Display device

Abstract

A display device is provided, comprising: a substrate; a transfer guide mold provided on the substrate and including a plurality of openings; and a plurality of micro light emitting diodes (LEDs) provided on the substrate in the plurality of openings, wherein a height of the transfer guide mold is less than twice a height of each of the plurality of micro LEDs.

Description

Technical Field

[0001] Example embodiments of the present disclosure relate to a display device, and more particularly, to a display device including a transfer guide mold configured to improve transfer efficiency of micro light emitting diodes (LEDs). Background Art

[0002] Liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays are widely used as display devices. Recently, the technology of using micro-light-emitting diodes (LEDs) to manufacture high-resolution display devices has attracted attention. To manufacture high-resolution display devices, a method is used to arrange high-efficiency LED chips manufactured in microchip form in appropriate positions on a substrate using a transfer process. Summary of the Invention

[0003] One or more example embodiments provide a display device including a transfer guide mold capable of improving transfer efficiency of micro light emitting diodes (LEDs).

[0004] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of example embodiments.

[0005] According to one aspect of example embodiments, there is provided a display device including: a substrate; a transfer guide mold provided on the substrate and including a plurality of openings; and a plurality of micro light emitting diodes (LEDs) provided on the substrate in the plurality of openings, wherein a height of the transfer guide mold is less than twice a height of each of the plurality of micro LEDs.

[0006] The display device may further include a plurality of driving circuits configured to respectively drive the plurality of micro LEDs, wherein each of the plurality of driving circuits is provided on a substrate, and a portion of each of the plurality of driving circuits is respectively exposed through the plurality of openings of the transfer guide mold.

[0007] The plurality of micro LEDs are provided to be spaced apart from the transfer guide mold.

[0008] The display device may further include a first reflective layer provided in the transfer guide mold between the plurality of micro LEDs.

[0009] The display device may further include a second reflective layer provided on an inner wall of the opening provided in the transfer guide mold.

[0010] The display device may further include a concavo-convex structure provided on an upper surface of the transfer guide mold.

[0011] The display device may further include a plurality of unit pixels, each unit pixel including a plurality of pixels of different colors.

[0012] Each of the plurality of unit pixels may include two or more pixels of the same color.

[0013] The plurality of pixels of different colors may include a plurality of micro LEDs configured to emit light of different wavelength bands.

[0014] The plurality of pixels of different colors may include a plurality of micro LEDs configured to emit light of the same wavelength band, and at least some of the plurality of micro LEDs are provided with a light conversion material layer configured to convert a wavelength of incident light.

[0015] The display device may further include a barrier provided on an upper portion of the transfer guide mold, the barrier configured to accommodate the light conversion material layer.

[0016] The display device may further include a reflective layer provided on an inner wall of the barrier.

[0017] The height of the barrier may be greater than the height of the transfer guide mold.

[0018] According to another aspect of the example embodiment, there is provided a display device including: a substrate; a transfer guide mold provided on the substrate and including a plurality of openings; a plurality of micro light emitting diodes (LEDs) provided on the substrate in the plurality of openings; and a first reflective layer provided in the transfer guide mold between the plurality of micro LEDs.

[0019] The display device may further include a groove of a predetermined depth provided in the transfer guide mold between the plurality of micro LEDs, wherein the first reflective layer may be provided on an inner wall of the groove.

[0020] The display device may further include a second reflective layer provided on inner walls of the plurality of openings provided in the transfer guide mold.

[0021] The display device may further include a concavo-convex structure provided on an upper surface of the transfer guide mold.

[0022] The display device may further include a plurality of unit pixels, each unit pixel including a plurality of pixels of different colors.

[0023] The plurality of pixels of different colors may include a plurality of micro LEDs configured to emit light of the same wavelength band, and at least some of the plurality of micro LEDs are provided with a light conversion material layer configured to convert a wavelength of incident light.

[0024] The display device may further include a barrier provided on an upper portion of the transfer guide mold, the barrier configured to accommodate the light conversion material layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or other aspects, features and advantages of example embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0026] Figure 1 is a top view schematically showing a display device according to an example embodiment;

[0027] Figure 2 It is along Figure 1 A sectional view taken along line II-II';

[0028] Figure 3 Shows the display Figure 2 A top view of the periphery of a micro light emitting diode (LED);

[0029] Figure 4 shows a display device according to another example embodiment;

[0030] Figure 5 shows a display device according to another example embodiment;

[0031] Figure 6 Shows the display Figure 5 A top view of the periphery of the micro LED;

[0032] Figure 7 shows a display device according to another example embodiment;

[0033] Figure 8 Shows the display Figure 7 A top view of the periphery of the micro LED;

[0034] Figure 9 shows a display device according to another example embodiment;

[0035] Figure 10 shows a display device according to another example embodiment;

[0036] Figure 11 shows a display device according to another example embodiment; and

[0037] Figure 12 is a top view schematically illustrating a display device according to another example embodiment. DETAILED DESCRIPTION

[0038] Reference will now be made in detail to the example embodiments shown in the accompanying drawings, in which like reference numerals refer to like elements throughout. In this regard, example embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Therefore, only example embodiments are described below with reference to the accompanying drawings to illustrate various aspects. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant enumerated items. Expressions such as "at least one of...", when following a list of elements, modify the entire list of elements without modifying the individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0039] For convenience of explanation and clarity, the thickness or size of each layer shown in the drawings may be exaggerated. In this regard, example embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein.

[0040] Hereinafter, when a constituent element is provided "above" or "on" another constituent element, the constituent element may be directly above the other constituent element or above the other constituent element in a non-contact manner. Terms such as "including" and / or "comprising..." may be interpreted as indicating a constituent element, but may not be interpreted as excluding the presence or possibility of addition of another constituent element.

