Transfer device, transfer method and display device

Abstract

The embodiments of the present invention disclose a transfer device, a transfer method and a display device. The transfer device comprises: a transfer substrate, which is arranged opposite to a target substrate, and the surface of the transfer substrate close to the target substrate is used to place the components to be transferred, and the components to be transferred are arranged in an array; a drive array substrate, on which a drive execution unit is arranged, and the drive execution unit is used to drive the corresponding components to be transferred to separate from the transfer substrate and transfer to the target substrate. Compared with the prior art, the embodiments of the present invention improve the accuracy and yield of mass transfer.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a transfer device, a transfer method and a display apparatus. Background Art

[0002] With the continuous development of display technology, the display device has gradually been replaced by the liquid crystal (LCD) display method instead of the cathode ray tube (CRT) display method. In recent years, the organic light emitting diode (OLED) display method and the micro light emitting diode (MicroLED or MINI LED) display method have been rapidly developed as a new generation of display technology. Among them, Micro LED is called the future display technology due to its advantages such as high response speed, high color gamut, high brightness and long life. LCD can improve the contrast and color gamut with MINI LED backlight technology, quantum dot technology or high color rendering technology. This makes LCD reduce the disadvantages of contrast and color gamut while maintaining the advantages of life and brightness compared to OLED.

[0003] However, Micro LED and MINI LED require mass transfer technology in the production process. Currently, mass transfer technology uses mechanical punching, stamping, electrostatic or fluid assembly, etc. However, the existing transfer technology has problems of low precision and low yield, which makes it difficult to support the mass production and popularization of Micro LED and MINI LED technology. Therefore, transfer technology has become one of the bottlenecks of Micro LED and MINI LED technology. Summary of the invention

[0004] The embodiments of the present invention provide a transfer device, a transfer method and a display apparatus to improve the accuracy and yield of mass transfer.

[0005] In a first aspect, an embodiment of the present invention provides a transfer device, including:

[0006] A transfer substrate is arranged opposite to the target substrate, and the surface of the transfer substrate close to the target substrate is used to place the components to be transferred, and the components to be transferred are arranged in an array;

[0007] A driving array substrate is provided with driving execution parts, the driving array substrate is arranged in an array, and the driving execution parts are used to drive the corresponding components to be transferred to separate from the transfer substrate and transfer to the target substrate.

[0008] Optionally, the drive execution unit includes a drive circuit and an energy trigger component; the drive circuit includes a switching device, which is used to be turned on in response to a control signal and transmit the drive signal to the energy trigger component; the energy trigger component responds to the drive signal and generates an energy trigger to drive the corresponding component to be transferred to separate from the transfer substrate.

[0009] Optionally, the switching device includes a triode or a field effect transistor;

[0010] Alternatively, the energy triggering component includes at least one of an electromagnetic device, a heat source device, an optical device, a mechanical device, a chemical device and an electrostatic device.

[0011] Optionally, the transfer device further comprises:

[0012] An auxiliary part is arranged on the surface of the transfer substrate close to the target substrate; the auxiliary part corresponds to the component to be transferred one by one, and is used to clamp the component to be transferred or is arranged between the component to be transferred and the transfer substrate; the auxiliary part is used to release the component to be transferred under the action of the energy triggering component; or, it is used to assist the component to be transferred to be aligned with the target substrate.

[0013] Optionally, the driving array substrate further includes:

[0014] A gate gating module connected to the switch devices on the drive array substrate; the gate gating module is used to turn on the switch devices row by row, or to turn on the switch devices of at least some rows at the same time;

[0015] A source gating module connected to the switch device on the drive array substrate; the source gating module is used to simultaneously send the drive signal to the energy triggering components of at least part of the columns through the switch device;

[0016] The rows extend along a first direction, and the columns extend along a second direction; or the rows extend along the second direction, and the columns extend along the first direction; and the first direction and the second direction intersect.

[0017] Optionally, the transfer device further comprises:

[0018] An optical measuring device, used to measure position information contained in the transfer substrate or the target substrate;

[0019] A data processing device connected to the optical measuring device; the data processing device is used to determine the number and position of the components to be transferred on the transfer substrate according to the position information;

[0020] An array driving device is connected to the data processing device; the array driving device is used to drive the corresponding driving execution part on the driving array substrate to work according to the number and position of the components to be transferred.

[0021] Optionally, the transfer device further comprises:

[0022] A motion device, used for controlling the displacement of the driving array substrate, the transfer substrate and the target substrate; wherein the driving array substrate and the target substrate remain relatively still, and the transfer substrate and the target substrate are aligned during the displacement process;

[0023] Alternatively, the transfer device comprises:

[0024] The moving device is used to drive the transfer substrate to move so that the transfer substrate and the target substrate are aligned.

[0025] Optionally, the target substrate is another transfer substrate, a backlight driving backplane or a display driving backplane.

[0026] Optionally, the arrangement density of the driving execution parts of the driving array substrate is the same as the arrangement density of the components to be transferred of the target substrate;

[0027] Alternatively, the arrangement density of the driving execution parts of the driving array substrate is 1 / n of the arrangement density of the components to be transferred of the target substrate, where n is a positive integer.

[0028] In a second aspect, an embodiment of the present invention further provides a transfer method, which can use the transfer device provided by any embodiment of the present invention, and the transfer method includes:

[0029] providing a target substrate;

[0030] Providing a transfer substrate, and aligning the transfer substrate with the target substrate; components to be transferred are disposed on one side of the transfer substrate, and the components to be transferred are arranged in an array;

[0031] Providing a driving array substrate, placing the driving array substrate on a side of the transfer substrate away from the target substrate, aligning with the target substrate and keeping it relatively still; wherein the driving array substrate is provided with driving execution parts, and the driving execution parts are arranged in an array;

[0032] At least part of the driving execution unit is driven to separate the corresponding component to be transferred from the transfer substrate and transfer it to the target substrate; wherein the transferred component meets the transfer accuracy.

[0033] Optionally, the driving at least part of the driving execution unit to separate the corresponding component to be transferred from the transfer substrate and transfer it to the target substrate includes:

[0034] Using an optical measuring device to measure the positions of the transfer substrate and the target substrate to obtain transfer information;

[0035] The data processing device processes the transfer information to determine whether the position of the component to be transferred on the transfer substrate meets the transfer accuracy, and obtains quantity information and position information;

[0036] The array driving device drives the corresponding driving execution part on the driving array substrate to work according to the quantity information and the position information;

[0037] Alternatively, the driving at least part of the driving execution unit to separate the corresponding component to be transferred from the transfer substrate and transfer it to the target substrate includes:

[0038] Acquire the pre-stored quantity information and location information of the components to be transferred;

[0039] The array driving device drives the corresponding driving execution part on the driving array substrate to work according to the quantity information and the position information.

[0040] Optionally, the transfer information includes at least one of the following:

[0041] The position of the component to be transferred on the transfer substrate, the shape of the component to be transferred on the transfer substrate, the crack of the component to be transferred on the transfer substrate, the direction of the component to be transferred on the transfer substrate, the position of the alignment mark on the transfer substrate, the shape of the alignment mark on the transfer substrate, and the direction of the alignment mark on the transfer substrate; the position of the alignment mark on the target substrate, the shape of the alignment mark on the target substrate, the direction of the alignment mark on the target substrate, the position of the pad on the target substrate, the shape of the pad on the target substrate, and the direction of the pad on the target substrate.

