Chemical supply equipment, method for removing particles from chemicals, nozzle unit, and substrate processing equipment

Abstract

A chemical supply device comprises: an evaporation unit, which is arranged downstream of a chemical supply source to evaporate the chemical supplied thereto; a filter unit, which is arranged downstream of the evaporation unit, wherein when the evaporated chemical passes through the filter unit, the filter unit filters impurities in the evaporated chemical; a liquefaction unit, which is arranged downstream of the filter unit to liquefy the evaporated chemical; and a chemical storage tank, which is arranged downstream of the liquefaction unit to store the liquefied chemical therein, wherein an electrode is arranged between the chemical supply source and the liquefaction unit, wherein the electrode electrically reacts with the chemical or particles in the chemical to change the electrical properties of the chemical or the particles.

Description

Background Art

[0001] Embodiments of the inventive concepts described herein relate to a chemical supply apparatus, a method for removing particles from chemicals, a nozzle unit, and a substrate processing apparatus.

[0002] Various chemicals are used in general semiconductor device manufacturing processes and flat panel display manufacturing processes. For example, in the process of cleaning a substrate, various chemicals such as IPA can be used to clean the substrate to remove foreign matter remaining on the surface of the substrate.

[0003] The equipment for supplying chemicals may include a central chemical supply system (CCSS). Chemicals supplied from the CCSS are transferred to a mixing tank and subsequently used therein. Filters are provided in the supply line connecting the CCSS to the mixing tank to remove particles mixed with the chemicals. However, because filters are expensive, the relevant industry needs a device that can reduce costs.

[0004] Furthermore, because the chemical supply is not a circulating structure, cations, anions, metal particles, and non-polar particles are likely to accumulate in the mixing tank regardless of the presence or absence of filters. Acidic solutions are used to remove these particles, but there is no method to purify the chemicals at a high purity. Summary of the invention

[0005] Embodiments of the inventive concept provide a chemical supply apparatus capable of effectively processing a substrate, a method for removing particles from chemicals, a nozzle unit, and a substrate processing apparatus.

[0006] Embodiments of the inventive concept provide a chemical supply apparatus capable of effectively removing particles (preferably cations, anions, metal particles, and non-polar particles) mixed with chemicals and a method for removing particles from chemicals.

[0007] Embodiments of the present inventive concept provide a chemical supply device, a method for removing particles from chemicals, a nozzle unit, and a substrate processing device that can control the potential of supplied chemicals and control the potential of chemicals purified with high purity, thereby preventing an ESD (electrostatic discharge) phenomenon that occurs when a substrate and chemicals contact each other.

[0008] According to one aspect, a chemical supply device includes an evaporation unit, which is arranged downstream of a chemical supply source to evaporate the chemical supplied thereto; a filter unit, which is arranged downstream of the evaporation unit, wherein when the evaporated chemical passes through the filter unit, the filter unit filters impurities in the evaporated chemical; a liquefaction unit, which is arranged downstream of the filter unit to liquefy the evaporated chemical; and a chemical storage tank, which is arranged downstream of the liquefaction unit to store the liquefied chemical therein, wherein an electrode is arranged between the chemical supply source and the liquefaction unit, wherein the electrode electrically reacts with the chemical or particles in the chemical to change the electrical properties of the chemical or the particles.

[0009] In one embodiment of the chemical supply apparatus, the electrical reaction between the electrode and the chemical or the particles may include a reduction reaction of the particles.

[0010] In an embodiment of a chemical supply device, said electrical reaction between said electrode and said chemical or said particles may comprise a polarization of said particles.

[0011] In one embodiment of the chemical supply apparatus, the particles may include non-polar particles.

[0012] In an embodiment of the chemical supply apparatus, said electrode may be comprised in said filter unit.

[0013] In an embodiment of the chemical supply apparatus, the electrode may be comprised in the liquefaction unit.

