Flexible audio sensor and method of manufacturing a flexible audio sensor

Abstract

The present application relates to a kind of flexible audio sensor and the manufacturing method of flexible audio sensor.Flexible audio sensor includes support, first component and second component.Support has opening, first component includes the organic film attached on the support and the first electrode attached on the surface of the organic film towards the support, at least in the region corresponding to the opening, first component is formed with hollow hole array, second component includes the ultra-thin paper film attached on the surface of the organic film away from the support and the second electrode attached on the surface of the ultra-thin paper film towards the organic film, at least in the region corresponding to the opening, second component is formed with micropore array.The technical scheme of the present application, by the dual effect of triboelectricity and electrostatic induction, without additional power supply, simple structure and easy to make, can effectively realize the detection or collection of audio signal under the excitation of external sound, and application scenario is wide.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to a flexible audio sensor and a method for manufacturing a flexible audio sensor. Background Technology

[0002] Triboelectric nanogenerators (TNGs) are widely used in flexible wearable devices and sensors, and have become a hot research topic. However, research on TNGs for audio sensing is relatively limited. Traditional audio sensors are mostly dynamic microphones or electret condenser microphones (ECMs). In recent years, with the rapid development of the MEMS field, capacitive silicon micromicrophones and piezoelectric thin-film micromicrophones have dominated the audio sensor market. However, existing MEMS capacitive microphones rely on a double-layer film design, resulting in poor resistance to dirt, dust, and water, and require robust IC circuitry to improve the signal-to-noise ratio. Piezoelectric MEMS microphones also require complex external circuitry. Furthermore, the sensitivity of piezoelectric thin-film sensors in converting audio signals into electrical signals is relatively low, and product performance still falls short of expectations. Summary of the Invention

[0003] Based on this, the present invention provides a flexible audio sensor and a method for manufacturing the flexible audio sensor. Relying on the dual effects of triboelectric charging and electrostatic induction, it requires no external power supply and has a simple structure that is easy to manufacture.

[0004] A flexible audio sensor includes: a support having an opening; a first component including an organic film attached to the support and a first electrode attached to a surface of the organic film facing the support, the first component having an array of perforations at least in a region corresponding to the opening; and a second component including an ultrathin paper film attached to a surface of the organic film facing away from the support and a second electrode attached to a surface of the ultrathin paper film facing the organic film, the second component having an array of micropores at least in a region corresponding to the opening.

[0005] The flexible audio sensor of the present invention is based on a triboelectric nanogenerator. Its principle is the dual action of triboelectric charging and electrostatic induction. It has the advantages of not requiring an external power supply, having a wide operating frequency band, and not requiring a resonant cavity. Through optimized structural design and material interface modification, it can effectively realize the detection or acquisition of audio signals under external sound excitation, thereby improving the performance of the sensor. It is simple to manufacture and has a wide range of applications.

[0006] In one embodiment, the organic film comprises a polytetrafluoroethylene film, a polyester film, or a fluorinated ethylene propylene copolymer film; and / or, polymer nanowires are formed on the surface of the organic film facing the ultrathin paper film; and / or, the thickness of the organic film is 20-100 μm.

[0007] These materials are all flexible electrical insulating materials with excellent dielectric properties, and can be used as substrates for flexible audio sensors.

[0008] Because the surface of the organic film is modified with polymer nanowires, the ultrathin paper film can be easily adsorbed onto the organic film to form an audio sensing unit. The organic film and the ultrathin paper film can be directly and tightly bonded together without the need for additional adhesives or bonding methods.

[0009] In one embodiment, the polymer nanowires are formed by plasma etching of the surface of the organic thin film. This provides a simple and easy-to-implement method for forming polymer nanowires.

[0010] In one embodiment, the polymer nanowire has a diameter or lateral dimension of 45-55 nm and a length of 0.5-1.5 μm.

[0011] In one embodiment, in the first component, at least the array of perforations on the organic film includes a plurality of perforation groups, each perforation group consisting of a plurality of perforations, wherein the plurality of perforation groups divide at least the region of the organic film corresponding to the opening into a plurality of sub-regions.

