Printed Circuit Board and Display Device Comprising the Same

Abstract

The present invention provides a printed circuit board and a display device including the printed circuit board. The display device includes: a wiring pattern portion including a wiring pattern and a wiring pad connected to the wiring pattern; a printed circuit board electrically connected to the wiring pattern portion; and a conductive material for electrically connecting the wiring pattern portion and the printed circuit board. The printed circuit board includes: a base substrate; a plurality of circuit pads provided on the base substrate and electrically connected to the wiring pattern through the conductive material; and dummy pads provided between adjacent ones of the circuit pads. The wiring pad includes a first portion overlapping with the circuit pad and a second portion not overlapping with the circuit pad. The conductive material is provided on the second portion and abuts against a side surface of the circuit pad.

Description

Technical Field

[0001] The present application relates to a printed circuit board and a display device including the printed circuit board. Background Art

[0002] Organic light-emitting display devices are applied to various products centered around smartphones because of their excellent characteristics such as brightness, driving voltage, and response speed, and the ability to achieve multicolorization. An organic light-emitting display device includes a display panel including organic light-emitting elements. The organic light-emitting elements are provided with a cathode electrode and an anode electrode centered around an organic light-emitting layer, and when a voltage is applied to these two electrodes, visible light is generated from the organic light-emitting layer connected to the two electrodes.

[0003] A panel lower sheet is attached to the lower part of the display panel. The panel lower sheet may include various functional sheets for protecting the display panel from heat, external shock, etc. Moreover, the panel lower sheet may further include an input auxiliary device or a driving device such as a digitizer that is difficult to be provided on the upper part of the display panel.

[0004] Auxiliary devices such as digitizers can be electrically connected to a printed circuit board for driving the digitizer. In order to short-circuit the pads of the digitizer and the pins or pads of the printed circuit board, a soldering process can be performed.

[0005] In addition, in the soldering process, alignment marks of the printed circuit board and adjacent alignment marks of the digitizer are photographed, and based on their distances, solder is jetted to the edge of the printed circuit board. Since the distances between the edges of the alignment marks of the printed circuit board are different due to cutting process deviations of the printed circuit board, the position of the solder moves as a whole, which may cause short-circuit defects and uneven solder formation. Summary of the Invention

[0006] The problem to be solved by the present invention is to provide a display device in which short-circuit defects between a wiring pattern portion and a printed circuit board for driving the wiring pattern portion are improved.

[0007] Another problem to be solved by the present invention is to provide a printed circuit board capable of preventing short-circuit defects and uneven solder formation with a wiring pattern portion in a soldering process.

[0008] The problems of the present invention are not limited to the above-mentioned problems, and those skilled in the art should clearly understand other technical problems not mentioned based on the following description.

[0009] A display device according to an embodiment for solving the above problems includes: a wiring pattern portion including a wiring pattern and a wiring pad connected to the wiring pattern; a printed circuit board electrically connected to the wiring pattern portion; and a conductive material for electrically connecting the wiring pattern portion and the printed circuit board. The printed circuit board includes: a base substrate; a plurality of circuit pads provided on the base substrate and electrically connected to the wiring pattern through the conductive material; and dummy pads provided between adjacent ones of the circuit pads. The wiring pad includes a first portion overlapping with the circuit pad and a second portion not overlapping with the circuit pad. The conductive material is provided on the second portion and abuts against a side surface of the circuit pad.

[0010] The base substrate may include a first edge on one side. The plurality of circuit pads may include a first circuit pad. The dummy pad includes a first dummy pad provided between adjacent ones of the first circuit pads. Side surfaces of the first circuit pad and the first dummy pad may be aligned with the first edge.

[0011] The base substrate may further include a second edge on the other side, where the other side is the opposite side of the one side. The plurality of circuit pads may further include a second circuit pad. The dummy pad may include a second dummy pad provided between adjacent ones of the second circuit pads. Side surfaces of the second circuit pad and the second dummy pad may be aligned with the second edge.

[0012] A plurality of the first circuit pads may form a first group of circuit pads. There may be a plurality of the first groups of circuit pads. The first dummy pad may be located between adjacent ones of the first groups of circuit pads.

[0013] A plurality of the second circuit pads may form a second group of circuit pads. There may be a plurality of the second groups of circuit pads. The second dummy pad may be located between adjacent ones of the second groups of circuit pads.

[0014] The printed circuit board may further include first circuit alignment marks respectively provided on one side and the other side, and a plurality of the first groups of circuit pads are interposed between the one side and the other side.

[0015] The printed circuit board may further include second circuit alignment marks respectively provided on one side and the other side, and a plurality of the second groups of circuit pads are interposed between the one side and the other side.

[0016] A distance in a top view between the first circuit alignment mark and the first edge may be different from a distance in a top view between the second circuit alignment mark and the second edge.

[0017] The conductive material may be formed to be adjacent to the first edge in a top view, and the conductive material may be formed by soldering.

[0018] The dummy pad may be configured to be formed adjacent to the first edge by the conductive material formed by the soldering.

[0019] The material of the dummy pad may be different from the material of the circuit pad.

[0020] The dummy pad may further include a printed layer.

[0021] The wiring pattern portion may include a digitizer.

[0022] The display device may further include a sensor unit disposed to overlap with the printed circuit board in a thickness direction, and the sensor unit may be a fingerprint sensor.

[0023] A printed circuit board according to an embodiment for solving the above another problem includes: a base substrate; a plurality of circuit pads disposed on the base substrate; and dummy pads disposed between adjacent ones of the circuit pads, wherein the material of the dummy pads is different from the material of the circuit pads.

[0024] The dummy pad may further include a printed layer.

