Organic light emitting display panel and manufacturing method thereof, and organic light emitting display device

Abstract

The present application provides an organic light-emitting display panel, a manufacturing method thereof, and an organic light-emitting display device, wherein the organic light-emitting display panel includes: an array substrate, a color film substrate, and a packaging structure; the packaging structure includes a sealing frame and / or a sealing layer, the sealing frame and the sealing layer are both arranged between the array substrate and the color film substrate, and the array substrate and the color film substrate are bonded and fixed by the sealing frame and / or the sealing layer; wherein the sealing frame is formed by curing a sealing glue, and the sealing frame is located in the border area of ​​the array substrate and the color film substrate, and the sealing layer is formed by curing a filling glue, and the sealing layer is located in the display area of ​​the array substrate and the color film substrate. In the organic light-emitting display panel, a manufacturing method thereof, and an organic light-emitting display device provided in the present application, by respectively arranging a sealing frame and / or a sealing layer between the array substrate and the color film substrate, not only can the packaging effect of the array substrate and the color film substrate be improved, but also it is conducive to achieving a narrow border.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an organic light-emitting display panel and a manufacturing method thereof, and an organic light-emitting display device. Background Art

[0002] Compared with many display devices, organic light emitting display devices (OLED) have many advantages such as full solid state, self-luminescence, wide viewing angle, wide color gamut, fast response speed, high luminous efficiency, high brightness, high contrast, ultra-thin and ultra-light, low power consumption, wide operating temperature range, ability to produce large-size and flexible panels and simple process. It can realize truly flexible display and best meet people's requirements for future displays.

[0003] In order to improve the contrast of the display device and achieve an integrated black effect, OLED devices usually use polarizers (POL), which can effectively reduce the reflection intensity of external ambient light on the screen. However, the light transmittance of POL is generally only about 44%. In order to achieve higher light brightness, more power consumption is required. Moreover, the thickness of the polarizer is large and the material is brittle, which is not conducive to the development of dynamic bending products. In order to develop dynamic bending products based on OLED display technology, new technologies and new processes must be introduced to replace polarizers.

[0004] To this end, the industry usually uses PFS technology (POL Free Solution) equipped with color filter (CF) to replace polarizers. The CF structure generally includes red (R), green (G) and blue (B) color resistance units and black matrix (BM). The red (R), green (G) and blue (B) color resistance units need to correspond to the red, green and blue pixel units of the OLED device respectively. The use of PFS technology not only greatly reduces the thickness of the functional layer, but also can increase the light output rate from 44% to 80%, greatly increasing the light output brightness, thereby reducing the power consumption of the OLED device.

[0005] As we all know, the electrodes and organic layers of OLED devices are easily corroded by water and oxygen, which reduces their lifespan, so the OLED display panel needs to be encapsulated. However, in actual production and use, it is found that the OLED display device made with PFS technology has the problem of poor encapsulation effect, and water and oxygen can easily enter the interior of the OLED device, causing the organic light-emitting layer to fail. Summary of the invention

[0006] In view of this, the present application provides an organic light emitting display panel and a manufacturing method thereof, and an organic light emitting display device, so as to solve the problem of poor packaging effect of organic light emitting display devices using PFS technology in the prior art.

[0007] In order to solve the above technical problems, the present invention provides an organic light emitting display panel, which includes: an array substrate, a color film substrate and a packaging structure;

[0008] The array substrate and the color film substrate both include a display area and a frame area surrounding the display area, a plurality of OLED pixel units are arranged in the display area of ​​the array substrate, a plurality of color resist units are arranged in the display area of ​​the color film substrate, the array substrate and the color film substrate are arranged opposite to each other, and the plurality of OLED pixel units and the plurality of color resist units are arranged one by one;

[0009] The packaging structure includes a sealing frame and / or a sealing layer, wherein the sealing frame and the sealing layer are both arranged between the array substrate and the color film substrate, and the array substrate and the color film substrate are bonded and fixed via the sealing frame and / or the sealing layer;

[0010] The sealing frame is formed by curing the sealing glue, and the sealing frame is located in the frame area of ​​the array substrate and the color film substrate. The sealing layer is formed by curing the filling glue, and the sealing layer is located in the display area of ​​the array substrate and the color film substrate.

[0011] Optionally, in the organic light emitting display panel, the frame region of the array substrate includes, from inside to outside, a first transition region, an edge defining region, a second transition region and a cutting region;

[0012] A thin film encapsulation layer is disposed on the plurality of OLED pixel units, the thin film encapsulation layer extends to the frame region of the array substrate, and an edge of the thin film encapsulation layer is consistent with an outer edge of the second transition region.

[0013] Optionally, in the organic light emitting display panel, the sealing frame is arranged in the second transition region and is located on the thin film encapsulation layer.

[0014] Optionally, in the organic light emitting display panel, the sealing frame is disposed in the second transition region and the edge defining region, and is located on the thin film encapsulation layer.

[0015] Optionally, in the organic light emitting display panel, the sealing frame is disposed in the second transition region, the edge defining region and the first transition region, and is located on the thin film encapsulation layer.

[0016] Optionally, in the organic light-emitting display panel, the sealing frame is made of a transparent material, and the sealing frame is arranged in the second transition area, the edge defining area, the first transition area and a part of the display area, and is located on the thin film encapsulation layer.

[0017] Optionally, in the organic light emitting display panel, the border region of the array substrate further includes a sealing frame area, the sealing frame area is located between the second transition area and the cutting area, and the sealing frame is disposed in the sealing frame area.

[0018] Optionally, in the organic light emitting display panel, a plurality of pads are provided in the frame sealing adhesive, and the plurality of pads are used to maintain the frame thickness of the organic light emitting display panel.

[0019] Optionally, in the organic light-emitting display panel, the sealing frame has four sides, one of which corresponds to the crimping side of the organic light-emitting display panel, and the other three sides are provided with multiple pads, and the side corresponding to the crimping side of the organic light-emitting display panel is not provided with a pad, or the size of the provided pad is smaller than that of the other three sides.

