Display device and method of manufacturing the same

Abstract

The display device includes a plurality of display modules each including a substrate and an inorganic light emitting diode mounted on a mounting surface of the substrate, a cover layer configured to cover the mounting surface of each display module, and an adhesive layer disposed between the cover layer and the mounting surface of each display module to adhere the cover layer to the mounting surface of each display module, wherein the adhesive layer includes a first region disposed on a gap formed between the plurality of display modules and a second region disposed on the mounting surface of each display module, and wherein the adhesive layer includes a photosensitive material such that the first region of the adhesive layer is configured to undergo a photosensitive reaction based on an external light source.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to a display apparatus capable of displaying an image by coupling modules to each other in which inorganic light emitting diodes that self-emit light are mounted on a substrate and a manufacturing method thereof. BACKGROUND

[0002] A display apparatus is an output device that visually displays a piece of data information such as text or graphics and an image.

[0003] A liquid crystal panel or an organic light emitting diode (OLED) panel formed by providing an OLED on a substrate is used as a conventional display apparatus. However, the liquid crystal panel has difficulties such as a slow response time and a large power consumption. Also, the liquid crystal panel itself does not emit light and thus needs a backlight. Therefore, the liquid crystal panel has a difficulty in a compact design. In addition, the OLED panel has a short lifespan and a poor production yield. In particular, since the OLED panel is self-emissive and it does not need a backlight, it is possible to thin the thickness of the OLED. However, the OLED panel can have a difficulty such as screen burn-in (deterioration). The screen burn-in is a phenomenon in which when the same image is displayed for a long time, even if the image is changed, a certain portion of the previous image remains due to the degradation of sub-pixels.

[0004] Therefore, as a new panel that replaces the OLED panel, a micro light emitting diode (micro LED or μLED) display panel in which inorganic light emitting diodes are mounted on a substrate and the inorganic light emitting diodes themselves are used as pixels is being researched.

[0005] The micro LED display panel can be a flat panel display panel composed of a plurality of inorganic light emitting diodes (inorganic LEDs) of 100 micrometers or less.

[0006] Since the micro LED display panel does not need a backlight and can have a minimized bezel, a compact and thin design can be achieved and has excellent brightness, resolution, power consumption, and durability.

[0007] The micro LED display panel provides better contrast, response time, and energy efficiency compared to a liquid crystal display (LCD) panel that needs a backlight. Both an organic light emitting diode (OLED) and a micro LED corresponding to an inorganic light emitting diode have good energy efficiency, but the micro LED has better brightness, light emission efficiency, and a longer lifespan than the OLED.

[0008] Further, since there is no complicated process other than the process of picking up inorganic light emitting diodes from a wafer and transferring the inorganic light emitting diodes to a substrate, a micro LED display panel can be manufactured in various resolutions and sizes according to a customer's order, and it is easy to implement a large screen by assembling unit panel modules. However, when assembling unit panels, a gap can inevitably occur in a seam between the panels, which can cause degradation of image quality. SUMMARY

[0009] Accordingly, an aspect of embodiments of the disclosure is to provide a display apparatus and a manufacturing method thereof capable of minimizing degradation of image quality caused by a gap between a plurality of display modules when a large-sized screen is implemented by assembling the plurality of display modules adjacent to each other.

[0010] Other aspects of embodiments of the disclosure will be set forth in part in the description which follows, and in part will be obvious from the description, or can be learned by practice of the disclosure.

[0011] According to one or more embodiments, a display apparatus is provided. The display apparatus can include a plurality of display modules, a cover layer, and an adhesive layer, wherein each of the plurality of display modules includes a substrate and a plurality of inorganic light emitting diodes mounted on a mounting surface of the substrate; the cover layer is configured to cover the mounting surface of each of the plurality of display modules; and the adhesive layer is disposed between the cover layer and the mounting surface of each of the plurality of display modules to adhere the cover layer to the mounting surface of each of the plurality of display modules. The adhesive layer can include a first area disposed on a gap formed between the plurality of display modules and a second area disposed on the mounting surface of each of the plurality of display modules, and the adhesive layer can include a photosensitive material such that the first area of the adhesive layer is configured to undergo a photosensitive reaction based on light emitted from an external light source.

[0012] The first area can be configured to be colored into a darker color than the second area by the photosensitive reaction.

[0013] The first area can be configured to produce a change in a physical property by the photosensitive reaction such that the first area becomes a light-absorbing area.

[0014] Each of the plurality of display modules can further include a black matrix disposed between the plurality of inorganic light emitting diodes of the display module.

[0015] Each of the plurality of display modules can further include an anisotropic conductive layer configured to electrically connect a contact electrode of the plurality of inorganic light emitting diodes of the display module to a pad electrode of the substrate of the display module.

[0016] The black matrix can be formed on the anisotropic conductive layer.

[0017] A black matrix can be patterned on an anisotropic conductive layer.

[0018] Black matrices can be formed on the overlay layer.

[0019] A black matrix can be formed on the second region.

[0020] The first region and the black matrix can be formed from different materials.

[0021] The adhesive layer can be formed from either optically clear adhesive (OCA) or optically clear resin (OCR).

[0022] The substrate of each of the multiple display modules may include a glass substrate and a thin-film transistor (TFT) layer formed on the glass substrate to drive multiple inorganic light-emitting diodes.

[0023] Each of the multiple display modules has a substrate that includes a light-absorbing layer formed entirely on one side of the substrate’s mounting surface to improve contrast by absorbing external light.

[0024] The adhesive layer may include a first layer and a second layer, the first layer being in contact with the mounting surface of each of the plurality of display modules and including a photosensitive material, and the second layer being disposed on the first layer and not including a photosensitive material.

[0025] The substrate of each of the plurality of display modules may include a barrier layer disposed on the side of the plurality of display modules opposite to the mounting surface of each of the plurality of display modules.

[0026] According to one or more embodiments, a method for manufacturing a display device is provided. The manufacturing method may include: preparing a plurality of display modules, each of the plurality of display modules being formed by mounting a plurality of inorganic light-emitting diodes on a mounting surface of a respective substrate; arranging the plurality of display modules adjacent to each other; disposing a photosensitive transparent adhesive layer on the mounting surface of each of the plurality of display modules, and providing a cover layer on the photosensitive transparent adhesive layer to cover the mounting surface of each of the plurality of display modules; bonding the cover layer to the plurality of display modules through the photosensitive transparent adhesive layer; and irradiating external light emitted from a light source from one side of the plurality of display modules opposite to the mounting surface of each of the plurality of display modules toward a gap formed between the plurality of display modules.

