A groove solder paste spraying device for groove circuit board

Abstract

A groove solder paste printing device for a groove circuit board, wherein a Z-axis servo-controlled conveying mechanism can be moved left and right and arranged on an X-axis servo-controlled conveying mechanism. A mobile fixture can be moved forward and backward and arranged on a Y-axis servo-controlled conveying mechanism. A visual detector is connected to the X-axis and Y-axis servo-controlled conveying mechanisms through a visual feedback device to accurately apply solder paste to the pads on the groove circuit board at precise X and Y positions. The Z-axis servo-controlled conveying mechanism drives the visual detector, the laser height measurement system and the solder paste adapter to move vertically up and down to accurately apply solder paste to the pads on the groove circuit board at a precise Z position. The automation of the entire process of solder paste printing for the groove circuit board is completed. After the visual test and the height measurement test are completed, the tinning needle fixed on the solder paste adapter is aligned with the pad positions in each groove circuit board and tinned in sequence. The solder paste can be sprayed on the pads in the groove of the groove circuit board to complete the precise tinning process.

Description

Technical Field

[0001] The invention relates to a circuit board soldering device, in particular to a soldering device for assembling electronic components on a soldering pad of a groove circuit board. Background Art

[0002] The existing SMT production process refers to the use of professional automatic assembly equipment such as solder paste printers, placement machines, reflow machines, etc. to assemble electronic components on the surface of the circuit board. It is an electronic mounting technology that directly attaches / solders electronic components such as resistors, capacitors, and inductors to the surface of the circuit board through soldering. It is currently the most popular technology and process in the electronic assembly industry.

[0003] In the solder paste printing process of electronic component soldering, the solder paste is printed onto the pads on the circuit board using a steel plate template. Figure 7 In the flat circuit board 10 shown in the figure, the existing solder paste 20 is scraped once on the steel plate mold 30 through reflow soldering, and the solder paste 20 is left on the pad 40 to complete the pad tinning. The solder paste 20 on the flat circuit board 10 in the figure is printed accurately and simply to print the solder paste 20 on the pad 40.

[0004] However, for the soldering of the pads 40 in the grooves 51 of the groove circuit board 50, if the existing method of printing solder paste with the steel plate mold 30 is still used, it is obvious that the solder paste 20 cannot be printed on the pads 40. Figure 7 In the groove circuit board 50 shown, the pad 40 is sunk in the groove 51 of the groove circuit board 50 , so the existing solder paste printing process cannot realize the printing of solder paste 20 on the pad 40 in the groove 51 of the groove circuit board. Summary of the invention

[0005] The purpose of the present invention is to solve the problems existing in the prior art and provide a groove solder paste printing device for a groove circuit board. The whole process of solder paste printing for the groove circuit board is automated. The solder paste can be sprayed on the pad in the groove of the groove circuit board to complete the tinning process.

[0006] To achieve the above object, the present invention adopts the following technical solution:

[0007] A groove solder paste printing device for a groove circuit board comprises a three-axis servo control conveying mechanism, a visual positioning system, a laser height measurement system and a solder paste printing control system; a plurality of groove circuit boards are arranged in a flow fixture, and solder pads are fixed in the grooves of the groove circuit boards; wherein,

[0008] The three-axis servo-controlled conveying mechanism includes an X-axis servo-controlled conveying mechanism, a Y-axis servo-controlled conveying mechanism and a Z-axis servo-controlled conveying mechanism; the X-axis servo-controlled conveying mechanism is arranged on a vertical plane, and the Y-axis servo-controlled conveying mechanism is arranged on a horizontal plane; the Z-axis servo-controlled conveying mechanism can be moved left and right and arranged on the X-axis servo-controlled conveying mechanism. The mobile fixture can be moved forward and backward and arranged on the Y-axis servo-controlled conveying mechanism;

[0009] The visual positioning system includes a visual detector, a visual display system and a visual feedback device. The visual detector is connected to the visual display system through the visual feedback device, and the visual display system is connected to the X-axis servo control conveying mechanism and the Y-axis servo control conveying mechanism through the visual feedback device; the visual detector is installed on the Z-axis servo control conveying mechanism, and the Z-axis servo control conveying mechanism drives the visual detector to move vertically up and down;

