Manufacturing method for forming auxiliary conductive unit on transparent electrode and finished product thereof

Abstract

A manufacturing method for forming auxiliary conductive units on a transparent electrode of a touch sensor and a finished product thereof, wherein the manufacturing method comprises: disposing a first touch conductive trace pattern and a first auxiliary conductive trace pattern on a first side surface of a dielectric substrate; and disposing a second touch conductive trace pattern and a second auxiliary conductive trace pattern on a second side surface of the dielectric substrate. The first and second auxiliary conductive trace patterns each have micro-auxiliary conductive units and are electrically connected to the areas defined by the first and second touch conductive trace patterns, respectively. The micro-auxiliary conductive units of the first and second auxiliary conductive trace patterns each have a light shielding rate of less than 1%. The first and second touch conductive trace patterns and the first and second auxiliary conductive trace patterns together form at least one touch sensor. The first and second touch conductive trace patterns have a sheet resistance between 80-150 ohm / sq, and the first and second auxiliary conductive trace patterns have a sheet resistance between 0.05-0.2 ohm / sq.

Description

Technical Field

[0001] The present invention relates to the technical scope of touch sensors, and in particular to a manufacturing method for forming auxiliary conductive units on a transparent electrode of a touch sensor and a finished product thereof. Background Art

[0002] Currently, touch sensors are mostly fabricated using a transparent indium tin oxide (ITO) conductive film. The touch sensing structure is formed by carving a number of touch sensing electrodes and signal lines onto the film. The design and production of touch sensors typically require different sheet resistance values ​​for the transparent ITO film depending on the product size. Producing products of varying sizes requires using ITO films with different properties. Consequently, facing market demand for touchpads of varying sizes, manufacturers face significant pressure on inventory costs and complex manufacturing processes. Furthermore, because the optical properties of ITO film are roughly inversely proportional to its conductivity—that is, higher conductivity (lower sheet resistance) correlates to poorer optical properties—this characteristic creates insurmountable bottlenecks in the design and process development of large-scale touchpads. Summary of the Invention

[0003] The present invention provides a manufacturing method for forming auxiliary conductive units on transparent electrodes of a touch sensor. According to the manufacturing method of the present invention, touch sensing electrodes and signal conductors can be simultaneously prepared on two sides of a substrate, and auxiliary conductive units and auxiliary signal conductors can be formed on the touch sensing electrodes and signal conductors, thereby achieving the purpose of reducing the surface resistivity of the touch sensing electrodes and signal conductors without compromising optical properties.

[0004] To achieve the above-mentioned object, the manufacturing method of the present invention generally comprises the following steps: Figure 1 The preparation steps shown are:

[0005] 1. Prepare a multi-conductive layer substrate: a first touch conductive layer and a first auxiliary conductive layer are disposed on a first side of a dielectric substrate, and a second touch conductive layer and a second auxiliary conductive layer are disposed on a second side of the dielectric substrate.

[0006] 2. First yellow photoprocess: disposing a first photoresist layer on the first side of the substrate, and developing the first photoresist layer to form a first photoresist trace pattern.

[0007] 3. Second yellow photoprocess: disposing a second photoresist layer on the second side surface of the substrate, and developing the second photoresist layer to form a second photoresist trace pattern.

[0008] 4. First etching process: using a first etchant to etch the substrate, forming a first touch conductive trace pattern on the first touch conductive layer and the first auxiliary conductive layer, and forming a second touch conductive trace pattern on the second touch conductive layer and the second auxiliary conductive layer.

[0009] 5. First stripping process: removing the first photoresist layer and the second photoresist layer.

[0010] 6. Third yellow photoprocess: disposing a third photoresist layer on the first side of the substrate, and developing the third photoresist layer to form a third photoresist trace pattern.

[0011] 7. Fourth yellow photoprocess: disposing a fourth photoresist layer on the second side surface of the substrate, and developing the fourth photoresist layer to form a fourth photoresist trace pattern.

[0012] 8. Second etching process: using a second etchant to etch the substrate to form a first auxiliary conductive trace pattern on the first auxiliary conductive layer, and forming a second auxiliary conductive trace pattern on the second auxiliary conductive layer.

[0013] 9. Second stripping process: removing the third photoresist layer and the fourth photoresist layer.

[0014] Through the manufacturing method of the present invention, the first touch conductive trace pattern, the first auxiliary conductive trace pattern, the second touch conductive trace pattern, and the second auxiliary conductive trace pattern together form at least one touch sensor; the first auxiliary conductive trace pattern is used to reduce the surface resistivity of the first touch conductive trace pattern, and the second auxiliary conductive trace pattern is used to reduce the surface resistivity of the second touch conductive trace pattern.

[0015] The present invention has the following advantages in design, application and production:

[0016] 1. Single standardized production raw material preparation: Only one optimized touch conductive layer (surface resistance value is approximately between 80-150 ohm / sq) and auxiliary conductive layer (surface resistance value is approximately between 0.05-0.2 ohm / sq) need to be selected to apply to touch panel products of most sizes, thereby significantly reducing material preparation costs and inventory pressure.

[0017] 2. Improve the flexibility and simplicity of touch panel design: By modifying the design of the auxiliary conductive trace pattern, the surface resistivity of the touch conductive trace pattern can be adjusted to meet the resistance requirements of touch panel products of various sizes.

[0018] 3. Simplify production technology and improve product production efficiency: Auxiliary conductive trace patterns can be formed through yellow light processing to adjust the surface resistivity of the touch conductive trace pattern, so as to produce resistance values ​​that meet the requirements of touch panel products of various sizes. The yellow light process technology is mature and has high production efficiency.

[0019] 4. Suitable for the design and production of large-size touch panel products: As the product size increases, the loop resistance is required to be lower. Therefore, the ITO conductive film used to make the touch conductive trace pattern must be thicker to increase conductivity, resulting in worse optical properties. However, if the touch conductive trace pattern made of ITO conductive film is used in conjunction with an auxiliary conductive trace pattern made of copper conductive film, the conductivity can be improved without increasing the thickness. Therefore, there is no problem of optical degradation when used in large-size touch panel products.

[0020] This summary is an introduction to some selected concepts in a simplified form, which will be further described in the detailed description below. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The figure is a process flow chart of the manufacturing method of the present invention.

[0022] Figure 2 FIG. 1 is a cross-sectional view showing a first embodiment in which two conductive layers and a photoresist layer are formed on two sides of a substrate.

[0023] Figure 3 FIG. 4 is a schematic cross-sectional view of the substrate after the first yellow light process and the second yellow light process are performed according to the first embodiment.

[0024] Figure 4 FIG. 4 is a schematic cross-sectional view of the substrate after the first etching process is performed according to the first embodiment.

[0025] Figure 5 FIG. 1 is a schematic cross-sectional view of the substrate after the first stripping process is performed according to the first embodiment.

[0026] Figure 6 FIG. 1 is a cross-sectional view of forming a photoresist layer on both sides of a substrate in a first embodiment.

[0027] Figure 7 FIG. 4 is a schematic cross-sectional view of the substrate after the third yellow light process and the fourth yellow light process are performed according to the first embodiment.

[0028] Figure 8 FIG. 4 is a schematic cross-sectional view of the substrate after the second etching process is performed according to the first embodiment.

[0029] Figure 9FIG. 1 is a schematic cross-sectional view of a substrate of a manufactured product according to the first embodiment.

[0030] Figure 10 This is a plan view of the finished product of the first embodiment.

[0031] Figure 11 FIG. 1 is a plan view of the X-axis touch sensing traces on the first side surface of the substrate of the finished product of the first embodiment.

[0032] Figure 12 FIG. 4 is a plan view of the first touch conductive trace pattern of the finished product of the first embodiment.

[0033] Figure 13 FIG. 4 is a plan view of the first auxiliary conductive trace pattern of the manufactured product of the first embodiment.

[0034] Figure 14 for Figure 11 An enlarged plan view of part F.

[0035] Figure 15 FIG. 1 is a schematic plan view of another fine conductive trace pattern of the product of the first embodiment.

[0036] Figure 16 FIG. 1 is a schematic plan view of another fine conductive trace pattern of the product of the first embodiment.

[0037] Figure 17 FIG. 1 is a schematic plan view of another fine conductive trace pattern of the product of the first embodiment.

[0038] Figure 18 FIG. 1 is a plan view of the Y-axis touch sensing traces on the second side surface of the substrate of the finished product of the first embodiment.

[0039] Figure 19 FIG. 1 is a cross-sectional view showing a second embodiment in which two conductive layers and a photoresist layer are formed on two sides of a substrate.

[0040] Figure 20 FIG. 4 is a schematic cross-sectional view of the substrate after the first yellow light process and the second yellow light process are performed according to the second embodiment.

[0041] Figure 21 FIG. 4 is a schematic cross-sectional view of the substrate after the first etching process is performed according to the second embodiment.

[0042] Figure 22 FIG. 4 is a schematic cross-sectional view of the substrate after the first stripping process is performed according to the second embodiment.

[0043] Figure 23 FIG. 1 is a cross-sectional view of forming a photoresist layer on both sides of a substrate in a second embodiment.

[0044] Figure 24FIG. 4 is a schematic cross-sectional view of the substrate after the third yellow light process and the fourth yellow light process are performed according to the second embodiment.

