Multi-section gold finger structure and manufacturing method thereof

Abstract

The present invention discloses a multi-section gold finger structure and a manufacturing method thereof. The multi-section gold finger structure comprises: a plate, an insulating outer layer formed on the plate, a circuit layer formed on the plate and comprising a plurality of metal traces arranged in a transverse direction, and a plurality of gold-plated films. Each metal trace comprises a main section, a front pad, and at least one isolated pad. One portion of the main section is embedded in the insulating outer layer, while another portion is exposed from the insulating outer layer and defines a rear pad. The plurality of gold-plated films are applied to the outer surface of the rear pad, the outer surface of the front pad, and the outer surface of at least one isolated pad of each metal trace.

Description

Technical Field

[0001] The present invention relates to a gold finger structure and a manufacturing method thereof, in particular to a multi-section gold finger structure and a manufacturing method thereof. Background Art

[0002] In recent years, with the continuous development of the technology industry, the requirements for gold finger structures have also increased. However, the development of existing gold finger structures has not kept pace with technological advancements and is gradually failing to meet market demand. Therefore, how to improve the structure and design to overcome the above-mentioned shortcomings and meet design requirements has become a key issue in this industry.

[0003] Therefore, the inventors believe that the above defects can be improved, and have conducted intensive research and applied scientific principles to finally propose the present invention which has a reasonable design and effectively improves the above defects. Summary of the Invention

[0004] The present invention provides a multi-section gold finger structure and a manufacturing method thereof, which can effectively improve the defects that may occur in the existing gold finger structure.

[0005] An embodiment of the present invention discloses a multi-section gold finger structure, comprising: a plate body; an insulating outer layer formed on the plate body; a circuit layer formed on the plate body and comprising a plurality of metal circuits arranged in a transverse direction, wherein each of the metal circuits comprises: a main section, one portion of which is buried in the insulating outer layer, and another portion of the main section is exposed from the insulating outer layer and defined as a rear pad; a front pad, spaced apart from the rear pad along a longitudinal direction, and the longitudinal direction is parallel to the transverse direction; and at least one isolated pad, spaced apart along the longitudinal direction between the rear pad and the front pad; and a plurality of gold-plated films, plated on the outer surface of the rear pad, the outer surface of the front pad, and the outer surface of at least one isolated pad of each metal circuit.

[0006] An embodiment of the present invention also discloses a method for manufacturing a multi-section gold finger structure, comprising: a preparatory step of providing a board, a circuit layer formed on the board, and an insulating outer layer partially covering the circuit layer; wherein the circuit layer comprises: a plurality of metal circuits, each comprising an inner circuit embedded in the insulating outer layer and a metal segment exposed from the insulating outer layer; and a plurality of sacrificial segments exposed from the insulating outer layer, wherein any two adjacent metal segments are connected by a sacrificial segment; a hole-forming step of forming a plurality of holes in each metal segment along a longitudinal direction, wherein the plurality of holes in any two adjacent metal segments are separated by the sacrificial segment located therebetween, such that each metal segment comprises a rear pad connected to the corresponding inner circuit, a front pad spaced apart from the rear pad, and at least one isolated pad spaced apart between the rear pad and the front pad; a dividing step in which a masking strip is formed on each of the sacrificial segments; a plating step in which a plurality of gold-plated films are plated on the outer surfaces of the rear pads, the outer surfaces of the front pads, and the outer surface of at least one of the isolated pads of the plurality of metal lines, respectively, and the plurality of gold-plated films are separated from each other; and a removing step in which the plurality of masking strips and the plurality of sacrificial segments are removed to form a multi-section gold finger structure.

[0007] The embodiment of the present invention further discloses a multi-section gold finger structure, which is manufactured using the above-mentioned manufacturing method of the multi-section gold finger structure.

[0008] In summary, the multi-section gold finger structure and the manufacturing method thereof disclosed in the embodiments of the present invention are different from the existing gold finger structure through special structural design and matching, and can effectively improve the defects of the existing gold finger structure.

