Sensing Component, Manufacturing Method of Sensing Component, and Battery Module

Abstract

The present invention relates to a sensing component, a manufacturing method of the sensing component, and a battery module including the sensing component. According to the sensing component of the present invention and the battery module including the sensing component, a part of the flexible printed circuit board used in the conventional sensing component is replaced with a relatively inexpensive rigid printed circuit board, so as to reduce the usage amount of the relatively expensive flexible printed circuit board, and thus the economy of the sensing component and the battery module including the sensing component can be improved.

Description

Technical Field

[0001] The present invention relates to a sensing component, a method of manufacturing the sensing component, and a battery module including the sensing component. Background Art

[0002] A secondary battery is a device that stores external electrical energy as chemical energy and generates electricity when needed, and is used in various fields such as electronic devices using electricity, hybrid vehicles, and electric vehicles.

[0003] The secondary battery is manufactured in the form of a battery module in which a plurality of battery cells are stacked in one direction, and in order to sense the voltage of the battery cells included in the battery module, wires are used to connect the unit electrode tabs formed on both sides of the battery cells. The wires connecting the unit electrode tabs on both sides have a very thin form, so additional reinforcing materials are required to prevent damage due to vibration. In order to prevent damage due to vibration, the thickness of the wire reinforcing material needs to be formed to be 3 mm or more, but this hinders the space utilization rate of the battery module, so improvement is needed.

[0004] To solve the above problems, the sensing component of the conventional battery module uses a flexible printed circuit board (Flexible Printed Circuits Board, hereinafter referred to as FPCB) to connect both sides of the battery cell instead of using wires.

[0005] Figure 1 Shows an exploded state of a conventional battery module applying a sensing component using an FPCB.

[0006] As Figure 1 Shown, the battery module 20 applying the sensing component 10 using an FPCB may include a sensing component 10, a battery cell stack 22, an upper cover 21, a bus bar coupling member 23, a first side cover 24, and a second side cover 25.

[0007] As Figure 1 Shown, the battery cell stack 22 has a structure in which the internal battery cells are stacked in one direction and the sides of the battery cells are covered. Unit electrode tabs are formed on both sides of the battery cells inside the battery cell stack 22, and the unit electrode tabs formed on both sides of the battery cells are inserted / protruded from the holes formed in the bus bar coupling member 23. Bus bars are formed in the bus bar coupling member 23 to connect the unit electrode tabs inserted / protruded from the holes formed in the bus bar coupling member 23 to each other, and the sensing component 10 is connected to the bus bar of the battery cell stack 22 to measure the voltage of the battery cells.

[0008] As Figure 1As shown, the sensing component 10 may include: a front-side component 11, which is a part connected to the unit electrode tab protruding from one side of the battery cell stack 22; a rear-side component 12, which is a part connected to the unit electrode tab protruding from the other side of the battery cell stack 22; and an FPCB component 13 that connects the front-side component 11 and the rear-side component 12 to each other.

[0009] Figure 2 Only shown Figure 1 is the FPCB component 13.

[0010] As the name implies, the FPCB component 13 is formed of an FPCB and connects the front-side component 11 and the rear-side component 12 included in the sensing component 10 to each other, electrically connecting the unit electrode tabs formed at both ends of the battery cell so that the sensing component 10 can sense the voltage of the battery cell. As Figure 2 shown, the FPCB component 13 may be formed of a front-side part 14, a rear-side part 15, and a middle-end part 16 according to its position.

[0011] Figure 2 (a) of shows the state before the FPCB component 13 is applied in the sensing component 10, Figure 2 (b) of shows the state when the FPCB component 13 is applied in the sensing component 10. As Figure 2 (a) and (b) of show, the widths of the front-side part 14 and the rear-side part 15 of the FPCB component 13 are greater than the width of the middle-end part 16 for application in the battery cell stack 22. However, for production efficiency, as Figure 2 (a) of shows, after the widths of the front-side part 14 and the rear-side part 15 are produced to be the same as that of the middle-end part 16, the bending parts 14a of the front-side part 14 and the bending parts 15a of the rear-side part 15 are respectively folded along the dotted lines, and then adhered to the front-side component 11 and the rear-side component 12 for use, and double-sided tape is used when the bending parts are respectively adhered to the front-side component 11 and the rear-side component 12.

[0012] Figure 3 Magnified view shows Figure 2 the front-side part 14 and a part of the middle-end part 16 of.