[0045] Figure 25 FIG. 4 is a schematic cross-sectional view of the substrate after the second etching process is performed according to the second embodiment.

[0046] Figure 26 FIG. 1 is a schematic cross-sectional view of a substrate of a finished product according to the second embodiment.

[0047] Figure 27 This is a plan view of the finished product of the second embodiment.

[0048] Figure 28 FIG. 4 is a plan view of the X-axis touch sensing traces on the first side surface of the substrate of the finished product according to the second embodiment.

[0049] Figure 29 FIG. 4 is a plan view of the Y-axis touch sensing traces on the second side surface of the substrate of the finished product of the second embodiment.

[0050] Description of symbols in the accompanying drawings:

[0051] 1 Substrate; 1A First side surface; 1B Second side surface; 2 First touch conductive layer; 21 First touch sensing electrode; 21A First touch sensing electrode; 21B Second touch sensing electrode; 22 First signal conductor; 2P First touch conductive trace pattern; 3 First auxiliary conductive layer; 31 First micro-auxiliary conductive unit; 32 First auxiliary signal conductor; 3P First auxiliary conductive trace pattern; 4 Second touch conductive layer; 41 Second touch sensing electrode; 41A Third touch sensing electrode; 41B Fourth touch sensing electrode; 42 Second signal conductor; 4P Second touch conductive trace pattern; 5 Second auxiliary conductive layer; 51 Second micro-auxiliary conductive unit; 52 Second auxiliary signal conductor; 5P Second auxiliary conductive trace pattern; 6 First photoresist layer; 6P First photoresist trace pattern; 7 Second photoresist layer; 7P Second photoresist trace pattern; 8 Third photoresist layer; 8P Third photoresist trace pattern; 9 Fourth photoresist layer; 9P Fourth photoresist trace pattern. DETAILED DESCRIPTION

[0052] First embodiment

[0053] exist Figures 2 to 10 The first embodiment of the manufacturing method of the present invention is described in detail below:

[0054] See Figure 2As shown, first, a dielectric substrate 1 with high light transmittance is provided. A first touch conductive layer 2 and a first auxiliary conductive layer 3 are sequentially stacked on a first side 1A of the dielectric substrate 1. A second touch conductive layer 4 and a second auxiliary conductive layer 5 are sequentially stacked on a second side 1B of the dielectric substrate 1. The first side 1A is opposite to the second side 1B through the substrate 1.

[0055] The material of the substrate 1 is selected from glass, polycarbonate (PC), polyester (PET), polymethyl methacrylate (PMMA) or cycloolefin copolymer (COC), but the material range is not limited to the aforementioned materials. Various soft, hard or flexible transparent substrates are applicable.

[0056] The first touch conductive layer 2 and the second touch conductive layer 4 are transparent conductive films formed of the same material. The material of the transparent conductive film is selected from metal oxides such as indium tin oxide, indium zinc oxide, aluminum zinc oxide, antimony tin oxide, polyethylene dioxythiophene, or graphene, but is not limited thereto. Preferably, the surface resistivity of the first touch conductive layer 2 and the second touch conductive layer 4 is between 80 and 150 ohm / sq.

[0057] The first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 are also opaque conductive films formed from the same material. The material of the opaque conductive film is selected from, but not limited to, gold, silver, copper, aluminum, molybdenum, nickel, or alloys of the foregoing materials. Preferably, the sheet resistivity of the first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 is between 0.05 and 0.2 ohm / sq. As previously mentioned, the sheet resistivity of the first auxiliary conductive layer 3 is lower than that of the first touch conductive layer 2, and the first auxiliary conductive layer 3 is electrically superimposed on the first touch conductive layer 2. Similarly, the sheet resistivity of the second auxiliary conductive layer 5 is lower than that of the second touch conductive layer 4, and the second auxiliary conductive layer 5 is electrically superimposed on the second touch conductive layer 4.

[0058] In this embodiment, the first touch conductive layer 2 and the second touch conductive layer 4 are made of a conductive film made of indium tin oxide (ITO), which is currently widely used in the field of touch panels, while the first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 are made of a conductive film made of copper (Cu), which has low surface resistivity (good conductivity) and is relatively inexpensive.

[0059] like Figure 2 and Figure 3As shown, a first yellow light process is performed on the first side surface 1A of the substrate 1. The first yellow light process includes the following steps: (1) setting a photoresist layer: a first photoresist layer 6 is coated on the first side surface 1A of the substrate 1, i.e., the outer surface of the outermost first auxiliary conductive layer 3; (2) pre-baking and curing the photoresist layer: the substrate is pre-baked by providing a hot air of about 60°C to 90°C to bake the first photoresist layer 6 on the substrate for about 100 to 140 seconds (Sec.), and then the temperature is gradually lowered to room temperature; (3) exposing the photoresist layer: the first photoresist layer 6 is exposed by providing an ultraviolet light source with an irradiation energy of about 150 to 250 MJ / cm2, and a photomask (not shown) with a default conductive trace pattern is placed between the first photoresist layer 6 and a light source, with a gap of about 30 μm between the first photoresist layer 6 and the photoresist layer 6. The first photoresist layer 6 is exposed at a distance of about 80 μm to transfer the default conductive trace pattern on the mask to the first photoresist layer 6; and (4) developing the photoresist layer: developing the first photoresist layer 6 with a spray pressure of about 0.5 Kg / cm 2 The developer is sprayed on the first photoresist layer 6 and then sprayed at a pressure of about 0.5 Kg / cm 2 The cleaning liquid is sprayed on it to remove the unwanted photoresist material.

[0060] The first yellow photoprocess can develop the first photoresist layer 6 to form a first photoresist trace pattern 6P.

[0061] In addition, a second yellow light process is also implemented on the second side surface 1B of the substrate 1. The technical means for implementing the second yellow light process are similar to the aforementioned first yellow light process, so they will not be repeated; therefore, a second photoresist trace pattern 7P can be formed by developing on the second photoresist layer 7 on the second side surface 1B.

[0062] In the aforementioned first and second yellow photoprocesses, the first photoresist layer 6 is coated on the outer surface of the first auxiliary conductive layer 3, and the second photoresist layer 7 is coated on the outer surface of the second auxiliary conductive layer 5. In other words, the first photoresist layer 6 and the second photoresist layer 7 are disposed opposite each other with the first and second auxiliary conductive layers 3 and 5 interposed therebetween. However, because the first and second auxiliary conductive layers 3 and 5 are opaque conductive films (copper films), when the aforementioned first and second yellow photoprocesses are simultaneously or separately performed on the two side surfaces 1A and 1B of the substrate 1, the exposure and development operations of the first and second photoresist layers 6 and 7 do not interfere with each other, thereby improving processing efficiency.

[0063] See also Figure 4As shown, a first etching process is then simultaneously performed on the first side 1A and the second side 1B of the substrate 1, using a first etchant to etch the conductive layers on the substrate 1 to remove the material portions that are not protected by the first photoresist layer 6 and the second photoresist layer 7. In this embodiment, wet etching is used as an example, and the implementation method is as follows: the substrate 1 is placed in an etching tank and sprayed with a pressure of about 0.6 Kg / cm 2 The first etchant is sprayed onto the first side 1A and the second side 1B of the substrate 1. On the first side 1A, the material on the first touch conductive layer 2 and the first auxiliary conductive layer 3 that is not protected by the first photoresist layer 6 is etched away. On the second side 1B, the material on the second touch conductive layer 4 and the second auxiliary conductive layer 5 that is not protected by the second photoresist layer 7 is etched away. After the etching is completed, the first etchant is sprayed at a pressure of about 1.5 kg / cm 2 The surfaces of both sides of the substrate 1 are cleaned with a washing / neutralizing liquid (for example, pure water).

[0064] The first etchant is a composite etchant that can etch the indium tin oxide (ITO) material of the first touch conductive layer 2 and the second touch conductive layer 4, as well as the copper (Cu) material of the first auxiliary conductive layer 3 and the second auxiliary conductive layer 5. In this embodiment, the first etchant contains at least iron nitrate Fe(NO3)3 and hydrochloric acid HCl.

[0065] Then, a first stripping process is performed to remove the first photoresist layer 6 and the second photoresist layer 7 on the substrate 1. The method is as follows: spraying with a pressure of about 0.6 Kg / cm 2 A stripping agent (e.g. potassium hydroxide KOH) is sprayed onto the first photoresist layer 6 and the second photoresist layer 7 to remove the conductive layer from the surface. The stripping agent is then sprayed at a pressure of about 1.5 Kg / cm 2 The surfaces of both sides of the substrate 1 are cleaned with a cleaning liquid (for example, water).

