Transportation system

Abstract

Embodiments herein relate to a transportation system and a substrate processing and transfer (SPT) system. The SPT system includes a transportation system connecting two processing tools. The transportation system includes a vacuum tunnel configured to transport a substrate between the processing tools. The vacuum tunnel includes a substrate transportation carrier to move the substrate through the vacuum tunnel. The SPT system has multiple configurations to allow a user to add or remove processing chambers as needed for a desired substrate processing recipe.

Description

Technical Field

[0001] This application generally relates to equipment, and more specifically to transportation systems. Background Technology

[0002] Manufacturing semiconductor devices typically involves a series of processes on a substrate or wafer, such as a silicon substrate or a glass plate. These steps may include polishing, deposition, etching, photolithography, and thermal processing. Often, multiple different processing steps can be performed in a single processing system or tool containing multiple processing chambers. However, it is common practice to perform other processing at other locations within the manufacturing facility, which necessitates transporting the substrate from one processing location to another within the facility. Depending on the type of semiconductor device to be manufactured, a relatively large number of processing steps may be performed at many different processing locations within the manufacturing facility.

[0003] Traditionally, substrates are transported from one processing location to another within substrate carriers such as sealed boxes, caskets, or containers. Automated substrate carrier transport devices, such as automated guided vehicles, overhead transport systems, and substrate carrier handling robots, are also traditionally used to move substrate carriers from one location to another within a manufacturing facility, or to transfer substrate carriers from or to substrate carrier transport devices.

[0004] This transport of the substrate typically involves exposing the substrate to indoor air or at least to non-vacuum conditions. Either of these exposures can expose the substrate to undesirable environments (e.g., oxidizing substances) and / or contaminants.

[0005] Therefore, there is a need for an improved transfer system for transferring substrates between processing tools. Summary of the Invention

[0006] The embodiments disclosed herein include a transport system and a substrate handling and transport (SPT) system. The transport and SPT systems include vacuum tunnels, carriers, and other features to help protect the substrate from undesirable environmental conditions.

[0007] In one embodiment, a transport system is provided, comprising: a vacuum tunnel configured to intersect with a first processing tool and a second processing tool. The vacuum tunnel includes: an enlarged region; a substrate transport carrier; and a rotary table disposed in the enlarged region. The rotary table is configured to rotate the substrate transport carrier between approximately 0 degrees and approximately 180 degrees. The substrate transport carrier includes: a carrier body; and an end effector coupled to the carrier body. The end effector is configured to support a substrate within the vacuum tunnel during transport. The end effector is configured to extend into the first or second processing tool to remove or place a substrate while the carrier body remains within the vacuum tunnel.

[0008] In another embodiment, a substrate handling and transport (SPT) system is provided, comprising: a first processing tool and a second processing tool, each processing tool including: a transfer chamber configured to be coupled to one or more processing chambers; a loading and locking chamber having a first inlet / outlet opening configured to receive a substrate from a device front-end module; a second inlet / outlet opening configured to transport the substrate in and out of the transfer chamber of the first processing tool; and a third inlet / outlet opening; and a vacuum tunnel coupled between the third inlet / outlet opening of the first processing tool and the third inlet / outlet opening of the second processing tool. The vacuum tunnel includes a substrate transport carrier. The substrate support carrier includes: a carrier body; and an end effector coupled to the carrier body. The end effector is configured to support the substrate within the vacuum tunnel during transport and is configured to extend into the loading and locking chamber of the first and second processing tools using the third inlet / outlet opening of each of the first and second processing tools.

[0009] In another embodiment, a transport system is provided, comprising: a vacuum tunnel configured to extend between a first processing tool and a second processing tool, the vacuum tunnel including a substrate transport carrier; a first lifting unit positioned near the first processing tool to allow transport of the substrate transport carrier between the first processing tool and the vacuum tunnel; a second lifting unit positioned near the second processing tool to allow transport of the substrate transport carrier between the first processing tool and the vacuum tunnel; and an emergency braking system configured to prevent the substrate transport carrier system within the first and second lifting units from falling during power loss. The vacuum tunnel is positioned above the first and second processing tools. Attached Figure Description

[0010] To provide a more detailed understanding of the above-described features of this disclosure, a more specific description of the disclosure can be made by referring to embodiments (briefly outlined above), some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only exemplary embodiments of the disclosure and should therefore not be considered as limiting its scope, as the disclosure can be applied to other equivalent embodiments.

[0011] Figures 1A to 1E The illustration shows a top view of a transportation system according to one embodiment.

[0012] Figure 2 The illustration shows a top view of a substrate processing and transport (SPT) system according to one embodiment.

