Transmitter module and its TOF camera module and electronic equipment

Abstract

The present invention provides a transmitting module and its TOF camera module and electronic device, wherein the transmitting module includes a circuit board, a transmitting element and a driving element, wherein the transmitting element and the driving element are arranged on the upper and lower surfaces of the circuit board relative to each other with the circuit board separated, and the transmitting element and the driving element are respectively conductively connected to the circuit board, wherein the driving element transmits a pulse current to the transmitting element to control the transmitting element to emit a light pulse signal.

Description

Technical Field

[0001] The present invention relates to the field of depth information, and more specifically to a transmitting module and a TOF camera module and an electronic device thereof. Background Art

[0002] The depth information acquisition function has become a hot function in the mobile phone market. More and more mobile phone manufacturers are installing depth information acquisition modules on their mobile phones to obtain depth information. Depth information acquisition can be obtained through methods such as time of flight, structured light or binocular. In the current market environment, the most commonly used methods are structured light and time of flight. Both require a transmitter and a receiver. The transmitter emits specific electromagnetic waves, which reach the object to be detected, undergo certain changes, and are reflected by the object. The receiver receives the electromagnetic waves reflected by the object, and the processing module obtains depth information by comparing the changes between the emitted electromagnetic waves and the received reflected electromagnetic waves.

[0003] Generally speaking, the transmitter and the receiver are assembled together, and the transmitter and the receiver are electrically connected to form a depth information acquisition module. Regardless of shipment or assembly, the transmitter and the receiver are assembled together to form a depth information acquisition module as a whole.

[0004] However, the transmitter and the receiver are assembled in a certain way, such as welding, conductive adhesive, etc., and the connection between the transmitter and the receiver forms an unstable factor. This unstable factor will affect the overall stability of the depth information acquisition module during transportation. For example, when the module manufacturer ships the module, the depth information acquisition module as a whole is shipped as a good product, but during transportation, the instability of the connection between the transmitter and the receiver will affect the depth information acquisition module, causing the depth information acquisition module to be transported to the electronic equipment manufacturer. The module may change from a good product to a defective product, causing losses to both the module manufacturer and the electronic equipment manufacturer, affecting the production and revenue of the module manufacturer and the electronic equipment manufacturer.

[0005] Furthermore, electronic equipment manufacturers have many personalized requirements for mobile phone design and would like to participate in the algorithm debugging of the module. The deep information acquisition module that is shipped and assembled as a whole restricts the design and debugging of electronic equipment manufacturers. In addition, the space occupied by the overall deep information acquisition module is fixed, and electronic equipment manufacturers cannot provide space utilization. The personalized needs of electronic equipment manufacturers in mobile phone design, module layout and assembly are restricted.

[0006] Therefore, it is necessary to pay attention to how to ensure that the transmitter and receiver can be transported and assembled stably, and how to adapt to the personalized needs of electronic equipment manufacturers for electronic equipment design and assembly. Summary of the invention

[0007] One advantage of the present invention is that it provides a transmitting module and its TOF camera module and electronic device, wherein the TOF camera module is flexibly adapted to the electronic device.

[0008] Another advantage of the present invention is that it provides a transmitting module and its TOF camera module and electronic device, wherein a transmitting module and a receiving module of the TOF camera module are independent of each other, so that the transmitting module and the receiving module can be transported independently, avoiding the two being affected during transportation in an unstable connection state.

[0009] Another advantage of the present invention is that it provides a transmitting module and its TOF camera module and electronic device, wherein the transmitting module and the receiving module of the TOF camera module can be independently assembled and installed in the electronic device respectively to adapt to different design and assembly requirements of the electronic device.

[0010] Another advantage of the present invention is that it provides a transmitting module and its TOF camera module and electronic device, wherein a transmitting element and a driving element of the TOF camera module are respectively arranged on the upper and lower surfaces of a circuit board, so that the connection circuit between the transmitting element and the driving element is shorter, and a light signal with better pulse wave quality can be generated.

[0011] Another advantage of the present invention is that it provides a transmitting module and its TOF camera module and electronic equipment, wherein the heat source of the transmitting module is dispersed to prevent the temperature of the transmitting module from being too high.

[0012] Another advantage of the present invention is to provide a transmitting module and its TOF camera module and electronic equipment, wherein the transmitting element, the circuit board and at least one electronic component are stacked to reduce the size of the transmitting module.

[0013] Another advantage of the present invention is that it provides a transmitting module and its TOF camera module and electronic device, wherein the transmitting module includes a supporting base, and the height of the supporting base can be adjusted to adjust the overall height of the transmitting module to adapt to different height design requirements.

[0014] Another advantage of the present invention is to provide a transmitting module and its TOF camera module and electronic device, after the transmitting module and the receiving module are assembled into the electronic device, the height difference is kept within a relatively small range.

[0015] Another advantage of the present invention is that it provides a transmitting module and its TOF camera module and electronic device, and the height of the transmitting module can be adjusted to adapt to the height of the receiving module.

[0016] Other advantages and features of the present invention will become more apparent from the following detailed description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

[0017] According to one aspect of the present invention, a transmitting module of the present invention capable of achieving the aforementioned objects and other objects and advantages comprises:

[0018] a circuit board;

[0019] a driving element; and

[0020] An emitting element, wherein the emitting element and the driving element are arranged on the upper and lower surfaces of the circuit board relative to each other with the circuit board separated therefrom, and the emitting element and the driving element are respectively conductively connected to the circuit board, wherein the driving element transmits a pulse current to the emitting element to control the emitting element to emit an optical pulse signal.

[0021] According to an embodiment of the present invention, the driving element is disposed below the emitting element to shorten the distance between the driving element and the emitting element.

[0022] According to an embodiment of the present invention, at least one connecting circuit is provided in a region of the circuit board spaced between the driving element and the emitting element, and the connecting circuit conducts electricity between the driving element and the emitting element.

[0023] According to an embodiment of the present invention, the transmitting module further includes a supporting element, and the supporting element is distributed in an annular shape on the upper surface of the circuit board.

[0024] According to one embodiment of the present invention, the transmitting assembly further includes an optical auxiliary element, and the optical auxiliary element is mounted on the upper end of the supporting element, and the supporting element supports the optical auxiliary element.

[0025] According to an embodiment of the present invention, at least one gap is formed between the optical auxiliary element and the supporting element.

[0026] According to an embodiment of the present invention, the upper end of the supporting element is stepped.

[0027] According to an embodiment of the present invention, the supporting element is formed on the upper surface of the circuit board by a molding process.

[0028] According to an embodiment of the present invention, the transmitting module further comprises a fixing element, and the supporting element is fixed to the upper surface of the circuit board through the fixing element.

[0029] According to an embodiment of the present invention, the transmitting module further includes a supporting base, and the supporting base is disposed on the lower surface of the circuit board.

[0030] According to an embodiment of the present invention, the support base is integrally formed on the lower surface of the circuit board.

[0031] According to an embodiment of the present invention, the support base is attached to the lower surface of the circuit board, wherein the interior of the support base is hollow.

[0032] According to one embodiment of the present invention, the support base has at least one channel, and the channel extends from the lower surface of the support base to the lower surface of the driving element to connect the driving element and the external space of the support base.

[0033] According to an embodiment of the present invention, the transmitting module further includes at least one heat conducting element, and the heat conducting element is disposed on the lower side of the driving element.

[0034] According to an embodiment of the present invention, the support base is distributed in an annular shape on the lower surface of the circuit board, and a hollow portion is formed inside the support base to accommodate the driving element.

[0035] According to an embodiment of the present invention, the support base is fixed to the lower surface of the circuit board in the shape of an inverted fixed bracket.

[0036] According to an embodiment of the present invention, the support base has at least one through hole, and the through hole connects the inner space and the outer space of the support base.

[0037] According to another aspect of the present invention, the present invention further provides a TOF camera module, comprising:

[0038] The transmitting module mentioned above; and

[0039] A receiving module, wherein the receiving module can be conductively connected to the transmitting module.

[0040] According to one embodiment of the present invention, the TOF camera module further includes a main circuit board, and the transmitting module and the receiving module are respectively and conductively arranged on the same side of the main circuit board.

[0041] According to one embodiment of the present invention, the TOF camera module also includes a second supporting base, the transmitting module is arranged on the second supporting base, the second supporting base supports the transmitting module, wherein the second supporting base can be conductively connected to the transmitting module, and the second supporting base is fixed to the main circuit board.

[0042] According to an embodiment of the present invention, the height of the second supporting base is adjusted to adjust the height of the transmitting module so that the height difference between the receiving module and the transmitting module is small.

[0043] According to one embodiment of the present invention, the TOF camera module further includes at least one electronic component, and at least one of the electronic components is disposed on the main circuit board.