[0020] Optionally, in the organic light-emitting display panel, one side of the sealing layer corresponds to the crimping side of the organic light-emitting display panel, and a blocking structure is provided on this side. The blocking structure is located at the edge of the filling glue and is used to prevent the filling glue from overflowing into the crimping area of ​​the organic light-emitting display panel.

[0021] Accordingly, the present invention provides a method for manufacturing an organic light-emitting display panel, and the method for manufacturing an organic light-emitting display panel includes:

[0022] Step 1: providing a substrate and a cover plate respectively, forming a TFT array, a plurality of OLED pixel units and a thin film encapsulation layer on the substrate in sequence to obtain an array substrate, and forming a black matrix, a plurality of color resist units and an organic protective layer on the cover plate in sequence to obtain a color film substrate;

[0023] Step 2: providing a circle of sealing glue in the edge area of ​​the color filter substrate or the array substrate;

[0024] Step 3: aligning and laminating the color filter substrate and the array substrate;

[0025] Step 4: curing the frame-sealing adhesive to form a sealing frame;

[0026] Among them, the border area of ​​the array substrate includes a first transition area, an edge defining area, a second transition area and a cutting area from the inside to the outside, the thin film encapsulation layer extends to the border area of ​​the array substrate, and the edge of the thin film encapsulation layer is consistent with the outer edge of the second transition area.

[0027] Optionally, in the method for manufacturing the organic light-emitting display panel, before aligning and bonding the color filter substrate and the array substrate, and after forming the array substrate and the color filter substrate, the method further includes: applying a filling glue in the display area of ​​the color filter substrate or the array substrate; and

[0028] While the frame sealing glue is being cured to form a sealing frame, the filling glue is being cured to form a sealing layer.

[0029] Optionally, in the manufacturing method of the organic light-emitting display panel, the coating position of the frame-sealing glue corresponds to the second transition zone of the array substrate, or the coating position of the frame-sealing glue corresponds to the second transition zone and the edge defining zone of the array substrate, or the coating position of the frame-sealing glue corresponds to the second transition zone, the edge defining zone and the first transition zone of the array substrate, or the frame-sealing glue is made of a transparent material, and the coating position of the frame-sealing glue corresponds to the second transition zone, the edge defining zone, the first transition zone and a part of the display area of ​​the array substrate.

[0030] Optionally, in the method for manufacturing the organic light-emitting display panel, the frame region of the array substrate further includes a sealing frame region, and the sealing frame region is located between the second transition region and the cutting region;

[0031] The coating position of the frame sealing glue corresponds to the sealing frame area.

[0032] Accordingly, the present invention provides another method for manufacturing an organic light emitting display panel, the method for manufacturing an organic light emitting display panel comprising:

[0033] Step 1: providing a substrate and a cover plate respectively, forming a TFT array, a plurality of OLED pixel units and a thin film encapsulation layer on the substrate in sequence to obtain an array substrate, and forming a black matrix, a plurality of color resist units and an organic protective layer on the cover plate in sequence to obtain a color film substrate;

[0034] Step 2: applying a filling glue in the display area of ​​the color filter substrate or the array substrate;

[0035] Step 3: aligning and laminating the color filter substrate and the array substrate;

[0036] Step 4: curing the filling glue to form a sealing layer;

[0037] Among them, the border area of ​​the array substrate includes a first transition area, an edge defining area, a second transition area and a cutting area from the inside to the outside, the thin film encapsulation layer extends to the border area of ​​the array substrate, and the edge of the thin film encapsulation layer is consistent with the outer edge of the second transition area.

[0038] Optionally, in the method for manufacturing the organic light-emitting display panel, before aligning and bonding the color filter substrate and the array substrate, and after forming the array substrate and the color filter substrate, the method further includes: applying a sealing glue on an edge region of the color filter substrate or the array substrate; and

[0039] While the frame sealing glue is being cured to form a sealing layer, the filling glue is being cured to form a sealing frame.

[0040] Optionally, in the manufacturing method of the organic light-emitting display panel, the coating position of the frame-sealing glue corresponds to the second transition zone of the array substrate, or the coating position of the frame-sealing glue corresponds to the second transition zone and the edge defining zone of the array substrate, or the coating position of the frame-sealing glue corresponds to the second transition zone, the edge defining zone and the first transition zone of the array substrate, or the frame-sealing glue is made of a transparent material, and the coating position of the frame-sealing glue corresponds to the second transition zone, the edge defining zone, the first transition zone and a part of the display area of ​​the array substrate.

[0041] Optionally, in the method for manufacturing the organic light-emitting display panel, the frame region of the array substrate further includes a sealing frame region, and the sealing frame region is located between the second transition region and the cutting region;

[0042] The coating position of the frame sealing glue corresponds to the sealing frame area.

[0043] Accordingly, the present invention provides an organic light emitting display device, which includes the organic light emitting display panel as described above.

[0044] In the organic light-emitting display panel, its manufacturing method and organic light-emitting display device provided by the present invention, by respectively arranging a sealing frame and / or a sealing layer between the array substrate and the color film substrate, not only the packaging effect of the array substrate and the color film substrate can be improved, but also it is conducive to achieving a narrow frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0046] Figure 1 A cross-sectional view of an organic light emitting display panel according to a first embodiment of the present invention is shown;

[0047] Figure 2 A cross-sectional view of the edge of an organic light emitting display panel according to the first embodiment of the present invention is shown;

[0048] Figure 3 A top view of an array substrate according to a first embodiment of the present invention is shown;

[0049] Figure 4 A cross-sectional view of an organic light emitting display panel according to a second embodiment of the present invention is shown;

[0050] Figure 5 A cross-sectional view of the edge of an organic light emitting display panel according to a second embodiment of the present invention is shown;

[0051] Figure 6 A cross-sectional view of an organic light emitting display panel according to a third embodiment of the present invention is shown;

[0052] Figure 7 A cross-sectional view of an organic light emitting display panel and a COP when pressed together according to a third embodiment of the present invention is shown;