[0013] Figure 3 The illustration shows a loading locking chamber according to one embodiment.

[0014] Figure 4A The illustration shows a schematic front view of a transportation system according to one embodiment.

[0015] Figure 4B The illustration shows a schematic side view of a transportation system according to one embodiment.

[0016] Figure 4C The illustration shows a schematic front view of a transportation system according to one embodiment.

[0017] Figure 4D The illustration shows a schematic side view of a transportation system according to one embodiment.

[0018] Figure 4E The illustration shows a side view of a magnetic levitation system according to one embodiment.

[0019] Figure 5A The figure shows an elevation side view of a lift unit according to one embodiment.

[0020] Figure 5B The illustration shows a top elevation view of a lift unit according to one embodiment.

[0021] Figure 5C and 5D An enlarged view of a tab according to one embodiment is shown.

[0022] Figure 6 The illustration shows a top view of an SPT system according to one embodiment.

[0023] Figure 7 The illustration shows a top view of an SPT system according to one embodiment.

[0024] Figure 8 The illustration shows a top view of an SPT system according to one embodiment.

[0025] Figure 9 The illustration shows a top view of an SPT system according to one embodiment.

[0026] Figure 10 The illustration shows a top view of an SPT system according to one embodiment.

[0027] For ease of understanding, the same reference numerals are used as much as possible to denote common elements in the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated into other embodiments without further description. Detailed Implementation

[0028] According to the embodiments described herein, one or more processing tools are coupled together via one or more vacuum tunnels. This system allows a substrate to be transported under vacuum to various chamber locations of multiple processing tools, effectively increasing the number of available high-vacuum or clean chamber locations (e.g., facets). Such processing tools are typically used as separate, independently operating processing tools that operate independently of each other.

[0029] In some embodiments, a vacuum tunnel is used to transport substrates between the loading and locking chambers of a first processing tool and a second processing tool. For example, substrate transport may be performed at the same height level as the processing tools or at a different height (e.g., above the processing tools). In some embodiments, the vacuum tunnel allows for metrology and / or inspection of the substrates while they are transported between processing tools. In one or more embodiments, magnetic levitation is used to transport the substrates within the vacuum tunnel between the processing tools.

[0030] As used herein, the term “about” means a change of + / - 10% from the nominal value. It should be understood that this change may be included in any value provided herein.

[0031] Figures 1A to 1E The figure shows a top view of a transport system 100 according to one embodiment. The transport system 100 is configured to transport a substrate between multiple processing tools. As shown, the transport system 100 includes a vacuum tunnel 102. The vacuum tunnel 102 is configured to extend between a first processing tool 104a and a second processing tool 104b. The processing tools 104a and 104b can be any suitable processing tool, such as an Endura 2 host available from Applied Materials Inc. in Santa Clara, California, or a Centura ACP host also available from Applied Materials Inc. Other processing tools and / or hosts can be used.

[0032] Processing tools 104a, 104b may include processing chambers coupled to the transfer chambers, device front-end modules, loading and locking chambers, pretreatment chambers, and / or the like (further described below). Exemplary processing chambers include deposition chambers (e.g., physical vapor deposition, chemical vapor deposition, plasma-enhanced chemical vapor deposition, etc.), etching chambers, degassing chambers, and / or any other type of processing chamber. Any number of processing chambers may perform the same or different processes.

[0033] Generally, vacuum tunnel 102 can be coupled to a front-end module of a device, a loading and locking chamber, a transfer chamber, a processing chamber, or other location of a processing tool. Although other vacuum levels can be used, an exemplary vacuum level for vacuum tunnel 102 is approximately 10. -10The range is from approximately 760 Torr.

[0034] As shown, the vacuum tunnel 102 includes a substrate transport carrier 106 with a carrier body 108 and an end effector 110 coupled to the carrier body 108. The end effector 110 is configured to support a substrate 112 within the vacuum tunnel 102 during transport. The end effector 110 is configured to extend the substrate into a first processing tool 104a or a second processing tool 104b to extract or place the substrate 112 while the carrier body 108 remains wholly or partially within the vacuum tunnel 102. For example, the end effector 110 may be long enough to extend into a loading locking chamber, processing chamber, transfer chamber, or other location within the processing tools 104a, 104b to receive or place the substrate while the remainder of the substrate transport carrier 106 remains within the vacuum tunnel 102. In some embodiments, the substrate transport carrier 106 is raised or lowered to facilitate the transfer of substrates to or from processing tools 104a or 104b (e.g., via a z-axis motor, increased magnetic field strength of a magnetic levitation system, etc.). In other embodiments, during substrate pick-up and / or placement operations, the substrate transport carrier 106 relies on lifting pins, robots, etc., within the processing tools 104a and / or 104b to provide z-axis movement.

