Substrate processing device and substrate processing method

Abstract

The substrate processing device (100) of the present invention comprises a liquid delivery pipe (41), a supply pipe (43), a return pipe (44), an adjustment valve (47), and a control unit (3). The control unit (3) can switch the opening of the adjustment valve (47) to any one of a first opening and a second opening. The first opening indicates an opening at which all or part of the chemical liquid guided by the liquid delivery pipe (41) is supplied to the supply pipe (43). The second opening indicates an opening at which all or part of the chemical liquid in the supply pipe (43) is supplied to the return pipe (44).

Description

Technical Field

[0001] The invention relates to a substrate processing device and a substrate processing method. Background Art

[0002] In the manufacturing process of a device including a substrate such as a semiconductor device or a liquid crystal display device, a substrate processing device is used to process the substrate. The substrate is, for example, a semiconductor wafer or a glass substrate for a liquid crystal display device.

[0003] Patent document 1 discloses a single-chip substrate processing device for processing substrates one by one. The substrate processing device described in Patent document 1 includes a rotating chuck and a processing liquid supply device. The rotating chuck rotates the substrate. The processing liquid supply device supplies processing liquid to the substrate held by the rotating chuck. The processing liquid supply device includes a nozzle, a supply pipe, and a valve. The nozzle sprays the processing liquid onto the substrate. The supply pipe supplies the processing liquid to the nozzle. The valve is arranged on the supply pipe. The processing liquid is supplied to the substrate by spraying from the nozzle. The valve has a valve core and a valve seat. The valve is closed by the valve core contacting the valve seat, and the valve is opened by the valve core leaving the valve seat.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2009-222189 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] However, after the valve is closed, processing liquid may remain between the valve and the nozzle. In this case, when the substrate processing apparatus is not processing a substrate, the processing liquid between the valve and the nozzle may drip from the nozzle.

[0009] The present invention provides a substrate processing device and a substrate processing method which can suppress a processing liquid from dripping from a nozzle when the substrate processing device is not processing a substrate.

[0010] Means used to solve problems

[0011] According to a first embodiment of the present invention, a substrate processing device processes the substrate by supplying a processing liquid from a nozzle to the substrate. The substrate processing device comprises a liquid supply piping, a supply piping, a return piping, an adjustment valve, and a control unit. The liquid supply piping guides the processing liquid. The supply piping guides the processing liquid guided by the liquid supply piping to the nozzle. The return piping guides the processing liquid guided by the liquid supply piping along a path different from that of the supply piping. The adjustment valve is provided on the return piping. The control unit controls the adjustment valve. The control unit can switch the opening of the adjustment valve to any one of the first opening and the second opening. The first opening indicates the opening of the supply piping to supply all or part of the processing liquid guided by the liquid supply piping to the supply piping. The second opening indicates the opening of the return piping to supply all or part of the processing liquid in the supply piping to the return piping.

[0012] In the substrate processing device of the present invention, the flow path of the processing liquid has a branch portion, a first flow path, a second flow path, and a third flow path. The branch portion is a branch point of the liquid delivery pipe, the supply pipe, and the return pipe. The first flow path is located on the liquid delivery pipe side relative to the branch portion. The second flow path is located on the supply pipe side relative to the branch portion. The third flow path is located on the return pipe side relative to the branch portion. The first angle is greater than the second angle. The first angle represents the angle formed by the first direction from the branch portion toward the first flow path and the third direction from the branch portion toward the third flow path. The second angle represents the angle formed by the first direction and the second direction from the branch portion toward the second flow path.

[0013] The substrate processing apparatus of the present invention further includes a constriction portion. The constriction portion is provided in the first flow path.

[0014] In the substrate processing apparatus of the present invention, a diameter of an upstream portion of the third flow path is equal to or larger than a diameter of a portion of the first flow path located downstream of the narrowed portion.

[0015] In the substrate processing apparatus of the present invention, the first opening degree indicates that the opening degree of the adjustment valve is smaller than a predetermined opening degree, and the second opening degree indicates that the opening degree of the adjustment valve is equal to or greater than the predetermined opening degree.

[0016] In the substrate processing apparatus of the present invention, when the opening of the adjustment valve is equal to or larger than the predetermined opening, if the opening of the adjustment valve is fixed at a certain value, the accumulation end position of the processing liquid in the supply pipe is maintained at a certain position.

[0017] In the substrate processing apparatus of the present invention, when the opening of the adjustment valve is fixed at a constant value equal to or greater than the predetermined opening, the retention end position is maintained at a higher position as the fixed opening of the adjustment valve increases.

[0018] The substrate processing apparatus of the present invention further includes a circulation pipe in which the processing liquid circulates. The processing liquid flowing through the circulation pipe is supplied to the liquid supply pipe.

[0019] In the substrate processing apparatus of the present invention, the processing liquid guided by the reflux pipe is supplied to the circulation pipe.

[0020] According to a second embodiment of the present invention, a substrate processing method is a method for processing the above-mentioned substrate by supplying a processing liquid from a nozzle to the substrate. The substrate processing method includes a step of switching the opening of an adjustment valve provided in the flow path of the above-mentioned processing liquid to any one of a first opening and a second opening. The flow path of the above-mentioned processing liquid is formed by a liquid delivery pipe, a supply pipe, and a return pipe. The liquid delivery pipe guides the above-mentioned processing liquid. The supply pipe guides the above-mentioned processing liquid guided by the above-mentioned liquid delivery pipe to the above-mentioned nozzle. The return pipe guides the above-mentioned processing liquid guided by the above-mentioned liquid delivery pipe along a path different from the above-mentioned supply pipe. The above-mentioned adjustment valve is provided in the above-mentioned return pipe. The above-mentioned first opening represents the opening of supplying all or part of the above-mentioned processing liquid guided by the above-mentioned liquid delivery pipe to the above-mentioned supply pipe. The above-mentioned second opening represents the opening of supplying all or part of the processing liquid in the above-mentioned supply pipe to the above-mentioned return pipe.

[0021] Effects of the Invention

[0022] According to the substrate processing apparatus and the substrate processing method of the present invention, it is possible to suppress the processing liquid from dripping from the nozzle when the substrate processing apparatus is not processing a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a plan view schematically showing the structure of a substrate processing apparatus according to an embodiment of the present invention.

[0024] Figure 2 It is a side view schematically showing the structure of the processing unit.

[0025] Figure 3 This is a flowchart showing an example of processing on a substrate executed by the substrate processing apparatus.

[0026] Figure 4 It is a schematic diagram showing the structure of the chemical solution supply device.

[0027] Figure 5 It is a schematic diagram showing the structure of the supply mechanism.

[0028] Figure 6 It is a cut-away end view of the installation component.

[0029] Figure 7 It is a schematic diagram showing the pressure of the chemical solution.

[0030] Figure 8 This is a schematic diagram showing a state where a chemical liquid is ejected from a chemical liquid nozzle.

[0031] Fig. 9 This is a first graph showing the relationship between the opening degree of the adjustment valve and the amount of chemical liquid discharged from the chemical liquid nozzle.

[0032] Fig.10 This is a schematic diagram showing a state where the discharge of the chemical liquid from the chemical liquid nozzle is stopped.

[0033] Fig.11 This is a second graph showing the relationship between the opening degree of the regulating valve and the retention end position of the chemical solution.