[0014] In one embodiment of the chemical supply apparatus, the electrode may be provided at a front end of the filter unit.

[0015] In one embodiment of the chemical supplying apparatus, the evaporation unit may include a first evaporation unit and a second evaporation unit, wherein each of the first evaporation unit and the second evaporation unit may include the electrode.

[0016] In an embodiment of the chemical supply apparatus, the particles may comprise metallic particles.

[0017] According to another aspect, a method for removing particles contained in a chemical product includes changing electrical properties of the particles contained in the chemical product, and collecting the particles whose electrical properties have been changed.

[0018] In one embodiment of the method, changing the electrical properties of the particles contained in the chemical may include reducing the particles contained in the chemical.

[0019] In one embodiment of the method, the particles may include metallic particles.

[0020] In one embodiment of the method, changing the electrical properties of the particles contained in the chemical may include polarizing the particles contained in the chemical.

[0021] In one embodiment of the method, the particles may include non-polar particles.

[0022] According to still another aspect, a nozzle unit includes a body in which a supply passage through which a chemical is supplied is defined, and an electrode accommodated in the supply passage, wherein the electrode is connected to a ground line or a power source.

[0023] In one embodiment of the nozzle unit, the nozzle unit may further include a controller, wherein the controller may enable or disable a connection between the electrode and the ground line and a connection between the electrode and the power source.

[0024] In an embodiment of the nozzle unit, the power supply may apply a negative voltage to the electrode.

[0025] According to another aspect, the substrate processing apparatus includes an evaporation unit, which is arranged downstream of a chemical supply source to evaporate the chemical supplied thereto; a filter unit, which is arranged downstream of the evaporation unit, wherein when the evaporated chemical passes through the filter unit, the filter unit filters impurities in the evaporated chemical; a liquefaction unit, which is arranged downstream of the filter unit to liquefy the evaporated chemical; a chemical storage tank, which is arranged downstream of the liquefaction unit to store the liquefied chemical therein; an electrode, which is arranged between the chemical supply source and the liquefaction unit, wherein the electrode is in contact with the chemical or the Particles in a chemical react electrically to change the electrical properties of the chemical or the particles; a container in which a processing space is defined; a support unit disposed in the processing space to support the substrate thereon; and a nozzle unit disposed downstream of the liquefaction unit and in fluid communication with the liquefaction unit, wherein the nozzle unit supplies the chemical to the substrate supported on the support unit, wherein the nozzle unit includes: a main body in which a supply channel is defined, through which the chemical is supplied; and an electrode accommodated in the supply channel, wherein the electrode of the nozzle unit is connected to a ground wire or a power source.

[0026] In one embodiment of the substrate processing apparatus, the nozzle unit may further include a controller, wherein the controller may enable or disable a connection between the electrode and the ground line and a connection between the electrode and the power source.

[0027] In one embodiment of the substrate processing apparatus, the power supply may apply a negative voltage to the electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other objects and features will become apparent from the following description with reference to the following drawings, in which like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and in which:

[0029] Figure 1 is a diagram showing a substrate processing system according to the inventive concept;

[0030] Figure 2 An embodiment is shown in which a plurality of filter units 130 are arranged in parallel;

[0031] Figure 3 A filter unit 1130 is shown according to another embodiment;

[0032] Figure 4 is a view showing the evaporation unit 120 according to the embodiment in more detail;

[0033] Figure 5 and Figure 6 A nozzle unit 28 according to an embodiment of the inventive concept is shown;

[0034] Figure 7 An electrode 1282 according to another embodiment of the nozzle unit 28 according to an embodiment of the inventive concept is shown;

[0035] Figure 8 shows a state in which an electrode 282 is connected to a ground line 284 so that chemicals are supplied according to one embodiment; and

[0036] Fig. 9 A state in which the electrode 282 according to the embodiment is connected to the power source 283 so that chemicals are supplied is shown. DETAILED DESCRIPTION

[0037] Hereinafter, embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings. The embodiments of the inventive concept may be modified in various forms, and the scope of the inventive concept should not be construed as being limited to the following embodiments. Embodiments are provided to more completely explain the inventive concept to those skilled in the art. Therefore, the shapes of the elements in the accompanying drawings are enlarged to emphasize their clearer description.

