Photosensitive Component, Camera Module and Preparation Method Thereof

Abstract

The present application relates to a photosensitive component, a camera module thereof and a manufacturing method. The photosensitive component includes a photosensitive chip and a circuit board, and the circuit board includes a circuit board body and an ink layer formed on the circuit board body. The ink layer includes a hollowed-out area formed in the photosensitive chip mounting area of the circuit board. The hollowed-out area is configured to apply an adhesive thereon, so that the photosensitive chip bends downward during the process of mounting the photosensitive chip on the circuit board through the adhesive. In this way, the bending state of the photosensitive chip is adjusted to improve its imaging quality.

Description

Technical Field

[0001] This application relates to the field of camera modules, and particularly to a photosensitive component, a camera module, and a preparation method thereof. Background Art

[0002] With the popularization of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users obtain images (such as videos or pictures) have developed rapidly and advanced. In recent years, camera modules have been widely used in many fields such as medical treatment, security, and industrial production.

[0003] As consumers' requirements for the imaging quality of mobile electronic devices (such as smartphones) are getting higher and higher, the size of the photosensitive chip in the camera module is gradually increasing. This has caused a series of technical problems, such as chip deformation problems and the over-large size of the camera module. Therefore, an improved structural design and preparation scheme of the camera module are needed. Summary of the Invention

[0004] The main purpose of this application is to provide a photosensitive component, a camera module, and a preparation method thereof. The ink layer of the circuit board has a hollowed-out area formed in the photosensitive chip mounting area, so that the photosensitive chip bends downward during the process of mounting the photosensitive chip on the photosensitive chip mounting area of the circuit board by applying an adhesive in the hollowed-out area. In this way, the bending state of the photosensitive chip is adjusted to improve the imaging quality of the camera module.

[0005] Another purpose of this application is to provide a photosensitive component, a camera module, and a preparation method thereof. During the process of mounting the photosensitive chip on the photosensitive chip mounting area, the adhesive applied in the hollowed-out area will cure and shrink, and the ink layer around the adhesive has the characteristic of being less deformable than the adhesive, so that the lower surface of the photosensitive chip bends downward to adjust the bending state of the photosensitive chip.

[0006] Another purpose of this application is to provide a photosensitive component, a camera module, and a preparation method thereof. The hollowed-out area is located within the photosensitive chip mounting area, and the non-overlapping area between the hollowed-out area and the photosensitive chip mounting area is located on the shorter side of the photosensitive chip mounting area, so that during the assembly process, a larger bend is generated on the shorter side of the photosensitive chip to adapt to the field curvature of the optical lens.

[0007] Another object of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof. Among them, the hollow area is located within the photosensitive chip mounting area, and the non-overlapping area between the hollow area and the photosensitive chip mounting area is located at the corner area of the photosensitive chip mounting area, so that during the assembly process, a large bending occurs in the corner area of the photosensitive chip to adapt to the field curvature of the optical lens.

[0008] Another object of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof. Among them, the photosensitive chip is directly bonded to the main body of the circuit board to improve the bonding stability between the photosensitive chip and the circuit board.

[0009] Another object of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof. Among them, through the hollow area, the overall height dimension of the photosensitive component and its camera module can be further reduced.

[0010] Through the following description, other advantages and features of the present application will become obvious and can be realized by the means and combinations specifically pointed out in the claims.

[0011] To achieve the above at least one object or advantage, the present application provides a photosensitive component, which includes:

[0012] A photosensitive chip; and

[0013] A circuit board, including a circuit board main body and an ink layer formed on the circuit board main body. The ink layer includes a hollow area formed in the photosensitive chip mounting area on the circuit board. The hollow area is configured to apply an adhesive thereon, so that the photosensitive chip bends downward during the process of mounting the photosensitive chip on the circuit board through the adhesive.

[0014] In the photosensitive component according to the present application, the hollow area partially overlaps with the photosensitive chip mounting area, and the non-overlapping area between the hollow area and the photosensitive chip mounting area is located on the shorter side of the photosensitive chip mounting area.

[0015] In the photosensitive component according to the present application, the hollow area partially overlaps with the photosensitive chip mounting area, and the non-overlapping area between the hollow area and the photosensitive chip mounting area is located at the corner area of the photosensitive chip mounting area.

[0016] In the photosensitive component according to the present application, the non-overlapping area of the hollow area and the photosensitive chip mounting area is symmetrically distributed with respect to the photosensitive chip mounting area.

[0017] In the photosensitive component according to the present application, the width of the hollowed-out area corresponding to the shorter side of the photosensitive chip mounting area is greater than the width of the hollowed-out area corresponding to the longer side of the photosensitive chip mounting area.

[0018] In the photosensitive component according to the present application, the center of the hollowed-out area corresponds to the center of the photosensitive chip mounting area.

[0019] In the photosensitive component according to the present application, the shape of the hollowed-out area is a centrosymmetric figure.

[0020] In the photosensitive component according to the present application, the shape of the hollowed-out area corresponds to the shape of the photosensitive chip mounting area.

[0021] In the photosensitive component according to the present application, the shape of the hollowed-out area is a cross shape.

[0022] In the photosensitive component according to the present application, the ink layer further includes at least one air escape through hole, and the at least one air escape through hole extends outward from the hollowed-out area and protrudes from the photosensitive chip mounting area.

[0023] In the photosensitive component according to the present application, the photosensitive component further includes at least one electronic component disposed on the circuit board and a lead for electrically connecting the photosensitive chip and the circuit board. Among them, the at least one air escape channel is formed on the side of the circuit board where there is no lead and the electronic component.

[0024] In the photosensitive component according to the present application, the area of the hollowed-out area is 30-90% of the area of the photosensitive chip mounting area.

[0025] In the photosensitive component according to the present application, the thickness of the part of the ink layer for mounting the photosensitive chip is higher than the thickness of the other parts of the ink layer.

[0026] In the photosensitive component according to the present application, the thickness of the ink layer is 30-100 microns.

