Micro-pattern structure transfer method and micro-pattern structure substrate

Abstract

The application relates to a microstructure pattern transfer method, which comprises the following steps: providing a substrate assembly, wherein the substrate assembly comprises a donor substrate and a combination body which is peelably arranged on one side surface of the donor substrate, the combination body comprises a microstructure pattern, a first sacrificial layer and a second sacrificial layer which are sequentially stacked, and the microstructure pattern is located on the side of the combination body which faces the donor substrate; peeling the combination body from the donor substrate; attaching the side of the combination body with the microstructure pattern to the surface of a receptor substrate; and removing the first sacrificial layer and the second sacrificial layer so that the microstructure pattern is transferred to the surface of the receptor substrate. The transfer method of the application protects the microstructure pattern, reduces stress mismatch in the transfer process, reduces the peeling frequency, can realize high-quality and low-loss transfer of various microstructure patterns between different substrates, and has good versatility.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of transfer printing, in particular to a micro-pattern structure transfer printing method and a micro-pattern structure substrate. BACKGROUND

[0002] Transfer printing has great application potential and has become one of the most commonly used processing methods for flexible electronics manufacturing. The main process of transfer printing is: the flexible stamp is attached to the surface of a donor substrate, then the flexible stamp is peeled off from the surface of the donor substrate, when the bonding force between the flexible stamp and the micro-pattern structure is greater than the bonding force between the micro-pattern structure and the donor substrate, the micro-pattern structure is transferred from the surface of the donor substrate to the surface of the flexible stamp; then, the flexible stamp is attached to the surface of a receiver substrate, when the bonding force between the flexible stamp and the micro-pattern structure is less than the bonding force between the micro-pattern structure and the receiver substrate, the micro-pattern structure is transferred from the surface of the flexible stamp to the surface of the receiver substrate. In the transfer printing process, adsorption and desorption processes between multiple different interfaces are involved. At present, the transfer printing effect can be improved by controlling the separation speed, surface modification, and introducing a release layer, but these methods still have many defects such as stress mismatch leading to damage of the micro-pattern structure, multiple peeling, poor universality, etc. SUMMARY

[0003] In view of the above technical problems, the present application provides a micro-pattern structure transfer printing method, which can reduce stress mismatch in the transfer printing process, reduce the number of peeling, and realize high-quality and low-loss transfer printing between multiple substrates and different micro-pattern structures with good universality.

[0004] To solve the above technical problems, the present application provides a micro-pattern structure transfer printing method, comprising:

[0005] a. providing a substrate assembly, the substrate assembly comprising a donor substrate and a combination body peelably disposed on one side surface of the donor substrate, the combination body comprising a micro-pattern structure, a first sacrificial layer, and a second sacrificial layer stacked in sequence, the micro-pattern structure being located on the side of the combination body facing the donor substrate;

[0006] b. peeling the combination body from the donor substrate;

[0007] c. attaching the side of the combination body having the micro-pattern structure to the surface of a receiver substrate;

[0008] d. removing the first sacrificial layer and the second sacrificial layer to transfer the micro-pattern structure to the surface of the receiver substrate.

[0009] Optionally, step a comprises:

[0010] a1. forming a release layer on one side surface of the donor substrate;

[0011] a2. forming the micro-pattern structure and the first sacrificial layer on the release layer in sequence;

[0012] a3. attaching the second sacrificial layer to the surface of the first sacrificial layer, and treating the release layer to reduce the binding force between the donor substrate and the micro-pattern structure.

[0013] Optionally, the release layer is at least one of polymethyl methacrylate, chitosan, and metal film; and / or, the thickness of the release layer is 0.5 μm to 1 μm.

[0014] Optionally, step a2 comprises:

[0015] forming the first sacrificial layer by dropping or spin-coating on the surface of the micro-pattern structure.

[0016] Optionally, the release layer is polymethyl methacrylate, and step a3 comprises:

[0017] attaching the second sacrificial layer to the surface of the first sacrificial layer.

