Heat dissipation structure and electronic device

Abstract

A heat dissipation structure is installed in an electronic device, the electronic device includes a camera module, the heat dissipation structure includes a heat dissipation body, a sealed cavity provided in the heat dissipation body, and a heat transfer medium sealed in the sealed cavity, the sealed cavity includes an evaporation section and a condensation section connected to the evaporation section, the heat dissipation structure also includes a connecting plate connected to the evaporation section, the connecting plate is used to fix the camera module, so that the camera module transfers the heat generated to the connecting plate, the connecting plate transfers the heat to the evaporation section, the heat transfer medium absorbs heat in the evaporation section and vaporizes and enters the condensation section, the vaporized heat transfer medium liquefies in the condensation section and dissipates the heat to the outside of the electronic device. The heat dissipation structure provided by the present invention enables the heat generated by the camera module to be quickly taken away, avoiding the problem of image quality degradation caused by deformation of the photosensitive chip due to heat or changes in internal air density. In addition, the present invention also provides an electronic device having the above-mentioned heat dissipation structure.

Description

Technical Field

[0001] The invention relates to a heat dissipation structure and an electronic device. Background Art

[0002] A mobile phone camera module usually includes an optical lens, a base, a photosensitive chip, a circuit board and other components. The photosensitive chip is arranged in a closed space formed by the base and the circuit board. The space is sealed and does not conduct heat up and down. When the mobile phone camera module works for a long time, the chip will be deformed by heat or the internal air density will change, and the image quality will be seriously reduced. Summary of the Invention

[0003] In view of this, the present invention provides a heat dissipation structure to solve the problem of poor heat dissipation of the camera module.

[0004] In addition, the present invention also provides an electronic device having the above heat dissipation structure.

[0005] A heat dissipation structure is installed in an electronic device, wherein the electronic device includes a camera module. The heat dissipation structure includes a heat dissipation body, a sealed cavity provided in the heat dissipation body, and a heat transfer medium sealed in the sealed cavity. The sealed cavity includes an evaporation section and a condensation section connected to the evaporation section. The heat dissipation structure also includes a connecting plate connected to the evaporation section. The connecting plate is used to fix the camera module so that the camera module transfers the generated heat to the connecting plate, and the connecting plate transfers the heat to the evaporation section. The heat transfer medium absorbs the heat in the evaporation section and vaporizes and enters the condensation section. The vaporized heat transfer medium liquefies in the condensation section and dissipates the heat to the outside of the electronic device.

[0006] Furthermore, a capillary structure is provided on the inner wall of the heat dissipation body.

[0007] Furthermore, the heat transfer medium is one of high-purity water, methanol and ethanol.

[0008] Furthermore, the heat dissipation structure is made of metal material.

[0009] An electronic device includes at least one rear camera and a first heat dissipation structure connected to the rear camera, the first heat dissipation structure includes a first heat dissipation body, a first sealed cavity provided in the first heat dissipation body and a heat transfer medium sealed in the first sealed cavity, the first sealed cavity includes a first evaporation section and a first condensation section connected to the first evaporation section, the first heat dissipation structure also includes a first connecting plate connected to the evaporation section, the rear camera contacts the first connecting plate and transfers the generated heat to the first connecting plate, the first connecting plate transfers the heat to the first evaporation section, the heat transfer medium absorbs the heat in the first evaporation section and vaporizes into the first condensation section, the vaporized heat transfer medium liquefies in the first condensation section and dissipates the heat to the outside of the electronic device.

[0010] Furthermore, the electronic device also includes at least one front camera and a second heat dissipation structure connected to the front camera, the second heat dissipation structure includes a second heat dissipation body, a second sealed cavity provided in the second heat dissipation body and the heat transfer medium sealed in the second sealed cavity, the second sealed cavity includes a second evaporation section and a second condensation section connected to the second evaporation section, the second heat dissipation structure also includes a second connecting plate connected to the evaporation section, the front camera contacts the second connecting plate and transfers the generated heat to the second connecting plate, the second connecting plate transfers the heat to the second evaporation section, the heat transfer medium absorbs the heat in the second evaporation section and vaporizes into the second condensation section, the vaporized heat transfer medium liquefies in the second condensation section and dissipates the heat outside the electronic device.

[0011] Furthermore, the electronic device further includes a frame, which includes a plurality of frame strips connected end to end, the inner side of the frame strips is recessed to form a receiving groove, and the first condensation section and the second condensation section are received in the receiving groove.

[0012] Furthermore, the first condensation section protrudes from the first evaporation section on one side, and the second condensation section protrudes from the second evaporation section on both sides.