[0027] In the photosensitive component according to the present application, the thickness of the adhesive is 10-100 microns.

[0028] In the photosensitive component according to the present application, the ink layer is less likely to deform than the adhesive.

[0029] In the photosensitive component according to the present application, the adhesive has insulation properties.

[0030] According to another aspect of the present application, the present application further provides a camera module, which includes:

[0031] The photosensitive component as described above; and

[0032] An optical lens maintained on the light-sensing path of the light-sensing component.

[0033] In the imaging module according to the present application, the curved shape of the lower surface of the light-sensing chip is adapted to the shape of the actual focal imaging surface of the imaging module.

[0034] According to another aspect of the present application, there is also provided a method for manufacturing a light-sensing component, which includes:

[0035] Forming a hollowed-out area on the light-sensing chip mounting area of the circuit board, wherein the hollowed-out area is located within the light-sensing chip mounting area;

[0036] Applying an adhesive on the hollowed-out area and the light-sensing chip mounting area; and

[0037] Mounting the light-sensing chip on the light-sensing chip mounting area to bend the light-sensing chip downward through the adhesive.

[0038] In the method for manufacturing a light-sensing component according to the present application, forming a hollowed-out area on the light-sensing chip mounting area of the circuit board includes:

[0039] Providing a circuit board body;

[0040] Forming an ink layer on the circuit board body; and

[0041] Etching the ink layer through an etching process to form the hollowed-out area on the light-sensing chip mounting area of the circuit board.

[0042] In the method for manufacturing a light-sensing component according to the present application, forming a hollowed-out area on the light-sensing chip mounting area of the circuit board includes:

[0043] Providing a circuit board body;

[0044] Setting a shielding object at the position where the hollowed-out area is to be formed;

[0045] Forming an ink layer around the shielding object; and

[0046] Removing the shielding object to form the hollowed-out area at the position corresponding to the shielding object.

[0047] In the method for manufacturing a light-sensing component according to the present application, forming a hollowed-out area on the light-sensing chip mounting area of the circuit board includes:

[0048] Providing a circuit board body; and

[0049] Forming an ink layer having the hollowed-out area on the circuit board body by means of inkjet printing.

[0050] Further objects and advantages of the present application will become fully apparent from the subsequent description and the accompanying drawings.

[0051] These and other objects, features, and advantages of the present application will become fully apparent from the following detailed description, the accompanying drawings, and the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other objects, features, and advantages of the present application will become more apparent. The drawings are used to provide a further understanding of the embodiments of the present application, and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application, and do not constitute a limitation to the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0053] Figure 1 FIG. shows a schematic diagram of the picking process of a photosensitive chip in an existing COB assembly process.

[0054] Figure 2 FIG. shows a schematic diagram of the imaging optical path of an imaging module.

[0055] Figure 3 FIG. shows a schematic diagram of an imaging module according to an embodiment of the present application.

[0056] Figure 4 FIG. shows a schematic diagram of a photosensitive component according to an embodiment of the present application.

[0057] Figure 5 FIG. shows a top view schematic diagram of the photosensitive component according to an embodiment of the present application.

[0058] Figure 6 FIG. shows a top view schematic diagram of a modified embodiment of the photosensitive component according to an embodiment of the present application.

[0059] Figure 7 FIG. shows a top view schematic diagram of another modified embodiment of the photosensitive component according to an embodiment of the present application.

[0060] Figure 8 FIG. shows a top view schematic diagram of yet another modified embodiment of the photosensitive component according to an embodiment of the present application.

[0061] Figure 9 FIG. shows a top view schematic diagram of yet another modified embodiment of the photosensitive component according to an embodiment of the present application.

[0062] Figure 10 FIG. shows a top view schematic diagram of yet another modified embodiment of the photosensitive component according to an embodiment of the present application.

[0063] Figure 11The figure shows a top view schematic diagram of yet another variant implementation of the photosensitive component according to an embodiment of the present application.

[0064] Figure 12 The figure shows a schematic diagram of yet another variant implementation of the photosensitive component according to an embodiment of the present application.

[0065] Figure 13 The figure shows a schematic diagram of yet another variant implementation of the photosensitive component according to an embodiment of the present application.

[0066] Figure 14 The figure shows a schematic diagram of yet another variant implementation of the photosensitive component according to an embodiment of the present application.

[0067] Figure 15 The figure shows a schematic diagram of yet another variant implementation of the photosensitive component according to an embodiment of the present application.

[0068] Figure 16 The figure shows a schematic diagram of yet another variant implementation of the photosensitive component according to an embodiment of the present application.

[0069] Figure 17 The figure shows a schematic diagram of the preparation process of the photosensitive component according to an embodiment of the present application. Detailed implementation manners

[0070] Next, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described herein.

[0071] Overview of the Application

[0072] As described above, as consumers' requirements for the imaging quality of terminal devices are getting higher and higher, the size of the photosensitive chips in camera modules is gradually increasing, which has caused a series of technical problems, such as chip deformation problems, over-large camera module sizes, etc. Therefore, improved camera module structure designs and preparation schemes are needed.

[0073] Specifically, existing camera modules usually adopt the COB (Chip on Board) process for assembly: pick up the photosensitive chip → attach it to the circuit board → electrically connect the photosensitive chip to the circuit board. However, as the size continues to increase, the photosensitive chip is prone to deformation during the picking process.

[0074] Figure 1 The figure shows a schematic diagram of the picking process of the photosensitive chip in the existing COB assembly process. As Figure 1As shown, in the existing COB assembly process, a photosensitive chip is picked up by adsorption. Moreover, since the photosensitive area of the photosensitive chip cannot be contacted, the suction nozzle of the picker can only adhere to the non-photosensitive area of the photosensitive chip. During the picking process, due to the suction adsorption of the suction nozzle, the photosensitive chip will bend towards the photosensitive surface of the photosensitive chip due to being adsorbed, presenting an upward convex shape (figuratively speaking, from the effect presented in Figure 1 it can be defined as a "crying face" shape).