[0013] As Figure 3 shown, a plurality of sensing lines for electrically connecting the front-side part 14 and the rear-side part 15 are formed in the middle-end part 16. In Figure 3 only the sensing lines are formed in the middle-end part 16, but this is only for convenience and other sensing lines are not shown in the figure. Sensing lines connected to the sensing lines formed in the middle-end part 16 are also respectively formed in the front-side part 14 and the rear-side part 15.

[0014] Figure 4 Shows Figure 3The state where the front side portion 14 of the FPCB component 13 adheres to the front side component 11.

[0015] Figure 4 The front side component 11 shown can be made of a synthetic resin injection molded product. A connector 31 and sensing pins 32 can be combined on the front surface of the front side component 11. The connector 31 is connected to an external wire to transmit the voltage information of the battery cell measured by the sensing component 10 to the outside, and the sensing pins 32 are welded to the bus bar. As Figure 2 shown, if the front side portion 14 of the FPCB component 13 is to be adhered to the front surface of the front side component 11, the bent portion 14a of the front side portion 14 needs to be folded, and the folded bent portion 14a is adhered to the front surface of the front side component 11 using a double-sided tape. For the rear side portion of the sensing component 10 not shown in Figure 4 , after folding the bent portion 15a of the rear side portion 15, it can be directly adhered to the rear surface of the battery cell laminate 22 using a double-sided tape, rather than being combined with the rear surface of the battery cell laminate 22 using an additional synthetic resin injection molded product.

[0016] The process of folding both ends of the above-mentioned FPCB component 13 and adhering it to the battery cell laminate 22 using a double-sided tape is difficult to automate and requires direct operation by an operator. However, since the above process is achieved through manual operation, there will be quality deviations in the product depending on the proficiency of the operator. In particular, the bent portion 14a should be adhered in such a way that the sensing line formed in the bent portion 14a is connected to the terminal or sensing pin formed on the front side component 11. However, since the adhesion process is achieved through manual operation, it is difficult to adhere the bent portion 14a to the designated position. In addition, when the bent portions 14a and 15a are incorrectly folded and errors occur, all the sensing lines formed in the bent portion will not be able to be connected to the terminal or sensing pin, and a large amount of relatively expensive FPCB is used, so the cost will increase.

[0017] Prior art documents

[0018] Patent documents

[0019] Published Patent Gazette No. 10-2018-0022445 Summary of the invention

[0020] (1) Technical problems to be solved

[0021] The present invention is proposed to solve the above-mentioned problems, and the object of the present invention is to provide a sensing component that can be automated by changing the manufacturing process applied to the sensing component in the battery module, so as to improve the assembly performance and economy, and further improve the economy by reducing the usage amount of relatively expensive flexible printed board circuits, a manufacturing method of the sensing component, and a battery module including the sensing component (II) Technical solution

[0022] To solve the above-mentioned technical problems, the sensing component according to the present invention may include: a first substrate formed of a rigid printed circuit board and having one or more first terminals provided on one surface; a second substrate formed of a flexible printed circuit board and including one or more sensing lines electrically connected to the first terminals; and a first electrical connection portion provided between one end of the second substrate and the first substrate and electrically connecting the sensing lines and the first terminals.

[0023] In addition, the first electrical connection portion may be formed by soldering.

[0024] In addition, the first electrical connection portion may be an adhesive portion joined by a conductive film.

[0025] In addition, the first electrical connection portion may be a welding portion welded by laser welding or ultrasonic welding.

[0026] In addition, the first substrate may further include second terminals formed on one surface of the first substrate, and the sensing component may further include: a sensing pin electrically connected to one end of the second terminal; and a second electrical connection portion provided on one surface of the first substrate to electrically connect the second terminal and the sensing pin.

[0027] In addition, the second electrical connection portion may be a welding portion formed by soldering.

[0028] In addition, the second electrical connection portion may be an adhesive portion joined by a conductive film.

[0029] In addition, the second electrical connection portion may be a welding portion welded by laser welding or ultrasonic welding.

[0030] The battery module according to the present invention may include: a battery cell stack formed by stacking a plurality of battery cells on one side; a bus bar coupling member coupled to both sides of the battery cell stack, and a unit electrode tab of the battery cell is inserted into the bus bar coupling member and exposed to the outside; and a sensing assembly electrically connected to the unit electrode tab exposed to the outside of the bus bar coupling member to sense the voltage of the battery cell. The sensing assembly may include: a first substrate formed of a rigid printed circuit board and having one or more first terminals provided on one surface; a second substrate formed of a flexible printed circuit board and including one or more sensing lines electrically joined to the first terminals; and a first electrical joining portion provided between one end of the second substrate and the first substrate and electrically joining the sensing lines and the first terminals.