[0035] In some embodiments, the vacuum tunnel 102 includes an enlarged region 114 with a rotary table 116 configured to rotate the substrate transport carrier 106 within a desired angular range (e.g., 0 degrees and 180 degrees in some embodiments). This allows the end effector 110 to rotate to face either the processing tool 104a or the processing tool 104b. Figures 1A to 1E The illustration shows an example movement of the substrate transport carrier 106, the end effector 110, and the substrate 112 during the transfer of the substrate 112 from the processing tool 104a to the processing tool 104b.

[0036] In some embodiments, the transport system 100 includes a metering or inspection tool 118 positioned relative to the vacuum tunnel 102 to allow metering or inspection of the substrate 112 placed on the end effector 110 while rotating the substrate transport carrier 106 via a turntable 116. For example, the metering tool 118 is configured to measure film thickness, film uniformity, substrate defect levels, perform edge inspection, etc. In other embodiments, the metering tool 118 is configured for scratch finding, substrate realignment, etc. Other metering and / or inspection tools may be used. In still other embodiments, the metering tool 118 or another tool is used for other processes within the enlarged area 114 of the vacuum tunnel 102, such as substrate degassing, substrate cooling, pre-cleaning, etc.

[0037] In some embodiments, the transport system 100 includes a magnetic levitation system 120 configured to levitate the substrate transport carrier 106 and move the substrate transport carrier 106 between a first processing tool 104a and a second processing tool 104b. For example, the substrate transport carrier 106 includes a plurality of permanent and / or other magnets repelled by permanent and / or other magnets used by a drive mechanism located outside the vacuum tunnel 102 in some embodiments. The electromagnets may be configured to facilitate control of the movement and / or positioning of the substrate transport carrier 106. A controller 122 (e.g., one or more microcontrollers, programmable logic controllers, dedicated hardware and / or software, etc.) may be configured to control one or more operations of the metering tool 118, the magnetic levitation system 120, the vacuum tunnel 102, etc.

[0038] In operation, the substrate transport carrier 106 can be configured to retrieve the substrate 112 from the first processing tool 104a by extending the end effector 110 from the vacuum tunnel 102 into the processing tool 104a. For example, the end effector 110 extends into the loading locking chamber, transfer chamber, processing chamber, etc., of the processing tool 104a to retrieve the substrate 112 (e.g., with or without z-direction movement provided by the substrate transport carrier 106). Thereafter, the substrate transport carrier 106 travels toward the processing tool 104b, rotating an appropriate amount within the enlarged region 114 such that the end effector 110 is oriented to extend into the processing tool 104b. The substrate transport carrier 106 rotates approximately 180 degrees so that the end effector 110 faces the processing tool 104b. In other embodiments, where the processing tools 104a, 104b are not positioned in a straight line, other rotation angles (e.g., 45 degrees, 90 degrees, etc.) can be used.

[0039] During the rotation of the substrate transport carrier 106, the metering tool 118 may perform one or more metering, inspection or other measurements on the substrate 112. Alternatively or alternatively, other processes (e.g., degassing, pre-cleaning, cooling, etc.) may be performed within the enlarged area 114.

[0040] Once the end effector 110 faces the processing tool 104b, the substrate transport carrier 106 can travel to place the substrate 112 into the processing tool 104b. For example, the end effector 110 extends into the loading locking chamber, transfer chamber, processing chamber, etc. of the processing tool 104b to place the substrate 112 therein (e.g., with or without the substrate transport carrier 106 providing z-direction movement).

[0041] Figure 2The figure shows a top view of a substrate handling and transport (SPT) system 200 according to one embodiment. As shown, the SPT system 200 includes two handling tools 202a and 202b. For example, the handling tools 202a and 202b are the Endura 2 system available from Applied Materials, or another suitable handling tool (e.g., a single or dual transfer chamber handling tool). The SPT system 200 is configured to move a substrate between the two handling tools 202a and 202b.

[0042] As shown in the figures, processing tool 202a includes processing chambers 206a to g coupled to transfer chambers 208a and 208b, and loading locking chambers 210a and 210b coupled between transfer chamber 208a and device front-end module (EFEM) 212. As shown in the figures, processing tool 202b includes processing chambers 202h to n coupled to transfer chambers 214a and 214b, and loading locking chambers 216a and 216b coupled between transfer chamber 214a and EFEM 218. In some embodiments, processing tools 202a and / or 202b each include degassing and / or pre-cleaning chambers 220a and 220b. Other numbers and / or types of chambers may be used. Processing tools 202a and 202b are configured to move a substrate around the respective chambers of the processing tool, thereby allowing the substrate to be processed in each individual processing chamber.