[0034] Fig.12 It is a diagram showing a modified example of the supply mechanism. DETAILED DESCRIPTION

[0035] Regarding the embodiments of the present invention, Figure 1 It should be noted that the same reference numerals are given to the same or corresponding parts in the drawings, and the description thereof will not be repeated.

[0036] Reference Figure 1 , a substrate processing apparatus 100 according to an embodiment of the present invention will be described. Figure 1 It is a plan view schematically showing the structure of a substrate processing apparatus 100 according to an embodiment of the present invention.

[0037] like Figure 1 As shown, the substrate processing apparatus 100 is a single-wafer type apparatus that processes substrates W one at a time.

[0038] The substrate W is, for example, a silicon wafer, a resin substrate, or a glass or quartz substrate. In this embodiment, a disk-shaped semiconductor substrate is exemplified as the substrate W. However, the shape of the substrate W is not particularly limited. The substrate W can be formed into a rectangular shape, for example.

[0039] The substrate processing apparatus 100 includes a plurality of load ports LP, a plurality of processing units 1 , a storage unit 2 , and a control unit 3 .

[0040] The load port LP holds a tray C containing substrates W. The processing unit 1 processes the substrates W transferred from the load port LP using a processing fluid. The processing fluid refers to, for example, a processing liquid or a processing gas.

[0041] The storage unit 2 includes a main storage device (e.g., semiconductor memory) such as ROM (Read Only Memory) and RAM (Random Access Memory), and may further include an auxiliary storage device (e.g., hard disk drive). The main storage device and / or the auxiliary storage device store various computer programs executed by the control unit 3.

[0042] The control unit 3 includes a processor such as a CPU (Central Processing Unit) and an MPU (MicroProcessing Unit) and controls various elements of the substrate processing apparatus 100 .

[0043] The substrate processing apparatus 100 further includes a transfer robot. The transfer robot transfers the substrate W between the load port LP and the processing unit 1. The transfer robot includes an indexer robot IR and a central robot CR. The indexer robot IR transfers the substrate W between the load port LP and the central robot CR. The central robot CR transfers the substrate W between the indexer robot IR and the processing unit 1. The indexer robot IR and the central robot CR each include a manipulator for supporting the substrate W.

[0044] The substrate processing apparatus 100 further includes a plurality of fluid boxes 4 and a chemical liquid cabinet 5. The plurality of fluid boxes 4 and the processing unit 1 are arranged inside the housing 100a of the substrate processing apparatus 100. The chemical liquid cabinet 5 is arranged outside the housing 100a of the substrate processing apparatus 100. The chemical liquid cabinet 5 may also be arranged on the side of the substrate processing apparatus 100. In addition, the chemical liquid cabinet 5 may also be arranged below (underground) the clean room in which the substrate processing apparatus 100 is installed.

[0045] The plurality of processing units 1 constitute a tower U stacked up and down. A plurality of towers U are provided. The plurality of towers U are arranged so as to surround the central robot CR in a plan view.

[0046] In this embodiment, three processing units 1 are stacked in the tower U. In addition, four towers U are provided. It should be noted that the number of processing units 1 constituting the tower U is not particularly limited. In addition, the number of towers U is also not particularly limited.

[0047] The plurality of fluid boxes 4 correspond to the plurality of towers U, respectively. The chemical solution in the chemical solution tank 5 is supplied to the tower U corresponding to the fluid box 4 via the fluid box 4. As a result, the chemical solution is supplied to all the processing units 1 included in the tower U.

[0048] Reference Figure 2 , processing unit 1 is described. Figure 2 It is a side view schematically showing the structure of the processing unit 1.

[0049] like Figure 2 As shown, the processing unit 1 includes a chamber 6 , a spin chuck 10 , and a cup 14 .

[0050] The chamber 6 includes a partition wall 8, a shutter 9, and a FFU 7 (fan filter unit). The partition wall 8 has a hollow shape. A transfer port is provided in the partition wall 8. The shutter 9 opens and closes the transfer port. The FFU 7 forms a downflow of clean air in the chamber 6. Clean air is air filtered through a filter.

[0051] The central robot CR carries the substrate W into the chamber 6 through the transfer port, and carries the substrate W out of the chamber 6 through the transfer port.

[0052] The spin chuck 10 is disposed in the chamber 6. The spin chuck 10 holds the substrate W horizontally and rotates the substrate W around a rotation axis A1. The rotation axis A1 is a vertical axis passing through the center of the substrate W.

[0053] The rotary chuck 10 includes a plurality of chuck pins 11 , a rotary base 12 , a rotary motor 13 , a cup 14 , and a cup lifting unit 15 .

[0054] The rotating base 12 is a disk-shaped member. The plurality of chuck pins 11 hold the substrate W in a horizontal posture on the rotating base 12. The rotating motor 13 rotates the plurality of chuck pins 11 to rotate the substrate W around the rotating axis A1.

[0055] The spin chuck 10 of this embodiment is a clamping chuck that makes a plurality of chuck pins 11 contact the outer peripheral surface of the substrate W. However, the present invention is not limited to this. The spin chuck 10 may also be a vacuum suction cup. The vacuum suction cup holds the substrate W horizontally by adsorbing the back side (lower surface) of the substrate W, which is a non-device forming surface, onto the upper surface of the spin base 12.

[0056] The cup 14 blocks the processing liquid discharged from the substrate W. The cup 14 includes an inclined portion 14a, a guide portion 14b, and a liquid receiving portion 14c. The inclined portion 14a is a cylindrical member extending obliquely upward toward the rotation axis A1. The inclined portion 14a includes an annular upper end having an inner diameter larger than the substrate W and the rotating base 12. The upper end of the inclined portion 14a is equivalent to the upper end of the cup 14. The upper end of the cup 14 surrounds the substrate W and the rotating base 12 when viewed from above. The guide portion 14b is a cylindrical member extending downward from the lower end (outer end) of the inclined portion 14a. The liquid receiving portion 14c is located at the lower part of the guide portion 14b, forming an annular groove that opens upward.

[0057] The cup lifting unit 15 raises and lowers the cup 14 between the raised position and the lowered position. When the cup 14 is in the raised position, the upper end of the cup 14 is located above the rotating chuck 10. When the cup 14 is in the lowered position, the upper end of the cup 14 is located below the rotating chuck 10.

[0058] The cup 14 is located at the raised position when the processing liquid is supplied to the substrate W. The processing liquid scattered from the substrate W to the outside is blocked by the inclined portion 14a and then collected in the liquid receiving portion 14c via the guide portion 14b.

[0059] The processing unit 1 further includes a cleaning liquid nozzle 16, a cleaning liquid pipe 17, and a cleaning liquid valve 18. The cleaning liquid nozzle 16 sprays cleaning liquid toward the substrate W held by the spin chuck 10. The cleaning liquid nozzle 16 is connected to the cleaning liquid pipe 17. The cleaning liquid valve 18 is installed in the cleaning liquid pipe 17.

[0060] When the cleaning liquid valve 18 is opened, the cleaning liquid is supplied from the cleaning liquid pipe 17 to the cleaning liquid nozzle 16. Then, the cleaning liquid is ejected from the cleaning liquid nozzle 16. The cleaning liquid is, for example, pure water (deionized water). The cleaning liquid is not limited to pure water, and may also be carbonated water, electrolytic ion water, hydrogen water, ozone water, and / or diluted hydrochloric acid water. The diluted concentration is, for example, a concentration of 10 ppm or more and 100 ppm or less.