[0031] In addition, the first electrical joining portion may be a soldering portion formed by soldering.

[0032] In addition, the first electrical joining portion may be an adhesive portion joined by a conductive film.

[0033] In addition, the first electrical joining portion may be a soldering portion soldered by laser soldering or ultrasonic soldering.

[0034] In addition, the first substrate may further include second terminals formed on one surface of the first substrate, and the sensing assembly may further include: a sensing pin electrically joined to one end of the second terminals; and a second electrical joining portion provided on one surface of the first substrate to electrically join the second terminals and the sensing pin.

[0035] In addition, the second electrical joining portion may be a soldering portion formed by soldering.

[0036] In addition, the second electrical joining portion may be an adhesive portion joined by a conductive film.

[0037] In addition, the second electrical joining portion may be a soldering portion soldered by laser soldering or ultrasonic soldering.

[0038] The method of manufacturing the sensing assembly according to the present invention may include: a) a step of providing a first substrate formed of a rigid printed circuit board, and one or more first terminals are respectively provided on one surface of the first substrate; and b) a step of disposing one end of a second substrate provided with one or more sensing lines and formed of a flexible printed circuit board on one surface of the first substrate, and electrically joining the sensing lines and the first terminals on one surface of the first substrate to form a first electrical joining portion.

[0039] In addition, in the step b), a soldering portion may be formed by soldering the sensing lines and the first terminals to form the first electrical joining portion.

[0040] In addition, in the step b), the sensing line and the first terminal may be joined by a conductive film to form a bonding portion, so as to form the first electrical joining portion.

[0041] In addition, in the step b), the conductive film may be disposed between the first terminal and the sensing line, and the first terminal, the conductive film, and the sensing line stacked in sequence may be pressed and heated by a heating device to form the bonding portion.

[0042] In addition, in the step b), the sensing line and the first terminal may be subjected to ultrasonic welding or laser welding to form a welding portion, so as to form the first electrical joining portion.

[0043] In addition, the first substrate may further include a second terminal formed on one surface of the first substrate, and the manufacturing method may further include: step c) of forming a second electrical joining portion that electrically joins one end of the sensing pin and the second terminal.

[0044] In addition, in the step c), a welding portion may be formed by welding one end of the sensing pin and the second terminal, so as to form the second electrical joining portion.

[0045] In addition, in the step c), the one end of the sensing pin and the second terminal may be joined by a conductive film to form a bonding portion, so as to form the second electrical joining portion.

[0046] In addition, in the step c), the conductive film may be disposed between the second terminal and the sensing pin, and the second terminal, the conductive film, and the sensing line stacked in sequence may be pressed and heated by a heating device to form the bonding portion.

[0047] In addition, in the step c), the second terminal and the sensing pin may be subjected to ultrasonic welding or laser welding to form a welding portion, so as to form the second electrical joining portion.

[0048] (III) Advantageous Effects

[0049] According to the sensing component, the manufacturing method of the sensing component, and the battery module including the sensing component of the present invention as described above, a part of the flexible printed circuit board used in the conventional sensing component is replaced with a relatively inexpensive rigid printed circuit board (Rigid Printed Circuit Board) to reduce the usage amount of the relatively expensive flexible printed circuit board. Therefore, the economy of the sensing component and the battery module including the sensing component can be improved.

[0050] In addition, according to the present invention, the first substrate formed of a rigid printed circuit board and the second substrate formed of a flexible printed circuit board are electrically joined by using one of soldering, a conductive film, ultrasonic soldering, and laser soldering, and the first substrate and the sensing pins are electrically joined by the same method to share a part of the process, thereby improving the manufacturing convenience of the sensing component and further improving the economy.

[0051] In addition, according to the present invention, the sensing pins are manufactured using a flexible printed circuit board, so that the sensing component according to the present invention can be applied to battery modules of various specifications, improving the assembly convenience. Even if an assembly error occurs within an allowable range, stress can be prevented from concentrating on the sensing pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 is an exploded perspective view of a battery module to which a conventional sensing component is applied.

[0053] Figure 2 is Figure 1 a plan view of the FPCB part of the sensing component shown.