[0043] Processing chambers 206a to n can be any type of processing chamber, such as deposition chambers (e.g., physical vapor deposition, chemical vapor deposition, plasma-enhanced chemical vapor deposition, etc.), etching chambers, degassing chambers, and / or any other type of processing chamber. Any number of processing chambers 206a to n can perform the same or different processes.

[0044] Processing tools 202a and 202b are coupled via vacuum tunnel 102. For example, vacuum tunnel 102 couples the loading lock chamber 210b of processing tool 202a to the loading lock chamber 216b of processing tool 202b. In some embodiments, loading lock chamber 210b has a first access opening, a second access opening, and a third access opening. The first access opening is configured to receive or supply a substrate to EFEM 212, the second access opening is configured to transfer a substrate to or from transfer chamber 208a of the first processing tool 202a, and the third access opening is coupled to vacuum tunnel 102. Similarly, the loading locking chamber 216b has a first inlet / outlet opening, a second inlet / outlet opening, and a third inlet / outlet opening. The first inlet / outlet opening is configured to receive a substrate from or supply a substrate to the EFEM 218. The second inlet / outlet opening is configured to transfer a substrate to or from the transfer chamber 214a of the second processing tool 202b. The third inlet / outlet opening is coupled to the vacuum tunnel 102.

[0045] Figure 3 The illustration shows a loading locking chamber 300 according to one embodiment. The loading locking chamber 300 can be used for... Figure 2 The loading locking chamber 300 is configured to receive a substrate from the processing tools 202a, 202b. As shown, the loading locking chamber 300 includes a first inlet / outlet opening 302, a second inlet / outlet opening 304, and a third inlet / outlet opening 306. The first inlet / outlet opening 302 is configured to receive a substrate from the EFEM (e.g., 212) and / or supply a substrate to the EFEM. The second inlet / outlet opening 304 is configured to transfer a substrate to and / or from a transfer chamber (e.g., 208a). The third inlet / outlet opening 306 is configured to be coupled to the vacuum tunnel 102.

[0046] Back Figure 2 The vacuum tunnel 102 may include an enlarged region 114, which includes a rotary table 116. The rotary table 116 is configured to rotate the substrate transport carrier 106 between approximately 0 degrees and approximately 180 degrees. This allows the end effector 110 to rotate to face the processing tool 202a or the processing tool 202b.

[0047] In some embodiments, a metering tool 118 is positioned relative to the vacuum tunnel 102 to allow metering and / or inspection of a substrate placed on the end effector 110, while the substrate transport carrier 106 is located in the enlarged area 114 and / or rotated by the rotary table 116. An exemplary metering tool 118 includes tools for measuring film thickness, film uniformity, substrate defect levels, edge characteristics, etc., as well as a score finder, substrate aligner, and / or reorienter to determine and / or adjust the alignment / or orientation of the substrate as it passes between the processing tools 202a, 202b. The vacuum tunnel 102 can transport substrates between the processing tools 202a, 202b at the same height as or at different heights.

[0048] Figure 4A The illustration shows a schematic front view of a transportation system 400 according to one embodiment. Figure 4B A schematic side view of a transport system 400 according to one embodiment is illustrated. A vacuum tunnel 102 is placed above processing tools 202a, 202b. An elevator unit 402a may be configured to transfer a substrate transport carrier 106 between the processing tool 202a and the vacuum tunnel 102. Similarly, an elevator unit 402b may be included to transfer the substrate transport carrier 106 between the processing tool 202b and the vacuum tunnel 102. Elevator units 402a, 402b may include mechanical, magnetically levitated, or other lifting mechanisms. As shown, orientation change modules 404a, 404b may be configured to change the orientation of the substrate transport carrier 106 from along the y-axis (vertical) to along the x-axis (horizontal), and / or vice versa (e.g., using a suitable transfer or handover operation). In some embodiments, elevator units 402a, 402b and / or orientation change modules 404a, 404b are maintained at a vacuum level similar to that of the vacuum tunnel 102.