[0042] Optionally, the step of transferring the component to be transferred is performed once, and the target substrate is a driving backplane;

[0043] Alternatively, the step of transferring the component to be transferred is repeated at least twice, and the transfer accuracy in the later step is higher than the transfer accuracy in the earlier step; wherein, before being transferred to the driving backplane, the target substrate is another transfer substrate.

[0044] Optionally, the arrangement density of the driving execution parts of the driving array substrate is the same as the arrangement density of the components to be transferred of the target substrate; if part of the components to be transferred are transferred in the step of transferring the components to be transferred for the first time, after part of the components to be transferred are transferred, the method further includes:

[0045] Realigning the transfer substrate with the target substrate, and performing the step of transferring the components to be transferred until all the remaining components to be transferred are transferred to the target substrate;

[0046] Alternatively, the arrangement density of the driving execution parts of the driving array substrate is 1 / n of the arrangement density of the components to be transferred on the target substrate, where n is a positive integer; after part of the components to be transferred are transferred, it also includes: performing at least n-1 steps of realigning the transfer substrate with the target substrate and transferring the components to be transferred.

[0047] In a third aspect, an embodiment of the present invention further provides a display device, comprising: a driving backplane and a display chip disposed on the driving backplane, wherein the display chip is transferred to the driving backplane using a transfer method as described in any embodiment of the present invention.

[0048] The embodiment of the present invention sets a drive array substrate in the transfer device, and sets a drive execution unit on the drive array substrate to drive the corresponding components to be transferred to separate from the transfer substrate. In this way, only the components to be transferred that meet the transfer accuracy can be transferred during one transfer process, and other components to be transferred that do not meet the transfer accuracy can be transferred after re-alignment. Compared with the existing mass transfer technology, the embodiment of the present invention realizes accurate control and transfer of the components to be transferred, thereby improving the transfer accuracy and transfer yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 A schematic diagram of the three-dimensional structure of a transfer device provided by an embodiment of the present invention;

[0050] Figure 2 For along Figure 1 Schematic diagram of the cross-sectional structure of AA;

[0051] Figure 3 A schematic diagram of the structure of a field effect transistor provided by an embodiment of the present invention;

[0052] Figure 4 A schematic diagram of a structure of a transfer substrate and an auxiliary part connected to each other provided by an embodiment of the present invention;

[0053] Figure 5 A schematic diagram of the structure of another transfer substrate and an auxiliary part connected to each other provided by an embodiment of the present invention;

[0054] Figure 6 A schematic diagram of the structure of a driving array substrate provided by an embodiment of the present invention;

[0055] Figure 7 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention;

[0056] Figure 8 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention;

[0057] Fig. 9 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention;

[0058] Fig.10 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention;

[0059] Fig.11 A schematic diagram of a transfer method provided by an embodiment of the present invention;

[0060] Fig.12 A schematic diagram of each step of a transfer method provided by an embodiment of the present invention;

[0061] Fig.13 A schematic diagram of another transfer method in each step provided by an embodiment of the present invention;

[0062] Fig.14 A schematic diagram of each step of another transfer method provided by an embodiment of the present invention;

[0063] Fig.15 A schematic diagram of each step of another transfer method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0064] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0065] An embodiment of the present invention provides a transfer device. Figure 1 A schematic diagram of a three-dimensional structure of a transfer device provided by an embodiment of the present invention, Figure 2 For along Figure 1 Schematic diagram of the cross-sectional structure of AA. Figure 1 and Figure 2The transfer device includes: a transfer substrate 100 and a drive array substrate 200. The transfer substrate 100 is arranged opposite to the target substrate 300. The surface 101 of the transfer substrate 100 close to the target substrate 300 is used to place the components to be transferred (for example, chips 110), and the components to be transferred are arranged in an array. That is, in the transfer process of the components to be transferred, the components to be transferred arranged in an array need to be placed on the surface 101 of the transfer substrate 100 close to the target substrate 300. The drive array substrate 200 is provided with a drive execution unit 210, which is arranged in an array, and the drive execution unit 210 is used to drive the corresponding components to be transferred to separate from the transfer substrate 100 and transfer to the target substrate 300.

[0066] Among them, the components to be transferred refer to components that need to be transferred in large quantities, such as components with a size in the range of 1um-5mm. Exemplarily, the components to be transferred include chips, other circuits or semiconductor devices, auxiliary components for transfer, etc. The following is an example of the component to be transferred being a chip, but it is not intended to limit the present invention. The chip 110 can be, for example, a light-emitting device chip. Specifically, the chip 110 can be a Micro LED chip or a MINI LED chip. A large number of light-emitting device chips 110 are transferred to eventually form a display device. The transfer substrate 100 can also be referred to as a transition carrier plate or a temporary carrier plate, which is used to pre-arrange the chip 110 according to the size of the chip to be transferred. Generally speaking, the position and direction of the chip 110 placed on the transfer substrate 100 can be imprecise or even chaotic. The target substrate 300 can also be referred to as a target carrier plate, that is, the transfer target position of the chip 110 is the position on the target carrier plate. The drive array substrate 200 refers to a substrate provided with a drive execution unit 210 (i.e., a drive array) arranged in an array. The driving array substrate 200 may be located on a side of the transfer substrate 100 away from the target substrate 300 (eg, Figure 1 and Figure 2 As shown); it may also be located on the other side of the transfer substrate 100, and can be set as needed in practical applications. The transfer device provided by the embodiment of the present invention can make the position accuracy of the chip 110 transferred to the target carrier plate higher than the chip position accuracy on the transfer substrate 100. Optionally, high-precision alignment marks (Mark) are provided on the transfer substrate 100, the target substrate 300 and the drive array substrate 200 to achieve accurate alignment of each substrate, which is beneficial to improve the transfer accuracy of the chip 110. For example, the accuracy range of the alignment mark can be 1μm to 5mm.

[0067] Exemplarily, the method of using the transfer device to transfer chips is as follows: providing a target substrate 300; providing a transfer substrate 100, disposing chips 110 to be transferred arranged in an array on one side 101 of the transfer substrate 100, and aligning the transfer substrate 100 with the target substrate 300; providing a drive array substrate 200, placing the drive array substrate 200 on a side of the transfer substrate 100 away from the target substrate 300, aligning with the target substrate 300 and keeping it relatively still; driving at least part of the drive execution unit 210 to separate the corresponding chip 110 from the transfer substrate 100 and transfer it to the target substrate 300 (punching). Among them, the transferred chip 110 meets the transfer accuracy. The chip 110 corresponding to the drive execution unit 210 refers to the chip 110 that is directly opposite to the drive execution unit 210 after the transfer substrate 100 is aligned. For example, Figure 1 The first driving execution unit 210 from the left corresponds to the first chip 110 from the left; if the first chip 110 from the left meets the transfer accuracy at this time, the driving execution unit 210 can drive the chip 110 to separate from the transfer substrate 100 and transfer it to the target substrate 300.