[0066] like Figure 5 As shown, after the first stripping process is completed, the first touch conductive layer 2 and the first auxiliary conductive layer 3 on the first side surface 1A are etched to form a first touch conductive trace pattern 2P corresponding to the first photoresist trace pattern 6P (please also refer to Figure 12), wherein the first touch conductive trace pattern 2P includes at least a pattern portion for a first touch sensing electrode 21 and a pattern portion for a first signal conductor 22. In this embodiment, the first touch sensing electrodes 21 are arranged in a serial pattern along the first direction (i.e., the X-axis), and the first signal conductor 22 is electrically connected to the first touch sensing electrodes 21. Furthermore, a second touch conductive trace pattern 4P corresponding to the second photoresist trace pattern 7P is etched onto both the second touch conductive layer 4 and the second auxiliary conductive layer 5 on the second side surface 1B. The second touch conductive trace pattern 4P includes at least a pattern portion for a second touch sensing electrode 41 and a pattern portion for a second signal conductor 42. In this embodiment, the second touch sensing electrodes 41 are arranged in a serial pattern along the second direction (i.e., the Y-axis), and the second signal conductor 42 is electrically connected to the first touch sensing electrodes 41.

[0067] Please refer to Figure 6 and Figure 7 As shown, a third yellow light process is then performed on the first side 1A of the substrate 1. The technical means for performing the process are similar to those for the first yellow light process, and thus will not be repeated. As a result, a third photoresist trace pattern 8P is formed on the third photoresist layer 8 on the first side 1A. Furthermore, a fourth yellow light process is also performed on the second side 1B of the substrate 1. The technical means for performing the process are similar to those for the first yellow light process, and thus will not be repeated. As a result, a fourth photoresist trace pattern 9P is formed on the fourth photoresist layer 9 on the second side 1B.

[0068] In the aforementioned third and fourth yellow photolithography processes, since the third photoresist trace pattern 8P is disposed within the region of the first touch conductive trace pattern 2P of the first auxiliary conductive layer 3, and the fourth photoresist trace pattern 9P is disposed within the region of the second touch conductive trace pattern 4P of the second auxiliary conductive layer 5, and since the first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 are a light-opaque conductive film (copper film), when the aforementioned third and fourth yellow photolithography processes are simultaneously or separately performed on the two side surfaces 1A and 1B of the substrate 1, the exposure and development operations of the third photoresist layer 8 and the fourth photoresist layer 9 will not interfere with each other.

[0069] See also Figure 8As shown, a second etching process is then performed simultaneously on the first side 1A and the second side 1B of the substrate 1. A second etchant is used to etch the first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 on the substrate 1 to remove the material portions not protected by the third photoresist layer 8 and the fourth photoresist layer 9. The second etchant does not etch the indium tin oxide (ITO) material of the first touch conductive layer 2 and the second touch conductive layer 4. In this embodiment, the second etchant contains at least iron nitrate Fe(NO3)3. The specific implementation techniques of the second etching process are similar to those of the first etching process, so a detailed description thereof will not be repeated.

[0070] Finally, a second stripping process is performed to remove the third photoresist layer 8 and the fourth photoresist layer 9 on the substrate 1. The specific implementation technology of the second stripping process is similar to that of the first stripping process, so it will not be repeated.

[0071] like Figure 9 and Figure 10 As shown, after the second stripping process is completed, a first auxiliary conductive trace pattern 3P corresponding to the third photoresist trace pattern 8P is etched on the first auxiliary conductive layer 3 on the first side 1A (please also refer to FIG. Figure 13 ), and the first touch conductive trace pattern 2P originally formed by the first etching process is still retained on the first touch conductive layer 2; wherein, the first auxiliary conductive trace pattern 3P includes a pattern portion of at least one first micro-auxiliary conductive unit 31 and a pattern portion of a first auxiliary signal wire 32; in particular, the first micro-auxiliary conductive unit 31 is arranged within the area of ​​the first touch sensing electrode 21, and its shading rate is less than 1%, and at least a portion of the first auxiliary signal wire 32 is formed in an overlapping manner within the area of ​​the first signal wire 22.

[0072] Furthermore, a second auxiliary conductive trace pattern 5P corresponding to the fourth photoresist trace pattern 9P is etched on the second auxiliary conductive layer 5 on the second side surface 1B, while the second touch conductive trace pattern 4P formed by the first etching process remains on the second touch conductive layer 4. The second auxiliary conductive trace pattern 5P includes at least one second micro-auxiliary conductive unit 51 and a second auxiliary signal conductor 52. Specifically, the second micro-auxiliary conductive unit 51 is positioned within the region of the second touch sensing electrode 41 and has a light shielding ratio of less than 1%. At least a portion of the second auxiliary signal conductor 52 overlaps the region of the second signal conductor 42. In this embodiment, the first touch conductive trace pattern 2P, the first auxiliary conductive trace pattern 3P, the second touch conductive trace pattern 4P, and the second auxiliary conductive trace pattern 5P collectively form a capacitive touch sensor.

[0073] As described above, the present invention primarily reduces the surface resistivity of the touch conductive trace patterns 2P and 4P by providing auxiliary conductive trace patterns 3P and 5P on the touch conductive trace patterns 2P and 4P. Furthermore, within the visible area of ​​the touch sensor (roughly equivalent to the touch operating area), although the micro-auxiliary conductive units 31 and 51 provided on the touch sensing electrodes 21 and 41 are formed from an opaque conductive film, their extremely low light shielding rate (below 1%) negligibly affects the visibility of the touch sensing electrodes 21 and 41.

[0074] like Figures 9 to 18 FIGURE 1 illustrates a touch sensor fabricated using the manufacturing method according to the first embodiment of the present invention. Key features include high-electrical-performance micro-auxiliary conductive units provided on the touch sensing electrodes and a high-electrical-performance auxiliary conductive line electrically connected to the signal conductors. These structures reduce the sheet resistance of the touch sensing electrodes and conductive line, ensuring that the touch sensor meets required resistance specifications without compromising optical properties.

[0075] The following embodiments are described using a capacitive touch sensor as an example. The touch sensor includes at least a substrate 1, a first touch conductive layer 2, a second touch conductive layer 3, a first auxiliary conductive layer 4, and a second auxiliary conductive layer 5. A first touch conductive trace pattern 2P and a second touch conductive trace pattern 4P are provided on opposite sides of the substrate 1, respectively. A first auxiliary conductive trace pattern 3P is electrically bonded to the first touch conductive trace pattern 2P, and a second auxiliary conductive trace pattern 5P is electrically bonded to the second touch conductive trace pattern 4P.

[0076] The substrate 1 is a dielectric, high-transmittance sheet material selected from glass, polycarbonate (PC), polyester (PET), polymethyl methacrylate (PMMA), or cycloolefin copolymer (COC). However, the material range is not limited to these materials and any soft, rigid, or flexible transparent substrate is suitable. The first touch conductive layer 2 and the second touch conductive layer 4 are transparent conductive films formed from the same material. The material of the transparent conductive film is selected from, but not limited to, metal oxides such as indium tin oxide, indium zinc oxide, aluminum zinc oxide, antimony tin oxide, polyethylene dioxythiophene, or graphene. Preferably, the surface resistivity of the first touch conductive layer 2 and the second touch conductive layer 4 is between 80 and 150 ohm / sq. The first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 are also opaque conductive films formed from the same material. The material of the opaque conductive film is selected from, but not limited to, gold, silver, copper, aluminum, molybdenum, nickel, or alloys of these materials. Preferably, the sheet resistivity of the first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 is between 0.05 and 0.2 ohm / sq. As previously described, the sheet resistivity of the first auxiliary conductive layer 3 is lower than that of the first touch conductive layer 2. Similarly, the sheet resistivity of the second auxiliary conductive layer 5 is lower than that of the second touch conductive layer 4. In this embodiment, the substrate 1 is a glass sheet, the first touch conductive layer 2 and the second touch conductive layer 4 are made of indium tin oxide (ITO), a conductive film widely used in touch panels, and the first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 are made of copper (Cu), a conductive film with low sheet resistivity (excellent conductivity) and a relatively low price.

[0077] The substrate 1 is divided into a touch working area and a non-touch working area. The touch working area is located in the center of the substrate 1 , and the non-touch working area is located around the edges of the substrate 1 .

[0078] like Figure 11 and Figure 12 As shown, the first touch conductive layer 2 is disposed on the first side surface 1A of the substrate 1. The first touch conductive layer 2 has a first touch conductive trace pattern 2P. The first touch conductive trace pattern 2P includes a plurality of first touch sensing electrodes 21 and a plurality of first signal conductors 22. The plurality of first touch sensing electrodes 21 are arranged in the touch active area. Each of the first touch sensing electrodes 21 is arranged in a series of rhombus-shaped surfaces along a first direction (i.e., the X-axis) and is electrically connected at at least one end thereof to one of the plurality of first signal conductors 22. The plurality of first signal conductors 22 are arranged in the non-touch active area.

[0079] See Figure 11 and Figure 13As shown, the first auxiliary conductive layer 3 is electrically connected to the first touch conductive layer 2. The first auxiliary conductive layer 3 has a first auxiliary conductive trace pattern 3P. The first auxiliary conductive trace pattern 3P is formed within the area defined by the aforementioned first touch conductive trace pattern 2P. The first auxiliary conductive trace pattern 3P includes a plurality of first micro-auxiliary conductive units 31 and a plurality of first auxiliary signal wires 32. The first micro-auxiliary conductive units 31 are formed to overlap at least a portion of the first touch sensing electrodes 21, and the first auxiliary signal wires 32 are formed to overlap at least a portion of the first signal wires 22. The aforementioned first micro-auxiliary conductive units 31 are fine conductive trace patterns, which are composed of one or a combination of nano-scale point, line, or surface graphic elements. Figures 14 to 17 Several specific implementation examples of the aforementioned fine conductive trace patterns are shown. Furthermore, to avoid interfering with the light transmittance of the first touch sensing electrode 21, the aforementioned plurality of first micro-auxiliary conductive units 31 are evenly distributed on the surface of the first touch sensing electrode 21, and their light shielding rate is preferably below 1%, more preferably between 0.05% and 0.2%. In this embodiment of the present invention, the first micro-auxiliary conductive unit 31 is one (or several) fine metal wires having a wire width of approximately 8 μm or less, preferably 5 μm or less, and is not connected to the first auxiliary signal wire 32.