[0027] Illuminating the gap with external light may include illuminating a first region of a photosensitive transparent adhesive layer disposed on the gap such that the first region is photosensitive by external light, while ignoring a second region disposed on the mounting surface of each of the plurality of display modules such that the second region is not photosensitive.

[0028] Applying a photosensitive transparent adhesive layer may include: bonding an optical adhesive to the mounting surface of each of a plurality of display modules, the optical adhesive being formed of either an optically transparent adhesive (OCA) or an optically transparent resin (OCR) and including a photosensitive material.

[0029] The manufacturing process may further include forming a black matrix between a plurality of inorganic light-emitting diodes on the mounting surface of each of the plurality of display modules.

[0030] According to one or more embodiments, a display device is provided. The display device may include: a plurality of display modules, each of the plurality of display modules including a substrate and a plurality of inorganic light-emitting diodes mounted on a mounting surface of the substrate; a cover layer configured to cover the mounting surface of each of the plurality of display modules; and a photosensitive transparent adhesive layer disposed between the cover layer and the mounting surface of the substrate of each of the plurality of display modules, such that the cover layer is adhered to the mounting surface of the substrate of each of the plurality of display modules, wherein the substrate of each of the plurality of display modules includes a black matrix between the plurality of inorganic light-emitting diodes disposed on the substrate, the photosensitive transparent adhesive layer includes a first region and a second region, the first region being disposed in a gap formed between the plurality of display modules and configured to undergo a photosensitive response based on light emitted from an external light source, and the second region being disposed on the mounting surface of each of the plurality of display modules. Attached Figure Description

[0031] These and / or other aspects of this disclosure will become apparent and more readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:

[0032] Figure 1A This is a view illustrating a display device according to an embodiment of the present disclosure;

[0033] Figure 1B yes Figure 1A A magnified view of a portion of the display device;

[0034] Figure 2 yes Figure 1A An exploded view of the main components of a display device;

[0035] Figure 3 yes Figure 1A Cross-sectional views of some components of the display device;

[0036] Figure 4 yes Figure 3 Enlarged cross-sectional views of some components of the display device;

[0037] Figure 5 This is a view showing the state of a typical combination of multiple display modules;

[0038] Figure 6 It shows that Figure 1A A view of the state of a display device before its multiple display modules and encapsulation layers are connected;

[0039] Figure 7 It shows that Figure 6 A view of the state of a display device after multiple display modules and encapsulation layers are connected;

[0040] Figure 8 It is shown in Figure 6 A view of the state in which a light-absorbing area is formed in a display device;

[0041] Figure 9 This is a view showing the state in which a light-absorbing region is formed in a display device according to another embodiment of the present disclosure;

[0042] Figure 10 This is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure;

[0043] Figure 11 This is a cross-sectional view of some components of a display device according to another embodiment of the present disclosure;

[0044] Figure 12A This is an exploded view of the main components of a display device according to yet another embodiment of the present disclosure;

[0045] Figure 12B yes Figure 12A A magnified view of a portion of the main components;

[0046] Figure 13 This is a cross-sectional view of some components of a display device according to another embodiment of the present disclosure;

[0047] Figure 14 This is a cross-sectional view of some components of a display device according to another embodiment of the present disclosure;

[0048] Figure 15 This is a cross-sectional view of some components of a display device according to another embodiment of the present disclosure; and

[0049] Figure 16 This is a cross-sectional view of some components of a display device according to another embodiment of the present disclosure. Detailed Implementation

[0050] The exemplary embodiments described in this disclosure and the configurations shown in the accompanying drawings are merely examples of embodiments of this disclosure, and may be modified in various ways to replace the exemplary embodiments and drawings of this disclosure when this application is filed.

[0051] The singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. For clarity, the shape and size of elements may be emphasized in the accompanying drawings.

[0052] In this disclosure, the terms "comprising," "having," etc., are used to enumerate features, numbers, steps, operations, elements, components, or combinations thereof, but do not exclude the presence or addition of one or more features, numbers, steps, operations, elements, components, or combinations thereof.

[0053] Embodiments of this disclosure will be described more fully below with reference to the accompanying drawings.

[0054] Figure 1A This is a view illustrating a display device according to an embodiment of the present disclosure. Figure 1B yes Figure 1A A magnified view of part A of the display device. Figure 2 This is an exploded view of the main components of the display device shown in Figure 1. Figure 3 yes Figure 1A Cross-sectional diagrams of some components of the display device. Figure 4 yes Figure 3 Enlarged cross-sectional views of some components of the display device, and Figure 5 This is a view showing the state of a typical combination of multiple display modules.

[0055] Some components of the display device 1 shown in the accompanying drawings, as well as the plurality of inorganic light-emitting diodes 50, are micro-unit components with dimensions ranging from a few micrometers to several hundred micrometers, and therefore some components (the plurality of inorganic light-emitting diodes 50, the black matrix 80, etc.) are exaggerated for ease of description.

[0056] Display device 1 is a device configured to display information, materials, data, etc., having characteristics such as characters, illustrations, graphics, and images, and TVs, personal computers (PCs), mobile phones, and digital signage can be implemented using display device 1.

[0057] According to embodiments of the present disclosure, the display device 1 may include a display panel 20 on which an image is displayed, a frame 21 configured to support the display panel 20, and a rear cover 10 configured to cover the rear surface of the frame 21.

[0058] The display panel 20 may include a plurality of display modules 30A-30P and an encapsulation layer 100, which is formed on the plurality of display modules 30A-30P to cover a plurality of inorganic light-emitting diodes 50 and each mounting surface 41 of the display modules 30A-30P (see [link]). Figure 4 ).

[0059] The rear cover 10 can support the display panel 20. The display device 1 can be mounted on the floor by a bracket (not shown) or on a wall by a hook (not shown). The display device 1 may include a power supply device (not shown) configured to supply power to a plurality of display modules 30A-30P and a control board 25 configured to control the operation of the plurality of display modules 30A-30P.

[0060] Multiple display modules 30A-30P can be arranged vertically and horizontally adjacent to each other. The multiple display modules 30A-30P can be arranged in an M*N matrix. In this embodiment, multiple display modules 30A-30P are provided and arranged in a 4*4 matrix, but the number and arrangement of the multiple display modules 30A-30P are not limited thereto.

[0061] Multiple display modules 30A-30P can be mounted in the frame 21. The multiple display modules 30A-30P can be mounted on the frame 21 by various known methods, such as using magnetic force or mechanical assembly structures. A rear cover 10 can be attached to the rear of the frame 21, and the rear cover 10 can form the rear appearance of the display device 1.

[0062] As described above, the display device 1 according to the embodiments of the present disclosure can realize a large screen by splicing multiple display modules 30A-30P.

