Scattering film and electronic device comprising a scattering film

Abstract

The application discloses a scattering film and an electronic device comprising the same, wherein the scattering film comprises a carrier layer configured to emit and / or receive microwave signals and a first protruding structure arranged on the surface of the carrier layer, and the microwave is reflected when passing through the first protruding structure. According to the scheme, the first protruding structure is arranged, the microwave passing through the first protruding structure can be reflected, the spatial range of the emission and / or reception of the originally directional transmission microwave is increased, and the coverage range of the microwave signal is improved.

Description

Technical Field

[0001] This invention relates to the field of communication technology, and in particular to a scattering film and an electronic device comprising the scattering film. Background Technology

[0002] Microwave communication uses electromagnetic waves with wavelengths between 0.1 millimeters and 1 meter. This wavelength range corresponds to frequencies from 300 MHz (0.3 GHz) to 3 THz. Microwave communication is directional due to the linear transmission characteristics of microwaves; if a user is not within the specified directional area, they cannot receive the signal, creating a communication dead zone. Summary of the Invention

[0003] One object of the present invention is to provide a scattering film that can scatter microwaves after passing through it, thereby increasing the spatial range of microwave transmission and / or reception and minimizing communication dead zones.

[0004] Another object of the present invention is to provide an electronic device with a wide microwave signal transmission and / or reception range, providing a good user experience.

[0005] To achieve the above objectives, the following technical solution is provided:

[0006] On one hand, a scattering film is provided, comprising: a first carrier layer configured for transmitting and / or receiving microwave signals, and a first protruding structure disposed on the surface of the carrier layer, wherein microwaves are reflected when passing through the first protruding structure. This solution, by providing the first protruding structure, allows microwaves to be reflected upon passing through it, thereby increasing the spatial range for transmitting and / or receiving microwaves that were previously only directional, and improving the coverage of the microwave signal.

[0007] On the other hand, an electronic device is provided, including the aforementioned scattering film and an antenna device, wherein a surface of the antenna device is connected to the scattering film.

[0008] Preferably, an electromagnetic scattering film is disposed on the other surface of the antenna device opposite to the surface on which the scattering film is disposed, and the electromagnetic scattering film includes at least a second carrier layer, wherein the second carrier layer is provided with through holes penetrating its upper and lower surfaces.

[0009] The electronic device provided in this embodiment of the invention has a scattering film connected to an antenna device. Microwave signals transmitted and / or received by the antenna device can be reflected outward by the first protruding structure of the scattering film, expanding the spatial range of microwave signal transmission and / or reception of the electronic device. In addition, an electromagnetic scattering film is also provided on the other side of the antenna device. The microwaves transmitted by the antenna device and the microwaves reflected by the scattering film can be diffracted through the through holes of the electromagnetic scattering film, further expanding the spatial range of microwave transmission and / or reception, avoiding the signal blind zone problem of the electronic device, and improving the user experience. Attached Figure Description

[0010] Figure 1 A schematic diagram of the structure of a scattering film (receiving microwave signals) provided in an embodiment of the present invention;

[0011] Figure 2 A schematic diagram of the structure of a scattering film (emitting microwave signals) provided in an embodiment of the present invention;

[0012] Figure 3 This is a schematic diagram of the structure of a scattering film with a connecting layer according to an embodiment of the present invention;

[0013] Figure 4 This is a schematic diagram of the first structure of a scattering film provided in an embodiment of the present invention;

[0014] Figure 5 This is a schematic diagram of the second structure of the scattering film provided in an embodiment of the present invention;

[0015] Figure 6 This is a schematic diagram of the third structure of the scattering film provided in an embodiment of the present invention;

[0016] Figure 7 This is a schematic diagram of the structure of a scattering film provided in another embodiment of the present invention;

[0017] Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention;

[0018] Figure 9 A schematic diagram of the structure of an electronic device provided in another embodiment of the present invention;

[0019] Figure 10 This is a schematic diagram of the structure of an electronic device provided in another embodiment of the present invention;

[0020] Figure 11 A schematic diagram of the structure of an electronic device provided in another embodiment of the present invention.