[0041] The use of the terms "a," "an," and "the" and similar pronouns in the context of describing the present disclosure will be interpreted as encompassing both the singular and the plural. In addition, the operations of all methods described herein can be performed in any suitable order, unless otherwise indicated herein or the context clearly contradicts. The present disclosure is not limited to the order of operations described. The use of any and all examples or language (e.g., "such as") provided herein is intended only to better illustrate the present disclosure and does not limit the scope of the present disclosure, unless otherwise stated.

[0042] Figure 1 is a top view schematically illustrating a display device 100 according to an example embodiment.

[0043] Reference Figure 1 , the display device 100 may include a plurality of unit pixels 150. For example, Figure 11 shows nine unit pixels 150. Here, in order for the display device 100 to realize a color image, each of the plurality of unit pixels 150 may include pixels 151, 152, and 153 of different colors. For example, each unit pixel 150 may include a first pixel 151, a second pixel 152, and a third pixel 153 of different colors. For example, the first pixel 151, the second pixel 152, and the third pixel 153 may be a blue pixel, a green pixel, and a red pixel, respectively. However, the first pixel 151, the second pixel 152, and the third pixel 153 are not limited thereto.

[0044] Figure 2 It is along Figure 1 A sectional view taken along line II-II'.

[0045] Reference Figure 2 , the unit pixel 150 may include a substrate 110, a transfer guide mold 120, and a plurality of micro light-emitting diodes (LEDs) 131, 132, and 133. Here, each of the micro LEDs 131, 132, and 133 may be a light-emitting diode that emits light of a specific color and is manufactured in the form of a micro-sized microchip. One surface of each of the micro LEDs 131, 132, and 133 may be provided with a p-type electrode and an n-type electrode that are electrically in contact with a drive circuit 111 to be described later. Each of the micro LEDs 131, 132, and 133 may constitute a pixel in the display device 100.

[0046] The substrate 110 may include, for example, a glass substrate or a silicon substrate. However, this is merely an example, and other substrates of various materials may be used. The substrate 110 may be provided with a driving circuit 111 for driving the plurality of micro LEDs 131, 132, and 133.

[0047] A transfer guide mold 120 may be provided on the upper surface of the substrate 110. The transfer guide mold 120 may be configured to guide the movement of the micro LEDs 131, 132, and 133 during the process of transferring the micro LEDs 131, 132, and 133 of a specific color to the substrate 110. To this end, an opening 120 a for accommodating the micro LEDs 131, 132, and 133 may be formed in the transfer guide mold 120. The portion exposed by the opening 120 a of the transfer guide mold 120 may have an area corresponding to approximately one micro LED 131, 132, or 133.

[0048] The driving circuit 111 provided on the substrate 110 can be exposed through the opening 120a of the transfer guide mold 120. The transfer guide mold 120 may include, for example, a polymer. For example, the transfer guide mold 120 may include a photoresist. However, this is merely an example. The transfer guide mold 120 may be manufactured, for example, by photoresist patterning, etching, molding, etc., but is not limited thereto.

[0049] A plurality of micro LEDs 131, 132, and 133 may be provided on the upper surface of the substrate 110. For example, the plurality of micro LEDs 131, 132, and 133 may be provided on the driving circuit 111 of the substrate 110 exposed through the opening 120a of the transfer guide mold 120. Here, each of the micro LEDs 131, 132, and 133 may be provided so that an electrode provided on a lower surface of each of the micro LEDs 131, 132, and 133 contacts the driving circuit 111.

[0050] The plurality of micro LEDs 131, 132, and 133 may include a first micro LED 131, a second micro LED 132, and a third micro LED 133 that emit light of different wavelength bands. The first micro LED 131 may emit light having a color corresponding to the first pixel 151. For example, the first micro LED 131 may emit blue light. The second micro LED 132 may emit light having a color corresponding to the second pixel 152. For example, the second micro LED 132 may emit green light. The third micro LED 133 may emit light having a color corresponding to the third pixel 153. For example, the third micro LED 133 may emit red light.

[0051] A plurality of micro LEDs 131, 132, and 133 may be provided inside each opening 120a of the transfer guide mold 120. Here, the plurality of micro LEDs 131, 132, and 133 may be provided to be spaced apart from the transfer guide mold 120. Figure 3 An example of a top view showing the periphery of the second micro LED 132 is shown. Figure 3 , the second micro LED 132 may be provided inside the transfer guide mold 120. Here, the second micro LED 132 may be positioned to be spaced apart from the transfer guide mold 120. In addition, like the second micro LED 132, the first micro LED 131 and the third micro LED 133 may be positioned inside the opening 120a of the transfer guide mold 120 to be spaced apart from the transfer guide mold 120.

[0052] Reference Figure 3In this example embodiment, the height H2 of the transfer guide mold 120 may be less than twice the height H1 of the micro LEDs 131, 132, and 133. For example, the height H2 of the transfer guide mold 120 may be about 0.5 to about 1.5 times the height H1 of the micro LEDs 131, 132, and 133. However, the height H2 of the transfer guide mold 120 is not limited thereto. As described above, the height H2 of the transfer guide mold 120 may be less than twice the height H1 of the micro LEDs 131, 132, and 133, so that the micro LEDs 131, 132, and 133 provided at a position away from the target position on the substrate 110 after the transfer process can be more easily removed.

[0053] In manufacturing the display device 100, micro LEDs 131, 132, and 133 of a specific color may be moved to a target position on the substrate 110 through a transfer process. Here, the micro LEDs 131, 132, and 133 may be more accurately positioned at the target position using a transfer guide mold 120 provided on the substrate 110.

[0054] During the transfer process, the micro LEDs 131, 132, and 133 may be positioned at locations deviated from the target locations. For example, two or more micro LEDs 131, 132, and 133 may overlap each other within the opening 120a of the transfer guide mold 120. In this case, the micro LEDs 131, 132, and 133 located above may need to be removed after the transfer process. In this example embodiment, the height H2 of the transfer guide mold 120 may be less than twice the height H1 of the micro LEDs 131, 132, and 133, so that the micro LEDs 131, 132, and 133 located at locations on the substrate 110 that are far from the target locations can be more easily removed.

