Display device

Abstract

A display device is disclosed, comprising: a substrate; a first pixel, which is arranged on the substrate and includes at least one first sub-pixel having a first red sub-pixel, a first green sub-pixel and a first blue sub-pixel; a second pixel, which is arranged to be adjacent to the first pixel on the substrate and separated from the first pixel, and includes at least one second sub-pixel having a second red sub-pixel, a second green sub-pixel and a second blue sub-pixel; a through hole, which is located in a region between the first pixel and the second pixel and passes through the substrate, and wherein the second sub-pixel is arranged in a direction rotated relative to the first sub-pixel.

Description

[0001] This application is a divisional application of the invention patent application with application date of December 28, 2015, application number 201511001468.3 and title “Display Device”. Technical Field

[0002] The described technology generally relates to a display device and a method of manufacturing a display device. Background Art

[0003] The use of display devices is being diversified due to their thin profile and light weight. Existing displays are being replaced by portable and thin flat panel displays. Generally, their thin profile and associated manufacturing difficulties raise concerns about the durability of the device. Bending and folding are in high demand, but it is challenging to manufacture display devices that are both flexible and durable. For this reason, enhancing the user experience under these constraints is limited. Summary of the invention

[0004] One inventive aspect relates to a display device and a method of manufacturing the same that enhance user convenience.

[0005] Another aspect is a display device comprising: a substrate; a plurality of pixel units formed on the substrate; a separation region defined on the substrate and formed between two adjacent pixel units among the plurality of pixel units; a through portion formed in the separation region and including an inner surface passing through the substrate; an encapsulation layer formed on the substrate and covering the inner surface of the through portion, wherein organic layers and inorganic layers are alternately formed in the encapsulation layer to seal the plurality of pixel units.

[0006] The inner surface of the through portion may have a slope.

[0007] The inner surface of the through portion may have a step height.

[0008] Each of the plurality of pixel units may include: a pixel electrode formed on a substrate; an intermediate layer including an emission layer formed on the pixel electrode; and an opposite electrode formed to be opposite to the pixel electrode and to cover the intermediate layer.

[0009] An inner surface of the through portion may have a width that becomes narrower in a direction from the counter electrode to the substrate.

[0010] The separation area may include a first separation area and a second separation area, and the first separation area may include an area between two pixel units adjacent to each other in a first direction among the plurality of pixel units. The second separation area may include an area between two pixel units adjacent to each other in a second direction intersecting the first direction among the plurality of pixel units. The through portion may include a first through portion and a second through portion. The first through portion may be formed in the first separation area, and the second through portion may be formed in the second separation area.

[0011] The first through portion may have a shape extending long along the second direction, and the second through portion may have a shape extending long along the first direction.

[0012] The display device may further include one or more wirings electrically connected to the plurality of pixel units, wherein the one or more wirings are formed not to overlap with the through-portion.

[0013] The one or more wirings may extend in one direction and be formed to bend and protrude in the other direction intersecting the one direction along a periphery of the through portion formed in the other direction intersecting the one direction.

[0014] The one or more wirings may include a plurality of wirings, and two wirings adjacent to each other in one direction among the plurality of wirings may be symmetrical about the through portion.

[0015] The substrate may be flexible.

[0016] Another aspect is a method for manufacturing a display device, the method comprising the following steps: providing a substrate including a pixel area and a separation area, wherein a plurality of pixel units are formed in the pixel area, and the separation area is formed between two adjacent pixel units among the plurality of pixel units; forming the plurality of pixel units on the substrate; forming a through portion including a through-portion passing through an inner surface of the substrate in the separation area of ​​the substrate; forming an encapsulation layer covering the inner surface of the through-portion on the substrate, wherein organic layers and inorganic layers are alternately formed in the encapsulation layer to seal the plurality of pixel units.

[0017] The forming step of the through portion may include forming an inner surface of the through portion to have a slope or a step height.

[0018] The step of forming the plurality of pixel units may include: forming a pixel electrode on a substrate; forming an intermediate layer including an emission layer on the pixel electrode; and forming an opposite electrode covering the intermediate layer and facing the pixel electrode.

[0019] The forming step of the through portion may include forming an inner surface of the through portion to be narrowed in a direction from the counter electrode to the substrate.

[0020] The method may further include forming a thin film transistor having a semiconductor layer, a gate electrode, a source electrode, and a drain electrode on a substrate. The step of forming the thin film transistor may include: forming a gate insulating layer between the semiconductor layer and the gate electrode; forming an interlayer insulating layer between the gate electrode and the source electrode and the drain electrode; forming contact holes in the gate insulating layer and the interlayer insulating layer so that the semiconductor layer can be electrically connected to the source electrode and the drain electrode. The step of forming the through-portion may include: forming a first through hole; forming a second through hole; forming a third through hole; forming a fourth through hole. The formation of the contact hole and the formation of the first through hole may be performed simultaneously.

[0021] The method may further include forming a first insulating layer on the thin film transistor, so that an exposed hole in the source electrode and the drain electrode of the thin film transistor is formed in the first insulating layer, wherein the formation of the first insulating layer and the formation of the second through hole may be performed simultaneously.

[0022] The method may further include forming a second insulating layer including an opening exposing a central portion of the pixel electrode on the first insulating layer, wherein the forming of the second insulating layer and the forming of the third through hole may be performed simultaneously.

[0023] The forming of the fourth through hole may include removing a portion of the substrate corresponding to the first through hole to form the fourth through hole.

[0024] The providing step of the substrate may include forming the substrate using a material having flexibility.

[0025] Another aspect is a display device comprising: a substrate including a partition area; a plurality of pixels formed above the substrate, wherein the partition area is formed between adjacent pixels, wherein a plurality of through holes are respectively defined by a plurality of surrounding inner surfaces of the partition area, wherein each inner surface passes through the substrate; and an encapsulation layer formed above the substrate and covering the inner surface of the partition area.

[0026] In the above display device, at least one of the inner surfaces has a slope.

[0027] In the above display device, at least one of the inner surfaces has a step height.

[0028] In the above display device, each pixel includes: a pixel electrode formed above the substrate; an intermediate layer including an emission layer formed above the pixel electrode; and an opposite electrode formed to be opposite to the pixel electrode and at least partially cover the intermediate layer.

[0029] In the above display device, at least one of the inner surfaces has a width greater at a portion adjacent to the counter electrode than at a portion adjacent to the substrate.

[0030] In the above-mentioned display device, the separation area includes a first separation area and a second separation area, wherein the first separation area includes an area between first pixels adjacent to each other in a first direction formed in the pixels, wherein the second separation area includes an area between second pixels adjacent to each other in a second direction intersecting the first direction formed in the pixels, and wherein the through hole includes a first through hole and a second through hole respectively formed in the first separation area and the second separation area.

[0031] In the above display device, the first through hole extends in the second direction, wherein the second through hole extends in the first direction.

[0032] The display device further includes one or more wirings electrically connected to the pixels, wherein the wirings do not overlap with the through holes in a direction intersecting the first direction and the second direction.

[0033] In the above display device, the wiring extends in one of the first direction and the second direction, wherein the wiring protrudes in the other direction to bend around the periphery of the through hole.

[0034] In the above display device, the wiring includes a plurality of wirings, wherein two of the wirings adjacent to each other in one of the first direction and the second direction are substantially symmetrical with respect to the through hole.

[0035] In the above display device, the substrate is flexible.

[0036] Another aspect is a method for manufacturing a display device, the method comprising the following steps: providing a substrate including a pixel area and a partition area; forming a plurality of pixel units in the pixel area, wherein the partition area is located between adjacent pixels; forming a plurality of through holes respectively defined by a plurality of surrounding inner surfaces of the partition area, wherein each inner surface passes through the substrate; and forming an encapsulation layer on the substrate to cover the inner surfaces of the through holes.

[0037] In the above method, the step of forming the through portion includes forming at least one inner surface to have a slope or step shape.