[0053] Figure 8 A top view of an array substrate according to a fourth embodiment of the present invention is shown;

[0054] Fig. 9 A cross-sectional view of the edge of an organic light emitting display panel according to a fourth embodiment of the present invention is shown;

[0055] Fig.10 A cross-sectional view showing an edge of an organic light emitting display panel according to another embodiment of the present invention is shown;

[0056] Fig.11 A cross-sectional view showing an edge of an organic light emitting display panel according to another embodiment of the present invention is shown;

[0057] Fig.12 A cross-sectional view showing an edge of an organic light emitting display panel according to another embodiment of the present invention;

[0058] Fig.13 A schematic diagram showing the structure of an organic light emitting display panel in the prior art during the manufacturing process;

[0059] Fig.14 A schematic structural diagram of an organic light emitting display panel during a manufacturing process according to another embodiment of the present invention is shown. DETAILED DESCRIPTION

[0060] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0061] [Example 1]

[0062] Please refer to Figures 1 to 3 , which is a schematic diagram of the structure of an organic light emitting display panel according to Embodiment 1 of the present invention. Figures 1 to 3 As shown, the organic light-emitting display panel 100 includes: an array substrate 10, a color film substrate and a packaging structure; the array substrate 10 and the color film substrate both include a display area AA and a frame area surrounding the display area AA, a plurality of OLED pixel units 12 are arranged in the display area AA of the array substrate 10, a plurality of color resist units 22 are arranged in the display area of ​​the color film substrate, the array substrate 10 and the color film substrate are arranged opposite to each other, and the plurality of OLED pixel units 12 and the plurality of color resist units 22 are arranged one by one; the packaging structure includes a sealing frame 31, the sealing frame 31 is arranged between the array substrate 10 and the color film substrate, and the array substrate 10 and the color film substrate are bonded and fixed by the sealing frame 31; wherein the sealing frame 31 is formed by curing a sealing glue, and the sealing frame 31 is located in the frame area of ​​the array substrate 10 and the color film substrate.

[0063] Specifically, the array substrate 10 includes a substrate 11, a thin film transistor (TFT) array (not shown in the figure), a plurality of OLED pixel units 12 and a thin film encapsulation layer (TFE) 13 which are stacked in sequence. The substrate 11 may be a hard substrate or a flexible substrate, the hard substrate may be transparent glass, and the flexible substrate may be transparent plastic. The TFT array includes a plurality of TFTs arranged in an array, the TFTs include a source / drain (not shown in the figure) and a gate (not shown in the figure), and the TFTs may be any one of an amorphous silicon TFT, a polycrystalline TFT or a metal oxide TFT. The plurality of OLED pixel units 12 include a red pixel unit R, a green pixel unit G and a blue pixel unit B, and the red pixel unit R, the green pixel unit G and the blue pixel unit B are all arranged in an array. The thin film encapsulation layer 13 is a continuous film layer and completely covers the plurality of OLED pixel units 12, and can prevent water vapor and oxygen from entering the interior of the OLED pixel unit 12.

[0064] The color filter substrate includes a cover plate 21, a color filter layer and an organic protective layer (i.e., OC layer) 23 stacked in sequence, the color filter layer includes a plurality of color resist units 22 and a black matrix (not shown in the figure), the plurality of color resist units 22 include a red color resist unit R, a green color resist unit G and a blue color resist unit B, the red color resist unit R, the green color resist unit G and the blue color resist unit B are arranged in an array, the black matrix (also called a light shielding layer or BM layer) is arranged between adjacent color resist units 22, and the organic protective layer 23 covers the black matrix and the color resist units 22. The light transmittance of the black matrix is ​​almost 0, and the light emitted by the OLED pixel unit 12 can only pass through the plurality of color resist units 22.

[0065] The array substrate 10 and the color filter substrate are arranged opposite to each other, and the film layer (including multiple OLED pixel units 12 and thin film encapsulation layer 13) on the substrate 11 and the film layer (multiple color resist units 22 and organic protective layer 23) on the cover plate 21 are both located between the substrate 11 and the cover plate 21. The multiple color resist units 22 of the color filter substrate correspond one-to-one to the multiple OLED pixel units 12 of the array substrate 10. Preferably, the orthographic projection of the color resist unit 22 on the substrate 11 is located within the orthographic projection of the OLED pixel unit 12 on the substrate 11.

[0066] Please refer to Figure 2 and Figure 3 The frame area of ​​the array substrate 10 includes, from the inside to the outside, a first transition area 10a, an edge defining area 10b, a second transition area 10c, a sealing area 10d and a cutting area 10e. The first transition area 10a is located between the display area AA and the edge defining area 10b, and the second transition area 10c is located between the edge defining area 10b and the sealing area 10d. The edge of the thin film encapsulation layer 13 is consistent with the outer edge of the second transition area 10c. An edge defining structure (i.e., Bank) 14 is provided in the edge defining area 10b. The edge defining structure 14 is used to determine the boundary between the display area and the non-display area, that is, the display area can be separated from the non-display area by the edge defining structure 14.

[0067] Among them, the width of the first transition zone 10a is A, the width of the edge defining zone 10b is B, the width of the second transition zone 10c is C, the width of the sealing zone 10d is D, the width of the cutting zone 10e is E, and the overall width D1 of the border area of ​​the array substrate 10 is equal to A+B+C+D+E.

[0068] Please continue to refer to Figures 1 to 3The packaging structure is a sealing frame 31, which is arranged in the sealing frame area 10d and stands on the TFT array. The sealing frame 31 is a fully enclosed frame structure, that is, its frame edges are connected end to end to form a circle. The specific shape of the sealing frame 31 is compatible with the appearance of the organic light-emitting display panel 100.

[0069] In this embodiment, the sealing frame 31 stands on the TFT array. In other embodiments, the sealing frame 31 may also stand on the substrate 11 without the TFT array.