[0055] Figure 4 A display device according to another exemplary embodiment is shown. The display device according to this exemplary embodiment has Figure 1 The same plane is shown, and the cross section of a unit pixel 250 of the display device is Figure 4 Shown in.

[0056] Reference Figure 4 , the unit pixel 250 may include a first pixel 251, a second pixel 252, and a third pixel 253 of different colors. Here, the first pixel 251, the second pixel 252, and the third pixel 253 may be, for example, a blue pixel, a green pixel, and a red pixel, respectively.

[0057] The unit pixel 250 may include a substrate 110, a transfer guide mold 120, and a plurality of micro LEDs 131, 132, and 133. The substrate 110 may be provided with a driving circuit 111 for driving the plurality of micro LEDs 131, 132, and 133.

[0058] A transfer guide mold 120 may be provided on an upper surface of the substrate 110, and openings 120a for accommodating the micro LEDs 131, 132, and 133 may be formed in the transfer guide mold 120. The driving circuit 111 provided on the substrate 110 may be exposed through the openings 120a of the transfer guide mold 120.

[0059] The height H2 of the transfer guide mold 120 may be less than twice the height H1 of the micro LEDs 131, 132, and 133. For example, the height H2 of the transfer guide mold 120 may be approximately 0.5 to approximately 1.5 times the height H1 of the micro LEDs 131, 132, and 133, but is not limited thereto. A concave-convex structure 125 may be provided on the upper surface of the transfer guide mold 120. As described below, the concave-convex structure 125 may be configured to facilitate removal of unnecessary micro LEDs 131, 132, and 133 remaining on the upper surface of the transfer guide mold 120 after the transfer process.

[0060] A plurality of micro LEDs 131, 132, and 133 may be provided on the upper surface of the substrate 110. For example, the plurality of micro LEDs 131, 132, and 133 may be provided on the driving circuit 111 of the substrate 110, which is exposed through the opening 120a of the transfer guide mold 120. The plurality of micro LEDs 131, 132, and 133 may include a first micro LED 131, a second micro LED 132, and a third micro LED 133, respectively, each emitting light of different wavelength bands. For example, the first micro LED 131, the second micro LED 132, and the third micro LED 133 may emit light of colors corresponding to the first pixel 251, the second pixel 252, and the third pixel 253, respectively. The transfer guide mold 120 may be provided to surround the periphery of the plurality of micro LEDs 131, 132, and 133. Here, the plurality of micro LEDs 131, 132, and 133 may be provided to be spaced apart from the transfer guide mold 120.

[0061] In this example embodiment, the concavo-convex structure 125 may be formed on the upper surface of the transfer guide mold 120, so that the micro LEDs 131, 132, and 133 present on the upper surface of the transfer guide mold 120 can be more effectively removed after the transfer process. In addition, the height H2 of the transfer guide mold 120 may be less than twice the height H1 of the micro LEDs 131, 132, and 133, so that the micro LEDs 131, 132, and 133 provided at a position away from the target position within the opening 120a of the transfer guide mold 120 can be more easily removed.

[0062] Figure 5 A display device according to another exemplary embodiment is shown. The display device according to this exemplary embodiment has Figure 1 The plane shown is the same plane, and the cross section of a unit pixel 350 of the display device is Figure 5 Shown in.

[0063] Reference Figure 5 , the unit pixel 350 may include a first pixel 351, a second pixel 352, and a third pixel 353 of different colors. Here, the first pixel 351, the second pixel 352, and the third pixel 353 may be, for example, a blue pixel, a green pixel, and a red pixel, respectively.

[0064] The unit pixel 350 may include a substrate 110 provided with a driving circuit 111 , a transfer guide mold 320 provided on the substrate 110 , a plurality of micro LEDs 131 , 132 , and 133 provided on the substrate 110 , and a reflective layer 341 provided in the transfer guide mold 320 .

[0065] A transfer guide mold 320 may be provided on the upper surface of the substrate 110, and openings 320a for accommodating the micro LEDs 131, 132, and 133 may be formed in the transfer guide mold 320. The driving circuit 111 provided on the substrate 110 may be exposed through the openings 320a of the transfer guide mold 320. Here, the portion exposed through the openings 320a of the transfer guide mold 320 may have an area corresponding to approximately one micro LED 131, 132, or 133.

[0066] The height H2 of the transfer guide mold 320 may be less than twice the height H1 of the micro LEDs 131, 132, and 133. For example, the height H2 of the transfer guide mold 320 may be about 0.5 to about 1.5 times the height H1 of the micro LEDs 131, 132, and 133, but is not limited thereto. The upper surface of the transfer guide mold 320 may be as described above. Figure 4 As shown, a relief structure 125 is provided.

[0067] A plurality of micro LEDs 131, 132, and 133 may be provided on the driving circuit 111 of the substrate 110 exposed through the opening 320a of the transfer guide mold 320. The plurality of micro LEDs 131, 132, and 133 may include a first micro LED 131, a second micro LED 132, and a third micro LED 133 that respectively emit light of different wavelength bands. The first micro LED 131, the second micro LED 132, and the third micro LED 133 may emit light of colors corresponding to the first pixel 351, the second pixel 352, and the third pixel 353.

[0068] A plurality of micro LEDs 131, 132, and 133 may be provided inside each opening 320a of the transfer guide mold 320. Here, the plurality of micro LEDs 131, 132, and 133 may be provided to be spaced apart from the transfer guide mold 320. Figure 6 An example of a top view showing the periphery of the second micro LED 132 is shown. Figure 6 , the second micro LED 132 may be provided inside the transfer guide mold 320. Here, the second micro LED 132 may be positioned to be spaced apart from the transfer guide mold 320. In addition, like the second micro LED 132, the first micro LED 131 and the third micro LED 133 may be positioned to be spaced apart from the transfer guide mold 320 inside the opening 320a of the transfer guide mold 320.