[0038] In the above method, the step of forming a pixel includes: forming a pixel electrode above a substrate; forming an intermediate layer including an emission layer on the pixel electrode; and forming an opposite electrode at least partially covering the intermediate layer and opposite to the pixel electrode.

[0039] In the above method, the forming step of the through hole may include forming at least one inner surface having a width adjacent to the counter electrode greater than a width adjacent to the substrate.

[0040] The above method also includes forming a thin film transistor (TFT) including a semiconductor layer and a gate electrode, a source electrode and a drain electrode above the substrate, wherein the step of forming the TFT includes: forming a gate insulating layer between the semiconductor layer and the gate electrode; forming an interlayer insulating layer between the gate electrode and the source electrode and between the gate electrode and the drain electrode; forming contact holes in the gate insulating layer and the interlayer insulating layer through which the semiconductor layer is electrically connected to the source electrode and the drain electrode, wherein the step of forming the through hole includes continuously forming a first through hole to a fourth through hole, wherein the formation of the contact hole and the formation of the first through hole are performed in parallel.

[0041] The method further includes forming a first insulating layer over the TFT, wherein the first insulating layer includes a hole exposing one of a source electrode and a drain electrode of the TFT, wherein the formation of the first insulating layer and the formation of the second through hole are performed in parallel.

[0042] The method further includes forming a second insulating layer including an opening exposing a central portion of the pixel electrode over the first insulating layer, wherein the forming of the second insulating layer and the forming of the third through hole are performed in parallel.

[0043] In the above method, the step of forming the fourth through hole includes removing a portion of the substrate corresponding to the first through hole.

[0044] In the above method, at least one of the through holes is formed between four adjacent pixels. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 is a plan view schematically illustrating a display device according to an exemplary embodiment.

[0046] Figure 2 It is schematically shown Figure 1 An enlarged plan view of section A.

[0047] Figure 3 It is along Figure 2 A cross-sectional view taken along line III-III.

[0048] FIG. 4A to FIG. 4C It is along Figure 2 A cross-sectional view taken along line VI-VI.

[0049] Figure 5 It is schematically shown Figure 1 An enlarged plan view of section A.

[0050] Figure 6 It is schematically shown Figure 1 An enlarged plan view of section A.

[0051] Figure 7 It is schematically shown Figure 6A plan view of an enlarged portion K.

[0052] Figures 8 to 12 is a cross-sectional view schematically illustrating a process of manufacturing a display device according to an exemplary embodiment. DETAILED DESCRIPTION

[0053] Reference will now be made in detail to the exemplary embodiments, examples of which are shown in the accompanying drawings, wherein like reference numerals represent like elements throughout. In this regard, the exemplary embodiments may have different forms and should not be construed as being limited to the description set forth herein. Therefore, only the exemplary embodiments are described below with reference to the accompanying drawings to explain various aspects of the description.

[0054] The embodiments may be modified in various ways to have various embodiments, and the specific embodiments shown in the drawings will be described in detail in the detailed description. The effects and features of the described technology will become apparent from the following description of the embodiments with reference to the drawings set forth below. However, the described technology may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein.

[0055] Hereinafter, embodiments of the described technology will be described in detail with reference to the accompanying drawings. In addition, in this specification and the accompanying drawings, the same reference numerals always represent the same elements, and thus redundant descriptions are omitted.

[0056] In the following embodiments, the terms "first" and "second" are used to distinguish one element from another element, and these elements should not be limited by these terms. In the following embodiments, unless the context clearly indicates otherwise, the singular forms "a (kind)" and "the (said)" are also intended to include plural forms.

[0057] In the following embodiments, it should also be understood that when the terms "comprising", "having" and / or "including" are used herein, it indicates that the features, integral bodies, steps, operations, elements and / or components described exist, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, components and / or groups thereof. In addition, when an element such as a layer or region is referred to as being "on" another element, this also includes a situation where an element is formed between other elements in addition to a situation where an element is directly formed on another element.

[0058] In the drawings, the sizes of layers and regions are exaggerated or reduced for convenience of illustration. For example, the size and thickness of each element in the drawings are arbitrarily shown for clarity, and therefore, the embodiments of the described technology are not limited thereto.

[0059] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system, but can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0060] When an embodiment can be performed in different ways, the specific process sequence can be performed differently from the described sequence. For example, two consecutively described processes can be performed substantially simultaneously or in an order opposite to the described sequence. In the present disclosure, the term "substantially" includes the following meanings: completely, almost completely, or to any significant extent according to certain applications by a person skilled in the art. In addition, "formed on..." can also mean "formed above...". The term "connected" can include an electrical connection.

[0061] Figure 1 is a plan view schematically illustrating a display device 1 according to an exemplary embodiment. Figure 2 It is schematically shown Figure 1 An enlarged plan view of section A.

[0062] Reference Figure 1 and Figure 2 , the display device 1 includes a substrate 100. A display area DA and a non-display area NDA are defined on the substrate 100. One or more pixel units (also referred to as "pixels") PU and a through-portion or through-hole 400 are formed in the display area DA.

[0063] The substrate 100 may be formed of various materials. The substrate 100 may be formed of glass, metal, organic material or other materials. For example, the substrate 100 is formed of a flexible material. That is, the substrate 100 may be formed of a curved, curved and folded or rolled material. The flexible material forming the substrate 100 may be thin glass, metal or plastic. When the substrate 100 includes plastic, the flexible substrate 100 may be formed of a plastic material such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or polyimide that has good heat resistance and durability and can be bent.

[0064] The substrate 100 may be divided into a display area DA and a non-display area NDA. The display area DA is an area where a plurality of pixel units or a plurality of pixels PU are arranged, and an image may be displayed. The display area DA may include a pixel area where the pixel unit PU is arranged and a separation area between adjacent pixel areas. Each pixel unit PU may include a display device (not shown) to realize visible light.

[0065] The non-display area NDA may be formed adjacent to the display area DA. Figure 1, the non-display area NDA is shown to surround the display area DA. In some embodiments, the non-display area NDA is formed adjacent to one side of the display area DA. In some other embodiments, the non-display area NDA is formed adjacent to two or three sides of the display area DA. In addition, depending on the circumstances, only the display area DA may be formed on the substrate 100. That is, although not shown, in some embodiments, the non-display area NDA is not formed on the substrate 100, and only the display area DA is formed on the substrate 100.

[0066] One or more pixel units PU and the through-portion 400 may be formed in the display area DA. In this case, the separation area BA may be formed between one pixel unit PU and another pixel unit PU adjacent thereto. The through-portion 400 may be formed in the separation area BA. Depending on the situation, the through-portion 400 may be formed to be separated from the pixel unit PU.

[0067] Each pixel unit PU includes a display device which may be an organic light emitting diode (OLED) or a liquid crystal device. This will be described in detail below.

[0068] The through-portions 400 are formed on the substrate 100. That is, each through-portion 400 is formed to include an inner surface that passes through the substrate 100. For example, the through-portion 400 is formed by removing an area of ​​the substrate 100 through a process such as etching. As another example, when the substrate 100 is manufactured, the substrate 100 is formed to include the through-portion 400. The process of forming the through-portion 400 on the substrate 100 can be changed, and the method of manufacturing the through-portion 400 is not limited. Each through-portion 400 may have a shape extending from one pixel unit PU to another pixel unit PU adjacent thereto in the partition area BA.

[0069] Each through portion 400 includes a first through portion 410 and a second through portion 420. The partition area BA includes a first partition area BA1 and a second partition area BA2. The first through portion 410 is formed in the first partition area BA1, and the second through portion 420 is formed in the second partition area BA2. Hereinafter, the through portion 400 will be described in detail.