[0025] The base substrate may include a first edge on one side, the plurality of circuit pads may include a first circuit pad, the dummy pad may include a first dummy pad disposed between adjacent ones of the first circuit pads, and sides of the first circuit pad and the first dummy pad may be aligned with the first edge.

[0026] The base substrate may further include a second edge on the other side, the other side being opposite to the one side, the plurality of circuit pads may further include a second circuit pad, the dummy pad includes a second dummy pad disposed between adjacent ones of the second circuit pads, and sides of the second circuit pad and the second dummy pad may be aligned with the second edge.

[0027] The dummy pad may include: a first dummy portion adjacent to the first edge; and a second dummy portion spaced apart from the first edge, the first dummy portion being between the second dummy portion and the first edge, and a width of the first dummy portion may be greater than a width of the second dummy portion.

[0028] A display device according to another embodiment for solving the above problems includes: a wiring pattern portion including a plurality of wiring patterns, wiring pads connected to the plurality of wiring patterns, and dummy pads provided between adjacent ones of the plurality of wiring patterns; a printed circuit board electrically connected to the wiring pattern portion; and a conductive material for electrically connecting the wiring pattern portion and the printed circuit board. The printed circuit board includes a plurality of circuit pads electrically connected to the wiring pads through the conductive material. The wiring pads include a first portion overlapping with the circuit pads and a second portion not overlapping with the circuit pads. The conductive material is provided on the second portion and contacts the side surface of the circuit pads.

[0029] Specific contents of other embodiments are included in the detailed description and the drawings.

[0030] According to an embodiment of a printed circuit board and a display device, it is possible to improve the short-circuit defect between the wiring pattern portion and the printed circuit board for driving the wiring pattern portion.

[0031] The effects of the embodiments are not limited to the contents illustrated above, and this specification includes more diverse effects. Description of the Drawings

[0032] Figure 1 is a perspective view of a display device according to an embodiment.

[0033] Figure 2 is Figure 1 an exploded perspective view of the display device.

[0034] Figure 3 is a cross-sectional view taken along the line II-II' of Figure 2 the display device.

[0035] Figure 4 is a cross-sectional view of a lower panel according to an embodiment.

[0036] Figure 5 is a layout diagram of a digitizer according to an embodiment.

[0037] Figure 6 is an enlarged Figure 5 top view of region A of

[0038] Figure 7 is an enlarged Figure 5 top view of region B of

[0039] Figure 8 is a top view of a printed circuit board according to an embodiment.

[0040] Figure 9 is an enlarged Figure 7 top view of region C of

[0041] Figure 10 is a cross-sectional view taken along the X-X' line of Figure 7 .

[0042] Figure 11 is a cross-sectional view taken along the XI-XI' line of Figure 7 .

[0043] Figure 12 is a top view of a printed circuit board of another embodiment.

[0044] Figure 13 is a top view of a printed circuit board of still another embodiment.

[0045] Figure 14 is a top view of a printed circuit board and a wiring pattern portion of still another embodiment. DETAILED DESCRIPTION

[0046] Advantages, features, and methods for realizing these of the present invention will become clear while referring to the accompanying drawings and also to the embodiments described in detail later. However, the present invention is not limited to the embodiments disclosed below, but is implemented in various different forms, and these embodiments are provided only to make the disclosure of the present invention complete and to fully inform those skilled in the art to which the present invention pertains of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0047] When an element or layer is "on" another element or layer, it includes both the case where the element or layer is directly on the other element or layer and the case where other layers or other elements are interposed therebetween. The same reference numerals denote the same structural elements throughout the specification.

[0048] Although first, second, etc. are used to describe various structural elements, it is needless to say that these structural elements are not limited to these terms. These terms are only used to distinguish one structural element from other structural elements. Therefore, the first structural element mentioned below may also be the second structural element within the technical idea of the present invention.

[0049] Hereinafter, embodiments will be described with reference to the accompanying drawings.

[0050] Figure 1 is a perspective view of a display device of one embodiment. Figure 2 is Figure 1 an exploded perspective view of the display device of Figure 3 is a cross-sectional view taken along the II-II' line of Figure 2 .

[0051] Refer to Figures 1 to 3, the display device 70 includes a display panel 20 and a lower panel sheet 10 disposed below the display panel 20. The display device 70 may further include a window 40 disposed above the display panel 20. In addition, the display device 70 may further include a bracket 60 disposed below the lower panel sheet 10.

[0052] In the absence of other definitions, in this specification, "upper part", "top end" or "upper surface" refer to the display surface side with respect to the display panel 20, and "lower part", "bottom end" or "lower surface" refer to the opposite side of the display surface with respect to the display panel 20.

[0053] The display device 70 may be formed in a rectangular shape when viewed from above. The display device 70 may include two long sides and two short sides. The corners where the long sides and short sides of the display device 70 meet may be right angles, but as Figure 1 shown, a curved surface may be formed. The top view shape of the display device 70 is not limited to the illustrated shape, and it may also be applied in a circular or other shape.

[0054] The display panel 20 is a panel for displaying an image, and for example, an organic light-emitting display panel may be applied. In the following embodiments, although the case of using an organic light-emitting display panel as the display panel 20 is illustrated, it is not limited thereto, and other types of display panels such as liquid crystal display devices and electrophoretic devices may also be applied.

[0055] The display panel 20 includes a plurality of organic light-emitting elements disposed on a substrate. The substrate may be a rigid substrate formed of glass or the like, or a flexible substrate formed of polyimide or the like. In the case of using a polyimide substrate as the substrate, the display panel 20 may be bent, folded, or rolled up.