[0012] In one embodiment, the micropore array is configured as a square array, each of the perforated groups consisting of a plurality of perforated holes arranged in a straight line, and the plurality of perforated holes are arranged in a cross pattern to form a square sub-region on the organic film; or, the micropore array is configured as a circular or elliptical array, each of the perforated groups consisting of a plurality of perforated holes arranged in a ring to form a ring-shaped sub-region on the organic film.

[0013] In one embodiment, the diameter of each of the perforations is 400-600 μm, and the distance between two adjacent perforations is 450-550 μm.

[0014] In one embodiment, the ultrathin paper film is selected from ultrathin tracing paper with a thickness of 20-40 μm.

[0015] In one embodiment, the aperture ratio of the micropore array is 30-40%; and / or, the micropore array is composed of a plurality of micropores, wherein the diameter of each micropore is 350-450 μm and the distance between two adjacent micropores is 150-250 μm.

[0016] In one embodiment, the first electrode is composed of a first metal material layer sputtered on the surface of the organic thin film, and the second electrode is composed of a second metal material layer sputtered on the surface of the ultrathin paper film.

[0017] A method for fabricating a flexible audio sensor includes: preparing a support with an opening; attaching a first electrode to one side surface of an organic thin film to form a first component, and forming a perforated array in the first component; attaching a second electrode to one side surface of an ultrathin paper film to form a second component, and forming a micron-hole array in the second component; attaching the second component to the first component, with the surface of the ultrathin paper film to which the second electrode is attached facing the first component, and the micron-hole array corresponding to the perforated array; attaching the first component to the support, with the surface of the organic thin film to which the first electrode is attached facing the support, and the perforated array corresponding to the opening.

[0018] In one embodiment, attaching the first electrode to one side surface of the organic thin film to form a first component and forming an array of perforated holes in the first component further includes: forming polymer nanowires by plasma etching on the surface of the organic thin film where the first electrode is not attached. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a flexible audio sensor according to an embodiment of the present invention;

[0020] Figure 2 This is a schematic cross-sectional view of a flexible audio sensor according to an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of an organic thin film according to an embodiment of the present invention; and

[0022] Figure 4 This is a schematic diagram of an ultrathin paper film according to an embodiment of the present invention.

[0023] Component designation explanation

[0024] 1. Support; 11. Base plate; 12. Vertical plate; 13. Opening; 2. Organic thin film; 21. First electrode; 23. Hole array; 231. Hole group; 232. Hole; 24. Sub-region; 3. Ultrathin paper film; 31. Second electrode; 32. Micro-pore array; 4. First electrode wire; 5. Second electrode wire.

[0025] The above description of the main component symbols, together with the accompanying drawings and specific embodiments, provides a more detailed explanation of the present invention. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the scope of protection of this invention.

[0027] It should be noted that when a component is described as "mounted on" another component, it can be directly on the other component or there may be an intermediate component. When a component is described as "set on" another component, it can be directly set on the other component or there may be an intermediate component. When a component is described as "fixed to" another component, it can be directly fixed to the other component or there may be an intermediate component. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] Figure 1 and Figure 2 A flexible audio sensor according to an embodiment of the present invention is shown. For example... Figure 1 and Figure 2 As shown, the flexible audio sensor includes a support 1 with an opening 13 and a flexible audio unit attached to the support 1 at a position corresponding to the opening 13. In the illustrated embodiment, the support 1, serving as the skeleton of the entire flexible audio sensor, is made of thin wood. The support 1 includes a base plate 11 and a vertical plate 12 mounted on and perpendicular to the base plate 11. The opening 13 is formed in the vertical plate 12.

[0030] The flexible audio sensing unit according to the present invention is made based on the principle of triboelectric nanogenerators, and includes a substrate and a vibrating unit attached to the substrate. For example... Figure 1 and Figure 2 As shown, in the illustrated embodiment, an organic thin film 2 is selected as the substrate and is attached to the opening 13 of the support 1 as the core triboelectric layer. At the same time, an ultra-thin paper film 3 is selected as the vibration unit and is bonded to the organic thin film 2.