[0070] The separation area BA includes a first separation area BA1 and a second separation area BA2. It can be understood that the first separation area BA1 is in the first direction (for example, Figure 2 It can be understood that the second separation area BA2 is an area between two pixel units PU adjacent to each other in the second direction (for example, Figure 2 The first direction refers to an area between two pixel units PU adjacent to each other in the Y-axis direction of the pixel unit PU. According to circumstances, the first direction may be substantially perpendicular to the second direction or cross the second direction.

[0071] The first through portion 410 of each through portion 400 may be formed in the first separation area BA1. The first through portion 410 may have a shape extending in a direction (eg, a second direction (Y-axis direction)) crossing the first direction (X-axis direction).

[0072] In some embodiments, the first through portion 410 is formed to pass through the first separation area BA1 , for example, to correspond to a region where a region extending from the first separation area BA1 overlaps a region extending from the second separation area BA2 .

[0073] In addition, in addition to extending in the second direction to the first separation area BA1 between two pixel units PU adjacent to each other in the first direction, the first through-portion 410 can also extend in the second direction to the first separation area BA1 between two adjacent pixel units PU adjacent to each other in the first direction in the second direction.

[0074] Therefore, the first through-hole 410 may correspond to one side of each of two pixel units PU adjacent to each other in the first direction, and may correspond to one side of each of two pixel units PU adjacent to each of the two pixel units PU in the second direction. For example, four pixel units PU are formed around one first through-hole 410.

[0075] For example, Figure 2 As shown in FIG, above the first through-hole 410, two pixel units PU are formed on the left and right sides respectively with the first through-hole 410 placed therebetween to correspond to each other. Below the first through-hole 410, two pixel units PU may be formed on the left and right sides respectively with the first through-hole 410 placed therebetween to correspond to each other.

[0076] The second through-portion 420 of each through-portion 400 may be formed in the second separation area BA2. The second through-portion 420 may extend in a direction (eg, the first direction) crossing the second direction.

[0077] In some embodiments, the second through portion 420 is formed to pass through the second separation area BA2 , for example, to correspond to a region where a region extending from the second separation area BA2 overlaps a region extending from the first separation area BA1 .

[0078] In addition, in addition to extending in the first direction to the second separation area BA2 between two pixel units PU adjacent to each other in the second direction, the second through-portion 420 can also extend in the first direction to the second separation area BA2 between two adjacent pixel units PU adjacent to each other in the second direction in the first direction.

[0079] Therefore, the second through-hole 420 may correspond to one side of each of two pixel units PU adjacent to each other in the second direction, and may correspond to one side of each of two pixel units PU adjacent to each other in the first direction. For example, four pixel units PU are formed with respect to one second through-hole 420.

[0080] like Figure 2 As shown in FIG, on the left side of the second through-hole 420, two pixel units PU are respectively formed at the upper and lower sides relative to the second through-hole 420. On the right side of the second through-hole 420, two pixel units PU may be respectively formed at the upper and lower sides relative to the second through-hole 420.

[0081] The first through-portion 410 and the second through-portion 420 may be separated from each other. Figure 2 In the display device 1 , the through-portions 400 are formed on the substrate 100 , and each of the through-portions 400 includes a plurality of first through-portions 410 and a plurality of second through-portions 420 .

[0082] In addition, the second through-portion 420 may be formed between two adjacent first through-portions 410 among the first through-portions 410. The first through-portion 410 may be formed between two adjacent second through-portions 420.

[0083] Figure 3 It is along Figure 2 A cross-sectional view taken along line III-III. Figure 3 In the embodiment, the display area DA of the display device 1 will be described in detail. As described above, the plurality of display devices formed in the display area DA may be OLEDs or liquid crystal devices. In this embodiment, a display device including an OLED will be described.

[0084] Reference Figure 3 , a thin film transistor TFT and a capacitor CAP are formed on a substrate 100, and an OLED electrically connected to the thin film transistor TFT is formed on the substrate 100. The thin film transistor TFT includes a semiconductor layer 120, a gate electrode 140, a source electrode 160, and a drain electrode 162, and may be formed of amorphous silicon, polycrystalline silicon, or an organic semiconductor material. Hereinafter, a general configuration of the thin film transistor TFT will be described in detail.

[0085] A buffer layer 110 formed of silicon oxide or silicon nitride may be formed on the substrate 100 to planarize the surface of the substrate 100 or prevent impurities from penetrating into the semiconductor layer 120 of the thin film transistor TFT, and the semiconductor layer 120 may be formed on the buffer layer 110 .

[0086] The gate electrode 140 is formed on the semiconductor layer 120. In this case, the source electrode 160 and the drain electrode 162 are electrically connected to each other according to a signal applied to the gate electrode 140. The gate electrode 140 may be formed of a single layer or a multilayer formed of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), in consideration of adhesion with adjacent layers, surface flatness of stacked layers, and processability.

[0087] In this case, a gate insulating layer 130 formed of silicon oxide and / or silicon nitride may be formed between the semiconductor layer 120 and the gate electrode 140 for ensuring dielectric properties between the semiconductor layer 120 and the gate electrode 140 .

[0088] The interlayer insulating layer 150 may be formed on the gate electrode 140 , and may be formed of a single layer or a multilayer having silicon oxide or silicon nitride.

[0089] The source electrode 160 and the drain electrode 162 are formed on the interlayer insulating layer 150. The source electrode 160 and the drain electrode 162 are electrically connected to the semiconductor layer 120 through corresponding contact holes formed in the interlayer insulating layer 150 and the gate insulating layer 130. Considering conductivity, the source electrode 160 and the drain electrode 162 may be formed of a single layer or a multilayer formed of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu).

[0090] Although not shown, a protective layer (not shown) covering the thin film transistor TFT may be formed to protect the thin film transistor TFT having the structure. The protective layer may be formed of, for example, an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride.

[0091] The first insulating layer 170 may be formed on the substrate 100. In this case, the first insulating layer 170 may be a layer that flattens the protective layer. When the OLED is formed on the thin film transistor TFT, the first insulating layer 170 flattens the top of the thin film transistor TFT and protects the thin film transistor TFT and various devices. The first insulating layer 170 may be formed of, for example, an acrylic organic material or benzocyclobutene (BCB). In this case, as Fig.10 As shown in , a buffer layer 110 , a gate insulating layer 130 , an interlayer insulating layer 150 , and a first insulating layer 170 may be formed over a substrate 100 .

[0092] The second insulating layer 180 may be formed on the thin film transistor TFT. In this case, the second insulating layer 180 may be a pixel unit defining layer. The second insulating layer 180 may be formed on the first insulating layer 170 and may have an opening. The second insulating layer 180 defines a pixel area on the substrate 100.

[0093] The second insulating layer 180 may be formed of, for example, an organic insulating layer. The organic insulating layer may be formed of an acrylic polymer such as polymethyl methacrylate (PMMA), polystyrene (PS), a polymer derivative containing a phenol group, an imide polymer, an aromatic ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, or a mixture thereof.

[0094] The OLED 200 may be formed on the second insulating layer 180. The OLED 200 may include a pixel electrode 210, an intermediate layer 220 including an emission layer (EML), and an opposite electrode 230.

[0095] The pixel electrode 210 may be formed as a (semi) transparent electrode or a reflective electrode. When the pixel electrode 210 is formed as a (semi) transparent electrode, the pixel electrode 210 may be made of, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO) or zinc aluminum oxide (AZO). When the pixel electrode 210 is formed as a reflective electrode, the pixel electrode 210 may further include a reflective layer formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a mixture thereof, and a reflective layer formed of ITO, IZO, ZnO, In 2 O 3 , IGO or AZO. However, the present embodiment is not limited thereto. For example, the pixel electrode 210 may be formed of various materials, and the structure of the pixel electrode 210 may be modified in various ways to include a single layer or multiple layers.