[0075] Those skilled in the art should be aware that even if the photosensitive chip does not undergo a "crying face" deformation (i.e., the photosensitive chip is planar), due to the different optical path differences between the edge part and the central part of the photosensitive chip relative to the optical lens, and factors such as assembly tolerances in the lens optical design and lens assembly process, when the imaging light reaches the edge part of the photosensitive chip, there are likely to be adverse phenomena such as distortion, corner light loss, and decreased clarity, resulting in a deteriorated imaging effect. After the "crying face" deformation occurs, these adverse phenomena will be further aggravated, more seriously affecting the imaging quality.

[0076] Specifically, Figure 2 The figure shows a schematic diagram of the imaging optical path of the camera module. As Figure 2 shown, during the imaging process of the camera module, due to factors such as assembly tolerances in the lens optical design and lens assembly process, the shape of the actual focal plane of imaging is an arc surface convex towards the image side. Those skilled in the art should be aware that when the plane where the photosensitive chip is located coincides with the actual focal plane of imaging, the imaging quality is the best. However, in actual situations, even when using multiple lenses to modulate the optical system of the camera module, the actual focal plane will still present an arc surface. This is also the reason why adverse phenomena such as distortion, corner light loss, and decreased clarity will occur even if the photosensitive chip does not deform during the picking process. However, due to the "crying face" deformation of the photosensitive chip during the picking process, comparing with Figure 2 the shape of the actual focal plane in it, it can be seen that the "crying face" deformation is exactly opposite to the deformation mode of the actual focal plane, resulting in an aggravation of the degree of adverse phenomena such as distortion, corner light loss, and sharp angle decrease, more seriously affecting the imaging quality of the camera module.

[0077] In addition, during the process of attaching the photosensitive chip to the corresponding area of the circuit board through the DA (Die Attach) process, due to the inconsistent coefficients of thermal expansion of the circuit board and the photosensitive chip, during the baking and curing process of the adhesive, the amount of expansion generated by the circuit board is greater than that of the photosensitive chip. When the temperature drops back to room temperature, the amount of shrinkage generated by the circuit board is also greater than that of the photosensitive chip, resulting in the photosensitive chip being bent convexly towards the image side. That is to say, when the photosensitive chip is attached to the circuit board through the DA process, the "crying face" deformation is aggravated, leading to adverse phenomena such as distortion, corner light loss, and sharp angle decline, further deteriorating the imaging effect.

[0078] In particular, for a camera module with high pixels and a large chip size, since the size of its photosensitive chip increases rapidly and the thickness of the photosensitive chip is thinner than that of other general chips, therefore, the large-sized photosensitive chip is more likely to generate bending problems, which has an increasing impact on the imaging quality of the camera module.

[0079] To address the above technical problems, the basic concept of this application is to hollow out the part of the ink layer of the circuit board corresponding to the photosensitive chip installation area, so that the photosensitive chip bends downward during the process of attaching the photosensitive chip to the photosensitive chip installation area of the circuit board by applying the adhesive in the hollowed-out area. In this way, the bending state of the photosensitive chip is adjusted to improve its imaging quality.

[0080] Based on this, this application proposes a photosensitive component, which includes: a photosensitive chip and a circuit board. Among them, the circuit board includes a circuit board main body and an ink layer formed on the circuit board main body. The ink layer includes a hollowed-out area formed in the photosensitive chip installation area of the circuit board. The hollowed-out area is configured to apply an adhesive thereon, so that the photosensitive chip bends downward during the process of attaching the photosensitive chip to the circuit board. In this way, the bending state of the photosensitive chip is adjusted to improve its imaging quality.

[0081] After introducing the basic principle of this application, the various non-limiting embodiments of this application will be specifically introduced below with reference to the accompanying drawings.

[0082] Exemplary Camera Module and Its Photosensitive Component

[0083] As Figure 3 and Figure 4 shown, the camera module according to an embodiment of this application is illustrated. Among them, the camera module includes an optical lens 10 and a photosensitive component 20. The optical lens 10 is held on the photosensitive path of the photosensitive component 20, so that the light collected by the optical lens 10 can be imaged in the photosensitive component 20 along this photosensitive path.

[0084] As Figure 4As shown, the photosensitive component 20 according to an embodiment of the present application includes: a circuit board 21, a photosensitive chip 22, at least one electronic component 23, and a package 24. Among them, the photosensitive chip 22 is electrically connected to the circuit board 21, the at least one electronic component 23 is disposed around the photosensitive chip 22 and electrically connected to the circuit board 21, and the package 24 is disposed on the circuit board 21 and is configured to mount the optical lens 10 thereon.

[0085] Specifically, in the embodiment of the present application, the package 24 is implemented as a traditional plastic bracket, which is prefabricated and mounted on a preset position of the circuit board 21 through the COB process. Of course, those skilled in the art should understand that in other examples of the present application, the package 24 can also be implemented as other types of packages 24. For example, the package 24 can be implemented as a molding bracket formed on the circuit board 21 through the MOB (Molding on Board) process and integrally covering at least a part of the circuit board 21 and at least a part of the electronic component 23, as Figure 15 shown. Again, for example, the package 24 can also be implemented as a molding bracket formed on the circuit board 21 through the MOC (Molding on Chip) process and integrally covering at least a part of the circuit board 21, at least a part of the non-photosensitive area of the photosensitive chip 22, and at least a part of the electronic component 23, as Figure 16 shown. This is not limited by the present application.

[0086] In the embodiment of the present application, the at least one electronic component 23 can be mounted on the upper surface of the circuit board 21 through the Surface Mounting Technology. Generally, the at least one electronic component 23 is mounted in the surrounding area of the photosensitive chip 22. Or, the at least one electronic component 23 can also be embedded in the circuit board 21 to reduce the height of the at least one electronic component 23 protruding from the circuit board 21. It should be understood that the installation process of the at least one electronic component 23 is not limited by the present application. At the same time, in the embodiment of the present application, the type of the at least one electronic component 23 is not limited by the present application, and it includes but is not limited to capacitors, inductors, triodes, thyristors, resistors, etc.