[0018] corrosion-removing the release layer by using acetone solution.

[0019] Optionally, the first sacrificial layer and the second sacrificial layer are soluble materials.

[0020] Optionally, step d comprises:

[0021] dissolving the first sacrificial layer and the second sacrificial layer and exposing the micro-pattern structure by using steam fumigation.

[0022] Optionally, the second sacrificial layer is a water-soluble adhesive tape; and / or, the first sacrificial layer is at least one of polyvinyl alcohol and polyacrylic acid, and the thickness of the first sacrificial layer is 100 μm to 300 μm.

[0023] Optionally, step b comprises:

[0024] mechanically peeling the combination of the second sacrificial layer, the first sacrificial layer, and the micro-pattern structure from the donor substrate.

[0025] Optionally, the first sacrificial layer is polyvinyl alcohol, and the polyvinyl alcohol is of low viscosity type, with alcoholysis degree of 87.0 to 89.0% and viscosity of 4.6 to 5.4.

[0026] The application also provides a substrate structure comprising a substrate and a micro-pattern structure, wherein the micro-pattern structure is transferred to at least one side surface of the substrate by the method as described above.

[0027] The microstructure pattern transfer method of the present application comprises: providing a substrate assembly, the substrate assembly comprising a donor substrate and a combination body peelably arranged on one side surface of the donor substrate, the combination body comprising a microstructure pattern, a first sacrificial layer and a second sacrificial layer stacked in sequence, the microstructure pattern being located on the side of the combination body facing the donor substrate; peeling the combination body from the donor substrate; attaching the side of the combination body with the microstructure pattern to the surface of a receptor substrate; removing the first sacrificial layer and the second sacrificial layer to transfer the microstructure pattern to the surface of the receptor substrate. The transfer method of the present application protects the microstructure pattern through the design of the first sacrificial layer and the second sacrificial layer, reduces stress mismatch in the transfer process, reduces the number of peeling, and can realize high-quality and low-loss transfer of various microstructure patterns between different substrates, with good versatility.

[0028] The microstructure pattern substrate of the present application has good pattern quality and low loss, as the microstructure pattern is transferred to at least one side surface of the substrate by the method described above. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 FIG. 1 is a flow diagram of a microstructure pattern transfer method according to an embodiment;

[0030] Figure 2 (a) to Figure 2 (f) are process diagrams of a microstructure pattern transfer method according to an embodiment. DETAILED DESCRIPTION

[0031] The embodiments of the present application are described below by specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the description.

[0032] In the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the present application. It is understood that other embodiments can be used and that mechanical, structural, electrical, and operational changes can be made without departing from the spirit and scope of the present application. The following detailed description is not to be considered limiting in any way. The terminology used here is for the purpose of describing particular embodiments only and is not intended to limit the present application.

[0033] Although the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0034] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including", as used herein, specify the presence of stated features, steps, operations, elements, components, items, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, items, and / or groups thereof. As used herein, the terms "or" and "and / or" are to be interpreted as inclusive, i.e., as meaning one or any combination of the items. Thus, "A, B or C" or "A, B and / or C" means any of the following: A; B; C; A and B; A and C; B and C; A, B and C. Exceptions to this definition apply only when the combination of elements, functions, steps or acts are mutually exclusive, i.e., are inherently mutually exclusive by their nature.

[0035] Figure 1 is a flowchart of a micro-pattern structure transfer method according to an embodiment. As shown in Figure 1 , the micro-pattern structure transfer method of the present embodiment comprises the following steps:

[0036] In step 110, a substrate assembly is provided, which comprises a donor substrate and a combination body peelably disposed on one side surface of the donor substrate, the combination body comprising a micro-pattern structure, a first sacrificial layer and a second sacrificial layer which are sequentially stacked, the micro-pattern structure being located on the side of the combination body facing the donor substrate.