[0096] The intermediate layer 220 may be formed in a pixel region defined by the second insulating layer 180. The intermediate layer 220 includes an EML that emits light according to an electrical signal, and in addition to the EML, may include a hole injection layer (HIL) and a hole transport layer (HTL) formed between the EML and the pixel electrode 210, and an electron transport layer (ETL) and an electron injection layer (EIL) formed between the EML and the counter electrode 230. The HIL, HTL, ETL, and EIL may be stacked in a single structure or a composite structure. The intermediate layer 220 is not limited thereto, and may have various structures.

[0097] An opposite electrode 230 covering the intermediate layer 220 including the EML and opposing the pixel electrode 210 may be formed over the substrate 100. The opposite electrode 230 may be formed as a transparent (or semi-transparent) electrode or a reflective electrode.

[0098] When the counter electrode 230 is formed as a (semi) transparent electrode, the counter electrode 230 may include a layer formed of a metal with a small work function (i.e., Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, or a mixture thereof) and a layer formed of ITO, IZO, ZnO, or In 2 O 3 When the counter electrode 230 is formed as a reflective electrode, the counter electrode 230 may include a layer formed of Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, or a mixture thereof. The configuration and material of the counter electrode 230 are not limited thereto and may be modified in various ways.

[0099] Reference Figure 3 , the encapsulation layer 300 is formed on the substrate 100 to cover the OLED 200. Figure 3 Although not shown in the figure, the encapsulation layer 300 may have a multilayer structure in which one or more inorganic layers (not shown) and organic layers (not shown) are stacked. The reason why the encapsulation layer 300 is formed in a multilayer structure is that when the encapsulation layer 300 is formed as only an organic layer or an inorganic layer, oxygen or moisture penetrates into the inside through a fine path formed in the layer and damages the display unit. The pixel unit is cut off from the outside and sealed by the encapsulation layer 300.

[0100] The organic material included in the organic layer includes, for example, acrylic resin, methacrylic resin, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, and / or perylene resin.

[0101] The inorganic material included in the inorganic layer includes, for example, silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and / or silicon oxynitride (SiON).

[0102] FIG. 4A to FIG. 4C It is along Figure 2 A cross-sectional view taken along line VI-VI. FIG. 4A to FIG. 4C , an exemplary embodiment of the structure of the through portion 400 will be described in detail.

[0103] Reference FIG. 4A to FIG. 4C , the through portion 400 is formed in the partition area BA. FIG. 4A to FIG. 4C, a cross-sectional surface of the first through portion 410 formed in the first partition area BA1 is shown, but the second through portion 420 formed in the second partition area BA2 may also have the same structure as that of the first through portion 410 .

[0104] Reference Figure 4A , the through portion 400 is formed to pass through the substrate 100, and includes an inner surface 400a passing through the substrate 100. The inner surface 400a represents a cross-sectional surface formed to pass through the substrate 100 and one or more material layers formed on the substrate 100. In some embodiments, the inner surface 400a of the through portion 400 is formed to be approximately perpendicular to the substrate 100 or substantially perpendicular to the surface of the substrate 100.

[0105] The encapsulation layer 300 in which the organic layer and the inorganic layer are alternately formed may be formed on the OLED and may be formed to cover the inner surface 400a of the through-portion 400. When the encapsulation layer 300 is not formed to cover the inner surface 400a, moisture or impurities may flow into one or more material layers whose cross-sectional surfaces are exposed due to the inner surface 400a and damage various devices or the OLED. Therefore, when the encapsulation layer 300 is sealed to cover the inner surface 400a, the reliability of the display device is enhanced.

[0106] Reference Figure 4B , the inner surface 400a is formed to have a slope. That is, the inner surface 400a may have an inclined surface. The inner surface 400a may have a shape in which the width becomes narrower in the direction from the counter electrode 230 to the substrate 100. That is, the inner surface 400a may have a V-shape with an opening on the substrate 100 side. The slope of the inner surface 400a may be formed to form an acute angle with respect to the substrate 100.

[0107] The inner surface 400a with a slope means that the cross-sectional surface formed through one or more material layers formed on the substrate 100 has a slope. In order to form such an artificial slope, the process of patterning the material layer can use a half-tone mask or a slit mask. However, the method of forming a through hole with a slope in the inner surface 400a is not limited. Therefore, when the encapsulation layer 300 is formed, the encapsulation layer 300 is very easy to cover the inner surface 400a of the through hole.

[0108] Reference Figure 4C, the through portion 400 is formed to pass through the substrate 100, and includes an inner surface 400a passing through the substrate 100. The inner surface 400a represents a cross-sectional surface formed to pass through the substrate 100 and one or more material layers 190 formed on the substrate 100. The one or more material layers 190 include, for example, a buffer layer 110, a gate insulating layer 130, an interlayer insulating layer 150, a first insulating layer 170, and a second insulating layer 180. Therefore, the material layer 190 may include a plurality of end surfaces 110a, 130a, 150a, 170a, and 180a corresponding to the inner surface 400a of the through portion 400.

[0109] In some embodiments, the inner surface 400a is formed in a stepped shape. This means that each of the end surfaces 110a, 130a, 150a, 170a, and 180a of the material layer 190 is formed to have a step height. The inner surface 400a may be formed so as to narrow the width in the direction from the counter electrode 230 to the substrate 100. That is, Figure 4C In the embodiment, the end surfaces 110a, 130a and 150a may be formed to protrude toward the through portion 400, and the end surfaces 170a and 180a may be stacked thereon to have a step height. The end surface 100a of the substrate 100 may be formed to have the same plane as that of the end surfaces 110a, 130a and 150a, or may be formed to protrude further than the end surfaces 110a, 130a and 150a.

[0110] exist Figure 4C In the embodiment, the end surface 110a of the buffer layer 110, the end surface 130a of the gate insulating layer 130, and the end surface 150a of the interlayer insulating layer 150 are formed on substantially the same plane. This is because the buffer layer 110, the gate insulating layer 130, and the interlayer insulating layer 150 are patterned substantially simultaneously or in parallel in the process of forming the contact hole, wherein the contact hole enables the semiconductor layer 120, the source electrode 160, and the drain electrode 162 to be electrically connected to each other. However, the present embodiment is not limited thereto. Depending on the circumstances, each of the end surfaces 110a, 130a, and 150a may be formed to have a step height.

[0111] The encapsulation layer 300 may be formed on the entire substrate 100 to seal the OLED and cover the end surfaces 110a, 130a, 150a, 170a, and 180a. Due to the internal structure of the through hole, the encapsulation layer 300 is very easy to cover the inner surface 400a of the through hole when the encapsulation layer 300 is formed. Therefore, the encapsulation layer 300 is sealed to cover the inner surface 400a, thereby enhancing the reliability of the display device.

[0112] Figure 5 It is schematically shown Figure 1 An enlarged plan view of section A.

[0113] Reference Figure 5 , the display device 1 includes a substrate 100 and one or more wirings SL1 to SL3 , V1 to V3 , and D1 to D3 .

[0114] A display area DA and a non-display area NDA are defined on the substrate 100. One or more pixel units PU and a through-portion 400 are formed in the display area DA.

[0115] The substrate 100 is divided into a display area DA and a non-display area NDA. Details of the positions of the display area DA and the non-display area NDA are the same as those of the above-described exemplary embodiment, and thus, their detailed descriptions are not provided.

[0116] The pixel unit PU and the through-hole 400 are formed in the display area DA. Each pixel unit PU may include a display element (not shown) to emit visible light. This is the same as the above exemplary embodiment, and the above reference numerals may be applied. Figure 3 The structure of the description.

[0117] The through-portion 400 is formed on the substrate 100. The through-portion 400 and the separation area BA are as described in the above exemplary embodiments, and thus, their detailed descriptions are not provided.

[0118] One or more wirings SL1 to SL3 , V1 to V3 , and D1 to D3 are wirings electrically connected to the pixel unit PU, and are formed to be separated from the through-portion 400 without overlapping the through-portion 400 .

[0119] The one or more wirings SL1 to SL3 , V1 to V3 , and D1 to D3 may include one or more first wirings SL1 to SL3 .

