A packaging method and a packaging system for an intelligent power module

Abstract

An embodiment of the present invention provides a packaging method and a packaging system for an intelligent power module. The method includes the steps of: S1. Inverting the assembled substrate onto a preset position of a packaging mold, wherein a packaging material is pre-placed in the packaging mold; S2. Pressing the substrate towards the packaging mold through a packaging and molding pressing mold so that the packaging material covers the components on the substrate; S3. Pressing the output leads on the substrate towards the direction of the packaging mold through an output lead forming mold, and making the output leads flush with the upper surface or the lower surface of the entire packaging structure through an output lead planarization mold; S4. Curing the packaging material; S5. Removing the entire packaging structure from the packaging mold. The present invention improves the structural flatness of the intelligent power module packaging module, reduces the formation of air gaps when assembling it onto a PCB board, and improves the yield of the assembled product.

Description

Technical Field

[0001] The present invention relates to the field of packaging technology, and in particular, to a packaging method and a packaging system for an intelligent power module. Background Art

[0002] An intelligent power module (IPM) generally includes a substrate, side baffles provided on both sides of the substrate, components provided on the substrate, and output leads provided on both sides of the substrate. The side baffles are used to fix the output leads.

[0003] Generally, the components on the substrate are encapsulated with epoxy resin to form an encapsulated module. As Figure 19 shown, this encapsulated module (i.e., the intelligent power module) will be subsequently assembled onto a PCB board 105. Specifically, the output leads 103 of the intelligent power module are connected to the PCB board 105 and fixed by soldering with solder paste 104. A heat sink 101 is provided at a corresponding position of the substrate, the substrate is directly placed on the heat sink, and the encapsulation structure 102 is located on the side away from the heat sink.

[0004] However, as Figure 20 shown, due to the possible unevenness in the extraction of the output leads 103, some of the output leads 103 on the right side cannot be combined with the solder paste 104, resulting in the formation of an air gap 106. As Figure 21 shown, since some of the output leads 103 are higher than the substrate plane, an air gap 107 is formed between the substrate and the heat sink 101. These problems will cause abnormalities in the circuit board. Summary of the Invention

[0005] Embodiments of the present invention provide a packaging method and a packaging system for an intelligent power module to solve the above technical problems.

[0006] Embodiments of the present invention provide a packaging method for an intelligent power module. The power module includes: a substrate, components provided on the substrate, and output leads led out from both sides of the substrate. The method includes the steps of:

[0007] S1. Inverting the assembled substrate onto a preset position of a packaging mold, wherein a packaging material is preset in the packaging mold;

[0008] S2. Pressing the substrate against the packaging mold through a packaging and molding pressing mold so that the packaging material covers the components on the substrate;

[0009] S3. Pressing the output leads on the substrate towards the direction of the packaging mold through an output lead forming mold, and making the output leads flush with the upper surface or the lower surface of the entire encapsulated module after being formed through an output lead planarizing mold;

[0010] S4. Curing the packaging material;

[0011] S5. Remove the entire encapsulated structure from the encapsulation mold.

[0012] The present invention also provides an encapsulation system for an intelligent power module. The power module includes a substrate and components disposed on the substrate. The encapsulation system includes:

[0013] An encapsulation mold for loading encapsulation material and shaping the encapsulation material on the substrate to cover the components on the substrate;

[0014] An encapsulation forming and pressing mold disposed corresponding to the encapsulation mold for pressing the substrate against the encapsulation mold so that the encapsulation material covers the components on the substrate;

[0015] An output lead forming mold disposed on both sides of the encapsulation forming and pressing mold for pressing the output leads on the substrate towards the encapsulation mold;

[0016] An output lead planarization mold disposed corresponding to the output lead forming mold for making the output leads flush with the upper surface or the lower surface of the entire encapsulated structure after being formed.

[0017] Preferably, the encapsulation mold is provided with flat portions extending outward on both sides corresponding to the leads, and the output lead planarization mold is disposed on the flat portions.

[0018] Preferably, the output lead planarization mold is a flat plate disposed on the flat portions. The sum of the thickness of the flat plate and the thickness of the output leads is equal to the thickness of the substrate. After the output lead forming mold presses down the output leads and forms them under the action of the flat plate, the output leads are flush with the back surface of the substrate.

[0019] Preferably, a sprue is provided at the bottom of the encapsulation mold.

[0020] Preferably, the encapsulation system further includes a direct pouring machine for grinding the cured encapsulation material on the sprue.

