Thermal fluid analysis method, thermal fluid analysis device, conversion method, conversion device, and recording medium

Abstract

A thermal fluid analysis method is provided, wherein a physical model (11) is used to calculate the air volume of air discharged from a plurality of discharge holes (140) (step S11), at least one virtual discharge hole corresponding to a grid of a two-dimensional model (21) of a cooling space (200) is set (step S12), and for each of the at least one virtual discharge hole, one or more discharge holes among the plurality of discharge holes (140) are allocated to one virtual discharge hole, and each of the plurality of discharge holes (140) is allocated (step S13), and based on the air volume of air discharged from each of the plurality of discharge holes (140), an equivalent air volume of air discharged from the at least one virtual discharge hole is calculated (step S14), and a physical quantity related to each equivalent air volume is set as an analysis parameter of the two-dimensional model (21) (step S15).

Description

Technical Field

[0001] The present invention relates to a thermal fluid analysis method, a thermal fluid analysis device, a conversion method, a conversion device and a recording medium. Background Art

[0002] Regarding the thermal design of a product for optimizing the temperature distribution or flow velocity distribution in the space around the product, etc., there are many cases where attempts are made to introduce simulations based on three-dimensional models or two-dimensional models from the design stage of the product for the purpose of improving the efficiency of the design or preventing rework. For example, Patent Document 1 discloses a product development support method using simulations based on three-dimensional models.

[0003] (Prior art literature)

[0004] (Patent Document)

[0005] Patent Document 1: Japanese Patent Application Publication No. 2000-348214

[0006] However, when performing thermal design of a product, if a three-dimensional model of a solid is created as in Patent Document 1 to perform thermal fluid analysis on all parts related to the thermal design of the product, it takes time to design the three-dimensional model, and it also takes time to perform calculations using the three-dimensional model. Therefore, there is a problem that it is difficult to perform thermal fluid analysis effectively. Summary of the invention

[0007] The present invention provides a thermal fluid analysis method and the like capable of efficiently performing thermal fluid analysis.

[0008] A thermal fluid analysis method according to one aspect of the present invention analyzes at least one of a temperature distribution and a flow velocity distribution of a space from which air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model. In the thermal fluid analysis method, the air volumes of the air discharged from the plurality of discharge holes are calculated using a physical model including design values ​​related to a fan, a heat exchanger, and a pipe. The heat exchanger adjusts the temperature of the air sent by the fan. The pipe is connected to the plurality of discharge holes. The air whose temperature is adjusted by the heat exchanger passes through the pipe. At least one virtual discharge hole corresponding to a grid of the two-dimensional model or the three-dimensional model of the space is set. For each of the at least one virtual discharge hole, one or more discharge holes among the plurality of discharge holes are assigned to one virtual discharge hole. Based on the air volume of the air discharged from each of the plurality of discharge holes, an equivalent air volume of the air discharged from the at least one virtual discharge hole is calculated. Physical quantities related to each of the equivalent air volumes are set as analysis parameters of the two-dimensional model or the three-dimensional model.

[0009] A recording medium according to one aspect of the present invention is a computer-readable recording medium having recorded thereon a program for causing a computer to execute the above-mentioned thermal fluid analysis method.

[0010] A thermal fluid analysis device according to one aspect of the present invention analyzes at least one of a temperature distribution and a flow velocity distribution of a space where air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model, and comprises: a first calculation unit that calculates the air volume of the air discharged from the plurality of discharge holes using a physical model including design values ​​related to a fan, a heat exchanger, and a pipe, the heat exchanger adjusting the temperature of the air sent by the fan, the pipe connected to the plurality of discharge holes, and the air whose temperature is adjusted by the heat exchanger passes through the pipe; and a first setting unit that sets the air volume of the air discharged from the plurality of discharge holes using a physical model including design values ​​related to the fan, the heat exchanger, and the pipe. a second calculation unit, which calculates an equivalent air volume of air discharged from each of the plurality of exhaust holes according to the air volume of air discharged from each of the plurality of exhaust holes; and a second setting unit, which sets physical quantities related to each of the equivalent air volumes as analysis parameters of the two-dimensional model or the three-dimensional model.

[0011] One aspect of the present invention relates to a conversion method, in order to analyze at least one of a temperature distribution and a flow velocity distribution of a space from which air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model, by converting analysis parameters of a physical model including design values ​​related to a fan, a heat exchanger, and a pipe into analysis parameters of the two-dimensional model or the three-dimensional model, wherein the heat exchanger adjusts the temperature of air sent by the fan, and the pipe is connected to the plurality of discharge holes, and the air whose temperature is adjusted by the heat exchanger passes through the pipe. In the conversion method, for each of at least one virtual discharge hole corresponding to a mesh of the two-dimensional model or the three-dimensional model of the space, one or more discharge holes among the plurality of discharge holes are allocated to one virtual discharge hole, and an equivalent air volume of air discharged from each of the at least one virtual discharge hole is calculated based on the air volume of air discharged from each of the plurality of discharge holes calculated using the physical model, and a physical quantity related to each of the equivalent air volume is set as an analysis parameter of the two-dimensional model or the three-dimensional model.

[0012] A recording medium according to one aspect of the present invention is a computer-readable recording medium having recorded thereon a program for causing a computer to execute the above-mentioned conversion method.

[0013] A conversion device according to one aspect of the present invention converts analysis parameters of a physical model including design values ​​related to a fan, a heat exchanger, and a pipe into analysis parameters of the two-dimensional model or the three-dimensional model in order to analyze at least one of a temperature distribution and a flow velocity distribution of a space from which air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model, wherein the heat exchanger adjusts the temperature of the air sent by the fan, and the pipe is connected to the plurality of discharge holes, and the air whose temperature is adjusted by the heat exchanger passes through the pipe, the conversion device comprising: an allocating unit that allocates each of the plurality of discharge holes in a manner that allocates one or more discharge holes among the plurality of discharge holes to one virtual discharge hole for each of at least one virtual discharge hole corresponding to a mesh of the two-dimensional model or the three-dimensional model of the space; a calculating unit that calculates equivalent air volumes of the air discharged from the at least one virtual discharge hole, based on air volumes of the air discharged from the plurality of discharge holes, calculated using the physical model; and a setting unit that sets physical quantities related to each of the equivalent air volumes as analysis parameters of the two-dimensional model or the three-dimensional model.

[0014] A thermal fluid analysis device according to one aspect of the present invention analyzes at least one of a temperature distribution and a flow velocity distribution of a space where air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model, and the thermal fluid analysis device comprises: a processor; and a memory, wherein the processor uses the memory to perform the following processing, namely, using a physical model including design values ​​related to a fan, a heat exchanger, and a pipe to calculate the air volume of the air discharged from the plurality of discharge holes, the heat exchanger adjusts the temperature of the air sent by the fan, the pipe is connected to the plurality of discharge holes, and the heat exchanger adjusts the air volume of the air discharged from the plurality of discharge holes. The air with a certain temperature passes through the pipe, and at least one virtual exhaust hole corresponding to the grid of the two-dimensional model or the three-dimensional model of the space is set. For each of the at least one virtual exhaust hole, one or more exhaust holes among the multiple exhaust holes are allocated to one virtual exhaust hole. According to the air volume of air discharged from each of the multiple exhaust holes, the equivalent air volume of the air discharged from the at least one virtual exhaust hole is calculated, and the physical quantities related to the respective equivalent air volumes are set as analysis parameters of the two-dimensional model or the three-dimensional model.