[0021] Figure label:

[0022] 1-Scattering film; 11-First carrier layer; 111-Signal line; 12-First connecting layer; 13-First protruding structure; 131-Protrusion; 14-First insulating layer; 15-Second protruding structure; 2-Antenna device; 21-Antenna line; 22-Substrate; 3-Electromagnetic scattering film; 31-Second carrier layer; 311-Through hole; 32-Second connecting layer; 33-Third protruding structure; 34-Second insulating layer; 35-Fourth protruding structure. Detailed Implementation

[0023] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Figure 1 This is a schematic diagram of the scattering film provided in one embodiment of the present invention. Please refer to [link / reference]. Figure 1 As shown, the scattering film 1 provided in this embodiment of the invention includes: a first carrier layer 11 and a first protruding structure 13 disposed on a surface of the first carrier layer 11. In the field of communication technology, signal transmission is an important means of realizing data exchange, and microwave signal transmission is one such means. Because microwave signals are transmitted linearly along a predetermined direction, microwave signals may not be received in areas not in the predetermined direction, or microwave signals may not be transmitted to areas outside the predetermined direction, leading to communication failure. Figure 1 The arrow shown is an exemplary microwave transmission direction. The scattering film provided in the embodiment of the present invention adopts the principle of diffuse reflection. By setting a first protruding structure 13 on the first carrier layer 11, when microwaves are emitted and pass through the first protruding structure 13, reflection will occur, which changes the movement path of the microwaves that were originally only transmitted in one direction. After reflection, multiple transmission paths are generated, expanding the spatial range of microwave transmission and / or reception.

[0025] The first carrier layer 11 of the present invention is configured to transmit and / or receive microwave signals. The first carrier layer 11 may include a metal layer that reflects microwave signals. For example, the first carrier layer 11 itself is made of metal. The first carrier layer 11 may also include an insulating layer, in which case the reflection of microwave signals is mainly achieved by a first protruding structure. In the above embodiments, the first carrier layer 11 is configured to receive microwave signals. In other embodiments of the present invention, the first carrier layer 11 may also be configured to transmit microwave signals. Figure 2As shown in the illustrated embodiment, conductive metal signal lines 111 are disposed on the surface or inside the first carrier layer 11. The arrows in the figure indicate exemplary microwave transmission directions. When the first carrier layer 11 includes signal lines 111, the first carrier layer 11 can emit microwave signals outward. The microwave signals are reflected when they pass through the first protruding structure 13, thereby expanding the spatial range of microwave signal emission.

[0026] For the material used to achieve microwave reflection, the present invention preferably uses a metal material for the first protruding structure 13. However, the present invention is not limited to this; any material capable of microwave reflection can be used, such as an alloy material for the first protruding structure 13. In a preferred embodiment, the first carrier layer 11 includes a metal layer, and the first protruding structure 13 is made of metal. The metal layer can be, for example, a circuit board with conductive metal patterns, and the first protruding structure 13 can be a metal protrusion disposed on the metal layer. By using the same material for the first carrier layer 11 and the first protruding structure 13, the bonding force between the two can be improved, making it less likely for the first protruding structure 13 to detach from the first carrier layer 11, thus ensuring the service life and stability of the scattering film 1. Of course, in other embodiments, the first carrier layer 11 may also include an insulating layer, for example, a resin material. In this case, the first protruding structure 13 on the first carrier layer 11 is made of metal and includes multiple protrusions, with the distance S1 between adjacent protrusions being less than the wavelength of the microwave. This also allows the microwave to be reflected when passing through the first protruding structure 13. Preferably, the distance S1 between adjacent protrusions is 0 μm-500 μm. It should be noted that the distance between adjacent protrusions refers to the minimum distance between the contours of two adjacent protrusions. More preferably, the first carrier layer 11 and / or the first protruding structure 13 may be made of any one of the following metallic materials or two or more alloy materials: copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver, or gold.