[0021] Preferably, the encapsulation mold is provided with a plurality of openings corresponding to the number and positions of the output leads on both side walls corresponding to the output leads, and the output lead planarization mold is disposed on both sides of the bottom of the encapsulation mold.

[0022] Preferably, the output lead planarization mold is a flat plate disposed on both sides of the bottom of the encapsulation mold. The upper surface of the flat plate is flush with the bottom surface of the encapsulation mold. After the output lead forming mold presses down the leads and forms them under the action of the flat plate, the output leads are flush with the surface of the encapsulation material of the entire encapsulated structure.

[0023] Preferably, the flat plate and the encapsulation mold are of an integral structure.

[0024] Preferably, the encapsulation system further includes a marking machine for printing marks on the cured encapsulation material.

[0025] Beneficial effects brought by the embodiments of the present invention: Through the output lead forming mold and the output lead planarizing mold, when encapsulating the intelligent power module, the output leads are planarized and formed, so that the output leads are flush with the surface of the substrate or the surface of the encapsulation structure, ensuring that there is no air gap after the entire encapsulation module is installed on the PCB board, and improving the assembly yield. Description of the Drawings

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0027] Figure 1 is a flowchart of the encapsulation method for the intelligent power module in Embodiment 1 of the present invention;

[0028] Figure 2 is a schematic structural diagram of the substrate assembly in Embodiment 1 of the present invention;

[0029] Figure 3 is a schematic diagram of the process of step S1 in Embodiment 1 of the present invention;

[0030] Figure 4 is a schematic diagram of the process of step S2 in Embodiment 1 of the present invention;

[0031] Figure 5 is a schematic diagram of the process of step S3 in Embodiment 1 of the present invention;

[0032] Figure 6 is a schematic diagram of the process of step S3 in Embodiment 1 of the present invention;

[0033] Figure 7 is a schematic diagram of the process of step S4 in Embodiment 1 of the present invention;

[0034] Figure 8 is a schematic diagram of the process of step S5 in Embodiment 1 of the present invention;

[0035] Figure 9 is a schematic diagram of the process of grinding flat in Embodiment 1 of the present invention;

[0036] Figure 10It is a schematic process diagram of marking and printing in the first embodiment of the present invention;

[0037] Figure 11 It is a schematic structural diagram of the encapsulation mold 110 in the second embodiment of the present invention;

[0038] Figure 12 It is a schematic process diagram of step S1 in the second embodiment of the present invention;

[0039] Figure 13 It is a schematic process diagram of step S2 in the second embodiment of the present invention;

[0040] Figure 14 It is a schematic process diagram of step S3 in the second embodiment of the present invention;

[0041] Figure 15 It is a schematic process diagram of step S4 in the second embodiment of the present invention;

[0042] Figure 16 It is a schematic process diagram of step S5 in the second embodiment of the present invention;

[0043] Figure 17 It is a schematic process diagram of the planing process in the second embodiment of the present invention;

[0044] Figure 18 It is a schematic process diagram of marking and printing in the second embodiment of the present invention;

[0045] Figure 19 It is a schematic structural diagram of an existing intelligent power module assembled on a PCB board;

[0046] Figure 20 It is a schematic diagram of the air gap in a situation where an existing intelligent power module is assembled on a PCB board;

[0047] Figure 21 It is a schematic diagram of the air gap in another situation where an existing intelligent power module is assembled on a PCB board. Specific embodiments

[0048] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0049] The terms used in the embodiments of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The singular forms "a", "the", and "said" used in the embodiments of the present invention and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0050] It should be understood that although the terms first, second, etc. may be used in the embodiments of the present invention to describe various units, these units should not be limited to these terms. These terms are only used to distinguish units of the same type from each other. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0051] Embodiment 1

[0052] As Figure 1 shown, a packaging method for an intelligent power module provided by an embodiment of the present invention, the power module includes: a substrate, components provided on the substrate, and output leads led out from both sides of the substrate, and the method includes the steps of:

[0053] S1. Invert the assembled substrate to a preset position of a packaging mold, wherein a packaging material is preset in the packaging mold;

[0054] S2. Press the substrate against the packaging mold through a packaging and molding pressing mold so that the packaging material covers the components on the substrate;

[0055] S3. Press the output leads on the substrate towards the packaging mold through an output lead forming mold, and make the output leads flush with the upper surface or the lower surface of the entire packaging structure after being formed through an output lead planarization mold;

[0056] S4. Cure the packaging material;

[0057] S5. Take out the entire packaging structure from the packaging mold.