[0015] A conversion device according to one aspect of the present invention converts analysis parameters of a physical model including design values ​​related to a fan, a heat exchanger, and a pipe into analysis parameters of the two-dimensional model or the three-dimensional model in order to analyze at least one of a temperature distribution and a flow velocity distribution of a space from which air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model, wherein the heat exchanger adjusts the temperature of the air sent by the fan, and the pipe is connected to the plurality of discharge holes, and the air whose temperature is adjusted by the heat exchanger passes through the pipe, the conversion device comprising: a processor; and a memory, wherein the processor uses the memory to perform the following processing, namely, for each of at least one virtual discharge hole corresponding to a mesh of the two-dimensional model or the three-dimensional model of the space, assigning one or more discharge holes among the plurality of discharge holes to one virtual discharge hole, calculating equivalent air volumes of the air discharged from the at least one virtual discharge hole based on air volumes of the air discharged from the plurality of discharge holes calculated using the physical model, and setting physical quantities related to each of the equivalent air volumes as analysis parameters of the two-dimensional model or the three-dimensional model.

[0016] According to the thermal fluid analysis method and the like according to one aspect of the present invention, thermal fluid analysis can be performed efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic cross-sectional view of a showcase according to the embodiment.

[0018] Figure 2 It is a structural diagram of a thermal fluid analysis device according to an embodiment.

[0019] Figure 3 This is a diagram showing an example of a cooling space represented by a two-dimensional model according to the embodiment.

[0020] Figure 4 This is a flowchart showing an example of the operation of the thermal fluid analysis device according to the embodiment.

[0021] Figure 5 It is a diagram for explaining the operation of the thermal fluid analysis device according to the embodiment in detail.

[0022] Figure 6 It is a diagram showing an example of a GUI of the thermal fluid analysis device according to the embodiment.

[0023] Figure 7 It is a diagram showing an example of a GUI of the thermal fluid analysis device according to the embodiment.

[0024] Figure 8It is a diagram showing an example of a GUI of the thermal fluid analysis device according to the embodiment.

[0025] Fig. 9 It is a configuration diagram of a thermal fluid analysis system according to another embodiment.

[0026] Fig.10 This is a sequence diagram showing an example of the operation of the thermal fluid analysis system according to another embodiment. DETAILED DESCRIPTION

[0027] Hereinafter, the embodiments will be described with reference to the accompanying drawings. The embodiments described below all show general or specific examples. The numerical values, shapes, materials, constituent elements, configuration positions of constituent elements, connection forms, steps, order of steps, etc. shown in the following embodiments are examples and do not limit the purpose of the present invention. Furthermore, constituent elements that are not recorded in the implementation scheme showing the highest level concept among the constituent elements of the following embodiments are described as arbitrary constituent elements.

[0028] Furthermore, each of the drawings is a schematic diagram and is not necessarily a strictly illustrated diagram. Furthermore, in each of the drawings, substantially the same structure is given the same reference numeral, and repeated description may be omitted or simplified.

[0029] (Implementation Method)

[0030] First, for a product to which the thermal fluid analysis device 1 according to the embodiment is applied, Figure 1 Provide explanation.

[0031] Figure 1 It is a schematic cross-sectional view of a showcase 100 according to the embodiment.

[0032] The thermal fluid analysis device 1 is a device that analyzes at least one of the temperature distribution and the flow velocity distribution in a specific space using a two-dimensional model or a three-dimensional model for the thermal design of a product. Moreover, the thermal fluid analysis device 1 has a feature that, when analyzing at least one of the temperature distribution and the flow velocity distribution in a specific space, not only the two-dimensional model or the three-dimensional model but also the physical model is used. In the present embodiment, the thermal fluid analysis device 1 is set in a supermarket or a convenience store, etc., and is suitable for a food display cabinet (hereinafter referred to as the display cabinet 100) for cooling food, etc. The thermal fluid analysis device 1 analyzes the temperature distribution of the periphery of the space cooled by the display cabinet 100 (referred to as the cooling space 200) using a two-dimensional model for the thermal design of the display cabinet 100. Moreover, similar to the analysis of the temperature distribution, the flow velocity distribution can also be analyzed, and therefore, the description of the flow velocity distribution is omitted below. Furthermore, for the display cabinet 100, if from Figure 1In the cross section viewed from the front of the drawing, the temperature distribution basically has the same tendency in any cross section of the cooling space 200, and in view of the convenience of processing the analysis results (for example, there is no labor and time to rotate the viewpoint like the three-dimensional analysis results), the following description focuses on the two-dimensional model and the description of the three-dimensional model is omitted. In addition, the thermal fluid analysis device 1 is not limited to the showcase 100, but can also be used for thermal design of room air conditioners, car air conditioners, refrigerators, etc.

[0033] The showcase 100 is provided with a pipe 110, a heat exchanger 120, a fan 130, a plurality of discharge holes 140, a plurality of shelves 150, a top discharge port 170, and a suction port 180 in order to cool the portion of the cooling space 200 where the food exists. For example, food is placed on the plurality of shelves 150. For example, between the plurality of shelves 150, such as Figure 1 As shown, a top outlet 170 and a plurality of outlet holes 140 are provided, and the cooled air is discharged from the top outlet 170 and the plurality of outlet holes 140. Here, the plurality of outlet holes 140 are schematically shown as black dots. The outlet holes 140 are, for example, elongated holes of 4 mm. For example, the top outlet 170, Figure 1 The size of the left-right direction is about 50 mm to about 100 mm, and the size of the depth direction is about the same as the size of the depth direction of the cooling space 200. The fan 130 sucks the air of the cooling space 200 through the suction port 180 and sends the air to the pipe 110. The heat exchanger 120 adjusts the temperature of the air sent by the fan 130, for example, cools the air. Here, the heat exchanger 120 is provided on the side where the air sucked by the fan 130 is discharged, and the heat exchanger 120 cools the air entering from the fan 130. The pipe 110 is connected to a plurality of discharge holes 140, and is a pipe through which the air whose temperature is adjusted by the heat exchanger 120 passes. Specifically, the holes provided on the side of the pipe 110 are connected to the discharge holes 140, and the cooled air passing through the pipe 110 is discharged from the discharge holes 140. In addition, the cooled air is also discharged from the top discharge port 170 located at the end of the pipe 110. The wind discharged from the top outlet 170 can make the front ( Figure 1The temperature of the passage part for the movement of shoppers, such as the left side of the display cabinet 100, is different from the temperature of the cooling part in the display cabinet 100. In other words, the wind discharged from the top outlet 170 forms a wall, which can prevent the cold air from leaking to the passage part. In addition, the top outlet 170 and the plurality of outlet holes 140 are described separately below, but the top outlet 170 can also be set as a type of outlet hole 140. The cooling space 200 is a space where air is discharged from the top outlet 170 and the plurality of outlet holes 140. The air circulates from the fan 130, the heat exchanger 120, the pipe 110, the outflow hole 140 and the top outlet 170, the cooling space 200, and the suction port 180 to the fan 130 again, and the part where the food exists can be kept at a low temperature. In addition, the pipe 110 does not necessarily need to be a tube, and there is no particular limitation if it is a space surrounded by a shell or the like, and the air whose temperature is adjusted by the heat exchanger 120 passes through.

[0034] In the cooling space 200, the periphery of the plurality of shelves 150 needs to be cooled to a constant temperature, and for this, the passage portion in front of the showcase 100, for example, for movement of shoppers, needs not to be cooled. This is because if cold air leaks into the passage portion, the cold air recovery efficiency of the fan 130 decreases, and there is a possibility that shoppers feel uncomfortable. Therefore, it is necessary to appropriately design the capacity of the fan 130, the capacity of the heat exchanger 120, the number of positions of the plurality of exhaust holes 140, and the positions of the plurality of shelves 150. For such an appropriate design, the temperature distribution of the cooling space 200 is simulated, so that the efficiency of the design can be achieved.