[0063] According to embodiments, each individual display module among the plurality of display modules 30A-30P can be applied to a display device. That is, the display modules, as individual units, can be mounted and applied to wearable devices, portable devices, handheld devices, and various electronic products and components requiring a display. Alternatively, according to embodiments of this disclosure, the display modules 30A-30P can be applied to display devices such as personal computer (PC) monitors, high-resolution TVs, signage, and electronic displays by means of multiple assemblies and arranged in a matrix. The plurality of display modules 30A-30P may have the same configuration. Therefore, the description of any of the display modules described below can be equally applied to all other display modules. Display module 30A includes a substrate 40 and a plurality of inorganic light-emitting diodes 50 mounted on the substrate 40. The substrate 40 may include a base substrate 42 and a thin-film transistor (TFT) layer 43 formed on the base substrate 42 to drive the inorganic light-emitting diodes 50. The base substrate 42 may include a glass substrate. That is, the substrate 40 may include a chip-on-glass (COG) type substrate. The first pad electrode 44a and the second pad electrode 44b, which are electrically connected to the inorganic light-emitting diode 50, can be formed on the substrate 40.

[0064] The thin-film transistor (TFT) forming the TFT layer 43 is not limited to a specific structure or type and can be configured in various embodiments. That is, the TFT of the TFT layer 43 according to embodiments of the present disclosure can be implemented as a low-temperature polycrystalline silicon (LTPS) TFT, an oxide TFT, a silicon TFT (polycrystalline silicon TFT or amorphous silicon (a-si) TFT), an organic TFT, or a graphene TFT.

[0065] Alternatively, when the base substrate 42 of the substrate 40 is provided using a silicon wafer, the TFT layer 43 can be replaced by a complementary metal-oxide-semiconductor (CMOS) type or an n-type metal-oxide-semiconductor field-effect transistor (MOSFET) or a p-type MOSFET.

[0066] Multiple inorganic light-emitting diodes 50 may comprise inorganic light-emitting diodes formed of inorganic materials and have dimensions ranging from several micrometers to several hundred micrometers in horizontal length, vertical length, and height. The size of a miniature inorganic light-emitting diode may be such that the length of the short side in the horizontal, vertical, and height is 100 μm or less. That is, each inorganic light-emitting diode 50 can be picked up from a wafer formed of silicon or sapphire material and directly transferred onto the substrate 40. Multiple inorganic light-emitting diodes 50 can be picked up and transferred using an electrostatic method with an electrostatic head or an adhesive method using an elastic polymer material such as PDMS or silicone resin as the head.

[0067] The plurality of inorganic light-emitting diodes 50 may be a light-emitting structure comprising an n-type semiconductor, an active layer, a p-type semiconductor, a first contact electrode 57a, and a second contact electrode 57b. The plurality of inorganic light-emitting diodes 50 may be in the form of a flip chip, wherein the first contact electrode 57a and the second contact electrode 57b are disposed in the same direction (opposite to the light-emitting direction).

[0068] In other words, each inorganic light-emitting diode 50 may include a light-emitting surface 54, a side surface 55, and a bottom surface 56. A first contact electrode 57a and a second contact electrode 57b may be formed on the bottom surface 56.

[0069] The first contact electrode 57a and the second contact electrode 57b can be electrically connected to the first pad electrode 44a and the second pad electrode 44b formed on the side of the mounting surface 41 of the substrate 40, respectively.

[0070] An anisotropic conductive layer 70 can be formed on the substrate 40 to mediate electrical bonding between the first and second contact electrodes 57a and 57b and the first and second pad electrodes 44a and 44b. The anisotropic conductive layer 70 can be formed by attaching anisotropic conductive adhesive to a protective film, and the anisotropic conductive layer 70 can have a structure in which conductive spheres 71 are dispersed in the adhesive resin. The conductive spheres 71 correspond to conductive spheres surrounded by a thin insulating film, and when the insulating film is damaged by pressure, the conductive spheres 71 can electrically connect the conductor to another conductor.

[0071] The anisotropic conductive layer 70 may include an anisotropic conductive film (ACF) in the form of a film and an anisotropic conductive paste (ACP) in the form of a paste.

[0072] Therefore, when pressure is applied to the anisotropic conductive layer 70 during the mounting of multiple inorganic light-emitting diodes 50 onto the substrate 40, the insulating film of the conductive ball 71 may rupture, and the first and second contact electrodes 57a and 57b of the inorganic light-emitting diodes 50 may be electrically connected to the first and second pad electrodes 44a and 44b of the substrate 40.

[0073] However, although not shown in the accompanying drawings, a plurality of inorganic light-emitting diodes 50 can be mounted on the substrate 40 using solder (not shown) instead of the anisotropic conductive layer 70. After one or more inorganic light-emitting diodes 50 are mounted on the substrate 40, one or more inorganic light-emitting diodes 50 can be bonded to the substrate 40 by a reflow process.

[0074] Multiple inorganic light-emitting diodes 50 may include red light-emitting diodes 51, green light-emitting diodes 52, and blue light-emitting diodes 53. The inorganic light-emitting diodes 50 can be mounted on the mounting surface 41 of the substrate 40, such that a series of red light-emitting diodes 51, green light-emitting diodes 52, and blue light-emitting diodes 53 function as a single unit. A series of red light-emitting diodes 51, green light-emitting diodes 52, and blue light-emitting diodes 53 can form a single pixel. In this case, each of the red light-emitting diodes 51, green light-emitting diodes 52, and blue light-emitting diodes 53 can form a sub-pixel.

[0075] According to embodiments of this disclosure, red LED 51, green LED 52, and blue LED 53 can be arranged in a row at predetermined intervals; or alternatively, red LED 51, green LED 52, and blue LED 53 can be arranged in various forms such as triangles.

[0076] The substrate 40 may include a light-absorbing layer 60 to absorb external light, thereby improving contrast. The light-absorbing layer 60 may be formed on one side of the substrate 40, covering the entire mounting surface 41. The light-absorbing layer 60 may be formed between the TFT layer 43 and the anisotropic conductive layer 70.

[0077] The encapsulation layer 100 may include a cover layer 110 configured to cover a plurality of display modules 30A-30P and an adhesive layer 120 configured to bond the plurality of display modules 30A-30P.

[0078] The encapsulation layer 100 can be formed from a single configuration to cover multiple display modules 30A-30P. The encapsulation layer 100 may include a single cover layer 110 and a single adhesive layer 120.

[0079] The capping layer 110 can be formed of glass. The capping layer 110 can be provided to physically protect multiple inorganic light-emitting diodes 50.