[0058] As Figure 2 shown, the assembled substrate assembly 203 includes: a substrate 109, components (not labeled) provided on the substrate 108, side baffles 108 provided on both sides of the substrate, and output leads 103 passing through the side baffles 108.

[0059] As Figure 3As shown, the specific process of step S1 is shown. In this step S1, the assembled substrate assembly 203 is flipped to a preset position of the packaging mold 201, so that the components on the substrate are aligned with the packaging material 202 in the packaging mold 201. In this embodiment, the packaging material 202 can be epoxy resin or putty.

[0060] Combination Figure 4 As shown, Figure 4 The specific process of step S2 is shown. At this time, the encapsulation molding pressing mold 204 presses the substrate assembly 203 downward toward the encapsulation mold 201. At this time, the encapsulation material in the encapsulation mold is filled into the components on the substrate assembly 203 to seal it, and the excess encapsulation material will overflow from the water outlet at the bottom of the encapsulation mold. The output lead 103 is warped upward under the action of the edge of the encapsulation mold 201. At this time, the output lead flattening mold 209 is ready to be assembled.

[0061] Combination Figure 5 and Figure 6 The specific process of step S3 is shown. After the output lead planarization mold 209 is assembled, the output lead forming mold 205 is pressed down to press the output lead onto the output lead planarization mold 209. The thickness of the output lead planarization mold 209 plus the thickness of the output lead is exactly equal to the thickness of the substrate. Therefore, after the forming effect of the output lead planarization mold 209, the output lead is exactly flush with the back of the substrate.

[0062] like Figure 7 As shown, the specific process of step S4 is shown. After forming, the packaging molding mold, the output lead molding mold, and the output lead planarization mold are withdrawn and heated and cured by the heating device 211.

[0063] like Figure 8 , which shows the specific process of step S5 , after curing, a packaging structure is formed on the substrate, and the intelligent power module is ejected from the water outlet by the demoulding device 212 .

[0064] like Figure 9 As shown, this embodiment further includes grinding the protrusion on the packaging structure caused by the water nozzle, and grinding is performed by the direct casting machine 214.

[0065] like Figure 10 As shown, this embodiment further includes printing a mark on the surface of the packaging structure by means of a laser printer 215 .

[0066] In this embodiment, the output leads are planarized and formed by using an output lead forming mold and an output lead planarizing mold when packaging the intelligent power module, so that the output leads are flush with the surface of the substrate or the surface of the packaging structure, so that after the entire packaging module is installed on the PCB board, no air gap will be caused, thereby improving the assembly yield.

[0067] Example 2

[0068] As Figures 11 - 18 shown, different from Example 1, in this example, the edge of the encapsulation mold 110 has an opening 112 for avoiding the output leads, and output lead planarization molds 113 are arranged on both sides of the bottom of the encapsulation mold 110. Other structures of the encapsulation mold 110, such as the gate 111, are basically the same as those in Example 1.

[0069] As Figure 12 shown, the structure of the encapsulation and molding mold 301 is also different from that in Example 1. The encapsulation and molding mold 301 has a groove (not marked in the figure) adapted to the shape of the substrate, which can accommodate the substrate. When pressed down, as Figure 13 shown, the substrate assembly 203 is pressed down. Since the two sides of the encapsulation mold 110 have openings to avoid the output leads 103, the output leads 103 are not pressed up.

[0070] As Figure 14 shown, the output leads 103 are pressed down by the output lead forming mold 303 until they reach the output lead planarization mold 113. Since the surface of the output lead planarization mold 113 is flush with the bottom surface of the encapsulation mold, at this time, the output leads 103 are also flush with the bottom surface of the encapsulation mold. That is to say, after curing, the output leads 103 will be flush with the surface of the encapsulation structure.

[0071] Example 3

[0072] As Figures 3 - 10 shown, the present invention also provides an encapsulation system for an intelligent power module. Among them, as Figure 2 shown, the power module includes: a substrate 109 and components (not marked in the figure) arranged on the substrate 109. The encapsulation system includes:

[0073] An encapsulation mold 201 for loading an encapsulation material 202 and forming the encapsulation material 202 on the substrate 109 to cover the components on the substrate;

[0074] An encapsulation and molding pressing mold 204, which is correspondingly arranged with the encapsulation mold 201, for pressing the substrate 109 against the encapsulation mold 204 so that the encapsulation material 202 covers the components on the substrate 109;

[0075] An output lead forming mold 205 arranged on both sides of the encapsulation and molding pressing mold 204 for pressing the output leads 103 on the substrate 109 towards the encapsulation mold 201;

[0076] The output lead planarization die 209 is correspondingly arranged with the output lead forming die 205, and is used to make the output lead 103 flush with the upper surface or the lower surface of the entire packaging module after being formed.