[0044] According to another aspect of the present invention, the present invention further provides an electronic device, comprising:

[0045] A TOF camera module, wherein the TOF camera module comprises:

[0046] A transmitting module as described above; and

[0047] a receiving module; and

[0048] A main board, wherein the transmitting module and the receiving module are respectively mounted on the main board, the upper ends of the transmitting module and the receiving module are flush, the transmitting module and the receiving module are respectively connected to a connector through a flexible board, each of the connectors is respectively connected to the main board, and the transmitting module and the receiving module are conductively connected to the main board.

[0049] According to one embodiment of the present invention, the TOF camera module also includes a mounting bracket, the mounting bracket includes a first mounting portion and a second mounting portion connected to each other, the transmitting module is fixed to the first mounting portion, the receiving module is fixed to the second mounting portion, and the mounting portion is fixed to the mainboard.

[0050] According to one embodiment of the present invention, the first mounting portion is arranged on one side of the upper portion of the second mounting portion, and the lower end height of the first mounting portion is higher than the lower end height of the second mounting portion, so that the transmitting module is lifted by the first mounting portion, and an avoidance space is formed between the lower side of the first mounting portion and the mainboard.

[0051] According to an embodiment of the present invention, the mounting bracket assists the transmitting module and the receiving module in adjusting their respective optical axes.

[0052] According to an embodiment of the present invention, the mainboard has a mounting area, and the transmitting module is fixed to the mounting area.

[0053] According to one embodiment of the present invention, the mainboard has a mounting groove, which is arranged on any side of the mounting area, and the receiving module is installed in the mounting groove so that the height difference between the upper end of the receiving module and the upper end of the transmitting module is maintained within a small range.

[0054] According to one embodiment of the present invention, the mainboard has a mounting hole that penetrates the mainboard, and the receiving module is installed in the mounting hole so that the height difference between the upper end of the receiving module and the upper end of the transmitting module is maintained within a small range.

[0055] According to one embodiment of the present invention, the TOF camera module further includes a fixing bracket, which fixes the receiving module to the mainboard, wherein the fixing bracket assists in adjusting the optical axis of the receiving module.

[0056] According to one embodiment of the present invention, the TOF camera module further includes an auxiliary bracket, the transmitting module is disposed on the auxiliary bracket, and the auxiliary bracket supports the transmitting module, wherein the auxiliary bracket is installed on the mainboard to raise the height of the transmitting module.

[0057] According to an embodiment of the present invention, the receiving module is mounted on the main board, and the height difference between the upper end of the receiving module and the upper end of the transmitting module is maintained within a relatively small range.

[0058] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and the accompanying drawings.

[0059] These and other objects, features and advantages of the present invention will be more fully understood from the following detailed description, accompanying drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 Schematic diagram of a TOF camera module according to a preferred embodiment of the present invention.

[0061] Figure 2 It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0062] Figure 3 It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0063] Figure 4A It is a schematic diagram of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0064] Figure 4B It is a partial installation diagram of a transmitting module of a TOF camera module according to the above preferred embodiment of the present invention.

[0065] Figure 4C is along Figure 4B Partial cross-section along line AA.

[0066] Figure 5 It is a schematic diagram of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0067] Figure 6 It is a schematic diagram of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0068] Figure 7 It is a schematic diagram of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0069] Figure 8 It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0070] Fig. 9 It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0071] Fig. 10A It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0072] Fig. 10B It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0073] Fig. 10C It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0074] Fig. 10D It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0075] Fig.11A It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0076] Fig. 11B It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0077] Fig. 12A It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0078] Fig. 12B It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0079] Fig. 12CIt is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0080] Fig.12D It is a cross-sectional view of a transmitting module of a TOF camera module according to another preferred embodiment of the present invention.

[0081] Fig.13A It is a schematic diagram of a TOF camera module installed in an electronic device according to another preferred embodiment of the present invention.

[0082] Fig. 13B It is a schematic diagram of a TOF camera module installed in an electronic device according to another preferred embodiment of the present invention.

[0083] Fig. 13C It is a schematic diagram of a TOF camera module according to another preferred embodiment of the present invention.

[0084] Fig.14 is a cross-sectional view of a TOF camera module installed in an electronic device according to another preferred embodiment of the present invention.

[0085] Fig.15 is a cross-sectional view of a TOF camera module installed in an electronic device according to another preferred embodiment of the present invention.

[0086] Fig.16 It is a schematic diagram of a TOF camera module installed in an electronic device according to another preferred embodiment of the present invention.

[0087] Fig.17 This is another schematic diagram of a TOF camera module installed in an electronic device according to another preferred embodiment of the present invention.

[0088] Fig.18 This is another cross-sectional view of a TOF camera module installed in an electronic device according to another preferred embodiment of the present invention.

[0089] Fig.19 This is another cross-sectional view of a TOF camera module installed in an electronic device according to another preferred embodiment of the present invention.

[0090] Fig. 20 This is another schematic diagram of a TOF camera module installed in an electronic device according to another preferred embodiment of the present invention.

[0091] Fig.21 Detailed description of the invention Figure 4 is a cross-sectional view of a TOF camera module according to another preferred embodiment of the present invention.

[0092] Fig. 22Detailed Description of the Invention FIG. 1 is a top view of a TOF camera module according to another preferred embodiment of the present invention.

[0093] Fig.23 Detailed description of the invention Figure 4 is a cross-sectional view of a TOF camera module according to another preferred embodiment of the present invention.

[0094] Fig.24 Detailed description of the invention Figure 4 is a cross-sectional view of a TOF camera module according to another preferred embodiment of the present invention. DETAILED DESCRIPTION

[0095] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0096] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0097] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0098] Reference Figure 1 , a TOF camera module 1 according to a preferred embodiment of the present invention is explained. The TOF camera module 1 includes a transmitting module 10, a receiving module 20 and a plurality of electronic components 30. The transmitting module 10 emits electromagnetic waves, which reach an object to be detected and are reflected by the object to be detected. The receiving module 20 receives the electromagnetic waves reflected by the object to be detected. At least one of the electronic components 30 is conductively connected to the transmitting module 10. That is, at least one of the electronic components 30 supports the operation of the transmitting module 10.

[0099] The transmitting module 10 radiates light outwards, and the light is reflected after encountering an object. The receiving module 20 receives the light reflected by the object and obtains depth information about the object according to the time difference or phase difference between the transmitted light and the reflected light.

[0100] Reference Figure 2 In a preferred embodiment of the present invention shown in FIG. 1 , the electronic component 30 includes a driving element 31 , and the driving element 31 is conductively connected to the transmitting module 10 .

[0101] The TOF camera module 1 includes a transmitting module 10, and the transmitting module 10 includes the driving element 31. The transmitting module 10 also includes a circuit board 11 and a transmitting component 12. The transmitting component 12 is conductively connected to the circuit board 11. The transmitting component 12 is arranged on the upper side of the circuit board 11. The driving element 31 is conductively connected to the circuit board 11. The driving element 31 is arranged on the lower side of the circuit board 11. The transmitting component 12 and the driving element 31 are arranged opposite to each other with the circuit board 11 spaced apart. Among them, the driving element 31 is arranged on the lower surface of the circuit board 11.

[0102] The circuit board 11 may be a ceramic substrate, a circuit board, a rigid-flex board, or the like.

[0103] The transmitting component 12 includes a transmitting element 121 and an optical auxiliary element 122, and the transmitting element 121 is arranged on the upper surface of the circuit board 11. The transmitting element 121 is conductively connected to the circuit board 11. The transmitting element 121 radiates a light beam outward, and the light beam radiates outward after passing through the optical auxiliary element 122. The optical auxiliary element 122 diffracts or homogenizes the light source. The optical auxiliary element 122 can be implemented as a Diffuser, DOE (Diffractive Optical Elements) or a nano-optical chip, etc., to play the role of diffracting or homogenizing the light source.

[0104] The driving element 31 transmits a pulse current to the transmitting element 121, and the reflecting element 121 emits a regular light pulse signal according to the received pulse current. The light pulse signal is transmitted to the detected object and then returns to form a return signal, and the receiving module 20 receives the return signal. The TOF camera module group 1 calculates the distance between the detected object and the TOF camera module 1 according to the difference between the transmitted signal and the return signal. The driving element 31 controls the light pulse signal at the transmitting end of the transmitting element 121 according to the transmitted pulse current.

[0105] The emitting element 121 and the driving element 31 can be directly attached to the circuit board 11 by SMT process, which is simple and low in cost.