[0069] A reflective layer 341 may be provided in the transfer guide mold 320 between the plurality of micro LEDs 131, 132, and 133. Specifically, grooves 320b of a predetermined depth may be formed in the transfer guide mold 320 between the plurality of micro LEDs 131, 132, and 133, and a reflective layer 341 may be provided on inner walls of the grooves 320b.

[0070] A reflective layer 341 may be provided to surround each of the plurality of micro LEDs 131, 132, and 133. Figure 6 , a reflective layer 341 may be provided in the transfer guide mold 320 to surround the second micro LED 132. In addition, the reflective layer 341 may be provided to surround each of the first micro LED 131 and the third micro LED 133. The reflective layer 341 may include a metal material. For example, the reflective layer 341 may include aluminum (Al), silver (Ag), etc., but is not limited thereto.

[0071] The reflective layer 341 can be configured to prevent or reduce mixing of light of different colors emitted from adjacent pixels 351, 352, and 353. For example, light of a predetermined color emitted from the second micro LED 132 constituting the second pixel 352 can be provided in the transfer guide mold 320 to be reflected by the reflective layer 341 surrounding the second micro LED 132. Thus, the light of the predetermined color emitted from the second micro LED 132 can be prevented from traveling toward the adjacent first pixel 351 and third pixel 353. Consequently, crosstalk between the adjacent pixels 351, 352, and 353 can be prevented or reduced.

[0072] In this exemplary embodiment, the height H2 of the transfer guide mold 320 may be less than twice the height H1 of the micro LEDs 131, 132, and 133, making it easier to remove the micro LEDs 131, 132, and 133 located on the substrate 110 at a position away from the target position. Furthermore, when a concave-convex structure is formed on the upper surface of the transfer guide mold 320, the micro LEDs 131, 132, and 133 located on the upper surface of the transfer guide mold 320 can be more effectively removed after the transfer process. A reflective layer 341 may be provided in the transfer guide mold 320 between the plurality of micro LEDs 131, 132, and 133, thereby preventing or reducing crosstalk between adjacent pixels 351, 352, and 353.

[0073] Figure 7 A display device according to another exemplary embodiment is shown. The display device according to this exemplary embodiment has Figure 1 The plane shown is the same plane, and the cross section of a unit pixel 450 of the display device is Figure 7 Shown in.

[0074] Reference Figure 7 , the unit pixel 450 may include a first pixel 451, a second pixel 452, and a third pixel 453 of different colors. Here, the first pixel 451, the second pixel 452, and the third pixel 453 may be, for example, a blue pixel, a green pixel, and a red pixel, respectively.

[0075] The unit pixel 450 may include a substrate 110 provided with a driving circuit 111 , a transfer guide mold 420 provided on the substrate 110 , a plurality of micro LEDs 131 , 132 , and 133 provided on the substrate 110 , and a reflective layer 442 provided on the transfer guide mold 420 .

[0076] An opening 420a for accommodating the micro LEDs 131, 132, and 133 may be formed in the transfer guide mold 420. The driving circuit 111 provided on the substrate 110 may be exposed through the opening 420a of the transfer guide mold 420. Here, the portion exposed through the opening 420a of the transfer guide mold 420 may have an area corresponding to approximately one micro LED 131, 132, or 133.

[0077] The height H2 of the transfer guide mold 420 may be less than twice the height H1 of the micro LEDs 131, 132, and 133. For example, the height H2 of the transfer guide mold 420 may be about 0.5 to about 1.5 times the height H1 of the micro LEDs 131, 132, and 133, but is not limited thereto. The upper surface of the transfer guide mold 420 may be as shown in FIG. Figure 4 As shown, the above-mentioned concavo-convex structure 125 is provided.

[0078] A plurality of micro LEDs 131, 132, and 133 may be provided on the driving circuit 111 of the substrate 110 exposed through the opening 420a of the transfer guide mold 420. The plurality of micro LEDs 131, 132, and 133 may include a first micro LED 131, a second micro LED 132, and a third micro LED 133 that respectively emit light of different wavelength bands. The first micro LED 131, the second micro LED 132, and the third micro LED 133 may respectively emit light of colors corresponding to the first pixel 351, the second pixel 352, and the third pixel 353.

[0079] A plurality of micro LEDs 131, 132, and 133 may be provided inside each opening 420a of the transfer guide mold 420. Here, the plurality of micro LEDs 131, 132, and 133 may be provided to be spaced apart from the transfer guide mold 420. Figure 8 An example of a top view showing the periphery of the second micro LED 132 is shown. Figure 8 , the second micro LED 132 may be provided inside the transfer guide mold 420. Here, the second micro LED 132 may be positioned to be spaced apart from the transfer guide mold 420. In addition, like the second micro LED 132, the first micro LED 131 and the third micro LED 133 may be positioned to be spaced apart from the transfer guide mold 420 inside the opening 420a of the transfer guide mold 420.

[0080] A reflective layer 442 may be provided in the transfer guide mold 420. For example, the reflective layer 442 may be provided on an inner wall of each opening 420a of the transfer guide mold 420. Here, the reflective layer 442 may be provided to surround each of the plurality of micro LEDs 131, 132, and 133. Figure 8 , a reflective layer 442 may be provided in the transfer guide mold 420 to surround the second micro LED 132. In addition, the reflective layer 442 may be provided to surround each of the first micro LED 131 and the third micro LED 133. The reflective layer 442 may include a metal material. For example, the reflective layer 442 may include Al, Ag, etc., but is not limited thereto.

[0081] The reflective layer 442 can be used to prevent or reduce mixing of different colored lights emitted from adjacent pixels 451, 452, and 453. Specifically, for example, light of a predetermined color emitted from the second micro LED 132 constituting the second pixel 452 can be provided on the inner wall of the opening 420a of the transfer guide mold 420 to be reflected by the reflective layer 442 surrounding the second micro LED 132. Therefore, the predetermined color light emitted from the second micro LED 132 can be prevented or reduced from traveling toward the adjacent first pixel 451 and third pixel 453, and thus the occurrence of crosstalk between the adjacent pixels 451, 452, and 453 can be prevented or reduced.