[0087] In the embodiment of the present application, the electrical connection between the photosensitive chip 22 and the circuit board 21 is realized through the lead 25. Specifically, in the embodiment of the present application, each lead 25 extends bendably between the photosensitive chip 22 and the circuit board 21, so as to electrically connect the photosensitive chip 22 to the circuit board 21 through the lead 25. Thus, the circuit board 21 can supply power to the photosensitive chip 22 based on the lead 25, and the photosensitive chip 22 can transmit the collected signals based on the lead 25. It is worth mentioning that the type of the lead 25 is not limited by the present application. For example, the lead 25 can be a gold wire, a silver wire, or a copper wire. And the lead 25 can be installed between the circuit board 21 and the photosensitive chip 22 through the process of "bonding gold wire" to realize the electrical connection between the two.

[0088] Specifically, the process of "bonding gold wire" is generally divided into two types: the "positive bonding gold wire" process and the "negative bonding gold wire" process. The "positive bonding gold wire" process means that during the process of laying the lead 25, one end of the lead 25 is first formed on the conductive end of the circuit board 21, and then the lead 25 is extended bendably, and finally the other end of the lead 25 is formed on the conductive end of the photosensitive chip 22. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21. The "negative bonding gold wire" process means that during the process of laying the lead 25, one end of the lead 25 is first formed on the conductive end of the photosensitive chip 22, and then the lead 25 is extended bendably, and finally the other end of the lead 25 is formed on the conductive end of the circuit board 21. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21. It is worth mentioning that the height of the lead 25 protruding upward formed by the "negative bonding gold wire" process is relative to the height of the lead 25 protruding upward formed by the "positive bonding gold wire" process. Therefore, preferably, in this specific implementation, the "negative bonding gold wire" process is used to form the lead 25.

[0089] Of course, those skilled in the art should know that in other examples of the present application, the photosensitive chip 22 and the circuit board 21 can be conducted through other means, such as using the back conduction method. This is not limited by the present application.

[0090] In the embodiment of the present application, the photosensitive chip 22 is mounted on the circuit board 21. That is to say, the circuit board 21 has a photosensitive chip mounting area 210 for mounting the photosensitive chip 22 thereon. As mentioned above, as consumers' requirements for the imaging quality of terminal devices are getting higher and higher, the size of the photosensitive chip 22 in the camera module is gradually increasing, resulting in more prone and severe chip deformation problems during the process of mounting the photosensitive chip 22 on the circuit board 21. In view of this technical problem, in the embodiment of the present application, the structure of the circuit board 21 is modified and an improved photosensitive chip 22 mounting process is matched.

[0091] Specifically, as Figure 4 shown, in the embodiment of the present application, the circuit board 21 includes a circuit board main body 211 and an ink layer 212 formed on the circuit board main body 211 to protect the exposed wire paths on the circuit board main body 211 through the ink layer 212, so as to achieve the purpose of protecting the circuit board main body 211. And, the ink layer 212 can also prevent the invasion of moisture and various dielectrics from oxidizing the circuit and endangering the electrical performance, and prevent external mechanical damage. At the same time, the ink layer 212 can also prevent soldering and insulation, prevent short circuits during the soldering of electronic components 23, save the amount of solder used, and can also avoid the conduction between circuits. It is worth mentioning that the conductive ends on the circuit board main body 211 are exposed to the ink layer 212.

[0092] Particularly, as Figure 4 shown, in the embodiment of the present application, the ink layer 212 includes a hollowed-out area 213 formed in the photosensitive chip mounting area 210. Among them, the hollowed-out area 213 is configured to apply an adhesive 26 thereon, so that the photosensitive chip 22 bends downward during the process of mounting the photosensitive chip 22 on the circuit board 21. That is to say, in the embodiment of the present application, the area of the ink layer 212 corresponding to the photosensitive chip 22 is hollowed out to form the hollowed-out area 213 on the photosensitive chip mounting area 210. Correspondingly, when the photosensitive chip 22 is mounted on the photosensitive chip mounting area 210 of the circuit board 21, the adhesive 26 applied in the hollowed-out area 213 will shrink during the curing process, and the ink layer 212 around the adhesive 26 has the characteristic of being less deformable than the adhesive 26, so that the lower surface of the photosensitive chip 22 bends downward.

[0093] Specifically, Figure 5 The figure shows a top view schematic diagram of the photosensitive component 20 according to the embodiment of the present application. As Figure 5As shown, in the embodiment of the present application, the hollow area 213 is located within the photosensitive chip mounting area 210. That is to say, in the embodiment of the present application, the hollow area 213 is accommodated within the photosensitive chip mounting area 210. In particular, in the photosensitive component 20 as Figure 5 shown, the boundary of the hollow area 213 is completely located within the photosensitive chip mounting area 210. That is to say, from the perspective of the relative positions of the photosensitive chip 22 and the ink layer 212, there is only one closed overlapping area in the projection of the photosensitive chip 22 and the ink layer 212 on the circuit board 21.

[0094] Correspondingly, during the process of mounting the photosensitive chip 22 onto the photosensitive chip mounting area 210, first, the adhesive 26 is applied within the hollow area 213 (it should be understood that in the embodiment of the present application, the application position of the adhesive 26 includes not only the hollow area 213, but also the part of the ink layer 212 that supports the photosensitive chip 22); then, the photosensitive chip 22 is placed on the photosensitive mounting area (it should be understood that at this time, the edge of the photosensitive chip 22 is supported on the ink layer 212); then, the adhesive 26 is cured to bond the photosensitive chip 22 to the circuit board main body 211. It should be understood that during the curing process of the adhesive 26, the adhesive 26 will shrink to a certain extent. In this way, after the adhesive 26 corresponding to the middle area of the lower surface of the photosensitive chip 22 shrinks, it will pull the lower surface of the photosensitive chip 22 to bend downward, thereby adjusting the bending state of the photosensitive chip 22. Specifically, in the embodiment of the present application, the lower surface of the photosensitive chip 22 bends downward under the action of the adhesive 26. Therefore, the degree of bending of the photosensitive chip 22 in the object side direction generated during the picking process is reduced, making it tend to be flat. Even more, under the action of the adhesive 26, the photosensitive chip 22 bends convexly in the image side direction. That is to say, in the embodiment of the present application, the adhesive 26 can compensate for the convex bending of the photosensitive chip 22 in the object side direction caused by baking and cooling of the circuit board 21.