[0049] Figure 4C The figure shows a schematic front view of a transportation system 401 according to one embodiment. Figure 4D A schematic side view of a transport system 401 according to one embodiment is illustrated. The transport system 401 includes stacked vacuum tunnels 102a, 102b at different heights. The transport system 401 includes a metering tool 118 within one of the elevator units 402a, 402b. Numerous additional orientation-changing modules 404a to e are shown. Such elevated vacuum tunnels 102a and / or 102b can be included within any transport system described herein. For example, in some embodiments, a loading locking chamber 300 (… Figure 3 It includes access openings to allow entry and exit of the substrate from the top of the loading locking chamber 300. It may include additional stacks and / or raised vacuum tunnels (e.g., 3, 4, 5 vacuum tunnels, etc.).

[0050] Back Figure 4A A lifting unit 402a positioned near the first processing tool 202a allows for the transport of a substrate transport carrier 106 between the first processing tool 202a and the vacuum tunnel 102. A lifting unit 402b positioned near the second processing tool 202b allows for the transport of the substrate transport carrier 106 between the second processing tool 202b and the vacuum tunnel 102. Figure 4C and 4D In this configuration, an additional vacuum tunnel 102b is placed above the processing tool and can be accessed by the first elevator unit 402a and the second elevator unit 402b. The substrate transport carrier 106 can also be configured to support more than one substrate.

[0051] Figure 4E A side view of a magnetic levitation system 120 according to one embodiment is illustrated. As shown, the magnetic levitation system 120 includes a passive actuator 424, which includes an upper actuator 466 and a lower actuator 468. Although two end actuators allow for rapid retrieval of a substrate from a loading lock or other chamber and placement of another substrate in the loading lock or other chamber, fewer or more end actuators may be included. In some embodiments, a plurality of permanent and / or other magnets 460 are located in the lower actuator 468. The magnets 460 are repelled by magnets 462 located in a frame 472. For example, the frame 472 is attached to or located in a fixed position relative to a horizontal magnetic levitation track 464. The horizontal magnetic levitation track 464 may include drive coils and position sensors (not shown) to move the passive actuator 424 via magnetic force. In some embodiments, the horizontal magnetic levitation track 464 (and / or drive coils and / or position sensors) is located outside a vacuum region containing a passive actuator 424 and end effectors 466, 468. For example, track 464 is located in an atmospheric environment.

[0052] The support plate 472 includes a top surface 474, which in some embodiments intersects the horizontal magnetic levitation track 464 at an angle of less than 90 degrees, or is parallel to a plane that intersects the horizontal magnetic levitation track 464 at an angle of less than 90 degrees. The lower actuator 468 has a lower surface 476 that is parallel to the top surface 474 of the support plate 472.

[0053] In operation, the passive actuator 424 is maintained in a vertical position away from the support plate 472 by magnets 460 and 462. This vertical position is maintained regardless of whether the magnetic levitation system 120 is powered. Magnets (not shown) in the passive actuator 424 and the horizontal magnetic levitation track 464 maintain a gap 480 between the horizontal magnetic levitation track 464 and the passive actuator 424. In the event of power loss, the horizontal magnetic levitation track 464 cannot maintain the gap 480 between the horizontal magnetic levitation track 464 and the passive actuator 424. Subsequently, the slope of the top surface 474 and the lower surface 476 forces the passive actuator 424 toward the horizontal magnetic levitation track 464 until the passive actuator 424 contacts the horizontal magnetic levitation track 464, and prevents movement (e.g., horizontal movement) by friction. The passive actuator 424 remains vertically supported by magnetic force.

[0054] In some implementations, the horizontal magnetic levitation track 464 is curved, provided that the gap 480 is maintained to keep the passive mover 424 unconstrained on the horizontal magnetic levitation track 464.

[0055] When the passive mover 424, equipped with end effectors 466 and 468, is supported by a permanent magnetic field, it can be horizontally driven along a horizontal magnetic levitation track 464 by coils (not shown) behind a magnetic levitation separator (not shown). These coils do not define the vertical position of the passive mover, but only maintain the gap 480 between the track 464 and the passive mover 424, and push the passive mover 424 horizontally along the track 464. This allows the horizontal magnetic levitation track 464 to be very simple and uses less power because there is reduced or no contact, friction, and resistance to gravity.

[0056] Back Figure 4A In some embodiments, the lifting units 402a, 402b include emergency braking systems 406a, 406b configured to prevent the base plate transport vehicle within the first lifting unit 402a or the second lifting unit 402b from falling during power loss. The emergency braking systems 406a, 406b can be used as backup or alternative to standard uninterruptible power supplies.

[0057] Figure 5A The figure shows an elevation side view of a lift unit 402b according to one embodiment. Figure 5BThe figure illustrates a top elevation view of a lifting unit 402b according to one embodiment. The second lifting unit 402b is shown in an unlocked state. As shown, the second lifting unit 402b includes a linear motor 520 configured to raise and lower a passive actuator 424 coupled to a substrate transport carrier 106. In some embodiments, the passive actuator 424 is a passive device without any electronics. If the linear motor 520 fails, an emergency braking system 406b prevents the passive actuator 424 from freefalling. The first lifting unit 402a may have similar locked and unlocked states.