[0037] Optionally, the step of providing the substrate assembly can specifically comprise:

[0038] forming a release layer on one side surface of the donor substrate;

[0039] sequentially forming the micro-pattern structure and the first sacrificial layer on the release layer;

[0040] attaching the second sacrificial layer to the surface of the first sacrificial layer, and treating the release layer to reduce the bonding force between the donor substrate and the micro-pattern structure.

[0041] Optionally, as shown in Figure 2 (a), a release layer 22 and a micro-pattern structure 23 are sequentially formed on one side surface of a donor substrate 21, the micro-pattern structure 23 comprising a flexible substrate 231 and a micro-pattern circuit 232, the micro-pattern circuit 232 being disposed on the side of the flexible substrate 231 facing away from the release layer 22. Then, as shown in Figure 2 (b), a first sacrificial layer 24 is formed on the surface of the micro-pattern circuit 232.

[0042] The donor substrate 21 is preferably a general rigid substrate, including a silicon wafer, a glass sheet, etc., for providing certain mechanical support. The flexible substrate 231 is a commonly used high-flexibility elastic polymer, including polyimide (PI), polyethylene terephthalate (PET), polydimethylsiloxane (PDMS), etc. The micro-pattern structure 23 is a pattern structure to be transferred, and the micro-pattern circuit 232, such as an electrode pattern, a circuit pattern containing microelectronic devices, etc., can be formed on the flexible substrate 231 by photolithography or electroblotting technology. The flexible substrate 231 and the micro-pattern circuit 232 are stacked in sequence, and the number of layers of the flexible substrate 231 and the micro-pattern circuit 232 is not limited. The bottom layer of the stacked structure of the flexible substrate 231 and the micro-pattern circuit 232 is the flexible substrate, for example, one layer of the flexible substrate 231 and one layer of the micro-pattern circuit 232 can be stacked in sequence on the donor substrate 21, or a first layer of the flexible substrate 231, a first layer of the micro-pattern circuit 232, a second layer of the flexible substrate 231, and a second layer of the micro-pattern circuit 232 can be stacked in sequence on the donor substrate 21. In actual implementation, the micro-pattern structure 23 can also contain other structures such as an intermediate layer, etc. The release layer 22 is a material with weak adhesion, including but not limited to at least one of polymethylmethacrylate (PMMA), chitosan, and a metal film. The thickness of the release layer 22 is 0.5 μm to 1 μm.

[0043] The first sacrificial layer 24 can be formed by drop coating. Drop coating of the first sacrificial layer 24 does not require uniformity, and only needs to cover the micro-pattern structure 23 so that it does not contact the subsequently used second sacrificial layer 25, making the first sacrificial layer 24 simple and easy to manufacture. After drop coating, the film is dried in an oven to form a film with certain stretchability, which can reduce stress mismatch in the transfer process and prevent loss and wrinkling of the micro-pattern circuit 232. In actual implementation, the first sacrificial layer 24 can also be formed by spin coating, so that the uniformity and film thickness of the first sacrificial layer 24 can be adjusted by controlling the spin coating speed and film forming temperature. The first sacrificial layer 24 is a soluble film, and the first sacrificial layer 24 is optionally at least one of polyvinyl alcohol (PVA) and polyacrylic acid (PAA). The thickness of the first sacrificial layer 24 is 100 μm to 300 μm. Preferably, the first sacrificial layer 24 is polyvinyl alcohol, which is a low-viscosity type with an alcoholysis degree of 87.0 to 89.0% and a viscosity of 4.6 to 5.4.

[0044] Please refer to Figure 2 (b) and Figure 2(c), the release layer 22 can be removed before the second sacrificial layer 25 is attached to the surface of the first sacrificial layer 24, or the release layer 22 can be removed after the second sacrificial layer 25 is attached to the surface of the first sacrificial layer 24, so that the micro-pattern structure 23, the first sacrificial layer 24 and the second sacrificial layer 25 can be peeled off from the donor substrate 21 as a combination. The release layer 22 can be partially removed or completely removed. When the release layer 22 is removed before the second sacrificial layer 25 is attached to the surface of the first sacrificial layer 24, only the release layer 22 needs to be partially etched and removed to ensure that the micro-pattern structure 23 does not completely separate from the donor substrate 21, and the transfer is ensured to be normal; when the release layer 22 is removed after the second sacrificial layer 25 is attached to the surface of the first sacrificial layer 24, the release layer 22 can be completely etched and removed to better peel off.