[0082] In this exemplary embodiment, the height H2 of the transfer guide mold 420 may be less than twice the height H1 of the micro LEDs 131, 132, and 133, so that the micro LEDs 131, 132, and 133 provided at a position away from the target position on the substrate 110 can be more easily removed. In addition, when the concave-convex structure is formed on the upper surface of the transfer guide mold 420, the micro LEDs 131, 132, and 133 provided on the upper surface of the transfer guide mold 420 can be more effectively removed after the transfer process. In addition, a reflective layer 442 may be provided on the inner wall of the opening 420a of the transfer guide mold 420, thereby preventing or reducing crosstalk between adjacent pixels 451, 452, and 453.

[0083] Figure 9 A display device according to another exemplary embodiment is shown. The display device according to this exemplary embodiment has Figure 1 The plane shown is the same plane, and the cross section of a unit pixel 550 of the display device is Figure 9 Shown in.

[0084] Reference Figure 9 , the unit pixel 550 may include a first pixel 551, a second pixel 552, and a third pixel 553 of different colors. Here, the first pixel 551, the second pixel 552, and the third pixel 553 may be, for example, a blue pixel, a green pixel, and a red pixel, respectively.

[0085] The unit pixel 550 may include a substrate 110 provided with a driving circuit, a transfer guide mold 520 provided on the substrate 110 , a plurality of micro LEDs 131 , 132 , and 133 provided on the substrate 110 , and first and second reflective layers 541 and 542 provided on the transfer guide mold 520 .

[0086] Openings 520a for accommodating the micro LEDs 131, 132, and 133 may be formed in the transfer guide mold 520. The driving circuit 111 provided on the substrate 110 may be exposed through the openings 520a of the transfer guide mold 520.

[0087] The height H2 of the transfer guide mold 520 may be less than twice the height H1 of the micro LEDs 131, 132, and 133. For example, the height H2 of the transfer guide mold 520 may be about 0.5 to about 1.5 times the height H1 of the micro LEDs 131, 132, and 133, but is not limited thereto. The upper surface of the transfer guide mold 520 may be as shown in FIG. Figure 4 As shown, the above-mentioned concavo-convex structure 125 is provided.

[0088] A plurality of micro LEDs 131, 132, and 133 may be provided on the driving circuit 111 of the substrate 110 exposed through the opening 520a of the transfer guide mold 520. The plurality of micro LEDs 131, 132, and 133 may include a first micro LED 131, a second micro LED 132, and a third micro LED 133 that respectively emit light of different wavelength bands. The first micro LED 131, the second micro LED 132, and the third micro LED 133 may emit light of a color corresponding to the first pixel 551, the second pixel 552, and the third pixel 553.

[0089] A plurality of micro LEDs 131, 132, and 133 may be provided inside each opening 520a of the transfer guide mold 520. Here, the plurality of micro LEDs 131, 132, and 133 may be provided to be spaced apart from the transfer guide mold 520.

[0090] The first reflective layer 541 may be provided in the transfer guide mold 520 between the plurality of micro LEDs 131, 132, and 133. For example, a groove 520b of a predetermined depth may be formed in the transfer guide mold 520 between the plurality of micro LEDs 131, 132, and 133, and the first reflective layer 541 may be provided on the inner wall of the groove 520b. The first reflective layer 541 may be provided to surround each of the plurality of micro LEDs 131, 132, and 133. The first reflective layer 541 may include, for example, a metal material such as Al, Ag, or the like.

[0091] A second reflective layer 542 may be provided on the inner wall of each opening 520a of the transfer guide mold 520. Here, the second reflective layer 542 may be provided to surround each of the plurality of micro LEDs 131, 132, and 133. The second reflective layer 542 may include a metal material that is the same as or similar to the first reflective layer 541. The first reflective layer 541 and the second reflective layer 542 may more effectively prevent or reduce crosstalk between adjacent pixels 551, 552, and 553.

[0092] In this exemplary embodiment, the height H2 of the transfer guide mold 520 may be less than twice the height H1 of the micro LEDs 131, 132, and 133, making it easier to remove the micro LEDs 131, 132, and 133 located on the substrate 110 at a position away from the target position. Furthermore, when the concave-convex structure is formed on the upper surface of the transfer guide mold 520, the micro LEDs 131, 132, and 133 located on the upper surface of the transfer guide mold 520 can be more effectively removed after the transfer process. Furthermore, the first reflective layer 541 and the second reflective layer 542 may be provided in the transfer guide mold 520, thereby more effectively preventing or reducing crosstalk between adjacent pixels 551, 552, and 553.

[0093] Figure 10 A display device according to another exemplary embodiment is shown. The display device according to this exemplary embodiment has Figure 1 The plane shown is the same plane, and the cross section of a unit pixel 650 of the display device is Figure 10 Shown in.

[0094] Reference Figure 10 , the unit pixel 650 may include a first pixel 651, a second pixel 652, and a third pixel 653 of different colors. Here, the first pixel 651, the second pixel 652, and the third pixel 653 may be, for example, a blue pixel, a green pixel, and a red pixel, respectively.

[0095] The substrate 110 may be provided with a driving circuit 111 for driving the plurality of micro LEDs 631, 632, and 633. The substrate 110 may include, for example, a glass substrate or a silicon substrate, but is not limited thereto.

[0096] A transfer guide mold 620 may be provided on the upper surface of the substrate 110. Here, an opening 620 a for accommodating the micro LEDs 631, 632, and 633 may be formed in the transfer guide mold 620. The driving circuit 111 provided on the substrate 110 may be exposed through the opening 620 a of the transfer guide mold 620. Here, the portion exposed through the opening 620 a of the transfer guide mold 620 may have an area corresponding to approximately one micro LED 631, 632, or 633.

