Light emitting diode module and display apparatus having the same

Abstract

A light-emitting diode (LED) module and a display device having the LED module are provided, the LED module enabling free structural design using fan-out interconnects and insulating layers. The LED module having a multilayer structure includes: a substrate; LEDs on the substrate configured to emit light toward the substrate; a plurality of upper electrodes on and connected to the LEDs; an upper insulating layer surrounding the plurality of upper electrodes; glass-on-glass (FOG) electrodes on the upper insulating layer; and a fan-out interconnect structure configured to connect the plurality of upper electrodes to the FOG electrodes through the upper insulating layer.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 2019-0127144, filed with the Korean Intellectual Property Office on October 14, 2019, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to an LED module that uses light-emitting diodes (LEDs) to display images and a display device having the LED module. Background Technology

[0004] A display device is a device that converts electrical information into visual information and displays that visual information. Display devices can include not only televisions and monitors, but also portable devices such as personal computers (PCs), smartphones, tablets, and wearable devices.

[0005] Display devices may include non-light-emitting display panels such as liquid crystal displays (LCDs) and light-emitting display panels that generate light corresponding to signals.

[0006] To realize light-emitting display panels, light-emitting diodes (LEDs) have been actively researched. LEDs are devices that use the properties of compound semiconductors to convert electrical signals into light (such as infrared and visible light). They are not only used in home appliances, remote controls, electronic boards, and various automation equipment, but are also becoming widely used, such as in small handheld electronic devices and large display devices.

[0007] Recently, microLED or μLED display panels have been used in display devices. MicroLED display panels are flat panel displays composed of multiple inorganic LEDs with a size of 100 micrometers or less. Compared to LCD panels that require backlighting, microLED display panels offer better contrast, response time, and energy efficiency. Furthermore, although both organic LEDs and microLEDs (inorganic LEDs) have high energy efficiency, microLEDs offer better brightness, luminous efficacy, and lifespan than OLEDs. Summary of the Invention

[0008] Therefore, the purpose of this disclosure is to provide a light-emitting diode (LED) module and a display device having the LED module, which allows for flexible structural design using fan-out interconnects and insulating layers.

[0009] Other aspects of this disclosure will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practice of this disclosure.

[0010] According to one aspect of this disclosure, a light-emitting diode (LED) module having a multilayer structure is provided, the LED module comprising: a substrate; an LED on the substrate configured to emit light toward the substrate; a plurality of upper electrodes on and connected to the LED; an upper insulating layer surrounding the plurality of upper electrodes; a glass-on-film (FOG) electrode on the upper insulating layer; and a fan-out interconnect structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer.

[0011] The upper insulating layer can be formed from a first layer that is different from the second layer on which the LEDs are mounted.

[0012] An insulating layer can be placed between the FOG electrode and the LED to protect the LED.

[0013] The upper insulating layer may include through holes corresponding to multiple upper electrodes.

[0014] The fan-out interconnect structure can be formed separately from the interconnect structure connected to the LED.

[0015] The LED module may further include: a thin-film transistor (TFT) disposed on a substrate and having a gate electrode, wherein a plurality of upper electrodes include a first upper electrode connected to a signal electrode and a second upper electrode connected to the gate electrode, the signal electrode being configured to provide a data signal to the LED, and wherein a FOG electrode is connected to the first upper electrode and the second upper electrode, which are respectively connected to the signal electrode and the gate electrode, and is connected to the FOG electrode through a fan-out interconnect structure.

[0016] The plurality of upper electrodes may include: a third upper electrode connected to a power supply voltage electrode that supplies power to the LED; and a fourth upper electrode connected to a reference voltage electrode connected to the cathode of the LED, wherein the FOG electrode is connected to the third and fourth upper electrodes respectively to the power supply voltage electrode and the reference voltage electrode to be connected to the FOG electrode via a fan-out interconnect structure.

[0017] The fan-out interconnect structure, which is connected to the power supply voltage electrode and the reference voltage electrode respectively, can form a symmetrical structure with respect to the FOG electrode.

[0018] According to another aspect of this disclosure, a display device is provided, comprising: a light-emitting diode (LED) module having a multilayer structure; a driver integrated chip (IC) configured to drive the LED module; a glass-on-film (FOG) electrode located on the LED module and configured to be connected to the driver IC; and a controller configured to provide power to the LED module via the driver IC. The LED module includes: a substrate; LEDs on the substrate configured to emit light toward the substrate; a plurality of upper electrodes on and connected to the LEDs; an upper insulating layer surrounding the plurality of upper electrodes; glass-on-film (FOG) electrodes on the upper insulating layer; and a fan-out interconnect structure configured to connect the plurality of upper electrodes to the FOG electrodes via the upper insulating layer.

[0019] The upper insulating layer can be formed from a first layer that is different from the second layer on which the LEDs are mounted.

[0020] An upper insulating layer can be placed between the FOG electrode and the LED to protect the LED.

[0021] The upper insulating layer may include through-holes corresponding to multiple upper electrodes.

[0022] The fan-out interconnect structure can be formed separately from the interconnect structure connected to the LED.

[0023] The display device may further include a thin-film transistor (TFT) disposed on a substrate and having a gate electrode, wherein a plurality of upper electrodes include a first upper electrode connected to a signal electrode and a second upper electrode connected to a gate electrode, the signal electrode being configured to provide a data signal to an LED, and wherein a FOG electrode is connected to the first upper electrode and the second upper electrode, which are respectively connected to the signal electrode and the gate electrode, and is connected to the FOG electrode through a fan-out interconnect structure.