[0031] According to an embodiment of the present invention, a first electrode 21 is formed on the surface of the organic thin film 2 facing away from the ultrathin paper film 3. The organic thin film 2 and the first electrode 21 together constitute a first assembly, and a perforated array 23 is formed in the first assembly. A second electrode 31 is formed on the surface of the ultrathin paper film 3 facing the organic thin film 2. The ultrathin paper film 3 and the second electrode 31 together form a second assembly, and a micro-pore array 32 is formed in the second assembly. A first electrode wire 4 is led out from the first electrode 21, and a second electrode wire 5 is led out from the second electrode 31, and the first electrode wire 4 and the second electrode wire 5 are electrically connected. Thus, a complete flexible audio sensor according to the present invention is constituted.

[0032] The flexible audio sensor of this invention operates on the principle of mechanical vibration of a thin film induced by sound waves and the generation of electrical energy resulting from this mechanical vibration. On one hand, when external sound waves are continuously incident on the flexible audio sensor, the ultrathin paper film will exhibit mechanical vibration. These periodic mechanical vibrations are mainly caused by changes in air pressure across the film. On the other hand, the electrical energy generated by the mechanical vibration of the ultrathin paper film is primarily the result of a combination of frictional electrification and electrostatic induction with the organic film. Furthermore, forming a micron-sized aperture array on the second component increases airflow velocity and reduces damping, resulting in greater deformation under the same sound pressure. Further, forming a perforated aperture array on the first component allows some sound waves to directly penetrate the flexible audio sensor, making the air pressure changes across the ultrathin paper film more sensitive, thereby improving the mechanical vibration sensitivity of the ultrathin paper film. The perforated aperture array of the first component, in conjunction with the micron-sized aperture array of the second component, enhances the electrical performance of the flexible audio sensor.

[0033] In the illustrated embodiment, forming a perforated array in the first component includes forming perforated arrays in both the organic thin film 2 and the first electrode 21, and the arrangement of the perforated arrays in both can be the same. The perforated array of the organic thin film 2 will be described in detail below as an example. Figure 3 An organic thin film 2 according to an embodiment of the present invention is shown. (Reference) Figure 2 and Figure 3As shown, the organic thin film 2 has a perforated array 23 formed on it, for example, by laser cutting. When assembled to the support 1, the perforated array 23 corresponds to the opening 13 of the support 1. In the illustrated embodiment, the perforated array 23 is composed of multiple perforated groups 231, and each perforated group 231 includes multiple perforated holes 232 arranged in a straight line. These perforated groups 231 are arranged in a crisscross pattern on the organic thin film 2 to form a regular perforated array 23. For illustrative purposes, one of the perforated groups 231 is shown with a dashed box, but those skilled in the art will understand that the dashed box itself is not part of the physical structure of the flexible audio sensor that this invention aims to illustrate.

[0034] like Figure 3 As shown, according to one embodiment of the present invention, six perforation groups 231 are regularly arranged, including three parallel transverse perforation groups 231 and three parallel longitudinal perforation groups 231. These six perforation groups 231 are arranged in a crisscross pattern, dividing the central region of the organic film 2 into 16 substantially square sub-regions 24. All 16 sub-regions 24 correspond to the positions of the openings 13. The number and arrangement of the perforation groups 231 can be adjusted as needed, for example, by increasing or decreasing the number of transverse or longitudinal perforation groups 231, or increasing or decreasing the number of perforations 232 contained in each perforation group 231. The number of perforations 232 contained in different perforation groups 231 can also be the same or different. The diameter of the perforations 232 can be selected within the range of 400-600 μm, for example, 400 μm, 450 μm, 500 μm, 550 μm, or 600 μm. Changing the diameter of the perforations can adjust the velocity and flow rate of sound waves passing through the first component, thus adjusting the electrical performance of the flexible audio sensor. The spacing between two adjacent perforations 232 can be selected within the range of 450-550 μm, for example, 450 μm, 500 μm, or 550 μm. Adjusting the perforation spacing changes the pore density of the perforation array, which in turn adjusts the overall flow rate of sound waves passing through the first component and thus adjusts the electrical performance of the flexible audio sensor.