[0045] After the release layer 22 is etched and removed, the adsorption force between the flexible substrate 231 and the donor substrate 21 can be reduced, that is, the bonding force between the donor substrate 21 and the micro-pattern structure 23 is reduced, which is helpful for subsequent mechanical peeling. Alternatively, when the release layer 22 is PMMA, the release layer 22 can be etched and removed by using an acetone solution. For example, the device is soaked in the acetone solution for 5-10 min, and the PMMA is dissolved by the acetone.

[0046] Alternatively, the soluble second sacrificial layer 25 is a soluble film, preferably a water-soluble film, for example, a commonly used water-soluble adhesive tape, which can lose adhesion after encountering water.

[0047] Step 120, peeling off the combination from the donor substrate.

[0048] Please refer to Figure 2 (d), the second sacrificial layer 25, the first sacrificial layer 24 and the micro-pattern structure 23 are mechanically peeled off from the donor substrate 21 as a combination, so that the first sacrificial layer 24 and the micro-pattern structure 23 are transferred to the surface of the second sacrificial layer 25. Since the first sacrificial layer 24 with good tensile property is arranged between the micro-pattern structure 23 and the second sacrificial layer 25, and the release layer 22 has been completely etched and removed or partially etched and removed, the combination is easy to peel off and the stress mismatch can be reduced during the peeling, so that the micro-pattern circuit 232 is prevented from being lost or wrinkled.

[0049] Step 130, attaching the side of the combination with the micro-pattern structure to the surface of the acceptor substrate.

[0050] The combination of the second sacrificial layer 25, the first sacrificial layer 24, and the micropattern structure 23 is attached to the acceptor substrate 26 by non-covalent forces such as electrostatic forces, capillary forces, and van der Waals forces between the micropattern structure 23 and the acceptor substrate 26. The acceptor substrate 26 can be a rigid substrate or a flexible substrate, depending on the deformation characteristics of the product. Preferably, the acceptor substrate 26 is a flexible substrate, such as polydimethylsiloxane (PDMS).

[0051] Step 140: Remove the first sacrificial layer and the second sacrificial layer to transfer the micro-pattern structure onto the surface of the host substrate.

[0052] Optionally, such as Figure 2 As shown in (e), the structure obtained in steam fumigation step 130 is used to dissolve the second sacrificial layer 25 and the first sacrificial layer 24, exposing the micro-pattern structure 23, resulting in the structure shown in (e). Figure 2 (f) shows a micro-patterned structure substrate, which includes a host substrate 26, a flexible substrate 231 and a micro-patterned circuit 232 arranged sequentially.

[0053] When the second sacrificial layer 25 and the first sacrificial layer 24 are water-soluble materials, the structure obtained in step 130 is placed upside down in a petri dish. Another petri dish containing deionized water is placed below the first sacrificial layer 25. Water vapor is generated by heating. The water vapor first acts on the second sacrificial layer 25. After the second sacrificial layer 25 loses its stickiness, it falls off or is gradually dissolved by the water vapor, exposing the first sacrificial layer 24. Subsequently, the first sacrificial layer 24 dissolves, exposing the micro-pattern structure 23. By using the water vapor fumigation method, the dissolution rate of the first sacrificial layer 24 can be effectively controlled, avoiding rapid dissolution of the first sacrificial layer 24 that could cause the micro-pattern structure 23 to fall off and be damaged, thus improving the transfer success rate.