[0080] The adhesive layer 120 can be configured to contact the mounting surfaces 41 of the plurality of substrates 40 and the surface of the cover layer 110 facing the mounting surfaces 41. Therefore, light generated by the plurality of inorganic light-emitting diodes 50 can be emitted to the outside by passing through the adhesive layer 120 and the cover layer 110 in sequence.

[0081] The adhesive layer 120 can be an optically transparent adhesive (OCA) or an optically transparent resin (OCR). The optically transparent adhesive (OCA) and optically transparent resin (OCR) can be in a highly transparent state with a transmittance of 90% or higher.

[0082] Both optically clear adhesives (OCA) and optically clear resins (OCR) can improve visibility and image quality by increasing transmittance through low reflectivity. In other words, in structures with air gaps, light is lost due to the difference in refractive index between the film and the air layer. However, in structures using optically clear adhesives (OCA) or optically clear resins (OCR), the difference in refractive index between the film and the optical adhesive layer is reduced, and light loss is decreased, resulting in improved visibility and image quality.

[0083] In other words, optically clear adhesives (OCA) and optically clear resins (OCR) can improve image quality and simply bond adjacent layers together.

[0084] However, the difference between optically clear adhesives (OCA) and optically clear resins (OCR) is that optically clear adhesives (OCA) are added to the process in the form of a film, while optically clear resins (OCR) are added to the process in the form of a liquid.

[0085] According to embodiments of this disclosure, the adhesive layer 120 may be formed of an optically clear adhesive (OCA). Alternatively, the adhesive layer 120 may be formed of an optically clear adhesive (OCA) comprising a photosensitive material.

[0086] The photosensitive material contained in the adhesive layer 120 can be a polymeric material in which physical properties change in response to light having a specific wavelength. In particular, when the irradiated light has a wavelength outside the wavelength range of visible light, the photosensitive material contained in the adhesive layer 120 can be colored by changing its physical properties.

[0087] Light with wavelengths outside the visible light range, such as ultraviolet (UV), can have wavelengths greater than or less than the visible light range irradiated by the multiple inorganic light-emitting diodes 50. This is to prevent changes in the physical properties of the adhesive layer 120 caused by light irradiated by the multiple inorganic light-emitting diodes 50.

[0088] The photosensitive material forming the adhesive layer 120 can be colored to near-black or similar-black in response to light having wavelengths outside the visible light wavelength range. This will be described in detail later.

[0089] Reference Figure 3 , Figure 4 and Figure 5 The adhesive layer 120 may include a first region 121 and a second region 122. The first region 121 is disposed on the gap G formed between the plurality of display modules 30A-30P in the direction relative to the mounting surface 41, and the second region 122 is disposed on the mounting surface 41.

[0090] As described above, multiple display modules 30A-30P are spliced ​​together in display device 1. At this time, gaps G may be formed between the multiple display modules 30A-30P.

[0091] The adhesive layer 120 can be disposed on multiple display modules 30A-30P, therefore a portion of the adhesive layer 120 can be disposed on the gap G. As described above, in the adhesive layer 120, the area disposed on the gap G is the first area 121, and the area configured to allow the mounting surface 41 to contact the cover layer 110 is the second area 122. The first area 121 and the second area 122 can be distinguished based on the gap G.

[0092] The multiple display modules 30A-30P may also include a black matrix 80 formed between multiple inorganic light-emitting diodes 50.

[0093] The black matrix 80 can supplement the light-absorbing layer 60 that is fully formed on the side of the mounting surface 41 of the substrate 40. In other words, the black matrix 80 can absorb external light and make the substrate 40 appear black, thereby improving the screen's contrast.

[0094] Black Matrix 80 is appropriate in black.

[0095] According to one embodiment, the black matrix 80 can be formed between pixels formed by a series of red light-emitting diodes 51, green light-emitting diodes 52, and blue light-emitting diodes 53. However, according to some embodiments, the black matrix 80 can be formed more finely to divide each of the inorganic light-emitting diodes 50 (e.g., red light-emitting diodes 51, green light-emitting diodes 52, and blue light-emitting diodes 53) corresponding to sub-pixels.

[0096] The black matrix 80 can be formed into a grid shape with horizontal and vertical patterns so that they can be set between pixels.

[0097] The black matrix 80 can be formed by applying light-absorbing ink to the anisotropic conductive layer 70 by inkjet printing and curing the light-absorbing ink; or by coating the anisotropic conductive layer 70 with a light-absorbing film.

[0098] In other words, in the anisotropic conductive layer 70 that is completely formed on the mounting surface 41, a black matrix 80 can be formed in the space between multiple inorganic light-emitting diodes 50 where no multiple inorganic light-emitting diodes 50 are installed.

[0099] As described above, for display device 1, when multiple display modules 30A-30P are spliced ​​together, gaps G may be formed between the multiple display modules 30A-30P. In the comparative embodiment with gaps G, light can be diffusely reflected in the gaps G, and therefore non-uniformity may occur and image quality may degrade. Furthermore, in the comparative embodiment, due to the gaps G of the multiple display modules 30A-30P, the seams may be visible, which may lead to non-uniformity and image quality degradation.

[0100] As described above, the black matrix 80 can be disposed between the plurality of inorganic light-emitting diodes 50 constituting the pixels, but components configured to absorb external light may not be provided in the gap G, so non-uniformity may occur in the comparative embodiment and the image quality may be degraded.

[0101] According to conventional techniques for creating large screens through splicing, after forming display panels by creating encapsulation layers for each display module, multiple display panels are spliced ​​together to achieve a large screen, where the encapsulation layers are configured to protect multiple inorganic light-emitting diodes. Therefore, gaps are formed between adjacent encapsulation layers, leading to visible seams, non-uniformity, and image quality degradation due to these gaps. To mitigate the visibility of seams, non-uniformity, and image quality degradation, a side-light-absorbing layer is formed on the side surface of the encapsulation layers. However, this process is difficult and complex.

[0102] Therefore, traditionally, to alleviate this difficulty, multiple display modules are arranged adjacent to each other, and then a process of forming a black matrix and light-absorbing pattern is performed on the entire mounting surface of the multiple display modules, wherein the black matrix and light-absorbing pattern are arranged in the gaps to absorb light incident on the gaps. After this process, a single encapsulation layer is integrally formed on it.

[0103] Alternatively, a light absorption pattern can be patterned on an optically transparent adhesive layer or cover glass that forms the encapsulation layer, and multiple display modules can be spliced ​​together according to the light absorption pattern in order to perform a process of setting the light absorption pattern in the gaps between the multiple display modules.

[0104] However, the process of forming light absorption patterns in tiny gaps is also very difficult and complex, and therefore it is difficult to accurately arrange the light absorption patterns in the gaps, which may still lead to difficulties in manufacturing reliability.

