barrier layer 311 and the light-blocking metal pattern BML. For example, the moisture permeation blocking pattern HPB may directly contact the second barrier layer 311.

[0188] In an embodiment, the moisture permeation blocking pattern HPB includes silicon oxynitride (SiO x N y ). When SiO x or SiN xWhen applied to the second barrier layer 311 disposed under the moisture permeation blocking pattern HPB, the moisture permeation blocking pattern HPB preferably has a small difference in refractive index. Here, the moisture permeation blocking pattern HPB according to the embodiment includes SiO x N y , thereby not only reducing the refractive index difference with the second barrier layer 311 disposed thereunder, but also preventing moisture or water from flowing in through the through holes.

[0189] Figure 20 is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept.

[0190] Reference Figure 20 , the display panel 300_10 according to the embodiment and Figure 19 The display panel 300_9 is different in that the moisture permeation blocking pattern HPB is disposed between the second barrier layer 311 and the second supporting substrate 304 .

[0191] In the display panel 300_10, the moisture permeation blocking pattern HPB is disposed between the second barrier layer 311 and the second supporting substrate 304. The moisture permeation blocking pattern HPB may be directly disposed on the top surface of the second supporting substrate 304. Figure 18 and Figure 19 Other descriptions have been described, so repeated descriptions will be omitted. In an exemplary embodiment, the upper surface of the second barrier layer 311 in the sensor area SA is closer to the bottom surface of the LED layer 340 than the first portion of the upper surface of the second barrier layer 311 in the non-sensor area NSA. The second other portion of the upper surface of the second barrier layer 311 in the non-sensor area NSA (between the first portion and the upper surface of the second barrier layer 311 in the sensor area SA) may be the same distance from the bottom surface of the LED layer 340 as the upper surface of the second barrier layer 311 in the sensor area SA.

[0192] Figure 21 is a schematic plan view illustrating a lower cover panel and a display panel according to an exemplary embodiment of the inventive concept, Figure 22 According to an exemplary embodiment of the inventive concept Figure 21 A cross-sectional view of a display panel.

[0193] Reference Figure 21 and Figure 22 , the display panel 300_11 of the display device 4 according to the embodiment and Figure 18 and Figure 19 The embodiment of the present invention is different in that the moisture permeation blocking pattern HPB is provided over the entire surface of the display panel 300_11 in a plane. For example, the moisture permeation blocking pattern HPB may completely overlap the display area DA and the non-display area NA.

[0194] The above has been referenced Figure 18 and Figure 19 Other descriptions are explained, so duplicate descriptions will be omitted.

[0195] Figure 23 is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept.

[0196] Reference Figure 23 , the display panel 300_12 according to the embodiment and Figure 22 The display panel 300_11 is different in that the moisture permeation blocking pattern HPB is disposed between the second barrier layer 311 and the second supporting substrate 304. For example, the moisture permeation blocking pattern HPB may completely overlap the display panel 300_12 in a plan view and be disposed between the second barrier layer 311 and the second supporting substrate 304.

[0197] The above has been referenced Figure 21 and Figure 22 Other descriptions are explained, so duplicate descriptions will be omitted.

[0198] Figure 24 is a schematic plan view illustrating a lower cover panel and a display panel according to an exemplary embodiment of the inventive concept, Figure 25 According to an exemplary embodiment of the inventive concept Figure 24 A cross-sectional view of a display panel.

[0199] Reference Figure 24 and Figure 25 , the display panel 300_13 of the display device 5 according to the embodiment and Figure 4 and Figure 7 The display panel 300 is different in that it further includes groove patterns GR1 and GR2 that surround the sensor area SA outside the sensor area SA in a plane.

[0200] The display panel 300_13 of the display device 5 according to the embodiment further includes a groove pattern that surrounds the sensor area SA outside the sensor area SA in a plane.

[0201] A plurality of such groove patterns may be included. Figure 24 , two groove patterns GR1 and GR2 surrounding the sensor area SA outside the sensor area SA are shown, but the number of the groove patterns is not limited thereto and may be one or three or more.

[0202] In a plane, the first groove pattern GR1 may be surrounded by the second groove pattern GR2. The first groove pattern GR1 may surround the sensor area SA.

[0203] In a plan view, the groove patterns GR1 and GR2 may have a circular curved shape that completely surrounds the sensor area SA. For example, at least one of the groove patterns GR1 and GR2 may have a circular shape or an elliptical shape. In an exemplary embodiment, the groove patterns GR1 and GR2 have an open curved shape in a plan view that does not completely surround the sensor area SA and is partially open. In an exemplary embodiment, the open curved shape is an arc.