[0056] A window 40 is disposed above the display panel 20. The window 40 is disposed above the display panel 20 to protect the display panel 20 while allowing the light emitted from the display panel 20 to transmit. The window 40 may be formed of glass or the like.

[0057] The window 40 may be arranged to overlap with the display panel 20 and cover the front of the display panel 20. The window 40 may be larger than the display panel 20. For example, the window 40 protrudes more outward than the display panel 20 at the two short sides of the display device 70. Although the window 40 may also protrude from the display panel 20 at the two long sides of the display device 70, the protrusion distance may be greater when it protrudes at the two short sides.

[0058] In one embodiment, a touch member 30 may be disposed between the display panel 20 and the window 40. The touch member 30 may be of a rigid panel type, a flexible panel type, or a film type. The touch member 30 has substantially the same size as the display panel 20 and is disposed overlapping the display panel 20. Although the sides of the touch member 30 and the sides of the display panel 20 may be aligned, this is not limited thereto. The display panel 20 and the touch member 30, and the touch member 30 and the window 40 may be bonded respectively through transparent bonding layers 52, 53 such as an optically clear adhesive (OCA) or an optically clear resin (OCR). The touch member 30 may also be omitted. In this case, the display panel 20 and the window 40 may be bonded through an optically clear adhesive (OCA) or an optically clear resin (OCR) or the like. In several embodiments, the display panel 20 may include a touch electrode portion inside thereof.

[0059] A panel lower sheet 10 is disposed below the display panel 20. The panel lower sheet 10 may include a top bonding layer ( Figure 4 “130” in the following) at the uppermost portion and is attached to the lower surface of the display panel 20 through the top bonding layer 130.

[0060] Although the panel lower sheet 10 may have substantially the same size as the display panel 20 and is disposed overlapping the display panel 20, and the sides of the panel lower sheet 10 and the sides of the display panel 20 are aligned, this is not limited thereto. The panel lower sheet 10 may perform functions such as heat dissipation function, electromagnetic shielding function, function of preventing pattern visibility, grounding function, buffering function, strength enhancement function, and / or digitization function, etc. The panel lower sheet 10 may include a functional layer having at least one of the above functions. The functional layer may be provided in various forms such as a layer, a film, a thin film, a sheet, a plate, a panel, etc.

[0061] The panel lower sheet 10 may include one or more functional layers. In the case where the panel lower sheet 10 includes a plurality of functional layers, the functional layers may be laminated overlapping each other. The functional layers may be directly laminated above other functional layers or provided through a bonding layer.

[0062] More embodiments of the panel lower sheet 10 will be described later.

[0063] A bracket 60 is disposed below the panel lower sheet 10. The bracket 60 houses the window 40, the touch member 30, the display panel 20, and the panel lower sheet 10. The bracket 60 may include a bottom surface and side walls. The bottom surface of the bracket 60 faces the lower surface of the panel lower sheet 10, and the side walls of the bracket 60 face the side walls of the window 40, the touch member 30, the display panel 20, and the panel lower sheet 10. The panel lower sheet 10 may include a bottom end bonding member (not shown) at the lowermost portion and is attached to the bottom surface of the bracket 60 through the bottom end bonding member.

[0064] Although not shown, a waterproof band may be provided around the bottom surface of the bracket 60. The waterproof band provided adjacent to the long side may be attached to the lower surface of the lower panel piece 10, and the waterproof band provided adjacent to the short side may be attached to the lower surface of the window 40.

[0065] In one embodiment, the display device 70 may include a flat portion FA and a curved portion BA that is connected to the flat portion FA and is located at the periphery of the flat portion FA. The flat portion FA is substantially located on a plane. The curved portion BA is not located on the same plane as the flat portion FA. For example, the curved portion BA may be bent or curved downward from the plane where the flat portion FA is located.

[0066] In one embodiment, the curved portion BA may include a curved surface that bulges outward. In another embodiment, the curved portion BA may have a flat surface, and the flat surface of the curved portion BA is located on a plane having a predetermined angle with the plane of the flat portion FA.

[0067] The curved portion BA may be located on two long sides or one long side of the rectangular display device 70. Although not shown, the short sides of the display device 70 may also be curved.

[0068] The above-described display panel 20, touch member 30, window 40, lower panel piece 10, and bracket 60 may all be located on the flat portion FA and the curved portion BA.

[0069] In addition, a sensor unit SU may be further provided on the lower panel piece 10. The sensor unit SU may be a fingerprint recognition device of the display device 70. That is, the sensor unit SU may recognize the fingerprint of the user input through the window 40 in a light manner or an ultrasonic manner. The sensor unit SU may be located on the lower side in the top view of the display device 70, but is not limited thereto.

[0070] Different from the case shown in the drawings, the display device 70 may also be a flat display device formed only of the flat portion FA without the curved portion BA. Among the contents discussed in this specification, except for the contents particularly related to the curved portion BA, it can be applied not only to the curved display device but also to the flat display device in the same way.

[0071] Next, the above-described lower panel piece 10 will be described in more detail.

[0072] Figure 4 It is a cross-sectional view of the lower panel piece of one embodiment. In Figure 4 For convenience of explanation, the generally flat lower panel piece 10 is illustrated. It should be understood that the flat-shaped lower panel piece maintains a flat shape when attached to the flat-shaped display panel, but bends together when attached to the curved display panel and can be divided into a flat portion and a curved portion.

[0073] Refer to Figure 4, the lower panel sheet 10 includes a cover plate portion 100 and a wiring pattern portion 200 provided below the cover plate portion 100.

[0074] The cover plate portion 100 includes a cover base material 110, a top bonding layer 130 provided on the upper surface of the cover base material 110, a first release film 160 provided on the upper surface of the top bonding layer 130, and a first interlayer bonding layer 140 provided on the lower surface of the cover base material 110.