[0054] Figure 3 is Figure 2 a partially enlarged view of the FPCB part of the sensing component shown.

[0055] Figure 4 is Figure 1 a partially enlarged view of the sensing component shown.

[0056] Figure 5 is a plan view of a sensing component according to an embodiment of the present invention.

[0057] Figure 6 is a side view of the bent state of the second substrate of the sensing component according to an embodiment of the present invention.

[0058] Figure 7 is a side schematic view of the sensing pins of a conventional sensing component and a sensing component according to an embodiment of the present invention.

[0059] Figure 8 is an exploded perspective view of a battery module including a sensing component according to an embodiment of the present invention.

[0060] Figure 9 and Figure 10 is a schematic view of step b) of the manufacturing method of the sensing component according to an embodiment of the present invention.

[0061] Figure 11 and Figure 12 is a schematic view of step c) of the manufacturing method of the sensing component according to an embodiment of the present invention.

[0062] Description of Reference Numerals

[0063] 10: Sensing Component 11: Front Side Component

[0064] 12: Rear Side Component 13: FPCB Component

[0065] 14: Front Side Portion 15: Rear Side Portion

[0066] 16: Middle End Portion 14a, 15a: Bending Portions

[0067] 20: Battery Module 21: Upper Cover

[0068] 22: Battery Cell Stack 23: Bus Bar Bonding Component

[0069] 24: First Side Cover 25: Second Side Cover

[0070] 31: Connector 32: Sensing Pin

[0071] 40: RPCB 50: Metal Sensing Pin

[0072] 60: Anisotropic Conductive Film 70: Heating Device

[0073] 100: First Substrate 110: Welding Portion

[0074] 121: First Terminal 122: Second Terminal

[0075] 200: Second Substrate 300: Sensing Pin

[0076] 1000: Sensing Component L: Sensing Line Detailed Description of the Embodiment

[0077] Hereinafter, a sensing component according to the present invention and a battery module including the sensing component will be described in detail with reference to the accompanying drawings. The accompanying drawings are provided only as examples to fully convey the technical idea of the present invention to those of ordinary skill in the art. The present invention is not limited to the drawings presented below and may be embodied in other ways.

[0078] Figure 5 The plane of a sensing component according to an embodiment of the present invention is schematically shown.

[0079] As Figure 5 shown, a sensing component according to an embodiment of the present invention may include a first substrate 100, a second substrate 200, and a sensing pin 300.

[0080] A pair of first substrates 100 are spaced apart from each other and are formed of a Rigid Printed Circuit Board (hereinafter referred to as RPCB). AsFigure 5 As shown by the dashed line portion, a circuit for electrically connecting the second substrate 200 and the sensing pins 300, which will be described later, may be printed on the surface or inside of the first substrate 100, and a pair of first substrates 100 are respectively bonded to the front surface and the rear surface of the battery cell stack.

[0081] On one surface of the first substrate 100 ( Figure 5 the surface shown), a first terminal 121 and a second terminal 122 may be formed. The first terminal 121 is electrically joined to the second substrate 200 described later, and the second terminal 122 is electrically joined to the sensing pins 300 described later.

[0082] The reason why a pair of first substrates 100 respectively bonded to the front surface and the rear surface of the battery cell stack are formed of a common printed circuit board (PCB) is that by using the first substrate 100 formed of a rigid printed circuit board to replace a part of the FPCB applied to the conventional sensing component in the above background art section, the usage amount of the FPCB can be reduced and the production cost can be saved.

[0083] As Figure 5 shown, the second substrate 200 connects a pair of first substrates 100 arranged at intervals from each other. Different from the first substrate 100, the second substrate 200 may be formed of a flexible printed circuit board (Flexible Printed Circuit Board, hereinafter referred to as FPCB). The reason why the second substrate 200 is formed of FPCB is that, as described in the background art section, the space utilization rate of the battery module can be improved, and even if an assembly error occurs within the allowable error range, the sensing component can be manufactured without damaging the second substrate 200 or other components.

[0084] As Figure 5 shown, sensing lines L are formed on the second substrate 200, and each sensing line L is formed from one end to the other end of the second substrate.