[0035] In the illustrated embodiment, the perforation array 23 is formed in approximately the central region of the organic thin film 2. However, those skilled in the art will understand that the position of the perforation array 23 can be offset from the central region as needed, as long as the position of the perforation array 23 corresponds to the position of the opening 13 of the support 1 in the assembled flexible audio sensor product.

[0036] According to embodiments of the present invention, the organic thin film 2 can be selected from thin film products made of flexible electrical insulating materials with excellent dielectric properties, such as polytetrafluoroethylene (PTFE) film, fluorinated ethylene propylene copolymer (FEP) film, or polyester (PET) film. As the substrate and core triboelectric layer of the flexible audio sensing unit, the thickness of the organic thin film 2 can be selected in the range of 20-100 μm, for example, 20 μm, 50 μm, 70 μm, or 100 μm.

[0037] According to an embodiment of the present invention, the first electrode 21 is composed of a first metal material layer formed on the surface of the organic thin film 2. Optionally, a metal material is sputtered onto the surface of the organic thin film 2 to form the first metal material layer.

[0038] According to an embodiment of the present invention, polymer nanowires are formed on another surface of the organic thin film 2 opposite to the surface to which the first electrode 21 is attached. The polymer nanowires formed on the surface of the organic thin film 2 have an electrostatic adsorption effect, increasing the contact charging of the organic thin film 2, thereby better and more directly bonding with the ultrathin paper film 3 without the need for additional bonding materials such as adhesives or additional bonding methods between the two. Optionally, the polymer nanowires are formed by plasma etching (PE) on the surface of the organic thin film 2. The diameter or lateral dimension of the polymer nanowires can be selected in the range of 45-55 nm, for example, 45 nm, 50 nm, or 55 nm. The length of the polymer nanowires can be selected in the range of 0.5 μm-1.5 μm, for example, 0.5 μm, 1 μm, or 1.5 μm. Changes in the diameter or lateral dimension and length of the polymer nanowires can affect the adsorption effect and adjust the bonding force between the organic thin film 2 and the ultrathin paper film 3.

[0039] In the illustrated embodiment, forming a micropore array in the second component includes forming micropore arrays 32 in both the ultrathin paper film 3 and the second electrode 31, and the arrangement of the micropore arrays in both can be the same. The micropore array 32 of the ultrathin paper film 3 will be described in detail below as an example. Figure 4 An ultrathin paper film 3 according to an embodiment of the present invention is shown. (Reference) Figure 1 , Figure 2 and Figure 4As shown, a micropore array 32 is formed on the ultrathin paper film 3, for example, by laser cutting. When the ultrathin paper film 3 is attached to the organic film 2, the micropore array 32 corresponds to the perforated array 23 of the organic film 2. In the illustrated embodiment, the micropore array 32 is basically constructed as a square array, including multiple micropores. Of course, the configuration of the micropore array 32 and the number of micropores it contains can be adjusted as needed. In an embodiment not shown, the micropore array is constructed as a circular or elliptical array. Correspondingly, all the perforations in each perforated group of the organic film are arranged in a ring, and the multiple perforated groups are basically concentric, thereby regularly dividing the region of the organic film corresponding to the opening 13 into multiple ring-shaped sub-regions; here, the ultrathin paper film can also be configured as a circular shape.

[0040] As described above, in the flexible audio sensor of the present invention, the ultrathin paper film serves as the core vibration unit, and its vibration performance plays a crucial role in the effective separation distance when the film is bent. When sound waves are continuously incident on the ultrathin paper film, the film exhibits mechanical vibration, primarily caused by changes in air pressure across the film. When sound waves are incident on the flexible audio sensor, a small portion passes directly between the ultrathin paper film and the organic film. This structure makes the changes in air pressure across the ultrathin paper film more sensitive, thereby improving the mechanical vibration sensitivity of the ultrathin paper film and further enhancing the electrical performance of the flexible audio sensor. The vibration performance of the ultrathin paper film depends to some extent on the selected material, film thickness, and the configuration and layout of the micron-sized aperture array formed on the ultrathin paper film.