[0105] Furthermore, patterning light absorption patterns on the optically transparent adhesive layer or cover glass can reduce the difficulty of forming the light absorption pattern, but this means that the light absorption pattern must be pre-formed on the encapsulation layer before splicing multiple display modules. Therefore, due to errors in the gaps generated when splicing multiple display modules, it may be difficult to place multiple display modules according to the light absorption pattern.

[0106] For example, such as Figure 5 As shown, multiple display modules can be arranged such that the spacing P between pixels Px mounted on each display module is equal in all directions.

[0107] At this time, during the process of forming the substrate of the display module, due to manufacturing errors, all substrates may not be formed to the same size, and some substrates S2 and S3 may have different sizes.

[0108] Therefore, when the spacing P between pixels Px is uniform, the sizes of the gaps G1, G2, and G3 formed between multiple display modules may be different.

[0109] Therefore, when light absorption patterns that can be set in the gaps are formed before splicing multiple display modules as described above, the light absorption patterns may not be set in all gaps.

[0110] In other words, if we assume that the gap formed when manufacturing substrate S1 according to the design value is G1, a gap G2 or G3 larger than the gap G1 may be formed, or a gap smaller than the gap G1 may be formed due to manufacturing errors of substrates S2 and S3.

[0111] At this point, a light absorption pattern with a width corresponding to the width of gap G1 can be formed based on the design values. Gap G2 and G3 may have a larger width than gap G1, and gaps G2 and G3 may be located outside the light absorption pattern. Therefore, seam recognition, inhomogeneity, and image quality degradation may occur in gaps G2 and G3.

[0112] Therefore, the display device 1 according to an embodiment of the present disclosure may include an adhesive layer 120 configured to absorb light irradiated onto each gap G, which may be formed during splicing of multiple display modules 30A-30P in order to prevent image quality degradation that may occur in the gap G.

[0113] Specifically, the first region 121 of the adhesive layer 120 disposed on the gap G can be configured to absorb external light, and thus the first region 121 can absorb the light illuminating the gap G. Therefore, it is possible to mitigate the seam recognition, non-uniformity, and image quality degradation in the gap G that may occur in the comparative example.

[0114] As described above, the adhesive layer 120 can be formed as a single sheet and bonded to multiple display modules 30A-30P. Therefore, referring to... Figure 3 The first region 121 of the adhesive layer 120 can be disposed on each gap G formed between the plurality of display modules 30A-30P.

[0115] The first region 121 can be formed of a black base material, which fully absorbs light to maximize the light absorption effect. It is appropriate for the first region 121 to be provided with a color corresponding to the black matrix 80.

[0116] As described above, the adhesive layer 120 can be formed of a transparent material, but the first region 121 can be configured to include a black material. Therefore, external light moving toward the gap G can be absorbed by the first region 121.

[0117] The adhesive layer 120 may include a photosensitive material that can be colored black. The first region 121 and the second region 122 may include the same material and have the same color. The first region 121 and the second region 122 may include the same photosensitive material.

[0118] However, during the manufacturing process of display device 1, only the first region 121 can be colored black due to irradiation by external light with a wavelength different from that of visible light (e.g., ultraviolet (UV) light). This will be described in detail later.

[0119] Regarding the adhesive layer 120 disposed across the entire mounting surface 41 and the gap G between the multiple display modules 30A-30P, a first region 121 disposed on the gap G absorbs external light. A second region 122 disposed on the mounting surface 41 is configured to transmit external light while simultaneously transmitting light irradiated from the multiple display modules 30A-30P. Therefore, without arranging additional components in the gap G, it is possible to mitigate non-uniformity and image quality degradation that may occur in the gap G.

[0120] In other words, a portion of the adhesive layer 120 forming the encapsulation layer 100 can be modified into a light-absorbing structure configured to absorb external light flowing into the gap G, thus eliminating the need for separate formation or arrangement of the light-absorbing structure. Therefore, the manufacturing efficiency of the display device 1 can be improved. Furthermore, the first region 121 can be disposed on each gap G, thereby improving the performance of the display device 1.

[0121] The process of changing the first region 121 to a state of absorbing external light will be described in detail below.

[0122] Figure 6 It shows that Figure 1A A view of the state of a display device before its multiple display modules and encapsulation layers are connected. Figure 7 It shows that Figure 6 A view of the state of a display device after multiple display modules and encapsulation layers are connected, and Figure 8 It is shown in Figure 6 A view of the state in which a light-absorbing area is formed in a display device.

[0123] like Figure 6 As shown, when multiple display modules 30A-30P are spliced ​​together, the cover layer 110 and the adhesive layer 120 can be disposed on the multiple display modules 30A-30P.

[0124] As described above, the adhesive layer 120 can be provided as a transparent adhesive film type including photosensitive material.

[0125] The adhesive layer 120 can bond the cover layer 110 to the mounting surface 41 of the multiple display modules 30A-30P. Before the adhesive layer 120 bonds the cover layer 110 to the multiple display modules 30A-30P, a black matrix 80 can first be formed on the anisotropic conductive layer 70.

[0126] refer to Figure 7The cover layer 110 and multiple display modules 30A-30P can be extruded at high temperature, and then the adhesive layer 120 can bond the cover layer 110 to the multiple display modules 30A-30P.

[0127] When the cover layer 110, the adhesive layer 120 and the multiple display modules 30A-30P overlap, the adhesive layer 120 can be divided into a first region 121 and a second region 122 through the gap G formed between the multiple display modules 30A-30P.

[0128] In this case, a first region 121 and a second region 122 with the same material and the same color can be provided. As described above, the first region 121 can be disposed in each gap G relative to the direction facing the mounting surface 41, and the second region 122 can be transparent and disposed on the mounting surface 41 of the plurality of display modules 30A-30P.

[0129] like Figure 8 As shown, external light L can shine on multiple display modules 30A-30P from a direction opposite to the direction facing the mounting surface 41.

[0130] The external light L can be light whose wavelength is outside the wavelength of visible light, such as ultraviolet (UV) light, and in particular, the external light L can be restricted to light whose wavelength is greater than or less than the wavelength of visible light irradiated from the plurality of inorganic light-emitting diodes 50.

[0131] When external light L shines on the multiple display modules 30A-30P from a direction opposite to the direction facing the mounting surface 41, the external light L can pass through the gap G and reach the first area 121.

[0132] Therefore, since the external light L only illuminates the first region 121, the photosensitive material contained in the first region 121 can undergo a change in physical properties, and thus only the first region 121 can be colored dark. In other words, it is appropriate for the first region 121 to be colored black.

[0133] The first region 121 of the adhesive layer 120 is a light-absorbing region formed by undergoing a photosensitive reaction based on external light L.

