Gas detection mobile device casing

Abstract

A device body has a vent, at least one connection port, and a receiving chamber, the vent being connected to the receiving chamber; at least one gas detection module is assembled in the receiving chamber of the device body; a drive control board is assembled in the receiving chamber of the device body, and the gas detection module is positioned on it and electrically connected thereto, while the drive control board is connected to a mobile device through the connection port of the device body; a microprocessor is positioned on the drive control board and electrically connected thereto, and can detect and start operation by controlling the drive signal of the gas detection module, convert the detection data of the gas detection module into detection data for storage and external transmission, and can transmit the data to the mobile device and to an external device.

Description

Technical Field

[0001] This case relates to a housing for a mobile device with gas detection capabilities, and more particularly to a thin, portable housing for a mobile device with gas detection capabilities. Background Technology

[0002] Modern people are paying increasing attention to the quality of the air in their surroundings. Gases such as carbon monoxide, carbon dioxide, volatile organic compounds (VOCs), PM2.5, nitrogen monoxide, and sulfur monoxide, as well as particulate matter within these gases, can all affect human health when exposed to the environment, and in severe cases, even endanger life. Therefore, the quality of environmental air quality has become a major concern for countries worldwide, and the urgent need to learn how to detect and avoid these pollutants is a pressing issue.

[0003] Using a gas sensor to detect ambient gases is a viable way to determine the quality of gases. If the sensor can provide real-time detection information and alert people in the environment, they can take immediate precautions or escape to avoid exposure to gases that could harm their health. Using a gas sensor to detect the surrounding environment is an excellent application.

[0004] However, portable devices are mobile devices that modern people carry with them when they go out. Therefore, embedding gas detection modules into the casing of mobile devices and combining them with mobile devices to form portable devices for detecting gases in the surrounding environment is highly valued. In particular, the current development trend of portable devices is to be lightweight and thin. How to make gas detection modules thin and integrate them into the casing of portable devices is an important research topic in this case. Summary of the Invention

[0005] The main objective of this case is to provide a housing for a mobile device with gas detection capabilities. By embedding a gas detection module within the housing, the gas detection module can detect the air quality in the user's surrounding environment at any time and transmit the air quality information to the mobile device in real time, thereby obtaining gas detection information and a notification warning. Alternatively, it can transmit the information to an external device via communication to generate gas detection information and a notification warning.

[0006] A broad embodiment of this case is a housing of a mobile device with gas detection, comprising: a device body having a vent, at least one connection port, and a receiving chamber, the vent communicating with the receiving chamber for introducing gas into the receiving chamber; at least one gas detection module, assembled in the receiving chamber of the device body, for introducing gas into the interior for detecting the particle size and concentration of suspended particles in the gas, and outputting detection data; and a drive control board, assembled in the receiving chamber of the device body, wherein the gas detection module is fixed... A drive control board is electrically connected to the drive control board, and the drive control board is connected to a mobile device through the connection port of the device body to provide the power required by the drive control board; a microprocessor is electrically connected to the drive control board and can detect and start the operation by controlling the drive signal of the gas detection module, convert the detection data of the gas detection module into detection data for storage and external transmission, and can transmit the detection data to the mobile device for processing and application, and transmit the detection data to an external device for storage. Attached Figure Description

[0007] Figure 1A This is a schematic diagram of the exterior of the casing of the gas detection mobile device in this case.

[0008] Figure 1B This is a cross-sectional schematic diagram of the casing of the gas detection mobile device in this case.

[0009] Figure 2A This is a three-dimensional schematic diagram of the appearance of the gas detection module in this case.

[0010] Figure 2B This is a three-dimensional schematic diagram of the gas detection module in this case from another angle.

[0011] Figure 2C This is an exploded three-dimensional diagram of the gas detection module in this case.

[0012] Figure 3A This is a three-dimensional schematic diagram of the base of this project.

[0013] Figure 3B This is a three-dimensional schematic diagram of the base of this case from another angle.

[0014] Figure 4 This is a three-dimensional schematic diagram of the base housing the laser assembly and particle sensor in this case.

[0015] Figure 5A This is an exploded three-dimensional schematic diagram of the piezoelectric actuator and its base in this case.

[0016] Figure 5B This is a three-dimensional schematic diagram of the piezoelectric actuator and its base in this case.

[0017] Figure 6AThis is an exploded three-dimensional schematic diagram of the piezoelectric actuator in this case.

[0018] Figure 6B This is an exploded three-dimensional schematic diagram of the piezoelectric actuator in this case from another angle.

[0019] Figure 7A This is a cross-sectional schematic diagram of the piezoelectric actuator integrated into the air guide assembly bearing area in this case.

[0020] Figure 7B and Figure 7C for Figure 7A The diagram shows the operation of the piezoelectric actuator in this case.

[0021] Figures 8A to 8C This is a schematic diagram of the gas path in the gas detection module.

[0022] Figure 9 This is a schematic diagram of the beam path emitted by the laser component in this case.

[0023] Figure 10A This is a cross-sectional schematic diagram of the microelectromechanical pump in this case.

[0024] Figure 10B This is an exploded view of the microelectromechanical pump in this case.

[0025] Figures 11A to 11C A schematic diagram illustrating the operation of a microelectromechanical pump.