[0058] The emergency braking system 406b may include a friction surface 522 located on the linear motor 520, or the friction surface 522 may be located near the linear motor 520. A strip 526 may extend the length of the second lifter unit 402b and may be configured to be magnetized by an electromagnet 528. For example, in response to the electromagnet 528 being energized, the outer surface of the strip 526 is polarized. For example, when the electromagnet 528 is energized, the outer surface of the strip 526 is polarized to the south. Opposite polarities may be used.

[0059] Figure 5C and 5D An enlarged view of a tab 530 according to one embodiment is illustrated. Tab 530 is included in a braking system 406b. Tab 530 is pivotable about a pivot point 532 relative to a driven actuator 424. Tab 530 is biased about the pivot point 532 in a counterclockwise direction 534 (e.g., via a spring or other tensioning device, not shown). Accordingly, the lower portion of tab 530 is biased toward a friction surface 522. Tab 530 may include a permanent magnet 538 having magnetic poles facing a strip 526, the polarity of which is the same as the polarity of the strip 526 when the strip is magnetized by the electromagnet 528.

[0060] Despite Figure 5B The diagram illustrates two emergency braking systems 406b, each located on each side of the passive actuator 424. It should be understood that fewer or more emergency braking systems may be used.

[0061] In operation, energizing the electromagnet 528 can be achieved from the source operating the linear motor 520. The energized electromagnet 528 magnetizes the strip 526, thereby repelling the magnet 538 and forcing the tab 530 to pivot relative to direction 534, as... Figure 5D As illustrated in the diagram. In this configuration, the second lifting unit 402b is in the unlocked state, and the substrate transport carrier 106 can be freely raised or lowered. When power is lost to the linear motor 520, the electromagnet 528 cannot magnetize the strip 526, therefore the tab 530 rotates counterclockwise into the friction surface 522, as shown in the diagram. Figure 5CAs illustrated in the diagram, the contact between the tab 530 and the friction surface 522 locks the second lifting unit 402b and prevents the driven actuator 424 from falling off. When the tab 530 contacts the friction surface 522, the bracket 540 prevents the driven actuator 424 from falling off or moving away from the linear motor 520.

[0062] Figure 6 The illustration shows a top view of an SPT system 60 according to one embodiment. SPT system 600 is similar to SPT system 200, but SPT system 600 includes a dual loading locking chamber 602a with a handling tool 202a. Additionally, vacuum tunnel 102 does not include an enlarged area or a turntable. The dual loading locking chamber 602a is sized to allow a substrate transport carrier 106 to extend into the dual loading locking chamber 602a, such that a robot within transfer chamber 208a can retrieve a substrate from the substrate transport carrier 106 (or place a substrate on the robot). For example, the internal region of the dual loading locking chamber 602a has sufficient space to allow the substrate transport carrier 106 to travel a sufficient distance therein to retrieve a substrate from the substrate transport carrier 106. In some embodiments, the loading locking chamber 602a includes mechanisms (e.g., magnetic levitation tracks or other movement mechanisms) for allowing the substrate transport carrier 106 to move therein. In this way, rotation is not employed when transporting substrates between handling tools 202a and 202b. In some implementations, the dual loading locking chamber 602b is similarly configured as the dual loading locking chamber 602a, although a single loading locking chamber may be used with the processing tool 202b.

[0063] Figure 7 The illustration shows a top view of an SPT system 700 according to one embodiment. SPT system 700 is similar to SPT system 200, but in SPT system 700, EFEM 212 is moved to provide access to loading lock chamber 210b, and EFEM 218 is moved to provide access to loading lock chamber 216b. In this way, vacuum tunnel 102 extends between the forward / outward openings of loading lock chamber 210b and loading lock chamber 216b. In some embodiments, two rotary tables 702a and 702b are provided to allow substrate transport carrier 106 to be oriented for placing or retrieving substrates from or from loading lock chamber 210b or loading lock chamber 216b (as illustrated by dashed lines). This configuration provides sufficient space for additional facets F1 and F2 of processing tools 202a and 202b. The additional facets F1 and F2 allow processing tools 202a and 202b to accommodate additional processing chambers.