[0024] The plurality of upper electrodes may include: a third upper electrode connected to a power supply voltage electrode that supplies power to the LED; and a fourth upper electrode connected to a reference voltage electrode connected to the cathode of the LED, wherein the FOG electrode is connected to the third and fourth upper electrodes respectively to the power supply voltage electrode and the reference voltage electrode to be connected to the FOG electrode via a fan-out interconnect structure.

[0025] The fan-out interconnect structure, which is connected to the power supply voltage electrode and the reference voltage electrode respectively, can form a symmetrical structure with respect to the FOG electrode.

[0026] The fan-out interconnect structure can form a symmetrical structure relative to the FOG electrode, in which the driver IC supplies power to the LED through the FOG electrode.

[0027] The plurality of upper electrodes may include: a third upper electrode connected to a power supply voltage electrode; and a fourth upper electrode connected to a reference voltage electrode; and wherein the FOG electrode connection is respectively connected to the third upper electrode and the fourth upper electrode connected to the power supply voltage electrode and the reference voltage electrode to be connected to the FOG electrode via a fan-out interconnect structure.

[0028] The driver IC can supply power to the LED in a substantially uniform manner through a fan-out interconnect structure.

[0029] According to another aspect of this disclosure, a light-emitting diode (LED) module is provided, comprising: a substrate; a first insulating layer on the substrate; a light-emitting diode (LED) on the first insulating layer; a second insulating layer on and surrounding the LED; a plurality of upper electrodes on and connected to the LED; an upper insulating layer on and surrounding the plurality of upper electrodes; a third insulating layer on the upper insulating layer; a glass-on-film (FOG) electrode on the third insulating layer; and a fan-out interconnect structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer.

[0030] According to another aspect of this disclosure, a method for forming a light-emitting diode (LED) module having a multilayer structure is provided, the method comprising: providing a substrate; forming an LED on the substrate; forming a plurality of upper electrodes on the LED for connection to the LED; forming an upper insulating layer surrounding the plurality of upper electrodes; providing a glass-on-film (FOG) electrode on the upper insulating layer; and forming a fan-out interconnect structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer. Attached Figure Description

[0031] These and / or other aspects of this disclosure will become apparent and more readily understood from the following description of embodiments, taken in conjunction with the accompanying drawings.

[0032] Figure 1A This is a diagram showing the appearance of a display device according to an embodiment of the present invention.

[0033] Figure 1B This is a control block diagram of a display device according to an embodiment of the present invention.

[0034] Figure 2 This is an exploded perspective view showing a display device according to an embodiment of the present disclosure;

[0035] Figure 3 This is a schematic diagram illustrating the structure of an LED module according to an embodiment of the present invention.

[0036] Figure 4 It shows the setting Figure 3 The diagram shows the circuit diagram of the sub-pixel circuit in the sub-pixel region of the LED module.

[0037] Figure 5 This is a diagram illustrating the structure in which the upper electrode 500 is provided independently of the interconnect structure connected to the LED, according to an embodiment.

[0038] Figure 6A This is a diagram showing step-by-step the operation of a manufacturing method for a display device according to an embodiment.

[0039] Figure 6B This is a diagram showing step-by-step the operation of a manufacturing method for a display device according to an embodiment.

[0040] Figure 6C This is a diagram showing step-by-step the operation of a manufacturing method for a display device according to an embodiment.

[0041] Figure 6D This is a diagram showing step-by-step the operation of a manufacturing method for a display device according to an embodiment.

[0042] Figure 6E This is a diagram showing step-by-step the operation of a manufacturing method for a display device according to an embodiment.

[0043] Figure 7A This is a top view of the LED module according to an embodiment; and

[0044] Figure 7B This is a top view of the LED module according to an embodiment. Specific Implementation

[0045] The embodiments set forth herein and shown in the configurations of this disclosure are merely exemplary embodiments and do not represent the full technical spirit of this disclosure. Therefore, it should be understood that they may be replaced by various equivalents and modifications at the time of this disclosure.

[0046] As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. In the accompanying drawings, the shape and size of each component shown may be enlarged for clarity. Throughout the drawings and detailed description, unless otherwise stated, the same reference numerals will be understood to denote the same elements, features, and structures.

[0047] It will be further understood that when the terms “comprising,” “including,” “containing,” and / or “having” are used herein, they specify the presence of the said feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0048] It should be understood that although the terms first, second, etc., may be used here to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0049] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0050] Figure 1A This is a diagram showing the appearance of a display device 1 according to an embodiment of the present disclosure. Figure 1B This is a control block diagram of a display device 1 according to an embodiment of the present disclosure.

[0051] Figure 2 This is an exploded perspective view showing a display device 1 according to an embodiment of the present disclosure. Figure 3 This is a diagram schematically illustrating the structure of an LED module according to an embodiment of the present disclosure.

[0052] Figure 4 It shows the setting Figure 3 The diagram shows a circuit diagram of the sub-pixel circuit in the sub-pixel region of the LED module. The display device 1 can display an image from an electrical signal received from an external source.

[0053] Specifically, the display device 1 can control the color of each of a plurality of pixels in a predetermined display area so that the user can recognize the display area as an image.

[0054] exist Figure 1A The diagram shows the mutually perpendicular X, Y, and Z axes. The X-axis refers to the left-right direction, the Y-axis refers to the up-down direction, and the Z-axis refers to the front-back direction.

[0055] Display device 1 is a device that displays information, materials, data, etc., as characters, graphics, charts, images, etc., and can be used as billboards, electronic signs, screens, televisions, monitors, etc. Display devices can be installed on walls or ceilings, or can be installed on the ground indoors or outdoors using brackets.