[0041] According to an embodiment of the invention, the diameter of each micro-hole included in the micro-hole array 32 can be selected in the range of 350-450 μm, for example, 350 μm, 400 μm, or 450 μm. Changing the diameter of the micro-holes can adjust the airflow velocity and flow rate through the first component, thereby adjusting the degree of deformation of the first component. The spacing between two adjacent micro-holes can be selected in the range of 150-250 μm, for example, 150 μm, 200 μm, or 250 μm. The aperture ratio of the micro-hole array 32 is selected in the range of 30-40%, for example, 30%, 35%, or 40%. Changing the aperture ratio and the spacing between holes can adjust the pore density of the micro-hole array, and thus adjust the overall airflow rate through the second component, and adjust the electrical performance of the flexible audio sensor. In this invention, the aperture ratio of the micro-hole array refers to the ratio of the total area of ​​all micro-holes in the micro-hole array to the area of ​​the region of the ultrathin paper film forming the micro-hole array.

[0042] The flexible audio sensor of this invention uses a micron-scale array of holes on an ultrathin paper film to replace the resonant cavity used in the prior art. These micron-scale hole arrays connect the incident sound wave to the air between the two charged surfaces, which has a significant impact on the final electrical signal output of the sensor. As shown in equation (1):

[0043]

[0044] In the formula: V oc The triboelectric potential difference (electrical signal output); σ eff ε0 is the effective surface charge density of the thin film; ε0 is the relative permittivity; x(y,z,t) is the unit point separation distance in the planar coordinate system.

[0045] Furthermore, equation (1) can be simplified to:

[0046]

[0047] d eff =∫∫ A x(y,z,t)d y d z / A (3)

[0048] In the formula: d eff This refers to the effective separation distance during thin film bending vibration.

[0049] Analysis of the formulas revealed that the main parameter affecting the electrical signal output of the triboelectric nanogenerator is the effective surface charge density σ of the thin film. eff Effective separation distance d during film bending vibration eff The effective surface charge density of the thin film depends on the modification of the organic thin film surface with polymer nanowires and the effective contact area, while the effective separation distance during bending vibration of the thin film mainly depends on the vibration performance of the ultrathin paper film in the flexible audio sensor. On the one hand, the micron-sized pores formed on the ultrathin paper film greatly affect air damping, and a large opening ratio will lead to rapid airflow speed and low damping, resulting in greater deformation of the ultrathin paper film under the same sound pressure, thus causing a higher electrical signal output. On the other hand, a large opening ratio will reduce the effective contact area of ​​the friction surface, thereby reducing the effective charge density and causing a low electrical signal output. Therefore, in this invention, the preferred opening ratio is selected as a compromise between the large deformation of the ultrathin paper film and the effective contact area. Through simulation analysis, the preferred opening ratio is 30%.

[0050] In the illustrated embodiment, the micro-aperture array 32 is formed in the approximate central region of the ultrathin paper film 3. However, those skilled in the art will understand that the position of the micro-aperture array 32 can be offset from the central region as needed, as long as the position of the micro-aperture array 32 corresponds to the position of the perforated hole array 23 of the organic film 2 in the assembled flexible audio sensor product.

[0051] According to embodiments of the invention, the ultrathin paper film 3 serves as the core vibration unit of the flexible audio sensor, and its bending performance directly determines the sensitivity of the entire flexible audio sensor. The ultrathin paper film 3 can be made of ultrathin tracing paper. The thickness of the ultrathin paper film 3 can be selected within the range of 20-40 μm, for example, 20 μm, 30 μm, or 40 μm.

[0052] According to an embodiment of the present invention, the second electrode 31 is composed of a second metal material layer formed on the surface of the ultrathin paper film 3. Optionally, a metal material is sputtered onto the surface of the ultrathin paper film 3 to form the second metal material layer. The sputtered metal material can be a conductive metal material, such as gold, silver, or copper. Taking sputtered gold as an example, sputtering gold as the second electrode 31 can effectively avoid the oxidation problem of the metal electrode. The thickness of the sputtered second metal material layer can be selected in the range of 50-200 nm, for example, 50 nm, 70 nm, 100 nm, 150 nm, 170 nm, or 200 nm. It should be noted that the first electrode 21 and the second electrode 31 can be formed using the same conductive metal material, or different conductive metal materials can be used.