[0035] Furthermore, the showcase 100 can be customized in such a way that, for example, the positions (heights) of the plurality of shelves 150 can be freely changed. Therefore, the design can be changed on site according to the application, and therefore, it is necessary to be able to analyze the temperature distribution of the cooling space 200 after the design change in a short time on site. Although described in detail later, according to the thermal fluid analysis device 1, such thermal fluid analysis can be performed efficiently.

[0036] Next, regarding the structure of the thermal fluid analysis device 1 according to the embodiment, Figure 2 Provide explanation.

[0037] Figure 2 The thermal fluid analysis device 1 includes a physical model 11, a first calculation unit 12, an input unit 13, a two-dimensional model 21, a first setting unit 22, an analysis unit 23, a display unit 24, an allocation unit 31, a second calculation unit 32, and a second setting unit 33.

[0038] The thermal fluid analysis device 1 is, for example, a computer including a processor, a memory, and a user interface. The memory is a ROM, RAM, etc., which can store programs executed by the processor. In addition, the thermal fluid analysis device 1 can also have a memory, and can also have multiple memories, and one or more memories are collectively referred to as a memory. The physical model 11 and the two-dimensional model 21 are stored in the memory. The user interface includes an input device such as a keyboard, a mouse or a touch screen, and an output device such as a display, which can realize a GUI (Graphical User Interface). Regarding the GUI, in the following Figures 6 to 8 The input unit 13 and the display unit 24 are examples of a user interface. For example, the processor operates according to the program to realize the first calculation unit 12, the first setting unit 22, the analysis unit 23, the allocation unit 31, the second calculation unit 32, and the second setting unit 33.

[0039] The physical model 11 includes design values ​​for the fan 130, the heat exchanger 120 for adjusting the temperature of the air sent by the fan 130, and the pipe 110 connected to the plurality of discharge holes 140 and through which the air whose temperature is adjusted by the heat exchanger 120 passes. The physical model 11 also includes design values ​​for the top discharge port 170 and the suction port 180. The physical model 11 is a model that describes the physical phenomenon of heat, control, or mechanism by physical formulas, for example.

[0040] The input unit 13 is a user interface capable of inputting the design values, and the physical model 11 is constructed using the design values ​​input to the input unit 13 .

[0041] The first calculation unit 12 is a functional component for performing simulation based on the physical model 11, for example, using a simulation method with high-speed calculation capability called 1D-CAE (Computer Aided Engineering). 1D-CAE is a simulation method useful in the design stage of a product that requires rapid analysis results. 1D-CAE is a simulation method that uses the physical model 11, for example. 1D-CAE can immediately calculate the desired physical quantity by digitizing the physical phenomena of heat, control, or mechanism and inserting them into a physical formula, thereby satisfying the immediacy required for the design of the showcase 100 as described above.

[0042] However, when 1D-CAE is used to analyze all phenomena including the temperature distribution of the cooling space 200 of the showcase 100 and the movement of the hot air itself, the number of elements required for 1D-CAE is huge, and it may not be able to meet the real-time requirements.

[0043] Therefore, the first calculation unit 12 does not simulate the temperature distribution of the cooling space 200 itself, which 1D-CAE is not good at. On the other hand, the first calculation unit 12 uses the physical model 11 to calculate the air volume of the air discharged from the plurality of discharge holes 140. In addition, the first calculation unit 12 uses the physical model 11 to calculate the air volume of the air discharged from the top discharge port 170 and the air volume of the air sucked into the suction port 180. The operation of the first calculation unit 12 will be described later. Figure 4 as well as Figure 5 Detailed description is given in .

[0044] The two-dimensional model 21 is a model that divides a two-dimensional space into a finite number of elements (grids). Figure 3 It is shown that the cooling space 200 can be represented by a mesh of a two-dimensional model 21 .

[0045] Figure 3 This is a diagram showing an example of a cooling space 200 represented by a two-dimensional model 21 according to an embodiment. For example, the grid is a square with a side length of 16 mm, and the number of grids is 96×96. The size, shape, and number of grids are not limited to these, and are appropriately set according to the target space, etc.

[0046] The first setting unit 22 is a functional component for setting at least one virtual exhaust hole corresponding to the grid of the two-dimensional model 21 of the cooling space 200. In addition, the first setting unit 22 sets a virtual top exhaust port and a virtual suction port corresponding to the grid of the two-dimensional model 21 of the cooling space 200. In addition, the virtual top exhaust port can also be set as a type of virtual exhaust hole. The operation of the first setting unit 22 will be described later. Figure 4 as well as Figure 5 Detailed description is given in .

[0047] The analysis unit 23 is a functional component for performing simulation based on the two-dimensional model 21, for example, CAE (referred to as 2D-CAE) using the difference method. 2D-CAE can analyze the phenomenon of movement of the hot air itself, such as the temperature distribution of the cooling space 200 of the showcase 100, in a shorter time than 1D-CAE. It is known that the behavior of the thermal fluid can be expressed by the Navier-Stokes equation shown in the following equation 1 and the continuous equation shown in equation 2, and in 2D-CAE, the solutions of these equations are obtained.

[0048] (Equation 1)

[0049]

[0050] (Equation 2)

[0051]

[0052] Here, v is the velocity vector, p is the pressure, ρ is the air density, and g is the gravity.

[0053] The display unit 24 is a user interface capable of displaying the analysis result of the analysis unit 23. For example, a GUI window, menu, icon, check box, or numeric input box may be displayed on the display unit 24.

[0054] The allocating unit 31 allocates each of the plurality of discharge holes 140 in a manner that one or more discharge holes 140 are allocated to each of the at least one virtual discharge hole set by the first setting unit 22. Furthermore, the allocating unit 31 allocates the top discharge port 170 to the virtual top discharge port and allocates the suction port 180 to the virtual suction port.

[0055] The second calculation unit 32 calculates the equivalent volume of air discharged from at least one virtual discharge hole based on the volume of air discharged from each of the plurality of discharge holes 140. Furthermore, the second calculation unit 32 calculates the equivalent volume of air discharged from the virtual top discharge port based on the volume of air discharged from the top discharge port 170, and calculates the equivalent volume of air sucked into the virtual suction port based on the volume of air sucked into the suction port 180.

[0056] The second setting unit 33 sets the physical quantities related to the respective equivalent air volumes calculated by the second calculating unit 32 as analysis parameters of the two-dimensional model 21 .

[0057] The allocating unit 31, the second calculating unit 32, and the second setting unit 33 are functional components for converting the analysis parameters of the physical model 11 into the analysis parameters of the two-dimensional model 21 in order to analyze the temperature distribution of the cooling space 200 by the two-dimensional model 21. Figure 4 as well as Figure 5 Provide detailed explanation.

[0058] Next, regarding the operation of the thermal fluid analysis device 1, use Figure 4 as well as Figure 5 Provide explanation.

[0059] Figure 4 This is a flowchart showing an example of the operation of the thermal fluid analysis device 1 according to the embodiment.

[0060] Figure 5 Detailed description of the operation of the thermal fluid analysis device 1 according to the embodiment. Figure 5 A schematic diagram of the physical model 11 is shown on the right side, and a schematic diagram of the two-dimensional model 21 is shown on the left side.