[0061] The processing unit 1 further includes a chemical liquid nozzle 21 and a nozzle moving unit 22. The chemical liquid nozzle 21 sprays chemical liquid onto the substrate W held by the spin chuck 10. The nozzle moving unit 22 moves the chemical liquid nozzle 21 between a processing position and a retreat position. The processing position indicates a position where the chemical liquid nozzle 21 sprays chemical liquid onto the substrate W. The retreat position indicates a position where the chemical liquid nozzle 21 is away from the substrate W. The nozzle moving unit 22 moves the chemical liquid nozzle 21, for example, by rotating the chemical liquid nozzle 21 around a swing axis A2. The swing axis A2 is a vertical axis located around the cup 14.

[0062] The substrate processing apparatus 100 further includes a chemical liquid supply device 30. The chemical liquid supply device 30 supplies chemical liquid to the chemical liquid nozzle 21 of the processing unit 1. The chemical liquid supplied to the chemical liquid nozzle 21 includes, for example, isopropyl alcohol (IPA).

[0063] The chemical liquid is an example of the processing liquid of the present invention. The chemical liquid nozzle 21 is an example of the nozzle of the present invention.

[0064] Reference Figure 3 , an example of processing of the substrate W performed by the substrate processing apparatus 100 is described. Figure 3 1 is a flowchart showing an example of processing on a substrate W executed by the substrate processing apparatus 100 .

[0065] like Figure 3 As shown, in step S1, the control unit 3 performs a transfer process of transferring the substrate W into the chamber 6. The following describes the sequence of the transfer process.

[0066] First, in a state where the chemical liquid nozzle 21 is retracted from above the substrate W, the central robot CR supports the substrate W with a robot arm and moves the robot arm into the chamber 6. Then, the central robot CR places the substrate W supported by the robot arm on the spin chuck 10. As a result, the substrate W is transferred to the spin chuck 10.

[0067] When the substrate W is transferred onto the spin chuck 10 , the chuck pins 11 hold the substrate W. Then, the spin motor 13 rotates the chuck pins 11 . As a result, the substrate W rotates. When the substrate W rotates, the process moves to step S2 .

[0068] In step S2 , the control unit 3 performs a chemical liquid supply process for supplying a chemical liquid to the substrate W. Hereinafter, the procedure of the chemical liquid supply process will be described.

[0069] First, the nozzle moving unit 22 moves the chemical liquid nozzle 21 to the processing position. Then, the cup lifting unit 15 raises the cup 14 to the raised position. Then, the chemical liquid supply device 30 starts supplying chemical liquid to the chemical liquid nozzle 21. As a result, the chemical liquid nozzle 21 sprays the chemical liquid onto the substrate W.

[0070] When the chemical liquid nozzle 21 ejects the chemical liquid, the nozzle moving unit 22 may also move the chemical liquid nozzle 21 between the central processing position and the peripheral processing position. The central processing position indicates the position where the chemical liquid ejected from the chemical liquid nozzle 21 lands on the central portion of the upper surface of the substrate W. The peripheral processing position indicates the position where the chemical liquid ejected from the chemical liquid nozzle 21 lands on the peripheral portion of the upper surface of the substrate W. In addition, when the chemical liquid nozzle 21 ejects the chemical liquid, the nozzle moving unit 22 may also stop the chemical liquid nozzle 21 in such a way that the landing position of the chemical liquid is located at the central portion of the upper surface of the substrate W.

[0071] The chemical liquid ejected from the chemical liquid nozzle 21 lands on the upper surface of the substrate W, and then flows toward the outside of the substrate W along the upper surface of the rotating substrate W. As a result, a chemical liquid film is formed to cover the entire upper surface of the substrate W.

[0072] In particular, when the nozzle moving unit 22 moves the chemical liquid nozzle 21 between the central processing position and the peripheral processing position, the chemical liquid lands on the entire upper surface of the substrate W. Therefore, the chemical liquid can be uniformly supplied to the entire upper surface of the substrate W.

[0073] When a predetermined time has passed since the start of the supply of the chemical liquid to the chemical liquid nozzle 21, the supply of the chemical liquid to the chemical liquid nozzle 21 is stopped. Then, the nozzle moving unit 22 moves the chemical liquid nozzle 21 to the retracted position. When the chemical liquid nozzle 21 reaches the retracted position, the process proceeds to step S3.

[0074] In step S3 , the control unit 3 performs a cleaning liquid supply process of supplying pure water as an example of the cleaning liquid to the substrate W. The procedure of the cleaning liquid supply process will be described below.

[0075] First, the cleaning liquid valve 18 is opened, and the cleaning liquid nozzle 16 starts to spray pure water. The pure water that has been applied to the upper surface of the substrate W flows along the upper surface of the rotating substrate W and toward the outside of the substrate W. The chemical liquid on the substrate W is rinsed by the pure water sprayed from the cleaning liquid nozzle 16. As a result, a pure water liquid film is formed on the entire upper surface of the substrate W.

[0076] When a predetermined time has passed after the cleaning liquid valve 18 is opened, the cleaning liquid valve 18 is closed to stop the pure water from being ejected toward the substrate W. When the pure water is stopped from being ejected toward the substrate W, the process proceeds to step S4.

[0077] In step S4 , the control unit 3 performs a drying process for drying the substrate W by rotating the substrate W. The procedure of the drying process will be described below.

[0078] First, the rotary motor 13 rotates the substrate W at a high speed (eg, several thousand rpm) greater than the substrate W rotation speed during the chemical liquid supply process and the substrate W rotation speed during the cleaning liquid supply process. As a result, the substrate W is dried by removing liquid from the substrate W.

[0079] When a predetermined time has elapsed after the high-speed rotation of the substrate W has started, the rotation motor 13 stops the rotation of the substrate W. When the rotation of the substrate W stops, the process proceeds to step S5.

[0080] In step S5, the control unit 3 performs a carry-out process of carrying out the substrate W from the chamber 6. The procedure of the carry-out process will be described below.

[0081] First, the cup lifting unit 15 lowers the cup 14 to the lower position. Then, the central robot CR causes the robot hand to enter the chamber 6. Then, the plurality of chuck pins 11 release the substrate W from being held.

[0082] After the plurality of chuck pins 11 release the substrate W from being held, the central robot CR supports the substrate W on the rotary chuck 10 with the robot arm. The central robot CR supports the substrate W with the robot arm and withdraws the robot arm from the chamber 6. As a result, the processed substrate W is unloaded from the chamber 6.

[0083] When the processed substrate W is unloaded from the chamber 6 , the unloading process shown in step S5 is completed.

[0084] By repeating the processes shown in step S1 to step S5 , the plurality of substrates W transported to the substrate processing apparatus 100 are processed one at a time.

[0085] Next, refer to Figure 4 , the chemical solution supply device 30 is described. Figure 4 It is a schematic diagram showing the structure of the chemical solution supply device 30 .

[0086] A plurality of liquid medicine supply devices 30 are provided. The plurality of liquid medicine supply devices 30 are respectively connected to the plurality of towers U (refer to Figure 1 The chemical liquid supply device 30 supplies chemical liquid to all the processing units 1 constituting the corresponding tower U.