[0010] The laser altimeter system comprises a laser altimeter and an altimeter feedback device; the laser altimeter is connected to a visual display system through the altimeter feedback device, and the visual display system is connected to a Z-axis servo-controlled conveying mechanism through the altimeter feedback device; the laser altimeter system is installed on the Z-axis servo-controlled conveying mechanism, and the Z-axis servo-controlled conveying mechanism drives the laser altimeter system to move vertically up and down;

[0011] The solder paste printing control system comprises a solder paste adapter and a tin dispensing needle, wherein the tin dispensing needle is fixed on the solder paste adapter; the solder paste adapter is installed on a Z-axis servo-controlled conveying mechanism, and the Z-axis servo-controlled conveying mechanism drives the solder paste adapter to move vertically up and down, and tin is dispensed by aligning the tin dispensing needle with the pad position.

[0012] In the above-mentioned groove solder paste printing device for a groove circuit board, the solder paste printing control system further includes a solder paste printing controller, and the solder paste printing controller is connected to a solder paste adapter.

[0013] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0014] First, the Z-axis servo-controlled conveying mechanism of the groove solder paste printing device of the groove circuit board of the present invention can be moved left and right and set on the X-axis servo-controlled conveying mechanism. The mobile fixture can be moved forward and backward and set on the Y-axis servo-controlled conveying mechanism. The visual detector is connected to the X-axis and Y-axis servo-controlled conveying mechanisms through a visual feedback device to accurately apply solder paste to the pads on the groove circuit board at precise X and Y positions. The Z-axis servo-controlled conveying mechanism drives the visual detector, the laser height measurement system and the solder paste adapter to move vertically up and down to accurately apply solder paste to the pads on the groove circuit board at a precise Z position. The automation of the entire process of solder paste printing of the groove circuit board is completed.

[0015] Second, after the visual test and height measurement test are completed, the tinning needle fixed on the solder paste adapter is aligned with the pad positions in each groove circuit board of the flow fixture and tinning is sprayed in sequence. The solder paste can be sprayed on the pads in the groove of the groove circuit board to complete the precise tinning project. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the groove solder paste spraying device of the groove circuit board of the present invention;

[0018] Figure 2 It is a side structural schematic diagram of a groove solder paste spray printing device for a groove circuit board of the present invention;

[0019] Figure 3 It is a schematic diagram of the main structure of the groove hot air soldering device of the groove circuit board of the present invention;

[0020] Figure 4 It is a schematic diagram of the top view of the structure of the groove hot air soldering device of the groove circuit board of the present invention;

[0021] Figure 5 It is a schematic diagram of the tinning point of the groove circuit board of the present invention;

[0022] Figure 6 It is a schematic diagram of solder paste printing of a groove circuit board in the prior art;

[0023] Figure 7 The present invention is a schematic diagram of solder paste printing on a planar circuit board in the prior art. DETAILED DESCRIPTION

[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and more understandable, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0025] In the claims, description and the above-mentioned drawings of the present invention, unless otherwise clearly defined, the use of terms such as "front", "side" or "third" is to distinguish different objects rather than to describe a specific order.

[0026] In the claims, specification and the above-mentioned drawings of the present invention, unless otherwise explicitly defined, directional words, such as the terms "center", "lateral", "longitudinal", "horizontal", "vertical", "top", "bottom", "inside", "outside", "up", "down", "front", "back", "left", "right", "clockwise", "counterclockwise", etc., indicating directions or positional relationships are based on the directions and positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the specific protection scope of the present invention.

[0027] In the claims, specification and the above drawings of the present invention, unless otherwise clearly defined, if the term "fixed connection" or "fixed connection" is used, it should be understood in a broad sense, that is, any connection method without a displacement relationship and relative rotation relationship between the two, that is to say, including non-detachable fixed connection, detachable fixed connection, integrated connection and fixed connection through other devices or elements.

[0028] In the claims, description and drawings of the present invention, if the terms "include", "have" and their variations are used, they are intended to mean "including but not limited to".

[0029] Now combined Figures 1 to 5 The present invention provides a solder paste printing device for a groove circuit board, comprising a three-axis servo-controlled conveying mechanism 500, a visual positioning system 600, a laser height measurement system 700 and a solder paste printing control system 800. A plurality of groove circuit boards 200 are arranged in a flow fixture 100, and a solder pad 220 is fixed in a groove 210 of each groove circuit board 200.