[0075] The cover base material 110 can be formed of polyethylene terephthalate (PET), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), cycloolefin polymer (COP), or the like.

[0076] The top bonding layer 130 is provided on the upper surface of the cover base material 110. The top bonding layer 130 serves to attach the lower panel sheet 10 to the lower surface of the display panel 20. The top bonding layer 130 can be constituted by a bonding layer, an adhesive layer, or a resin layer. For example, the top bonding layer 130 can contain polymer substances classified as silicone resins, polyurethanes, SU polymers having a silicone resin-polyurethane hybrid structure, acrylic resins, isocyanates, polyvinyl alcohols, gelatins, vinyls, latexes, polyesters, and aqueous polyesters, etc.

[0077] The first release film 160 is provided on the upper surface of the top bonding layer 130. The first release film 160 covers and protects the upper surface of the top bonding layer 130 before attaching the lower panel sheet 10 to the display panel 20, and is peeled off when attaching the lower panel sheet 10 to the display panel 20 to expose the upper surface of the top bonding layer 130 that becomes the bonding surface.

[0078] Although the first release film 160 is in contact with the top bonding layer 130, it is not completely attached and can be in contact with the top bonding layer 130 to the extent that it can be peeled off in a subsequent process. The first release film 160 can include polyethylene terephthalate (PET), polycarbonate (PC), polyimide (PI), or paper, etc. To increase the release force of the first release film 160, the upper surface of the film can be treated with a silicone resin solution or a release coating containing a silicone resin-based resin can be formed, but it is not limited thereto.

[0079] In several embodiments, the lower surface of the first release film 160 may have an embossed shape. The embossed shape of the lower surface of the first release film 160 is transferred to the upper surface of the adjacent top bonding layer 130, whereby the upper surface of the top bonding layer 130 may also have an embossed shape complementary to the shape of the lower surface of the first release film 160. When the upper surface of the top bonding layer 130 has an embossed shape, when the lower panel 10 is attached to the lower surface of the display panel 20, the surface embossed shape can function as an air passage to reduce bubbles. When the top bonding layer 130 is completely attached to the lower part of the display panel 20, as Figure 5 shown, the embossed shape on the upper surface of the top bonding layer 130 may collapse and become flat.

[0080] A first interlayer bonding layer 140 is provided on the lower surface of the cover substrate 110. The first interlayer bonding layer 140 bonds the cover substrate 110 to the wiring pattern portion 200. That is, the first interlayer bonding layer 140 functions to bond the cover plate portion 100 to the lower wiring pattern portion 200. Although in this embodiment it is described that the first interlayer bonding layer 140 is included in the cover plate portion 100, it can also be interpreted that the first interlayer bonding layer 140 at the same position is included in the wiring pattern portion 200 or the first interlayer bonding layer 140 is an independent component.

[0081] The material of the first interlayer bonding layer 140 may be selected from the exemplified materials of the above-mentioned top bonding layer 130.

[0082] The wiring pattern portion 200 may include a wiring pattern 200b and insulating layers 200a, 200c that surround the wiring pattern 200b from above and below. Specifically, the wiring pattern portion 200 may include a first insulating layer 200a, a wiring pattern 200b provided on the upper surface of the first insulating layer 200a, and a second insulating layer 200c that covers the upper surface of the wiring pattern 200b. The wiring pattern portion 200 may include a wiring pattern 200b that transmits signals and wiring pads PAD1, PAD2 connected to the wiring pattern 200b. This will be described in detail Figure 5 later.

[0083] The wiring pattern 200b may contain a metal material such as copper, silver, nickel, tungsten, etc. The wiring pattern 200b may be formed of a single film or multiple laminated films. In one embodiment, the wiring pattern 200b may be a double film including a lower copper film and an upper copper film.

[0084] The first insulating layer 200a and the second insulating layer 200c may be formed of an organic insulating material, an inorganic insulating material, or an organic-inorganic insulating material respectively, or may be formed of a bonding material such as a bonding substance, an adhesive substance, etc. respectively. The first insulating layer 200a or the second insulating layer 200c can be used as a base material layer for forming the wiring pattern 200b.

[0085] In one embodiment, the wiring pattern portion 200 may be a digitizer. A digitizer is an input device that, unlike input devices such as a keyboard or a mouse, receives position information indicated by a user on a screen. For example, a digitizer recognizes the movement of a stylus and converts the movement into a digital signal. The digitizer may be provided in the form of a film or a panel.

[0086] However, it is not limited thereto, and various components including a wiring pattern such as a printed circuit board and a flexible printed circuit board may be used as the wiring pattern portion 200.

[0087] The cover base material 110, the top bonding layer 130, the first release film 160, and the first interlayer bonding layer 140 of the cover portion 100 described above and the first insulating layer 200a and the second insulating layer 200c of the wiring pattern portion 200 may all overlap and each side surface may be aligned with each other. These side surfaces may be cut surfaces. For example, in the case where a plurality of individual panel lower sheets 10 are obtained by cutting a mother panel lower sheet after manufacturing the mother panel lower sheet, the side surfaces as cut surfaces can all be aligned.

[0088] Hereinafter, a digitizer as one application example of the wiring pattern portion 200 will be described in detail.