[0087] In the present embodiment, one tower U is composed of three processing units 1 . Therefore, one chemical solution supply device 30 supplies chemical solutions to the three processing units 1 .

[0088] like Figure 4 As shown, the chemical solution supply device 30 includes a supply tank 31 , a circulation pipe 32 , a circulation pump 33 , a circulation filter 34 , and a circulation heater 35 .

[0089] The supply tank 31 stores the chemical solution. The circulation pipe 32 is a tubular member. A circulation path for the chemical solution to circulate is formed in the circulation pipe 32. The circulation pipe 32 has an upstream end 32a and a downstream end 32b. The circulation pipe 32 is connected to the supply tank 31. Specifically, the upstream end 32a and the downstream end 32b of the circulation pipe 32 are connected to the supply tank 31.

[0090] The circulation pump 33 delivers the liquid medicine in the supply tank 31 to the circulation pipe 32. When the circulation pump 33 is actuated, the liquid medicine in the supply tank 31 is delivered to the upstream end 32a of the circulation pipe 32. The liquid medicine delivered to the upstream end 32a is transported in the circulation pipe 32 and discharged from the downstream end 32b to the supply tank 31. As the circulation pump 33 is continuously actuated, the liquid medicine continuously flows in the circulation pipe 32 from the upstream end 32a to the downstream end 32b. As a result, the liquid medicine circulates in the circulation pipe 32.

[0091] The circulation filter 34 removes foreign matter such as particles from the chemical solution circulating in the circulation pipe 32. The circulation heater 35 adjusts the temperature of the chemical solution by heating the chemical solution. The circulation heater 35 maintains the temperature of the chemical solution at a constant temperature (e.g., 60° C.) higher than room temperature, for example. The temperature of the chemical solution circulating in the circulation pipe 32 is maintained at a constant temperature by the circulation heater 35.

[0092] The circulation pump 33 , the circulation filter 34 , and the circulation heater 35 are provided in the circulation pipe 32 .

[0093] The supply tank 31 , the circulation pump 33 , the circulation filter 34 , and the circulation heater 35 are installed in the chemical solution cabinet 5 .

[0094] A pressurizing device may be provided instead of the circulation pump 33 . The pressurizing device increases the air pressure in the supply tank 31 to deliver the chemical solution in the supply tank 31 to the circulation pipe 32 .

[0095] The chemical solution supply device 30 further includes a plurality of supply mechanisms 40. In the present embodiment, three supply mechanisms 40 are provided.

[0096] The plurality of supply mechanisms 40 are respectively connected to the circulation pipe 32. The chemical solution circulating in the circulation pipe 32 is supplied to each of the plurality of supply mechanisms 40.

[0097] The plurality of supply mechanisms 40 correspond to the plurality of processing units 1 . The supply mechanism 40 supplies the chemical liquid to the corresponding processing unit 1 . The chemical liquid supplied to the processing unit 1 is ejected from the chemical liquid nozzle 21 .

[0098] The chemical solution supply device 30 further includes a recovery tank 51 , a recovery pipe 52 , a recovery pump 53 , and a recovery filter 54 .

[0099] The recovery tank 51 is connected to each of the plurality of supply mechanisms 40. The recovery tank 51 receives each of the chemical liquids that have not been ejected from the chemical liquid nozzle 21 but have passed through the plurality of supply mechanisms 40.

[0100] The recovery pipe 52 is a tubular member. The recovery pipe 52 guides the liquid medicine in the recovery tank 51 to the supply tank 31. The recovery pipe 52 includes an upstream end 52a and a downstream end 52b. The upstream end 52a is connected to the recovery tank 51. The downstream end 52b is connected to the supply tank 31.

[0101] The recovery pump 53 is provided in the recovery pipe 52. The recovery pump 53 pressurizes and delivers the chemical solution in the recovery tank 51 to the supply tank 31 through the recovery pipe 52. The recovery filter 54 is provided in the recovery pipe 52. The recovery filter 54 removes foreign matter from the chemical solution flowing in the recovery pipe 52.

[0102] Secondly, refer to Figure 5 , the supply mechanism 40 is described. Figure 5 It is a schematic diagram showing the structure of the supply mechanism 40.

[0103] like Figure 5 As shown, the supply mechanism 40 includes a liquid supply pipe 41, a branch portion 42, a supply pipe 43, and a return pipe 44. The liquid supply pipe 41, the supply pipe 43, and the return pipe 44 are connected to each other via the branch portion 42.

[0104] The liquid supply pipe 41 is a tubular member and guides the chemical solution circulating in the circulation pipe 32 to the outside of the circulation pipe 32 . The liquid supply pipe 41 includes an upstream end 41 a and a downstream end 41 b . The upstream end 41 a communicates with the circulation pipe 32 .

[0105] The supply pipe 43 is a tubular member. The supply pipe 43 guides the liquid medicine guided by the liquid supply pipe 41 to the liquid medicine nozzle 21. The supply pipe 43 includes an upstream end 43a and a downstream end 43b. The upstream end 43a is connected to the downstream end 41b of the liquid supply pipe 41 via the branch portion 42. The downstream end 43b is connected to the liquid medicine nozzle 21.

[0106] The reflux pipe 44 is a tubular member. The reflux pipe 44 guides the treatment liquid guided by the liquid supply pipe 41 along a path different from the supply pipe 43. In the present embodiment, the reflux pipe 44 guides the liquid to the recovery tank 51. The reflux pipe 44 includes an upstream end 44a and a downstream end 44b. The upstream end 44a is connected to the downstream end 41b of the liquid supply pipe 41 and the upstream end 43a of the supply pipe 43 via the branch portion 42. The downstream end 44b is connected to the recovery tank 51.

[0107] The supply mechanism 40 further includes a flow meter 45 , a mounting member 46 , and a regulating valve 47 .

[0108] The flow meter 45 detects the flow rate of the chemical solution flowing in the liquid supply pipe 41. The flow meter 45 is provided in the liquid supply pipe 41. Specifically, the flow rate of the chemical solution indicates the amount of the chemical solution flowing at a predetermined position in the liquid supply pipe 41 per unit time.

[0109] The mounting member 46 is disposed at the branch portion 42. The mounting member 46 is a hollow member and is mounted between the liquid supply pipe 41, the supply pipe 43, and the return pipe 44. The liquid supply pipe 41, the supply pipe 43, and the return pipe 44 are connected to each other via the mounting member 46.

[0110] The regulating valve 47 is provided in the return pipe 44. The opening degree of the regulating valve 47 can be changed. The opening degree indicates the degree of opening of the regulating valve 47. The smaller the opening degree of the regulating valve 47 is, the smaller the degree of opening of the regulating valve 47 is.

[0111] The regulating valve 47 includes a driving source such as a motor, and changes its opening degree by the power of the driving source. Figure 1 The control unit 3 shown controls the opening degree of the regulating valve 47 by operating the driving source.

[0112] Next, refer to Figure 4 and Figure 5 , the flow of the chemical solution in the chemical solution supply device 30 will be described.