[0080] See also Figure 18 As shown, the second touch conductive layer 4 is disposed on the second side surface 1B of the substrate 1. The second touch conductive layer 4 has a second touch conductive trace pattern 4P. The second touch conductive trace pattern 4P includes a plurality of second touch sensing electrodes 41 and a plurality of second signal conductors 42. The plurality of second touch sensing electrodes 41 are arranged in the touch active area. The individual second touch sensing electrodes 41 are arranged in a series of rhombus-shaped surfaces along a second direction (i.e., the Y-axis), which is orthogonal to the first direction. The second touch sensing electrodes 41 are electrically connected at at least one end to one of the plurality of second signal conductors 42. The plurality of second signal conductors 42 are arranged in the non-touch active area.

[0081] The second auxiliary conductive layer 5 is electrically connected to the second touch conductive layer 4. The second auxiliary conductive layer 5 has a second auxiliary conductive trace pattern 5P. The second auxiliary conductive trace pattern 5P is formed within the area defined by the second touch conductive trace pattern 4P. The second auxiliary conductive trace pattern 5P includes a plurality of second micro-auxiliary conductive units 51 and a plurality of second auxiliary signal wires 52. The second micro-auxiliary conductive units 51 are formed to overlap at least a portion of the second touch sensing electrodes 41, and the second auxiliary signal wires 52 are formed to overlap at least a portion of the second signal wires 42. The second micro-auxiliary conductive units 51 are fine conductive trace patterns that have the same configuration as the fine conductive trace pattern of the first micro-auxiliary conductive units 31 (see FIG. 2 ). Figures 14 to 17 ); and in order to avoid hindering the light transmittance of the second touch sensing electrode 41, the aforementioned plurality of second micro auxiliary conductive units 51 are evenly distributed on the surface of the second touch sensing electrode 41, and their light shielding rate is preferably less than 1%, more preferably between 0.05% and 0.2%; Figure 18 As shown in the figure, in the embodiment of the present invention, the second micro-auxiliary conductive unit 51 is one (or several) metal wires, the wire width of the metal wire is less than 8 μm, preferably less than 5 μm, and the second micro-auxiliary conductive unit 51 is not connected to the second auxiliary signal wire 52.

[0082] The first touch conductive trace pattern 2P, the first auxiliary conductive trace pattern 3P, the second touch conductive trace pattern 4P, and the second auxiliary conductive trace pattern 5P collectively form a capacitive touch sensor. The second auxiliary conductive trace pattern 3P is used to reduce the sheet resistivity of the first touch conductive trace pattern 2P, while the second auxiliary conductive trace pattern 5P is used to reduce the sheet resistivity of the second touch conductive trace pattern 4P.

[0083] Second embodiment

[0084] exist Figures 19 to 27 The second embodiment of the manufacturing method of the present invention is described in detail below:

[0085] See Figure 19 As shown, first, a dielectric substrate 1 with high light transmittance is provided. A first touch conductive layer 2 and a first auxiliary conductive layer 3 are sequentially stacked on a first side 1A of the dielectric substrate 1. A second touch conductive layer 4 and a second auxiliary conductive layer 5 are sequentially stacked on a second side 1B of the dielectric substrate 1. The first side 1A is opposite to the second side 1B through the substrate 1.

[0086] The substrate 1 is made of a material selected from glass, polycarbonate (PC), polyester (PET), polymethyl methacrylate (PMMA), or cycloolefin copolymer (COC), but the material range is not limited to these materials and any soft, rigid, or flexible transparent substrate is suitable. The first touch conductive layer 2 and the second touch conductive layer 4 are transparent conductive films formed from the same material. The material of the transparent conductive film is selected from, but not limited to, metal oxides such as indium tin oxide, indium zinc oxide, aluminum zinc oxide, antimony tin oxide, polyethylene dioxythiophene, or graphene. Preferably, the surface resistivity of the first touch conductive layer 2 and the second touch conductive layer 4 is between 80 and 150 ohm / sq. The first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 are also opaque conductive films formed from the same material. The material of the opaque conductive film is selected from, but not limited to, gold, silver, copper, aluminum, molybdenum, nickel, or alloys of the foregoing materials. Preferably, the sheet resistivity of the first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 is between 0.05 and 0.2 ohm / sq. As previously mentioned, the sheet resistivity of the first auxiliary conductive layer 3 is lower than that of the first touch conductive layer 2, and the first auxiliary conductive layer 3 is electrically superimposed on the first touch conductive layer 2. Similarly, the sheet resistivity of the second auxiliary conductive layer 5 is lower than that of the second touch conductive layer 4, and the second auxiliary conductive layer 5 is electrically superimposed on the second touch conductive layer 4. In this embodiment, the first touch conductive layer 2 and the second touch conductive layer 4 are made of a conductive film made of indium tin oxide (ITO), which is currently widely used in the field of touch panels, while the first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 are made of a conductive film made of copper (Cu), which has low surface resistivity (good conductivity) and is relatively inexpensive.

[0087] like Figure 19 and Figure 20 As shown, a first yellow light process is performed on the first side 1A of the substrate 1. The implementation of the first yellow light process is similar to the first yellow light process of the first embodiment, so the details will not be repeated. Through the first yellow light process, a first photoresist trace pattern 6P is formed on the first photoresist layer 6. Furthermore, a second yellow light process is performed on the second side 1B of the substrate 1. The implementation of the second yellow light process is similar to the first yellow light process of the first embodiment, so the details will not be repeated. As a result, a second photoresist trace pattern 7P is formed on the second photoresist layer 7 of the second side 1B.

[0088] See also Figure 21As shown, a first etching process is then simultaneously performed on the first side 1A and the second side 1B of the substrate 1, and a first etchant is used to etch the conductive layers on the substrate 1 to remove the material portions that are not protected by the first photoresist layer 6 and the second photoresist layer 7; the first etchant is a composite etchant that can etch the indium tin oxide (ITO) material of the first touch conductive layer 2 and the second touch conductive layer 4, as well as the copper (Cu) material of the first auxiliary conductive layer 3 and the second auxiliary conductive layer 5; the first etchant contains at least iron nitrate Fe(NO3)3 and hydrochloric acid HCl; the technical means for implementing the first etching process are similar to the first etching process of the first embodiment, so they will not be repeated.

[0089] Then, a first stripping process is performed to remove the first photoresist layer 6 and the second photoresist layer 7 on the substrate 1. The implementation technology of the first stripping process is the same as that of the first stripping process of the first embodiment, so it will not be repeated. Figure 22 As shown, after the first stripping process is completed, a first touch conductive trace pattern 2P corresponding to the first photoresist trace pattern 6P is etched over the first touch conductive layer 2 and the first auxiliary conductive layer 3 on the first side surface 1A. The first touch conductive trace pattern 2P includes at least pattern portions for a plurality of first touch sensing electrodes 21A, a plurality of second touch sensing electrodes 21B, and a plurality of first signal conductors 22. The first touch sensing electrodes 21A and the second touch sensing electrodes 21B are arranged in series along a first direction (i.e., the X-axis), parallel to each other, and spaced apart. At least one end of each of the first touch sensing electrodes 21A and the second touch sensing electrodes 21B are electrically connected to the first signal conductors 22. Furthermore, a second touch conductive trace pattern 4P corresponding to the second photoresist trace pattern 7P is etched onto both the second touch conductive layer 4 and the second auxiliary conductive layer 5 on the second side surface 1B. The second touch conductive trace pattern 4P includes at least pattern portions for a plurality of third touch sensing electrodes 41A, a plurality of fourth touch sensing electrodes 41B, and a plurality of second signal conductors 42. The third touch sensing electrodes 41A and the fourth touch sensing electrodes 41B are arranged serially along the second direction (i.e., the Y-axis), parallel to each other, and spaced apart. At least one edge of each of the third touch sensing electrodes 41A and the fourth touch sensing electrodes 41B are electrically connected to the second signal conductors 42.

[0090] Please refer to Figure 23 and Figure 24As shown, a third yellow light process is then performed on the first side 1A of the substrate 1. The technical implementation is similar to the first yellow light process of the first embodiment, and therefore will not be repeated. This third yellow light process develops the third photoresist layer 8 on the first side 1A to form a third photoresist trace pattern 8P. Furthermore, a fourth yellow light process is also performed on the second side 1B of the substrate 1. The technical implementation is similar to the first yellow light process of the first embodiment, and therefore will not be repeated. As a result, a fourth photoresist trace pattern 9P is developed on the fourth photoresist layer 9 on the second side 1B.