[0068] It can be seen that the embodiment of the present invention sets a drive array substrate 200 in the transfer device, and sets a drive execution unit 210 on the drive array substrate 200 to drive the corresponding chip 110 to separate from the transfer substrate 100. In this way, only the chips 110 that meet the transfer accuracy can be transferred during one transfer process, and other chips 110 that do not meet the transfer accuracy can be transferred again after re-alignment. Compared with the existing mass transfer technology, the embodiment of the present invention realizes accurate control and transfer of the chips 110 to be transferred, thereby improving the transfer accuracy and transfer yield.

[0069] In the embodiment of the present invention, there are many ways to set the drive execution unit 210, and any implementation that can drive the chip 110 to separate from the transfer substrate 100 is within the protection scope of the present invention. Several of them are described below, but they are not intended to limit the present invention.

[0070] Continue to see Figure 1 and Figure 2 In one embodiment of the present invention, optionally, the driving execution unit 210 includes a driving circuit 211 and an energy triggering component 212; the driving circuit 211 includes a switching device, which is used to respond to a control signal and turn on to transmit the driving signal to the energy triggering component 212; the energy triggering component 212 responds to the driving signal and generates an energy trigger to drive the corresponding chip 110 to separate from the transfer substrate 100.

[0071] Among them, the switching devices include semiconductor devices such as triodes or field effect transistors. Figure 3A schematic diagram of the structure of a field effect transistor provided by an embodiment of the present invention. Figure 3 In one embodiment of the present invention, optionally, the field effect transistor includes a gate, a source, and a drain. For example, the gate is connected to the control signal, the source is connected to the drive signal, and the drain is connected to the energy trigger component 212. When the gate of the field effect transistor receives the control signal, the source and the drain are turned on to transmit the drive signal to the energy trigger component 212. The switching device can be a triode or field effect transistor that is set separately, or a combination of semiconductor devices, such as a complementary metal oxide semiconductor (CMOS), etc., which can be set as needed in actual needs. The manufacturing form of the switching device can be a thin film transistor (TFT) to reduce the thickness of the drive array substrate 200 and reduce the size of the transfer device. For example, the thin film transistor or field effect tube array can be directly manufactured on the substrate of the drive array substrate 200 using a semiconductor process.

[0072] The energy triggering component 212 includes at least one of an electromagnetic device, a heat source device, an optical device, a mechanical device, a chemical device, and an electrostatic device. Among them, the electromagnetic device can be, for example, an electromagnetic coil, which can generate electromagnetic changes under the drive of a driving signal; accordingly, the chip 110 itself can be set to have magnetic force, and can be separated from the transfer substrate 100 when the electromagnetic changes. The heat source device can be, for example, a resistor wire, which can generate thermal energy changes under the drive of a driving signal; accordingly, the chip 110 and the transfer substrate 100 can be bonded together by a bonding glue with a low melting point, and after the temperature rises, the bonding glue melts, and the chip 110 can be separated from the transfer substrate 100. The optical device can be, for example, a laser source, which can generate laser under the drive of a driving signal; accordingly, the chip 110 and the transfer substrate 100 can be fixed to the transfer substrate 100 through a light-exciting substance, and after being irradiated by the laser, the light-exciting substance changes its material state and releases the chip 110. The mechanical device may be, for example, an ultrasonic generator, memory metal or piezoelectric ceramic, etc., which may be deformed under the drive of a driving signal; accordingly, the chip 110 is separated from the transfer substrate 100 under the action of an external force. The chemical device may be, for example, an electrochemical device, which undergoes a chemical change under the drive of a driving signal, thereby generating a change in thermal energy or a change in the state of a substance. The energy trigger component 212 may include one, two or more of the above-mentioned devices. Those skilled in the art may understand that if the energy trigger component 212 includes two or more of the above-mentioned devices, two or more driving circuits need to be provided accordingly.

[0073] It can be seen that the embodiment of the present invention sets the driving execution unit 210 to include a driving circuit 211 and an energy triggering component 212 corresponding to the driving circuit 211. The driving circuit 211 drives the corresponding energy triggering component 212 to work, thereby driving the corresponding chip 110 to separate from the transfer substrate 100, thereby further improving the positioning accuracy and transfer accuracy of the chip 110.

[0074] Exemplarily, the energy trigger component 212 can be directly manufactured on the driving array substrate 200 by using a semiconductor process; or the energy trigger component 212 can be manufactured separately and then connected to the driving array substrate 200 by bonding or conductive medium.

[0075] In the above embodiments, the chip 110 itself can be set to be separated from the transfer substrate 100 under the action of the energy triggering component 212, and the auxiliary part can also be set to undergo energy change under the action of the energy triggering component 212, which is described in detail below.

[0076] Figure 4 A schematic diagram of the structure of the connection between a transfer substrate and an auxiliary part provided by an embodiment of the present invention. Figure 4In one embodiment of the present invention, optionally, the auxiliary part 120 is disposed on the surface 101 of the transfer substrate 100 close to the target substrate 300; the auxiliary part 120 corresponds to the chip 110 one by one, and is used to clamp the chip 110, and the auxiliary part 120 releases the chip 110 under the action of the energy triggering component 212. Exemplarily, if the energy triggering component 212 is an electromagnetic device, it can generate electromagnetic changes under the drive of the driving signal; accordingly, the auxiliary part 120 has magnetic force, fits with the transfer substrate 100, and can clamp the chip 110 so that the chip 110 fits with the transfer substrate 100; when the electromagnetic changes, the auxiliary part 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the substrate. If the energy trigger component 212 is a heat source device, it can generate heat energy changes when driven by the driving signal; accordingly, the auxiliary part 120 is bonded to the transfer substrate 100 through an adhesive with a lower melting point, and can clamp the chip 110 so that the chip 110 is attached to the transfer substrate 100; after the temperature rises, the adhesive melts, and the auxiliary part 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the transfer substrate 100. Alternatively, the energy trigger component 212 is a heat source device, and it can generate heat energy changes when driven by the driving signal; accordingly, the auxiliary part 120 is a hot-melt material, and is fixed to the transfer substrate 100, and can clamp the chip 110 so that the chip 110 is attached to the transfer substrate 100; after the temperature rises, the auxiliary part 120 melts, thereby releasing the chip 110 so that the chip 110 is separated from the transfer substrate 100. If the energy triggering component 212 is an optical device, it can generate laser under the drive of the driving signal; accordingly, the auxiliary part 120 and the transfer substrate 100 are fixed to the transfer substrate 100 through the light-exciting substance, and can clamp the chip 110 so that the chip 110 and the transfer substrate 100 are attached; after being irradiated with the laser, the light-exciting substance undergoes a material state change, and the auxiliary part 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the transfer substrate 100. Alternatively, the energy triggering component 212 is a light-emitting device, which can generate laser under the drive of the driving signal; accordingly, the auxiliary part 120 is a light-exciting substance, and is fixed to the transfer substrate 100, and can clamp the chip 110 so that the chip 110 and the transfer substrate 100 are attached; after being irradiated with the laser, the auxiliary part 120 undergoes a material state change, thereby releasing the chip 110 so that the chip 110 is separated from the transfer substrate 100.

[0077] On the basis of the above embodiments, optionally, the auxiliary portion 120 may also be used as an alignment mark to assist in completing the alignment of the chip 110 and the target substrate 300 to improve the alignment accuracy of the chip 110 .