[0054] This embodiment addresses the drawback of traditional transfer methods, where significant stress mismatch leads to wrinkling and deformation of micro-patterns (especially metallic patterns). It introduces a first sacrificial layer as a protective layer, reducing the stress mismatch between the second sacrificial layer and the micro-pattern structure, thus minimizing damage to the micro-pattern during the transfer process. Furthermore, to address the complexity and poor versatility of traditional transfer methods, a double-sacrificial-layer approach simplifies the peeling process across multiple interfaces into a dissolution process of the soluble first and second sacrificial layers, thereby expanding the versatility and repeatability of the transfer process. Simultaneously, this transfer method eliminates the need for surface processing and chemical treatment, reducing the number of peeling steps, simplifying the process, and ensuring the quality and performance of the transferred pattern.

[0055] The microstructure pattern transfer method of the present application comprises: providing a substrate assembly, the substrate assembly comprising a donor substrate and a combination body peelably arranged on one side surface of the donor substrate, the combination body comprising a microstructure pattern, a first sacrificial layer and a second sacrificial layer which are sequentially stacked, and the microstructure pattern is located on the side of the combination body facing the donor substrate; peeling the combination body from the donor substrate; attaching the side of the combination body with the microstructure pattern to the surface of a receptor substrate; removing the first sacrificial layer and the second sacrificial layer to transfer the microstructure pattern to the surface of the receptor substrate. The transfer method of the present application protects the microstructure pattern through the design of the first sacrificial layer and the second sacrificial layer, reduces the stress mismatch in the transfer process, reduces the peeling frequency, and can realize high-quality and low-loss transfer of various substrates and different microstructure patterns, and has good versatility.

[0056] The present application also provides a microstructure pattern substrate comprising a substrate and a microstructure pattern, wherein the microstructure pattern is transferred to at least one side surface of the substrate by the method described above, and has good pattern quality and low loss.

[0057] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought of the present application should be covered by the claims of the present application.

Claims

1. A micro-pattern structure transfer method characterized by, The method comprises: a. providing a substrate assembly, the substrate assembly comprising a donor substrate and a combination releasably disposed on a side surface of the donor substrate, the combination comprising a micro-pattern structure, a first sacrificial layer, and a second sacrificial layer stacked in sequence, the micro-pattern structure being on a side of the combination facing the donor substrate; b. releasing the combination from the donor substrate; c. attaching the side of the combination having the micro-pattern structure to a surface of an acceptor substrate; d. using steam fumigation to dissolve the first sacrificial layer and the second sacrificial layer and expose the micro-pattern structure, and transfer the micro-pattern structure to the surface of the acceptor substrate; the first sacrificial layer and the second sacrificial layer are soluble materials, and the second sacrificial layer is a water-soluble adhesive tape; and / or, the first sacrificial layer is at least one of polyvinyl alcohol and polyacrylic acid, and the thickness of the first sacrificial layer is 100 μm-300 μm.

2. The micrographic structure transfer method according to claim 1, wherein Step a comprises: a1. forming a release layer on a side surface of the donor substrate; a2. forming the micro-pattern structure and the first sacrificial layer in sequence on the release layer; a3. attaching the second sacrificial layer to a surface of the first sacrificial layer, and treating the release layer to reduce the bonding force between the donor substrate and the micro-pattern structure.

3. The micrographic structure transfer method according to claim 2, wherein The release layer is at least one of polymethyl methacrylate, chitosan, and a metal film, and / or the thickness of the release layer is 0.5 μm-1 μm.

4. The micrographic structure transfer method according to claim 2, wherein Step a2 comprises: forming the first sacrificial layer by drop coating or spin coating on a surface of the micro-pattern structure.

5. The micrographic structure transfer method according to claim 3, wherein The release layer is polymethyl methacrylate, and step a3 comprises: attaching the second sacrificial layer to a surface of the first sacrificial layer; removing the release layer by etching with an acetone solution.

6. The micrographic structure transfer method according to claim 1, wherein Step b comprises: mechanically releasing the combination of the second sacrificial layer, the first sacrificial layer, and the micro-pattern structure from the donor substrate.

7. A substrate structure, characterized by The substrate and the micro-pattern structure are transferred to at least one side surface of the substrate by the method of any one of claims 1-6.

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