[0091] For example Figure 25 As shown, a second etching process is then simultaneously performed on the first side 1A and the second side 1B of the substrate 1. A second etchant is used to etch the first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 on the substrate 1 to remove the material portions not protected by the third photoresist layer 8 and the fourth photoresist layer 9. The second etchant does not etch the indium tin oxide (ITO) material of the first touch conductive layer 2 and the second touch conductive layer 4. In this embodiment, the second etchant contains at least iron nitrate Fe(NO3)3. The specific implementation techniques of the second etching process are similar to those of the first etching process of the first embodiment, and therefore will not be repeated.

[0092] Finally, a second stripping process is performed to remove the third photoresist layer 8 and the fourth photoresist layer 9 on the substrate 1. The specific implementation technology of the second stripping process is similar to the first stripping process of the first embodiment, so it will not be repeated.

[0093] like Figure 26 and Figure 27 As shown, after the second stripping process is completed, a first auxiliary conductive trace pattern 3P corresponding to the third photoresist trace pattern 8P is etched on the first auxiliary conductive layer 3 on the first side 1A, while the first touch conductive trace pattern 2P formed by the first etching process remains on the first touch conductive layer 2. The first auxiliary conductive trace pattern 3P includes pattern portions of several first micro-auxiliary conductive units 31 and pattern portions of several first auxiliary signal wires 32. In particular, the first micro-auxiliary conductive units 31 are disposed within the region of the first touch sensing electrodes 21A and the second touch sensing electrodes 21B, and their light shielding rate is less than 1%. At least a portion of the first auxiliary signal wires 32 overlaps and is formed within the region of the first signal wires 22.

[0094] Furthermore, a second auxiliary conductive trace pattern 5P corresponding to the fourth photoresist trace pattern 9P is etched on the second auxiliary conductive layer 5 on the second side surface 1B, while the second touch conductive trace pattern 4P formed by the first etching process remains on the second touch conductive layer 4. The second auxiliary conductive trace pattern 5P includes pattern portions of several second micro-auxiliary conductive units 51 and pattern portions of several second auxiliary signal wires 52. In particular, the second micro-auxiliary conductive units 51 are located within the region of the third touch sensing electrodes 41A and the fourth touch sensing electrodes 41B, with a light shielding rate of less than 1%. At least a portion of the second auxiliary signal wires 52 overlaps and is formed within the region of the second signal wires 42.

[0095] In this embodiment, the first touch conductive trace pattern 2P, the first auxiliary conductive trace pattern 3P, the second touch conductive trace pattern 4P, and the second auxiliary conductive trace pattern 5P collectively form two independent touch sensors. The first touch sensing electrode 21A and the first micro-auxiliary conductive unit 31 collectively form a capacitive touch sensing electrode in the first direction (X-axis direction). The third touch sensing electrode 41A and the second micro-auxiliary conductive unit 51 collectively form a capacitive touch sensing electrode in the second direction (Y-axis direction). The first-direction capacitive touch sensing electrodes and the second-direction capacitive touch sensing electrodes collectively form a capacitive touch sensor. The second touch sensing electrode 21B and the first micro-auxiliary conductive unit 31 collectively form an electromagnetic touch sensing electrode in the first direction (X-axis direction). The fourth touch sensing electrode 41A and the second micro-auxiliary conductive unit 51 collectively form an electromagnetic touch sensing electrode in the second direction (Y-axis direction). The first-direction electromagnetic touch sensing electrodes and the second-direction electromagnetic touch sensing electrodes collectively form an electromagnetic touch sensor.

[0096] The present invention achieves the purpose of reducing the surface resistivity of the touch conductive trace patterns 2P and 4P by providing auxiliary conductive trace patterns 3P and 5P. Moreover, within the visible area of ​​the touch sensor, the micro-auxiliary conductive units 31 and 51 provided on the touch sensing electrodes 21A, 21B, 41a, and 41B have an extremely low light shielding rate (below 1%), which has a negligible impact on the visibility.

[0097] like Figures 26 to 29FIGURE 1 illustrates a touch sensor fabricated according to the manufacturing method of the second embodiment of the present invention. The touch sensor structure comprises two independent touch sensors. High-electricity micro-auxiliary conductive units are provided on the touch sensing electrodes, and a high-electricity auxiliary conductive line is electrically connected to the signal conductor. These elements reduce the sheet resistance of the touch sensing electrodes and conductive line, ensuring that the touch sensor meets the required resistance specifications without compromising optical properties.

[0098] The following embodiments illustrate a touch sensor that combines capacitive and electromagnetic sensing. The touch sensor comprises at least a substrate 1, a first touch conductive layer 2, a second touch conductive layer 3, a first auxiliary conductive layer 4, and a second auxiliary conductive layer 5. The substrate 1 is a dielectric material with high light transmittance. The first touch conductive layer 2 and the second touch conductive layer 4 are formed from the same material: a transparent indium tin oxide conductive film with a sheet resistivity between 80 and 150 ohm / sq. The first auxiliary conductive layer 3 and the second auxiliary conductive layer 5 are also formed from the same material: an opaque copper conductive film with a sheet resistivity between 0.05 and 0.2 ohm / sq.

[0099] The substrate 1 is divided into a touch working area and a non-touch working area. The touch working area is located in the center of the substrate 1 , and the non-touch working area is located around the edges of the substrate 1 .

[0100] like Figure 26 and Figure 28 As shown, the first touch conductive layer 2 is disposed on the first side surface 1A of the substrate 1. The first touch conductive layer 2 has a first touch conductive trace pattern 2P. The first touch conductive trace pattern 2P includes a plurality of first touch sensing electrodes 21A, a plurality of second touch sensing electrodes 21B, and a plurality of first signal wires 22. The first touch sensing electrodes 21A and the second touch sensing electrodes 21B are arranged in the touch active area. The first touch sensing electrodes 21A are in the form of a series of rhombuses, and the second touch sensing electrodes 21B are in the form of strips. They are arranged along a first direction (X-axis) and are parallel to and spaced apart from each other. At least one end of each electrode is electrically connected to the first signal wire 22. The first signal wires 22 are arranged in the non-touch active area.

[0101] The first auxiliary conductive layer 3 is electrically connected to the first touch conductive layer 2. The first auxiliary conductive layer 3 has a first auxiliary conductive trace pattern 3P. The first auxiliary conductive trace pattern 3P is formed within the area defined by the first touch conductive trace pattern 2P. The first auxiliary conductive trace pattern 3P includes a plurality of first micro-auxiliary conductive units 31 and a plurality of first auxiliary signal wires 32. The first micro-auxiliary conductive units 31 are formed to overlap within the area of ​​the first touch sensing electrode 21A and the second touch sensing electrode 21B. The first auxiliary signal wires 32 are formed to overlap at least a portion of the area of ​​the first signal wires 22. The first micro-auxiliary conductive units 31 are fine conductors. The fine conductive trace pattern is composed of one or more nanometer-scale dot, line, or surface graphic elements. To avoid interfering with the light transmittance of the first touch sensing electrode 21, the plurality of first micro-auxiliary conductive units 31 are evenly distributed on the surfaces of the first touch sensing electrode 21A and the second touch sensing electrode 21B, and their light shielding rate is preferably less than 1%, more preferably between 0.05% and 0.2%. In the embodiment of the present invention, the first micro-auxiliary conductive unit 31 is one (or more) fine metal wires with a wire width of approximately 8 μm or less, preferably less than 5 μm. The first micro-auxiliary conductive unit 31 is not connected to the first auxiliary signal wire 32.

[0102] See also Figure 26 and Figure 29 As shown, the second touch conductive layer 4 is disposed on the second side surface 1B of the substrate 1. The second touch conductive layer 4 has a second touch conductive trace pattern 4P. The second touch conductive trace pattern 4P includes a plurality of third touch sensing electrodes 41A, a plurality of fourth touch sensing electrodes 41B, and a plurality of second signal wires 42. The plurality of second touch sensing electrodes 41 are arranged in the touch active area. The third touch sensing electrodes 41A are in the form of a series of rhombuses, and the fourth touch sensing electrodes 41B are in the form of long strips. They are arranged along the second direction (Y-axis) and are parallel to and spaced apart from each other. At least one end of each of the third touch sensing electrodes 41A and the fourth touch sensing electrodes 41B are electrically connected to the second signal wires 42. The second signal wires 42 are arranged in the non-touch active area.

[0103] The second auxiliary conductive layer 5 is electrically connected to the second touch conductive layer 4. The second auxiliary conductive layer 5 has a second auxiliary conductive trace pattern 5P. The second auxiliary conductive trace pattern 5P is formed within the area defined by the second touch conductive trace pattern 4P. The second auxiliary conductive trace pattern 5P includes a plurality of second micro auxiliary conductive units 51 and a plurality of second auxiliary signal wires 52. The second micro auxiliary conductive units 51 are formed in an overlapping manner within the area of ​​the third touch sensing electrode 41A and the fourth touch sensing electrode 41B. The second auxiliary signal wires 52 are formed in an overlapping manner. The line 52 is formed to overlap at least a portion of the area of ​​the second signal conductor 42. The second micro-auxiliary conductive unit 51 is a fine conductive trace pattern having the same configuration as the fine conductive trace pattern of the first micro-auxiliary conductive unit 31. To avoid interfering with the light transmittance of the second touch sensing electrode 41, the plurality of second micro-auxiliary conductive units 51 are evenly distributed on the surface of the second touch sensing electrode 41, and their light shielding rate is preferably less than 1%, more preferably between 0.05% and 0.2%. Figure 16 As shown in the figure, in the embodiment of the present invention, the second micro-auxiliary conductive unit 51 is one (or several) metal thin wires, the wire width of the metal thin wire is approximately less than 8μm, preferably less than 5μm, and the second micro-auxiliary conductive unit 51 is not connected to the second auxiliary signal wire 52.