[0030] The three-axis servo-controlled conveying mechanism 500 of the present invention includes an X-axis servo-controlled conveying mechanism 510, a Y-axis servo-controlled conveying mechanism 520, and a Z-axis servo-controlled conveying mechanism 530. The X-axis servo-controlled conveying mechanism 510 is arranged on a vertical plane, and the Y-axis servo-controlled conveying mechanism 520 is arranged on a horizontal plane. The Z-axis servo-controlled conveying mechanism 530 can be moved left and right and arranged on the X-axis servo-controlled conveying mechanism 510. The mobile fixture 100 can be moved forward and backward and arranged on the Y-axis servo-controlled conveying mechanism 520.

[0031] The visual positioning system 600 of the present invention comprises a visual detector 610, a visual display system 620 and a visual feedback device. The visual detector 610 is connected to the visual display system 620 through the visual feedback device, and the visual display system 620 is connected to the X-axis servo-controlled conveying mechanism 510 and the Y-axis servo-controlled conveying mechanism 520 through the visual feedback device. The visual detector 610 is installed on the Z-axis servo-controlled conveying mechanism 530, and the Z-axis servo-controlled conveying mechanism 530 drives the visual detector 610 to move vertically up and down.

[0032] When the visual test starts, the visual detector 610 is started, and the X-axis servo-controlled conveying mechanism 510, the Y-axis servo-controlled conveying mechanism 520 and the Z-axis servo-controlled conveying mechanism 530 are synchronously coordinated to perform horizontal plane coordinate point tests on the pads 220 in the grooves 210 of each groove circuit board in the flow fixture 100 at the X position and the Y position; then the visual tester 610 feeds back the horizontal position values ​​of the pads 220 of each groove circuit board at the X position and the Y position after the horizontal plane coordinate point test to the visual display system 620 through the visual feedback device, and the visual display system 620 saves the horizontal position values ​​and feeds back to the X-axis servo-controlled conveying mechanism 510 and the Y-axis servo-controlled conveying mechanism 520 through the visual feedback device when the soldering is started, respectively, to perform compensation control, and compensate the difference of the corresponding horizontal position values ​​through the left and right horizontal movements of the X-axis servo-controlled conveying mechanism 510 and the front and back horizontal movements of the Y-axis servo-controlled conveying mechanism 520, so as to accurately apply solder paste to the pads 220 on the groove circuit board 200 at the precise X position and Y position.

[0033] The laser altimeter system 700 includes a laser altimeter 710 and an altimeter feedback device. The laser altimeter 710 is connected to the visual display system 620 through the altimeter feedback device, and the visual display system 620 is connected to the Z-axis servo control conveying mechanism 530 through the altimeter feedback device. The laser altimeter system 700 is installed on the Z-axis servo control conveying mechanism 530, and the Z-axis servo control conveying mechanism 530 drives the laser altimeter system 700 to move vertically up and down.

[0034] After the visual test is completed, the visual tester 610 is turned off, and the laser altimeter 710 is turned on. The X-axis servo-controlled conveying mechanism 510, the Y-axis servo-controlled conveying mechanism 520, and the Z-axis servo-controlled conveying mechanism 530 are synchronized and coordinated to perform orderly height measurement tests on the Z positions of the pads 220 in the grooves 210 of each groove circuit board in the flow fixture 100. Then the laser altimeter 710 feeds back the vertical position values ​​(height values) of the pads 220 of each groove circuit board at the Z position after the height measurement test to the visual display system 620 through the height measurement feedback device, and the visual display system 620 saves the values, and when the soldering is started, the values ​​are fed back to the Z-axis servo-controlled conveying mechanism 530 through the height measurement feedback device for compensation control, and the difference in the corresponding vertical position values ​​is compensated by the up and down movement of the Z-axis servo-controlled conveying mechanism 530, so as to accurately apply solder paste to the pads 220 on the groove circuit board 200 at a precise Z position.