[0026] Figure 12 This is a block diagram showing the configuration relationship between the drive control board and related components of the gas detection mobile device housing in this case.

[0027] Explanation of reference numerals in the attached figures

[0028] 100: Device body

[0029] 100a: Vent

[0030] 100b: Connection port

[0031] 100c: Receptacle chamber

[0032] 10: Gas detection module

[0033] 20: Drive control board

[0034] 30: Microprocessor

[0035] 30a: Communicator

[0036] 40: Mobile Devices

[0037] 50: External devices

[0038] 1: Base

[0039] 11: First Surface

[0040] 12: Second Surface

[0041] 13: Laser Setting Area

[0042] 14: Intake Groove

[0043] 14a: Air intake

[0044] 14b: Light-transmitting window

[0045] 15: Air guide assembly bearing area

[0046] 15a: Vent

[0047] 15b: Positioning notch

[0048] 16: Vent groove

[0049] 16a: Air outlet

[0050] 16b: First interval

[0051] 16c: Second interval

[0052] 17: Light Trap Zone

[0053] 17a: Light trap structure

[0054] 2: Piezoelectric actuator

[0055] 21: Jet nozzle plate

[0056] 210: Suspension tablets

[0057] 211: Hollow cavity

[0058] 212: Connector

[0059] 213: Gap

[0060] 22: Cavity Frame

[0061] 23: Actuator

[0062] 231: Piezoelectric carrier plate

[0063] 2311: Piezoelectric pin

[0064] 232: Adjust the resonant plate

[0065] 233: Piezoelectric plate

[0066] 24: Insulation Frame

[0067] 25: Conductive framework

[0068] 251: Conductive pin

[0069] 252: Conductive electrode

[0070] 26: Resonance Chamber

[0071] 27: Airflow chamber

[0072] 2a: Microelectromechanical pump

[0073] 21a: First substrate

[0074] 211a: Inlet hole

[0075] 212a: First surface

[0076] 213a: Second surface

[0077] 22a: First oxide layer

[0078] 221a: Combination Channel

[0079] 222a: Manifold Chamber

[0080] 23a: Second substrate

[0081] 231a: Silicon wafer layer

[0082] 2311a: Actuator

[0083] 2312a: Peripheral part

[0084] 2313a: Connecting part

[0085] 2314a: Fluid Channel

[0086] 232a: Second oxide layer

[0087] 2321a: Vibration chamber

[0088] 233a: Silicon layer

[0089] 2331a: Perforation

[0090] 2332a: Vibrating part

[0091] 2333a: Fixing part

[0092] 2334a: Third surface

[0093] 2335a: Fourth surface

[0094] 24a: Piezoelectric component

[0095] 241a: Lower electrode layer

[0096] 242a: Piezoelectric layer

[0097] 243a: Insulation layer

[0098] 244a: Upper electrode layer

[0099] 3: Driver circuit board

[0100] 4: Laser Components

[0101] 5: Particle sensor

[0102] 6: Outer cover

[0103] 61: Side panel

[0104] 61a: Air intake frame

[0105] 61b: Air vent

[0106] 7a: First volatile organic compound sensor

[0107] 7b: Second volatile organic compound sensor

[0108] D: Light trap distance

[0109] H: Thickness

[0110] L: Length

[0111] W: Width Detailed Implementation

[0112] Some typical embodiments that embody the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different forms, all of which do not depart from the scope of this invention, and the descriptions and illustrations herein are for illustrative purposes only and not intended to limit this invention.

[0113] Please see Figure 1A , Figure 1B Figure 2 and Figure 12This invention provides a housing for a mobile device with gas detection, comprising a device body 100, a gas detection module 10, a drive control board 20, and a microprocessor 30. The device body 100 has a vent 100a, at least one connection port 100b, and a receiving chamber 100c. The vent 100a connects to the receiving chamber 100c to allow gas to be introduced into the receiving chamber 100c. The connection port 100b serves as a communication connection for a mobile device 40. The drive control board 20 is connected to the mobile device 40 via the connection port 100b, allowing the mobile device 40 to provide the power required by the drive control board 20. At least one gas detection module 10 is disposed in the receiving chamber 100c of the device body 100 to introduce gas into the interior for detecting the particle size and concentration of suspended particles in the gas and outputting detection data. Multiple gas detection modules 10 can also be assembled in the accommodating chamber 100c of the device body 100 to detect the particle size and concentration of suspended particles in the gas. A drive control board 20 is assembled in the accommodating chamber 100c of the device body 100, and the gas detection modules 10 are positioned on the drive control board 20 and electrically connected to it. A microprocessor 30 is positioned on the drive control board 20 and electrically connected to it, and can detect and start operation by controlling the drive signal of the gas detection modules 10, convert the detection data of the gas detection modules 10 into detection data for storage, and can transmit the detection data to a mobile device 40 for processing and application, and can also transmit the detection data to an external device 50 for storage via communication, prompting the external device 50 to generate gas detection information and a notification warning. The aforementioned external device 50 can be a cloud system, a portable device, a computer system, etc.; or, the device body 100 can be connected to the mobile device 40 via the connection port 100b, and transmit power to the mobile device 40 to provide power, and transmit the detection data output by the microprocessor 30 to the mobile device 40 for processing and application, providing the user of the mobile device 40 with gas detection information and notification warnings, and the mobile device 40 can transmit the detection data to the external device 50 for storage via communication, causing the external device 50 to generate gas detection information and a notification warning. The communication transmission can be through wired communication transmission or through wireless communication transmission, such as: Wi-Fi transmission, Bluetooth transmission, radio frequency identification transmission, near field communication transmission, etc.