[0106] The emitting element 121 and the driving element 31 are arranged on the upper and lower surfaces of the circuit board 11 respectively, separated by the circuit board 11, so that the connection circuit between the emitting element 121 and the driving element 31 is relatively short. The emitting element 121 and the driving element 31 are stacked and arranged on the circuit board 11 along the vertical direction, and the conducting distance between the emitting element 121 and the driving element 31 is only separated by the thickness of the circuit board 11, so the conducting distance between the emitting element 121 and the driving element 31 is relatively short, which facilitates the driving element 31 to better control the emitting element 121.

[0107] At least one connection circuit is provided in the corresponding area of ​​the circuit board 11 between the emitting element 121 and the driving element 31 to conduct the emitting element 121 and the circuit board 11. The emitting element 121 and the driving element 31 are respectively located on the upper and lower surfaces of the circuit board 11, and the driving element 31 is arranged below the emitting element 121, so that the conduction distance between the emitting element 121 and the driving element 31 is short, and they are only separated by the circuit board 11, so the connection circuit connecting the emitting element 121 and the driving element 31 is short. Therefore, the wiring distance between the emitting element 121 and the driving element 31 is short. In addition, the emitting element 121 and the driving element 31 are arranged on the upper and lower surfaces of the circuit board 11 to avoid the wiring being concentrated on one side of the circuit board 11.

[0108] When the connection circuit between the transmitting element 121 and the driving element 31 is long, the waveform generated by the transmitting element 121 is poor and deviates greatly from the ideal square wave. When the connection circuit between the transmitting element 121 and the driving element 31 is shorter, the waveform generated by the transmitting element 121 is closer to the ideal square wave. The transmitting element 121 and the driving element 31 are arranged on the upper and lower opposite surfaces of the circuit board 11 with the circuit board 11 spaced apart. The connection circuit between the transmitting element 121 and the driving element 31 is short, and the parasitic inductance is small, so that the waveform generated by the transmitting element 121 is close to the ideal square wave, thereby improving the signal-to-noise ratio.

[0109] In addition, the emitting element 121 and the driving element 31 generate heat when working, that is, the emitting element 121 and the driving element 31 are both a heat source. The emitting element 121 and the driving element 31 are arranged on both sides of the circuit board 11, so that the heat source of the emitting module 10 is dispersed, avoiding the concentration of the heat source, improving the heat dissipation performance, and avoiding the excessive temperature of the emitting module 10, which affects the optical power and the detection distance.

[0110] The transmitting element 121 , the circuit board 11 and the driving element 31 are stacked to avoid laying out the elements in a radial direction, which is beneficial to reducing the volume of the entire transmitting module 10 .

[0111] The electronic components 30 also include but are not limited to capacitors, resistors, inductors, etc., and a plurality of the electronic components 30 are conductively connected to the transmitting module 10. The arrangement of a plurality of the electronic components 30 can reduce the parasitic inductance of the driving element 31 and the bracket of the transmitting element 121, so as to ensure the integrity of the waveform of the optical signal emitted by the transmitting element 121.

[0112] The transmitting module 10 further includes a photodiode 13 , which is disposed on the upper surface of the circuit board 11 . The photodiode 13 is located on one side of the transmitting element 121 .

[0113] The transmitting module 10 further includes a supporting element 14, which is disposed on the upper surface of the circuit board 11. The supporting element 14 is formed to protrude upward along the circumference of the upper surface of the circuit board 11. That is, the supporting element 14 is distributed in an annular manner on the upper surface of the circuit board 11. An accommodating space 1000 is formed between the inner side of the supporting element 14 and the upper side of the circuit board 11. The transmitting element 121 and the photodiode 13 are accommodated in the accommodating space 1000.

[0114] The optical auxiliary element 122 is mounted on the upper end of the supporting element 14. The supporting element 14 supports the optical auxiliary element 122.

[0115] In some embodiments of the present invention, the support element 14 is integrally formed on the upper surface of the circuit board 11 by molding, injection molding, etc. The support element 14 is in direct contact with the driving element 31 and other electronic components 30 disposed on the lower side of the circuit board 11, which has a better heat dissipation effect than air conduction heat dissipation.

[0116] In some other embodiments of the present invention, the support element 14 is fixed to the circuit board 11 by bonding or other methods. The support element 14 can also be fixed to the circuit board 11 by soldering or other methods.

[0117] Reference Figure 2In a preferred embodiment of the present invention shown in FIG. 1 , the upper end of the support element 14 is stepped, and the stepped concave portion of the upper end of the support element 14 has a bearing surface 141, and the bearing surface 141 is lower than the highest surface of the upper end of the support element 14. The bearing surface 141 is used to mount the optical auxiliary element 122. The stepped portion of the upper end of the support element 14 is raised relative to the bearing surface 141 to form a raised portion 142, and the raised portion 142 has a certain height, and the height of the raised portion 142 is slightly greater than the thickness of the optical auxiliary element 122.

[0118] Preferably, the periphery of the optical auxiliary element 122 is bonded to the carrying surface 141 , and the supporting element 14 supports the optical auxiliary element 122 to keep the optical auxiliary element 122 located above the emitting element 121 .

[0119] The transmitting module 10 further includes a supporting base 15, and the supporting base 15 is disposed on the lower surface of the circuit board 11. The supporting base 15 covers the driving element 31. The circuit board 11 is disposed on the upper side of the supporting base 15. The transmitting component 12 is disposed on the upper side of the circuit board 11. The supporting base 15 supports the circuit board 11 and the transmitting component 12 disposed on the upper side of the circuit board 11.

[0120] The driving element 31 is wrapped by the supporting base 15 , so that the driving element 31 is shielded by the supporting base 15 , and the supporting base 15 protects the driving element 31 .

[0121] When the other at least one electronic component 30 is disposed on the lower side of the circuit board 11 , the support base 15 can cover and wrap the other at least one electronic component 30 , thereby protecting the other at least one electronic component 30 .

[0122] The distance between the lower surface of the circuit board 11 and the lower surface of the support base 15 can be adjusted, that is, the height of the support base 15 can be adjusted to adapt to module designs with different height requirements. For example, the height of the support base 15 can be adjusted according to the height of the electronic components 30 arranged on the lower surface of the circuit board 11 to completely wrap the electronic components 30.

[0123] The height of the support base 15 can be adjusted, so that the overall height of the transmitting module 10 can be adjusted. The height to which the upper end of the transmitting module 10 is raised is affected by the height of the support base 15 .

[0124] In some embodiments of the present invention, the support base 15 can be formed on the circuit board 11 by molding, injection molding, etc. In other embodiments of the present invention, the support base 15 can be fixed to the circuit board 11 by gluing, etc.

[0125] It is worth mentioning that when the support element 14 and the support base 15 are formed by molding or other processes, the overall strength and flatness of the transmitting module 10 can be improved. By using molding or other processes, mass production can also be carried out, such as whole panel production, and then cutting according to demand, which is beneficial to improving production efficiency. In addition, part of the electronic components 30 are wrapped by the support base 15 formed by molding or other processes, and the space of part of the electronic components 30 overlaps with the space of the support base 15, which reduces the avoidance space of the electronic components 30, which is beneficial to reducing the length and width of the support base 15, and then it is beneficial to reduce the size of the overall transmitting module 10, and at the same time canceling the attachment process is beneficial to reducing the component assembly tolerance.

[0126] The support base 15 wraps the driving element 31, and the heat dissipation of the driving element 31 is affected to a certain extent. In order to improve the heat dissipation performance, refer to Figure 3 The transmitting module 10 further includes at least one heat-conducting element 16, which is disposed below the driving element 31. The heat-conducting element 16 is made of a heat-conducting material. The provision of the heat-conducting element 16 can improve the heat dissipation performance of the transmitting module 10 to prevent the temperature of the transmitting module 10 from being too high.

[0127] The support base 15 wraps the heat-conducting element 16. That is, the heat-conducting element 16 is disposed inside the support base 15. The heat generated by the driving element 31 is conducted out of the support base 15 through the heat-conducting element 16.

[0128] It is worth mentioning that the position and number of the heat-conducting element 16 are not limited. The heat-conducting element 16 can be arranged below or to the side of the driving element 31 , and the number of the heat-conducting element 16 can be one or more.

[0129] When at least one other electronic component 30 is disposed on the lower side of the circuit board 11 , the position and quantity of the heat-conducting element 16 can be adjusted according to actual conditions to ensure heat dissipation performance.

[0130] Reference FIG. 4A to FIG. 4C, the optical auxiliary element 122 is mounted on the support element 14 by gluing. The optical auxiliary element 122 is surrounded by the protrusion 142. When the optical auxiliary element 122 has a mounting surface 1221, the mounting surface 1221 is formed along the periphery of the lower surface of the optical auxiliary element 122. When the optical auxiliary element 122 is mounted on the support element 14, the mounting surface 1221 faces the bearing surface 141. The mounting surface 1221 is partially or completely glued to be glued to the bearing surface 141.