[0120] The first wirings SL1 to SL3 are electrically connected to the pixel unit PU. In some embodiments, the first wiring SL1 is electrically connected to the pixel unit PU in the first direction ( Figure 5 The first wiring SL1 is formed to have a bend. That is, the first wiring SL1 may include a region extending in the first direction and a region extending in the second direction ( Figure 5 The region bent in the second direction may refer to a region protruding in the second direction. Therefore, the first wiring SL1 is separated from the first through portion 410 and the second through portion 420.

[0121] In some embodiments, the first wiring SL1 is electrically connected to a plurality of pixel units PU formed below the first wiring SL1 (ie, formed to be adjacent to each other in the first direction) and arranged in a row in the first direction.

[0122] The first wiring SL2 is formed to have a bend. That is, the first wiring SL2 may include a region extending in the first direction and a region bent in the second direction along the periphery of the first through-portion 410. The region bent in the second direction may mean a region protruding in the second direction. Therefore, the first wiring SL2 is separated from the first through-portion 410 and the second through-portion 420.

[0123] In some embodiments, the first wiring SL2 is substantially symmetrical to the first wiring SL1. In some embodiments, the first wiring SL2 is substantially symmetrical to the first wiring SL1 about the second through-portion 420.

[0124] The first wiring SL3 has the same form as that of the first wiring SL1. The first wiring SL3 may be electrically connected to the first wiring SL1 in the first direction ( Figure 5 The first wiring SL3 is formed to have a bend. That is, the first wiring SL3 may include an area extending in the first direction and an area bent in the second direction along the periphery of the first through-portion 410. The area bent in the second direction may mean an area protruding in the second direction. Therefore, the first wiring SL3 is separated from the first through-portion 410 and the second through-portion 420.

[0125] Although not shown, a first wiring (not shown) having the same form as that of the first wiring SL2 may be formed under the first wiring SL3. In addition, the arrangement of the first wirings SL1 to SL3 may be repeated.

[0126] The first wirings SL1 to SL3 transmit various signals to the pixel unit PU. In some embodiments, the first wirings SL1 to SL3 transmit scan signals to the pixel unit PU. As another example, the first wirings SL1 to SL3 are electrically connected to Figure 7 105 of the thin film transistor shown in FIG.

[0127] The wirings SL1 to SL3, V1 to V3, and D1 to D3 may include one or more second wirings V1 to V3. The second wirings V1 to V3 are electrically connected to the pixel unit PU. In some embodiments, the second wiring V1 is electrically connected to the pixel unit PU in the second direction ( Figure 5 A plurality of pixel units PU are arranged in a row in the Y-axis direction (in the Y-axis direction).

[0128] The second wiring V1 is formed to have a bend. That is, the second wiring V1 may include a region extending in the second direction and a region extending in the first direction ( Figure 5 The region bent in the first direction may refer to a region protruding in the first direction. Therefore, the second wiring V1 is separated from the first through portion 410 and the second through portion 420.

[0129] In some embodiments, the second wiring V2 may be electrically connected to a second wiring V1 formed in a lateral direction (eg, right side) (ie, in the second direction ( Figure 5 A plurality of pixel units PU which are adjacent to each other in the Y-axis direction of the pixel and are arranged in a row in the second direction.

[0130] The second wiring V2 is formed to have a bend. That is, the second wiring V2 may include a region extending in the second direction and a region bent in the first direction along the periphery of the first through-portion 410. Figure 5 The region bent in the X-axis direction of the first through-portion 410 (in the X-axis direction) may refer to a region protruding in the first direction. Therefore, the second wiring V2 is separated from the first through-portion 410 and the second through-portion 420.

[0131] In some embodiments, the second wiring V2 may be symmetrical with the second wiring V1 , and in detail, the second wiring V2 may be symmetrical with the second wiring V1 about the first through-portion 410 .

[0132] The second wiring V3 has the same form as that of the second wiring V1. The second wiring V3 may be electrically connected to a plurality of pixel units PU arranged in a row in the second direction. The second wiring V3 is formed to have a bend. That is, the second wiring V3 may include an area extending in the second direction and an area bent in the first direction along the periphery of the second through-portion 420. The area bent in the first direction may represent an area protruding in the first direction. Therefore, the second wiring V3 is separated from the first through-portion 410 and the second through-portion 420.

[0133] Although not shown, a second wiring (not shown) having the same form as that of the second wiring V2 may be formed on the right side of the second wiring V3. In addition, the arrangement of the second wirings V1 to V3 may be repeated.

[0134] The second wirings V1 to V3 may transmit various signals to the pixel unit PU. In some embodiments, the second wirings V1 to V3 may transmit signals for power supply to the pixel unit PU. As another example, the second wirings V1 to V3 may be electrically connected to Figure 6 or Figure 7 The first electrode 131 or the second electrode 132 shown in FIG.

[0135] The one or more wirings SL1 to SL3 , V1 to V3 , and D1 to D3 may include one or more third wirings D1 to D3 .

[0136] One or more third wirings D1 to D3 are electrically connected to the pixel unit PU. In some embodiments, the third wiring D1 may be electrically connected to the pixel unit PU in the second direction ( Figure 5A plurality of pixel units PU are arranged in a row in the Y-axis direction (in the Y-axis direction).

[0137] The third wiring D1 is formed to have a bend. That is, the third wiring D1 may include a region extending in the second direction and a region extending in the first direction ( Figure 5 The region bent in the first direction may refer to a region protruding in the first direction. Therefore, the third wiring D1 is separated from the first through portion 410 and the second through portion 420.

[0138] In some embodiments, the third wiring D1 may be separated from the second wirings V1 to V3. In addition, the second through-portions 420 corresponding to the region of the third wiring D1 bent in the first direction may be different from the second through-portions 420 corresponding to the region of the second wirings V1 to V3 bent in the first direction. For example, the second through-portions 420 are adjacent to each other.

[0139] In some embodiments, the third wiring D2 may be electrically connected to a third wiring D1 formed in a lateral direction (eg, right side) (ie, in the second direction ( Figure 5 A plurality of pixel units PU which are adjacent to each other in the Y-axis direction of the pixel and are arranged in a row in the second direction.

[0140] The third wiring D2 is formed to have a bend. That is, the third wiring D2 may include an area extending in the second direction and an area bent in the first direction along the periphery of the second through-portion 420. The area bent in the first direction may mean an area protruding in the first direction. Therefore, the third wiring D2 is separated from the first through-portion 410 and the second through-portion 420.

[0141] In some embodiments, the third wiring D2 is substantially symmetrical to the third wiring D1. For example, the third wiring D2 is substantially symmetrical to the third wiring D1 about the first through-portion 410.

[0142] In some embodiments, the third wiring D2 is separated from the second wirings V1 to V3. In addition, the second through-portions 420 corresponding to the regions of the third wiring D2 bent in the first direction may be different from the second through-portions 420 corresponding to the regions of the second wirings V1 to V3 bent in the first direction. For example, the second through-portions 420 are adjacent to each other.

[0143] The third wiring D3 has a form substantially the same as that of the third wiring D1. The third wiring D3 may be electrically connected to a plurality of pixel units PU arranged in a row in the second direction. The third wiring D3 is formed to have a bend. That is, the third wiring D3 may include an area extending in the second direction and an area bent in the first direction along the periphery of the second through-portion 420. The area bent in the first direction may represent an area protruding in the first direction. Therefore, the third wiring D3 is separated from the first through-portion 410 and the second through-portion 420.

[0144] In some embodiments, the third wiring D3 is separated from the second wirings V1 to V3. In addition, the second through-portions 420 corresponding to the regions of the third wiring D3 bent in the first direction may be different from the second through-portions 420 corresponding to the regions of the second wirings V1 to V3 bent in the first direction. For example, the second through-portions 420 are adjacent to each other.