[0134] When the second region 122 is disposed on the mounting surface 41 of the plurality of display modules 30A-30P in the direction facing the mounting surface 41, and when external light L shines on the plurality of display modules 30A-30P from the direction opposite to the direction facing the mounting surface 41, the external light L may not reach the second region 122 due to the substrate 40 of the plurality of display modules 30A-30P.

[0135] Therefore, the photosensitive material contained in the second region 122 can retain its original transparent color without altering its physical properties due to external light L.

[0136] In other words, in the adhesive layer 120, the first region 121 disposed on the gap G can be changed to be configured as a region for absorbing light, and the second region 122 disposed on the mounting surface 41 of the plurality of display modules 30A-30P can be configured as a region for transmitting light.

[0137] The display device 1 according to an embodiment of the present disclosure may not include an additional light-absorbing component configured to absorb light irradiated onto the gap G, since the first region 121 configured to absorb light is formed as part of the adhesive layer 120.

[0138] Because the first region 121 can be easily modified into a region configured to absorb external light by irradiating the multiple display modules 30A-30P from the opposite direction to the direction facing the mounting surface 41, the process of installing or forming light-absorbing components can be reduced, thereby improving the assembly efficiency of the display device 1.

[0139] The display device 1 according to an embodiment of the present disclosure is configured such that an encapsulation layer 100 is formed on the entire display modules 30A-30P constituting the display panel 20, and therefore no gaps appear in the encapsulation layer 100. Therefore, when constructing a large screen by splicing, a seamless effect can be achieved more easily and efficiently.

[0140] Furthermore, by encapsulating multiple display modules 30A-30P as a whole, the effect of assembling them together can be achieved simply by encapsulating multiple display modules 30A-30P.

[0141] Furthermore, since the conventional process of forming a light-absorbing pattern configured to absorb light irradiated in the black matrix and gaps before forming the encapsulation layer 100 is eliminated, the efficiency of the process can be improved.

[0142] When setting the light absorption pattern and gap G in the comparative example, positional errors may occur between the light absorption pattern and the gap G, which may be caused by errors in the gap G. In contrast, embodiments of this disclosure can avoid such positional errors; and the first region 121 configured to absorb light can be provided to always be arranged above the gap G, thereby improving the reliability of the performance of the display device 1.

[0143] Furthermore, in the conventional method, a light absorption pattern, as in the comparative example, is patterned on the cover layer or adhesive layer. In this case, a height difference exists between the multiple inorganic light-emitting diodes and the light absorption pattern in the direction of the mounting surface, and some light beams emitted from the multiple inorganic light-emitting diodes are blocked by the light absorption pattern, which may lead to a decrease in the performance of the display device 1.

[0144] However, according to embodiments of this disclosure, a portion of the adhesive layer 120 itself can absorb light, and thus it is possible to minimize obstruction of light irradiated from the plurality of inorganic light-emitting diodes 50. Therefore, the performance of the display device 1 can be improved.

[0145] The first region 121′ and the second region 122′ of the adhesive layer 120 of the display device 1 according to another embodiment of the present disclosure will be described in detail below. The configuration of the first region 121′ and the second region 122′, except for the first region 121′ and the second region 122′ described below, is the same as that of the display device 1 according to the above-described embodiment of the present disclosure, and therefore further description thereof will be omitted.

[0146] Figure 9 This is a view showing the state in which a light-absorbing region is formed in a display device according to another embodiment of the present disclosure.

[0147] like Figure 9 As shown, the cross-section of the first region 121′ can be provided as a trapezoidal shape extending in the direction facing the mounting surface 41.

[0148] According to embodiments of the present disclosure, the first region 121' may be disposed only in the gap G, but is not limited thereto, and at least a portion of the first region 121' may be disposed outside the gap G relative to the direction facing the mounting surface 41.

[0149] The reason for arranging at least a portion of the first region 121′ outside the gap G is that during the process of forming the first region 121′, some light beams irradiating the substrate 40 from the opposite side of the mounting surface 41 may be transmitted outside the gap G.

[0150] That is, as shown in another embodiment of this disclosure, according to the process of forming the first region 121', a portion of the first region 121' may be disposed outside the gap G, or as shown in an embodiment of this disclosure (see reference). Figure 8 The first region 121 can be set only in the gap G.

[0151] Optionally, at least a portion of the second region may be set in the gap G.

[0152] The first region 121 described below according to other embodiments of the present disclosure will be described as an example of a first region 121 provided only in the gap G, but not limited thereto. A first region 121′ according to another embodiment may be applied to other embodiments of the present disclosure described later.

[0153] The following text will refer to Figures 1 to 12. Figure 8 A method for manufacturing a display device according to embodiments of the present disclosure is briefly described.

[0154] Figure 10 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure.

[0155] Prepare multiple display modules 30A-30P (210). The multiple display modules 30A-30P can be formed by mounting multiple inorganic light-emitting diodes 50 onto the mounting surface 41 of the substrate 40. To improve contrast, the substrate 40 may include a light-absorbing layer 60. The substrate 40 may include an anisotropic conductive layer 70 to facilitate the connection of the multiple inorganic light-emitting diodes 50 to the substrate 40.

[0156] A black matrix 80 can be formed on the anisotropic conductive layer 70 of multiple display modules 30A-30P.

[0157] Multiple display modules 30A-30P can be arranged adjacent to each other (220). In this case, the multiple display modules 30A-30P can be fixed by clamps. The multiple display modules 30A-30P can be arranged in an M*N matrix.

[0158] The adhesive layer 120 and the cover layer 110 can be disposed on multiple display modules 30A-30P in the direction facing the mounting surface 41 (230).

[0159] At this point, after the multiple display modules 30A-30P are arranged adjacent to each other, the adhesive layer 120 and the cover layer 110 can be disposed on the multiple display modules 30A-30P. Alternatively, after disposing of the cover layer 110 and the adhesive layer 120, the multiple display modules 30A-30P can be disposed on the adhesive layer 120, and then the multiple display modules 30A-30P can be arranged adjacent to each other.

[0160] Heat can be applied to each component (e.g., cover layer 110, adhesive layer 120, and multiple display modules 30A-30P), and each component (240) can be pressed in one direction or another. For example, after the cover layer 110 is fixed, the multiple display modules 30A-30P can be pressed in the direction in which the cover layer 110 is set. Alternatively, after the multiple display modules 30A-30P are fixed, the cover layer 110 can be pressed in the direction in which the multiple display modules 30A-30P are set.

[0161] Therefore, the adhesive layer 120 can be configured to bond the cover layer 110 to a plurality of display modules 30A-30P.