[0114] Please continue reading. Figures 2A to 2CAs shown, this invention provides a gas detection module 10, comprising a base 1, a piezoelectric actuator 2, a drive circuit board 3, a laser assembly 4, a particle sensor 5, and an outer cover 6. The drive circuit board 3 is attached to the second surface 12 of the base 1. The laser assembly 4 is disposed on and electrically connected to the drive circuit board 3. The particle sensor 5 is also disposed on and electrically connected to the drive circuit board 3. The outer cover 6 covers the base 1 and is attached to the first surface 11 of the base 1. The outer cover 6 has a side plate 61, which has an air inlet 61a and an air outlet 61b.

[0115] Please review Figure 3A and Figure 3B As shown, the base 1 has a first surface 11, a second surface 12, a laser setting area 13, an air inlet groove 14, an air guide component support area 15, and an air outlet groove 16. The first surface 11 and the second surface 12 are two surfaces arranged opposite to each other. The laser setting area 13 is formed by hollowing out from the first surface 11 toward the second surface 12. The air inlet groove 14 is recessed from the second surface 12 and is adjacent to the laser setting area 13. The air inlet groove 14 has an air inlet 14a that communicates with the outside of the base 1 and corresponds to the air inlet frame 61a of the outer cover 6, and a light-transmitting window 14b that passes through both side walls and communicates with the laser setting area 13. Therefore, the first surface 11 of the base 1 is covered by the outer cover 6, and the second surface 12 is covered by the drive circuit board 3, so that the air inlet groove 14 defines an air intake path.

[0116] The air guide assembly bearing area 15 is formed by a recess in the second surface 12 and is connected to the air intake groove 14, and has a vent hole 15a through the bottom surface. The venting groove 16 is provided with an vent 16a, which is correspondingly provided with the vent frame opening 61b of the outer cover 6. The venting groove 16 includes a first interval 16b formed by the recess of the first surface 11 corresponding to the vertical projection area of ​​the air guide component support area 15, and an area extending from the vertical projection area of ​​the non-air guide component support area 15, and a second interval 16c formed by hollowing out from the first surface 11 to the second surface 12. The first interval 16b and the second interval 16c are connected to form a step, and the first interval 16b of the venting groove 16 communicates with the vent hole 15a of the air guide component support area 15, and the second interval 16c of the venting groove 16 communicates with the vent 16a. Therefore, when the first surface 11 of the base 1 is covered by the outer cover 6 and the second surface 12 is covered by the drive circuit board 3, the venting groove 16 defines an venting path.

[0117] Figure 4This is a schematic diagram of the base housing the laser assembly 4 and the particle sensor 5. Both the laser assembly 4 and the particle sensor 5 are mounted on the drive circuit board 3 and located within the base 1. To clearly illustrate the positions of the laser assembly 4 and the particle sensor 5 relative to the base 1, the drive circuit board 3 is deliberately omitted in Figure 3. Please review. Figure 4 and Figure 2C The laser component 4 is housed in the laser setting area 13 of the base 1, and the particle sensor 5 is housed in the air intake groove 14 of the base 1 and aligned with the laser component 4. In addition, the laser component 4 corresponds to the light transmission window 14b, through which the laser light emitted by the laser component 4 passes, so that the laser light irradiates the air intake groove 14. The path of the beam emitted by the laser component 4 passes through the light transmission window 14b and forms an orthogonal direction with the air intake groove 14.

[0118] The laser component 4 emits a projected beam that enters the air intake groove 14 through the light-transmitting window 14b, irradiating the suspended particles contained in the gas within the air intake groove 14. When the beam comes into contact with the suspended particles, it scatters and generates projected light spots. The particle sensor 5 receives the projected light spots generated by the scattering and performs calculations to obtain relevant information about the particle size and concentration of the suspended particles contained in the gas. The particle sensor 5 is a PM2.5 sensor.

[0119] Please see Figure 5A and Figure 5B The piezoelectric actuator 2 is housed in the air guide assembly support area 15 of the base 1. The air guide assembly support area 15 is square, with a positioning notch 15b at each of its four corners. The piezoelectric actuator 2 is positioned in the air guide assembly support area 15 through the four positioning notches 15b. In addition, the air guide assembly support area 15 is connected to the air inlet groove 14. When the piezoelectric actuator 2 is actuated, it draws gas from the air inlet groove 14 into the piezoelectric actuator 2 and passes the gas through the vent hole 15a of the air guide assembly support area 15 into the air outlet groove 16.