[0113] like Figure 4 and Figure 5As shown, when the chemical liquid circulating in the circulation piping 32 flows from the circulation piping 32 into the liquid delivery piping 41, it is guided to the branch portion 42 by the liquid delivery piping 41. The chemical liquid supplied from the branch portion 42 to the supply piping 43 is ejected from the chemical liquid nozzle 21. The chemical liquid supplied from the branch portion 42 to the return piping 44 is discharged from the return piping 44 to the recovery tank 51. The chemical liquid discharged to the recovery tank 51 is supplied to the supply tank 31 through the recovery piping 52. The chemical liquid supplied to the supply tank 31 circulates in the circulation piping 32.

[0114] Next, refer to Figure 6 , the mounting component 46 will be described. Figure 6 It is a cutaway end view of the mounting member 46 .

[0115] like Figure 6 As shown, the mounting member 46 includes a first member 46a, a second member 46b, and a third member 46c. The first member 46a, the second member 46b, and the third member 46c are hollow members and communicate with each other. The space where the first member 46a, the second member 46b, and the third member 46c communicate with each other constitutes the branch portion 42.

[0116] The first member 46a and the third member 46c protrude in opposite directions from the branch portion 42. The second member 46b protrudes from the branch portion 42 in a direction perpendicular to the first member 46a and the third member 46c.

[0117] The first member 46a has a first opening 4A. The first opening 4A connects the inside and the outside of the first member 46a. The downstream end 41b of the liquid supply pipe 41 is connected to the first opening 4A.

[0118] The second member 46b has a second opening 4B. The second opening 4B connects the inside and the outside of the second member 46b. The upstream end 43a of the supply pipe 43 is connected to the second opening 4B.

[0119] The third member 46c has a third opening 4C. The third opening 4C communicates the inside and the outside of the third member 46c. The upstream end 44a of the return pipe 44 is connected to the third opening 4C.

[0120] The liquid medicine flowing in the liquid supply pipe 41 is supplied to the inside of the mounting member 46 via the first opening 4A. The liquid medicine inside the mounting member 46 is supplied to the supply pipe 43 via the second opening 4B. The liquid medicine inside the mounting member 46 is supplied to the return pipe 44 via the third opening 4C.

[0121] The flow path of the liquid medicine includes a branch portion 42, a first flow path R1, a second flow path R2, and a third flow path R3. The branch portion 42 is a branch point of the liquid delivery pipe 41, the supply pipe 43, and the return pipe 44. The first flow path R1 represents the flow path of the liquid medicine located on the liquid delivery pipe 41 side relative to the branch portion 42. The first flow path R1 is located between the branch portion 42 and the upstream end 41a of the liquid delivery pipe 41 (see Figure 5 ). The second flow path R2 represents the flow path of the drug solution located on the supply piping 43 side relative to the branch portion 42. The second flow path R2 is located between the branch portion 42 and the downstream end 43b of the supply piping 43. The third flow path R3 represents the flow path of the drug solution located on the return piping 44 side relative to the branch portion 42. The third flow path R3 is located between the branch portion 42 and the downstream end 44b of the return piping 44.

[0122] The supply mechanism 40 further includes a narrowing portion 46d. The narrowing portion 46d is disposed in the first flow path R1. The narrowing portion 46d functions as an orifice that reduces the flow path area of ​​the first flow path R1. The flow path area is the area of ​​the cross section of the drug solution flow path perpendicular to the flow direction of the drug solution.

[0123] In the present embodiment, the narrowed portion 46d is formed in the first member 46a of the mounting member 46. The narrowed portion 46d is opposite to the branch portion 42. The narrowed portion 46d sprays the drug solution toward the branch portion 42. In the present embodiment, the narrowed portion 46d is located near the branch portion 42. Therefore, the drug solution flows into the branch portion 42 immediately after being sprayed from the narrowed portion 46d.

[0124] Figure 6 A first direction Q1 , a second direction Q2 , and a third direction Q3 are shown.

[0125] The first direction Q1 indicates a direction from the branch portion 42 toward the first flow path R1. The second direction Q2 indicates a direction from the branch portion 42 toward the second flow path R2. The third direction Q3 indicates a direction from the branch portion 42 toward the third flow path R3.

[0126] Figure 6 The first angle θ1 and the second angle θ2 are further shown. The first angle θ1 represents the angle formed by the first direction Q1 and the third direction Q3. In detail, the first angle θ1 represents the smaller angle among the angles formed by the first direction Q1 and the third direction Q3. The second angle θ2 represents the angle formed by the first direction Q1 and the second direction Q2. In detail, the second angle θ2 represents the smaller angle among the angles formed by the first direction Q1 and the second direction Q2.

[0127] The first angle θ1 is greater than the second angle θ2 (the first angle θ1>the second angle θ2). That is, the third flow path R3 is less curved relative to the first flow path R1 than the second flow path R2. Therefore, the liquid medicine flowing from the first flow path R1 to the branch portion 42 is mainly guided toward the third flow path R3. In other words, the narrowing portion 46d sprays the liquid medicine toward the third flow path R3.

[0128] In the present embodiment, the first angle θ1 is 180 degrees, and the second angle θ2 is 90 degrees.

[0129] Reference Figure 7 , the pressure of the drug solution is explained. Figure 7 It is a schematic diagram showing the pressure of the chemical solution.

[0130] Figure 7 The first pressure P1, the second pressure P2, and the third pressure P3 are shown. The first pressure P1 indicates the pressure of the drug solution in the upstream region of the narrowed portion 46d in the first flow path R1. The second pressure P2 indicates the pressure of the drug solution in the branch portion 42. The third pressure P3 indicates the pressure of the drug solution in the second flow path R2.

[0131] Figure 7 The first moving direction X1 and the first moving speed V1 are further shown. The first moving direction X1 indicates the moving direction of the medical solution flowing upstream of the narrowed portion 46d in the first flow path R1. The first moving speed V1 indicates the moving speed of the medical solution flowing upstream of the narrowed portion 46d in the first flow path R1.

[0132] Figure 7 The second moving direction X2 and the second moving speed V2 are further shown. The second moving direction X2 indicates the moving direction of the drug solution when the drug solution flows from the first flow path R1 into the branching portion 42. The second moving direction X2 is Figure 6 The second moving speed V2 indicates the moving speed of the medical solution when the medical solution flows from the first flow path R1 into the branching portion 42 .

[0133] In the present embodiment, when the medical solution discharged from the narrowed portion 46 d flows from the first flow path R1 into the branching portion 42 , it moves in the second moving direction X2 at the second moving speed V2 .

[0134] like Figure 7 As shown in FIG. 1 , the flow path area of ​​the narrowed portion 46d is smaller than the flow path area upstream of the narrowed portion 46d. Therefore, according to Bernoulli's theorem, the movement speed of the drug solution increases and the pressure of the drug solution decreases in the narrowed portion 46d compared to the upstream of the narrowed portion 46d. As a result, the drug solution accelerated and decompressed in the narrowed portion 46d is ejected from the narrowed portion 46d.

[0135] Since the liquid medicine accelerated and decompressed in the narrowed portion 46d is ejected from the narrowed portion 46d, the second moving speed V2 is greater than the first moving speed V1 (second moving speed V2>first moving speed V1). In addition, the second pressure P2 is less than the first pressure P1 (second pressure P2<first pressure P1).