[0104] The first touch conductive trace pattern 2P, the first auxiliary conductive trace pattern 3P, the second touch conductive trace pattern 4P, and the second auxiliary conductive trace pattern 5P collectively form two independent touch sensors. The first touch sensing electrode 21A and the first micro-auxiliary conductive unit 31 collectively form a capacitive touch sensing electrode in the first direction (X-axis direction). The third touch sensing electrode 41A and the second micro-auxiliary conductive unit 51 collectively form a capacitive touch sensing electrode in the second direction (Y-axis direction). The first-direction capacitive touch sensing electrodes and the second-direction capacitive touch sensing electrodes collectively form a capacitive touch sensor. The second touch sensing electrode 21B and the first micro-auxiliary conductive unit 31 collectively form an electromagnetic touch sensing electrode in the first direction (X-axis direction). The fourth touch sensing electrode 41A and the second micro-auxiliary conductive unit 51 collectively form an electromagnetic touch sensing electrode in the second direction (Y-axis direction). The first-direction electromagnetic touch sensing electrodes and the second-direction electromagnetic touch sensing electrodes collectively form an electromagnetic touch sensor. The second auxiliary conductive trace pattern 3P is used to reduce the surface resistivity of the first touch conductive trace pattern 2P, and the second auxiliary conductive trace pattern 5P is used to reduce the surface resistivity of the second touch conductive trace pattern 4P.

[0105] Although the present invention has been disclosed above with reference to the embodiments, they are not intended to limit the present invention. Anyone skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the invention patent application attached hereto.

Claims

1. A method for forming an auxiliary conductive unit on a transparent electrode of a touch sensor, characterized in that: It includes the following steps: Preparing a conductive substrate: sequentially stacking a first touch conductive layer and a first auxiliary conductive layer on a first side of a dielectric substrate, and sequentially stacking a second touch conductive layer and a second auxiliary conductive layer on a second side of the substrate, wherein the first side is opposite to the second side across the substrate, wherein the first touch conductive layer and the second touch conductive layer are transparent conductive films formed of the same material, the first auxiliary conductive layer and the second auxiliary conductive layer are opaque conductive films formed of the same material, the sheet resistivity of the first auxiliary conductive layer is lower than that of the first touch conductive layer, the first auxiliary conductive layer is electrically stacked on the first touch conductive layer, the sheet resistivity of the second auxiliary conductive layer is lower than that of the second touch conductive layer, and the second auxiliary conductive layer is electrically stacked on the second touch conductive layer; A first yellow photoprocess: disposing a first photoresist layer on the first side surface of the substrate, and developing the first photoresist layer to form a first photoresist trace pattern, wherein the first photoresist trace pattern includes at least a pattern portion of a first touch sensing electrode and a pattern portion of a first signal wire, wherein the first touch sensing electrodes are arranged in series along a first direction, and the first signal wire is electrically connected to the first touch sensing electrodes; A second yellow photoprocess: disposing a second photoresist layer on the second side surface of the substrate, and developing the second photoresist layer to form a second photoresist trace pattern, wherein the second photoresist trace pattern includes at least a pattern portion for a second touch sensing electrode and a pattern portion for a second signal conductor, wherein the second touch sensing electrodes are arranged in series along a second direction, and the second signal conductor is electrically connected to the second touch sensing electrodes; A first etching process: etching the first touch conductive layer, the first auxiliary conductive layer, the second touch conductive layer, and the second auxiliary conductive layer using a first etchant to remove material portions not protected by the first photoresist layer and the second photoresist layer; A first stripping process is performed in which the first photoresist layer and the second photoresist layer are removed, and a first touch conductive trace pattern corresponding to the first photoresist trace pattern is formed on the first touch conductive layer and the first auxiliary conductive layer on the first side of the substrate, and a second touch conductive trace pattern corresponding to the second photoresist trace pattern is formed on the second touch conductive layer and the second auxiliary conductive layer on the second side of the substrate; A third yellow photoprocess: disposing a third photoresist layer on the first side surface of the substrate, and developing the third photoresist layer to form a third photoresist trace pattern, wherein the third photoresist trace pattern includes at least a pattern portion of a first micro-auxiliary conductive unit and a pattern portion of a first auxiliary signal wire, wherein the first micro-auxiliary conductive unit is disposed within the region of the first touch sensing electrode, and at least a portion of the first auxiliary signal wire is formed to overlap within the region of the first signal wire; Fourth yellow photoprocess: disposing a fourth photoresist layer on the second side surface of the substrate, and developing the fourth photoresist layer to form a fourth photoresist trace pattern, wherein the fourth photoresist trace pattern includes a pattern portion of at least one second micro-auxiliary conductive unit and a pattern portion of a second auxiliary signal wire, wherein the second micro-auxiliary conductive unit is disposed within the region of the second touch sensing electrode, and at least a portion of the second auxiliary signal wire is formed to overlap within the region of the second signal wire; A second etching process: etching the first auxiliary conductive layer and the second auxiliary conductive layer using a second etchant to remove portions of the material not protected by the third photoresist layer and the fourth photoresist layer, wherein the second etchant does not produce an etching reaction with the materials of the first touch conductive layer and the second touch conductive layer; and A second stripping process is performed: removing the third photoresist layer and the fourth photoresist layer, etching the first auxiliary conductive layer on the first side of the substrate to form a first auxiliary conductive trace pattern corresponding to the third photoresist trace pattern, while the first touch conductive layer still retains the first touch conductive trace pattern; etching the second auxiliary conductive layer on the second side of the substrate to form a second auxiliary conductive trace pattern corresponding to the fourth photoresist trace pattern, while the second touch conductive layer still retains the second touch conductive trace pattern; wherein the first touch conductive trace pattern, the first auxiliary conductive trace pattern, the second touch conductive trace pattern, and the second auxiliary conductive trace pattern together form a touch sensor; the first auxiliary conductive trace pattern is used to reduce the surface resistivity of the first touch conductive trace pattern, and the second auxiliary conductive trace pattern is used to reduce the surface resistivity of the second touch conductive trace pattern.

2. The method for forming an auxiliary conductive unit on a transparent electrode of a touch sensor according to claim 1, wherein: The surface resistivity of the first touch conductive layer and the second touch conductive layer is between 80 and 150 ohm / sq, and the surface resistivity of the first auxiliary conductive layer and the second auxiliary conductive layer is between 0.05 and 0.2 ohm / sq.

3. The method for forming an auxiliary conductive unit on a transparent electrode of a touch sensor according to claim 1, wherein: The material of the first touch conductive layer and the second touch conductive layer is selected from one of indium tin oxide, indium zinc oxide, aluminum zinc oxide, antimony tin oxide, and polyethylene dioxythiophene.

4. The method for forming an auxiliary conductive unit on a transparent electrode of a touch sensor according to claim 1, wherein: The materials of the first auxiliary conductive layer and the second auxiliary conductive layer are selected from gold, silver, copper, aluminum, molybdenum, nickel or alloys thereof.

5. The method for forming an auxiliary conductive unit on a transparent electrode of a touch sensor according to claim 1, wherein: The first etchant is a composite etchant for etching the materials of the first touch conductive layer, the first auxiliary conductive layer, the second touch conductive layer, and the second auxiliary conductive layer.

6. The method for forming an auxiliary conductive unit on a transparent electrode of a touch sensor according to claim 1, wherein: The first touch conductive layer and the second touch conductive layer are formed of an indium tin oxide material, and the first auxiliary conductive layer and the second auxiliary conductive layer are formed of a copper material.

7. The method for forming an auxiliary conductive unit on a transparent electrode of a touch sensor according to claim 6, wherein: The first etchant includes ferric nitrate and hydrochloric acid, and the second etchant is ferric nitrate.

8. The method for forming an auxiliary conductive unit on a transparent electrode of a touch sensor according to claim 1, wherein: The first photoresist layer is developed to form the first photoresist trace pattern, and the second photoresist layer is developed to form the second photoresist trace pattern, and both are performed simultaneously.

9. The method for forming an auxiliary conductive unit on a transparent electrode of a touch sensor according to claim 1, wherein: The third photoresist layer is developed to form the third photoresist trace pattern, and the fourth photoresist layer is developed to form the fourth photoresist trace pattern, and both are performed simultaneously.