[0078] It should be noted that the auxiliary portion 120 for clamping the chip 110 may be retained or removed on the final product, and may be set as required in actual applications.

[0079] Figure 5 A schematic diagram of another structure of the transfer substrate and the auxiliary part provided by an embodiment of the present invention. Figure 5 In one embodiment of the present invention, optionally, the auxiliary part 120 is disposed on the surface 101 of the transfer substrate 100 close to the target substrate 300; the auxiliary part 120 corresponds to the chip 110 one by one and is disposed between the chip 110 and the transfer substrate 100; the auxiliary part 120 is used to separate from the transfer substrate 100 under the action of the energy triggering component 212 to release the chip 110. Exemplarily, the chip 110 and the auxiliary part 120 are bonded together by solder paste or a conductive adhesive.

[0080] Exemplarily, if the energy triggering component 212 is an electromagnetic device, it can generate electromagnetic changes under the drive of the driving signal; accordingly, the auxiliary part 120 has magnetic force and fits with the transfer substrate 100; when the electromagnetic changes, the auxiliary part 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the substrate. If the energy triggering component 212 is a heat source device, it can generate thermal energy changes under the drive of the driving signal; accordingly, the auxiliary part 120 and the transfer substrate 100 are bonded together by an adhesive with a low melting point; after the temperature rises, the adhesive melts, and the auxiliary part 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the transfer substrate 100. If the energy triggering component 212 is an optical device, it can generate laser under the drive of a driving signal; accordingly, the auxiliary part 120 and the transfer substrate 100 are fixed to the transfer substrate 100 through the light-exciting substance; after being irradiated with laser, the light-exciting substance undergoes a material state change, and the auxiliary part 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the transfer substrate 100.

[0081] Figure 6 A schematic diagram of the structure of a driving array substrate provided by an embodiment of the present invention. Figure 6 In one embodiment of the present invention, optionally, the drive array substrate 200 is an active drive array, and the drive array substrate 200 further includes a gate gating module 220 and a source gating module 230. The gate gating module 220 is connected to the switch device (drive circuit 211) on the drive array substrate 200; the gate gating module 220 is used to turn on the switch device row by row, or to turn on the switch devices of at least some rows at the same time. The source gating module 230 is connected to the switch device on the drive array substrate 200; the source gating module 230 is used to send a drive signal to the energy trigger component 212 of at least some columns through the switch device at the same time.

[0082] The driving mode of the gate gating module 220 is to turn on the switch devices row by row or to turn on the switch devices of at least some rows at the same time, which can be selected according to actual needs. The driving mode of the source gating module 230 is to send a driving signal to the energy trigger components 212 of some columns through the switch devices at the same time or to send a driving signal to the energy trigger components 212 of all columns, which can be selected according to actual needs.

[0083] Exemplarily, the drive execution unit 210 on the drive array substrate 200 can be scanned by row / column scanning. At this time, the gate selection module 220 controls the conduction and disconnection of the switching device row by row. At the same time, under this timing, the drive signal of the corresponding column is output by the source selection module 230, connected to the source of the corresponding switching device for writing, thereby driving the energy trigger component 212 to perform the punching action, so that the corresponding chip 110 performs the transfer action. For example, the chips 110 located in the first row and first column, the second row and second column, the third row and third column, the fourth row and fourth column, the fifth row and fifth column, and the sixth row and sixth column meet the transfer accuracy. When the gate selection module 220 scans the switching devices in the first row, the source selection module 230 writes a driving signal to the switching devices in the first column; when the gate selection module 220 scans the switching devices in the second row, the source selection module 230 writes a driving signal to the switching devices in the second column; and so on, until the gate selection module 220 scans the switching devices in the sixth row, and the source selection module 230 writes a driving signal to the switching devices in the sixth column.

[0084] Exemplarily, the driving execution unit 210 on the driving array substrate 200 can also be scanned in a surface scanning manner. At this time, the gate selection module 220 controls the conduction and disconnection of multiple rows of switch devices at the same time. At the same time, under this timing, the driving signal of the corresponding column is output by the source selection module 230, connected to the source of the corresponding switch device for writing, thereby driving the energy trigger component 212 to perform the punching action, so that the corresponding chip 110 performs the transfer action. For example, the chips 110 located in the first three columns of the first row, the first three columns of the second row, the first three columns of the third row, and the first three columns of the fourth row meet the transfer accuracy, the gate selection module 220 scans the switch devices of the first four rows at the same time, and the source selection module 230 writes the driving signal to the switch devices of the first three columns at the same time.

[0085] The embodiment of the present invention adopts an active drive array, which can realize row / column scanning or surface scanning, so that scanning and printing can be performed quickly, the transfer efficiency and stability are improved, and the operation difficulty is simplified.

[0086] It should be noted that Figure 6exemplarily shows that the rows extend along the first direction X, the columns extend along the second direction Y, and the first direction X intersects the second direction Y. This is not a limitation of the present invention, and in other embodiments, the directions of the rows and columns may be reversed, for example, the rows extend along the second direction Y, and the columns extend along the first direction X.

[0087] Figure 7 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention. Figure 7 In one embodiment of the present invention, the transfer device may further include an optical measuring device 400, a data processing device 500 and an array driving device 600. The optical measuring device 400 is used to measure the information contained in the transfer substrate 100 or the target substrate 300; the data processing device 500 is connected to the optical measuring device 400; the data processing device 500 is used to determine the number and position of the chips 110 to be transferred on the transfer substrate 100 according to the information measured by the optical measuring device 400; the array driving device 600 is connected to the data processing device 500; the array driving device 600 is used to drive the corresponding driving execution unit 210 to work according to the number and position of the chips 110 to be transferred.

[0088] The optical measuring device 400 may be, for example, an automatic optical inspection device (AOI) or an X-ray (XRay) measuring device. The information of the transfer substrate 100 measured may be, for example, the position of the chip 110 on the transfer substrate 100, the shape of the chip 110 on the transfer substrate 100, the crack of the chip 110 on the transfer substrate 100, the direction of the chip 110 on the transfer substrate 100, the position of the alignment mark on the transfer substrate 100, the shape of the alignment mark on the transfer substrate 100, the direction of the alignment mark on the transfer substrate 100, the position of the chip 110 on the transfer substrate 100, the shape of the chip on the transfer substrate 100, the crack of the chip on the transfer substrate 100, or the direction of the chip 110 on the transfer substrate 100. The position information of the target substrate 300 measured may be, for example, the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, the shape of the pad on the target substrate 300, or the direction of the pad on the target substrate 300. Therefore, the alignment mark detected by the optical measuring device 400 may be an alignment point or an alignment point array. The information detected by the optical measuring device 400 may be used for alignment or to determine whether the chip 110 meets the alignment requirements.