[0136] By changing Figure 5 The second pressure P2 is changed by changing the opening of the regulating valve 47 shown in FIG. The smaller the opening of the regulating valve 47, the smaller the flow path area of ​​the third flow path R3 where the regulating valve 47 is located. As a result, the amount of liquid medicine passing through the regulating valve 47 per unit time decreases, so the second pressure P2 increases.

[0137] It should be noted that the opening degree of the regulating valve 47 is changed by Figure 1 The control unit 3 shown is performed.

[0138] Figure 7 The first diameter D1, the second diameter D2, the third diameter D3, the fourth diameter D4, and the fifth diameter D5 are shown. The first diameter D1 indicates the diameter of the portion of the first flow path R1 located upstream of the narrowing portion 46d. The second diameter D2 indicates the diameter of the narrowing portion 46d. The third diameter D3 indicates the diameter of the portion of the first flow path R1 located downstream of the narrowing portion 46d. The fourth diameter D4 indicates the diameter of the upstream portion of the third flow path R3. The upstream portion of the third flow path R3 indicates the vicinity of the branch portion 42 in the third flow path R3. The fifth diameter D5 indicates the diameter of the upstream portion of the second flow path R2. The upstream portion of the second flow path R2 indicates the vicinity of the branch portion 42 in the second flow path R2.

[0139] The first diameter D1 is larger than the second diameter D2 (the first diameter D1>the second diameter D2). The third diameter D3 is larger than the second diameter D2 (the third diameter D3>the second diameter D2). The fourth diameter D4 is larger than the third diameter D3 (the fourth diameter D4≧the third diameter D3). The fourth diameter D4 is larger than the fifth diameter D5 (the fourth diameter D4≧the fifth diameter D5). It should be noted that the size relationship between the fourth diameter D4 and the fifth diameter D5 is not particularly limited. The fourth diameter D4 may also be smaller than the fifth diameter D5.

[0140] Next, refer to Figures 7 to 9 , the relationship between the opening degree of the adjustment valve 47 and the amount of the chemical liquid discharged from the chemical liquid nozzle 21 will be described. Figure 8 A schematic diagram showing a state where the chemical liquid is ejected from the chemical liquid nozzle 21 .

[0141] Fig. 9The first graph G1 shows the relationship between the opening of the regulating valve 47 and the amount of the liquid medicine discharged from the liquid medicine nozzle 21. In the first graph G1, the horizontal axis shows the opening of the regulating valve 47. In the first graph G1, the vertical axis shows the amount of the liquid medicine discharged from the liquid medicine nozzle 21. Specifically, the amount of the liquid medicine discharged indicates the amount of the liquid medicine discharged per unit time.

[0142] like Figures 7 to 9 As shown, the control unit 3 adjusts the opening of the regulating valve 47 so that the second pressure P2 is greater than the third pressure P3, thereby generating an attractive force F1 using the pressure difference between the second pressure P2 and the third pressure P3 (second pressure P2>third pressure P3). The attractive force F1 represents the force that attracts the liquid medicine supplied from the first flow path R1 to the branching portion 42 to the second flow path R2. The smaller the opening of the regulating valve 47, the greater the attractive force F1.

[0143] In this embodiment, if Figure 6 As shown, the first angle θ1 is greater than the second angle θ2 (θ1>θ2). Therefore, in a state where the suction force F1 is not generated, the liquid medicine flowing from the first flow path R1 to the branch portion 42 is mainly guided toward the third flow path R3. However, by generating the suction force F1, the liquid medicine that is intended to flow from the branch portion 42 to the third flow path R3 is sucked into the second flow path R2. The liquid medicine sucked into the second flow path R2 is supplied to the liquid medicine nozzle 21. As a result, the liquid medicine is ejected from the liquid medicine nozzle 21.

[0144] When the opening of the regulating valve 47 is the minimum opening J0, the regulating valve 47 is not closed but opened. In this case, the regulating valve 47 is slightly opened. In this case, the liquid medicine supplied from the first flow path R1 to the branch portion 42 is mainly supplied to the liquid medicine nozzle 21 via the second flow path R2. As a result, the liquid medicine is ejected from the liquid medicine nozzle 21. In addition, in this case, the ejection amount of the liquid medicine from the liquid medicine nozzle 21 becomes the maximum ejection amount H. In addition, in this case, a small amount of liquid medicine is supplied to the recovery tank 51, or no liquid medicine is supplied to the recovery tank 51.

[0145] It should be noted that the regulating valve 47 may be closed when the opening of the regulating valve 47 is at the minimum opening J0. In this case, all the liquid medicine supplied from the first flow path R1 to the branching portion 42 is supplied to the liquid medicine nozzle 21 via the second flow path R2. In this case, the liquid medicine is not supplied to the recovery tank 51.

[0146] When the opening of the regulating valve 47 is greater than the predetermined opening J1, the suction force F1 is not generated to the extent that the liquid medicine can be sucked into the second flow path R2. Therefore, all the liquid medicine supplied from the first flow path R1 to the branching portion 42 is supplied to the recovery tank 51 via the third flow path R3. As a result, the liquid medicine is not ejected from the liquid medicine nozzle 21.

[0147] The predetermined opening J1 indicates the minimum value of the opening of the regulating valve 47 when the chemical liquid is not ejected from the chemical liquid nozzle 21 .

[0148] When the opening of the regulating valve 47 is greater than the minimum opening J0 and less than the predetermined opening J1, a portion of the liquid medicine supplied from the first flow path R1 to the branch portion 42 flows to the second flow path R2, and another portion of the liquid medicine supplied to the branch portion 42 flows to the third flow path R3. As a result, the liquid medicine is ejected from the liquid medicine nozzle 21 and supplied to the recovery tank 51.

[0149] When the opening of the adjustment valve 47 is greater than the minimum opening J0 and less than the predetermined opening J1, the smaller the opening of the adjustment valve 47, the greater the amount of the liquid medicine discharged from the liquid medicine nozzle 21. In other words, in this case, the smaller the opening of the adjustment valve 47, the smaller the amount of the liquid medicine supplied to the recovery tank 51. Therefore, the amount of the liquid medicine discharged from the liquid medicine nozzle 21 can be adjusted by adjusting the opening of the adjustment valve 47.

[0150] Next, refer to Figure 7 , Fig.10 and Fig.11 Next, the relationship between the opening of the adjustment valve 47 and the medical solution retention end position Z will be described. The medical solution retention end position Z indicates the end position of the medical solution retained in the second flow path R2 on the medical solution nozzle 21 side.

[0151] Fig.10 This is a schematic diagram showing a state in which the discharge of the chemical liquid from the chemical liquid nozzle 21 is stopped. Fig.11 The second graph G2 shows the relationship between the opening of the regulating valve 47 and the stagnation end position Z of the chemical solution. In the second graph G2, the horizontal axis shows the opening of the regulating valve 47 and the vertical axis shows the stagnation end position Z of the chemical solution.

[0152] like Figure 7 , Fig.10 and Fig.11 As shown, the control unit 3 adjusts the opening of the regulating valve 47 so that the second pressure P2 is smaller than the third pressure P3, thereby generating the suction force F2 by utilizing the pressure difference between the second pressure P2 and the third pressure P3 (the second pressure P2 < the third pressure P3). The suction force F2 represents the force for sucking the liquid medicine in the second flow path R2 into the branching portion 42. The larger the opening of the regulating valve 47, the larger the suction force F2.