[0097] The transfer guide mold 620 may have a height H2 less than twice the height H1 of the micro LEDs 631, 632, and 633. For example, the transfer guide mold 620 may have a height H2 of about 0.5 to about 1.5 times the height H1 of the micro LEDs 631, 632, and 633, but is not limited thereto. A concave-convex structure may be provided on the upper surface of the transfer guide mold 620.

[0098] A plurality of micro LEDs 631, 632, and 633 may be provided on the substrate 110, for example, on the driving circuit 111 exposed through the opening 620a of the transfer guide mold 620. The plurality of micro LEDs 631, 632, and 633 may be provided to be spaced apart from the transfer guide mold 620 inside each opening 620a of the transfer guide mold 620.

[0099] In this example embodiment, the plurality of micro LEDs 631, 632, and 633 may include a first micro LED 631, a second micro LED 632, and a third micro LED 633 that respectively emit light of the same wavelength band. Here, the first micro LED 631, the second micro LED 632, and the third micro LED 633 may be provided to correspond to a first pixel 651, a second pixel 652, and a third pixel 653, respectively. For example, the first micro LED 631, the second micro LED 632, and the third micro LED 633 may emit light of a first color, for example, blue light.

[0100] A first reflective layer 641 may be provided in the transfer guide mold 620 between the micro LEDs 631, 632, and 633. For example, a groove 620b of a predetermined depth may be formed in the transfer guide mold 620 between the plurality of micro LEDs 631, 632, and 633, and the first reflective layer 641 may be provided on the inner wall of the groove 620b. The first reflective layer 641 may be provided to surround each of the plurality of micro LEDs 631, 632, and 633. The first reflective layer 641 may include, for example, a metal material such as Al, Ag, or the like. Furthermore, a reflective layer may be provided on the inner wall of the opening 620a of the transfer guide mold 620.

[0101] A filling layer 665 may be provided in the opening 620a of the transfer guide mold 620 to fill a space around the micro LEDs 631, 632, and 633. Here, the filling layer 665 may include a material that transmits light emitted from the micro LEDs 631, 632, and 633.

[0102] A transparent material layer 670 may be provided on the first micro LEDs 631 arranged to correspond to the first pixels 651. Furthermore, a barrier 660 containing the transparent material layer 670 may be provided on the upper portion of the transfer guide mold 620 surrounding the first micro LEDs 631. The barrier 660 may include, but is not limited to, the same material as the filler layer 665 described above. A second reflective layer 685 may be provided on the inner wall of the barrier 660. The second reflective layer 685 may include, for example, a metal material that is the same as or similar to the first reflective layer 641, such as Al or Ag, but is not limited thereto. Light of the first color, e.g., blue light, emitted from the first micro LEDs 631 may pass through the transparent material layer 670 and may be emitted from the first pixel 651.

[0103] A first light conversion material layer 672 may be provided on an upper portion of the second micro LED 632 corresponding to the second pixel 652. The first light conversion material layer 672 may convert the wavelength of incident light. Specifically, the first light conversion material layer 672 may convert light of a first color, such as blue light emitted from the second micro LED 632, into light of a second color, such as green light. The first light conversion material layer 672 may include, but is not limited to, quantum dots (QDs).

[0104] A barrier 660 containing the first light conversion material layer 672 may be provided on the upper portion of the transfer guide mold 620 surrounding the second micro LEDs 632. Furthermore, the aforementioned second reflective layer 685 may be provided on the inner wall of the barrier 660. Light of a first color, for example, blue light emitted from the second micro LEDs 632, may be converted by the first light conversion material layer 672 into light of a second color, for example, green light, and thus emitted from the second pixel 652.

[0105] A second light-conversion material layer 673 may be provided on an upper portion of the third micro-LED 633 corresponding to the third pixel 653. The second light-conversion material layer 673 may convert the wavelength of incident light. For example, the second light-conversion material layer 673 may convert light of a first color, such as blue light emitted from the third micro-LED 633, into light of a third color, such as red light. The second light-conversion material layer 673 may include, but is not limited to, QDs.

[0106] A barrier 660 containing the second light-conversion material layer 673 may be provided on the upper portion of the transfer guide mold 620 surrounding the third micro-LEDs 633. Furthermore, the aforementioned second reflective layer 685 may also be provided on the inner wall of the barrier 660. Light of a first color, such as blue light emitted from the third micro-LEDs 633, may be converted by the second light-conversion material layer 673 into light of a third color, such as red light, and thus emitted from the third pixel 653.

[0107] The barrier 660 , which is provided on an upper portion of the transfer guide mold 620 to allow the first and second light conversion material layers 672 and 673 accommodated by the barrier 660 to more efficiently convert incident light, may have a height H3 greater than a height H2 of the transfer guide mold 620 .

[0108] In this example embodiment, the height H2 of the transfer guide mold 620 may be less than twice the height H1 of the micro LEDs 631, 632, and 633, so that the micro LEDs 631, 632, and 633 provided at positions away from the target position on the substrate 110 can be more easily removed. In addition, the first reflective layer 641 and the second reflective layer 685 may be provided in the transfer guide mold 620 and the barrier 660, thereby more effectively preventing or reducing crosstalk between adjacent pixels 651, 652, and 653.

[0109] Figure 11 A display device according to another exemplary embodiment is shown. The display device according to this exemplary embodiment has Figure 1 The same plane is shown, and the cross section of a unit pixel 750 of the display device is Figure 11 Shown in.

[0110] Reference Figure 11 , the unit pixel 750 may include a first pixel 751, a second pixel 752, and a third pixel 753 of different colors. Here, the first pixel 751, the second pixel 752, and the third pixel 753 may be, for example, a blue pixel, a green pixel, and a red pixel, respectively.

[0111] The substrate 110 may be provided with a driving circuit 111 for driving the plurality of micro LEDs 731, 732, and 733, and a transfer guide mold 720 may be provided on an upper surface of the substrate 110. An opening 720a for accommodating the micro LEDs 731, 732, and 733 may be formed in the transfer guide mold 720, and the driving circuit 111 provided on the substrate 110 may be exposed through the opening 720a.