[0085] As Figure 5As shown, one end of the second substrate 200 is placed on one surface of the first substrate 100. That is, one end of the second substrate 200 is placed on one surface of the first substrate 100 so that one surface of the first substrate 100 and one surface of the second substrate 200 (the surface on the first substrate 100 side) are in surface contact with each other. The reason why one surface of the first substrate 100 and one surface of the second substrate 200 are in surface contact with each other is that when the first substrate 100 and the second substrate 200 are electrically joined, the bonding force between the first substrate 100 and the second substrate 200 is further improved. As described above, a first terminal 121 for connecting to the sensing line L of the second substrate 200 is formed on one surface of the first substrate 100. After placing one end of the second substrate 200 on one surface of the first substrate 100, the first terminal 121 and the sensing line L can be electrically joined to each other through the first electrical joining portion to connect the second substrate and the first terminal 121 of the first substrate 100. In one embodiment of the present invention, the first electrical joining portion is a soldering portion 110 formed by soldering.

[0086] In the past, there have also been cases where RPCB and FPCB are used together. However, the traditional method is to form connectors on the RPCB and FPCB respectively and connect the respectively formed connectors to each other, thereby using the FPCB and RPCB together. This method also includes the process of electrically joining the connector and the RPCB and the process of electrically joining the connector and the FPCB. Therefore, the production cost is higher than that of this embodiment.

[0087] In contrast, in this embodiment, the first substrate 100 and the second substrate 200 are directly connected by soldering, and no additional connector is required. Thus, the production cost is lower than the above traditional method, and the production process is simple. The method of forming the soldering portion 110 by soldering can be as follows: the second substrate 200 is arranged on one surface of the first substrate 100 so that the first terminal 121 and the sensing line L are in contact with each other. Then, solder paste is applied to the portion where the first terminal 121 and the sensing line L are in contact with each other. Then, the first substrate 100 and the second substrate 200 are exposed to a heated space such as an oven for a specified time, or hot air is applied to the portion where the solder paste is applied. In this way, the soldering portion 110 can be formed on a plurality of first substrates 100 and second substrates 200 at the same time, so the mass productivity can be improved.

[0088] In the present invention, the connection manner between the first terminal 121 and the sensing line L is not limited to the above-mentioned soldering manner. A bonding portion may also be formed through a conductive film, or a soldering portion may be formed by using ultrasonic soldering or laser soldering, etc., to electrically connect the first terminal 121 and the sensing line L to each other and form a first electrical bonding portion. Herein, the conductive film refers to a film that can electrically connect two components adhered to each other. For example, the conductive film may be an anisotropic conductive film (hereinafter referred to as ACF). When the ACF is disposed between two components to be electrically bonded, and then the two stacked components and the ACF are pressed and heated to form a bonding portion as the first electrical bonding portion, thereby two different components can be electrically bonded to each other. The specific method of using the ACF in the present invention will be described later.

[0089] Figure 6 is schematically shown Figure 5 a side view of a sensing assembly according to an embodiment of the present invention shown in the figure.

[0090] As Figure 6 shown, the second substrate 200 included in the sensing assembly according to an embodiment of the present invention is formed of an FPCB, so that it can be flexibly bent or folded. Therefore, when the sensing assembly is applied to a battery cell laminate, even if an assembly error occurs, stress will not concentrate on the second substrate 200. Thus, it is easy to apply the sensing assembly to the battery cell laminate without worrying about damage to the second substrate 200 or other components.

[0091] As Figure 5 shown, one end of the sensing pin 300 can be electrically bonded to a second terminal 122 formed on one surface of the first substrate 100 through a second electrical bonding portion. Herein, the sensing pin 300 is a terminal that can sense the voltage or temperature of a battery cell, and can also be referred to as a sensing terminal or a sensing terminal, etc. In addition, the sensing pin 300 can be configured to be combined with a unit voltage sensing bus bar when included in a battery module. In the same manner as the manner of forming the first electrical bonding portion between the first substrate 100 and the second substrate 200 in the present embodiment, the forming manner of the second electrical bonding portion for electrically bonding the sensing pin 300 and the second terminal 122 may be a method of forming a soldering portion by using soldering. However, in the present invention, the manner of electrically bonding the sensing pin 300 and the second terminal of the first substrate 100 is not limited to the soldering manner, and may also be a manner of forming a bonding portion by using a conductive film, or a manner of forming a soldering portion by using ultrasonic soldering or laser soldering. After the one surface of the sensing pin 300 is in surface contact with the one surface of the first substrate 100, at least one of soldering, a conductive film, ultrasonic soldering, and laser soldering is used to form a second electrical bonding portion to electrically bond the sensing pin 300 and the first substrate 100, which is to improve the bonding force between the sensing pin 300 and the first substrate 100.