[0038] Figure 12 is a diagram showing a substrate processing system according to the present invention. Figure 1 , a substrate processing system according to the inventive concept includes a chemical supply source 10 , a chemical processing apparatus 20 , and a chemical supply apparatus 100 .

[0039] The chemical supply source 10 stores chemicals therein. For example, the chemical may be an isopropyl alcohol chemical (hereinafter referred to as "IPA"). The chemical supply source 10 is a facility that supplies chemicals to the chemical supply device 100. For example, the chemical supply source 10 may be a central chemical supply system (CCSS).

[0040] The chemical processing apparatus 20 performs a process of processing a semiconductor substrate (hereinafter referred to as a wafer W). The chemical processing apparatus 20 has at least one processing chamber. The processing chamber includes a container 22, a spin chuck 24, a driver 26, and a nozzle unit 28.

[0041] The container 22 provides therein a space for cleaning wafers W. The container 22 has a cup shape with an open top. The open top of the container 22 serves as a passage through which the wafers W can enter and leave.

[0042] During processing, the spin chuck 24 supports the wafer W thereon in the container 22. The spin chuck 24 is installed at the center of the container 22, and performs rotation and vertical motion. The spin chuck 24 is driven by a driver 26. During processing, the nozzle unit 28 supplies IPA to the processing target surface of the wafer W rotated by the spin chuck 24. At least one nozzle unit 28 is provided.

[0043] The chemical supplying apparatus 100 includes an evaporation unit 120, a filter unit 130, a liquefaction unit 140, a chemical storage tank 150, and supply lines 161, 162, 163, 164, and 165 connecting the evaporation unit 120, the filter unit 130, the liquefaction unit 140, and the chemical storage tank 150 to one another.

[0044] The evaporation unit 120 evaporates the chemical. The evaporation unit 120 is disposed downstream of the chemical supply source 10. The evaporation unit 120 is connected to the chemical supply source 10 via a first supply line 161. The evaporation unit 120 evaporates the chemical supplied from the chemical supply source 10. The evaporation unit 120 includes a tank 121, a heater 122, and an electrode 125. The electrode 125 may include a first electrode 125a and a second electrode 125b. The electrode 125 is connected to a power supply 126. The first electrode 125a may receive a positive voltage to act as a positive electrode, and the second electrode 125b may receive a negative voltage to act as a negative electrode. The supplied chemical is temporarily stored in the tank 121. The temporarily stored chemical may contain cations, anions, metal particles, and non-polar particles. The electrode 125 can remove cations, anions, and metal particles. For example, cations are collected on the negative electrode, and anions are collected on the positive electrode. Metal particles are usually cations, and therefore can be collected on the negative electrode while being reduced.

[0045] In a process in which the chemical is evaporated in the evaporation unit 120 and then moved to the liquefaction unit 140, the evaporated chemical may be filtered by the filter unit 130. The filter unit 130 is disposed between the evaporation unit 120 and the liquefaction unit 140. The evaporation unit 120 and the filter unit 130 are connected to each other via a second supply line 162, and the filter unit 130 and the liquefaction unit 140 are connected to each other via a third supply line 163.

[0046] The filter unit 130 removes unremoved particles in an evaporation state. The filter unit 130 may include a filter 131 and an electrode 135. The filter 131 may be embodied as a HEPA filter or a membrane filter, but is not limited thereto.