[0089] Figure 5 It is a layout diagram of a digitizer according to an embodiment. Figure 6 It is an enlarged Figure 5 top view of region A. Figure 7 It is an enlarged Figure 5 top view of region B. Figure 8 It is a top view of a printed circuit board according to an embodiment. Figure 9 It is an enlarged Figure 7 top view of region C. Figure 10 It is a cross-sectional view taken along line Figure 7 X-X' of Figure 11 It is a cross-sectional view taken along line Figure 7 XI-XI' of

[0090] Referring to Figures 5 to 11 , the wiring pattern portion 200 may be provided in the flat portion FA and the bent portion BA. The insulating layers 200a and 200c of the wiring pattern portion 200 may be provided in the entire regions of the flat portion FA and the bent portion BA, and the wiring pattern 200b of the wiring pattern portion 200 may be provided only in the flat portion FA as shown in Figure 5 . However, it is not limited thereto, and the wiring pattern 200b may also be provided in the bent portion BA.

[0091] In a top view, a first wiring pattern 210 may be provided above a sensor unit SU with respect to the wiring pattern 200b, and a second wiring pattern 220 may be provided below the sensor unit SU. The first wiring pattern 210 may include a 1-1 wiring pattern 221a extending in one direction in the figure and a 1-2 wiring pattern 231a extending in another direction intersecting the one direction. For example, the one direction may be a longitudinal direction, and the another direction may be a lateral direction.

[0092] The second wiring pattern 220 may include a 2-1 wiring pattern 221b extending in one direction in the figure and a 2-2 wiring pattern 231b extending in the another direction.

[0093] A wiring pattern group may be formed by bringing a plurality of the first wiring patterns 221a, 231a and the second wiring patterns 221b, 231b relatively close to each other and aggregating them. For example, as Figure 5 shown, five wiring patterns may form a wiring pattern group. However, it is not limited thereto, and a wiring pattern group may also be formed by aggregating various numbers of wiring patterns.

[0094] The first wiring patterns 221a, 231a and the second wiring patterns 221b, 231b may be connected to wiring pads PAD1, PAD2 in a pad region, respectively. That is, the first wiring pattern 210 may be connected to a first wiring pad PAD1 in the pad region, and the second wiring pattern 220 may be connected to a second wiring pad PAD2 in the pad region.

[0095] Although the wiring pads PAD1, PAD2 are illustrated as being connected together with the wiring patterns forming the wiring pattern group in Figure 5 , actually, they may be independently connected to each wiring pattern.

[0096] The pad region may be provided to overlap the sensor unit SU in a top view.

[0097] A printed circuit board C_FPC may be provided in the pad region. That is, the wiring pads PAD1, PAD2 may be attached to and electrically connected to the printed circuit board C_FPC.

[0098] Referring to Figure 6 , an area where the wiring pattern group of the 1-1 wiring pattern 221a and the wiring pattern group of the 1-2 wiring pattern 231a intersect may become a coordinate electrode portion CE that is a basic unit for position recognition. Similarly, an area where the wiring pattern group of the 2-1 wiring pattern 22b and the wiring pattern group of the 2-2 wiring pattern 231b intersect may become a coordinate electrode portion CE that is a basic unit for position recognition.

[0099] The first wiring pattern 221a and the second wiring pattern 231a can be formed by different wiring layers from each other. Thus, as Figure 5 shown, the first wiring pattern 221a and the second wiring pattern 231a are insulated in the overlapping region and can prevent short circuit. Similarly, the first wiring pattern 221b and the second wiring pattern 231b can be formed by different wiring layers from each other. Thus, as Figure 5 shown, the first wiring pattern 221b and the second wiring pattern 231b are insulated in the overlapping region and can prevent short circuit.

[0100] For example, the first wiring pattern 221a and the second wiring pattern 221b can be disposed on the first wiring layer, and the first wiring pattern 231a and the second wiring pattern 231b can be disposed on a second wiring layer different from the first wiring layer. In several embodiments, for example, the first wiring pattern 221a and the second wiring pattern 231b can be disposed on the first wiring layer, and the first wiring pattern 231a and the second wiring pattern 221b can be disposed on a second wiring layer different from the first wiring layer.

[0101] The pad portion PAD can be formed by the first wiring layer and / or the second wiring layer.

[0102] Referring to Figure 7 and Figure 8 , there can be a plurality of first wiring pads PAD1, and there can be a plurality of second wiring pads PAD2. The plurality of first wiring pads PAD1 can be connected to the plurality of first wiring patterns 221a, 231a, and the plurality of second wiring pads PAD2 can be connected to the plurality of second wiring patterns 221b, 231b. A wiring pad group can be formed by bringing the plurality of wiring pads PAD1, PAD2 relatively close and aggregating them. For example, five wiring pads can form a wiring pad group. However, it is not limited thereto, and a wiring pad group can also be formed by aggregating various numbers of wiring pads.

[0103] The printed circuit board C_FPC can include a base substrate SUB and a plurality of circuit pads C_PAD1, C_PAD2 disposed on the base substrate SUB. The plurality of circuit pads C_PAD1, C_PAD2 can be electrically connected to the corresponding wiring pads PAD1, PAD2 in the thickness direction.

[0104] The circuit pads C_PAD1, C_PAD2 can contain a conductive material. As examples of the conductive material, copper, aluminum, silver, gold, titanium, etc. can be cited, but it is not limited thereto.

[0105] As Figure 7As shown, the wiring pads PAD1 and PAD2 can be arranged to overlap with the C_FPC part of the printed circuit board.

[0106] The top view shape of the printed circuit board C_FPC can be a rectangular shape. When a rectangular shape is applied as the top view shape of the printed circuit board C_FPC, the printed circuit board C_FPC can include a long side extending in the horizontal direction and a short side extending in the vertical direction. However, the top view shape of the printed circuit board C_FPC is not limited to this, and a square, a circle, an ellipse, or other polygons can be applied. Hereinafter, the case where a rectangular shape is applied as the top view shape of the printed circuit board C_FPC will be mainly described.