[0145] Although not shown, a third wiring (not shown) having substantially the same form as that of the third wiring D2 may be formed on the right side of the third wiring D3. In addition, the arrangement of the third wirings D1 to D3 may be repeated.

[0146] The third wirings D1 to D3 may transmit various signals to the pixel unit PU. In some embodiments, the third wirings D1 to D3 transmit data signals to the pixel unit PU. As another example, the third wirings D1 to D3 are electrically connected to Figure 7 The source electrode 107 or the drain electrode 108 is shown in FIG.

[0147] Although not shown, Figures 3 to 5 One of can be selectively applied to the display device 1.

[0148] In some embodiments, the through portion 400 is formed on the substrate 100. Therefore, the flexibility of the substrate 100 is enhanced, and thus the weight of the substrate 100 is reduced. In addition, when the display device 1 is a curved display device, a flexible display device, or a stretchable display device, the flexibility is enhanced and abnormal deformation is reduced.

[0149] In some embodiments, since the through portion 400 includes a first through portion 410 extending in one direction and a second through portion 420 extending in a direction intersecting the one direction, the flexibility of the substrate 100 is ensured even when the substrate 100 is bent, curved, or rolled in various directions, abnormal deformation of the substrate 100 is prevented, and durability is enhanced. Therefore, when using the display device 1, the convenience of the user is enhanced, and the display device 1 is easily applied to, for example, a wearable device.

[0150] In addition, in some embodiments, the first through-portion 410 may be formed in a long extended form to correspond to two pixel units PU adjacent to each other in one direction and two different pixel units PU adjacent to the two pixel units PU. Therefore, the change in deformation characteristics is mitigated or reduced on the boundary line between the pixel units PU, thereby enhancing the durability of the display device 1. In addition, the first through-portion 410 is easily applied to a display device requiring flexibility, such as a curved display device, a flexible display device, or a stretchable display device.

[0151] In addition, in some embodiments, the second through portion 420 may be formed in a direction crossing the first through portion 410, and may be formed in a long extended form to correspond to two pixel units PU and two different pixel units PU adjacent to the two pixel units PU. Therefore, the change in deformation characteristics is mitigated or reduced on the boundary line between the pixel units PU, thereby enhancing the durability of the display device 1. In addition, the second through portion 420 is easily applied to a display device requiring flexibility, such as a curved display device, a flexible display device, or a stretchable display device.

[0152] In addition, the display device 1 may include one or more wirings SL1 to SL3, V1 to V3, and D1 to D3 electrically connected to the pixel unit PU. In some embodiments, the one or more wirings SL1 to SL3, V1 to V3, and D1 to D3 are formed to be separated from the through-portion 400 without overlapping the through-portion 400. Therefore, the flexibility and durability of the substrate 100 are enhanced due to the through-portion 400. In addition, the wirings SL1 to SL3, V1 to V3, and D1 to D3 can be prevented from being peeled off, contaminated by gases such as external oxygen, and degraded by moisture due to not overlapping the through-portion 400.

[0153] Similar or same kind of wirings (ie, wirings SL1 to SL3 ) may extend in one direction and have a curved shape and may be repeated at a specific period, thereby reducing or preventing unevenness of each pixel unit PU caused by the wirings SL1 to SL3 .

[0154] Furthermore, the wirings V1 to V3 may extend in one direction and have a bent shape and may be repeated at a certain period, and thus, unevenness of each pixel unit PU caused by the wirings V1 to V3 is reduced or prevented.

[0155] In addition, the wirings D1 to D3 may extend in one direction and have a bent shape, and may be repeated at a certain period, and thus, unevenness of each pixel unit PU caused by the wirings D1 to D3 is reduced or prevented.

[0156] Specifically, the wirings V1 to V3 and the wirings D1 to D3 extending in the same direction and electrically connected to the plurality of pixel units PU arranged in the same direction are formed not to overlap each other, thereby minimizing interference therebetween. In addition, the bending regions of the wirings V1 to V3 and the wirings D1 to D3 correspond to different second through-holes 420, thereby preventing the electrical characteristics of the pixel unit PU from being reduced due to interference of the bending portions of the wirings V1 to V3 and the wirings D1 to D3.

[0157] Figure 6 It is schematically shown Figure 1 An enlarged plan view of section A. Figure 7 It is schematically shown Figure 6 A plan view of an enlarged portion K.

[0158] Reference Figure 6 and Figure 7 , the display device 1 includes a substrate 100 and wirings SL1 to SL3 , V1 to V3 , and D1 to D3 .

[0159] A display area DA and a non-display area NDA are defined on the substrate 100. One or more pixel units PU1 to PU3 and a through-portion 400 are formed in the display area DA. Each of the pixel units PU1 to PU3 may include a plurality of sub-pixels SP1 to SP3.

[0160] The substrate 100 is divided into a display area DA and a non-display area NDA. The through-portion 400 is formed on the substrate 100. The substrate 100 and the through-portion 400 are as described in the above exemplary embodiments, and thus, their detailed descriptions are not provided.

[0161] Each of the pixel units PU1 to PU3 may include one or more sub-pixels SP1 to SP3 .

[0162] exist Figure 6 In the figure, three sub-pixels SP1 to SP3 are shown, but the described technology is not limited thereto. One pixel unit PU1 may include two or four or more sub-pixels. In some embodiments, the sub-pixels SP1 to SP3 included in one pixel unit PU1 emit visible light of different colors. For example, the sub-pixels SP1 to SP3 respectively realize red visible light, green visible light, and blue visible light.

[0163] The sub-pixels SP1 to SP3 included in one pixel unit PU1 may be sequentially arranged in one direction (eg, in the direction of Figure 6 In addition, another pixel unit PU2 adjacent to one pixel unit PU1 may include pixels that can be sequentially arranged in a direction intersecting the one direction (for example, Figure 6 Multiple sub-pixels SP1 to SP3 in the Y-axis direction).

[0164] In addition, another pixel unit PU3 adjacent to the pixel unit PU2 may include pixels that can be sequentially arranged in a direction intersecting the one direction (for example, in the direction of Figure 6 In some embodiments, the sub-pixels SP1 to SP3 included in the pixel units PU1 to PU3 are all arranged in one direction (the X-axis direction) or in a direction crossing the one direction (the Y-axis direction).

[0165] The wirings SL1 to SL3, V1 to V3, D1 to D3 may include first wirings SL1 to SL3, second wirings V1 to V3, and third wirings D1 to D3. The first wirings SL1 to SL3, the second wirings V1 to V3, and the third wirings D1 to D3 are electrically connected to the pixel units PU1 to PU3. The arrangement of the first wirings SL1 to SL3, the second wirings V1 to V3, and the third wirings D1 to D3 is substantially the same as that of the above-described exemplary embodiment, and therefore, a detailed description thereof is not provided.

[0166] Will refer to Figure 7 The following description is given. Figure 7 It is shown Figure 6 A magnified portion of K.

[0167] Reference Figure 7 , the first wiring SL1 is electrically connected to the sub-pixels SP1 to SP3 of the pixel unit PU1. The first wiring SL1 may have various forms. In some embodiments, the first wiring SL1 includes a plurality of connection lines SL1c, a common line SL1b, and a body line SL1a, wherein the plurality of connection lines SL1c are respectively connected to the sub-pixels SP1 to SP3 and are formed to be separated from each other, the common line SL1b is commonly connected to the plurality of connection lines SL1c, and the body line SL1a is connected to the common line SL1b and is formed to correspond to the side of one of the sub-pixels SP1 to SP3 (e.g., the sub-pixel SP1).

[0168] The second wiring V1 is electrically connected to the sub-pixels SP1 to SP3. The second wiring V1 may have various forms. In some embodiments, the second wiring V1 includes a plurality of connection lines V1c, a common line V1b, and a body line V1a, wherein the plurality of connection lines V1c are respectively connected to the sub-pixels SP1 to SP3 and are formed to be separated from each other, the common line V1b is commonly connected to the connection lines V1c, and the body line V1a is connected to the common line V1b and is formed to correspond to the side of one of the sub-pixels SP1 to SP3 (e.g., the sub-pixel SP1).