[0131] In some embodiments of the present invention, the mounting surface 1221 has multiple edges. For example, as shown in FIG4 , the mounting surface 1221 has four edges according to the shapes of the optical auxiliary element 122 and the supporting element 14. When the four edges of the bearing member 1221 are completely glued, the mounting surface 1221 and the bearing surface 141 are completely glued around, and there is no gap between the mounting surface 1221 and the bearing surface 141, which is not conducive to gas circulation. When the transmitting module 10 is working, the components of the transmitting module 10 produce a certain temperature change, which causes the internal gas volume to change, affecting the stability of the internal components and structures.

[0132] By designing the glue position of the mounting surface 1221 , a structure for gas flow is formed between the mounting surface 1221 and the bearing surface 141 .

[0133] Figures 5 to 7 Different designs of the gas flow structure when the optical auxiliary element 122 of the TOF camera module 1 of the present invention is installed on the supporting element 14 are shown.

[0134] Specifically, Figure 5 As shown, one side of the mounting surface 1221 is not glued, so that when the optical auxiliary element 122 is mounted on the supporting element 14, there is a certain gap between the mounting surface 1221 and the bearing surface 141, which is conducive to gas circulation. Two or three sides of the mounting surface 1221 are not glued, and a gap for gas circulation can also be formed.

[0135] like Figure 6 Another example of the glue position is shown, in which part of the mounting surface 1221 is not glued, and when the optical auxiliary element 122 is mounted on the support element 14, at least one gap 120 is formed between the mounting surface 1221 and the bearing surface 141, and the gap 120 can be used for gas flow. Since the glue has a certain thickness, a certain interval is formed between the bearing surface 141 and the mounting surface 1221, and the gap 120 is formed in the area where the glue is not applied.

[0136] When applying glue, the starting position of applying glue and the ending position of applying glue may be discontinuous to form a position not applied glue, thereby forming the gap 120. In addition, in other examples of the present invention, the starting position of applying glue and the ending position of applying glue may be overlapped, and the applying glue process may be interrupted in one or more areas to form a position not applied glue, thereby forming the gap 120 after the optical auxiliary element 122 is installed on the supporting element 14.

[0137] It is worth mentioning that the position not coated with glue can be one area or multiple areas, so as to form one or more gaps 120 when installing the optical auxiliary element 122. The number of the gaps 120 is not limited.

[0138] Reference Figure 7 Another example of the glue position is shown, where the corners of two adjacent sides of the mounting surface 1221 are not glued. When the optical auxiliary element 122 is mounted on the support element 14, the gap 120 formed between the mounting surface 1221 and the bearing surface 141 is located at the corner of the optical auxiliary element 122.

[0139] When applying glue, the speed of applying glue is slower at the corners. The fewer corners passed and the more straight distances passed, the faster the speed of applying glue can be increased. Therefore, by taking one side of the corner as the starting point of applying glue and the other side of the corner as the end point of applying glue, applying glue at one or more corners can be avoided, which is beneficial to improving production efficiency.

[0140] Combination Figures 5 to 7 The different examples of the glue application positions are shown, and the glue application positions are various, and the number of the formed gaps 120 is not limited. When applying glue, positions without glue application can be formed in different areas of the mounting surface 1221, and the positions are various, and the number of the formed positions without glue application is not limited.

[0141] Reference Figure 8 Another example of the present invention is shown with Figure 2 The preferred embodiment shown is different in that the support element 14 is not formed in an integral manner on the circuit board 11 by molding, injection molding or other processes.

[0142] Specifically, the transmitting module 10 includes at least one fixing element 17, the lower end of the supporting element 14 is bonded to the fixing element 17, and the lower end of the fixing element 17 is fixed to the upper surface of the circuit board 11. The fixing element 17 is made of an adhesive material and can be used for bonding. The supporting element 14 is bonded to the upper surface of the circuit board 11 through the fixing element 17.

[0143] It is worth mentioning that the material used to make the fixing element 17 also has good heat dissipation. In one example of the present invention, the fixing element 17 may also be provided with at least one notch to connect the inner side and the outer side of the fixing element 17 for gas circulation. In other words, at least one notch is reserved for the fixing element 17 as a space for gas circulation.

[0144] It is also worth mentioning that a step portion 143 is provided on the inner side of the upper end of the support element 14 , and the step portion 143 is formed by extending inward from the inner side of the upper end of the support element 14 . The optical auxiliary element 122 is mounted on the step portion 143 .

[0145] The support element 14 can be formed into different shapes on the circuit board 11 by molding or other processes, and the support elements 14 of different shapes can also be fixed to the circuit board 11 by gluing or other methods.

[0146] The supporting element 14 may also be fixed to the circuit board 11 by soldering or other methods.

[0147] In other embodiments of the present invention, the support element 14 may further be designed with a gas flow structure. Fig. 9 As shown, the support element 14 is mounted on the upper side of the circuit board 11 through the fixing element 17. The support element 14 has at least one vent hole 140, which is disposed on one side of the step portion 143 and located outside the optical auxiliary element 122 to prevent the optical auxiliary element 122 from blocking the vent hole 140.

[0148] One end of the air escape hole 140 is in communication with the accommodation space 1000 where the emitting element 121 is located, and the other end of the air escape hole 140 is in communication with the outside of the emitting module 10 .

[0149] When the transmitting module 10 works and generates heat, the volume of the gas in the containing space 1000 will change. When the temperature rises, the gas expands and can flow outward through the gas escape hole 140 to ensure the stability of the internal structure and components.

[0150] It is worth mentioning that the heat conducting element 16 may also be disposed inside the support base 15 for heat conduction.

[0151] Reference Fig. 10A Another example of the present invention is shown with Figure 2The difference of a preferred embodiment shown is that the support base 15 is provided with at least one channel 151. The support base 15 is provided on the lower surface of the circuit board 11, and the driving element 31 is provided on the lower surface of the circuit board 11. The channel 151 extends from the lower surface of the driving element 31 to the lower surface of the support base 15, so that a part of the driving element 31 is exposed through the channel 151.

[0152] The heat of the driving element 31 can be transferred outward along the channel 151. The driving element 31 can dissipate heat outward through the channel 151.

[0153] The channel 151 passes through the outer surface of the support base 15 to the electronic component 30 arranged on the lower surface of the circuit board 11, so that a partial area of ​​the electronic component 30 arranged on the lower side of the circuit board 11 can be connected to the outside world through the channel 151, and the electronic component 30 can perform heat exchange with the outside world through the channel 151.

[0154] The driving element 31 of the electronic component 30 is disposed on the lower surface of the circuit board 11. The channel 151 extends from the lower surface of the driving element 31 to the lower surface of the supporting base 15, so that a part of the driving element 31 is exposed to the air, and the driving element 31 can exchange heat with the outside.

[0155] It is worth mentioning that at least one escape space 144 may be provided at the upper end of the support element 14, and the escape space 144 extends inwardly along the upper end of the protrusion 142 to the lower side of the mounting surface 141. The escape space 144 connects the accommodating space 1000 with the outside world. During the assembly of the launch module 10, if there is a heating process, the accommodating space 1000 is connected with the outside world, so that when the gas changes, the gas has a channel to overflow, thereby avoiding the influence of the gas volume change on the internal structure. In one example of the present invention, the escape space 144 can be closed after the assembly of the launch module 10 is completed.

[0156] The number of channels 151 is not limited. Fig. 10A An example is shown in which the support base 15 is provided with a channel 151. Fig. 10BAn example is shown in which the support base 15 is provided with a plurality of channels 151. One end of the plurality of channels 151 is connected to the electronic components 30 provided on the lower surface of the circuit board 11, and the other end of the plurality of channels 151 extends to the lower surface of the support base 15 and is connected to the outside. The plurality of channels 151 penetrates a portion of the space between the electronic components 30 provided on the lower surface of the circuit board 11 and the lower surface of the support base 15, so that a plurality of regions of the electronic components 30 provided on the lower surface of the circuit board 11 can be connected to the outside through the channels 151 for heat exchange. The electronic components 30 can dissipate heat through the channels 151.

[0157] The driving element 31 is disposed on the lower surface of the circuit board 11. The channel 151 extends from the lower surface of the driving element 31 to the lower surface of the supporting base 15, and multiple areas of the driving element 31 can be exposed through the channel 151, so that the driving element 31 can exchange heat with the outside.