[0089] The data processing device 500 can be, for example, a chip 110 with data processing functions, such as a microprocessor, a single-chip microcomputer or a digital signal processor (DSP). Specifically, the data processing device 500 can process and calculate the position information such as the position of the chip 110 on the transfer substrate 100, the position of the alignment mark on the transfer substrate 100, the shape of the alignment mark on the transfer substrate 100 or the direction of the alignment mark on the transfer substrate 100, and can obtain the position of the transfer substrate 100 and the position of each chip 110 on the transfer substrate 100. In addition, the data processing device 500 can process and calculate the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, the shape of the pad on the target substrate 300 or the direction of the pad on the target substrate 300, and can obtain the position of the target substrate 300 and the position where each chip 110 on the target substrate 300 needs to be accurately placed. The data processing device 500 can process and calculate the chip shape on the transfer substrate 100 or the chip cracks on the transfer substrate 100, so as to obtain the number and position of the defective chips 110. The data processing device 500 combines the above information to determine whether the transfer substrate 100 and the target substrate 300 are aligned, and whether each chip 110 meets the transfer accuracy, so as to determine the number and position of the chips 110 that need to be transferred on the transfer substrate 100.

[0090] The array driving device 600 can be, for example, a chip such as a timing controller. The array driving device 600 generates a timing control signal and other signals according to the number and position of the chips 110 to be transferred, so as to determine the driving mode of the gate gating module 220 and the source gating module 230, thereby driving the corresponding driving execution unit 210 to work and perform chip punching. In other embodiments, the array driving device 600 can also be configured to control the size of the driving signal generated by the source gating module 230 according to the size of the chip 110 to be transferred, so as to improve the stability and reliability of the chip 110 transfer. Among them, the array driving device 600 can be arranged on the driving array substrate 200, or it can be independently arranged outside the driving array substrate 200, and it can be set as needed in actual applications.

[0091] It should be noted that in the above embodiments, the data processing device 500 and the array driving device 600 may be separately provided chips 110 or may be integrated in the same chip 110, and may be set as required in actual applications.

[0092] It should also be noted that in the above embodiments, the optical detection device is used to detect the position of the target substrate 300 and the transfer substrate 100, which is not a limitation of the present invention. In other embodiments, the optical detection device may not be provided, and the number and position of the chips 110 to be transferred may be pre-stored and may be set as needed in actual applications.

[0093] Figure 8 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention. Figure 8 In one embodiment of the present invention, the transfer device further comprises a motion device 700, which is used to drive the transfer substrate 100 to move so that the transfer substrate 100 is aligned with the target substrate 300. Exemplarily, the array substrate 200 and the target substrate 300 are driven to remain stationary and accurately aligned, and the position of the transfer substrate 100 only needs to be adjusted by the motion device 700. In the embodiment of the present invention, only the transfer substrate 100 is arranged to perform displacement alignment, which is conducive to reducing the manufacturing cost of the transfer device.

[0094] Fig. 9 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention. Fig. 9 The transfer device includes a motion device 700, which is used to control the displacement of the array substrate 200, the transfer substrate 100 and the target substrate 300. The motion device 700 can be, for example, a device such as a robotic arm that can control the displacement of the substrate. Exemplarily, the motion device 700 can drive the array substrate 200 and the target substrate 300 to remain relatively still, and the transfer substrate 100 and the target substrate 300 are aligned during the displacement process. For example, dynamic punching is performed by calculating the motion advance amount, which is conducive to further improving the transfer accuracy.

[0095] Continue to see Fig. 9 In the above embodiments, optionally, the target substrate 300 is another transfer substrate 100, a backlight drive backplane or a display drive backplane. If the target substrate 300 is another transfer substrate 100, the chip 110 transfer action can be repeated multiple times, and each time the transfer is performed, the chip 110 has a higher precision. In this way, each transfer action can have a larger number of chips 110 that meet the transfer precision, which is beneficial to improving the transfer efficiency. The target substrate 300 can be, for example, a glass substrate or a quartz substrate, which is beneficial to improving the dimensional stability, thermal stability and chemical stability of the target substrate 300, thereby improving the transfer precision.

[0096] If the target substrate 300 is a backlight driver backplane, at this time, the chip 110 is a backlight chip. After the chip 110 is completely transferred to the backlight driver backplane, it is also necessary to use hot pressing, UV curing and reflow soldering to weld the chip 110 to the pads on the backlight driver backplane to form a backlight source in the display device. If the target substrate 300 is a display driver backplane, at this time, the chip 110 is a display chip. After the chip 110 is completely transferred to the display driver backplane, it is also necessary to use hot pressing, UV curing and reflow soldering to weld the chip 110 to the pads on the display driver backplane to form pixels in the display device. Among them, a drive backplane such as a backlight driver backplane or a display driver backplane is provided with a drive circuit. When the transfer substrate 100 and the drive backplane are aligned and transferred, the transfer substrate 100 and the drive backplane can also play a role in supporting and protecting the chip 110 and protecting the circuits on the drive backplane. The driving backplane can be made of flexible materials such as polyimide (PI), polycarbonate (PC) or polyethylene terephthalate (PET) as a substrate to achieve flexible display. The circuit film layer in the driving backplane can be an organic thin film transistor (OTFT) or an organic field effect transistor (OMOS). The driving backplane can be a glass substrate or a quartz substrate with a driving circuit engraved on it, or a flexible printed circuit board (FPC), a printed circuit board (PCB), etc.

[0097] It should be noted that, in the above-mentioned embodiments, it is exemplarily shown that the arrangement density of the driving execution unit 210 of the driving array substrate 200 is the same as the arrangement density of the chip 110 of the target substrate 300, that is, the driving execution unit 210 corresponds to the chip 110 one by one, which is not a limitation of the present invention. In other embodiments, the arrangement density of the driving execution unit 210 of the driving array substrate 200 may be different from the arrangement density of the chip 110 of the target substrate 300. Fig.10 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention. Fig.10 Optionally, the arrangement density of the driving execution unit 210 of the driving array substrate 200 is 1 / n of the arrangement density of the chips 110 of the target substrate 300, where n is a positive integer. This arrangement reduces the number of settings of the driving execution unit 210, thereby helping to reduce manufacturing costs. Fig.10 The case where n=2 is exemplarily shown in FIG. 1 , so that 1 / 2 of the chips 110 can be transferred during one transfer process, and the remaining 1 / 2 of the chips 110 can be transferred during the next transfer process.

[0098] In summary, the embodiment of the present invention sets a drive array substrate 200 in the transfer device, and sets a drive execution unit 210 on the drive array substrate 200 to drive the corresponding chip 110 to separate from the transfer substrate 100. In this way, during one transfer process, only the chips 110 that meet the transfer accuracy can be transferred, and other chips 110 that do not meet the transfer accuracy can be transferred again after re-alignment. Compared with the existing mass transfer technology, the embodiment of the present invention realizes accurate control and transfer of the chips 110 to be transferred, thereby improving the transfer accuracy and transfer yield. Furthermore, by adopting an active drive array, row / column scanning or surface scanning can be realized, thereby improving the efficiency of mass transfer. Furthermore, by setting an optical measurement device 400, the alignment accuracy can be improved, thereby further improving the transfer accuracy. Furthermore, by setting the motion device 700, the drive array substrate 200 and the target substrate 300 can remain relatively still, and the transfer substrate 100 and the target substrate 300 can be aligned, so that the transfer substrate 100 and the target substrate 300 can be aligned during the displacement process, further improving the transfer accuracy.