[0112] The height of the transfer guide mold 720 may be less than twice the height of the micro LEDs 731, 732, and 733. For example, the height of the transfer guide mold 720 may be about 0.5 to about 1.5 times the height of the micro LEDs 731, 732, and 733, but is not limited thereto. A concave-convex structure may be provided on the upper surface of the transfer guide mold 720.

[0113] A plurality of micro LEDs 731, 732, and 733 may be provided on the driving circuit 111 of the substrate 110 exposed through the openings 720a of the transfer guide mold 720. The plurality of micro LEDs 731, 732, and 733 may be provided to be spaced apart from the transfer guide mold 720 inside each opening 720a of the transfer guide mold 720.

[0114] In this example embodiment, the plurality of micro LEDs 731, 732, and 733 may include a first micro LED 731, a second micro LED 732, and a third micro LED 733, each emitting light of the same wavelength band. The first micro LED 731, the second micro LED 732, and the third micro LED 733 may be provided to correspond to a first pixel 751, a second pixel 752, and a third pixel 753, respectively. The first micro LED 731, the second micro LED 732, and the third micro LED 733 may emit, for example, ultraviolet light.

[0115] A first reflective layer 741 may be provided in the transfer guide mold 720 between the plurality of micro LEDs 731, 732, and 733. For example, a groove 720b of a predetermined depth may be formed in the transfer guide mold 720 between the plurality of micro LEDs 731, 732, and 733, and the first reflective layer 741 may be provided on the inner wall of the groove 720b. Alternatively, a reflective layer may be provided on the inner wall of the opening 720a of the transfer guide mold 720. A filling layer 765 may be provided within the opening 720a of the transfer guide mold 720 to fill the space around the micro LEDs 731, 732, and 733. The filling layer 765 may include a material that transmits light emitted from the micro LEDs 731, 732, and 733.

[0116] A first light conversion material layer 771 may be provided on an upper portion of the first micro LED 731 corresponding to the first pixel 751. The first light conversion material layer 771 may convert the wavelength of incident light. For example, the first light conversion material layer 771 may convert light of a predetermined wavelength, such as ultraviolet light emitted from the first micro LED 731, into light of a first color, such as blue light. The first light conversion material layer 771 may include, but is not limited to, QDs.

[0117] A barrier 760 for accommodating the first light-conversion material layer 771 may be provided on the upper portion of the transfer guide mold 720 surrounding the first micro-LEDs 731. A second reflective layer 785 may be provided on the inner wall of the barrier 760. The second reflective layer 785 may include, for example, a metal material that is the same as or similar to the first reflective layer 741, such as Al or Ag, but is not limited thereto. Light of a predetermined wavelength, such as ultraviolet light, emitted from the first micro-LEDs 731 may be converted by the first light-conversion material layer 771 into light of a first color, such as blue light, and thus emitted from the first pixel 751.

[0118] A second light-conversion material layer 772 may be provided on an upper portion of the second micro-LED 732 corresponding to the second pixel 752. The second light-conversion material layer 772 may convert the wavelength of incident light. For example, the second light-conversion material layer 772 may convert light of a predetermined wavelength, such as ultraviolet light emitted from the second micro-LED 732, into light of a second color, such as green light. The second light-conversion material layer 772 may include, but is not limited to, QDs.

[0119] A barrier 760 for accommodating the second light-conversion material layer 772 may be provided on the upper portion of the transfer guide mold 720 surrounding the second micro-LEDs 732. Furthermore, the aforementioned second reflective layer 785 may be provided on the inner wall of the barrier 760. Light of a predetermined wavelength, such as ultraviolet light emitted from the second micro-LEDs 732, may be converted by the second light-conversion material layer 772 into light of a second color, such as green light, and thus emitted from the second pixel 752.

[0120] A third light-conversion material layer 773 may be provided on an upper portion of the third micro-LED 733 corresponding to the third pixel 753. The third light-conversion material layer 773 may convert the wavelength of incident light. For example, the third light-conversion material layer 773 may convert light of a predetermined wavelength, such as ultraviolet light emitted from the third micro-LED 733, into light of a third color, such as red light. The third light-conversion material layer 773 may include, but is not limited to, QDs.

[0121] A barrier 760 for accommodating the third light-conversion material layer 773 may be provided on the upper portion of the transfer guide mold 720 surrounding the third micro-LEDs 733. Furthermore, the aforementioned second reflective layer 785 may be provided on the inner wall of the barrier 760. Light of a predetermined wavelength, such as ultraviolet light emitted from the third micro-LEDs 733, may be converted by the third light-conversion material layer 773 into light of a third color, such as red light, and thus emitted from the third pixel 753.

[0122] The barrier 760 may have a height greater than that of the transfer guide mold 720 , which is provided on an upper portion of the transfer guide mold 720 so that the first, second, and third light conversion material layers 771 , 772 , and 773 accommodated by the barrier 760 can more efficiently convert incident light.

[0123] In this example embodiment, the height of the transfer guide mold 720 may be less than twice the height of the micro LEDs 731, 732, and 733, so that the micro LEDs 731, 732, and 733 provided at positions away from the target position on the substrate 110 can be more easily removed. In addition, the first reflective layer 741 and the second reflective layer 785 may be provided in the transfer guide mold 720 and the barrier 760, thereby more effectively preventing or reducing crosstalk between adjacent pixels 751, 752, and 753.

[0124] In the above example embodiments, a unit pixel of a display device is described as including a plurality of pixels of different colors, for example, a first pixel, a second pixel, and a third pixel of different colors. Here, a unit pixel includes only one pixel of the same color. However, the embodiment is not limited thereto, and two or more pixels of the same color may be included in one unit pixel.

[0125] Figure 12 is a top view schematically illustrating a display device 800 according to another example embodiment.