[0120] Please review Figure 6A and Figure 6BThe piezoelectric actuator 2 includes an air jet plate 21, a cavity frame 22, an actuator 23, an insulating frame 24, and a conductive frame 25. The air jet plate 21 is made of a flexible material and has a suspension plate 210, a hollow hole 211, and multiple connectors 212. The suspension plate 210 is a bendable and vibrating sheet structure, the shape and size of which roughly correspond to the inner edge of the air guide assembly bearing area 15, but is not limited thereto; the shape of the suspension plate 210 can also be square, circular, elliptical, triangular, or polygonal. The hollow hole 211 penetrates the center of the suspension plate 210 to allow gas flow. In this embodiment, there are four connectors 212. Their number and type mainly correspond to the positioning notches 15b of the air guide assembly support area 15. Each connector 212 and its corresponding positioning notch 15b form a snap-fit ​​structure to engage and fix each other, so that the piezoelectric actuator 2 can be placed in the air guide assembly support area 15. The cavity frame 22 is stacked on the jet nozzle plate 21, and its shape corresponds to the jet nozzle plate 21. The actuator 23 is stacked on the cavity frame 22, and defines a resonant cavity 26 between the cavity frame 22 and the suspension plate 210. The insulating frame 24 is stacked on the actuator 23, and its appearance is similar to that of the cavity frame 22. The conductive frame 25 is stacked on the insulating frame 24, and its appearance is similar to that of the insulating frame 24. The conductive frame 25 has a conductive pin 251 and a conductive electrode 252. The conductive pin 251 extends outward from the outer edge of the conductive frame 25, and the conductive electrode 252 extends inward from the inner edge of the conductive frame 25. Furthermore, the actuator 23 further includes a piezoelectric carrier plate 231, an adjusting resonance plate 232, and a piezoelectric plate 233. The piezoelectric carrier plate 231 is supported and stacked on the cavity frame 22, the adjusting resonance plate 232 is supported and stacked on the piezoelectric carrier plate 231, and the piezoelectric plate 233 is supported and stacked on the adjusting resonance plate 232. The adjusting resonance plate 232 and the piezoelectric plate 233 are housed within the insulating frame 24 and are electrically connected to the piezoelectric plate 233 by the conductive electrode 252 of the conductive frame 25. The piezoelectric carrier plate 231 and the adjusting resonance plate 232 are both made of conductive materials. The piezoelectric carrier plate 231 has a piezoelectric pin 2311, which is connected to the conductive pin 251. The drive circuit (not shown) on the drive circuit board 3 receives drive signals (drive frequency and drive voltage). The drive signal forms a loop through the piezoelectric pin 2311, piezoelectric carrier plate 231, adjustment resonant plate 232, piezoelectric plate 233, conductive electrode 252, conductive frame 25, and conductive pin 251. The insulating frame 24 isolates the conductive frame 25 from the actuator 23 to prevent short circuits, allowing the drive signal to be transmitted to the piezoelectric plate 233. After receiving the drive signal (drive frequency and drive voltage), the piezoelectric plate 233 deforms due to the piezoelectric effect, further driving the piezoelectric carrier plate 231 and adjustment resonant plate 232 to produce reciprocating bending vibrations.

[0121] As described above, the resonant plate 232 is located between the piezoelectric plate 233 and the piezoelectric carrier plate 231, serving as a buffer between the two, and can adjust the vibration frequency of the piezoelectric carrier plate 231. Basically, the thickness of the resonant plate 232 is greater than the thickness of the piezoelectric carrier plate 231, and the thickness of the resonant plate 232 is variable, thereby adjusting the vibration frequency of the actuator 23.

[0122] Please also refer to Figure 6A , Figure 6B and Figure 7A Multiple connectors 212 define multiple gaps 213 between the inner edge of the suspension plate 210 and the air guide assembly bearing area 15 to allow gas flow. Please refer to [the relevant documentation / reference]. Figure 7A The jet nozzle 21, cavity frame 22, actuator 23, insulating frame 24, and conductive frame 25 are stacked sequentially and disposed in the gas guiding assembly support area 15. A gas flow chamber 27 is formed between the jet nozzle 21 and the bottom surface (not shown) of the gas guiding assembly support area 15. The gas flow chamber 27 is connected to the resonant chamber 26 between the actuator 23, cavity frame 22, and suspension plate 210 through the hollow hole 211 of the jet nozzle 21. By controlling the vibration frequency of the gas in the resonant chamber 26 to be close to the vibration frequency of the suspension plate 210, the resonant chamber 26 and the suspension plate 210 can generate a Helmholtz resonance effect, thereby improving the gas transmission efficiency.

[0123] Figure 7B and Figure 7C for Figure 7A Please review the schematic diagram of the piezoelectric actuator operation first. Figure 7B As shown, when the piezoelectric plate 233 moves away from the bottom surface of the air guide assembly bearing area 15, it drives the suspension plate 210 of the jet nozzle plate 21 to move away from the bottom surface of the air guide assembly bearing area 15, causing the volume of the airflow chamber 27 to expand rapidly. The internal pressure drops, creating a negative pressure that attracts gas from outside the piezoelectric actuator 2 through multiple gaps 213 and into the resonant chamber 26 via the hollow holes 211, increasing the air pressure inside the resonant chamber 26 and generating a pressure gradient. For example... Figure 7C As shown, when the piezoelectric plate 233 drives the suspension plate 210 of the jet nozzle 21 to move towards the bottom surface of the guide gas assembly bearing area 15, the gas in the resonant chamber 26 flows out rapidly through the hollow hole 211, compressing the gas in the airflow chamber 27, and causing the converged gas to be ejected rapidly and in large quantities in an ideal gas state close to Bernoulli's law. According to the principle of inertia, the internal air pressure of the resonant chamber 26 after exhaust is lower than the equilibrium air pressure, which will guide the gas to re-enter the resonant chamber 26. Therefore, through repeated... Figure 7B and Figure 7CAfter the action, the piezoelectric plate 233 reciprocates and vibrates, and the vibration frequency of the gas in the resonant chamber 26 is controlled to be close to the vibration frequency of the piezoelectric plate 233, so as to generate the Helmholtz resonance effect and realize the high-speed and large-volume transmission of gas.