[0095] Preferably, in the embodiment of the present application, the center of the hollow area 213 corresponds to the center of the photosensitive chip mounting area 210. That is to say, preferably, the center of the hollow area 213 coincides with the center of the mounting area of the photosensitive chip 22, or the hollow area 213 and the photosensitive chip mounting area 210 are coaxially arranged.

[0096] Preferably, in the embodiments of the present application, when the photosensitive chip 22 is mounted on the photosensitive chip mounting area 210, the center of the hollow area 213 corresponds to the center of the photosensitive surface of the photosensitive chip 22, where the photosensitive surface of the photosensitive chip 22 represents the area set by the photosensitive area of the photosensitive chip 22. It is worth mentioning that in the existing photosensitive chips, the photosensitive surface of the photosensitive chip 22 is not necessarily located in the central area of the photosensitive chip 22.

[0097] Preferably, in the embodiments of the present application, the shape of the hollow area 213 is a centrosymmetric figure. For example, a cross shape (as Figure 6 shown) is used to enable the photosensitive chip 22 to bend evenly. It is worth mentioning that the figure of the hollow area 213 can also be implemented as other figures, such as a circle, an ellipse, a regular polygon, etc. In this regard, it is not limited by the present application. At the same time, it should be understood that when the shape of the hollow area 213 is a centrosymmetric figure, from the perspective of the relative positions of the photosensitive chip 22 and the ink layer 212, the overlapping area of the projections of the photosensitive chip 22 and the ink layer 212 on the circuit board 21 is symmetrically distributed with respect to the photosensitive chip 22.

[0098] Preferably, in the embodiments of the present application, the shape of the hollow area 213 corresponds to the shape of the photosensitive chip mounting area 210. Those of ordinary skill in the art should know that the existing photosensitive chips 22 usually have a rectangular structure. Correspondingly, preferably, in the embodiments of the present application, the photosensitive chip mounting area 210 is implemented as a rectangle corresponding to the size of the photosensitive chip 22, and the shape of the hollow area 213 is a rectangle scaled according to a specific ratio. Of course, those skilled in the art should understand that with the development of technology, the shape design of the photosensitive chip 22 will change in different scenarios. When the shape of the photosensitive chip 22 changes, the shapes of the photosensitive chip mounting area 210 and the hollow area 213 need to be changed synchronously.

[0099] Preferably, in the embodiment of the present application, the width of the hollowed-out area 213 corresponding to the shorter side of the photosensitive chip mounting area 210 is greater than the width of the hollowed-out area 213 corresponding to the longer side of the photosensitive chip mounting area 210, so that the shorter side of the photosensitive chip 22 can be bent relatively more. Those of ordinary skill in the art should understand that generally, the degree of bending of the lens focal plane is higher the farther away from the center field of view, and the bending of the photosensitive chip 22 caused by the expansion and contraction of the circuit board 21 also shows a larger situation on the shorter side. Therefore, configuring the width of the hollowed-out area 213 corresponding to the shorter side of the photosensitive chip mounting area 210 to be greater than the width of the hollowed-out area 213 corresponding to the longer side of the photosensitive chip mounting area 210 is beneficial to improving the imaging quality of the photosensitive component 20 and the imaging module.

[0100] Figure 7 FIG. shows a top view schematic diagram of another variant implementation of the photosensitive component 20 according to the embodiment of the present application. As Figure 7 shown, in this variant implementation, the boundary part of the hollowed-out area 213 coincides with two boundaries of the photosensitive chip mounting area 210. As Figure 7 shown, from the perspective of the relative positions of the photosensitive chip 22 and the ink layer 212, the projections of the photosensitive chip 22 and the ink layer 212 on the circuit board 21 include two overlapping areas.

[0101] Preferably, as Figure 7 shown, in this variant embodiment, the non-coincident area between the hollowed-out area 213 and the photosensitive chip mounting area 210 is located on the shorter side of the photosensitive chip mounting area 210, so that the shorter side of the photosensitive chip 22 generates a relatively large bend. More preferably, as Figure 7 shown, the non-coincident area between the hollowed-out area 213 and the photosensitive chip mounting area 210 is symmetrically distributed with respect to the center of the photosensitive chip mounting area 210, so that the bending of the photosensitive chip 22 can be more uniform.

[0102] Figure 8 FIG. shows a top view schematic diagram of yet another variant implementation of the photosensitive component 20 according to the embodiment of the present application. As Figure 8 shown, in this variant implementation, the boundary part of the hollowed-out area 213 coincides with four boundaries of the photosensitive chip mounting area 210. As Figure 8 shown, from the perspective of the relative positions of the photosensitive chip 22 and the ink layer 212, the projections of the photosensitive chip 22 and the ink layer 212 on the circuit board 21 include four overlapping areas.

[0103] Preferably, as Figure 8As shown, in this modified embodiment, the non - overlapping region between the hollowed - out region 213 and the photosensitive chip mounting region 210 is located at the corner region of the photosensitive chip mounting region 210. It should be understood that since the bending degree of the lens focal plane is higher at positions farther from the central field of view, the corner region of the photosensitive chip 22 can be made to have a larger bend to cooperate with the field curvature of the lens for imaging. More preferably, as Figure 8 shown, the non - overlapping region between the hollowed - out region 213 and the photosensitive chip mounting region 210 is located at the four corner regions of the photosensitive chip mounting region 210. Of course, those of ordinary skill in the art should understand that in other examples of this modified implementation, the non - overlapping region between the hollowed - out region 213 and the photosensitive chip mounting region 210 can be set at two corner regions of the photosensitive chip 22 region, and this is not limited by this application.