[0070] In this embodiment, the sealing frame 31 is formed by curing a sealing glue (ie, Dam glue). The Dam glue is acrylic or epoxy resin glue, and the Dam glue can be cured by ultraviolet irradiation or by heating.

[0071] Preferably, a plurality of spacers (ie, spacer particles) are provided in the Dam glue, and the plurality of spacer particles are used to maintain the frame thickness of the organic light emitting display panel 100 , so that the frame thickness of the organic light emitting display panel 100 remains uniform.

[0072] Accordingly, the present invention also provides a method for manufacturing an organic light emitting display panel. Figures 1 to 3 , the manufacturing method of the organic light emitting display panel 100 includes:

[0073] Step 1: providing a substrate 11 and a cover plate 21 respectively, sequentially forming a TFT array, a plurality of OLED pixel units 12 and a thin film encapsulation layer 13 on the substrate 11 to obtain an array substrate 10, and sequentially forming a black matrix, a plurality of color resist units 22 and an organic protective layer 23 on the cover plate 21 to obtain a color filter substrate;

[0074] Step 2: a circle of sealing glue is provided in the edge area of ​​the color filter substrate or the array substrate 10;

[0075] Step 3: aligning and laminating the color filter substrate and the array substrate 10;

[0076] Step 4: curing the sealing glue to form a sealing frame 31 , and encapsulating the organic light emitting display panel 100 through the sealing frame 31 .

[0077] Specifically, the array substrate 10 manufactured in step one includes a display area AA and a frame area surrounding the display area AA, the multiple OLED pixel units 12 are located in the display area AA, the thin film encapsulation layer 13 covers the multiple OLED pixel units 12 and extends to the frame area of ​​the array substrate 10, the frame area includes a first transition area 10a, an edge defining area 10b, a second transition area 10c, a sealing area 10d and a cutting area 10e from the inside to the outside, and the edge of the thin film encapsulation layer 13 is consistent with the outer edge of the second transition area 10c.

[0078] In step 2, the coating position of the frame-sealing glue (i.e., DAM glue) is selected according to the specific positions of the color filter substrate and the array substrate 10 in the bonding process. In this embodiment, since the color filter substrate is located below the array substrate 10 during the bonding process, the DAM glue is coated on the color filter substrate, and the coating position corresponds to the frame-sealing area 10d of the array substrate 10. If the color filter substrate is located above the array substrate 10 when the color filter substrate is bonded to the array substrate 10, the DAM glue should be coated on the array substrate 10 and located in the frame-sealing area 10d of its border area.

[0079] In step three, the array substrate 10 and the color filter substrate are arranged opposite to each other, and during lamination, the plurality of OLED pixel units 12 and the plurality of color resist units 22 correspond to each other one by one.

[0080] In step 4, the DAM glue is cured by ultraviolet irradiation or heating. After the DAM glue is cured, a sealing frame 31 is formed, thereby completing the packaging of the organic light emitting display panel 100 .

[0081] After the packaging is completed, cutting is performed along a predetermined cutting line (located at the outer edge of the cutting area 10 e ) to finally obtain the organic light emitting display panel 100 .

[0082] Accordingly, the present invention further provides an organic light emitting display device, and the organic light emitting display device includes the organic light emitting display panel 100 as described above. Please refer to the above for details, which will not be described here.

[0083] In the prior art, the array substrate and the color filter substrate of the organic light emitting display panel are generally fixed and packaged by adhesive, but the packaging reliability is relatively poor, and water and oxygen can easily enter the interior of the OLED device, causing the organic light emitting layer to fail. In this embodiment, the edge of the array substrate 10 and the edge of the color filter substrate are connected by a sealing frame 31 formed by curing Dam glue, so that effective packaging can be achieved, not only without the use of adhesive, but also with a simpler process, higher production efficiency and lower cost.

[0084] [Example 2]

[0085] Please refer to Figures 3 to 5 , which is a schematic diagram of the structure of an organic light emitting display panel according to the second embodiment of the present invention. Figures 3 to 5 As shown, the organic light emitting display panel 200 includes: an array substrate 10, a color film substrate and a packaging structure; the array substrate 10 and the color film substrate both include a display area AA and a frame area surrounding the display area AA, a plurality of OLED pixel units 12 are arranged in the display area AA of the array substrate 10, a plurality of color resist units 22 are arranged in the display area of ​​the color film substrate, the array substrate 10 is arranged opposite to the color film substrate, and the plurality of OLED pixel units 12 and the plurality of color resist units 22 are arranged one by one; the packaging structure The structure includes a sealing frame 31 and a sealing layer 32, and the sealing frame 31 and the sealing layer 32 are both arranged between the array substrate 10 and the color film substrate, and the array substrate 10 and the color film substrate are bonded and fixed by the sealing frame 31 and the sealing layer 32; wherein, the sealing frame 31 is solidified by a sealing glue, and the sealing frame 31 is located in the frame area of ​​the array substrate 10 and the color film substrate, and the sealing layer 32 is solidified by a filling glue, and the sealing layer 32 is located in the display area AA of the array substrate 10 and the color film substrate.

[0086] Specifically, the array substrate 10 is arranged opposite to the color film substrate, and the multiple color resist units 22 of the color film substrate correspond to the multiple OLED pixel units 12 of the array substrate one by one. The packaging structure includes a sealing frame 31 and a sealing layer 32, and the sealing frame 31 and the sealing layer 32 are both arranged between the array substrate 10 and the color film substrate. The sealing frame 31 is arranged in the border area of ​​the array substrate 10 and the color film substrate, and the sealing layer 32 is arranged in the display area AA of the array substrate 10 and the color film substrate.

[0087] like Figure 4 As shown, the sealing layer 32 is filled between the thin film encapsulation layer 13 of the array substrate 10 and the organic protective layer 23 of the color film substrate, and is located within the range defined by the sealing frame 31. Figure 5 As shown, the border area of ​​the array substrate 10 includes a first transition area 10a, an edge defining area 10b, a second transition area 10c, a sealing area 10d and a cutting area 10e. The overall width D2 of the border area of ​​the array substrate 10 is equal to A+B+C+D+E. The sealing frame 31 is arranged in the sealing area 10d and stands on the TFT array.