[0009] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 A top view schematically illustrating a multi-section gold finger structure according to an embodiment of the present invention;

[0011] Figure 2 for Figure 1 Schematic diagram of the metal film is omitted;

[0012] Figure 3 for Figure 1 A schematic cross-sectional view along section line III-III;

[0013] Figure 4 for Figure 1 A schematic cross-sectional view along section line IV-IV;

[0014] Figure 5 for Figure 1 A schematic cross-sectional view along section line VV;

[0015] Figure 6 A schematic diagram of the preparatory steps of a method for manufacturing a multi-section gold finger according to an embodiment of the present invention;

[0016] Figure 7 Schematic diagram of the hole-making steps of the multi-section gold finger manufacturing method according to an embodiment of the present invention;

[0017] Figure 8 Schematic diagram of the steps of a method for manufacturing a multi-section gold finger according to an embodiment of the present invention;

[0018] Figure 9 Schematic diagram of the electroplating steps of the method for manufacturing a multi-section gold finger according to an embodiment of the present invention;

[0019] Figure 10 Schematic diagram of the removal steps of the multi-section gold finger manufacturing method according to an embodiment of the present invention.

[0020] Explanation of symbols

[0021] 100: Multi-section gold finger structure

[0022] 1: Board body

[0023] 11: Inner conductive layer

[0024] 1a: Free end

[0025] 2: Insulation outer layer

[0026] 3: Protective layer

[0027] 4: Circuit layer

[0028] 41: Metal lines

[0029] 41a: First metal line

[0030] 41b: Second metal line

[0031] 410: Metal segment

[0032] 411: Internal line

[0033] 412: Main body

[0034] 4121: rear pad

[0035] 413: Front pad

[0036] 414: Isolated pad

[0037] 415: Connection

[0038] 416: Conductive column

[0039] 42: Horizontal lines

[0040] 43: Sacrifice

[0041] 44: Opening

[0042] 5: Gold-plated film

[0043] 6: Masking bar

[0044] L: vertical direction

[0045] L1: first length distance

[0046] L2: Second length distance

[0047] W: horizontal direction

[0048] A1: First short side

[0049] A2: Second short side

[0050] B1: first longest side

[0051] B2: Second longest side

[0052] S110: Preliminary steps

[0053] S120: Hole opening steps

[0054] S130: Division step

[0055] S140: Electroplating step

[0056] S150: Removal Steps DETAILED DESCRIPTION

[0057] See also Figures 1 to 10 As shown, it is an embodiment of the present invention. It should be noted that the relevant quantities and appearances mentioned in the accompanying drawings of this embodiment are only used to specifically illustrate the implementation method of the present invention to facilitate understanding of the content of the present invention, and are not used to limit the scope of protection of the present invention.

[0058] This embodiment discloses a multi-section gold finger structure 100, which is a multi-section gold finger product with a small pitch. The multi-section gold finger structure 100 includes a board 1, an insulating outer layer 2 formed on the board 1, a circuit layer 4 formed on the board 1, and multiple gold-plated films 5 covering portions of the circuit layer 4.

[0059] See also Figures 1 to 3As shown, in this embodiment, the plate body 1 is, for example, a rectangle, and the plate body 1 includes an inner conductive layer 11 embedded therein. The edge of the plate body 1 includes two first short sides A1 facing each other and two first long sides B1 facing each other. For the convenience of explanation, the multi-section gold finger structure 100 is defined as a transverse direction W parallel to the two first short sides A1 and a longitudinal direction L parallel to the two first long sides B1. In actual application, the main function of the plate body 1 is to support the insulating outer layer 2, the circuit layer 4 and other components, so the shape, size, material and other related properties of the plate body 1 can be changed according to needs and are not limited in this embodiment.

[0060] In addition, the plate 1 is close to Figure 1 The lower end is defined as a free end 1a. In practical applications, the free end 1a of the plate 1 can be used to connect to a mating component, a slot, or other related components. It should be noted that the multi-section gold finger structure 100 disclosed in this embodiment can also be used in conjunction with related components, and relevant personnel can also adjust the related components of the multi-section gold finger structure 100 accordingly. In other words, the multi-section gold finger structure 100 of this embodiment does not limit its use with related components or structural adjustments.