[0035] The solder paste printing control system 800 includes a solder paste printing controller 810, a solder paste adapter 820 and a tin dot needle 830. The solder paste printing controller 810 is connected to the solder paste adapter 820, and the solder paste adapter 820 is installed on the Z-axis servo control conveying mechanism 530, and the Z-axis servo control conveying mechanism 530 drives the solder paste adapter 820 to move vertically up and down. The tin dot needle 830 is installed and fixed on the solder paste adapter 820, and the solder paste 400 is poured into the solder paste adapter 820, and the tin dot needle 830 extends into the groove 210 of each groove circuit board 200, and aligns with the position of the pad 220 to dot the solder. The solder paste adapter 820 controls the tin spraying size and the speed of the tin dot printing through the solder paste printing controller 810.

[0036] After the visual test and height measurement test are completed, the horizontal position values ​​of the X position and Y position of each pad 220 stored on the visual display system 620, as well as the vertical position value of the Z position are fed back to the X-axis servo-controlled conveying mechanism 510, the Y-axis servo-controlled conveying mechanism 520 and the Z-axis servo-controlled conveying mechanism 530 respectively, and then the solder paste printing control system 800 starts to start, and the tin dot needle 830 fixed on the solder paste adapter 820 is aligned with the positions of the pads 220 in each groove circuit board 200 in the flow fixture 100 and tin dot printing is carried out in sequence.

[0037] The above description shows and describes the preferred embodiments of the present invention. As mentioned above, it should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the invention concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, and should be within the scope of protection of the claims attached to the present invention.

Claims

1. A groove solder paste printing device for a groove circuit board, characterized in that: The invention comprises a three-axis servo-controlled conveying mechanism (500), a visual positioning system (600), a laser height measurement system (700) and a solder paste spraying control system (800); a plurality of groove circuit boards (200) are arranged in a flow fixture (100), and a solder pad (220) is fixed in a groove (210) of the groove circuit board (200); wherein: The three-axis servo-controlled conveying mechanism (500) comprises an X-axis servo-controlled conveying mechanism (510), a Y-axis servo-controlled conveying mechanism (520) and a Z-axis servo-controlled conveying mechanism (530); the X-axis servo-controlled conveying mechanism (510) is arranged on a vertical plane, and the Y-axis servo-controlled conveying mechanism (520) is arranged on a horizontal plane; the Z-axis servo-controlled conveying mechanism (530) is arranged on the X-axis servo-controlled conveying mechanism (510) so as to be movable leftward and rightward; and the mobile fixture (100) is arranged on the Y-axis servo-controlled conveying mechanism (520) so as to be movable forward and backward; The visual positioning system (600) comprises a visual detector (610), a visual display system (620) and a visual feedback device; the visual detector (610) is connected to the visual display system (620) via the visual feedback device, and the visual display system (620) is connected to an X-axis servo-controlled conveying mechanism (510) and a Y-axis servo-controlled conveying mechanism (520) via the visual feedback device; the visual detector (610) is installed on a Z-axis servo-controlled conveying mechanism (530), and the Z-axis servo-controlled conveying mechanism (530) drives the visual detector (610) to move vertically up and down; A laser altimeter system (700) comprises a laser altimeter (710) and an altimeter feedback device; the laser altimeter (710) is connected to a visual display system (620) via the altimeter feedback device, and the visual display system (620) is connected to a Z-axis servo-controlled conveying mechanism (530) via the altimeter feedback device; the laser altimeter system (700) is installed on the Z-axis servo-controlled conveying mechanism (530), and the Z-axis servo-controlled conveying mechanism (530) drives the laser altimeter system (700) to move vertically up and down; A solder paste printing control system (800) comprises a solder paste adapter (820) and a soldering needle 830, wherein the soldering needle 830 is fixedly mounted on the solder paste adapter (820); the solder paste adapter (820) is mounted on a Z-axis servo-controlled conveying mechanism (530), and the Z-axis servo-controlled conveying mechanism (530) drives the solder paste adapter (820) to move vertically up and down, and performs soldering by aligning the soldering needle (830) with the position of the solder pad (220).

2. The groove solder paste printing device for a groove circuit board according to claim 1, characterized in that: The solder paste printing control system (800) further includes a solder paste printing controller (810), and the solder paste printing controller (810) is connected to a solder paste adapter (820).

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