[0204] like Figure 25 As shown in FIG, the groove patterns GR1 and GR2 may have a shape protruding downward from the second barrier layer 311. The second barrier layer 311 in which the groove patterns GR1 and GR2 are arranged may have a 32nd thickness t32. In an exemplary embodiment, the 32nd thickness t32 is greater than the third thickness t3.

[0205] The groove patterns GR1 and GR2 may be physically connected to the second barrier layer 311. That is, the groove patterns GR1 and GR2 may include the same material as the second barrier layer 311. The groove patterns GR1 and GR2 may mate with corresponding recesses within the second supporting substrate 304. The recesses may be spaced apart from each other in the non-sensor area NSA.

[0206] The display panel 300_13 according to the embodiment may further include groove patterns GR1 and GR2 that are physically connected to the second barrier layer 311 and protrude downward to prevent moisture or water from flowing in through the through hole.

[0207] Figure 26 is a plan view showing a plurality of pixels arranged in a sensor area and a non-sensor area, Figure 27 It is along Figure 26 A cross-sectional view taken along line XXVII-XXVII'.

[0208] Reference Figure 26 and Figure 27 , multiple pixels PX (like Figure 5 The pixels 10 are arranged in different densities in the sensor area SA and the non-sensor area NSA, which is different from Figure 4 and Figure 8 The embodiments are different.

[0209] like Figure 26 As shown in FIG, a plurality of such pixels PX may be arranged in each of the sensor area SA and the non-sensor area NSA. In an exemplary embodiment, the density of the pixels PX arranged in the sensor area SA is lower than the density of the pixels PX arranged in the non-sensor area NSA. The sensor area SA may further include a transmissive area TA in which no pixels PX are arranged.

[0210] like Figure 27 As shown in FIG, the pixel PX is not arranged in the transmission area TA of the sensor area SA. The transmission area TA may have a stacked structure of a first barrier layer 303, a second supporting substrate 304, a second barrier layer 311, an insulating interlayer 312, a gate insulating film 321, an insulating interlayer film 322, a first via layer VIA1, a pixel defining film BNK, and an encapsulation layer 360.

[0211] In the sensor area SA, the pixels PX may be arranged near the transmissive area TA. That is, an area of ​​the sensor area SA in which the pixels PX are not arranged may be defined as the transmissive area TA. In an exemplary embodiment, in the transmissive area TA, only the insulating layers 303, 304, 311, 312, 321, 322, VIA1, BNK, and 360 are arranged, and no conductive material (e.g., the semiconductor layer ACT, the light-blocking metal pattern BML, the anode electrode ANO, and the cathode electrode CAT) is arranged. Although Figure 27 Portions of the cathode electrode CAT, the anode electrode ANO, and the emission layer EL extending into the transmission area TA are shown, but in an alternative embodiment, these portions do not exist in the transmission area TA. For example, these portions may be moved to the respective nearest pixels PX, and the insulating layers BNK and 360 may extend to the respective edges between the pixel PX and the transmission area TA (see FIG. Figure 27 dashed line in the middle).

[0212] In the display device according to an exemplary embodiment of the present disclosure, a camera or a sensor located in a display area may receive light more easily.

[0213] While the disclosure has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure.

Claims

1. A display device comprising a display area and a non-display area located in a periphery of the display area, wherein the display area includes a sensor area for an optical sensor and a non-sensor area, the display device comprising: a base portion comprising a first flexible substrate, a second flexible substrate facing the first flexible substrate, and a first barrier layer disposed between the first flexible substrate and the second flexible substrate, wherein the first flexible substrate and the second flexible substrate comprise polyimide; a thin film transistor layer, disposed on the entire surface of the substrate and comprising at least one thin film transistor; as well as A light emitting diode is provided on the thin film transistor layer, wherein the thickness of the base portion in the sensor region is smaller than the thickness of the base portion in the non-sensor region; wherein the base portion includes a through hole that passes through the base portion in the sensor region in a thickness direction and exposes at least a portion of a bottom surface of the first barrier layer or the second flexible substrate, and The roughness level of the bottom surface of the first barrier layer or the second flexible substrate in the sensor area is greater than the roughness level of the bottom surface of the first barrier layer or the second flexible substrate in the non-sensor area. 2 . The display device of claim 1 , further comprising a sacrificial pattern disposed directly on a region of the bottom surface of the first barrier layer exposed by the through hole.

3. The display device according to claim 1, wherein The at least exposed portion of the bottom surface of the first barrier layer includes a carbonized surface.

4. The display device according to claim 1, wherein The through hole also passes through at least a portion of the first barrier layer, and a thickness of the first barrier layer in the sensor region is smaller than a thickness of the first barrier layer in the non-sensor region.