[0158] and Fig. 10A and Fig. 10B The example shown differs in that Fig. 10C In the example shown, the support element 14 is fixed to the circuit board 11 by other means. The transmitting module 10 further includes at least one fixing element 17, the lower end of the support element 14 is bonded to the fixing element 17, and the lower side of the fixing element 17 is fixed to the upper surface of the circuit board 11, so that the support element 14 is bonded to the circuit board 11 through the fixing element 17. The support element 14 is made of plastic material. In another example of the present invention, the support element 14 is made of a metal material with better heat dissipation performance. The fixing element 17 is made of an adhesive material with better heat dissipation performance.

[0159] A step portion 143 is provided at the inner side of the upper end of the support element 14 , and the step portion 143 is formed by extending inward from the inner side of the upper end of the support element 14 . The optical auxiliary element 122 is fixed to the step portion 143 .

[0160] In addition, the supporting element 14 may also be fixed to the circuit board 11 by welding or other methods.

[0161] The support base 15 is provided with a channel 151 , and the channel 151 extends from the lower surface of the support base 15 to the lower surface of the driving element 31 , so that the driving element 31 can perform heat exchange with the outside.

[0162] Fig. 10DAn example is shown in which the support base 15 is provided with a plurality of the channels 151 , and the plurality of the channels 151 extend from the lower surface of the support base 15 to the lower surface of the driving element 31 , so that the driving element 31 can dissipate heat outward through the plurality of the channels 151 .

[0163] When the other electronic components 30 are installed on the lower surface of the circuit board 11 , the multiple channels 151 extend from the lower surface of the support base 15 to the lower surface of the other electronic components 30 , so that the electronic components 30 can dissipate heat outward through the multiple channels 151 .

[0164] FIG. 10A to FIG. 10D The support base 15 shown is integrally formed on the lower surface of the circuit board 11. The support base 15 with different numbers and positions of the channels 151 can be formed by molding or injection molding.

[0165] Reference Fig.11A and Fig. 11B Another preferred embodiment of the present invention is shown, the transmitting module 10 includes a circuit board 11 and a transmitting assembly 12. The transmitting assembly 12 is arranged on the upper side of the circuit board 11. The transmitting assembly 12 includes a transmitting element 121 and an optical auxiliary element 122, and the transmitting element 121 is conductively connected to the circuit board 11. The transmitting element 121 is arranged on the upper surface of the circuit board 11. The optical auxiliary element 122 is arranged above the transmitting element 121.

[0166] The transmitting module 10 further includes a photodiode 13, and the photodiode 13 is conductively connected to the circuit board 11. The photodiode 13 is disposed on the upper surface of the circuit board 11. The photodiode 13 is located on one side of the transmitting element 121.

[0167] The transmitting module 10 further includes at least one driving element 31, and the driving element 31 is conductively connected to the circuit board 11. The driving element 31 is disposed on the lower surface of the circuit board 11.

[0168] The transmitting element 121 and the driving element 31 are respectively arranged on the upper and lower surfaces of the circuit board 11 with the circuit board 11 between them. The transmitting element 121 and the driving element 31 are opposite to each other on the circuit board 11 and are respectively located on the upper and lower surfaces of the circuit board 11, so that the connection circuit between the transmitting element 121 and the circuit board 11 is shorter.

[0169] like Fig.11AAs shown, the transmitting module 10 further includes a supporting element 14, and the supporting element 14 is integrally formed on the upper surface of the circuit board 11. The optical auxiliary element 122 is mounted on the upper end of the supporting element 14. The supporting element 14 supports the optical auxiliary element 122, so that the optical auxiliary element 122 is held above the transmitting element 121.

[0170] like Fig. 11B As shown, the transmitting module 10 also includes a supporting element 14 and at least one fixing element 17. The lower end of the supporting element 14 is bonded to the fixing element 17, and the fixing element 17 is bonded to the upper surface of the circuit board 11. The supporting element 14 is bonded to the circuit board 11 through the fixing element 17.

[0171] That is, the support element 14 can be formed on the circuit board 11 in an integral manner, or can be fixed to the circuit board 11 by bonding or other means. For example, the support element 14 can also be fixed to the circuit board 11 by welding or other means.

[0172] An accommodation space 1000 is formed between the inner side of the supporting element 14 and the upper side of the circuit board 11. The emitting element 121 and the photodiode 13 are accommodated in the accommodation space 1000.

[0173] like Fig.11A As shown, the upper end of the support element 14 is stepped, and the stepped concave portion of the upper end of the support element 14 has a bearing surface 141, and the bearing surface 141 is used to mount the optical auxiliary element 122. The upper end of the support element 14 also has a raised portion 142, and the raised portion 142 is raised relative to the bearing surface 141, and the raised portion 142 has a certain height.

[0174] The optical auxiliary element 122 is mounted on the carrying surface 141. The supporting element 14 supports the optical auxiliary element 122.

[0175] like Fig. 11BAs shown, a step portion 143 is provided on the inner side of the upper end of the support element 14, and the step portion 143 is formed by extending inward from the inner side of the upper end of the support element 14. The optical auxiliary element 122 is installed on the step portion 143. The support element 14 also has at least one escape hole 140, and the escape hole 140 is provided on one side of the step portion 143. The optical auxiliary element 122 is installed on the step portion 143, and the escape hole 140 is located on the outer side of the optical auxiliary element 122 to prevent the optical auxiliary element 122 from blocking the escape hole 140. The escape hole 140 connects the accommodating space 1000 where the emitting element 121 is located and the outside to allow gas to flow.

[0176] like Fig.11A and Fig. 11B As shown, the transmitting module 10 further includes a supporting base 15, and the supporting base 15 is disposed on the lower surface of the circuit board 11. The supporting base 15 extends downward from the lower surface of the circuit board 11 to a certain height. The supporting base 15 has a hollow portion 1500, and the hollow portion 1500 is formed on the inner side of the supporting base 15. In other words, the supporting base 15 is distributed in an annular shape on a small surface of the circuit board 11. A partial area of ​​the circuit board 11 is exposed through the hollow portion 1500.

[0177] The electronic component 30 may be disposed on the exposed portion of the lower surface of the circuit board 11 through the hollow portion 1500 . The driving element 31 may be disposed on the lower surface of the circuit board 11 through the hollow portion 1500 .

[0178] The support base 15 has a certain height, so that the electronic component 30 is contained in the hollow portion 1500 to protect the electronic component 30 from being squeezed.

[0179] The support base 15 is made of a heat-conducting material to conduct heat to the circuit board 11 and the electronic components 30 .

[0180] In addition, the electronic component 30 is exposed to the air through the hollow portion 1500, and the electronic component 30 can directly exchange heat with the outside. The driving element 31 is arranged in the area of ​​the circuit board 11 exposed in the hollow portion 1500, and the driving element 31 can directly exchange heat with the outside.

[0181] Reference Fig. 12A and Fig. 12BAnother preferred embodiment of the present invention is shown, the transmitting module 10 includes a circuit board 11 and a transmitting assembly 12, and the transmitting assembly 12 is conductively connected to the transmitting assembly 12. The transmitting assembly 12 is arranged on the upper side of the circuit board 11. At least one electronic component 30 is conductively connected to the circuit board 11. Among them, the electronic component 30 includes at least one driving element 31, and the driving element 31 is conductively connected to the circuit board 11. The driving element 31 is arranged on the lower surface of the circuit board 11.

[0182] The transmitting assembly 12 includes a transmitting element 121 and an optical auxiliary element 122 . The transmitting element 121 is disposed on the upper surface of the circuit board 11 , and the optical auxiliary element 122 is disposed above the transmitting element 121 .

[0183] The driving element 31 is disposed on the lower surface of the circuit board 11. The emitting element 121 and the driving element 31 are disposed on the upper and lower surfaces of the circuit board 11 opposite to each other, so that the connection circuit between the emitting element 121 and the driving element 31 is short.

[0184] The transmitting module 10 further includes a photodiode 13 , which is conductively connected to the circuit board 11 . The photodiode 13 is disposed on the upper surface of the circuit board 11 , at one side of the transmitting element 121 .

[0185] The transmitting module 10 further includes a supporting element 14, which is disposed on the upper side of the circuit board 11. The supporting element 14 protrudes upward along the periphery of the circuit board 11. The supporting element 14 is distributed in an annular shape on the upper surface of the circuit board 11. An accommodating space 1000 is formed between the inner side of the supporting element 14 and the upper side of the circuit board 11. The transmitting element 121 is disposed in the accommodating space 1000.

[0186] The support element 14 is integrally formed on the circuit board 11. The support element 14 is integrally formed on the upper surface of the circuit board 11 by a molding process. The optical auxiliary element 122 is mounted on the upper end of the support element 14. The support element 14 supports the optical auxiliary element 122 so that the optical auxiliary element 122 is held above the emitting element 121.