10. A touch sensor manufactured by the manufacturing method according to any one of claims 1 to 9, characterized in that: Include: A substrate, which is a plate material with dielectric properties and high light transmittance, and is defined on the substrate as a touch active area and a non-touch active area, wherein the touch active area is located in the center of the substrate, and the non-touch active area is located at the edges of the substrate; a first touch conductive layer, comprising a transparent conductive film, disposed on the first side of the substrate, the first touch conductive layer having a first touch conductive trace pattern, the first touch conductive trace pattern including a plurality of first touch sensing electrodes and a plurality of first signal wires, wherein the plurality of first touch sensing electrodes are arranged in the touch active area, each of the first touch sensing electrodes being arranged in a serial pattern along a first direction, and at least one end of each of the first touch sensing electrodes being electrically connected to one of the plurality of first signal wires, and the plurality of first signal wires being arranged in the non-touch active area; a first auxiliary conductive layer, comprising an opaque conductive film electrically bonded to the first touch conductive layer; the first auxiliary conductive layer having a lower sheet resistivity than the first touch conductive layer; and a first auxiliary conductive trace pattern formed within an area defined by the first touch conductive trace pattern. The first auxiliary conductive trace pattern includes a plurality of first micro-auxiliary conductive units and a plurality of first auxiliary signal wires. The first micro-auxiliary conductive units are formed to overlap within the area of ​​the first touch sensing electrodes, and the first auxiliary signal wires are formed to overlap within at least a portion of the area of ​​the first signal wires. a second touch conductive layer, which is a transparent conductive film and is disposed on the second side of the substrate. The second touch conductive layer has a second touch conductive trace pattern, and the second touch conductive trace pattern includes a plurality of second touch sensing electrodes and a plurality of second signal wires. The plurality of second touch sensing electrodes are arranged in the touch active area, and each of the second touch sensing electrodes is arranged in a serial manner along a second direction. At least one end of each of the second touch sensing electrodes is electrically connected to one of the plurality of second signal wires. The plurality of second signal wires are arranged in the non-touch active area, and the second direction is orthogonal to the first direction. a second auxiliary conductive layer, comprising an opaque conductive film, electrically bonded to the second touch conductive layer; the second auxiliary conductive layer having a lower sheet resistivity than the second touch conductive layer; and a second auxiliary conductive trace pattern formed within an area defined by the second touch conductive trace pattern. The second auxiliary conductive trace pattern comprises a plurality of second micro-auxiliary conductive units and a plurality of second auxiliary signal wires. The second micro-auxiliary conductive units are overlapped within the area of ​​the second touch sensing electrodes, and the second auxiliary signal wires are overlapped within at least a portion of the area of ​​the second signal wires. The first touch conductive trace pattern, the first auxiliary conductive trace pattern, the second touch conductive trace pattern, and the second auxiliary conductive trace pattern together form a touch sensor. The first auxiliary conductive trace pattern is configured to reduce the sheet resistivity of the first touch conductive trace pattern, and the second auxiliary conductive trace pattern is configured to reduce the sheet resistivity of the second touch conductive trace pattern.

11. The touch sensor according to claim 10, wherein: The surface resistivity of the first touch conductive layer and the second touch conductive layer is between 80 and 150 ohm / sq, and the surface resistivity of the first auxiliary conductive layer and the second auxiliary conductive layer is between 0.05 and 0.2 ohm / sq.

12. The touch sensor according to claim 10, wherein: The first touch conductive layer and the second touch conductive layer are formed of an indium tin oxide material, and the first auxiliary conductive layer and the second auxiliary conductive layer are formed of a copper material.

13. The touch sensor according to claim 10, wherein: The first micro auxiliary conductive unit and the second micro auxiliary conductive unit are both a fine conductive trace pattern, and the fine conductive trace pattern is composed of one or a combination of several graphic elements of nano-scale points, lines or surfaces.

14. The touch sensor according to claim 13, wherein: The first micro-auxiliary conductive units are evenly distributed on the surface of the first touch sensing electrode, and a light shielding rate of the first micro-auxiliary conductive units is less than 1%. The second micro-auxiliary conductive units are evenly distributed on the surface of the second touch sensing electrode, and a light shielding rate of the second micro-auxiliary conductive units is less than 1%.

15. The touch sensor according to claim 14, wherein: The shading rate is between 0.05% and 0.2%.

16. The touch sensor according to claim 13, wherein: The first micro auxiliary conductive unit and the second micro auxiliary conductive unit are each one or more metal thin wires, and the wire diameter width of the metal thin wire is less than 8 μm.

17. The touch sensor according to claim 10, wherein: The first micro auxiliary conductive unit is not connected to the first auxiliary signal wire, and the second micro auxiliary conductive unit is not connected to the second auxiliary signal wire.

18. A method for forming an auxiliary conductive unit on a transparent electrode of a multi-touch sensor, characterized in that: It includes the following steps: Preparing a conductive substrate: sequentially stacking a first touch conductive layer and a first auxiliary conductive layer on a first side of a dielectric substrate, and sequentially stacking a second touch conductive layer and a second auxiliary conductive layer on a second side of the substrate, wherein the first side is opposite to the second side across the substrate, wherein the first touch conductive layer and the second touch conductive layer are transparent conductive films formed of the same material, the first auxiliary conductive layer and the second auxiliary conductive layer are opaque conductive films formed of the same material, the sheet resistivity of the first auxiliary conductive layer is lower than that of the first touch conductive layer, the first auxiliary conductive layer is electrically stacked on the first touch conductive layer, the sheet resistivity of the second auxiliary conductive layer is lower than that of the second touch conductive layer, and the second auxiliary conductive layer is electrically stacked on the second touch conductive layer; A first yellow photoprocess: disposing a first photoresist layer on the first side surface of the substrate, and developing the first photoresist layer to form a first photoresist trace pattern, wherein the first photoresist trace pattern includes at least pattern portions of a plurality of first touch sensing electrodes, pattern portions of a plurality of second touch sensing electrodes, and pattern portions of a plurality of first signal wires, wherein the first touch sensing electrodes and the second touch sensing electrodes are arranged in series along a first direction, parallel to each other, and spaced apart, and at least one end edge of the first touch sensing electrode and the second touch sensing electrode is electrically connected to one of the plurality of first signal wires; a second yellow photoprocess: disposing a second photoresist layer on the second side surface of the substrate, and developing the second photoresist layer to form a second photoresist trace pattern, wherein the second photoresist trace pattern includes at least pattern portions of a plurality of third touch sensing electrodes, pattern portions of a plurality of fourth touch sensing electrodes, and pattern portions of a plurality of second signal wires, wherein the third touch sensing electrodes and the fourth touch sensing electrodes are arranged in series along the second direction, parallel to each other, and spaced apart, and at least one edge of the third touch sensing electrode and the fourth touch sensing electrode is electrically connected to one of the plurality of second signal wires; A first etching process: etching the first touch conductive layer, the first auxiliary conductive layer, the second touch conductive layer, and the second auxiliary conductive layer using a first etchant to remove material portions not protected by the first photoresist layer and the second photoresist layer; A first stripping process is performed in which the first photoresist layer and the second photoresist layer are removed, and a first touch conductive trace pattern corresponding to the first photoresist trace pattern is formed on the first touch conductive layer and the first auxiliary conductive layer on the first side of the substrate, and a second touch conductive trace pattern corresponding to the second photoresist trace pattern is formed on the second touch conductive layer and the second auxiliary conductive layer on the second side of the substrate; A third yellow light process: disposing a third photoresist layer on the first side surface of the substrate, and developing the third photoresist layer to form a third photoresist trace pattern, wherein the third photoresist trace pattern includes pattern portions of a plurality of first micro-auxiliary conductive units and pattern portions of a plurality of first auxiliary signal wires, wherein the plurality of first micro-auxiliary conductive units are disposed within the region of the first touch sensing electrodes and the second touch sensing electrodes, and at least a portion of the plurality of first auxiliary signal wires overlaps and is formed within the region of the first signal wires; Fourth yellow photoprocess: disposing a fourth photoresist layer on the second side surface of the substrate, and developing the fourth photoresist layer to form a fourth photoresist trace pattern, wherein the fourth photoresist trace pattern includes pattern portions of a plurality of second micro-auxiliary conductive units and pattern portions of a plurality of second auxiliary signal wires, wherein the plurality of second micro-auxiliary conductive units are disposed within the region of the third touch sensing electrodes and the fourth touch sensing electrodes, and the plurality of second auxiliary signal wires are formed so as to overlap with at least a portion of each other within the region of the second signal wires; A second etching process: etching the first auxiliary conductive layer and the second auxiliary conductive layer using a second etchant to remove portions of the material not protected by the third photoresist layer and the fourth photoresist layer, wherein the second etchant does not produce an etching reaction with the materials of the first touch conductive layer and the second touch conductive layer; and A second stripping process is performed: removing the third photoresist layer and the fourth photoresist layer, etching the first auxiliary conductive layer on the first side of the substrate to form a first auxiliary conductive trace pattern corresponding to the third photoresist trace pattern, while the first touch conductive trace pattern is retained on the first touch conductive layer; etching the second auxiliary conductive layer on the second side of the substrate to form a second auxiliary conductive trace pattern corresponding to the fourth photoresist trace pattern, while the second touch conductive layer is retained on the second touch conductive layer; wherein the first touch conductive trace pattern, the first auxiliary conductive trace pattern, the second touch conductive trace pattern, and the second auxiliary conductive trace pattern together form at least two independent touch sensors; the first auxiliary conductive trace pattern is used to reduce the surface resistivity of the first touch conductive trace pattern, and the second auxiliary conductive trace pattern is used to reduce the surface resistivity of the second touch conductive trace pattern.