[0162] External light L (250) can be shone toward the multiple display modules 30A-30P from a direction opposite to the direction facing the mounting surface 41. The first region 121 of the adhesive layer 120 disposed within the gap G can undergo a change in physical properties through external light L, thereby changing the first region 121 into a light-absorbing region configured to absorb light.

[0163] The following describes the blocking film 111 and blocking film 112 of the display device 1' according to another embodiment of the present disclosure. The configuration of the blocking film 111 and blocking film 112, except for those described below, is the same as that of the display device 1 according to the embodiment of the present disclosure, and therefore further description thereof will be omitted.

[0164] Figure 11 This is a cross-sectional view of some components of a display device according to another embodiment of the present disclosure. Figure 12A This is an exploded view of the main components of a display device according to another embodiment of the present disclosure, and Figure 12B yes Figure 12A A magnified view of part B of the main component.

[0165] As described above, the adhesive layer 120 may include a photosensitive material that reacts with a light source having a wavelength greater than or less than the wavelength range of visible light irradiated from a plurality of inorganic light-emitting diodes 50, the inorganic light-emitting diodes 50 being ultraviolet (UV) light having wavelengths outside the wavelength range of visible light.

[0166] Therefore, in the adhesive layer 120, changes in its physical properties caused by light irradiation from the plurality of inorganic light-emitting diodes 50 may not occur, and the second region 122 can remain transparent. However, light emitted from the sun encompasses a wide range of wavelengths. For example, there is a difficulty where the photosensitive material contained in the second region 122 and the first region 121 may be colored when ultraviolet light from the sun passes through the cover layer 110 and reaches the adhesive layer 120.

[0167] To alleviate this difficulty, the cover layer 110 may also include a barrier film 111 and a barrier film 112 configured to prevent sunlight from reaching the second region 122.

[0168] The blocking films 111 and 112 can transmit light with wavelengths in the visible light range, and can restrict the transmission of light with wavelengths greater than or less than the visible light range.

[0169] Specifically, when light shines on the photosensitive material of the adhesive layer 120, the blocking film 111 and the blocking film 112 can transmit only light with wavelengths in which the physical properties of the photosensitive material remain unchanged, and the blocking film 111 and the blocking film 112 can block light with wavelengths in which the physical properties of the photosensitive material are changed.

[0170] like Figure 11 As shown, the barrier film 111 can be attached to the front surface of the cover layer 110.

[0171] Optionally or additionally, such as Figure 12B As shown, the barrier film 112 can be attached to the side surface of the cover layer 110.

[0172] Furthermore, in Figure 11 and Figure 12B The barrier films 111 and 112 shown can be attached to the cover layer 110.

[0173] The following describes a display device according to another embodiment of the present disclosure. Except for the encapsulation layer 100 and black matrices 80′ and 80″ described below, the configuration is the same as that of the display device 1 according to the above-described embodiment of the present disclosure, and therefore further description thereof will be omitted.

[0174] Figure 13 This is a cross-sectional view of some components of a display device according to another embodiment of the present disclosure, and Figure 14 This is a cross-sectional view of some components of a display device according to another embodiment of the present disclosure.

[0175] like Figure 13 As shown, the black matrix 80' can be formed on the adhesive layer 120'. That is, compared with the black matrix 80 formed on the anisotropic conductive layer 70 according to an embodiment of the present disclosure, the black matrix 80' according to another embodiment of the present disclosure can be formed on one surface of the adhesive layer 120'.

[0176] At this point, multiple display modules 30A-30P can be spliced ​​together based on the black matrix 80' formed on the adhesive layer 120'.

[0177] like Figure 14As shown, the black matrix 80″ can be formed on the capping layer 110″. That is, compared with the black matrix 80 formed on the anisotropic conductive layer 70 according to the embodiment of the present disclosure, the black matrix 80″ according to another embodiment of the present disclosure can be formed on one surface of the capping layer 110″.

[0178] At this point, multiple display modules 30A-30P can be spliced ​​together based on the black matrix 80" formed on the overlay layer 110″.

[0179] In addition to Figure 3 As shown, the black matrix 80 can be formed on the substrate 40 of the multiple display modules 30A-30P, as shown. Figure 13 and Figure 14 As shown, black matrices 80′ and 80″, corresponding to components different from the first region 121 configured to absorb light, can also be formed as additional components in the cover layer 110″ or the adhesive layer 120′.

[0180] However, the first region 121 configured to absorb light irradiated through the gap G can be provided as a region of the adhesive layers 120 and 120′, and can be formed as a component separate from the black matrices 80′ and 80″.

[0181] The following describes a display device according to another embodiment of the present disclosure. The configuration, except for the adhesive layer 150 described below, is the same as that of the display device 1 according to the embodiment of the present disclosure described above, and therefore its description will be omitted.

[0182] Figure 15 This is a cross-sectional view of some components of a display device according to another embodiment of the present disclosure.

[0183] Since the adhesive layer 150 fully fills the gaps that may be formed between the adhesive layer and the plurality of inorganic light-emitting diodes when the adhesive layer bonds the substrate and the cover glass, it can be configured to have a height greater than a predetermined height in the direction facing the mounting surface.

[0184] In particular, since the mounting surface may be uneven due to the multiple inorganic light-emitting diodes mounted on it, the adhesive layer may need to have a height greater than a predetermined height to fill the unevenness of the mounting surface formed by the multiple inorganic light-emitting diodes, and gaps that may occur between the multiple inorganic light-emitting diodes and the mounting surface will not exist.

[0185] In other words, in order to completely fill the mounting surface and cover the glass, and to ensure that there are no gaps between the mounting surface and the cover glass and no air bubbles caused by unevenness in the adhesive layer, the adhesive layer may need to have a predetermined height.

[0186] When assuming the total height of the adhesive layer 150 relative to the direction facing the mounting surface 41 is h, the first region may be formed to have a height that is the same as the height h of the adhesive layer 150.

[0187] As described above, the height h of the adhesive layer 150 is required to have a value equal to or greater than a specific height, while the height of the first region may be formed to have the same height h as the adhesive layer 150. Therefore, the height of the first region may be higher than the required height, and thus the first region may be located within the illumination radius of multiple inorganic light-emitting diodes, thereby reducing the efficiency of the display device.

[0188] To alleviate this difficulty, for a display device according to another embodiment of the present disclosure, the adhesive layer 150 may include a first layer 130 disposed adjacent to the mounting surface 41 and a second layer 140 disposed on the first layer 130.

[0189] The first layer 130 may include a photosensitive material. The second layer 140 may not include a photosensitive material. That is, both the first layer 130 and the second layer 140 are formed of a transparent optical adhesive material, but only the first layer 130 may include a photosensitive material.

[0190] The first layer 130 can be divided into a first region 131 disposed on the gap G in the direction facing the mounting surface 41 and a second region 132 disposed on the mounting surface 41.