[0099] An embodiment of the present invention provides a transfer method, and a transfer device provided by any embodiment of the present invention can be used to transfer chips in batches. Fig.11 A schematic diagram of a transfer method provided by an embodiment of the present invention, Fig.12 A schematic diagram of each step of a transfer method provided by an embodiment of the present invention. Fig.11 and Fig.12 , the transfer method comprises the following steps:

[0100] S110 , providing a target substrate 300 .

[0101] The target substrate 300 may also be referred to as a target carrier plate, that is, the transfer target position of the chip 110 is a position on the target substrate 300 .

[0102] S120, providing a transfer substrate 100, and aligning the transfer substrate 100 with the target substrate 300; the chips 110 to be transferred are disposed on one side 101 of the transfer substrate 100, and the chips 110 are arranged in an array.

[0103] The transfer substrate 100 may also be referred to as a transition carrier or a temporary carrier, and is used to pre-arrange the chips 110 according to the size of the chips 110 to be transferred. Generally speaking, the position and direction of the chips 110 placed on the transfer substrate 100 may be imprecise or even chaotic.

[0104] S130 , providing a driving array substrate 200 , placing the driving array substrate 200 on a side of the transfer substrate 100 away from the target substrate 300 , aligning with the target substrate 300 and keeping the driving array substrate 200 relatively still.

[0105] Among them, a driving execution unit 210 is provided on the driving array substrate 200, and the driving execution unit 210 is arranged in an array, for example, the driving execution unit 210 corresponds to the chip 110 one by one. Optionally, the driving execution unit 210 includes a driving circuit 211 and an energy trigger component 212; the driving circuit 211 includes a switch device, the switch device is used to respond to the control signal and turn on, and transmit the driving signal to the energy trigger component 212; the energy trigger component 212 responds to the driving signal and generates energy triggering to drive the corresponding chip 110 to separate from the transfer substrate 100. The switch device includes a semiconductor device such as a triode or a field effect transistor, and the energy trigger component 212 includes at least one of an electromagnetic device, a heat source device, an optical device, a mechanical device, a chemical device, and an electrostatic device.

[0106] Optionally, the array substrate 200 and the target substrate 300 are driven to move synchronously and remain relatively still, so that the transfer substrate 100 and the target substrate 300 are aligned during the displacement process. For example, dynamic punching is performed by calculating the motion advance amount, which is conducive to further improving the transfer accuracy. Alternatively, the array substrate 200 and the target substrate 300 are driven to be still, and both remain absolutely still.

[0107] S140 , driving all the driving execution units 210 to separate the corresponding chips 110 from the transfer substrate 100 and transfer them to the target substrate 300 .

[0108] Since all the chips 110 meet the transfer accuracy, all the chips 110 are transferred to the target substrate 300. Optionally, the method for determining whether the chip position on the transfer substrate 100 meets the transfer requirement is: compare the chip position on the transfer substrate 100 with the preset position or the position of the chip solder pin on the target substrate 300 (for example, make a difference), and determine whether the two positions are completely overlapped or partially overlapped. If they are completely overlapped, the transfer requirement is met; if they are partially overlapped, the minimum overlapping area is compared with a set threshold to determine whether the threshold requirement is met.

[0109] It should be noted that, in the above embodiment, the execution order of S120 and S130 can be interchanged.

[0110] In S110-S140, by driving all the driving execution units 210, all the chips 110 on the transfer substrate 100 are transferred at one time, which is not a limitation of the present invention. In other embodiments, it is also possible to drive part of the driving execution unit 210 to realize the transfer of all the chips 110 on the transfer substrate 100 in at least two chip 110 transfer (chipping) steps. Fig.13 A schematic diagram of another transfer method provided by an embodiment of the present invention in each step. Fig.13 , the transfer method comprises the following steps:

[0111] S210 , providing a target substrate 300 .

[0112] S220, providing a transfer substrate 100, and aligning the transfer substrate 100 with the target substrate 300; chips 110 to be transferred are disposed on one side of the transfer substrate 100, and the chips 110 are arranged in an array.

[0113] Exemplarily, the transfer substrate 100 and the target substrate 300 are arranged in parallel after being aligned. In order to clearly indicate the number of chips 110 to be transferred, Fig.13 , it is shown that the viewing angles of the transfer substrate 100 and the target substrate 300 are different.

[0114] S230 , providing a driving array substrate 200 , and placing the driving array substrate 200 on a side of the transfer substrate 100 away from the target substrate 300 .

[0115] S240 , the driving part drives the execution part 210 to separate the corresponding chip 110 from the transfer substrate 100 and transfer it to the target substrate 300 .

[0116] Among them, only some chips 110 on the transfer substrate 100 meet the transfer accuracy. Through the corresponding driving execution unit 210, these chips 110 that meet the transfer accuracy are transferred to complete the first chip bonding action.

[0117] S250 , aligning the transfer substrate 100 and the target substrate 300 again, and driving the remaining drive execution units 210 to separate the corresponding chips 110 from the transfer substrate 100 and transfer them to the target substrate 300 .

[0118] The transfer substrate 100 and the target substrate 300 are aligned again so that the remaining chips 110 can meet the alignment accuracy. For example, all the remaining chips 110 meet the transfer accuracy, and the corresponding drive execution unit 210 transfers all the remaining chips 110 to complete the second chip bonding action.

[0119] Fig.12 and Fig.13It is exemplarily shown that all the chips 110 can be transferred from the transfer substrate 100 to the target substrate 300 by one or two bonding actions, which is not a limitation of the present invention. In actual applications, the number of bonding times in one transfer process can be set as needed.

[0120] It can be seen from the above steps that the embodiment of the present invention uses the driving execution unit 210 on the driving array substrate 200 to perform the chip-bonding action, so that the corresponding chip 110 is separated from the transfer substrate 100. In this way, in a transfer process, only the chips 110 that meet the transfer accuracy can be transferred, and other chips 110 that do not meet the transfer accuracy can be transferred again after re-alignment. Compared with the existing mass transfer technology, the embodiment of the present invention realizes accurate control and transfer of the chips 110 to be transferred, thereby improving the transfer accuracy and transfer yield.

[0121] In the above embodiments, in S140, S240 and S250, there are multiple methods for determining the drive execution unit 210 that needs to be driven, and several of them are described below.

[0122] In an embodiment of the present invention, optionally, the method used by the drive execution unit 210 to determine the drive that needs to be driven includes the following steps:

[0123] First, an optical measuring device is used to measure the positions of the transfer substrate 100 and the target substrate 300 to obtain transfer information.

[0124] The optical measuring device may be, for example, an automatic optical inspection device (AOI) or an X-ray measuring device. The transfer information includes at least one of the following: the position of the chip 110 on the transfer substrate 100, the shape of the chip on the transfer substrate 100, the crack of the chip on the transfer substrate 100, the direction of the chip 110 on the transfer substrate 100, the position of the alignment mark on the transfer substrate 100, the shape of the alignment mark on the transfer substrate 100, and the direction of the alignment mark on the transfer substrate 100; the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, the shape of the pad on the target substrate 300, and the direction of the pad on the target substrate 300.

[0125] Then, the data processing device processes the transfer information to determine whether the chip position on the transfer substrate 100 meets the transfer accuracy, and obtains the quantity information and the position information.