19. The method for forming an auxiliary conductive unit on a transparent electrode of a multi-touch sensor according to claim 18, wherein: The surface resistivity of the first touch conductive layer and the second touch conductive layer is between 80 and 150 ohm / sq, and the surface resistivity of the first auxiliary conductive layer and the second auxiliary conductive layer is between 0.05 and 0.2 ohm / sq.

20. The method for forming an auxiliary conductive unit on a transparent electrode of a multi-touch sensor according to claim 18, wherein: The material of the first touch conductive layer and the second touch conductive layer is selected from one of indium tin oxide, indium zinc oxide, aluminum zinc oxide, antimony tin oxide, and polyethylene dioxythiophene.

21. The method for forming an auxiliary conductive unit on a transparent electrode of a multi-touch sensor according to claim 18, wherein: The materials of the first auxiliary conductive layer and the second auxiliary conductive layer are selected from gold, silver, copper, aluminum, molybdenum, nickel or alloys thereof.

22. The method for forming an auxiliary conductive unit on a transparent electrode of a multi-touch sensor according to claim 18, wherein: The first etchant is a composite etchant for etching the materials of the first touch conductive layer, the first auxiliary conductive layer, the second touch conductive layer, and the second auxiliary conductive layer.

23. The method for forming an auxiliary conductive unit on a transparent electrode of a multi-touch sensor according to claim 18, wherein: The first touch conductive layer and the second touch conductive layer are formed of an indium tin oxide material, and the first auxiliary conductive layer and the second auxiliary conductive layer are formed of a copper material.

24. The method for forming an auxiliary conductive unit on a transparent electrode of a multi-touch sensor according to claim 23, wherein: The first etchant includes ferric nitrate and hydrochloric acid, and the second etchant is ferric nitrate.

25. The method for forming an auxiliary conductive unit on a transparent electrode of a multi-touch sensor according to claim 18, wherein: The first photoresist layer is developed to form the first photoresist trace pattern, and the second photoresist layer is developed to form the second photoresist trace pattern, and both are performed simultaneously.

26. The method for forming an auxiliary conductive unit on a transparent electrode of a multi-touch sensor according to claim 18, wherein: The third photoresist layer is developed to form the third photoresist trace pattern, and the fourth photoresist layer is developed to form the fourth photoresist trace pattern, and both are performed simultaneously.

27. The method for forming an auxiliary conductive unit on a transparent electrode of a multi-touch sensor according to claim 18, wherein: The first touch sensing electrode and the first micro-auxiliary conductive unit together form a first-direction capacitive touch sensing electrode, the third touch sensing electrode and the second micro-auxiliary conductive unit together form a second-direction capacitive touch sensing electrode, and a plurality of the first-direction capacitive touch sensing electrodes and a plurality of the second-direction capacitive touch sensing electrodes together form a capacitive touch sensor.

28. The method for forming an auxiliary conductive unit on a transparent electrode of a multi-touch sensor according to claim 18, wherein: The second touch sensing electrode and the first micro-auxiliary conductive unit together form a first-direction electromagnetic touch sensing electrode, the fourth touch sensing electrode and the second micro-auxiliary conductive unit together form a second-direction electromagnetic touch sensing electrode, and the first-direction electromagnetic touch sensing electrode and the second-direction electromagnetic touch sensing electrode together form an electromagnetic touch sensor.

29. A touch sensor manufactured by the manufacturing method according to any one of claims 18 to 28, characterized in that: Include: A substrate, which is a plate material with dielectric properties and high light transmittance, and is defined on the substrate as a touch active area and a non-touch active area, wherein the touch active area is located in the center of the substrate, and the non-touch active area is located at the edges of the substrate; a first touch conductive layer, which is a transparent conductive film and is disposed on the first side of the substrate. The first touch conductive layer has a first touch conductive trace pattern, which includes a plurality of first touch sensing electrodes, a plurality of second touch sensing electrodes, and a plurality of first signal wires. The plurality of first touch sensing electrodes and the plurality of second touch sensing electrodes are arranged in the touch active area. The first touch sensing electrodes and the second touch sensing electrodes are arranged in series along a first direction, parallel to each other, and spaced apart. At least one edge of the first touch sensing electrode and the second touch sensing electrode is electrically connected to one of the plurality of first signal wires. The plurality of first signal wires are arranged in the non-touch active area. a first auxiliary conductive layer, comprising an opaque conductive film, electrically bonded to the first touch conductive layer; the first auxiliary conductive layer having a lower sheet resistivity than the first touch conductive layer; and a first auxiliary conductive trace pattern formed within an area defined by the first touch conductive trace pattern. The first auxiliary conductive trace pattern includes a plurality of first micro-auxiliary conductive units and a plurality of first auxiliary signal wires. The first micro-auxiliary conductive units are formed to overlap within the area of ​​the first touch sensing electrodes and the second touch sensing electrodes, and the first auxiliary signal wires are formed to overlap within at least a portion of the area of ​​the first signal wires. a second touch conductive layer, which is a transparent conductive film and is disposed on the second side surface of the substrate. The second touch conductive layer has a second touch conductive trace pattern, and the second touch conductive trace pattern includes a plurality of third touch sensing electrodes, a plurality of fourth touch sensing electrodes, and a plurality of second signal wires. The plurality of third touch sensing electrodes and the plurality of fourth touch sensing electrodes are arranged in the touch active area. The third touch sensing electrodes and the fourth touch sensing electrodes are arranged in series along a second direction, parallel to each other, and spaced apart. At least one edge of the third touch sensing electrodes and the fourth touch sensing electrodes is electrically connected to one of the plurality of second signal wires. The plurality of second signal wires are arranged in the non-touch active area. The second direction is orthogonal to the first direction. a second auxiliary conductive layer, comprising an opaque conductive film, electrically bonded to the second touch conductive layer; the second auxiliary conductive layer having a lower sheet resistivity than the second touch conductive layer; and a second auxiliary conductive trace pattern formed within an area defined by the second touch conductive trace pattern. The second auxiliary conductive trace pattern comprises a plurality of second micro-auxiliary conductive units and a plurality of second auxiliary signal wires. The second micro-auxiliary conductive units are overlapped within the area of ​​the third touch sensing electrode and the fourth touch sensing electrode, and the second auxiliary signal wires are overlapped within at least a portion of the area of ​​the second signal wires. The first touch conductive trace pattern, the first auxiliary conductive trace pattern, the second touch conductive trace pattern, and the second auxiliary conductive trace pattern together form at least two independent touch sensors. The first auxiliary conductive trace pattern is used to reduce the sheet resistivity of the first touch conductive trace pattern, and the second auxiliary conductive trace pattern is used to reduce the sheet resistivity of the second touch conductive trace pattern.

30. The touch sensor according to claim 29, wherein: The surface resistivity of the first touch conductive layer and the second touch conductive layer is between 80 and 150 ohm / sq, and the surface resistivity of the first auxiliary conductive layer and the second auxiliary conductive layer is between 0.05 and 0.2 ohm / sq.

31. The touch sensor according to claim 29, wherein: The first touch conductive layer and the second touch conductive layer are formed of an indium tin oxide material, and the first auxiliary conductive layer and the second auxiliary conductive layer are formed of a copper material.

32. The touch sensor according to claim 29, wherein: The first micro auxiliary conductive unit and the second micro auxiliary conductive unit are both a fine conductive trace pattern, and the fine conductive trace pattern is composed of one or a combination of several graphic elements of nano-scale points, lines or surfaces.

33. The touch sensor according to claim 32, wherein: The first micro-auxiliary conductive units are evenly distributed on the surfaces of the first touch sensing electrode and the second touch sensing electrode, and a light shielding rate of the first micro-auxiliary conductive units is less than 1%. The second micro-auxiliary conductive units are evenly distributed on the surfaces of the third touch sensing electrode and the fourth touch sensing electrode, and a light shielding rate of the second micro-auxiliary conductive units is less than 1%.

34. The touch sensor according to claim 33, wherein: The shading rate is between 0.05% and 0.2%.

35. The touch sensor according to claim 32, wherein: The first micro auxiliary conductive unit and the second micro auxiliary conductive unit are each one or more metal thin wires, and the wire diameter width of the metal thin wire is less than 8 μm.

36. The touch sensor according to claim 29, wherein: The first micro auxiliary conductive unit is not connected to the first auxiliary signal wire, and the second micro auxiliary conductive unit is not connected to the second auxiliary signal wire.

37. The touch sensor according to claim 29, wherein: The first touch sensing electrode and the first micro-auxiliary conductive unit together form a first-direction capacitive touch sensing electrode, the third touch sensing electrode and the second micro-auxiliary conductive unit together form a second-direction capacitive touch sensing electrode, and a plurality of the first-direction capacitive touch sensing electrodes and a plurality of the second-direction capacitive touch sensing electrodes together form a capacitive touch sensor.

38. The touch sensor according to claim 29, wherein: The second touch sensing electrode and the first micro-auxiliary conductive unit together form a first-direction electromagnetic touch sensing electrode, the fourth touch sensing electrode and the second micro-auxiliary conductive unit together form a second-direction electromagnetic touch sensing electrode, and a plurality of the first-direction electromagnetic touch sensing electrodes and a plurality of the second-direction electromagnetic touch sensing electrodes together form an electromagnetic touch sensor.

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