[0061] like Figure 1 and Figure 2 As shown, the insulating outer layer 2 is formed on the plate 1. In this embodiment, the insulating outer layer 2 is, for example, rectangular, and includes two second short sides A2 facing each other and two second long sides B2 facing each other. In addition, the two second short sides A2 of the insulating outer layer 2 are parallel to the longitudinal direction L and the two second long sides B2 of the insulating outer layer 2 are parallel to the transverse direction W. In detail, in this embodiment, the insulating outer layer 2 is formed on the plate 1 and adjacent to Figure 1 Above.

[0062] However, the shape, size, quantity, material, location on the plate 1, and other related properties of the insulating outer layer 2 can be varied according to needs. For example, the insulating outer layer 2 can be made of a resin material such as polyimide, polyester, polyethylene glycol, polytetrafluoroethylene, epoxy resin, or aramid.

[0063] The circuit layer 4 is formed on the board 1. In this embodiment, the circuit layer 4 can be formed of a conductive material, such as copper or silver. However, the material of the circuit layer 4 can vary depending on the needs and is not limited to this embodiment. The circuit layer 4 includes a plurality of metal circuits 41 arranged along the transverse direction W. Specifically, the plurality of metal circuits 41 are generally parallel to the longitudinal direction L, and the distance between any two adjacent metal circuits 41 can vary depending on the needs.

[0064] In this embodiment, the circuit layer 4 may also include a transverse circuit 42. In the diagram of this embodiment, the transverse circuit 42 is generally parallel to the transverse direction W and embedded in the insulating outer layer 2. However, the transverse circuit 42 is not limited to being parallel to the transverse direction W, and the orientation of the transverse circuit 42 can vary depending on needs and is not limited to this embodiment. Furthermore, the transverse circuit 42 connects the plurality of metal circuits 41 arranged along the transverse direction W at intervals.

[0065] See also Figure 1 and Figure 2 As shown, each metal trace 41 includes a main section 412, a front pad 413, and at least one isolated pad 414. A portion of the main section 412 is embedded in the insulating outer layer 2 and connected to the transverse trace 42. Another portion of the main section 412 is exposed from the insulating outer layer 2 and defines a rear pad 4121. The rear pad 4121 and the front pad 413 are spaced apart from each other along the longitudinal direction L. At least one isolated pad 414 is spaced apart along the longitudinal direction L between the rear pad 4121 and the front pad 413.

[0066] In this embodiment, the rear pad 4121, the front pad 413, and the at least one isolated pad 414 are all roughly rectangular in shape and their shapes can be changed according to needs. For example, in other embodiments not shown in the present invention, the rear pad 4121, the front pad 413, and the at least one isolated pad 414 may be square or trapezoidal in shape. In more detail, in each of the metal lines 41, the distances between the rear pad 4121, the front pad 413, and the at least one isolated pad 414 are not limited to being equal. For example, the distance between the rear pad 4121 and the at least one isolated pad 414 may not be equal to the distance between the at least one isolated pad 414 and the front pad 413.

[0067] In this embodiment, the number of at least one isolated pad 414 included in the plurality of metal lines 41 is two, and the number of at least one isolated pad 414 included in some of the plurality of metal lines 41 is one (e.g., Figure 2 The number of the at least one isolated pad 414 included in the other part of the plurality of metal lines 41 is two (eg, the 1st and 3rd metal lines 41 from left to right). Figure 2 The second and fourth metal lines 41 from left to right in FIG.

[0068] However, the number of the at least one isolated pad 414 included in the plurality of metal lines 41 is not limited to one or two and can vary based on needs. For example, in other embodiments not shown in the present invention, the number of the at least one isolated pad 414 included in any one of the metal lines 41 can be one, two, or three. In other words, the number of the at least one isolated pad 414 included in the plurality of metal lines 41 is three.

[0069] Furthermore, the plurality of metal lines 41 may be defined as a first metal line 41a including one isolated pad 414 and a second metal line 41b including two isolated pads 414. The lengths of the rear pad 4121 and the front pad 413 of each first metal line 41a are respectively greater than the lengths of the rear pad 4121 and the front pad 413 of each second metal line 41b.