[0092] The sensing lines formed on the second substrate 200 of the present invention, the first terminal 121 and the second terminal 122 formed on the first substrate 100, and the sensing pins 300 can be electrically connected to each other, and through this electrical connection, the voltage and temperature of the battery cell can be sensed.

[0093] In this embodiment, similar to the second substrate 200, the sensing pins 300 can be formed of FPCB. However, in the present invention, the sensing pins 300 are not limited to being formed of FPCB, and the sensing pins 300 can also be formed of RPCB, or formed of other forms or other materials other than RPCB.

[0094] One end of the sensing pin 300 can be electrically connected to the sensing line L of the second substrate 200 through a circuit printed on the surface or inside of the first substrate 100. The other end of the sensing pin 300 can be connected to the bus bar by welding. The welding process for connecting the other end of the sensing pin 300 and the bus bar and the welding process for connecting the first substrate 100 and the second substrate 200 or bonding the sensing pin 300 on the first substrate 100 can share many parts of the process. Therefore, when manufacturing the sensing component according to an embodiment of the present invention, the convenience and economy can be improved.

[0095] If the method of electrically joining the first substrate 100 and the second substrate 200 in the present invention is other than welding, the method of electrically joining the first substrate 100 and the sensing pins 300 also adopts the same method as the method of electrically joining the first substrate 100 and the second substrate 200. Therefore, even when using other non-welding methods, the convenience and economy can be improved when manufacturing the sensing component according to an embodiment of the present invention.

[0096] Similar to the second substrate 200, the reason for forming the sensing pins 300 of FPCB is that when the sensing component is combined into the battery module, even if an assembly error occurs, as long as the assembly error is within the allowable range, the stress will not concentrate on the sensing pins 300, and it is easy to assemble.

[0097] To further elaborate on the reason for forming the sensing pins 300 of FPCB, Figure 7 Schematically shows two conventional ways of bonding sensing pins to a substrate and the situation of bonding sensing pins in the sensing component according to an embodiment of the present invention. Figure 7 (a) of Figure 7 and the way shown in (b) of Figure 7 are conventional ways,

[0098] First, in Figure 7In the manner shown in (a), after processing a hole in the RPCB 40, one end of a metal sensing pin 50 formed of metal is inserted into the hole, and then the circuit printed on the RPCB 40 and the metal sensing pin 50 are electrically connected by soldering. Usually, the metal sensing pin 50 can be manufactured using copper. Figure 7 In the manner shown in (a), a process of forming an additional hole in the RPCB 40 is required, and when assembly errors occur, stress is applied to the metal sensing pin 50, so the metal sensing pin 50 may be damaged. Additionally, the metal sensing pin 50 is usually manufactured using a mold. In order to apply the sensing component to battery cell laminates of different specifications, the metal sensing pins 50 applied to each battery cell laminate need to be manufactured with different specifications from each other, so various specifications of molds are required. Usually, manufacturing a new mold requires a high cost, so Figure 7 the manner shown in (a) of is poor in economy, and the metal sensing pin 50 manufactured by this method does not have universality.

[0099] In Figure 7 In the manner shown in (b), instead of processing a hole in the RPCB 40, after placing the metal sensing pin 50 on the RPCB 40, the metal sensing pin 50 is connected to the RPCB 40 by soldering. Compared with Figure 7 the manner shown in (a) of , this method omits the process of processing a hole in the RPCB 40, and can improve manufacturing convenience and economy. However, similar to Figure 7 the manner shown in (a) of , due to assembly errors, the metal sensing pin 50 may be damaged, and it does not have universality.

[0100] In contrast, Figure 7 The sensing pin 300 of the present invention shown in (c) is formed of FPCB instead of metal such as copper. As long as it is formed to a length above a specified length, it can be applied to a battery module including battery cell laminates of various specifications. And even if assembly errors occur, stress is not applied to the sensing pin 300 (or the applied stress is below a specified level). Therefore, the possibility of damage is low and it is easy to assemble in the battery cell laminate.

[0101] Figure 8 is an exploded perspective view of a battery module according to an embodiment of the present invention.