[0061] First, the first calculation unit 12 calculates the air volume of the air discharged from each of the plurality of discharge holes 140 using the physical model 11 (step S11). The air volume of the air discharged from each of the plurality of discharge holes 140 changes according to the pressure difference (PQ characteristic) before and after the fan 130 as the design value of the fan 130, the pressure loss of the heat exchanger 120 as the design value of the heat exchanger 120, the pressure loss of the pipe 110 as the design value of the pipe 110 and the shape of the pipe 110, and the size, position and number of the plurality of discharge holes 140. In other words, the physical phenomenon of the air volume discharged from each of the plurality of discharge holes 140 can be described as a physical formula with these design values ​​as variables. The physical model 11 becomes a physical formula including these design values. That is, the first calculation unit 12 can easily calculate the air volume of the air discharged from each of the plurality of discharge holes 140 based on these design values. Moreover, the air volume of the air discharged from the top discharge port 170 and the air volume of the air sucked into the suction port 180 can also be easily calculated.

[0062] Next, the first setting unit 22 sets at least one virtual exhaust hole corresponding to the grid of the two-dimensional model 21 of the cooling space 200 (step S12). The first setting unit 22 sets the grid on the two-dimensional model 21 corresponding to the position of each of the plurality of exhaust holes 140 set in the showcase 100 as at least one virtual exhaust hole. Moreover, the first setting unit 22 sets at least one virtual exhaust hole, which means obtaining information showing at least one virtual exhaust hole. Similarly, the first setting unit 22 sets the grid on the two-dimensional model 21 corresponding to the position of the top exhaust port 170 set in the showcase 100 as a virtual top exhaust port, and sets the grid on the two-dimensional model 21 corresponding to the suction port 180 as a virtual suction port. Figure 5 It is shown that the first setting unit 22 sets specific grids of the two-dimensional model 21 as a plurality of virtual discharge holes 241, 242, 243, 244 and 245, a virtual top discharge hole 270, and a virtual suction port 280, for example. And, for example, at least one virtual discharge hole is set to correspond to the area divided by the partition (a plurality of shelves 150) set in the cooling space 200. In the two-dimensional model 21, the plurality of shelves 150 are represented as virtual shelves 251, 252, 253 and 254. The grids on the two-dimensional model 21 corresponding to the area divided by the plurality of shelves 150 are the grids between the virtual shelf 251 and the virtual shelf 252, the grids between the virtual shelf 252 and the virtual shelf 253, the grids between the virtual shelf 253 and the virtual shelf 254, and the grids between the virtual shelf 254 and the virtual bottom corresponding to the bottom of the food display part of the display cabinet. These meshes of the two-dimensional model 21 are set as a plurality of virtual discharge holes 241 , 242 , 243 , 244 , and 245 .

[0063] Next, the allocating unit 31 allocates each of the plurality of discharge holes 140 in a manner that one or more discharge holes 140 are allocated to each of the at least one virtual discharge holes (step S13). Specifically, the allocating unit 31 allocates each of the plurality of discharge holes 140 in a manner that two or more discharge holes 140 are allocated to each of the at least one virtual discharge holes. Similarly, the allocating unit 31 allocates the top discharge port 170 to the virtual top discharge port 270 and allocates the suction port 180 to the virtual suction port 280.

[0064] like Figure 5 As shown, for example, in the showcase 100, discharge holes 141a, 141b, 142a, 142b, 142c, 143a, 143b, 143c, 144a, 144b, 145a, and 145b are set as the plurality of discharge holes 140. The discharge holes 141a and 141b are respectively set at positions close to each other (for example, at intervals of 1 to 2 mm). The discharge holes 142a, 142b, and 142c, the discharge holes 143a, 143b, and 143c, the discharge holes 144a and 144b, and the discharge holes 145a and 145b are also respectively set at positions close to each other. The allocation unit 31 allocates two discharge holes 141a and 141b among the plurality of discharge holes 140 to one virtual discharge hole 241. Similarly, the allocating unit 31 allocates three discharge holes 142a, 142b and 142c to one virtual discharge hole 242, allocates three discharge holes 143a, 143b and 143c to one virtual discharge hole 243, allocates two discharge holes 144a and 144b to one virtual discharge hole 244, and allocates two discharge holes 145a and 145b to one virtual discharge hole 245.

[0065] Furthermore, one discharge hole 140 can be assigned to one virtual discharge hole. However, for example, in the present embodiment, the length of one discharge hole 140 is 4 mm, and the grid is a rectangular size of 16 mm. In the case of assigning one discharge hole 140 to one virtual discharge hole, the size of the grid around the portion corresponding to the plurality of discharge holes 140 on the two-dimensional model 21 needs to be reduced to, for example, a rectangular size of 4 mm. The more complex the design of the grid is and the smaller the size of the grid is, the more time is required for the design of the two-dimensional model 21, and the more time is required for the calculation using the two-dimensional model 21. On the other hand, for example, two or three discharge holes 140 set at positions close to each other are set in the showcase 100 in a manner such that they are within the range of a rectangular size of 16 mm, which is the size of the grid. Therefore, the two or three discharge holes 140 set at positions close to each other can be collectively regarded as one virtual discharge hole on the two-dimensional model 21. According to this, the time required for the design of the two-dimensional model 21 and the time required for the calculation using the two-dimensional model 21 can be reduced. Furthermore, since all of the four discharge holes 144a, 144b, 145a, and 145b are not within the range of the rectangle with a side length of 16 mm, which is the size of the grid, the discharge holes 144a and 144b are assigned to one virtual discharge hole 244, and the discharge holes 145a and 145b are assigned to one virtual discharge hole 245. Furthermore, one discharge hole 140 may be assigned to one virtual discharge hole.

[0066] Next, the second calculation unit 32 calculates the equivalent air volume of air discharged from at least one virtual discharge hole (here, virtual discharge holes 241 to 245) based on the air volume of air discharged from each of the plurality of discharge holes 140 calculated by the first calculation unit 12 (step S14). For example, if the virtual discharge hole 241 is described with attention, the second calculation unit 32 calculates the equivalent air volume of air discharged from the virtual discharge hole 241 based on the air volume of air discharged from each of the discharge holes 141a and 141b allocated to the virtual discharge hole 241. Specifically, the second calculation unit 32 calculates the sum of the air volume of air discharged from the discharge hole 141a and the air volume of air discharged from the discharge hole 141b as the equivalent air volume of air discharged from the virtual discharge hole 241. In addition, the calculation method of the equivalent air volume may not be such a calculation method based on a simple sum, but may be appropriately selected according to the situation. Similarly, the equivalent air volume of air discharged from the other virtual discharge holes 242 to 245 is calculated based on the air volume of air discharged from the discharge hole 140 allocated to each of the virtual discharge holes 242 to 245. Also, similarly, the equivalent air volume of air discharged from the virtual top discharge port 270 is calculated based on the air volume of air discharged from the top discharge port 170, and the equivalent air volume of air sucked into the virtual suction port 280 is calculated based on the air volume of air sucked into the suction port 180.

[0067] Furthermore, the second setting unit 33 sets the physical quantities related to the respective equivalent air volumes calculated by the second calculation unit 32 as analysis parameters of the two-dimensional model 21 (step S15). Specifically, the second setting unit 33 outputs the physical quantities related to the respective equivalent air volumes calculated by the second calculation unit 32 to the two-dimensional model 21. Thus, even if virtual components corresponding to the pipes 110, the heat exchangers 120, the fans 130, etc. are not formed on the two-dimensional model 21, the air volumes of the air discharged from the plurality of discharge holes 140 by the pipes 110, the heat exchangers 120, the fans 130, etc., the air volumes of the air discharged from the top discharge holes 170, and the air volumes of the air sucked into the suction holes 180 can be reproduced in the two-dimensional model 21. In other words, it is not necessary to prepare the two-dimensional model 21 for all the parts related to the thermal design of the product, but it is sufficient to prepare the two-dimensional model 21 for the cooling space 200, and to establish correspondence between the virtual discharge holes (grids) and the like of the two-dimensional model 21 and the equivalent air volumes calculated by the physical model 11.