[0124] Please see Figures 8A to 8C , Figures 8A to 8C This is a schematic diagram of the gas path for the gas detection module. First, review... Figure 8A All gas enters through the air inlet 61a of the outer cover 6, passes through the air inlet 14a into the air inlet groove 14 of the base 1, and flows to the position of the particulate sensor 5. Figure 8B As shown, the piezoelectric actuator 2 continuously drives the intake gas, facilitating rapid and stable flow of external gas. Above the particle sensor 5, the laser assembly 4 emits a projection beam that enters the intake groove 14 through the light-transmitting window 14b, illuminating the suspended particles in the gas passing above the particle sensor 5. When the beam contacts the suspended particles, it scatters and generates projection points. The particle sensor 5 receives these projection points and calculates the particle size and concentration of the suspended particles in the gas. Meanwhile, the gas above the particle sensor 5 is continuously driven by the piezoelectric actuator 2 and guided into the vent 15a of the air guide assembly's carrying area 15, entering the first section 16b of the outlet groove 16, and finally... Figure 8C As shown, after the gas enters the first section 16b of the outlet groove 16, the gas will be continuously supplied into the first section 16b by the piezoelectric actuator 2. The gas in the first section 16b will be pushed to the second section 16c, and finally discharged outward through the outlet 16a and the outlet frame 61b.

[0125] like Figure 9 As shown, the base 1 further includes a light trap area 17, which is formed by hollowing out from the first surface 11 to the second surface 12 and corresponds to the laser setting area 13. The light trap area 17 allows the light beam emitted by the laser component 4 to be projected into it through the light transmission window 14b. The light trap area 17 is provided with a cone-shaped light trap structure 17a, which corresponds to the path of the light beam emitted by the laser component 4. In addition, the light trap structure 17a causes the projected light beam emitted by the laser component 4 to be reflected into the light trap area 17 through the cone-shaped structure, avoiding the light beam from being reflected to the position of the particle sensor 5. The position of the projected light beam received by the light trap structure 17a and the light transmission window 14b are maintained at a light trap distance D. This light trap distance D must be greater than 3mm. When the light trap distance D is less than 3mm, the projected light beam reflected on the light trap structure 17a will be directly reflected back to the position of the particle sensor 5 due to too much stray light, causing distortion of the detection accuracy.

[0126] Please continue reviewing. Figure 2Cand Figure 9 The gas detection module 10 of this invention can not only detect particulate matter in the gas, but also further detect the characteristics of the introduced gas. Therefore, the gas detection module 10 of this invention further includes a first volatile organic compound (VOC) sensor 7a, which is positioned on and electrically connected to the drive circuit board 3 and housed in the outlet groove 16 to detect the concentration of VOCs contained in the gas exiting the outlet path. Alternatively, the gas detection module 10 of this invention further includes a second VOC sensor 7b, which is positioned on and electrically connected to the drive circuit board 3. The second VOC sensor 7b is housed in the light trap area 17 and detects the concentration of VOCs in the gas that enters the light trap area 17 through the inlet path of the inlet groove 14 and through the light-transmitting window 14b.

[0127] As described above, the gas detection module 10 of this invention features a structural design with a properly configured laser setting area 13, an air inlet groove 14, an air guide component support area 15, and an air outlet groove 16 on the base 1. Combined with the sealing design of the outer cover 6 and the drive circuit board 3, the outer cover 6 covers the first surface 11 of the base 1, and the drive circuit board 3 covers the second surface 12. This allows the air inlet groove 14 to define an air inlet path, and the air outlet groove 16 to define an air outlet path, forming a single-layer air guide channel. This reduces the overall height of the gas detection module 10, resulting in a length L between 10mm and 35mm, a width W between 10mm and 35mm, and a thickness H between 1mm and 6.5mm, making it convenient for users to carry and detect the concentration of surrounding particles. Furthermore, another embodiment of the piezoelectric actuator 2 in this invention can be a microelectromechanical pump 2a.

[0128] Please see Figure 10A and Figure 10B The microelectromechanical pump 2a includes a first substrate 21a, a first oxide layer 22a, a second substrate 23a, and a piezoelectric component 24a.

[0129] The first substrate 21a is a silicon wafer with a thickness between 150 and 400 micrometers (μm). The first substrate 21a has a plurality of inflow holes 211a, a first surface 212a, and a second surface 213a. In this embodiment, the number of the plurality of inflow holes 211a is four, but not limited to this. Each inflow hole 211a extends from the second surface 213a to the first surface 212a. In order to improve the inflow effect, the inflow hole 211a is tapered from the second surface 213a to the first surface 212a.