[0102] As Figure 8As shown, a battery module according to an embodiment of the present invention may include a battery cell stack 22, a bus bar coupling member 23, and a sensing component 1000. In addition, it may further include an upper cover 21, a first side cover 24, and a second side cover 25. In the above structure, the sensing component 1000 is the same as the sensing component according to the present invention. Therefore, the sensing component 1000 may include a first substrate 100, a second substrate 200, and sensing pins 300. A detailed description of the sensing component 1000 is omitted, and the structures other than the sensing component 1000 in the structure included in the battery module according to an embodiment of the present invention are the same as the structures described in the above background art section.

[0103] Hereinafter, a method for manufacturing a sensing component according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0104] A method for manufacturing a sensing component according to an embodiment of the present invention may include step a) and step b). In step a), a pair of first substrates 100 each having one or more first terminals 121 formed on one surface are disposed apart from each other. In step b), a second substrate formed with sensing lines L and made of a flexible printed circuit board is disposed between the first substrates 100, and the sensing lines L and the first terminals 121 are electrically joined to form a first electrical joining portion.

[0105] As described above, the first electrical joining portion may be formed by various methods such as soldering, a conductive film, ultrasonic soldering, and laser soldering, and the sensing lines L and the first terminals 121 may be electrically joined. A method for electrically joining the sensing lines L and the first terminals 121 by soldering has been described. In the present embodiment, a joining method using an ACF, which is a type of conductive film, will be described.

[0106] Figure 9 FIG. shows a state in which an ACF 60 is disposed between the first substrate 100 formed with the first terminals 121 and the second substrate 200 formed with the sensing lines L in step b). In step b) of the present embodiment, after laminating Figure 9 the shown first substrate 100, ACF 60, and second substrate 200, it becomes Figure 10 the shown state. Then, a rod-shaped heating device 70 is moved to be in partial contact with the laminated portion, and while applying pressure to the portion where the first terminals 121, ACF 60, and sensing lines L are laminated to a degree equal to or greater than a specified level, heating is performed to form an adhesive portion formed by the ACF 60, thereby electrically coupling the first terminals 121 and the sensing lines L. That is, in the present embodiment, the adhesive portion formed by the ACF 60 is the first electrical joining portion. As described above, the electrical joining method using the ACF 60 can miniaturize the heating device 70, and thus, has the advantage of being able to be performed in a relatively narrow space.

[0107] The manufacturing method of the sensing component according to an embodiment of the present invention may further include step c).

[0108] Figure 11 and Figure 12 The execution process of step c) of the manufacturing method of the sensing component according to an embodiment of the present invention is shown in sequence.

[0109] As Figure 11 shown, in step c), first, one end of the sensing pin 300 formed of FPCB and the first substrate 100 are arranged to be separated from each other, and the ACF 60 is disposed between the second terminal 122 formed on the surface of the first substrate 100 and the sensing pin 300. The state where the second terminal 122, the ACF 60, and the sensing pin 300 are stacked on each other is as Figure 12 shown. Then, in step c), while pressurizing and heating the second terminal 122, the ACF 60, and the sensing pin 300 stacked on each other with a pressure above a specified level by the heating device 70, a bonding portion is formed. The bonding portion formed through the above process is the second electrical bonding portion that electrically bonds the second terminal 122 and the sensing pin 300. However, in the present invention, the process of forming the second electrical bonding portion in step c) is not limited to the above embodiment. Similar to step b) of forming the first electrical bonding portion, in step c), a welded portion can be formed by soldering, or a welded portion can be formed by ultrasonic welding or laser welding, thereby forming the second electrical bonding portion.

[0110] Step c) can be executed regardless of the order of the above steps a) and b). That is, after the sensing pin 300 and the first substrate 100 are electrically bonded to each other, the first substrate 100 and the second substrate 200 can be electrically bonded to each other.

[0111] As described above, although the present invention has been described through limited embodiments and drawings, the present invention is not limited to the above embodiments. Those of ordinary skill in the technical field to which the present invention pertains can make various modifications and changes based on the above description. Therefore, the technical idea of the present invention is only determined by the claims, and any changes equivalent or equivalent thereto fall within the scope of the technical idea of the present invention.

Claims

1. A sensing component, which is a sensing component for sensing a battery cell laminate, comprising: A pair of first substrates formed of a rigid printed circuit board, and one or more first terminals and one or more second terminals are provided on one surface of the first substrate, and the pair of first substrates are respectively bonded to both ends of the battery cell laminate; A second substrate formed of a flexible printed circuit board, and comprising one or more sensing lines electrically joined to the first terminals, and connecting the pair of first substrates; Sensing pins, one end of which is electrically joined to the second terminals and the other end of which is electrically connected to the battery cells to sense the voltage and temperature of the battery cells; A first electrical joining portion provided between one end of the second substrate and the first substrate, and electrically joining the sensing lines and the first terminals, and A second electrical joining portion provided on one surface of the first substrate to electrically join the second terminals and the sensing pins, The manner of joining the sensing lines and the first terminals at the first electrical joining portion is the same as the manner of joining the sensing pins and the second terminals at the second electrical joining portion.