[0068] As described above, according to the thermal fluid analysis device 1 , the analysis parameters of the physical model 11 can be converted into the analysis parameters of the two-dimensional model 21 , and the thermal fluid analysis can be performed efficiently.

[0069] Next, for the GUI for performing simulation using the thermal fluid analysis device 1, Figures 6 to 8 Provide explanation.

[0070] Figures 6 to 8 It is a diagram showing an example of a GUI of the thermal fluid analysis device 1 according to the embodiment.

[0071] Figure 6 This is a screen for inputting the position and number of the discharge holes 140 , the position and size of the rack 150 , and the position for monitoring the temperature distribution of the cooling space 200 .

[0072] For example, by operating the check box in the portion labeled "shelf" in the screen, the number of shelves 150 set in the showcase 100 can be set to a desired number, and by inputting numerical values ​​in the numerical input boxes labeled "height" and "depth" in the portion, the position and size of the shelves 150 set in the showcase 100 can be set to a desired position and size. In other words, the temperature distribution of the cooling space 200 can be analyzed when the conditions of the number, position, and size of the shelves 150 are changed to various conditions.

[0073] For example, the check boxes of the portion described as "slit" in the screen are basically checked in correspondence with the check boxes of the portion described as "rack". Here, the first section of the portion described as "slit" is explained with attention. For example, the check boxes of the first section of the check boxes of the portion described as "rack" correspond to the check boxes of the first section of the check boxes of the portion described as "slit". The numerical input box of the first section of "slit" in the screen is used to input the position and number of discharge holes 140 set between the rack 150 corresponding to the "rack" of the first section and the rack 150 corresponding to the "rack" of the second section. For example, the upper limit that can be input to the numerical input box of the first section of "slit" is determined according to the position of the rack 150 corresponding to the "rack" of the first section and the rack 150 corresponding to the "rack" of the second section.

[0074] For example, by operating the check box in the portion labeled "Temperature Monitoring Point" in the screen, the number of monitoring points for the temperature distribution of the cooling space 200 can be set to the desired number, and by inputting numerical values ​​into the numerical input boxes labeled (y) and (x) in the portion, it is possible to set which portion of the cooling space 200 is to be monitored.

[0075] By inputting various values ​​into the screen, for example, the virtual cooling space 200 is automatically described in the two-dimensional model 21, as shown in FIG. Figure 7 Display as shown.

[0076] Figure 7 The virtual cooling space 200 image created on the two-dimensional model 21 is, for example, Figure 6 The screen shown is created by inputting numerical values, etc.

[0077] Through Figure 6 By inputting the values ​​of the first to fourth segments of the "shelf" set in the 2D model 21, virtual shelves 251 to 254 are created on the two-dimensional model 21. Figure 6 By inputting the values ​​of the first to fourth segments of the "slit" set in , virtual discharge holes 241 to 245 are created on the two-dimensional model 21. For example, Figure 6 In the example, in response to the input of 4 into the numerical input box of the "Number" of the fourth section of "Slit", two virtual discharge holes 244 and 245 are created on the two-dimensional model 21. This is because the number of discharge holes 140 that can be assigned to one virtual discharge hole (grid) is determined based on the predetermined size of the grid of the two-dimensional model 21 and the predetermined size of the discharge holes 140 of the showcase 100, and it is determined that four discharge holes 140 cannot be assigned to one virtual discharge hole. For example, this determination is automatically made. That is, as long as Figure 6 The desired number of the discharge holes 140 is inputted in the screen shown, and virtual discharge holes corresponding to the input number of the discharge holes 140 are automatically created by dividing the two-dimensional model 21 into a number such as two virtual discharge holes 244 and 245. Figure 6 By inputting the value of the length of the "top discharge" set in Figure 6 By inputting the numerical value of the length of the “suction port” set in , a virtual suction port 280 is created on the two-dimensional model 21 .

[0078] In the change Figure 6 When entering the value on the screen shown, Figure 7 The shape of the two-dimensional model 21 on the screen shown is automatically changed according to the inputted numerical value. Therefore, through such a GUI, even a designer who does not have specialized knowledge for simulation can easily edit the two-dimensional model 21 by simply inputting numerical values.

[0079] Furthermore, in the virtual cooling space 200, as Figure 6 The temperature monitoring points 1 to 5 set in the figure are shown as points 261 to 265, and the wind speed and air volume of these points are displayed at the bottom of the screen.

[0080] Moreover, by starting to analyze, e.g. Figure 8 The diagram shows the temperature distribution of the cooling space 200 .

[0081] Figure 8 That is, the screen showing the temperature distribution of the cooling space 200 shows how the temperature of each grid changes with the passage of time.

[0082] For example, the two-dimensional model 21 is a transient analysis model, and the analysis unit 23 calculates the difference between the time steps of the physical quantity involved in the analysis result, and ends the analysis when the calculated difference becomes less than a specified value. In other words, when the temperature in a specific grid or the average value of the temperature in multiple grids does not change after a certain amount of time, the analysis ends. In addition, the designer can also view Figure 8 The analysis can be ended manually when sufficient results are obtained, or automatically when a certain period of time has passed, for example, while the screen shown is displayed.

[0083] Moreover, you can also Figures 6 to 8 The screens shown are arranged and displayed as one screen. By displaying the screen as one screen, the designer can check the shape on the two-dimensional model 21 that changes according to the inputted numerical value, or check the analysis result at that time.

[0084] Furthermore, the present invention can be realized not only as the thermal fluid analysis device 1 but also as a thermal fluid analysis method including steps (processes) performed by the components constituting the thermal fluid analysis device 1 .

[0085] Specifically, the thermal fluid analysis method is a thermal fluid analysis method that uses a two-dimensional model 21 or a three-dimensional model to analyze at least one of the temperature distribution and the flow rate distribution of the space (cooling space 200) where air is discharged from the plurality of discharge holes 140. Figure 4 The thermal fluid analysis method is shown, using a physical model 11 including design values ​​related to a fan 130, a heat exchanger 120 for adjusting the temperature of air sent by the fan 130, and a pipe 110 connected to a plurality of exhaust holes 140 and through which the air whose temperature is adjusted by the heat exchanger 120 passes, to calculate the air volume of air discharged from the plurality of exhaust holes 140 respectively (step S11), setting at least one virtual exhaust hole corresponding to a grid of a two-dimensional model 21 or a three-dimensional model of a cooling space 200 (step S12), for each of the at least one virtual exhaust hole, allocating each of the plurality of exhaust holes 140 in a manner of allocating one or more exhaust holes among the plurality of exhaust holes 140 to one virtual exhaust hole (step S13), calculating the equivalent air volume of air discharged from the at least one virtual exhaust hole according to the air volume of air discharged from each of the plurality of exhaust holes 140 (step S14), and setting the physical quantity related to each equivalent air volume as an analysis parameter of the two-dimensional model 21 or the three-dimensional model (step S15).

[0086] When analyzing at least one of the temperature distribution and the flow velocity distribution of a space (cooling space 200), it is necessary to calculate the air volume of the air discharged from the plurality of discharge holes 140 to the cooling space 200. However, for this air volume, the two-dimensional model 21 or the three-dimensional model is not used, but the physical model 11 that can describe the physical phenomenon with a physical formula is used. The calculation of this air volume based on the physical model 11 can be performed by simple calculations such as substituting numerical values ​​into the physical formula, so the calculation of this air volume does not require time. In addition, one or more discharge holes 140 are allocated to the virtual discharge holes, and the equivalent air volume is calculated based on the air volume. The physical quantity involved in the equivalent air volume is set as the analysis parameter of the two-dimensional model 21 or the three-dimensional model, so that the analysis parameter of the physical model 11 can be converted into the analysis parameter of the two-dimensional model 21 or the three-dimensional model. Therefore, it is not necessary to prepare a two-dimensional model 21 or a three-dimensional model for the fan 130, the heat exchanger 120, and the piping 110 for thermal fluid analysis, and the time required for the design of the two-dimensional model 21 or the three-dimensional model and the time required for the calculation of the two-dimensional model 21 or the three-dimensional model can be reduced. For example, compared with the case where the fan 130, the heat exchanger 120, and the piping 110 are all designed and calculated using a three-dimensional model, it is possible to achieve a reduction in time of less than 1 / 10 (more specifically, the required 820 minutes is reduced to 33 minutes). In this way, thermal fluid analysis can be performed efficiently, for example, the number of trial productions can be reduced and the number of man-hours can be reduced.