[0130] The aforementioned first oxide layer 22a is a silicon dioxide (SiO2) thin film with a thickness between 10 and 20 micrometers (μm). The first oxide layer 22a is stacked on the first surface 212a of the first substrate 21a. The first oxide layer 22a has multiple confluence channels 221a and a confluence chamber 222a. The number and position of the confluence channels 221a correspond to the inflow holes 211a of the first substrate 21a. In this embodiment, the number of confluence channels 221a is also four. One end of each of the four confluence channels 221a is connected to one of the four inflow holes 211a of the first substrate 21a, and the other end of each confluence channel 221a is connected to the confluence chamber 222a. After the gas enters through the inflow holes 211a, it converges into the confluence chamber 222a through the corresponding confluence channels 221a.

[0131] The aforementioned second substrate 23a is a silicon-on-insulator (SOI) wafer, comprising: a silicon wafer layer 231a, a second oxide layer 232a, and a silicon material layer 233a; the thickness of the silicon wafer layer 231a is between 10 and 20 micrometers (μm), and it has an actuating portion 2311a, an outer peripheral portion 2312a, multiple connecting portions 2313a, and multiple fluid channels 2314a. The actuating portion 2311a is circular; the outer peripheral portion 2312a is hollow and ring-shaped, surrounding the periphery of the actuating portion 2311a; the multiple connecting portions 2313a are respectively located between the actuating portion 2311a and the outer peripheral portion 2312a, connecting the two and providing elastic support. The multiple fluid channels 2314a are formed around the periphery of the actuating portion 2311a and are respectively located between the multiple connecting portions 2313a.

[0132] The aforementioned second oxide layer 232a is a silicon monoxide layer with a thickness between 0.5 and 2 micrometers (μm). It is formed on the silicon wafer layer 231a in a hollow ring shape and defines a vibration chamber 2321a with the silicon wafer layer 231a. The silicon material layer 233a is circular, stacked on the second oxide layer 232a and bonded to the first oxide layer 22a. The silicon material layer 233a is a silicon dioxide (SiO2) thin film with a thickness between 2 and 5 micrometers (μm) and has a through hole 2331a, a vibration part 2332a, a fixing part 2333a, a third surface 2334a, and a fourth surface 2335a. A perforation 2331a is formed at the center of the silicon layer 233a. The vibration part 2332a is located in the peripheral area of ​​the perforation 2331a and is perpendicular to the vibration chamber 2321a. The fixing part 2333a is in the peripheral area of ​​the silicon layer 233a and is fixed to the second oxide layer 232a by the fixing part 2333a. The third surface 2334a is bonded to the second oxide layer 232a, and the fourth surface 2335a is bonded to the first oxide layer 22a. The piezoelectric component 24a is stacked on the actuation part 2311a of the silicon wafer layer 231a.

[0133] The aforementioned piezoelectric component 24a includes a lower electrode layer 241a, a piezoelectric layer 242a, an insulating layer 243a, and an upper electrode layer 244a. The lower electrode layer 241a is stacked on the actuation portion 2311a of the silicon wafer layer 231a, while the piezoelectric layer 242a is stacked on the lower electrode layer 241a. The two are electrically connected through their contact area. Furthermore, the width of the piezoelectric layer 242a is smaller than the width of the lower electrode layer 241a, so that the piezoelectric layer 242a cannot completely cover the lower electrode layer 241a. An insulating layer 243a is stacked on a portion of the piezoelectric layer 242a and the portion of the lower electrode layer 241a not covered by the piezoelectric layer 242a. Finally, an upper electrode layer 244a is stacked on the remaining surfaces of the insulating layer 243a and the piezoelectric layer 242a not covered by the insulating layer 243a, allowing the upper electrode layer 244a to make contact with the piezoelectric layer 242a for electrical connection. At the same time, the insulating layer 243a is used to block the upper electrode layer 244a and the lower electrode layer 241a, preventing them from making direct contact and causing a short circuit.

[0134] Please refer to section 11A to... Figure 11C Figures 11A to 11C are schematic diagrams illustrating the operation of the microelectromechanical pump 2a. Please refer to them first. Figure 11A After receiving the driving voltage and driving signal (not shown) transmitted by the driving circuit board 3, the lower electrode layer 241a and upper electrode layer 244a of the piezoelectric component 24a conduct them to the piezoelectric layer 242a. Upon receiving the driving voltage and driving signal, the piezoelectric layer 242a begins to deform due to the inverse piezoelectric effect, causing the actuator 2311a of the silicon wafer layer 231a to begin to displace. When the piezoelectric component 24a causes the actuator 2311a to move upward and increase the distance between it and the second oxide layer 232a, the volume of the vibration chamber 2321a of the second oxide layer 232a will increase, creating a negative pressure inside the vibration chamber 2321a, and drawing the gas from the confluence chamber 222a of the first oxide layer 22a into it through the perforation 2331a. Please continue reading. Figure 11B When the actuator 2311a is pulled upward by the piezoelectric component 24a, the vibrating part 2332a of the silicon layer 233a will also be moved upward due to the resonance principle. When the vibrating part 2332a moves upward, it will compress the space of the vibration chamber 2321a and push the gas in the vibration chamber 2321a to move towards the fluid channel 2314a of the silicon wafer layer 231a, allowing the gas to be discharged upward through the fluid channel 2314a. While the vibrating part 2332a moves upward to compress the vibration chamber 2321a, the volume of the manifold 222a increases due to the displacement of the vibrating part 2332a, creating a negative pressure inside. This draws in the gas outside the microelectromechanical pump 2a through the inlet hole 211a, and finally... Figure 11CAs shown, when the piezoelectric component 24a drives the actuator 2311a of the silicon wafer layer 231a to move downward, it pushes the gas in the vibration chamber 2321a into the fluid channel 2314a and discharges the gas. The vibration part 2332a of the silicon layer 233a is also driven downward by the actuator 2311a, and the gas in the compressed manifold 222a moves into the vibration chamber 2321a through the perforation 2331a. When the piezoelectric component 24a drives the actuator 2311a to move upward, the volume of the vibration chamber 2321a will increase significantly, and thus there will be a higher suction force to draw the gas into the vibration chamber 2321a. The above actions are repeated, so that the piezoelectric component 24a continuously drives the actuator 2311a to move up and down, thereby causing the vibration part 2332a to move up and down in conjunction. By changing the internal pressure of the microelectromechanical pump 2a, it continuously draws in and discharges gas, thereby completing the operation of the microelectromechanical pump 2a.