[0126] The data processing device may be, for example, a chip 110 having a data processing function, such as a microprocessor, a single-chip microcomputer or a digital signal processor (DSP). Specifically, the data processing device can process and calculate the position information such as the position of the chip 110 on the transfer substrate 100, the position of the alignment mark on the transfer substrate 100, the shape of the alignment mark on the transfer substrate 100 or the direction of the alignment mark on the transfer substrate 100, and can obtain the position of the transfer substrate 100 and the position of each chip 110 on the transfer substrate 100. Furthermore, the data processing device can process and calculate the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, the shape of the pad on the target substrate 300 or the direction of the pad on the target substrate 300, and can obtain the position of the target substrate 300 and the position where each chip 110 on the target substrate 300 needs to be accurately placed. The data processing device can process and calculate the chip shape on the transfer substrate 100 or the chip cracks on the transfer substrate 100, so as to obtain the number and position of the defective chips 110. The data processing device combines the above information to determine whether the transfer substrate 100 and the target substrate 300 are aligned, and whether each chip 110 meets the transfer accuracy, so as to determine the number and position of the chips 110 that need to be transferred on the transfer substrate 100.

[0127] Finally, the array driving device drives the corresponding driving execution unit 210 to work according to the quantity information and the position information.

[0128] Wherein, illustratively, the driving array substrate 200 adopts an active driving array, including a gate gating module and a source gating module. The array driving device can be, for example, a chip such as a timing controller. The array driving device generates a timing control signal and other signals according to the number and position of the chips 110 to be transferred to determine the driving mode of the gate gating module and the source gating module, and can realize the scanning mode of row / column scanning or surface scanning, drive the corresponding driving execution unit 210 to work, so that the scanning and printing can be executed quickly, improve the transfer efficiency and stability, and simplify the operation difficulty.

[0129] In another embodiment of the present invention, optionally, the method used by the drive execution unit 210 to determine the drive that needs to be driven includes the following steps:

[0130] First, obtain the pre-stored chip quantity information and location information that need to be transferred.

[0131] Then, the array driving device drives the corresponding driving execution unit 210 to work according to the quantity information and the position information. The driving method of the array driving device is similar to that of the above embodiment, which will not be described in detail.

[0132] In each of the above embodiments, optionally, the step of transferring the chip 110 is performed once, that is, the target substrate 300 is a driving backplane. The driving backplane may be a backlight driving backplane or a display driving backplane. If the target substrate 300 is a backlight driving backplane, at this time, the chip 110 is a backlight chip. After all the chips 110 are transferred to the backlight driving backplane, it is necessary to weld the chip 110 to the pads on the backlight driving backplane by means of heat pressing, UV curing and reflow soldering to form a backlight source in the display device. If the target substrate 300 is a display driving backplane, at this time, the chip 110 is a display chip. After all the chips 110 are transferred to the display driving backplane, it is necessary to weld the chip 110 to the pads on the display driving backplane by means of heat pressing, UV curing and reflow soldering to form pixels in the display device.

[0133] In the above embodiments, optionally, the step of transferring the chip 110 is repeated at least twice, and the transfer accuracy in the later step is higher than the transfer accuracy in the earlier step; wherein, before being transferred to the driving backplane, the target substrate 300 is another transfer substrate 100. Specifically, Fig.14 A schematic diagram of another transfer method in each step provided by an embodiment of the present invention. Fig.14 , the transfer method comprises the following steps:

[0134] S300 , the target substrate 300 is another transfer substrate, and the chip 110 satisfying the first transfer accuracy is transferred from one transfer substrate 100 to another transfer substrate (target substrate 300 ).

[0135] S400: The target substrate 300 is a driving backplane, the target substrate 300 in S300 is used as a transfer substrate 100, and the chip 110 meeting the second transfer accuracy is transferred from the transfer substrate 100 to the driving backplane. The second transfer accuracy is higher than the first transfer accuracy.

[0136] The embodiment of the present invention transfers all the chips 110 at least twice, and the transfer accuracy of the later executed transfer step is higher than the transfer accuracy of the earlier executed step, which is beneficial for transferring a larger number of chips 110 in one bonding process, thereby helping to reduce the total number of bonding times to improve the accuracy of large-scale transfer.

[0137] It should be noted that, in the above-mentioned embodiments, the transfer method is exemplarily shown in the case where the arrangement density of the driving execution unit 210 of the driving array substrate 200 is the same as the arrangement density of the chip 110 of the target substrate 300, that is, the driving execution unit 210 corresponds to the chip 110 one by one, which is not a limitation of the present invention. In other embodiments, the arrangement density of the driving execution unit 210 of the driving array substrate 200 can also be set to be different from the arrangement density of the chip 110 of the target substrate 300. This arrangement reduces the number of settings of the driving execution unit 210, which is conducive to reducing the manufacturing cost. In this case, Fig.15 A schematic diagram of another transfer method in each step provided by an embodiment of the present invention. Fig.15 In one embodiment of the present invention, illustratively, the arrangement density of the driving execution unit 210 of the driving array substrate 200 is 1 / n of the arrangement density of the chips 110 of the target substrate 300, where n is a positive integer. Taking n=2 as an example, the transfer method includes the following steps:

[0138] S510 , aligning the driving array substrate 200 and the target substrate 300 for the first time.

[0139] The driving execution unit 210 on the driving array substrate 200 corresponds to half of the chip positions on the target substrate 300 .

[0140] S520 , under the action of the driving execution unit 210 , the corresponding chip 110 that meets the transfer accuracy is transferred from the transfer substrate 100 to the target substrate 300 .

[0141] S530 , performing a second alignment of the driving array substrate 200 and the target substrate 300 .

[0142] The driving execution unit 210 on the driving array substrate 200 corresponds to the remaining half of the chip position on the target substrate 300 .

[0143] S540 , under the action of the driving execution unit 210 , the remaining chips 110 that meet the transfer accuracy are transferred from the transfer substrate 100 to the target substrate 300 .

[0144] Through S510 - S540 , the transfer of all chips 110 is completed, and the transfer accuracy is the same as that in the case where the driver execution unit 210 corresponds to the chip 110 one by one.

[0145] In summary, the transfer method provided in the embodiment of the present invention can perform a single large-scale transfer of the chips 110 on the transfer substrate 100, or can perform multiple large-scale transfers by adopting different target substrates 300; each large-scale transfer can be completed in one time, or can be divided into multiple times for alignment, and the transfer accuracy and efficiency are both high.

[0146] An embodiment of the present invention further provides a display device, which may be an LCD display device equipped with a Mini LED backlight source, an LCD display device equipped with a Micro LED backlight source, a Mini LED display device, or a Micro LED display device. The display device includes: a driving backplane and a display chip (e.g., a Mini LED chip or a Micro LED chip) disposed on the driving backplane, wherein the display chip is transferred to the driving backplane using a transfer method provided in any embodiment of the present invention.

[0147] The driving backplane can be made of flexible materials such as polyimide (PI), polycarbonate (PC) or polyethylene terephthalate (PET) as a substrate to achieve flexible display. The circuit film layer in the driving backplane can be made of organic thin film transistors (OTFT) or organic field effect transistors (OMOS). The driving backplane can be a glass substrate or a quartz substrate with a driving circuit engraved on it, or a flexible printed circuit board (FPC), a printed circuit board (PCB), etc.