[0087] Furthermore, in the allocation (step S13 ), for each of the at least one virtual discharge hole, allocation may be performed such that two or more discharge holes 140 among the plurality of discharge holes 140 are allocated to one virtual discharge hole.

[0088] For example, when one virtual drain hole is assigned one drain hole 140, the size of the mesh around the portion corresponding to the plurality of drain holes 140 on the two-dimensional model 21 or the three-dimensional model needs to be set to be small. The more complex the design of the mesh becomes, or the smaller the size of the mesh becomes, the more time is required for the design of the two-dimensional model 21 or the three-dimensional model, and the more time is required for the calculation using the two-dimensional model 21 or the three-dimensional model. Therefore, by assigning two or more drain holes 140 to one virtual drain hole, the time can be further shortened, and the thermal fluid analysis can be performed more efficiently.

[0089] Furthermore, at least one virtual exhaust hole may be set to correspond to a region partitioned by a partition (rack 150 ) provided in the cooling space 200 .

[0090] According to this, the conditions of the simulation can be brought closer to the actual conditions, and the accuracy of the analysis of at least one of the temperature distribution and the flow velocity distribution can be improved.

[0091] Furthermore, the two-dimensional model 21 or the three-dimensional model may be a transient analysis model, and the thermal fluid analysis method may further include calculating the difference between time steps of physical quantities involved in the analysis result, and terminating the analysis when the calculated difference becomes less than a predetermined value.

[0092] According to this, the analysis can be automatically ended when the simulation being executed reaches a stable state, thereby improving the convenience for the designer.

[0093] Furthermore, the thermal fluid analysis device 1 is a device that analyzes at least one of the temperature distribution and the flow velocity distribution of the space (cooling space 200 ) where air is discharged from the plurality of discharge holes 140 using the two-dimensional model 21 or the three-dimensional model. The thermal fluid analysis device 1 includes: a first calculation unit 12 for calculating the air volume of each of the plurality of discharge holes 140 using a physical model 11 including design values ​​related to a fan 130, a heat exchanger 120 for adjusting the temperature of air sent by the fan 130, and a pipe 110 connected to the plurality of discharge holes 140 and through which the air whose temperature is adjusted by the heat exchanger 120 passes; a first setting unit 22 for setting at least one virtual discharge hole corresponding to a mesh of a two-dimensional model 21 or a three-dimensional model of a cooling space 200; an allocation unit 31 for allocating each of the plurality of discharge holes 140 in a manner of allocating one or more discharge holes among the plurality of discharge holes 140 to one virtual discharge hole for each of the at least one virtual discharge hole; a second calculation unit 32 for calculating the equivalent air volume of each of the plurality of discharge holes 140 based on the air volume of each of the plurality of discharge holes 140; and a second setting unit 33 for setting physical quantities related to each equivalent air volume as analysis parameters of the two-dimensional model 21 or the three-dimensional model.

[0094] According to this, it is possible to provide the thermal fluid analysis device 1 capable of efficiently performing thermal fluid analysis.

[0095] (Other Embodiments)

[0096] As mentioned above, the thermal fluid analysis method and the thermal fluid analysis device 1 according to the embodiment have been described, but the present invention is not limited to the above-described embodiment.

[0097] For example, in the above-described embodiment, the physical model 11, the first calculation unit 12, the input unit 13, the two-dimensional model 21, the first setting unit 22, the analysis unit 23, the display unit 24, the allocation unit 31, the second calculation unit 32, and the second setting unit 33 are arranged in one thermal fluid analysis device 1, but the present invention is not limited thereto and the two-dimensional model 11, the first calculation unit 12, the input unit 13, the two-dimensional model 21, the first setting unit 22, the analysis unit 23, the display unit 24, the allocation unit 31, the second calculation unit 32, and the second setting unit 33 may be arranged in separate devices. Fig. 9 as well as Fig.10 Provide explanation.

[0098] Fig. 9 It is a configuration diagram of a thermal fluid analysis system 1 a according to another embodiment.

[0099] The thermal fluid analysis system 1a includes a first analysis device 10, a second analysis device 20, and a conversion device 30. In the thermal fluid analysis system 1a, the physical model 11, the first calculation unit 12, and the input unit 13 of the thermal fluid analysis device 1 are arranged in the first analysis device 10, the two-dimensional model 21, the first setting unit 22, the analysis unit 23, and the display unit 24 are arranged in the second analysis device 20, and the allocation unit 31, the second calculation unit 32, and the second setting unit 33 are arranged in the conversion device 30.

[0100] The first analysis device 10 is a device for performing simulation based on the physical model 11, and the second analysis device 20 is a device for performing simulation based on the two-dimensional model 21. The conversion device 30 is a device for converting the analysis parameters of the physical model 11 into the analysis parameters of the two-dimensional model 21 in order to analyze the temperature distribution of the cooling space 200 by the two-dimensional model 21. In this way, the components of the thermal fluid analysis device 1 can also be dispersed and configured in a plurality of devices.

[0101] Fig.10 This is a sequence diagram showing an example of the operation of the thermal fluid analysis system 1a according to another embodiment. Basically, the operation is the same as that of the thermal fluid analysis device 1, and although there are some overlaps with the description of the operation of the thermal fluid analysis device 1, the operation of the thermal fluid analysis system 1a will be briefly described below.

[0102] The first analyzing device 10 obtains design values ​​related to the fan 130, the heat exchanger 120, and the pipe 110 (step S101). For example, the design values ​​are input to the input unit 13, so that the first analyzing device 10 obtains the design values.

[0103] The second analyzing device 20 sets at least one virtual exhaust hole corresponding to the mesh of the two-dimensional model 21 of the cooling space 200 (step S102 ).

[0104] The transformation device 30 allocates each of the multiple discharge holes 140 included in the design value obtained by the first analysis device 10 in a manner that allocates one or more discharge holes 140 among the multiple discharge holes 140 to each of the at least one virtual discharge hole set in the second analysis device 20 (step S103).

[0105] The first analyzing device 10 calculates the air volume of air discharged from each of the plurality of discharge holes 140 using the physical model 11 including the obtained design value (step S104 ).

[0106] The conversion device 30 calculates the equivalent air volume of air discharged from at least one virtual discharge hole based on the air volume discharged from each of the plurality of discharge holes 140 calculated by the first analysis device 10 (step S105).

[0107] The conversion device 30 sets the calculated physical quantity related to each equivalent air volume as an analysis parameter of the two-dimensional model 21 (step S106).

[0108] The second analysis device 20 performs analysis using the two-dimensional model 21 in which the physical quantity related to the equivalent air volume is set as an analysis parameter by the conversion device 30 (step S107).

[0109] Then, the second analysis device 20 calculates the difference between time steps of the physical quantity related to the analysis result, for example, and ends the analysis when the calculated difference becomes equal to or smaller than a predetermined value (step S108 ).