[0104] Figure 9 FIG. illustrates a top - view schematic diagram of another modified implementation of the photosensitive component 20 according to an embodiment of the present application, where Figure 9 the photosensitive component 20 shown in Figure 5 is a modified implementation of the photosensitive component 20 shown. Figure 10 FIG. illustrates a top - view schematic diagram of another modified implementation of the photosensitive component 20 according to an embodiment of the present application, where Figure 10 the photosensitive component 20 shown in Figure 7 is a modified implementation of the photosensitive component 20 shown. Figure 11 FIG. illustrates a top - view schematic diagram of another modified implementation of the photosensitive component 20 according to an embodiment of the present application, where Figure 11 the photosensitive component 20 shown in Figure 8 is a modified implementation of the photosensitive component 20 shown. As Figures 9 - 11 shown, in this modified implementation, the ink layer 212 further includes at least one air - escape channel 214, and the at least one air - escape channel 214 extends outward from the hollowed - out region 213 and protrudes from the photosensitive chip mounting region 210.

[0105] Specifically, in the embodiment of the present application, the function of the at least one air - escape channel 214 is to prevent the photosensitive chip 22 from being unexpectedly tilted and / or bent due to the expansion of gas in the closed space. Here, the closed space refers to the closed space formed by the photosensitive component 20 and the hollowed - out region 213. Specifically, when curing the adhesive 26, the closed space is baked and then cooled. If the at least one air - escape channel 214 is not provided, the gas in the closed space cannot be exchanged with the outside world. When the air pressure in the closed space exceeds a preset threshold, it may cause the photosensitive chip 22 to be unexpectedly tilted and / or bent.

[0106] Preferably, as Figure 9 and Figure 11 shown, the at least one venting channel 214 is formed on the side of the circuit board 21 without the leads 25. Of course, those skilled in the art should understand that the at least one venting channel 214 can also be formed on the side of the circuit board 21 where the leads 25 exist, as Figure 10 shown. In particular, those of ordinary skill in the art should know that the distance between the conductive end and the photosensitive chip mounting area 210 is about 100 microns. Therefore, if the at least one venting channel 214 is provided on the side of the circuit board 21 where the leads 25 exist, attention should be paid to the length of the at least one venting channel 214 protruding from the photosensitive chip mounting area 210. Preferably, this length is less than 100 microns to avoid removing the solder resist ink on the periphery of the conductive end. Those of ordinary skill in the art should know that the solder resist ink has the function of solder resist insulation. After the solder resist ink on the periphery of the conductive end is removed, it may cause a short circuit between adjacent conductive ends.

[0107] It is worth mentioning that the at least one venting channel 214 can also reduce the interference of the part of the ink layer 212 corresponding to the at least one venting channel 214 on the bending of the photosensitive chip 22 during the bending process of the photosensitive chip 22.

[0108] It should be understood that in the embodiment of the present application, after the ink layer 212 is hollowed out to form the hollowed-out area 213 in the middle area of the ink layer 212, the wire paths on the circuit board main body 211 may be exposed (the conductive paths are not shown in the figure). Based on this, in the wiring design process of the circuit board 21, the wire paths laid at the position of the hollowed-out area 213 can be reduced. Or, the adhesive 26 can be configured to have insulation to avoid short circuits between wire paths.

[0109] When applying the adhesive 26 to the hollowed-out area 213, preferably, the adhesive 26 is disposed at the middle position of the hollowed-out area 213 corresponding to the photosensitive surface of the photosensitive chip 22, so that the middle area of the photosensitive surface of the photosensitive chip 22 can be uniformly subjected to the force of the curing shrinkage of the adhesive 26 and bend downward, so that the imaging surface of the photosensitive chip 22 can be adjusted relatively uniformly. In a specific implementation, the adhesive 26 can be disposed in a cross shape.

[0110] Preferably, in the embodiments of the present application, the area of the hollowed-out area 213 is 30-90% of the area of the photosensitive chip mounting area 210. It should be understood that when the area of the hollowed-out area 213 is small, the central area of the photosensitive chip 22 can be accurately bent convexly towards the object side; when the area of the hollowed-out area 213 is large, more of the adhesive 26 can be applied to provide a stronger adhesive force, so that the photosensitive chip 22 is firmly and stably bonded to the circuit board 21.

[0111] It is worth mentioning that in specific implementation, the adhesive 26 can also be disposed on a part of the ink layer 212 in the photosensitive chip mounting area 210. And, preferably, the thickness of the adhesive 26 applied in the hollowed-out area 213 is higher than the thickness of the surrounding adhesive 26. In this way, during the curing process of the adhesive 26, the adhesive 26 applied in the hollowed-out area 213 generates a larger shrinkage amount, while the shrinkage amount of the surrounding adhesive 26 is relatively small and the surrounding ink layer 212 is not easily deformed. In this way, the bending state of the photosensitive chip 22 can be further adjusted.

[0112] It is worth mentioning that in the embodiments of the present application, the thickness of the ink layer 212 can be set between 30 and 100 microns. Preferably, in the embodiments of the present application, the thickness of the part of the ink layer 212 for mounting the photosensitive chip 22 is higher than the thickness of the other parts of the ink layer 212. As Figures 12 - 14 shown, here, the other parts of the ink layer refer to the parts of the ink layer 212 that are not used for mounting the photosensitive chip 22. Specifically, as Figure 12 shown, the thickness of the wire path in the circuit board 21 is increased, that is, the height of the wire and the conductive end is increased. As Figure 13 shown, the thickness of the wire path in the circuit board 21 remains unchanged, and only the height of the ink layer 212 is increased. As Figure 14 shown, the thickness of the wire path in the circuit board 21 remains unchanged, and only the thickness of the part of the ink layer 212 for supporting the photosensitive chip 22 is increased. It is worth mentioning that when the thickness of the ink layer 212 is too large, it is difficult for the solvent to volatilize during ink curing, increasing the manufacturing difficulty of the ink layer 212. And only increasing the part of the ink layer 212 for supporting the photosensitive chip 22 can reduce the manufacturing difficulty of the ink layer 212, and at the same time, there is no need to add additional process problems due to changing the thickness of the wire path. In specific implementation, the thicker part of the ink layer 212 can be formed in one step or through multiple processes, and this is not limited by the present application.