[0077] In this embodiment, the packaging die 201 is provided with flat portions 206 extending outwardly corresponding to both sides of the lead, and the output lead planarization die 209 is arranged on the flat portions 206.

[0078] In this embodiment, the output lead planarization die 209 is a flat plate arranged on the flat portion. The sum of the thickness of the flat plate and the thickness of the output lead 103 is equal to the thickness of the substrate 109. When the output lead forming die 209 presses down the output lead 103 and forms it under the action of the flat plate, the output lead 103 is flush with the back surface of the substrate 109.

[0079] In this embodiment, a sprue (not marked in the figure) is provided at the bottom of the packaging die 201. The sprue can overflow the excess packaging material when the packaging die 201 is formed on the basic component 203, and can also be used as the ejection port for ejecting the packaging module during demolding.

[0080] In this embodiment, the packaging system may further include a demolding device 212 for ejecting the cured packaging module.

[0081] In this embodiment, the packaging system further includes a direct pouring machine 214, and the direct pouring machine is used to grind the protruding portion 213 formed by the cured packaging material on the sprue.

[0082] In this embodiment, the packaging system further includes a laser printer 215 for printing marks on the packaging structure.

[0083] Embodiment 4

[0084] As Figures 11 - 18 Combined with Figure 2 As shown, in this embodiment, different from Embodiment 3, the packaging die 110 is provided with a plurality of openings 112 corresponding to the number and positions of the output leads 103 on both side walls corresponding to the output leads 103, and the output lead planarization die 113 is arranged on both sides of the bottom of the packaging die 110.

[0085] The output lead planarization die 113 is a flat plate arranged on both sides of the bottom of the packaging die 110. The upper surface of the flat plate is flush with the bottom surface of the packaging die 110. When the output lead forming die 303 presses down the output lead and forms it under the action of the flat plate, the output lead 103 is flush with the surface of the entire packaging structure.

[0086] In this embodiment, the flat plate and the encapsulation mold 301 are an integral structure.

[0087] The above-disclosed are only the preferred embodiments of the present invention. Of course, the scope of the rights of the present invention cannot be limited thereby. Therefore, equivalent changes made according to the claims of the present invention still fall within the scope covered by the present invention.

Claims

1. A packaging method for an intelligent power module, the power module including an assembled substrate assembly, and the assembled substrate assembly including: A substrate, components provided on the substrate, and output leads led out from both sides of the substrate, characterized by comprising the steps of: S1. Invert the assembled substrate assembly onto a preset position of a packaging mold, wherein a packaging material is preset in the packaging mold; S2. Press the substrate assembly against the packaging mold through a packaging and molding pressing mold so that the packaging material covers the components on the substrate; the output leads are warped upward under the action of the edge of the packaging mold; S3. Press the output leads on the substrate towards the packaging mold through an output lead forming mold, and form the output leads through an output lead planarizing mold; The packaging mold is provided with flat portions extending outward on both sides corresponding to the leads, the output lead planarizing mold is arranged between the flat portions and the output leads, the output lead planarizing mold is a flat plate arranged on the flat portion, and the sum of the thickness of the flat plate and the thickness of the output leads is equal to the thickness of the substrate. When the output lead forming mold presses down the output leads and the output leads are formed under the action of the flat plate, the surface of the output leads in contact with the output lead forming mold is flush with the back surface of the substrate; a water inlet is arranged at the bottom of the packaging mold; the packaging and molding pressing mold presses the substrate assembly downwards towards the packaging mold. At this time, the packaging material in the packaging mold fills the components on the substrate to seal them, and the excess packaging material will overflow from the water inlet at the bottom of the packaging mold; S4. Cure the packaging material; use a direct pouring machine to grind the cured packaging material on the water inlet; S5. Remove the cured packaging material from the packaging mold.