[0088] In this embodiment, the sealing layer 32 is formed by curing a filling glue (ie, fill glue), and the sealing frame 31 is formed by curing a Dam glue. The Dam glue and the fill glue can be cured by ultraviolet irradiation or by heating.

[0089] In this embodiment, the Dam glue and the fill glue are both acrylic or epoxy resin glue. Preferably, the optical refractive index of the fill glue is between 1.2 and 1.8. Preferably, the Dam glue is provided with a plurality of spacer particles, and the plurality of spacer particles are used to ensure that the overall height of the frame of the organic light-emitting display panel 100 remains uniform.

[0090] The present embodiment is different from the first embodiment in that the packaging structure includes not only a sealing frame 31 but also a sealing layer 32. Thus, the array substrate 10 and the color filter substrate are not only bonded and fixed by the sealing frame 31 but also bonded and fixed together by the sealing layer 32, so that the packaging reliability is higher.

[0091] Accordingly, the present invention also provides a method for manufacturing an organic light emitting display panel. Figures 3 to 5 , the manufacturing method of the organic light emitting display panel 200 includes:

[0092] Step 1: providing a substrate 11 and a cover plate 21 respectively, sequentially forming a TFT array, a plurality of OLED pixel units 12 and a thin film encapsulation layer 13 on the substrate 11 to obtain an array substrate 10, and sequentially forming a black matrix, a plurality of color resist units 22 and an organic protective layer 23 on the cover plate 21 to obtain a color filter substrate;

[0093] Step 2: a circle of sealing glue is provided in the edge area of ​​the color filter substrate or the array substrate 10 , and a filling glue is applied in the display area AA of the color filter substrate or the array substrate 10 to form a sealing layer 32 ;

[0094] Step 3: aligning and laminating the color filter substrate and the array substrate 10;

[0095] Step 4: solidify the sealing glue to form a sealing frame 31 , and encapsulate the organic light emitting display panel 200 through the sealing frame 31 and the sealing layer 32 .

[0096] Specifically, in step 2, the Dam glue and the Fill glue are applied on the organic protective layer 23 of the color filter substrate or on the thin film encapsulation layer 13 of the array substrate 10 according to the positions of the color filter substrate and the array substrate 10 during bonding.

[0097] Accordingly, the present invention further provides an organic light emitting display device, and the organic light emitting display device includes the organic light emitting display panel 200 as described above. Please refer to the above for details, which will not be described here.

[0098] [Example 3]

[0099] Please refer to Figure 3 , Figure 6 and Figure 7 , which is a schematic diagram of the structure of the organic light emitting display panel according to the third embodiment of the present invention. Figure 3 , Figure 6 and Figure 7 As shown, the organic light-emitting display panel 300 includes: an array substrate 10, a color film substrate and a packaging structure; the array substrate 10 and the color film substrate both include a display area AA and a frame area surrounding the display area AA, a plurality of OLED pixel units 12 are arranged in the display area AA of the array substrate 10, a plurality of color resist units 22 are arranged in the display area of ​​the color film substrate, the array substrate 10 and the color film substrate are arranged opposite to each other, and the plurality of OLED pixel units 12 and the plurality of color resist units 22 are arranged one by one; the packaging structure includes a sealing layer 32, the sealing layer 32 is arranged between the array substrate 10 and the color film substrate, and the array substrate 10 and the color film substrate are bonded and fixed by the sealing layer 32; wherein the sealing layer 32 is formed by curing a filling glue, and the sealing layer 32 is located in the display area of ​​the array substrate 10 and the color film substrate.

[0100] Specifically, one side of the sealing layer 32 corresponds to the crimping side of the organic light emitting display panel (towards COF), and a blocking structure 33 is provided on this side. The blocking structure 33 is used to prevent the filling glue from overflowing to the crimping area of ​​the organic light emitting display panel.

[0101] Since the fill glue is prone to overflow before curing, once it overflows to the crimping area, poor crimping will occur. Therefore, a blocking structure 33 needs to be provided on the side of the sealing layer 32 facing the COF to prevent the fill glue from overflowing to the bonding area of ​​the COF (i.e., the crimping area of ​​the organic light-emitting display panel 300).

[0102] The present embodiment is different from the first embodiment in that the packaging structure is not a sealing frame 31 but a sealing layer 32 , and a blocking structure 33 is provided at the edge of the sealing layer 32 , and the blocking structure 33 can prevent the filling glue (ie the sealing layer 32 ) from overflowing.

[0103] The blocking structure 33 can be formed by curing Dam glue, or can be formed by chemical vapor deposition during the process of manufacturing the array substrate 10 or the color filter substrate. The Dam glue and the fill glue are both acrylic or epoxy resin glue. Preferably, the optical refractive index of the fill glue is between 1.2 and 1.8.

[0104] Accordingly, the present invention also provides a method for manufacturing an organic light emitting display panel. Figure 3 , Figure 6 and Figure 7 , the manufacturing method of the organic light emitting display panel 300 includes:

[0105] Step 1: providing a substrate 11 and a cover plate 21 respectively, sequentially forming a TFT array, a plurality of OLED pixel units 12 and a thin film encapsulation layer 13 on the substrate 11 to obtain an array substrate 10, and sequentially forming a black matrix, a plurality of color resist units 22 and an organic protective layer 23 on the cover plate 21 to obtain a color filter substrate;

[0106] Step 2: a blocking structure 33 is provided in the edge region of the color filter substrate or the array substrate 10 , and a filling glue is applied in the display region of the color filter substrate or the array substrate 10 to form a sealing layer 32 ;

[0107] Step three: aligning and bonding the color filter substrate and the array substrate 10 to achieve packaging of the organic light emitting display panel 300 .

[0108] Accordingly, the present invention further provides an organic light emitting display device, and the organic light emitting display device includes the organic light emitting display panel 300 as described above. Please refer to the above for details, which will not be described here.