[0013] Furthermore, a first thermally conductive adhesive layer is provided between the rear camera and the first connecting plate, and a first thermally conductive adhesive layer is provided between the front camera and the second connecting plate.

[0014] Furthermore, a second thermally conductive adhesive layer is provided between the first condensation section and the peripheral wall of the receiving groove, and a second thermally conductive adhesive layer is provided between the second condensation section and the peripheral wall of the receiving groove.

[0015] The heat dissipation structure provided by the present invention is connected to the camera module, so that the heat generated by the camera module can be quickly removed, avoiding the problem of image quality degradation caused by thermal deformation of the photosensitive chip or changes in internal air density. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of an electronic device provided by an embodiment of the present invention.

[0017] Figure 2 for Figure 1 Exploded view of the electronic device shown.

[0018] Figure 3 for Figure 1 The electronic device is shown as a cross-sectional view along line III-III.

[0019] Description of main component symbols

[0020] Heat dissipation structure 100

[0021] First heat dissipation structure 100a

[0022] The second heat dissipation structure 100b

[0023] Heat dissipation body 10

[0024] First heat dissipation body 10a

[0025] Second heat dissipation body 10b

[0026] Sealed chamber 11

[0027] First sealed cavity 11a

[0028] Second sealed cavity 11b

[0029] Evaporation section 111

[0030] First evaporation section 111a

[0031] Second evaporation section 111b

[0032] Condensation section 112

[0033] First condensation section 112a

[0034] Second condensation section 112b

[0035] Heat transfer medium 12

[0036] Connecting plate 20

[0037] First connecting plate 20a

[0038] Second connecting plate 20b

[0039] First thermal conductive adhesive layer 30

[0040] Second thermal conductive adhesive layer 40

[0041] Electronic device 200

[0042] Camera module 201

[0043] Rear camera 201a

[0044] Front camera 201b

[0045] Optical Lens 2011

[0046] Mirror Mount 2012

[0047] Circuit Board 2013

[0048] Photosensitive chip 2014

[0049] Hollowed Out Area 2015

[0050] Steel Plate 2016

[0051] Border 202

[0052] Border Strip 2021

[0053] First border strip 2021a

[0054] Second border strip 2021b

[0055] Storage Tank 2022

[0056] First receiving slot 2022a

[0057] Second receiving slot 2022b

[0058] The following specific embodiments will further illustrate the present invention in conjunction with the above description of the drawings. DETAILED DESCRIPTION

[0059] The following will be combined with specific embodiments and attached Figure 1-3 The technical solution of the present invention is described clearly and completely. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, all technical and scientific terms used in this article have the same meaning as those commonly understood by technicians in the technical field of the present invention. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0060] In the description of the embodiments of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the embodiments of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0061] Please also see Figure 1 、 Figure 2 and Figure 3 A heat dissipation structure 100 provided in an embodiment of the present invention is installed in an electronic device 200, and the electronic device 200 includes a heating element. In this embodiment, the heating element is a camera module 201. The heat dissipation structure 100 includes a heat dissipation body 10, a sealed cavity 11 provided in the heat dissipation body 10, and a heat transfer medium 12 sealed in the sealed cavity 11. The sealed cavity 11 includes an evaporation section 111 and a condensation section 112 connected to the evaporation section 111. The heat dissipation structure 100 also includes a connecting plate 20 connected to the evaporation section 111. The camera module 201 is fixed to the connecting plate 20 and transfers the generated heat to the connecting plate 20. The connecting plate 20 transfers the heat to the evaporation section 111. The heat transfer medium 12 absorbs the heat in the evaporation section 111 and vaporizes and enters the condensation section 112. The vaporized heat transfer medium 12 liquefies in the condensation section 112 and dissipates the heat to the outside of the electronic device 200.

[0062] The heat dissipation structure 100 is connected to the camera module 201 via the connecting plate 20, so that the heat generated by the camera module 201 can be quickly removed, thereby avoiding the problem of image quality degradation caused by thermal deformation of the photosensitive chip or changes in internal air density.

[0063] In this embodiment, the heat dissipation structure 100 is made of a metal material with thermal conductivity, such as copper, iron, silver, gold, and alloys thereof.

[0064] In this embodiment, a capillary structure (not shown) is provided on the inner wall of the heat dissipation body 10. The capillary structure is composed of a capillary porous material. The capillary structure in this embodiment is formed by sintering copper powder of different forms. In other embodiments of the present invention, the capillary structure can also be formed using other methods known in the art, such as fibers, wire mesh, grooves, etc.