[0027] The thickness d1 of the first carrier layer 11 of the present invention should be as thin as possible while ensuring that the product does not fail, so as to make the overall scattering film 1 thinner and lighter. In the embodiments of the present invention, the thickness d1 of the first carrier layer 11 is preferably 0.1μm-10μm.

[0028] Figure 3 This is a schematic diagram of the structure of a scattering film according to an embodiment of the present invention. Figure 3As shown, to facilitate the connection of the scattering film 1 of the present invention with other components, a first connecting layer 12 is provided on the surface of the first carrier layer 11. The first connecting layer 12 and the first protruding structure 13 are located on the same surface of the first carrier layer 11, and the first protruding structure 13 extends into the first connecting layer 12. In a preferred embodiment of the present invention, the first connecting layer 12 is an adhesive film layer. By providing the adhesive film layer, the scattering film 1 of this embodiment can easily achieve external connection. To ensure the reliability of the connection, the adhesive film layer covers all the first protruding structures 13. Therefore, in this embodiment, the height h1 of the first protruding structure 13 is ≦ the thickness d2 of the first connecting layer 12. Through this design, it is ensured that the first protruding structure 13 extends into the first connecting layer 12 but does not extend beyond it. It should be noted that the first protruding structure 13 may contain multiple protrusions 131 of different heights. In this case, the height h1 of the first protruding structure 13 refers to the highest height of all protrusions 131. The outer surface of the adhesive film layer and the surface of the first carrier layer 11 can be a flat plane without undulations or a non-flat plane with gentle undulations; the present invention does not limit this. Preferably, the material used for the adhesive film layer is selected from any one of the following materials: epoxy resin, modified epoxy resin, acrylic acid, modified rubber, thermoplastic polyimide, modified thermoplastic polyimide, polyurethane, polyacrylate, and silicone.

[0029] The first protruding structure 13 of this embodiment includes a plurality of protrusions 131. The protrusions 131 are arranged in a matrix array on the first carrier layer 11. Adjacent protrusions 131 can be connected or spaced apart. The present invention does not impose specific limitations on the size of the protrusions 131; the sizes of the plurality of protrusions 131 can be the same or different. Figure 4 This is a schematic diagram of the first structure of the scattering film provided in an embodiment of the present invention. In this embodiment, a plurality of protrusions 131 are arranged at intervals on the surface of the first carrier layer 11. Figure 5 This is a schematic diagram of a second structure of a scattering film provided in an embodiment of the present invention. In this embodiment, a plurality of protrusions 131 are arranged continuously on the surface of the first carrier layer 11. Figure 6 This is a schematic diagram of a third structure of a scattering film provided in an embodiment of the present invention. In this embodiment, a portion of the plurality of protrusions 131 are arranged at intervals on the surface of the first carrier layer 11, while another portion is arranged continuously on the surface of the first carrier layer 11.

[0030] In embodiments of the present invention, the shape of the first protruding structure 13 can be diverse according to actual needs, and can be a regular or irregular three-dimensional geometric shape. In some examples, the shape of the first protruding structure 13 is one or more of the following: pointed, inverted conical, granular, dendritic, columnar, and blocky. For example, Figure 4 In the example, the first protruding structure 13 is a columnar structure. Figure 5In the example, the first protruding structure 13 is a triangle. Figure 6 In the example, the first protruding structure 13 is an irregular curved surface shape. Those skilled in the art will understand that the shape of the first protruding structure 13 can be applied to this invention as long as it possesses any one or more of the following reflective surfaces that are conducive to microwave reflection: a slope, an arc, a plane, or an irregular shape. By designing the reflective surface, the purpose of this invention—to change the microwave transmission path through reflection—can be achieved.