[0053] According to the flexible audio sensor provided by the present invention, the surface of the sputtered second electrode 31 of the ultrathin paper film 3 is bonded to the surface of the unsputtered first electrode 21 of the flexible organic film 2. Since the polymer nanowires formed by plasma etching on the surface of the organic film 2 have electrostatic adsorption, the organic film 2 and the ultrathin paper film 3 can be easily and tightly bonded together by direct bonding without the need for additional bonding materials or bonding methods such as adhesives.

[0054] An embodiment of the present invention also provides a method for manufacturing the flexible audio sensor as described above, comprising the following steps:

[0055] S1: Prepare a scaffold 1 with an opening 13;

[0056] S2: Attach the first electrode 21 to one side surface of the organic thin film 2 to form a first component, and form a perforated array 23 in the first component;

[0057] S3: Attach the second electrode 31 to one side surface of the ultrathin paper film 3 to form a second component, and form a micro-pore array 32 in the second component;

[0058] S4: Attach the second component to the first component, and make the surface of the ultrathin paper film 3 with the second electrode 31 attached face the first component, and the micro-hole array 32 corresponds to the perforated hole array 23;

[0059] S5: Attach the first component to the support 1, with the surface of the organic film 2 to which the first electrode 21 is attached facing the support 1, and the perforation array 23 corresponding to the opening 13. In one embodiment, the attachment method may be to use tape or adhesive to stick the edge portion of the organic film 2 that avoids the perforation array to the support 1.

[0060] In one embodiment, the method for manufacturing a flexible audio sensor may further include:

[0061] S6: Lead out the first electrode wire 4 from the first electrode 21;

[0062] S7: Lead out the second electrode wire 5 from the second electrode 31.

[0063] In one embodiment, step S2 may specifically include the following steps:

[0064] S201: Obtain organic thin film 2;

[0065] S202: Sputter metal material onto one side surface of the organic thin film 2 to form a first metal material layer, wherein the first metal material layer is configured as a first electrode 21;

[0066] S203: A perforated array 23 is formed on the first component consisting of the organic thin film 2 and the first electrode 21, for example by laser cutting and drilling.

[0067] In one embodiment, the organic thin film 2 in step S201 is a polytetrafluoroethylene (PTFE) film with a thickness of 100 μm and a rectangular size of 70 mm × 75 mm. In step S202, a metal material layer with a thickness of Cr + Au = 20 nm + 200 nm is sputtered onto the surface of the PTFE film using magnetron sputtering. In step S203, perforations are arranged according to a designed pattern, and laser cutting is used to create an array of perforations in the middle region of the PTFE film, comprising three groups of perforations in both the horizontal and vertical directions. The horizontal and vertical perforation groups intersect perpendicularly, dividing the middle sensing area of ​​the PTFE film into 16 sub-regions. The perforation diameter is 500 μm, and the perforation spacing is 500 μm.

[0068] In one embodiment, step S2 may further include step S204: forming polymer nanowires, for example by plasma etching, on the side of the organic thin film 2 where the first electrode 21 is not attached.

[0069] In one embodiment, step S3 may specifically include the following steps:

[0070] S301: Obtain ultra-thin paper film 3;

[0071] S302: Sputter metal material onto one side surface of the ultrathin paper film 3 to form a second metal material layer, wherein the second metal material layer is configured as a second electrode 31;

[0072] S303: A micron-hole array 32 is formed on the second component consisting of the ultrathin paper film 3 and the second electrode 31, for example by laser drilling.

[0073] In one embodiment, the ultrathin paper film 3 in step S301 is an ultrathin tracing paper film with a thickness of 25 μm and a rectangular size of 50 mm × 55 mm. In step S302, a metal material layer with a thickness of Cr + Au = 20 nm + 200 nm is sputtered onto the surface of the ultrathin tracing paper film using magnetron sputtering. In step S303, the size of the micron-hole perforated area of ​​the ultrathin tracing paper film is 40 mm × 40 mm, the diameter of the micron-hole is 400 μm, and the spacing between the holes is 200 μm.