[0191] When external light L shines on the multiple display modules 30A-30P from a direction opposite to the direction facing the mounting surface 41, the external light L can pass through the gap G and reach the first area 131.

[0192] Therefore, when external light L only illuminates the first region 131, the physical properties of the photosensitive material contained in the first region 131 can change, and thus only the first region 131 can be colored dark. That is to say, it is appropriate for the first region 131 to be colored black.

[0193] Because a portion of the second layer 140 is disposed in the gap G along the direction facing the mounting surface 41, external light L can illuminate the second layer 140. However, the second layer 140 may not include the photosensitive material as described above, and therefore no change in physical properties may occur in the second layer 140.

[0194] Therefore, the region configured to absorb light may be limited to the first region 131 of the first layer 130, and the second layer 140 may not include the region configured to absorb light.

[0195] The height of the first region 131 configured to absorb light can be less than the height h1 of the total height h of the adhesive layer 150.

[0196] When the adhesive layer 150 is formed from a single layer containing photosensitive material without any difference between the first layer 130 and the second layer 140, the height of the area configured to absorb light may be the same as the height h of the adhesive layer 150.

[0197] At this time, as described above, some light beams generated by the inorganic light-emitting diodes located near the light-absorbing area may be restricted by the light-absorbing area and thus cannot illuminate the outside of the display device.

[0198] However, since the height h1 of the first region 131 of the adhesive layer 150 according to the embodiments of the present disclosure is less than the height h of the entire adhesive layer 150, the limitation of illumination by the light generated by the inorganic light-emitting diode adjacent to the first region 131 can be minimized.

[0199] As described above, the first layer 130 and the second layer 140 can be used to form the adhesive layer 150, thereby improving the performance of the display device.

[0200] The following describes a display device according to another embodiment of the present disclosure. The configuration, except for the blocking layer 47 described below, is the same as that of the display device 1 according to the embodiment of the present disclosure described above, and therefore further description thereof will be omitted.

[0201] Figure 16 This is a cross-sectional view of some components of a display device according to another embodiment of the present disclosure.

[0202] The substrate 40 of the multiple display modules 30A-30P may include a barrier layer 47 disposed on opposite sides of the mounting surface 41.

[0203] The blocking layer 47 can be formed of a material that prevents external light L from passing through it.

[0204] As described above, the base substrate 42 can be provided as a glass material. Glass is a material with high light transmittance, and therefore some beams of light irradiated from the external light L can pass through the base substrate 42 and irradiate the adhesive layer 120.

[0205] At this time, because the adhesive layer 120 includes a photosensitive material in which the physical properties are changed by external light L, the first region 121 can be colored.

[0206] Appropriately, only the first region 121 is colored by the external light L irradiated through the gap G, and thus a barrier layer 47 can be provided to prevent the second region 122 from being colored by the external light L transmitted through the base substrate 42.

[0207] The barrier layer 47 can be positioned in the direction of external light L illumination. That is, the barrier layer 47 can be provided in the direction of external light L illumination to cover the base substrate 42.

[0208] The barrier layer 47 prevents external light L from shining through the base substrate 42 onto the second region 122. Therefore, only the first region 121 can be modified by external light L to be configured as a region that absorbs light.

[0209] As is evident from the above description, the display device of this disclosure can have a seamless effect in which the seams are invisible because light incident through the gap between adjacent display modules is absorbed by the light-absorbing area.

[0210] Because a portion of the adhesive layer forms a light-absorbing area after multiple display modules are assembled, display devices can achieve a seamless effect more easily and effectively.

[0211] Although several embodiments of the present disclosure have been shown and described, those skilled in the art will understand that changes can be made to these embodiments without departing from the principles and spirit of the present disclosure.

Claims

1. A display device, including: Multiple display modules, each of the multiple display modules including a substrate and multiple inorganic light-emitting diodes mounted on a mounting surface of the substrate; A cover layer configured to cover the mounting surface of each of the plurality of display modules; as well as An adhesive layer is disposed between the cover layer and the mounting surface of each of the plurality of display modules, such that the cover layer is bonded to the mounting surface of each of the plurality of display modules; The adhesive layer includes a first region and a second region, wherein the first region is disposed in the gap formed between the plurality of display modules, and the second region is disposed on the mounting surface of each of the plurality of display modules. The adhesive layer includes a photosensitive material, such that a first region of the adhesive layer is configured to undergo a photosensitive response based on light emitted from an external light source. The first region is configured to undergo a change in physical properties through the photosensitive reaction, thereby transforming the first region into a light-absorbing region.

2. The display device as claimed in claim 1, wherein, The first region is configured to be colored a darker color than the second region by the photosensitive reaction.

3. The display device as claimed in claim 1, wherein, Each of the plurality of display modules further includes: A black matrix is ​​disposed between the plurality of inorganic light-emitting diodes in the display module.

4. The display device as claimed in claim 3, wherein, Each of the plurality of display modules further includes: An anisotropic conductive layer is configured to electrically connect the contact electrodes of the plurality of inorganic light-emitting diodes of the display module to the pad electrodes of the substrate of the display module.

5. The display device as claimed in claim 4, wherein, The black matrix is ​​formed on the anisotropic conductive layer.

6. The display device as claimed in claim 5, wherein, The black matrix is ​​patterned on the anisotropic conductive layer.

7. The display device as claimed in claim 3, wherein, The black matrix is ​​formed on the overlay layer.

8. The display device as claimed in claim 3, wherein, The black matrix is ​​formed on the second region.

9. The display device as claimed in claim 3, wherein, The first region and the black matrix are formed of different materials.

10. The display device as claimed in claim 1, wherein, The adhesive layer is formed from either optically transparent adhesive (OCA) or optically transparent resin (OCR).

11. The display device as claimed in claim 1, wherein, The substrate of each of the plurality of display modules includes: Glass substrate; and A thin-film transistor (TFT) layer is formed on the glass substrate to drive the plurality of inorganic light-emitting diodes.

12. The display device as claimed in claim 11, wherein, The substrate of each of the plurality of display modules includes: A light-absorbing layer is formed entirely on the mounting surface side of the substrate, thereby improving contrast by absorbing external light.

13. The display device as claimed in claim 1, wherein, The adhesive layer includes a first layer and a second layer, the first layer being in contact with the mounting surface of each of the plurality of display modules and including the photosensitive material, and the second layer being disposed on the first layer and not including the photosensitive material.

14. The display device as claimed in claim 1, wherein, The substrate of each of the plurality of display modules includes: A barrier layer is disposed on one side of the plurality of display modules opposite to the mounting surface of each of the plurality of display modules.

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