[0113] It is worth mentioning that in conventional camera modules, the thickness of the adhesive 26 used to bond the photosensitive chip 22 to the circuit board 21 is about 10 to 50 microns, while the thickness of the ink layer 212 on the surface of the circuit board 21 is about 20 to 30 microns. The thicker adhesive 26 can produce a larger amount of shrinkage during the curing process, and has a better chip bending adjustment effect, while the use of thick glue will increase the distance between the photosensitive surface of the photosensitive chip 22 and the circuit board 21, thereby increasing the thickness of the camera module. Considering the above factors comprehensively, it is preferred to set the thickness of the ink layer 212 between 30 and 100 microns, and the thickness of the adhesive 26 between 10 and 100 microns, thereby ensuring that the height of the camera module is less affected while providing a certain bonding force and chip bending adjustment effect.

[0114] In summary, the camera module and its photosensitive component based on the embodiment of the present application are explained, which hollows out the portion of the ink layer of the circuit board corresponding to the photosensitive chip mounting area, so that the photosensitive chip is bent downward during the process of being mounted on the photosensitive chip mounting area 210 of the circuit board by applying an adhesive in the hollowed-out area. In this way, the bending state of the photosensitive chip 22 is adjusted to improve its imaging quality.

[0115] Although, the camera module is implemented as follows Figures 3 - 11 The fixed-focus camera module shown is an example. A person skilled in the art should understand that the camera module involved in the present application can also be implemented as a dynamic-focus camera module, that is, the camera module also includes a driving element disposed between the optical lens 10 and the photosensitive component 20, so that the driving element carries the optical lens 10 to move along the photosensitive path to change the distance between the optical lens 10 and the photosensitive component 20. Alternatively, the camera module can also be implemented as an optical image stabilization camera module, that is, the camera module also includes an optical image stabilization motor disposed between the optical lens 10 and the photosensitive component 20, so that the optical image stabilization motor can prevent the image quality from being affected by shaking during shooting. This is not limited to the present application.

[0116] Schematic Method for Preparing Photosensitive Component

[0117] According to another aspect of the present application, a method for preparing a photosensitive component 20 is also provided. Figure 17 FIG. 2 is a schematic diagram showing a process of preparing the photosensitive component 20 according to an embodiment of the present application. Figure 17As shown, the preparation process of the photosensitive component 20 according to the embodiment of the present application first includes: forming a hollowed-out area 213 on the photosensitive chip mounting area 210 of the circuit board 21, where the hollowed-out area 213 is located within the photosensitive chip mounting area 210; then, applying an adhesive 26 on the hollowed-out area 213 and the photosensitive chip mounting area 210; and finally, mounting the photosensitive chip 22 on the photosensitive chip mounting area 210 so that the photosensitive chip 22 is bent downward through the adhesive 26.

[0118] In the embodiment of the present application, the process of forming the hollowed-out area 213 on the photosensitive chip mounting area 210 of the circuit board 21 includes: first, providing a circuit board main body 211; then, forming an ink layer 212 on the circuit board main body 211; and etching the ink layer 212 through an etching process to form the hollowed-out area 213 on the photosensitive chip mounting area 210 of the circuit board 21.

[0119] Specifically, the ink layer 212 can be formed on the circuit board main body 211 by any one of printing, curtain coating, spraying, or roll coating. Further, an etching pattern is provided on the ink layer 212, where the etching pattern is made of a material that is impervious to ultraviolet light, and the etching pattern corresponds to the patterns of electronic components 23 such as conductive ends, resistors, and capacitors to be exposed and the hollowed-out area 213 (for example, the conductive pattern on the film can be transferred to the ink layer 212 of the circuit board 21 by using the photosensitive reaction of the photoresist); then, ultraviolet light is irradiated. Since ultraviolet light does not pass through outside the etching pattern, the remaining ink irradiated by ultraviolet light undergoes a photosensitive polymerization reaction and forms a polymer from monomers; finally, the unpolymerized ink on the surface of the circuit board 21 is removed by a weak base solution, exposing the pads and the hollowed-out area 213.

[0120] Those skilled in the art should understand that in other examples of the present application, the hollowed-out area 213 can also be formed on the ink layer 212 by other means.

[0121] For example, in other examples of the present application, the process of forming the hollowed-out area 213 on the photosensitive chip mounting area 210 of the circuit board 21 includes: providing a circuit board main body 211; however, a masking material is provided at the position where the hollowed-out area 213 is to be formed; then, an ink layer 212 is formed around the masking material, and at the same time, the masking material is removed to form the hollowed-out area 213 at the position corresponding to the masking material.

[0122] For another example, in other examples of the present application, the process of forming the hollowed-out area 213 on the photosensitive chip mounting area 210 of the circuit board 21 includes: providing a circuit board main body 211; and forming an ink layer 212 having the hollowed-out area 213 on the circuit board main body 211 by means of inkjet printing.

[0123] In summary, the method for preparing a photosensitive component based on the embodiments of the present application is elucidated, which can prepare the photosensitive component as described above and its variant embodiments.

[0124] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the drawings are only examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The function and structural principle of the present invention have been shown and explained in the embodiments, and the embodiments of the present invention can have any deformation or modification without departing from the principle.