[0107] As Figure 8 shown, the printed circuit board C_FPC can include a first edge (or first long side) located on the upper side in the top view and a second edge (or second long side) located on the lower side in the top view. The base substrate SUB can have a top view shape substantially the same as the top view contour of the printed circuit board C_FPC. That is, the first edge and the second edge can be directly applied to the base substrate SUB included in the printed circuit board C_FPC.

[0108] The circuit pads C_PAD1 and C_PAD2 can include a first circuit pad C_PAD1 adjacent to the first edge EG1 and a second circuit pad C_PAD2 adjacent to the second edge EG2. The ends of the circuit pads C_PAD1 and C_PAD2 can be aligned with the edges EG1 and EG2 respectively. This is because when the upper side part and the lower side part of the printed circuit board C_FPC in the top view are stamped or cut, the circuit pads C_PAD1 and C_PAD2 are also stamped or cut at the same time, so the ends of the circuit pads C_PAD1 and C_PAD2 can be aligned with the edges EG1 and EG2 of the stamped or cut printed circuit board C_FPC respectively.

[0109] The wiring pads PAD1 and PAD2 can be arranged to overlap with the circuit pads C_PAD1 and C_PAD2 whose ends are aligned with the edges EG1 and EG2 respectively. That is, the wiring pads PAD1 and PAD2 can include a first part arranged to overlap with the circuit pads C_PAD1 and C_PAD2 and a second part not arranged to overlap with the circuit pads C_PAD1 and C_PAD2.

[0110] A conductive substance SR can be further provided on the second part of the wiring pads PAD1 and PAD2. The conductive substance SR can electrically connect the wiring pads PAD1 and PAD2 and the circuit pads C_PAD1 and C_PAD2. That is, the conductive substance SR functions to electrically connect the printed circuit board C_FPC and the wiring pattern part 200.

[0111] The conductive material SR may include a conductive substance. For example, the conductive material SR may be a metal or a metal oxide. More specifically, as examples of the metal, lead, silver, aluminum, etc. may be cited.

[0112] The conductive material SR may be formed on the first part by jet soldering. Jet soldering may be defined as electrically connecting two adjacent parts by dropping or dripping the conductive material SR onto a teaching point.

[0113] In one embodiment, the teaching point may be the first edge EG1 and the second edge EG2 of the printed circuit board C_FPC. That is, when jet soldering the conductive material SR towards the first edge EG1 and the second edge EG2, the conductive material SR physically contacts each of the circuit pads C_PAD1, C_PAD2 aligned with the ends and the edges EG1, EG2 and the wiring pads PAD1, PAD2 overlapping therewith, so that the wiring pads PAD1, PAD2 and the circuit pads C_PAD1, C_PAD2 can be electrically connected.

[0114] That is, with reference to Figure 11 For more specific description, the wiring pads PAD1, PAD2 may be exposed by the first insulating layer 200a. The exposed wiring pads PAD1, PAD2 may be overlapped with the circuit pads C_PAD1, C_PAD2. Further, the exposed wiring pads PAD1, PAD2 may be directly connected to the circuit pads C_PAD1, C_PAD2.

[0115] The directly connected wiring pads PAD1, PAD2 and the circuit pads C_PAD1, C_PAD2 are conductive substances respectively, so they can be electrically connected. However, since the wiring pads PAD1, PAD2 and the circuit pads C_PAD1, C_PAD2 connected to each other are not fixed, the power-on may not be smooth.

[0116] Therefore, as described above, the conductive material SR may be formed with the edges EG1, EG2 as the teaching points, so that the conductive material SR is directly connected to the outer sides P_EG1, P_EG2 of the circuit pads C_PAD1, C_PAD2 and the exposed second parts of the wiring pads PAD1, PAD2. Thus, the wiring pads PAD1, PAD2 and the circuit pads C_PAD1, C_PAD2 are not only physically fixed to each other, but also the power-on between the wiring pads PAD1, PAD2 and the circuit pads C_PAD1, C_PAD2 can be made smooth through the conductive material SR.

[0117] In order to precisely perform the spray welding of the conductive material SR to the reference points, the printed circuit board C_FPC may further include circuit alignment marks C_LM1 and C_LM2, and the wiring pattern portion 200 may further include wiring alignment marks D_LM1 and D_LM2. The circuit alignment marks C_LM1 and C_LM2 may be located, for example, on the outermost sides (the lateral one side and the other side) of the circuit pads C_PAD1 and C_PAD2. The wiring alignment marks D_LM1 and D_LM2 may be located, for example, on the outermost sides (the lateral one side and the other side) of the wiring pads PAD1 and PAD2. That is, the circuit pads C_PAD1 and C_PAD2 may be provided between the circuit alignment marks C_LM1 and C_LM2 located on the lateral one side and the other side, and the wiring pads PAD1 and PAD2 may be provided between the wiring alignment marks D_LM1 and D_LM2 located on the lateral one side and the other side.

[0118] A photographing device such as a camera can be used to photograph and measure the distance between the circuit alignment marks C_LM1 and C_LM2 and the adjacent wiring alignment marks D_LM1 and D_LM2, and for example, the positions at 0.5 times the distance are set as the edges EG1 and EG2 serving as the reference points.

[0119] However, as described in Figure 8 , when punching or cutting the upper and lower sides of the printed circuit board C_FPC in a top view, due to the punching tolerance, the distances d1 and d2 between the circuit alignment marks C_LM1 and C_LM2 and the adjacent edges EG1 and EG2 are different. Thus, after temporarily setting the positions at 0.5 times the distance as the edges EG1 and EG2 serving as the reference points, even if the conductive material SR is spray-welded, the conductive material SR may not be formed adjacent to the edges EG1 and EG2.