[0065] In this embodiment, the evaporation section 111 is approximately square, and the condensation section 112 is long and has a semicircular cross section. In other embodiments of the present invention, the evaporation section 111 and the condensation section 112 can be any shape according to requirements.

[0066] In this embodiment, the heat dissipation structure 100 is formed by an in-mold molding process. In other embodiments of the present invention, the heat dissipation structure 100 may also be made by other molding processes.

[0067] In this embodiment, the heat transfer medium 12 is a liquid with a low boiling point, which is easily volatile and will not corrode the heat dissipation structure, such as high-purity water, methanol, or ethanol. The heat transfer medium 12 can be injected into the heat dissipation structure 100 during film molding.

[0068] In this embodiment, the camera module 201 includes an optical lens 2011, a lens holder 2012, and a circuit board 2013 connected in sequence. The camera module 201 also includes a photosensitive chip 2014 electrically connected to the circuit board 2013. Specifically, the circuit board 2013 is provided with a hollow area 2015 at a position corresponding to the optical lens 2011. The photosensitive chip 2014 is accommodated in the hollow area 2015, and a steel plate 2016 is provided on the side of the photosensitive chip 2014 away from the optical lens 2011. The steel plate 2016 is connected to the connecting plate 20 through the first thermal conductive adhesive layer 30.

[0069] An embodiment of the present invention also provides an electronic device 200, which includes at least one first heating element (such as a rear camera 201a) and a first heat dissipation structure 100a connected to the first heating element, and at least one second heating element (such as a front camera 201b) and a second heat dissipation structure 100b connected to the second heating element.

[0070] In this embodiment, the first heat dissipation structure 100a includes a first heat dissipation body 10a, a first sealed cavity 11a provided in the first heat dissipation body 10a, and the heat transfer medium 12 sealed in the first sealed cavity 11a, the first sealed cavity 11a includes a first evaporation section 111a and a first condensation section 112a connected to the first evaporation section 111a, the first heat dissipation structure 100a also includes a first connecting plate 20a connected to the first evaporation section 111a, the rear camera 201a contacts the first connecting plate 20a and transfers the generated heat to the first connecting plate 20a, the first connecting plate 20a transfers the heat to the first evaporation section 111a, the heat transfer medium 12 absorbs the heat in the first evaporation section 111a and vaporizes into the first condensation section 112a, the vaporized heat transfer medium 12 liquefies in the first condensation section 112a and dissipates the heat to the outside of the electronic device 200.

[0071] In this embodiment, the second heat dissipation structure 100b includes a second heat dissipation body 10b, a second sealed cavity 11b provided in the second heat dissipation body 10b, and the heat transfer medium 12 sealed in the second sealed cavity 11b, the second sealed cavity 11b includes a second evaporation section 111b and a second condensation section 112b connected to the second evaporation section 111b, the second heat dissipation structure 100b also includes a second connecting plate 20b connected to the second evaporation section 111b, the front camera 201b contacts the second connecting plate 20b and transfers the generated heat to the second connecting plate 20b, the second connecting plate 20b transfers the heat to the second evaporation section 111b, the heat transfer medium 12 absorbs the heat in the second evaporation section 111b and vaporizes into the second condensation section 112b, the vaporized heat transfer medium 12 liquefies in the second condensation section 112b and dissipates the heat to the outside of the electronic device 200.

[0072] In this embodiment, the electronic device 200 further includes a frame 202. The frame 202 is generally rectangular and includes a plurality of frame strips 2021 connected end to end. The inner sides of the frame strips 2021 are recessed to form a receiving groove 2022. The condensing section 112 of the sealed cavity 11 protrudes from the evaporating section 111 and is received in the receiving groove 2022. By protruding the condensing section 112 from the evaporating section 111, the volume of the condensing section 112 is increased, which helps to improve the heat dissipation rate of the heat transfer medium 12.

[0073] In this embodiment, the frame strips 2021 include two parallel, opposing first frame strips 2021a and two parallel, opposing second frame strips 2021b. The first frame strips 2021a and the second frame strips 2021b are alternately connected end to end. The inner side of the first frame strip 2021a is recessed to form a first receiving groove 2022a, and the inner side of the second frame strip 2021b is recessed inward to form a second receiving groove 2022b. The first condensation section 112a and the second condensation section 112b are respectively received in the first receiving groove 2022a and the second receiving groove 2022b. In other embodiments of the present invention, the frame 202 can be any shape other than a rectangle, such as a circle.