[0064] Figure 8The illustration shows a top view of an SPT system 800 according to one embodiment. SPT system 800 is similar to SPT system 700, but in SPT system 700, the loading locking chambers 210b and 201b are removed (e.g., to provide a more compact layout). Instead, each processing tool 202a, 202b of SPT system 800 contains only a single loading locking chamber 210a, 210b. Vacuum tunnel 102 directly intersects with transfer chambers 208a, 208b.

[0065] Figure 9 The illustration shows a top view of an SPT system 900 according to one embodiment. The SPT system 900 is similar to the SPT system 800, but the SPT system 900 includes a curved path within a vacuum tunnel 102. Because the vacuum tunnel 102 is curved, a single rotary table 902 is used to reorient the substrate transport carrier 106 when substrate transfer is performed between processing tools 202a and 202b.

[0066] Figure 10 The illustration shows a top schematic of an SPT system 1000 according to one embodiment. A vacuum tunnel 102 is configured to extend linearly between two or more processing tools (e.g., at least processing tools 202a and 202b). Figure 6 Like the SPT system 600, the SPT system 1000 does not include a rotary table.

[0067] Vacuum tunnel 102 is positioned between loading and locking chambers 210a, 210b of processing tool 202a and EFEM 212, and between loading and locking chambers 216a, 216b of processing tool 202b and EFEM 218. A robot within EFEM 212 or a robot within transfer chamber 208a is used to transfer substrates into vacuum tunnel 102 near processing tool 202a. For example, a robot within transfer chamber 208a picks up or places substrates within vacuum tunnel 102 by extending through loading and locking chambers 210a or 210b. Isolation valves 1002a to 1002g allow for the isolation of portions of vacuum tunnel 102 during substrate transfer, particularly when transferring substrates between EFEM 212 and vacuum tunnel 102, since EFEM 212 is typically not operated at a vacuum level. Isolation valves 1002a to 1002g prevent the remainder of vacuum tunnel 102 and / or loading locking chambers 210a, 210b from being exposed to the atmospheric pressure environment within EFEM 212. Vacuum tunnel 102 may similarly have isolation valves (not shown) configured near the processing tool 202b to allow the transfer of substrates between vacuum tunnel 102, loading locking chambers 216a, 216b, and EFEM 218.

[0068] One advantage of the SPT system 1000 is that no rotation is used when moving between processing tools 202a, 202b. Additionally, in some embodiments, the substrate transport vehicle 106 is simplified because the substrate transport vehicle does not extend into the processing tools 202a, 202b during pick-and-place operations. Instead, the robot within EFEM 212, 218 or transfer chambers 208a, 214a enters the vacuum tunnel 102. Furthermore, the vacuum tunnel 102 can be used to interconnect any number of processing tools. The substrate transport vehicle 106 does not include an end effector (although an end effector may be used).

[0069] In some embodiments, loading locking chambers 210a, 210b, 216a, 216b are used for preheating, cooling, metering, inspection, etc., or are replaced by such chambers, since the vacuum tunnel 102 effectively serves as a loading locking chamber.

[0070] In some embodiments, one or more auxiliary substrate buffer positions 1004 are included, and the auxiliary substrate buffer positions are configured as storage substrates. For example, an isolation valve 1006 is used to isolate the substrate from the vacuum tunnel 102. The substrate buffer position 1004 may be located in the same plane as the vacuum tunnel 102, perpendicular to the vacuum tunnel 102, vertically oriented, etc.

[0071] As described above, a transport system and an SPT system are provided. The SPT system includes a transport system connecting two processing tools. The transport system includes a vacuum tunnel configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carrier to move the substrates through the vacuum tunnel.

[0072] The SPT system offers various configurations to allow users to add or remove processing chambers based on the desired substrate processing procedure. It can include one or more vacuum tunnels, enabling the transport of multiple substrates. A lift unit with a braking system prevents damage to the substrates and components of the SPT system during power outages.

[0073] Those skilled in the art will understand that the foregoing examples are exemplary and not restrictive. It is intended that all permutations, enhancements, equivalents, and modifications that will become apparent to those skilled in the art upon reading the specification and studying the accompanying drawings are included within the true spirit and scope of this disclosure. Therefore, it is intended that the following appended claims encompass all such modifications, permutations, and equivalents that are consistent with the true spirit and scope of these teachings.

Claims

1. A transportation system, comprising: A vacuum tunnel, configured to intersect with a first processing tool and a second processing tool, the vacuum tunnel comprising: Expand the area; The substrate transport vehicle includes: Vehicle body; and An end effector coupled to the carrier body, the end effector being configured to support a substrate within the vacuum tunnel during transport, the end effector being configured to extend into the first or second processing tool to remove or place the substrate while the carrier body remains within the vacuum tunnel; and A rotary table, disposed in the enlarged area, is configured to rotate the substrate transport carrier between 0 degrees and 180 degrees to face one of the first processing tool or the second processing tool. The vacuum tunnel further includes a metering tool configured to meter the substrate placed on the end effector, while the substrate transport carrier is located within the enlarged area and rotated by the turntable.