[0109] [Example 4]

[0110] Please refer to Figure 4 , Figure 8 and Fig. 9 , which is a schematic diagram of the structure of an organic light emitting display panel according to a fourth embodiment of the present invention. Figure 4 , Figure 8 and Fig. 9As shown, the organic light emitting display panel includes: an array substrate 20, a color filter substrate and a packaging structure; the array substrate 20 and the color filter substrate both include a display area AA and a frame area surrounding the display area AA, a plurality of OLED pixel units 12 are arranged in the display area AA of the array substrate 20, a plurality of color resist units 22 are arranged in the display area of ​​the color filter substrate, the array substrate 20 is arranged opposite to the color filter substrate, and the plurality of OLED pixel units 12 and the plurality of color resist units 22 are arranged one by one; the packaging structure The invention comprises a sealing frame 31 and a sealing layer 32, wherein the sealing frame 31 and the sealing layer 32 are both arranged between the array substrate 20 and the color film substrate, and the array substrate 20 and the color film substrate are bonded and fixed by the sealing frame 31 and the sealing layer 32; wherein the sealing frame 31 is formed by curing the sealing glue, and the sealing frame 31 is located in the frame area of ​​the array substrate 20 and the color film substrate, and the sealing layer 32 is formed by curing the filling glue, and the sealing layer 32 is located in the display area AA of the array substrate 20 and the color film substrate.

[0111] Specifically, the border region of the array substrate 20 includes a first transition region 10a, an edge defining region 10b, a second transition region 10c and a cutting region 10e, and the overall width D3 of the border region of the array substrate 20 is equal to A+B+D+E.

[0112] The difference between this embodiment and the second embodiment is that no sealing frame area is provided between the second transition area 10c and the cutting area 10e, and the sealing frame 31 is not provided in the sealing frame area but in the second transition area 10c. Since a thin film encapsulation layer 13 is provided in the second transition area 10c, the sealing frame 31 stands on the thin film encapsulation layer 13 but not on the substrate 11 or the TFT array. In this way, the sealing frame area can be omitted in the frame area of ​​the array substrate 20, thereby achieving the purpose of a narrow frame.

[0113] In the manufacturing process of the organic light emitting display panel provided in this embodiment, the coating position of the frame sealant corresponds to the second transition area 10 c of the array substrate 20 .

[0114] In another embodiment, the sealing frame 31 may also be disposed in the edge defining area 10b and the second transition area 10c to further reduce the overall width of the frame area. Accordingly, during the manufacturing process of the organic light-emitting display panel, the coating position of the sealing glue corresponds to the edge defining area 10b and the second transition area 10c of the array substrate. Fig.10As shown, the border area of ​​the array substrate 20 includes a first transition area 10a, an edge defining area 10b, a second transition area 10c and a cutting area 10e, the sealing frame 31 is arranged in the edge defining area 10b and the second transition area 10c, the sum of the widths of the edge defining area 10b and the second transition area 10c is D, the width of the first transition area 10a is A, the width of the cutting area 10e is E, and the overall width D4 of the border area of ​​the array substrate 20 is equal to A+D+E.

[0115] In another embodiment, the sealing frame 31 may also be disposed in the first transition region 10a, the edge defining region 10b, and the second transition region 10c to further reduce the overall width of the frame region. Accordingly, during the manufacturing process of the organic light-emitting display panel, the coating position of the frame sealant corresponds to the first transition region 10a, the edge defining region 10b, and the second transition region 10c of the array substrate. Fig.11 As shown, the border area of ​​the array substrate 20 includes a first transition area 10a, an edge defining area 10b, a second transition area 10c and a cutting area 10e, and the sealing frame 31 is arranged in the first transition area 10a, the edge defining area 10b and the second transition area 10c. The sum of the widths of the first transition area 10a, the edge defining area 10b and the second transition area 10c is D, the width of the cutting area 10e is E, and the overall width D5 of the border area of ​​the array substrate 20 is equal to D+E.

[0116] In addition, the sealing frame 31 can be made of a transparent material. In this way, the sealing frame 31 can also be arranged in the first transition zone 10a, the second transition zone 10c, the edge defining zone 10b and the middle display area AA, further reducing the overall width of the frame area and reducing the width limit of the sealing frame 31. Correspondingly, in the manufacturing process of the organic light-emitting display panel, the coating position of the sealing frame glue corresponds to the first transition zone 10a, the edge defining zone 10b, the second transition zone 10c and the partial display area AA close to the frame area of ​​the array substrate. In this embodiment, since the Dam glue will be arranged in part of the display area AA, in order not to affect the display effect, the optical refractive index of the Dam glue and the optical refractive index of the fill glue are both between 1.2 and 1.8. In other embodiments, since the Dam glue is arranged in the non-display area, the optical refractive index of the Dam glue is not limited.

[0117] In the above embodiment, since the thin film encapsulation layer 13 extends to the outer edge of the second transition area 10c, the sealing frame 31 stands on the thin film encapsulation layer 13. The frame area of ​​the array substrate 20 can not only omit the sealing frame area, thereby achieving the purpose of a narrow frame, but also the width restriction of the sealing frame 31 is smaller, that is, the width of the sealing frame 31 can be increased to the sum of the widths of the first transition area 10a, the edge defining area 10b and the second transition area 10c of the array substrate 20, or even wider. In this way, not only the process difficulty of manufacturing the sealing frame 31 is reduced, but also the encapsulation effect can be avoided to be affected due to the width being too narrow.

[0118] In the above embodiment, the cutting paths of the organic light emitting display panel are all arranged at the edge of the cutting area 10e. In other embodiments, the cutting paths of the organic light emitting display panel can also be arranged on the sealing frame 31 formed by curing the Dam glue. Fig.12 As shown, a cutting path (indicated by a vertical dotted line in the figure) is provided on the sealing frame 31, and the border width of the organic light-emitting display panel obtained by cutting along the cutting path is further reduced, and the reduced width includes the width E of the cutting area 10e and a part of the width D (i.e., a partial width of the sealing frame 31).