[0047] The electrode 135 may be included in the filter unit 130. In an embodiment, the electrode 135 may include a first electrode 135a, a second electrode 135b, a third electrode 135c, and a fourth electrode 135d. The first electrode 135a, the second electrode 135b, the third electrode 135c, and the fourth electrode 135d may be sequentially arranged on the moving path of the evaporated chemical. A positive voltage is applied to each of the first electrode 135a and the third electrode 135c to act as a positive electrode, and a negative voltage is applied to each of the second electrode 135b and the fourth electrode 135d to act as a negative electrode. Exemplary embodiments of the inventive concept show that the electrode 135 is embodied as two pairs of electrode rods. However, the present disclosure is not limited thereto. For example, the electrode 135 may be embodied as an ionizer, an electrostatic generating unit, or an ultrasonic instrument.

[0048] The electrode 135 electrically reacts with the non-polar particles to exhibit electrical properties. For example, the electrode 135 can apply electricity to the electrically neutral non-polar particles, thereby causing polarization of the non-polar particles. The non-polar particles can be polarized and thus can be easily collected by the filter 131.

[0049] A plurality of filter units 130 may be arranged in series (not shown). In addition, a plurality of filter units 130 may be arranged in parallel.

[0050] Figure 2 An embodiment in which a plurality of filter units 130 are arranged in parallel is shown. In one example, the second supply line 162 is divided into a first branch line 167 and a second branch line 168, and then the branch lines 167 and 168 are reunited at the third supply line 163. The first filter unit 130a is provided at the first branch line 167, and the second filter unit 130b is provided at the second branch line 168. A valve 167a may be provided at the front end of the first filter unit 130a in the first branch line 167. A valve 168a may be provided at the front end of the filter unit 130b in the second branch line 168. Since a plurality of filter units 130 are arranged in parallel, the apparatus may be continuously operated using another filter unit 130b while one filter unit 130a is being repaired.

[0051] Figure 3 A filter unit 1130 according to another embodiment is shown. In another embodiment, the filter unit 1130 may be divided into an electrode unit 1135 and a filter 1138. For example, the electrode unit 1135 is disposed at the front end or upstream of the filter 1138 to apply electricity to the evaporated chemical. This allows the particles to be polarized and thus collected by the filter 1138 disposed at the rear end or downstream thereof. The illustrated embodiment may be modified so that polarization occurs in electrically neutral particles using the provided electrodes and thus the polarized particles are collected using the filter.

[0052] Return to reference Figure 1 , the liquefaction unit 140 is disposed downstream of the filter unit 130. The liquefaction unit 140 liquefies the filtered chemical. The liquefied chemical is stored in the chemical storage tank 150. The chemical storage tank 150 is connected to the liquefaction unit 140 via a fourth supply line 164.

[0053] The chemical storage tank 150 receives the processed chemical and stores it therein. The chemical storage tank 150 may include a plurality of chemical storage tanks 150. The chemical stored in the chemical storage tank 150 does not contain particles and thus has high purity.

[0054] The chemicals stored in the chemical storage tank 150 are transferred to the chemical processing equipment 20, and then supplied to the substrate through the nozzle unit 28. The nozzle unit 28 and the chemical storage tank 150 are connected to each other via a fifth supply line 165. A bubble remover (not shown) may be provided at the fifth supply line 165. The bubble remover (not shown) removes bubbles from the chemicals to be supplied to the chemical processing equipment 20.

[0055] Figure 4 1 is a view showing the evaporation unit 120 according to an embodiment in more detail. In an embodiment, the evaporation unit 120 may include a first evaporation unit 120a and a second evaporation unit 120b. The description of each of the configuration of the first evaporation unit 120a and the configuration of the second evaporation unit 120b is replaced by the description of the evaporation unit 120 described above. Although two evaporation units are shown according to the embodiment, the number thereof may be increased or decreased as needed. For example, since a plurality of evaporation units 120 are arranged in parallel, the device may be operated continuously using the second evaporation unit 120b during the maintenance of the first evaporation unit 120a. In one embodiment, the maintenance may include cleaning the redox electrode.