[0153] The suction force F2 generates the back suction. The back suction means that all or part of the liquid medicine in the second flow path R2 is sucked into the branching portion 42 by the suction force F2. As a result, the discharge of the liquid medicine from the liquid medicine nozzle 21 stops.

[0154] The drug solution flowing from the second flow path R2 to the branch portion 42 is sucked into the flow X of the drug solution ejected from the narrowed portion 46 d by back suction and is supplied to the third flow path R3 (suction effect).

[0155] In the present embodiment, when the opening degree of the regulating valve 47 is equal to or greater than the predetermined opening degree J1, the suction force F2 is generated. As a result, the discharge of the chemical liquid from the chemical liquid nozzle 21 is stopped.

[0156] When the opening of the regulating valve 47 is equal to or greater than the predetermined opening J1, if the opening of the regulating valve 47 is fixed to a certain value, the retention end position Z of the liquid medicine is maintained at a certain position. In this case, the retention end position Z of the liquid medicine is maintained at a certain position by the suction force F2 and the weight of the liquid medicine in the second flow path R2. As a result, the liquid medicine in the second flow path R2 is supported by the suction force F2, thereby suppressing the liquid medicine in the second flow path R2 from dripping from the liquid medicine nozzle 21.

[0157] When the opening of the regulating valve 47 is fixed at a constant value equal to or greater than the predetermined opening J1, the retention end position Z is maintained at a higher position as the fixed opening of the regulating valve 47 increases.

[0158] The higher the retention end position Z is, the closer the retention end position Z is to the branch portion 42. The lower the retention end position Z is, the closer the retention end position Z is to the chemical liquid nozzle 21.

[0159] Above, as reference Figures 7 to 11 As described above, the control unit 3 can switch the opening degree of the regulating valve 47 to any one of the first opening degree and the second opening degree.

[0160] The first opening degree indicates an opening degree smaller than the predetermined opening degree J1. In this case, all or part of the chemical liquid guided through the liquid delivery pipe 41 is supplied to the supply pipe 43. As a result, the chemical liquid is ejected from the chemical liquid nozzle 21.

[0161] The second opening degree indicates an opening degree greater than or equal to the predetermined opening degree J1. In this case, all or part of the chemical liquid in the supply pipe 43 is supplied to the return pipe 44 by the suction effect. In addition, in this case, the suction force F2 acts on the chemical liquid in the supply pipe 43. Therefore, the control unit 3 fixes the opening degree of the adjustment valve 47 at a certain value greater than or equal to the predetermined opening degree J1, and can make the suction force F2 continue to act on the chemical liquid in the supply pipe 43 even when the substrate processing apparatus 100 is not in use. As a result, it is possible to suppress the chemical liquid from dripping from the chemical liquid nozzle 21 when the substrate processing apparatus 100 is not in use.

[0162] The state in which the substrate processing apparatus 100 is not used indicates a state in which the substrate processing apparatus 100 is not processing the substrate W. The state in which the substrate processing apparatus 100 is used indicates a state in which the substrate processing apparatus 100 is processing the substrate W.

[0163] In addition, when the opening of the adjustment valve 47 is the first opening, the liquid medicine is ejected from the liquid medicine nozzle 21. When the opening of the adjustment valve 47 is the second opening, the liquid medicine is not ejected from the liquid medicine nozzle 21. Therefore, even if a valve is not provided upstream of the liquid medicine nozzle 21, it is possible to control whether the liquid medicine is ejected from the liquid medicine nozzle 21. As a result, it is possible to suppress the generation of particles due to the opening and closing action of the valve located upstream of the liquid medicine nozzle 21, so that the particles in the liquid medicine ejected from the liquid medicine nozzle 21 can be reduced. The upstream of the liquid medicine nozzle 21 represents the liquid delivery pipe 41 and the supply pipe 43.

[0164] In the case where the substrate processing apparatus 100 is not used after being used, if the chemical liquid is not retained in the supply piping 43, condensation will occur in the supply piping 43 due to the cooling of the supply piping 43 and contact with the air. Then, if the substrate processing apparatus 100 is used again after condensation occurs in the supply piping 43, water generated by condensation will be mixed into the chemical liquid as an impurity, so there is a possibility of abnormality. However, in the present embodiment, when the opening of the adjustment valve 47 is greater than the prescribed opening J1, if the opening of the adjustment valve 47 is fixed to a certain value, the retention end position Z of the chemical liquid in the supply piping 43 is maintained at a certain position. Therefore, the chemical liquid can be retained in the supply piping 43 when the substrate processing apparatus 100 is not used. As a result, since condensation can be suppressed in the supply piping 43, abnormality can be suppressed after the substrate processing apparatus 100 is used again.

[0165] In addition, by allowing the chemical liquid to remain in the supply pipe 43 when the substrate processing apparatus 100 is not in use, the chemical liquid can be quickly ejected from the chemical liquid nozzle 21 after the substrate processing apparatus 100 is used again. In addition, by changing the accumulation end position Z of the chemical liquid in the supply pipe 43, the timing of starting to eject the chemical liquid from the chemical liquid nozzle 21 can be adjusted.

[0166] Above, with reference to the accompanying drawings ( Figures 1 to 11) and describes the embodiments of the present invention. However, the present invention is not limited to the above-mentioned embodiments, and may be implemented in various forms without departing from the main purpose thereof (for example, (1) to (6)). In addition, various inventions may be formed by appropriately combining the multiple components disclosed in the above-mentioned embodiments. For example, several components may be deleted from all the components shown in the embodiments. The accompanying drawings are schematically represented with each component as the main body for easy understanding, and there are also situations where the number of each component shown in the drawings is different from the actual situation due to the conditions for making the drawings. In addition, the various components shown in the above-mentioned embodiments are only examples and are not particularly limited. Various changes may be made without departing from the scope of the effects of the present invention.

[0167] (1) Fig.12 40 is a diagram showing a modified example of the supply mechanism 40. Fig.12 As shown in FIG. 1 , the modification of the supply mechanism 40 is different from the substrate processing apparatus 100 of the present embodiment in that a flow meter 45 is provided in the supply pipe 43 .

[0168] (2) In the present embodiment, the chemical solution is stored in the supply tank 31. However, the present invention is not limited thereto. The cleaning solution may also be stored in the supply tank 31. Figure 5 and Fig.12 In the embodiment, the cleaning liquid can flow in the liquid delivery pipe 41, the supply pipe 43, and the return pipe 44, and the liquid nozzle 21 can be the cleaning liquid nozzle 16. In this case, the cleaning liquid is a second example of the treatment liquid of the present invention. In addition, the cleaning liquid nozzle 16 is a second example of the nozzle of the present invention.

[0169] In addition, the processing liquid of the present invention is not limited to a chemical liquid or a cleaning liquid, and any liquid may be used as long as it is a liquid used for processing the substrate W in the substrate processing apparatus 100 .

[0170] (3) Even if not set Figure 5 and Fig.12 In a case where the substrate processing apparatus 100 can function even with the flow meter 45 shown, the flow meter 45 may not be provided.

[0171] (4) Even if not set Fig.10 The narrowed portion 46d shown in FIG. 1 can also ensure a sufficiently fast second moving speed V2 of the drug solution (see FIG. 1 ). Figure 7 ) so that the suction effect can be generated, the narrowed portion 46d may not be provided. As a result, the device structure of the substrate processing apparatus 100 can be simplified.