[0056] Display device 1 may include a light-emitting diode (LED) module 110 for a display screen and a frame 20 coupled to the rear of the LED module 110 to support the LED module 110. According to an embodiment, display device 1 may include a plurality of LED modules 110(a)-110(f) assembled to form a display panel, and a plurality of frames 20(a)-20(d) coupled to the rear of the LED modules 110(a)-110(f) to support the LED modules 110(a)-110(f).

[0057] Reference Figure 1B This shows a control block diagram of a display device 1 according to an embodiment.

[0058] Display device 1, as an example of an electronic device, is a device capable of processing image signals received from the outside and visually displaying the processed image. For example, display device 1 can be implemented in various forms, such as monitors and portable multimedia devices, and the form is not limited as long as it can visually display images.

[0059] like Figure 1B As shown, the display device 1 includes: an input device 710 that receives control commands from a user; a content receiver 720 that receives content including images and sounds from an external device; an image processor 730 that processes image data included in the content; a display 100 that displays an image corresponding to the image data included in the content; an audio output device 750 that outputs sound corresponding to the sound data included in the content; and a main controller 790 that controls the overall operation of the display device 1.

[0060] According to an embodiment, the input device 710 may be an input circuit or input interface configured to receive control commands from a user. Furthermore, according to an embodiment, the audio output device 750 may be an output circuit or output interface configured to output sound.

[0061] Here, the input device 710 may include a button group 711, which receives various control commands from the user.

[0062] For example, the button group 711 includes: a volume button for adjusting the volume of the sound output from the sound outputter 750, a channel button for changing the communication channel received by the content receiver 720, and a power button for turning the power on / off the display device 1. Furthermore, the input device 710 can receive various control commands related to the operation of the display device 1 and the Internet of Things (IoT) device from the user via the button group 711 as described above, and there are no limitations on the input device 710.

[0063] On the other hand, the various buttons included in the button assembly 711 employ push-button switches and membrane switches that sense the user's pressure, or touch switches that sense contact with the user's body parts. However, this disclosure is not limited to this, and the button assembly 711 may employ various input devices capable of outputting electrical signals in response to specific user operations.

[0064] Furthermore, the input device 710 may include a remote control that receives control commands from a user at a remote site and sends the received user control commands to the display device 1. Additionally, the input device 710 may include various components generally known to be capable of receiving control commands from a user. Furthermore, when the LED module 110 is implemented as a touchscreen type, the LED module 110 can be used as the input device 710.

[0065] For example, the input device 710 can receive control commands related to the IoT device from the user via the button group 711, a remote control, or a display implemented as a touchscreen as described above. Therefore, the input device 710 can send control commands related to the IoT device to the controller 790 via control signals.

[0066] Content receiver 720 can receive various types of content from various external devices. For example, content receiver 720 can receive content from an antenna that receives broadcast signals wirelessly, a set-top box that receives broadcasts wirelessly or wiredly and converts the signals appropriately, and a multimedia playback device that reproduces content stored on multimedia storage media (such as DVD players, CD players, Blu-ray players, etc.).

[0067] Specifically, the content receiver 720 may include: a connector 721 or more connectors connected to an external device; a receive path selector 723 that selects a path for receiving content from the multiple connectors; and a tuner 725 that selects a channel (or frequency) for receiving broadcast signals.

[0068] Connector 721 may include: a coaxial cable connector for receiving broadcast signals containing content from an antenna; a high-definition multimedia interface (HDMI) connector for receiving content from a set-top box or multimedia player; a component video connector; a composite video connector; a D-sub connector, etc.

[0069] The receive path selector 723 selects the connector 721 to be used for receiving content from the plurality of connectors mentioned above. For example, the receive path selector 723 can automatically select the connector 721 through which it has already received content, or manually select the connector 721 through which it will receive content, based on the user's control command.

[0070] When receiving broadcast signals, tuner 725 extracts the transmission signal of a specific frequency (channel) from various signals received through an antenna, etc. In other words, tuner 725 can select the channel (or frequency) for receiving content based on the user's channel selection command.

[0071] At the same time, refer to Figure 1B The display device 1 may be equipped with an image processor 730. The image processor 730 can process the image content included in the content received by the content receiver 720 and provide the processed image data to the display 100.

[0072] In this case, the image processor 730 may include, for example: Figure 1BThe graphics processor 731 and graphics memory 733 are shown. The graphics processor 731 and graphics memory 733 are implemented as separate single chips. However, the graphics processor 731 and graphics memory 733 are not limited to being implemented as a single chip, and the graphics processor 731 and graphics memory 733 can be integrated and implemented on a single chip.

[0073] The graphics processor 731 can process image data stored in the graphics memory 733 according to the image processing program stored in the graphics memory 733. In addition, the graphics memory 733 can store the image processing program and image processing information for image processing, or it can temporarily store image information output from the graphics processor 731 or image information received from the content receiver 720.

[0074] At the same time, refer to Figure 1B The display device 100 may include a display 1. The display device 100 may include an LED module 110 for visually displaying images and a driver integrated chip (IC) 900 for driving the LED module 110.

[0075] LED module 110 may include pixels that serve as units for displaying images. Each pixel may receive an electrical signal representing image data and output a light signal corresponding to the received electrical signal. In this way, the light signals output from multiple pixels included in LED module 110 are combined, thereby displaying an image on LED module 110.

[0076] Furthermore, depending on the method by which each pixel outputs a light signal, the LED module 110 can be classified into several types. For example, the LED module 110 can be classified into a light-emitting display where the pixels emit light themselves, a transmissive display that blocks or transmits light emitted from a backlight source, and a reflective display that reflects or absorbs light incident from an external light source.