[0070] In this embodiment, the first metal traces 41a and the second metal traces 41b are staggered along the lateral direction W. It should be noted that the arrangement of the first metal traces 41a and the second metal traces 41b can vary based on needs. In other words, the number of second metal traces 41b located between any two adjacent first metal traces 41a is not limited to one, and the number of first metal traces 41a located between any two adjacent second metal traces 41b is not limited to one.

[0071] See also Figures 3 to 5 In this embodiment, each metal line 41 is defined with at least one connection portion 415, and the at least one connection portion 415 is located at the rear pad 4121 or the front pad 413. For example, a metal line 41 may have one connection portion 415, which is located at the rear pad 4121 or the front pad 413. Alternatively, a metal line 41 may have four connection portions 415 (e.g., Figure 2 (The third metal line 41 from left to right in the figure). Two of the four connecting portions 415 are located on the rear pad 4121, and the other two of the four connecting portions 415 are located on the front pad 413. However, the number and position of the connecting portions 415 can be varied according to needs and are not limited here.

[0072] Furthermore, in this embodiment, each metal circuit 41 includes a conductive post 416 embedded in the board 1 and connected to the connecting portion 415. In other words, each metal circuit 41 has at least one conductive post 416, and the conductive post 416 is connected to the rear pad 4121 or the front pad 413 via the connecting portion 415. In other words, the circuit layer 4 including multiple metal circuits 41 includes multiple conductive posts 416, but the present invention is not limited to this.

[0073] The conductive posts 416 are electrically coupled to the inner conductive layer 11 embedded within the board 1, enabling at least a portion of the plurality of rear pads 4121 and at least a portion of the plurality of front pads 413 in the circuit layer 4 to be electrically coupled to the inner conductive layer 11 via the corresponding conductive posts 416. In other words, each metal circuit 41 is electrically coupled to the inner conductive layer 11 within the board 1 through the conductive posts 416 connected to the connecting portion 415. It should be noted that, in this embodiment, the isolated pads 414 of each metal circuit 41 are not electrically coupled to the inner conductive layer 11, and the number of conductive posts 416 in this embodiment can be adjusted as needed, and the present invention is not limited thereto.

[0074] It should be noted that the multi-section gold finger structure 100 in this embodiment may also include a protective layer 3 formed on the board 1. This protective layer 3 is located adjacent to the free end 1a of the board 1 and covers the portion of the metal trace 41 connected to each front pad 413 to prevent damage to the metal trace 41 during use of the multi-section gold finger structure 100. Furthermore, the shape, material, and other related properties of the protective layer 3 are not limited to the same as those of the insulating outer layer 2 and can vary depending on requirements, so they will not be detailed here.

[0075] A plurality of gold-plated films 5 are respectively plated on the outer surfaces of the rear pads 4121, the outer surfaces of the front pads 413, and the outer surfaces of the isolated pads 414 of the plurality of metal traces 41. In this embodiment, the plurality of gold-plated films 5 are separated from each other, and the surface size of any one of the gold-plated films 5 can be equal to the outer surface of the rear pad 4121, the outer surface of the front pad 413, or the outer surface of the isolated pad 414 on which it is plated. Furthermore, the number of the plurality of gold-plated films 5 is equal to the total number of the rear pads 4121, the front pads 413, and the isolated pads 414. However, the size and number of the plurality of gold-plated films 5 can vary according to needs and are not limited to this embodiment.

[0076] See also Figures 6 to 10As shown, this embodiment also discloses a method for manufacturing a multi-section gold finger structure. The method includes a pre-processing step S110, a hole-forming step S120, a dividing step S130, a plating step S140, and a removal step S150. While the multi-section gold finger structure 100 of this embodiment can be manufactured using the aforementioned manufacturing method, the present invention is not limited thereto. Furthermore, the present invention is not limited to the content and order of the aforementioned steps when implementing the aforementioned method for manufacturing a multi-section gold finger structure.

[0077] The following will describe the steps of the method for manufacturing the multi-section gold finger structure of this embodiment. For the structure of each part of the multi-section gold finger structure or other related features, please refer to the relevant introduction of the first embodiment and will not be repeated here.