[0172] It should be noted that, when the narrowing portion 46d is provided as in the present embodiment and the modified example of the present embodiment, even if the first moving speed V1 is not fast enough to produce the suction effect, the narrowing portion 46d can make the second moving speed V2 of the liquid medicine faster than the first moving speed V1. Therefore, the suction effect can be effectively produced.

[0173] (5) In the present embodiment and the modified example of the present embodiment, a first switch valve for opening and closing the first flow path R1 may be provided in the liquid supply piping 41. In this case, for example, the first switch valve is closed when the substrate processing apparatus 100 is not in use, and the first switch valve is opened when the substrate processing apparatus 100 is in use. In addition, a second switch valve for opening and closing the second flow path R2 may be provided in the supply piping 43. In this case, for example, the second switch valve is closed when the substrate processing apparatus 100 is not in use, and the second switch valve is opened when the substrate processing apparatus 100 is in use. However, not providing the first switch valve and the second switch valve as in the present embodiment and the modified example of the present embodiment is advantageous in that particles can be effectively suppressed.

[0174] (6) Figure 4 , Figure 5 and Fig.12 As shown, in the present embodiment and the modified example of the present embodiment, the liquid medicine discharged from the reflux pipe 44 is supplied to the supply tank 31 via the recovery tank 51 and the recovery pipe 52. However, the present invention is not limited to this. The reflux pipe 44 may be directly connected to the recovery tank 51, so that the liquid medicine discharged from the reflux pipe 44 is supplied to the recovery tank 51. In addition, the reflux pipe 44 may be directly connected to the circulation pipe 32, so that the liquid medicine discharged from the reflux pipe 44 is supplied to the circulation pipe 32. In this case, the pressure of the liquid medicine in the circulation pipe 32 is lower than the pressure of the liquid medicine in the reflux pipe 44, which becomes a condition for returning the liquid medicine in the reflux pipe 44 to the circulation pipe 32.

[0175] (7) In the present embodiment and the modified example of the present embodiment, the processing unit 1 may further include an opposing member 23 (see Fig.12 ). The opposing member (shielding plate) 23 may be arranged opposite to the upper surface of the substrate W. The size of the surface of the opposing member 23 that faces the upper surface of the substrate W is, for example, larger than the size of the upper surface of the substrate W. The chemical liquid nozzle 21 faces the upper surface of the substrate W at a distance from the central portion of the opposing member 23.

[0176] Industrial Applicability

[0177] The present invention can be applied to the fields of substrate processing devices and substrate processing methods.

[0178] Description of Reference Numerals

[0179] 3. Control Unit

[0180] 21. Liquid nozzle (nozzle)

[0181] 32 Circulation piping

[0182] 41 Liquid delivery piping

[0183] 42 Branch

[0184] 43 Supply piping

[0185] 44 Return pipe

[0186] 46d Narrowing

[0187] 47 Regulating valve

[0188] 100 Substrate processing device

[0189] D3 3rd diameter (diameter of the upstream portion of the 3rd flow path)

[0190] D4: 4th diameter (diameter of the portion of the first flow path located downstream of the narrowing portion)

[0191] J1 Specified opening

[0192] Q1 Direction 1

[0193] Q2 Direction 2

[0194] Q3 3rd direction

[0195] R1 1st flow path

[0196] R2 2nd flow path

[0197] R3 3rd flow path

[0198] W substrate

[0199] Z dwell end position

[0200] θ1 1st angle

[0201] θ2 Second angle

Claims

1. A substrate processing device for processing a substrate by supplying a processing liquid to the substrate from a nozzle, wherein: have: A liquid delivery pipe for guiding the above-mentioned treatment liquid; a supply pipe for guiding the processing liquid guided by the liquid delivery pipe to the nozzle; a return pipe for guiding the processing liquid guided by the liquid delivery pipe along a path different from that of the supply pipe; A regulating valve is installed on the return pipe; and A control unit, controlling the regulating valve; The control unit adjusts the flow rate of the treatment liquid supplied to the supply pipe by adjusting the opening of the adjustment valve when the opening of the adjustment valve is smaller than a predetermined opening. The control unit stops supplying the processing liquid to the supply pipe by making the opening of the regulating valve equal to or larger than the predetermined opening. The predetermined opening degree indicates a minimum value of the opening degree of the regulating valve when the processing liquid is not ejected from the nozzle.

2. The substrate processing apparatus according to claim 1, wherein: The flow path of the above-mentioned treatment liquid has: a branch portion, the branch portion being a branch point of the liquid delivery pipe, the supply pipe, and the return pipe; A first flow path located on the liquid delivery pipe side relative to the branch portion; A second flow path located on the supply pipe side relative to the branch portion; and A third flow path located on the return pipe side relative to the branch portion; The first angle is greater than the second angle. The first angle refers to an angle formed by a first direction from the branch portion toward the first flow path and a third direction from the branch portion toward the third flow path. The second angle indicates an angle formed between the first direction and a second direction from the branch portion toward the second flow path.

3. The substrate processing apparatus according to claim 2, wherein: The invention further comprises a narrowing portion provided in the first flow path.

4. The substrate processing apparatus according to claim 3, wherein: The diameter of the upstream portion of the third flow path is equal to or larger than the diameter of a portion of the first flow path located downstream of the narrowed portion.

5. The substrate processing apparatus according to any one of claims 1 to 4, wherein: When the opening degree of the regulating valve is equal to or larger than the predetermined opening degree, if the opening degree of the regulating valve is fixed to a certain value, the accumulation end position of the processing liquid in the supply pipe is maintained at a certain position.

6. The substrate processing apparatus according to claim 5, wherein: When the opening of the regulating valve is fixed at a constant value equal to or greater than the predetermined opening, the stagnation end position is maintained at a higher position as the fixed opening of the regulating valve increases.

7. The substrate processing apparatus according to any one of claims 1 to 4 and 6, wherein: It also has a circulation pipe for circulating the above-mentioned treatment liquid. The processing liquid flowing through the circulation pipe is supplied to the liquid feeding pipe.

8. The substrate processing apparatus according to claim 7, wherein: The processing liquid guided by the reflux pipe is supplied to the circulation pipe.

9. A substrate processing method, wherein a processing liquid is supplied from a nozzle to the substrate to process the substrate, wherein: A step of changing the opening of a regulating valve provided in the flow path of the treatment liquid; The flow path of the above-mentioned treatment liquid is formed by the following pipes: A liquid delivery pipe for guiding the above-mentioned treatment liquid; a supply pipe for guiding the processing liquid guided by the liquid delivery pipe to the nozzle; and a return pipe for guiding the processing liquid guided by the liquid delivery pipe along a path different from that of the supply pipe; The regulating valve is arranged on the return pipe. In the step of changing the opening of the regulating valve, when the opening of the regulating valve is smaller than a predetermined opening, the flow rate of the processing liquid supplied to the supply pipe is adjusted by adjusting the opening of the regulating valve, In the step of changing the opening of the regulating valve, the supply of the processing liquid to the supply pipe is stopped by making the opening of the regulating valve equal to or larger than the predetermined opening. The predetermined opening degree indicates a minimum value of the opening degree of the regulating valve when the processing liquid is not ejected from the nozzle.

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