[0110] The transformation device 30 has characteristic components for transforming the analysis parameters of the physical model 11 into the analysis parameters of the two-dimensional model 21 or the three-dimensional model. Therefore, in addition to being able to be implemented as a thermal fluid analysis device 1, the present invention can also be implemented as a transformation device 30, and further, a transformation method including steps (processing) performed by each component constituting the transformation device 30.

[0111] Specifically, the conversion method is a method of converting the analysis parameters of the physical model 11 using design values ​​related to the fan 130, the heat exchanger 120 for adjusting the temperature of the air sent by the fan 130, and the pipe 110 connected to the plurality of discharge holes 140 and through which the air whose temperature is adjusted by the heat exchanger 120 passes, into the analysis parameters of the two-dimensional model 21 or the three-dimensional model in order to analyze at least one of the temperature distribution and the flow velocity distribution of the space (cooling space 200) where the air is discharged from the plurality of discharge holes 140 using the two-dimensional model 21 or the three-dimensional model. Figure 4 The transformation method is shown, for each of at least one virtual exhaust hole corresponding to the grid of the two-dimensional model 21 or the three-dimensional model of the cooling space 200, one or more exhaust holes among the multiple exhaust holes 140 are allocated to one virtual exhaust hole, each of the multiple exhaust holes 140 is allocated (step S13), and based on the air volume of air discharged from the multiple exhaust holes 140 respectively calculated by using the physical model 11, the equivalent air volume of air discharged from at least one virtual exhaust hole is calculated (step S14), and the physical quantities related to each equivalent air volume are set as analysis parameters of the two-dimensional model 21 or the three-dimensional model (step S15).

[0112] According to this, a conversion method capable of efficiently performing thermal fluid analysis can be provided.

[0113] Furthermore, the conversion device 30 is a device that converts the analysis parameters of the physical model 11 using design values ​​related to the fan 130, the heat exchanger 120 for regulating the temperature of the air delivered by the fan 130, and the piping 110 connected to the multiple exhaust holes 140 and through which the air whose temperature is regulated by the heat exchanger 120 passes, into the analysis parameters of the two-dimensional model 21 or the three-dimensional model, in order to analyze at least one of the temperature distribution and the flow velocity distribution of the space (cooling space 200) from which air is discharged from multiple exhaust holes 140 using the two-dimensional model 21 or the three-dimensional model. The transformation device 30 includes: an allocation unit 31, which allocates each of the multiple exhaust holes 140 in a manner of allocating one or more exhaust holes 140 among the multiple exhaust holes 140 to each of the at least one virtual exhaust holes corresponding to the grid of the two-dimensional model 21 or the three-dimensional model of the cooling space 200; a calculation unit (second calculation unit 32), which calculates the equivalent air volume of the air discharged from the at least one virtual exhaust hole based on the air volume of the air discharged from the multiple exhaust holes 140 respectively calculated by using the physical model 11; and a setting unit (second setting unit 33), which sets the physical quantity related to each equivalent air volume as an analysis parameter of the two-dimensional model 21 or the three-dimensional model.

[0114] According to this, it is possible to provide the conversion device 30 capable of efficiently performing thermal fluid analysis.

[0115] For example, the steps in the thermal fluid analysis method and the conversion method may also be performed by a computer (computer system). Furthermore, the present invention may be implemented as a program for causing a computer to execute the steps included in these methods. Furthermore, the present invention may be implemented as a non-temporary computer-readable recording medium such as a CD-ROM having the program recorded thereon. Furthermore, the recording medium may not be non-temporary.

[0116] For example, in the case where the present invention is implemented as a program (software), the program is executed using the hardware resources of the computer such as the CPU, memory, and input / output circuit, thereby executing each step. That is, the CPU obtains data from the memory or the input / output circuit and performs calculations, or outputs calculation results to the memory or the input / output circuit, thereby executing each step.

[0117] Furthermore, each component included in the thermal fluid analysis device 1 and the conversion device 30 of the above-described embodiment may be realized as a dedicated or general-purpose circuit.

[0118] Furthermore, each component included in the thermal fluid analysis device 1 and the conversion device 30 of the above-described embodiment may be realized as an integrated circuit (IC: Integrated Circuit), that is, LSI (Large Scale Integration).

[0119] Furthermore, the integrated circuit is not limited to LSI, and can be implemented as a dedicated circuit or a general-purpose processor. A programmable FPGA (Field Programmable Gate Array) or a reconfigurable processor that can reconfigure the connection and setting of circuit cells inside the LSI can also be used.

[0120] Furthermore, if integrated circuit technology that replaces LSI emerges due to advances in semiconductor technology or other derived technologies, it is natural that the various components included in the thermal fluid analysis device 1 and the conversion device 30 can also be integrated into integrated circuits using this technology.

[0121] In addition, various modifications that can be conceived by those skilled in the art to the embodiments and any combinations of components and functions of the embodiments without departing from the spirit of the present invention are also included in the present invention.

[0122] Explanation of symbols

[0123] 1 Thermal fluid analysis device

[0124] 1a Thermal Fluid Analysis System

[0125] 10. First analysis device

[0126] 11 Physical Model

[0127] 12 First Computing Department

[0128] 13 Input section

[0129] 20. Second analysis device

[0130] 21 2D Mode

[0131] 22 First setting section

[0132] 23 Analysis Department

[0133] 24 Display

[0134] 30 Transformation Device

[0135] 31 Distribution Department

[0136] 32. Second calculation unit (calculation unit)

[0137] 33 Second setting unit (setting unit)

[0138] 100 Display Cabinets

[0139] 110 Piping

[0140] 120 Heat exchanger

[0141] 130 Fan

[0142] 140, 141a, 141b, 142a, 142b, 142c, 143a, 143b, 143c, 144a, 144b, 145a, 145b discharge hole

[0143] 150 Shelves

[0144] 170 Top outlet

[0145] 180 suction port

[0146] 200 Cooling space (space)

[0147] 241, 242, 243, 244, 245 Virtual drain holes

[0148] 251, 252, 253, 254 virtual shelves

[0149] 261, 262, 263, 264, 265 points

[0150] 270 Virtual top outlet

[0151] 280 Virtual Inlet

Claims

1. A thermal fluid analysis method, comprising: analyzing at least one of a temperature distribution and a flow velocity distribution of a space where air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model; In the thermal fluid analysis method, The volume of air discharged from the plurality of discharge holes is calculated using a physical model including design values ​​related to a fan, a heat exchanger, and a pipe, wherein the heat exchanger adjusts the temperature of the air sent by the fan, and the pipe is connected to the plurality of discharge holes, and the air whose temperature is adjusted by the heat exchanger passes through the pipe. setting at least one virtual drain hole corresponding to a mesh of the two-dimensional model or the three-dimensional model of the space, For each of the at least one virtual discharge hole, each of the plurality of discharge holes is allocated in a manner that one or more discharge holes among the plurality of discharge holes are allocated to one virtual discharge hole, According to the air volume of the air discharged from each of the plurality of discharge holes, an equivalent air volume of the air discharged from the at least one virtual discharge hole is calculated, The physical quantities related to each of the equivalent air volumes are set as analysis parameters of the two-dimensional model or the three-dimensional model. The equivalent air volume is an air volume equivalent to the air volume of air discharged from the one or more discharge holes assigned to the one virtual discharge hole. The design values ​​include a pressure difference before and after the fan, a pressure loss of the heat exchanger, a pressure loss of the pipe and a shape of the pipe, and a size, a position, and a number of the plurality of discharge holes.

2. The thermal fluid analysis method according to claim 1, In the allocation, each of the plurality of discharge holes is allocated in such a manner that two or more discharge holes among the plurality of discharge holes are allocated to one virtual discharge hole for each of the at least one virtual discharge hole.