[0187] The transmitting module 10 also includes a supporting base 15, which is in the shape of an inverted bracket. The supporting base 15 is hollow, so that the driving element 31 can be accommodated in the supporting base 15. The supporting base 15 is stably attached to the lower surface of the circuit board 11 by processes such as gluing or soldering. The upper end of the supporting base 15 is fixed to the lower surface of the circuit board 11. The lower end of the supporting base 15 surrounds the driving element 31. Among them, the supporting base 15 is made of a material with heat dissipation performance, such as metal. The driving element 31 is installed on the lower surface of the circuit board 11. The driving element 31 is built into the supporting base 15.

[0188] When the other electronic components 30 are installed on the lower side of the circuit board 11, the support base 15 accommodates the other electronic components 30 in the internal space of the support base 15. The height of the support base 15 can be adjusted according to the design requirements of the transmitting module 10 to adapt to the height of the driving element 31 and the other electronic components 30.

[0189] Reference Fig. 12B ,and Fig. 12A The difference from the example shown is that the support element 14 is not formed on the circuit board 11 in an integral manner. The transmitting module 10 further includes at least one fixing element 17, the lower end of the support element 14 is bonded to the fixing element 17, and the fixing element 17 is bonded to the upper surface of the circuit board 11. The support element 14 is bonded to the circuit board 11 by the fixing element 17. The support elements 14 are distributed in an annular manner on the circuit board 11 to form a certain accommodation space 1000 to accommodate the emitting element 121 on the upper surface of the circuit board 11. The emitting element 121 and the photodiode 13 are accommodated in the accommodation space 1000.

[0190] Reference Fig. 12A The upper end of the support element 14 is stepped, and the stepped concave portion of the upper end of the support element 14 has a bearing surface 141, and the bearing surface 141 is lower than the highest surface of the upper end of the support element 14. The bearing surface 141 is used to mount the optical auxiliary element 122. The stepped portion of the upper end of the support element 14 is raised relative to the bearing surface 141 to form a protrusion 142, and the protrusion 142 has a certain height, and the height of the protrusion 142 is slightly greater than the thickness of the optical auxiliary element 122.

[0191] Preferably, the periphery of the optical auxiliary element 122 is bonded to the carrying surface 141 , and the supporting element 14 supports the optical auxiliary element 122 to keep the optical auxiliary element 122 located above the emitting element 121 .

[0192] and Fig. 12A The difference of the illustrated example is that a step portion 143 is provided inside the upper end of the support element 14, and the step portion 143 extends from the inner side of the upper end of the support element 14 toward the accommodation space 1000. The step portion 143 is step-shaped for mounting the optical auxiliary element 122.

[0193] like Fig. 12A As shown, the support base 15 is fixed to the lower side of the circuit board 11 , and the support base 15 completely wraps the driving element 31 installed on the lower side of the circuit board 11 .

[0194] Reference Fig. 12C ,and Fig. 12A The difference from the illustrated example is that the support base 15 is provided with at least one through hole 152, and the through hole 152 connects the internal space of the support base 15 and the external space of the support base 15. The through hole 152 is provided at a position close to the upper end of the support base 15. The gas in the internal space of the support base 15 can flow outward through the through hole 152. When the transmitting module 10 is working, the temperature changes, which in turn causes the gas volume to change, and the through hole 152 provides space for the gas to flow, so as to eliminate the influence of the gas volume change on the structural stability of the transmitting module 10.

[0195] The through hole 152 is small in size, allowing the gas in the internal space to escape without affecting the stability of the support base 15, and also preventing the external environment from affecting the internal space and components, thereby ensuring a certain barrier property.

[0196] Reference Fig.12D The support element 14 is fixed to the circuit board 11 through the fixing element 17. The optical auxiliary element 122 is mounted on the step portion 143. The support base 15 is provided with the through hole 152 for gas circulation.

[0197] comprehensive FIG. 12A to FIG. 12D The support element 14 may be integrally formed with the circuit board 11, or may be fixed to the circuit board 11 by bonding or other methods. The upper end of the support element 14 may be directly formed into a step shape to mount the optical auxiliary element 122, or the step portion 143 may be formed at the upper end of the support element 14 to mount the optical auxiliary element 122.

[0198] The support base 15 may be implemented as an inverted bracket-shaped hollow structure. The support base 15 may completely wrap the driving element 31, or may be provided with the through hole 152 for gas circulation.

[0199] FIG. 13A to FIG. 14 An example of the present invention is shown, in which the TOF camera module 1 is installed in an electronic device 400. The TOF camera module 1 includes a transmitting module 10 and a receiving module 20, and the TOF camera module 1 also includes a mounting bracket 100, and the mounting bracket 100 assists in mounting the transmitting module 10 and the receiving module 20 to a mainboard 4000 of the electronic device 400. The transmitting module 10 and the receiving module 20 can be connected to the mainboard 4000 respectively.

[0200] The mounting bracket 100 includes a first mounting portion 101 and a second mounting portion 102, and the first mounting portion 101 and the second mounting portion 102 are connected to each other. The transmitting module 10 and the receiving module 20 are respectively arranged on the first mounting portion 101 and the second mounting portion 102, so that the transmitting module 10 and the receiving module 20 are installed on the mainboard 4000 of the electronic device 400 through the mounting bracket 100.

[0201] The first mounting portion 101 surrounds the side of the transmitting module 10, and the second mounting portion 102 surrounds the side of the receiving module 20. The size and height of the first mounting portion 101 and the second mounting portion 102 are respectively suitable for surrounding the side of the transmitting module 10 and the receiving module 20. Fig.13A , the first mounting portion 101 is arranged on one side of the upper part of the second mounting portion 102, the lower end height of the first mounting portion 101 is higher than the lower end height of the second mounting portion 102, and a avoidance space 1010 is formed on the lower side of the first mounting portion 101, so that when the transmitting module 10 is installed on the first mounting portion 101. The transmitting module 10 is suspended relative to the mainboard 4000, and the transmitting module 10 is raised so that the height difference between the transmitting module 10 and the receiving module 20 is kept within a small range. The small range means that the upper end of the receiving module 20 is the same as the upper end of the transmitting module 10 or the difference is small. The receiving module 20 is sunken and installed to the mainboard 4000 to reduce the height of the upper end of the receiving module 20, and the height difference with the upper end of the transmitting module 10 is kept within a small range. The mainboard 4000 may be provided with a mounting hole or a mounting groove to reduce the installation height of the receiving module 20.

[0202] Reference Fig. 13B ,and Fig.13AThe difference is that the lower end of the first mounting portion 101 extends to the mainboard 4000, the lower end of the first mounting portion 101 is fixed to the mainboard 4000, and the first mounting portion 101 supports the transmitting module 10. The first mounting portion 101 can support the transmitting module 10 more stably and maintain the stability of the overall structure. The transmitting module 10 is lifted by the first mounting portion 101 so that the height difference between the transmitting module 10 and the receiving module 20 is kept within a small range. It is worth mentioning that the lower side of the transmitting module 10, that is, the lower part of the first mounting portion 101 is hollow, to form the avoidance space 1010 for installing electronic components.

[0203] The internal spaces of the first mounting portion 101 and the second mounting portion 102 of the mounting bracket 100 define the mounting position and orientation of the transmitting module 10 and the receiving module 20. When the transmitting module 10 and the receiving module 20 are mounted in the first mounting portion 101 and the second mounting portion 102, respectively, the positions of the transmitting module 10 and the receiving module 20 can be adjusted, so that the optical axes of the transmitting module 10 and the receiving module 20 can be adjusted, so as to facilitate adjusting the optical axes of the transmitting module 10 and the receiving module 20 to be parallel to each other, so as to obtain higher imaging quality.

[0204] Reference Fig. 13C , the transmitting module 10 and the receiving module 20 are respectively connected to a connector 70, and the transmitting module 10 and the receiving module 20 are respectively connected to the main board 4000 through the connector 70. Wherein, the transmitting module 10 and the receiving module 20 are respectively connected to a flexible board, each of the flexible boards is connected to the connector 70, and the connector 70 is connected to the main board 4000. The transmitting module 10 and the receiving module 20 are conductively connected to the main board 4000. The transmitting module 10 and the receiving module 20 are conductively connected to each other.

[0205] The difference from the preferred embodiment of the transmitting module 10 described above is that: FIG. 13A to FIG. 14 The lower side of the transmitting module 10 shown in the figure is not provided with the supporting base 15. The lower side of the transmitting module 10 is the avoidance space 1010, which can be used to install other electronic components 30 on the main board 4000, so that the electronic components 30 and the transmitting module 10 are stacked on the main board 4000 to save space.

[0206] It is worth mentioning that the electronic components of the mainboard 4000 can be installed in the avoidance space 1010, so that the electronic components of the mainboard 4000 and the transmitting module 10 of the TOF camera module 1 are stacked, thereby improving the space utilization of the mainboard 4000.