[0077] Here, the LED module 110 can be provided using cathode ray tube (CRT) display panels, liquid crystal display (LCD) panels, LED panels, organic OLED, plasma display panels (PDP), field emission display (FED) panels, etc., and there are no restrictions on the LED module 110.

[0078] However, the LED module 110 is not limited to this and can use various display devices, as long as they can visually display an image corresponding to the image data. Meanwhile, the display panel 20 can be simply referred to as a monitor.

[0079] The driver IC 900 can receive image data from the image processor 730 according to control signals from the controller 790, and drive the LED module 110 to display an image corresponding to the received data. According to an embodiment, the driver IC can drive the LED module 110 in conjunction with a thin-film-on-glass (FOG) electrode, which will be described below.

[0080] Additionally, display device 1 may be equipped with a sound output device 750.

[0081] The sound output device 750 can receive sound information from the content receiver 720 and output sound according to the control signal from the main controller 790. In this case, the sound output device 750 may include one, two or more speakers 751 for converting electrical signals into sound signals.

[0082] Additionally, the display device 1 may be equipped with an infrared receiver 760.

[0083] The infrared receiver 760 can receive infrared signals. For example, an infrared transmitter can be incorporated into a remote control. When the remote control receives a control command from the user, it converts the command into an infrared signal and transmits it via the infrared transmitter. Therefore, the infrared receiver 760 can receive the infrared signal and identify the control command from it. The infrared receiver 760 can be implemented using various methods known to those skilled in the art without limitation.

[0084] At the same time, such as Figure 1B As shown, the display 1 may be equipped with a communicator 770. The communicator 770 may include a wireless communication module 771 that supports wireless communication methods and a wired communication module 774 that supports wired communication methods, so as to support various communication methods.

[0085] The communicator 770 can communicate with a relay server and other electronic devices. The data sent and received between the communicator 770 and the relay server and other electronic devices may include data for controlling each general-purpose device and encryption keys for each electronic device.

[0086] Communication methods include wireless communication methods and wired communication methods. Here, wireless communication methods refer to communication methods capable of wirelessly sending and receiving signals containing data. Wireless communication methods can include, without limitation, 3G, 4G, wireless LAN, Wi-Fi, Bluetooth, Zigbee, Wi-Fi Direct (WFD), Ultra Wideband (UWB), Infrared Data Association (IrDA), Bluetooth Low Energy (BLE), Near Field Communication (NFC), Z-Wave, and various other communication methods.

[0087] Furthermore, wired communication methods refer to communication methods that can send and receive signals containing data in a wired manner. Examples of wired communication methods include Peripheral Component Interconnect (PCI), PCI-express, and Universal Serial Bus (USB). However, there are no restrictions on wired communication methods.

[0088] For example, the communicator 770 can send and receive wireless signals to and from IoT devices via a base station using communication methods such as 3G and 4G. Furthermore, the communicator 770 can send and receive wireless signals, including data to and from the device, within a predetermined distance using wireless LAN, Wi-Fi, Bluetooth, Z-wave, Zigbee, WFD, UWB, IrDA, BLE, NFC, etc.

[0089] Reference Figure 1B The wireless communication module 771 includes a Wi-Fi communication module 772 that supports Wi-Fi communication and a Bluetooth communication module 773 that supports Bluetooth communication. Additionally, the wired communication module 774 includes a USB communication module 775 that supports USB communication.

[0090] Additionally, the communicator 770 may include at least one communication module supporting the aforementioned communication method, and is not limited to the figures. In this case, depending on the communication method, each communication module may be implemented as a separate single chip. Alternatively, multiple communication modules may be integrated and implemented as a single chip.

[0091] Additionally, display device 1 can be configured with, for example... Figure 1B The power supply shown is 780.

[0092] Power supply 780 supplies power to each component of display device 1, thereby driving display device 1. Power supply 780 can provide the power required to drive each component to activate display device 1.

[0093] Meanwhile, power supply 780 can provide standby power to certain components of display device 1. Here, standby power refers to the power consumed by the device even when the power is turned off. In other words, standby power refers to the electrical energy supplied to the device simply by plugging it into a socket, independent of the device's operation.

[0094] On the other hand, standby power supplies differ between countries and even between different devices. For example, a display device 1 might have a standby power supply of 0.5W, a dishwasher might have a standby power supply of 0.5W, while a rice cooker might have a standby power supply of 2W. Standby power supply standards may vary depending on the device and the country.

[0095] Even when the main power supply of display device 1 is turned off, power supply 780 will provide standby power to certain components of display device 1 to continuously activate these components.

[0096] For example, power supply 780 can activate infrared receiver 760 through standby power. Therefore, even when display device 1 is in a turned-off state (i.e., in an inactive state), infrared receiver 760 can receive infrared signals sent from the remote control and turn on the power to display device 1.

[0097] Meanwhile, the display device 1 may be equipped with a controller 790.

[0098] The controller 790 can power the LED module via the driver IC.

[0099] like Figure 1B As shown, the controller 790 includes a processor 791, a memory 793, and a microcomputer 795. Here, at least one of the processor 791, memory 793, and microcomputer 795 can be integrated into a system-on-a-chip (SOC) embedded in the display device 1. However, since one or more SOCs can be embedded in the display device, at least one of the processor 791, memory 793, and microcomputer 795 is not limited to being integrated into a single SOC.

[0100] The memory 793 can store control programs and control data for controlling the operation of the display device 1, and temporarily store control commands received through the input device 710 or control signals output from the processor 791.

[0101] Simultaneously, the method for implementing the user interface can be implemented as an algorithm or program and stored in memory 793. Therefore, processor 791 can use the data stored in memory 793 to generate the user interface.

[0102] The processor 791 can control the overall operation of the display device 1. For example, the processor 791 generates control signals for controlling the components of the display device 1 to control the operation of each component.