2. The sensing component according to claim 1, wherein The first electrical joining portion and the second electrical joining portion are welding portions formed by welding.

3. The sensing component according to claim 1, wherein The first electrical joining portion and the second electrical joining portion are bonding portions joined by a conductive film.

4. The sensing component according to claim 1, wherein The first electrical joining portion and the second electrical joining portion are welding portions welded by laser welding or ultrasonic welding.

5. A battery module, comprising: A battery cell laminate formed of a plurality of battery cells laminated on one side; A bus bar joining member joined to both sides of the battery cell laminate, and unit electrode tabs of the battery cells are inserted into the bus bar joining member and exposed to the outside; and A sensing component electrically connected to the unit electrode tabs exposed to the outside of the bus bar joining member to sense the voltage of the battery cells, The sensing component includes: A pair of first substrates formed of a rigid printed circuit board, and one or more first terminals and one or more second terminals are provided on one surface of the first substrate, and the pair of first substrates are respectively bonded to both ends of the battery cell laminate; A second substrate formed of a flexible printed circuit board, and comprising one or more sensing lines electrically joined to the first terminals, and connecting the pair of first substrates; Sensing pins, one end of which is electrically joined to the second terminals and the other end of which is electrically connected to the battery cells to sense the voltage and temperature of the battery cells; A first electrical joining portion provided between one end of the second substrate and the first substrate, and electrically joining the sensing lines and the first terminals, and A second electrical joining portion provided on one surface of the first substrate to electrically join the second terminals and the sensing pins, The manner of joining the sensing lines and the first terminals at the first electrical joining portion is the same as the manner of joining the sensing pins and the second terminals at the second electrical joining portion.

6. A manufacturing method of a sensing component, which is a manufacturing method of a sensing component for a sensing battery unit laminate, comprising: a) a step of respectively disposing a pair of first substrates formed of rigid printed circuit boards at both ends of the battery unit laminate, and respectively disposing one or more first terminals and one or more second terminals on one surface of the first substrates; b) a step of disposing a second substrate formed of a flexible printed circuit board, the second substrate being provided with one or more sensing lines electrically joined to the first terminals, and the second substrate being disposed between the pair of first substrates to connect the pair of first substrates; and c) a step of disposing one end of the second substrate on one surface of the first substrate, and forming a first electrical joining portion on the one surface of the first substrate to electrically join the sensing line and the first terminal, d) a step of forming a second electrical joining portion to electrically join one end of a sensing pin and the second terminal, The manner of forming the first electrical joining portion in the step c) is the same as the manner of forming the second electrical joining portion in the step d).

7. The manufacturing method of the sensing component according to claim 6, wherein, In the step c), a welding portion is formed by welding the sensing line and the first terminal to form the first electrical joining portion, In the step d), a welding portion is formed by welding one end of the sensing pin and the second terminal to form the second electrical joining portion.

8. The manufacturing method of the sensing component according to claim 6, wherein, In the step c), an adhesive portion is formed by joining the sensing line and the first terminal with a conductive film to form the first electrical joining portion, In the step d), an adhesive portion is formed by joining one end of the sensing pin and the second terminal with a conductive film to form the second electrical joining portion.

9. The manufacturing method of the sensing component according to claim 8, wherein, In the step c), the conductive film is disposed between the first terminal and the sensing line, and the first terminal, the conductive film, and the sensing line stacked in sequence are pressed and heated by a heating device to form the adhesive portion, In the step d), the conductive film is disposed between the second terminal and the sensing pin, and the second terminal, the conductive film, and the sensing pin stacked in sequence are pressed and heated by a heating device to form the adhesive portion.

10. The manufacturing method of the sensing component according to claim 6, wherein, In the step c), ultrasonic welding or laser welding is performed on the sensing line and the first terminal to form a welding portion to form the first electrical joining portion, In the step d), ultrasonic welding or laser welding is performed on the second terminal and the sensing pin to form a welding portion to form the second electrical joining portion.

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