[0031] Figure 7 This is a schematic diagram of the scattering film provided in another embodiment of the present invention. Please refer to... Figure 7 In this embodiment, a first insulating layer 14 is provided on the surface opposite to the surface of the first carrier layer 11 where the first protruding structure 13 is provided. The first insulating layer 14 has insulating and protective functions, preventing short circuits caused by the first carrier layer 11 coming into contact with other external electronic components during the use of the scattering film 1, and also protecting the first carrier layer 11 from damage during use. Preferably, the first insulating layer 14 is any one of the following: a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed after curing epoxy resin ink, a film layer formed after curing polyurethane ink, a film layer formed after curing modified acrylic resin, or a film layer formed after curing polyimide resin. To improve the connection reliability between the first carrier layer 11 and the first insulating layer 14 and prevent peeling or detachment between the first insulating layer 14 and the first carrier layer 11, this embodiment of the invention provides a second protruding structure 15 extending into the first insulating layer 14 on the surface of the first carrier layer 11. Figure 7 As shown, the second protruding structure 15 includes multiple protrusions that protrude from the surface of the first carrier layer 11 toward the first insulating layer 14. Of course, those skilled in the art will understand that the protrusions can also protrude from the first insulating layer 14 toward the surface of the first carrier layer 11. This invention does not impose specific limitations on the shape, number, or size of the second protruding structure 15; any protrusion that improves the connection reliability between the first insulating layer 14 and the first carrier layer 11 is applicable to this invention. For example, the shape of the second protruding structure 15 can be one or more of the following: pointed, inverted conical, granular, dendritic, columnar, or blocky. Figure 7In the example, the second protruding structure 15 is triangular in shape. Furthermore, the height h2 of the second protruding structure 15 is ≤ the thickness d3 of the first insulating layer 14. This design ensures that the second protruding structure 15 extends into the first insulating layer 14 but does not protrude beyond it, thus preventing the first insulating layer 14 from failing. It should be noted that when the second protruding structure 15 includes multiple protrusions of varying heights, the height h2 of the second protruding structure refers to the highest height among all protrusions. Preferably, the thickness d3 of the first insulating layer 14 is 1μm-25μm, and the height h2 of the second protruding structure 14 is 0.1μm-15μm.

[0032] To adapt to more application scenarios, the scattering film 1 of this invention has a flexible, foldable, and bendable structure. Specifically, the first carrier layer 11 can be made flexible, for example, an FPC circuit board. The adhesive film layer for connection provided on one surface of the first carrier layer 11 is foldable, and the first insulating layer 14 for protection provided on the other surface of the first carrier layer 11 is also bendable, thus giving the scattering film 1 of this invention foldable and bendable properties. In practical use, the scattering film can be bent or folded into any shape, such as a ring structure or a semi-closed structure, as needed, for example, an arc structure, an elliptical structure, or a stacked structure.

[0033] An embodiment of the present invention provides a method for preparing a scattering film, the method comprising the steps of:

[0034] (1) A first carrier layer 11 is provided, the surface of the first carrier layer 11 has a first protrusion structure 13, and the first protrusion structure 13 is integrally formed with the first carrier layer 11;

[0035] When the first carrier layer 11 is a circuit board with conductive patterns, the specific position of the first protrusion structure 13 in the circuit board can be pre-marked, and the first carrier layer 11 with the first protrusion structure 13 can be formed in one step through the circuit board processing technology.

[0036] (2) A first connecting layer 12 is formed on the surface of the first carrier layer 11, and the first connecting layer 12 at least covers the first protruding structure 13. When the first connecting layer 12 is an adhesive film layer, the adhesive film layer can be obtained by first coating or printing an adhesive material on the surface of the first carrier layer 11 and then performing a curing process, or by first coating the adhesive film layer on a release film and then pressing and transferring the adhesive film layer onto the surface of the first carrier layer 11 through the release film, and the adhesive film layer at least covers the first protruding structure 13.