[0169] The third wiring D1 is electrically connected to the sub-pixels SP1 to SP3 of the pixel unit PU1. The third wiring D1 may have various forms. In some embodiments, the third wiring D1 includes a plurality of connection lines D1c, a common line D1b, and a body line D1a, wherein the plurality of connection lines D1c are respectively connected to the sub-pixels SP1 to SP3 and are formed to be separated from each other, the common line D1b is commonly connected to the plurality of connection lines D1c, and the body line D1a is connected to the common line D1b and is formed to correspond to the side of one of the sub-pixels SP1 to SP3 (e.g., the sub-pixel SP3).

[0170] In the display device 1, the through portion 400 may be formed on the substrate 100. Therefore, the flexibility of the substrate 100 is enhanced, thereby reducing the weight of the substrate 100.

[0171] In addition, the separation area BA between the pixel units PU1 to PU3 is formed on the substrate 100, so when the substrate 100 is deformed, that is, when the substrate 100 is bent, curved or rolled, the substrate 100 is easily deformed near the pixel units PU1 to PU3, and the stress caused by the deformation is easily reduced or prevented. That is, when the display device 1 is applied as a curved display device, a flexible display device or a stretchable display device, the flexibility is enhanced and abnormal deformation is reduced.

[0172] In some embodiments, since the through-portion 400 includes a first through-portion 410 extending in one direction and a second through-portion 420 extending in a direction intersecting the one direction, the flexibility of the substrate 100 is ensured even when the substrate 100 is bent, curved, or rolled in various directions, abnormal deformation of the substrate 100 is prevented, and durability is enhanced. Therefore, when using the display device 1, the convenience of the user is enhanced, and the display device 1 can be easily applied to a wearable device.

[0173] Furthermore, in some embodiments, the second through-portions 420 are formed between two adjacent first through-portions 410 among the first through-portions 410 , and thus cracks can be prevented from occurring in the length direction of the first through-portions 410 of the substrate 100 because the first through-portions 410 extend in one direction.

[0174] In addition, the first through-portions 410 are formed between two adjacent second through-portions 420 among the second through-portions 420 , and thus cracks are prevented from occurring in the length direction of the second through-portions 420 of the substrate 100 since the second through-portions 420 extend in one direction.

[0175] In addition, each of the pixel units PU1 to PU3 includes sub-pixels SP1 to SP3 arranged in one direction. The direction along which the sub-pixels SP1 to SP3 of the pixel unit PU1 are arranged intersects with the direction along which a plurality of sub-pixels SP1 to SP3 adjacent to the pixel unit PU1 are arranged. Therefore, the sub-pixels SP1 to SP3 may be arranged to correspond to the arrangement direction of the first through-portion 410 and the second through-portion 420. Therefore, even when the arrangement direction of the first through-portion 410 is different from the arrangement direction of the second through-portion 420, the non-uniformity of the visual impact of the pixel units PU1 to PU3 is minimized, thereby enhancing the image quality characteristics of the display device 1.

[0176] In addition, the display device 1 may include the wirings SL1 to SL3, V1 to V3, and D1 to D3, which are formed to be separated from the through-portion 400 without overlapping the through-portion 400. Therefore, the flexibility and durability of the substrate 100 are enhanced due to the through-portion 400. In addition, the wirings SL1 to SL3, V1 to V3, and D1 to D3 are prevented from being peeled off, being contaminated by gas such as external oxygen, and being degraded by moisture due to not overlapping the through-portion 400.

[0177] Similar or identical wirings (i.e., wirings SL1 to SL3) may extend in one direction and have a curved shape and may be repeated at a specific period, thereby reducing or preventing the non-uniformity of each pixel unit PU caused by the wirings SL1 to SL3. In addition, the non-uniformity of the wirings V1 to V3 and the wirings D1 to D3 is reduced or prevented.

[0178] For example, the wirings V1 to V3 and the wirings D1 to D3 extending in the same direction are formed not to overlap each other, thereby minimizing interference therebetween. In addition, the bending regions of the wirings V1 to V3 and the wirings D1 to D3 correspond to different second through-holes 420, thereby preventing the electrical characteristics of the display device 1 from being reduced due to interference of the bending portions of the wirings V1 to V3 and the wirings D1 to D3.

[0179] In addition, each of the pixel units PU1 to PU3 includes sub-pixels SP1 to SP3 arranged in a specific direction. Wirings SL1 to SL3, V1 to V3, and D1 to D3 are respectively connected to the sub-pixels SP1 to SP3, and are bent to be separated from the through-portion 400. To this end, each of the wirings SL1 to SL3, V1 to V3, and D1 to D3 includes a plurality of connection lines, common lines, and body lines respectively connected to a plurality of sub-pixels SP1 to SP3, and therefore, the wirings SL1 to SL3, V1 to V3, and D1 to D3 can be electrically connected to the sub-pixels SP1 to SP3 without overlapping the through-portion 400.

[0180] So far, the display device 1 has been mainly described, but the described technology is not limited thereto. For example, a method of manufacturing a display device is within the scope of the described technology.

[0181] Figures 8 to 12 is a cross-sectional view schematically illustrating a process of manufacturing a display device according to an exemplary embodiment.

[0182] Reference Figure 8 , performing an operation of providing a substrate 100, wherein the substrate 100 includes a pixel area PA formed with a pixel unit PU and a separation area BA formed between two adjacent pixel units PU. The substrate 100 may be formed of various materials. In detail, the substrate 100 may be formed of glass, metal, organic material or other materials. In some embodiments, the substrate 100 is formed of a flexible material having flexibility.

[0183] An operation of forming a buffer layer 110, a gate insulating layer 130, and an interlayer insulating layer 150 on the substrate 100 may be performed. In addition, an operation of forming a semiconductor layer 120 and a gate electrode 140 constituting a thin film transistor TFT on the substrate 100 may be performed. The interlayer insulating layer 150 may be stacked on the gate electrode 140, and then, contact holes CNT may be formed to electrically connect the source electrode 160 and the drain electrode 162 to the semiconductor layer 120.

[0184] In the operation of forming the contact hole H1, the first through hole 401 may be formed in the separation area BA substantially simultaneously or in parallel. Therefore, the operation of forming the first through hole 401 in the separation area BA may be performed without adding a separate mask, thereby reducing manufacturing costs.

[0185] The end surface 110a of the buffer layer 110, the end surface 130a of the gate insulating layer 130, and the end surface 150a of the interlayer insulating layer 150 may be exposed through the first through hole 401. The end surfaces 110a, 130a, and 150a may be the first end surface 160a of the first through hole 401. The first end surface 160a may be formed to have the same plane. This is because the first through hole 401 is formed in the operation of forming the contact hole H1. In some embodiments, the first end surface 160a is formed in a stepped form to have different planes.

[0186] Reference Fig. 9 , a source electrode 160 and a drain electrode 162 electrically connected to the semiconductor layer 120 through the contact hole H1 are formed on the gate electrode 140. A first insulating layer 170 may be stacked on the source electrode 160 and the drain electrode 162. In order to electrically connect the pixel electrode 210 to one selected from the source electrode 160 and the drain electrode 162, an operation of forming a via hole H2 in the first insulating layer 170 may be performed.

[0187] In the operation of forming the via hole H2, the second through portion 420 may be formed substantially simultaneously or in parallel in the isolation area BA. Therefore, the operation of forming the second through portion 420 in the isolation area BA may be performed without adding a separate mask, thereby reducing manufacturing costs.

[0188] The second end surface 170a may be exposed through the second through-portion 420. This is because the second through-portion 420 is formed in the operation of forming the via hole H2. In this case, the width of the second through-portion 420 may be formed to be greater than the width of the first through-hole 401.