[0074] In this embodiment, a first thermal conductive adhesive layer 30 is provided between the rear camera 201a and the first connecting plate 20a, and another first thermal conductive adhesive layer 30 is provided between the front camera 201b and the second connecting plate 20b.

[0075] In this embodiment, a second thermally conductive adhesive layer 40 is provided between the first condensing section 112a and the peripheral wall of the first receiving groove 2022a, and another second thermally conductive adhesive layer 40 is provided between the second condensing section 112b and the peripheral wall of the second receiving groove 2022b.

[0076] In this embodiment, the first condensation section 112a of the first sealed cavity 11a protrudes from the first evaporation section 111a on one side, and the second condensation section 112b of the second sealed cavity 11b protrudes from the second evaporation section 111b on both sides, so that the rear camera 201a and the front camera 201b are assembled in appropriate positions.

[0077] The heat dissipation structure provided by the present invention is connected to the camera module, so that the heat generated by the camera module can be quickly taken away, avoiding the problem of image quality degradation caused by thermal deformation of the photosensitive chip or changes in internal air density.

[0078] In addition, those skilled in the art should recognize that the above embodiments are merely intended to illustrate the present invention and are not intended to limit the present invention. Any appropriate changes and modifications to the above embodiments are intended to be within the scope of the present invention as long as they fall within the spirit of the present invention.

Claims

1. An electronic device, characterized in that: The electronic device comprises: at least one first heating element; and a first heat dissipation structure connected to each of the first heating elements, the first heat dissipation structure comprising a first heat dissipation body, a first sealed cavity provided within the first heat dissipation body, and a heat transfer medium sealed within the first sealed cavity, the first sealed cavity comprising a first evaporation section and a first condensation section communicating with the first evaporation section, the first heat dissipation structure further comprising a first connecting plate connected to the evaporation section, the first heating element being fixed to the first connecting plate so that the first heating element transfers heat generated therefrom to the first connecting plate, the first connecting plate transferring the heat to the first evaporation section, the heat transfer medium absorbing the heat in the first evaporation section and vaporizing and entering the first condensation section, the vaporized heat transfer medium liquefying in the first condensation section and dissipating the heat outside the electronic device; The first heating element includes a camera module, which includes an optical lens, a lens holder, and a circuit board connected in sequence. The camera module also includes a photosensitive chip electrically connected to the circuit board. Specifically, the circuit board is provided with a hollow area at a position corresponding to the optical lens, and the photosensitive chip is accommodated in the hollow area. A steel plate is provided on the side of the photosensitive chip away from the optical lens, and the steel plate is connected to the connecting plate through a thermally conductive adhesive layer.

2. The electronic device according to claim 1, wherein The electronic device further comprises: at least one second heating element; and A second heat dissipation structure is connected to each second heating element, the second heat dissipation structure includes a second heat dissipation body, a second sealed cavity provided in the second heat dissipation body and the heat transfer medium sealed in the second sealed cavity, the second sealed cavity includes a second evaporation section and a second condensation section connected to the second evaporation section, the second heat dissipation structure also includes a second connecting plate connected to the evaporation section, the second heating element is fixed to the second connecting plate, so that the second heating element transfers the heat generated to the second connecting plate, the second connecting plate transfers the heat to the second evaporation section, the heat transfer medium absorbs the heat in the second evaporation section and vaporizes into the second condensation section, the vaporized heat transfer medium liquefies in the second condensation section and dissipates the heat outside the electronic device.

3. The electronic device according to claim 2, wherein: The electronic device further comprises a frame, which comprises a plurality of frame strips connected end to end. The inner side of the frame strips is recessed to form a receiving groove, and the first condensation section and the second condensation section are received in the receiving groove.

4. The electronic device according to claim 2, wherein: The first condensing section protrudes from the first evaporating section on one side, and the second condensing section protrudes from the second evaporating section on both sides.

5. The electronic device according to claim 2, wherein: A first thermal conductive adhesive layer is provided between the first heating element and the first connecting plate, and another first thermal conductive adhesive layer is provided between the second heating element and the second connecting plate.

6. The electronic device according to claim 3, wherein: A second thermally conductive adhesive layer is provided between the first condensation section and the peripheral wall of the receiving groove, and another second thermally conductive adhesive layer is provided between the second condensation section and the peripheral wall of the receiving groove.

7. The electronic device according to claim 1, wherein: A capillary structure is provided on the inner wall of the heat dissipation body.

8. The electronic device according to claim 1, wherein: The heat transfer medium is one of pure water, methanol and ethanol.

9. The electronic device according to claim 1, wherein: The heat dissipation structure is made of metal material.

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