[0056] Figure 5 and Figure 6 A nozzle unit 28 according to an embodiment of the inventive concept is illustrated. Figure 5 is a cross-sectional view of a nozzle unit 28 according to an embodiment of the present inventive concept, and Figure 6 2 is a partial cross-sectional view of a nozzle unit 28 according to an embodiment of the present inventive concept. The nozzle unit 28 includes a body 281 having a supply channel 281a defined therein to supply chemicals and an electrode 282 disposed at the supply channel 281a. The electrode 282 may be disposed at a position adjacent to the discharge end of the supply channel 281a. However, the present disclosure is not limited thereto. The electrode 282 may be connected to a ground wire 284 or a power source 283. It may be selectively connected to the ground wire 284 or the power source 283 via a switch 285. The switch 285 may be controlled by a controller (not shown). In one embodiment, the electrode 282 may be embodied as a disk extending in a manner perpendicular to the length direction of the supply channel 281a. A hole is formed in the disk in the direction of the flow path to allow chemicals to pass therethrough. However, the shape of the electrode 282 is not limited thereto. The shape of the electrode 282 may not be particularly limited, as long as the electrode 282 is disposed in the supply channel 281a and allows chemicals to pass therethrough, and the chemicals have sufficient contact with the electrode 282. For example, in reference Figure 7 In another embodiment, the electrode 1282 includes a plurality of slits 1282a, and the chemical may pass through the slits 1282a.

[0057] Return to reference Figure 5 and Figure 6 In addition, reference Figure 8 . When the electrode 282 is connected to the ground line 284, the electrode 282 is able to discharge the charge contained in the chemical to the ground. In other words, the chemical can be made electrically neutral. The electrical properties such as the electric potential of the ultra-high purity chemical supplied from the above-mentioned chemical supply device 100 can be easily controlled. Therefore, in the case where the processed wafer is electrically neutral, the ESD (electrostatic discharge) phenomenon that occurs when the wafer and the chemical are in contact with each other can be suppressed.

[0058] refer to Figure 5 , Figure 6 and Fig. 9 When the electrode 282 is connected to the power source 283, the electrode 282 can make the chemical have an electrical polarity. For example, when the electrode 282 is charged to a negative electrode, the supplied chemical may have a negative charge. Therefore, when the wafer W is charged with a positive charge, the effect of capturing and removing particles of the chemical onto the substrate charged with a positive charge and thus making the substrate electrically neutral can be obtained, thereby preventing the ESD (electrostatic discharge) phenomenon that occurs when the wafer and the chemical contact each other.

[0059] That is, the nozzle unit 28 may control the potential of the high-purity chemical, thereby preventing an ESD (electrostatic discharge) phenomenon that occurs when the wafer and the chemical come into contact with each other.

[0060] In one example, an example in which IPA is a chemical has been described. However, the chemical may not be particularly limited as long as the chemical can be purified and its potential can be controlled.

[0061] In one example, an example in which the electrode is included in the evaporation unit has been described. However, a tip sonicator may be used instead of the electrode.

[0062] In one example, an embodiment has been described in which the heater is included in the evaporation unit. However, the evaporation unit may use a freeze drying method instead of using high temperature and high pressure.

[0063] In one example, an embodiment in which the heater is received in the evaporation unit has been described. However, the heater may be provided outside the evaporation unit.

[0064] In embodiments of the inventive concept, a substrate may be efficiently processed.

[0065] In an embodiment of the present inventive concept, particles mixed with chemicals, preferably cations, anions, metal particles, and non-polar particles, may be effectively removed.

[0066] In an embodiment of the inventive concept, the potential of supplied chemicals may be adjusted, and the potential of highly purified chemicals may be adjusted, thereby preventing an ESD (electrostatic discharge) phenomenon that occurs when a substrate and chemicals contact each other.