[0078] The preceding step S110 is as follows: Figure 6 As shown, a board 1 is provided, a circuit layer 4 formed on the board 1, and an insulating outer layer 2 partially covering the circuit layer 4. The circuit layer 4 includes multiple metal circuits 41 and multiple sacrificial segments 43. Each of the multiple metal circuits 41 includes an inner circuit 411 embedded in the insulating outer layer 2 and a metal segment 410 exposed from the insulating outer layer 2. The multiple sacrificial segments 43 are exposed from the insulating outer layer 2, and any two adjacent metal segments 410 are connected by a sacrificial segment 43.

[0079] In this embodiment, each of the sacrificial segments 43 is rectangular and can be changed according to needs. In addition, each of the sacrificial segments 43 has a first length L1 parallel to the longitudinal direction L, and each of the metal segments 410 has a second length L2 parallel to the longitudinal direction L. The second length L2 of each of the metal segments 410 is not less than the first length L1 of each of the sacrificial segments 43. In actual applications, the first length L1, the second length L2, the shape, number, and other related properties of the sacrificial segments 43 and the metal segments 410 can be changed according to actual needs and are not limited to this embodiment. For example, in other embodiments not shown in the present invention, the second length L2 of each of the metal segments 410 is equal to the first length L1 of each of the sacrificial segments 43, the number of the metal segments 410 is five, and the number of the sacrificial segments 43 is four.

[0080] The hole-making step S120 is as follows: Figure 7As shown, a plurality of openings 44 are formed in each metal segment 410 along a longitudinal direction L, and the plurality of openings 44 on any two adjacent metal segments 410 are separated by the sacrificial segment 3 located therebetween, so that each metal segment 410 includes a rear pad 4121 connected to the corresponding internal circuit 411, a front pad 413 spaced apart from the rear pad 4121, and at least one isolated pad 414 spaced apart between the rear pad 4121 and the front pad 413.

[0081] Furthermore, the number of the plurality of openings 44 formed on the plurality of metal segments 410 is at least two. In this embodiment, the number of the plurality of openings 44 formed on any one of the metal segments 410 is two or three. That is, when the number of the plurality of openings 44 formed on the metal segment 410 is two, the metal segment 410 includes one rear pad 4121, one front pad 413, and one isolated pad 414; when the number of the plurality of openings 44 formed on the metal segment 410 is three, the metal segment 410 includes one rear pad 4121, one front pad 413, and two isolated pads 414.

[0082] In this embodiment, the opening 44 is shaped like a rectangle, so that the rear pad 4121, the front pad 413, and at least one isolated pad 414 are all roughly rectangular. However, the shape of the opening 44 can be varied as needed and is not limited to this embodiment. Furthermore, the shape of any opening 44 is not limited to the shape of any other opening 44.

[0083] It should be noted that the number and type of the plurality of openings 44 can be varied based on demand. In other words, the number of openings 44 formed in each metal segment 410 can be adjusted based on design requirements, thereby varying the number of isolated pads 414 included in each metal segment 410. Furthermore, the dimensions of the openings 44 in the longitudinal direction L of each metal segment 410 can also be adjusted based on design requirements, thereby varying the dimensions of the rear pads 4121, the front pads 413, and the isolated pads 414, as well as the spacing therebetween.

[0084] The dividing step S130 is as follows: Figure 8 As shown, a shielding strip 6 is formed on each sacrificial segment 43. In this embodiment, the shielding strip 6 is generally rectangular in shape, and the shape of the shielding strip 6 can be varied as needed. In other words, the shape of the shielding strip 6 is not limited to a rectangle, and the shapes of the shielding strips 6 are not necessarily identical.

[0085] The electroplating step S140 is as follows: Figure 9 As shown, multiple gold-plated films 5 are respectively plated on the outer surfaces of the rear pads 4121 of the multiple metal lines 41, the outer surfaces of the front pads 413, and the outer surface of at least one isolated pad 414, and the multiple gold-plated films 5 are separated from each other.

[0086] The removal step S150 is as follows: Figure 10 As shown, a plurality of the masking strips 6 and a plurality of the sacrificial segments 43 are removed to form the multi-section gold finger structure 100 .