Claims

1. A photosensitive component, characterized in that, comprising: a photosensitive chip; a circuit board, including a circuit board body and an ink layer formed on the circuit board body, the ink layer including a hollowed-out area formed in a photosensitive chip mounting area on the circuit board, the hollowed-out area configured to apply an adhesive thereon so that the photosensitive chip bends downward during the process of attaching the photosensitive chip to the circuit board; at least one electronic component disposed on the circuit board; and a lead for electrically connecting the photosensitive chip and the circuit board; wherein, the hollowed-out area is located within the photosensitive chip mounting area, and the width of the hollowed-out area corresponding to the shorter side of the photosensitive chip mounting area is greater than the width of the hollowed-out area corresponding to the longer side of the photosensitive chip mounting area; the ink layer further includes at least one air escape through-hole, the at least one air escape through-hole extends outward from the hollowed-out area and protrudes from the photosensitive chip mounting area; the at least one air escape channel is formed on a side of the circuit board where no lead is provided.

2. The photosensitive component according to claim 1, wherein, the hollowed-out area partially coincides with the photosensitive chip mounting area, and the non-coincident area between the hollowed-out area and the photosensitive chip mounting area is located on the shorter side of the photosensitive chip mounting area.

3. The photosensitive component according to claim 1, wherein, the hollowed-out area partially coincides with the photosensitive chip mounting area, and the non-coincident area between the hollowed-out area and the photosensitive chip mounting area is located in the corner area of the photosensitive chip mounting area.

4. The photosensitive component according to claim 2 or 3, wherein, the non-coincident areas of the hollowed-out area and the photosensitive chip mounting area are symmetrically distributed with respect to the photosensitive chip mounting area.

5. The photosensitive component according to claim 1, wherein, the center of the hollowed-out area corresponds to the center of the photosensitive chip mounting area.

6. The photosensitive component according to claim 5, wherein, the shape of the hollowed-out area is a centrally symmetric figure.

7. The photosensitive component according to claim 6, wherein, the shape of the hollowed-out area corresponds to the shape of the photosensitive chip mounting area.

8. The photosensitive component according to claim 6, wherein, the shape of the hollowed-out area is a cross shape.

9. The photosensitive component according to claim 1, wherein, the area of the hollowed-out area is 30 - 90% of the area of the photosensitive chip mounting area.

10. The photosensitive component according to claim 1, wherein, the thickness of the part of the ink layer for mounting the photosensitive chip is higher than the thickness of the other parts of the ink layer.

11. The photosensitive component according to claim 10, wherein, the thickness of the ink layer is 30 - 100 microns.

12. The photosensitive component according to claim 11, wherein, the thickness of the adhesive is 10 - 100 microns.

13. The photosensitive component according to claim 1, wherein, the ink layer is less deformable than the adhesive.

14. The photosensitive component according to claim 1, wherein, the adhesive has insulation properties.

15. An imaging module, characterized in that, it includes: a photosensitive component as described in any one of claims 1-14; and an optical lens held on the photosensitive path of the photosensitive component.

16. The imaging module according to claim 15, wherein, the curved shape of the lower surface of the photosensitive chip is adapted to the shape of the actual focal imaging surface of the imaging module.

17. A method for preparing a photosensitive component, characterized in that, it includes: forming a hollowed-out area on the photosensitive chip mounting area of the circuit board, wherein the hollowed-out area is located within the photosensitive chip mounting area, and the width of the hollowed-out area corresponding to the shorter side of the photosensitive chip mounting area is greater than the width of the hollowed-out area corresponding to the longer side of the photosensitive chip mounting area; applying an adhesive on the hollowed-out area and the photosensitive chip mounting area; and mounting the photosensitive chip on the photosensitive chip mounting area to bend the photosensitive chip downward through the adhesive; wherein, forming a hollowed-out area on the photosensitive chip mounting area of the circuit board includes: providing a circuit board body; forming an ink layer on the circuit board body; and etching the ink layer through an etching process to form the hollowed-out area on the photosensitive chip mounting area of the circuit board; wherein, the ink layer includes at least one air escape through-hole, and the at least one air escape through-hole extends outward from the hollowed-out area and protrudes from the photosensitive chip mounting area; the at least one air escape channel is formed on the side of the circuit board where no leads will be provided.

18. A method for preparing a photosensitive component, characterized in that, it includes: forming a hollowed-out area on the photosensitive chip mounting area of the circuit board, wherein the hollowed-out area is located within the photosensitive chip mounting area, and the width of the hollowed-out area corresponding to the shorter side of the photosensitive chip mounting area is greater than the width of the hollowed-out area corresponding to the longer side of the photosensitive chip mounting area; applying an adhesive on the hollowed-out area and the photosensitive chip mounting area; and mounting the photosensitive chip on the photosensitive chip mounting area to bend the photosensitive chip downward through the adhesive; wherein, forming a hollowed-out area on the photosensitive chip mounting area of the circuit board includes: providing a circuit board body; setting a shielding object at the position where the hollowed-out area is to be formed; forming an ink layer around the shielding object; and removing the shielding object to form the hollowed-out area at the position corresponding to the shielding object; wherein, the ink layer includes at least one air escape through-hole, and the at least one air escape through-hole extends outward from the hollowed-out area and protrudes from the photosensitive chip mounting area; the at least one air escape channel is formed on the side of the circuit board where no leads will be provided.

19. A method for preparing a photosensitive component, characterized in that, it includes: forming a hollowed-out area on the photosensitive chip mounting area of the circuit board, wherein the hollowed-out area is located within the photosensitive chip mounting area, and the width of the hollowed-out area corresponding to the shorter side of the photosensitive chip mounting area is greater than the width of the hollowed-out area corresponding to the longer side of the photosensitive chip mounting area; Apply an adhesive on the hollow area and the photosensitive chip mounting area; and Mount the photosensitive chip on the photosensitive chip mounting area so as to bend the photosensitive chip downward through the adhesive; Wherein, forming a hollow area on the photosensitive chip mounting area of the circuit board includes: Provide a circuit board body; and Form an ink layer with the hollow area on the circuit board body by means of inkjet printing; Wherein, the ink layer includes at least one air escape through hole, and the at least one air escape through hole extends outward from the hollow area and protrudes from the photosensitive chip mounting area; the at least one air escape channel is formed on a side of the circuit board where no leads will be provided.

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