[0120] That is, when the distances d1 and d2 between the circuit alignment marks C_LM1 and C_LM2 and the adjacent edges EG1 and EG2 are less than the reference, the conductive material SR may be formed more outside than the edges EG1 and EG2. In this case, a short-circuit defect may occur between the circuit pads C_PAD1 and C_PAD2 of the conductive material SR and the wiring pads PAD1 and PAD2.

[0121] In addition, even when spray-welding is performed based on the circuit pads C_PAD1 and C_PAD2 whose ends are aligned with the edges EG1 and EG2, since the ends of the circuit pads C_PAD1 and C_PAD2 overlap with the overlapping wiring pads PAD1 and PAD2, the ends of the circuit pads C_PAD1 and C_PAD2 may not be recognizable by the naked eye.

[0122] However, the display device 70 of an embodiment may further include circuit dummy pads C_DE1 and C_DE2 whose ends are aligned with the edges EG1 and EG2, respectively, in the same way as the circuit pads C_PAD1 and C_PAD2. The edges EG1 and EG2 can be easily identified by the naked eye by photographing the ends of the circuit dummy pads C_DE1 and C_DE2 using the photographing device. Different from the circuit pads C_PAD1 and C_PAD2, the circuit dummy pads C_DE1 and C_DE2 may be dummy electrodes that are electrically insulated from the wiring pattern portion 200.

[0123] The circuit dummy pads C_DE1 and C_DE2 may be in the shape of lines extending longitudinally.

[0124] There may be a plurality of circuit dummy pads C_DE1 and C_DE2. A circuit pad group formed by the circuit pads C_PAD1 and C_PAD2 may be provided between adjacent circuit dummy pads C_DE1 and C_DE2. In other words, the circuit dummy pads C_DE1 and C_DE2 may be provided between adjacent circuit pad groups. The circuit dummy pads C_DE1 and C_DE2 may include a first circuit dummy pad C_DE1 whose end is aligned with the first edge EG1 and a second circuit dummy pad C_DE2 whose end is aligned with the second edge EG2.

[0125] In one embodiment, the circuit dummy pads C_DE1 and C_DE2 may contain a substance different from that of the circuit pads C_PAD1 and C_PAD2. For example, a substance that can be clearly recognized by the naked eye may be coated or printed on the surfaces of the circuit dummy pads C_DE1 and C_DE2.

[0126] However, it is not limited thereto, and the circuit dummy pads C_DE1 and C_DE2 may also contain the same substance as the circuit pads C_PAD1 and C_PAD2.

[0127] Referring to Figure 9 , the circuit pads C_PAD1 and C_PAD2 may further include an etching pattern IDP that is recessed from the edges EG1 and EG2 toward the sensor unit SU in a top view. Thus, the ends of the circuit pads C_PAD1 and C_PAD2 may be composed of a reference end aligned with the edges EG1 and EG2 and an etching pattern IDP that is recessed from the reference end toward the sensor unit SU.

[0128] Since the conductive substance SR extends further from the region where the etching pattern IDP is provided toward the circuit pads C_PAD1 and C_PAD2, the adhesion between the circuit pads C_PAD1 and C_PAD2 and the wiring pads PAD1 and PAD2 can be further improved.

[0129] As described above, the display device 70 of an embodiment may further include circuit dummy pads C_DE1 and C_DE2 whose ends are aligned with the ends and edges EG1 and EG2 of the circuit pads C_PAD1 and C_PAD2. By using the photographing device to photograph the ends of the circuit dummy pads C_DE1 and C_DE2, the edges EG1 and EG2 can be easily recognized by the naked eye.

[0130] Furthermore, by coating or printing a substance that is easily recognizable by the naked eye on the surfaces of the circuit dummy pads C_DE1 and C_DE2, the visibility of the ends of the circuit dummy pads C_DE1 and C_DE2 can be further increased, and the edges EG1 and EG2 serving as the reference points for spray soldering can be better recognized.

[0131] By adopting this method, the display device 70 of an embodiment can prevent in advance the disconnection between the circuit pads C_PAD1 and C_PAD2 and the wiring pads PAD1 and PAD2 caused by the uneven formation of the solder of the conductive substance SR, that is, the solder is not formed on the edges EG1 and EG2.

[0132] Figure 12 It is a top view of a printed circuit board of another embodiment.

[0133] Refer to Figure 12 This embodiment of the display device is different from the display device in Figure 7 in that the circuit dummy pads C_DE1_1 and C_DE2_1 include portions with different lateral widths.

[0134] More specifically, the circuit dummy pads C_DE1_1 and C_DE2_1 of the printed circuit board C_FPC of this embodiment may include extension portions C_DE1_1b and C_DE2_1b and main body portions C_DE1_1a and C_DE2_1a. The extension portions C_DE1_1b and C_DE2_1b are adjacent to the edges EG1 and EG2, and the main body portions C_DE1_1a and C_DE2_1a are spaced apart from the edges EG1 and EG2. The extension portions C_DE1_1b and C_DE2_1b are located between the main body portions C_DE1_1a and C_DE2_1a and the edges EG1 and EG2. The extension portions C_DE1_1b and C_DE2_1b may meet EG1 and EG2 in a top view.

[0135] For example, the extension portions C_DE1_1b and C_DE2_1b may have a shape in which the lateral width gradually increases as they approach the edges EG1 and EG2. In this case, as shown in Figure 12 the top view shape of the extension portions C_DE1_1b and C_DE2_1b may be trapezoidal. Although in Figure 12It is illustrated that the degree of width increase is constant, but it is not limited thereto. The degree of width increase may also gradually decrease, gradually increase, or randomly change as it approaches the edges EG1 and EG2, but it is not limited thereto.