3. The thermal fluid analysis method according to claim 1, The at least one virtual discharge hole is set to correspond to a region partitioned by a partition provided in the space.

4. The thermal fluid analysis method according to any one of claims 1 to 3, The two-dimensional model or the three-dimensional model is a transient analysis model, In the thermal fluid analysis method, further, Calculate the difference between the time steps of the physical quantities involved in the analysis results, When the calculated difference becomes equal to or smaller than a predetermined value, the analysis is terminated. 5 . A computer-readable recording medium having a program recorded thereon for causing a computer to execute the thermal fluid analysis method according to claim 1 .

6. A thermal fluid analysis device for analyzing at least one of the temperature distribution and the flow velocity distribution of a space where air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model, The thermal fluid analysis device comprises: a first calculation unit, calculating the air volume of the air discharged from the plurality of discharge holes respectively using a physical model including design values ​​related to a fan, a heat exchanger, and a pipe, wherein the heat exchanger adjusts the temperature of the air sent by the fan, and the pipe is connected to the plurality of discharge holes, and the air whose temperature is adjusted by the heat exchanger passes through the pipe; A first setting unit is configured to set at least one virtual discharge hole corresponding to a grid of the two-dimensional model or the three-dimensional model of the space; an allocating unit that allocates each of the plurality of discharge holes in a manner of allocating one or more discharge holes among the plurality of discharge holes to each of the at least one virtual discharge hole; a second calculating unit for calculating an equivalent air volume of air discharged from each of the plurality of discharge holes according to the air volume of air discharged from each of the plurality of discharge holes; as well as The second setting unit sets each physical quantity related to the equivalent air volume as an analysis parameter of the two-dimensional model or the three-dimensional model. The equivalent air volume is an air volume equivalent to the air volume of air discharged from the one or more discharge holes assigned to the one virtual discharge hole. The design values ​​include a pressure difference before and after the fan, a pressure loss of the heat exchanger, a pressure loss of the pipe and a shape of the pipe, and a size, a position, and a number of the plurality of discharge holes.

7. A conversion method, in order to analyze at least one of the temperature distribution and the flow velocity distribution of a space where air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model, by converting analysis parameters of a physical model including design values ​​related to a fan, a heat exchanger, and a pipe into analysis parameters of the two-dimensional model or the three-dimensional model, wherein the heat exchanger adjusts the temperature of the air sent by the fan, the pipe is connected to the plurality of discharge holes, and the air whose temperature is adjusted by the heat exchanger passes through the pipe, In the transformation method, For each of at least one virtual exhaust hole corresponding to the two-dimensional model or the three-dimensional model grid of the space, each of the plurality of exhaust holes is allocated in a manner of allocating one or more exhaust holes among the plurality of exhaust holes to one virtual exhaust hole, The equivalent air volume of the air discharged from the at least one virtual discharge hole is calculated based on the air volume of the air discharged from the plurality of discharge holes respectively calculated by the physical model, The physical quantities related to each of the equivalent air volumes are set as analysis parameters of the two-dimensional model or the three-dimensional model. The equivalent air volume is an air volume equivalent to the air volume of air discharged from the one or more discharge holes assigned to the one virtual discharge hole. The design values ​​include a pressure difference before and after the fan, a pressure loss of the heat exchanger, a pressure loss of the pipe and a shape of the pipe, and a size, a position, and a number of the plurality of discharge holes.

8. A computer-readable recording medium having a program recorded thereon, the program causing a computer to execute the conversion method according to claim 7.

9. A conversion device for converting analysis parameters of a physical model including design values ​​related to a fan, a heat exchanger, and a pipe into analysis parameters of the two-dimensional model or the three-dimensional model in order to analyze at least one of a temperature distribution and a flow velocity distribution of a space where air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model, wherein the heat exchanger adjusts the temperature of the air sent by the fan, the pipe is connected to the plurality of discharge holes, and the air whose temperature is adjusted by the heat exchanger passes through the pipe, The conversion device comprises: an allocating unit that allocates each of the plurality of discharge holes in a manner of allocating one or more discharge holes among the plurality of discharge holes to each of the at least one virtual discharge hole corresponding to the two-dimensional model or the three-dimensional model grid of the space; a calculation unit, which calculates an equivalent air volume of air discharged from the at least one virtual exhaust hole, based on the air volumes of air discharged from the plurality of exhaust holes, respectively, calculated using the physical model; as well as a setting unit that sets each physical quantity related to the equivalent air volume as an analysis parameter of the two-dimensional model or the three-dimensional model, The equivalent air volume is an air volume equivalent to the air volume of air discharged from the one or more discharge holes assigned to the one virtual discharge hole. The design values ​​include a pressure difference before and after the fan, a pressure loss of the heat exchanger, a pressure loss of the pipe and a shape of the pipe, and a size, a position, and a number of the plurality of discharge holes.

10. A thermal fluid analysis device for analyzing at least one of a temperature distribution and a flow velocity distribution of a space where air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model, The thermal fluid analysis device comprises: Processor; and Memory, The processor uses the memory to perform the following processing, namely, The volume of air discharged from the plurality of discharge holes is calculated using a physical model including design values ​​related to a fan, a heat exchanger, and a pipe, wherein the heat exchanger adjusts the temperature of the air sent by the fan, and the pipe is connected to the plurality of discharge holes, and the air whose temperature is adjusted by the heat exchanger passes through the pipe. setting at least one virtual drain hole corresponding to a grid of the two-dimensional model or the three-dimensional model of the space, For each of the at least one virtual discharge hole, each of the plurality of discharge holes is allocated in a manner that one or more discharge holes among the plurality of discharge holes are allocated to one virtual discharge hole, According to the air volume of the air discharged from each of the plurality of discharge holes, an equivalent air volume of the air discharged from the at least one virtual discharge hole is calculated, The physical quantities related to each of the equivalent air volumes are set as analysis parameters of the two-dimensional model or the three-dimensional model. The equivalent air volume is an air volume equivalent to the air volume of air discharged from the one or more discharge holes assigned to the one virtual discharge hole. The design values ​​include a pressure difference before and after the fan, a pressure loss of the heat exchanger, a pressure loss of the pipe and a shape of the pipe, and a size, a position, and a number of the plurality of discharge holes.

11. A conversion device, for converting analysis parameters of a physical model including design values ​​related to a fan, a heat exchanger, and a pipe into analysis parameters of the two-dimensional model or the three-dimensional model in order to analyze at least one of a temperature distribution and a flow velocity distribution of a space where air is discharged from a plurality of discharge holes using a two-dimensional model or a three-dimensional model, wherein the heat exchanger adjusts the temperature of the air sent by the fan, the pipe is connected to the plurality of discharge holes, and the air whose temperature is adjusted by the heat exchanger passes through the pipe, The conversion device comprises: Processor; and Memory, The processor uses the memory to perform the following processing, namely, For each of at least one virtual exhaust hole corresponding to the two-dimensional model or the three-dimensional model grid of the space, each of the plurality of exhaust holes is allocated in a manner of allocating one or more exhaust holes among the plurality of exhaust holes to one virtual exhaust hole, According to the air volumes of the air discharged from the plurality of discharge holes respectively calculated by the physical model, the equivalent air volumes of the air discharged from the at least one virtual discharge hole are calculated, and the physical quantities related to the respective equivalent air volumes are set as analysis parameters of the two-dimensional model or the three-dimensional model. The equivalent air volume is an air volume equivalent to the air volume of air discharged from the one or more discharge holes assigned to the one virtual discharge hole. The design values ​​include a pressure difference before and after the fan, a pressure loss of the heat exchanger, a pressure loss of the pipe and a shape of the pipe, and a size, a position, and a number of the plurality of discharge holes.

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