[0119] It should be noted that the position and width of the sealing frame 31 are only examples, not limitations, and those skilled in the art can set the position and width of the sealing frame 31 according to actual needs. In the above embodiment, the sealing frame 31 is located in the second transition zone 10c and its width is consistent with the width of the second transition zone 10c, or is just located in the edge defining zone 10b and the second transition zone 10c and its width is consistent with the sum of the widths of the edge defining zone 10b and the second transition zone 10c, or is just located in the first transition zone 10a, the edge defining zone 10b and the second transition zone 10c and its width is consistent with the sum of the widths of the first transition zone 10a, the edge defining zone 10b and the second transition zone 10c. In other embodiments, when the sealing frame 31 is located in the second transition zone 10c, its width may be inconsistent with the width of the second transition zone 10c; when the sealing frame 31 is located in the edge defining zone 10b and the second transition zone 10c, its width may be inconsistent with the sum of the widths of the edge defining zone 10b and the second transition zone 10c; when the sealing frame 31 is located in the first transition zone 10a, the edge defining zone 10b and the second transition zone 10c, its width may also be inconsistent with the sum of the widths of the first transition zone 10a, the edge defining zone 10b and the second transition zone 10c.

[0120] In other embodiments, the sealing frame 31 may be further expanded outward to increase the distance between the sealing frame 31 and the display area AA, so that the coating position of the Dam glue is away from the display area AA to prevent it from overflowing to the display area AA. The following is an example of manufacturing 6 organic light-emitting display panels on a substrate.

[0121] Please refer to Fig.13 , which is a schematic diagram of the structure of an organic light-emitting display panel in the prior art during the manufacturing process. Fig.13 As shown, in the prior art, the organic light-emitting display panel is generally rectangular, and accordingly, each sealing frame 31 generally has four sides, and the four sides of the sealing frame 31 are all connected to the edges of the display area AA, that is, the coating position of the Dam glue is very close to the edge of the display area AA, and at the corner position G, the Dam glue is at risk of overflowing to the display area AA.

[0122] Please refer to Fig.14 , which is a schematic diagram of the structure of an organic light emitting display panel in a manufacturing process according to another embodiment of the present invention. Fig.14 As shown, the entire pattern of the Dam glue is expanded outward, one side of which is extended and connected to the adjacent frame glue pattern, and the other three sides are expanded outward to the dummy area (the numbers are not shown in the figure), so that the coating position of each Dam glue (including the corner position G) maintains a certain distance from the corresponding display area AA, thereby reducing the risk of the Dam glue overflowing to the display area AA.

[0123] Preferably, no spacer particles are provided on one side of the sealing frame 31 corresponding to the crimping side T or the size of the spacer particles is smaller than that of the other three sides. For example, the size of the spacer particles on the other three sides of the sealing frame 31 is 10-17 μm, and the size of the spacer ball on the side corresponding to the crimping side T is 1-5 μm smaller than that of the other three sides.

[0124] In this embodiment, since only the sealing layer 32 is used to achieve encapsulation, the degree of freedom of the cutting position is better, and the cutting position can be selected according to the actual needs of the narrow frame design. Fig.12 , the cutting road AB of the organic light emitting display panel may be arranged at the edge of the thin film encapsulation layer (TFE).

[0125] Correspondingly, the present invention further provides an organic light emitting display device, wherein the organic light emitting display device comprises the organic light emitting display panel as described above. Please refer to the above for details, which will not be described in detail here.

[0126] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0127] The above drawings are only schematic illustrations of the organic light-emitting display panel provided by the present invention. For the sake of clarity, the shapes and numbers of components in the above drawings are simplified and some components are omitted. Those skilled in the art may make changes according to actual needs. These changes are within the scope of protection of the present invention and will not be described in detail here.

[0128] In summary, the organic light-emitting display panel, its manufacturing method and organic light-emitting display device provided by the present invention can not only improve the packaging effect of the array substrate and the color film substrate, but also help to achieve a narrow frame by respectively setting a sealing frame and / or a sealing layer between the array substrate and the color film substrate.

[0129] The above content is a further detailed description of the present application in combination with specific preferred implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. An organic light emitting display panel, characterized in that: include: Array substrate, color film substrate and packaging structure; The array substrate and the color film substrate both include a display area and a frame area surrounding the display area, a plurality of OLED pixel units are arranged in the display area of ​​the array substrate, a plurality of color resist units are arranged in the display area of ​​the color film substrate, the array substrate and the color film substrate are arranged opposite to each other, and the plurality of OLED pixel units and the plurality of color resist units are arranged one by one, the frame area of ​​the array substrate includes a first transition area, an edge defining area, a second transition area and a cutting area in sequence from the inside to the outside, a thin film encapsulation layer is arranged on the plurality of OLED pixel units, the thin film encapsulation layer extends to the frame area of ​​the array substrate, and an edge of the thin film encapsulation layer is consistent with an outer edge of the second transition area; The packaging structure includes a sealing frame and / or a sealing layer, wherein the sealing frame and the sealing layer are both arranged between the array substrate and the color film substrate, and the array substrate and the color film substrate are bonded and fixed via the sealing frame and / or the sealing layer; The sealing frame is formed by curing a sealing glue, and the sealing frame is located in the frame area of ​​the array substrate and the color film substrate. The sealing layer is formed by curing a filling glue, and the sealing layer is located in the display area of ​​the array substrate and the color film substrate. The frame area of ​​the array substrate further includes a sealing frame area, and the sealing frame area is located between the second transition area and the cutting area. The sealing frame is arranged in the sealing frame area. One side of the sealing layer corresponds to the pressing side of the organic light emitting display panel, and a blocking structure is provided on the side, and the blocking structure is located at the edge of the filling glue and is used to prevent the filling glue from overflowing to the pressing area of ​​the organic light emitting display panel; A plurality of gaskets are arranged in the frame sealing glue, and the plurality of gaskets are used to maintain the frame thickness of the organic light-emitting display panel; the sealing frame has four sides, one of which corresponds to the crimping side of the organic light-emitting display panel, and the other three sides are all provided with a plurality of gaskets, and the side corresponding to the crimping side of the organic light-emitting display panel is not provided with a gasket, or the size of the provided gasket is smaller than that of the other three sides.