[0135] Of course, in order to be embedded in the housing of a mobile device, the piezoelectric actuator 2 of this invention can be replaced by the structure of the microelectromechanical pump 2a, so that the overall size of the gas detection module 10 is further reduced, resulting in the length L and width W of the gas detection module 10 being reduced to between 2mm and 4mm, and the thickness H being between 1mm and 3.5mm, implementing a current thin 5mm thickness, so that users can detect the surrounding air quality in real time.

[0136] In summary, the mobile device housing with gas detection provided in this case has a gas detection module embedded in the device body. The gas detection module can detect the air quality in the user's surrounding environment at any time and transmit the air quality information to the mobile device in real time to obtain gas detection information and a notification warning, or transmit it to an external device through communication to generate gas detection information and a notification warning.

[0137] This case can be modified in various ways by those who are familiar with this technology, but all of them are still subject to the protection sought by the attached patent application.

Claims

1. A housing for a mobile device with gas detection, characterized in that, Include: A device body has a vent, at least one connection port and a receiving chamber, the vent being connected to the receiving chamber for introducing gas into the receiving chamber; At least one gas detection module is assembled in the receiving chamber of the device body to introduce gas into the interior for detecting the particle size and concentration of suspended particles in the gas and outputting detection data; the gas detection module includes: A base, having: The first surface; A second surface, relative to the first surface; A laser setting area is formed by hollowing out from the first surface toward the second surface; An air inlet groove is formed by a recess in the second surface and is adjacent to the laser setting area. The air inlet groove is provided with an air inlet that connects to the outside of the base, and a light-transmitting window that passes through both side walls and connects to the laser setting area. An air guide component bearing area is recessed from the second surface and connects to the air inlet groove, and has a vent hole extending through its bottom surface; and An air outlet groove is formed by recessing from the first surface to the bottom surface of the air guide component support area, and hollowing out from the first surface toward the second surface in the area of ​​the first surface that does not correspond to the air guide component support area. It communicates with the air hole and has an air outlet that connects to the outside of the base. A piezoelectric actuator is housed in the air guide assembly bearing area; A drive circuit board is covered and attached to the second surface of the base; A laser component is positioned on the drive circuit board and electrically connected to it, and is correspondingly housed in the laser setting area. The path of the emitted beam passes through the light-transmitting window and forms an orthogonal direction with the air inlet groove. A particle sensor is positioned on the drive circuit board and electrically connected thereto, and is housed at a position perpendicular to the path of the beam projected by the laser component, so as to detect particles that pass through the air inlet groove and are irradiated by the path of the beam projected by the laser component. as well as An outer cover covers the first surface of the base and has a side plate. The side plate is provided with an air inlet frame and an air outlet frame respectively corresponding to the positions of the air inlet and the air outlet of the base. The base has an outer cover covering the first surface and a drive circuit board covering the second surface, so that the air inlet groove defines an air inlet path and the air outlet groove defines an air outlet path. This allows the piezoelectric actuator to accelerate and guide external gas from the air inlet frame into the air inlet path defined by the air inlet groove. The gas then passes through the particle sensor to detect the particle concentration in the gas. The gas is then guided by the piezoelectric actuator and discharged through the vent into the air outlet path defined by the air outlet groove, and finally discharged from the air outlet frame. A drive control board is assembled in the accommodating chamber of the device body, and the gas detection module is positioned on it and electrically connected to it. The drive control board is connected to a mobile device through the connection port of the device body to provide the power required by the drive control board. A microprocessor is positioned on the drive control board and electrically connected to it. It can detect and start the operation of the gas detection module by controlling the drive signal of the gas detection module, convert the detection data of the gas detection module into detection data, store it and transmit it to the external device for processing, and transmit it to an external device for storage.

2. The housing of the mobile device with gas detection as described in claim 1, characterized in that, The connection port of the device body is connected to the mobile device to transmit the detection data output by the microprocessor to the mobile device for processing and application.

3. The housing of the mobile device with gas detection as described in claim 1, characterized in that, The microprocessor includes a communicator for receiving the detection data output by the microprocessor and transmitting it to an external device for storage, thereby enabling the external device to generate gas detection information and a notification alert.