[0103] The processor 711 can send a control signal to the sound outputter 750 according to a sound adjustment command input through the input device 710, thereby adjusting the volume of the sound output through the speaker 751. In another embodiment, the processor 791 can control the image processor 730 to perform image processing on image information received from the content receiver 720, and control the display 100 to display the image-processed image data.

[0104] In one embodiment, processor 791 includes a graphics processor such that the graphical user interface described above is implemented as being displayed on LED module 110.

[0105] Power supply 780 uses standby power to activate infrared receiver 760 and Bluetooth communication module 773, so that power supply 780 can still operate even when main power is not supplied to display device 1. Therefore, when a power-on signal is received from at least one of infrared receiver 760 and Bluetooth communication module 773, microcomputer 795 allows main power to be supplied to display device 1.

[0106] In one embodiment, when the power to display device 1 is turned off, the user can press the power button attached to the remote control. The remote control can then request the display device 1 to be powered on via an infrared signal. Therefore, infrared receiver 760 can receive the infrared signal and input a power-on signal to the interrupt port of microcomputer 795. Microcomputer 795 activates processor 791 to activate display device 1, thereby putting display device 1 into a powered-on state.

[0107] Reference Figure 2 The display device 1 may include an LED module 110, a support member 150, a frame 160, and a housing 170.

[0108] The housing 170 can form the appearance of the display device 1 and may include a bezel 171 and a cover 172. The bezel 171 and the cover 172 can be joined together to form a receiving space. The LED module 110, support member 150, rack 160, etc. can be arranged in the receiving space.

[0109] The support member 150 can support the LED module 110 and the frame 160 disposed between the frame 171 and the cover 172. For this purpose, the support member 150 can be detachably coupled to the frame 171 to secure the LED module 110 and the frame 160.

[0110] The rack 160 can connect various components required for image display and sound output. That is, various printed circuit boards, input / output devices, etc., can be mounted on the rack 160. The rack 160 can be formed from a metal material with excellent heat dissipation and strength.

[0111] LED module 110 enables users to visually recognize images. LED module 110 may refer to a panel that emits light having a frequency corresponding to an image signal received from outside the display device 1 or generated inside the display device 1.

[0112] Reference Figure 3On one surface of the LED module 110, multiple data lines D1-Dm are arranged in the column direction, multiple scan lines S1-Sn are arranged in the row direction, and multiple sub-pixel regions SP are formed by the intersections of adjacent scan lines S1-Sn and data lines D1-Dm. Sub-pixel circuitry can be provided in each sub-pixel region SP. At least three adjacent sub-pixel regions SP can constitute a pixel region P.

[0113] Data lines D1-Dm transmit data signals representing image signals to the sub-pixel circuits in the sub-pixel region SP, and scan lines S1-Sn transmit scan signals to the sub-pixel circuits in the sub-pixel region SP.

[0114] Scan signals are sequentially applied to scan lines S1-Sn via scan driver 130, and data voltages VDATA corresponding to the image signals are supplied to data lines D1-Dm via data driver 140.

[0115] According to embodiments of this disclosure, the scan driver 130 and the data driver 140 can be mounted on the substrate 111 of the LED module. Therefore, the border of the LED module 110 (the width of the area covering the pixel region in the lateral direction) can be minimized or omitted, allowing the entire front surface of the LED module 110 to form a pixel region.

[0116] Figure 4 It is shown Figure 3 The equivalent circuit diagram of the sub-pixel circuit in the sub-pixel region SP. Specifically, Figure 4 The sub-pixel circuit driven by the first scan line S1 and the first data line D1 is shown.

[0117] Reference Figure 4 The sub-pixel circuit may include an LED, two transistors M1 and M2, and a capacitor Cst. The transistors M1 and M2 may be implemented as PMOS transistors. However, this circuit configuration is merely an example of a sub-pixel circuit, and this disclosure is not limited to this. Figure 4 Circuit configuration.

[0118] According to an embodiment, transistor M2 may be a switching transistor and may have a gate electrode connected to scan line Sn, a source electrode connected to data line Dm, and a drain electrode connected to one end of capacitor Cst and connected to the gate electrode of transistor M1, which may be a driving transistor. The other end of capacitor Cst may be connected to the power supply voltage VDD. Additionally, driving transistor M1 may have a source electrode connected to the power supply voltage VDD and a drain electrode connected to the anode 310 of an LED. The LED may have a cathode 320 connected to a reference voltage VSS to emit light based on the current applied from driving transistor M1.

[0119] The reference voltage VSS connected to the cathode 320 of the LED is a voltage lower than the power supply voltage VDD, and can be provided using ground voltage, etc.

[0120] According to an embodiment, the sub-pixel circuit operates as follows. First, when a scan signal is applied to the scan line Sn to turn on the switching transistor M2, a data voltage is transmitted to one end of the capacitor Cst and the gate electrode of the driving transistor M1. As a result, the gate-source voltage VGS of the driving transistor M1 can be maintained for a certain period of time through the capacitor Cst. Additionally, the driving transistor M1 applies a current ILED corresponding to the gate-source voltage VGS to the anode 310 of the LED, thereby causing the LED to emit light.

[0121] In this configuration, when a high data voltage VDATA is sent to the gate of the driving transistor M1, the gate-source voltage VGS of the driving transistor M1 decreases, resulting in a small current ILED being applied to the anode 310 of the LED, and the LED emitting less light, thus displaying low grayscale. Conversely, when a low data voltage (VDATA) is sent to the gate of the driving transistor M1, the gate-source voltage (VGS) of the driving transistor M1 increases, resulting in a large current (ILED) being applied to the anode 310 of the LED, and the LED emitting more light, displaying high grayscale. Thus, the level of the data voltage VDATA applied to each sub-pixel circuit can be determined based on the image to be displayed.