2. A packaging method for an intelligent power module, the power module including an assembled substrate assembly, and the assembled substrate assembly comprising: A substrate, components provided on the substrate, and output leads led out from both sides of the substrate, characterized by comprising the steps of: S1. Invert the assembled substrate assembly onto a preset position of a packaging mold, wherein a packaging material is preset inside the packaging mold; S2. Press the substrate assembly against the packaging mold through a packaging and molding pressing mold so that the encapsulated material covers the components on the substrate; S3. Press the output leads on the substrate towards the packaging mold through an output lead forming mold, and form the output leads through an output lead planarizing mold; The upper surface of the packaging mold is provided with a plurality of openings corresponding to the output leads in terms of quantity and position. The output lead planarizing mold is a flat plate arranged on both sides of the bottom of the packaging mold; the upper surface of the flat plate is flush with the inner bottom surface of the packaging mold. Press down the output leads through the output lead forming mold until the output leads contact the output lead planarizing mold. At this time, the output leads are flush with the inner bottom surface of the packaging mold. A water inlet is arranged at the bottom of the packaging mold; the packaging and molding pressing mold presses the substrate assembly downwards towards the packaging mold. At this time, the packaging material in the packaging mold fills the components on the substrate to seal them, and the excess packaging material will overflow from the water inlet at the bottom of the packaging mold; S4. Cure the packaging material; use a direct pouring machine to grind the cured packaging material on the water inlet; S5. Remove the cured encapsulation material from the encapsulation mold.

3. An encapsulation system for an intelligent power module, the power module including an assembled substrate assembly, and the assembled substrate assembly including: A substrate and components provided on the substrate, characterized in that the encapsulation system includes: An encapsulation mold for loading the encapsulation material and forming the encapsulation material on the substrate to cover the components on the substrate; An encapsulation molding press mold correspondingly arranged with the encapsulation mold for pressing the substrate assembly against the encapsulation mold so that the encapsulation material covers the components on the substrate; An output lead forming mold provided on both sides of the encapsulation molding press mold for pressing the output leads on the substrate towards the encapsulation mold; An output lead planarization mold correspondingly arranged with the output lead forming mold for forming the output leads; The encapsulation mold is provided with flat portions extending outward on both sides corresponding to the leads, and the output lead planarization mold is arranged between the flat portion and the output leads. The output lead planarization mold is a flat plate provided on the flat portion, and the sum of the thickness of the flat plate and the thickness of the output leads is equal to the thickness of the substrate. When the output lead forming mold presses down the output leads and the output leads are formed under the action of the flat plate, the surface of the output leads in contact with the output lead forming mold is flush with the back surface of the substrate; a water inlet is provided at the bottom of the encapsulation mold; the encapsulation molding press mold presses the substrate assembly downward against the encapsulation mold. At this time, the encapsulation material in the encapsulation mold fills the components on the substrate assembly to enclose them, and the excess encapsulation material will overflow from the water inlet at the bottom of the encapsulation mold.

4. An encapsulation system for an intelligent power module, the power module comprising an assembled substrate assembly, the assembled substrate assembly comprising: A substrate and components provided on the substrate, characterized in that the encapsulation system includes: An encapsulation mold for loading the encapsulation material and forming the encapsulation material on the substrate to cover the components on the substrate; An encapsulation molding press mold correspondingly arranged with the encapsulation mold for pressing the substrate assembly against the encapsulation mold so that the encapsulation material covers the components on the substrate; An output lead forming mold provided on both sides of the encapsulation molding press mold for pressing the output leads on the substrate towards the encapsulation mold; An output lead planarization mold correspondingly arranged with the output lead forming mold for forming the output leads; The upper surface of the encapsulation mold is provided with a plurality of openings corresponding to the output leads in number and position. The output lead planarization mold is a flat plate provided on both sides of the bottom of the encapsulation mold; the upper surface of the flat plate is flush with the inner bottom surface of the encapsulation mold. By pressing down the output leads with the output lead forming mold until the output leads contact the output lead planarization mold, at this time, the output leads are flush with the inner bottom surface of the encapsulation mold. A water inlet is provided at the bottom of the encapsulation mold; the encapsulation molding press mold presses the substrate assembly downward against the encapsulation mold. At this time, the encapsulation material in the encapsulation mold fills the components on the substrate assembly to enclose them, and the excess encapsulation material will overflow from the water inlet at the bottom of the encapsulation mold.

5. The encapsulation system according to claim 4, wherein The flat plate and the encapsulation mold are of an integral structure.

6. The encapsulation system according to claim 3 or 4, wherein The encapsulation system further includes a marking machine for printing marks on the cured encapsulation material.

Images