5. The display device according to claim 4, wherein The through-hole passes completely through the first barrier layer and exposes the bottom surface of the second flexible substrate. The display device according to claim 5 , wherein: The exposed bottom surface of the second flexible substrate includes a carbonized surface.

7. The display device according to claim 5, wherein: The through hole also passes through at least a portion of the second flexible substrate, and a thickness of the second flexible substrate in the sensor region is smaller than a thickness of the second flexible substrate in the non-sensor region.

8. A display device comprising a display area and a non-display area located in a periphery of the display area, the display area comprising a sensor area for an optical sensor and a non-sensor area, the display device comprising: a base portion comprising a first flexible substrate, a second flexible substrate facing the first flexible substrate, and a first barrier layer disposed between the first flexible substrate and the second flexible substrate, wherein the first flexible substrate and the second flexible substrate comprise polyimide; a thin film transistor layer, disposed on the entire surface of the substrate and comprising at least one thin film transistor; a second barrier layer, disposed between the second flexible substrate and the thin film transistor layer; as well as A light emitting diode is provided on the thin film transistor layer, wherein the base portion includes a through hole that completely passes through the first flexible substrate, the first barrier layer, and the second flexible substrate in the sensor region in a thickness direction and exposes at least a portion of a bottom surface of the second barrier layer; and The roughness level of the bottom surface of the second barrier layer in the sensor area is greater than the roughness level of the bottom surface of the second barrier layer in the non-sensor area. 9 . The display device of claim 8 , further comprising a sacrificial pattern disposed directly on a region of the bottom surface of the second barrier layer exposed by the through hole.

10. The display device according to claim 8, wherein The exposed bottom surface of the second barrier layer includes a carbonized surface.

11. The display device according to claim 10, wherein: The through hole also passes through at least a portion of the second barrier layer, and a thickness of the second barrier layer in the sensor region is smaller than a thickness of the second barrier layer in the non-sensor region.

12. The display device according to claim 1 or 8, wherein: The thin film transistor layer includes a semiconductor layer provided on the base portion, a gate electrode provided on the semiconductor layer, and source / drain electrodes provided on the gate electrode and each connected to the semiconductor layer, and The display device further includes a light-blocking metal layer disposed on the base portion in the sensor region.

13. The display device according to claim 12, wherein: The light-blocking metal layer includes a plurality of light-blocking metal patterns arranged to be spaced apart from each other.

14. The display device according to claim 13, wherein: The plurality of light-blocking metal patterns overlap the semiconductor layer.

15. The display device according to claim 13, wherein The light-blocking metal layer includes titanium or molybdenum.

16. The display device according to claim 1 or 8, wherein: The base portion further includes a burr protruding from a periphery of the sensor region of the base portion.

17. The display device according to claim 1 or 8, wherein: The sensor area and the non-sensor area each include a plurality of pixels, and a density of the plurality of pixels arranged in the sensor area is smaller than a density of the plurality of pixels arranged in the non-sensor area.

18. The display device according to claim 17, wherein: The sensor area includes a pixel arrangement area and a transmission area, the plurality of pixels are arranged in the pixel arrangement area, the plurality of pixels are not arranged in the transmission area, and Wherein, the conductive material is not arranged in the transmission area.

19. A display device comprising a display area and a non-display area located in a periphery of the display area, the display area comprising a sensor area for an optical sensor and a non-sensor area, the display device comprising: a base portion comprising a first flexible substrate and a second flexible substrate facing the first flexible substrate, wherein the first flexible substrate and the second flexible substrate comprise polyimide; a thin film transistor layer, disposed on the entire surface of the substrate and comprising at least one thin film transistor; as well as A light emitting diode is provided on the thin film transistor layer, wherein the through hole passes through the surface of the base portion in the sensor region in the thickness direction, and The roughness level of the bottom surface of the layer of the display device exposed by the through hole in the sensor region is greater than the roughness level of the bottom surface in the non-sensor region.

20. The display device according to claim 19, further comprising: a barrier layer, disposed between the base portion and the thin film transistor layer; as well as a moisture permeation blocking pattern disposed between the base portion and the thin film transistor layer, Wherein, the moisture penetration blocking pattern comprises silicon oxynitride.

21. The display device according to claim 20, wherein The moisture permeation blocking pattern is disposed in the sensor region and overlaps the sensor region.

22. The display device according to claim 19, further comprising a barrier layer disposed between the base portion and the thin film transistor layer. in, The barrier layer further includes a groove protruding further than the barrier layer in the thickness direction in the non-sensor region.

23. The display device according to claim 22, wherein: The groove includes a plurality of groove patterns arranged in a periphery of the sensor area.

24. The display device according to claim 22, wherein: The groove completely surrounds the sensor area in plan view.

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