[0148] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A transfer device, characterized in that: include: A transfer substrate is arranged opposite to the target substrate, and the surface of the transfer substrate close to the target substrate is used to place the components to be transferred, and the components to be transferred are arranged in an array; A driving array substrate, on which driving execution parts are arranged in an array, and the driving execution parts are used to drive the corresponding components to be transferred to separate from the transfer substrate and transfer to the target substrate; The drive execution unit includes a drive circuit and an energy trigger component; The driving circuit includes a switch device, and the switch device is used to be turned on in response to a control signal to transmit the driving signal to the energy triggering component; The energy triggering component generates energy triggering in response to the driving signal to drive the corresponding component to be transferred to separate from the transfer substrate; The driving circuit of the driving execution unit is arranged in a one-to-one correspondence with the energy triggering component; The energy triggering component includes at least one of an electromagnetic device, a mechanical device, a chemical device and an electrostatic device.

2. The transfer device according to claim 1, characterized in that The switch device includes a triode or a field effect transistor; Alternatively, the energy triggering component further includes at least one of a heat source device and an optical device.

3. The transfer device according to claim 1, characterized in that Also includes: an auxiliary part, arranged on the surface of the transfer substrate close to the target substrate; the auxiliary part corresponds to the component to be transferred one by one, and is used to clamp the component to be transferred or is arranged between the component to be transferred and the transfer substrate; the auxiliary part is used to release the component to be transferred under the action of the energy triggering component; Alternatively, it is used to assist the alignment of the component to be transferred and the target substrate.

4. The transfer device according to claim 1, characterized in that The driving array substrate further comprises: A gate gating module connected to the switch devices on the drive array substrate; the gate gating module is used to turn on the switch devices row by row, or to turn on the switch devices of at least some rows at the same time; A source gating module connected to the switch device on the drive array substrate; the source gating module is used to simultaneously send the drive signal to the energy triggering components of at least part of the columns through the switch device; The rows extend along a first direction, and the columns extend along a second direction; or the rows extend along the second direction, and the columns extend along the first direction; and the first direction and the second direction intersect.

5. The transfer device according to claim 1, characterized in that Also includes: An optical measuring device, used to measure information contained in the transfer substrate or the target substrate; A data processing device connected to the optical measuring device; the data processing device is used to determine the number and position of the components to be transferred on the transfer substrate according to the information measured by the optical measuring device; An array driving device is connected to the data processing device; the array driving device is used to drive the corresponding driving execution part on the driving array substrate to work according to the number and position of the components to be transferred.

6. The transfer device according to claim 1, characterized in that Also includes: A motion device, used for controlling the displacement of the driving array substrate, the transfer substrate and the target substrate; wherein the driving array substrate and the target substrate remain relatively still, and the transfer substrate and the target substrate are aligned during the displacement process; Alternatively, the transfer device comprises: The moving device is used to drive the transfer substrate to move so that the transfer substrate and the target substrate are aligned.

7. The transfer device according to claim 1, characterized in that The target substrate is another transfer substrate, a backlight driving backplane or a display driving backplane.

8. The transfer device according to claim 1, characterized in that The arrangement density of the driving execution parts of the driving array substrate is the same as the arrangement density of the components to be transferred of the target substrate; Alternatively, the arrangement density of the driving execution parts of the driving array substrate is 1 / n of the arrangement density of the components to be transferred of the target substrate, where n is a positive integer.

9. A transfer method, characterized in that: include: providing a target substrate; Providing a transfer substrate, and aligning the transfer substrate with the target substrate; Components to be transferred are disposed on one side of the transfer substrate, and the components to be transferred are arranged in an array; Providing a driving array substrate, placing the driving array substrate on a side of the transfer substrate away from the target substrate, aligning with the target substrate and keeping it relatively still; wherein the driving array substrate is provided with driving execution parts, and the driving execution parts are arranged in an array; Drive at least part of the drive execution unit to separate the corresponding component to be transferred from the transfer substrate and transfer it to the target substrate; wherein the transferred component meets the transfer accuracy; the drive execution unit includes a drive circuit and an energy trigger component; the drive circuit includes a switch device, which is used to be turned on in response to a control signal and transmit the drive signal to the energy trigger component; the energy trigger component responds to the drive signal and generates an energy trigger to drive the corresponding component to be transferred to be separated from the transfer substrate; the drive circuit of the drive execution unit is arranged in a one-to-one correspondence with the energy trigger component; the energy trigger component includes at least one of an electromagnetic device, a mechanical device, a chemical device and an electrostatic device.

10. The transfer method according to claim 9, characterized in that: The driving at least part of the driving execution unit to separate the corresponding component to be transferred from the transfer substrate and transfer it to the target substrate includes: Using an optical measuring device to measure the positions of the transfer substrate and the target substrate to obtain transfer information; The data processing device processes the transfer information to determine whether the position of the components on the transfer substrate meets the transfer accuracy, and obtains quantity information and position information; The array driving device drives the corresponding driving execution part on the driving array substrate to work according to the quantity information and the position information; Alternatively, the driving at least part of the driving execution unit to separate the corresponding component to be transferred from the transfer substrate and transfer it to the target substrate includes: Acquire the pre-stored quantity information and location information of the components to be transferred; The array driving device drives the corresponding driving execution part on the driving array substrate to work according to the quantity information and the position information.

11. The transfer method according to claim 10, characterized in that: The transfer information includes at least one of the following: The position of the component to be transferred on the transfer substrate, the shape of the component to be transferred on the transfer substrate, the crack of the component to be transferred on the transfer substrate, the direction of the component to be transferred on the transfer substrate, the position of the alignment mark on the transfer substrate, the shape of the alignment mark on the transfer substrate, and the direction of the alignment mark on the transfer substrate; The alignment mark position on the target substrate, the alignment mark shape on the target substrate, the alignment mark direction on the target substrate, the pad position on the target substrate, the pad shape on the target substrate and the pad direction on the target substrate.

12. The transfer method according to claim 9, characterized in that: The step of transferring the component to be transferred is performed once, and the target substrate is a driving backplane; Alternatively, the step of transferring the component to be transferred is repeated at least twice, and the transfer accuracy in the later step is higher than the transfer accuracy in the earlier step; wherein, before being transferred to the driving backplane, the target substrate is another transfer substrate.

13. The transfer method according to claim 9, characterized in that: The arrangement density of the driving execution parts of the driving array substrate is the same as the arrangement density of the components to be transferred of the target substrate; if part of the components to be transferred are transferred in the step of transferring the components to be transferred for the first time, after part of the components to be transferred are transferred, the method further includes: Realigning the transfer substrate with the target substrate, and performing the step of transferring the components to be transferred until all the remaining components to be transferred are transferred to the target substrate; Alternatively, the arrangement density of the driving execution unit of the driving array substrate is 1 / n of the component arrangement density of the target substrate, where n is a positive integer; after part of the components to be transferred are transferred, the method further includes: performing at least n-1 times the step of realigning the transfer substrate with the target substrate and the step of transferring the components to be transferred.

14. A display device, characterized in that: include: A driving backplane and a display chip arranged on the driving backplane, wherein the display chip is transferred to the driving backplane using the transfer method as described in any one of claims 9 to 13.

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