[0037] Another embodiment of the present invention provides a method for preparing a scattering film, the method comprising the steps of:

[0038] (1) Provide a first carrier layer 11: that is, provide a carrier layer material with conductive metal patterns;

[0039] (2) Forming a first protruding structure 13 on the surface of the first carrier layer 11: forming a metal protrusion on the carrier layer material with conductive metal pattern by one or more of the following methods: electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc.; wherein, the surface of the first carrier layer itself can be a flat surface without undulations or a non-flat surface with undulations.

[0040] (3) A first connecting layer 12 is formed on the surface of the first carrier layer 11 where the first protruding structure 13 is provided, and the first connecting layer 12 at least covers the first protruding structure 13.

[0041] When the first connecting layer 12 is an adhesive film layer, the adhesive film layer can be obtained by first coating or printing an adhesive material on the surface of the first carrier layer 11 and then curing it, or by first coating the adhesive film layer on the release film and then pressing and transferring the adhesive film layer onto the surface of the first carrier layer through the release film. The adhesive film layer at least covers the first protruding structure 13.

[0042] Figure 8 This is a schematic diagram of the structure of an electronic device provided according to an embodiment of the present invention. Please refer to... Figure 8 As shown, an embodiment of the present invention provides an electronic device including an antenna device 2 and a scattering film 1, with one surface of the antenna device 2 connected to the scattering film 1. By connecting the scattering film 1 to the antenna device 2, microwave signals emitted by the antenna device 2 are reflected by a first protruding structure 13 of the scattering film 1. In this embodiment, the antenna device 2 is connected to the scattering film 1 via a first connecting layer 12. In other embodiments, the antenna device 2 may also be connected to the scattering film 1 via a third connecting layer (not shown) disposed on the surface of the antenna device 2.

[0043] Figure 9 A schematic diagram of the structure of an electronic device provided according to another embodiment of the present invention (the arrows in the figure indicate the microwave transmission direction). The first carrier layer 11 of the scattering film 1 includes signal lines 111. The scattering film 1 is connected to the antenna device 2 through a first connecting layer 12. The microwave signal emitted by the signal lines 111 is reflected by the first protruding structure 13, expanding the spatial range of microwave signal transmission. This design enhances the signal coverage of the electronic device and improves the user experience. Specifically, the antenna device 2 includes antenna lines 21 and a substrate 22 for mounting the antenna lines 21. The surface of the substrate 22 is bonded to the adhesive layer of the scattering film 1, realizing the connection between the antenna device 2 and the scattering film 1.

[0044] Figure 10This is a schematic diagram of the structure of an electronic device provided in another embodiment of the present invention. In this embodiment, an electromagnetic scattering film 3 is provided on the other surface of the antenna device 2 opposite to the surface on which the scattering film 1 is provided. The electromagnetic scattering film 3 includes: a second carrier layer 31 and a second connecting layer 32. The second carrier layer 31 is provided with through holes 311 penetrating its upper and lower surfaces. The second connecting layer 32 is provided on one surface of the second carrier layer 31 and is used to connect the antenna device 2. By providing an electromagnetic scattering film 3 on the other side of the antenna device 2, the electromagnetic scattering film 3 achieves rapid connection with the antenna device 2 through a second connecting layer 32. The second connecting layer 32 can be an adhesive film layer, enabling rapid adhesive bonding with the antenna device 2. Furthermore, the electromagnetic scattering film 3 also has through-holes 311 penetrating its upper and lower surfaces. Microwaves received and transmitted by the antenna device 2 undergo diffraction after passing through the through-holes 311, expanding the spatial range for microwave signal reception and / or transmission. Simultaneously, microwaves reflected by the scattering film 1 also enter the through-holes 311, further expanding the spatial range for microwave signal reception and / or transmission. This transforms microwave transmission from directional to multi-directional, improving the signal coverage of the electronic device and enhancing the user experience. Those skilled in the art will understand that in other embodiments of the present invention, the electromagnetic scattering film 3 can also be connected to the antenna device 2 through a fourth connecting layer disposed on the surface of the antenna device 2.