[0074] It should be noted that the steps above are numbered, such as S1, S2, etc., for clarity of description, but this does not imply a limitation on the order of implementation of the method steps. In fact, the above steps can be reversed as needed without violating the logic of the technical solution of this invention. For example, the order of steps S1, S2, and S3 can be reversed, such as steps S2 and S3 being performed before step S1. As another example, the order of steps S6 and S7 can be reversed.

[0075] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A flexible audio sensor, characterized in that, include: The bracket has an opening; The first component includes an organic film attached to the support and a first electrode attached to the surface of the organic film facing the support, wherein the first component has at least an array of perforations in the region corresponding to the opening. The second component includes an ultrathin paper film attached to the surface of the organic film facing away from the support and a second electrode attached to the surface of the ultrathin paper film facing the organic film. The second component has at least a micron-hole array formed in the region corresponding to the opening, the micron-hole array corresponding to the perforated hole array.

2. The flexible audio sensor according to claim 1, characterized in that, The organic film includes a polytetrafluoroethylene film, a polyester film, or a fluorinated ethylene propylene copolymer film; and / or, Polymer nanowires are formed on the surface of the organic film facing the ultrathin paper film; and / or, The thickness of the organic film is 20-100 μm.

3. The flexible audio sensor according to claim 2, characterized in that, The polymer nanowires have a diameter or lateral dimension of 45-55 nm and a length of 0.5-1.5 μm.

4. The flexible audio sensor according to claim 1, characterized in that, In the first component, at least the array of perforations on the organic film includes a plurality of perforation groups, each perforation group consisting of a plurality of perforations, wherein the plurality of perforation groups divide at least the region of the organic film corresponding to the opening into a plurality of sub-regions.

5. The flexible audio sensor according to claim 4, characterized in that, The micron-hole array is constructed as a square array, and each of the perforated hole groups consists of a plurality of perforated holes arranged in a straight line, and the plurality of perforated holes are arranged in a cross pattern to construct a square sub-region on the organic film. or, The micropore array is configured as a circular or elliptical array, and each of the perforated groups consists of a plurality of perforated holes arranged in a ring to form a ring-shaped sub-region on the organic film.

6. The flexible audio sensor according to claim 4, characterized in that, The diameter of each of the perforated holes is 400-600μm, and the distance between two adjacent perforated holes is 450-550μm.

7. The flexible audio sensor according to any one of claims 1 to 6, characterized in that, The ultra-thin paper film is made of ultra-thin tracing paper with a thickness of 20-40μm.

8. The flexible audio sensor according to any one of claims 1 to 6, characterized in that, The aperture ratio of the micron-pore array is 30-40%; and / or, The micropore array consists of multiple micropores, each of which has a diameter of 350-450 μm and a distance of 150-250 μm between two adjacent micropores.

9. The flexible audio sensor according to any one of claims 1 to 6, characterized in that, The first electrode is composed of a first metal material layer sputtered on the surface of the organic thin film, and the second electrode is composed of a second metal material layer sputtered on the surface of the ultrathin paper film.

10. A method for manufacturing a flexible audio sensor, characterized in that, include: Prepare a scaffold with an opening; The first electrode is attached to one side surface of the organic thin film to form a first component, and an array of perforated holes is formed in the first component; The second electrode is attached to one side surface of the ultrathin paper film to form a second component, and a micropore array is formed in the second component; The second component is attached to the first component, and the surface of the ultrathin paper film with the attached second electrode faces the first component, and the micro-pore array corresponds to the perforated hole array; The first component is attached to the support, with the surface of the organic film to which the first electrode is attached facing the support, and the array of perforations corresponding to the opening.

11. The method for manufacturing a flexible audio sensor according to claim 10, characterized in that, The method of attaching the first electrode to one side surface of the organic thin film to form a first component, and forming an array of perforated holes in the first component, further includes: Polymer nanowires are formed by plasma etching on the surface of the organic thin film where the first electrode is not attached.

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