2. The transportation system of claim 1, further comprising a magnetic levitation system configured to levitate the substrate transport vehicle and move the substrate transport vehicle between the first processing tool and the second processing tool.

3. The transportation system of claim 1, further comprising: A first lifting unit is positioned near the first processing tool to allow the substrate transport vehicle to transport between the first processing tool and the vacuum tunnel; and A second lifting unit is positioned near the second processing tool to allow the substrate transport vehicle to move between the second processing tool and the vacuum tunnel. The vacuum tunnel is positioned above the first processing tool and the second processing tool.

4. The transport system of claim 3, further comprising an additional vacuum tunnel positioned above the first processing tool and the second processing tool, accessible by the first lifting unit and the second lifting unit.

5. The transport system of claim 3, further comprising an emergency braking system configured to prevent the substrate transport vehicle within the first elevator unit and the second elevator unit from falling during power loss.

6. A substrate processing and transport (SPT) system, comprising: The first processing tool and the second processing tool, each comprising: A transfer chamber configured to be coupled to one or more processing chambers; A loading locking chamber having a first inlet / outlet opening configured to receive a substrate from a device front-end module; A second inlet / outlet opening is configured to transfer a substrate to or from the transfer chamber of the first processing tool; and The third entrance / exit opening; and A vacuum tunnel coupled between the third inlet / outlet opening of the first processing tool and the third inlet / outlet opening of the second processing tool, the vacuum tunnel including a substrate transport carrier, the substrate transport carrier comprising: Vehicle body; and An end effector coupled to the carrier body, the end effector being configured to support the substrate within the vacuum tunnel during transport, and configured to extend into the loading locking chamber of the first and second processing tools using the third access opening of each of the first and second processing tools, wherein the vacuum tunnel further comprises: An expanded area, wherein the substrate transport carrier is disposed in the expanded area; and A rotary table, disposed in the enlarged area, is configured to rotate the substrate transport carrier between 0 degrees and 180 degrees to face one of the first processing tool or the second processing tool. The SPT system further includes a metering tool positioned relative to the vacuum tunnel to allow metering of the substrate placed on the end effector, while the substrate transport carrier is rotated by the turntable.

7. The SPT system of claim 6, wherein the vacuum tunnel further comprises a second rotary table.

8. The SPT system of claim 6, further comprising a magnetic levitation system configured to levitate the substrate transport vehicle and move the substrate transport vehicle between the first processing tool and the second processing tool.

9. The SPT system of claim 6, wherein the vacuum tunnel further includes a curved path.

10. The SPT system of claim 6, further comprising a plurality of isolation valves, wherein each of the plurality of isolation valves is disposed between the vacuum tunnel and the loading locking chamber of the first processing tool and the second processing tool.

11. A transportation system, comprising: A vacuum tunnel configured to extend between a first processing tool and a second processing tool, wherein the vacuum tunnel is placed above the first processing tool and the second processing tool, the vacuum tunnel including a substrate transport carrier; A first lifting unit is positioned near the first processing tool to allow the substrate transport vehicle to transport between the first processing tool and the vacuum tunnel; A second lifting unit is positioned near the second processing tool to allow the substrate transport vehicle to move between the first processing tool and the vacuum tunnel; and An emergency braking system configured to prevent the base plate transport carrier systems within the first and second lifting units from falling during periods of power loss. The vacuum tunnel further includes a metering tool, an enlarged area, and a rotary table disposed in the enlarged area. The metering tool is configured to meter a substrate placed on the end effector, while the substrate transport carrier is located in the enlarged area and rotated by the rotary table. The rotary table is configured to rotate the substrate transport carrier between 0 degrees and 180 degrees to face one of the first processing tool or the second processing tool.

12. The transport system of claim 11, wherein the substrate transport carrier comprises: Vehicle body; and An end effector coupled to the vehicle body, the end effector being configured to support a base plate within the vacuum tunnel during transport.

13. The transport system of claim 11, wherein at least one of the first lifting unit and the second lifting unit comprises a magnetic lifting mechanism.

14. The transport system of claim 11, wherein the vacuum tunnel further includes a second rotary table disposed in the enlarged area.

15. The transport system of claim 11, further comprising a magnetic levitation system configured to levitate the substrate transport vehicle and move the substrate transport vehicle between the first processing tool and the second processing tool.

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