[0045] Figure 10 In the example, the through-hole 311 is a circular hole, but the present invention does not limit the shape of the through-hole 311. It can be a triangular, quadrilateral, or other polygonal hole, or other irregularly shaped hole, as long as diffraction occurs after the microwave enters the hole. To achieve the above function, the through-hole 311 should be as small as possible and much smaller than the wavelength of the microwave. Preferably, when the through-hole 311 is a circular hole, the ratio of the diameter of the through-hole 311 to the wavelength of the microwave is 1:200-1:100. When the through-hole 311 is a non-circular hole, the ratio of the longest distance between two points on the cross-sectional edge of the through-hole 311 to the wavelength of the microwave is 1:200-1:100. This ensures that the aperture of the through-hole 311, or the longest distance between two points on the cross-sectional edge of the through-hole 311, is much smaller than the wavelength of the microwave. This guarantees that diffraction will occur regardless of the direction from which the microwave enters the through-hole 311, thereby ensuring that microwave transmission is converted from directional to multi-directional transmission, improving signal coverage, and overcoming the problem of blind spots in signal reception. Preferably, when the through-hole 311 is circular, its aperture is 1μm-500μm; when the through-hole is non-circular, the longest distance between two points on the cross-sectional edge of the through-hole 311 is 1μm-500μm.

[0046] In an embodiment of the present invention, the second carrier layer 31 is a conductive metal layer. Microwave diffraction is achieved by creating through-holes 311 in the second carrier layer 31. Preferably, the metal residual rate of the second carrier layer 31 is 1%-99%. This design ensures that microwaves achieve complete coverage after diffraction by the electromagnetic scattering film. The metal residual rate refers to the ratio of the cross-sectional area containing metal in the second carrier layer 31 to the total cross-sectional area of ​​the second carrier layer 31. The cross-sectional area containing metal in the second carrier layer 31 is the total area of ​​the second carrier layer 31 minus the cross-sectional area of ​​the through-holes 311. If the metal residual rate is too high, it indicates that there is a large area of ​​metal in the second carrier layer 31, and microwaves will be reflected by the metal layer, resulting in a large amount of microwaves failing to pass through the electromagnetic scattering film 3. If the metal residual rate is too low, the second carrier layer 31 may be prone to cracking, causing the electromagnetic scattering film to fail.

[0047] In this embodiment, the thickness d4 of the second carrier layer 31 is preferably 0.1 μm-10 μm. This thickness design ensures that the second carrier layer 31 is not easily broken and has good flexibility. Furthermore, the second connecting layer 32 is an adhesive film layer, which is an adhesive layer without conductive particles. This avoids the problem of conductive particles easily entering and blocking the through-hole 311, thus preventing microwaves from passing through the through-hole and causing diffraction.

[0048] Figure 11 A schematic diagram of the structure of an electronic device provided in another embodiment of the present invention. (See diagram below.) Figure 11 As shown, in this embodiment, a third protruding structure 33 extending into the second connecting layer 32 is provided on the surface of the second carrier layer 31. By providing the third protruding structure 33, when using the electromagnetic scattering film 3, it is grounded to the outside, dissipating interference charges and avoiding the accumulation of interference charges to form an interference source. The height h3 of the third protruding structure 33 is preferably 0.1μm-30μm, and the thickness d5 of the second connecting layer 32 is preferably 0.1μm-45μm. In use, the third protruding structure 33 can pierce the second connecting layer 32 to ensure that the electromagnetic scattering film can be grounded. The third protruding structure 33 includes multiple protrusions. The present invention does not limit the shape and size of the multiple protrusions. The protrusions can be one or more of the following: pointed, inverted conical, granular, dendritic, columnar, and blocky. The dimensions of the multiple protrusions can be the same or different.