[0126] Reference Figure 12 , the display device 800 may include a plurality of unit pixels 850. Figure 12 , for example, six unit pixels 850 are shown. Here, each of the plurality of unit pixels 850 may include pixels 851, 852, and 853 of different colors. For example, each unit pixel 850 may include a first pixel 851, a second pixel 852, and a third pixel 853 of different colors. Here, each of the first pixel 851, the second pixel 852, and the third pixel 853 may have the same structure as the first pixel, the second pixel, and the third pixel described in the above example embodiment. Therefore, a detailed description thereof will be omitted.

[0127] In this example embodiment, the unit pixel 850 may include two pixels of the same color. For example, the unit pixel 850 may include two first pixels 851, two second pixels 852, and two third pixels 853. Here, the first pixel 851, the second pixel 852, and the third pixel 853 may be, for example, a blue pixel, a green pixel, and a red pixel, respectively.

[0128] As described above, when the unit pixel 850 includes two pixels 851 , 852 , and 853 of the same color, even if any one of the two pixels 851 , 852 , and 853 of the same color is defective, a color image can be normally realized without repairing the defective pixel.

[0129] The case where the unit pixel 850 includes two pixels 851, 852, and 853 of the same color is described as an example, but is not limited thereto. The unit pixel 850 may include three or more pixels of the same color. In the unit pixel 850, there may be two or more pixels of at least one of all colors.

[0130] According to the display device of the above-described example embodiment, the height of the transfer guide mold that guides the transfer of multiple micro-LEDs can be less than twice the height of the micro-LEDs, making it easier to remove micro-LEDs located on the substrate away from the target location. Furthermore, a concave-convex structure can be formed on the surface of the transfer guide mold, making it easier to remove micro-LEDs remaining on the surface of the transfer guide mold. A reflective layer can be provided on the transfer guide mold, effectively preventing or reducing crosstalk between adjacent pixels.

[0131] Although the exemplary embodiments have been described above, the present disclosure is not limited thereto, and various modifications may be made by those skilled in the art.

[0132] It should be understood that the example embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each example embodiment should typically be considered as available for other similar features or aspects in other embodiments.

[0133] Although example embodiments have been described with reference to the accompanying drawings, workers skilled in the art will recognize that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the claims.

[0134] This application claims the benefit of Korean Patent Application No. 10-2019-0117488 filed on September 24, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.

Claims

1. A display device comprising: substrate; a transfer guide mold provided on the substrate and including a plurality of openings; as well as a plurality of micro light emitting diodes provided on the substrate in the plurality of openings, The height of the transfer guide mold is less than twice the height of each of the plurality of micro light emitting diodes and is greater than or equal to 1.5 times the height of each of the plurality of micro light emitting diodes.

2. The display device according to claim 1 , further comprising a plurality of driving circuits configured to drive the plurality of micro light emitting diodes respectively. Each of the plurality of driving circuits is provided on the substrate, and a portion of each of the plurality of driving circuits is exposed through the plurality of openings of the transfer guide mold, respectively. 3 . The display device according to claim 1 , wherein the plurality of micro light emitting diodes are provided to be spaced apart from the transfer guide mold. 4 . The display device according to claim 1 , further comprising a first reflective layer provided in the transfer guide mold between the plurality of micro light emitting diodes. 5 . The display device according to claim 1 , further comprising a second reflective layer provided on an inner wall of the opening provided in the transfer guide mold. The display device according to claim 1 , further comprising a concavo-convex structure provided on an upper surface of the transfer guide mold. 7 . The display device according to claim 1 , further comprising a plurality of unit pixels, each of the plurality of unit pixels including a plurality of pixels of different colors. 8 . The display device according to claim 7 , wherein each of the plurality of unit pixels includes two or more pixels of the same color. 9 . The display device according to claim 7 , wherein the plurality of pixels of different colors include a plurality of micro light emitting diodes configured to emit light of different wavelength bands.

10. The display device according to claim 7, wherein the plurality of pixels of different colors include a plurality of micro light emitting diodes configured to emit light of the same wavelength band, and at least some of the plurality of micro light emitting diodes are provided with a light conversion material layer configured to convert the wavelength of incident light. 11 . The display device according to claim 10 , further comprising a barrier provided on an upper portion of the transfer guide mold, the barrier being configured to accommodate the light conversion material layer. 12 . The display device according to claim 11 , further comprising a reflective layer provided on an inner wall of the barrier. 13 . The display device of claim 11 , wherein a height of the barrier is greater than a height of the transfer guide mold.

14. A display device comprising: substrate; a transfer guide mold provided on the substrate and including a plurality of openings; a plurality of micro light emitting diodes provided on the substrate in the plurality of openings; as well as providing a stopper on an upper portion of the transfer guide die, The height of the transfer guide mold is less than twice the height of each of the plurality of micro light emitting diodes and is greater than or equal to 1.5 times the height of each of the plurality of micro light emitting diodes. 15 . The display device of claim 14 , further comprising a first reflective layer provided in the transfer guide mold between the plurality of micro light emitting diodes.

16. The display device according to claim 15, further comprising a groove of a predetermined depth provided in the transfer guide mold between the plurality of micro light emitting diodes, The first reflective layer is provided on the inner wall of the groove. 17 . The display device of claim 14 , further comprising a second reflective layer provided on inner walls of the plurality of openings provided in the transfer guide mold. 18 . The display device according to claim 14 , further comprising a concavo-convex structure provided on an upper surface of the transfer guide mold. 19 . The display device according to claim 14 , further comprising a plurality of unit pixels, each of the plurality of unit pixels comprising a plurality of pixels of different colors.

20. The display device according to claim 19, wherein the plurality of pixels of different colors include a plurality of micro light emitting diodes configured to emit light of the same wavelength band, and at least some of the plurality of micro light emitting diodes are provided with a light conversion material layer configured to convert the wavelength of incident light. The display device according to claim 20 , wherein the barrier is configured to accommodate the light conversion material layer.

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