[0207] Fig.15 The specific application of a preferred embodiment of the above-mentioned transmitting module 10 of the present invention is shown, and the TOF camera module 1 is installed in an electronic device 400.

[0208] The TOF camera module 1 includes a transmitting module 10 and a receiving module 20. The transmitting module 10 and the receiving module 20 are assembled independently. That is, the transmitting module 10 and the receiving module 20 can be independently installed on a mainboard 4000 of the electronic device 400. The mainboard 4000 can be implemented as the mainboard of the electronic device 400. The transmitting module 10 can be directly installed on the mainboard 4000. The receiving module 20 is then installed on the mainboard 4000, so that the transmitting module 10 and the receiving module 20 form the TOF camera module 1 in the electronic device 400.

[0209] The TOF camera module 1 further includes a fixing bracket 80, which is fixed to the main board 4000, and the receiving module 20 is fixed to the main board 4000 by the fixing bracket 80. The receiving module 20 is fixedly connected to the fixing bracket 80, and the fixing bracket 80 supports the receiving module 20 so that the receiving module 20 is stably fixed to the main board 4000. When the receiving module 20 is fixed to the main board 4000, the installation position and orientation of the receiving module 20 can be adjusted, and the optical axis of the receiving module 20 can be adjusted so that the optical axes of the receiving module 20 and the transmitting module 10 are parallel to each other to achieve a better imaging effect.

[0210] In another example of the present invention, the transmitting module 10 can also be fixed to the fixing bracket 80, so as to be fixed to the main board 4000 through the fixing bracket 80, and the fixing bracket 80 supports the reflecting module 10 to ensure the stability of the transmitting module 10. Before the transmitting module 10 is fixed to the main board 4000, the installation position and orientation of the transmitting module 10 can be adjusted, and its optical axis can also be adjusted to be parallel to the optical axis of the receiving module 20.

[0211] Generally speaking, the height of the receiving module 20 is greater than the height of the transmitting module 10. In order to keep the height difference between the upper end of the receiving module 20 and the upper end of the transmitting module 10 within a small range, the height difference is within a small range. The height of the receiving module 20 at the installation position of the mainboard 4000 is lower than the installation height of the transmitting module 10.

[0212] like Fig.16 and Fig.17 As shown, the mainboard 4000 has an installation area 4001, and the installation area 4001 is formed on the surface of the mainboard 4000. The transmitting module 10 is fixed to the installation area 4001. The transmitting module 10 can be fixed to the installation area 4001 by welding. The mainboard 4000 also includes a mounting groove 4002, and the mounting groove 4002 is formed on one side of the mounting area 4001. The mounting groove 4002 is recessed downward relative to the mounting area 4001. The receiving module 20 is installed in the mounting groove 4002. The receiving module 20 is conductively connected to the mainboard 4000.

[0213] The receiving module 20 is installed in the sunken installation groove 4002, and the transmitting module 10 is installed in the installation area 4001. The difference in installation position height can make the height difference between the receiving module 20 and the transmitting module 10 relative to the mainboard 4000 smaller.

[0214] The positional relationship between the receiving module 20 and the transmitting module 10 is varied. The receiving module 20 can be located on any side of the transmitting module 10. Fig.16 and Fig.17 shown.

[0215] The thickness of the mainboard 4000 of the electronic device 400 is affected by the design requirements of the electronic device 400, and the thickness is limited. The thickness of the mounting groove 4002 is limited by the thickness of the mainboard 4000. Therefore, the difference in the installation height of the receiving module 20 relative to the transmitting module 10 is limited. The mainboard 4000 is not thick enough, resulting in the insufficient thickness of the mounting groove 4002, so that the upper end of the receiving module 10 cannot maintain a height difference with the upper end of the transmitting module 10 within a small range. Therefore, another example is provided to illustrate other installation methods of the TOF camera module 1.

[0216] Fig.18 Another installation method of the TOF camera module 1 in the electronic device 400 is shown.

[0217] The TOF camera module 1 further includes an auxiliary bracket 50, which is conductively connected to the transmitting module 10. The auxiliary bracket 50 is installed on the lower side of the transmitting module 10. The transmitting module 10 is arranged on the auxiliary bracket 50, and the auxiliary bracket 50 supports the transmitting module 10 to increase the height of the transmitting module 10 so that the upper end of the transmitting module 10 and the upper end of the receiving module 20 are roughly flush. The auxiliary bracket 50 is built-in with a connection circuit so that the auxiliary bracket 50 is conductively connected to the main board 4000. The transmitting module 10 is conductively connected to the main board 4000 through the auxiliary bracket 50.

[0218] At least one of the electronic components 30 is conductively connected to the transmitting module 10. The electronic component 30 can be arranged on the circuit board 11 of the transmitting module 10, or on the main board 4000 of the electronic device 400. The position of the electronic component 30 can be designed according to the design requirements of the TOF camera module 1 and the design requirements of the electronic device 400.

[0219] In an example of the present invention, the auxiliary bracket 50 and the mounting groove 4002 can be used together to achieve that the height difference between the upper ends of the transmitting module 10 and the receiving module 20 is kept within a relatively small range.

[0220] In another example of the present invention, the receiving module 20 is conductively mounted on the surface of the main board 4000, and the transmitting module 10 is mounted on the main board 4000 via the auxiliary bracket 30, that is, the auxiliary bracket 50 is provided to adjust the height of the transmitting module 10 so that the height difference between the upper ends of the transmitting module 10 and the receiving module 20 is maintained within a smaller range.

[0221] Fig.19 and Fig. 20 Another installation method of the TOF camera module 1 described in the present invention in the electronic device 400 is shown from different angles.

[0222] The mainboard 4000 is provided with an installation area 4001 and a installation hole 4003, and the installation hole 4003 is located at one side of the installation area 4001. The transmitting module 10 of the TOF camera module 1 is installed in the installation area 4001. The transmitting module 10 is welded to the installation area 4001, and the receiving module 20 is installed in the installation hole 4003. The installation hole 4003 runs through the mainboard 4000, so that the installation height of the receiving module 20 is lower than the installation height of the transmitting module 10, so that the height difference between the receiving module 20 and the transmitting module 10 after installation is kept within a small range.

[0223] It is worth mentioning that the mounting hole 4003 can be arranged on any side around the mounting area 4001 , and the specific arrangement position can be adjusted according to the design requirements of the electronic device 400 .

[0224] It is also worth mentioning that the receiving module 20 can be fixed to the mainboard 4000 via the fixing bracket 80 .

[0225] The transmitting module 10 and the receiving module 20 of the TOF camera module 1 of the present invention are independent of each other. The transmitting module 10 and the receiving module 20 are respectively installed in the electronic device 400. In other embodiments of the present invention, the TOF camera module 1 can form a whole. Fig.21 A preferred embodiment of the TOF camera module 1 of the present invention is shown. The TOF camera module 1 is assembled into a whole. The support base 15 of the transmitting module 10 is integrally formed on the lower surface of the circuit board 11, and the height of the support base 15 can be adjusted.

[0226] The height of the support base 15 is adjusted according to the height of the receiving module 20, so that the height difference between the overall transmitting module 10 and the receiving module 20 is within a small range. The support base 15 has a built-in connection circuit and is connected to the circuit board 11.

[0227] The TOF camera module 1 further includes a main circuit board 60, the transmitting module 10 and the receiving module 20 are respectively mounted on the main circuit board 60, and the transmitting module 10 and the receiving module 20 are respectively conductively connected to the main circuit board 60. The circuit board 11 is connected to the main circuit board 60 through the connection circuit built into the support base 15.

[0228] The height difference between the transmitting module 10 and the receiving module 20 is within a relatively small range.

[0229] After the transmitting module 10 and the receiving module 20 are installed on the main circuit board 60 , the TOF camera module 1 is formed, and then the TOF camera module 1 is integrally installed on the mainboard 4000 of the electronic device 400 .

[0230] It is worth mentioning that at least one of the electronic components 30 can be installed on the main circuit board 60 to be conductively connected to the transmitting module 10 to support the operation of the transmitting module 10 .

[0231] Reference Fig. 22 The TOF camera module 1 also includes a connector 70 , which connects the transmitting module 10 and the receiving module 20 .

[0232] Fig.23 Another preferred embodiment in which the TOF camera module 1 is assembled into a whole is shown, wherein the TOF camera module 1 further comprises a main circuit board 60, and the transmitting module 10 and the receiving module 20 are conductively mounted on the same side of the main circuit board 60. The TOF camera module 1 further comprises a second supporting base 18, which is disposed on the lower side of the transmitting module 10, and the transmitting module 10 is supported by the second supporting base 18. The transmitting module 10 is lifted by the second supporting base 18. At least one of the electronic components 30 may be disposed on the lower side of the second supporting base 18, and at least one of the electronic components 30 may be conductively connected to the main circuit board 60.