[0049] A second insulating layer 34 is provided on the opposite surface of the second carrier layer 31 to the surface where the second connecting layer 32 is provided. The second insulating layer 34 provides insulation and protection, preventing short circuits caused by the second carrier layer 31 coming into contact with other external electronic components during use of the electromagnetic scattering film 3, and also protecting the second carrier layer 31 from damage during use. Preferably, the second insulating layer 34 is any one of the following: a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed after curing epoxy resin ink, a film layer formed after curing polyurethane ink, a film layer formed after curing modified acrylic resin, or a film layer formed after curing polyimide resin. To improve the connection reliability between the second carrier layer 31 and the second insulating layer 34 and prevent peeling or detachment between the second insulating layer 34 and the second carrier layer 31, this embodiment of the invention provides a fourth protruding structure 35 extending into the second insulating layer 34 on the surface of the second carrier layer 31. Figure 8 As shown, the fourth protruding structure 35 includes multiple protrusions that protrude from the surface of the second carrier layer 31 toward the second insulating layer 34. Of course, those skilled in the art will understand that the protrusions can also protrude from the second insulating layer 34 toward the surface of the second carrier layer 31. This invention does not impose specific limitations on the shape, number, or size of the fourth protruding structure 35; any protrusion that improves the connection reliability between the second insulating layer 34 and the second carrier layer 31 is applicable to this invention. For example, the shape of the fourth protruding structure 35 can be one or more of the following: pointed, inverted conical, granular, dendritic, columnar, or blocky. Furthermore, the height h4 of the fourth protruding structure 35 is ≤ the thickness d6 of the second insulating layer 34. This design ensures that the fourth protruding structure 35 extends into the second insulating layer 34 but does not pierce it, thus preventing the second insulating layer 34 from failing. It should be noted that when the fourth protruding structure 35 includes multiple protrusions of varying heights, the height h4 of the fourth protruding structure refers to the highest height among all the protrusions. Preferably, the thickness d4 of the second insulating layer 34 is 1μm-25μm, and the height h2 of the fourth protruding structure 35 is 0.1μm-15μm.

[0050] To adapt to more application scenarios, the electromagnetic scattering film 3 of this invention has a flexible, foldable, and bendable structure. Specifically, the second carrier layer 31 can be made flexible, such as a metal circuit board or an FPC circuit board. The adhesive film layer for connection on one surface of the second carrier layer 31 is foldable, and the second insulating layer 34 for protection on the other surface of the second carrier layer 31 is also bendable, thus giving the electromagnetic scattering film 3 of this invention foldable and bendable properties. In practical use, the scattering film can be bent or folded into any shape, such as a ring structure or a semi-closed structure, for example, an arc structure, an elliptical structure, or a stacked structure.

[0051] In summary, the electronic device provided in this embodiment of the invention has a scattering film connected to an antenna device. Microwave signals received and transmitted by the antenna device can be reflected outward by the first protruding structure of the scattering film, thereby expanding the spatial range for receiving and / or transmitting microwave signals. In addition, an electromagnetic scattering film is also provided on the other side of the antenna device. The microwaves transmitted by the antenna device and the microwaves reflected by the scattering film can be diffracted through the through-holes of the electromagnetic scattering film, further expanding the spatial range for receiving and / or transmitting microwave signals, avoiding the signal blind zone problem of the electronic device, and improving the user experience.

[0052] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A scattering film, characterized in that, include: A first carrier layer, wherein conductive metal signal lines are disposed on the surface or inside the first carrier layer, and configured to transmit microwave signals and / or receive microwave signals; The first protruding structure, made of metal, is disposed on the surface of the first carrier layer; When microwaves pass through the first protruding structure, they are reflected. A first connecting layer is disposed on the surface of the first carrier layer, the first connecting layer and the first protruding structure are located on the same surface of the first carrier layer, and the first protruding structure extends into the first connecting layer; The height h1 of the first protruding structure is less than or equal to the thickness d2 of the first connecting layer.