[0122] Figure 5 This is a diagram illustrating a structure in which the upper electrode is disposed independently of the interconnect structure T connected to the LED, according to an exemplary embodiment.

[0123] Reference Figure 5 According to an embodiment, the LED module 110 includes an LED 380, an interconnect structure T connecting the LED 380, an upper electrode 500, a fan-out interconnect F, and a FOG electrode 800.

[0124] The interconnect structure T can refer to the interconnect of the LED module 110 required to drive the LED 380.

[0125] As will be described below, upper electrode 500 may refer to an electrode that includes electrodes disposed in a specific layer in LED module 110 to provide signals and power.

[0126] Fan-out interconnect F may refer to an interconnect structure connected to the upper electrode 500 to connect the upper electrode 500 to the FOG electrode 800.

[0127] The use of fan-out interconnect F can reduce the number of driver ICs and FOG electrodes when driving LED module 110.

[0128] On the other hand, since multiple upper electrodes and interconnects for connecting the substrate and the LED are required in each pixel of the LED, and in order to realize the fan-out interconnect structure, the upper insulating layer structure can be provided as described below. A detailed description of this will be provided in the relevant sections.

[0129] In addition, the fan-out interconnect F, the FOG electrode 800 and the interconnect structure T connecting the LED 380 can be formed on separate layer structures to avoid crossing each other on the same layer.

[0130] Therefore, as will be described below, when the upper electrode is connected to the FOG electrode via the upper insulating layer and the fan-out interconnect formed in the upper insulating layer, the FOG electrode can have a high degree of positional freedom.

[0131] The structure of the LED module in which the above-described upper electrode and interconnect structure are connected to the FOG electrode through the upper insulating layer will be described in detail below.

[0132] Figures 6A to 6E This is a diagram showing the sequential operation of a method for manufacturing a display device according to an embodiment.

[0133] Reference Figure 6A Substrate 111 is prepared. According to one embodiment, a light-absorbing layer can be formed on substrate 111.

[0134] The substrate 111 can be formed from various materials. For example, the substrate 111 can be formed from a transparent glass material containing SiO2 as the main component. However, the substrate 111 is not limited to this and can also be formed from a transparent plastic material to have flexibility. The plastic material can be an insulating organic material selected from the group consisting of polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide, polycarbonate (PC), cellulose triacetate (TAC), and cellulose acetate propionate (CAP).

[0135] According to embodiments of the present disclosure, LED module 110 is a bottom-emitting LED module, and substrate 111 may be formed of a transparent material.

[0136] The substrate 111 may include a light-emitting region L1 in which LEDs 380 are arranged and emit light, and a non-light-emitting region L2 in which circuit elements such as thin-film transistors (TFTs) 200 are arranged and do not emit light. A light-absorbing layer for improving visibility by absorbing external light may be formed on the non-light-emitting region L2 of the substrate 111.

[0137] Meanwhile, the aforementioned LEDs can be configured as inorganic LEDs.

[0138] According to one embodiment, the LED 380 can have a size of 10-100 μm and is formed by growing multiple thin films of inorganic materials such as Al, Ga, N, P, As In on a substrate or silicon substrate and cutting and separating the sapphire substrate or silicon substrate.

[0139] The light-absorbing layer may include black inorganic materials, black organic materials, or black metals that effectively absorb light.

[0140] For example, light-absorbing materials can be formed from carbon black, polyene pigments, azo-based pigments, azomethyl base-based pigments, diammonium-based pigments, phthalocyanine-based pigments, quinone-based pigments, indigo-based pigments, thio-indigo-based pigments, dioxazine-based pigments, quinacridone-based pigments, isoindolineone-based pigments, metal oxides, metal complexes, and other materials such as aromatic hydrocarbons.

[0141] Reference Figure 6A A buffer layer 113 can be formed on the substrate 111. The buffer layer 113 can provide a flat surface on the substrate 111 and can prevent foreign matter or moisture from being introduced into the substrate 111. For example, the buffer layer 113 may include: inorganic materials, such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, or titanium nitride; or organic materials, such as polyimide, polyester, and acrylic acid, or may be formed from multiple laminates of the above materials.

[0142] Reference Figure 6B TFT 200 and LED 380 can be disposed on buffer layer 113.

[0143] Transistor 200 may include a semiconductor active layer 210, a gate electrode 220, a source electrode 230a, and a drain electrode 230b. The semiconductor active layer 210 may include a semiconductor material and may have a source region, a drain region, and a channel region between the source and drain regions. The gate electrode 220 may be formed on the active layer 210 to correspond to the channel region. The source electrode 230a and drain electrode 230b may be electrically connected to the source and drain regions of the active layer 210, respectively.

[0144] A gate insulating layer 114 may be disposed between the active layer 210 and the gate electrode 220. The gate insulating layer 114 may be formed of an inorganic insulating material. According to an embodiment, the gate insulating layer 114 may be formed on the buffer layer 113.

[0145] An interlayer insulating layer 115 may be disposed between the gate electrode 220 and the source electrode 230a, and between the gate electrode 220 and the drain electrode 230b. The interlayer insulating layer 115 may be formed of an organic insulating material or an inorganic insulating material, and may be formed by alternately forming organic and inorganic insulating materials. According to an embodiment, the interlayer insulating layer 115 may be formed on the gate insulating layer 114.

[0146] A first insulating layer 117 is disposed on the source electrode 230a and the drain electrode 230b as a planarization layer. The first insulating layer 117 can be formed of an organic insulating material or an inorganic insulating material, and can be formed by alternately forming organic and inorganic insulating materials. According to an embodiment, the first insulating layer 117 can be formed on the interlayer insulating layer 115.