[0189] Reference Fig.10 , an operation of patterning and forming a pixel electrode 210 on the first insulating layer 170 is performed for each pixel. The pixel electrode 210 may be electrically connected to one of the source electrode 160 and the drain electrode 162 of the thin film transistor TFT through a via hole H2 formed in the first insulating layer 170.

[0190] After forming the pixel electrode 210, an operation of forming the second insulating layer 180 to expose a central portion of the pixel electrode 210 and cover an edge of the pixel electrode 210 may be performed. The second insulating layer 180 may be understood as a pixel defining layer.

[0191] In the operation of forming the opening H3 that exposes the central portion of the pixel electrode 210 through the second insulating layer 180, the third through hole 403 may be formed in the partition area BA substantially simultaneously or in parallel. Therefore, the operation of forming the third through hole 403 in the partition area BA may be performed without adding a separate mask, thereby reducing manufacturing costs.

[0192] The third end surface 180a may be exposed through the third through hole 403. This is because the third through hole 403 is formed in the operation of forming the opening H3. In this case, the width of the third through hole 403 may be formed to be greater than the width of the second through hole 402.

[0193] That is, the first through hole 401 may be formed to have the smallest width, the second through portion 420 may be formed on the first through hole 401, and the third through hole 403 may be formed to have the largest width. Therefore, the first end surface 160a, the second end surface 170a, and the third end surface 180a may be formed to have a stepped structure with a step height. The first end surface 160a may be formed to protrude further than the second end surface 170a, and the second end surface 170a may be formed to protrude further than the third end surface 180a. Fig. 9 , the first end surface 160a, the second end surface 170a, and the third end surface 180a are shown to be formed into a structure having a step height, but the described technology is not limited thereto. The end surface of the through hole may have FIG. 4A to FIG. 4C One of the structure.

[0194] Reference Fig.11 , an intermediate layer 220 including an emission layer is formed on the pixel electrode 210 exposed by the second insulating layer 180. Subsequently, an operation of forming an opposite electrode 230 opposite to the pixel electrode 210 on the second insulating layer 180 to cover the intermediate layer 220 may be performed. The opposite electrode 230 may be formed over the substrate 100. Therefore, although not shown, the opposite electrode 230 may be formed on the first end surface 160a, the second end surface 170a, and the third end surface 180a.

[0195] Subsequently, a fourth through hole 404 having a size substantially equal to or smaller than that of the first through hole 401 may be formed on the substrate 100. The fourth through hole 404 may be formed to pass through the substrate 100. The fourth through hole 404 may be formed by a laser cutting process, for example, a portion of the substrate 100 may be removed by a fine pattern process using a femto laser.

[0196] Reference Fig.12 , a portion of the substrate 100 corresponding to the first through hole 401 is removed, thereby forming a fourth through hole 404. Therefore, the first through hole 401 to the fourth through hole 404 may be formed to overlap each other in the through portion 400 formed in the partition area BA. In addition, the fourth end surface 100a may be exposed by the fourth through hole 404. The first end surface 160a to the fourth end surface 100a may be understood as the inner surface 400a of the through portion 400.

[0197] The inner surface 400a of the through portion 400 may be formed in a stepped shape to have a Fig.12 In addition, in order to narrow the width in the direction from the counter electrode 230 to the substrate 100, the inner surface 400a of the through portion 400 may be formed. That is, the inner surface 400a of the through portion 400 may have an approximately V-shape with an open lower end.

[0198] exist Fig.12 , it is shown that the counter electrode 230 is formed on the second insulating layer 180 but not on the first to fourth end surfaces 160a to 100a, but depending on circumstances, the counter electrode 230 may be formed without being patterned on the entire substrate 100. Therefore, the counter electrode 230 may be formed on the inner surface 400a of the through-portion 400.

[0199] An operation of forming the encapsulation layer 300 on the counter electrode 230 may be performed. Fig.12 Although not shown in the figure, the encapsulation layer 300 can be formed in a multi-layer structure in which organic layers and inorganic layers are alternately stacked.

[0200] The encapsulation layer 300 is formed to seal the OLED and cover the inner surface 400a. When the encapsulation layer 300 is not formed to cover the inner surface 400a of the through-portion 400, moisture or impurities may flow into one or more material layers whose cross-sectional surfaces are exposed due to the inner surface 400a and damage various devices. Therefore, when the encapsulation layer 300 is sealed to cover the inner surface 400a, the reliability of the display device is enhanced.

[0201] As described above, according to at least one of the disclosed embodiments, a display device and a method of manufacturing the same that enhance user convenience are realized.

[0202] It should be understood that the exemplary embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each exemplary embodiment should typically be considered as available for other similar features or aspects in other exemplary embodiments.

[0203] While the inventive technology has been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in details and form may be made therein without departing from the spirit and scope as defined by the claims.

Claims

1. A display device, comprising: substrate; A first pixel, disposed on the substrate and comprising at least one first sub-pixel among a first red sub-pixel, a first green sub-pixel and a first blue sub-pixel; a second pixel disposed adjacent to the first pixel and spaced apart from the first pixel on the substrate, and comprising at least one second sub-pixel of a second red sub-pixel, a second green sub-pixel, and a second blue sub-pixel; as well as a through hole located in a region between the first pixel and the second pixel and penetrating the substrate, Among them, the at least one first sub-pixel is arranged in a first direction, and the at least one second sub-pixel is arranged in a second direction intersecting the first direction, the first direction is the length direction of the at least one second sub-pixel, and the second direction is the length direction of the at least one first sub-pixel.

2. The display device according to claim 1, in, The at least one second sub-pixel is rotated 90 degrees relative to the at least one first sub-pixel.

3. The display device according to claim 1, in, The first direction and the second direction are orthogonal to each other.

4. The display device according to claim 1, in, The through hole extends in the first direction or the second direction, the first direction is the length direction of the through hole, or the second direction is the length direction of the through hole.

5. The display device according to claim 1, further comprising: an encapsulation layer, disposed on the first pixel and the second pixel, Wherein, the encapsulation layer covers the inner surface of the through hole.

6. The display device according to claim 5, further comprising: A plurality of insulating layers are disposed on the substrate, Wherein, the plurality of insulating layers and the substrate both have openings for forming the through holes.

7. The display device according to claim 1, further comprising: A thin film transistor, disposed on the substrate and comprising a semiconductor layer, a gate electrode and an electrode layer; a gate insulating layer located between the semiconductor layer and the gate electrode and having a first opening defined by a first inner surface; an interlayer insulating layer, located between the gate electrode and the electrode layer and having a second opening corresponding to the first opening, wherein the second opening is defined by a second inner surface; a planarization layer covering the electrode layer and having a third opening corresponding to the second opening, wherein the third opening is defined by a third inner surface; as well as a pixel defining layer, disposed on the planarization layer and having a fourth opening corresponding to the third opening, wherein the fourth opening is defined by a fourth inner surface, The base has a fifth opening corresponding to the first opening to the fourth opening, and the fifth opening is defined by a fifth inner surface.

8. The display device according to claim 7, in, The through hole includes the first opening to the fifth opening.

9. The display device according to claim 7, further comprising: an encapsulation layer, covering the first pixel and the second pixel, Wherein, the encapsulation layer covers the first inner surface to the fifth inner surface.

10. The display device according to claim 7, in, The width of the second opening is greater than or equal to the width of the first opening, the width of the third opening is greater than or equal to the width of the second opening, the width of the fourth opening is greater than or equal to the width of the third opening, and the width of the fifth opening is less than or equal to the width of the first opening.

11. The display device according to claim 1, further comprising: wiring, disposed on the substrate, Wherein, the wiring is arranged to bypass the through hole.

12. The display device according to claim 1, wherein: The inner surface of the through hole is inclined.

13. The display device according to claim 1, in, The through hole has a stepped inner surface.

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