[0233] The TOF camera module 1 also includes a connecting component 19, one end of which is connected to the transmitting module 10, and the other end of the connecting component 19 is connected to the main circuit board 60. The connecting component 19 connects the transmitting module 10 and the main circuit board 60 in a conductive manner.

[0234] The connection assembly 19 includes a first connection body 191 and a second connection body 192, wherein the first connection body 191 is connected to the second connection body 192, and the second connection body 192 is installed on the transmitting module 10. The second connection body 192 is installed on the upper side of the second supporting base 18. The transmitting module 10 is installed on the upper side of the second connection body 192. The second connection body 192 is conductively connected to the transmitting module 10. One end of the first connection body 191 is connected to the second connection body 192, and the other end of the first connection body 191 is connected to the main circuit board 60, so that the transmitting module 10 is conductively connected to the main circuit board 60. The first connection body 191 is implemented as a soft board.

[0235] The second support base 18 may be formed by a molding process, such as Fig.23 See Fig.24 The bracket can also be a metal bracket or a bracket made of other materials with good heat dissipation performance.

[0236] In some embodiments, the transmitting module 10 and the receiving module 20 of the TOF camera module 1 are independent entities, and the transmitting module 10 and the receiving module 20 can be packaged independently to avoid the instability of the connection between the transmitting module 10 and the receiving module 20, which affects the stability of the overall TOF camera module 1. The transmitting module 10 and the receiving module 20 can be shipped, transported, and installed in the electronic device 400 independently, reducing defective products generated during transportation and reducing losses.

[0237] The positional relationship and installation method between the transmitting module 10 and the receiving module 20 can also be flexibly adjusted according to the design and assembly requirements of the electronic device 400, thereby improving the adaptability of the transmitting module 10 and the receiving module 20 to the electronic device 400 and adapting to the personalized needs of the electronic device 400.

[0238] In other embodiments, the TOF camera module 1 forms a whole, so as to be installed in the electronic device 400 as a whole.

[0239] It is worth noting that the setting position of the transmitting element 121 of the transmitting module 10 is not restricted. The transmitting element 121 can be set on the upper surface of the circuit board 11 and is not limited to a position close to the receiving module 20. It can also be set to a position away from the receiving module 20.

[0240] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A transmitting module, characterized in that: include: a circuit board; a driving element; as well as A transmitting element, wherein the transmitting element and the driving element are arranged on the upper and lower surfaces of the circuit board opposite to each other with the circuit board separated therefrom, the transmitting element and the driving element are respectively conductively connected to the circuit board, wherein the driving element transmits a pulse current to the transmitting element to control the transmitting element to emit a light pulse signal, and the light pulse signal is emitted to the detected object and then returns to form a return signal; The transmitting module further comprises a supporting base, wherein the supporting base is integrally formed and arranged on the lower surface of the circuit board, and the height of the supporting base can be adjusted; The height of the support base is adjusted according to the height of a receiving module that receives the return signal, so that the height difference between the overall transmitting module and the receiving module is within a relatively small range, and the support base is built-in with a connecting circuit, and the built-in connecting circuit is connected to the circuit board; The radiating element and the driving element are stacked on the circuit board along a vertical direction, and a conducting distance between the radiating element and the driving element is only equal to the thickness of the circuit board. 2 . The transmitting module according to claim 1 , wherein the driving element is disposed below the transmitting element to shorten the distance between the driving element and the transmitting element.

3. The transmitting module according to claim 2, wherein an area of ​​the circuit board spaced between the driving element and the transmitting element is provided with at least one connecting circuit, and the connecting circuit conducts between the driving element and the transmitting element. 4 . The transmitting module according to claim 3 , wherein the transmitting module further comprises a supporting element, wherein the supporting element is distributed in an annular shape on the upper surface of the circuit board.

5. The transmitting module according to claim 4, wherein the transmitting module comprises a transmitting assembly, the transmitting assembly comprises the transmitting element and an optical auxiliary element, and the optical auxiliary element is installed on the upper end of the supporting element. The transmitting module according to claim 5 , wherein at least one gap is formed between the optical auxiliary element and the supporting element. The transmitting module according to claim 4 , wherein an upper end of the supporting element is stepped. 8 . The transmitting module according to claim 4 , wherein the supporting element is integrally formed on an upper surface of the circuit board. 9 . The transmitting module according to claim 4 , wherein the transmitting module further comprises a fixing element, and the supporting element is fixed to the upper surface of the circuit board through the fixing element. 10 . The transmitting module according to claim 1 , wherein the supporting base has at least one channel, and the channel extends from the lower surface of the supporting base to the lower surface of the driving element to connect the driving element and the external space of the supporting base. 11 . The transmitting module according to claim 1 , wherein the transmitting module further comprises at least one heat conducting element, wherein the heat conducting element is disposed on a lower side of the driving element. 12 . The transmitting module according to claim 1 , wherein the supporting base is distributed in a ring shape on the lower surface of the circuit board, and a hollow portion is formed inside the supporting base to accommodate the driving element.

13. A TOF camera module, characterized in that: include: The transmitting module according to any one of claims 1 to 12; and A receiving module, wherein the receiving module can be conductively connected to the transmitting module.

14. The TOF camera module according to claim 13, wherein the TOF camera module further comprises a main circuit board, and the transmitting module and the receiving module are respectively and conductively arranged on the same side of the circuit board.

15. The TOF camera module according to claim 14, wherein the TOF camera module further comprises a second supporting base, the transmitting module is arranged on the second supporting base, the second supporting base supports the transmitting module, wherein the second supporting base can be conductively connected to the transmitting module, and wherein the second supporting base is fixed to the main circuit board. 16 . The TOF camera module according to claim 15 , wherein the height of the second supporting base is adjusted to adjust the height of the transmitting module so that the height difference between the receiving module and the transmitting module is smaller. 17 . The TOF camera module according to claim 14 , wherein the TOF camera module further comprises at least one electronic component, and at least one of the electronic components is disposed on the main circuit board.

18. An electronic device, characterized in that: include: A TOF camera module, wherein the TOF camera module comprises: A transmitting module as claimed in any one of claims 1 to 12; and a receiving module; and A main board, wherein the transmitting module and the receiving module are respectively mounted on the main board, the upper ends of the transmitting module and the receiving module are flush, the transmitting module and the receiving module are respectively connected to a connector through a flexible board, each of the connectors is respectively connected to the main board, and the transmitting module and the receiving module are conductively connected to the main board.

19. The electronic device according to claim 18, wherein the TOF camera module further comprises a mounting bracket, the mounting bracket comprising a first mounting portion and a second mounting portion connected to each other, the transmitting module is fixed to the first mounting portion, the receiving module is fixed to the second mounting portion, and the mounting portion is fixed to the mainboard.

20. An electronic device according to claim 19, wherein the first mounting portion is arranged on one side of the upper portion of the second mounting portion, and the lower end height of the first mounting portion is higher than the lower end height of the second mounting portion, so that the transmitting module is lifted by the first mounting portion, and an avoidance space is formed between the lower side of the first mounting portion and the mainboard.

21. The electronic device according to claim 19, wherein the mounting bracket assists the transmitting module and the receiving module in adjusting their respective optical axes so that the optical axes of the transmitting module and the receiving module are parallel.

22. The electronic device according to claim 18, wherein the mainboard has a mounting area, and the transmitting module is fixed to the mounting area.

23. An electronic device according to claim 22, wherein the mainboard has a mounting groove, the mounting groove is arranged on any side of the mounting area, and the receiving module is installed in the mounting groove so that the upper end of the receiving module is flush with the upper end of the transmitting module.

24. The electronic device according to claim 22, wherein the mainboard has a mounting hole, the mounting hole penetrates the mainboard, and the receiving module is mounted in the mounting hole so that the upper end of the receiving module is flush with the upper end of the transmitting module.

25. The electronic device according to claim 23 or 24, wherein the TOF camera module further comprises a fixing bracket, wherein the fixing bracket fixes the receiving module to the mainboard, wherein the fixing bracket assists in adjusting the optical axis of the receiving module.

26. The electronic device according to claim 18, wherein the TOF camera module further comprises an auxiliary bracket, the transmitting module is disposed on the auxiliary bracket, the auxiliary bracket supports the transmitting module, wherein the auxiliary bracket is installed on the mainboard to raise the height of the transmitting module. 27 . The electronic device according to claim 26 , wherein the receiving module is mounted on the main board, and an upper end of the receiving module is flush with an upper end of the transmitting module.

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