2. The scattering film as described in claim 1, characterized in that, The first carrier layer includes an insulating layer, and the first protruding structure includes a plurality of protrusions, wherein the distance S1 between adjacent protrusions is less than the wavelength of the microwave.

3. The scattering film as described in claim 1, characterized in that, The thickness d1 of the first carrier layer is 0.1μm-10μm.

4. The scattering film as described in claim 1, characterized in that, The first protruding structure includes a plurality of protrusions, which are arranged at intervals on the surface of the first carrier layer. Alternatively, a plurality of the protrusions may be arranged continuously on the surface of the first carrier layer; Alternatively, a portion of the plurality of protrusions may be arranged at intervals on the surface of the first carrier layer, while another portion may be arranged continuously on the surface of the first carrier layer.

5. The scattering film as described in claim 1, characterized in that, The first carrier layer and / or the first protruding structure are made of any one of the following metallic materials or alloys: copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver or gold.

6. The scattering film as described in claim 1, characterized in that, The first protruding structure has any one or more of the following reflective surfaces that are conducive to microwave reflection: inclined surface, curved surface, flat surface, or irregular shape.

7. The scattering film as described in claim 1, characterized in that, The first connecting layer is an adhesive film layer.

8. The scattering film as described in claim 1, characterized in that, A first insulating layer is provided on the other surface of the first carrier layer opposite to the surface on which the first protruding structure is provided.

9. The scattering film as described in claim 8, characterized in that, The surface of the first carrier layer is provided with a second protruding structure that extends into the first insulating layer.

10. The scattering film according to any one of claims 1 to 9, characterized in that, The scattering film has a flexible, foldable, and bendable structure.

11. The scattering film according to any one of claims 1 to 9, characterized in that, The first protruding structure is integrally formed with the first carrier layer.

12. An electronic device, characterized in that, The device includes a scattering film as described in any one of claims 1 to 11, and further includes an antenna device, one surface of which is connected to the scattering film.

13. The electronic device according to claim 12, characterized in that, The surface of the antenna device is connected to the scattering film via a first connecting layer of the scattering film; or... A third connecting layer is provided on the surface of the antenna device, and the scattering film is connected to the antenna device through the third connecting layer.

14. The electronic device according to claim 12, characterized in that, An electromagnetic scattering film is provided on the other surface of the antenna device opposite to the surface on which the scattering film is provided. The electromagnetic scattering film includes at least a second carrier layer, wherein the second carrier layer is provided with through holes penetrating its upper and lower surfaces.

15. The electronic device according to claim 14, characterized in that, The second carrier layer is a metal conductive layer.

16. The electronic device according to claim 15, characterized in that, The residual metal content of the metal conductive layer is 1% to 99%.

17. The electronic device according to claim 14, characterized in that, A second connecting layer is disposed on the surface of the second carrier layer, and the antenna device is connected to the electromagnetic scattering film through the second connecting layer; or, A fourth connection layer is provided on the surface of the antenna device, and the electromagnetic scattering film is connected to the antenna device through the fourth connection layer.

18. The electronic device according to claim 17, characterized in that, The surface of the second carrier layer is provided with a third protruding structure that extends into the second connecting layer.

19. The electronic device according to claim 17, characterized in that, A second insulating layer is provided on the other surface opposite to the surface of the second carrier layer where the second connecting layer is provided.

20. The electronic device according to claim 14, characterized in that, When the through hole is a circular hole, the ratio of the diameter of the through hole to the wavelength of the microwave is 1:200-1:100; When the through hole is a non-circular hole, the ratio of the longest distance between two points on the cross-sectional edge of the through hole to the wavelength of the microwave is 1:200-1:

100.

21. The electronic device according to claim 14, characterized in that, The electromagnetic scattering film has a flexible, foldable, and bendable structure.

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