[0147] According to an embodiment of this disclosure, as an example, TFT 200 is configured as a top-gate type TFT in which the gate electrode 220 is disposed on the semiconductor active layer 210, but this disclosure is not limited thereto. For example, the gate electrode 220 may be disposed below the semiconductor active layer 210.

[0148] like Figure 6B As shown, LED 380 can be disposed on the first insulating layer 117. According to embodiments of the present disclosure, LED 380 can be a micro LED. Here, micro can represent a size from 1 to 100 μm, but the present disclosure is not limited thereto and can be applied to LEDs having sizes greater than or less than the range of 1 to 100 μm.

[0149] Micro-LEDs can be individually or collectively picked up from the wafer and transferred to the substrate 111 using a transfer device. These micro-LEDs, formed from inorganic materials, can have a faster response speed than organic OLEDs using organic materials, supporting low power consumption and high brightness. Furthermore, while organic LEDs, susceptible to moisture and oxygen, require sealing processes and have poor durability, micro-LEDs may exhibit excellent durability under sealing conditions.

[0150] LED 380 can emit light with a predetermined wavelength, which falls within the wavelength range from ultraviolet to visible light. For example, LED 380 can be a red, green, blue, white LED, or an ultraviolet (UV) LED. That is, red, green, and blue LEDs are arranged in adjacent sub-pixel regions SP, forming a pixel region P. A color can be determined by mixing the red, green, and blue light generated in a pixel region P.

[0151] LED 380 may include a pn diode, an anode 310, and a cathode 320. The anode 310 and / or cathode 320 may be formed of a variety of conductive materials, including metals, conductive oxides, and conductive polymers. The anode 310 may be electrically connected to a signal electrode 510, and the cathode 320 may be electrically connected to a common ground electrode 530. The pn diode may include a p-doped portion on the side of the anode 310, at least one quantum well portion, and an n-doped portion on the side of the cathode 320. Alternatively, the doped portion on the side of the cathode 320 may be a p-doped portion, and the doped portion on the side of the anode 310 may be an n-doped portion.

[0152] The anode 310 and cathode 320 can be located on the upper surface of the LED 380. Conversely, the light-emitting surface of the LED 380 can be located at the bottom of the LED 380. Therefore, the light-emitting surface of the LED 380 can contact the first insulating layer 117, and the LED 380 can emit light toward the substrate 111.

[0153] The gate electrode 220 and the data electrode 250 can be provided in the first insulating layer 117. At the same time, an interconnection structure connecting the gate electrode 220 and the data electrode 250 to the LED 380 can be provided on the first insulating layer 117 and the second insulating layer 118.

[0154] That is, according to embodiments of this disclosure, LED 380 may be a bottom-emitting LED. Since LED 380 is a bottom-emitting LED, pixel circuit elements such as TFT 200 and LED 380 are arranged so that they do not overlap each other in the vertical direction. LED 380 can be fixed to the first insulating layer 117 by an adhesive coating.

[0155] like Figure 6B As shown, a second insulating layer 118 may be disposed on the first insulating layer 117 to surround the LED 380. The second insulating layer 118 may include an organic insulating material. For example, the second insulating layer 118 may be formed of acrylic acid, polymethyl methacrylate (PMMA), benzocyclobutene (BCB), polyimide, acrylate, epoxy resin, polyester, etc., but is not limited thereto.

[0156] The upper electrodes 220s, 250s, 240s, and Vss can be connected to various driver ICs 900 used to drive the LED module 110 to the pixel circuit.

[0157] For example, the upper electrodes 220s, 250s, 240s and Vss can be connected to the power supply voltage electrode 240, the data signal electrode 250, the gate electrode 220 and the reference voltage VSS.

[0158] The upper electrodes 220s, 250s, 240s and Vss may include a signal electrode 510 that connects the drain 230b of the TFT 200 to the anode 310 of the LED 380 to apply a data signal to the LED 380, and a common ground electrode 530 that connects the cathode 320 of the LED 380 to a reference voltage VSS 554 to ground the LED 380.

[0159] Since LED 380 is a bottom-emitting LED, the first insulating layer 117, interlayer insulating layer 115, gate insulating layer 114 and buffer layer 113 mentioned above can all be formed of transparent materials.

[0160] at the same time, Figure 6B It shows that the LED is transferred, and then a second insulating layer is formed, but... Figure 6C The diagram shows the formation of a second insulating layer, followed by the transfer of the LED. The order in which the second insulator and the LED are formed on the substrate can be changed, and the interconnect shape can be altered according to that order.

[0161] Reference Figure 6D The aforementioned upper electrode may be disposed on the upper insulating layer 119, and the upper insulating layer 119 may further include fan-out interconnects 220-F, 250-F, 240-F and Vss-F connected to the upper electrode.

[0162] Meanwhile, an upper insulating layer 119 is provided to allow the interconnect structure connected to the LED to be formed in a different layer than the layers forming the fan interconnects 220-F, 250-F, 240-F and Vss-F, while protecting the LED.

[0163] In addition, a via H corresponding to the upper electrode can be formed in the upper insulating layer 119 to form a fan-out interconnect.

[0164] Reference Figure 6E A third insulating layer 120 is disposed on the upper insulating layer 119, such that the fan-out interconnect is connected to the FOG electrode 800 via the cover metal 400. Additionally, according to an embodiment, the cover conductor may be formed of indium tin oxide (ITO).

[0165] The capping conductor 400 can be connected to the FOG electrode 800 via anisotropic conductive film (ACF) bonding 600.