[0087] It should be noted that in the removal step S150 of this embodiment, the plurality of masking strips 6 are first removed, and then the plurality of sacrificial segments 43 are removed by etching. Furthermore, in this embodiment, the shape and number of the masking strips 6 correspond to the shape and number of the sacrificial segments 43 removed by etching. In other words, the shape and number of the masking strips 6 can be modified as needed to adjust the shape and number of the sacrificial segments 43 removed by etching.

[0088] [Technical Effects of the Embodiments of the Present Invention]

[0089] In summary, the multi-section gold finger structure and the manufacturing method thereof disclosed in the embodiments of the present invention provide an innovative gold finger structure and the manufacturing method thereof through special structural design and matching, and can overcome the defects of the existing gold finger structure.

[0090] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the protection scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the present invention.

Claims

1. A multi-section gold finger structure, characterized in that: include: plate body; an insulating outer layer formed on the plate body; The circuit layer is formed on the board and includes a plurality of metal circuits arranged in a transverse direction W, and each of the metal circuits includes: a main body segment, one portion of which is embedded in the insulating outer layer, and another portion of which is exposed from the insulating outer layer and defined as a rear pad; a front pad, spaced apart from the rear pad along a longitudinal direction, wherein the longitudinal direction is parallel to the transverse direction W; and at least one isolated pad disposed between the rear pad and the front pad at intervals along the longitudinal direction; as well as A plurality of gold-plated films are plated on the outer surface of the rear pad of each metal circuit, the outer surface of the front pad, and the outer surface of at least one isolated pad. The plurality of metal lines are divided into a plurality of first metal lines and a plurality of second metal lines staggered along the lateral direction W. Each of the first metal lines includes one isolated pad, and each of the second metal lines includes two isolated pads.

2. The multi-section gold finger structure according to claim 1, wherein: The multi-section gold finger structure further includes an inner conductive layer embedded in the board body, and at least a portion of the plurality of rear pads and at least a portion of the plurality of front pads in the circuit layer are electrically coupled to the inner conductive layer.

3. The multi-section gold finger structure according to claim 2, wherein: At least one of the isolated pads of each metal line is not electrically coupled to the inner conductive layer.

4. The multi-section gold finger structure according to claim 1, wherein: The number of the at least one isolated pad included in the plurality of metal lines is at least two.

5. The multi-section gold finger structure according to claim 1, wherein: The lengths of the rear pad and the front pad of each first metal circuit are respectively greater than the lengths of the rear pad and the front pad of each second metal circuit.

6. A method for manufacturing a multi-section gold finger structure, comprising: Preliminary step: providing a board, a circuit layer formed on the board, and an insulating outer layer covering a portion of the circuit layer; wherein the circuit layer includes: a plurality of metal circuits, each comprising an inner circuit buried in the insulating outer layer and a metal segment exposed from the insulating outer layer; and a plurality of sacrificial segments, exposed on the insulating outer layer, and any two adjacent metal segments are connected by one of the sacrificial segments; A hole-forming step: forming a plurality of holes in each metal segment along a longitudinal direction, wherein the plurality of holes in any two adjacent metal segments are separated by the sacrificial segment located therebetween, so that each metal segment includes a rear pad connected to the corresponding internal circuit, a front pad spaced apart from the rear pad, and at least one isolated pad spaced apart between the rear pad and the front pad; Dividing step: forming a shielding strip on each of the sacrificial segments; an electroplating step of plating a plurality of gold-plated films on the outer surfaces of the rear pads of the plurality of metal lines, the outer surfaces of the front pads, and the outer surface of at least one of the isolated pads, respectively, and the plurality of gold-plated films are separated from each other; and The removing step is to remove the plurality of shielding strips and the plurality of sacrificial segments to form a multi-section gold finger structure.

7. The method for manufacturing a multi-section gold finger structure according to claim 6, wherein: In the removing step, the plurality of shielding strips are first removed, and then the plurality of sacrificial segments are removed by etching.

8. The method for manufacturing a multi-section gold finger structure according to claim 6, wherein: In the hole-making step, the number of the plurality of holes formed on the plurality of metal segments is at least two.

9. A multi-section gold finger structure manufactured by implementing the manufacturing method of the multi-section gold finger structure according to claim 6.

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