4. The housing of the mobile device with gas detection as described in claim 1, characterized in that, The mobile device transmits the detection data to an external device via communication for storage, causing the external device to generate gas detection information and a notification alert.

5. The housing of the mobile device with gas detection as described in claim 1, characterized in that, The air guide assembly has a positioning notch at each of the four corners of its bearing area, which allows the piezoelectric actuator to be embedded and positioned.

6. The housing of the mobile device with gas detection as described in claim 1, characterized in that, The base further includes a light trapping area, which is formed by hollowing out from the first surface toward the second surface and corresponding to the laser setting area. The light trapping area is provided with a light trapping structure with an oblique conical surface and is set to correspond to the beam path.

7. The housing of the mobile device with gas detection as described in claim 6, characterized in that, The position of the projected light source received by the light trap structure is maintained at a light trap distance from the light-transmitting window.

8. The housing of the mobile device with gas detection as described in claim 7, characterized in that, The light trap has a distance greater than 3mm.

9. The housing of the mobile device with gas detection as described in claim 1, characterized in that, This particulate sensor is a PM2.5 sensor.

10. The housing of the mobile device with gas detection as described in claim 1, characterized in that, The piezoelectric actuator includes: An air jet plate includes multiple connectors, a suspension plate, and a hollow hole. The suspension plate is flexible and vibrating. The multiple connectors are adjacent to the periphery of the suspension plate, and the hollow hole is formed at the center of the suspension plate. The suspension plate passes through the... Multiple connectors are fixedly installed, and the multiple connectors provide elastic support for the suspension plate. An airflow chamber is formed between the bottoms of the jet nozzles, and at least one gap is formed between the multiple connectors and the suspension plate. A cavity frame supports the suspended plate; A uniformly moving body, supported and stacked on the cavity frame, is subjected to voltage to generate reciprocating bending vibration; An insulating frame is supported and stacked on the actuator; as well as A conductive frame is stacked on the insulating frame; The actuator, the cavity frame, and the suspension plate form a resonant chamber. By driving the actuator to cause the jet orifice plate to resonate, the suspension plate of the jet orifice plate will reciprocate and vibrate, so that the gas enters the airflow chamber through the gap and is then discharged, thereby realizing the transmission and flow of the gas.

11. The housing of the mobile device with gas detection as described in claim 10, characterized in that, The actuator includes: A piezoelectric carrier plate is stacked on the cavity frame; One resonant plate is adjusted and placed on the piezoelectric carrier plate; as well as A piezoelectric plate is supported and stacked on the adjusting resonant plate to receive voltage and drive the piezoelectric plate and the adjusting resonant plate to produce reciprocating bending vibrations.

12. The housing of the mobile device with gas detection as described in claim 1, characterized in that, The gas detection module further includes a first volatile organic compound sensor, which is electrically connected to the drive circuit board and housed in the gas outlet groove to detect the gas exiting the gas outlet path.

13. The housing of the mobile device with gas detection as described in claim 6, characterized in that, The gas detection module further includes a second volatile organic compound sensor, which is electrically connected to the drive circuit board and housed in the light trap area to detect the gas that passes through the air intake path of the air intake groove and through the light-transmitting window and is introduced into the light trap area.

14. The housing of the mobile device with gas detection as described in claim 1, characterized in that, The housing of the mobile device with gas detection, wherein the gas detection module has a length between 2mm and 4mm, a width between 2mm and 4mm, and a thickness between 1mm and 3.5mm.

15. The housing of the mobile device with gas detection as described in claim 14, characterized in that, This piezoelectric actuator is a microelectromechanical pump, comprising: A first substrate having a plurality of inflow holes, the plurality of inflow holes being tapered; A first oxide layer is stacked on the first substrate. The first oxide layer has multiple confluence channels and a confluence chamber. The multiple confluence channels are connected between the confluence chamber and the multiple inflow holes. A second substrate, bonded to the first substrate, comprising: A silicon wafer layer having: The moving part is circular; An outer peripheral portion, in the form of a hollow ring, surrounds the periphery of the actuating part; Multiple connecting parts are respectively connected between the actuating part and the outer peripheral part; and Multiple fluid channels surround the actuating part and are located between the multiple connecting parts; a second oxide layer is formed on the silicon wafer layer in a hollow ring shape and defines a vibration chamber with the silicon wafer layer; and A silicon layer, circular in shape, is located in the second oxide layer and bonded to the first oxide layer, having: A perforation is formed at the center of the silicon layer; A vibrating part is located in the surrounding area of ​​the perforation; A fixing part is located in the peripheral area of ​​the silicon material layer; and A piezoelectric component, in the shape of a circle, is stacked on the actuation portion of the silicon wafer layer.

16. The housing of the mobile device with gas detection as described in claim 15, characterized in that, The piezoelectric component includes: One electrode layer; A piezoelectric layer is stacked on the lower electrode layer; An insulating layer is laid on a portion of the surface of the piezoelectric layer and a portion of the surface of the lower electrode layer; as well as An upper electrode layer is stacked on the insulating layer and the remaining surface of the piezoelectric layer where the insulating layer is not present, for electrical connection with the piezoelectric layer.

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