2. The organic light emitting display panel according to claim 1, wherein: The sealing frame is disposed in the second transition area and is located on the thin film encapsulation layer.

3. The organic light emitting display panel according to claim 1, wherein: The sealing frame is disposed in the second transition area and the edge defining area and is located on the thin film encapsulation layer.

4. The organic light emitting display panel according to claim 1, wherein: The sealing frame is disposed in the second transition region, the edge defining region and the first transition region, and is located on the thin film encapsulation layer.

5. The organic light emitting display panel according to claim 4, wherein: The sealing frame is made of a transparent material, and is disposed in the second transition area, the edge defining area, the first transition area, and a portion of the display area, and is located on the thin film encapsulation layer.

6. A method for manufacturing an organic light emitting display panel, characterized in that: include: Step 1: providing a substrate and a cover plate respectively, forming a TFT array, a plurality of OLED pixel units and a thin film encapsulation layer on the substrate in sequence to obtain an array substrate, and forming a black matrix, a plurality of color resist units and an organic protective layer on the cover plate in sequence to obtain a color film substrate; Step 2: providing a circle of sealing glue in the edge area of ​​the color filter substrate or the array substrate; Step 3: aligning and laminating the color filter substrate and the array substrate; Step 4: curing the frame-sealing adhesive to form a sealing frame; Before aligning and bonding the color filter substrate and the array substrate, or after forming the array substrate and the color filter substrate, the method further includes: coating a filling glue in a display area of ​​the color filter substrate or the array substrate; and While curing the frame sealing glue to form a sealing frame, curing the filling glue to form a sealing layer; Among them, the border area of ​​the array substrate includes a first transition area, an edge defining area, a second transition area and a cutting area from the inside to the outside, the thin film encapsulation layer extends to the border area of ​​the array substrate, and the edge of the thin film encapsulation layer is consistent with the outer edge of the second transition area, and a plurality of pads are arranged in the frame sealant, and the plurality of pads are used to maintain the border thickness of the organic light-emitting display panel; the sealing frame has four sides, one of which corresponds to the crimping side of the organic light-emitting display panel, and the other three sides are all provided with a plurality of pads, and the side corresponding to the crimping side of the organic light-emitting display panel is not provided with a pad, or the size of the provided pad is smaller than that of the other three sides.

7. The method for manufacturing an organic light emitting display panel according to claim 6, wherein: The coating position of the frame-sealing glue corresponds to the second transition zone of the array substrate, or the coating position of the frame-sealing glue corresponds to the second transition zone and the edge defining zone of the array substrate, or the coating position of the frame-sealing glue corresponds to the second transition zone, the edge defining zone and the first transition zone of the array substrate, or the frame-sealing glue is made of transparent material, and the coating position of the frame-sealing glue corresponds to the second transition zone, the edge defining zone, the first transition zone and part of the display area of ​​the array substrate.

8. The method for manufacturing an organic light emitting display panel according to claim 6, wherein: The border region of the array substrate further includes a sealing frame area, and the sealing frame area is located between the second transition area and the cutting area; The coating position of the frame sealing glue corresponds to the sealing frame area.

9. A method for manufacturing an organic light emitting display panel, characterized in that: include: Step 1: providing a substrate and a cover plate respectively, forming a TFT array, a plurality of OLED pixel units and a thin film encapsulation layer on the substrate in sequence to obtain an array substrate, and forming a black matrix, a plurality of color resist units and an organic protective layer on the cover plate in sequence to obtain a color film substrate; Step 2: applying a filling glue in the display area of ​​the color filter substrate or the array substrate; Step 3: aligning and laminating the color filter substrate and the array substrate; Step 4: curing the filling glue to form a sealing layer; Before aligning and bonding the color filter substrate and the array substrate, and after forming the array substrate and the color filter substrate, the method further includes: applying a sealing glue on the edge area of ​​the color filter substrate or the array substrate; and While the frame sealing glue is being cured to form a sealing layer, the filling glue is being cured to form a sealing frame. Among them, the border area of ​​the array substrate includes a first transition area, an edge defining area, a second transition area and a cutting area from the inside to the outside, the thin film encapsulation layer extends to the border area of ​​the array substrate, and the edge of the thin film encapsulation layer is consistent with the outer edge of the second transition area, and a plurality of pads are arranged in the frame sealant, and the plurality of pads are used to maintain the border thickness of the organic light-emitting display panel; the sealing frame has four sides, one of which corresponds to the crimping side of the organic light-emitting display panel, and the other three sides are all provided with a plurality of pads, and the side corresponding to the crimping side of the organic light-emitting display panel is not provided with a pad, or the size of the provided pad is smaller than that of the other three sides.

10. The method for manufacturing an organic light emitting display panel according to claim 9, wherein: The coating position of the frame-sealing glue corresponds to the second transition zone of the array substrate, or the coating position of the frame-sealing glue corresponds to the second transition zone and the edge defining zone of the array substrate, or the coating position of the frame-sealing glue corresponds to the second transition zone, the edge defining zone and the first transition zone of the array substrate, or the frame-sealing glue is made of transparent material, and the coating position of the frame-sealing glue corresponds to the second transition zone, the edge defining zone, the first transition zone and part of the display area of ​​the array substrate.

11. The method for manufacturing an organic light emitting display panel according to claim 9, wherein: The border region of the array substrate further includes a sealing frame area, and the sealing frame area is located between the second transition area and the cutting area; The coating position of the frame sealing glue corresponds to the sealing frame area.

12. An organic light emitting display device, characterized in that: include: An organic light emitting display panel as claimed in any one of claims 1 to 5.

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