[0067] Although the inventive concept has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the inventive concept. Therefore, it should be understood that the above embodiments are not restrictive but illustrative.

Claims

1. A chemical supply device, comprising: an evaporation unit disposed downstream of a chemical supply source to evaporate the chemical supplied thereto; a filter unit disposed downstream of the evaporation unit, wherein the filter unit filters impurities in the evaporated chemical as the evaporated chemical passes through the filter unit; a liquefaction unit disposed downstream of the filter unit to liquefy the evaporated chemical; as well as a chemical storage tank disposed downstream of the liquefaction unit to store liquefied chemicals therein, An electrode is arranged between the chemical supply source and the liquefaction unit, wherein the electrode electrically reacts with the chemical or particles in the chemical to change the electrical properties of the chemical or the particles. 2 . The chemical supplying apparatus according to claim 1 , wherein the electrical reaction between the electrode and the chemical or the particle includes a reduction reaction of the particle. 3 . The chemical supply apparatus of claim 1 , wherein the electrical reaction between the electrode and the chemical or the particle includes polarization of the particle.

4. The chemical supply apparatus of claim 3, wherein the particles comprise non-polar particles. 5 . The chemical supplying equipment according to claim 1 , wherein the electrode is included in the filter unit. The chemical supply equipment according to claim 1 , wherein the electrode is included in the liquefaction unit. 7 . The chemical supplying equipment according to claim 1 , wherein the electrode is provided at a front end of the filter unit. 8 . The chemical supplying equipment of claim 1 , wherein the evaporation unit comprises a first evaporation unit and a second evaporation unit, wherein each of the first evaporation unit and the second evaporation unit comprises the electrode.

9. The chemical supply facility of claim 1, wherein the particles comprise metallic particles.

10. A nozzle unit, comprising: a body having a supply passage defined therein through which a chemical is supplied; as well as an electrode received in the supply channel and embodied as a disk extending perpendicularly to the length direction of the supply channel, and comprising holes or slits to allow the chemical to pass therethrough, wherein the electrodes are connected to a ground wire or a power source, The nozzle unit further comprises a controller. wherein the controller is configured to enable or disable a connection between the electrode and the ground line and a connection between the electrode and the power source, and When the electrode is connected to the ground line, the electrode can discharge the electric charge contained in the chemical to the ground, and when the electrode is connected to the power source, the electrode can make the chemical have an electric polarity. The nozzle unit according to claim 10 , wherein the power supply applies a negative voltage to the electrode.

12. A substrate processing device, comprising: an evaporation unit disposed downstream of a chemical supply source to evaporate the chemical supplied thereto; a filter unit disposed downstream of the evaporation unit, wherein the filter unit filters impurities in the evaporated chemical as the evaporated chemical passes through the filter unit; a liquefaction unit disposed downstream of the filter unit to liquefy the evaporated chemical; a chemical storage tank disposed downstream of the liquefaction unit to store liquefied chemicals therein; an electrode disposed between the chemical supply source and the liquefaction unit, wherein the electrode electrically reacts with the chemical or particles in the chemical to change electrical properties of the chemical or the particles; a container having a processing space defined therein; a supporting unit disposed in the processing space to support a substrate thereon; as well as a nozzle unit disposed downstream of the liquefaction unit and in fluid communication with the liquefaction unit, wherein the nozzle unit supplies the chemical onto the substrate supported on the support unit, The nozzle unit comprises: a body having a supply passage defined therein and through which the chemical is supplied; as well as an electrode housed in the supply channel, The electrode of the nozzle unit is connected to a ground line or a power source.

13. The substrate processing apparatus according to claim 12, wherein the nozzle unit further comprises a controller, The controller is configured to enable or disable a connection between the electrode and the ground line and a connection between the electrode and the power source. 14 . The substrate processing apparatus of claim 12 , wherein the power supply applies a negative voltage to the electrode.

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