[0136] Figure 13 It is a top view of a printed circuit board according to another embodiment.

[0137] Referring to Figure 13 , the difference between the display device of this embodiment and the embodiment of Figure 12 is that the top view shapes of the circuit dummy pads C_DE1_2 and C_DE2_2 are applied with semicircular shapes.

[0138] In addition to this, the description is the same as that described in Figure 12 , so the repeated description is omitted below.

[0139] Figure 14 It is a top view of a printed circuit board and a wiring pattern portion according to another embodiment.

[0140] Referring to Figure 14 , the difference from the embodiment of Figure 7 is that no circuit dummy pads are provided on the printed circuit board C_FPC_1, and wiring dummy pads D_DE1 and D_DE2 are further provided in the wiring pattern portion.

[0141] For a more specific description, the display device of this embodiment may further include wiring dummy pads D_DE1 and D_DE2 whose ends are aligned with the ends of the wiring pads PAD1 and PAD2. Different from the wiring pads PAD1 and PAD2, the wiring dummy pads D_DE1 and D_DE2 may be dummy electrodes that are electrically insulated from the printed circuit board C_FPC_1.

[0142] The wiring dummy pads D_DE1 and D_DE2 may be in the shape of lines extending longitudinally.

[0143] There may be multiple wiring dummy pads D_DE1 and D_DE2. A wiring pad group formed by the wiring pads PAD1 and PAD2 may be provided between adjacent wiring dummy pads D_DE1 and D_DE2. In other words, wiring dummy pads D_DE1 and D_DE2 may be provided between adjacent said wiring pad groups. In this embodiment, the wiring dummy pads D_DE1 and D_DE2 may include substances different from those of the wiring pads PAD1 and PAD2. For example, substances that can be easily recognized by the naked eye may be coated or printed on the surfaces of the wiring dummy pads D_DE1 and D_DE2.

[0144] However, it is not limited thereto, and the wiring dummy pads D_DE1 and D_DE2 may also contain the same substances as the wiring pads PAD1 and PAD2.

[0145] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art to which the present invention pertains should be able to understand that the present invention can be implemented in other specific forms without changing the technical idea or essential features of the present invention. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

[0146] Description of Reference Numerals

[0147] 10: Lower panel

[0148] 20: Display panel

[0149] 30: Touch component

[0150] 40: Window

[0151] 60: Bracket

[0152] 70: Display device.

Claims

1. A display device, comprising: A wiring pattern portion, including a wiring pattern and a wiring pad connected to the wiring pattern; A printed circuit board electrically connected to the wiring pattern portion; And A conductive material for electrically connecting the wiring pattern portion and the printed circuit board, The printed circuit board includes: a base substrate; a plurality of circuit pads provided on the base substrate and electrically connected to the wiring pattern through the conductive material; and dummy pads provided between adjacent ones of the circuit pads, The wiring pad includes a first portion overlapping with the circuit pad and a second portion not overlapping with the circuit pad, The conductive material is provided on the second portion and contacts the side surface of the circuit pad, The base substrate includes a first edge on one side, the plurality of circuit pads include a first circuit pad, the dummy pads include a first dummy pad provided between adjacent ones of the first circuit pads, and the side surfaces of the first circuit pad and the first dummy pad are aligned with the first edge.

2. The display device according to claim 1, wherein, The base substrate further includes a second edge on the other side, the other side being the opposite side of the one side, the plurality of circuit pads further include a second circuit pad, the dummy pads include a second dummy pad provided between adjacent ones of the second circuit pads, and the side surfaces of the second circuit pad and the second dummy pad are aligned with the second edge.

3. The display device according to claim 2, wherein, A plurality of the first circuit pads form a first group of circuit pads, there are a plurality of the first groups of circuit pads, and the first dummy pad is located between adjacent ones of the first groups of circuit pads.

4. The display device according to claim 3, wherein, A plurality of the second circuit pads form a second group of circuit pads, there are a plurality of the second groups of circuit pads, and the second dummy pad is located between adjacent ones of the second groups of circuit pads.

5. The display device according to claim 4, wherein, The printed circuit board further includes first circuit alignment marks respectively provided on one side and the other side, and a plurality of the first groups of circuit pads are located between the one side and the other side.

6. The display device according to claim 5, wherein, The printed circuit board further includes second circuit alignment marks respectively provided on one side and the other side, and a plurality of the second groups of circuit pads are located between the one side and the other side.

7. A printed circuit board, comprising: A base substrate; A plurality of circuit pads provided on the base substrate; And Dummy pads provided between adjacent ones of the circuit pads, The material of the dummy pads is different from the material of the circuit pads, The base substrate includes a first edge on one side, the plurality of circuit pads include a first circuit pad, the dummy pads include a first dummy pad provided between adjacent ones of the first circuit pads, and the side surfaces of the first circuit pad and the first dummy pad are aligned with the first edge.

8. The printed circuit board according to claim 7, wherein, The dummy pad further includes a printed layer.

9. A display device, comprising: A wiring pattern portion, including a plurality of wiring patterns, wiring pads connected to the plurality of wiring patterns, and dummy pads provided between adjacent ones of the plurality of wiring patterns; A printed circuit board electrically connected to the wiring pattern portion; And A conductive material for electrically connecting the wiring pattern portion and the printed circuit board, The printed circuit board includes a plurality of circuit pads electrically connected to the wiring pads through the conductive material, The wiring pad includes a first portion overlapping with the circuit pad and a second portion not overlapping with the circuit pad. The conductive material is disposed on the second portion and is in contact with the side surface of the circuit pad. Wherein, the end of the dummy pad is aligned with the end of the wiring pad.

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