[0166] ACF can refer to anisotropic conductive film.

[0167] Various driver IC chips used to drive the LED module 110, such as power line ICs, data ICs, gate ICs, touch sensing ICs, wireless controllers, communication ICs, etc., can be connected to the FOG electrode 800.

[0168] The FOG electrode 800 can be electrically connected to the fan-out interconnects 220F, 250F, 240F and VssF via ACF bonding 600.

[0169] Based on the above structure, the driver IC 900 can be disposed on the rear side of the light-emitting surface of the substrate 111.

[0170] At the same time, Figures 6A to 6E The layer described herein provides at least one light absorption layer (black matrix) to improve the uniformity of screen output and color separation through pixel separation.

[0171] At the same time, Figures 6A to 6E The embodiments described herein may be only one embodiment of this disclosure. LED modules can be implemented in various forms such as flip-chip LED modules and vertical chip LED modules, and there are no restrictions on the form in which LEDs are formed in LED modules.

[0172] Figure 7A This is a top view of the LED module 110 according to an embodiment.

[0173] Reference Figure 7A A fan-out interconnect F connected to the upper electrode can be provided on the LED module 110. The fan-out interconnect can be connected to the upper electrodes 220S, 250S, 240S and Vss respectively, which are connected to the gate electrode, signal electrode, power supply electrode and reference voltage electrode Vss respectively.

[0174] Meanwhile, the upper electrode can be connected to FOG electrodes 800-1 and 800-2 via fan-out interconnects. Additionally, according to an embodiment, electrodes 220S and 250S related to LED signal transmission can be connected to FOG electrodes different from the upper electrodes Vss and 240S connected therein, which relate to power supply.

[0175] In detail, the gate electrode and the signal electrode can be connected to the upper electrodes 220S and 250S, thereby being connected to the signal FOG electrode 800-1 via the fan-out interconnect F.

[0176] In addition, the power supply voltage electrode and the reference voltage electrode can be connected to the upper electrode 240S and Vss, thereby connecting to the power supply FOG electrode 800-2 via another fan-out interconnect F.

[0177] At the same time, refer to Figure 7B The upper electrodes 220S and 250S involved in the LED signal transmission and the upper electrodes Vss and 240S involved in the power supply can be connected to the same FOG electrode 800.

[0178] Furthermore, according to one embodiment, the fan-out interconnect connected to the power supply voltage electrode and the reference voltage electrode on one side can be symmetrical with respect to the center line CL of the FOG electrode and the fan-out interconnect connected to the power supply voltage electrode and the reference voltage electrode on the other side.

[0179] With this connection, the LED module can be powered from the center of the panel using the aforementioned FOG electrodes to provide a uniform radial brightness distribution.

[0180] It is evident from the above that by using fan-out interconnects and insulating layers, LED modules, display devices, and the methods of manufacturing display devices can provide greater freedom in the structural design of LED modules.

[0181] The display module according to this disclosure can be installed individually for wearable devices, portable devices, handheld devices, and various electronic products and machine parts that require display, and can be assembled and installed in a matrix for display devices, such as monitors for PCs, high-resolution televisions, signage (electronic displays), etc.

[0182] Although exemplary embodiments of this disclosure have been described for illustrative purposes, those skilled in the art will understand that various modifications, additions, and substitutions may be made without departing from the scope and spirit of this disclosure. Therefore, the description of exemplary embodiments of this disclosure is not intended to be limiting.

Claims

1. A light-emitting diode (LED) module with a multilayer structure, the LED module comprising: substrate; An LED on a substrate, the LED being configured to emit light toward the substrate; Multiple upper electrodes are attached to and connected to the LED; An upper insulating layer surrounding multiple upper electrodes; Thin-film FOG electrode on glass over an upper insulating layer; and The fan-out interconnect structure is configured to connect multiple upper electrodes to the FOG electrodes via an upper insulating layer. A metal overlay is disposed between the FOG electrode and the fan-out interconnect structure. The plurality of upper electrodes includes: a third upper electrode connected to a power supply voltage electrode that supplies power to the LED; and a fourth upper electrode connected to a reference voltage electrode connected to the cathode of the LED. The FOG electrode is connected to the third and fourth upper electrodes of the power supply voltage electrode and the reference voltage electrode, respectively, via a fan-out interconnect structure. The fan-out interconnect structure, which is connected to the power supply voltage electrode and the reference voltage electrode respectively, forms a symmetrical structure with respect to the center line of the FOG electrode.

2. The LED module of claim 1, wherein, The upper insulating layer is formed from a first layer that is different from the second layer on which the LEDs are mounted.

3. The LED module of claim 1, wherein, The upper insulating layer is disposed between the FOG electrode and the LED to protect the LED.

4. The LED module of claim 1, wherein, The upper insulating layer includes through holes corresponding to the plurality of upper electrodes.

5. The LED module of claim 1, wherein, The fan-out interconnect structure is formed separately from the interconnect structure connected to the LED.

6. The LED module according to claim 1, further comprising: Thin-film transistors (TFTs) are disposed on the substrate and have gate electrodes. The plurality of upper electrodes includes a first upper electrode connected to a signal electrode and a second upper electrode connected to a gate electrode. The signal electrode is configured to provide a data signal to the LED. The FOG electrode is connected to the first upper electrode and the second upper electrode of the signal electrode and the gate electrode respectively through a fan-out interconnect structure.

7. A display device, comprising: The light-emitting diode (LED) module according to any one of claims 1 to 6; The driver is an integrated IC chip configured to drive the LED module; and The controller is configured to provide power to the LED module via a driver IC; The thin-film FOG electrode on the glass is configured to be connected to the driver IC.

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